Film affixation device and film affixation method

Abstract

This film affixation device comprises: a lower mold that has a recess in which an accommodated part is accommodated, a placement surface which is formed on the outer peripheral side of the recess and on which a flange is placed, a stepped part which is formed on the outer peripheral side of the placement surface, and a first vacuum flow path, one end of which opens at a stepped part; and a blade part that presses down a resin film by moving downward. In a state where the flange is pressed by an outer peripheral edge of a heating plate, air in a closed space formed by the lower mold, an outer edge part of the flange, and the resin film which is pressed down by the blade part is sucked through the first vacuum flow path.

Description

Film application device and film application method

[0001] The present invention relates to a film applying device and a film applying method.

[0002] JPH11-240536A discloses a film sticking device for sticking a resin film onto a container portion.

[0003] However, in the film application device described in Patent Document 1, the vacuum flow path opens to the mounting surface on which the flange is placed, which causes the resin film to not be properly rolled up and the outer edge of the lower surface of the flange to not be reliably covered.

[0004] The present invention has been made in response to this problem, and aims to provide a film application device and a film application method that can effectively wrap a resin film around the flange of a container portion.

[0005] According to one aspect of the present invention, there is provided a film applying device for applying a resin film to a container part made of a fiber material, the film applying device comprising: a recess for accommodating a storage part of the container part; a mounting surface formed on the outer periphery of the recess and on which a flange of the container part is placed; a step portion formed on the outer periphery of the mounting surface; a first vacuum flow path having one end opening to the step portion; a lower mold which is provided immovably or vertically movable; a flange presser which is provided immediately above the lower mold movable up and down or immovably and which presses the flange via the resin film by moving relative to the lower mold; and a push-down section that is provided directly above the lower mold and pushes down the resin film by moving relative to the lower mold, the step section being located at a position lower than the mounting surface and having a step surface that sandwiches the resin film together with the flange holder, and when the flange is held down by the flange holder, the resin film pushed down by the push-down section, the outer edge of the flange protruding outward from the mounting surface, and the gas in the sealed space formed by the lower mold are sucked in through the first vacuum flow path that communicates with the sealed space.

[0006] FIG. 1 is a schematic explanatory diagram showing a container according to the present embodiment. FIG. 2 is a perspective view showing a paper container portion constituting the container. FIG. 3 is a cross-sectional view showing a film laminating device according to the present embodiment. FIG. 4 is a cross-sectional view showing the state of the film laminating device in step 1 of the film laminating method. FIG. 5 is a cross-sectional view showing the state of the film laminating device in step 2 of the film laminating method. FIG. 6 is a cross-sectional view showing the state of the film laminating device in step 3 of the film laminating method. FIG. 7 is an enlarged view of a main part M in FIG. 6. FIG. 8 is a cross-sectional view showing the state of the film laminating device in step 4 of the film laminating method. FIG. 9 is a cross-sectional view showing the state of the film laminating device in step 5 of the film laminating method. FIG. 10 is an enlarged view of a main part M in FIG. 9. FIG. 11 is a cross-sectional view showing the state of the film laminating device in step 6 of the film laminating method. FIG. 12 is a cross-sectional view showing a first modified example of the first vacuum flow path. FIG. 13 is a cross-sectional view showing a second modified example of the first vacuum flow path.

[0007] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention (hereinafter also referred to as the present embodiment) will be described with reference to the accompanying drawings. In this specification, the same elements are designated by the same reference numerals throughout.

[0008] [Container] A container A according to this embodiment will be described with reference to FIGS. 1 and 2. FIG.

[0009] Fig. 1 is a schematic explanatory view showing a container A according to this embodiment. Fig. 2 is a perspective view showing a paper container part B constituting the container A.

[0010] As shown in Figures 1 and 2, a container A is a container for containing contents P such as food, and includes a paper container part B, a resin film C, and a top seal D as container parts.

[0011] The paper container section B is assembled by folding a single piece of cardboard along perforations or lines, and has a storage section B1 in which the contents P are stored, and a flange B2 formed on the outer periphery of the storage section B1.

[0012] 1, the storage section B1 has a substantially octagonal bottom plate B11, a plurality of (eight in this example) side plates B12 formed on the outer edge of the bottom plate B11 so as to be inclined relative to the bottom plate B11, and a storage area B13 surrounded by the bottom plate B11 and the plurality of side plates B12. Note that, here, an opening of the storage area B13 is referred to as an opening B14.

