Computing device

Abstract

Embodiments of the present application provide a computing device. The computing device comprises: a housing, an air channel having an air inlet and an air outlet being defined in the housing; a circuit board, arranged in the air channel; and a fan assembly, arranged in the air passage, in the wind direction in the air channel, the fan assembly being located in the upwind direction, and the circuit board being located in the downwind direction, the fan assembly comprising at least one fan module, and the axial direction of the fan module being parallel to the wind direction in the air channel. The technical solution of the embodiments of the present application can improve the overall safety of the computing device, thereby avoiding the risk of injury due to a user accidentally touching the fan assembly.

Description

computing devices

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 12, 2023, with application number 202323392183X and title “Computing Device,” the entire contents of which are incorporated by reference into this application.

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on December 12, 2023, with application number 2023117075536 and titled “Computing Device,” the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the technical field of electronic devices, and in particular to a computing device. Background Art

[0004] In the related art, electronic devices, such as computing devices, are typically equipped with fan assemblies on the outside of their housings to create air ducts, thereby removing heat generated by the electronic device's internal components. However, such fan assemblies pose a safety hazard, and users can be easily injured if they accidentally touch the fan assembly.

[0005] Summary of the Invention

[0006] The embodiments of the present application provide a computing device to solve or alleviate one or more technical problems in the prior art.

[0007] As one aspect of an embodiment of the present application, the embodiment of the present application provides a computing device, including: a shell, a duct with an air inlet and an air outlet is defined in the shell; a circuit board is arranged in the air duct; a fan assembly is arranged in the air duct, and along the wind direction in the air duct, the fan assembly is located in the upwind direction and the circuit board is located in the downwind direction; the fan assembly includes at least one fan module, and the axial direction of the fan module is parallel to the wind direction in the air duct.

[0008] In one embodiment, there are multiple air outlets; wherein, the extension direction of the multiple air outlets is the same; or, the multiple air outlets are divided into a first air outlet group and a second air outlet group, and the extension direction of the air outlets in the first air outlet group is different from the extension direction of the air outlets in the second air outlet group.

[0009] In one embodiment, the computing device further includes: an air inlet guide, which is arranged on the side of the fan assembly facing away from the circuit board, and the air inlet is arranged on the air inlet guide; an air outlet guide, which is arranged on the side of the circuit board facing away from the fan assembly, and the air outlet is arranged on the air outlet guide.

[0010] In one embodiment, a first magnetic component is provided on the shell, and a second magnetic component is provided on the air inlet guide member and / or the air outlet guide member, and the first magnetic component is magnetically connected to the second magnetic component.

[0011] In one embodiment, the computing device further includes: a control bracket connected to the housing; and a control module connected to the control bracket.

[0012] In one embodiment, the control bracket includes a first connecting plate and a second connecting plate connected to each other, the first connecting plate and the second connecting plate form an angle, the control module is connected to the first connecting plate, and the second connecting plate is connected to the housing.

[0013] In one embodiment, the computing device further includes a display component connected to the second connecting board.

[0014] In one embodiment, a switch controller and a display switching controller are provided on the control bracket, wherein the switch controller corresponds to the first button portion provided on the housing, and the display switching controller corresponds to the second button portion provided on the housing.

[0015] In one embodiment, the fan assembly further includes a fan bracket, the fan module is disposed on the fan bracket, and the fan bracket is connected to the housing.

[0016] In one embodiment, a vibration absorbing pad is provided at the bottom of the fan bracket.

[0017] In one embodiment, the fan bracket includes: a mounting back portion, to which the fan module is connected; a mounting bottom portion, which is arranged at the bottom of the fan module; and two mounting sides, which are respectively located at two ends of the mounting bottom portion.

[0018] In one embodiment, the computing device further includes: a control module electrically connected to the fan assembly and the circuit board, wherein the control module is connected to one of the two mounting sides.

[0019] In one embodiment, the mounting bottom includes a bottom plate and a flange connected to the bottom plate, the flange is arranged close to the circuit board, and the flange is located between the bottom plate and the bottom plate of the housing.

[0020] In one embodiment, the mounting bottom defines a wiring groove, and the wiring groove is formed by a portion of the mounting bottom being recessed toward the bottom plate of the housing.

[0021] In one embodiment, the computing device further includes: a first duct member and a second duct member connected to the fan bracket, the first duct member and the second duct member being respectively located on both sides of the fan module in the radial direction; the bottom of the first duct member and / or the second duct member being bonded to the bottom plate of the shell through a flexible adhesive.

[0022] In one embodiment, a filter device is provided between the fan assembly and the air inlet.

[0023] In one embodiment, at least one fan mounting hole is formed on the housing; at least one fan module is provided in a one-to-one correspondence with the at least one fan mounting hole, and each fan module is connected to the housing.

[0024] In one embodiment, the computing device further includes: a third duct member and a fourth duct member, the third duct member and the fourth duct member are respectively located on both sides of the fan module in the radial direction; the third duct member and / or the fourth duct member are connected to the top plate of the shell.

[0025] In one embodiment, the computing device further includes: a fifth duct member and a sixth duct member, the fifth duct member and the sixth duct member are respectively located on both sides of the fan module in the radial direction; the fifth duct member and / or the sixth duct member are connected to the bottom plate of the shell.

[0026] In one embodiment, the housing further includes a mounting location, in which the display assembly is mounted.

[0027] In one embodiment, the computing device further includes a pressure plate, which is fixedly connected to the housing, and the display assembly is pressed between the pressure plate and the inner wall of the housing.

[0028] In one embodiment, a mounting groove is provided on the housing, and a light-emitting element and / or a light-guiding element is provided in the mounting groove.

[0029] In one embodiment, the circuit board includes a first surface and a second surface that are opposite to each other, and a plurality of heat-generating components are arranged in an array on the first surface.

[0030] In one embodiment, the areas of the plurality of heat-generating components are equal, and / or the device types of the plurality of heat-generating components are the same.

[0031] In one embodiment, the computing device further includes a heat sink, which is disposed on the first surface and / or the second surface.

[0032] In one embodiment, the radiator includes a liquid cooling tube and a plurality of heat dissipating fins arranged at intervals, the extension direction of each heat dissipating fin is the same as the wind direction in the air duct, and the liquid cooling tube is passed through the plurality of heat dissipating fins along the arrangement direction of the plurality of heat dissipating fins.

[0033] In one embodiment, a top plate of the housing is provided with a reinforcing rib, the reinforcing rib is located between the fan assembly and the circuit board, and the reinforcing rib covers a portion of a side surface of the radiator.

