Ring device including antenna

Abstract

According to various embodiments disclosed herein, a ring device is provided. The ring device comprises: a first metal portion provided on the inner side of the ring device; a second metal portion that is provided on the outer side the ring device and separated from the first metal portion; at least one connecting portion that electrically connects the first metal portion and the second metal portion; and a wireless communication circuit configured to transmit and / or receive radio signals via a conductive loop that includes a slot formed by the first metal portion, the second metal portion, and the at least one connecting portion.

Description

Ring device including antenna

[0001] The present disclosure relates to a ring device including an antenna.

[0002] A wearable device (or wearable electronic device) is a smart device that can be worn, such as glasses, watches, clothing, or accessories.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] Wireless communication is expanding and diversifying with the advent of wearable devices. Wearable devices are being offered in lightweight and compact forms to reduce discomfort, which can complicate the design of antennas for wireless communication.

[0005] Various embodiments of the present disclosure provide a ring device including an antenna that can secure and / or improve antenna radiation performance by overcoming antenna design constraints due to miniaturization and weight reduction. Various embodiments of the present disclosure are provided to address or at least alleviate the above-mentioned problems.

[0006] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0007] According to various embodiments of the present disclosure, a ring device is provided, the ring device including a first metal portion, a second metal portion, at least one connecting portion, and a wireless communication circuit. The first metal portion is disposed on the inside of the ring device. The second metal portion is disposed on the outside of the ring device and is separated from the first metal portion. At least one connecting portion electrically connects the first metal portion and the second metal portion. The wireless communication circuit is configured to transmit and / or receive a wireless signal through a conductive loop including a slot formed by the first metal portion, the second metal portion, and the at least one connecting portion.

[0008] A ring device including an antenna according to various embodiments of the present disclosure can not only secure and / or improve antenna radiation performance by overcoming antenna design constraints, but also reduce external dielectrics or external conductors from degrading antenna radiation performance.

[0009] In addition, the effects that can be obtained or expected from various embodiments of the present disclosure are disclosed directly or implicitly in the detailed description of the embodiments of the present disclosure.

[0010] The above and other aspects, features, and advantages of specific embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0011] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0012] FIG. 2 illustrates a ring device worn on a user's body according to various embodiments of the present disclosure.

[0013] FIG. 3 is a perspective view of a ring device according to various embodiments of the present disclosure.

[0014] FIG. 4 is a cross-sectional view of a portion of a ring device according to various embodiments of the present disclosure.

[0015] FIG. 5 is a cross-sectional view of a portion of a ring device according to various embodiments of the present disclosure.

[0016] FIG. 6 is a cross-sectional view of a portion of a ring device according to various embodiments of the present disclosure.

[0017] FIG. 7 is a cross-sectional view of a portion of a ring device according to various embodiments of the present disclosure.

[0018] FIG. 8 is a cross-sectional view of a portion of a ring device according to various embodiments of the present disclosure.

[0019] FIG. 9 is a diagram showing an electromagnetic field distribution on a ring device when an electromagnetic signal is fed to the antenna structure in the example of FIG. 5 according to various embodiments of the present disclosure.

[0020] FIG. 10 is a cross-sectional view of a portion of a ring device according to various embodiments of the present disclosure.

[0021] FIG. 11 is a cross-sectional view of a portion of a ring device according to various embodiments of the present disclosure.

[0022] FIG. 12 is a cross-sectional view of a portion of a ring device according to various embodiments of the present disclosure.

[0023] FIG. 13 is a cross-sectional view of a portion of a ring device according to various embodiments of the present disclosure.

[0024] FIG. 14 is a cross-sectional view of a portion of a ring device according to various embodiments of the present disclosure.

[0025] FIG. 15 is a cross-sectional view of a portion of a ring device according to various embodiments of the present disclosure.

[0026] FIG. 16 is a cross-sectional view of a portion of a ring device according to various embodiments of the present disclosure.

[0027] FIG. 17 is a cross-sectional view of a portion of a ring device according to various embodiments of the present disclosure.

[0028] FIG. 18 is a cross-sectional view of a portion of a ring device according to various embodiments of the present disclosure.

[0029] FIG. 19 is a graph showing antenna radiation performance in a worn and unworn state of a ring device according to the example of FIG. 5 or the example of FIG. 8, according to various embodiments of the present disclosure.

[0030] FIG. 20 is a graph showing antenna radiation performance measured through simulation in a worn and unworn state of a ring device according to the example of FIG. 5 or the example of FIG. 8, according to various embodiments of the present disclosure.

[0031] FIG. 21 is a drawing showing a portion of a ring device of a comparative example for comparison with embodiments of the present disclosure, and graphs showing the antenna radiation performance of the ring device of the comparative example.

[0032] FIG. 22 is a perspective view of a ring device, a drawing showing the ring device, and a cross-sectional view of a portion of the ring device, according to various embodiments of the present disclosure.

[0033] FIG. 23 is a perspective view of a ring device, a drawing showing the ring device, and a cross-sectional view of a portion of the ring device, according to various embodiments of the present disclosure.

[0034] FIG. 24 is a graph showing the radiation efficiency of a ring device according to the example of FIG. 22 and a ring device according to the example of FIG. 23, according to various embodiments of the present disclosure.

[0035] FIG. 25 is a graph showing the reflection coefficient of a ring device according to the example of FIG. 22 and a ring device according to the example of FIG. 23, according to various embodiments of the present disclosure.

[0036] FIG. 26 is a cross-sectional view of a portion of a ring device according to various embodiments of the present disclosure.

[0037] Hereinafter, various embodiments of the present disclosure are described in more detail with reference to the attached drawings.

[0038] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments of the present disclosure.

[0039] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an external electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an external electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). The electronic device (101) may communicate with the external electronic device (104) via the server (108). The external electronic device (102 or 104) may include, but is not limited to, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device, for example. The electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), and / or an antenna module (197). In various embodiments of the present disclosure, at least one of these components may be omitted, or one or more other components may be added to the electronic device (101). In various embodiments of the present disclosure, some of these components may be implemented as a single integrated circuitry.

[0040] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. As at least part of the data processing or operations, the processor (120) may load commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) into the volatile memory (132), process the commands or data stored in the volatile memory (132), and store the resulting data in the non-volatile memory (134). The processor (120) may include a main processor (121) (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor (123) (e.g., a graphics processing unit (GPU)), a neural processing unit (NPU)), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that can operate independently or together with the main processor (121). Additionally or alternatively, the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0041] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. The auxiliary processor (123) (e.g., an image signal processor (ISP) or a communication processor (CP)) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). According to various embodiments of the present disclosure, the auxiliary processor (123) (e.g., a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. This learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or may be performed through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include multiple artificial neural network layers.The artificial neural network may be any one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent DNN (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may additionally or alternatively include a software structure.

[0042] The memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The various data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) and / or a non-volatile memory (134).

[0043] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), and / or an application (146).

[0044] The input module (150) can receive commands or data to be used in other components of the electronic device (101) (e.g., the processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, but is not limited to, a microphone or a key (e.g., a button), for example.

[0045] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback, and the receiver can be used for incoming calls. The receiver can be implemented separately from the speaker or as part of the speaker.

[0046] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. The display module (160) may include a touch circuit configured to detect a touch (e.g., a touch sensor), or a sensor circuit configured to measure the intensity of a force generated by the touch (e.g., a pressure sensor).

[0047] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. The audio module (170) can acquire sound through the input module (150), or output sound through an audio output module (155), or an external electronic device (e.g., an external electronic device (102)) (e.g., a speaker or headphones) directly or wirelessly connected to the electronic device (101).

[0048] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. The sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0049] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the external electronic device (102)). The interface (177) may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface.

[0050] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., an external electronic device (102)). The connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, and / or an audio connector (e.g., a headphone connector).

[0051] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. The haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0052] The camera module (180) can capture still images and videos. The camera module (180) may include one or more lenses, image sensors, image signal processors (ISPs), or flashes.

[0053] The power management module (188) can manage power supplied to or consumed by the electronic device (101). The power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0054] A battery (189) may power at least one component of the electronic device (101). The battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel cell.

[0055] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., external electronic device (102), external electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor (AP)) and may include one or more communication processors (CPs) that support direct (e.g., wired) communication or wireless communication. The communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Of these communication modules, the corresponding communication module is a first network (198) (e.g., a short-range communication network such as BLUETOOTH, WiFi (wireless fidelity) direct, or IrDA (IR data association)) or a second network (199) (e.g., a legacy cellular network, 5G (5 thThe wireless communication module (192) can communicate with an external electronic device (104) via a wide area network (e.g., a LAN or WAN), a next generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in a subscriber identity module (SIM) (196) to identify or authenticate the electronic device (101) within a communication network, such as a first network (198) or a second network (199).

[0056] The wireless communication module (192) is 4G (4 thThe wireless communication module (192) can support 5G networks and next-generation communication technologies after the 5G network, such as new radio access technology (NR). The NR access technology can support high-speed transmission of high-capacity data (i.e., enhanced mobile broadband (eMBB)), minimizing terminal power and connecting multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) may support various requirements specified in the electronic device (101), an external electronic device (e.g., an external electronic device (104)), or a network system (e.g., a second network (199)). According to various embodiments of the present disclosure, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0057] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). The antenna module (197) may include an antenna including a radiator including a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). The antenna module (197) may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0058] According to various embodiments of the present disclosure, the antenna module (197) may form a mmWave antenna module. According to various embodiments of the present disclosure, the mmWave antenna module may include a printed circuit board (PCB), an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0059] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0060] Commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be of the same or a different type of device as the electronic device (101). All or part of the operations executed by the electronic device (101) may be executed by one or more external electronic devices among the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of executing the function or service itself or in addition, request one or more external electronic devices to execute the function or at least a part of the service. The one or more external electronic devices that receive the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be utilized, for example. The electronic device (101) may provide an ultra-low delay service using, for example, distributed computing or mobile edge computing (MEC). In various embodiments of the present disclosure, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network.According to various embodiments of the present disclosure, an external electronic device (104) or server (108) may be included within a second network (199). The electronic device (101) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0061] An electronic device according to various embodiments of the present disclosure may include a wearable electronic device (e.g., a ring device (2) of FIGS. 2 and 3).

[0062] The various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In the present disclosure, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When one element (e.g., a first component) is referred to as being “coupled” or “connected” to another element (e.g., a second component), with or without the terms “functionally” or “communicatively,” the element can be connected to the other element directly (e.g., wired), wirelessly, or through a third component.

[0063] The term "module" may include a unit implemented in hardware, software, or firmware, or any combination thereof, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or portion of such a component that performs one or more functions. For example, according to various embodiments of the present disclosure, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0064] Various embodiments of the present disclosure may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0065] The methods according to various embodiments of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., CD-ROM (compact disc read-only memory)) or an application store (e.g., PLAYSTORE). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0066] Each component (e.g., a module or a program) of the above-described components may comprise one or more entities. One or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the multiple components identically or similarly to those performed by the corresponding component of the multiple components prior to the integration. The operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0067] In the present disclosure, when the term “substantially” is used to define a structural part (a structure or a structural element), the expression including the term “substantially” is understood or interpreted as a technical feature produced within the technical tolerances of the method used to manufacture it.

[0068] In the present disclosure, “disposed on XX” can be understood as disposed adjacent to XX, disposed in substantial contact with XX, or coupled to XX.

[0069] FIG. 2 illustrates a ring device (2) worn on a user's body according to various embodiments of the present disclosure. FIG. 3 is a perspective view of a ring device (2) according to various embodiments of the present disclosure. FIG. 4 is a cross-sectional view of a portion of a ring device (2) according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and includes all combinations of the features and / or embodiments disclosed with respect to FIGS. 2, 3, and 4. That is, all combinations of features described below with respect to FIGS. 2, 3, and 4 should be considered to be encompassed by the present disclosure as specific examples.

[0070] Referring to FIGS. 2, 3, and 4, a ring device (referred to as a ring-type electronic device) (2) is a wearable device including electrical components that can be worn on a user's finger (3). The ring device (2) may be the electronic device (101) of FIG. 1 or may include at least some of the components included in the electronic device (101) of FIG. 1.

[0071] According to various embodiments, the ring device (2) may include a first metal portion (21), a second metal portion (22), and a frame (23).

[0072] According to various embodiments, the first metal portion (21) and the second metal portion (22) may be disposed on a frame (23). The first metal portion (21) and the second metal portion (22) may be disposed on opposite sides of each other and may be physically separated from each other. The first metal portion (21) may be disposed on the inside of the ring device (2), and the second metal portion (22) may be disposed on the outside of the ring device (2). The relative position between the first metal portion (21) and the second metal portion (22) may be fixed and maintained by the frame (23). For example, when the ring device (2) is worn on a user's finger (3), the first metal portion (21) may be in contact with the finger (3) and the second metal portion (22) may be spaced apart from the first metal portion (21) with at least a portion of the frame (23) therebetween.

[0073] According to various embodiments, the first metal portion (21) may be arranged in a looped shape on the frame (23). The first metal portion (21) may have a ring shape. The first metal portion (21) may be, for example, a first metal ring (also referred to as an inner ring or inner metal ring) including a first inner surface of a first inner radius of curvature (R11) and a first outer surface (also referred to as a first circumferential surface) of a first outer radius of curvature (R12). The first metal portion (21) may have a thickness corresponding to a difference between the first inner radius of curvature (R11) and the first outer radius of curvature (R12).

[0074] According to various embodiments, the second metal portion (22) may be arranged on the frame (23) in a loop shape. The second metal portion (22) may have a ring shape surrounding the first outer surface (first circumferential surface) of the first metal portion (21). The second metal portion (21) may be, for example, a second metal ring (also referred to as an outer ring or an outer metal ring) including a second inner surface of a second inner radius of curvature (R21) and a second outer surface (also referred to as a second circumferential surface) of a second outer radius of curvature (R22). The second metal portion (22) may have a thickness corresponding to a difference between the second inner radius of curvature (R21) and the second outer radius of curvature (R22).

[0075] According to various embodiments, the first inner radius of curvature (R11) and the first outer radius of curvature (R12) of the first metal portion (21), and the second inner radius of curvature (R21) and the second outer radius of curvature (R22) of the second metal portion (22) may be formed based on the center line (C) of the ring device (2). The center line (C) of the ring device (2) may be defined or interpreted as the first center line of the first metal portion (21), which serves as the reference for the first inner radius of curvature (R11) and the first outer radius of curvature (R12), and the second center line of the second metal portion (22), which serves as the reference for the second inner radius of curvature (R21) and the second outer radius of curvature (R22), substantially coinciding with each other.