[0013] The flange B2 is made up of a plurality of bent portions B21 formed by bending each of the side plates B12 outward, and is formed parallel to the bottom plate B11.

[0014] The resin film C is made of a thermoplastic resin film such as polypropylene (PP). The resin film C is tightly adhered (fused) to and covers the inside of the paper container portion B (specifically, the upper surface of the bottom plate B11 and the inner surfaces of the multiple side plates B12), the upper surface of the flange B2, the end surface continuous with the upper surface, and the outer edge of the lower surface continuous with the end surface. In this way, the outer edge B22 of the flange B2 is rolled up by the resin film C. In other words, the resin film C has a rolled-up portion C1 that rolls up the outer edge B22 of the flange B2. Note that roll-up also refers to a state in which the resin film C extends at least inward beyond the outer edge B22 of the flange B2.

[0015] The top seal D is made of a thermoplastic resin seal such as polyethylene terephthalate (PET), and when the contents P are contained in the paper container portion B, the top seal D seals the opening B14 of the containing portion B1 so as to be tightly attached to and cover the resin film C placed on the upper surface of the flange B2.

[0016] The wrapping portion C1 of the resin film C wraps around the outer edge portion B22 of the flange B2, which prevents the resin film C from peeling off from the outer edge portion B22 when the top seal D is peeled off from the resin film C. The film application device 1 (see FIG. 3) that wraps the resin film C around the outer edge portion B22 of the flange B2 of the paper container portion B will be described later.

[0017] In this embodiment, the container part is made of a paper container part B, but is not limited to this and may be made of, for example, a molded plant-derived material that allows gas to pass through. In other words, the container part may be made of a fiber material.

[0018] [Film Apparatus] Next, the film applicator 1 according to this embodiment will be described with reference to FIG.

[0019] FIG. 3 is a cross-sectional view showing the film bonding device 1 according to this embodiment.

[0020] As shown in FIG. 3, the film bonding device 1 according to this embodiment is a device for bonding a resin film C to a paper container part B, and includes an upper die 2, a lower presser 3, and a lower die 4.

[0021] The upper mold 2 is provided directly above the lower mold 4 so as to be movable up and down relative to the lower mold 4 by driving a driving source such as a motor or a cylinder. The upper mold 2 also has a heating plate 21 as a heating part that heats the resin film C to a temperature equal to or higher than the melting point, an annular upper presser 22 that is provided on the outer periphery of the heating plate 21 and presses (i.e., clamps) the resin film C from above and below together with the lower presser 3, a blade part 23 as a pressing part that is located between the heating plate 21 and the upper presser 22 so as to be adjacent to the heating plate 21, and a vacuum air flow path 24 that is formed above the heating plate 21 and communicates with a through hole 213 of the heating plate 21, which will be described later.

[0022] The heating plate 21 is a heating unit that heats up when electricity is supplied, for example. The heating plate 21 is fixed to the upper mold 2 so as to face the lower mold 4. That is, the heating plate 21 is provided directly above the lower mold 4 so as to be movable up and down relative to the lower mold 4. This allows the overall structure of the film laminating device 1 to be made smaller and simpler than in a structure in which the heating unit is provided upstream of the lower mold 4. Furthermore, compared to a structure in which the heating unit is provided upstream of the lower mold 4, the process of transporting the resin film C from the heating unit to the downstream lower mold 4 can be omitted, thereby simplifying the operation of the film laminating device 1. The heating plate 21 is formed in a substantially rectangular shape in a plan view to match the shape of the flange B2 of the paper container portion B.

[0023] The heating plate 21 also has a ring-shaped (specifically, rectangular ring-shaped) outer edge 211 that serves as a flange holder for pressing the flange B2 via the resin film C, a recess 212 formed on the inner side of the outer edge 211, and a plurality of through holes 213 that are located on the inner side of the outer edge 211 and that penetrate the heating plate 21 in the thickness direction.

[0024] As described above, the flange holder is formed from the annular outer peripheral edge 211 of the heating plate 21, which simplifies the overall structure of the film bonding device 1 and makes it possible to efficiently heat the resin film C placed on the placement surface 42 (described later) compared to a structure in which the flange holder and the heating plate 21 are formed separately. The lower surface of the outer peripheral edge 211 that faces the lower mold 4 is flat.

