Method and apparatus for examining cold plate during PCB design, and device and medium

Abstract

Disclosed in the present invention is a method for examining a cold plate during PCB design. The method comprises: acquiring CAD data, which comprises cold-plate design data and PCB design data, wherein the cold-plate design data comprises vector coordinates of a cold plate, different thickness values of the cold plate and the height of a lower bottom face of a cold-plate clearance region, and the PCB design data comprises graphic-related data of a device, pad related information of the device, hole layer information and line layer information; on the basis of the cold-plate design data, checking whether the width of the narrowest part of a cold plate strip meets design requirements; on the basis of the CAD data, checking whether devices above the cold plate meet design requirements; on the basis of the CAD data, checking whether devices below the cold plate meet design requirements, wherein a corresponding report is output when the corresponding design requirements in any instance of checking are not met; and finally, modifying a cold-plate design on the basis of all reports. By means of the present invention, a cold-plate design in PCB design can be automatically examined, thereby improving the comprehensiveness and accuracy of examination and the examination efficiency.

Description

Review methods, devices, equipment and media for cold plate in PCB design Technical Field

[0001] The present invention belongs to the field of PCB design and manufacturing, and in particular relates to a review method, device, electronic equipment and storage medium for a cold plate in PCB design. Background Art

[0002] Electronics designers often incorporate a cold plate when designing PCBs (Printed Circuit Boards). This plate primarily dissipates heat from components, supports the PCBA (Printed Circuit Board Assembly), and increases PCB strength. Currently, cold plates are designed for both DIP (Dip-In-Pack) and SMD (Surface-Mounted Device) components.

[0003] Cold plates designed for DIP plug-in components require the cold plate to be installed first, followed by the components. The cold plate is a metal plate that needs to be fixed snugly to the PCB. DIP plug-in components that require heat dissipation are mounted against the cold plate, similar to how DIP components are mounted on cold plate strips. TO-39 transistor components that require heat dissipation are mounted against the cold plate, similar to how TO components are mounted on cold plate strips. For components that don't require heat dissipation, such as capacitors and connectors, the cold plate has recessed areas to allow for proper installation, effectively facilitating the installation process without a cold plate.

[0004] Currently, there are two methods for generating cold plates for devices such as the DIP plug-in components mentioned above: 1. Designers manually draw areas based on the locations of components that need to dissipate heat, such as which component areas should be hollowed out, which areas are metal plates, and which plug-in hole areas should be hollowed out; 2. Automatically generate cold plates through software.

[0005] However, both methods can create cold plates that may present production problems. For example, components and pads on the PCB can cause collisions, interference, and repair issues after assembly. Currently, the industry relies on engineers manually comparing the cold plate to the PCB to identify potential issues, or these issues can only be identified during actual assembly. This review method is not only inefficient and inaccurate, but also can lead to omissions and other issues that go undetected.

[0006] Therefore, it is an urgent problem for those skilled in the art to propose a fast, efficient and accurate method for inspecting cold plates.

[0007] Summary of the Invention

[0008] To address the aforementioned issues in the prior art, the present invention provides a method, device, electronic device, and storage medium for reviewing cold plates in PCB design. The technical issues addressed by the present invention are achieved through the following technical solutions:

[0009] In a first aspect, an embodiment of the present invention provides a method for reviewing a cold plate in a PCB design, the method comprising:

[0010] Acquire CAD data; wherein the CAD data includes cold plate design data and PCB design data; the cold plate design data includes cold plate vector coordinates, different thickness values ​​of the cold plate, and the bottom surface height of the cold plate overhead area; the PCB design data includes device graphic related data, device pad related information, hole layer information, and circuit layer information;

[0011] According to the cold plate design data, check whether the width of the cold plate strip at its narrowest point meets the design requirements;

[0012] According to the CAD data, check whether the components above the cold plate meet the design requirements;

[0013] According to the CAD data, check whether the components under the cold plate meet the design requirements; wherein, if any check does not meet the corresponding design requirements, output a corresponding report,

[0014] The cold plate design was modified based on all reports.

[0015] In a second aspect, an embodiment of the present invention provides a device for reviewing a cold plate in a PCB design, the device comprising:

[0016] A CAD data acquisition module is configured to acquire CAD data; wherein the CAD data includes cold plate design data and PCB design data; the cold plate design data includes cold plate vector coordinates, different cold plate thickness values, and the bottom surface height of the cold plate overhead area; and the PCB design data includes device graphic related data, device pad related information, hole layer information, and circuit layer information.

[0017] A cold plate strip narrowest width review module, used to check whether the narrowest width of the cold plate strip meets the design requirements based on the cold plate design data;

[0018] A component review module above the cold plate, used to check whether the components above the cold plate meet the design requirements based on the CAD data;

[0019] A component review module under the cold plate is used to check whether the components under the cold plate meet the design requirements based on the CAD data; wherein, if any inspection fails to meet the corresponding design requirements, a corresponding report is output;

[0020] Cold plate design modification module, used to modify the cold plate design based on all reports.

[0021] In a third aspect, an embodiment of the present invention provides an electronic device, comprising a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other via the communication bus;

[0022] The memory is used to store computer programs;

[0023] The processor is configured to implement the steps of the cold plate review method in PCB design provided by an embodiment of the present invention when executing the program stored in the memory.

[0024] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the method for reviewing a cold plate in PCB design provided by the embodiment of the present invention are implemented.

[0025] Beneficial effects of the present invention:

[0026] Compared to current industry solutions, the solution provided by the embodiments of the present invention improves the accuracy and correctness of cold plate design through comprehensive automated inspection, avoiding the waste of resources caused by remaking cold plates after defects are discovered during production and use, thereby achieving cost savings. It also shortens the cold plate design cycle, reducing the time required for traditional manual cold plate inspections from several hours to a few minutes. This avoids omissions in manual inspections, improves inspection accuracy, reduces the number of inspectors, and saves labor costs. By transforming existing manual spot checks into comprehensive, automated inspections, engineers can promptly identify potential problems after the cold plate is installed on the PCB, helping electronics companies improve manufacturing quality and efficiency while reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] FIG1 is a schematic flow chart of a method for reviewing cold plates in PCB design according to an embodiment of the present invention;

[0028] FIG2 is another schematic flow chart of a method for reviewing cold plates in PCB design provided by an embodiment of the present invention;

[0029] FIG3 is a schematic diagram of a cold plate in an embodiment of the present invention;

[0030] FIG4( a ) is a schematic diagram of the shortest distance between two closed hollow areas on a cold plate in an embodiment of the present invention;

[0031] FIG4( b ) shows the shortest distance between a closed hollow area on the cold plate and the outer contour of the cold plate in an embodiment of the present invention.

[0032] FIG5 is a schematic diagram of a closed hollow area in which some cold strips are not inspected according to an embodiment of the present invention;

[0033] FIG6 is a schematic diagram of a process for checking whether the components above the cold plate meet the design requirements according to an embodiment of the present invention;

[0034] 7( a ) to 7 ( n ) are schematic diagrams showing whether a device pin pad of a device collides with a cold plate or not according to an embodiment of the present invention;

[0035] FIG8 is a schematic diagram illustrating determining the number of intersections between a center line connecting each set of pin pads matching at both ends of a device and the outline of the cold plate when the device is centered on the cold plate in accordance with an embodiment of the present invention;

[0036] FIG9( a ) and FIG9 ( b ) are two examples of situations in which the percentage difference between the two distances obtained by the pin pads in an embodiment of the present invention does not meet the design requirements;

[0037] FIG10 is a schematic diagram of a process for checking whether the components below the cold plate meet the design requirements according to an embodiment of the present invention;

[0038] FIG11 is a schematic diagram of a cold plate overhead area according to an embodiment of the present invention;

[0039] FIG12 is a schematic diagram of the distance between hollowed-out areas on a cold plate according to a specific embodiment of the present invention;

[0040] 13( a ) to 13 ( k ) are schematic diagrams showing different relative positions of the device and the cold plate contour edge in a specific embodiment of the present invention;

[0041] Figures 14(a) to 14(c) are schematic diagrams showing the distance between the pin of device V14 and its mounting hole in a specific embodiment of the present invention;

[0042] Figures 15(a) to 15(c) are schematic diagrams showing a device riding on a cold plate in a specific embodiment of the present invention;

[0043] Figures 16(a) to 16(b) are schematic diagrams showing the calculation of the horizontal distance between components in the overhead area of ​​the cold plate in a specific embodiment of the present invention;

[0044] FIG17 is a schematic structural diagram of a cold plate review device for PCB design provided by an embodiment of the present invention;

[0045] FIG18 is a schematic structural diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0046] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0047] In order to perform efficient, accurate, and comprehensive inspection of cold plate design in PCB design, embodiments of the present invention provide a method, device, electronic device, and storage medium for reviewing cold plates in PCB design.

[0048] It should be noted that the embodiment of the present invention provides a method for reviewing cold plate components in PCB design, and the execution entity may be a cold plate review device for PCB design, which may be run in an electronic device. The electronic device may be a server or a terminal device, but is not limited thereto.

[0049] In a first aspect, an embodiment of the present invention provides a method for reviewing a cold plate in a PCB design. Referring to FIG. 1 and FIG. 2 , the method may include the following steps:

[0050] S1, obtain CAD data;

[0051] It is understood by those skilled in the art that CAD data is data generated by PCB design. CAD data includes cold plate design data and PCB design data.

[0052] The cold plate design data includes the cold plate vector coordinates, different thickness values ​​of the cold plate, and the bottom surface height of the cold plate overhead area;

[0053] Among them, the cold plate vector coordinates include the vector coordinates of various positions on the cold plate; due to the need to build bridges to enhance the strength of the PCB board or support the installation of the upper PCB board, the cold plate may have a cold plate overhead area, which may cause the thickness values ​​of different positions of the cold plate to be different. The embodiment of the present invention can obtain the thickness values ​​of various positions of the cold plate for backup. The cold plate overhead area refers to a certain distance between the cold plate and the PCB below it. There may be devices and / or traces designed under the cold plate overhead area. In order to achieve avoidance, the cold plate thickness of the cold plate overhead area will be less than the cold plate thickness of the general area. In the embodiment of the present invention, in order to detect whether the avoidance design of this part of the cold plate and the devices and / or traces below is compliant, it is necessary to obtain the bottom surface height of the cold plate overhead area, that is, the vertical distance between the bottom surface of the cold plate overhead area and the PCB surface.

[0054] PCB design data includes device graphic related data, device pad related information, hole layer information, and circuit layer information;

[0055] The devices involved in the device graphic related data and the device pad related information may be stored in List B. It is understandable that List B includes all the devices on the PCB.

[0056] In the embodiment of the present invention, the device graphic related data and the device pad related information specifically include the following (1) to (5):

[0057] (1) Device information, including: device number, device type, device height, and device package type;

[0058] (2) Device pin information, including: number of device pins, device pin number, device pin size (if the device pin projection is a rectangle, the device pin size includes length and width; if the device pin projection is a circle, the device pin size includes radius), and device pin center coordinates;

[0059] (3) Device body information, including: device body center coordinates, device body vector coordinates;

[0060] (4) Device pin pad information, including: device pin pad number, device pin pad vector coordinates, and device pin pad center coordinates;

[0061] (5) Device appearance and name, etc.;

[0062] It should be noted that: the device body outline can be obtained according to the device body center coordinates and the device body vector coordinates; the device outline graphic can be obtained according to the device body outline and the device pin size.

[0063] The holes in the hole layer information include copper-plated holes and non-copper-plated holes; the hole layer information specifically includes: hole center coordinates, hole radius, and whether the hole is copper-plated (a hole with copper plating is a copper-plated hole, and a hole without copper plating is a non-copper-plated hole).

[0064] The circuit layer information includes the routing position (specifically including the starting position and the ending position), routing length, and routing width.

[0065] Of course, the cold plate design data and PCB design data in the CAD data are not limited to the above.

[0066] S2, according to the cold plate design data, check whether the width of the cold plate strip at its narrowest point meets the design requirements;

[0067] S3, check whether the components above the cold plate meet the design requirements according to the CAD data;

[0068] S4, check whether the components under the cold plate meet the design requirements according to the CAD data;

[0069] Among them, for the three aspects of inspection corresponding to S2, S3 and S4, a corresponding report is output when any inspection fails to meet the corresponding design requirements.