[0076] According to various embodiments, the ring device (2) may include a gap (201) between the first metal portion (21) and the second metal portion (22). The gap (201) may be arranged in a loop shape. The gap (201) may have a thickness corresponding to the difference between the first outer radius of curvature (R12) of the first metal portion (21) and the second inner radius of curvature (R21) of the second metal portion (22).

[0077] According to various embodiments, the first metal portion (21) may have a first width and the second metal portion (22) may have a second width in a direction parallel to the center line (C) (e.g., in the z-axis direction). For example, the first width and the second width may substantially coincide, and the first metal portion (21) and the second metal portion (22) may be aligned when viewed in a direction perpendicular to the center line (C) (e.g., in the x-axis direction or the y-axis direction).

[0078] According to various embodiments, a frame (also referred to as a frame structure or framework) (23) may be a structural element of the ring device (2). A plurality of components included in the ring device (2) may be arranged on or supported by the frame (23).

[0079] According to various embodiments, the frame (23) may include a support (also referred to as a support structure) (231), a first side (also referred to as a first side portion or a first side member) (232), and a second side (233). The support (231) may be positioned at least partially between the first metal portion (21) and the second metal portion (22). The first side (232) may extend from the support (231) or be connected to the support (23). The first side (232) may provide (or form) one side of the exterior of the ring device (2) that is exposed between the first metal portion (21) and the second metal portion (22). The second side (233) may provide (or form) the other side of the exterior of the ring device (2) that is exposed between the first metal portion (21) and the second metal portion (22).

[0080] According to various embodiments, the frame (23) may be formed of a non-conductive material such as a polymer.

[0081] According to various embodiments, the frame (23) may be provided (or formed) through a combination of at least one non-conductive portion of a non-conductive material and at least one conductive portion of a conductive material.

[0082] According to various embodiments, although not shown separately, the frame (23) may be extended or a separate member covering the first metal portion (21) may be added so that the first metal portion (21) is at least partially disposed inside the ring device (2).

[0083] According to various embodiments, the frame (23) may be extended or a separate member may be added to cover the second metal member (22) so that the second metal member (22) is at least partially disposed within the ring device (2). For example, a member (e.g., an accessory or accessory member) formed of various materials such as plastic, glass, gemstones, beads, or wood may be added to cover at least a portion of the second metal member (22).

[0084] According to various embodiments, the ring device (2) may include a substrate assembly (24) positioned between a first metal portion (21) and a second metal portion (22). The substrate assembly (24) may be disposed or coupled to a support portion (231) of the frame (23). The substrate assembly (24) may include a printed circuit board (241) and a plurality of electronic components (not shown separately) disposed on the printed circuit board (241). The substrate assembly (24) may include a support member or a reinforcing member (not shown separately) disposed or coupled to the printed circuit board (241). The substrate assembly (24) may include a support member or a reinforcing member (not shown separately) disposed or coupled to at least one of the plurality of electronic components disposed on the printed circuit board (241).

[0085] According to various embodiments, the support portion (231) of the frame (23) may be at least partially disposed between the first metal portion (21) and the substrate assembly (24). The first metal portion (21) may be supported by the first and second sides (232, 233) of the frame (23). The second metal portion (22) may be supported by the support portion (231) or the first and second sides (232, 233) of the frame (23).

[0086] According to various embodiments, the printed circuit board (241) of the substrate assembly (24) may include a flexible printed circuit board (FPCB).

[0087] According to various embodiments, the printed circuit board (241) of the substrate assembly (24) may include a rigid-flexible printed circuit board (RF PCB) including at least one rigid portion and at least one flexible portion.

[0088] According to various embodiments, the ring device (2) may include a ground (also referred to as a ground structure) (e.g., ground (G) of FIG. 5). The ground may include a first metal portion (21) and a second metal portion (22). The ground may include a first conductive portion included in a substrate assembly (24). The first conductive portion of the substrate assembly (24) may include, for example, a ground area included in a printed circuit board (241), and one or more shielding members (also referred to as shielding structures) (e.g., a shield can) disposed on the printed circuit board (241) and electrically connected to the ground area. The ground may include a second conductive portion disposed or included in a frame (23). The first metal portion (21), the second metal portion (22), the first conductive portion of the substrate assembly (24), and / or the second conductive portion of the frame (23) may be electrically connected. The ground may further include at least one other conductive portion (not shown) electrically connected to the first metal portion (21), the second metal portion (22), the first conductive portion of the substrate assembly (24), and / or the second conductive portion of the frame (23). The ground may be provided (or formed) by various other combinations.

[0089] According to various embodiments, the ground of the ring device (2) can reduce or prevent electromagnetic interference (EMI) to a plurality of electrical elements included in the ring device (2). The ground of the ring device (2) can reduce or prevent electromagnetic influence of noise from outside the ring device (2) on the electrical elements included in the ring device (2). The ground of the ring device (2) can reduce or prevent electromagnetic interference between electrical elements included in the ring device (2).

[0090] According to various embodiments, the ring device (2) may include a first conductive region (not shown separately) and a second conductive region (not shown separately). The first conductive region and the second conductive region may be electrically connected, or may be electrically and physically connected. In various embodiments of the present disclosure, when the first conductive region is configured to substantially radiate electromagnetic waves, the first conductive region among the combination of the first conductive region and the second conductive region may be defined or interpreted as a radiating portion (or, antenna radiating portion, radiator, or antenna radiator), and the second conductive region among the combination of the first conductive region and the second conductive region may be defined or interpreted as a ground of the ring device (2) that is distinct from the radiating portion. According to various embodiments of the present disclosure, when the first conductive region is configured to substantially radiate electromagnetic waves, the combination of the first conductive region and the second conductive region may be defined or interpreted as a ground of the ring device (2), and the first conductive region may be defined or interpreted as a radiating portion implemented through a portion of the ground of the ring device (2). In various embodiments of the present disclosure, when the first conductive region is configured to substantially radiate electromagnetic waves, the second conductive region may operate as an antenna ground that electromagnetically influences the first conductive region (e.g., an antenna radiator). The antenna ground may contribute to securing antenna radiation performance (or, radio transmission and reception performance or communication performance) and / or securing coverage with respect to the antenna radiator. The antenna ground may reduce electromagnetic interference (EMI) or signal loss with respect to the radiating portion.

[0091] According to various embodiments, a portion of the ground of the ring device (2) may be configured to operate as a radiator (or, antenna radiator, radiator, or antenna radiator). A portion of the ground of the ring device (2) may be electrically connected to a wireless communication circuit of the ring device (2) (e.g., a wireless communication module (510) of FIG. 5). A portion of the ground of the ring device (2) may be provided (or powered) with an electromagnetic signal (or, a wireless signal, a radio frequency (RF) signal, or a radiated current) from the wireless communication circuit and may operate as a radiator (e.g., a resonator). Another portion of the ground of the ring device (2) may be operated as an antenna ground that exerts an electromagnetic influence on at least one antenna radiator.

[0092] According to various embodiments, the ring device (2) may include a wireless communication circuit (e.g., a wireless communication circuit (510) of FIG. 5) disposed on a printed circuit board (241). The wireless communication circuit may include, for example, a wireless communication module (192) of FIG. 1. The wireless communication circuit may include, for example, a communication processor (CP) of FIG. 1.

[0093] According to various embodiments, a wireless communication circuit (e.g., a wireless communication circuit (510) of FIG. 5) may be configured to transmit and / or receive a signal in a designated frequency band via a first metal portion (21) and a second metal portion (22). The combination of the first metal portion (21) and the second metal portion (22) may be referred to as an 'antenna structure (20)'. The designated frequency band may include, for example, a low band (LB) (about 600 MHz to about 1 GHz), a middle band (MB) (about 1 GHz to about 2.3 GHz), a high band (HB) (about 2.3 GHz to about 2.7 GHz), or an ultra-high band (UHB) (about 2.7 GHz to about 6 GHz). At least one designated frequency band may include various other frequency bands.

[0094] According to various embodiments, a wireless communication circuit (e.g., a wireless communication circuit (510) of FIG. 5) may provide (or power) an electromagnetic signal to an antenna structure (20). The antenna structure (20) may receive an electromagnetic signal from the wireless communication circuit and radiate an electromagnetic field. The antenna structure (20) may be defined or interpreted as a portion configured to operate as an antenna radiator among the grounds of the ring device (2).

[0095] According to various embodiments, at least one of the plurality of electronic components arranged on the printed circuit board (241) may include a matching circuit (not shown separately). The matching circuit may include, for example, an electrical element having components such as inductance, capacitance, or conductance. The matching circuit may include various elements such as, for example, a lumped element or a passive element. The matching circuit may, for example, shift the resonant frequency of the antenna structure (20) to a specified frequency or shift it by a specified amount. The matching circuit may, for example, perform impedance matching for the antenna structure (20). The matching circuit can substantially match the impedance of an electrical path (e.g., a transmission line or a feed line) that electrically connects, for example, a wireless communication circuit and an antenna structure (20) and the impedance of the antenna structure (20). Impedance matching can reduce the amount of reflection at the connection between the transmission line and the antenna structure (20), thereby reducing degradation of antenna radiation performance.

[0096] According to various embodiments, the first metal portion (21) and / or the second metal portion (22) may be coated with a non-conductive material. The coating layers (e.g., insulating layers) of the non-conductive material disposed on the first metal portion (21) and the second metal portion (22) may, for example, reduce or prevent direct contact of the antenna structure (20) with an external dielectric (e.g., a user's body) or an external conductor, thereby reducing degradation of the antenna radiation performance of the antenna structure (20). The frame (23) is extended so that the first metal portion (21) is at least partially disposed inside the ring device (2), or a separate member that covers at least a portion of the first metal portion (21) is added, thereby reducing or preventing direct contact of the first metal portion (21) with an external dielectric or an external conductor, thereby reducing degradation of the antenna radiation performance of the antenna structure (20) due to the external dielectric or an external conductor. The frame (23) is extended so that the second metal portion (22) is at least partially disposed inside the ring device (2), or a separate member is added that covers at least a portion of the second metal portion (22), thereby reducing or preventing direct contact of the second metal portion (22) with an external dielectric or external conductor, thereby reducing degradation of the antenna radiation performance of the antenna structure (20) due to the external dielectric or external conductor.

[0097] According to various embodiments, the ring device (2) may include a battery (242) (e.g., battery (189)) positioned inside the ring device (2). The battery (242) may be disposed on a support (231) of the frame (23). The battery (242) may supply power to a plurality of electrical elements included in the ring device (2). The battery may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel cell.

[0098] According to various embodiments, the ring device (2) may include a power management circuit (e.g., a power management module (188) of FIG. 1) disposed on a printed circuit board (241). The power management circuit may, for example, manage power supplied to or consumed by the ring device (2). The power management circuit may, for example, be implemented as at least a portion of a PMIC.

[0099] According to various embodiments, the ring device (2) may include a connection terminal (243) (e.g., the connection terminal (178) of FIG. 1). The connection terminal may include a connector that allows the ring device (2) to be physically connected to an external electronic device (e.g., the external electronic device (102) of FIG. 1). The connector may be positioned corresponding to a connector hole (not shown separately) formed in, for example, the first metal portion (21), the second metal portion (22), the first side (232) of the frame (23), or the second side (233) of the frame (23).

[0100] According to various embodiments, the ring device (2) may include various other electrical elements. For example, the ring device (2) may include a coil (coil antenna) for wireless charging. For example, the ring device (2) may include a biometric sensor module (e.g., a heart rate sensor module).

[0101] FIG. 5 is a cross-sectional view of a portion of a ring device (2) according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and encompasses all combinations of the features and / or embodiments disclosed with respect to FIG. 5 . That is, all combinations of features described below with respect to FIG. 5 should be considered to be encompassed by the present disclosure as specific examples.

[0102] Referring to FIG. 5, the ring device (2) may include a first metal portion (21), a second metal portion (22), a wireless communication circuit (510), a ground (G), a first electrical path (EP1), a second electrical path (EP2), and a third electrical path (EP3).

[0103] According to various embodiments, the wireless communication circuit (510) may be electrically connected to the first metal portion (21) via a first electrical path (EP1). The first electrical path (EP1) may include one or more conductive members, one or more conductive structures, one or more conductive paths, or a combination thereof between the wireless communication circuit (510) and the first metal portion (21). The wireless communication circuit (510) may provide (or feed) an electromagnetic signal to a first point (P1) on the first metal portion (21) via the first electrical path (EP1). The first point (P1) may be defined or interpreted as a boundary area of ​​the first metal portion (21) that is physically or electrically connected to the first electrical path (EP1). The first electrical path (EP1) may be referred to as a 'feeding line' or a 'transmission line'. The first point (P1) on the first metal part (21) may be referred to as a ‘feeding point’.

[0104] According to various embodiments, the ground (G) may be electrically connected to the second metal portion (22) via a second electrical path (EP2). The second electrical path (EP2) may include one or more conductive members, one or more conductive structures, one or more conductive paths, or a combination thereof between the ground (G) and the second metal portion (22). The ground (G) may be electrically connected to a second point (P2) on the second metal portion (22) via the second electrical path (EP2). The second point (P1) may be defined or interpreted as a boundary area of ​​the second metal portion (22) that is physically or electrically connected to the second electrical path (EP2). The second electrical path (EP2) may be referred to as a 'grounding line'. The second point (P2) may be referred to as a 'grounding point'.

[0105] According to various embodiments, the first point (P1) on the first metal portion (21) and the second point (P2) on the second metal portion (22) may be positioned on opposite sides with a gap (201) between the first metal portion (21) and the second metal portion (22) interposed therebetween. Positioning the first point (P1) and the second point (P2) on opposite sides with the gap (201) between the first metal portion (21) and the second metal portion (22) interposed therebetween may reduce a distance between the first point (P1) and the second point (P2). In various embodiments, the relative positions between the first point (P1) and the second point (P2) may also vary.

[0106] According to various embodiments, when an electromagnetic signal is provided (or powered) to the first metal portion (21) through the first electrical path (521), an electromagnetic field (also called a radiation field) may be generated (or formed) through the gap (201) between the first metal portion (21) and the second metal portion (22) due to a potential difference between a first point (P1) on the first metal portion (21) and a second point (P2) on the second metal portion (22). The wireless communication circuit (510) may transmit electromagnetic waves to the outside or receive electromagnetic waves from the outside through the gap (201) between the first metal portion (21) and the second metal portion (22).