[0034] In one embodiment, the radiator includes a first radiator and a second radiator, the first radiator is arranged on the first surface, and the second radiator is arranged on the second surface; along the arrangement direction of the multiple heat dissipation fins, the size of the second radiator is larger than the size of the first radiator.

[0035] In one embodiment, the second heat sink is connected to the housing via fasteners.

[0036] In one embodiment, the second heat sink is used to support the weight of the circuit board and the first heat sink.

[0037] In one embodiment, the top of the air inlet, the top of the air outlet, and the top of the radiator are flush with each other, and the bottom of the air inlet, the bottom of the air outlet, and the bottom of the radiator are flush with each other.

[0038] In one embodiment, the air outlet is connected to a heat recovery system.

[0039] The embodiments of the present application adopt the above technical solutions to improve the overall safety of the computing device and avoid the risk of injury due to the user accidentally touching the fan assembly.

[0040] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0042] 1 and 2 are schematic diagrams showing the three-dimensional structure of a computing device according to an embodiment of the present application;

[0043] 3 and 4 show exploded views of a computing device according to an embodiment of the present application;

[0044] 5 to 7 are schematic diagrams showing a partial structure of a computing device according to an embodiment of the present application;

[0045] FIG8 shows a top view of a computing device according to an embodiment of the present application;

[0046] FIG9 shows a cross-sectional view along line AA in FIG8 ;

[0047] FIG10 shows a front view of a computing device according to another embodiment of the present application;

[0048] FIG11A shows a rear view of a computing device according to another embodiment of the present application;

[0049] FIG11B is a schematic diagram showing the air outlet effect according to an embodiment of the present application;

[0050] FIG12 shows a top view of a computing device according to another embodiment of the present application;

[0051] FIG13 shows a bottom view of a computing device according to another embodiment of the present application;

[0052] FIG14 shows a side view of a computing device according to another embodiment of the present application;

[0053] FIG15 shows an exploded view of a computing device according to another embodiment of the present application;

[0054] FIG16 is a schematic diagram showing a control bracket of a computing device according to another embodiment of the present application;

[0055] 17 to 22 are partial schematic diagrams of a housing of a computing device according to another embodiment of the present application.

[0056] Explanation of reference numerals: 10: computing device; 100: housing; 110: air inlet; 120: air outlet; 130: fan mounting hole; 140: first magnetic member; 150: mounting hole; 160: screen cover; 171: first button portion; 172: second button portion; 180: pressure plate; 190: mounting slot; 191: light-emitting member; 10a: reinforcing rib; 10b: data interface; 210: circuit board; 211: heating component; 220: radiator; 221: liquid cooling tube; 222: cooling fin; 300: fan assembly; 310: fan module; 320: fan bracket; 321: mounting back; 322: mounting bottom; 322 1: Bottom plate; 3222: Flanged edge; 3223: Wiring trough; 323: Mounting side; 324: Vibration-absorbing pad; 330: Filter device; 400: Control module; 510: Duct piece; 511: Flexible adhesive piece; 520: Second duct piece; 530: Third duct piece; 540: Fourth duct piece; 550: Fifth duct piece; 560: Sixth duct piece; 610: Air inlet guide piece; 611: Second magnetic piece; 620: Air outlet guide piece; 700: Control bracket; 710: First connecting plate; 720: Second connecting plate; 721: Display assembly; 730: Switch controller; 740: Display switching controller. DETAILED DESCRIPTION

[0057] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0058] The following describes a computing device according to an embodiment of the present application in conjunction with Figures 1 to 30.

[0059] Figures 1 and 2 illustrate a schematic perspective view of a computing device 10 according to an embodiment of the present invention; Figures 3 and 4 illustrate exploded views of the computing device 10 according to an embodiment of the present invention. As shown in Figures 1-4 , the computing device 10 according to an embodiment of the present invention includes a housing 100, a circuit board 210, and a fan assembly 300.

[0060] The housing 100 defines an air duct having an air inlet 110 and an air outlet 120. A circuit board 210 and a fan assembly 300 are both disposed within the air duct. The fan assembly 300 includes at least one fan module 310, the axial direction of which is parallel to the wind direction within the air duct. Along the wind direction within the air duct, the fan assembly 300 is located upwind, while the circuit board 210 is located downwind.

[0061] It should be noted that the phrase "along the wind direction in the air duct, the fan assembly 300 is located upwind, and the circuit board 210 is located downwind" means that along the wind direction in the air duct, the fan assembly 300 is located upwind relative to the circuit board 210, and the circuit board 210 is located downwind relative to the fan assembly 300. In other words, when the wind flows in the air duct, the wind first passes through the fan assembly 300 and then passes through the circuit board 210.

[0062] Among them, "upwind direction" and "downwind direction" should be understood in a broad sense in this application, and "up" and "down" do not refer to "up" and "down" in physical orientation, but refer to the relative position relationship in the wind direction within the air duct. For example: in the air duct, if the wind flows from left to right, then the left side of the air duct can be described as upwind direction, and the right side of the air duct is downwind direction. At this time, "the fan assembly 300 is located in the upwind direction, and the circuit board 210 is located in the downwind direction" means that the fan assembly 300 is located on the left side of the circuit board 210, and the circuit board 210 is located on the right side of the fan assembly 300. If the wind flows from bottom to top, then the lower side of the air duct can be described as upwind direction, and the upper side of the air duct is downwind direction. At this time, "the fan assembly 300 is located in the upwind direction, and the circuit board 210 is located in the downwind direction" means that the fan assembly 300 is located on the lower side of the circuit board 210, and the circuit board 210 is located on the upper side of the fan assembly 300.

[0063] Because the fan assembly 300 is located upwind and the circuit board 210 is located downwind, the fan assembly 300 operates in a blower-type configuration. When the fan assembly 300 is operating, cold air from outside enters the air duct through the air inlet 110, then flows through the fan assembly 300 and the circuit board 210, exchanging heat with the circuit board 210 and removing heat generated during operation. Finally, the hot air flowing through the circuit board 210 flows out through the air outlet 120.

[0064] For example, the fan module 310 may be an axial flow fan, and the circuit board 210 may be located at one axial end of the fan module 310. When the fan module 310 is in operation, the fan module 310 pushes air in a direction from the air inlet 110 to the air outlet 120, so that cool air can flow through the circuit board 210, thereby achieving heat dissipation of the circuit board 210.

[0065] The air outlet 120 can be connected to a heat recovery system. In this way, while the computing device 10 performs its computing functions, it can also be used as a heater, and the hot air output from the air outlet 120 can be reused, thereby improving energy efficiency, reducing carbon emissions, and lowering energy costs.

