Electronic device comprising camera

Abstract

An electronic device disclosed in the present document may comprise a first printed circuit board and a camera module. The camera module may include: a lens unit; an image sensor which converts light transmitted through the lens unit, into an electrical signal; a second printed circuit board including a first surface on which the image sensor is mounted and a second surface facing in a direction opposite to the first surface; a first coupling member mounted on the second surface and coupled to the first printed circuit board by a magnetic force; and a first contact member mounted on the second surface and electrically connected to the first printed circuit board. Other embodiments identified through the specification are also possible.

Description

Electronic devices containing cameras

[0001] Embodiments disclosed in this document relate to an electronic device including a camera.

[0002] Electronic devices such as smartphones and tablet PCs can capture photos or videos using camera modules (or cameras, camera devices, or imaging devices). Recently, high-resolution, high-performance camera modules with various shooting functions are being integrated into electronic devices.

[0003] Electronic devices may include multiple camera modules with different characteristics. For example, various camera modules, such as a wide-angle camera, an ultra-wide-angle camera, or a telephoto camera, are integrated into an electronic device.

[0004] A camera module may include a lens, an image sensor, and a printed circuit board. The camera module transmits light through the lens, which is then converted into an electrical signal by an image sensor mounted on the printed circuit board. Recently, image sensor performance has improved, and high-resolution camera modules are being used. This has led to a demand for high-speed data transmission between the camera module's printed circuit board and the main printed circuit board within the electronic device.

[0005] Various interfaces are used to transmit camera data between the circuit board within the camera module and the main printed circuit board of the electronic device. For example, the Mobile Industry Processor Interface Camera Serial interface (MIPI-CSI) is used as a camera interface. Furthermore, with the advancement of camera technology, demand for high-speed communication of high-resolution data is increasing, and camera interfaces with improved transmission speeds, such as MIPI D-PHY and C-PHY, are being used.

[0006] An electronic device according to one embodiment may include a first printed circuit board and a camera module. The camera module may include a lens unit, an image sensor that converts light passing through the lens unit into an electrical signal, a second printed circuit board having a first surface on which the image sensor is mounted and a second surface facing in an opposite direction to the first surface, a first coupling member mounted on the second surface and coupled to the first printed circuit board by magnetic force, and a first contact member mounted on the second surface and electrically connected to the first printed circuit board.

[0007] A camera module according to one embodiment may include a lens unit, an image sensor that converts light passing through the lens unit into an electrical signal, a printed circuit board including a first surface on which the image sensor is mounted and a second surface facing in an opposite direction to the first surface, a first coupling member mounted on the second surface and coupled to an external printed circuit board by magnetic force, and a first contact member mounted on the second surface and electrically connected to the external printed circuit board.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0009] FIG. 2 is a block diagram illustrating a camera module according to various embodiments.

[0010] FIG. 3A is a front perspective view of an electronic device according to one embodiment.

[0011] FIG. 3b is a rear perspective view of an electronic device according to one embodiment.

[0012] FIG. 3c is an exploded perspective view of an electronic device according to one embodiment.

[0013] Figures 4a to 4c illustrate the combination of a camera module and a main PCB according to one embodiment.

[0014] FIGS. 5A and 5B illustrate a camera PCB including a guide pole according to one embodiment.

[0015] FIG. 6 illustrates a camera PCB including a protruding first joining member according to one embodiment.

[0016] Figure 7 illustrates a camera PCB including various protruding first joining members.

[0017] FIG. 8 illustrates a camera PCB including a ground shielding pattern according to one embodiment.

[0018] FIG. 9 illustrates a camera PCB including a protruding first joining member and a ground shielding pattern according to one embodiment.

[0019] Figure 10 illustrates contact pads having various widths according to one embodiment.

[0020] Figures 11a and 11b illustrate the combination of multiple camera modules according to one embodiment.

[0021] Fig. 12 illustrates a shielding member for a magnetic field inside a camera module according to one embodiment.

[0022] Fig. 13 shows the pin shape of the first contact member according to one embodiment.

[0023] Fig. 14 illustrates a first contact member of a buffer structure according to one embodiment.

[0024] FIG. 15 illustrates a structure for preventing image sensor cracks, according to one embodiment.

[0025] FIG. 16 illustrates a first contact member having various contact pin thicknesses according to one embodiment.

[0026] Fig. 17 shows a guide structure using a camera housing according to one embodiment.

[0027] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0028] Hereinafter, various embodiments of this document will be described with reference to the attached drawings. However, this is not intended to limit the technology described in this document to specific embodiments, and it should be understood that various modifications, equivalents, and / or alternatives of the embodiments of this document are included. In connection with the description of the drawings, similar reference numerals may be used for similar components.

[0029]

[0030] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with the electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0031] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0032] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0033] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0034] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0035] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0036] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0037] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0038] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0039] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0040] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0041] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0042] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0043] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0044] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0045] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0046] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0047] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0048] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0049] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0050] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0051] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0052]

[0053] FIG. 2 is a block diagram (200) illustrating a camera module (180) according to various embodiments.

[0054] Referring to FIG. 2, the camera module (180) may include a lens assembly (210), a flash (220), an image sensor (230), an image stabilizer (240), a memory (250) (e.g., a buffer memory), or an image signal processor (260). The lens assembly (210) may collect light emitted from a subject that is a target of image capturing. The lens assembly (210) may include one or more lenses. According to one embodiment, the camera module (180) may include a plurality of lens assemblies (210). In this case, the camera module (180) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (210) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties that are different from the lens properties of the other lens assemblies. A lens assembly (210) may include, for example, a wide-angle lens or a telephoto lens.

[0055] The flash (220) can emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash (220) can include one or more light-emitting diodes (e.g., red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor (330) can acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (210) into an electrical signal. According to one embodiment, the image sensor (330) can include one image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same property, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (330) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0056] The image stabilizer (240) can move at least one lens or image sensor (330) included in the lens assembly (210) in a specific direction or control the operating characteristics of the image sensor (330) (e.g., adjusting the read-out timing, etc.) in response to the movement of the camera module (180) or the electronic device (101) including the same. This allows compensating for at least some of the negative effects of the movement on the captured image. According to one embodiment, the image stabilizer (240) can detect the movement of the camera module (180) or the electronic device (101) by using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module (180). According to one embodiment, the image stabilizer (240) can be implemented as, for example, an optical image stabilizer.

[0057] The memory (250) can temporarily store at least a portion of the image acquired through the image sensor (330) for the next image processing task. For example, when image acquisition is delayed due to the shutter, or when multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (250), and a corresponding copy image (e.g., a low-resolution image) can be previewed through the display device (160). Thereafter, when a specified condition is satisfied (e.g., a user input or a system command), at least a portion of the original image stored in the memory (250) can be acquired and processed, for example, by the image signal processor (260). According to one embodiment, the memory (250) can be configured as at least a portion of the memory (130) or as a separate memory that operates independently therefrom.

[0058] The image signal processor (260) can perform one or more image processing operations on an image acquired through an image sensor (330) or an image stored in a memory (250). The one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor (260) may perform control (e.g., exposure time control, read-out timing control, etc.) for at least one of the components included in the camera module (180) (e.g., image sensor (330)). The image processed by the image signal processor (260) may be stored back in the memory (250) for further processing or provided to an external component of the camera module (180) (e.g., memory (130), display device (160), electronic device (102), electronic device (104), or server (108)). According to one embodiment, the image signal processor (260) may be configured to perform a control operation of the processor (120). At least part of the image signal processor (260) may be configured as a separate processor that operates independently of the processor (120). When the image signal processor (260) is configured as a separate processor from the processor (120), at least one image processed by the image signal processor (260) may be displayed through the display device (160) as is or after undergoing additional image processing by the processor (120). According to various embodiments, at least part of the image signal processor (260) may be included in a processor (e.g., the processor (120) of FIG. 1).

