Base-generating agent, curable resin composition, cured product thereof, and printed wiring board

Abstract

Provided are: a base-generating agent which is excellent in storage stability of one component, exhibits high catalytic activity and causes a rapid curing reaction at a desired curing temperature; and a curable resin composition.　The base-generating agent comprises pyridinium cations and anion residues of an organic acid or an inorganic acid, and is represented by formula (a). In formula (a), A represents a C1-8 divalent hydrocarbon group which may contain a hetero atom; R1-R5 each independently represent a hydrogen atom or an electron-donating group; and R1 and R2, R2 and R3, R3 and R4, and R4 and R5 may be bonded to each other to form a ring structure. R6 to R10 each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, an alkoxy group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a cyano group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, an amino group, or an ammonio group. R6 and R7, R7 and R8, R8 and R9, and R9 and R10 may be bonded to each other to form a ring structure.

Description

Base generator, curable resin composition, cured product thereof, and printed wiring board

[0001] The present invention relates to a base generator, a curable resin composition containing the base generator, and a cured product thereof.

[0002] Conventionally, curing accelerators for thermosetting resins, particularly those for epoxy resins, include phosphorus-based or imidazole-based curing accelerators, and it is known that phosphorus-based curing accelerators have high curing power and can produce cured products with high electrical reliability. Among the phosphorus-based curing accelerators, examples of latent curing accelerators include phosphonium borate (Patent Document 1), phosphonium carboxylate (Patent Documents 2 to 6), phosphonium thiocyanate (Patent Document 7), and 1,2-bis(diphenylphosphino)acetylene (Patent Document 8), but these are insufficient in terms of latency.

[0003] Japanese Patent No. 3638258 International Publication No. 2010 / 087526 International Publication No. 2009 / 014270 Japanese Patent Application Laid-Open No. 3-20065 Japanese Patent Application Laid-Open No. 2016-113475 Japanese Patent Application Laid-Open No. 11-158251 Japanese Patent Application Laid-Open No. 2010-209150 Japanese Patent Application Laid-Open No. 2015-172136

[0004] An object of the present invention is to provide a base generator and a curable resin composition which have excellent storage stability in a one-part form and which exhibit high catalytic activity at a desired curing temperature to initiate a curing reaction in a short time.

[0005] That is, the present invention relates to the following [1] to

[16] . In this application, "(numerical value 1) to (numerical value 2)" indicates that the upper and lower limits are included. [1] A base generator represented by the following formula (a), which comprises a pyridinium cation and an anionic residue of an organic acid or an inorganic acid:

[0006]

[0007] (In formula (a), A represents a divalent hydrocarbon group having 1 to 8 carbon atoms which may contain a heteroatom, and R １ ~R ５ each independently represents a hydrogen atom or an electron-donating group; R １ and R ２ , R２ and R ３ , R ３ and R ４ , R ４ and R ５ may be bonded to each other to form a ring structure. ６ ~R １０ each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, an alkoxy group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a cyano group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, an amino group, or an ammonio group; R ６ and R ７ , R ７ and R ８ , R ８ and R ９ , R ９ and R １０ may be bonded to each other to form a ring structure. １ , R ２ , R ４ , and R ５ is a hydrogen atom, and R ３ is a hydrogen atom or a dimethylamino group. [3] The base generator according to the above item [1] or [2], wherein A in formula (a) is an unsubstituted divalent hydrocarbon group having 1 to 8 carbon atoms, or a divalent hydrocarbon group having 1 to 8 carbon atoms containing a carbonyl group, an ether group, an ester group, an amide group, or a sulfide group. [4] The anionic residue X in formula (a) － [5] The base generator according to any one of the above items [1] to [3], wherein the anion residue X in the formula (a) contains a halogen atom, a boron atom, or a silicon atom. － The base generator according to any one of the above items [1] to [3], wherein the base generator is represented by the following formula (b-1):

[0008]

[0009] (In formula (b-1), R １１ ~R １４ each independently represents a linear or branched alkyl group having 1 to 16 carbon atoms, or a substituted or unsubstituted aromatic ring. [6] R in the formula (b-1)１１ ~R １４ [7] The base generator according to the above item [5], wherein each of the anion residues X in the formula (a) is a phenyl group. － The base generator according to any one of the above items [1] to [3], wherein the base generator is represented by the following formula (b-2):

[0010]

[0011] (In formula (b-2), Y １ and Y ２ are organic groups and may be the same or different. １ represents a substituted or unsubstituted organic group having an aromatic ring or a heterocyclic ring, or a substituted or unsubstituted aliphatic group. [8] The anionic residue X in the formula (a) － The base generator according to any one of the above items [1] to [3], wherein the base generator is represented by the following formula (b-3) or the following formula (b-4):

[0012]

[0013]

[0014] [9] A curable resin composition containing the base generator described in any one of the preceding items [1] to [8].

[10] The curable resin composition described in the preceding item [9], further containing an epoxy resin.

[11] The curable resin composition described in the preceding item [9] or

[10] , further containing a curing agent.

[12] The curable resin composition described in any one of the preceding items [9] to

[11] , further containing at least one selected from the group consisting of maleimide compounds, polyphenylene ether compounds, compounds having an ethylenically unsaturated bond, cyanate compounds, polybutadiene and modified products thereof, polystyrene and modified products thereof, and polyethylene and modified products thereof.

[13] The curable resin composition described in any one of the preceding items [9] to

[12] , further containing at least one selected from the group consisting of a thermal polymerization initiator, a photopolymerization initiator, an anionic curing accelerator, and a cationic curing accelerator.

[14] The curable resin composition according to any one of the preceding items [9] to

[13] , which is used for a semiconductor encapsulant, an adhesive, an adhesive film, a prepreg, an interlayer insulating material, or a thermally conductive and heat-dissipating material.

[15] A cured product of the curable resin composition according to any one of the preceding items [9] to

[14] .

[16] A printed wiring board having the cured product according to the preceding item

[15] .

[0015] According to the present invention, it is possible to provide a base generator and a curable resin composition which have excellent storage stability in a one-part form and which exhibit high catalytic activity at a desired curing temperature to initiate a curing reaction in a short time.

[0016] Synthesis Example 1 １ 1 is a H-NMR chart of Synthesis Example 2. １ 1 is a H-NMR chart of Synthesis Example 3. １ 1 is a H-NMR chart of Synthesis Example 4. １ 1 is a H-NMR chart of Synthesis Example 5. １ 1 is a H-NMR chart of Comparative Synthesis Example 1. １ 1 is a H-NMR chart of Synthesis Example 6. １ 1 is a H-NMR chart of Synthesis Example 7. １ 1 is a H-NMR chart of Synthesis Example 8. １ 1H-NMR chart.

[0017] The base generator of the present invention comprises a pyridinium cation and an anion residue of an organic or inorganic acid, and is represented by the following formula (a): The base generator is a compound that generates a base upon irradiation with ultraviolet light or visible light or upon heating.

[0018]

[0019] In the above formula (a), A represents a divalent hydrocarbon group having 1 to 8 carbon atoms which may contain a heteroatom, and is preferably an unsubstituted divalent hydrocarbon group having 1 to 8 carbon atoms, or a divalent hydrocarbon group having 1 to 8 carbon atoms which contains a carbonyl group, an ether group, an ester group, an amide group, or a sulfide group. A more preferably has 1 to 5 carbon atoms, particularly preferably 1 to 3 carbon atoms, and most preferably a methylene group. Examples of heteroatoms include an oxygen atom, a sulfur atom, and a nitrogen atom. The above formula (a) can be represented, for example, as in the following formula (a-1) or (a-2). R in formulas (a-1) and (a-2) １ ~R １０ , and X － has the same meaning as in formula (a).

[0020]

[0021]

[0022] In the above formula (a), R １ ~R ５ each independently represents a hydrogen atom or an electron-donating group; R １ and R ２ , R ２ and R ３ , R ３ and R ４ , R ４ and R ５ may be bonded to each other to form a ring structure. The electron donating group is preferably an alkyl group, an alkylamino group, or an alkoxy group. １ , R ２ , R ４ , and R ５ is more preferably a hydrogen atom, and R ３is more preferably a hydrogen atom or a dimethylamino group, and particularly preferably a dimethylamino group.

[0023] In the above formula (a), R ６ ~R １０ each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, an alkoxy group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a cyano group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, an amino group, or an ammonio group; R ６ and R ７ , R ７ and R ８ , R ８ and R ９ , R ９ and R １０ may be bonded to each other to form a ring structure.

[0024] The anionic residue X in the above formula (a) － preferably contains a halogen atom, a boron atom, or a silicon atom, and more preferably is represented by any one of the following formulas (b-1) to (b-4):

[0025]

[0026] In the above formula (b-1), R １１ ~R １４ each independently represents a linear or branched alkyl group having 1 to 16 carbon atoms, or a substituted or unsubstituted aromatic ring, preferably a substituted or unsubstituted aromatic ring.

[0027]

[0028] In the above formula (b-2), Y １ and Y ２ are organic groups, which may be the same or different from each other, and are preferably substituted or unsubstituted aromatic rings. １ represents an organic group having a substituted or unsubstituted aromatic ring or heterocyclic ring, or a substituted or unsubstituted aliphatic group, preferably a substituted or unsubstituted aromatic ring.

[0029]

[0030]

[0031] The compound represented by formula (a) can be used as a curing accelerator for a curable resin composition. The compound represented by formula (a) has low catalytic activity at low temperatures (e.g., about 50°C) and does not cure the curable resin composition, but at a desired curing temperature (e.g., about 150°C), it exhibits high catalytic activity and has the potential to cure the composition in a short time (e.g., about 300 to 500 seconds). Therefore, the curable resin composition containing the compound represented by formula (a) has excellent storage stability in a one-part form.

[0032] When the curable resin composition is in a liquid state, the storage stability can be confirmed by viscosity measurement. In the present invention, the storage stability is confirmed by dividing the viscosity of the curable resin composition after standing at 25°C for 24 hours by the initial viscosity, and the viscosity is preferably 1.8 times or less, and more preferably 1.5 times or less. When the curable resin composition is in a solid state, the storage stability can be confirmed by gel time measurement. In the present invention, the gel time retention is calculated by dividing the gel time of the curable resin composition after standing at 50°C for 6 hours by the initial gel time, and the closer the gel time retention is to 100%, the better the storage stability. Specifically, the gel time retention is preferably 80% or more, and more preferably 90% or more.

[0033] In addition, the curability can be confirmed by gel time and DSC (differential scanning calorimetry). Generally, since there is often a trade-off between curability and storage stability, it is considered difficult to satisfy both properties. Therefore, by comparing the curability of curable resin compositions with the same storage stability, it is possible to compare the difference in properties.

[0034] When the base generator of the present invention is used in electric and electronic parts, it is preferable that the cured product contains as few conductive impurities as possible.

[0035] The compound represented by the above formula (a) may be synthesized by any method, but can be obtained as follows.

[0036] The compound represented by the formula (a) can be obtained, for example, by an addition reaction of a pyridine derivative with an alkyl halide, followed by an anion exchange reaction with a sodium borate or a sodium silicate, but is not limited to this. This reaction is preferably carried out without a catalyst, but a catalyst may be used if necessary.

[0037] Specific examples of organic solvents that can be used in the above addition reaction include alcohols such as methanol and ethanol; alkanes such as hexane, cyclohexane, and heptane; aromatic hydrocarbon compounds such as toluene and xylene; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, and anone; ethers such as diethyl ether, tetrahydrofuran, and dioxane; and ester compounds such as ethyl acetate, butyl acetate, and methyl formate.

[0038] The above addition reaction proceeds sufficiently even at a temperature of about 20° C. In view of the reaction time, the reaction temperature is preferably 30 to 200° C., more preferably 40 to 200° C., and particularly preferably 40 to 150° C.

[0039] Next, the curable resin composition of the present invention will be described.

[0040] [Epoxy Resin] The curable resin composition of the present invention may contain an epoxy resin. Preferred examples of the epoxy resin include, but are not limited to, those listed below. The epoxy resin may be liquid or solid, and may be used alone or in combination.