[0066] For example, air outlet 120 can be connected to the indoor space or vehicle interior through a heat recovery system, so that the hot air output from air outlet 120 can raise the indoor or vehicle air temperature, achieving a heating function. Compared to using electric heaters for heating, this can save electricity, improve resource utilization efficiency, and reduce negative impacts on the environment. Optionally, the computing device can be a small device that can be placed on a desktop, making it convenient for users to keep warm in office settings.

[0067] It should be noted that the term "heat recovery system" in this application should be broadly understood to refer to a system for recovering heat energy. For example, if the air outlet 120 is directly connected to the indoor space so that the hot air output from the air outlet 120 is used for heating, the heat recovery system is the house.

[0068] The computing device 10 according to the embodiment of the present application can utilize the heat generated by the circuit board 210 during operation to achieve heating, thereby saving electricity and improving resource utilization efficiency. In addition, by locating both the circuit board 210 and the fan assembly 300 within the air duct, the internal structure of the computing device 10 is made more compact, improving the space utilization within the housing 100 and making the appearance of the computing device 10 more regular. At the same time, the overall safety of the computing device 10 is improved, and the risk of injury due to accidental contact of the fan assembly 300 by the user is avoided.

[0069] Figures 5 to 7 are schematic diagrams of the partial structure of a computing device 10 according to an embodiment of the present application. In one embodiment, as shown in Figures 3 to 7, the fan assembly 300 may further include a fan bracket 320, the fan module 310 is disposed on the fan bracket 320, and the fan bracket 320 is connected to the housing 100. For example, three fan modules 310 are shown in Figures 4 to 7, and the three fan modules 310 are arranged at intervals in the length direction of the housing 100. The fan modules 310 and the circuit board 210 are arranged in the width direction of the housing 100. The radial direction of each fan module 310 is parallel to the length direction of the housing 100, and the axial direction of each fan module 310 is parallel to the width direction of the housing 100. Optionally, a vibration-absorbing pad 324 may be provided at the bottom of the fan bracket 320 to absorb vibrations generated during the operation of the fan module 310.

[0070] In this embodiment, the fan module 310 can be installed on the housing 100 through the fan bracket 320, thereby reducing the installation accuracy requirement of the fan module 310 and making the arrangement position of the fan module 310 more flexible.

[0071] Figures 3-7 show three fan modules 310 for illustrative purposes, but after reading the technical solution of this application, ordinary technicians can obviously understand that the solution can be applied to the technical solution of other numbers of fan modules 310, which also falls within the scope of protection of this application.

[0072] In one embodiment, referring to Figures 3-7 , the fan bracket 320 may include a mounting back 321, a mounting bottom 322, and two mounting side portions 323. The fan module 310 is connected to the mounting back 321. The mounting bottom 322 is disposed at the bottom of the fan module 310. The two mounting side portions 323 are located at either end of the mounting bottom 322.

[0073] Exemplarily, the housing 100 may include a top plate and a bottom plate that are arranged opposite to each other, two first side plates that are arranged opposite to each other, and two second side plates that are arranged opposite to each other. The top plate, the first side plate and the second side plate may constitute the overall structure of the upper shell. The second side plate is located in the axial direction of the fan assembly 300, wherein the air inlet 110 is arranged on one of the two second side plates, and the air outlet 120 is arranged on the other of the two second side plates. The mounting back 321 may be connected to the second side plate on which the air inlet 110 is provided by fasteners, and the mounting side portion 323 may be connected to the bottom plate by fasteners. A vibration absorbing pad 324 may be provided at the bottom of the mounting side portion 323 to absorb vibrations generated during the operation of the fan module 310.

[0074] In this embodiment, by making the fan bracket 320 include a mounting back 321 , a mounting bottom 322 and two mounting side portions 323 , the structure of the fan bracket 320 is more stable and reliable, thereby improving the installation stability of the fan module 310 .

[0075] FIG8 illustrates a top view of a computing device 10 according to an embodiment of the present application; FIG9 illustrates a cross-sectional view taken along line AA in FIG8 . In one embodiment, referring to FIG3-9 , the mounting base 322 may include a base plate 3221 and a flange 3222 connected to the base plate 3221. The flange 3222 is disposed adjacent to the circuit board 210 and positioned between the base plate 3221 and the bottom plate of the housing 100. With this configuration, the flange 3222 can be positioned within the gap between the base plate 3221 and the bottom plate of the housing 100, effectively blocking air leakage caused by air passing through the gap between the base plate 3221 and the bottom plate of the housing 100. This prevents air short-circuiting and ensures that air flowing in from the air inlet 110 can flow through the fan and the circuit board 210, ultimately exiting through the air outlet 120.

[0076] In one embodiment, referring to Figures 3-9 , the mounting base 322 defines a wiring trough 3223. The wiring trough 3223 is formed by a portion of the mounting base 322 recessed toward the bottom plate of the housing 100. For example, if there are multiple fan modules 310, the wiring trough 3223 extends in the direction of arrangement of the multiple fan modules 310. The bottom of the wiring trough 3223 may contact the bottom plate of the housing 100. Thus, the wiring trough 3223 facilitates the arrangement of fan wiring, allowing the fan wiring to be installed within the wiring trough 3223. Furthermore, it blocks the gap between the mounting base 322 and the bottom plate of the housing 100, thereby preventing air leakage caused by air passing through the gap between the mounting base 322 and the bottom plate of the housing 100. This prevents air short-circuiting and ensures that air flowing in from the air inlet 110 flows through the fan and circuit board 210, and ultimately flows out of the air outlet 120.

[0077] In one embodiment, the computing device 10 may further include a control module 400 , which is electrically connected to both the fan assembly 300 and the circuit board 210 . The control module 400 may be connected to one of the two mounting sides 323 .

[0078] For example, the control module 400 may include a fan interface connected to the fan module 310 so that the control board can control the operation of the fan module 310. The circuit board 210 may be provided with a first signal socket, and the control module 400 may include a second signal socket connected to the second signal socket so that the control module 400 can control the operation of the circuit board 210.

[0079] In this embodiment, by providing the aforementioned control module 400, the control module 400 can control the operation of the circuit board 210 and the fan assembly 300, thereby achieving computing functions while ensuring heat dissipation, thereby improving the reliability and long-term stability of the computing device 10. Furthermore, by connecting the control module 400 to one of the two mounting side portions 323, the arrangement of the control module 400 is more rational, making the distance between the control module 400, the fan assembly 300, and the circuit board 210 closer, thereby facilitating the routing of the control module 400 and the fan assembly 300, as well as the wiring between the control module 400 and the fan assembly 300, and between the control module 400 and the circuit board 210.