[0059] According to one embodiment, the electronic device (101) may include a plurality of camera modules (180), each having different properties or functions. For example, the electronic device (101) may include a plurality of camera modules (180) having lenses (e.g., lens assemblies (210)) having different angles of view, and the electronic device (101) may control the electronic device (101) to change the angle of view of the camera modules (180) based on a user's selection. For example, at least one of the plurality of camera modules (180) may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (180) may be a front camera, and at least another may be a rear camera. In addition, the plurality of camera modules (180) may include at least one of a wide-angle camera, a telephoto camera, a color camera, a monochrome camera, or an infrared (IR) camera (e.g., a time of flight (TOF) camera, a structured light camera). According to one embodiment, the IR camera may be operated as at least a part of a sensor module (e.g., sensor module (176) of FIG. 1). For example, the TOF camera may be operated as at least a part of a sensor module (e.g., sensor module (176) of FIG. 1) for detecting a distance to a subject.

[0060]

[0061] FIG. 3A is a front perspective view of an electronic device according to one embodiment. FIG. 3B is a rear perspective view of an electronic device according to one embodiment. FIG. 3C is an exploded perspective view of an electronic device according to one embodiment.

[0062] Referring to FIGS. 3A and 3B , an electronic device (300) according to an embodiment (e.g., the electronic device (101) of FIG. 1 ) may include a housing (310) that includes a first side (or front side) (310A), a second side (or back side) (310B), and a third side (or side side) (310C) that surrounds a space between the first side (310A) and the second side (310B). In an embodiment, the housing (310) may also refer to a structure that forms a portion of the first side (310A), the second side (310B), and the third side (310C).

[0063] The first side (310A) may be formed by a front plate (302) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (310B) may be formed by a substantially opaque back plate (311). The back plate (311) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The third side (310C) may be formed by a side bezel structure (or side member) (318) that is joined to the front plate (302) and the back plate (311) and includes a metal and / or a polymer. In various embodiments, the back plate (311) and the side bezel structure (318) may be formed integrally and may include the same material (e.g., a metal material such as aluminum).

[0064] The front plate (302) may include two first regions (310D) that extend seamlessly from a portion of the first surface (310A) toward the rear plate (311). The first regions (310D) may be located at both ends of a long edge of the front plate (302).

[0065] The rear plate (311) may include two second regions (310E) that extend seamlessly from a portion of the second surface (310B) toward the front plate (302). The second regions (310E) may include both long edges of the rear plate (311).

[0066] In one embodiment, the front plate (302) (or the back plate (311)) may include only one of the first regions (310D) (or the second regions (310E)). Additionally, in another embodiment, the front plate (302) (or the back plate (311)) may not include some of the first regions (310D) (or the second regions (310E)).

[0067] In one embodiment, the side bezel structure (318) may have a first thickness (or width) in a side direction (e.g., a short side) that does not include the first regions (310D) or the second regions (310E) as viewed from the side of the electronic device (300), and may have a second thickness that is thinner than the first thickness in a side direction (e.g., a long side) that includes the first regions (310D) or the second regions (310E).

[0068] The electronic device (300) may include at least one of a display (301) (e.g., a display module (160) of FIG. 1), an audio module (not shown) (e.g., an audio module (170) of FIG. 1), a sensor module (not shown) (e.g., a sensor module (176) of FIG. 1), a camera module (305, 312, 313) (e.g., a camera module (180) of FIG. 1), a key input device (317) (e.g., an input module (150) of FIG. 1), a light-emitting element (not shown), and a connector hole (308) (e.g., a connection terminal (178) of FIG. 1). In another embodiment, the electronic device (300) may omit at least one of the above components (e.g., a key input device (317) or a light-emitting element (not shown)) or may additionally include other components.

[0069] The display (301) may be visually exposed through a significant portion of the front plate (302). For example, at least a portion of the display (301) may be visually exposed through the front plate (302) including the first area (310D) of the first side (310A) and the third side (310C). The display (301) may be disposed on the back surface of the front plate (302).

[0070] The corners of the display (301) may be formed to be substantially identical to the adjacent outer shape of the front plate (302). In another embodiment, in order to expand the area where the display (301) is visually exposed, the gap between the outer edge of the display (301) and the outer edge of the front plate (302) may be formed to be substantially identical.

[0071] The surface (or front plate (302)) of the housing (310) may include a screen display area formed as the display (301) is visually exposed. For example, the screen display area may include a first surface (310A) and first areas (310D) of the side surfaces.

[0072] In one embodiment, the screen display area (310A, 310D) may include a sensing area (not shown) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (310A, 310D) includes the sensing area" may be understood to mean that at least a portion of the sensing area may overlap the screen display area (310A, 310D). For example, the sensing area (not shown) may be an area capable of displaying visual information by the display (301) like other areas of the screen display area (310A, 310D) and additionally capable of acquiring biometric information of the user (e.g., fingerprint).

[0073] The screen display area (310A, 310D) of the display (301) may include an area where the first camera module (305) (e.g., a punch hole camera) is visually exposed. For example, the area where the first camera module (305) is visually exposed may have at least a portion of its edge surrounded by the screen display area (310A, 310D). In various embodiments, the first camera module (305) may include a plurality of camera modules (e.g., the camera module (180) of FIG. 1).

[0074] In one embodiment, the display (301) may be configured such that at least one of an audio module (not shown), a sensor module (not shown), a camera module (e.g., a first camera module (305)), and a light-emitting element (not shown) is disposed on the back surface of the screen display area (310A, 310D). For example, the electronic device (300) may be configured such that the first camera module (305) (e.g., an under display camera (UDC)) is disposed on the back surface (e.g., a surface facing the -Z-axis direction) of the first surface (310A) (e.g., a front surface) and / or the side surface (310C) (e.g., at least one surface of the first area (310D)) so as to face the first surface (310A) and / or the side surface (310C). For example, the first camera module (305) may be positioned below the display (301) and may not be visually exposed to the screen display area (310A, 310D).

[0075] In one embodiment, when the first camera module (305) is configured as an under-display camera, the display (301) may be formed as a transparent area having a designated transmittance as a part of the display area that displays content in an area facing the first camera module (305). For example, the transparent area may be formed to have a transmittance in a range of about 5% to about 50%. This transparent area may include an area overlapping with an effective area (e.g., a field of view (FOV) area) of the first camera module (305) through which light passes to be imaged by an image sensor (e.g., the image sensor (230) of FIG. 3B) to create an image. For example, the transparent area of ​​the display (301) may include an area having a lower pixel density and / or wiring density than the surrounding area.

[0076] The display (301) may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0077] The audio module can acquire or output audio signals through microphone holes (303, 304) and speaker holes (307). The microphone holes (303, 304) may include a first microphone hole (303) formed in a portion of the third surface (310C) and a second microphone hole (304) formed in a portion of the second surface (310B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (303, 304). The microphone may include multiple microphones to detect the direction of the sound.

[0078] A second microphone hole (304) formed in a portion of the second surface (310B) may be positioned adjacent to a camera module (305, 312, 313). For example, the second microphone hole (304) may acquire sound when the camera module (305, 312, 313) is running, or may acquire sound when another function is running.

