Exterior cover, electronic device comprising same, and manufacturing method therefor

Abstract

According to an embodiment of the present disclosure, an exterior cover may be provided. The exterior cover may include a body part including a first recycled plastic and a cover part including a second recycled plastic. The second recycled plastic may be relatively more flexible than the first recycled plastic and formed as a thin film. The body part may include a first surface, and the cover part may include a second surface directly coupled to the first surface of the body part. In addition, various embodiments are possible.

Description

Outer cover, electronic device including same, and method for manufacturing same

[0001] Examples disclosed in this document relate to an outer cover, an electronic device including the same, and a method of manufacturing the same.

[0002] Advances in information and communication technology and semiconductor technology are integrating diverse functions into a single portable electronic device. For example, electronic devices can implement not only communication functions but also entertainment functions such as gaming, multimedia functions such as music and video playback, communication and security functions for mobile banking, or even calendar management and electronic wallet functions. These electronic devices are becoming smaller and more portable for users.

[0003] These electronic devices may be used with an external cover (or case) that encloses the exterior of the electronic device to protect its internal components from external physical impact. These electronic device covers not only provide protection, but also provide aesthetic appeal that can attract users to purchase the device.

[0004] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0005] According to one embodiment of the present disclosure, an outer cover may be provided. The outer cover may include a main body portion comprising a first recycled plastic and a cover portion comprising a second recycled plastic. The second recycled plastic may be relatively more flexible than the first recycled plastic and may be in the form of a thin film. The main body portion may include a first surface, and the cover portion may include a second surface directly bonded to (or integrally formed with) the first surface of the main body portion.

[0006] According to one embodiment of the present disclosure, an electronic device may be provided. The electronic device may include an outer cover forming a portion of an exterior of the electronic device. The outer cover may include a body portion comprising a first recycled plastic and a cover portion comprising a second recycled plastic. The second recycled plastic may be relatively more flexible than the first recycled plastic and may be in the form of a thin film. The body portion may include a first surface, and the cover portion may include a second surface directly bonded to the first surface of the body portion.

[0007] According to one embodiment of the present disclosure, a method for manufacturing an outer cover may be provided. The method may include an operation of preparing a first recycled plastic, an operation of forming the first recycled plastic into a main body, an operation of preparing a second recycled plastic, and an operation of thermally compressing the second recycled plastic onto the main body to form a cover portion joined to the main body.

[0008] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0010] FIG. 2 is a front perspective view of an electronic device according to one embodiment disclosed in this document.

[0011] FIG. 3 is a rear perspective view of an electronic device according to one embodiment disclosed in this document.

[0012] FIG. 4 is a perspective view of an outer cover according to one embodiment of the present disclosure.

[0013] FIG. 5 is a cross-sectional side view taken along line B-B' of FIG. 4 according to one embodiment of the present disclosure.

[0014] FIG. 6 is a side view illustrating a method for manufacturing an outer cover according to one embodiment of the present disclosure.

[0015] FIG. 7 is a drawing for explaining the production of a first recycled plastic using waste plastic according to one embodiment of the present disclosure.

[0016] FIG. 8 is an enlarged view of the first recycled plastic constituting the main body of the outer cover according to one embodiment of the present disclosure.

[0017] FIGS. 9A and 9B are plan views of an outer cover according to one embodiment of the present disclosure.

[0018] FIG. 10 is a plan view of an outer cover according to one embodiment of the present disclosure.

[0019] Figure 11 is a flowchart of a method for manufacturing an outer cover according to one embodiment of the present disclosure.

[0020] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0021] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present invention as defined by the claims and their equivalents. While the following description includes numerous specific details to aid understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various modifications and variations of the various embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0022] The terms and words used in the following description and claims are not intended to be limited by their bibliographic meanings, but are merely used by the inventors to ensure a clear and consistent understanding of the disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present invention is provided solely for illustrative purposes, not for the purpose of limiting the present invention, which is defined by the appended claims and their equivalents.

[0023] The singular forms "a," "an," and "the" should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a surface of a part" includes reference to one or more of these surfaces.

[0024] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0025] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0026] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0027] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0028] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0029] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0030] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0031] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0032] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0033] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0034] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0035] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0036] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0037] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0038] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0039] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0040] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0041] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0042] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0043] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0044] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0045] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0046] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0047] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the orthogonal coordinate system illustrated in the drawings. For example, the front of the electronic device or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. Also, in one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the orthogonal coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit the one embodiment disclosed in this document. For example, the aforementioned front or rear facing direction may vary depending on whether the electronic device is unfolded or folded, and the aforementioned direction may be interpreted differently depending on the user's gripping habits.

[0048] FIG. 2 is a perspective view showing the front side of an electronic device according to one embodiment of the present disclosure. FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2 according to one embodiment of the present disclosure. The configuration of the electronic device (101) of FIGS. 2 and 3 may be all or part of the same as the configuration of the electronic device (101) of FIG. 1.

[0049] Referring to FIGS. 2 and 3 , an electronic device (101) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A) of FIG. 2 , the second side (210B), and the side surface (210C) of FIG. 3 . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In one embodiment, the rear plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0050] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat, in which case it may not include a curved extending region. When it includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be less than that of the other portions.

[0051] According to one embodiment, the electronic device (101) may include one or more of a display (201), an audio module (not shown) including at least one sound hole (203, 207, 214) (e.g., audio module (170) of FIG. 1), a sensor module (204) (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), or a connector hole (208, 209) (e.g., connection terminal (178) of FIG. 1). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., key input device (217) or light emitting element (206)) or may additionally include other components.

