microphone

Abstract

A microphone, comprising: a circuit board; a shell, which covers the circuit board to form an accommodation space; and a plurality of functional components, which are arranged in the accommodation space and electrically connected to the circuit board, wherein the plurality of functional components include at least two functional components having different functions; a plurality of baffles are provided in the accommodation space, and are arranged and spaced apart in a direction parallel to the plane where the circuit board is located; and the plurality of baffles divide the accommodation space into a plurality of isolation chambers, at least one functional component is provided in each isolation chamber, and the functional components having different functions are isolated in different isolation chambers by the baffles. In such an arrangement, the baffles can isolate the functional components having different functions, so as to effectively prevent the degradation of performance of sensors among the plurality of functional components that are highly susceptible to thermal interference due to the influence of heat generated by an ASIC chip that has high heat generation.

Description

microphone Technical Field

[0001] The present invention relates to the field of acoustics and electricity, and in particular to a microphone. Background Art

[0002] With the development of wireless communications, there are more and more mobile phone users around the world. Users' requirements for mobile phones are no longer just to make calls, but also to provide high-quality call effects. Especially with the development of mobile multimedia technology, the call quality of mobile phones has become more important. The microphone of a mobile phone is the voice pickup device of the mobile phone, and its design directly affects the call quality.

[0003] A microphone in the related art includes a circuit board, a housing that covers the circuit board to form a receiving space, and multiple functional components disposed within the receiving space and electrically connected to the circuit board. The multiple functional components include at least two components with different functions, including an ASIC chip and a sensor. The sensor of at least one of the multiple functional components is a microphone sensor for picking up sound, while the sensors of the other functional components may be sensors for detecting changes in air pressure, sensors for detecting the content of different gases in the air, and so on. However, the ASIC chips of the functional components with different functions in this microphone generate different amounts of heat during operation. The heat generated by the ASIC chip with higher heat generation can, through heat transfer from the circuit board and / or the housing, as well as thermal movement of air in the receiving space, degrade the performance of certain sensors that are highly susceptible to thermal interference (e.g., microphone sensors for picking up sound).

[0004] Therefore, it is necessary to study a new microphone. Summary of the Invention

[0005] The present invention aims to solve the problem that the performance of certain sensors that are extremely susceptible to thermal interference may be degraded due to the heat generated by an ASIC chip with high heat generation, and provides a microphone with a novel structure.

[0006] To achieve the above-mentioned objectives, the present invention provides a microphone, comprising a circuit board, a shell covered with the circuit board to form a receiving space, and a plurality of functional components arranged in the receiving space and electrically connected to the circuit board, wherein the plurality of functional components include at least two functional components with different functions, a plurality of baffles are provided in the receiving space, the plurality of baffles are arranged at intervals along a direction parallel to the plane where the circuit board is located, and the plurality of baffles divide the receiving space into a plurality of isolation cavities, each of the isolation cavities is provided with at least one functional component, and the functional components with different functions are isolated by the baffles in different isolation cavities.

[0007] As an improvement, a plurality of first adhesive strips are provided on the surface of the circuit board facing the receiving space, and the plurality of first adhesive strips are bonded to the plurality of baffles in a one-to-one correspondence.

[0008] As an improvement, a plurality of second adhesive strips are provided on the surface of the shell facing the receiving space, and the plurality of second adhesive strips are bonded to the plurality of baffles in a one-to-one correspondence.

[0009] As an improvement, the orthographic projection of the second adhesive strip on the circuit board coincides with the first adhesive strip.

[0010] As an improvement, the adhesives used to bond the first adhesive strip and the second adhesive strip to the baffle respectively include glue or solder paste.

[0011] As an improvement, the shell and the baffle are formed integrally.

[0012] As an improvement, the shell is a metal shell with electromagnetic shielding function, and the baffle is a metal plate made of the same material as the shell.

[0013] As an improvement, the functional component includes an ASIC chip and a sensor, and the sensor of at least one of the multiple functional components is a microphone sensor. The microphone sensor is fixed on the circuit board and separates the isolation cavity into a first sound cavity and a second sound cavity. A first sound hole is provided on the circuit board, and the first sound hole connects the first sound cavity and the outside world.

[0014] As an improvement, a second sound hole is provided on the shell, and the second sound hole connects the second sound cavity and the outside.