[0107] According to various embodiments, the first metal portion (21) and the second metal portion (22) may be electrically connected via a third electrical path (EP3). The third electrical path (EP3) may include one or more conductive members, one or more conductive structures, one or more conductive paths, or a combination thereof between the first metal portion (21) and the second metal portion (22). A third point (P3) on the first metal portion (21) and a fourth point (P4) on the second metal portion (22) may be electrically connected via the third electrical path (EP3). The third point (P3) may be defined or interpreted as a boundary area that is physically or electrically connected to the third electrical path (EP3) among the first metal portions (21). The fourth point (P4) may be defined or interpreted as a boundary region that is physically or electrically connected to the third electrical path (EP3) among the second metal portions (22). The third point (P3) and the fourth point (P4) may be located on opposite sides of each other, for example, with a gap (201) between the first metal portion (21) and the second metal portion (22) interposed therebetween. The positioning of the third point (P3) and the fourth point (P4) on opposite sides may reduce the length of the third electrical path (EP3). In various embodiments, the relative positions between the third point (P3) and the fourth point (P4) may also vary.

[0108] According to various embodiments, a conductive loop (CL) may be provided (or formed) by a combination of a first metal portion (21), a second metal portion (22), and a third electrical path (EP3). The conductive loop (CL) may be defined or interpreted as a conductive path (also referred to as an electrical path) having a closed curve shape. A first point (P1) on the first metal portion (21) and a second point (P2) on the second metal portion (22) may be located in the conductive loop (CL). A wireless communication circuit (510) may be configured to transmit and / or receive a signal of a designated frequency band through the conductive loop (CL). When the wireless communication circuit (510) supplies an electromagnetic signal to the first point (P1) through the first electrical path (EP1), the electromagnetic signal may substantially flow in the conductive loop (CL). When a conductive loop (CL) is powered, the flow of electromagnetic signals and the distribution of electromagnetic signals (e.g., the distribution of surface currents) can generate (or form) electromagnetic fields (also called radiated fields) capable of transmitting and / or receiving signals in a specified frequency band. The conductive loop (CL) may be referred to as a 'looped signal path'.

[0109] According to various embodiments, when an electromagnetic signal is supplied, the conductive loop (CL) may resonate in a designated frequency band due to a potential difference between a first point (P1) on the conductive loop (CL) and a second point (P2) on the conductive loop (CL). When an electromagnetic signal is supplied, an electromagnetic field (also referred to as a radiation field) is formed through a gap (201) between the first metal portion (21) and the second metal portion (22), which may substantially cause the conductive loop (CL) to resonate. The conductive loop (CL) includes a slot (520), and when an electromagnetic signal is supplied, an electromagnetic field that causes the slot (520) of the conductive loop (CL) to resonate may be generated (or formed). When an electromagnetic signal is supplied, energy (also referred to as electromagnetic wave energy or wave energy) in a designated frequency band may be substantially or relatively concentrated in the slot (520) of the conductive loop (CL). A conductive loop (CL) can reduce the distribution of energy of a specified frequency band when an electromagnetic signal is supplied to the inner space of the ring device (2) surrounded by the first metal portion (21) and the outer space of the ring device (2) surrounding the second metal portion (22).

[0110] According to various embodiments, when the electromagnetic signal is fed, the energy of a designated frequency band is substantially or relatively concentrated in the slot (520) of the conductive loop (CL), which can reduce the external dielectric (e.g., the user's body) or external conductor around the ring device (2) from degrading the antenna radiation performance. For example, when the electromagnetic signal is fed, the energy of a designated frequency band is substantially or relatively concentrated in the slot (520) of the conductive loop (CL), which can reduce the finger (3) (see FIG. 2) inserted into the ring device (2) and the dielectric (e.g., another finger) around the ring device (2) from degrading the antenna radiation performance when the ring device (2) is worn by the user.

[0111] According to various embodiments, the conductive loop (CL) of the antenna structure (20) may be defined or interpreted as a slot radiator, a slot radiator, or a slot antenna radiator. The combination of the conductive loop (CL), the wireless communication circuit (510), and the ground (G) may be defined or interpreted as a slot antenna.

[0112] According to various embodiments, the ring device (2) may include a dielectric (not shown separately) of a non-conductive material at least partially disposed in the slot (520) of the conductive loop (CL). The dielectric may have a permittivity that can reduce degradation of the antenna radiation performance. The dielectric may include, for example, a material with a low permittivity. At least a portion of the dielectric may be provided (or formed) by, for example, a support member (231) of the frame (23).

[0113] According to various embodiments, the shape of the first metal portion (21) and / or the second metal portion (22) surrounded by the first metal portion (21) is not limited to the illustrated example. The gap (201) between the first metal portion (21) and the second metal portion (22) may vary depending on the shape of the first metal portion (21) and the second metal portion (22), and the relative position between the first metal portion (21) and the second metal portion (22) (e.g., see the example of FIG. 22 or the example of FIG. 23).

[0114] According to various embodiments, the relative positions of the third point (P3) and / or the fourth point (P4) with respect to the first point (P1) and / or the second point (P2) are not limited to the illustrated examples.

[0115] FIG. 6 is a cross-sectional view of a portion of a ring device (2) according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and encompasses all combinations of the features and / or embodiments disclosed in connection with FIG. 6 . That is, all combinations of features described below in connection with FIG. 6 should be considered to be encompassed by the present disclosure as specific examples.

[0116] Referring to FIG. 6, the ring device (2) may include a first metal portion (21), a second metal portion (22), a printed circuit board (241), a first flexible conductive member (610), and / or a second flexible conductive member (620).

[0117] According to various embodiments, the printed circuit board (241) may be positioned at least partially between the first metal portion (21) and the second metal portion (22).

[0118] According to various embodiments, a first flexible conductive member (also referred to as a first flexible conductor or a first flexible conductive member) (610) may be positioned between a first metal portion (21) and a printed circuit board (241). The first metal portion (21) and the printed circuit board (241) may be electrically connected through the first flexible conductive member (610). A wireless communication circuit (e.g., a wireless communication circuit (510) of FIG. 5) disposed on the printed circuit board (241) may be electrically connected to the first metal portion (21) through the first flexible conductive member (610). The first flexible conductive member (610) may be brought into elastic contact with a first point (P1) on the first metal portion (21) between the first metal portion (21) and the printed circuit board (241).

[0119] According to various embodiments, the first flexible conductive member (610) may include a first conductive clip (e.g., a first metal structure including a resilient structure) as illustrated. The first flexible conductive member (610) may include a pogo pin, a spring, a conductive poron, a conductive rubber, a conductive tape, or a conductive connector, in place of the first conductive clip. The first flexible conductive member (610) may include a conductive adhesive material (or conductive adhesive material), in place of the first conductive clip.

[0120] According to various embodiments, the first flexible conductive member (610) may be disposed on a printed circuit board (241). The printed circuit board (241) may include a first conductive pad (also referred to as a first land or a first terminal) (not shown separately) corresponding to the first flexible conductive member (610). The first flexible conductive member (610) may be physically and electrically connected to the first conductive pad via a first conductive adhesive portion (or first conductive bonding portion) (not shown separately) including a conductive adhesive material (or conductive adhesive material), such as solder. The printed circuit board (241) may include a first conductive path (also referred to as a first conductive line) (not shown separately) electrically connecting the first conductive pad and a wireless communication circuit (e.g., the wireless communication circuit (510) of FIG. 5). The first electrical path (EP1) of FIG. 5 may include a first flexible conductive member (610), a first conductive adhesive portion, and a first conductive path.

[0121] According to various embodiments, a second flexible conductive member (also referred to as a second flexible conductor or a second flexible conductive member) (620) may be positioned between the second metal member (22) and the printed circuit board (241). The second metal member (22) and the printed circuit board (241) may be electrically connected through the second flexible conductive member (620). A ground area included in the printed circuit board (241) may be electrically connected to the second metal member (22) through the second flexible conductive member (620). The ground area included in the printed circuit board (241) may be included in the ground (G) of FIG. 5. The second flexible conductive member (620) may be brought into elastic contact with a second point (P2) on the second metal member (22) between the second metal member (22) and the printed circuit board (241).

[0122] According to various embodiments, the second flexible conductive member (620) may include a second conductive clip (e.g., a second metal structure including a resilient structure) as illustrated. The second flexible conductive member (620) may include a pogo pin, a spring, a conductive poron, a conductive rubber, a conductive tape, or a conductive connector, in place of the second conductive clip. The second flexible conductive member (620) may include a conductive adhesive material (or conductive adhesive material), in place of the second conductive clip.

[0123] According to various embodiments, the second flexible conductive member (620) may be disposed on a printed circuit board (241). The printed circuit board (241) may include a second conductive pad (also referred to as a second land or a second terminal) (not shown separately) corresponding to the second flexible conductive member (620). The second flexible conductive member (620) may be physically and electrically connected to the second conductive pad via a second conductive adhesive portion (or second conductive adhesive portion) (not shown separately) including a conductive adhesive material (or conductive adhesive material), such as solder. The printed circuit board (241) may include a second conductive path (also referred to as a second conductive line) (not shown separately) electrically connecting the second conductive pad and a ground region of the printed circuit board (241). The second electrical path (EP2) of FIG. 5 may include a second flexible conductive member (620), a second conductive adhesive, and a second conductive path. In various embodiments, the second conductive pad may be part of a ground area included in the printed circuit board (241), and the second conductive path may be omitted.

[0124] FIG. 7 is a cross-sectional view of a portion of a ring device (2) according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and encompasses all combinations of the features and / or embodiments disclosed in connection with FIG. 7 . That is, all combinations of features described below in connection with FIG. 7 should be considered to be encompassed by the present disclosure as specific examples.

[0125] Referring to FIG. 7, the ring device (2) may include a first metal portion (21), a second metal portion (22), a printed circuit board (241), a third flexible conductive member (630), and / or a fourth flexible conductive member (640).

[0126] According to various embodiments, the printed circuit board (241) may be positioned at least partially between the first metal portion (21) and the second metal portion (22).

[0127] According to various embodiments, a third flexible conductive member (also referred to as a third flexible conductor or third flexible conductive member) (630) may be positioned between the first metal portion (21) and the printed circuit board (241). The first metal portion (21) and the printed circuit board (241) may be electrically connected through the third flexible conductive member (630). The third flexible conductive member (630) may be brought into elastic contact with a third point (P3) on the first metal portion (21) between the first metal portion (21) and the printed circuit board (241).

[0128] According to various embodiments, the third flexible conductive member (630) may include a third conductive clip (e.g., a third metal structure including a resilient structure) as illustrated. The third flexible conductive member (630) may include a pogo pin, a spring, a conductive poron, a conductive rubber, a conductive tape, or a conductive connector, in place of the third conductive clip. The third flexible conductive member (630) may include a conductive adhesive material (or conductive adhesive material), in place of the third conductive clip.

[0129] According to various embodiments, the third flexible conductive member (630) may be disposed on a printed circuit board (241). The printed circuit board (241) may include a third conductive pad (also referred to as a third land or a third terminal) (710) corresponding to the third flexible conductive member (630). The third flexible conductive member (630) may be physically and electrically connected to the third conductive pad (710) via a third conductive adhesive portion (or third conductive bonding portion) including a conductive adhesive material such as solder.

[0130] According to various embodiments, a fourth flexible conductive member (also referred to as a fourth flexible conductor or fourth flexible conductive member) (640) may be positioned between the second metal member (22) and the printed circuit board (241). The second metal member (22) and the printed circuit board (241) may be electrically connected through the fourth flexible conductive member (640). The fourth flexible conductive member (640) may be brought into elastic contact with a fourth point (P4) on the second metal member (22) between the second metal member (22) and the printed circuit board (241).

[0131] According to various embodiments, the fourth flexible conductive member (640) may include a fourth conductive clip (e.g., a fourth metal structure including a resilient structure) as illustrated. The fourth flexible conductive member (640) may include a pogo pin, a spring, a conductive poron, a conductive rubber, a conductive tape, or a conductive connector, in place of the fourth conductive clip. The fourth flexible conductive member (640) may include a conductive adhesive material (or conductive adhesive material), in place of the fourth conductive clip.

[0132] According to various embodiments, the fourth flexible conductive member (640) may be disposed on a printed circuit board (241). The printed circuit board (241) may include a fourth conductive pad (also referred to as a fourth land or a fourth terminal) (720) corresponding to the fourth flexible conductive member (640). The fourth flexible conductive member (620) may be physically and electrically connected to the fourth conductive pad (720) via a fourth conductive adhesive portion (or fourth conductive adhesive portion) (not shown) including a conductive adhesive material (or conductive adhesive material), such as solder.

[0133] According to various embodiments, the printed circuit board (241) may include a conductive via (730) electrically connecting the third conductive pad (710) and the fourth conductive pad (720). The conductive via (730) may be a conductive hole in which a connecting wire for electrically connecting the third conductive pad (710) and the fourth conductive pad (720) is arranged. The conductive via (730) may be, for example, a plated through hole (PTH).

[0134] According to various embodiments, the third electrical path (EP3) of FIG. 5 may include a third flexible conductive member (630), a fourth flexible conductive member (640), a third conductive pad (710), a fourth conductive pad (720), and a conductive via (730).

[0135] According to various embodiments, and not limited to the illustrated example, the third electrical path (EP3) of FIG. 5 may include various types of conductive members electrically connecting the first metal portion (21) and the second metal portion (22). The conductive member may be, for example, disposed on a printed circuit board (241) or a frame (23) (see FIG. 3) or supported by the printed circuit board (241) or the frame (23).

[0136] According to various embodiments, the conductive member as the third electrical path (EP3) of FIG. 5 may include a pogo pin (not shown separately) penetrating the printed circuit board (241) or the frame (23). One pin of the pogo pin may be in elastic contact with the third point (P3) of the first metal portion (21), and the other pin of the pogo pin may be in elastic contact with the fourth point (P4) of the second metal portion (22).

[0137] According to various embodiments, the conductive member as the third electrical path (EP3) of FIG. 5 may include a conductive support structure (also referred to as a conductive support member or a conductive support member) disposed between the first metal portion (21) and the second metal portion (22). For example, the conductive support structure may be provided (or formed) by a support member (231) of the frame (23) (see FIG. 4). For example, the conductive support structure may protrude toward the second metal portion (22) as a portion (e.g., a rib) of the first metal portion (21) and may be electrically connected to the second metal portion (22) via a flexible conductive member or a conductive adhesive material (or a conductive adhesive material). For example, the conductive support structure may protrude toward the first metal portion (21) as a part (e.g., a rib) of the second metal portion (22) and may be electrically connected to the first metal portion (21) through a flexible conductive member or a conductive adhesive material (or a conductive bonding material).