[0080] In one embodiment, as shown in Figures 3-7 , the computing device 10 may further include a first duct member 510 and a second duct member 520 connected to the fan bracket 320. The first duct member 510 and the second duct member 520 are respectively located on either side of the fan module 310 in the radial direction. The bottom of the first duct member 510 and / or the second duct member 520 is bonded to the bottom plate of the housing 100 via a flexible adhesive 511. That is to say, the bottom of the first duct member 510 may be bonded to the bottom plate of the shell 100 through the flexible adhesive member 511, and the bottom of the second duct member 520 may not be bonded to the bottom plate of the shell 100 through the flexible adhesive member 511; or, the bottom of the second duct member 520 may be bonded to the bottom plate of the shell 100 through the flexible adhesive member 511, and the bottom of the first duct member 510 may not be bonded to the bottom plate of the shell 100 through the flexible adhesive member 511; it is also possible that the bottom of the first duct member 510 and the bottom of the second duct member 520 are both bonded to the bottom plate of the shell 100 through the flexible adhesive member 511.

[0081] For example, in the examples of Figures 4-7 , the first duct member 510 and the second duct member 520 are arranged opposite each other in the arrangement direction of the plurality of fan modules 310. The first duct member 510 can be connected to one of the two mounting side portions 323 by fasteners, such as bolts, and the second duct member 520 can be connected to the other of the two mounting side portions 323 by fasteners, such as bolts. A flexible adhesive member 511 can be provided at the bottom of each of the first duct member 510 and the second duct member 520 to achieve adhesion between the first duct member 510 and the housing 100, and between the second duct member 520 and the housing 100.

[0082] In this embodiment, by setting up the first air duct member 510 and the second air duct member 520, the first air duct member 510 and the second air duct member 520 can be used to guide the airflow so that the wind flowing in from the air inlet 110 can flow from the fan module 310 to the circuit board 210, avoiding air leakage and air crossflow, and improving the heat dissipation effect of the circuit board 210.

[0083] In one embodiment, a filter device 330 may be disposed between the fan assembly 300 and the air inlet 110. For example, the filter device 330 may include a filter screen and filter cotton, with the filter cotton disposed between the filter screen and the fan module 310. The filter screen may be fixedly connected to the fan bracket 320 using fasteners such as screws. After a period of use, the filter cotton may be replaced based on the degree of dirtiness.

[0084] In this embodiment, by providing the aforementioned filter device 330, after external air flows into the air inlet 110 under the action of the fan module 310, it first flows through the filter device 330. After being filtered by the filter device 330, it flows through the fan module 310 and the circuit board 210 in sequence, and finally flows out of the air outlet 120. This ensures the cleanliness of the air output from the air outlet 120. In addition, it prevents external dust and other impurities from entering the fan module 310 and affecting its normal operation, thereby improving the operational reliability of the fan module 310 and extending its service life.

[0085] In one embodiment, at least one fan mounting hole 130 may be formed in the housing 100; at least one fan module 310 is provided in a one-to-one correspondence with the at least one fan mounting hole 130, and each fan module 310 is connected to the housing 100. Unlike the above-described embodiment, as shown in FIG17 , the fan modules 310 of this computing device 10 are directly connected to the housing 100, eliminating the need for a fan bracket, resulting in a simpler structure and easier installation.

[0086] In one embodiment, as shown in Figures 15 and 17 , the computing device 10 may further include a third duct member 530 and a fourth duct member 540, respectively located on either side of the fan module 310 in the radial direction. The third duct member 530 and / or the fourth duct member 540 are connected to the top plate of the housing 100. Exemplarily, the third duct member 530 and the fourth duct member 540 are disposed opposite each other in the arrangement direction of the plurality of fan modules 310. For example, the third duct member 530 and the fourth duct member 540 may be disposed opposite each other in the longitudinal direction of the housing 100. The third duct member 530 and the fourth duct member 540 may be integrally formed with the top plate of the housing 100. Figure 15 shows three fan modules 310, each of which is located between the third duct member 530 and the fourth duct member 540.

[0087] In this embodiment, the third and fourth duct members 530, 540 are provided to guide airflow, allowing air flowing in from the air inlet 110 to flow from the fan module 310 to the circuit board 210, thereby preventing air leakage and cross-flow and improving the heat dissipation effect on the circuit board 210. Furthermore, the third and fourth duct members 530, 540 can be directly connected to the top plate of the housing 100, thereby reducing the number of installation steps for the computing device 10 and making assembly and disassembly of the computing device 10 more convenient.

[0088] In one embodiment, as shown in Figures 15 and 19 , the computing device 10 may further include a fifth duct member 550 and a sixth duct member 560, respectively located on either side of the fan module 310 in the radial direction. The fifth duct member 550 and / or the sixth duct member 560 are connected to the bottom plate of the housing 100. Exemplarily, the fifth duct member 550 and the sixth duct member 560 are disposed opposite each other in the arrangement direction of the plurality of fan modules 310. For example, the fifth duct member 550 and the sixth duct member 560 may be disposed opposite each other in the longitudinal direction of the housing 100. The fifth duct member 550 and the sixth duct member 560 may be integrally formed with the bottom plate of the housing 100. Figure 15 shows three fan modules 310, each of which is located between the fifth duct member 550 and the sixth duct member 560.

[0089] In this embodiment, the fifth and sixth duct members 550, 560 are provided to guide airflow, allowing air flowing in from the air inlet 110 to flow from the fan module 310 to the circuit board 210, thereby preventing air leakage and cross-flow and improving the heat dissipation effect on the circuit board 210. Furthermore, the fifth and sixth duct members 550, 560 can be directly connected to the bottom plate of the housing 100, thereby reducing the number of installation steps for the computing device 10 and making assembly and disassembly of the computing device 10 more convenient.

[0090] In one embodiment, there may be multiple air outlets 120. The multiple air outlets 120 may extend in the same direction (as shown in FIG2 ); or, the multiple air outlets 120 may be divided into a first air outlet group and a second air outlet group, with the air outlets 120 in the first air outlet group extending in a different direction than the air outlets 120 in the second air outlet group (as shown in FIG11B ).