[0025] In this embodiment, the heating section is composed of a heating plate 21 fixed to the upper mold 2 so as to be positioned directly above the lower mold 4, but is not limited to this and may be composed of, for example, a heater provided upstream of the lower mold 4. In this case, the flange holder is not composed of the outer peripheral edge 211 of the heating plate 21, but is composed of a part fixed to the upper mold 2.

[0026] In this embodiment, the through-holes 213 are used for both vacuum and compressed air, but are not limited thereto and may be used for only compressed air. In this case, for example, a plurality of vacuum through-holes are separately formed in the heating plate 21.

[0027] The upper presser foot 22 is fixed to the upper mold 2 so as to protrude downward below the heating plate 21. This allows the heating plate 21 and the upper presser foot 22 to move up and down together. As a result, the operation of the film bonding device 1 can be simplified compared to a structure in which the heating plate 21 and the upper presser foot 22 move up and down independently.

[0028] The blade portion 23 is provided directly above the lower mold 4 so as to be movable up and down relative to the heating plate 21 by being driven by a drive source such as a motor. This allows the overall structure of the film laminating device 1 to be made smaller and simpler than in a structure in which the blade portion is provided downstream of the lower mold 4. Furthermore, compared to a structure in which the blade portion is provided downstream of the lower mold 4, the process of transporting the resin film C from the lower mold 4 to the downstream side can be omitted, thereby simplifying the operation of the film laminating device 1.

[0029] The blade portion 23 is configured so that, when moved to the uppermost position (i.e., the initial position), the tip thereof protrudes from the underside of the outer peripheral edge 211. Furthermore, the presser lower surface 221 of the upper presser 22 that presses the resin film C is located below the tip of the blade portion 23 when the blade portion 23 has moved to the initial position.

[0030] In this embodiment, the pressing portion is configured from a blade portion 23 that cuts the resin film C, but is not limited to this and may be configured from a member different from the blade portion 23.

[0031] The lower presser 3 is an annular presser that presses down the resin film C from above and below together with the upper presser 22. The lower presser 3 is provided so as to be movable up and down relative to the upper mold 2 and the lower mold 4 by being driven by a drive source such as a motor or a cylinder. The lower presser 3 is also provided on the outer periphery of the lower mold 4.

[0032] In this embodiment, the lower presser 3 is supported by the lower mold 4 so as to be vertically movable, but this is not limited to this, and for example, it may be supported by the upper mold 2 so as to be vertically movable.

[0033] In this embodiment, the lower mold 4 is provided immediately below the upper mold 2 and is not movable in the vertical direction (i.e., is immobile), but this is not limiting and, for example, the lower mold 4 may be provided immediately below the upper mold 2 and be movable in the vertical direction. In this case, the upper mold 2 may be provided so as to be movable in the vertical direction or may be provided so as to be immobile.

[0034] The lower mold 4 has a recess 41 formed directly below the heating plate 21 so as to face the heating plate 21, a ring-shaped (specifically, approximately rectangular ring-shaped) support surface 42 formed on the outer periphery of the recess 41 and on which the flange B2 is placed, a ring-shaped step portion 43 formed on the outer periphery of the support surface 42 so as to be adjacent to the support surface 42, a plurality of first vacuum flow paths 44 formed with one end opening into the step portion 43, a plurality of second vacuum flow paths 45 formed with one end opening into the recess 41, a communicating vacuum flow path 46 communicating with the plurality of first vacuum flow paths 44 and the plurality of second vacuum flow paths 45, and a ring-shaped cutting surface 47 formed on the outer periphery of the step portion 43.

[0035] The recess 41 accommodates the storage section B1 of the paper container section B. The recess 41 has a bottom surface 411 on which the bottom plate B11 of the storage section B1 is placed, and a side surface 412 that comes into close contact with the outer surface of the side plate B12.

[0036] The mounting surface 42 is a flat surface that is continuous with the upper end of the side surface 412 of the recess 41 so as to be parallel to the bottom surface 411. The mounting surface 42 is formed directly below the outer peripheral edge 211 of the heating plate 21 so as to face the outer peripheral edge 211. When the flange B2 is placed on the mounting surface 42, the portion of the flange B2 that protrudes outward from the mounting surface 42 is an outer edge portion B22 (see FIG. 7 ).