[0138] FIG. 8 is a cross-sectional view of a portion of a ring device (2) according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and encompasses all combinations of the features and / or embodiments disclosed in connection with FIG. 8. That is, all combinations of features described below in connection with FIG. 8 should be considered to be encompassed by the present disclosure as specific examples.

[0139] Referring to FIG. 8, the ring device (2) may include a first metal portion (21), a second metal portion (22), a wireless communication circuit (510), a ground (G), a first electrical path (EP1), a second electrical path (EP2), and a third electrical path (EP3). Descriptions of some components having the same reference numerals as those illustrated in FIG. 5 are omitted.

[0140] According to various embodiments, the wireless communication circuit (510) may be electrically connected to a second point (P2) on the second metal portion (22) via a first electrical path (also referred to as a feed line or transmission line) (EP1). The first electrical path (EP1) may include one or more conductive members, one or more conductive structures, one or more conductive paths, or a combination thereof between the wireless communication circuit (510) and the second metal portion (22). The wireless communication circuit (510) may provide (or feed) an electromagnetic signal to a second point (P2) on the second metal portion (22) via the first electrical path (EP1). The second point (P2) may be defined or interpreted as a boundary area of ​​the second metal portion (22) that is physically or electrically connected to the first electrical path (EP1). The second point (P2) on the second metal part (22) may be referred to as a ‘supply point’.

[0141] According to various embodiments, the ground (G) may be electrically connected to a first point (P1) on the first metal portion (21) via a second electrical path (also referred to as a ground path or ground line) (EP2). The second electrical path (EP2) may include one or more conductive members, one or more conductive structures, one or more conductive paths, or a combination thereof between the ground (G) and the first metal portion (21). The first point (P1) may be defined or interpreted as a boundary area of ​​the first metal portion (21) that is physically or electrically connected to the second electrical path (EP2). The first point (P1) on the first metal portion (21) may be referred to as a 'ground point'.

[0142] According to various embodiments, the third electrical path (EP3) can electrically connect a third point (P3) on the first metal portion (21) and a fourth point (P4) on the second metal portion (22).

[0143] According to various embodiments, a conductive loop (CL) may be formed by a combination of a first metal portion (21), a second metal portion (22), and a third electrical path (EP3). A wireless communication circuit (510) may be configured to transmit and / or receive a signal of a designated frequency band through the conductive loop (CL). When the wireless communication circuit (510) supplies an electromagnetic signal to a second point (P2) through the first electrical path (EP1), the conductive loop (CL) may resonate in the designated frequency band due to a potential difference between the first point (P1) on the conductive loop (CL) and the second point (P2) on the conductive loop (CL). When the electromagnetic signal is supplied, energy of the designated frequency band may be substantially or relatively concentrated in the slot (520) of the conductive loop (CL). A conductive loop (CL) can reduce the distribution of energy of a specified frequency band when an electromagnetic signal is supplied to the inner space of the ring device (2) surrounded by the first metal portion (21) and the outer space of the ring device (2) surrounding the second metal portion (22).

[0144] According to various embodiments, when an electromagnetic signal is fed, the energy of a designated frequency band is substantially or relatively concentrated in the slot (520) of the conductive loop (CL), which can reduce the external dielectric or external conductor around the ring device (2) from degrading the antenna radiation performance. For example, when an electromagnetic signal is fed, the energy of a designated frequency band is substantially or relatively concentrated in the slot (520) of the conductive loop (CL), which can reduce the degrading of the antenna radiation performance by a finger (3) (see FIG. 2) inserted into the ring device (2) and a dielectric (e.g., another finger) around the ring device (2) when the ring device (2) is worn by a user.

[0145] Hereinafter, as in the examples of FIG. 5 and FIG. 8, a portion of the conductive loop (CL) that receives an electromagnetic signal and actually generates a potential difference between the first metal portion (21) and the second metal portion (22) may be referred to as a 'power supply portion' or a 'power supply structure'.

[0146] Hereinafter, as in the examples of FIG. 5 and FIG. 8, a portion (e.g., a third electrical path (EL3)) that electrically connects the first metal portion (21) and the second metal portion (22) to form a conductive loop (CL) may be referred to as a 'connection portion' or a 'connection structure'.

[0147] FIG. 9 is a diagram showing the electromagnetic field distribution on the ring device (2) when an electromagnetic signal is fed to the antenna structure (20) in the example of FIG. 5 according to various embodiments of the present disclosure.

[0148] Referring to FIG. 9, the ring device (2) may include (910) and a connection portion (920) provided (or formed) on the antenna structure (20). When an electromagnetic signal is fed, a potential difference may be generated between the first metal portion (21) and the second metal portion (22) through the feeding portion (910). For example, when an electromagnetic signal is fed, the intensity of an electric field (or radiation efficiency of an electromagnetic wave) may be substantially maximized at the feeding portion (910). 901 represents an electric field distribution on the ring device (2) when an electromagnetic signal is fed. 902 represents a magnetic field distribution on the ring device (2) when an electromagnetic signal is fed. Referring to 901 and 902, when an electromagnetic signal is supplied, an electric field can be substantially formed in a direction from the first metal portion (21) to the second metal portion (22), and energy (also called electromagnetic wave energy or wave energy) of a frequency band specified in the slot (520) of the conductive loop (CL) can be substantially or relatively concentrated.

[0149] Although not shown separately, in the example of FIG. 8, when an electromagnetic signal is supplied to the antenna structure (20), an electric field is substantially formed in a direction from the second metal portion (22) to the first metal portion (21), and an electromagnetic field distribution can be provided (or formed) in which energy of a frequency band specified in the slot (520) of the conductive loop (CL) is substantially or relatively concentrated.

[0150] Hereinafter, various examples of ring devices (2) will be described. Any one example may be interpreted as being a modification or variation of at least a portion of any other example and thus falling within the scope of various embodiments of the present disclosure. With respect to any one example, the same terminology and / or the same reference numerals may be used for components that are at least partially identical, similar, or related to any other example. In any two examples, two components that use the same terminology but different reference numerals may be understood to be substantially the same or have been modified or varied in form.

[0151] FIG. 10 is a cross-sectional view of a portion of a ring device (2) according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and encompasses all combinations of the features and / or embodiments disclosed with respect to FIG. 10 . That is, all combinations of features described below with respect to FIG. 10 should be considered to be encompassed by the present disclosure as specific examples.

[0152] Referring to FIG. 10, the ring device (2) may include a first metal portion (21), a second metal portion (22), a power supply portion (910), a connection portion (920), and a substrate assembly (24). Descriptions of some components having the same reference numerals as those illustrated in FIG. 3, 4, 5, or 8 are omitted.

[0153] According to various embodiments, a conductive loop (CL) may be provided (or formed) by a combination of a first metal portion (21), a second metal portion (22), and a connection portion (920) (e.g., a third electrical path (EP3) of FIG. 5). At least a portion (not shown separately) of the ground of the ring device (2) may be positioned in a slot (520) of the conductive loop (CL). At least a portion of the ground positioned in the slot (520) of the conductive loop (CL) may be included in an electrical element such as, for example, a substrate assembly (24). At least a portion of the ground positioned in the slot (520) of the conductive loop (CL) may be at least partially physically separated from the first metal portion (21) and the second metal portion (22). At least a portion of the conductive loop (CL) positioned in the slot (520) of the ground can be physically separated from the second metal portion (22), for example, by a support portion (231) of the frame (23). At least a portion of the conductive loop (CL) positioned in the slot (520) of the ground can be physically separated from the first metal portion (21) disposed on the first and second sides (232, 233) of the frame (23) (see FIG. 3).

[0154] According to various embodiments, in order to reduce or prevent at least a portion of the ground located in the slot (520) of the conductive loop (CL) during feeding of an electromagnetic signal through the feeding portion (910) from changing the resonant frequency or generating parasitic resonance, at least a portion of the ground may be electrically connected to the second metal portion (22) through a plurality of electrical paths (1001, 1002, 1003, 1004, 1005). The plurality of electrical paths (1001, 1002, 1003, 1004, 1005) may be positioned corresponding to a plurality of points on the second metal portion (22). The plurality of electrical paths (1001, 1002, 1003, 1004, 1005) may include one or more conductive members, one or more conductive structures, or one or more conductive paths, or a combination thereof, between the second metal portion (22) and at least a portion of the slot (520) of the conductive loop (CL) in the ground.

[0155] According to various embodiments, at least a portion of the ground conductive loop (CL) located in the slot (520) is electrically connected to the second metal portion (22) via a plurality of electrical paths (1001, 1002, 1003, 1004, 1005), thereby allowing the combination of the portion of the ground and the second metal portion (22) to operate substantially as an integrated or single metal structure (e.g., a single continuous metal structure or a complete metal structure).

[0156] According to various embodiments, the positions or numbers of the plurality of electrical paths (1001, 1002, 1003, 1004, 1005) can be configured such that a combination of at least some of the conductive loops (CL) and / or the grounds located in the slots (520) of the conductive loops (CL) can resonate in a designated frequency band. The positions or numbers of the plurality of electrical paths (1001, 1002, 1003, 1004, 1005) can be configured in consideration of the shape (e.g., electrical size or electrical length expressed as a ratio of wavelengths (λ)) of the conductive loops (CL) and / or the grounds located in the slots (520) of the conductive loops (CL).

[0157] FIG. 11 is a cross-sectional view of a portion of a ring device (2) according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and encompasses all combinations of the features and / or embodiments disclosed with respect to FIG. 11 . That is, all combinations of the features described below with respect to FIG. 11 should be considered to be encompassed by the present disclosure as specific examples.

[0158] Referring to FIG. 11, the ring device (2) may include a first metal portion (21), a second metal portion (22), a power supply portion (910), a connection portion (920), and a substrate assembly (24). Descriptions of some components having the same reference numerals as those illustrated in FIGS. 3, 4, 5, 8, or 10 are omitted.

[0159] According to various embodiments, a conductive loop (CL) may be provided (or formed) by a combination of a first metal portion (21), a second metal portion (22), and a connection portion (920) (e.g., a third electrical path (EP3) of FIG. 5). At least a portion (not shown separately) of the ground of the ring device (2) may be positioned in a slot (520) of the conductive loop (CL). At least a portion of the ground positioned in the slot (520) of the conductive loop (CL) may be included in an electrical element such as, for example, a substrate assembly (24). At least a portion of the ground positioned in the slot (520) of the conductive loop (CL) may be at least partially physically separated from the first metal portion (21) and the second metal portion (22).

[0160] According to various embodiments, in order to reduce or prevent at least a portion of the ground located in the slot (520) of the conductive loop (CL) during the feeding of an electromagnetic signal through the feeding portion (910) from changing the resonant frequency or generating parasitic resonance, at least a portion of the ground may be electrically connected to the first metal portion (21) through a plurality of electrical paths (1101, 1102, 1103, 1104). The plurality of electrical paths (1101, 1102, 1103, 1104) may be positioned corresponding to a plurality of points on the first metal portion (21). The plurality of electrical paths (1101, 1102, 1103, 1104) may include one or more conductive members, one or more conductive structures, or one or more conductive paths, or a combination thereof, between the first metal portion (21) and at least a portion of the slot (520) of the conductive loop (CL) of the ground.

[0161] According to various embodiments, at least a portion of the ground conductive loop (CL) located in the slot (520) is electrically connected to the first metal portion (21) via a plurality of electrical paths (1101, 1102, 1103, 1104), thereby allowing the combination of the portion of the ground and the second metal portion (21) to substantially operate as an integral or single metal structure (e.g., a single continuous metal structure or a complete metal structure).

[0162] According to various embodiments, the positions or numbers of the plurality of electrical paths (1101, 1102, 1103, 1104) can be configured such that a combination of at least some of the conductive loops (CL) and / or the grounds located in the slots (520) of the conductive loops (CL) can resonate in a designated frequency band. The positions or numbers of the plurality of electrical paths (1101, 1102, 1103, 1104) can be configured in consideration of the shape (e.g., electrical size or electrical length expressed as a ratio of wavelengths (λ)) of the conductive loops (CL) and / or at least some of the grounds located in the slots (520) of the conductive loops (CL).

[0163] FIG. 12 is a cross-sectional view of a portion of a ring device (2) according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and encompasses all combinations of the features and / or embodiments disclosed with reference to FIG. 12 . That is, all combinations of the features described below with reference to FIG. 12 should be considered to be encompassed by the present disclosure as specific examples.

[0164] Referring to FIG. 12, the ring device (2) may include a first metal portion (21), a second metal portion (22), a power supply portion (1210), a first connection portion (1221), and a second connection portion (1222).

[0165] According to various embodiments, the first metal portion (21) and the second metal portion (22) can be electrically connected via the first connection portion (1221) and the second connection portion (1222). The first connection portion (1221) and / or the second connection portion (1222) can be implemented in substantially the same manner as, for example, the third electrical path (EP3) of FIG. 5. The first connection portion (1221) can electrically connect a third point (P3) on the first metal portion (21) and a fourth point (P4) on the second metal portion (22). The second connection portion (1222) can electrically connect a fifth point (P5) on the first metal portion (21) and a sixth point (P6) on the second metal portion (22). A conductive loop (CL) can be provided (or formed) by a combination of the first metal portion (21), the second metal portion (22), the first connecting portion (1221), and the second connecting portion (1222).

[0166] According to various embodiments, the feed portion (1210) may be provided (or formed) between the first connection portion (1221) and the second connection portion (1222). The first point (P1) of the feed portion (1210) may be located between the third point (P3) and the fifth point (P5) of the first metal portion (21). The second point (P2) of the feed portion (1210) may be located between the fourth point (P4) and the sixth point (P6) of the second metal portion (22).

[0167] According to various embodiments, the power supply unit (1210) may be configured as in the example of Fig. 5. A first point (P1) of the power supply unit (1210) may be electrically connected to a wireless communication circuit (510), and a second point (P2) of the power supply unit (1210) may be electrically connected to a ground (G) of the ring device (2).

[0168] According to various embodiments, the power supply unit (1210) may be configured as in the example of Fig. 8. The second point (P2) of the power supply unit (1210) may be electrically connected to the wireless communication circuit (510), and the first point (P1) of the power supply unit (1210) may be electrically connected to the ground (G) of the ring device (2).