[0070] S5, the cold plate design was modified based on all reports.

[0071] The embodiment of the present invention performs three-aspect inspections based on CAD data, and can automatically inspect multiple design items, including the cold plate strip width design, the device design above the cold plate, and the device design below the cold plate. This ensures that all inspection items of the cold plate design are fully covered, while improving inspection efficiency and accuracy. Furthermore, during the three-aspect inspection process, if any inspection item fails to meet the corresponding design requirements, a corresponding report is output to record the specific location and content of the non-compliance with the design. Finally, the cold plate design is modified based on the records of all reports to avoid missed inspections. It should be noted that the above-mentioned three-aspect inspections in the embodiment of the present invention can be performed in parallel or sequentially, and the order of execution is not limited.

[0072] The following describes each inspection step separately.

[0073] In an optional implementation manner, S2 may include the following steps:

[0074] S21, determining the hollowed-out area on the cold plate and the outer contour of the cold plate according to the vector coordinates of the cold plate;

[0075] Because the cold plate vector coordinates include all coordinates on the cold plate outline, the cold plate's hollowed-out area and the cold plate's outer contour can be obtained based on the cold plate vector coordinates. For more information, see the cold plate schematic in Figure 3. The white box in Figure 3 represents the cold plate, and the black box represents the hollowed-out area.

[0076] S22, calculating the distance between the hollowed-out areas and the distance between the hollowed-out areas and the outer contour of the cold plate;

[0077] This step does not matter whether there are components installed on the cold plate area. It only checks the distance between the hollow areas on the cold plate and the distance between the hollow areas and the outer contour of the cold plate.

[0078] The distance between the hollowed-out areas on the cold plate refers to the distance between two closed hollowed-out areas on the cold plate, as shown in FIG4( a ). The figure shows the shortest distance between two closed hollowed-out areas on the cold plate by the AB line. However, it can be understood that there are multiple distances between the two closed hollowed-out areas in FIG4( a ).

[0079] The distance between the hollowed area and the outer contour of the cold plate refers to the distance between a closed hollowed area and the outer contour of the cold plate, as shown in Figure 4(b). The figure shows the shortest distance between a closed hollowed area on the cold plate and the outer contour of the cold plate with the EF connecting line. However, it can be understood that there are multiple distances between the closed hollowed area and the outer contour of the cold plate in Figure 4(b).

[0080] S23, obtaining the shortest distance among all calculated distances;

[0081] To simplify the representation, the shortest distance among all the calculated distances is represented as D1 距 .

[0082] Taking FIG4(a) and FIG4(b) as an example, the shortest distance is determined between distance AB and distance EF.

[0083] S24, determining whether the shortest distance is greater than a preset cold strip width threshold; if so, determining that the width of the cold strip at the narrowest point meets the design requirements; if not, determining that the width of the cold strip at the narrowest point does not meet the design requirements.

[0084] In the embodiment of the present invention, a preset cold strip width threshold may be set in advance based on design experience values, such as 2 mm, etc.

[0085] Determine whether the shortest distance obtained in S23 is greater than the preset cold plate width threshold; if so, determine that the width of the narrowest part of the cold plate meets the design requirements and do not output the report; if not, determine that the width of the narrowest part of the cold plate does not meet the design requirements and output the corresponding report, which contains the coordinate positions of the two points at the narrowest part of the cold plate that do not meet the design requirements, which can be obtained through the cold plate vector coordinates, and the shortest distance D1 calculated by the coordinate positions of these two points 距 .

[0086] It should be noted that if there are some protruding cold slats in a closed hollow area, they do not need to be checked and will not be reported. Please refer to Figure 5 for an explanation of this situation. This means that the distance CD in Figure 5 does not need to be checked and will not be reported.

[0087] The embodiment of the present invention checks the width of the cold plate at its narrowest point because if the cold plate is too narrow, its strength will be insufficient. Generally, the wider the cold plate width, the better, which can increase the strength and heat dissipation of the PCB. The reason why the widest point of the cold plate width is not checked is that not all components need to be installed on the cold plate; only some designated components need to be installed on the cold plate. In addition, the cold plate at the board frame may also be very wide, so there is no requirement for an upper limit on the width. By checking whether the width of the cold plate at its narrowest point meets the design requirements, the embodiment of the present invention can simultaneously ensure the strength and heat dissipation of the PCB.

[0088] In an optional implementation manner, S3 may include the following steps S31 to S33 . The process of inspecting the components above the cold plate may be understood with reference to FIG. 6 .

[0089] S31, based on the CAD data, check whether the minimum distance between the device pin pad and the cold plate meets the safety distance;

[0090] In an optional implementation manner, S31 may include the following steps S311 to S312:

[0091] S311, for each device, based on the device graphic related data and device pad related information in the PCB design data, check whether the device pin pad of the device collides with the cold plate; if so, output a corresponding report; if not, store the device in list B1;

[0092] Specifically, based on the PCB design data, device graphic related data and device pad related information can be obtained, and the device type, device shape name, device body center coordinates, device pin pad vector coordinates, device pin pad center coordinates, etc. can be obtained.

[0093] For each device, based on the above data, a collision algorithm can be used to determine whether the device pin pad of the device collides with the cold plate. If so, a corresponding report is output; if not, no report is output, and the device is stored in list B1. For the process of using the collision algorithm to determine whether the device pin pad of the device collides with the cold plate, please refer to the specific content of the existing collision algorithm, which will not be explained in detail here.

[0094] In order to understand whether the device pin pads of the device in the embodiment of the present invention collide with the cold plate, several schematic diagrams are given as examples. Please refer to Figures 7(a) to 7(n), where Figure 7(a) shows the situation where the device is riding on the cold plate and centered, in which case the device pin pads do not collide with the cold plate; Figure 7(b) shows the situation where the device is riding on the cold plate but not centered, in which case the device pin pads do not collide with the cold plate; Figure 7(c) shows the situation where the right half of the device body rides on the cold plate, in which case the device pin pads do not collide with the cold plate; Figure 7(d) shows the situation where the left half of the device body rides on the cold plate. Figure 7(e) shows the situation where the upper half of the device pins fall on the cold plate strip, in which case the device pin pads collide with the cold plate; Figure 7(f) shows the situation where the lower half of the device pins fall on the cold plate strip, in which case the device pin pads collide with the cold plate; Figure 7(g) shows the situation where the lower edge of the device body collides with the cold plate strip (introduction), in which case the device pin pads do not collide with the cold plate; Figure 7(h) shows FIG7 (i) shows the situation where the upper side of the device body collides with the cold plate strip (internal cutting), in which case the device pin pad and the cold plate do not collide; FIG7 (j) shows the situation where the lower side of the device body collides with the cold plate strip (external cutting), in which case the device pin pad and the cold plate collide; FIG7 (k) shows the situation where the device body is equal to the collision area (body is equal), in which case the device pin pad and the cold plate collide. There is no collision between the foot pad and the cold plate; Figure 7(l) shows the situation where the entire device falls on the collision area (the device body is small), in which case the device pin pad collides with the cold plate; Figure 7(m) shows the situation where the device body is covered on the cold plate, in which case the device pin pad does not collide with the cold plate; Figure 7(n) shows the situation of the collision area between the TO device body and the cold plate, in which case the device pin pad does not collide with the cold plate; P1, P2, P3, P4, P5, and VT14 are device numbers.

[0095] The report output in S311 contains the device pin position, device pin number, and device bit number of the device where the device pin pad collides with the cold plate.

[0096] S312, determine whether the minimum distance between the device pin pad of each device in list B1 and the cold plate is greater than or equal to a preset safety distance threshold. If not, output a corresponding report; if so, store the device in list B2.

[0097] In the embodiment of the present invention, a preset safety distance threshold may be determined based on design experience, for example, it may be 1 mm, etc.

[0098] The report output in S312 contains the device pin locations, device pin numbers, and device bit numbers of the devices whose minimum distance between the device pin pad and the cold plate is less than a preset safety distance threshold. The reports of S312 and S311 can be merged together.

[0099] S32, determining whether any of the devices whose minimum distance between the device pin pad and the cold plate meets the safety distance are mounted on the cold plate; if so, for the devices mounted on the cold plate, checking whether the cold plate design below meets the requirements;

[0100] Among the devices whose minimum distance between the device pin pad and the cold plate meets the safety distance, whether there is a device mounted on the cold plate includes:

[0101] For each device in List B2, the PCB design data is used to determine whether the device's shape name contains the TO field. If so, the device is determined to be a device mounted on a cold plate and is stored in List B3.

[0102] Specifically, if the TO field indicates a TO-39 transistor, etc., the device's outer shape name contains the TO field, indicating that the device is a plug-in device mounted on a cold plate (referring to a device with a hollowed-out area on the cold plate below the device body, or a plug-in device). Device graphics data and device pad information for the device can be obtained and stored in list B3.

[0103] In an optional embodiment, for a device mounted on a cold plate, checking whether the cold plate design below meets the requirements includes:

[0104] Step a1: For each component in List B3, obtain the component body outline from the PCB design data and perform a collision calculation with the cold plate. If no collision occurs, it is determined that there is no cold plate design under the component, and a corresponding report is output. If a collision occurs, it is determined that there is a cold plate design under the component, and the component is stored in List C1.

[0105] The collision calculation between the device body outline and the cold plate is implemented using a collision algorithm, which will not be explained here.

[0106] For plug-in components mounted on a cold plate, a cold plate is required underneath the component. If the device outline of a component in List B3 does not collide with the cold plate, it indicates that there is no cold plate designed underneath the component and the design requirement is not met. A corresponding report is output, containing the position number of the component whose outline does not collide with the cold plate. If the device outline of a component in List B3 does collide with the cold plate, it indicates that there is a cold plate designed underneath the component (as shown in Figure 7(m)). The component is then stored in List C1 and further inspection is required for the components in List C1 in step a2.

[0107] Step a2, determining whether the contact area percentage between the cold plate and the device body outline of each device in list C1 meets the corresponding design requirements; if not, outputting a corresponding report; if yes, storing the devices meeting the design requirements in list D1;

[0108] In an optional embodiment, in step a2, calculating the contact area percentage between the cold plate and the device body contour of the device includes:

[0109] Step b1, calculating the device body outline area of ​​the device according to the PCB design data;

[0110] Regarding step a2, the specific process of step b1 is: obtaining the device body outline based on the device body center coordinates and device body vector coordinates in the PCB design data, thereby calculating the device body outline area, which is represented by S1 for ease of understanding.

[0111] Step b2: calculating the collision area between the device body outline and the cold plate based on the CAD data;

[0112] Regarding step a2, the specific process of step b1 is: for each device in list C1, using a collision algorithm, calculate the collision area of ​​the device body outline of the device and the cold plate, expressed as area S.

[0113] The collision area is the intersection of the cold plate and the circular device body outline, that is, the shadow part of the collision in Figure 7(n). The polygonal area S of the cold plate hollowing area is T The calculation is as follows:

[0114] For any polygon, get the coordinates of each vertex A1(x1,y1),A2(x2,y2),…,A n (x n ,y n ), then the area of ​​this polygon is:

[0115] All vector coordinates of the device body outline and the cold plate can be obtained through PCB data and cold plate design data. By finding the intersection of the device body and the cold plate, the coordinates of each vertex of the outline edge of the intersection part (i.e., the collision area) can be obtained.

[0116] Using the above polygon area calculation formula, the polygon area of ​​the cold plate hollowing area can be obtained as S T , then the area S=S1-S T .

[0117] Step b3: Calculating the quotient of the collision area between the device body contour of the device and the cold plate and the area of ​​the device body contour of the device to obtain the contact area percentage between the cold plate and the device body contour of the device.

[0118] The percentage of contact area between the cold plate and the device body contour can be expressed as PP1, which is calculated as follows:

[0119] PP1 = (area S / device body outline area S1) × 100%;

[0120] For step a2, determining whether the contact area percentage between the cold plate and the device body contour of each device in list C1 meets the corresponding design requirements is to determine whether the PP1 calculated in step a2 is greater than or equal to a preset first PP1 threshold. The preset first PP1 threshold can be set based on design experience, such as 50%.