[0041] Examples of liquid epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AF type epoxy resins, naphthalene type epoxy resins, glycidyl ester type epoxy resins, glycidyl amine type epoxy resins, phenol novolac type epoxy resins, alicyclic epoxy resins having an ester skeleton, cyclohexane type epoxy resins, cyclohexane dimethanol type epoxy resins, and epoxy resins having a butadiene structure. Specific examples include "RE310S" and "RE410S" (all manufactured by Nippon Kayaku Co., Ltd., bisphenol A type epoxy resins), "RE303S", "RE304S", "RE403S", and "RE404S" (all manufactured by Nippon Kayaku Co., Ltd., bisphenol F type epoxy resins), "HP4032", "HP4032D", and "HP4032SS" (all manufactured by DIC Corporation, naphthalene type epoxy resins), "828", "828US", "828EL", "825", and "828XA" (all manufactured by Mitsubishi Chemical Corporation, bisphenol A type epoxy resins), "jE807" and "1750" (all manufactured by Mitsubishi Chemical Corporation, bisphenol F type epoxy resins), and "jER152" (manufactured by Mitsubishi Chemical Corporation, phenol novolac resins). bisphenol A epoxy resin), "630" and "630LSD" (all manufactured by Mitsubishi Chemical Corporation, glycidylamine epoxy resin), "ZX1059" (manufactured by Nippon Steel Chemical & Material Co., Ltd., a mixture of bisphenol A epoxy resin and bisphenol F epoxy resin), "EX-721" (manufactured by Nagase ChemteX Corporation, glycidyl ester epoxy resin), "Celloxide 2021P" (manufactured by Daicel Corporation, an alicyclic epoxy resin having an ester skeleton), "PB-3600" (manufactured by Daicel Corporation, an epoxy resin having a butadiene structure), "ZX1658" and "ZX1658GS" (all manufactured by Nippon Steel Chemical & Material Co., Ltd., liquid 1,4-glycidylcyclohexane epoxy resin). These may be used alone or in combination of two or more.

[0042] Preferred examples of solid epoxy resins include bixylenol-type epoxy resins, naphthalene-type epoxy resins, naphthalene-type tetrafunctional epoxy resins, cresol novolac-type epoxy resins, dicyclopentadiene-type epoxy resins, trisphenol-type epoxy resins, naphthol-type epoxy resins, biphenyl-type epoxy resins, naphthylene ether-type epoxy resins, anthracene-type epoxy resins, bisphenol A-type epoxy resins, bisphenol AF-type epoxy resins, and tetraphenylethane-type epoxy resins, and examples of such solid epoxy resins include naphthol-type epoxy resins, bisphenol AF-type epoxy resins, naphthalene-type epoxy resins, and biphenyl-type epoxy resins. Specific examples include "HP4032H" (manufactured by DIC Corporation, naphthalene type epoxy resin), "HP-4700", "HP-4710" (all manufactured by DIC Corporation, naphthalene type tetrafunctional epoxy resin), "N-690" (manufactured by DIC Corporation, cresol novolac type epoxy resin), "N-695" (manufactured by DIC Corporation, cresol novolac type epoxy resin), "HP-7200", "HP-7200HH", "HP-7200H" (all manufactured by DIC Corporation, dicyclopentadiene type epoxy resin), "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP-6000" (all manufactured by DIC Corporation, naphthylene ether type epoxy resin), "EPPN-502H" (manufactured by Nippon Kayaku Co., Ltd., trisphenol type epoxy resin), "NC-700 0L," "NC-7300" (all manufactured by Nippon Kayaku Co., Ltd., naphthol-cresol novolac type epoxy resin), "NC-3000H," "NC-3000," "NC-3000L," "NC-3100" (all manufactured by Nippon Kayaku Co., Ltd., biphenyl aralkyl type epoxy resin), "XD-1000-2L," "XD-1000-L," "XD-1000-H" (all manufactured by Nippon Kayaku Co., Ltd., dicyclopentasiloxane type epoxy resin), anthradiene-type epoxy resin), "ESN475V" (manufactured by Nippon Steel Chemical & Material Co., Ltd., naphthol-type epoxy resin), "ESN485" (manufactured by Nippon Steel Chemical & Material Co., Ltd., naphthol novolac-type epoxy resin), "YX-4000H", "YX-4000", "YL6121" (all manufactured by Mitsubishi Chemical Corporation, biphenyl-type epoxy resin), "YX-4000HK" (manufactured by Mitsubishi Chemical Corporation,Examples of epoxy resins include "bixylenol-type epoxy resin," "YX-8800" (manufactured by Mitsubishi Chemical Corporation, anthracene-type epoxy resin), "PG-100," "CG-500" (manufactured by Osaka Gas Chemicals Co., Ltd., fluorene-based epoxy resin), "YL-7760" (manufactured by Mitsubishi Chemical Corporation, bisphenol AF-type epoxy resin), "YL-7800" (manufactured by Mitsubishi Chemical Corporation, fluorene-type epoxy resin), "jER1010" (manufactured by Mitsubishi Chemical Corporation, solid bisphenol A-type epoxy resin), "jER1031S" (manufactured by Mitsubishi Chemical Corporation, tetraphenylethane-type epoxy resin), CNE-195LL (manufactured by Chang Chun Synthetic Resin Co., Ltd., orthocresol novolac-type epoxy resin), and "TEPIC-S" (manufactured by Nissan Chemical Industries, isocyanuric-type epoxy resin). These may be used alone or in combination of two or more.

[0043] Of these epoxy resins, those having high heat resistance are preferred, and therefore bixylenol-type epoxy resins, naphthalene-type epoxy resins, naphthalene-type tetrafunctional epoxy resins, cresol novolac-type epoxy resins, dicyclopentadiene-type epoxy resins, trisphenol-type epoxy resins, naphthol-type epoxy resins, biphenyl-type epoxy resins, naphthylene ether-type epoxy resins, anthracene-type epoxy resins, bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, and tetraphenylethane-type epoxy resins are preferred, and glycidyl ether-type epoxy resins such as naphthol-type epoxy resins, bisphenol AF-type epoxy resins, naphthalene-type epoxy resins, and biphenyl-type epoxy resins are more preferred.

[0044] The compound represented by the formula (a) is preferably used in an amount of 0.001 to 15 parts by mass, more preferably 0.01 to 5 parts by mass, per 100 parts by mass of the epoxy resin.

[0045] [Curing Agent] The curable resin composition of the present invention may be used in combination with a curing agent. Examples of curing agents that can be used in combination include amine compounds, acid anhydride compounds, amide compounds, phenolic compounds, carboxylic acid compounds, and active ester compounds. Among these, amine compounds, acid anhydride compounds, phenolic compounds, carboxylic acid compounds, and active ester compounds are preferred.

[0046] [Amine Compound] The amine compound is preferably a compound having two or more amino groups in the molecule, such as 4,4'-methylenebis(2-ethyl-6-methylaniline) (MDEA), diaminodiphenylmethane, 4,4'-diamino-3,3'-diethyl-5,5'-dimethyldiphenylmethane, diaminodiphenylsulfone, isophoronediamine, naphthalenediamine, aniline novolak (a reaction product of aniline and formalin), N-methylaniline novolak (a reaction product of N-methylaniline and formalin), orthoethylaniline novolak (a reaction product of orthoethylaniline and formalin), a reaction product of 2-methylaniline and formalin, a reaction product of 2,6-diisopropylaniline and formalin, a reaction product of 2,6-diethylaniline and formalin, a reaction product of 2-ethyl-6-ethylaniline and formalin, Examples of suitable aniline resins include, but are not limited to, a reaction product of 2,6-dimethylaniline and formalin, aniline resins obtained by reacting aniline and xylylene chloride, a reaction product of aniline and a substituted biphenyl (4,4'-bis(chloromethyl)-1,1'-biphenyl, 4,4'-bis(methoxymethyl)-1,1'-biphenyl, etc.) described in Japanese Patent No. 6,429,862, a reaction product of aniline and a substituted phenyl (1,4-bis(chloromethyl)benzene, 1,4-bis(methoxymethyl)benzene, 1,4-bis(hydroxymethyl)benzene, etc.), 4,4'-(1,3-phenylenediisopropylidene)bisaniline, 4,4'-(1,4-phenylenediisopropylidene)bisaniline, a reaction product of aniline and diisopropenylbenzene, and dimer diamine. These may be used alone or in combination.

[0047] [Acid Anhydride Compounds] Examples of acid anhydride compounds include phthalic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, nadic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, butanetetracarboxylic anhydride, bicyclo[2.2.1]heptane-2,3-dicarboxylic anhydride, and methylbicyclo[2.2.1]heptane-2,3-dicarboxylic anhydride. Examples of commonly available acid anhydride compounds include those listed in "KAYAHARD Examples of suitable phthalates include, but are not limited to, "MCD" (manufactured by Nippon Kayaku Co., Ltd.), "RIKACID MH-700" (manufactured by New Japan Chemical Co., Ltd., 4-methylhexahydrophthalic anhydride), "RIKACID TH" (manufactured by New Japan Chemical Co., Ltd., tetrahydrophthalic anhydride), "RIKACID HH" (manufactured by New Japan Chemical Co., Ltd., hexahydrophthalic anhydride), and "RIKACID MH-T" (manufactured by New Japan Chemical Co., Ltd.; main component is 4-methylhexahydrophthalic anhydride). These may be used alone or in combination.

[0048] [Phenol-Based Compounds] Preferred phenol-based compounds are compounds having two or more phenolic hydroxyl groups in the molecule. Examples include reaction products of phenols and aldehydes (phenol novolac curing agents), reaction products of phenols and diene compounds, reaction products of phenols and ketones, reaction products of phenols and substituted biphenyls, reaction products of phenols and substituted phenyls, and reaction products of bisphenols and aldehydes. Commonly available phenol-based compounds include phenol novolac curing agent H-1 (manufactured by UBE Corporation) and cresol novolac curing agent KA-1160 (manufactured by DIC Corporation), but are not limited to these. These compounds may be used alone or in combination. Specific examples of the above-mentioned raw materials are listed below, but are not limited to these. <Phenols> Phenol, alkyl-substituted phenols, aromatic-substituted phenols, hydroquinone, resorcinol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, alkyl-substituted dihydroxybenzene, dihydroxynaphthalene, etc. <Aldehydes> Formaldehyde, acetaldehyde, alkyl aldehyde, benzaldehyde, alkyl-substituted benzaldehyde, hydroxybenzaldehyde, naphthaldehyde, glutaraldehyde, phthalaldehyde, crotonaldehyde, cinnamaldehyde, furfural, etc. <Diene compounds> Dicyclopentadiene, terpenes, vinylcyclohexene, norbornadiene, vinylnorbornene, tetrahydroindene, divinylbenzene, divinylbiphenyl, diisopropenylbiphenyl, butadiene, isoprene, etc. <Ketones> Acetone, methyl ethyl ketone, methyl isobutyl ketone, acetophenone, benzophenone, fluorenone, etc. <Substituted biphenyls> 4,4'-bis(chloromethyl)-1,1'-biphenyl, 4,4'-bis(methoxymethyl)-1,1'-biphenyl, 4,4'-bis(hydroxymethyl)-1,1'-biphenyl, etc. <Substituted phenyls> 1,4-bis(chloromethyl)benzene, 1,4-bis(methoxymethyl)benzene, 1,4-bis(hydroxymethyl)benzene, etc.

[0049] [Carboxylic Acid Compound] The carboxylic acid compound is preferably a compound having two or more carboxyl groups in the molecule, and examples thereof include aromatic carboxylic acids such as phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, benzophenonetetracarboxylic acid, and furandicarboxylic acid, succinic acid, adipic acid, dodecanedioic acid, sebacic acid, thiodipropionic acid, cyclohexanedicarboxylic acid, tris(2-carboxymethyl)isocyanurate, tris(2-carboxyethyl)isocyanurate, tris(2-carboxypropyl)isocyanurate, and bis(2-carboxyethyl)isocyanurate, but are not limited to these. These compounds may be used alone or in combination.

[0050] [Active Ester Compound] An active ester compound refers to a compound containing at least one ester bond in its structure, and having an aliphatic chain, an aliphatic ring, or an aromatic ring bonded to both sides of the ester bond. Examples of active ester compounds include compounds having two or more highly reactive ester groups per molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds. These active ester compounds are obtained by a condensation reaction between at least one compound selected from a carboxylic acid compound, an acid chloride, and a thiocarboxylic acid compound and at least one compound selected from a hydroxy compound and a thiol compound. In particular, from the viewpoint of improving heat resistance, active ester compounds obtained from a carboxylic acid compound or an acid chloride and a hydroxy compound are preferred, and the hydroxy compound is preferably a phenol compound or a naphthol compound. Active ester compounds may be used alone or in combination of two or more types.

[0051] Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid.