[0169] According to various embodiments, the relative position between the feed unit (1210) and the first connection unit (1221), the relative position between the feed unit (1210) and the second connection unit (1222), or the relative position between the first connection unit (1221) and the second connection unit (1222) is not limited to the illustrated example.

[0170] According to various embodiments, the wireless communication circuit (510) (e.g., see FIG. 5 or 8) may be configured to transmit and / or receive a signal in a designated frequency band through a conductive loop (CL). When the wireless communication circuit (510) supplies an electromagnetic signal through a feeding unit (1210), the conductive loop (CL) may resonate in the designated frequency band due to a potential difference between a first point (P1) on the conductive loop (CL) and a second point (P2) on the conductive loop (CL). When the electromagnetic signal is supplied, energy in the designated frequency band may be substantially or relatively concentrated in the slot (520) of the conductive loop (CL). The conductive loop (CL) may reduce the distribution of energy in the designated frequency band to an inner space of the ring device (2) surrounded by the first metal portion (21) and an outer space of the ring device (2) surrounding the second metal portion (22) when the electromagnetic signal is supplied.

[0171] According to various embodiments, when an electromagnetic signal is fed, the energy of a designated frequency band is substantially or relatively concentrated in the slot (520) of the conductive loop (CL), which can reduce the external dielectric or external conductor around the ring device (2) from degrading the antenna radiation performance. For example, when an electromagnetic signal is fed, the energy of a designated frequency band is substantially or relatively concentrated in the slot (520) of the conductive loop (CL), which can reduce the degrading of the antenna radiation performance by a finger (3) (see FIG. 2) inserted into the ring device (2) and a dielectric (e.g., another finger) around the ring device (2) when the ring device (2) is worn by a user.

[0172] FIG. 13 is a cross-sectional view of a portion of a ring device (2) according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and encompasses all combinations of the features and / or embodiments disclosed with respect to FIG. 13 . That is, all combinations of the features described below with respect to FIG. 13 should be considered to be encompassed by the present disclosure as specific examples.

[0173] Referring to FIG. 13, the ring device (2) may include a first metal portion (21), a second metal portion (22), a power supply portion (1310), a first connection portion (1321), and a second connection portion (1322).

[0174] According to various embodiments, the first metal portion (21) may extend from one end to the other end along a portion of the second metal portion (22) in the shape of a loop. The second metal portion (22) may have a ring shape. The first metal portion (21) may have a partial ring shape.

[0175] According to various embodiments, a conductive loop (CL) may be provided (or formed) by a combination of a first metal portion (21), a second metal portion (22), a first connecting portion (1321) (e.g., the first connecting portion (1221) of FIG. 12), and a second connecting portion (1322) (e.g., the second connecting portion (1222) of FIG. 12).

[0176] According to various embodiments, the ring device (2) may include a frame having a more expanded outer surface area corresponding to the first metal portion (21) extending along a portion of the second metal portion (22) compared to the frame (23) of FIG. 3.

[0177] According to various embodiments, the wireless communication circuit (510) (e.g., see FIG. 5 or 8) may be configured to transmit and / or receive a signal in a designated frequency band through a conductive loop (CL). When the wireless communication circuit (510) supplies an electromagnetic signal through a feeding unit (1310) (e.g., the feeding unit (1210) of FIG. 12), the conductive loop (CL) may resonate in a designated frequency band due to a potential difference between a first point (P1) on the conductive loop (CL) and a second point (P2) on the conductive loop (CL). When the electromagnetic signal is supplied, energy in the designated frequency band may be substantially or relatively highly concentrated in the slot (520) of the conductive loop (CL). When the electromagnetic signal is supplied, energy in the designated frequency band may be substantially or relatively highly concentrated in the slot (520) of the conductive loop (CL) to reduce external dielectric or external conductors around the ring device (2) from degrading the antenna radiation performance.

[0178] FIG. 14 is a cross-sectional view of a portion of a ring device (2) according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and encompasses all combinations of the features and / or embodiments disclosed with respect to FIG. 14 . That is, all combinations of the features described below with respect to FIG. 14 should be considered to be encompassed by the present disclosure as specific examples.

[0179] Referring to FIG. 14, the ring device (2) may include a first metal portion (21), a second metal portion (22), a first feeding portion (1411), a second feeding portion (1412), a first connecting portion (1421), a second connecting portion (1422), a third connecting portion (1423), and a fourth connecting portion (1424).

[0180] According to various embodiments, the first metal portion (21) may include a first partial metal portion (211) and a second partial metal portion (212). The first partial metal portion (211) may extend from one end to the other end along a portion of a loop-shaped second metal portion (22). The second partial metal portion (212) may extend from one end to the other end along a portion of the loop-shaped second metal portion (22). The second metal portion (22) may have a ring shape, and the first partial metal portion (211) and the second partial metal portion (212) may have a partial ring shape. The first partial metal portion (211) and the second partial metal portion (212) may be physically separated.

[0181] According to various embodiments, the ring device (2) may include a frame having a more expanded external area corresponding to the first partial metal portion (211) and the second partial metal portion (212) extending along a portion of the second metal portion (22) compared to the frame (23) of FIG. 3.

[0182] According to various embodiments, a first conductive loop (CL11) may be provided (or formed) by a combination of a first partial metal portion (211), a second metal portion (22), a first connection portion (1421), and a second connection portion (1422). The first connection portion (1421) and / or the second connection portion (1422) may be implemented in substantially the same manner as, for example, the third electrical path (EP3) of FIG. 5. The first connection portion (1421) may electrically connect a third point (P3) of the first partial metal portion (211) and a fourth point (P4) of the second metal portion (22). The second connection portion (1422) may electrically connect a fifth point (P5) of the first partial metal portion (211) and a sixth point (P6) of the second metal portion (22).

[0183] According to various embodiments, the first feed portion (1411) may be provided (or formed) between the first connection portion (1421) and the second connection portion (1422). The first feed portion (1411) may include a first point (P1) on the first partial metal portion (1411) and a second point (P2) on the second metal portion (22). The first point (P1) may be located between the third point (P3) and the fifth point (P5) of the first partial metal portion (211). The second point (P2) may be located between the fourth point (P4) and the sixth point (P6) of the second metal portion (22).

[0184] According to various embodiments, the first power supply unit (1411) may be configured as in the example of Fig. 5. The first point (P1) of the first power supply unit (1411) may be electrically connected to a wireless communication circuit (510), and the second point (P2) of the first power supply unit (1411) may be electrically connected to a ground (G) of the ring device (2).

[0185] According to various embodiments, the first power supply unit (1411) may be configured as in the example of Fig. 8. The second point (P2) of the first power supply unit (1411) may be electrically connected to the wireless communication circuit (510), and the first point (P1) of the first power supply unit (1411) may be electrically connected to the ground (G) of the ring device (2).

[0186] According to various embodiments, the relative position between the first feed unit (1411) and the first connection unit (1421), the relative position between the first feed unit (1411) and the second connection unit (1422), or the relative position between the first connection unit (1421) and the second connection unit (1422) is not limited to the illustrated example.

[0187] According to various embodiments, the wireless communication circuit (510) (e.g., see FIG. 5 or 8) may be configured to transmit and / or receive a signal in a designated frequency band via the first conductive loop (CL11). When the wireless communication circuit (510) supplies an electromagnetic signal via the first feeder (1411), the first conductive loop (CL11) may resonate in the designated frequency band due to a potential difference between a first point (P1) on the first conductive loop (CL11) and a second point (P2) on the first conductive loop (CL11). When the electromagnetic signal is supplied, energy in the designated frequency band may be substantially or relatively concentrated in the first slot (1401) of the first conductive loop (CL11). When the electromagnetic signal is supplied, the energy of the frequency band specified in the first slot (1401) of the first conductive loop (CL11) is substantially or relatively concentrated, which can reduce the external dielectric or external conductor around the ring device (2) from degrading the antenna radiation performance.

[0188] According to various embodiments, a second conductive loop (CL12) may be provided (or formed) by a combination of the second partial metal portion (212), the second metal portion (22), the third connection portion (1423), and the fourth connection portion (1424). The third connection portion (1423) and / or the fourth connection portion (1424) may be implemented in substantially the same manner as, for example, the third electrical path (EP3) of FIG. 5. The third connection portion (1423) may electrically connect the ninth point (P9) of the second partial metal portion (212) and the tenth point (P10) of the second metal portion (22). The fourth connecting portion (1424) can electrically connect the 11th point (P11) of the second metal portion (212) and the 12th point (P12) of the second metal portion (22).

[0189] According to various embodiments, the second feed portion (1412) may be provided (or formed) between the third connection portion (1423) and the fourth connection portion (1424). The second feed portion (1412) may include a seventh point (P7) on the second partial metal portion (1412) and an eighth point (P8) on the second metal portion (22). The seventh point (P7) may be located between the ninth point (P9) and the eleventh point (P11) of the second partial metal portion (212). The eighth point (P8) may be located between the tenth point (P10) and the twelfth point (P12) of the second metal portion (22).

[0190] According to various embodiments, the second power supply unit (1412) may be configured as in the example of Fig. 5. The seventh point (P7) of the second power supply unit (1412) may be electrically connected to the wireless communication circuit (510), and the eighth point (P8) of the second power supply unit (1412) may be electrically connected to the ground (G) of the ring device (2).

[0191] According to various embodiments, the second feed unit (1412) may be configured as in the example of Fig. 8. The eighth point (P8) of the second feed unit (1412) may be electrically connected to the wireless communication circuit (510), and the seventh point (P7) of the second feed unit (1412) may be electrically connected to the ground (G) of the ring device (2).

[0192] According to various embodiments, the relative position between the second feed portion (1412) and the third connection portion (1423), the relative position between the second feed portion (1412) and the fourth connection portion (1424), or the relative position between the third connection portion (1423) and the fourth connection portion (1424) is not limited to the illustrated examples.

[0193] According to various embodiments, the wireless communication circuit (510) (e.g., see FIG. 5 or 8) may be configured to transmit and / or receive a signal in a designated frequency band via the second conductive loop (CL12). When the wireless communication circuit (510) supplies an electromagnetic signal via the second feeder (1412), the second conductive loop (CL12) may resonate in the designated frequency band due to a potential difference between the seventh point (P7) on the second conductive loop (CL12) and the eighth point (P8) on the first conductive loop (CL11). When the electromagnetic signal is supplied, energy in the designated frequency band may be substantially or relatively concentrated in the second slot (1402) of the second conductive loop (CL12). When the electromagnetic signal is supplied, the energy of the frequency band specified in the second slot (1402) of the second conductive loop (CL12) is substantially or relatively concentrated, which can reduce the external dielectric or external conductor around the ring device (2) from degrading the antenna radiation performance.

[0194] According to various embodiments, the relative position between the first conductive loop (CL11) and the second conductive loop (CL12) is not limited to the illustrated example.

[0195] According to various embodiments, the ring device (2) may be implemented to include at least three conductive loops provided (or formed) in substantially the same manner as the first conductive loop (CL11) and the second conductive loop (CL12).

[0196] FIG. 15 is a cross-sectional view of a portion of a ring device (2) according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and encompasses all combinations of the features and / or embodiments disclosed with respect to FIG. 15 . That is, all combinations of the features described below with respect to FIG. 15 should be considered to be encompassed by the present disclosure as specific examples.

[0197] Referring to FIG. 15, the ring device (2) may include a first metal portion (21), a second metal portion (22), a power supply portion (1510), a first connection portion (1521), and a second connection portion (1522).

[0198] According to various embodiments, the second metal portion (22) may extend from one end to the other end along a portion of the first metal portion (21) in the shape of a loop. The first metal portion (21) may have a ring shape, and the second metal portion (22) may have a partial ring shape that partially surrounds the circumference of the first metal portion (21).

[0199] According to various embodiments, a conductive loop (CL) may be provided (or formed) by a combination of a first metal portion (21), a second metal portion (22), a first connecting portion (1521) (e.g., the first connecting portion (1221) of FIG. 12), and a second connecting portion (1522) (e.g., the second connecting portion (1222) of FIG. 12).

[0200] According to various embodiments, the ring device (2) may include a frame having a more expanded outer surface area corresponding to a second metal portion (22) extending along a portion of the first metal portion (21) compared to the frame (23) of FIG. 3.

[0201] According to various embodiments, the wireless communication circuit (510) (e.g., see FIG. 5 or 8) may be configured to transmit and / or receive a signal in a designated frequency band through a conductive loop (CL). When the wireless communication circuit (510) supplies an electromagnetic signal through a feeding unit (1510) (e.g., the feeding unit (1210) of FIG. 12), the conductive loop (CL) may resonate in a designated frequency band due to a potential difference between a first point (P1) on the conductive loop (CL) and a second point (P2) on the conductive loop (CL). When the electromagnetic signal is supplied, energy in the designated frequency band may be substantially or relatively highly concentrated in the slot (520) of the conductive loop (CL). When the electromagnetic signal is supplied, energy in the designated frequency band may be substantially or relatively highly concentrated in the slot (520) of the conductive loop (CL) to reduce external dielectric or external conductors around the ring device (2) from degrading the antenna radiation performance.

[0202] FIG. 16 is a cross-sectional view of a portion of a ring device (2) according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and encompasses all combinations of the features and / or embodiments disclosed with respect to FIG. 16 . That is, all combinations of the features described below with respect to FIG. 16 should be considered to be encompassed by the present disclosure as specific examples.

[0203] Referring to FIG. 14, the ring device (2) may include a first metal portion (21), a second metal portion (22), a first feeding portion (1611), a second feeding portion (1612), a first connecting portion (1621), a second connecting portion (1622), a third connecting portion (1623), and a fourth connecting portion (1624).

[0204] According to various embodiments, the second metal portion (22) may include a third partial metal portion (221) and a fourth partial metal portion (222). The third partial metal portion (221) may extend from one end to the other end along a portion of the first metal portion (21) in a loop shape. The fourth partial metal portion (222) may extend from one end to the other end along a portion of the first metal portion (21) in a loop shape. The first metal portion (21) may have a ring shape, and the third partial metal portion (221) and the fourth partial metal portion (222) may have a partial ring shape that partially surrounds the periphery of the first metal portion (21). The third partial metal portion (221) and the fourth partial metal portion (222) may be physically separated.

[0205] According to various embodiments, the ring device (2) may include a frame having a more expanded external area corresponding to a third partial metal portion (221) and a fourth partial metal portion (222) extending along a portion of the first metal portion (21) compared to the frame (23) of FIG. 3.