[0052] In one embodiment, the display (201) may be visually exposed, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (201) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the corners of the display (201) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), in order to expand the area over which the display (201) is visually exposed, the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially the same.

[0053] In one embodiment (not shown), a recess or opening may be formed in a part of a screen display area of ​​the display (201), and at least one of an acoustic hole (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an acoustic hole (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (201). In one embodiment (not shown), the display (201) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor module (204) and / or at least a portion of the key input device (217) may be positioned on the side (210C).

[0054] According to one embodiment, the audio module (not shown) may include a microphone hole (203) and sound holes (207, 214). The microphone hole (203) may have a microphone disposed inside to acquire external sound, and in one embodiment, multiple microphones may be disposed to detect the direction of the sound. According to one embodiment, the sound holes (207, 214) may include an external sound hole (207) and a receiver hole (214) for calls. In one embodiment, the sound holes (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included in the audio module without the sound holes (207, 214) (e.g., a piezo speaker).

[0055] According to one embodiment, the sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210). According to an embodiment, an additional sensor module may be disposed on a second surface (210B) of the housing (210). The fingerprint sensor (not shown) may be disposed on not only the first surface (210A) (e.g., the display (201)) of the housing (210) but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0056] In one embodiment, the camera modules (205, 212, 213) may include a first camera module (205) facing the first side (210A) of the electronic device (101), and a second camera module (212) and / or a flash (213) facing the second side (210B). For example, the first camera module (205) and / or the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, some of the camera modules (205) and / or some of the sensor modules (e.g., the sensor module (204)) among the camera modules (205, 212) may be arranged to be exposed to the outside through at least a portion of the display (201). In one embodiment, the first camera module (205) may include a punch hole camera arranged inside a hole or recess formed on the back surface of the display (201). For example, the first camera module (205) may receive at least a portion of light incident on the first side (210A) (or front side) of the electronic device (101) through the display (201) within the electronic device (101). According to one embodiment, the first camera module (205) and / or the sensor module (204) may be arranged so as to be in contact with the external environment through a transparent area from the internal space of the electronic device (101) to the front plate (202) of the display (201). Additionally, some of the sensor modules (204) may be arranged so as to perform their functions without being visually exposed through the front plate (202) within the internal space of the electronic device.

[0057] In one embodiment, the second camera module (212) may be disposed inside the housing (210) such that the lens is exposed to the second side (210B) (or back) of the electronic device (101). For example, the camera module (212) may be electrically connected to a printed circuit board (e.g., the printed circuit board (240a) of FIG. 4). For example, the flash (213) may include a light-emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (213) may emit infrared light. For example, infrared light emitted from the flash (213) and reflected by a subject may be received through a sensor module (not shown) disposed on the second side (210B) of the housing (210). An electronic device (101) or processor (e.g., processor (180) of FIG. 1) can detect depth information of a subject based on the point in time when infrared rays are received from the sensor module.

[0058] The camera modules (205, 212, 213) are not limited to the above structure, and may be designed in various ways, such as by mounting only some camera modules or adding new camera modules, depending on the structure of the electronic device (101).

[0059] According to one embodiment, the electronic device (101) may include a plurality of camera modules (e.g., dual cameras or triple cameras) each having different properties (e.g., angles of view) or functions. For example, the electronic device (101) may include a plurality of camera modules (205, 212) each having a different angle of view, and the electronic device (101) may control the camera modules (205, 212) to change the angle of view performed by the electronic device (101) based on a user's selection. For example, at least one of the plurality of camera modules (205, 212) may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (205, 212) may be a front camera (e.g., front camera (205)), and at least another may be a rear camera (e.g., rear camera (212)). Additionally, the plurality of camera modules (205, 212) may include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (e.g., a time of flight (TOF) camera, a structured light camera). In one embodiment, the IR camera may be operated as at least a part of a sensor module. For example, the TOF camera may be operated as at least a part of a sensor module (not shown) for detecting a distance to a subject.

[0060] In one embodiment, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0061] In one embodiment, the light emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light emitting element (206) may provide a light source that is linked to a process of, for example, the camera module (205). The light emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0062] According to one embodiment, the connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0063] FIG. 4 is a perspective view of an outer cover according to an embodiment of the present disclosure. FIG. 5 is a cross-sectional side view taken along line B-B' of FIG. 4 according to an embodiment of the present disclosure. FIG. 6 is a side view illustrating a method for manufacturing an outer cover according to an embodiment of the present disclosure. FIG. 7 is a drawing illustrating the manufacturing of a first recycled plastic using waste plastic according to an embodiment of the present disclosure.

[0064] Referring to FIGS. 4 and 5, according to one embodiment, the outer cover (300) (or case) may include a first outer surface (300A), a second outer surface (300B) opposite the first outer surface (300A), and through holes (308, 309) formed penetrating from the first outer surface (300A) to the second outer surface (300B). According to one embodiment, the outer cover (300) may include a sidewall portion (300C) connected to the first outer surface (300A) and the second outer surface (300B), which is disposed at an edge of the first outer surface (300A) and the second outer surface (300B) and connected thereto.