[0079] The speaker hole (307) may include an external speaker hole (307) and a call receiver hole (not shown). The external speaker hole (307) may be formed in a part of the third surface (310C) of the electronic device (300). In another embodiment, the external speaker hole (307) may be implemented as a single hole with the microphone hole (303). Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (310C). For example, the call receiver hole may be formed in another part of the third surface (310C) (e.g., a part facing the -Y-axis direction) that faces a part of the third surface (310C) where the external speaker hole (307) is formed (e.g., a part facing the -Y-axis direction). According to various embodiments, the receiver hole for the call may not be formed in a part of the third side (310C), but may be formed by a gap between the front plate (302) (or display (301)) and the side bezel structure (318).

[0080] The electronic device (300) may include at least one speaker (not shown) configured to output sound to the outside of the housing (310) through an external speaker hole (307) or a call receiver hole (not shown). According to various embodiments, the speaker may include a piezo speaker in which the speaker hole (307) is omitted.

[0081] A sensor module (not shown) can generate an electrical signal or data value corresponding to an internal operating state of an electronic device (300) or an external environmental state. For example, the sensor module can include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0082] In one embodiment, the camera modules (305, 312, 313) may include a first camera module (305) (e.g., a punch hole camera) exposed to a first side (310A) of the electronic device (300), a second camera module (312) exposed to a second side (310B), and / or a flash (313).

[0083] In one embodiment, the first camera module (305) may be visually exposed through a portion of the screen display area (310A, 310D) of the display (301). For example, the first camera module (305) may be visually exposed to a portion of the screen display area (310A, 310D) through an opening (not shown) formed in a portion of the display (301). In another example, the first camera module (305) (e.g., an under-display camera) may be disposed on the back surface of the display (301) and may not be visually exposed to the screen display area (310A, 310D).

[0084] The second camera module (312) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (312) is not necessarily limited to including multiple cameras and may include one camera.

[0085] The first camera module (305) and the second camera module (312) may include one or more lenses, image sensors, and / or image signal processors. The flash (313) may include, for example, a light-emitting diode or a xenon lamp. In another embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (300).

[0086] The key input device (317) may be disposed on the third side (310C) of the housing (310) (e.g., the first areas (310D) and / or the second areas (310E)). In another embodiment, the electronic device (300) may not include some or all of the key input devices (317), and the key input devices (317) that are not included may be implemented in another form, such as a soft key, on the display (301). In another embodiment, the key input device may include a sensor module (not shown) that forms a sensing area (not shown) included in the screen display area (310A, 310D).

[0087] The connector hole (308) can accommodate a connector. The connector hole (308) can be arranged on the third side (310C) of the housing (310). For example, the connector hole (308) can be arranged on the third side (310C) so as to be adjacent to at least a portion of an audio module (e.g., a microphone hole (303) and a speaker hole (307)). In another embodiment, the electronic device (300) can include a first connector hole (308) that can accommodate a connector (e.g., a USB connector) for transmitting / receiving power and / or data with an external electronic device, and / or a second connector hole (not shown) that can accommodate a connector (e.g., an earphone jack) for transmitting / receiving audio signals with an external electronic device.

[0088] The electronic device (300) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (310A) of the housing (310). The light-emitting element (not shown) may provide status information of the electronic device (300) in the form of light. In another embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (305). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0089] Referring to FIG. 3c, an electronic device (300) according to one embodiment may include a front plate (320) (e.g., the front plate (302) of FIG. 3a), a display (330) (e.g., the display (301) of FIG. 3a), a side member (340) (e.g., the side bezel structure (318) of FIG. 3a), a printed circuit board (350), a rear case (360), a battery (370), and a rear plate (380) (e.g., the rear plate (311) of FIG. 3b).

[0090] In various embodiments, the electronic device (300) may omit at least some of the above components (e.g., the rear case (360)), or may additionally include other components. Some of the components of the electronic device (300) illustrated in FIG. 3c may be identical or similar to some of the components of the electronic device (300) illustrated in FIGS. 3a and 3b, and any redundant descriptions thereof will be omitted below.

[0091] The front plate (320) and the display (330) may be coupled to the side member (340). For example, referring to FIG. 3C, the front plate (320) and the display (330) may be positioned below the side member (340). The front plate (320) and the display (330) may be positioned in the +Z-axis direction from the side member (340). For example, the display (330) may be coupled below the side member (340), and the front plate (320) may be coupled below the display (330). The front plate (320) may form a part of the outer surface (or exterior) of the electronic device (300). The display (330) may be positioned between the front plate (320) and the side member (340) so as to be located inside the electronic device (300).

[0092] The side member (340) may be positioned between the display (330) and the back plate (380). For example, the side member (340) may be configured to surround the space between the back plate (380) and the display (330).

[0093] The side member (340) may include a side frame (or frame structure) (341) forming a portion of a side of the electronic device (300) (e.g., the third side (310C) of FIG. 3A) and a plate structure (342) extending inward from the side frame (341).

[0094] The plate structure (342) may be disposed inside the side frame (341) so as to be surrounded by the side frame (341). The plate structure (342) may be connected to the side frame (341) or may be formed integrally with the side frame (341). The plate structure (342) may be formed of a metallic material and / or a non-metallic (e.g., polymer) material. In one embodiment, the plate structure (342) may support other components included in the electronic device (300). For example, at least one of a display (330), a printed circuit board (350), a rear case (360), and a battery (370) may be disposed on the plate structure (342). For example, the plate structure (342) may have the display (330) coupled to one side (e.g., a side facing the +Z-axis direction) and the printed circuit board (350) coupled to the opposite side (e.g., a side facing the -Z-axis direction).

[0095] The rear case (360) may be positioned between the rear plate (380) and the plate structure (342). The rear case (360) may be coupled to the side member (340) so as to overlap at least a portion of the printed circuit board (350). For example, the rear case (360) may face the plate structure (342) with the printed circuit board (350) interposed therebetween.

[0096] A printed circuit board (350) may be equipped with a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0097] A battery (370) (e.g., battery (189) of FIG. 1) may power at least one component of the electronic device (300). For example, the battery (370) may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (370) may be disposed substantially flush with the printed circuit board (350). The battery (370) may be integrally disposed within the electronic device (300), or may be disposed detachably from the electronic device (300).

[0098] The first camera module (305) may be positioned on at least a portion of the side member (340) (e.g., the plate structure (342)) such that the lens may receive external light through a portion of the front plate (320) (e.g., the front surface (310A) of FIG. 3A). For example, the lens of the first camera module (305) may be visually exposed through a portion of the front plate (320). The display (330) may be formed with a camera area (337) (e.g., an aperture area or a light-transmitting area) corresponding to the first camera module (305).

[0099] The second camera module (312) may be disposed on the printed circuit board (350) such that the lens can receive external light through the camera area (384) of the rear plate (380) of the electronic device (300) (e.g., the rear surface (310B) of FIG. 3B). For example, the lens of the second camera module (312) may be visually exposed to the camera area (384). In one embodiment, the second camera module (312) may be disposed in at least a portion of an internal space formed in a housing of the electronic device (300) (e.g., the housing (310) of FIGS. 3A and 3B) and may be electrically connected to the printed circuit board (350) via a connecting member (e.g., a connector).

[0100] The camera area (384) may be formed on a surface of the rear plate (380) (e.g., the rear surface (310B) of FIG. 3B). In one embodiment, the camera area (384) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (312). In one embodiment, at least a portion of the camera area (384) may protrude from the surface of the rear plate (380) by a predetermined height. However, the present invention is not limited thereto, and the camera area (384) may also form a substantially flat surface with the surface of the rear plate (380).