[0015] The present invention has the beneficial effect of providing a plurality of baffles within the receiving space, the baffles being spaced apart in a direction parallel to the plane of the circuit board. The baffles divide the receiving space into a plurality of isolation chambers, so that functional components with different functions are isolated by the baffles within different isolation chambers. The baffles thus arranged can isolate the functional components with different functions, thereby blocking heat exchange caused by thermal movement of air within adjacent isolation chambers. This effectively prevents the performance degradation of sensors in the multiple functional components that are particularly susceptible to thermal interference from being affected by the heat generated by the high-heat-generating ASIC chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] FIG1 is a top view of a microphone according to the present invention.

[0017] FIG2 is a front view of the microphone shown in FIG1.

[0018] FIG3 is a bottom view of the microphone shown in FIG1 .

[0019] FIG4 is a schematic structural diagram of the microphone shown in FIG1 with the housing and baffle removed.

[0020] FIG5 is a schematic structural diagram of the housing and the second adhesive strip in the microphone shown in FIG1 .

[0021] FIG6 is a cross-sectional view of the microphone shown in FIG1 along the AA direction.

[0022] FIG7 is a cross-sectional view of the microphone shown in FIG1 along the BB direction.

[0023] FIG8 is a schematic structural diagram of another embodiment of a microphone of the present invention. DETAILED DESCRIPTION

[0024] The present invention will be described in detail below with reference to FIG. 1 to FIG. 8 .

[0025] The microphone of the present invention includes a circuit board 1, a housing 3 covering the circuit board 1 to form a receiving space A, and a plurality of functional components 5 arranged in the receiving space A and electrically connected to the circuit board 1, wherein the plurality of functional components 5 include at least two functional components with different functions.

[0026] The functional component 5 includes an ASIC chip 51 and a sensor 53. The sensor 53 of at least one of the multiple functional components 5 is a microphone sensor 53. As shown in FIG4 , the sensors 53 of the multiple functional components 5 are all configured as microphone sensors 53, and the microphone sensors 53 of the multiple functional components 5 can have at least two different sensitivity designs (i.e., the multiple functional components 5 include at least two functional components with different functions). It is understood that in other optional embodiments, provided that the sensor 53 of at least one of the multiple functional components 5 is a microphone sensor 53, the sensors 53 of other functional components 5 can also be sensor chips such as pressure sensors and gas sensors.

[0027] Multiple baffles 7 are provided within the receiving space A. The baffles 7 are spaced apart in a direction parallel to the plane of the circuit board 1. The baffles 7 divide the receiving space A into multiple isolation chambers B. Each isolation chamber B is provided with at least one functional component 5, and functional components 5 with different functions are isolated by the baffles 7 in different isolation chambers B. Specifically, assuming that N baffles are provided within the receiving space A, the N baffles 7 divide the receiving space A into N+1 isolation chambers B. Each isolation chamber B can be provided with one or more functional components 5, but two or more functional components 5 with different functions cannot be provided in the same isolation chamber B.

[0028] The surface of the circuit board 1 facing the receiving space A is provided with multiple first adhesive strips 11, which are bonded to the baffles 7 in a one-to-one correspondence. The surface of the housing 3 facing the receiving space A is provided with multiple second adhesive strips 31, which are bonded to the baffles 7 in a one-to-one correspondence. The separate bonding of the first and second adhesive strips 11, 31 to the baffles 7 not only facilitates assembly of the microphone but also effectively ensures a seal between the baffles 7, the housing 3, and the circuit board 1.

[0029] The adhesive used to bond the first and second adhesive strips 11, 31 to the baffle 7, respectively, can be glue or solder paste. During assembly, the adhesive can be evenly applied to the first and second adhesive strips 11, 31, followed by bonding the baffle 7 to the second adhesive strip 31. Finally, the circuit board 1 and the housing 3 are bonded together. During this bonding process, the baffle 7 and the first adhesive strip 11 are also bonded.

[0030] Preferably, the orthographic projection of the second adhesive strip 31 on the circuit board 1 coincides with the first adhesive strip 11 .

[0031] It should be noted that the overlap of the orthographic projection of the second adhesive strip 31 on the circuit board 1 with the first adhesive strip 11 refers to the relative positions of the second adhesive strip 31 and the first adhesive strip 11 after the microphone is assembled. This arrangement of the first and second adhesive strips 11, 31 effectively ensures the bonding area between the first and second adhesive strips 11, 31 and the baffle 7 after assembly, thereby improving both bonding strength and the sealing and reliability between the baffle 7, the housing 3, and the circuit board 1.

[0032] As shown in Figures 4, 5, and 7, the plurality of baffles 7 are all flat. Accordingly, the first adhesive strip 11 is strip-shaped, and the second adhesive strip 31 is U-shaped, so that the first adhesive strip 11 and the second adhesive strip 31 form a closed loop. It is understood that the baffles 7 are not limited to being flat. For example, the ends of the baffles 7 perpendicular to the circuit board can also be designed to be curved. Accordingly, the portions of the first adhesive strip 11 and the second adhesive strip 31 opposite the first adhesive strip 11 are also curved.