[0065] In one embodiment, the outer cover (300) of FIGS. 4 and 5 may be identical to or similar to all or part of the configuration of a housing (e.g., the housing (210) of FIGS. 2 and 3) of an electronic device (e.g., the electronic device (101) of FIGS. 1 to 3). According to one embodiment, the outer cover (300) may constitute a rear plate (e.g., the rear plate (211) of FIGS. 2 and 3) of the housing (210). According to one embodiment, the outer cover (300) may constitute a rear plate (e.g., the rear plate (211) of FIGS. 2 and 3) of the housing (210) and at least a portion of a side structure (218) extending from the rear plate (211). When the outer cover (300) constitutes at least a portion of the housing (210), the first outer surface (300A) of the outer cover (300) may form at least a portion of a second surface (or rear surface) of the electronic device (101) (e.g., the second surface (210B) of FIG. 3) and / or a side surface (e.g., the side surface (210C) of FIGS. 2 and 3) extending from the second surface (210B). According to one embodiment, components disposed on the second surface (210B) of the electronic device (101) may be disposed in the through holes (318) of the outer cover (300). For example, a camera module (e.g., the rear camera (212) and / or the flash (213) of FIG. 3) of the electronic device (101) may be disposed in the through holes (308, 309). For example, the through holes (308, 309) may include a first through hole(s) (308) in which a camera module (e.g., a rear camera (212) of FIG. 3) is disposed, and a second through hole (309) in which a flash (e.g., a flash (213) of FIG. 3) is disposed. In one embodiment, at least a portion of the configuration of the outer cover (300) may be omitted (e.g., at least a portion of the through holes (308, 309) and / or a portion of the side wall portion (300C)).In one embodiment, when the outer cover (300) includes a side wall portion (300C), the outer cover (300) may include an additional through hole formed in the side wall portion (300C) (e.g., the microphone hole (203), the external sound hole (207), the first connector hole (208) and / or the second connector hole (209) of FIGS. 2 and 3).

[0066] In the present disclosure, the external cover (300) is described mainly with an example in which the external cover (300) constitutes a housing (e.g., the housing (210) of FIGS. 2 and 3) of an electronic device (e.g., the electronic device (101) of FIGS. 1 to 3), but according to one embodiment, the external cover (300) may be an accessory case (e.g., see FIG. 10) that can be detachably mounted on the housing (210) of the electronic device (101).

[0067] In the present disclosure, an example in which an external cover (300) is applied to an electronic device (e.g., an electronic device (101) of FIGS. 2 and 3) (e.g., a smart phone) is described, but the type of electronic device to which the external cover (300) can be applied is not limited, and may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.

[0068] Referring to FIG. 5, in one embodiment, the outer cover (300) may include a body portion (or first material, first member) (301) and a cover portion (302) laminated on the body portion (301). According to one embodiment, the body portion (301) and the cover portion (302) may be directly coupled to or integrated with each other.

[0069] Referring to FIG. 5, according to one embodiment, the main body portion (301) may include a first surface (310A) and a surface (310B) opposite the first surface (310A) (or facing in the opposite direction to the first surface (310A)). According to one embodiment, the first surface (310A) of the main body portion (301) may face the second surface (320A) of the cover portion (302) and may be directly coupled to (or integrated with) the second surface (320A) of the cover portion (302). According to one embodiment, the third surface (310B) of the main body portion (301) may form or correspond to the second outer surface (300B) of the outer cover (300). In one embodiment, when the outer cover (300) is included in a housing (e.g., the housing (210) of FIGS. 2 and 3) of an electronic device (e.g., the electronic device (101) of FIGS. 2 and 3), the third surface (310B) of the main body (301) may face internal structures or electrical / electronic components built into the electronic device (101). In one embodiment, when the outer cover (300) is an accessory case detachably coupled on a housing (e.g., the housing (210) of FIGS. 2 and 3) of an electronic device (e.g., the electronic device (101) of FIGS. 2 and 3), the third surface (310B) of the main body (301) may face a second surface (210B) of the housing (210).

[0070] According to one embodiment, the first recycled plastic included in the main body (301) may include a thermoplastic plastic (or a thermoplastic synthetic resin) that is used at least once, discarded, or recycled. In the present disclosure, recycling of plastic may include material recycling in which waste plastic is physically and mechanically processed to produce plastic again, or chemical recycling (e.g., thermal decomposition, depolymerization) in which waste plastic is converted into a raw material in the form of a monomer through a chemical process and the raw material is used to produce plastic again. However, the type or method of recycling of plastic is not limited to what has been described above. For example, the material recycling may include melting, crushing, and / or molding of waste plastic. Referring to FIG. 7, for example, the first recycled plastic included in the main body (301) may be a recycled plastic (21) that is primarily recycled through process A (e.g., crushing, melting, and / or molding) from waste plastic (e.g., shampoo container, toy). Alternatively, the first recycled plastic included in the main body (301) may be a recycled plastic that is recycled more than twice, and as an example, may be a recycled plastic (22) that is secondary recycled through process B (e.g., crushing, melting, and / or molding) from a primarily recycled recycled plastic (21).

[0071] In one embodiment, the first recycled plastic of the main body (301) may include polypropylene (PP) or polyethylene (PE) (e.g., high density polyethylene (HDPE)). However, the type of plastic constituting the first recycled plastic of the main body (301) is not limited, and may include various types of thermoplastic plastics that can be recyclable. In one embodiment, the first recycled plastic of the main body (301) may be made of a single type (or one type) of plastic. For example, when the first recycled plastic includes a single type of plastic (e.g., polypropylene or polyethylene), physical recycling of the main body (301) may be easier when the outer cover (300) is disposed of, compared to when the first recycled plastic includes two or more types of plastic.