[0101]

[0102] Figures 4a to 4c illustrate the combination of a camera module and a main PCB according to one embodiment.

[0103] Referring to FIGS. 4A and 4B , a camera module (410) (or camera, camera device, imaging device) may be mounted on a camera PCB (420). The camera module (410) may include various components related to capturing images, such as a lens unit (or barrel unit), an actuator, a base, or an image sensor, within the camera module. The image sensor (not shown) may be mounted on the camera PCB (420) and electrically connected thereto. Additional information regarding the internal configuration of the camera module (410) may be provided through a separate drawing (FIG. 12).

[0104] The camera PCB (420) may be placed between the camera module (410) and the main PCB (450). Hereinafter, the camera PCB (420) and the camera module (410) are discussed as separate components, but are not limited thereto. The camera PCB (420) may be a component of the camera module (410).

[0105] The first side of the camera PCB (420) can be coupled to the camera module (410). An image sensor (not shown) inside the camera module (410) can be mounted on the camera PCB (420).

[0106] The second surface (420b) of the camera PCB (420) may include a first contact member (430) for electrical connection to the main PCB (450). The first contact member (430) may be disposed in a central region of the second surface (420b). In FIG. 4b, the first contact member (430) is exemplarily illustrated as including a plurality of contact pads having a uniform width, but is not limited thereto. For example, the first contact member (430) may include a plurality of contact pads, at least some of which may have different widths. Alternatively, the first contact member (430) may be a contact pin protruding toward the main PCB (450). Additional information regarding the first contact member (430) may be provided through a separate drawing.

[0107] The camera PCB (420) may include a first bonding member (440) for physically bonding to the main PCB (420) on the second side (420b). For example, the first bonding member (440) may be a magnet or a metal pad and may be bonded to the camera PCB (420) using epoxy. The epoxy may be naturally cured or UV cured.

[0108] The camera PCB (420) can be magnetically coupled to the main PCB (420) through the first coupling member (440). The first coupling member (440) may be positioned in an outer region rather than a central region of the camera PCB (420). In FIG. 4b, the first coupling member (440) is exemplarily illustrated as not protruding in the direction toward the main PCB (420) (Z+ direction) and forming the same plane as the second plane (420b) of the camera PCB (420), but is not limited thereto. For example, the first coupling member (440) may also protrude in the direction toward the main PCB (420) (Z+ direction). Additional information regarding the protruding first coupling member (440) may be provided through a separate drawing (see FIG. 6).

[0109] According to one embodiment, there may be a plurality of first coupling members (440). The first coupling members (440) may be arranged in a form that facilitates fixing or coupling of the camera PCB (420) to the main PCB (450). For example, there may be three first coupling members (440), and each first coupling member (440) may be arranged at three of the four vertices of the camera PCB (420). In FIG. 3, a case in which there are three first coupling members (440) is illustrated as an example, but the present invention is not limited thereto.

[0110] Referring to FIG. 4C, the main PCB (420) may be the printed circuit board (350) in FIG. 3C. The main PCB (450) may include a second contact member (460) corresponding to the first contact member (430). The second contact member (460) may be positioned at a position corresponding to the first contact member (430) and may have a shape corresponding to the first contact member (430). When the first coupling member (440) and the second coupling member (470) are coupled to each other, the second contact member (460) may be electrically connected to the first contact member (430).

[0111] The main PCB (450) may include a second joining member (470) corresponding to the first joining member (440). For example, the second joining member (470) may be a magnet or a metal pad, and may be bonded to the main PCB (450) by surface mount technology (SMT) or using epoxy. The second joining member (470) may be positioned corresponding to the first joining member (440). The second joining member (470) may be coupled to the first joining member (440) by magnetic force.

[0112] In one embodiment, one of the first coupling member (440) and the second coupling member (470) may be a magnet, and the other may be a metal pad or metal plate. In another embodiment, both the first coupling member (440) and the second coupling member (470) may be magnets, and may be arranged with opposite poles facing each other to form an attractive force.

[0113] The camera module (410) can be connected to the main PCB (450) without using a separate FPCB or connector. This ensures high-speed transmission of camera data and stable contact between the PCBs.

[0114]

[0115] Figures 5a and 5b illustrate a camera PCB including a guide pole according to one embodiment. Descriptions of the same configuration as Figures 4a to 4c are omitted.

[0116] Referring to FIGS. 5A and 5B, the camera module (410) may be mounted on a first surface of the camera PCB (420). In addition to the first contact member (430) and the first coupling member (440), the camera PCB (420) may further include a guide pole (445) on a second surface (420b). The guide pole (445) may protrude from the second surface (420b) of the camera PCB (420) toward the main PCB (420). For example, the guide pole (445) may be bonded to the camera PCB (420) using epoxy. The epoxy may be naturally cured or UV cured.

[0117] According to one embodiment, there may be a plurality of guide poles (445). The guide poles (445) may be arranged in a form that is easy to be fixed or coupled to the main PCB (420). For example, if there are three guide poles (445), they may be arranged one at each of three of the four vertices of the camera PCB (420). In FIG. 3, the case where there are three guide poles (445) is illustrative and is not limited thereto.

[0118] According to one embodiment, the guide poles (445) may be the same number as the first coupling member (440) and may be positioned at a point adjacent to the first coupling member (440). The guide poles (445) may be positioned further from the center of the second surface (420b) of the camera PCB (420) than the first coupling member (440).

[0119] In addition to the second contact member (460) and the second coupling member (470), the main PCB (450) may further include a guide hole (475) corresponding to the guide pole (445). The guide hole (475) may be positioned at a position corresponding to the guide pole (445). When the guide pole (445) is inserted into the guide hole (475) and fixed, the first coupling member (440) and the second coupling member (470) may be coupled by magnetic force. When an impact occurs from the outside, the first coupling member (440) and the second coupling member (470) may be separated. The guide pole (445) and the guide hole (475) may supplement the magnetic coupling of the first coupling member (440) and the second coupling member (470), and may prevent the camera PCB (420) and the main PCB (450) from moving on the XY plane.

[0120] Depending on the position of the first joining member (440) or the guide pole (445), the joining direction of the camera PCB (420) and the main PCB (450) can be predetermined, and mixing or reverse insertion of other camera module models can be prevented. This can reduce assembly defects and be advantageous in automating the process of joining the camera PCB (420) and the main PCB (450).

[0121]

[0122] FIG. 6 illustrates a camera PCB including a protruding first joining member according to one embodiment.

[0123] Referring to FIG. 6, the camera PCB (620) may include a first contact member (630) for electrically connecting to the main PCB (650) in a central region of the second surface (620b). In addition, the camera PCB (620) may include a first coupling member (640) for physically connecting to the main PCB (620) in the second surface (620b). The first coupling member (640) may be disposed around the first contact member (630).

[0124] The first joining member (640) may protrude from the second surface (620b) in a direction (Z+ direction) toward the main PCB (620). The camera PCB (620) may be magnetically joined to the main PCB (620) through the first joining member (640).

[0125] According to one embodiment, there may be a plurality of first coupling members (640). The first coupling members (640) may be arranged in a form that is easy to be fixed or coupled to the main PCB (620). For example, if there are three first coupling members (640), they may be arranged one at a time close to three of the four vertices of the camera PCB (620). In FIG. 6, the case where there are three first coupling members (640) is illustrative and is not limited thereto (see FIG. 7).