[0091] For example, in FIG2 , the plurality of air outlets 120 all extend vertically. The direction of the wind output from the air outlet 120 may be perpendicular to the second side panel of the housing 100. In FIG11B , the extension direction of the plurality of air outlets 120 in the first air outlet group is the same, and the extension direction of the plurality of air outlets 120 in the second air outlet group is the same. For example, in FIG11B (a), the plurality of air outlets 120 in the first air outlet group are all inclined to the left relative to the vertical line, and the plurality of air outlets 120 in the second air outlet group are all inclined to the right relative to the vertical line. The direction of the wind output from the plurality of air outlets 120 in the first air outlet group is inclined to the right from top to bottom, and the direction of the wind output from the plurality of air outlets 120 in the second air outlet group is inclined to the left from top to bottom.

[0092] In FIG11B(b), the direction in which the multiple air outlets 120 in the first air outlet group extend is tilted to the right relative to the vertical line, while the direction in which the multiple air outlets 120 in the second air outlet group extend is tilted to the left relative to the vertical line. The direction of the air output by the multiple air outlets 120 in the first air outlet group is tilted to the right from bottom to top, while the direction of the air output by the multiple air outlets 120 in the second air outlet group is tilted to the left from bottom to top.

[0093] In FIG11B(c), the direction in which the multiple air outlets 120 in the first air outlet group extend is tilted to the right relative to the vertical line, while the direction in which the multiple air outlets 120 in the second air outlet group extend is tilted to the left relative to the vertical line. The direction of the air output by the multiple air outlets 120 in the first air outlet group is tilted to the left from top to bottom, while the direction of the air output by the multiple air outlets 120 in the second air outlet group is tilted to the right from top to bottom.

[0094] In FIG11B(d), the plurality of air outlets 120 in the first air outlet group are all tilted to the left relative to the vertical line, while the plurality of air outlets 120 in the second air outlet group are all tilted to the right relative to the vertical line. The direction of the wind output from the plurality of air outlets 120 in the first air outlet group can be tilted to the left from bottom to top, while the direction of the wind output from the plurality of air outlets 120 in the second air outlet group can be tilted to the right from bottom to top.

[0095] In this embodiment, different air outlet effects can be achieved by changing the extension direction of the air outlet 120, effectively improving the user experience. The user can manually flip the structural member where the air outlet 120 is located (e.g., left-right, up-down, or inside-out) to change the extension direction of the air outlet 120. Alternatively, the user can replace the structural member where the air outlet 120 is located to change the extension direction of the air outlet 120. This application does not limit this.

[0096] In one embodiment, as shown in Figures 10, 11A and 15, the computing device 10 may further include an air inlet guide 610 and an air outlet guide 620. The air inlet guide 610 is disposed on the side of the fan assembly 300 facing away from the circuit board 210, and the air inlet 110 is disposed on the air inlet guide 610. The air outlet guide 620 is disposed on the side of the circuit board 210 facing away from the fan assembly 300, and the air outlet 120 is disposed on the air outlet guide 620. Thus, the structural member where the air outlet 120 is located is the air outlet guide 620, and the air outlet guide 620 can be independently disposed relative to the housing 100. By manually flipping the air outlet guide 620 or replacing a different air outlet guide 620, the direction of the air outlet 120 can be changed to achieve different air outlet modes. The structure is simple and the operation is convenient.

[0097] In one embodiment, referring to FIG15 , a first magnetic member 140 may be provided on the housing 100, and a second magnetic member 611 may be provided on the air inlet guide 610 and / or the air outlet guide 620. The first magnetic member 140 is magnetically connected to the second magnetic member 611. This simplifies the connection between the housing 100 and the air inlet guide 610 and / or the air outlet guide 620, making installation and removal more convenient and quick, without the need for tools, and greatly improving the efficiency of installing and removing the air inlet guide 610 and / or the air outlet guide 620.

[0098] In one embodiment, as shown in Figures 15 and 16 , the computing device 10 may further include a control bracket 700 and a control module 400 . The control bracket 700 is connected to the housing 100 . The control module 400 is connected to the control bracket 700 .

[0099] The control bracket 700 may include a first connecting plate 710 and a second connecting plate 720 connected to each other, wherein the first connecting plate 710 and the second connecting plate 720 form an angle, the control module 400 is connected to the first connecting plate 710, and the second connecting plate 720 is connected to the housing 100. For example, with reference to Figures 15 and 16, the second connecting plate 720 may be connected to the top plate of the housing 100.

[0100] For example, the computing device 10 may further include a data interface 10b. The data interface 10b may be provided on the bottom plate of the housing 100. The data interface 10b is electrically connected to the control module 400. Optionally, the data interface 10b may be a Type-C interface, but is not limited thereto.

[0101] In this embodiment, the control module 400 can be installed on the housing 100 through the control bracket 700, thereby reducing the installation accuracy requirement of the control module 400 and making the arrangement position of the control module 400 more flexible.

[0102] In one embodiment, the computing device 10 may further include a display assembly 721 connected to the second connecting plate 720. For example, the display assembly 721 may be connected to the side of the second connecting plate 720 facing away from the control module 400. The display assembly 721 may have a display side and a non-display side. The display side is used to display image information or text information. The display side of the display assembly 721 may be positioned away from the circuit board 210, while the non-display side of the display assembly 721 may be positioned toward the circuit board 210. The housing 100 may be provided with a mounting hole 150, through which the display assembly 721 mounted on the second connecting plate 720 may be exposed, allowing a user to view the image information or text information displayed on the display assembly 721. For example, the display assembly 721 may be used to cyclically display Internet Protocol (IP) information, inlet air temperature, outlet air temperature, computing power, power consumption, and other information. Optionally, a transparent screen cover 160 may be provided over the mounting hole 150 to protect the display assembly 721. The mounting hole 150 may be provided on the top plate of the housing 100 , but is not limited thereto.

[0103] In this embodiment, by providing the display assembly 721, the user can observe the information displayed by the display assembly 721 from the outside. In addition, the display assembly 721 and the control module 400 can be installed on the same control bracket 700, thereby reducing the number of overall components of the computing device 10 and improving the efficiency of installation and removal of the computing device 10.

[0104] Of course, the present application is not limited thereto. In one embodiment, the housing 100 further includes a mounting position in which the display assembly 721 is mounted. The difference from the above embodiment is that the display assembly 721 in this embodiment can be directly mounted on the mounting position on the housing 100, rather than on the second connecting plate 720.

[0105] In one example, referring to Figures 21 and 22 , the mounting location can be a through-hole 150, through which the display assembly 721 is exposed, allowing a user to externally observe the image information or text information displayed on the display assembly 721. For example, the mounting hole 150 can penetrate the top plate of the housing 100 along the wall thickness direction of the housing 100. At least a portion of the display assembly 721 is located within the air duct.