[0052] Examples of the acid chloride include acetyl chloride, acrylic acid chloride, methacrylic acid chloride, malonyl chloride, succinic acid dichloride, diglycolyl chloride, glutaric acid dichloride, suberic acid dichloride, sebacic acid dichloride, adipic acid dichloride, dodecandioyl dichloride, azelaic acid chloride, 2,5-furandicarbonyl dichloride, phthaloyl chloride, isophthaloyl chloride, terephthaloyl chloride, trimesic acid chloride, bis(4-chlorocarbonylphenyl) ether, 4,4'-diphenyldicarbonyl chloride, and 4,4'-azodibenzoyl dichloride.

[0053] Examples of the phenol compound and naphthol compound include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalene, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, fluoroglycine, benzenetriol, dicyclopentadiene-type diphenol compounds, phenol novolak, and the phenolic resins described below. Here, the term "dicyclopentadiene-type diphenol compound" refers to a diphenol compound obtained by condensing one molecule of dicyclopentadiene with two molecules of phenol.

[0054] Preferred specific examples of the active ester compound include active ester compounds containing a dicyclopentadiene-type diphenol structure, active ester compounds containing a naphthalene structure, active ester compounds containing an acetylated phenol novolac, active ester compounds containing a benzoylated phenol novolac, the compound described in Example 2 of WO 2020 / 095829, and the compounds disclosed in WO 2020 / 059625. Among these, active ester compounds containing a naphthalene structure and active ester compounds containing a dicyclopentadiene-type diphenol structure are more preferred. The dicyclopentadiene-type diphenol structure refers to a divalent structural unit consisting of phenylene-dicyclopentylene-phenylene.

[0055] Commercially available active ester compounds include, for example, "EXB9451," "EXB9460," "EXB9460S," "HPC-8000-65T," "HPC-8000H-65TM," "EXB-8000L-65TM," and "EXB-8150-65T" (manufactured by DIC Corporation) as active ester compounds containing a dicyclopentadiene-type diphenol structure, "EXB9416-70BK" (manufactured by DIC Corporation) as an active ester compound containing a naphthalene structure, and "EXB9416-70BK" (manufactured by DIC Corporation) as an active ester compound containing an acetylated product of phenol novolac. Examples of active ester compounds containing benzoyl phenol novolac include "DC808" (manufactured by Mitsubishi Chemical Corporation), active ester compounds containing benzoyl phenol novolac include "YLH1026", "YLH1030", and "YLH1048" (manufactured by Mitsubishi Chemical Corporation), an active ester curing agent that is an acetylated phenol novolac, "DC808" (manufactured by Mitsubishi Chemical Corporation), an active ester curing agent containing a phosphorus atom, "EXB-9050L-62M" (manufactured by DIC Corporation), and an active ester compound containing a bisphenol A structure, "Unifiner W-575".

[0056] Regarding the compounding ratio of the active ester compound and the epoxy resin, the ratio (α / β) of the active ester equivalent (α) to the epoxy equivalent (β) is preferably 0.5 to 1.5, more preferably 0.8 to 1.2, and even more preferably 0.90 to 1.10. If the ratio is outside the above range, excess epoxy groups or active ester groups may remain in the system, which may deteriorate the properties in a high-temperature storage test (e.g., 150°C, 1000 hours) or a long-term reliability test under high-temperature and high-humidity conditions (e.g., temperature: 85°C, humidity: 85%).

[0057] The compounding ratio of epoxy resin to curing agent is preferably such that, per equivalent of epoxy groups in the epoxy resin, the active groups in the curable resin curing agent that can react with the epoxy groups (such as acid anhydride groups or hydroxyl groups) are 0.5 to 1.5 equivalents (considering carboxylic acid as monofunctional and acid anhydride as monofunctional), and particularly preferably 0.5 to 1.2 equivalents. If the ratio is less than 0.5 equivalents or more than 1.5 equivalents per equivalent of epoxy groups, curing may be incomplete and good cured physical properties may not be obtained.

[0058] [Carboxylic Acid Compound] Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, phthalic acid, isophthalic acid, terephthalic acid, pyromellitic acid, 5-hydroxyisophthalic acid, 2-chloroterephthalic acid, 2-methylterephthalic acid, 5-methylisophthalic acid, 5-sodiumsulfoisophthalic acid, hexahydroterephthalic acid, hexahydroisophthalic acid, cyclohexanedicarboxylic acid, biphenyldicarboxylic acid, naphthalenedicarboxylic acid, benzophenonedicarboxylic acid, furandicarboxylic acid, 4,4'-dicarboxydiphenyl ether, and 4,4'-dicarboxydiphenyl sulfide. Commercially available products include G4-142MHR (manufactured by Nippon Kayaku Co., Ltd.).

[0059] [Curing Accelerator] In addition to the compound represented by formula (a), the curable resin composition of the present invention may contain a curing accelerator. As the curing accelerator, an anionic curing accelerator that accelerates the curing reaction by generating anions upon irradiation with ultraviolet light or visible light or heating, or a cationic curing accelerator that accelerates the curing reaction by generating cations upon irradiation with ultraviolet light or visible light or heating, is preferred.

[0060] [Anionic Curing Accelerator] Examples of anionic curing accelerators include imidazoles such as 2-methylimidazole, 2-ethylimidazole, and 2-ethyl-4-methylimidazole; trialkylamines such as triethylamine and tributylamine; 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo(5,4,0)-undecene, with 4-dimethylaminopyridine and 1,8-diazabicyclo(5,4,0)-undecene being preferred. Other examples include phosphines such as triphenylphosphine; and quaternary ammonium salts such as tetrabutylammonium salt, triisopropylmethylammonium salt, trimethyldecanylammonium salt, cetyltrimethylammonium salt, and hexadecyltrimethylammonium hydroxide, but are not limited thereto. These may be used alone or in combination.

[0061] [Cationic Curing Accelerator] Examples of the cationic curing accelerator include quaternary phosphonium salts such as triphenylbenzylphosphonium salt, triphenylethylphosphonium salt, and tetrabutylphosphonium salt (the counter ion of the quaternary salt may be a halogen, an organic acid ion, a hydroxide ion, or the like, and is not particularly specified, but an organic acid ion or a hydroxide ion is particularly preferred), and transition metal compounds (transition metal salts) such as tin octoate, octope Zn (2-ethylhexanoate), zinc carboxylate (zinc 2-ethylhexanoate, zinc stearate, zinc behenate, zinc myristate), and zinc phosphate ester (zinc octylphosphate, zinc stearylphosphate). These may be used alone or in combination.

[0062] The curing accelerator is preferably used in an amount of 0.001 to 15 parts by mass, more preferably 0.01 to 5 parts by mass, per 100 parts by mass of the epoxy resin.

[0063] [Thermal Polymerization Initiator] The curable resin composition of the present invention may contain a thermal polymerization initiator. The thermal polymerization initiator is a compound capable of polymerizing an olefin functional group such as an ethylenically unsaturated bond, and examples thereof include an olefin metathesis polymerization initiator, a thermal anionic polymerization initiator, a thermal cationic polymerization initiator, and a thermal radical polymerization initiator. Among these, it is preferable to use a thermal radical polymerization initiator that has curability and appropriate stability. The thermal radical polymerization initiator is a compound that generates radicals upon heating and initiates a chain polymerization reaction. Examples of the thermal radical polymerization initiator include organic peroxides, azo compounds, and benzopinacols. It is preferable to use an organic peroxide because it is effective in controlling the curing temperature, suppressing outgassing, and minimizing the impact of decomposition products on electrical properties.

[0064] [Organic Peroxides] Examples of organic peroxides include ketone peroxides such as methyl ethyl ketone peroxide and acetylacetone peroxide, diacyl peroxides such as benzoyl peroxide, dialkyl peroxides such as dicumyl peroxide and 1,3-bis-(t-butylperoxyisopropyl)-benzene, peroxyketals such as t-butyl peroxybenzoate and 1,1-di-t-butylperoxycyclohexane, α-cumylperoxyneodecanoate, t-butylperoxyneodecanoate, t-butylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, t-amylperoxy-2-ethylhexanoate, t-butylperoxymethyl ... Examples of the peroxycarbonate include, but are not limited to, alkyl peresters such as di-2-ethylhexyl peroxydicarbonate, t-amylperoxy-3,5,5-trimethylhexanoate, t-butylperoxy-3,5,5-trimethylhexanoate, and t-amylperoxybenzoate, peroxycarbonates such as di-2-ethylhexyl peroxydicarbonate, bis(4-t-butylcyclohexyl)peroxydicarbonate, t-butylperoxyisopropyl carbonate, and 1,6-bis(t-butylperoxycarbonyloxy)hexane, t-butyl hydroperoxide, cumene hydroperoxide, t-butyl peroxyoctoate, and lauroyl peroxide. These peroxycarbonates may be used alone or in combination. Among the above organic peroxides, ketone peroxides, diacyl peroxides, hydroperoxides, dialkyl peroxides, peroxyketals, alkyl peresters, peroxycarbonates, etc. are preferred, with dialkyl peroxides being more preferred.

[0065] [Azo Compound] Examples of azo compounds include, but are not limited to, azobisisobutyronitrile, 4,4'-azobis(4-cyanovaleric acid), 2,2'-azobis(2,4-dimethylvaleronitrile), etc. These compounds may be used alone or in combination.

[0066] [Photopolymerization initiator] The curable resin composition of the present invention may contain a photopolymerization initiator. Examples of the photopolymerization initiator include radical photopolymerization initiators, cationic photopolymerization initiators, and photobase initiators. Among these, radical photopolymerization initiators, which have high curability, are preferred.

[0067] [Radical Photopolymerization Initiator] Examples of the radical photopolymerization initiator include 1,2-octanedione, 1-[4-(phenylthio)-, 2-(O-benzoyloxime)] (manufactured by BASF Japan, "IRGACURE OXE-01"), ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-, 1-(O-acetyloxime) (manufactured by BASF Japan, "IRGACURE OXE-01"). OXE-02); benzoins such as benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, and benzoin isobutyl ether; acetophenones such as acetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 2-hydroxy-2-methyl-phenylpropan-1-one, diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propan-1-one; 2-ethylanthraquinone, 2-t-butylanthraquinone, 2-chloroanthraquinone, and 2-amylanthraquinone; Examples of known general radical photopolymerization initiators include anthraquinones such as thraquinone; thioxanthones such as 2,4-diethylthioxanthone (manufactured by Nippon Kayaku Co., Ltd., "DETX-S"), 2-isopropylthioxanthone, and 2-chlorothioxanthone; ketals such as acetophenone dimethyl ketal and benzil dimethyl ketal; benzophenones such as benzophenone, 4-benzoyl-4'-methyldiphenyl sulfide and 4,4'-bismethylaminobenzophenone; and phosphine oxides such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide.

[0068] [Cationic Photopolymerization Initiator] Examples of the cationic photopolymerization initiator include diazonium salts of Lewis acids, iodonium salts of Lewis acids, sulfonium salts of Lewis acids, phosphonium salts of Lewis acids, other halides, triazine-based photopolymerization initiators, borate-based photopolymerization initiators, and other photoacid generators.

[0069] <Diazonium Salts of Lewis Acids> Examples of diazonium salts of Lewis acids include p-methoxyphenyldiazonium fluorophosphonate and N,N-diethylaminophenyldiazonium hexafluorophosphonate (e.g., San-Aid SI-60L / SI-80L / SI-100L manufactured by Sanshin Chemical Industry Co., Ltd.). Examples of iodonium salts of Lewis acids include diphenyliodonium hexafluorophosphonate and diphenyliodonium hexafluoroantimonate. Examples of sulfonium salts of Lewis acids include triphenylsulfonium hexafluorophosphonate (e.g., Cyracure UVI-6990 manufactured by Union Carbide) and triphenylsulfonium hexafluoroantimonate (e.g., Cyracure UVI-6974 manufactured by Union Carbide). Examples of phosphonium salts of Lewis acids include triphenylphosphonium hexafluoroantimonate.