[0072] Referring to FIG. 5, according to one embodiment, the cover portion (302) may include a second surface (320A) and a fourth surface (320B) opposite the second surface (320A) (or facing in the opposite direction to the second surface (320A)). According to one embodiment, the second surface (320A) of the cover portion (302) may face and directly contact the first surface (310A) of the main body portion (301) with the cover portion (302) and may be coupled to the first surface (310A). According to one embodiment, the cover portion (302) may be thermally compressed and coupled to the main body portion (301), in which case a portion of the second surface (320A) of the cover portion (302) and a portion of the first surface (310A) of the main body portion (301) may be melted and coupled to each other. For example, when the cover part (302) is bonded to the main body part (301) through heat compression without an adhesive, the outer cover (300) can be formed without an adhesive, and the outer cover (300) can be easily recycled after use, and the quality (e.g., purity, durability) of the recycled plastic can be higher than that of waste plastic containing an adhesive when recycled.

[0073] According to one embodiment, the fourth surface (320B) of the cover portion (302) may form or correspond to the first outer surface (300A) of the outer cover (300). In one embodiment, when the outer cover (300) is included in a housing (e.g., the housing (210) of FIGS. 2 and 3) of an electronic device (e.g., the electronic device (101) of FIGS. 2 and 3), the fourth surface (320B) of the cover portion (302) may be exposed to the outside of the electronic device (101) and may form an exterior of the electronic device (101). In one embodiment, when the outer cover (300) is an accessory case detachably coupled to a housing (e.g., housing (210) of FIGS. 2 and 3) of an electronic device (e.g., electronic device (101) of FIGS. 2 and 3), the fourth surface (320B) of the cover portion (302) can form the exterior of the outer cover (300).

[0074] In one embodiment, the cover portion (302) may include a second recycled plastic. In one embodiment, the second recycled plastic of the cover portion (302) may have greater flexibility than the first recycled plastic of the body portion (301). In the present disclosure, “flexibility” may refer to a property of a material to be deformed by an external force and then return to its original shape. In one embodiment, the body portion (301) may provide a function of maintaining the shape of the outer cover (300) and protecting an electronic device (e.g., the electronic device (101) of FIGS. 1 to 3) equipped with the outer cover (300). The body portion (301) and / or the cover portion (302) may be used for the exterior design of the outer cover (300).

[0075] In one embodiment, the second recycled plastic included in the cover portion (302) may be a thermoplastic plastic, and may include at least a soft plastic in the form of a thin film that has been used once, discarded, or recycled (e.g., food packaging paper, plastic bags). According to one embodiment, the second recycled plastic of the cover portion (302) may be a flexible soft plastic in the form of a thin film. For example, the second recycled plastic of the cover portion (302) may include polypropylene (PP) and / or polyethylene (PE). For example, the second recycled plastic of the cover portion (302) may include polyethylene such as low density polyethylene (LDPE) or linear low density polyethylene (LLDPE). However, the type of plastic constituting the second recycled plastic of the cover portion (302) is not limited, and may include various thermoplastic plastics that can be processed into a thin film. According to one embodiment, the second recycled plastic of the cover portion (302) may include a single type or two or more types of plastic.

[0076] Referring to FIG. 5, according to one embodiment, the thickness (t0) (e.g., the Z-direction thickness) of the main body portion (301) may be greater than the thickness (t2) (e.g., the Z-direction thickness) of the cover portion (302). For example, the lower limit of the thickness (t0) of the main body portion (301) may be about 3 to about 6 times, or about 4 to about 5 times, or more, of the upper limit of the thickness (t2) of the cover portion (302). For example, the lower limit of the thickness (t0) of the main body portion (301) may be in a range of about 0.7 mm to about 1.3 mm, a range of about 0.8 mm to about 1.2 mm, or a range of about 0.9 mm to about 1.1 mm, or may be about 1.0 mm as an example. However, the above-described description of the thickness (t0) of the main body (301) is only an example and is not limiting, and the thickness (t0) of the main body (301) can be set to a value that can maintain the shape of the main body (301) and can be changed depending on the material. For example, the upper limit of the thickness (t2) of the cover part (302) can be in a range of about 0.1 mm to 0.3 mm or about 0.15 mm to 0.25 mm, and can be about 0.2 mm as an example. However, the above-described description of the thickness (t2) of the cover part (302) is only an example and is not limiting, and the thickness (t2) of the cover part (302) can be set to a value that can be bonded to the main body (301) by thermal compression, and can be changed depending on the material. For example, in FIG. 5, the thickness of the main body (301) excluding the height (h1) of the first protrusions (311) may be indicated as t1.

[0077] Referring to FIG. 6, in one embodiment, the main body (301) and the cover part (302) can be directly bonded or integrated with each other through thermal compression (or thermal compression process) using a mold (10). According to one embodiment, as described above with reference to FIG. 5, the second surface (320A) of the cover part (302) can face and directly contact the first surface (310A) of the main body (301) with the cover part (302), and can be bonded to the first surface (310A).