[0121] If the contact area percentage of the device body contour of the device in list C1 does not meet the corresponding design requirements, a corresponding report is output, which contains the position numbers of the devices that have collided and whose PP1 is less than the preset first PP1 threshold; if the contact area percentage of the device body contour of the device in list C1 meets the corresponding design requirements, the devices that meet the design requirements are stored in list D1.

[0122] It should be noted that, taking the preset first PP1 threshold of 50% as an example, if the PP1 is less than 50% as shown in Figure 7(m), a report is required, and it is regarded as if there is no cold plate under the device; if the PP1 is greater than or equal to 50% as shown in Figure 7(m), no report is made, indicating that there is a cold plate under the device.

[0123] Step a3: determine whether the device pins of each device in list D1 are centered in their mounting holes. If not, output a corresponding report; if so, determine that the cold plate design under the corresponding device meets the requirements.

[0124] In an optional embodiment, determining whether the device pin of each device in the list D1 is centered in its mounting hole includes:

[0125] Step c1: For each device in list D1, based on the CAD data, determine whether the device pin outline of the device collides with the inner side of the mounting hole in the corresponding cold plate hollow area on the same two-dimensional plane. If so, a corresponding report is output; if not, the device is stored in list E1.

[0126] For each device in the list D1, the device pin outline of the device can be obtained according to the device pin center and device pin size of the device in the PCB design data.

[0127] Based on the cold plate design data, the device pin mounting hole can be vertically projected to obtain the two-dimensional angle (i.e., the planar angle) of the device pin mounting hole. The center coordinates and radius of the device mounting hole are then used to obtain the inner contour of the mounting hole, thereby determining the inner side edge of the mounting hole corresponding to the hollowed-out area on the cold plate.

[0128] It can be understood that by vertically projecting the mounting hole of the device pin of the device so that the device pin outline of the device and the inner side edge of the mounting hole of the corresponding hollowed-out area on the cold plate are on the same two-dimensional plane, a collision algorithm can be used to determine whether the two collide on the same two-dimensional plane. If they collide, a corresponding report is output, which contains the device pin position, device pin number, and device bit number where the device pin collides with the inner side edge of the mounting hole; if there is no collision, no report is output, and the device is stored in list E1.

[0129] Step c2, calculating, within the same two-dimensional plane, the minimum distance between the device pin outline of each device in the list E1 and the inner side edge of the mounting hole of the corresponding hollowed-out area on the cold plate;

[0130] The minimum distance between the device lead outline of each device in Table E1 and the inner side of the mounting hole of the corresponding cold plate hollow area can be expressed as D 引脚 express.

[0131] 1) If the device pin outline is rectangular, D 引脚 The calculation formula is:

[0132] According to the device pin center coordinates (X, Y) and the device pin size (length L, width K), the device pin outline vertex coordinates, such as Z (X1, Y1), can be obtained.

[0133] According to the center distance calculation formula between two points, the distance between the center of the mounting hole and point Z is d 引脚 ;

[0134] Then D 引脚 = mounting hole radius - d 引脚 ;

[0135] 2) If the device pin outline is circular, D 引脚 The calculation formula is:

[0136] Based on the device pin size, the device pin radius can be obtained;

[0137] According to the calculation formula of the center distance between two points, the distance between the center of the mounting hole and the center of the device pin is d' 引脚 ;

[0138] Then D 引脚 = mounting hole radius - d' 引脚 -Device pin radius;

[0139] Step c3, determining whether the minimum spacing obtained for each device is greater than or equal to the minimum spacing threshold corresponding to the device; if not, determining that the device pin of the device is not centered in its mounting hole; if so, determining that the device pin of the device is centered in its mounting hole;

[0140] Among them, if the device pin outline of the device is circular, the corresponding minimum spacing threshold is half of the difference between the device mounting hole radius and the device pin radius; if the device pin outline of the device is rectangular, the corresponding minimum spacing threshold is half of the difference obtained by subtracting half of the diagonal of the device pin outline from the device mounting hole radius.

[0141] If it is determined that the device pins of the device are not centered in their mounting holes, a corresponding report is output, which contains the device pin positions, device pin numbers, and device bit numbers of the device pins and their corresponding mounting holes that do not meet the safety spacing requirements.

[0142] S33, determining whether there are any devices riding on the cold plate among the devices whose minimum distance between the device pin pad and the cold plate meets the safety distance. If so, for the devices riding on the cold plate, check whether the cold plate design below meets the requirements.

[0143] S33 and S32 can be executed in parallel.

[0144] In an optional embodiment, determining whether there is a device riding on the cold plate among the devices whose minimum distance between the device pin pad and the cold plate meets the safety distance includes:

[0145] For each device in List B2, use the PCB design data to determine whether the device type includes DIP and / or AXIAL. If so, the device is determined to be a device riding on a cold plate and is stored in List B4. If not, the device is determined not to be a device riding on a cold plate and is stored in List B5.

[0146] Among them, DIP stands for dual in-line package component, and AXIAL stands for axial plug-in component, both of which are devices riding on the cold plate.

[0147] If the device type of the device includes DIP and / or AXIAL, then the graphic-related data and device pad-related information of the device are acquired, and the device is stored in list B4; otherwise, the device is stored in list B5.

[0148] In an optional embodiment, for a device riding on a cold plate, checking whether the cold plate design below meets the requirements includes:

[0149] Step d1: For each component in List B4, the device body outline is obtained from the PCB design data and a collision calculation is performed with the cold plate. If no collision occurs, it is determined that there is no cold plate design under the component, and a corresponding report is output. If a collision occurs, it is determined that there is a cold plate design under the component, and the component is stored in List C2.

[0150] The collision calculation between the device body outline and the cold plate is implemented using a collision algorithm, which will not be explained here.

[0151] For devices mounted on a cold plate, a cold plate must be designed underneath the device. If the device outline of a device in List B4 does not collide with the cold plate, it indicates that there is no cold plate designed underneath the device and the design requirement is not met. A corresponding report is output, which contains the position numbers of the devices whose outlines do not collide with the cold plate. If the device outline of a device in List B4 does collide with the cold plate, it indicates that a cold plate is designed underneath the device and the device is stored in List C2. Devices in List C2 require further inspection in step d2.

[0152] Step d2, determining whether the contact area percentage between the cold plate and the device body outline of each device in list C2 meets the corresponding design requirements; if not, outputting a corresponding report; if yes, storing the devices that meet the design requirements in list D2;

[0153] Similar to step a2, in an optional embodiment, in step d2, calculating the contact area percentage between the cold plate and the device body contour of the device includes:

[0154] Step b1, calculating the device body outline area of ​​the device according to the PCB design data;

[0155] Step b2: calculating the collision area between the device body outline and the cold plate based on the CAD data;

[0156] Step b3: Calculating the quotient of the collision area between the device body contour of the device and the cold plate and the area of ​​the device body contour of the device to obtain the contact area percentage between the cold plate and the device body contour of the device.

[0157] The specific process of the above steps b1 to b3 can be found in the relevant description of step a2, which will not be repeated here.

[0158] For step d2, determining whether the contact area percentage between the cold plate and the device body contour of each device in list C2 meets the corresponding design requirements is to determine whether the PP1 calculated in step d2 is greater than or equal to a preset second PP1 threshold. The preset second PP1 threshold can be set based on design experience, such as 75%.

[0159] If the contact area percentage of the device body contour of the device in list C2 does not meet the corresponding design requirements, a corresponding report is output, which contains the position numbers of the devices that have collided and whose PP1 is less than the preset second PP1 threshold; if the contact area percentage of the device body contour of the device in list C2 meets the corresponding design requirements, the devices that meet the design requirements are stored in list D2.

[0160] It should be noted that, taking the preset second PP1 threshold of 75% as an example, if the collision area percentage PP1 in Figures 7(c) and 7(d) is less than 75%, a report is required, indicating that there is no cold plate under the device. If the collision area percentage PP1 in Figures 7(a), 7(b), 7(g), and 7(h) is greater than or equal to 75%, and the collision percentage in Figure 7(k) is equal to 100%, no report is made, indicating that a cold plate is present under the device. Furthermore, if the collision area percentage PP1 in Figures 7(c) and 7(d) is greater than 75%, no report is made either, indicating that a cold plate is present under the device.

[0161] Step d3, determining whether each component in list D2 is centrally installed, if not, outputting a corresponding report; if so, determining whether the cold plate design under the corresponding component meets the requirements.

[0162] In an optional implementation manner, determining whether each component in list D2 is centrally installed includes:

[0163] Step e1: For each device in list D2, determine whether the number of intersections between the center line of each set of pin pads matching the two ends of the device and the cold plate outline is equal to 2; if not, output a corresponding report; if equal, store the device in list E2;

[0164] For the devices in List D2, the center line of each matching set of pin pads on either side of the device refers to the pairwise matching distance between the pin pads on either side of the device. Refer to Figure 8. The thick black rectangle in Figure 8 represents one of the outlines of cold plate A. The thin black rectangle represents the device body outline in List D2. The small square represents device pin pad 1, and the small circles represent the remaining device pin pads. Pin pad 1 and the pin pad on the opposite side are the matching set of pin pads on both sides of the device. The remaining matching sets of pin pads are explained in detail in the same way. The center line connecting the pin pads P1 and P2 intersects the cold plate outline at two points.

[0165] For each device in List D2, if the center line connecting each set of matching pin pads at both ends of the device intersects the cold plate contour at two points, it means that the pin pads on both sides of the device are located on the two outer sides of the cold plate contour, respectively, and the device is riding on the cold plate strip. Such devices are stored in list E2 for further inspection. If the number of intersections between the centerline of each pair of pin pads on both ends of the device and the cold plate outline is not equal to 2, it may be that one or both of the device's pin pads are within the cold plate outline (when both pin pads are within the cold plate outline, the number of intersections between the centerline of each pair of pin pads on both ends of the device and the cold plate outline is equal to 0; when one pair of pin pads is within the cold plate outline, the number of intersections between the centerline of each pair of pin pads on both ends of the device and the cold plate outline is equal to 1). Alternatively, the device is twisted on the cold plate, causing the device's centerline along the pad arrangement to be at an angle to the axis of the cold plate area, which should be parallel to the device, causing some pin pads to be within the cold plate outline. These situations do not meet the design requirement of "device riding on the cold plate strip." A corresponding report is then output, containing the device indexes for which the number of intersections between the centerline of each pair of pin pads on both ends of the device and the cold plate outline is not equal to 2.

[0166] In step e2, for each device in list E2, the distances between the two intersection points of the center line connecting each set of matching pin pads at both ends and the cold plate outline are calculated, and the distances between each intersection point and the center of the nearest pin pad are determined. A determination is then made as to whether the percentage difference between the two distances obtained for each set of pin pads is less than or equal to a preset distance difference percentage threshold. If not, it is determined that the corresponding device in list D2 is not mounted centered. If so, it is determined that the corresponding device in list D2 is mounted centered.

[0167] Specifically, see Figure 8. If the line connecting the center point P1 of the device pin pad and the center point P2 of the device pin pad intersects the outline of the cold plate at two points, which are marked as J1 and J2 respectively, the distance from point P1 to point J1 is calculated as P1J1, that is, D3 距 , calculate the distance from point P2 to point J2 as P2J2, that is, D4 距 ;

[0168] To calculate D3 距 and D4 距 As an example, the distance difference percentage is calculated as follows:

[0169] In principle, the smaller PP2 is, the better, and the closer it is to 0, the better. This means that D3 距 and D4 距 Close to, meeting the requirement of centering the device.

[0170] In practice, the preset distance difference percentage threshold can be set as needed, for example, it can be 20%.

[0171] Determine whether PP2 is less than or equal to the preset distance difference percentage threshold. If not, indicate D3 距 and D4 距 If the deviation is large and does not meet the requirement of device centering, a corresponding report will be output. The report contains the device number, device pin pad center coordinates, and the group of pin pads with the largest PP2, where the reported distance difference percentage PP2 is greater than or equal to the preset distance difference percentage threshold. As shown in Figure 9(a), the device is mounted on the cold plate, but the D3 of each group of pin pads is greater than or equal to the preset distance difference percentage threshold. 距 and D4 距 The deviation is large, and the device rides on the cold plate but is not centered. As shown in Figure 9(b), the device is not centered on the cold plate, and the cold plate is polygonal. The group of pin pads with the largest PP2 is the group of pin pads P1 and P2.