[0070] <Other Halides> Examples of other halides include 2,2,2-trichloro-[1-4'-(dimethylethyl)phenyl]ethanone (e.g., Trigonal PI manufactured by AKZO Corporation), 2,2-dichloro-1-4-(phenoxyphenyl)ethanone (e.g., Sandray 1000 manufactured by Sandoz Corporation), and α,α,α-tribromomethylphenyl sulfone (e.g., BMPS manufactured by Seisteels Chemical Co., Ltd.). Examples of triazine initiators include 2,4,6-tris(trichloromethyl)-triazine, 2,4-trichloromethyl-(4'-methoxyphenyl)-6-triazine (e.g., Triazine A manufactured by Panchim), 2,4-trichloromethyl-(4'-methoxystyryl)-6-triazine (e.g., Triazine PMS manufactured by Panchim), and 2,4-trichloromethyl-(piperonyl)-6-triazine (e.g., Triazine PMS manufactured by Panchim). Examples of suitable bis(trichloromethyl)-s-triazine include Triazine PP manufactured by Panchim, 2,4-trichloromethyl-(4'-methoxynaphthyl)-6-triazine (Triazine B manufactured by Panchim, etc.), 2[2'(5-methylfuryl)ethylidene]-4,6-bis(trichloromethyl)-s-triazine (manufactured by Sanwa Chemical Co., Ltd., etc.), and 2(2'-furylethylidene)-4,6-bis(trichloromethyl)-s-triazine (manufactured by Sanwa Chemical Co., Ltd.).

[0071] <Borate-based photopolymerization initiator> Examples of the borate-based photopolymerization initiator include NK-3876 and NK-3881 manufactured by Nippon Kanko Dyes Co., Ltd. Other examples of the photoacid generator include 9-phenylacridine, 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2-biimidazole (e.g., Biimidazole manufactured by Kurogane Chemical Co., Ltd.), 2,2-azobis(2-amino-propane) dihydrochloride (e.g., V50 manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.), 2,2-azobis[2-(imidazolin-2-yl)propane]dihydrochloride (e.g., V50 manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.), and 2,2-azobis[2-(imidazolin-2-yl)propane]dihydrochloride (e.g., V50 manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.). [eta-5-2-4-(cyclopentadecyl)(1,2,3,4,5,6,eta)-(methylethyl)-benzene]iron(II) hexafluorophosphonate (Irgacure 261 manufactured by CibaGeigy, etc.), and bis(y5-cyclopentadienyl)bis[2,6-difluoro-3-(1H-pyr-1-yl)phenyl]titanium (CGI-784 manufactured by CibaGeigy, etc.).

[0072] [Photobase Initiator] Examples of the photobase initiator include photobase initiators such as TRD-001 (manufactured by Nippon Kayaku Co., Ltd.), TRD-008 (manufactured by Nippon Kayaku Co., Ltd.), WPBG-300 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.), WPBG-345 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.), PBG-266 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.), WPBG-018 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.), WPBG-027 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.), WPBG-140 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.), and WPBG-165 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.).

[0073] The amount of the photopolymerization initiator added is preferably 0.01 to 5 parts by mass, and particularly preferably 0.01 to 3 parts by mass, per 100 parts by mass of the curable resin composition. One type of photopolymerization initiator can be used alone, or two or more types can be used in combination.

[0074] [Polymerization inhibitor] The curable resin composition of the present invention may contain a polymerization inhibitor. The inclusion of a polymerization inhibitor improves storage stability and enables control of the reaction initiation temperature. Controlling the reaction initiation temperature makes it easier to ensure fluidity, prevents impregnation into glass cloth and the like from being impaired, and facilitates B-staging, such as prepreg formation. If the polymerization reaction proceeds too much during prepreg formation, problems such as difficulty in lamination in the lamination step are likely to occur.

[0075] The amount of the polymerization inhibitor used is 0.008 to 1 part by mass, preferably 0.01 to 0.5 part by mass, based on 100 parts by mass of the curable resin composition of the present invention.

[0076] Examples of the polymerization inhibitor include phenol-based, sulfur-based, phosphorus-based, hindered amine-based, nitroso-based, and nitroxyl radical-based. One type of polymerization inhibitor may be used alone, or multiple types may be used in combination. Among these, in this embodiment, phenol-based, hindered amine-based, nitroso-based, and nitroxyl radical-based inhibitors are preferred.

[0077] [Phenol-based polymerization inhibitor] Examples of phenol-based polymerization inhibitors include 2,6-di-t-butyl-p-cresol, butylated hydroxyanisole, 2,6-di-t-butyl-p-ethylphenol, stearyl-β-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, isooctyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-t-butylanilino)-1,3,5-triazine, 2,4-bis[(octylthio)methyl]-o ...butylated hydroxyanisole, 2, monophenols such as ethanol, 2,2'-methylenebis(4-methyl-6-t-butylphenol), 2,2'-methylenebis(4-ethyl-6-t-butylphenol), 4,4'-thiobis(3-methyl-6-t-butylphenol), 4,4'-butylidenebis(3-methyl-6-t-butylphenol), triethylene glycol-bis[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate], 1,6-hexanediol-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], ], N,N'-hexamethylenebis(3,5-di-t-butyl-4-hydroxy-hydrocinnamamide), 2,2-thio-diethylenebis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 3,5-di-t-butyl-4-hydroxybenzylphosphonate-diethyl ester, 3,9-bis[1,1-dimethyl-2-{β-(3-t-butyl-4-hydroxy-5-methylphenyl)propionyloxy}ethyl]2,4,8,10-tetraoxaspiro[5,5]undecane, bis(3,5-di-t-butyl bisphenols such as calcium ethyl 4-hydroxybenzylsulfonate, 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane, 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, tetrakis-[methylene-3-(3',5'-di-t-butyl-4'-hydroxyphenyl)propionate]methane, bis[3,3'-bis-(4'-hydroxy-3'-t-butylphenyl)butyric acid]glycol ester, tris-(3,Examples of the polymerizable phenols include, but are not limited to, 1,3,5-tris(3',5'-di-t-butyl-4'-hydroxybenzyl)-isocyanurate, 1,3,5-tris(3',5'-di-t-butyl-4'-hydroxybenzyl)-s-triazine-2,4,6-(1H,3H,5H)trione, and tocopherol.

[0078] [Sulfur-Based Polymerization Inhibitor] Examples of sulfur-based polymerization inhibitors include, but are not limited to, dilauryl-3,3'-thiodipropionate, dimyristyl-3,3'-thiodipropionate, and distearyl-3,3'-thiodipropionate.

[0079] [Phosphorus-Based Polymerization Inhibitor] Examples of phosphorus-based polymerization inhibitors include triphenyl phosphite, diphenyl isodecyl phosphite, phenyl diisodecyl phosphite, tris(nonylphenyl) phosphite, diisodecyl pentaerythritol phosphite, tris(2,4-di-t-butylphenyl) phosphite, cyclic neopentanetetraylbis(octadecyl) phosphite, cyclic neopentanetetraylbis(2,4-di-t-butylphenyl) phosphite, cyclic neopentanetetraylbis(2,4-di-t-butyl-4-methylphenyl) phosphite, bis[2-t 10-(3,5-di-t-butyl-4-hydroxybenzyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-(3,5-di-t-butyl-4-hydroxybenzyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-decyloxy-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, and the like, but are not limited to these.

[0080] [Hindered amine polymerization inhibitor] Examples of the hindered amine polymerization inhibitor include ADK STAB LA-40MP, ADK STAB LA-40Si, ADK STAB LA-402AF, ADK STAB LA-87, ADK STAB LA-82, ADK STAB LA-81, ADK STAB LA-77Y, ADK STAB LA-77G, ADK STAB LA-72, ADK STAB LA-68, ADK STAB LA-63P, ADK STAB LA-57, and ADK STAB L. A-52, Chimassorb 2020FDL, Chimassorb 944FDL, Chimassorb 944LD, Tinuvin 622SF, Tinuvin PA144, Tinuvin 765, Tinuvin 770DF, Tinuvin XT55FB, Tinuvin 111FDL, Tinuvin 783FDL, Tinuvin 791FB and the like, but are not limited thereto.

[0081] [Nitroso-based polymerization inhibitor] Examples of nitroso-based polymerization inhibitors include, but are not limited to, p-nitrosophenol, N-nitrosodiphenylamine, ammonium salt of N-nitrosophenylhydroxyamine, (cupferron), etc. Among these, ammonium salt of N-nitrosophenylhydroxyamine (cupferron) is preferred.

[0082] [Nitroxyl Radical Polymerization Inhibitor] Examples of nitroxyl radical polymerization inhibitors include, but are not limited to, di-tert-butyl nitroxide, 2,2,6,6-tetramethylpiperidine-1-oxyl, 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-oxo-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-amino-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-methoxy-2,2,6,6-tetramethylpiperidine-1-oxyl, 4-acetoxy-2,2,6,6-tetramethylpiperidine-1-oxyl, and 4-benzoyloxy-2,2,6,6-tetramethylpiperidine-1-oxyl.

[0083] [Flame Retardant] The curable resin composition of the present invention may contain a flame retardant. Examples of the flame retardant include halogen-based flame retardants, inorganic flame retardants (antimony compounds, metal hydroxides, nitrogen compounds, boron compounds, etc.), and phosphorus-based flame retardants. From the viewpoint of achieving halogen-free flame retardancy, phosphorus-based flame retardants are preferred.

[0084] The phosphorus-based flame retardant may be a reactive type or an additive type. Specific examples include phosphate esters such as trimethyl phosphate, triethyl phosphate, tricresyl phosphate, trixylylene phosphate, cresyl diphenyl phosphate, cresyl-2,6-dixylylene phosphate, 1,3-phenylenebis(dixylylene phosphate), 1,4-phenylenebis(dixylylene phosphate), and 4,4'-biphenyl(dixylylene phosphate); phosphanes such as 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and 10(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide; phosphorus-containing epoxy compounds obtained by reacting an epoxy resin with the active hydrogen of the above-mentioned phosphanes; and red phosphorus. These may be used alone or in combination. Of the above-listed substances, phosphate esters, phosphanes, and phosphorus-containing epoxy compounds are preferred, with 1,3-phenylenebis(dixylilenyl phosphate), 1,4-phenylenebis(dixylilenyl phosphate), 4,4'-biphenyl(dixylilenyl phosphate), and phosphorus-containing epoxy compounds being particularly preferred.

[0085] The content of the flame retardant is preferably in the range of 0.1 to 0.6 parts by mass per 100 parts by mass of the curable resin composition. If the content is less than 0.1 part by mass, the flame retardancy may be insufficient, and if the content is more than 0.6 part by mass, the moisture absorption and dielectric properties of the cured product may be adversely affected.

[0086] [Light Stabilizer] The curable resin composition of the present invention may contain a light stabilizer. A hindered amine-based light stabilizer, particularly a HALS, is preferred as the light stabilizer. Examples of HALS include a reaction product of dibutylamine, 1,3,5-triazine, N,N'-bis(2,2,6,6-tetramethyl-4-piperidyl)-1,6-hexamethylenediamine, and N-(2,2,6,6-tetramethyl-4-piperidyl)butylamine, a reaction product of dimethyl succinate-1-(2-hydroxyethyl)-4-hydroxy-2,2,6,6-tetramethylpiperidine, and poly[{6-(1,1,3,3-tetramethylbutyl)amino-1,3,5-triazine-2,4-diyl}{(2,2,6,6-tetramethyl-4-piperidyl)imino}hexamethylene{(2,2,6,6-tetramethyl-4-piperidyl)butylamine]. Examples of suitable hydroxybenzyl compounds include, but are not limited to, bis(1,2,2,6,6-pentamethyl-4-piperidyl)[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butyl malonate, bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, bis(1,2,2,6,6-pentamethyl-4-piperidyl)sebacate, bis(1-octyloxy-2,2,6,6-tetramethyl-4-piperidyl)sebacate, and bis(1,2,2,6,6-pentamethyl-4-piperidyl) 2-(3,5-di-t-butyl-4-hydroxybenzyl)-2-n-butylmalonate. These compounds may be used alone or in combination.

[0087] The content of the light stabilizer is preferably in the range of 0.001 to 0.1 parts by mass relative to 100 parts by mass of the curable resin composition. If the content is less than 0.001 part by mass, the light stabilizing effect may be insufficient, and if the content is more than 0.1 part by mass, the moisture absorption and dielectric properties of the cured product may be adversely affected.

[0088] [Binder Resin] The curable resin composition of the present invention may contain a binder resin. Examples of binder resins include, but are not limited to, polyphenylene ether compounds, polyamide resins, polyimide resins, polybutadiene and modified products thereof, polystyrene and modified products thereof, polyethylene and modified products thereof, butyral-based resins, acetal-based resins, acrylic-based resins, epoxy-nylon-based resins, NBR-phenol-based resins, epoxy-NBR-based resins, and silicone-based resins. These may be used alone or in combination.