[0106] In another example, the mounting location may be a mounting slot, with the display assembly 721 positioned within the mounting slot. In this case, the user can also observe the image or text displayed on the display assembly 721 from the outside. For example, the mounting slot may be formed by an inwardly recessed portion of the housing 100. The display assembly 721 may be positioned outside the air duct.

[0107] In one embodiment, the computing device 10 may further include a pressure plate 180, which is fixedly connected to the housing 100, and the display assembly 721 is pressed between the pressure plate 180 and the inner wall of the housing 100. For example, in the examples of Figures 21 and 22, the pressure plate 180 can be formed into a runway-shaped structure. The computing device 10 may include a third fastener. During installation, the third fastener can be fixedly connected to the top plate of the housing 100 through the pressure plate 180. Furthermore, there can be two third fasteners, and the two third fasteners can be respectively located at both ends of the pressure plate 180. In this embodiment, through the above-mentioned arrangement, while ensuring that the user can observe the information displayed by the display assembly 721 from the outside, the structural stability and reliability of the display assembly 721 can also be ensured.

[0108] In one embodiment, the control bracket 700 may be provided with a switch controller 730 and a display switching controller 740, wherein the switch controller 730 corresponds to the first button portion 171 provided on the housing 100, and the display switching controller 740 corresponds to the second button portion 172 provided on the housing 100. For example, in the examples of Figures 15 and 16, the switch controller 730 and the display switching controller 740 may be provided on the second connecting plate 720, and the switch controller 730 and the display switching controller 740 may be located on the side of the second connecting plate facing away from the control module 400. The switch controller 730 may control the start and stop of the computing device 10, and the display switching controller 740 may switch the display information on the display assembly 721. When a user presses the first button portion 171, the switch controller 730 is triggered, thereby turning the computing device 10 on if it is off, and turning it off if it is on. When the user presses the second button portion 172, the display switching controller 740 is triggered, which can switch the IP information, air inlet temperature, air outlet temperature, computing power, power consumption and other information displayed on the display component 721, and can also control the lights.

[0109] In one embodiment, referring to FIG15 , the housing 100 may be provided with a mounting slot 190, in which a light-emitting element 191 (as shown in FIG4 ) and / or a light guide (not shown) may be provided. For example, when the light-emitting element 191 is provided in the mounting slot 190, the light-emitting element 191 may be mounted and fixed to the air outlet 120. The light-emitting element 191 may be a light strip; when the light guide is provided in the mounting slot 190, the light guide may be a light guide bar, but the present invention is not limited thereto.

[0110] Therefore, by setting the light-emitting component 191 and / or the light-guiding component, the light-emitting component 191 can display different colors according to different air outlet temperatures, which is more intuitive; the light-guiding component can be used to guide and distribute light so that the light can reach the desired position, thereby improving the display effect.

[0111] In one embodiment, the circuit board 210 includes a first surface and a second surface arranged opposite to each other, and a heat-generating component 211 is provided on the first surface to implement the computing function of the computing device. Exemplarily, the plurality of heat-generating components 211 can be arranged in an array. The areas of the plurality of heat-generating components 211 can be equal, and / or the device types of the plurality of heat-generating components 211 can be the same, so as to facilitate the arrangement of the heat-generating components 211 on the circuit board 210. For example, the plurality of heat-generating components 211 can all be chips.

[0112] In one embodiment, the computing device 10 may further include a heat sink 220. The heat sink 220 may be disposed on the first surface and / or the second surface. In other words, the heat sink 220 may be disposed on the first surface of the circuit board 210, but not on the second surface; or the heat sink 220 may be disposed on the second surface of the circuit board 210, but not on the first surface; or the heat sink 220 may be disposed on both the first and second surfaces of the circuit board 210.

[0113] In this way, the heat generated by the heat-generating components 211 on the circuit board 210 during operation can be transferred to the heat sink 220. When the fan assembly 300 is in operation, external cold air can flow from the air inlet 110 into the air duct and then flow through the heat sink 220, thereby removing the heat from the heat sink 220, effectively reducing the temperature of the circuit board 210 and ensuring the normal operation of the heat-generating components 211.

[0114] For example, when there is only one heat sink 220, the heat sink 220 can be disposed on the first surface of the circuit board 210 or on the second surface of the circuit board 210. When there are multiple heat sinks 220, the multiple heat sinks 220 can all be disposed on the first surface of the circuit board 210; or, the multiple heat sinks 220 can all be disposed on the second surface of the circuit board 210; or, some of the multiple heat sinks 220 can be disposed on the first surface of the circuit board 210, and another part of the multiple heat sinks 220 can be disposed on the second surface of the circuit board 210. When a heat sink 220 is disposed on the first surface of the circuit board 210, the heat sink 220 can be in direct contact with the heat-generating component 211 or in indirect contact with the heat-generating component 211 through a thermally conductive material (such as silicone grease). A riveted nut column can be disposed on the bottom plate of the housing 100, and the heat sink 220 can be fixedly connected to the riveted nut column by fasteners such as bolts, thereby achieving the installation of the heat sink 220.

[0115] In one embodiment, the radiator 220 may include a liquid cooling tube 221 and a plurality of heat dissipating fins 222 arranged at intervals. The extension direction of each heat dissipating fin 222 is the same as the wind direction in the air duct. The liquid cooling tube 221 is provided through the plurality of heat dissipating fins 222 along the arrangement direction of the plurality of heat dissipating fins 222. In the description of this application, "plurality" means two or more.

[0116] For example, the heat dissipation fins 222 can be perpendicular to the first surface and the second surface of the circuit board 210. A heat dissipation channel can be defined between two adjacent heat dissipation fins 222. Since the extension direction of each heat dissipation fin 222 is the same as the wind direction in the air duct, the extension direction of the heat dissipation channel is the same as the wind direction in the air duct. A coolant, such as water, is provided in the liquid cooling tube 221. The heat generated during the operation of the heat-generating component 211 can be transferred to the heat dissipation fins 222. Since the liquid cooling tube 221 is provided through the plurality of heat dissipation fins 222, the heat dissipation fins 222 can transfer part of the heat to the coolant in the liquid cooling tube 221, thereby exchanging heat with the coolant. When the fan assembly 300 is working, external cold air can flow into the air duct from the air inlet 110, and then flow through the heat dissipation channel, thereby achieving heat exchange with the radiator 220, reducing the temperature of the radiator 220 and the circuit board 210, and ensuring the normal operation of the heat-generating component 211. The hot air after heat exchange can flow out from the air outlet 120 under the action of the fan assembly 300.