[0078] Referring to FIG. 6, according to one embodiment, the cover portion (302) may be formed by thermally compressing a second recycled plastic (e.g., food packaging paper, plastic bag) in a thin film form onto the body portion (301) by a mold (10). The cover portion (302) may be integrated into the body portion (301) by the pressure and heat of the mold (10). According to one embodiment, as described above with reference to FIG. 5, a part of the second surface (320A) of the cover portion (302) and a part of the first surface (310A) of the body portion (301) may be melted and bonded to each other. In this way, when the cover part (302) is bonded to the main body part (301) through thermal compression without an adhesive, the outer cover (300) can be formed without an adhesive, and the outer cover (300) can be easily recycled after use, and the quality (e.g., purity, durability) of the recycled plastic can be higher than that of waste plastic containing an adhesive when recycled.

[0079] Referring to FIG. 6, according to one embodiment, the mold (10) may include a plurality of protrusions (11) and flat portions (12) arranged between the protrusions (11). According to one embodiment, when thermal compression is performed using the mold (10), the outer cover (300) may be formed with protrusions (311, 321) and flat portions (312, 322) formed by the protrusions (11) and flat portions (12) of the mold (10). Referring again to FIG. 5, according to one embodiment, the main body (301) of the outer cover (300) may include first protrusions (311) protruding toward the cover portion (302) and first flat portions (312) extending from the first protrusions (311) and arranged between the first protrusions (311). According to one embodiment, the cover portion (302) of the outer cover (300) may include second protrusions (321) laminated on the first protrusions (311) and second flat portions (322) extending from the second protrusions (321) and laminated on the first flat portions (312). For example, the first protrusions (311) and the second protrusions (321) may have an arrangement and shape corresponding to the protrusions (11). For example, the first flat portions (312) and the second flat portions (322) may have an arrangement and shape corresponding to the flat portions (12) of the mold (10). For example, the protrusions (11) of the mold (10) can enable bonding between the main body (301) and the cover portion (302) with relatively low heat and / or relatively low pressure compared to when the mold (10) is formed flat without unevenness (or when the mold (10) includes only a flat portion (12).

[0080] Referring to FIG. 5, for example, the protrusions (11) of the mold (10) may be spaced apart from each other at a constant interval, and accordingly, the interval (d1) between the first protrusions (311) of the main body (301) may be constant, but is not limited thereto, and the interval between the protrusions (11) and the interval (d1) between the first protrusions (311) may vary. For example, the interval (d1) between the first protrusions (311) may be in a range of about 1.5 mm to about 3.5 mm, in a range of about 2 mm to about 3 mm, or as an example, may be about 2.5 mm. For example, the height (h1) (e.g., the Z-direction height) of the first protrusions (311) may be in a range of about 0.1 mm to about 0.5 mm, in a range of about 0.2 mm to about 0.4 mm, or as an example, may be about 0.3 mm. However, the above-described description of the spacing (d1) and the height (h1) between the first protrusions (311) is only an example and is not limiting. For example, the spacing and height of the protrusions (11) of the mold (10) that determine the spacing (d1) and the height (h1) between the first protrusions (311) may be set and changed by factors such as a value that can thermally compress the cover part (302) to the main body part (301) with minimal pressure and heat, and the materials of the main body part (301) and the cover part (302).

[0081] FIG. 8 is an enlarged view of the first recycled plastic constituting the main body of the outer cover according to one embodiment of the present disclosure. FIGS. 9A and 9B are plan views of the outer cover according to one embodiment of the present disclosure. FIG. 10 is a plan view of the outer cover according to one embodiment of the present disclosure.

[0082] Referring to FIG. 8, according to one embodiment, the first recycled plastic constituting the main body (301) of the outer cover (300) may include plastic fragments (P1, P2) obtained by crushing waste plastic. According to one embodiment, the plastic fragments (P1, P2) of the first recycled plastic of the main body (301) may include two or more colors. For example, the colors of the first plastic fragments (P1) and the second plastic fragments (P2) in FIG. 8 may be different from each other. For example, the first recycled plastic of the main body (301) may be formed by classifying and mixing plastic fragments obtained by crushing waste plastic of various colors according to color. For example, the first recycled plastic may be implemented to have a specific pattern by melting plastic fragments of two or more colors and controlling the flow of the plastic fragments. For example, the first recycled plastic may be implemented with a specific pattern, such as a marbling pattern or a terrazzo pattern. However, the patterns that can be implemented in the first recycled plastic are not limited to those described above, and various patterns can be implemented depending on the size and color of the plastic fragments included in the first recycled plastic. However, the characteristics of the plastic fragments (P1, P2) of the first recycled plastic of the main body (301) are not limited and can be composed of a single color.

[0083] Figures 9a and 9b may illustrate examples of an outer cover (300). Referring to Figures 9a and 9b, according to one embodiment, the cover portion (302) of the outer cover (300) may be at least partially transparent. For example, the cover portion (302) may be formed by bonding a second recycled plastic, such as a soft waste plastic (or waste vinyl), such as food packaging, to the main body portion (301) by thermal compression without an adhesive. For example, the second recycled plastic constituting the cover portion (302) may include a graphic layer. Here, the graphic layer may mean a sheet on which a conventional printed matter (e.g., a picture, a photograph, a text) is formed on a soft plastic, such as food packaging or a plastic bag. Referring to FIGS. 9A and 9B , according to one embodiment, the graphic layer of the cover portion (302) may be visually exposed to the outside of the outer cover (300) and may be utilized as a design element (e.g., color, texture) of the outer cover (300). FIG. 9A may illustrate an example in which the second recycled plastic constituting the cover portion (302) includes multiple pieces of second recycled plastics arranged and / or layered on the main body portion (301), and FIG. 9B may illustrate an example in which the second recycled plastic constituting the cover portion (302) is a single piece. However, the material, shape, and design of the cover portion (302) are not limited to those described above, and may include various extended examples that can be derived from the method for manufacturing the outer cover of the present disclosure.