[0089] [Polyphenylene Ether Compound] From the viewpoint of heat resistance and electrical properties, the polyphenylene ether compound is preferably a polyphenylene ether compound having an ethylenically unsaturated bond, and more preferably a polyphenylene ether compound having an acrylic group, a methacrylic group, or a styrene structure. Commercially available products include SA-9000 (manufactured by SABIC Corporation, a polyphenylene ether compound having a methacrylic group) and OPE-2St 1200 (manufactured by Mitsubishi Gas Chemical Company, a polyphenylene ether compound having a styrene structure). The number average molecular weight (Mn) of the polyphenylene ether compound is preferably 500 to 5,000, more preferably 2,000 to 5,000, and even more preferably 2,000 to 4,000. If the molecular weight is less than 500, the heat resistance of the cured product tends to be insufficient. Furthermore, if the molecular weight is greater than 5,000, the melt viscosity increases, and sufficient fluidity cannot be obtained, which tends to result in molding defects. Furthermore, the reactivity decreases, the curing reaction takes a long time, and the amount of unreacted polyphenylene ether not incorporated into the curing system increases, which lowers the glass transition temperature of the cured product and reduces the heat resistance of the cured product. If the number average molecular weight of the polyphenylene ether compound is 500 to 5,000, it is possible to exhibit excellent heat resistance and moldability while maintaining excellent dielectric properties. The number average molecular weight here can be measured specifically using gel permeation chromatography or the like.

[0090] The polyphenylene ether compound may be one obtained by a polymerization reaction or one obtained by a redistribution reaction of a high-molecular-weight polyphenylene ether compound having a number-average molecular weight of approximately 10,000 to 30,000. Furthermore, these compounds may be used as raw materials and reacted with a compound having an ethylenically unsaturated bond, such as methacrylic acid chloride, acrylic acid chloride, or chloromethylstyrene, to impart radical polymerizability. A polyphenylene ether compound obtained by a redistribution reaction may be obtained, for example, by heating a high-molecular-weight polyphenylene ether compound in a solvent such as toluene in the presence of a phenolic compound and a radical initiator to cause a redistribution reaction. Such polyphenylene ether compounds obtained by a redistribution reaction are preferred because they have hydroxyl groups derived from the phenolic compound at both ends of the molecular chain that contribute to curing, thereby maintaining even higher heat resistance. Furthermore, functional groups can be introduced at both ends of the molecular chain even after modification with a compound having an ethylenically unsaturated bond. Furthermore, polyphenylene ether compounds obtained by a polymerization reaction are preferred because they exhibit excellent fluidity.

[0091] In the case of polyphenylene ether compounds obtained by polymerization, the molecular weight of the polyphenylene ether compound can be adjusted by adjusting the polymerization conditions, etc. In the case of polyphenylene ether compounds obtained by redistribution, the molecular weight of the resulting polyphenylene ether compound can be adjusted by adjusting the conditions, etc. of the redistribution reaction. More specifically, adjusting the amount of the phenolic compound used in the redistribution reaction can be considered. That is, the greater the amount of the phenolic compound, the lower the molecular weight of the resulting polyphenylene ether compound. In this case, poly(2,6-dimethyl-1,4-phenylene ether) or the like can be used as the high-molecular-weight polyphenylene ether compound that undergoes the redistribution reaction. Furthermore, the phenolic compound used in the redistribution reaction is not particularly limited, but preferred are, for example, polyfunctional phenolic compounds having two or more phenolic hydroxyl groups per molecule, such as bisphenol A, phenol novolac, and cresol novolac. These compounds may be used alone or in combination of two or more.

[0092] The content of the polyphenylene ether compound is not particularly limited, but is preferably 5 to 1,000 parts by mass, and more preferably 10 to 750 parts by mass, relative to 100 parts by mass of the curable resin composition. A content of the polyphenylene ether compound within the above range is preferable in that it not only has excellent heat resistance and the like, but also allows a cured product to be obtained that fully exhibits the excellent dielectric properties of the polyphenylene ether compound.

[0093] [Polyamide Resin] Examples of polyamide resins include a reaction product of one or more of diamines, diisocyanates, and oxazolines with dicarboxylic acids, a reaction product of diamines with acid chlorides, and ring-opening polymerization products of lactam compounds. These may be used alone or in combination. Specific examples of the above-mentioned raw materials are listed below, but are not limited thereto.<Diamines> Ethylenediamine, trimethylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, heptamethylenediamine, octamethylenediamine, nonamethylenediamine, decanediamine, undecanediamine, dodecanediamine, tridecanediamine, tetradecanediamine, pentadecanediamine, hexadecanediamine, heptadecanediamine, octadecanediamine, nonadecanediamine, eicosanediamine, 2-methyl-1,5-diaminopentane, 2-methyl diamino-1,8-diaminooctane, dimer diamine, cyclohexanediamine, bis-(4-aminocyclohexyl)methane, bis(3-methyl-4-aminocyclohexyl)methane, xylylenediamine, norbornanediamine, isophoronediamine, bisaminomethyltricyclodecane, phenylenediamine, diethyltoluenediamine, naphthalenediamine, diaminodiphenylmethane, bis(4-amino-3,5-dimethylphenyl)methane, bis(4-amino-3,5-diethylphenyl)methane , 4,4'-methylenebis-o-toluidine, 4,4'-methylenebis-o-ethylaniline, 4,4'-methylenebis-2-ethyl-6-methylaniline, 4,4'-methylenebis-2,6-diisopropylaniline, 4,4-ethylenedianiline, diaminodiphenyl sulfone, diaminodiphenyl ether, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 4,4-bis(4-aminophenoxy)biphenyl, 2,2-bis[4-(4-amino 4,4'-(1,3-phenylenediisopropylidene)bisaniline, 4,4'-(1,4-phenylenediisopropylidene)bisaniline, 9,9-bis(4-aminophenyl)fluorene, 2,7-diaminofluorene, aminobenzylamine, diaminobenzophenone, and the like.<Diisocyanates> benzene diisocyanate, toluene diisocyanate, 1,3-bis(isocyanatomethyl)benzene, 1,3-bis(isocyanatomethyl)cyclohexane, bis(4-isocyanatophenyl)methane, isophorone diisocyanate, 1,3-bis(2-isocyanato-2-propyl)benzene, 2,2-bis(4-isocyanatophenyl)hexafluoropropane, dicyclohexylmethane-4,4′-diisocyanate, and the like. <Dicarboxylic acids> oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, terephthalic acid, isophthalic acid, 5-hydroxyisophthalic acid, 2-chloroterephthalic acid, 2-methylterephthalic acid, 5-methylisophthalic acid, 5-sodiumsulfoisophthalic acid, hexahydroterephthalic acid, hexahydroisophthalic acid, cyclohexanedicarboxylic acid, biphenyldicarboxylic acid, naphthalenedicarboxylic acid, benzophenonedicarboxylic acid, furandicarboxylic acid, 4,4'-dicarboxydiphenyl ether, 4,4'-dicarboxydiphenyl sulfide, and the like. <Acid chlorides> acetyl chloride, acrylic acid chloride, methacrylic acid chloride, malonyl chloride, succinic acid dichloride, diglycolyl chloride, glutaric acid dichloride, suberic acid dichloride, sebacic acid dichloride, adipic acid dichloride, dodecandioyl dichloride, azelayl chloride, 2,5-furandicarbonyl dichloride, phthaloyl chloride, isophthaloyl chloride, terephthaloyl chloride, trimesic acid chloride, bis(4-chlorocarbonylphenyl) ether, 4,4'-diphenyldicarbonyl chloride, 4,4'-azodibenzoyl dichloride, etc. <Lactams> ε-caprolactam, ω-undecanelactam, ω-laurolactam, etc.

[0094] [Polyimide Resin] Examples of polyimide resins include, but are not limited to, reaction products of the above diamines with the tetracarboxylic dianhydrides exemplified below. Specific examples include LDFI089 (a polyimide compound obtained by the method described in WO2023013224A1). These may be used alone or in combination. <Tetracarboxylic Dianhydrides> 4,4'-(hexafluoroisopropylidene)diphthalic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-cyclohexene-1,2dicarboxylic anhydride, pyromellitic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 2,2',3,3'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 4,4'- ...4,4'-hexafluoroisopropylidene)diphthalic anhydride, 5-(2,5-di carboxylic dianhydride, 3,3',4,4'-diphenylsulfonetetracarboxylic dianhydride, 2,2',3,3'-biphenyltetracarboxylic dianhydride, methylene-4,4'-diphthalic dianhydride, 1,1-ethylidene-4,4'-diphthalic dianhydride, 2,2'-propylidene-4,4'-diphthalic dianhydride, 1,2-ethylene-4,4'-diphthalic dianhydride, 1,3-trimethylene-4,4'-diphthalic dianhydride, 1,4-tetramethylene 4,4'-diphthalic dianhydride, 1,5-pentamethylene-4,4'-diphthalic dianhydride, 4,4'-oxydiphthalic dianhydride, thio-4,4'-diphthalic dianhydride, sulfonyl-4,4'-diphthalic dianhydride, 1,3-bis(3,4-dicarboxyphenyl)benzene dianhydride, 1,3-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 1,3-bis(3,4-dicarboxyphenoxy)benzene dianhydride Bis[2-(3,4-dicarboxyphenyl)-2-propyl]benzene dianhydride, 1,4-bis[2-(3,4-dicarboxyphenyl)-2-propyl]benzene dianhydride, bis[3-(3,4-dicarboxyphenoxy)phenyl]methane dianhydride, bis[4-(3,4-dicarboxyphenoxy)phenyl]methane dianhydride, 2,2-bis[3-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, bis(3,4-dicarboxyphenoxy)dimethylsilane dianhydride, 1,3-bis(3,4-dicarboxyphenyl)-1,1,3,3-tetramethyldisiloxane dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 1,2,5,6-naphthalenetetracarboxylic dianhydride, 3,4,9,10-perylenetetracarboxylic dianhydride, 2,3,6,7-anthracenetetracarboxylic dianhydride, 1,2,7,8-phenane Tetylenetetracarboxylic dianhydride, ethylenetetracarboxylic dianhydride, 1,2,3,4-butanetetracarboxylic dianhydride, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, cyclopentanetetracarboxylic dianhydride, cyclohexane-1,2,3,4-tetracarboxylic dianhydride, cyclohexane-1,2,4,5-tetracarboxylic dianhydride, 3,3',4,4'-bicyclohexyltetracarboxylic dianhydride, carbonyl-4,4'-bis(cyclohexane-1,2-dicarboxylic acid) dianhydride, methylene-4,4'-bis(cyclohexa 4,4'-bis(cyclohexane-1,2-dicarboxylic acid) dianhydride, 1,2-ethylene-4,4'-bis(cyclohexane-1,2-dicarboxylic acid) dianhydride, 1,1-ethylidene-4,4'-bis(cyclohexane-1,2-dicarboxylic acid) dianhydride, 2,2-propylidene-4,4'-bis(cyclohexane-1,2-dicarboxylic acid) dianhydride, oxy-4,4'-bis(cyclohexane-1,2-dicarboxylic acid) dianhydride, thio-4,4'-bis(cyclohexane-1,2-dicarboxylic acid) dianhydride, sulfonyl-4,4'-bis(cyclohexane-1,2-dicarboxylic acid) dianhydride Aqueous solutions, bicyclo[2,2,2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride, rel-[1S,5R,6R]-3-oxabicyclo[3,2,1]octane-2,4-dione-6-spiro-3'-(tetrahydrofuran-2',5'-dione), 4-(2,5-dioxotetrahydrofuran-3-yl)-1,2,3,4-tetrahydronaphthalene-1,2-dicarboxylic anhydride, ethylene glycol-bis-(3,4-dicarboxylic anhydride phenyl) ether, 4,4'-biphenylbis(trimellitic acid monoester acid anhydride), 9,9'-bis(3,4-dicarboxyphenyl)fluorene dianhydride, etc.

[0095] [Allyl Compound] Examples of the allyl compound include monoallyl isocyanurate, diallyl isocyanurate, triallyl isocyanurate, etc. Specific examples include "TAIC" (manufactured by Mitsubishi Chemical Corporation), "MA-DGIC", and "DA-MGIC" (all manufactured by Shikoku Chemical Industry Co., Ltd.).