[0117] In this embodiment, since the direction of extension of the heat dissipating fins 222 is the same as the wind direction within the air duct, the cold air passing through the heat dissipating fins 222 can better remove heat, effectively improving heat dissipation efficiency. Furthermore, by providing the liquid cooling tube 221, the coolant within the liquid cooling tube 221 has good thermal conductivity, which can more quickly absorb and transfer heat, further improving heat dissipation efficiency.

[0118] In one example, by detecting the air temperature at the air outlet, the air temperature 1 cm away from the air outlet, the air temperature 2 cm away from the air outlet, the air speed at the air outlet, the air speed 1 cm away from the air outlet, and the air speed 2 cm away from the air outlet, it can be finally concluded that: when the spacing between adjacent heat dissipation fins is 6 mm, there are three fan modules, and the speed of the fan module is 4000 rpm, when the air inlet temperature of the computing device is 20°C, the average air outlet temperature is 39.6°C, the average temperature of heat-generating components such as chips is 63.57°C, and the air outlet of the computing device is relatively uniform.

[0119] In one embodiment, the radiator 220 may include a first radiator and a second radiator, the first radiator is arranged on the first surface, and the second radiator is arranged on the second surface, wherein along the arrangement direction of the multiple heat dissipation fins 222, the size of the second radiator 220 is larger than the size of the first radiator.

[0120] For example, during installation, the control module 400 can be first connected to the fan assembly 300 using fasteners such as screws, then the heat sink 220 can be connected to the bottom plate of the housing 100 using fasteners such as screws, and the fan assembly 300 can be connected to the bottom plate of the housing 100 using fasteners such as screws. Finally, the entire upper housing structure can be installed using fasteners such as screws.

[0121] Alternatively, first, the light-emitting component 191, light guide, and fan module 310 can be installed on the housing 100. The fan module 310 can be secured to the housing 100 using countersunk, pointed-tail self-tapping screws, the light-emitting component 191 can be glued to the housing 100, and the light guide can be secured to the housing 100 using countersunk, pointed-tail self-tapping screws. Then, install the button 170 and install foam in the mounting hole 150. The foam can be glued to the housing 100, and the button 170 can be heat-soldered to the housing 100 using a soldering iron. Then, use screws to attach the display assembly 721 to the second connecting plate 720 and the control module 400 to the first connecting plate 710. Then, connect the second connecting plate 720 to the top plate of the housing 100. Next, sequentially install the heat sink 220 and power board on the bottom plate of the housing 100. Finally, glue the first magnetic component 140 to the housing 100 and the screen cover 160 to the mounting hole 150. Then, the second magnetic member 611, such as a magnet, the inlet guide 610 and the outlet guide 620 are sequentially installed, and the bottom plate of the housing 100 is installed. Finally, the foot pad is attached to the bottom plate of the housing 100 to complete the assembly of the whole machine.

[0122] In this embodiment, by providing the above-mentioned first and second heat sinks, the heat on the first surface of the circuit board 210 can be effectively transferred to the first heat sink, and the heat on the second surface of the circuit board 210 can be effectively transferred to the second heat sink. In the process of wind blowing from the air inlet 110 of the air duct to the air outlet 120, the heat of the first and second heat sinks can be effectively removed, thereby achieving effective heat dissipation of the circuit board 210. In addition, since the first surface of the circuit board 210 is usually provided with a relatively tall functional module (such as a sensor, etc.), by making the size of the second heat sink larger than the size of the first heat sink, the smaller first heat sink can effectively avoid the heat, which is beneficial to the overall installation of the computing device 10. At the same time, the larger second heat sink has a better heat dissipation effect, thereby effectively reducing the temperature of the heat-generating component 211, ensuring the normal operation of the heat-generating component 211 and extending its service life.

[0123] In one embodiment, the second heat sink can be connected to the housing 100 by fasteners. In this way, the second heat sink can be used to support the weight of the circuit board 210 and the first heat sink. Since the size of the second heat sink is larger than that of the first heat sink, the second heat sink has a larger supporting area, which helps to disperse the weight of the circuit board 210 and the first heat sink, achieves uniform distribution of the load, reduces the risk of single-point concentration, and helps to improve the load-bearing capacity and vibration resistance of the entire computing device 10. Moreover, since the second heat sink is usually made of solid metal or other high-strength materials, it can provide better structural stability when used as a support structure. In addition, the second heat sink used as a support structure can effectively reduce the stress of the circuit board 210 when it is subjected to mechanical shock or vibration, reduce its force burden, and thus extend the service life of the circuit board 210.

[0124] In one embodiment, the top of the air inlet 110, the top of the air outlet 120, and the top of the heat sink 220 are flush, and the bottom of the air inlet 110, the bottom of the air outlet 120, and the bottom of the heat sink 220 are flush. This ensures that the air from the air inlet 11 to the air outlet 120 can flow through the heat sink 220, achieving effective heat dissipation for the circuit board 210. At the same time, the risk of air flowing into the gap between the heat sink 220 and the housing is reduced, preventing air leakage and crossflow.

[0125] It should be noted that in the above scheme, flush refers to a situation with a significant height difference, for example, a height difference of more than 2 cm between the two surfaces. Flush here can be understood as: the top of the air inlet 110, the top of the air outlet 120, and the top of the radiator 220 are in the same plane or have a certain deviation distance, but the visual effect is almost flush, and the bottom of the air inlet 110, the bottom of the air outlet 120, and the bottom of the radiator 220 are in the same plane or have a certain deviation distance, but the visual effect is almost flush; those skilled in the art can understand that the air inlet 110, the air outlet 120, and the radiator 220 in the above scheme may not be strictly flush due to screws, protective layer structure, reinforcement structure or paint, but as long as they are basically flush, they all fall within the scope of protection defined by "flush with each other" in this application.

[0126] In one embodiment, referring to Figures 3, 4, 21, and 22, the top plate of the housing 100 may be provided with reinforcing ribs 10a. The reinforcing ribs 10a are located between the fan assembly 300 and the circuit board 210, and the reinforcing ribs 10a cover a portion of the side surface of the heat sink 220. Thus, the reinforcing ribs 10a can not only improve the structural rigidity of the housing 100, but also prevent wind from passing through the gap between the heat sink 220 and the top plate of the housing 100, ensuring that wind can flow through the heat sink 220.

[0127] Other components of the computing device 10 in the above embodiment may adopt various technical solutions known to ordinary technicians in this field now and in the future, and will not be described in detail here.

[0128] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on this application.