[0172] It should be noted that, taking the preset distance difference percentage threshold of 20% as an example, if the collision requirement of PP1 calculated in step d2 is greater than or equal to 75% in Figure 7(c) and Figure 7(d), and the device belongs to the device in list D2, the center lines of multiple groups of pin pads at both ends of the device are connected (the pins located on both sides of the device body with the shortest distance between each other are grouped as a group, as shown in Figure 8, the distance between P1 and P2 is the shortest, so the connection is a group), among which three groups of line segments have two intersections with the outline of the cold plate, and one group of lines connecting the center lines of the pin pads at both ends has no intersection with the outline of the cold plate, then a report is required.

[0173] If the PP2 of Figure 7(a) and Figure 7(b) is less than or equal to 20%, no report is made; if the PP2 of Figure 7(a) and Figure 7(b) is greater than 20%, a report is required; if the PP2 of Figure 7(k) is equal to 0, no report is made.

[0174] In an optional implementation manner, S4 may include the following steps S41 to S49 . The process of inspecting the components below the cold plate can be understood with reference to FIG. 10 .

[0175] S41, determining the cold plate overhead area according to the cold plate design data;

[0176] Based on the cold plate design data, the cold plate thickness and cold plate vector coordinates are obtained to determine the location where the cold plate thickness is relatively small. This allows the cold plate overhead area to be determined. Refer to Figure 11 for more information. In Figure 11, the parallelogram represents the device, the shaded area represents the normal cold plate, the thick horizontal line in the center and above represents the thinned cold plate, and a, b, and c represent the distance from the device to the cold plate. After determining the cold plate overhead area, the planar dimensions of the cold plate overhead area, such as length and width, can be determined.

[0177] From a three-dimensional perspective, for cold plates with inconsistent thickness, there are devices (such as SMD devices) placed underneath and / or designed with traces, resulting in an overhead cold plate area. From an electrical clearance perspective, it is necessary to determine whether the devices and / or traces below the cold plate and their surroundings interfere with the overhead cold plate area.

[0178] S42, based on the PCB design data, screen out the SMD components from the list B5 and calculate the outline of the SMD components;

[0179] Based on the PCB design data, SMD devices can be filtered out from List B5 based on the device package type (if the device package type contains the SMD field, it means that the device is an SMD device). The device graphic-related data and device pad-related information are obtained, and the device type, device package type, device body center coordinates, device height, device body vector coordinates, etc. are obtained, thereby calculating the outline of the SMD device.

[0180] S43, calculating the routing profile based on the circuit layer information in the PCB design data;

[0181] Specifically, the routing position (including the starting position and the ending position), the routing length and the routing width can be obtained according to the circuit layer information, and the routing profile can be obtained.

[0182] S44, obtaining a vertical projection area of ​​the cold plate overhead area on the PCB board, and determining whether the projection area collides with the outline of the SMD device and / or the trace outline;

[0183] This step is to determine whether the vertical projection area of ​​the cold plate overhead area on the PCB board collides with the area corresponding to the outline of the SMD device and / or the trace outline.

[0184] Specifically, this can be achieved using a collision algorithm. If the projected area does not collide with the outline of the SMD device and / or the trace outline, it means that there are no SMD devices and / or traces under the cold plate overhead area, and no further inspection is required, and no report output is required. If the projected area collides with the outline of the SMD device and / or the trace outline, it means that there are SMD devices and / or traces under the cold plate overhead area. A corresponding report will be output, which contains the device position number and / or trace position that collides with the projection area perpendicular to the cold plate overhead area on the PCB board, and further judgment is required to determine whether the design is compliant.

[0185] S45, if the projection area collides with the outline of the SMD device and / or the trace outline, it is determined that there are SMD devices and / or traces in the projection area; for the SMD devices and / or traces in the projection area, it is determined whether they collide with the outline of the cold plate overhead area;

[0186] For SMD devices and / or traces in the projection area, determine whether they collide with the outline of the cold plate overhead area. If not, determine whether the distance between the device and / or trace and the cold plate meets the safety spacing requirements.

[0187] S46, if a collision occurs, output a corresponding report;

[0188] If the SMD components and / or traces in the projected area collide with the outline of the cold plate overhead area, it means that there is no electrical clearance, interference has occurred, and it does not meet the design requirements. A corresponding report is then output, which contains the component position numbers and / or trace positions that collide with the outline of the cold plate overhead area.

[0189] S47, if no collision occurs, determine whether the distance between the SMD components and / or traces in the projection area and the cold plate meets the corresponding safety spacing requirements;

[0190] If the SMD components and / or traces in the projected area do not collide with the outline of the cold plate overhead area, it indicates that there is electrical clearance, but further determination is required to determine whether the clearance meets the design requirements.

[0191] In an optional embodiment, determining whether the distance between the SMD device and / or trace in the projection area and the cold plate meets the corresponding safety spacing requirement includes:

[0192] Determine whether the vertical distance between the SMD devices and / or traces in the projection area and the cold plate meets the corresponding vertical safety distance requirements, and determine whether the horizontal distance between the SMD devices and / or traces in the projection area and the cold plate meets the corresponding horizontal safety distance requirements.

[0193] Specifically,

[0194] For the vertical direction: Determine whether the vertical distance between the top of the SMD devices and / or traces in the projection area and the overhead area of ​​the cold plate, that is, the height difference between the bottom surface of the overhead area of ​​the cold plate and the SMD devices, meets the corresponding vertical safety distance requirements. The vertical safety distance can be required to be no less than 2mm. If the vertical distance between the top of the SMD devices and / or traces in the projection area and the overhead area of ​​the cold plate meets the corresponding vertical safety distance requirements, no report output is required. If not, a corresponding report output is required.

[0195] Horizontally: Determine whether the horizontal distance between the SMD device and / or trace within the projection area (referring to the front and back or left and right) and the outline of the cold plate overhead area, i.e., the horizontal distance between the SMD device or trace outline and the cold plate overhead area projection outline, meets the corresponding horizontal safety spacing requirements. The horizontal safety spacing may be a requirement of no less than 2mm. If the horizontal distance between the SMD device and / or trace within the projection area and the cold plate meets the corresponding horizontal safety spacing requirements, no report output is required. If not, a corresponding report output is required. The horizontal distance between the SMD device or trace outline and the cold plate overhead area projection outline can be determined by calculating the distance between the two points closest to each other based on the SMD device outline or trace position, length, width, and cold plate vector coordinates.

[0196] S48, if not, output the corresponding report;

[0197] The report in S48 contains the vertical distance between the top of the SMD device and / or trace and the cold plate overhead area, and the horizontal distance between the surrounding area (front and back or left and right) of the SMD device and / or trace and the outline of the cold plate overhead area, which do not meet the safety spacing requirements. The device position number and / or trace position.

[0198] S49, if compliant, determines that the components below the cold plate meet the design requirements.

[0199] After S41 to S49 , if the corresponding design requirements are met, it is determined that the components below the cold plate meet the design requirements.

[0200] S5, the cold plate design was modified based on all reports.

[0201] After S1 to S4, the embodiment of the present invention can summarize and record the information related to the cold plate that does not meet the design requirements, and modify the cold plate design in S5. After the modification is completed, the above three checks can be repeated until no more reports are output. At this point, the cold plate design meets the requirements and can be used as a standard cold plate.

[0202] Compared to current industry solutions, the solution provided by the embodiments of the present invention improves the accuracy and correctness of cold plate design through comprehensive automated inspection, avoiding the waste of resources caused by remaking cold plates after defects are discovered during production and use, thereby achieving cost savings. It also shortens the cold plate design cycle, reducing the time required for traditional manual cold plate inspections from several hours to a few minutes. This avoids omissions in manual inspections, improves inspection accuracy, reduces the number of inspectors, and saves labor costs. By transforming existing manual spot checks into comprehensive, automated inspections, engineers can promptly identify potential problems after the cold plate is installed on the PCB, helping electronics companies improve manufacturing quality and efficiency while reducing production costs.

[0203] To facilitate understanding of the embodiments of the present invention, a specific embodiment is given below to illustrate the specific implementation process of the cold plate review method for PCB design. The specific cold plate review process is divided into the following steps:

[0204] Step Ⅰ: Check whether the width of the cold plate at its narrowest point meets the design requirements;

[0205] This step corresponds to step S2. The data source takes the cold plate as an example.

[0206] By reading the cold plate design data and performing preprocessing, the cold plate vector coordinates are obtained, and the hollowed area on the cold plate and the outer contour of the cold plate are obtained.

[0207] 1. Check the shortest distance between the two hollowed-out areas on the cold plate and the shortest distance D1 between the hollowed-out area and the outer contour of the cold plate 距 Whether the requirement is met, that is, whether it is greater than the preset cold plate strip width threshold of 2mm, taking Figure 12 as an example, Figure 12 is a schematic diagram of the distance between the hollowed areas on the cold plate.

[0208] Based on the vector coordinates of the hollowed-out area A1 on the cold plate, the position closest to the edge of the hollowed-out area A2 on the cold plate is obtained as A1 (48.1432, 62.9920). Based on the vector coordinates of the hollowed-out area A2 on the cold plate, the position closest to the edge of the hollowed-out area A1 on the cold plate is obtained as A2 (52.7785, 63.1944). The vector distance between A1 and A2 is d1 = 4.6397 mm. d1 > 2 mm, which meets the design requirements, so no report is made.

[0209] According to the vector coordinates of the hollowed-out area A1 on the cold plate, the position A4 (42.4153, 64.4911) closest to the edge of the hollowed-out area A3 on the cold plate is obtained. According to the vector coordinates of the hollowed-out area A3 on the cold plate, the position A3 (40.9429, 64.6133) closest to the edge of the hollowed-out area A1 on the cold plate is obtained. The vector distance d2 between A3A4 is 1.4774 mm. If d2 is less than 2 mm, it does not meet the design requirements and needs to be reported. The report information is shown in Table 1.

[0210] According to the vector coordinates of the hollowed-out area A3 on the cold plate, the position A6 (39.3985, 66.8140) closest to the edge of the hollowed-out area A4 on the cold plate is obtained. According to the vector coordinates of the hollowed-out area A4 on the cold plate, the position A5 (39.6509, 67.9522) closest to the edge of the hollowed-out area A3 on the cold plate is obtained. The vector distance d3 between A5 and A6 is 1.1658 mm. If d3 is less than 2 mm, it does not meet the design requirements and needs to be reported. The report information is shown in Table 1.

[0211] The vector distance d4 between A7 and A8 is not calculated because d4 is the distance between the cold plate strips in a closed hollow area on the cold plate and does not need to be checked.

[0212] According to the vector coordinates of the hollowed-out area A2 on the cold plate, the position A9 (58.7785, 64.1944) closest to the outer contour of the cold plate is obtained. According to the vector coordinates of the outer contour of the cold plate, the position A10 (59.7345, 64.1944) closest to the edge of the hollowed-out area A2 on the cold plate is obtained. The vector distance d5 between A9 and A10 is 0.956 mm. If d5 is less than 2 mm, it does not meet the design requirements and needs to be reported. The report information is shown in Table 1.

[0213] Taking Figure 12 as an example, the report results are as follows:

[0214] Table 1 Inspection report contents of the narrowest width of cold plate strips

[0215] In Table 1 and subsequent tables, the result of NG indicates that the design requirements are not met.

[0216] Step II: Check whether the components above the cold plate meet the design requirements

[0217] The data source of this step takes the cold plate and PCB board data as an example, corresponding to step S3.

[0218] The cold plate vector coordinates are obtained by reading the cold plate design data and performing preprocessing.

[0219] By reading and preprocessing the PCB design data, the device graphic related data and the device pad related data are obtained and stored in list B.

[0220] List B is represented as (N4, N5, N8, D1, D2, D3, D10, D16, D18, V14, V15, ...), which contains device graphic related data and device pad related information.

[0221] By reading the PCB design data and performing preprocessing, the hole layer information such as hole position coordinates, hole radius size, etc. is obtained.

[0222] 1. Check the safe distance between the device pin pad and the cold plate

[0223] (1) Check all devices in List B:

[0224] (N4, N5, N8, D1, D2, D3, D10, D16, D18, V14, V15, …), perform collision calculation between the device pin pads of the devices in List B and the cold plate.