[0126] The main PCB (650) may include a second contact member (660), a coupling hole (670), and a second coupling member (675). On a first surface (650a) of the main PCB (650), the coupling hole (670) may be positioned at a position corresponding to the first coupling member (640). The first coupling member (640) may be inserted into and fixed in the coupling hole (670). The second coupling member (675) may be positioned on a second surface (650b) of the main PCB (650). The first coupling member (640) may pass through the coupling hole (670) and be coupled to the second coupling member (675) by magnetic force. The coupling hole (670) can complement the magnetic coupling of the first coupling member (640) and the second coupling member (675), and can prevent the camera PCB (620) and the main PCB (650) from moving on the XY plane.

[0127] In Fig. 6, the second connecting member (675) is exemplarily illustrated as being formed as a single plate, but is not limited thereto. For example, the second connecting member (675) may be composed of separate pads corresponding to each connecting hole (670).

[0128]

[0129] Figure 7 illustrates a camera PCB including various protruding first joining members.

[0130] Referring to FIG. 7, in the first embodiment (701), the camera PCB (721) may include a first coupling member (741, 742) for coupling to the main PCB on the second surface. The camera PCB (721) may be coupled to the main PCB by magnetic force through the first coupling member (741, 742). The first coupling member (741, 742) may be arranged around the first contact member (731). The first coupling member (741, 742) may protrude in a direction (Z+ direction) toward the main PCB.

[0131] The first connecting members (741, 742) may have the same square pillar shape. Among the first connecting members (741, 742), the connecting member (741) may be positioned at the center of the first direction (Y+ direction) of the first contact member (731), and among the first connecting members (741, 742), the connecting member (742) may be positioned adjacent to one vertex of the camera PCB (721) in the second direction (Y- direction) of the first contact member (731).

[0132] In the second embodiment (702), the camera PCB (722) may include a first coupling member (751, 752, 753) for coupling to the main PCB on the second surface. The camera PCB (722) may be coupled to the main PCB by magnetic force through the first coupling member (751, 752, 753). The first coupling member (751, 752, 753) may be arranged around the first contact member (732). The first coupling member (751, 752, 753) may protrude in a direction (Z+ direction) toward the main PCB.

[0133] The first joining members (751, 752, 753) may all have the same cylindrical shape. The first joining members (751, 752, 753) may be positioned adjacent to three of the four vertices of the camera PCB (721), respectively.

[0134] In the third embodiment (703), the camera PCB (723) may include a first coupling member (761, 762) for coupling to the main PCB on the second surface. The camera PCB (723) may be coupled to the main PCB by magnetic force through the first coupling member (761, 762). The first coupling member (761, 762) may be arranged around the first contact member (733). The first coupling member (761, 762) may protrude in a direction (Z+ direction) toward the main PCB.

[0135] The first coupling members (761, 762) may have different sizes and shapes. Among the first coupling members (761, 762), the coupling member (761) may have a square pillar shape of a first size. The coupling member (761) may be arranged adjacent to a vertex of the camera PCB (723) in a first direction (Y+ direction) of the first contact member (731). Among the first coupling members (761, 762), the coupling member (762) may have a square pillar shape of a second size smaller than the first size. The coupling member (762) may be arranged adjacent to one vertex of the camera PCB (721) in a second direction (Y- direction) of the first contact member (731). On the second surface of the camera PCB (723), the coupling members (761) and the coupling members (762) may be arranged diagonally to each other.

[0136] The size, shape, and arrangement of the first joining member in Fig. 7 are exemplary and are not limited thereto. First joining members of various sizes, shapes, and arrangements may be mounted on the camera PCB.

[0137]

[0138] Fig. 8 illustrates a camera PCB including a ground shielding pattern according to one embodiment. Descriptions of configurations identical or similar to those in Figs. 5a and 5b are omitted.

[0139] Referring to FIG. 8, a camera module (810) may be mounted on a first surface of a camera PCB (820). The camera PCB (820) may include a first contact member (830), a first coupling member (840), a guide pole (845), and a ground shielding pattern (848) on a second surface (820b). When camera data is transmitted at high speed, RF noise may occur due to the use of ultra-high frequencies. RF noise affects peripheral circuits and electrical devices (e.g., RF components), causing many side effects. The ground shielding pattern (848) may block RF noise generated due to high-speed data transmission through the first contact member (830).

[0140] The ground shielding pattern (848) may be positioned on the outer area of ​​the camera PCB (820). The ground shielding pattern (848) may be positioned to surround the first contact member (830) and the first coupling member (840). FIG. 8 is an example and is not limited thereto. The ground shielding pattern (848) may be formed in various thicknesses and shapes to enhance shielding performance against RF noise.

[0141] According to one embodiment, the ground shielding pattern (848) may be arranged in a manner that is coupled with the guide pole (845). The guide pole (845) may be plated in the same manner as the ground shielding pattern (848) and may be electrically connected thereto.

[0142] In Fig. 8, a case in which the ground shielding pattern (848) is formed integrally with the guide pole (845) is illustrated as an example, but the present invention is not limited thereto. The ground shielding pattern (848) may be formed even in the absence of the guide pole (845), and may be positioned independently of the guide pole (845) (see Fig. 9).

[0143]

[0144] FIG. 9 illustrates a camera PCB including a protruding first joining member and a ground shielding pattern according to one embodiment.

[0145] Referring to FIG. 9, a camera module (910) may be mounted on a first surface of a camera PCB (920). The camera PCB (920) may include a first contact member (930), a first coupling member (940), and a ground shielding pattern (948) on a second surface (920b). The ground shielding pattern (948) may block RF noise generated by high-speed transmission of camera data through the first contact member (930). The ground shielding pattern (948) may be a grounding area and may have a square plating shape.

[0146] According to one embodiment, the ground shielding pattern (948) may be positioned on an outer area of ​​the camera PCB (920). The ground shielding pattern (948) may be positioned to surround the first contact member (930) and the first coupling member (940).

[0147]

[0148] Figure 10 illustrates contact pads having various widths according to one embodiment.

[0149] Referring to FIG. 10, a camera module (1010) may be mounted on a first surface of a camera PCB (1020). The camera PCB (1020) may include a first contact member (1030) and a first coupling member (1040) on a second surface. In FIG. 10, a case in which the camera PCB (1020) includes a protruding first coupling member (1040) is illustrated as an example, but the present invention is not limited thereto.

[0150] The first contact member (1030) may be positioned in a central area of ​​the camera PCB (1020). The first contact member (1030) may be electrically connected to the second contact member of the main PCB.

[0151] The first contact member (1030) may include a plurality of contact pads (1031, 1032, 1033). The plurality of contact pads (1031, 1032, 1033) may not have a uniform width, but at least some may have different widths (or areas). For example, the first contact pad (1031) disposed on the periphery of the camera PCB (1020) may have a wider width than the second contact pad (1032) or the third contact pad (1033). The second contact pad (1032) may have a wider width than the third contact pad (1033) disposed at the center.

[0152] The width of the contact pads may be determined depending on the purpose or characteristics of the transmitted signal. For example, the first contact pad (1031) may transmit a MIPI signal that requires high bandwidth and low input impedance, and the third contact pad (1033) may transmit an I2C signal that uses low bandwidth and minimizes pad area. As another example, the first contact pad (1031) may transmit power transmitted from the main PCB to the camera module (1010). The first contact pad (1031) may have a relatively wide width and maintain a stable power supply.