[0084] Referring to FIG. 10, according to one embodiment, a cover portion (302) may not be arranged on a part of a main body portion (301) of an outer cover (300), and a pattern implemented on the main body portion (301) may be visually exposed to the outside of the outer cover (300). For example, an electronic device (e.g., a smartphone) to which an outer cover (300) according to one embodiment of the present disclosure is applied may have various form factors such as a bar type (e.g., see FIGS. 9A and 9B), a foldable type (e.g., see FIG. 10), a rollable type, and a stretchable type.

[0085] Figure 11 is a flowchart of a method for manufacturing an outer cover according to one embodiment of the present disclosure.

[0086] FIG. 11 may illustrate a method for manufacturing an outer cover (300) according to an embodiment described above with reference to FIGS. 4 to 10. As described above with reference to FIGS. 4 to 10, the outer cover (300) may include a main body (301) and a cover portion (302) laminated on the main body portion (301). According to one embodiment, the main body portion (301) and the cover portion (302) may be directly coupled to or integrated with each other.

[0087] Referring to FIG. 11, in one embodiment, a method for manufacturing an outer cover (300) may include an operation (1) of preparing a first recycled plastic, an operation (2) of forming a main body (301) with the first recycled plastic, an operation (3) of preparing a second recycled plastic, and an operation (4) of forming a cover portion (302) coupled to the main body (301) with the second recycled plastic.

[0088] In one embodiment, the cover portion (302) may include a second recycled plastic. In one embodiment, the second recycled plastic of the cover portion (302) may have greater flexibility than the first recycled plastic of the body portion (301). In one embodiment, the body portion (301) may provide a function of maintaining the shape of the outer cover (300) and protecting an electronic device (e.g., the electronic device (101) of FIGS. 1 to 3) equipped with the outer cover (300). The body portion (301) and / or the cover portion (302) may be used in the exterior design of the outer cover (300).

[0089] According to one embodiment, in the operation (1) of preparing the first recycled plastic, the first recycled plastic for forming the main body (301) may include a thermoplastic plastic (or a thermoplastic synthetic resin) that is used at least once, discarded, or recycled. In the present disclosure, recycling of plastic may include material recycling that physically and mechanically processes waste plastic to produce plastic again, or chemical recycling (e.g., thermal decomposition, depolymerization) that converts waste plastic into a raw material in the form of a monomer through a chemical process and produces plastic again with the raw material. However, the type or method of recycling of plastic is not limited to what has been described above. For example, the material recycling may include melting, crushing, and / or molding of waste plastic. In one embodiment, the first recycled plastic of the main body (301) may include polypropylene (PP) or polyethylene (PE) (e.g., high density polyethylene (HDPE)). However, the type of plastic constituting the first recycled plastic is not limited, and may include various types of thermoplastic plastics that can be recycled. In one embodiment, the first recycled plastic may be made of a single type (or one type) of plastic. For example, when the first recycled plastic includes a single type of plastic (e.g., polypropylene or polyethylene), physical recycling of the main body (301) may be easier when the outer cover (300) is disposed of, compared to when the first recycled plastic includes two or more types of plastic.

[0090] According to one embodiment, the operation (1) of preparing the first regenerated plastic may include an operation of crushing waste plastics. According to one embodiment, the operation (1) of preparing the first regenerated plastic may include an operation of mixing waste plastic fragments of different colors. For example, the crushed waste plastic fragments may be classified by color, and the colors of the waste plastic fragments may be specified and mixed according to the design of the outer cover (300). For example, waste plastic fragments of a single color or waste plastic fragments containing two colors (e.g., plastic fragments (P1, P2) of FIG. 8) may be mixed.

[0091] According to one embodiment, the operation (2) of forming the first recycled plastic into the main body (301) may include an operation of melting waste plastic fragments of different colors (e.g., plastic fragments (P1, P2) of FIG. 8). According to one embodiment, the operation (2) of forming the first recycled plastic into the main body (301) may include an operation of controlling the flow of the waste plastic fragments to form a specific pattern (e.g., a marbling pattern, a terrazzo pattern).

[0092] According to one embodiment, in the operation (3) of preparing the second recycled plastic, the second recycled plastic for forming the cover portion (302) may be a thermoplastic plastic, and may include at least a soft plastic in the form of a thin film (e.g., food packaging paper, plastic bag) that has been used, discarded, or recycled once. According to one embodiment, the second recycled plastic may be a flexible soft plastic in the form of a thin film. For example, the second recycled plastic may include polypropylene (PP) and / or polyethylene (PE). For example, the second recycled plastic may include polyethylene such as low density polyethylene (LDPE) or linear low density polyethylene (LLDPE). However, the type of plastic constituting the second recycled plastic is not limited, and may include various thermoplastic plastics that can be processed into a thin film. According to one embodiment, the second recycled plastic may include a single type or two or more types of plastic.

[0093] According to one embodiment, the operation (4) of forming the cover portion coupled to the main body portion (301) may include an operation of placing a plurality of second recycled plastics on the main body portion (301). According to one embodiment, the graphic layer of the cover portion (302) may be visually exposed to the outside of the outer cover (300) and may be utilized as a design element (e.g., color, texture) of the outer cover (300). Referring to FIG. 9A, the second recycled plastic constituting the cover portion (302) may be placed and / or layered on the main body portion (301).