[0037] In this embodiment, the step portion 43 is formed on the outer periphery of the mounting surface 42 around the entire circumference, but this is not limited to this and may also be formed at the four corners of the approximately rectangular ring-shaped mounting surface 42.

[0038] The step portion 43 has a step surface 431 that is located lower than the mounting surface 42 so as to face the outer peripheral edge 211 of the heating plate 21, a connection surface 432 that is formed to extend in the vertical direction and connects the step surface 431 and the mounting surface 42, and an outer peripheral surface 433 that is also formed to extend in the vertical direction. The step portion 43 is located on the inner peripheral side of the blade portion 23. In other words, the blade portion 23 is located on the outer peripheral side of the step portion 43 (specifically, the step surface 431).

[0039] The first vacuum flow path 44 is formed in the lower mold 4 so that one end opens to the stepped surface 431 and extends in the vertical direction. When the flange B2 is placed on the mounting surface 42, the outer edge portion B22 of the flange B2 covers one end of the first vacuum flow path 44 so as to be spaced apart from the one end of the first vacuum flow path 44 (see FIG. 7 ). Specifically, the first vacuum flow path 44 is formed so that one end is located more inward than the end face of the outer edge portion B22. More specifically, the first vacuum flow path 44 is formed so that one end is in contact with the connection surface 432 in a plan view. A clearance of at least two times the thickness of the resin film C is formed between the outer edge portion B22 of the flange B2 and the stepped surface 431. Note that the clearance formed between the outer edge portion B22 of the flange B2 and the stepped surface 431 is preferably at least three times the thickness of the resin film C. The first vacuum flow path 44 is formed so that the other end thereof communicates with the communicating vacuum flow path 46 .

[0040] In this embodiment, the multiple first vacuum flow paths 44 are open at one end around the entire circumference of the annular step surface 431 at a predetermined interval, but this is not limited to this and, for example, they may be open at a position on the step surface 431 corresponding to the tab for peeling off the top seal D.

[0041] The second vacuum flow path 45 is formed in the lower mold 4 so that one end opens at a connection point connecting the bottom surface 411 and the side surface 412 and extends in the vertical direction. The other end of the second vacuum flow path 45 is formed to communicate with the communicating vacuum flow path 46.

[0042] In this way, since the communicating vacuum flow path 46 is connected to both the first vacuum flow path 44 and the second vacuum flow path 45, suction from both the first vacuum flow path 44 and the second vacuum flow path 45 can be performed simultaneously.

[0043] The cut surface 47 is farther away from the upper mold 2 than the step surface 431. The cut surface 47 is connected to the lower end of the outer circumferential surface 433.

[0044] [Film Applying Method Using Film Applying Apparatus] Next, a film applying method according to this embodiment will be described with reference to FIGS. 4 to 11. FIG.

[0045] FIG. 4 is a cross-sectional view showing the state of the film bonding device 1 in step 1 of the film bonding method. FIG. 5 is a cross-sectional view showing the state of the film bonding device 1 in step 2 of the film bonding method. FIG. 6 is a cross-sectional view showing the state of the film bonding device 1 in step 3 of the film bonding method. FIG. 7 is an enlarged view of a main part M in FIG. 6. FIG. 8 is a cross-sectional view showing the state of the film bonding device 1 in step 4 of the film bonding method. FIG. 9 is a cross-sectional view showing the state of the film bonding device 1 in step 5 of the film bonding method. FIG. 10 is an enlarged view of a main part M in FIG. 9. FIG. 11 is a cross-sectional view showing the state of the film bonding device 1 in step 6 of the film bonding method.

[0046] The film applying method performed by the film applying device 1 includes steps 1 to 6.

[0047] First, as shown in FIG. 4, in step 1, the upper presser foot 22 and the lower presser foot 3 of the film bonding device 1 clamp the resin film C from above and below, which is transported by a transport mechanism (not shown) equipped with, for example, a feed roller and a feed roller.

[0048] Specifically, when the resin film C transported by the transport mechanism is positioned between the upper press 22 and the lower press 3, the upper mold 2 is moved downward (i.e., lowered) relative to the lower press 3, so that the resin film C is horizontally clamped between the lower press surface 221 of the upper press 22 and the upper press surface 31 of the lower press 3.