[0225] (2) Device D2

[0226] Figures 13(a) to 13(k) illustrate different situations in which the device and the cold plate edge are positioned relative to each other. Figure 13(a) shows the device sitting in the middle of the cold plate strip; Figure 13(b) shows the device sitting on the cold plate strip but not centered; Figure 13(c) shows the device's length coinciding with the cold plate; Figure 13(d) shows the device resting entirely on the cold plate; Figure 13(e) shows the device and some of its pins resting on the cold plate; Figure 13(f) shows some of its pins resting on the cold plate; Figure 13(g) shows some of its pins not resting on the cold plate strip; Figure 13(h) shows the device not resting on the cold plate strip; Figure 13(i) shows the device not touching the cold plate outline; Figure 13(j) shows the device touching the cold plate outline; and Figure 13(k) shows the device resting below the cold plate's overhead area.

[0227] The center coordinates of the first pin pad D2.1 of device D2 (D2 represents the device number; 1 represents the device pin pad number) are (18.6321, 42.0531), and its pin pad vector coordinates are (18.6321, 42.5531), (18.6321, 41.5531), (19.1321, 42.0531), and (18.1321, 42.0531).

[0228] Obtaining a pin pad outline of the first pin pad D2.1 of the device D2 according to the pin pad center coordinates and the pin pad vector coordinates of the first pin pad D2.1 of the device D2;

[0229] Perform collision calculation on the outline of the first pin pad D2.1 of the device D2 and the cold plate, and if it is found that the first pin pad D2.1 of the device D2 collides with the cold plate, report the result accordingly;

[0230] Similarly, if the second pin pad D2.2 of device D2 collides with the cold plate, the result is reported accordingly.

[0231] Similarly, if the third pin pad D2.3 of device D2 collides with the cold plate, the result is reported accordingly.

[0232] Similarly, if the fourth pin pad D2.4 of the device D2 collides with the cold plate, the result is reported accordingly.

[0233] Similarly, the fifth pin pad D2.5 of the device D2 is obtained. If the pin pad of the fifth pin pad D2.5 of the device D2 does not collide with the cold plate, the result will not be reported.

[0234] Similarly, the sixth pin pad D2.6 of the device D2 is obtained. If the sixth pin pad D2.6 of the device D2 does not collide with the cold plate, the result is not reported.

[0235] Similarly, the seventh pin pad D2.7 of the device D2 is obtained. If the seventh pin pad D2.7 of the device D2 does not collide with the cold plate, the result will not be reported.

[0236] Similarly, if the eighth pin pad D2.8 of the device D2 does not collide with the cold plate, the result will not be reported.

[0237] Since some pin pads of device D2 collide with the cold plate, it needs to be reported. The report information is shown in Table 2.

[0238] The collision calculation method for other devices D1, D3, D10, D16, D18, N4, N5, N8, V14, V15 is the same as that for D2.

[0239] If the pin pads of the device D16 collide with the cold plate, it needs to be reported. The report information is shown in Table 2.

[0240] If all the pin pads of device D1 collide with the cold plate, it needs to be reported. The report information is shown in Table 2.

[0241] If all the pin pads of device D3 do not collide with the cold plate, no report is made and the device is placed in list B1 (D3, ...);

[0242] If all the pin pads of device D10 do not collide with the cold plate, no report is made and the device is placed in list B1 (D3, D10, ...);

[0243] If all the pin pads of device D18 do not collide with the cold plate, no report is made and the device is placed in list B1 (D3, D10, D18, ...);

[0244] If all the pin pads of device N4 do not collide with the cold plate, no report is made and the device is placed in list B1 (D3, D10, D18, N4, ...);

[0245] If all the pin pads of device N5 do not collide with the cold plate, no report is made and the device is placed in list B1 (D3, D10, D18, N4, N5, ...);

[0246] If all the pin pads of device N8 do not collide with the cold plate, no report is made and the device is placed in list B1 (D3, D10, D18, N4, N5, N8, ...);

[0247] If all the pin pads of device V14 do not collide with the cold plate, no report will be made and the pins will be placed in list B1 (D3, D10, D18, N4, N5, N8, V14, ...).

[0248] If all the pin pads of device V15 do not collide with the cold plate, no report will be made and the device will be placed in list B1 (D3, D10, D18, N4, N5, N8, V14, V15, ...).

[0249] (3) Determine whether the minimum distance between the device pin pads and the cold plate of the devices in List B1 (D3, D10, D18, N4, N5, N8, V14, V15, ...) meets the safety distance requirement, that is, whether it is greater than or equal to the preset safety distance threshold of 1mm. For simplicity, the preset safety distance threshold of 1mm is based on D2 安 express.

[0250] For device N8 (taking Figures 13(a) to 13(k) as an example), according to the center coordinates of the first pin pad N8.1 of device N8 (48.1432, 62.9920) and its pin pad vector coordinates (48.1432, 63.4920), (48.1432, 62.4920), (48.6432, 62.9920), (48.1432, 62.9920), we can get the device N8. The closest position between the outline of the first pin pad N8.1 and the edge of the cold plate outline is Y1 (48.1432, 63.4920); according to the cold plate vector coordinates, the closest position between the cold plate outline and the first pin N8.1 of the device N8 is Y2 (48.1432, 64.5920), and the closest distance between the first pin pad N8.1 and the cold plate is obtained, that is, the vector distance d5 between Y1Y2 = 1.1mm> 1mm, that is, d5> D2 安 ,It complies with the safety distance requirements, so no report is made;

[0251] Similarly, the same applies to the other pin pads of device N8:

[0252] The shortest distance between the second pin pad N8.2 of device N8 and the cold plate is obtained, that is, the vector distance between Y3Y4 d6=1.1mm>1mm, that is, d6>D2 安 , it complies with the safety distance requirements, so no report is made;

[0253] The shortest distance between the third pin pad N8.3 of the device N8 and the cold plate is obtained, that is, the vector distance between Y5Y6 d7=1.1mm>1mm, that is, d7>D2 安 ,It complies with the safety distance requirements, so no report is made;

[0254] The shortest distance between the fourth pin pad N8.4 of the device N8 and the cold plate is obtained, that is, the vector distance between Y7Y8 is d8=1.1m>1mm, that is, d8>D2 安 ,It complies with the safety distance requirements, so no report is made;

[0255] The shortest distance between the fifth pin pad N8.5 of the device N8 and the cold plate is obtained, that is, the vector distance between Y9Y10 d9=1.1mm>1mm, that is, d9>D2 安 , it complies with the safety distance requirements, so no report is made;

[0256] The shortest distance between the sixth pin pad N8.6 of the device N8 and the cold plate is obtained, that is, the vector distance between Y11Y12 is d10=1.1mm>1mm, that is, d10>D2 安 ,It complies with the safety distance requirements, so no report is made;

[0257] The shortest distance between the seventh pin pad N8.7 of the device N8 and the cold plate is obtained, that is, the vector distance between Y13Y14 d11=1.1mm>1mm, that is, d11>D2安 ,It complies with the safety distance requirements, so no report is made;

[0258] The shortest distance between the eighth pin pad N8.8 of the device N8 and the cold plate is obtained, that is, the vector distance between Y15Y16 d12=1.1mm>1mm, that is, d12>D2 安 ,It complies with the safety distance requirements, so no report is made;

[0259] Since the distance between each pin pad of device N8 and the cold plate is 1.1mm, the closest distance between the pin pad of device N8 and the cold plate is 1.1mm, which is greater than 1mm and meets the safety distance requirement, so no report is made.

[0260] Similarly, the calculation method for the closest distances between the device pin pads and the cold plate for other devices D3, D10, D18, N4, N5, V14, and V15 is the same. The results show that the closest distances between the pin pads and the cold plate for devices D3, D10, D18, N4, V14, and V15 are all greater than 1 mm, meeting the safety spacing requirements. Therefore, they are not reported and are placed in List B2 (D3, D10, D18, N4, N5, N8, V14, V15, ...).

[0261] Taking Figures 13(a) to 13(k) as an example, the reported results are as follows:

[0262] Table 2 Contents of the inspection report on the safety distance between the device pin pad and the cold plate

[0263] 2. Check if there is a cold plate under the specific device

[0264] (1) Check the components mounted on the cold plate

[0265] (1.1) Check if there is a cold plate under the device mounted on the cold plate

[0266] (1.1.1) Check list B2 (D3, D10, D18, N4, N5, N8, V14, V15, ...). Device V14 and device V15 have the device form factor names TO-39 and TO-5, respectively, contain the TO field, and their device package type is THT (through-hole device). Filter them out and place the TO devices that meet the conditions in list B3 (V14, V15, ...).

[0267] (1.1.2) Perform collision calculations on the device body outlines of the devices in the device B3 list and the cold plate to determine whether there is a cold plate underneath. Specifically, take Figures 13(a) to 13(k) as an example:

[0268] (1.1.3) The device body center coordinates of device V14 are (65.5632, 34.3374), and the device body vector coordinates are (65.5632, 38.9074), (65.5632, 29.7674), (70.1332, 34.3374), and (60.9932, 34.3374). Based on the device body center coordinates and device body vector coordinates, the device body contour can be obtained, and it can be concluded that the device body contour is circular.

[0269] The collision calculation between the device V14 body outline and the cold plate shows that the device V14 collides with the cold plate, indicating that there is a cold plate under the device.

[0270] Similarly, it is concluded that the outline of the device V15 is circular, and the device V15 collides with the cold plate, indicating that there is a cold plate under the device;

[0271] Devices V14 and V15 are placed in the C1 list (V14, V15, ...) as collision devices. The contact area percentage between the cold plate and the body contours of devices V14 and V15 is determined to see if it meets the design requirements (the contact area percentage must be greater than or equal to the preset first PP1 threshold of 50%).

[0272] (1.1.4) According to all the vector coordinates of the device V14 and the cold plate in List C1, obtain the vector coordinates of the cold plate in the collision area and the diameter of the circular body of the V14 device (D T =9.14mm), as shown in Figure 7(n), the shaded area is the collision area, that is, the area S = S1-S T The coordinates of each vertex of the cold plate hollowing area contour edge are obtained as AT1 (125.362, 71.110), AT2 (125.562, 70.809), AT3 (125.762, 70.609), ..., AT n (x n ,y n ),…….

[0273] By obtaining the coordinates of each vertex of the V14 collision area contour edge AT1 (125.362, 71.110), AT2 (125.562, 70.809), AT3 (125.762, 70.609), ..., AT n (x n ,y n ), using the polygon area calculation formula: The calculated polygonal area of ​​the cold plate hollowing area is: S T =30.526.

[0274] (1.1.5) The radius of the circular body of the device V14 is r = DT / 2=4.57, and its main body area S1=π*r 2 =π*4.57*4.57≈65.58, that is, the device V14 body area S1=65.58.

[0275] Thus we get the area S = S1-S T =65.58-30.526=35.054;

[0276] According to the collision area percentage formula:

[0277] PP1 = (area S / device body area S1) x 100% = 35.054 / 65.58 x 100% = 53.45%;

[0278] (1.1.6) Similarly, the calculation method for the polygonal area of ​​the cold plate hollowing area of ​​device V15 is the same as that of the cold plate hollowing area of ​​device V14. The polygonal area of ​​the cold plate hollowing area is: S T =30.526.

[0279] The diameter of the circular body of the device V15 is (D T =8.14mm), its radius is r=D T / 2=4.07, and its main body area S1=π*r 2 =π*4.07*4.07≈52.04, that is, the device V14 body area S1=52.04.

[0280] Thus we get the area S = S1-S T =52.04-30.526=21.514;

[0281] According to the collision area percentage formula:

[0282] PP1 = (area S / device body area S1) x 100% = 21.514 / 52.04 x 100% = 41.34%;

[0283] (1.1.7) Taking the figures in FIG. 13 as an example, the body of device V14 collides with the cold plate, and the collision area is 35.054, that is, the collision area percentage PP1 = 53.45%, which is greater than the preset first PP1 threshold of 50%, meeting the design requirements. Therefore, device V14 does not need to be reported and is stored in list D1 (V14, ...).

[0284] The body of device V15 collides with the cold plate. The collision area is 21.514, that is, the collision area percentage PP1 = 41.34%, which is less than 50% and does not meet the design requirements. Therefore, device V15 needs to be reported. The report information is shown in Table 3.