[0094] According to one embodiment, the operation (4) of forming the cover part coupled to the main body part (301) may include an operation of thermally compressing the second recycled plastic onto the main body part (301). According to one embodiment, the cover part (302) may be thermally compressed and coupled onto the main body part (301), in which case a portion of one side of the cover part (302) (e.g., the second side (320A) of FIG. 5) and a portion of one side of the main body part (301) (e.g., the first side (310A) of FIG. 5)) may be melted and coupled to each other. For example, when the cover part (302) is thermally compressed and coupled to the main body part (301) without an adhesive, the outer cover (300) may be formed without an adhesive, and recycling of the outer cover (300) after use may be easy, and the quality (e.g., purity, durability) of the recycled plastic may be higher than that of waste plastic containing an adhesive when recycled. The operation of thermally compressing the second recycled plastic on the main body (301) may use a mold (e.g., the mold (10) of FIG. 6). For example, the temperature and time for performing thermal compression using the mold (10) may be set to the minimum temperature and time for which the main body (301) and the cover (302) are coupled. For example, the temperature of thermal compression may be, for example, about 180 degrees or less or about 170 degrees or less, for example, about 165 degrees to about 170 degrees, and the time may be, for example, about 20 seconds or more and 40 seconds or less, or about 30 seconds or more and 35 seconds or less. However, the temperature and time of thermal compression may be set and changed according to factors such as the material and thickness of the main body (301) and the cover (302), and are not limited thereto.

[0095] Regarding the disposal of waste plastics, interest in recycling them is growing as an alternative to simple landfilling or incineration, which can cause additional environmental problems. Recently, the social and environmental significance of products made from recycled (or reclaimed) plastics can serve as a purchasing incentive for consumers. For example, material recycling can be applied to waste plastics, which involves physically and mechanically processing the material to produce new plastics. However, in the case of waste plastics subjected to treatments that hinder recycling (e.g., painting, printing, metallization, filming), even if material recycling is performed, the low quality of the recycled plastic can limit its utility and make product development (or commercialization) difficult. In particular, thin-film plastics such as food packaging and plastic bags (e.g., polypropylene, low-density polyethylene) often contain treatments that hinder recycling (e.g., painting, printing, metallization, filming), resulting in a significantly low recycling rate. Therefore, technologies or product development methods that enable these thin-film plastics to be recycled more than once are urgently needed.

[0096] Aspects of the present disclosure are intended to solve at least the problems and / or disadvantages described above and to provide at least the advantages described below.

[0097] According to one embodiment of the present disclosure, an outer cover (or case) of an eco-friendly (or sustainable) electronic device may be provided, which includes a main body made of a first recycled plastic (or waste plastic) material and a cover part made of a second recycled plastic material in the form of a thin film laminated on the main body.

[0098] According to one embodiment of the present disclosure, an outer cover having design elements (e.g., color, material, finish) added to the main body can be provided using a second recycled plastic material in a thin film form without any treatment (e.g., painting, printing, deposition, film) that hinders recycling.

[0099] According to one embodiment of the present disclosure, an outer cover may be provided in which a main body part of a first recycled plastic material and a cover part of a second recycled plastic material in the form of a thin film are joined to each other face to face through a heat compression process without an adhesive.

[0100] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0101] According to an embodiment of the present disclosure, by utilizing the printing itself of thin-film plastics (e.g., polypropylene, low-density polyethylene) such as waste food packaging constituting the cover portion as the design of the outer cover, the design of the outer cover can be diversified without additional processing (e.g., painting, printing, deposition, film), and the usability of thin-film plastics with a significantly low recycling rate can be increased.

[0102] According to an embodiment of the present disclosure, an outer cover has the advantage of being able to be recycled after use, since the use of an adhesive or treatment (e.g., painting, printing, deposition, film) that hinders recycling is excluded during the manufacturing process of the outer cover.

[0103] The effects that can be obtained from this disclosure are not limited to the effects mentioned above, and various effects that can be directly or indirectly identified through this document may be provided.

[0104] According to one embodiment of the present disclosure, an outer cover (300) may be provided. The outer cover may include a main body portion (301) comprising a first recycled plastic and a cover portion (302) comprising a second recycled plastic. The second recycled plastic may be relatively more flexible than the first recycled plastic and may be in the form of a thin film. The main body portion may include a first surface (310A), and the cover portion may include a second surface (320B) directly bonded to (or integrated with) the first surface of the main body portion.

[0105] According to one embodiment, a portion of the first surface of the main body and a portion of the second surface of the cover may be melted and joined to each other.

[0106] According to one embodiment, the cover portion can be joined to the main body portion by thermal compression.

[0107] In one embodiment, the thickness of the main body portion may exceed four times the thickness of the cover portion.

[0108] According to one embodiment, the first recycled plastic of the main body may include plastic fragments having two or more colors.

[0109] According to one embodiment, the plastic fragments having two or more colors of the first recycled plastic can be mixed with each other to form a specific pattern.

[0110] In one embodiment, the second recycled plastic of the cover portion may include a graphic layer that is visually exposed to the exterior of the outer cover.

[0111] According to one embodiment, the main body portion may include a plurality of first protrusions (311) protruding toward the cover portion, and first flat portions (312) extending from the first protrusions and positioned between the first protrusions.