[0049] Next, as shown in Figure 5, in step 2, with the resin film C horizontally clamped between the lower press surface 221 of the upper press 22 and the upper press surface 31 of the lower press 3, the upper mold 2 is moved downward together with the lower press 3 so that the resin film C comes into contact with the flange B2 of the paper container part B that has been placed in the recess 41 in advance.

[0050] When the resin film C is in contact with the flange B2 placed on the placement surface 42, the resin film C is not in contact with the outer peripheral edge 211 of the heating plate 21 but is spaced apart.

[0051] Next, as shown in Figures 6 and 7, in step 3, with the resin film C sandwiched between the lower press surface 221 of the upper press 22 and the upper press surface 31 of the lower press 3, the upper mold 2 is moved further downward together with the lower press 3 so that the resin film C and the flange B2 come into contact (i.e., the flange B2 is pressed by the outer peripheral edge 211 of the heating plate 21 via the resin film C).

[0052] As described above, the upper presser foot 22 protrudes downwardly beyond the heating plate 21, and therefore the presser foot lower surface 221 of the upper presser foot 22 protrudes downwardly beyond the lower surface of the outer peripheral edge 211 of the heating plate 21. As a result, when the flange B2 is pressed by the outer peripheral edge 211 via the resin film C (i.e., the resin film C is sandwiched between the flange B2 and the outer peripheral edge 211), the resin film C located between the flange B2 and the presser foot lower surface 221 of the upper presser foot 22 is pressed downward. As a result, tension is applied to the pressed-down resin film C.

[0053] Also, as shown in Figure 7, when the flange B2 is pressed by the outer peripheral edge 211 via the resin film C, the resin film C, which has been pressed down by the lowering of the upper presser 22 and the lower presser 3, is pressed further downward by the blade portion 23.

[0054] In this state, the blade portion 23 is located on the outer periphery of the step portion 43, and the resin film C is sandwiched between the tip of the blade portion 23 and the outer periphery 433 of the step portion 43. That is, in this state, the tip of the blade portion 23 and the outer periphery 433 overlap in the vertical direction. Note that in this state, when the tip of the blade portion 23 comes into contact with the film C, the film C is not cut. In other words, the film C is not cut simply by pressing the tip of the blade portion 23 against it.

[0055] In this state, an enclosed space S is formed by the resin film C pressed down by the blade portion 23 (specifically, the resin film C located between the outer peripheral edge 211 and the blade portion 23), the outer edge portion B22 of the flange B2, and the lower mold 4 (specifically, the step surface 431 and the connection surface 432 of the step portion 43). In this way, by utilizing the descent of the blade portion 23 accompanying the descent of the upper mold 2, there is no need to provide a separate pressing portion different from the blade portion 23, and the enclosed space S formed by the resin film C pressed down by the blade portion 23, the outer edge portion B22, and the lower mold 4 can be easily formed. As a result, the overall structure of the film laminating device 1 and the operation of the film laminating device 1 can be simplified.

[0056] Next, as shown in FIG. 8, in step 4, the film application device 1 sucks in the air as a gas located between the recess 212 of the heating plate 21 and the resin film C through a plurality of through holes 213 connected to the vacuum air flow path 24, thereby adsorbing the resin film C into the recess 212 and heating it to above its melting point.

[0057] This allows the heating time of the resin film C to be shortened compared to a structure in which the resin film C is heated without being adsorbed to the heating plate 21, thereby improving the efficiency of heating the resin film C.

[0058] Next, as shown in Figure 10, in step 5, the film application device 1 sucks in air as a gas in the sealed space S through the first vacuum flow path 44 which is connected to the communicating vacuum flow path 46, thereby causing the resin film C which has been heated and surrounds the sealed space S to wrap around and cover the outer edge portion B22 of the flange B2 (specifically, the upper surface, end surface and lower surface of the outer edge portion B22).

[0059] This allows the resin film C to be more effectively wrapped around the flange B2 of the paper container part B (specifically, the underside of the outer edge part B22 of the flange B2) by simply sucking the air from the sealed space S, compared to suction in a structure where the sealed space S is not formed. As a result, the reliability of the wrapping part C1 that wraps around the outer edge part B22 of the flange B2 can be improved.