[0206] According to various embodiments, a first conductive loop (CL21) may be provided (or formed) by a combination of a first metal portion (21), a third partial metal portion (221), a first connection portion (1621), and a second connection portion (1622). The first connection portion (1621) and / or the second connection portion (1622) may be implemented in substantially the same manner as, for example, the third electrical path (EP3) of FIG. 5. The first connection portion (1621) may electrically connect a third point (P3) of the first metal portion (21) and a fourth point (P4) of the third partial metal portion (221). The second connection portion (1622) may electrically connect a fifth point (P5) of the first metal portion (21) and a sixth point (P6) of the third partial metal portion (221).

[0207] According to various embodiments, the first feed portion (1611) may be provided (or formed) between the first connection portion (1621) and the second connection portion (1622). The first feed portion (1611) may include a first point (P1) on the first metal portion (21) and a second point (P2) on the third partial metal portion (221). The first point (P1) may be located between the third point (P3) and the fifth point (P5) of the first metal portion (21). The second point (P2) may be located between the fourth point (P4) and the sixth point (P6) of the third partial metal portion (221).

[0208] According to various embodiments, the first power supply unit (1611) may be configured as in the example of Fig. 5. The first point (P1) of the first power supply unit (1611) may be electrically connected to a wireless communication circuit (510), and the second point (P2) of the first power supply unit (1611) may be electrically connected to a ground (G) of the ring device (2).

[0209] According to various embodiments, the first power supply unit (1611) may be configured as in the example of Fig. 8. The second point (P2) of the first power supply unit (1611) may be electrically connected to the wireless communication circuit (510), and the first point (P1) of the first power supply unit (1611) may be electrically connected to the ground (G) of the ring device (2).

[0210] According to various embodiments, the relative position between the first feed portion (1611) and the first connection portion (1621), the relative position between the first feed portion (1611) and the second connection portion (1622), or the relative position between the first connection portion (1621) and the second connection portion (1622) is not limited to the illustrated examples.

[0211] According to various embodiments, the wireless communication circuit (510) (e.g., see FIG. 5 or 8) may be configured to transmit and / or receive a signal in a designated frequency band via the first conductive loop (CL21). When the wireless communication circuit (510) supplies an electromagnetic signal via the first feeder (1611), the first conductive loop (CL21) may resonate in the designated frequency band due to a potential difference between a first point (P1) on the first conductive loop (CL21) and a second point (P2) on the first conductive loop (CL21). When the electromagnetic signal is supplied, energy in the designated frequency band may be substantially or relatively concentrated in the first slot (1601) of the first conductive loop (CL21). When the electromagnetic signal is supplied, the energy of the frequency band specified in the first slot (1601) of the first conductive loop (CL21) is substantially or relatively concentrated, which can reduce the external dielectric or external conductor around the ring device (2) from degrading the antenna radiation performance.

[0212] According to various embodiments, a second conductive loop (CL22) may be provided (or formed) by a combination of a first metal portion (21), a fourth partial metal portion (222), a third connection portion (1623), and a fourth connection portion (1624). The third connection portion (1623) and / or the fourth connection portion (1624) may be implemented in substantially the same manner as, for example, the third electrical path (EP3) of FIG. 5. The third connection portion (1623) may electrically connect a ninth point (P9) on the first metal portion (21) and a tenth point (P10) on the fourth partial metal portion (222). The fourth connecting portion (1624) can electrically connect the 11th point (P11) on the first metal portion (21) and the 12th point (P12) on the fourth partial metal portion (222).

[0213] According to various embodiments, the second feed portion (1612) may be provided (or formed) between the third connection portion (1623) and the fourth connection portion (1624). The second feed portion (1612) may include a seventh point (P7) on the first metal portion (21) and an eighth point (P8) on the fourth partial metal portion (222). The seventh point (P7) may be located between the ninth point (P9) and the eleventh point (P11) of the first metal portion (21). The eighth point (P8) may be located between the tenth point (P10) and the twelfth point (P12) of the fourth partial metal portion (222).

[0214] According to various embodiments, the second feed unit (14612) may be configured as in the example of Fig. 5. The seventh point (P7) of the second feed unit (1612) may be electrically connected to the wireless communication circuit (510), and the eighth point (P8) of the second feed unit (1612) may be electrically connected to the ground (G) of the ring device (2).

[0215] According to various embodiments, the second feed unit (1612) may be configured as in the example of FIG. 8. The eighth point (P8) of the second feed unit (1612) may be electrically connected to the wireless communication circuit (510), and the seventh point (P7) of the second feed unit (1612) may be electrically connected to the ground (G) of the ring device (2).

[0216] According to various embodiments, the relative position between the second feed portion (1612) and the third connection portion (1623), the relative position between the second feed portion (1612) and the fourth connection portion (1624), or the relative position between the third connection portion (1623) and the fourth connection portion (1624) is not limited to the illustrated examples.

[0217] According to various embodiments, the wireless communication circuit (510) (e.g., see FIG. 5 or 8) may be configured to transmit and / or receive a signal in a designated frequency band via the second conductive loop (CL22). When the wireless communication circuit (510) supplies an electromagnetic signal via the second feeder (1612), the second conductive loop (CL22) may resonate in the designated frequency band due to a potential difference between the seventh point (P7) on the second conductive loop (CL22) and the eighth point (P8) on the second conductive loop (CL21). When the electromagnetic signal is supplied, energy in the designated frequency band may be substantially or relatively concentrated in the second slot (1602) of the second conductive loop (CL22). When the electromagnetic signal is supplied, the energy of the frequency band specified in the second slot (1602) of the second conductive loop (CL22) is substantially or relatively concentrated, which can reduce the external dielectric or external conductor around the ring device (2) from degrading the antenna radiation performance.

[0218] According to various embodiments, the relative position between the first conductive loop (CL21) and the second conductive loop (CL22) is not limited to the illustrated example.

[0219] According to various embodiments, the ring device (2) may be implemented to include at least three conductive loops provided (or formed) in substantially the same manner as the first conductive loop (CL21) and the second conductive loop (CL22).

[0220] FIG. 17 is a cross-sectional view of a portion of a ring device (2) according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and encompasses all combinations of the features and / or embodiments disclosed in connection with FIG. 17. That is, all combinations of features described below in connection with FIG. 17 should be considered to be encompassed by the present disclosure as specific examples.

[0221] Referring to FIG. 17, the ring device (2) may include a first metal portion (21), a second metal portion (22), a power supply portion (1710), a first connection portion (1721), and a second connection portion (1722).

[0222] According to various embodiments, the first metal portion (21) and the second metal portion (22) may extend along a portion of the perimeter of the loop-shaped ring device (2). The first metal portion (21) and the second metal portion (22) may face each other and have a partial ring shape.

[0223] According to various embodiments, a conductive loop (CL) may be provided (or formed) by a combination of a first metal portion (21), a second metal portion (22), a first connecting portion (1721) (e.g., the first connecting portion (1221) of FIG. 12), and a second connecting portion (1722) (e.g., the second connecting portion (1222) of FIG. 12).

[0224] According to various embodiments, the ring device (2) may include a frame having a more expanded outer surface area corresponding to the first metal portion (21) and the second metal portion (22) extending along a portion of the perimeter of the ring device (2), compared to the frame (23) of FIG. 3.

[0225] According to various embodiments, the wireless communication circuit (510) (e.g., see FIG. 5 or 8) may be configured to transmit and / or receive a signal in a designated frequency band through a conductive loop (CL). When the wireless communication circuit (510) supplies an electromagnetic signal through a feeding unit (1710) (e.g., the feeding unit (1210) of FIG. 12), the conductive loop (CL) may resonate in a designated frequency band due to a potential difference between a first point (P1) on the conductive loop (CL) and a second point (P2) on the conductive loop (CL). When the electromagnetic signal is supplied, energy in the designated frequency band may be substantially or relatively highly concentrated in the slot (520) of the conductive loop (CL). When the electromagnetic signal is supplied, energy in the designated frequency band may be substantially or relatively highly concentrated in the slot (520) of the conductive loop (CL) to reduce external dielectric or external conductors around the ring device (2) from degrading the antenna radiation performance.

[0226] According to various embodiments, the ring device (2) may be implemented to include at least two conductive loops provided (or formed) in substantially the same manner as the conductive loop (CL).

[0227] FIG. 18 is a cross-sectional view of a portion of a ring device (2) according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and encompasses all combinations of the features and / or embodiments disclosed in connection with FIG. 18. That is, all combinations of the features described below in connection with FIG. 18 should be considered to be encompassed by the present disclosure as specific examples.

[0228] Referring to FIG. 18, the ring device (2) may include a first metal portion (21), a second metal portion (22), a first power supply portion (1811), a second power supply portion (1812), a first connection portion (1821), and a second connection portion (1822).

[0229] According to various embodiments, the first metal portion (21) and the second metal portion (22) can be electrically connected via the first connection portion (1821) and the second connection portion (1822). The first connection portion (1821) and / or the second connection portion (1822) can be implemented in substantially the same manner as, for example, the third electrical path (EP3) of FIG. 5. The first connection portion (1821) can electrically connect a third point (P3) on the first metal portion (21) and a fourth point (P4) on the second metal portion (22). The second connection portion (1822) can electrically connect a fifth point (P5) on the first metal portion (21) and a sixth point (P6) on the second metal portion (22). A first conductive loop (CL31) and a second conductive loop (CL32) can be provided (or formed) by a combination of the first metal portion (21), the second metal portion (22), the first connecting portion (1221), and the second connecting portion (1222).

[0230] According to various embodiments, the first feed unit (1811) may be positioned corresponding to the first conductive loop (CL31), and the second feed unit (1812) may be positioned corresponding to the second conductive loop (CL32).

[0231] According to various embodiments, the first power supply unit (1811) may be configured as in the example of Fig. 5. The first point (P1) of the first power supply unit (1811) may be electrically connected to a wireless communication circuit (510), and the second point (P2) of the first power supply unit (1811) may be electrically connected to a ground (G) of the ring device (2).

[0232] According to various embodiments, the first power supply unit (1811) may be configured as in the example of Fig. 8. The second point (P2) of the first power supply unit (1811) may be electrically connected to the wireless communication circuit (510), and the first point (P1) of the first power supply unit (1811) may be electrically connected to the ground (G) of the ring device (2).

[0233] According to various embodiments, the wireless communication circuit (510) (e.g., see FIG. 5 or 8) may be configured to transmit and / or receive a signal in a designated frequency band via the first conductive loop (CL31). When the wireless communication circuit (510) supplies an electromagnetic signal via the first feeder (1811), the first conductive loop (CL31) may resonate in the designated frequency band due to a potential difference between a first point (P1) on the first conductive loop (CL31) and a second point (P2) on the first conductive loop (CL31). When the electromagnetic signal is supplied, energy in the designated frequency band may be substantially or relatively concentrated in the first slot (1801) of the first conductive loop (CL31). When the electromagnetic signal is supplied, the energy of the frequency band specified in the first slot (1801) of the first conductive loop (CL31) is substantially or relatively concentrated, which can reduce the external dielectric or external conductor around the ring device (2) from degrading the antenna radiation performance.

[0234] According to various embodiments, the second feed unit (1812) may be configured as in the example of FIG. 5. The seventh point (P7) of the second feed unit (1812) may be electrically connected to the wireless communication circuit (510), and the eighth point (P8) of the second feed unit (1812) may be electrically connected to the ground (G) of the ring device (2).

[0235] According to various embodiments, the second feed unit (1812) may be configured as in the example of Fig. 8. The eighth point (P8) of the second feed unit (1812) may be electrically connected to the wireless communication circuit (510), and the seventh point (P7) of the second feed unit (1812) may be electrically connected to the ground (G) of the ring device (2).

[0236] According to various embodiments, the wireless communication circuit (510) (e.g., see FIG. 5 or 8) may be configured to transmit and / or receive a signal in a designated frequency band via the second conductive loop (CL32). When the wireless communication circuit (510) supplies an electromagnetic signal via the second feeder (1812), the second conductive loop (CL32) may resonate in the designated frequency band due to a potential difference between the seventh point (P7) on the second conductive loop (CL32) and the eighth point (P8) on the second conductive loop (CL32). When the electromagnetic signal is supplied, energy in the designated frequency band may be substantially or relatively concentrated in the second slot (1802) of the second conductive loop (CL32). When the electromagnetic signal is supplied, the energy of the frequency band specified in the second slot (1802) of the second conductive loop (CL32) is substantially or relatively concentrated, which can reduce the external dielectric or external conductor around the ring device (2) from degrading the antenna radiation performance.

[0237] According to various embodiments, the relative positions between the first feed portion (1811), the second feed portion (1812), the first connection portion (1821), and the second connection portion (1822) are not limited to the illustrated example.

[0238] According to various embodiments, the ring device (2) may be implemented to include at least three conductive loops provided (or formed) in substantially the same manner as the first conductive loop (CL31) and the second conductive loop (CL31).

[0239] FIG. 19 is a graph showing antenna radiation performance in a worn and unworn state of a ring device (2) according to the example of FIG. 5 or the example of FIG. 8, according to various embodiments of the present disclosure.

[0240] Referring to FIG. 19, 1911 is a graph showing the radiation efficiency of the ring device (2) in a worn state. 1912 is a graph showing the reflection coefficient of the ring device (2) in a worn state. 1921 is a graph showing the radiation efficiency of the ring device (2) in a non-worn state. 1922 is a graph showing the reflection coefficient of the ring device (2) in a non-worn state. In order to measure the antenna radiation performance of the ring device (2) in a worn state, a finger phantom having substantially the same electrical constant as a finger is used.

[0241] According to various embodiments, when the electromagnetic signal is fed, the energy (also called electromagnetic wave energy or wave energy) is substantially or relatively concentrated in the slot (520) of the conductive loop (CL) (see FIG. 5 or 8), thereby reducing the external dielectric or external conductor around the ring device (2) from degrading the antenna radiation performance. Referring to 1912 and 1922, when the electromagnetic signal is fed in the unworn state, the ring device (2) can resonate at a first frequency (e.g., about 1.1 GHz) of a first frequency band (FB1) corresponding to the electromagnetic signal. When the electromagnetic signal is fed in the unworn state, the ring device (2) can resonate at a second frequency (e.g., about 2.2 GHz) of a second frequency band (FB2) by frequency multiplication. When the electromagnetic signal is fed to the ring device (2) in the non-worn state, the ring device (2) can resonate at a third frequency (e.g., about 3.3 GHz) of the third frequency band (FB3) by frequency multiplication. When the electromagnetic signal is fed to the ring device (2) in the non-worn state, the ring device (2) can resonate at a fourth frequency band of the fourth frequency band (FB2) by frequency multiplication. When the electromagnetic signal is fed to the ring device (2) in the non-worn state, the ring device (2) can resonate at a fifth frequency band of the fifth frequency band (FB2) by frequency multiplication. Referring to 1911, 1912, 1921, and 1922, when switching from the non-worn state to the worn state, the resonance frequencies may not substantially shift or may shift within a range in which antenna radiation performance can be secured. For example, when switching from a non-wearing state to a wearing state, the antenna radiation performance in the second frequency band (FB2) and the third frequency band (FB3) may be degraded by up to about 2 dB within the obtainable range.