[0153] Fig. 10 is exemplary and not limiting. Contact pads having various widths (or areas) may be used depending on the characteristics of the signal being transmitted.

[0154]

[0155] Figures 11a and 11b illustrate the combination of multiple camera modules according to one embodiment.

[0156] Referring to FIGS. 11a and 11b, the main PCB (1150) may include a first region (1151) for a first camera module (1110a) and a second region (1152) for a second camera module (1110b). FIGS. 11a and 11b illustrate a form in which two camera modules are combined, but the present invention is not limited thereto. Three or more camera modules may be combined.

[0157] In the first region (1151), a first camera module (1110a) and a first camera PCB (1120a) may be mounted. The first camera PCB (1120a) may include a first contact member (1130a), a first coupling member (1140a), and a guide pole (1145a). The main PCB (1150) may include a second contact member (1160a), a second coupling member (1170a), and a guide hole (1175a) in the first region (1151). The second contact member (1160a) may be positioned corresponding to the first contact member (1130a). The second coupling member (1170a) may be positioned corresponding to the first coupling member (1140a). The guide hole (1175a) may be positioned corresponding to the guide pole (1145a).

[0158] When the guide pole (1145a) is inserted into the guide hole (1175a) and the first coupling member (1140a) is coupled to the second coupling member (1170a) by magnetic force, the first contact member (1130a) and the second contact member (1160a) can be electrically connected by making contact with each other.

[0159] In the second region (1152), a second camera module (1110b) and a second camera PCB (1120b) may be mounted. The second camera PCB (1120b) may include a third contact member (1130b), a third coupling member (1140b), and a guide pole (1145b). The main PCB (1150) may include a fourth contact member (1160b), a fourth coupling member (1170b), and a guide hole (1175b) in the second region (1152). The fourth contact member (1160b) may be positioned corresponding to the third contact member (1130b). The fourth coupling member (1170b) may be positioned corresponding to the third coupling member (1140b). The guide hole (1175b) may be positioned corresponding to the guide pole (1145b).

[0160] When the guide pole (1145b) is inserted into the guide hole (1175b) and the third coupling member (1140b) is coupled to the fourth coupling member (1170b) by magnetic force, the third contact member (1130b) and the fourth contact member (1160b) can be electrically connected by making contact with each other.

[0161] Referring to FIG. 11b, the first camera PCB (1120a) may include a first shared pad (1190a). A portion of the first shared pad (1190a) may be disposed on a second side (1120a1) of the first camera PCB (1120a), and another portion of the first shared pad (1190a) may be disposed on a side facing the second camera PCB (1120b).

[0162] The second camera PCB (1120b) may include a second shared pad (1190b). A portion of the second shared pad (1190b) may be disposed on a second side (1120b1) of the second camera PCB (1120b), and another portion of the second shared pad (1190b) may be disposed on a side facing the first camera PCB (1120a).

[0163] When the first camera PCB (1120a) is coupled to the main PCB (1050) and the second camera PCB (1120b) is coupled to the main PCB (1050), the first shared pad (1190a) and the second shared pad (1190b) can be electrically connected by making contact. The first shared pad (1190a) and the second shared pad (1190b) can transmit signals commonly used by the first camera module (1110a) and the second camera module (1110b). For example, the first shared pad (1190a) and the second shared pad (1190b) can transmit an I / O power signal or a core power signal of the first camera module (1110a) and the second camera module (1110b). For another example, the first shared pad (1190a) and the second shared pad (1190b) can be used to connect the grounds of the first camera module (1110a) and the second camera module (1110b).

[0164] The combination of the first camera module (1110a) and the second camera module (1110b) secures mounting space and reduces the number of peripheral components required. Furthermore, securing additional grounding areas facilitates stable signal transmission and shielding from RF noise.

[0165] According to one embodiment, when the camera PCB (1120a, 1120b) and the main PCB (1150) are magnetically coupled, alignment can be facilitated during the assembly process, and precise assembly through automation can be achieved. In addition, the gap between the multiple camera modules (1110a, 1110b) can be reduced, thereby reducing the transition time lag during the shooting process. Furthermore, an increase in manufacturing costs due to assembly defects during the assembly process can be prevented.

[0166]

[0167] Fig. 12 illustrates a shielding member for a magnetic field inside a camera module according to one embodiment.

[0168] Referring to FIG. 12, the camera module (1210) may include a lens unit (or barrel unit) (1211), an actuator (1212), an IR filter (1213), a filter base (1214), and an image sensor (1215). The camera PCB (1220) may be a component of the camera module (1210).

[0169] The lens unit (or barrel unit) (1211) may include one or more lenses. The one or more lenses may be aligned in the optical axis direction and may transmit light to the image sensor (1215).

[0170] The actuator (1212) can move the lens unit (1121) to perform AF or OIS. The actuator (1212) can include a coil and a magnet. The actuator (1212) can be moved by a magnetic field formed by the coil and the magnet.

[0171] The IR filter (1213) can block infrared rays coming from outside.

[0172] The filter base (1214) can securely and securely mount the IR filter (1213). The filter base (1214) can include a hole in the central portion, and at least a portion of the hole can be secured to the camera PCB (1220).

[0173] The image sensor (1215) can be mounted in the central area of ​​the camera PCB (1220). The image sensor (1215) can be connected to the main PCB via the first contact member (1230) of the camera PCB (1220).

[0174] The camera PCB (1220) may include a first contact member (1230) and a first coupling member (1240). The first coupling member (1240) may be a magnet. When the camera PCB (1220) includes the first coupling member (1240), a magnetic force generated from the first coupling member (1240) may affect the operation of the actuator (1212). To block this, the filter base (1424) may be coupled with a shielding member (1228). The shielding member (1228) may be disposed between the filter base (1424) and the first coupling member (1240). The shielding member (1228) may block the magnetic force generated from the first coupling member (1240). For example, the shielding member (1228) may be a non-magnetic material such as a yoke.

[0175] In Fig. 12, the shielding member (1228) is exemplarily illustrated as being mounted on the filter base (1424), but is not limited thereto. For example, the shielding member (1228) may be positioned inside or outside the actuator (1212). In response to various shapes of the camera module (1210), the shielding member (1228) may be positioned at a location that facilitates blocking the magnetic force generated from the first coupling member (1240).

[0176]

[0177] Fig. 13 shows the pin shape of the first contact member according to one embodiment.

[0178] Referring to FIG. 13, in the first embodiment (1301), the camera PCB (1321) may include a first contact member (1331) in the form of a contact pin (1333). The first contact member (1331) may include a three-dimensional contact pin rather than a flat contact pad. The first contact member (1331) may protrude in a direction (Z+ direction) toward the main PCB. Even when the camera PCB (1321) and the main PCB (not shown) are spaced apart or the coupling state is lifted, the first contact member (1331) in the form of a contact pin can maintain a stable contact state with the second contact member (1360) of the main PCB.

[0179] According to one embodiment, the first contact member (1331) may include pin rows arranged in a unidirectional manner. For example, the first contact member (1332) may include pin rows (1331a) arranged in a first direction (Y-direction).

[0180] In the second embodiment (1302), the camera PCB (1322) may include a first contact member (1332) in the form of a contact pin (1333). The first contact member (1332) may protrude in a direction toward the main PCB (Z+ direction).