[0060] Furthermore, as described above, the outer edge portion B22 covers one end of the first vacuum flow path 44, and therefore the resin film C can be more effectively wrapped around the flange B2 of the paper container portion B (specifically, the underside of the outer edge portion B22 of the flange B2) compared to a structure in which the outer edge portion B22 does not cover one end of the first vacuum flow path 44. As a result, the reliability of the wrapping portion C1 that wraps around the outer edge portion B22 of the flange B2 can be improved.

[0061] Furthermore, as described above, the first vacuum flow path 44 is formed so that one end is located more inward than the end face of the outer edge B22, which allows the resin film C to be more smoothly wrapped around the flange B2 of the paper container part B (specifically, the underside of the outer edge B22 of the flange B2) compared to a structure in which one end of the first vacuum flow path 44 is not located more inward than the end face of the outer edge B22. As a result, the reliability of the wrapping part C1 that wraps around the outer edge B22 of the flange B2 can be improved.

[0062] As shown in FIG. 10, the resin film C is folded back by suction from the first vacuum channel 44 to tightly cover the lower surface of the outer edge portion B22 and the step surface 431.

[0063] 9, the film laminating device 1 sucks in the air present between the storage section B1 and the resin film C through the second vacuum flow path 45, which is in communication with the communicating vacuum flow path 46, thereby coating the heated and softened resin film C so that it adheres tightly to the inner surface of the storage section B1. The air present between the storage section B1 and the resin film C is sucked into the second vacuum flow path 45 through the perforations or the overlapping portions of the side panels B12.

[0064] In this way, suction from the first vacuum flow path 44 and suction from the second vacuum flow path 45 are performed simultaneously, so that the winding process of winding the resin film C around the outer edge portion B22 of the flange B2 and the covering process of covering the storage portion B1 with the resin film C can be performed simultaneously. As a result, the efficiency of the film applying method using the film applying device 1 can be improved.

[0065] At the same time, the film application device 1 applies compressed air from multiple through holes 213 connected to the vacuum air flow path 24 above the resin film C located on the inner side of the outer edge 211, thereby coating the heated and softened resin film C so that it adheres tightly to the inner surface of the storage section B1.

[0066] This improves the reliability of coating the resin film C on the storage section B1 compared to coating the storage section B1 with the resin film C by suction through the second vacuum flow path 45 alone.

[0067] 11 , in step 6, the film application device 1 can complete the resin film-coated paper container part B by cutting the excess resin film C with the blade part 23. Specifically, the excess resin film C can be cut by moving the blade part 23 downward so that the tip of the blade part 23 and the cutting surface 47 abut against each other.

[0068] [Operation and Effect] Next, the operation and effect of this embodiment will be described.

[0069] The film bonding device 1 according to this embodiment bonds a resin film C to a paper container portion B (container portion), and includes a lower mold 4 having a recess 41 in which the storage portion B1 of the paper container portion B (container portion) is stored, a mounting surface 42 formed on the outer periphery of the recess 41 and on which the flange B2 of the paper container portion B (container portion) is placed, a step portion 43 formed on the outer periphery of the mounting surface 42, and a first vacuum flow path 44 one end of which opens to the step portion 43, a flange presser (outer peripheral edge 211) provided directly above the lower mold 4 so as to be movable up and down relative to the lower mold 4, and which moves downward to press the flange B2 via the resin film C, and a lower mold 4 having a flange presser (outer peripheral edge 212) which is movable up and down relative to the lower mold 4. and a push-down portion (blade portion 23) that is provided directly above the mold 4 and moves downward to push down the resin film C. The step portion 43 is provided at a position lower than the mounting surface 42 and has a step surface 431 that, together with the flange holder (outer peripheral edge 211), sandwiches the resin film C. When the flange B2 is held down by the flange holder (outer peripheral edge 211), the resin film C pushed down by the push-down portion (blade portion 23), the outer edge portion B22 of the flange B2 that protrudes outward from the mounting surface 42 of the flange B2, and the gas (air) in the sealed space S formed by the lower mold 4 are sucked through a first vacuum flow path 44 that communicates with the sealed space S.