[0285] Table 3 Inspection report contents of whether there is a cold plate under the device mounted on the cold plate

[0286] (1.2) Check whether the pins of the device mounted on the cold plate are centered in their mounting holes

[0287] (1.2.1) Check that the device pins of device V14 in List D1 (V14, ...) are centered in the mounting holes in the corresponding cold plate cutout area.

[0288] (1.2.2) Project the mounting hole of device V14.1 vertically to obtain the two-dimensional angle pin mounting hole of device V14. Based on the hole layer data, the device graphic data of device V14.1, and the device pad related information, the center coordinates of the mounting hole corresponding to device V14.1 (68.1032, 32.6674) and the radius size of 2.158mm are obtained;

[0289] The inner side of the mounting hole can be obtained based on the center coordinates and radius of the mounting hole corresponding to device V14.1;

[0290] According to the center coordinates of the first pin V14.1 of the device V14 (68.1032, 33.0674) and the pin radius size of 0.5mm, the pin outline of the first pin V14.1 of the device V14 is obtained;

[0291] A collision calculation was performed on the pin outline of the first pin V14.1 of the device V14 and the inner side of the corresponding mounting hole. The result showed that there was no collision between the pin outline of the first pin V14.1 of the device V14 and the inner side of the corresponding mounting hole, and no report was required.

[0292] Similarly, based on the center coordinates (65.5632, 35.2074) and radius 2.158mm of the mounting hole corresponding to the second pin V14.2 of the device V14, the inner side of the mounting hole is obtained.

[0293] According to the center coordinates of the second pin V14.2 of the device V14 (65.5632, 35.6074) and the pin radius size of 0.5mm, the pin outline of the second pin V14.2 of the device V14 is obtained;

[0294] Similarly, the collision calculation method between the V14.1 outline and its mounting hole is the same. It is found that the outline of the second pin V14.2 of the device V14 does not collide with the inner side of the corresponding mounting hole, so no report is required.

[0295] Similarly, based on the center coordinates (63.0232, 32.6674) and radius 2.158mm of the mounting hole corresponding to the third pin V14.3 of the device V14, the inner side of the mounting hole can be obtained.

[0296] According to the center coordinates of the third pin V14.3 of the device V14 (63.0232, 33.0674) and the pin radius size of 0.5mm, the pin outline of the third pin V14.3 of the device V14 is obtained;

[0297] Similarly, the collision calculation method between the V14.1 outline and its mounting hole is the same. It is found that the outline of the third pin V14.3 of the device V14 does not collide with the inner side of the corresponding mounting hole, so no report is required.

[0298] If all pins of device V14 do not collide with the inner sides of their corresponding mounting holes, no report is required and the device is stored in list E1 (V14, ...).

[0299] (1.2.3) Check the minimum distance between the V14 pin of the device in List E1 (V14, ...) and the inner side of the mounting hole ring of the corresponding cold plate hollow area to determine whether the minimum distance meets the safety spacing requirements.

[0300] Please refer to Figures 14(a) to 14(c) for understanding. Figures 14(a) to 14(c) are schematic diagrams of the distance between the device V14 pin and its mounting hole in a specific embodiment of the present invention; among them, Figure 14(a) shows V14.2 and the mounting hole; Figure 14(b) shows V14.3 and the mounting hole; Figure 14(c) shows V14.1 and the mounting hole.

[0301] Calculate the distance between the first pin V14.1 of device V14 and the inner side of its corresponding mounting hole. Based on the center coordinates of the first pin V14.1 of device V14 being (68.1032, 33.0674), the pin size being a radius of 0.5mm, the center coordinates of the corresponding mounting hole being (68.1032, 32.6674), and the mounting hole radius being 2.158mm, and the device pin being circular, the minimum distance D between the first pin of device V14 and the inner side of its mounting hole is obtained. 引脚 = mounting hole radius - d' 引脚 -Device pin radius:

[0302] According to the center distance calculation formula between two points, the distance d' between the center of the mounting hole and the center of the device pin can be calculated 引脚 =0.4mm;

[0303] D 引脚 =d15=2.158-0.4-0.5=1.258mm.

[0304] According to the radius of the first pin V14.1 of the device V14, which is 0.5 mm, the difference between the radius of the first pin V14.1 of the device V14 and the radius of its mounting hole is r. 差 =2.158-0.5=1.658mm, then the minimum spacing threshold = 1 / 2*r差 =0.829mm.

[0305] D 引脚 =d15=1.258mm>0.829mm, meets the safety distance requirements, no report is made;

[0306] Similarly, the minimum spacing D between the second pin V14.2 of the device V14 is obtained. 引脚 =d13=1.258mm>0.829mm, meets the safety distance requirements, no report is made;

[0307] Similarly, the minimum spacing D between the third pins of device V14 is obtained. 引脚 =d14=1.258mm>0.829mm, meets the safety distance requirements, no report is made;

[0308] Since all three pins of device V14 are centered in their corresponding mounting holes, the pins of device V14 are centered in their mounting holes and do not need to be reported.

[0309] (2) Check the components riding on the cold plate

[0310] (2.1) Check if there is a cold plate under the device riding on the cold plate

[0311] (2.1.1) Check the components in list B2 (D3, D10, D18, N4, N5, N8, ...) except the components mounted on the cold plate. If the device type of components D3, D18, N4, N5, and N8 is DIP, filter them out and select the THT components that meet the requirements as the designated components and place them in list B4 (D3, D18, N4, N5, N8, ...); otherwise, place them in list B5 (D10, ...).

[0312] (2.1.2) Perform collision calculations on the device body outline of the device in the specified device B4 list and the cold plate to determine whether there is a cold plate underneath. Specifically, take Figures 13(a) to 13(k) as examples:

[0313] (2.1.3) Device D18 in List B4:

[0314] Taking Figures 13(a) to 13(k) as examples, the body center coordinates of device D18 are (117.9200, 96.5454) and the body vector coordinates are (115.4200, 98.5454), (120.4200, 98.5454), (115.4200, 94.5454), (120.4200, 94.5454), (117.9200, 94.5454), (117.9200, 98.5454), (120.4200, 96.5454), (115.4200, 96.5454); the device body contour is obtained according to the device body center coordinates and the device body vector coordinates.

[0315] The collision calculation between the body outline of device D18 and the cold plate shows that there is no collision between the body outline of device D18 and the cold plate. This indicates that there is no cold plate under device D18. Therefore, device D18 needs to be reported. The report information is shown in Table 4.

[0316] (2.1.4) Similarly, the method for determining whether the body outlines of devices D3, N4, N5, and N8 in list B4 (using Figures 13(a) to 13(k) as examples) collide with the cold plate is the same as that for D18. It is concluded that the body outlines of devices D3, N4, N5, and N8 collide with the cold plate, indicating that there is a cold plate under the devices. These are considered as collision devices and are placed in list C2 (D3, N4, N5, N8, ...).

[0317] Determine whether the contact area percentage between the cold plate and the body of the device in list C2 meets the design requirements (the contact area percentage is required to be greater than or equal to a preset second PP1 threshold of 75%).

[0318] (2.1.5) Based on all the vector coordinates of the device body contour and the cold plate in the device N4 in List C2 (taking the figures in Figures 13(a) to 13(k) as an example), the vector coordinates of the contour edge of the collision area are obtained, and the coordinates of each vertex of the contour edge of the collision area between the device N4 body contour and the cold plate are obtained: A1 (95.362, 71.110), A2 (96.362, 71.109), A3 (97.361, 71.106), ...

[0319] By obtaining the coordinates of each vertex of the contour edge of the N4 collision area A(94.362,71.108), A1(95.362,71.110), A2(96.362,71.109), A3(97.361,71.106),.......,A n (x n ,y n ), using the polygon area calculation formula: The calculated polygon collision area is: S = SN4 =S ABCD =16, that is, S is equal to 16.

[0320] (2.1.6) According to the polygon area calculation formula, the outline area of ​​device N4 body S1 = 20;

[0321] (2.1.7) According to the collision area percentage formula:

[0322] PP1 = (area S / device body outline area S1) x 100% = 16 / 20 x 100% = 80%;

[0323] The calculated collision area percentage PP1 = 80%, meaning PP1 is greater than 75%, meeting the design requirement. Therefore, device N4 is not reported because there is a cold plate underneath it. This device is considered a collision device with a PP1 that meets the requirements and is placed in list D2 (N4, ...).

[0324] Similarly, taking Figures 13(a) to 13(k) as an example, it is found that device N5 in list C2 has PP1 = 80%, which is greater than 75% and meets the design requirements. It is placed in list D2 (N4, N5, ...) as a collision device that meets the PP1 requirements.

[0325] Similarly, taking Figures 13(a) to 13(k) as an example, device D3 in List C2, i.e., with a PP1 of 75%, meets the design requirements. It is placed in List D2 (D3, N4, N5, ...) as a collision device that meets the PP1 requirements.

[0326] Similarly, using Figures 13(a) to 13(k) as an example, device N8 in List C2 has a PP1 of 100%, which is greater than 75% and meets the design requirements. Therefore, device N8 is not reported. It is considered a collision device that meets the PP1 requirements and is placed in List D2 (D3, N4, N5, N8, etc.).

[0327] Please see Table 4 for the reported results.

[0328] Table 4: Inspection report contents for whether there is a cold plate under the device riding on the cold plate

[0329] (2.2) Check whether the components riding on the cold plate are installed in the center

[0330] (2.2.1) Check whether the components in the collision device list D2 (D3, N4, N5, N8, ...) that meet the requirements of PP1 are installed centered on the cold plate. First, it is necessary to determine whether the number of intersections between the center line connecting each set of pin pads at both ends of the component in the collision device list D2 that meet the requirements of PP1 and the outline of the cold plate is equal to 2 (as shown in Figure 8). If it is not equal to 2, that is, less than 2 (including equal to 0 and 1), it does not meet the requirements and needs to be reported. The report information is shown in Table 5. If it is equal to 2, it meets the requirements and no report is made. The component is stored in list E2;

[0331] (2.2.2) Taking Figures 13(a) to 13(k) as an example, the center coordinates of the D3.1 pin of device D3 in Table D2 (66.0450, 52.9454) and the center coordinates of D3.5 (66.0450, 60.1454) are a group, and the number of intersections between the line connecting the center of the pin pads and the edge of the cold plate is 0;

[0332] The center coordinates of the D3.2 pin of device D3 (67.2950, ​​52.9454) and the center coordinates of D3.6 (67.2950, ​​60.1454) are a group, and the number of intersections between the center line of the pin pads and the edge of the cold plate is 2;

[0333] The center coordinates of the D3.3 pin of device D3 (68.5450, 52.9454) and the center coordinates of D3.7 (68.5450, 60.1454) are a group, and the number of intersections between the center line of the pin pads and the edge of the cold plate is 2;

[0334] The center coordinates of the D3.4 pin of device D3 (69.7950, 52.9454) and the center coordinates of D3.8 (69.7950, 60.1454) are a group, and the number of intersections between the center line of the pin pads and the edge of the cold plate is 2;

[0335] Device D3 has one set of pins where the number of intersections between the center line connecting the pin pads at both ends and the cold plate edge is 0, not 2. Therefore, device D3 needs to be reported. The reporting information is shown in Table 5.

[0336] (2.2.3) By analogy, we conclude that: Taking Figures 15(a) to 15(c) as an example, Figures 15(a) to 15(c) illustrate the device mounted on a cold plate. Figure 15(a) shows the device mounted centered; Figure 15(b) shows the device mounted partially centered; and Figure 15(c) shows the device mounted completely centered. Devices N4, N5, and N8 in List D2 are mounted on the cold plate. The number of intersections between the center lines connecting each set of pin pads at both ends and the cold plate outline is 2, meeting the intersection requirement and therefore not reported. These devices are considered 2-intersection devices and are placed in List E2 (N4, N5, N8, ...).

[0337] (2.2.4) Then determine whether the distance between the two intersection points of the line connecting the centers of each group of pin pads of the device in List E2 and the center of the nearest pin pad meets the requirements, that is, the distance difference percentage is less than or equal to the preset distance difference percentage threshold distance of 20%. If it does, it meets the design requirements and the device is stored in List F2. If it does not meet the requirements, it needs to be reported. The report information is shown in Table 5.