[0181] According to one embodiment, the first contact member (1332) may have a multi-contact structure. For example, the first contact member (1332) may include pin rows arranged in both directions. The first contact member (1332) may include a first pin row (1332a) arranged in a first direction (Y- direction) and a second pin row (1332b) arranged in a second direction (Y+ direction). A sufficient contact area can be secured through the first pin row (1332a) and the second pin row (1332b), and even when the coupling state between the camera PCB (1322) and the main PCB is disturbed, a more stable contact state can be maintained than in the first embodiment (1301).

[0182] In one embodiment, for signals requiring stable transmission, a first contact member formed with a multi-contact structure may be used, or multiple pads (or multiple contact pins) may be configured to transmit the same signal. This prevents the pin transmitting the primary signal from becoming open.

[0183]

[0184] Fig. 14 illustrates a first contact member of a buffer structure according to one embodiment. Fig. 14 is exemplary and not limiting.

[0185] Referring to FIG. 14, the camera module (1410) may include a lens unit (or barrel unit) (1411), an actuator (1412), an IR filter (1413), a filter base (1414), and an image sensor (1415). Descriptions of configurations identical or similar to those in FIG. 12 are omitted.

[0186] An actuator (1412), a filter base (1414), and an image sensor (1415) may be mounted on a first surface of a camera PCB (1420). The camera PCB (1420) may include a first contact member (1430) on a second surface. The first contact member (1430) may protrude toward the main PCB (1450). The first contact member (1430) may be in the form of a pin with a buffer structure. The first contact member (1430) may maintain contact with the main PCB (1450) through the buffer structure when bending of the camera PCB (1420) or the main PCB (1450) occurs or an external impact occurs.

[0187] Fig. 14 is exemplary and not limited thereto. The range of motion of the buffer structure of the first contact member (1430) may be implemented in various forms, reflecting the material of the contact pin, the distance between the camera PCB (1420) and the main PCB (1450), and the fluidity of the camera PCB (1420) or the main PCB (1450).

[0188] According to one embodiment, the first coupling member (1440) may be implemented in a protruding form, and the main PCB (1450) may include a second coupling member (1475) coupled with the first coupling member (1440). When the first coupling member (1440) is coupled with the second coupling member (1475) through a hole formed in the main PCB (1450), and the thickness of the first coupling member (1440) is greater than the thickness of the main PCB (1450), a gap (G1) may be formed between the camera PCB (1420) and the main PCB (1450). Through the gap (G1), cracking of the image sensor (1415) due to bending of the main PCB (1450) may be prevented.

[0189]

[0190] FIG. 15 illustrates a structure for preventing image sensor cracks, according to one embodiment.

[0191] Referring to FIG. 15, an image sensor (1515) of a camera PCB (1520) may be mounted. A sus plate (1517) may be placed between the camera PCB (1520) and the image sensor (1515) to prevent cracks. The sus plate (1517) can prevent cracks in the image sensor (1515) by alleviating the shock transmitted to the image sensor (1515) when a shock occurs due to movement between the camera PCB (1520) and the main PCB.

[0192] According to one embodiment, the camera PCB (1520) may be implemented with a material or shape that mitigates the impact transmitted to the image sensor (1515) at least some of its internal layers. For example, the camera PCB (1520) may mitigate the impact transmitted to the image sensor (1515) by increasing the thickness of some of its internal layers (e.g., a prepreg layer) or by using a specific material (e.g., DFSR).

[0193]

[0194] FIG. 16 illustrates a first contact member having various contact pin thicknesses according to one embodiment.

[0195] Referring to FIG. 16, a camera module (1610) may be mounted on a first surface of a camera PCB (1620). The camera PCB (1620) may include a first contact member (1630) and a first coupling member (1640) on a second surface. In FIG. 16, a case in which the camera PCB (1620) includes a protruding first coupling member (1640) is illustrated as an example, but the present invention is not limited thereto.

[0196] The first contact member (1630) may be arranged in a central area of ​​the camera PCB (1620). The first contact member (1630) may be electrically connected to a second contact member of the main PCB. The first contact member (1630) may include a plurality of contact pins. The first contact member (1630) may protrude in a direction (Z+ direction) toward the main PCB. Even when the camera PCB (1320) and the main PCB are spaced apart or the coupling state is lifted, the first contact member (1330) in the form of a contact pin can maintain a stable contact state with the second contact member of the main PCB.

[0197] The first contact member (1630) may include a plurality of contact pins (1631, 1632, 1633). The plurality of contact pins (1631, 1632, 1633) may not have a uniform width, but at least some of them may have different widths (or areas). For example, the first contact pin (1661) arranged on the outer side may have a wider width than the second contact pin (1662) or the third contact pin (1663). The second contact pin (1662) may have a wider width than the third contact pin (1663) arranged in the center.

[0198] The width of the contact pins may be determined depending on the purpose or characteristics of the transmitted signal. For example, the first contact pin (1661) may transmit a MIPI signal requiring high bandwidth and low input impedance, while the third contact pin (1663) may transmit an I2C signal using low bandwidth and minimizing pad area. As another example, the first contact pin (1661) may transmit a power signal requiring a stable power supply.

[0199] Fig. 16 is exemplary and not limiting. Contact pins having various widths (or areas) may be used depending on the characteristics of the signal being transmitted.

[0200]

[0201] Fig. 17 shows a guide structure using a camera housing according to one embodiment.

[0202] Referring to FIG. 17, the camera module (1710) may include a camera housing (1715). A portion of the camera housing (1715) may form a guide pole structure (1715a) that passes through the camera PCB (1720) and the main PCB (1750).

[0203] The camera housing (1715) forms the exterior of the camera module (1710) and can protect the internal components. In one embodiment, the camera housing (171) can be an outer case of an actuator.

[0204] The camera module (1710) may be mounted on a first surface of the camera PCB (1720). The camera PCB (1720) may include a first contact member (1730) and a first coupling member (1740) on a second surface (1720b). The guide pole structure (1715a) may pass through a hole formed in the camera PCB (1720) and protrude to the second surface (1720b) ​​of the camera PCB (1720).

[0205] According to one embodiment, there may be multiple guide pole structures (1715a). The guide pole structures (1715a) may be arranged in a form that is easy to be fixed or coupled to the main PCB (1750). For example, if there are three guide pole structures (1715a), they may be arranged one at each of three of the four vertices. In Fig. 17, the case where there are three guide pole structures (1715a) is illustrative and is not limited thereto.

[0206] According to one embodiment, the guide pole structure (1715a) may be the same number as the first coupling member (1740) and may be positioned at a point adjacent to the first coupling member (1740). The guide pole structure (1715a) may be positioned further from the center of the second surface (1720b) ​​of the camera PCB (1720) than the first coupling member (1740).

[0207] According to one embodiment, the guide pole structure (1715a) may be arranged in a form that is coupled with the ground shielding pattern (1748). The guide pole structure (1715a) may be plated in the same manner as the ground shielding pattern (1748) and may be electrically connected thereto.

[0208] The main PCB (1750) may include a second contact member (1760), a second bonding member (1770), and a first ground shielding pattern (1790). In addition, the main PCB (1750) may further include a guide hole (1775) corresponding to the guide pole structure (1715a).

[0209] The guide hole (1775) can be positioned corresponding to the guide pole structure (1715a). When the guide pole structure (1715a) is inserted into the guide hole (1775) and fixed, the first coupling member (1740) and the second coupling member (1770) can be coupled by magnetic force. The guide hole (1775) and the guide pole structure (1715a) can supplement the magnetic coupling of the first coupling member (1740) and the second coupling member (1770), and can prevent the camera PCB (1720) and the main PCB (1750) from moving on the XY plane.