[0112] According to one embodiment, the cover portion may include second protrusions (321) stacked on the first protrusions of the main body portion, and second flat portions (322) extending from the second protrusions and stacked on the first flat portions of the main body portion.

[0113] In one embodiment, the first recycled plastic may comprise a single type of thermoplastic resin.

[0114] In one embodiment, the first recycled plastic may comprise polypropylene or polyethylene.

[0115] In one embodiment, the second recycled plastic may comprise a thermoplastic resin.

[0116] In one embodiment, the second recycled plastic may comprise at least one of polypropylene or polyethylene.

[0117] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may include an outer cover forming a part of an exterior of the electronic device. The outer cover may include a body portion (301) comprising a first recycled plastic and a cover portion (302) comprising a second recycled plastic. The second recycled plastic may be relatively more flexible than the first recycled plastic and may be in the form of a thin film. The body portion may include a first surface (310A), and the cover portion may include a second surface (320B) directly coupled to (or integrated with) the first surface of the body portion.

[0118] According to one embodiment, a portion of the first surface of the main body and a portion of the second surface of the cover may be melted and joined to each other.

[0119] In one embodiment, the first recycled plastic and the second recycled plastic may comprise a thermoplastic plastic.

[0120] According to one embodiment of the present disclosure, a method for manufacturing an outer cover (300) may be provided. The method may include an operation (1) of preparing a first recycled plastic, an operation (2) of forming the first recycled plastic into a main body, an operation (3) of preparing a second recycled plastic, and an operation (4) of thermally compressing the second recycled plastic onto the main body to form a cover portion coupled to the main body.

[0121] In one embodiment, the act of preparing the first recycled plastic may include an act of crushing waste plastics and an act of mixing waste plastic fragments of different colors.

[0122] In one embodiment, the operation of forming the first recycled plastic into the main body may include an operation of melting waste plastic fragments of different colors and an operation of controlling the flow of the waste plastic fragments to form a specific pattern.

[0123] According to one embodiment, the act of forming the cover portion coupled to the main body portion may include the act of arranging a plurality of second recycled plastics on the main body portion and the act of thermally compressing the second recycled plastics on the main body portion.

[0124] The outer cover of the present disclosure described above, the electronic device including the same, and the manufacturing method thereof are not limited to the above-described embodiments and drawings, and it will be apparent to a person skilled in the art to which the present disclosure pertains that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

[0125] While this disclosure has been described by way of example and example, it should be understood that the specific embodiment is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

[0126] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0127] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0128] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0129] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0130] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0131] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In the outer cover (300), A main body (301) comprising a first recycled plastic; and It includes a cover part (302) including a second recycled plastic that is relatively more flexible than the first recycled plastic and is in a thin film form, An outer cover, wherein the main body portion includes a first surface (310A), and the cover portion includes a second surface (320B) directly connected to the first surface of the main body portion.

2. In paragraph 1, An outer cover in which a portion of the first surface of the main body and a portion of the second surface of the cover are melted and joined to each other.

3. In paragraph 1 or 2, An outer cover in which the above cover portion is joined to the main body portion by heat pressing.

4. In any one of paragraphs 1 to 3, An outer cover having a thickness of the main body portion greater than four times the thickness of the cover portion.

5. In any one of paragraphs 1 to 4, The first recycled plastic of the above main body part is an outer cover including plastic fragments (P1, P2) having two or more colors.

6. In paragraph 5, An outer cover in which the plastic fragments having two or more colors of the first recycled plastic are mixed with each other to form a specific pattern.

7. In any one of paragraphs 1 to 6, An outer cover, wherein the second recycled plastic of the cover portion includes a graphic layer visually exposed to the outside of the outer cover.

8. In any one of paragraphs 1 to 7, An outer cover, wherein the main body portion includes a plurality of first protrusions (311) protruding toward the cover portion, and first flat portions (312) extending from the first protrusions and arranged between the first protrusions.

9. In paragraph 8, An outer cover, wherein the cover portion includes second protrusions (321) laminated on the first protrusions of the main body portion, and second flat portions (322) extending from the second protrusions and laminated on the first flat portions of the main body portion.

10. In any one of paragraphs 1 to 9, The first regenerated plastic is an outer cover comprising a single thermoplastic resin.

11. In any one of paragraphs 1 to 10, The first recycled plastic is an outer cover comprising polypropylene or polyethylene.

12. In any one of paragraphs 1 to 11, The second recycled plastic is an outer cover comprising a thermoplastic resin.

13. In any one of paragraphs 1 to 12, The second recycled plastic is an outer cover comprising at least one of polypropylene and polyethylene.

14. In an electronic device (101), Comprising an outer cover forming a part of the exterior of the electronic device; The above outer cover, A main body (301) comprising a first recycled plastic; and It includes a cover part (302) including a second recycled plastic that is relatively more flexible than the first recycled plastic and is in a thin film form, An electronic device, wherein the main body portion includes a first surface (310A), and the cover portion includes a second surface (320B) directly coupled to the first surface of the main body portion.

15. In the method of manufacturing an outer cover (300), Action for preparing the first recycled plastic (1); An operation (2) of forming the above first recycled plastic into a main body; Action for preparing a second recycled plastic (3); and A manufacturing method including an operation (4) of forming a cover part joined to the main body part by thermally compressing the second recycled plastic on the main body part.

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