[0338] Taking the first pin group in Figure 15(a) as an example, since the coordinates of each vertex in the polygonal collision area are known, according to the intersection points J1 and J2 of the line connecting the center points P1 (95.362, 67.108) and P2 (95.362, 72.108) of the pin pads at both ends of device N4 in List E2 and the contour edge of the cold plate, the intersection coordinates J1 (95.362, 68.008) and J2 (95.362, 71.158) can be determined, and the distances P1J1 = 0.9 and P2J2 = 0.95 are obtained, that is, D3 距 =0.9 and D4 距 =0.95.

[0339] Using the formula: The obtained distance difference percentage PP2 = (0.05 / 0.9-0.05 / 0.95) x 100% = 0.29%, which is less than 20% and meets the distance difference percentage requirement.

[0340] Using the same method, calculate the distance difference percentages for the other three pin groups in Figure 15(a). Finally, if the distance difference percentages for each of the three pin groups are equal, that is, PP2 = 0.29%, then use any of these pin group distance difference percentages as the distance difference percentage for device N4, i.e., PP2 = 0.29%. This is less than 20%, meeting the distance difference percentage requirement, and is not reported. Note that device N4 in List E2 is centered on the cold plate and is therefore not reported.

[0341] (2.2.5) Similarly, taking the first pin group in Figure 15(b) as an example, according to Table E2, the intersection points of the line connecting the center points P1 (110.362, 67.208) and P2 (110.362, 72.208) of the pin pads at both ends of device N5 and the contour edge of the cold plate are J1 and J2. The coordinates of the intersection points J1 (110.362, 67.508) and J2 (110.362, 71.508) can be determined, and the distances P1J1 = 0.3 and P2J2 = 0.7 are obtained, that is, D3 距 =0.3 and D4 距 =0.7.

[0342] Using the formula: The obtained distance difference percentage PP2 = (0.4 / 0.3 - 0.4 / 0.7) x 100% = 76.19%, which is greater than 20% and does not meet the distance difference percentage requirement.

[0343] Similarly, for the other three pin groups in N5 (using Figure 15(b) as an example), we calculate their distance difference percentages. The resulting distance difference percentages for each of the other three groups are all equal, i.e., PP2 = 42.86%. Therefore, we use the distance difference percentage of any of these pin groups as the distance difference percentage for device N5, resulting in PP2 = 42.86%, which is greater than 20% and does not meet the distance difference percentage requirement. Explanation 2: Device N5 in intersection device E2 is not centered on the cold plate, so a report is required. See Table 5 for the report information.

[0344] (2.2.6) Similarly, taking the first pin group in device N8 (Figure 15(c)) as an example, according to the center points P1 (130.362, 67.208) and P2 (130.362, 74.108) of the pin pads at both ends of device N8 in List E2, the intersection points of the connecting line with the contour edge of the cold plate are J1 and J2, and the coordinates of the intersection points J1 (130.362, 68.408) and J2 (130.362, 72.908) can be determined, and the distances P1J1 = 1.2 and P2J2 = 1.2, that is, D3 距 =1.2 and D4 距 =1.2.

[0345] Using the formula: The obtained distance difference percentage PP2 = (0 / 1.2 - 0 / 1.2) x 100% = 0%, which is less than 20% and meets the distance difference percentage requirement.

[0346] Similarly, calculate the distance difference percentages for the other three pin groups of device N8 (Figure 15(c)). The resulting distance difference percentages for each of the other three groups are all equal, meaning PP2 = 0%. Therefore, the distance difference percentage for any of these pin groups is taken as the distance difference percentage for device N8, resulting in PP2 = 0%, which is less than 20%, meeting the distance difference percentage requirement and not reported. Note that device N8 in List E2 is centered on the cold plate and therefore not reported.

[0347] Taking Figure 13(g) and Figures 15(a) to 15(c) as examples, the percentage of distance differences that do not meet the intersection number requirement is considered to be 9999% (i.e., +∞%). The results are reported as follows:

[0348] Table 5: Inspection report contents for centering components on a cold plate

[0349] Notes on the meaning of the actual values ​​in Table 5:

[0350] The number of intersections 0 and 2 respectively represent multiple groups of line segments, some of which have no intersections and some of which have two intersections; the reported result is 9999%. Apply the PP2 formula, take the line segment P1P2 and the extension lines of other pin groups, where the first group of pins has no intersection with the cold plate, indicating that the device is partially riding on the cold plate. Take the largest result of the first group of pins, and the actual value is PP2 = 9999%.

[0351] Step III: Check whether the components under the cold plate meet the design requirements

[0352] The data source of this step takes the cold plate and PCB board data as an example, corresponding to step S4.

[0353] By reading the cold plate design data and performing preprocessing, the cold plate vector coordinates, different thicknesses of the cold plate, the position of the cold plate overhead area, and the size of the cold plate overhead area are obtained. The cold plate vector coordinates, the overall thickness of the cold plate is 4.5 mm (the thickness of the cold plate is generally 2 to 5 mm), the thickness of the cold plate overhead area is 0.8 mm, the length of the cold plate overhead area L = 50 mm, the width of the cold plate overhead area W = 20 mm, and the height of the cold plate overhead area H = 3.3 mm are obtained.

[0354] By reading the PCB design data and performing preprocessing, the device graphic related data and device pad related information are obtained, and the B list of all devices (N4, N5, N8, D1, D2, D3, D10, D16, D18, V14, V15, ...) is obtained.

[0355] Through the circuit layer information, the routing position (including the starting position and the end position), the routing length, and the routing width are obtained, and a list S of all routings (S1, S2, ...) is obtained. The list contains relevant information such as the routing position (including the starting position and the end position), the routing length, and the routing width.

[0356] 1. Interference of devices in the overhead area of ​​the cold plate

[0357] (1.1) Check the device list B5 (D10, ...), and filter the device list B5 according to the device package type. If the package type of the device in D10 is an SMD device, it will be filtered out. The devices that meet the conditions are designated as the specified devices and placed in the list B6 (D10, ...).

[0358] According to the device body center coordinates of device D10 (132.5637,172.0572) and the device body vector coordinates (142.5637,176.0572), (122.5637,176.0572), (142.5637,168.0572), (122.5637,168.0572), (132.5637,176.0572), (132.5637,168.0572), (142.5637,172.0572), (12 2.5637,172.0572), and the center coordinates of the D10.1 pin of the device D10 (123.397,168.0572), ..., the center coordinates of the D10.24 pin (141.7304,168.0572), ..., the center coordinates of the D10.25 pin (123.397,176.0572), ..., the center coordinates of the D10.48 pin (141.7304,176.0572), and the pin size is 1mm long and 0.5mm wide, and the outline of the device D10 is obtained;

[0359] (1.2) Taking Figures 16(a) and 16(b) as examples, Figures 16(a) and 16(b) are schematic diagrams illustrating the calculation of the horizontal distance between components in the cold plate overhead region according to a specific embodiment of the present invention. Figure 16(a) is a top view of the cold plate overhead region, and Figure 16(b) is an expanded view of the component outline below the cold plate overhead region. The two black lines in Figures 16(a) and 16(b) represent the cold plate outline where the thickness of the cold plate and its overhead region is reduced; the length of the black lines represents the width of the cold plate overhead region; the numbers 1, 24, 25, and 48 represent the component pin numbers, and D10 represents the SMD component number. The figure containing D10 represents component D10.

[0360] The cold plate's overhead area is projected downward perpendicular to the PCB to obtain its projected area on the PCB. A collision calculation is performed between the outline of device D10 and the projected area of ​​the cold plate's overhead area. If a collision is found between the projected area of ​​the cold plate and the outline of device D10, device D10 is present within the projected area. Device D10 that meets the requirements is placed in list B7.

[0361] (1.3) A collision calculation is performed between the outline of device D10 in list B7 and the outline of the overhead area of ​​the cold plate. If no collision occurs between the outline of device D10 and the outline of the overhead area of ​​the cold plate, the device that meets the conditions is placed in list B8.

[0362] (1.4) Determine whether the distance between device D10 in List B8 and the cold plate meets the safety distance requirements (safety distance D is not less than 2 mm).

[0363] (1.5) Vertical direction: Determine whether the vertical distance between the top of device D10 in List B8 and the overhead area of ​​the cold plate meets the safety spacing requirement (safety spacing D is not less than 2 mm). In other words, determine whether the height difference between the overhead area of ​​the cold plate and device D10 meets the safety spacing requirement (safety spacing D is not less than 2 mm).

[0364] Taking Figures 16(a) and 16(b) as an example, the height of device D10 is 1.2 mm, and the height of the cold plate overhead area is H = 3.3 mm. The height difference between the device height and the cold plate overhead area is h = H - 1.2 = 3.3 - 1.2 = 2.1. That is, the vertical distance c between the top of device D10 and the cold plate overhead area is 2.1 mm, which is greater than 2 mm and meets the safety distance requirements, so no report is required.

[0365] (1.6) Horizontal direction: Determine the horizontal distance between the periphery (front and back or left and right) of device D10 in List B8 and the outline of the cold plate overhead area. That is, whether the distance between the outline of device D10 in List B8 and the outline of the cold plate overhead area projected meets the safety distance requirement (safety distance D is not less than 2 mm) (see Figure 16(a)). Taking Figure 16(b) as an example, the center coordinates of the device D10 body are (132.5637, 172.0572) and the vector coordinates of the device body are (142.5637, 176.0572), (122.5637, 176.0572), (142.5637, 168.0572), (122.5637, 168.0572), (132.5637, 176.0572), (132.5637, 168.0572), (142.5637, 172.0572), (1 Given the pin dimensions of 1 mm in length and 0.5 mm in width, the outline of device D10 is obtained. Calculate the shortest distance between the outline of device D10 and the cold plate.

[0366] Using the device outline vector coordinates of device D10 and the cold plate vector coordinates, we determine the closest position between the D10 device outline and the cold plate, E (135.0637, 172.0572), and the closest position between the cold plate and the D10 device outline, F (136.9637, 172.0572). The resulting vector distance EF = 1.9 mm, or d16 = 1.9 mm, is less than 2 mm and does not meet the safety distance requirement. This must be reported. See Table 6 for detailed report information.

[0367] (1.7) Taking Figures 16(a) and 16(b) as an example, the vertical distance c = 2.1 mm between device D10 and the cold plate is greater than 2 mm, meeting the safety spacing requirement and requiring no reporting. However, the horizontal distance b = d16 = 1.9 mm is less than 2 mm, not meeting the safety spacing requirement and requiring reporting. Therefore, the distance between device D10 and the cold plate outline in the overhead area does not meet the safety spacing requirement and requires reporting. See Table 6 for detailed reporting information.

[0368] (1.8) Similarly, the method for determining the distance between the trace and the cold plate in the overhead area is the same as that for device D10, and it is concluded that there is no trace under the cold plate overhead area.

[0369] Table 6 Contents of inspection report on the distance between components and cold plate below the overhead area of ​​cold plate

[0370] Finally, the reported information about the cold plate that does not meet the above three conditions is summarized and recorded, and returned to the cold plate design process. The designed cold plate is then manually or automatically modified. After the modifications are completed, the above steps I to III are repeated until no non-compliant cold plate information conditions are reported. At this point, the cold plate design meets the requirements and can be used as a standard cold plate. This avoids the waste of resources and the need to re-make the cold plate due to defects discovered after production use, thus achieving the goal of cost savings.

[0371] In a second aspect, corresponding to the above method embodiment, an embodiment of the present invention further provides a review device for a cold plate in PCB design, as shown in FIG17 , the device comprising:

[0372] A CAD data acquisition module is configured to acquire CAD data; wherein the CAD data includes cold plate design data and PCB design data; the cold plate design data includes cold plate vector coordinates, different cold plate thickness values, and the bottom surface height of the cold plate overhead area; and the PCB design data includes device graphic related data, device pad related information, hole layer information, and circuit layer information.

[0373] A cold plate strip narrowest width review module, used to check whether the narrowest width of the cold plate strip meets the design requirements based on the cold plate design data;

[0374] A component review module above the cold plate, used to check whether the components above the cold plate meet the design requirements based on the CAD data;

[0375] A component review module under the cold plate, configured to check whether the components under the cold plate meet design requirements based on the CAD data;

[0376] Among them, when any inspection fails to meet the corresponding design requirements, a corresponding report is output; that is, when the inspection module for the narrowest width of the cold plate strip, the inspection module for the components above the cold plate, and the inspection module for the components below the cold plate fail to meet the corresponding design requirements, a corresponding report is output;

[0377] Cold plate design modification module, used to modify the cold plate design based on all reports.