[0242] According to various embodiments, when switching from a non-wearing state to a wearing state, the radiation performance in the first frequency band (FB1) may be improved due to the conductivity of the finger phantom.

[0243] FIG. 20 is a graph showing antenna radiation performance measured through simulation (also called a simulation tool) in a worn state and an unworn state of a ring device (2) according to the example of FIG. 5 or the example of FIG. 8, according to various embodiments of the present disclosure.

[0244] Referring to FIG. 20, 2011 is a graph showing the radiation efficiency of the ring device (2) in a worn state. 2012 is a graph showing the reflection coefficient of the ring device (2) in a worn state. 2021 is a graph showing the radiation efficiency of the ring device (2) when another finger touches the ring device (2) in a worn state. 2022 is a graph showing the reflection coefficient of the ring device (2) when another finger touches the ring device (2) in a worn state. 2031 is a graph showing the radiation efficiency of the ring device (2) in a non-wearing state. 2032 is a graph showing the reflection coefficient of the ring device (2) in a non-wearing state.

[0245] According to various embodiments, with reference to 2011, 2012, 2021, 2022, 2031, and 2032, resonance characteristics substantially identical to the resonance characteristics (or frequency characteristics) disclosed in FIG. 19 are measured. When switching from a non-wearing state to a wearing state, the resonance frequencies may not substantially shift or may shift within a range in which antenna radiation performance can be secured. For example, when switching from a non-wearing state to a wearing state, the resonance frequency may shift by about 10 MHz to about 50 MHz, which corresponds to a range in which antenna radiation performance can be secured. For example, when switching from a non-wearing state to a wearing state, the antenna radiation performance may be degraded by about 4 dB, which corresponds to a range in which antenna radiation performance can be secured.

[0246] According to various embodiments, when switching from a non-wearing state to a wearing state, the radiation performance in the first frequency band (FB1) may be improved due to the conductivity of the finger.

[0247] According to various embodiments, even if another finger comes into contact with the ring device (2) while it is being worn, the antenna radiation performance may be reduced within an obtainable range.

[0248] FIG. 21 is a drawing showing a part of a ring device (2100) of a comparative example for comparison with embodiments of the present disclosure, and graphs showing antenna radiation performance of the ring device (2100) of the comparative example.

[0249] The ring device (2100) of the comparative example is presented only for comparison with embodiments of the present disclosure and does not have a prior status with respect to various embodiments of the present disclosure.

[0250] Referring to FIG. 21, a ring device (2100) of a comparative example may include a first metal portion (2110) and a second metal portion (2120). The second metal portion (2120) may be extended, for example, in a loop shape. The first metal portion (2110) may be positioned, for example, inside the second metal portion (2120), and may extend from one end to the other end along a portion of the second metal portion (212). The first metal portion (2110) and the second metal portion (2120) may be implemented as a planar inverted F antenna (PIFA). An electromagnetic signal may be fed to a feeding point on the first metal portion (2110). The second metal portion (2120) may function as an antenna ground. The grounding point on the first metal portion (2110) can be electrically connected to the second metal portion (2020).

[0251] 2111 is a graph showing the radiation efficiency of the ring device (2100) of the comparative example in a worn state. 2112 is a graph showing the reflection coefficient of the ring device (2100) of the comparative example in a worn state. 2121 is a graph showing the radiation efficiency of the ring device (2100) of the comparative example when another finger touches the ring device (2100) of the comparative example in a worn state. 2122 is a graph showing the reflection coefficient of the ring device (2100) of the comparative example when another finger touches the ring device (2100) of the comparative example in a worn state. 2131 is a graph showing the radiation efficiency of the ring device (2100) of the comparative example in a non-worn state. 2032 is a graph showing the reflection coefficient of the ring device (2100) of the comparative example in a non-worn state.

[0252] According to various embodiments, with reference to 2111, 2112, 2121, 2122, 2131, and 2132, when switching from a non-wearing state to a wearing state, the ring device (2100) of the comparative example exhibits a large shift in resonant frequency (e.g., shifts by about 150 MHz to about 170 MHz) and may have difficulty securing antenna radiation performance in a designated frequency band, as compared to the ring device (2) of the present disclosure, since it is difficult to reduce the electromagnetic influence of another finger in a wearing state. The ring device (2100) of the comparative example may have difficulty securing antenna radiation performance, as compared to the ring device (2) of the present disclosure, since it is difficult to reduce the electromagnetic influence of another finger in a wearing state.

[0253] FIG. 22 is a perspective view of a ring device (2), a drawing illustrating the ring device (2), and a cross-sectional view of a portion of the ring device (2), according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and encompasses all combinations of the features and / or embodiments disclosed with respect to FIG. 22. That is, all combinations of features described below with respect to FIG. 22 should be considered to be encompassed by the present disclosure as specific examples.

[0254] Referring to Fig. 22, the ring device (2) may include a first metal portion (21), a second metal portion (22), and a frame (23). The first metal portion (21) and the second metal portion (22) may be supported by the frame (23) and may be physically separated from each other.

[0255] According to various embodiments, the first metal portion (21) may include a first inner surface (21A) having a first inner radius of curvature (R11) and a first outer surface (21B) having a first outer radius of curvature (R12) with respect to a first center line (C1). The first metal portion (21) may have a first thickness corresponding to a difference between the first inner radius of curvature (R11) and the first outer radius of curvature (R12). The first metal portion (21) may have a first width in a direction parallel to the first center line (C1) (e.g., in the z-axis direction).

[0256] According to various embodiments, the second metal portion (22) may include a second inner surface (22A) having a second inner radius of curvature (R21) and a second outer surface (22B) having a second outer radius of curvature (R22) with respect to the second center line (C2). The second metal portion (22) may have a second thickness corresponding to a difference between the second inner radius of curvature (R21) and the second outer radius of curvature (R22). The second metal portion (22) may have a second width in a direction parallel to the second center line (C2) (e.g., in the z-axis direction).

[0257] According to various embodiments, the first width of the first metal portion (21) and the second width of the second metal portion (22) may be substantially the same, and the second metal portion (22) may cover the first metal portion (21) when viewed in a direction perpendicular to the first center line (C1) or the second center line (C2) (e.g., in the x-axis direction or the y-axis direction).

[0258] According to various embodiments, the first center line (C1) of the first metal portion (21) and the second center line (C2) of the second metal portion (22) may not coincide. The thickness of the gap (201) between the first metal portion (21) and the second metal portion (22) may not be constant. The ring device (2) may include a first portion (2201) in which the first metal portion (21) and the second metal portion (22) are spaced apart from each other by a substantially maximum first distance (T1), and a second portion (2202) in which the first metal portion (21) and the second metal portion (22) are spaced apart from each other by a substantially minimum second distance (T2). The first part (2201) and the second part (2202) may be positioned substantially opposite each other with respect to the first center line (C1) of the first metal part (C1) (or the second center line (C2) of the second metal part (C2)).

[0259] According to various embodiments, the ring device (2) may include at least one conductive loop (e.g., the conductive loop (CL) of FIG. 5) provided (or formed) by a combination of a first metal portion (21), a second metal portion (22), and one or more connecting portions electrically connecting the first metal portion (21) and the second metal portion (22). The ring device (2) may include at least one feeding portion (e.g., the feeding portion (910) of FIG. 9) among the conductive loops that receives an electromagnetic signal to substantially generate a potential difference between the first metal portion (21) and the second metal portion (22).

[0260] According to various embodiments, the ring device (2) may include a feeding portion (e.g., feeding portion (910) of FIG. 9) located in the first portion (2201) and a connecting portion (e.g., connecting portion (920) of FIG. 9) located in the second portion (2202).

[0261] According to various embodiments, the ring device (2) may include a feeding portion (e.g., feeding portion (910) of FIG. 9) located in the second portion (2202) and a connecting portion (e.g., connecting portion (920) of FIG. 9) located in the first portion (2201).

[0262] FIG. 23 is a perspective view of a ring device (2), a drawing illustrating the ring device (2), and a cross-sectional view of a portion of the ring device (2), according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and encompasses all combinations of the features and / or embodiments disclosed with respect to FIG. 23. That is, all combinations of features described below with respect to FIG. 23 should be considered to be encompassed by the present disclosure as specific examples.

[0263] Referring to Fig. 23, the ring device (2) may include a first metal portion (21), a second metal portion (22), and a frame (23). The first metal portion (21) and the second metal portion (22) may be supported by the frame (23) and may be physically separated from each other.

[0264] According to various embodiments, the first metal portion (21) may include a first inner surface (21A) having a first inner radius of curvature (R11) and a first outer surface (21B) having a first outer radius of curvature (R12) with respect to the center line (C) of the ring device (2). The first metal portion (21) may have a first thickness corresponding to a difference between the first inner radius of curvature (R11) and the first outer radius of curvature (R12).

[0265] According to various embodiments, the second metal portion (22) may include a second inner surface (22A) having a first inner radius of curvature (R21) and a first outer surface (21B) having a second outer radius of curvature (R12) with respect to the center line (C) of the ring device (2). The first metal portion (21) may have a second thickness corresponding to the difference between the first inner radius of curvature (R11) and the first outer radius of curvature (R12).

[0266] According to various embodiments, the center line (C) of the ring device (2) may be defined or interpreted as a first center line of the first metal portion (21) that serves as a reference for the first inner radius of curvature (R11) and the first outer radius of curvature (R12), and a second center line of the second metal portion (22) that serves as a reference for the second inner radius of curvature (R21) and the second outer radius of curvature (R22) substantially coinciding with each other.

[0267] According to various embodiments, when viewed in a direction perpendicular to the center line (C) of the ring device (2) (e.g., in the x-axis direction or the y-axis direction), the first metal portion (21) and the second metal portion (22) may have a shape with substantially the same width, and the second metal portion (22) may cover the first metal portion (21).

[0268] According to various embodiments, in a direction perpendicular to the center line (C) of the ring device (2), the ring device (2) may include a third portion (2301) in which the first metal portion (21) and the second metal portion (22) extend to a maximum first width (W1), and a fourth portion (2302) in which the first metal portion (21) and the second metal portion (22) extend to a minimum second width (W2). The third portion (2301) and the fourth portion (2302) may be positioned substantially opposite each other with respect to the center line (C) of the ring device (2).

[0269] According to various embodiments, the ring device (2) may include at least one conductive loop (e.g., the conductive loop (CL) of FIG. 5) provided (or formed) by a combination of a first metal portion (21), a second metal portion (22), and one or more connecting portions electrically connecting the first metal portion (21) and the second metal portion (22). The ring device (2) may include at least one feeding portion (e.g., the feeding portion (910) of FIG. 9) among the conductive loops that receives an electromagnetic signal to substantially generate a potential difference between the first metal portion (21) and the second metal portion (22).

[0270] According to various embodiments, the ring device (2) may include a feeding portion (e.g., feeding portion (910) of FIG. 9) located in the third portion (2301) and a connecting portion (e.g., connecting portion (920) of FIG. 9) located in the fourth portion (2302).

[0271] According to various embodiments, the ring device (2) may include a feeding portion (e.g., feeding portion (910) of FIG. 9) located in the fourth portion (2302) and a connecting portion (e.g., connecting portion (920) of FIG. 9) located in the third portion (2301).

[0272] FIG. 24 is a graph showing the radiation efficiency of a ring device (2) according to the example of FIG. 22 and a ring device (2) according to the example of FIG. 23, according to various embodiments of the present disclosure. FIG. 25 is a graph showing the reflection coefficient of a ring device (2) according to the example of FIG. 22 and a ring device (2) according to the example of FIG. 23, according to various embodiments of the present disclosure.

[0273] Referring to FIG. 24, 2411 is a graph showing the radiation efficiency of the ring device (2) when an electromagnetic signal is fed in a first example in which a feeding part (e.g., a feeding part (910) of FIG. 9) is positioned in a first part (2201) of the ring device (2) of FIG. 22, and a connecting part (e.g., a connecting part (920) of FIG. 9) is positioned in a second part (2202) of the ring device (2) of FIG. 22, and a connecting part is positioned in a first part (2201) of the ring device (2). 2412 is a graph showing the radiation efficiency of the ring device (2) when an electromagnetic signal is fed in a second example in which a feeding part is positioned in a second part (2202) of the ring device (2) of FIG. 22, and a connecting part is positioned in a first part (2201) of the ring device (2). 2421 is a graph showing the radiation efficiency of the ring device (2) when an electromagnetic signal is fed in a third example in which the feeding part is located in the third part (2301) of the ring device (2) of FIG. 23 and the connecting part is located in the fourth part (2302) of the ring device (2). 2422 is a graph showing the radiation efficiency of the ring device (2) when an electromagnetic signal is fed in a fourth example in which the feeding part is located in the fourth part (2401) of the ring device (2) of FIG. 23 and the connecting part is located in the third part (2301) of the ring device (2).

[0274] Referring to FIG. 25, 2511 is a graph showing a reflection coefficient of a ring device (2) when an electromagnetic signal is fed in a first example in which a feeding part (e.g., a feeding part (910) of FIG. 9) is positioned in a first part (2201) of a ring device (2) of FIG. 22 and a connecting part (e.g., a connecting part (920) of FIG. 9) is positioned in a second part (2202) of a ring device (2) of FIG. 22. 2512 is a graph showing a reflection coefficient of a ring device (2) when an electromagnetic signal is fed in a second example in which a feeding part (e.g., a feeding part (910) of FIG. 9) is positioned in a first part (2201) of a ring device (2) of FIG. 22. 2521 is a graph showing the reflection coefficient of the ring device (2) when an electromagnetic signal is fed in the third example in which the feeding part is located in the third part (2301) of the ring device (2) of FIG. 23 and the connecting part is located in the fourth part (2302) of the ring device (2). 2522 is a graph showing the reflection coefficient of the ring device (2) when an electromagnetic signal is fed in the fourth example in which the feeding part is located in the fourth part (2401) of the ring device (2) of FIG. 23 and the connecting part is located in the third part (2301) of the ring device (2).