[0070] The film application method according to this embodiment is a film application method carried out by the film application device 1, and includes step 3 of pressing the flange B2 with the flange presser (outer peripheral edge 211) and pressing down the resin film C with the pressing section (blade section 23), and step 5 of sucking the gas (air) in the sealed space S through the first vacuum flow path 44.

[0071] With these configurations, by utilizing the downward movement of the blade portion 23, it is possible to easily form an enclosed space S captured by the resin film C pressed down by the blade portion 23, the outer edge portion B22, and the lower mold 4.

[0072] Furthermore, simply sucking the air from the sealed space S allows the resin film C to be wound around the flange B2 of the paper container part B (specifically, the underside of the outer edge part B22 of the flange B2) more effectively than suction in a structure where the sealed space S is not formed. As a result, the reliability of the winding part C1 that winds around the outer edge part B22 of the flange B2 can be improved.

[0073] In addition, in this embodiment, the film application device 1 further includes a heating section (heating plate 21) for heating the resin film C, and the heating section is composed of a heating plate 21 arranged directly above the lower mold 4 so as to be movable up and down relative to the lower mold 4, and the flange holder is composed of the outer peripheral edge 211 of the heating plate 21.

[0074] This configuration allows for a smaller and simpler overall structure of the film laminating device 1 compared to a structure in which the heating unit is provided upstream of the lower mold 4. Furthermore, compared to a structure in which the heating unit is provided upstream of the lower mold 4, the process of transporting the resin film C from the heating unit to the downstream lower mold 4 can be omitted, thereby simplifying the operation of the film laminating device 1.

[0075] Furthermore, compared to a structure in which the flange holder and the heating plate 21 are formed separately, the structure of the entire film bonding device 1 can be simplified and the resin film C placed on the placement surface 42 can be heated efficiently.

[0076] In addition, in this embodiment, the film pasting device 1 further includes an upper presser 22 and a lower presser 3 that press the resin film C from above and below, and the presser portion (blade portion 23) is located between the heating plate 21 and the upper presser 22.

[0077] With this configuration, the resin film C held down by the upper presser foot 22 and the lower presser foot 3 can be pressed down by the blade portion 23 located between the heating plate 21 and the upper presser foot 22, thereby applying tension to the resin film C.

[0078] In this embodiment, the film bonding device 1 further includes an upper mold 2 that is provided so as to be movable up and down relative to the lower mold 4 and to which a heating plate 21 and an upper presser 22 are fixed.

[0079] With this configuration, the heating plate 21 and the upper presser 22 can move up and down together, which simplifies the operation of the film application device 1 compared to a structure in which the heating plate 21 and the upper presser 22 move up and down individually.

[0080] In this embodiment, the pressing portion is composed of a blade portion 23 provided on the outer periphery of the heating plate 21 so as to be movable up and down relative to the heating plate 21, and the blade portion 23 cuts the resin film C.

[0081] This configuration allows for a smaller and simpler overall structure of the film laminating device 1 compared to a structure in which the blade portion is provided downstream of the lower mold 4. Furthermore, compared to a structure in which the blade portion is provided downstream of the lower mold 4, the process of transporting the resin film C downstream from the lower mold 4 can be omitted, thereby simplifying the operation of the film laminating device 1.

[0082] Furthermore, by utilizing the downward movement of the blade portion 23, there is no need to provide a separate pressing portion different from the blade portion 23, and it is possible to easily form the sealed space S enclosed by the resin film C pressed down by the blade portion 23, the outer edge portion B22, and the lower mold 4. As a result, it is possible to simplify the structure of the entire film laminating device 1 and the operation of the film laminating device 1.

[0083] In addition, in this embodiment, one end of the first vacuum channel 44 opens to the step surface 431, and the outer edge portion B22 covers one end of the first vacuum channel 44 in plan view.

[0084] This configuration allows the resin film C to be more effectively wrapped around the flange B2 of the paper container part B (specifically, the underside of the outer edge B22 of the flange B2) than in a structure in which the outer edge B22 does not cover one end of the first vacuum flow path 44. As a result, the reliability of the wrapping part C1 that wraps around the outer edge B22 of the flange B2 can be improved.

[0085] In addition, in this embodiment, a second vacuum flow path 45 is formed in the lower mold 4, one end of which opens into the recess 41, and the gas (air) located between the resin film C and the storage section B1 is sucked through the second vacuum flow path 45, thereby causing the resin film C to adhere to the storage section B1, and suction from the first vacuum flow path 44 and suction from the second vacuum flow path 45 are performed simultaneously.