[0033] As shown in Figures 4 and 7, two baffles 7 are provided in the receiving space A. The two baffles 7 are arranged at intervals along the length direction of the circuit board 1 (the length direction of the circuit board 1 is parallel to the plane where the circuit board 1 is located) and divide the receiving space A into three isolation chambers B. A functional component 5 is provided in each isolation chamber B.

[0034] It should be noted that the baffle 7 is not limited to a material and can be made of either metal or non-metal materials.

[0035] Further preferably, the housing 3 is a metal shell with electromagnetic shielding function. The housing 3 with electromagnetic shielding function can effectively prevent external electromagnetic waves from interfering with the microphone.

[0036] As shown in FIG6 , the microphone sensor 53 is fixed on the circuit board 1 and divides the isolation cavity B into a first acoustic cavity 1B and a second acoustic cavity 3B. A first acoustic hole 1a is provided on the circuit board 1 , which connects the first acoustic cavity 1B with the outside world.

[0037] The microphone sensor 53 includes a substrate 531 fixed on the circuit board 1 and a capacitor component 533 fixed on a side of the substrate 531 facing away from the circuit board 1 , wherein the substrate 531 , the capacitor component 533 and the circuit board 1 together form a first acoustic cavity 1B.

[0038] The capacitor assembly 533 includes a diaphragm and a back plate spaced apart from the diaphragm.

[0039] Further preferably, housing 3 is provided with a second acoustic hole 3a, which connects second acoustic cavity 3B to the outside world. Vibration of the microphone diaphragm causes vibration of the air within second acoustic cavity 3B, thereby enabling convection between second acoustic cavity 3B and the outside air, thereby accelerating heat dissipation. Second acoustic cavity 3B also balances pressure on both sides of the diaphragm.

[0040] It is understandable that in other embodiments, as shown in FIG. 8 , the housing 3 and the baffle 7 may be integrally formed to avoid the use of adhesive strips and adhesives for bonding.

[0041] It should be noted that, no matter the housing 3 and the baffle 7 are made of metal material or plastic material, the housing 3 and the baffle 7 can be formed by a stamping process.

[0042] The above description is only an embodiment of the present invention. It should be pointed out that those skilled in the art can make improvements without departing from the creative concept of the present invention, but these improvements all fall within the scope of protection of the present invention.

Claims

1. A microphone, comprising a circuit board, a housing that is lid-connected to the circuit board to form a receiving space, and a plurality of functional components disposed in the receiving space and electrically connected to the circuit board. At least two functional components with different functions are included among the plurality of functional components. Characterized in that: A plurality of baffles are provided in the receiving space. The plurality of baffles are spaced apart in a direction parallel to the plane where the circuit board is located, and the plurality of baffles divide the receiving space into a plurality of isolation chambers. At least one of the functional components is provided in each isolation chamber, and the functional components with different functions are isolated in different isolation chambers by the baffles.

2. The microphone according to claim 1, Characterized in that: A plurality of first adhesive strips are provided on the surface of the circuit board facing the receiving space. The plurality of first adhesive strips are adhesively bonded to the plurality of baffles one by one.

3. The microphone according to claim 2, Characterized in that: A plurality of second adhesive strips are provided on the surface of the housing facing the receiving space. The plurality of second adhesive strips are adhesively bonded to the plurality of baffles one by one.

4. The microphone according to claim 3, Characterized in that: The orthographic projection of the second adhesive strip on the circuit board coincides with the first adhesive strip.

5. The microphone according to claim 3, Characterized in that: The adhesives for adhesively bonding the first adhesive strip and the second adhesive strip to the baffle respectively include glue or solder paste.

6. The microphone according to claim 2, Characterized in that: The housing and the baffle are integrally formed.

7. The microphone according to claim 6, Characterized in that: The housing is a metal shell with electromagnetic shielding function, and the baffle is a metal plate made of the same material as the housing.

8. The microphone according to claim 1, Characterized in that: The functional components include an ASIC chip and a sensor. Among the plurality of functional components, at least one of the sensors is a microphone sensor. The microphone sensor is fixedly provided on the circuit board and divides the isolation chamber into a first sound chamber and a second sound chamber. A first sound hole is provided on the circuit board, and the first sound hole communicates the first sound chamber with the outside.

9. The microphone according to claim 8, Characterized in that: A second sound hole is provided on the housing, and the second sound hole communicates the second sound chamber with the outside.

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