[0275] According to various embodiments, referring to 2411, 2412, 2421, 2422, 2511, 2512, 2521, and 2522, the resonant frequencies of the ring device (2) can be shifted within a range that ensures antenna radiation performance in the designated frequency bands according to the first example, the second example, the third example, and the fourth example (see 2501, 2502, 2503, 2504, and 2505).

[0276] FIG. 26 is a cross-sectional view of a portion of a ring device (2) according to various embodiments of the present disclosure. It should be understood that the present disclosure encompasses and encompasses all combinations of the features and / or embodiments disclosed in connection with FIG. 26. That is, all combinations of the features described below in connection with FIG. 26 should be considered to be encompassed by the present disclosure as specific examples.

[0277] Referring to Fig. 26, the ring device (2) may include an inner surface (2A), an outer surface (2B), and a substrate assembly (24). Descriptions of some components having the same reference numerals as those shown in Fig. 4 are omitted.

[0278] According to various embodiments, when the ring device (2) is worn on a user's finger (3) (see FIG. 2), the inner surface (2A) of the ring device (2) can be in contact with the finger (3). The outer surface (2B) of the ring device (2) can surround the inner surface (2A).

[0279] According to various embodiments, the inner surface (2A) of the ring device (2) may be provided (or formed) by a first metal portion (21) (see FIG. 3).

[0280] According to various embodiments, the inner surface (2A) of the ring device (2) may be provided (or formed) by a combination of a first metal portion (21) (see FIG. 13, 14, 15, or 17) and a frame.

[0281] According to various embodiments, the outer surface (2B) of the ring device (2) may be provided (or formed) by a second metal portion (22) (see FIG. 3).

[0282] According to various embodiments, the outer surface (2B) of the ring device (2) may be provided (or formed) by a combination of a second metal portion (22) (see FIG. 15, 16, or 17) and a frame.

[0283] According to various embodiments, the substrate assembly (24) may include a first conductive portion (2600) positioned between an inner surface (2A) and an outer surface (2B) of the ring device (2). The first conductive portion (2600) may be part of a ground (also referred to as a ground structure) of the ring device (2). The first conductive portion (2600) may be disposed at least partially along the inner surface (2A) and the outer surface (2B) of the ring device (2).

[0284] According to various embodiments, the first conductive portion (2600) of the substrate assembly (24) may be physically separated from the first metal portion (21) (see FIG. 3, 13, 14, 15, or 17) that provides (or forms) at least a portion of the inner surface (2A) of the ring device (2).

[0285] According to various embodiments, the first conductive portion (2600) of the substrate assembly (24) may be physically separated from the first metal portion (21) (see FIG. 3, 15, 16, or 17) that provides (or forms) at least a portion of the outer surface (2B) of the ring device (2).

[0286] According to various embodiments, the ring device (2) can be configured to transmit and / or receive a signal of a specified frequency band via a first conductive portion (2600) of a substrate assembly (24) and a first metal portion (21) (see FIG. 3, 13, 14, 15, or 17) that provides (or forms) at least a portion of an inner surface (2A) of the ring device (2). The ring device (2) can include at least one feed portion and at least one connection portion for the first conductive portion (2600) and the first metal portion (21). The at least one feed portion can be formed in substantially the same manner as the feed portion (910) for the first metal portion (21) and the second metal portion (22), for example, in the example of FIG. 10. At least one connecting portion may be formed in substantially the same manner as the connecting portion (920) for the first metal portion (21) and the second metal portion (22), for example, in the example of FIG. 10. The ring device (2) may have at least one conductive loop formed by a combination of the first conductive portion (2600), the first metal portion (21), and the at least one connecting portion. The wireless communication circuit included in the ring device (2) provides (or feeds) an electromagnetic signal to the at least one conductive loop via the at least one feeding portion, and the electromagnetic signal may be substantially radiated through the at least one conductive loop (or a slot of the at least one conductive loop).

[0287] According to various embodiments, the ring device (2) can be configured to transmit and / or receive a signal of a specified frequency band via a first conductive portion (2600) of the substrate assembly (24) and a second metal portion (22) (see FIG. 3, 15, 16, or 17) that provides (or forms) at least a portion of an outer surface (2B) of the ring device (2). The ring device (2) can include at least one feed portion and at least one connection portion for the first conductive portion (2600) and the second metal portion (22). The at least one feed portion can be formed in substantially the same manner as the feed portion (910) for the first metal portion (21) and the second metal portion (22), for example, in the example of FIG. 10. At least one connecting portion may be formed in substantially the same manner as the connecting portion (920) for the first metal portion (21) and the second metal portion (22), for example, in the example of FIG. 10. The ring device (2) may have at least one conductive loop formed by a combination of the first conductive portion (2600), the second metal portion (22), and the at least one connecting portion. The wireless communication circuit included in the ring device (2) provides (or feeds) an electromagnetic signal to the at least one conductive loop via the at least one feeding portion, and the electromagnetic signal may be substantially radiated through the at least one conductive loop (or a slot of the at least one conductive loop).

[0288] According to various embodiments, the present disclosure discloses a ring device (2) that is worn on a user's finger, but the ring device (2) may be provided (or formed) in a form that is wearable on various parts of the user's body. For example, the ring device (2) may be implemented so that it is wearable on the arm, wrist, neck, or head. The ring device (2) may be implemented as an earring, for example.

[0289] According to various embodiments, the present disclosure discloses a circular ring device (2), but the ring device (2) may be implemented in an oval or polygonal shape.

[0290] According to various embodiments of the present disclosure, a ring device (2) includes a first metal portion (21), a second metal portion (22), at least one connecting portion (e.g., connecting portion (920), or first and second connecting portions (1221, 1222)), and a wireless communication circuit (510). The first metal portion (21) is disposed on the inside of the ring device (2). The second metal portion (22) is disposed on the outside of the ring device (2). The second metal portion (22) is separated from the first metal portion (21). At least one connecting portion electrically connects the first metal portion (21) and the second metal portion (21). The wireless communication circuit (510) is configured to transmit and / or receive a wireless signal through a conductive loop (CL) including a slot (520) formed by the first metal portion (21), the second metal portion (22), and the at least one connecting portion.

[0291] According to various embodiments of the present disclosure, a first point (P1) on a first metal portion (21) of a conductive loop (CL) may be electrically connected to receive a power supply signal from a wireless communication circuit (510). A second point (P2) on a second metal portion (22) of the conductive loop (CL) may be electrically connected to a ground (G) included in a ring device (2). The first point (P1) and the second point (P2) may be positioned on opposite sides of a slot (520) formed between the first point (P1) and the second point (P2).

[0292] According to various embodiments of the present disclosure, a first point (P1) on a first metal portion (21) of a conductive loop (CL) may be electrically connected to a ground (G) included in a ring device (2). A second point (P2) on a second metal portion (22) of the conductive loop (CL) may be electrically connected to receive a power supply signal from a wireless communication circuit (510). The first point (P1) and the second point (P2) may be positioned on opposite sides with a slot (520) formed between the first point (P1) and the second point (P2) interposed therebetween.

[0293] According to various embodiments of the present disclosure, at least one connecting portion may include a first connecting portion (1221) and a second connecting portion (1222). The first connecting portion (1221) may electrically connect a third point (P3) on the first metal portion (21) and a fourth point (P4) on the second metal portion (22). The second connecting portion (1222) may electrically connect a fifth point (P5) on the first metal portion (21) and a sixth point (P6) on the second metal portion (22). The first point (P1) may be located between the third point (P3) and the fifth point (P5) on the first metal portion (21). The second point (P2) may be located between the fourth point (P4) and the sixth point (P6) on the second metal portion (22).

[0294] According to various embodiments of the present disclosure, the ring device (2) may include a printed circuit board (241) positioned between a first metal portion (21) and a second metal portion (22). A wireless communication circuit (510) may be disposed on the printed circuit board (241). A first point (P1) may be electrically connected to the printed circuit board (241) via a first flexible conductive member (610) disposed between the first point (P1) and the printed circuit board (241). A second point (P2) may be electrically connected to the printed circuit board (241) via a second flexible conductive member (620) disposed between the second point (P2) and the printed circuit board (241).

[0295] According to various embodiments of the present disclosure, at least one connecting portion may comprise a conductive via (730) of a printed circuit board (241).

[0296] According to various embodiments of the present disclosure, a plurality of points on the first metal portion (21) of the conductive loop (CL) can be electrically connected to a portion of the ground (G) of the ring device (2) located in the slot (520) (see FIG. 11).

[0297] According to various embodiments of the present disclosure, a plurality of points on the second metal portion (22) of the conductive loop (CL) can be electrically connected to a portion of the ground (G) of the ring device (2) located in the slot (520) (see FIG. 10).

[0298] According to various embodiments of the present disclosure, the ring device (2) may include a non-conductive material at least partially disposed in a slot (520) between the first metal portion (21) and the second metal portion (22).

[0299] According to various embodiments of the present disclosure, the first metal portion (21) may have a ring shape. The second metal portion (22) surrounding the periphery of the first metal portion (21) may have a ring shape (see FIG. 5, 12, or 18).

[0300] According to various embodiments of the present disclosure, the first metal portion (21) may have a ring shape. The second metal portion (22) may have a partial ring shape that partially surrounds the peripheral surface of the first metal portion (21) (see FIG. 15 or 16).

[0301] According to various embodiments of the present disclosure, the second metal portion (22) may have a ring shape. The first metal portion (21) may have a partial ring shape (see FIG. 13 or 14).

[0302] According to various embodiments of the present disclosure, the ring device (2) can be configured to be worn on a user's finger.

[0303] According to various embodiments of the present disclosure, the ring device (2) can be configured to be worn on a user's wrist.

[0304] According to various embodiments of the present disclosure, the ring device (2) may be configured as an earring.

[0305] The embodiments disclosed in this disclosure and the drawings are merely specific examples to more easily explain the technical content and to help understand the present disclosure, and are not intended to limit the scope of the present disclosure. Therefore, the scope of various embodiments of the present disclosure should be construed as including modified or altered forms in addition to the embodiments disclosed herein. Additionally, it will be understood that any embodiment(s) described herein can be used in conjunction with any other embodiment(s) described herein. In particular, it is emphasized that while the present disclosure is presented in a form that provides multiple embodiments each defining multiple features, some of these embodiments are connected only by reference to the same drawing or drawings. The present disclosure should be understood to include all combinations of these embodiments, unless there is an apparent contradiction between two (or more) embodiments. That is, if features are presented as optional in the present disclosure, all combinations of such optional features are included in the present disclosure.

Claims

1. In the ring device (2), A first metal part (21) arranged on the inside of the above ring device (2); A second metal part (22) arranged on the outside of the above ring device (2) and separated from the first metal part (21); At least one connecting portion (920, 1221, 1222) electrically connecting the first metal portion (21) and the second metal portion (22); and A ring device comprising a wireless communication circuit (510) configured to transmit and / or receive a wireless signal through a conductive loop (CL) including a slot (520) formed by the first metal portion (21), the second metal portion (22), and the at least one connecting portion (920, 1221, 1222).

2. In paragraph 1, The first point (P1) on the first metal portion (21) of the above-mentioned conductive loop (CL) is electrically connected to receive a power supply signal from the wireless communication circuit (510). The second point (P2) on the second metal portion (22) of the above-mentioned conductive loop (CL) is electrically connected to the ground (G) included in the ring device (2), and A ring device in which the first point (P1) and the second point (P2) are positioned on opposite sides of the slot (520) formed between the first point (P1) and the second point (P2).

3. In paragraph 1, The first point (P1) on the first metal portion (21) of the above-mentioned challenging loop (CL) is electrically connected to the ground (G) included in the ring device (2), The second point (P2) on the second metal portion (22) of the above conductive loop (CL) is electrically connected to receive a power supply signal from the wireless communication circuit (510), and A ring device in which the first point (P1) and the second point (P2) are positioned on opposite sides of the slot (520) formed between the first point (P1) and the second point (P2).

4. In paragraph 2 or 3, At least one of the above connecting portions, A first connecting portion (1221) electrically connecting the third point (P3) on the first metal portion (21) and the fourth point (P4) on the second metal portion (22), and It includes a second connecting portion (1222) that electrically connects the fifth point (P5) on the first metal portion (21) and the sixth point (P6) on the second metal portion (22). The above first point (P1) is located between the third point (P3) and the fifth point (P5) on the first metal part (21), and The second point (P2) is a ring device located between the fourth point (P4) and the sixth point (P6) on the second metal part (22).

5. In any one of paragraphs 2 to 4, It further includes a printed circuit board (241) positioned between the first metal portion (21) and the second metal portion (22), The above wireless communication circuit (510) is placed on the printed circuit board (241), The first point (P1) is electrically connected to the printed circuit board (241) through a first flexible conductive member (610) arranged between the first point (P1) and the printed circuit board (241), and The second point (P2) is a ring device electrically connected to the printed circuit board (241) through a second flexible conductive member (620) disposed between the second point (P2) and the printed circuit board (241).

6. In paragraph 5, A ring device wherein at least one of the above connecting portions comprises a conductive via (730) of the printed circuit board (241).

7. In any one of paragraphs 1 to 6, A ring device in which a plurality of points on the first metal portion (21) of the above-described conductive loop (CL) are electrically connected to a portion of the ground (G) of the ring device (2) located in the slot (520).

8. In any one of paragraphs 1 to 6, A ring device in which a plurality of points on the second metal portion (22) of the above-described conductive loop (CL) are electrically connected to a portion of the ground (G) of the ring device (2) located in the slot (520).

9. In any one of paragraphs 1 to 8, A ring device further comprising a non-conductive material at least partially disposed in the slot (520) between the first metal portion (21) and the second metal portion (22).

10. In any one of paragraphs 1 to 9, A ring device in which the first metal portion (21) has a ring shape and the second metal portion (22) surrounding the circumference of the first metal portion (21) has a ring shape.

11. In any one of paragraphs 1 to 9, A ring device in which the first metal portion (21) has a ring shape and the second metal portion (22) has a partial ring shape that partially surrounds the circumference of the first metal portion (21).

12. In any one of paragraphs 1 to 9, A ring device in which the second metal portion (22) has a ring shape and the first metal portion (21) has a partial ring shape.

13. In any one of paragraphs 1 to 12, The above ring device is a ring device configured to be worn on a user's finger.

14. In any one of paragraphs 1 to 12, The above ring device is a ring device configured to be worn on a user's wrist.

15. In any one of paragraphs 1 to 12, The above ring device is a ring device consisting of an earring.

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