[0129] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or to implicitly indicate the quantity of the technical features indicated. Thus, features defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0130] In this application, unless otherwise expressly specified or limited, terms such as "installed," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0131] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0132] The disclosure above provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described above. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0133] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily conceive of various modifications or substitutions within the technical scope disclosed in this application, and such modifications or substitutions should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A computing device, characterized in that include: A housing, wherein an air duct having an air inlet and an air outlet is defined in the housing; A circuit board is arranged in the air duct; The fan assembly is arranged in the air duct, and along the wind direction in the air duct, the fan assembly is located in the upwind direction, and the circuit board is located in the downwind direction; the fan assembly includes at least one fan module, and the axial direction of the fan module is parallel to the wind direction in the air duct.

2. The computing device according to claim 1, wherein: There are multiple air outlets; wherein, the extension direction of the multiple air outlets is the same; or, the multiple air outlets are divided into a first air outlet group and a second air outlet group, and the extension direction of the air outlets in the first air outlet group is different from the extension direction of the air outlets in the second air outlet group.

3. The computing device according to claim 1, wherein: Also includes: An air inlet guide is arranged on a side of the fan assembly away from the circuit board, and the air inlet is arranged on the air inlet guide; The air outlet guide is arranged on a side of the circuit board away from the fan assembly, and the air outlet is arranged on the air outlet guide.

4. The computing device according to claim 3, characterized in that The shell is provided with a first magnetic attraction member, the air inlet guide member and / or the air outlet guide member is provided with a second magnetic attraction member, and the first magnetic attraction member is magnetically connected to the second magnetic attraction member.

5. The computing device according to claim 1, wherein: Also includes: A control bracket connected to the housing; A control module is connected to the control bracket.

6. The computing device according to claim 5, characterized in that The control bracket includes a first connecting plate and a second connecting plate connected to each other, wherein the first connecting plate and the second connecting plate form an angle, the control module is connected to the first connecting plate, and the second connecting plate is connected to the housing.

7. The computing device according to claim 6, characterized in that The computing device further includes a display component connected to the second connecting board.

8. The computing device according to claim 5, characterized in that The control bracket is provided with a switch controller and a display switching controller, wherein the switch controller corresponds to a first button portion provided on the shell, and the display switching controller corresponds to a second button portion provided on the shell.

9. The computing device according to claim 1, wherein: The fan assembly further comprises a fan bracket, the fan module is arranged on the fan bracket, and the fan bracket is connected to the housing.

10. The computing device according to claim 9, characterized in that A vibration absorbing pad is arranged at the bottom of the fan bracket.

11. The computing device according to claim 9, characterized in that The fan bracket comprises: A mounting back, the fan module being connected to the mounting back; An installation bottom is arranged at the bottom of the fan module; The two mounting side parts are respectively located at two ends of the mounting bottom.

12. The computing device according to claim 11, characterized in that Also includes: A control module is electrically connected to the fan assembly and the circuit board, and the control module is connected to one of the two mounting side portions.

13. The computing device according to claim 11, characterized in that The mounting bottom comprises a bottom plate and a flange connected to the bottom plate, the flange is arranged close to the circuit board, and the flange is located between the bottom plate and the bottom plate of the shell.

14. The computing device according to claim 11, characterized in that The installation bottom defines a wiring groove, and the wiring groove is formed by a portion of the installation bottom being recessed toward the bottom plate of the housing.

15. The computing device according to claim 9, characterized in that Also includes: A first air duct member and a second air duct member connected to the fan bracket, wherein the first air duct member and the second air duct member are respectively located on two sides of the fan module in a radial direction; The bottom of the first air duct member and / or the second air duct member is bonded to the bottom plate of the housing through a flexible adhesive member.

16. The computing device according to claim 1, wherein: A filtering device is arranged between the fan assembly and the air inlet.

17. The computing device according to claim 1, wherein: At least one fan installation hole is formed on the shell; the at least one fan module is arranged in a one-to-one correspondence with the at least one fan installation hole, and each of the fan modules is connected to the shell.

18. The computing device according to claim 17, characterized in that It is characterized in that it also includes: a third air duct member and a fourth air duct member, the third air duct member and the fourth air duct member are respectively located on both sides of the fan module in the radial direction; the third air duct member and / or the fourth air duct member are connected to the top plate of the shell.

19. The computing device according to claim 17, wherein: It is characterized in that it also includes: a fifth air duct member and a sixth air duct member, the fifth air duct member and the sixth air duct member are respectively located on both sides of the fan module in the radial direction; the fifth air duct member and / or the sixth air duct member are connected to the bottom plate of the shell.

20. The computing device of claim 1, wherein: The housing also includes a mounting position in which a display assembly is mounted.

21. The computing device of claim 20, wherein: The computing device further comprises a pressing plate, wherein the pressing plate is fixedly connected to the shell, and the display assembly is pressed between the pressing plate and the inner wall of the shell.

22. The computing device of claim 1, wherein: The housing is provided with a mounting groove, and a light emitting element and / or a light guiding element is arranged in the mounting groove.

23. The computing device of claim 1, wherein: The circuit board comprises a first surface and a second surface which are arranged opposite to each other, and a plurality of heat generating components are arranged in an array on the first surface.

24. The computing device of claim 23, wherein: The areas of the multiple heat-generating components are equal, and / or the device types of the multiple heat-generating components are the same.

25. The computing device of claim 23, wherein: The computing device further includes a heat sink disposed on the first surface and / or the second surface.

26. The computing device of claim 25, wherein: The radiator includes a liquid cooling tube and a plurality of heat dissipating fins arranged at intervals, the extension direction of each of the heat dissipating fins is the same as the wind direction in the air duct, and the liquid cooling tube is passed through the plurality of heat dissipating fins along the arrangement direction of the plurality of heat dissipating fins.

27. The computing device of claim 25, wherein: The top plate of the housing is provided with a reinforcing rib, the reinforcing rib is located between the fan assembly and the circuit board, and the reinforcing rib covers a portion of the side surface of the radiator.

28. The computing device of claim 25, wherein: The heat sink includes a first heat sink and a second heat sink, wherein the first heat sink is disposed on a first surface and the second heat sink is disposed on a second surface; along an arrangement direction of a plurality of heat sink fins, a size of the second heat sink is larger than a size of the first heat sink.

29. The computing device of claim 28, wherein: The second heat sink is connected to the housing via fasteners.

30. The computing device of claim 29, wherein: The second heat sink is used to support the weight of the circuit board and the first heat sink.

31. The computing device of claim 25, wherein: The top of the air inlet, the top of the air outlet, and the top of the radiator are flush with each other, and the bottom of the air inlet, the bottom of the air outlet, and the bottom of the radiator are flush with each other.

32. The computing device according to any one of claims 1 to 31, characterized in that The air outlet is communicated with a heat recovery system.

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