[0096] [Polybutadiene and Modified Products Thereof] Polybutadiene and modified products thereof are compounds having polybutadiene or a structure derived from polybutadiene in the molecule. The unsaturated bonds in the polybutadiene-derived structure may be partially or entirely converted to single bonds by hydrogenation. Examples of polybutadiene and modified products thereof include, but are not limited to, polybutadiene, hydroxyl-terminated polybutadiene, (meth)acrylate-terminated polybutadiene, carboxylic acid-terminated polybutadiene, amine-terminated polybutadiene, and styrene-butadiene rubber. These may be used alone or in combination. Of these, polybutadiene or styrene-butadiene rubber is preferred from the viewpoint of dielectric properties. Examples of styrene-butadiene rubber (SBR) include RICON-100, RICON-181, and RICON-184 (all manufactured by Cray Valley Chemical Industries, Ltd.) and 1,2-SBS (manufactured by Nippon Soda Co., Ltd.). Examples of polybutadienes include B-1000, B-2000, and B-3000 (all manufactured by Nippon Soda Co., Ltd.). The molecular weight of polybutadiene and styrene-butadiene rubber is preferably a weight-average molecular weight of 500 to 10,000, more preferably 750 to 7,500, and even more preferably 1,000 to 5,000. Below the lower limit of the above range, the amount of volatilization is high, making it difficult to adjust the solids content during prepreg production. Above the upper limit of the above range, compatibility with other curable resins deteriorates. In general, in the case of compounds containing heteroatoms such as oxygen and nitrogen, such as bismaleimides and polymaleimides, their polarity makes it difficult to ensure compatibility with low-polarity compounds, such as compounds composed mainly of hydrocarbons or compounds composed only of hydrocarbons. On the other hand, the compound of the present embodiment does not have a skeleton design in which heteroatoms such as oxygen and nitrogen are actively introduced, and therefore has excellent compatibility with materials having low polarity and low dielectric properties and compounds composed only of hydrocarbons.

[0097] [Polystyrene and Modified Polystyrene] Polystyrene and modified polystyrene are polystyrene or compounds having a structure derived from polystyrene in the molecule. Examples of polystyrene and modified products thereof include polystyrene, styrene-2-isopropenyl-2-oxazoline copolymers (Epocross RPS-1005, RP-61, both manufactured by Nippon Shokubai Co., Ltd.), SEP (styrene-ethylene-propylene copolymer: Septon 1020, manufactured by Kuraray Co., Ltd.), SEPS (styrene-ethylene-propylene-styrene copolymer: Septon 2002, Septon 2004F, Septon 2005, Septon 2006, Septon 2063, Septon 2104, all manufactured by Kuraray Co., Ltd.), SEEPS (styrene-ethylene / ethylene-propylene-styrene block copolymer: Septon 4003, Septon 4044, Septon 4055, Septon 4077, Septon 4099, all manufactured by Kuraray Co., Ltd.), SEBS (styrene-ethylene-butylene-styrene copolymer). Examples of suitable block copolymers include SEPTON 8004, SEPTON 8006, and SEPTON 8007L, all manufactured by Kuraray Co., Ltd.), SEEPS-OH (a styrene-ethylene / ethylene propylene-styrene block copolymer having a hydroxyl group at its terminal: SEPTON HG252, manufactured by Kuraray Co., Ltd.), SIS (styrene-isoprene-styrene block copolymer: SEPTON 5125 and SEPTON 5127, both manufactured by Kuraray Co., Ltd.), hydrogenated SIS (hydrogenated styrene-isoprene-styrene block copolymer: HYBRAR 7125F and HYBRAR 7311F, both manufactured by Kuraray Co., Ltd.), and SIBS (styrene-isobutylene-styrene block copolymer: SIBSTAR073T, SIBSTAR102T, and SIBSTAR103T (all manufactured by Kaneka Corporation), and SEPTON V9827 (manufactured by Kuraray Co., Ltd.)), but are not limited thereto. These may be used alone or in combination. Polystyrene and modified products thereof are preferably free of unsaturated bonds, since they have higher heat resistance and are less susceptible to oxidative degradation.Furthermore, there are no particular restrictions on the weight-average molecular weight of polystyrene and modified products thereof as long as it is 10,000 or more. However, if it is too large, compatibility with not only the polyphenylene ether compound but also low-molecular-weight components having a weight-average molecular weight of about 50 to 1,000 and oligomer components having a weight-average molecular weight of about 1,000 to 5,000 deteriorates, making it difficult to ensure mixing and solvent stability. Therefore, it is preferably about 10,000 to 300,000.

[0098] [Polyethylene and Modified Polyethylenes] Polyethylene and modified polyethylenes are compounds having polyethylene or a polyethylene-derived structure in the molecule. Examples of polyethylene and modified polyethylenes include, but are not limited to, ethylene-propylene copolymers, ethylene-styrene copolymers, ethylene-propylene-ethylidene norbornene copolymers (EBT: K-8370EM, K-9330M, etc., manufactured by Mitsui Chemicals, Inc.), ethylene-propylene-vinyl norbornene copolymers (VNB-EPT: PX-006M, PX-008M, PX-009M, etc., manufactured by Mitsui Chemicals, Inc.), ethylene-vinyl alcohol copolymers, and ethylene-vinyl acetate copolymers. From the viewpoint of improving heat resistance, it is preferable to use ethylene-propylene-ethylidene norbornene copolymers or ethylene-propylene-vinyl norbornene copolymers containing a crosslinkable structure. These may be used alone or in combination. There are no particular restrictions on the weight-average molecular weight of polyethylene and modified polyethylenes thereof as long as it is 10,000 or more. However, if it is too large, compatibility with not only the polyphenylene ether compound but also low-molecular-weight components having a weight-average molecular weight of about 50 to 1,000 and oligomer components having a weight-average molecular weight of about 1,000 to 5,000 deteriorates, making it difficult to ensure mixing and solvent stability. Therefore, it is preferably about 10,000 to 300,000.

[0099] The amount of binder resin is preferably within a range that does not impair the flame retardancy and heat resistance of the cured product, and is preferably 0.05 to 50 parts by mass, more preferably 0.05 to 20 parts by mass, per 100 parts by mass of the curable resin composition, as needed. Of these compounds, polyphenylene ether compounds, polybutadiene and modified products thereof, and polystyrene and modified products thereof are preferably contained in order to achieve a balance between heat resistance, adhesion, and dielectric properties. The inclusion of these compounds can improve the brittleness of the cured product and adhesion to metals, and can suppress package cracking during solder reflow and reliability tests such as thermal cycling.

[0100] [Inorganic Filler] The curable resin composition of the present invention may contain an inorganic filler. Examples of inorganic fillers include, but are not limited to, powders such as fused silica, crystalline silica, porous silica, alumina, zircon, calcium silicate, calcium carbonate, quartz powder, silicon carbide, silicon nitride, boron nitride, zirconia, aluminum nitride, graphite, forsterite, steatite, spinel, mullite, titania, talc, clay, iron oxide, asbestos, and glass powder, as well as inorganic fillers obtained by shaping these into spherical or crushed forms. These fillers may be used alone or in combination.

[0101] When preparing a curable resin composition for use as a semiconductor sealant, a thermally conductive or heat-dissipating material, or the like, the inorganic filler is preferably used in an amount of 80 to 92 parts by mass, and more preferably 83 to 90 parts by mass, per 100 parts by mass of the curable resin composition. When preparing a curable resin composition for use as an interlayer insulating layer-forming material, or a substrate material for a copper-clad laminate, prepreg, RCC, or the like, the inorganic filler is preferably used in an amount of 5 to 80 parts by mass, and more preferably 10 to 60 parts by mass, per 100 parts by mass of the curable resin composition.

[0102] The curable resin composition of the present embodiment may further contain a compound having an ethylenically unsaturated bond, an isocyanate compound, a maleimide compound, a cyanate compound, or the like, and these may be used alone or in combination.

[0103] [Compound Having an Ethylenically Unsaturated Bond] The compound having an ethylenically unsaturated bond is a compound having one or more ethylenically unsaturated bonds in the molecule that can be polymerized by heat or light, regardless of whether a polymerization initiator is used. Examples of the compound having an ethylenically unsaturated bond include (meth)acrylate compounds such as isobornyl acrylate and acryloylmorpholine, reaction products of the above phenolic compounds with ethylenically unsaturated bond-containing halogen-based compounds (chloromethylstyrene, allyl chloride, methallyl chloride, acrylic acid chloride, methacrylic acid chloride, etc.), reaction products of ethylenically unsaturated bond-containing phenols (2-allylphenol, 2-propenylphenol, 4-allylphenol, 4-propenylphenol, eugenol, isoeugenol, etc.) with halogen-based compounds (1,4-bis(chloromethyl)benzene, 4, Examples of the isocyanuric acid derivative include, but are not limited to, reaction products of epoxy resins or alcohols with (meth)acrylic acids (acrylic acid, methacrylic acid, etc.), reaction products of epoxy resins or alcohols with (meth)acrylic acids (acrylic acid, methacrylic acid, etc.), and acid-modified products thereof, styrene resins, allyl group-containing compounds, acenaphthyl group-containing compounds (acenaphthylene, etc.), and isocyanuric acid derivatives (TAIC manufactured by Mitsubishi Chemical Corporation, MA-DGIC, DA-MGIC, MeDAIC, L-DAIC, DD-1 manufactured by Shikoku Chemicals Corporation, etc.). These may be used alone or in combination.

[0104] As the (meth)acrylate compound, commercially available products can be used, for example, STR-2000 (manufactured by Nippon Kayaku Co., Ltd., Xylok-type styrene resin), KAYARAD (registered trademark) R-604, KAYARAD (registered trademark) R-684, KAYARAD (registered trademark) HX-220, KAYARAD (registered trademark) HX-620, KAYARAD (registered trademark) DPHA, KAYARAD (registered trademark) DPCA-60, KAYARAD (registered trademark) DPEA-12, KAYARAD (registered trademark) PET-30, KAYARAD (registered trademark) ZXR-1801H (trade name, manufactured by Nippon Kayaku Co., Ltd.), KAYARAD (registered trademark) ZXR-1806H (trade name), product name), KAYARAD (registered trademark) ZXR-1810H (trade name), KAYARAD (registered trademark) ZXR-1889H (trade name), KAYARAD (registered trademark) ZCR-6001H, KAYARAD (registered trademark) ZCR-6002H, KAYARAD (registered trademark) ZCR-8001H, KAYARAD (registered trademark) ZCR-8002H, KAYARAD (registered trademark) ZAR-2001H, KAYARAD (registered trademark) ZAR-2002H, KAYARAD (registered trademark) UXE-3000, KAYARAD (registered trademark) PCR-1222H, CCR-1171H, KAYARAD (registered trademark) ZFR-1494H, and the like. These compounds having an ethylenically unsaturated bond can be used either individually or in combination of two or more.

[0105] [Isocyanate Compound] An isocyanate compound is a compound having two or more isocyanate groups in the molecule. Examples of the isocyanate compound include aromatic diisocyanates such as p-phenylene diisocyanate, m-phenylene diisocyanate, p-xylene diisocyanate, m-xylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, and naphthalene diisocyanate; aliphatic or alicyclic diisocyanates such as isophorone diisocyanate, hexamethylene diisocyanate, 4,4'-dicyclohexylmethane diisocyanate, hydrogenated xylene diisocyanate, norbornene diisocyanate, and lysine diisocyanate; polyisocyanates such as one or more biuret compounds of isocyanate monomers or isocyanate compounds obtained by trimerizing the above diisocyanate compounds; and polyisocyanates obtained by a urethanization reaction between the above isocyanate compounds and polyol compounds, but are not limited to these. These may be used alone or in combination.

[0106] [Maleimide Compound] A maleimide compound is a compound having one or more maleimide groups in the molecule. Examples of the maleimide compound include phenylmaleimide, 4,4'-diphenylmethane bismaleimide, polyphenylmethane maleimide, m-phenylene bismaleimide, 2,2'-bis[4-(4-maleimidophenoxy)phenyl]propane, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, 4-methyl-1,3-phenylene bismaleimide, 4,4'-diphenylether bismaleimide, 4,4'-diphenylsulfone bismaleimide, 1,3-bis(3-maleimidophenoxy)benzene, 1,3-bis(4-maleimidophenoxy)benzene), and Xyloc-type maleimide compounds (anilix). maleimide, manufactured by Mitsui Chemicals Fine Co., Ltd.), biphenylaralkyl-type maleimide compounds (solidified by distilling off the solvent under reduced pressure from a resin solution containing the maleimide compound (M2) described in Example 4 of JP 2009-001783 A), bisaminocumylbenzene-type maleimide (maleimide compounds described in WO 2020 / 054601 A), maleimide compounds having an indane structure described in Japanese Patent No. 6629692 or WO 2020 / 217679, MATERIAL STAGE Vol. 18, No. 12 2019 "Continued Epoxy Resin CAS Number Story - Curing Agent CAS Number Memorandum No. 31 Bismaleimide (1)" and MATERIAL STAGE Vol. 19, No. 12 2019 Examples of such maleimide compounds include those described in "Continued Epoxy Resin CAS Number Story - Curing Agent CAS Number Memorandum No. 32, Bismaleimide (2)" published in February 2019. Commercially available products include MIR-3000-70MT (biphenylaralkyl maleimide compound, manufactured by Nippon Kayaku Co., Ltd.) and MIZ-001 (manufactured by Nippon Kayaku Co., Ltd.), but are not limited to these. These compounds may be used alone or in combination.