[0210] The guide hole (1775) can be arranged in a form that is combined with the second ground shielding pattern (1795). The guide hole (1775) can be electrically connected by being plated in the same manner as the second ground shielding pattern (1795).

[0211]

[0212] In electronic devices, when camera data is transmitted at high speeds, RF noise can occur due to the use of ultra-high frequencies. This RF noise can affect peripheral circuits and electrical components (e.g., RF components), causing numerous adverse effects.

[0213] Existing camera modules utilize the R (Rigid)-FPCB type, which combines HPCB and FPCB. This type is vulnerable to high-frequency transmission and requires connectors with a high defect rate during manufacturing and assembly. Furthermore, this type requires a large amount of mounting space.

[0214] An electronic device according to one embodiment may include a first printed circuit board and a camera module. The camera module may include a lens unit, an image sensor that converts light passing through the lens unit into an electrical signal, a second printed circuit board having a first surface on which the image sensor is mounted and a second surface facing in an opposite direction to the first surface, a first coupling member mounted on the second surface and coupled to the first printed circuit board by magnetic force, and a first contact member mounted on the second surface and electrically connected to the first printed circuit board.

[0215] According to one embodiment, the first printed circuit board may be positioned at a position corresponding to the first bonding member. It may include a second bonding member that is magnetically bonded to the first bonding member.

[0216] In one embodiment, the first bonding member may include a magnet. The second bonding member may include a metal pad.

[0217] In one embodiment, the first bonding member may include a metal pad. The second bonding member may include a magnet.

[0218] In one embodiment, the first coupling member may include a first magnetic body arranged such that a first pole faces the second coupling member. The second coupling member may include a second magnetic body arranged such that a second pole faces the first coupling member.

[0219] According to one embodiment, the first printed circuit board may be positioned at a position corresponding to the first contact member. It may include a second contact member electrically connected to the first contact member.

[0220] According to one embodiment, each of the first contact member and the second contact member may include a plurality of contact pads.

[0221] According to one embodiment, the plurality of contact pads may include a first contact pad having a first width and a second contact pad having a second width greater than the first width.

[0222] In one embodiment, the second contact pad can transmit power to drive the camera module.

[0223] According to one embodiment, the first contact member may include a plurality of conductive pins.

[0224] In one embodiment, the first printed circuit board may include a hole in an area corresponding to the first bonding member. The first bonding member may protrude from the second surface. When the first bonding member is bonded to the first printed circuit board, the first bonding member may be inserted into and fixed in the hole.

[0225] In one embodiment, the first coupling member may include a plurality of members spaced apart from each other. The first contact member may be disposed between the plurality of members.

[0226] In one embodiment, the first coupling member may include first to third magnetic bodies. The first to third magnetic bodies may be arranged at a specified interval around the first contact member.

[0227] In one embodiment, the camera module may include a guide pole protruding from the second surface toward the first printed circuit board. The first printed circuit board may include a hole at a position corresponding to the guide pole.

[0228] In one embodiment, the camera module may include a ground shielding pattern electrically connected to the guide pole.

[0229] A camera module according to one embodiment may include a lens unit, an image sensor that converts light passing through the lens unit into an electrical signal, a printed circuit board having a first surface on which the image sensor is mounted and a second surface facing in an opposite direction to the first surface, a first coupling member mounted on the second surface and coupled to an external printed circuit board by magnetic force, and a first contact member mounted on the second surface and electrically connected to the external printed circuit board.

[0230] According to one embodiment, the first contact member may include a plurality of contact pads.

[0231] According to one embodiment, the plurality of contact pads may include a first contact pad having a first width and a second contact pad having a second width greater than the first width.

[0232] In one embodiment, the second contact pad can transmit a power signal that drives the camera module.

[0233] In one embodiment, the first joining member may protrude from the second surface.

[0234] An electronic device according to one embodiment disclosed in this document can directly bond a printed circuit board of a camera module to a main printed circuit board using a magnetic material. This simplifies the assembly structure and eliminates the need for a separate connector or FPCB. The generation of unnecessary RF signals can be prevented. The structure of the camera module can be simplified and its mounting space can be reduced. The simplified assembly structure allows the camera module to be bonded using automated equipment or a robotic process.

[0235] Electronic devices according to embodiments disclosed herein can combine multiple camera modules and mount them magnetically on a main printed circuit board. This reduces assembly tolerances, thereby reducing switching lag, and simplifies electrical connections by utilizing common pads.

[0236] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0237] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0238] Various embodiments of the present document may be implemented as software (e.g., program (10)) including one or more instructions stored in a storage medium (e.g., built-in memory (1436) or external memory (138)) readable by a machine (e.g., electronic device (1401)). For example, a processor (e.g., processor (1420)) of the machine (e.g., electronic device (1401)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0239] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0240] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, comprising a first printed circuit board and a camera module; The above camera module Lens section; An image sensor that converts light passing through the lens unit into an electrical signal; A second printed circuit board including a first surface on which the image sensor is mounted and a second surface facing in an opposite direction to the first surface; A first bonding member mounted on the second surface and magnetically bonded to the first printed circuit board; and An electronic device comprising a first contact member mounted on the second surface and electrically connected to the first printed circuit board.

2. In the first paragraph, the first printed circuit board An electronic device comprising: a second coupling member positioned at a position corresponding to the first coupling member and coupled to the first coupling member by magnetic force; 3. In the second paragraph, the first connecting member Contains a magnet, The above second bonding member An electronic device comprising a metal pad.

4. In the second paragraph, the first connecting member Contains metal pads, The above second bonding member An electronic device containing a magnet.

5. In the second paragraph, the first connecting member A first magnetic body is included, wherein the first pole is arranged to face the second coupling member, The above second bonding member An electronic device comprising a second magnetic body arranged so that the second pole faces the first coupling member.

6. In the first paragraph, the first printed circuit board An electronic device comprising: a second contact member disposed at a position corresponding to the first contact member and electrically connected to the first contact member; 7. In paragraph 6, each of the first contact member and the second contact member An electronic device comprising a plurality of contact pads.

8. In the 7th paragraph, the plurality of contact pads An electronic device comprising a first contact pad having a first width and a second contact pad having a second width greater than the first width.

9. In the 8th paragraph, the second contact pad An electronic device that transmits power to drive the above camera module.

10. In the first paragraph, the first printed circuit board Including a hole in an area corresponding to the first connecting member, The above first joining member protrudes from the second surface, An electronic device in which the first bonding member is inserted into and fixed in the hole when bonded to the first printed circuit board.

11. In paragraph 1, The above first joining member includes a plurality of members arranged spaced apart from each other, The above first contact member An electronic device positioned between the above-mentioned plurality of absences.

12. In the first paragraph, the first connecting member Containing first to third magnetic bodies, An electronic device in which the first to third magnetic bodies are arranged at a specified interval around the first contact member.

13. In the first paragraph, the camera module Including a guide pole protruding toward the first printed circuit board on the second surface, An electronic device wherein the first printed circuit board includes a hole at a position corresponding to the guide pole.

14. In the 13th paragraph, the camera module An electronic device comprising a ground shielding pattern electrically connected to the above guide pole.

15. In the camera module, Lens section; An image sensor that converts light passing through the lens unit into an electrical signal; A printed circuit board comprising a first surface on which the image sensor is mounted and a second surface facing in an opposite direction to the first surface; A first bonding member mounted on the second surface and magnetically bonded to an external printed circuit board; and A camera module comprising a first contact member mounted on the second surface and electrically connected to the external printed circuit board.

Images