[0086] According to this configuration, the winding process of winding the resin film C around the outer edge portion B22 of the flange B2 and the covering process of covering the storage portion B1 with the resin film C can be performed simultaneously, thereby improving the efficiency of the film applying method using the film applying device 1.

[0087] 12 and 13, a modified example of the first vacuum flow path 44 will be described. Note that in the modified example, points that are the same as those in the above-described embodiment will be omitted, and points that are different from the above-described embodiment will be mainly described.

[0088] Fig. 12 is a cross-sectional view showing a first modified example of the first vacuum flow path 44. Fig. 13 is a cross-sectional view showing a second modified example of the first vacuum flow path 44.

[0089] In this embodiment, the first vacuum flow path 44 is formed so that one end opens to the step surface 431, but this is not limited to this. For example, as shown in FIG. 12, one end may be formed so that it opens to the connection surface 432, or as shown in FIG. 13, both branched ends may be formed so that they open to both the step surface 431 and the connection surface 432.

[0090] 13, when both branched ends of the first vacuum flow path 44 are open to both the step surface 431 and the connecting surface 432, the resin film C can be more closely attached to the connecting surface 432 and the underside of the outer edge B22 of the flange B2 by suction of the first vacuum flow path 44, which makes it possible to more effectively wrap the resin film C around the flange B2 of the paper container part B (specifically, the underside of the outer edge B22 of the flange B2). As a result, the reliability of the wrapping part C1 that wraps around the outer edge B22 of the flange B2 can be further improved.

[0091] The present embodiment and its modified examples have been described above, but the above-described embodiment and modified examples merely illustrate some of the application examples of the present invention, and are not intended to limit the technical scope of the present invention to the specific configurations of the above-described embodiment.

Claims

1. A film application device for applying a resin film to a container part made of a fiber material, comprising: a lower mold which has a recess for accommodating a storage part of the container part, a mounting surface formed on the outer periphery of the recess and on which a flange of the container part is placed, a step formed on the outer periphery of the mounting surface, and a first vacuum flow path one end of which opens to the step, and which is provided immovably or vertically movable; a flange presser which is provided immediately above the lower mold, movable vertically or immovably, and presses down the flange via the resin film by moving relative to the lower mold; and a presser which is provided immediately above the lower mold, movable vertically or immovably, and presses down the resin film by moving relative to the lower mold, wherein the step is provided at a position lower than the mounting surface, and has a step surface which sandwiches the resin film together with the flange presser, a film application device in which, when the flange is held down by the flange holder, gas in a sealed space formed by the resin film pressed down by the pressing portion, the outer edge portion of the flange protruding outward from the mounting surface of the flange, and the lower mold is sucked in through the first vacuum flow path communicating with the sealed space.

2. A film application device as described in claim 1, further comprising a heating section for heating the resin film, the heating section being composed of a heating plate disposed directly above the lower mold and movable up and down relative to the lower mold, and the flange holder being composed of the outer peripheral edge of the heating plate.

3. The film bonding device according to claim 2, further comprising an upper presser and a lower presser which press the resin film from above and below, the presser being positioned between the heating plate and the upper presser.

4. The film bonding device according to claim 3, further comprising an upper mold which is movable up and down relative to said lower mold and to which said heating plate and said upper presser are fixed.

5. A film application device as described in claim 2, wherein the pressing portion is composed of a blade portion provided on the outer periphery of the heating plate so as to be movable up and down relative to the heating plate, and the blade portion cuts the resin film.

6. A film bonding device as described in claim 1, wherein one end of the first vacuum flow path opens to the step surface, and the outer edge portion covers one end of the first vacuum flow path in a plan view.

7. A film application device as described in claim 1, wherein the lower mold is formed with a second vacuum flow path having one end opening into the recess, and the resin film is adhered to the storage section by sucking gas located between the resin film and the storage section through the second vacuum flow path, and suction from the first vacuum flow path and suction from the second vacuum flow path are performed simultaneously.

8. A film application method carried out by the film application device described in any one of claims 1 to 7, comprising the steps of: pressing the flange with the flange presser and pressing down the resin film with the pressing section; and sucking gas from the sealed space through the first vacuum flow path.

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