[0107] [Cyanate Compound] The cyanate compound is a cyanate compound obtained by reacting a phenolic resin with a cyanogen halide, and specific examples include dicyanatobenzene, tricyanatobenzene, dicyanatonaphthalene, dicyanatobiphenyl, 2,2'-bis(4-cyanatophenyl)propane, bis(4-cyanatophenyl)methane, bis(3,5-dimethyl-4-cyanatophenyl)methane, 2,2'-bis(3,5-dimethyl-4-cyanatophenyl)propane, 2,2'-bis(4-cyanatophenyl)ethane, 2,2'-bis(4-cyanatophenyl)hexafluoropropane, bis(4-cyanatophenyl)sulfone, bis(4-cyanatophenyl)thioether, phenol novolac cyanate, and phenol-dicyclopentadiene co-condensates in which hydroxyl groups have been converted to cyanate groups. Commercially available products include, but are not limited to, SYTESTER TA (bisphenol A-type cyanate resin, manufactured by Mitsubishi Gas Chemical Company, Inc.). These may be used alone or in combination. Furthermore, the cyanate compound whose synthesis method is described in JP-A-2005-264154 is particularly preferred as the cyanate compound because it has low moisture absorption, excellent flame retardancy, and excellent dielectric properties.

[0108] The cyanate compound may optionally contain a catalyst such as zinc naphthenate, cobalt naphthenate, copper naphthenate, lead naphthenate, zinc octoate, tin octoate, lead acetylacetonate, or dibutyltin maleate to trimerize the cyanate group and form a sym-triazine ring. The catalyst is preferably used in an amount of 0.0001 to 0.10 parts by mass, and more preferably 0.00015 to 0.0015 parts by mass, per 100 parts by mass of the cyanate compound and the curable resin composition.

[0109] The curable resin composition of the present invention may be used in combination with a commonly available latent curing catalyst. Examples of commonly available latent curing catalysts include tetraphenylphosphonium tetraphenylborate (TPP-K manufactured by Hokko Chemical Co., Ltd.), tetraphenylborate salt of benzyl-modified 1,8-diazabicyclo[5,4,0]-7-undecene (DBU) (U-CAT5002 manufactured by San-Apro Co., Ltd.), phenolic resin salt of 1,5-diazabicyclo[4,3,0]-5-nonene (DBN) (U-CAT881 manufactured by San-Apro Co., Ltd.), adduct-type latent curing agents (PN-23J manufactured by Ajinomoto Fine-Techno Co., Ltd., Fujicure FXR-1030 manufactured by T&K Toka Corporation, etc.), and thiol-based liquid latent curing agents (Fujicure 7004 manufactured by T&K Toka Corporation), but are not limited thereto. These may be used alone or in combination.

[0110] [Additives] The curable resin composition of the present invention may contain additives, such as modified acrylonitrile copolymers, polyethylene, fluororesins, silicone gels, silicone oils, surface treatment agents for fillers such as silane coupling agents, release agents, and colorants such as carbon black, phthalocyanine blue, and phthalocyanine green.

[0111] If necessary, the curable resin composition of the present invention may contain, as additives other than those described above, commonly used additives for epoxy resins, such as dyes, fluorescent brighteners, reinforcing materials, white pigments or other pigments, nucleating agents, surfactants, plasticizers, viscosity modifiers, flowability modifiers, antioxidants, ultraviolet absorbers, and light stabilizers.

[0112] The amount of the additive to be added is preferably 1,000 parts by mass or less, more preferably 700 parts by mass or less, per 100 parts by mass of the curable resin composition.

[0113] The curable resin composition of the present invention may be prepared by any method without particular limitation, for example, by premixing the components in predetermined amounts and then mixing or melt-kneading them using a roll mixer, kneader, extruder, or the like.

[0114] The curable resin composition of the present invention may be cured by any known curing method, such as a sealed curing oven or a tunnel oven capable of continuous curing. The heat source is also not particularly limited, and any known method, such as hot air circulation, infrared heating, or high-frequency heating, may be used. The curing temperature and curing time may be appropriately set.

[0115] The use of the curable resin composition of the present invention is not particularly limited, and the composition can be applied to various fields and products in which resin materials are used, and can be widely used in electrical and electronic materials, construction, civil engineering, automotive, medical materials, and the like.

[0116] For example, examples of applications in electrical and electronic materials include adhesives, adhesive films, sealants, semiconductor encapsulants, insulating materials, heat-conducting and heat-dissipating materials, hot-melt materials, paints, potting agents, and the like. More specific examples include sealing materials and layer-forming materials for electronic components such as printed wiring boards, copper foils, copper-clad laminates, interlayer insulating materials, wiring coating films, resin-coated copper foils (RCC), and prepregs; forming materials for display devices such as color filters, films for flexible displays, resist materials, solder resist inks, and alignment films; forming materials for semiconductor devices such as resist materials and buffer coat films; and forming materials for optical components such as holograms, optical waveguides, optical circuits, optical circuit components, and antireflection films.

[0117] The present invention will be described in more detail below based on examples, but the present invention is not limited to these examples. Unless otherwise specified, "parts" and "%" in the text are based on mass.

[0118] [ １ H-NMR measurement] １ H-NMR was measured as follows: 10 mg of sample was dissolved in approximately 0.5 ml of deuterated DMSO, placed in a φ5 mm sample tube, and measured using a JNM-ECS400 manufactured by JEOL Ltd. The shift value was based on DMSO (δ = 2.49 ppm).

[0119] Synthesis Example 1 Synthesis of Compound C1 13.86 parts of 4-dimethylaminopyridine (4-DMAP) and 83.14 parts of acetone were placed in a 300 ml separable flask and heated to 45°C to dissolve. Then, 20.00 parts of benzyl bromide was added dropwise while taking care not to generate heat, and the mixture was allowed to react for 2 hours. The mixture was then cooled to 30°C to crystallize. The solid was recovered by suction filtration and washed three times with an excess amount of acetone. The obtained wet cake was dried under reduced pressure at 45°C for 4 hours to obtain Compound C1 represented by the following formula (1) as a white solid in a yield of 96%. １ The H-NMR spectrum data is shown in FIG.

[0120]

[0121] Synthesis Example 2 Synthesis of Compound C2 12.84 parts of sodium tetraphenylborate and 50 mL of methanol were placed in a 300 mL separable flask and dissolved. A solution prepared by dissolving 10.00 parts of compound C1 in 50 mL of methanol was slowly added dropwise to this solution, and the mixture was allowed to react for 2 hours, resulting in the precipitation of crystals. The solid was collected by suction filtration and washed three times with an excess amount of methanol. The obtained wet cake was dried under reduced pressure at 45°C for 4 hours to obtain compound C2 represented by the following formula (2) as a white solid in a yield of 92%. １ The H-NMR spectrum data is shown in FIG.

[0122]

[0123] Synthesis Example 3 Synthesis of Compound C3 Compound C3 represented by the following formula (3) was obtained as a white solid in a yield of 92% in the same manner as in Synthesis Example 1, except that 8.97 parts of pyridine was used instead of 13.86 parts of 4-DMAP. １ The H-NMR spectrum data is shown in FIG.

[0124]

[0125] Synthesis Example 4 Synthesis of Compound C4 Compound C4 represented by the following formula (4) was obtained as a white solid in a yield of 93% in the same manner as in Synthesis Example 2, except that compound C3 (8.53 parts) was used instead of compound C1 (10.00 parts). １The H-NMR spectrum data is shown in FIG.

[0126]

[0127] Synthesis Example 5 Synthesis of Compound C5 7.92 parts of phenyltrimethoxysilane, 6.40 parts of 2,3-dihydroxynaphthalene, and 50 mL of methanol were placed in a 300 mL separable flask and dissolved. A solution prepared by dissolving 1.6 parts of sodium hydroxide in 10 mL of methanol was added to this solution and stirred for 30 minutes. A solution prepared by dissolving 11.73 parts of compound C1 in 25 mL of methanol was slowly added dropwise to this solution, and the reaction was allowed to proceed for 2 hours, resulting in the precipitation of crystals. The solid was recovered by suction filtration and washed three times with an excess amount of methanol. The obtained wet cake was dried under reduced pressure at 45°C for 4 hours to obtain compound C5 represented by the following formula (5) as a gray solid in a yield of 79%. The obtained C5 １ The H-NMR spectrum data is shown in FIG.

[0128]

[0129] Comparative Synthesis Example 1 Synthesis of Compound C6 Compound C6 represented by the following formula (6) was obtained as a gray solid in a yield of 72% in the same manner as in Synthesis Example 5, except that tetraphenylphosphonium bromide (16.80 parts) was used instead of compound C1 (11.73 parts). １ The H-NMR spectrum data is shown in FIG.

[0130]

[0131] Synthesis Example 6 Synthesis of Compound C7 14.06 parts of 4-dimethylaminopyridine (4-DMAP) and 51.08 parts of acetone were placed in a 300 ml separable flask and heated to 50°C to dissolve. Then, 20.00 parts of 3-chloropropiophenone was added while taking care to avoid heat generation, and the mixture was allowed to react for 2 hours. The mixture was then cooled to 30°C to crystallize. The solid was recovered by suction filtration and washed three times with an excess amount of acetone. The obtained wet cake was dried under reduced pressure at 80°C for 2 hours to obtain Compound C7 represented by the following formula (7) as a white solid in a yield of 95%. １ The H-NMR spectrum data is shown in FIG.

[0132]

[0133] Synthesis Example 7 Synthesis of Compound C8 Compound C8 represented by the following formula (8) was obtained as a white solid in a yield of 34% in the same manner as in Synthesis Example 2, except that compound C7 (10.58 parts) was used instead of compound C1 (10.00 parts). １ The H-NMR spectrum data is shown in FIG.

[0134]

[0135] Synthesis Example 8 Synthesis of Compound C9 10.79 parts of phenyltrimethoxysilane and 5.99 parts of catechol were placed in a 300 ml separable flask. A solution prepared by dissolving 2.18 parts of sodium hydroxide in 35.0 parts of methanol was added thereto and stirred for 30 minutes. A solution prepared by dissolving 15.96 parts of compound C1 in 16.0 parts of methanol was slowly added dropwise to this solution, and the mixture was allowed to react for 5 hours, resulting in the precipitation of crystals. The solid was recovered by suction filtration and washed three times with an excess amount of methanol. The obtained wet cake was dried under reduced pressure at 80°C for 2 hours to obtain compound C9 represented by the following formula (9) as a white solid in a yield of 79%. The obtained C9 １ The H-NMR spectrum data is shown in FIG.

[0136]

[0137] [Examples 1 to 6, 14 to 16 and Comparative Examples 1 to 5] Phenol novolac curing agent H-1 (hydroxyl equivalent: 107, manufactured by UBE Corporation), epoxy resin NC-3000 (hydroxyl equivalent: 276, manufactured by Nippon Kayaku Co., Ltd.), and various curing accelerators were added in the amounts shown in Tables 1 and 2, and 3.45 parts of acetone was further added, stirred and mixed, and then dried under reduced pressure at 80°C for 1 hour to obtain a solid curable resin composition (equivalent ratio of epoxy equivalent to hydroxyl equivalent: 1.0).

[0138] [150°C Gel Time Measurement] An appropriate amount of each of the curable resin compositions obtained in Examples 1 to 6, 14, and 15 and Comparative Examples 1 to 5 was placed on a hot plate at 150°C and stirred using a Teflon (registered trademark) spatula. The time when the sample lost its tackiness and began to peel off from the hot plate, or the time when the tackiness disappeared, was measured using a gel time measuring device (Madoka MDK13G, manufactured by Cyber ​​Corporation). The results are shown in Tables 1 to 3 as the initial gel time. In addition, after storing the curable resin composition at 50°C for 6 hours, the gel time was measured in the same manner as above, and the results are shown in Tables 1 to 3 as the gel time after 6 hours of storage at 50°C. The gel time after 6 hours of storage at 50°C was divided by the initial gel time to determine the retention rate, and the results are shown in Tables 1 to 3.