[0378] Regarding each module, please refer to the relevant content in the first aspect and will not go into details here.

[0379] In a third aspect, an embodiment of the present invention further provides an electronic device, as shown in FIG18 , including a processor 1801, a communication interface 1802, a memory 1803, and a communication bus 1804, wherein the processor 1801, the communication interface 1802, and the memory 1803 communicate with each other via the communication bus 1804.

[0380] The memory is used to store computer programs;

[0381] The processor is configured to implement, when executing the program stored in the memory, any of the steps of the method for reviewing a cold plate in PCB design provided in the first aspect of the embodiment of the present invention.

[0382] The communication bus mentioned in the above electronic device may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The communication bus may be divided into an address bus, a data bus, a control bus, etc.

[0383] The communication interface is used for communication between the above electronic device and other devices.

[0384] The memory may include a random access memory (RAM) or a non-volatile memory (NVM), such as at least one disk memory.

[0385] The above-mentioned processor can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), etc.

[0386] The method provided in the embodiment of the present invention can be applied to electronic devices. Specifically, the electronic devices can be: desktop computers, portable computers, smart mobile terminals, servers, etc., which are not limited here.

[0387] In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, it implements the steps of any of the methods for reviewing cold plates in PCB design provided in the first aspect of the embodiment of the present invention.

[0388] Those skilled in the art will appreciate that the embodiments of the present application can be provided as methods, devices (equipment), or computer program products. Therefore, the present application can adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware, which are all collectively referred to as "module" or "system" herein. Moreover, the present application can adopt the form of a computer program product implemented on one or more computer-readable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program code. The computer program is stored / distributed in a suitable medium, provided together with other hardware or as a part of hardware, or other distribution forms can be adopted, such as by the Internet or other wired or wireless telecommunication systems.

[0389] In the description of the present invention, it should be understood that the terms "first" and "second" are used solely for descriptive and distinguishing purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the technical features being described. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0390] The above description is a further detailed description of the present invention in conjunction with specific preferred embodiments. The specific implementation of the present invention is not limited to these descriptions. Those skilled in the art may combine and combine the different embodiments or examples described in this specification. Those skilled in the art may also make several simple deductions or substitutions without departing from the scope of the present invention, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A method for reviewing cold plates in PCB design, characterized in that: include: Acquire CAD data; wherein the CAD data includes cold plate design data and PCB design data; the cold plate design data includes cold plate vector coordinates, different thickness values ​​of the cold plate, and the bottom surface height of the cold plate overhead area; the PCB design data includes device graphic related data, device pad related information, hole layer information, and circuit layer information; According to the cold plate design data, check whether the width of the cold plate strip at its narrowest point meets the design requirements; According to the CAD data, check whether the components above the cold plate meet the design requirements; According to the CAD data, checking whether the components under the cold plate meet the design requirements; wherein, when any check does not meet the corresponding design requirements, outputting a corresponding report; The cold plate design was modified based on all reports.

2. The method for reviewing cold plates in PCB design according to claim 1, characterized in that: According to the cold plate design data, check whether the width of the cold plate strip at its narrowest point meets the design requirements, including: Determine the hollowed-out area on the cold plate and the outer contour of the cold plate according to the cold plate vector coordinates; Calculate the distance between the hollowed-out areas and the distance from the hollowed-out areas to the outer contour of the cold plate; Get the shortest distance among all calculated distances; Determine whether the shortest distance is greater than a preset cold strip width threshold; if so, determine that the width of the cold strip at the narrowest point meets the design requirements; if not, determine that the width of the cold strip at the narrowest point does not meet the design requirements.

3. The method for reviewing cold plates in PCB design according to claim 1, characterized in that: According to the CAD data, check whether the components above the cold plate meet the design requirements, including: According to the CAD data, checking whether the minimum distance between the device pin pad and the cold plate meets the safety distance; Determine whether there are any devices embedded in the cold plate among the devices whose minimum distance between the device pin pad and the cold plate meets the safety distance. If yes, check whether the cold plate design below meets the requirements for the devices embedded in the cold plate. Determine whether there are any devices riding on the cold plate among the devices whose minimum distance between the device pin pad and the cold plate meets the safety distance. If so, check whether the cold plate design below meets the requirements for the devices riding on the cold plate.

4. The method for reviewing cold plates in PCB design according to claim 3, characterized in that: According to the CAD data, check whether the minimum distance between the device pin pad and the cold plate meets the safety distance, including: For each device, according to the device graphic related data and device pad related information in the PCB design data, check whether the device pin pad of the device collides with the cold plate; if so, output a corresponding report; if not, store the device in the list B1; Determine whether the minimum distance between the device pin pad and the cold plate of each device in the list B1 is greater than or equal to a preset safety distance threshold, if not, output a corresponding report; if yes, store the device in the list B2.

5. The method for reviewing cold plates in PCB design according to claim 4, characterized in that: The step of judging whether there is a device mounted on the cold plate among the devices whose minimum distance between the device pin pad and the cold plate meets the safety distance comprises: For each device in the list B2, the PCB design data is used to determine whether the device's appearance name contains a TO field. If so, the device is determined to be a device mounted on a cold plate, and the device is stored in the list B3.

6. The method for reviewing cold plates in PCB design according to claim 5, characterized in that: For the devices mounted on the cold plate, check whether the cold plate design below meets the requirements, including: For each device in the list B3, the device body outline of the device is obtained from the PCB design data and collision calculation is performed with the cold plate. If no collision occurs, it is determined that there is no cold plate design under the device, and a corresponding report is output; if a collision occurs, it is determined that there is a cold plate design under the device, and the device is stored in the list C1; Determine whether the contact area percentage between the cold plate and the device body contour of each device in the list C1 meets the corresponding design requirements; if not, output a corresponding report; if yes, store the devices meeting the design requirements in the list D1; Determine whether the device pin of each device in the list D1 is centered in its mounting hole, and if not, output a corresponding report; if so, determine that the cold plate design under the corresponding device meets the requirements.

7. The method for reviewing cold plates in PCB design according to claim 6, characterized in that: Determining whether the device pin of each device in the list D1 is centered in its mounting hole includes: For each device in the list D1, based on the CAD data, determine whether the device pin outline of the device collides with the inner side edge of the mounting hole of the corresponding hollowed-out area on the cold plate on the same two-dimensional plane, and if so, output a corresponding report; if not, store the device in the list E1; In the same two-dimensional plane, calculating the minimum distance between the device pin outline of each device in the list E1 and the inner side edge of the mounting hole of the corresponding hollowed-out area on the cold plate; Determine whether the minimum spacing obtained by each device is greater than or equal to the minimum spacing threshold corresponding to the device. If not, determine that the device pin of the device is not centered in its mounting hole; if so, determine that the device pin of the device is centered in its mounting hole; wherein, if the device pin contour of the device is circular, the corresponding minimum spacing threshold is half of the difference between the mounting hole radius of the device and the device pin radius; if the device pin contour of the device is rectangular, the corresponding minimum spacing threshold is half of the difference obtained by subtracting half of the diagonal in the device pin contour line from the mounting hole radius of the device.

8. The method for reviewing cold plates in PCB design according to claim 4, characterized in that: Determine whether there are any devices riding on the cold plate among the devices whose minimum distance between the device pin pad and the cold plate meets the safety distance, including: For each device in the list B2, the PCB design data is used to determine whether the device type of the device includes DIP and / or AXIAL. If so, the device is determined to be a device riding on a cold plate and the device is stored in the list B4; if not, the device is determined not to be a device riding on a cold plate and the device is stored in the list B5.

9. The method for reviewing cold plates in PCB design according to claim 8, characterized in that: For the device riding on the cold plate, check whether the cold plate design below meets the requirements, including: For each device in the list B4, the device body outline of the device is obtained from the PCB design data and collision calculation is performed with the cold plate. If no collision occurs, it is determined that there is no cold plate design under the device, and a corresponding report is output; if a collision occurs, it is determined that there is a cold plate design under the device, and the device is stored in the list C2; Determine whether the contact area percentage between the cold plate and the device body contour of each device in the list C2 meets the corresponding design requirements; if not, output a corresponding report; if yes, store the devices meeting the design requirements in the list D2; Determine whether each device in the list D2 is installed in the center. If not, output a corresponding report. If yes, determine whether the cold plate design under the corresponding device meets the requirements.

10. The method for reviewing cold plates in PCB design according to claim 6 or 9, characterized in that: Calculate the percentage of contact area between the cold plate and the device body outline of the device, including: Calculating a device body outline area of ​​the device according to the PCB design data; Calculating the collision area between the device body contour of the device and the cold plate according to the CAD data; The contact area percentage between the cold plate and the device body contour of the device is obtained by calculating the quotient of the collision area between the device body contour of the device and the cold plate and the device body contour area of ​​the device.

11. The method for reviewing cold plates in PCB design according to claim 9, characterized in that: Determining whether each device in the list D2 is centrally installed includes: For each device in the list D2, determine whether the number of intersections between the center line of each group of pin pads matched at both ends of the device and the cold plate contour is equal to 2; if not, output a corresponding report; if equal, store the device in the list E2; For each device in the list E2, calculate the distances of the two intersection points of the center line of each group of pin pads matched at both ends and the cold plate contour from the center of the nearest pin pad, and determine whether the distance difference percentage of the two distances obtained for each group of pin pads is less than or equal to a preset distance difference percentage threshold; if not, determine that the corresponding device in the list D2 is not installed in the center; if so, determine that the corresponding device in the list D2 is installed in the center.

12. The method for reviewing cold plates in PCB design according to claim 8, characterized in that: According to the CAD data, check whether the components under the cold plate meet the design requirements, including: Determine the overhead area of ​​the cold plate according to the cold plate design data; According to the PCB design data, SMD components are selected from the list B5, and the outline of the SMD components is calculated; Calculate the routing profile according to the circuit layer information in the PCB design data; Obtaining a vertical projection area of ​​the cold plate overhead area on the PCB board, and determining whether the projection area collides with the outline and / or routing outline of the SMD device; If the projection area collides with the contour of the SMD device and / or the trace contour, it is determined that there are SMD devices and / or traces in the projection area; for the SMD devices and / or traces in the projection area, it is determined whether they collide with the contour line of the cold plate overhead area; If a collision occurs, a corresponding report is output; if no collision occurs, it is determined whether the distance between the SMD devices and / or traces in the projection area and the cold plate meets the corresponding safety spacing requirements; if not, a corresponding report is output; if yes, it is determined that the devices under the cold plate meet the design requirements.

13. The method for reviewing cold plates in PCB design according to claim 12, characterized in that: Determining whether the distance between the SMD device and / or the trace in the projection area and the cold plate meets the corresponding safety spacing requirements includes: Determine whether the vertical distance between the SMD devices and / or traces in the projection area and the cold plate meets the corresponding vertical safety spacing requirements, and determine whether the horizontal distance between the SMD devices and / or traces in the projection area and the cold plate meets the corresponding horizontal safety spacing requirements.

14. A review device for cold plate in PCB design, characterized in that: include: A CAD data acquisition module is used to acquire CAD data; wherein the CAD data includes cold plate design data and PCB design data; the cold plate design data includes cold plate vector coordinates, different thickness values ​​of the cold plate, and the bottom surface height of the cold plate overhead area; the PCB design data includes device graphic related data, device pad related information, hole layer information, and circuit layer information; The cold plate strip narrowest width review module is used to check whether the cold plate strip narrowest width meets the design according to the cold plate design data. Require; A component review module above the cold plate, used to check whether the component above the cold plate meets the design requirements according to the CAD data; A component review module under the cold plate, used to check whether the component under the cold plate meets the design requirements according to the CAD data; Wherein, when any inspection fails to meet the corresponding design requirements, a corresponding report is output; Cold plate design modification module, used to modify the cold plate design based on all reports.

15. An electronic device, characterized in that: It includes a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory communicate with each other through the communication bus; The memory is used to store computer programs; The processor is used to implement the method steps described in any one of claims 1-13 when executing the program stored in the memory.

16. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method steps described in any one of claims 1 to 13 are implemented.

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