[0139] [DSC Measurement] The curable resin compositions obtained in Examples 1 to 6, 14 to 16 and Comparative Examples 1 to 5 were measured using a thermogravimetric differential thermal analyzer (TGA / DSC1 manufactured by Mettler Toledo) under conditions of a measurement temperature range of 50 to 350°C and a temperature rise rate of 10°C / min, and the exothermic peak top temperatures are shown in Tables 1 to 3.

[0140]

[0141] TPP-K: tetraphenylphosphonium tetraphenylborate (manufactured by Hokko Chemical Industry Co., Ltd.) TPP: triphenylphosphine (manufactured by Fujifilm Wako Pure Chemical Industries Co., Ltd.) 4-DMAP: 4-dimethylaminopyridine (manufactured by Tokyo Chemical Industry Co., Ltd.)

[0142] As shown in Table 1, it was confirmed that the curable resin compositions of the Examples had higher gel time retention rates and better storage stability than the curable resin compositions of the Comparative Examples.

[0143]

[0144]

[0145] As shown in Tables 2 and 3, it was confirmed that the curable resin compositions of Examples had higher gel time retention rates and better storage stability than the curable resin compositions of Comparative Examples.

[0146] Examples 7 to 12 and Comparative Examples 6 to 10 An acid anhydride curing agent, Rikacid MH-T (acid anhydride equivalent: 168, manufactured by New Japan Chemical Co., Ltd.; main component: 4-methylhexahydrophthalic anhydride), an epoxy resin, jER828 (epoxy equivalent: 190, manufactured by Mitsubishi Chemical Corporation), and various curing accelerators were added in the amounts shown in Tables 4 and 5, and the mixture was stirred and mixed to obtain a liquid curable resin composition (equivalent ratio of epoxy equivalent to acid anhydride equivalent: 1.0).

[0147] [150°C Gel Time Measurement] An appropriate amount of each of the curable resin compositions obtained in Examples 7 to 12 and Comparative Examples 6 to 10 was placed on a hot plate at 150°C and stirred using a Teflon (registered trademark) spatula. The time when the sample lost its tackiness and began to peel off from the hot plate, or the time when the tackiness disappeared, was measured using a gel time measuring device (Madoka MDK13G manufactured by Cyber ​​Corp.). The results are shown as gel times in Tables 4 and 5.

[0148] [Viscosity Measurement and Storage Stability Test] The viscosity of the curable resin compositions obtained in Examples 7 to 12 and Comparative Examples 6 to 10 was measured at a measurement temperature of 25.0°C using an E-type viscometer (TVE-25H manufactured by Toki Sangyo Co., Ltd.). This viscosity was taken as the initial viscosity and is shown in Tables 4 and 5. In addition, after storing the curable resin compositions at 25°C for 24 hours, the viscosity was measured in the same manner as above, and the viscosity increase rate was calculated by dividing the viscosity by the initial viscosity. The results are shown in Tables 4 and 5.

[0149]

[0150]

[0151] As shown in Tables 4 and 5, it was confirmed that the curable resin compositions of Examples had better storage stability than the curable resin compositions of Comparative Examples. On the other hand, Comparative Example 7 had excellent storage stability, but its gel time exceeded 800 seconds, and it had a problem with curability.

[0152] [Example 13 and Comparative Examples 11 to 13] 10 parts of epoxy resin jER828 (epoxy equivalent: 190, manufactured by Mitsubishi Chemical Corporation) and 5.78 parts of phenol novolac curing agent H-1 (hydroxyl equivalent: 107, manufactured by UBE Corporation) were heated and stirred to completely dissolve. Thereafter, 0.05 parts of various curing accelerators were added and mixed with stirring to obtain liquid curable resin compositions.

[0153] [Electrical Conductivity Measurement] 4.0 parts of the curable resin composition obtained in Example 13 and Comparative Examples 11 to 13 was poured into an aluminum foil Petri dish (No. 2001, manufactured by Nonaka Rikaki Seisakusho Co., Ltd.) and cured at 150 ° C for 3 hours to obtain a cured product of the curable resin composition. 4.0 g of the obtained cured product and 40 g of ultrapure water were placed in a Teflon (registered trademark) PCT container, and the PCT container was sealed in an SUS pressure vessel and placed in a small thermostatic tester to perform ion extraction (120 ° C / 100 hours). After extraction, the electrical conductivity of the extracted water was measured using a Mettler Toledo SevenMulti-A, and the results are shown in Table 6.

[0154]

[0155] As shown in Table 6, the curable resin compositions of the Examples have lower electrical conductivity of extracted water than the curable resin compositions of the Comparative Examples, and therefore it can be said that the cured products contain fewer conductive impurities.

[0156] <Curability Test> [Reference Example 1] A mixture of 0.2 parts of the compound (C2) obtained in Synthesis Example 2, 20 parts of NC-3000 (a biphenylaralkyl epoxy resin manufactured by Nippon Kayaku Co., Ltd.), 0.5 parts of KAYAHARD GPH-65 (a biphenylaralkyl phenolic resin manufactured by Nippon Kayaku Co., Ltd.), 0.5 parts of MDEA: 4,4'-methylenebis(2-ethyl-6-methylaniline) (an amine resin manufactured by Tokyo Chemical Industry Co., Ltd.), 0.5 parts of KAYAHARD MCD (an acid anhydride compound manufactured by Nippon Kayaku Co., Ltd.), and Unifine 0.5 parts of W-575 (manufactured by Unitika Ltd., activated ester resin), 0.5 parts of G4-142MHR (manufactured by Nippon Kayaku Co., Ltd., carboxylic acid compound), 2.5 parts of MIR-3000-70MT (manufactured by Nippon Kayaku Co., Ltd., maleimide resin), 2.5 parts of MIZ-001 (manufactured by Nippon Kayaku Co., Ltd., maleimide resin), 0.5 parts of CYTESTER TA (manufactured by Mitsubishi Gas Chemical Co., Ltd., bisphenol A type cyanate resin), 60 parts of OPE-2St 2200 (manufactured by Mitsubishi Gas Chemical Co., Ltd., polyphenylene ether compound), 3 parts of STR-2000 (manufactured by Nippon Kayaku Co., Ltd., styrene resin), KAYARAD R-684 (manufactured by Nippon Kayaku Co., Ltd., acrylate resin) 1 part, LDFI089 (polyamide-imide resin obtained by the method described in WO2023013224A1) 1 part, Septon 2104 (manufactured by Kuraray Co., Ltd., hydrogenated styrene-based thermoplastic elastomer) 1 part, TAIC: triallyl isocyanurate (manufactured by Mitsubishi Chemical Corporation, allyl compound) 1 part, acenaphthylene (manufactured by Tokyo Chemical Industry Co., Ltd.) 0.5 parts, phenylmaleimide (manufactured by Tokyo Chemical Industry Co., Ltd.) ) 0.5 parts, DICY: dicyandiamide (Tokyo Chemical Industry Co., Ltd., amide compound) 1 part, DCP: dicumyl peroxide (Kayaku Nouryon Co., Ltd., curing accelerator) 1 part, 2E4MZ: 2-ethyl-4-methylimidazole (Shikoku Chemical Industry Co., Ltd., curing accelerator) 0.5 parts, TPP: triphenylphosphine (Hokuko Chemical Co., Ltd., curing accelerator) 0.5 parts, Octope Zn (Hope Pharmaceutical Co., Ltd., curing accelerator) 0.1 parts, San-Aid SI-B5 (Sanshin Chemical Co., Ltd., curing accelerator) 0.1 parts, toluene as a solvent 99.2 parts, tetrahydrofuran 49.6 parts were mixed in a ratio of 110 ° C. for 10 minutes under a nitrogen atmosphere and 220 ° C. for 1 hour to obtain a cured product.

[0157] Reference Example 2 0.5 parts of the compound (C2) obtained in Synthesis Example 2, 50 parts of NC-3000 (biphenylaralkyl epoxy resin manufactured by Nippon Kayaku Co., Ltd.), 10 parts of MIZ-001 (maleimide resin manufactured by Nippon Kayaku Co., Ltd.), 5 parts of STR-2000 (styrene resin manufactured by Nippon Kayaku Co., Ltd.), 45 parts of KAYARAD R-684 (acrylate resin manufactured by Nippon Kayaku Co., Ltd.), 1 part of Irgacure OXE-04 (photopolymerization initiator manufactured by BASF Corporation), and 1 part of Irgacure 290 (photopolymerization initiator manufactured by BASF Corporation) were mixed together and applied to a PET film to a film thickness of 100 μm. A PET film was also attached to the side not in contact with the film, and the mixture was exposed to 3000 mJ / cm irradiated with a high-pressure mercury lamp (365 nm). ２ A cured product was obtained by irradiating the composition with ultraviolet light.

[0158] The base generator of the present invention can be used, for example, as a latent curing accelerator for epoxy compounds. Because of its excellent storage stability, refrigeration of the composition is unnecessary, and because of its excellent curing properties, it can be cured at low temperatures. Because the cured product contains few conductive impurities, it is useful for resin encapsulation of various electrical and electronic components and semiconductor components.

Claims

1. A base generator represented by the following formula (a), which comprises a pyridinium cation and an anion residue of an organic acid or an inorganic acid: (In formula (a), A represents a divalent hydrocarbon group having 1 to 8 carbon atoms which may contain a heteroatom, and R １ ~R ５ each independently represents a hydrogen atom or an electron donating group; R １ and R ２ , R ２ and R ３ , R ３ and R ４ , R ４ and R ５ may be bonded to each other to form a ring structure. ６ ~R １０ each independently represents a hydrogen atom, a halogen atom, a hydroxyl group, an alkoxy group, a mercapto group, a sulfide group, a silyl group, a silanol group, a nitro group, a nitroso group, a cyano group, a sulfino group, a sulfo group, a sulfonato group, a phosphino group, a phosphinyl group, a phosphono group, a phosphonato group, an amino group, or an ammonio group; R ６ and R ７ , R ７ and R ８ , R ８ and R ９ , R ９ and R １０ may be bonded to each other to form a ring structure.) 2. R in the above formula (a) １ , R ２ , R ４ , and R ５ is a hydrogen atom, R ３ The base generator according to claim 1 , wherein is a hydrogen atom or a dimethylamino group.

3. The base generator according to claim 1 or 2, wherein A in formula (a) is an unsubstituted divalent hydrocarbon group having 1 to 8 carbon atoms, or a divalent hydrocarbon group having 1 to 8 carbon atoms which contains a carbonyl group, an ether group, an ester group, an amide group or a sulfide group.

4. The anionic residue X in the formula (a) － The base generator according to claim 1 or 2, wherein contains a halogen atom, a boron atom, or a silicon atom.

5. The anionic residue X in the formula (a) － The base generator according to claim 1 or 2, wherein the base generator is represented by the following formula (b-1): (In formula (b-1), R １１ ~R １４ each independently represents a linear or branched alkyl group having 1 to 16 carbon atoms, or a substituted or unsubstituted aromatic ring.

6. R in the above formula (b-1) １１ ~R １４ The base generator according to claim 5 , wherein each of the is a phenyl group.

7. The anionic residue X in the formula (a) － The base generator according to claim 1 or 2, wherein the base generator is represented by the following formula (b-2): (In formula (b-2), Y １ and Y ２ are organic groups and may be the same or different. １ represents a substituted or unsubstituted organic group having an aromatic ring or a heterocyclic ring, or a substituted or unsubstituted aliphatic group.

8. The anionic residue X in the formula (a) － The base generator according to claim 1 or 2, wherein the base generator is represented by the following formula (b-3) or the following formula (b-4):

9. A curable resin composition containing the base generator according to claim 1 or 2.

10. The curable resin composition according to claim 9, further comprising an epoxy resin.

11. The curable resin composition according to claim 10, further comprising a curing agent.

12. The curable resin composition according to claim 9, further comprising at least one selected from the group consisting of maleimide compounds, polyphenylene ether compounds, compounds having an ethylenically unsaturated bond, cyanate compounds, polybutadiene and modified products thereof, polystyrene and modified products thereof, and polyethylene and modified products thereof.

13. The curable resin composition according to claim 9, further comprising at least one selected from the group consisting of a thermal polymerization initiator, a photopolymerization initiator, an anionic curing accelerator, and a cationic curing accelerator.

14. The curable resin composition according to claim 9, which is used for any one of a semiconductor encapsulant, an adhesive, an adhesive film, a prepreg, an interlayer insulating material, and a heat conductive and heat dissipating material.

15. A cured product of the curable resin composition according to claim 9.

16. A printed wiring board having the cured product according to claim 15.

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