Production process for electrostatic precipitator

Abstract

A production process for an electrostatic precipitator, comprising the following steps: S100, sequentially and alternately placing dust collection plates and spacers to form a mold core; S300, installing fixed isolation members along fixed positions reserved on the dust collection plates, and removing the spacers; and S500, installing electric conductors at end portions of the mold core, and using an insulating adhesive to carry out insulation treatment on the end portions of the mold core.

Description

Production process of electrostatic dust removal device Technical Field

[0001] The invention belongs to the technical field of air purification, and in particular relates to a production process of an electrostatic dust removal device. Background Art

[0002] Currently, mainstream air purification technologies are divided into filtration and electrostatic technologies. Filtration technology uses fibers and fiber-based filter materials to filter or absorb airborne pollutants, thereby purifying the air. While the technology is mature and relatively stable, it carries high labor, material, operating, and maintenance costs, and improper maintenance can pose safety risks. As the filter material continuously intercepts pollutants from the air, the gaps between the fibers become increasingly clogged, increasing air resistance. This requires frequent cleaning and replacement of the filter material. Furthermore, airborne bacteria and viruses can become trapped in the filter material, leading to bacterial growth, mold, and odor. Electrostatic technology uses an ionization module to charge particles in the air. These charged particles are then attracted by the electric field created by the dust collection module, completing the purification process. Various high-voltage electrostatic dust removal devices designed and developed using the principles of electrostatic technology can purify a wide range of airflow rates and a wide range of particle pollution. They can operate stably in various temperature and humidity environments, making them suitable for air filtration in homes, businesses, industries, tunnels, subways, and other applications. They offer advantages such as long service life, high purification efficiency, low operating costs, and low maintenance.

[0003] Currently, the production process of most electrostatic precipitators is complicated, resulting in low production efficiency and increased investment costs. Therefore, it is necessary to develop a rapid production process for electrostatic precipitators. Summary of the Invention

[0004] In view of the various deficiencies in the existing technology, a production process for an electrostatic precipitator is proposed to solve the technical problems in the existing technology such as low production efficiency and increased investment cost due to complicated production process.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A production process for an electrostatic dust removal device comprises the following steps:

[0007] S100, alternately placing dust collecting plates and spacers in sequence to form a mold core;

[0008] S300, install the fixed isolation piece along the fixed position reserved on the dust collecting plate and remove the spacer;

[0009] S500: Install a conductor at the end of the mold core, and use insulating glue to insulate the end of the mold core.

[0010] The present technical solution is further configured such that, in step S100, the placement order of the dust collecting plates and the spacers is adjustable, the dust collecting plates comprising grounded dust collecting plates and high-pressure dust collecting plates that are alternately stacked, the grounded dust collecting plates and the high-pressure dust collecting plates being staggered 180°, and the structures of the two are the same.

[0011] The technical solution is further configured such that the interior of the dust collecting plate is an insulating layer, semiconductor layers are provided on both sides of the insulating layer, and a conductive layer is provided between the insulating layer and the semiconductor layer.

[0012] The technical solution is further configured as follows: the manufacturing method of the dust collecting plate is:

[0013] Conductive layers are printed symmetrically on both sides of the insulating layer. After the conductive layers are dried, adhesive layers are applied. Semiconductor layers are pasted or bonded on the adhesive layers. After flipping, the semiconductor layers are pasted or bonded on the other side of the conductive layer using the same method. Dust collecting plates that meet the design size requirements are cut or punched out on the equipment.

[0014] The technical solution is further configured such that the thickness of the semiconductor layer of the dust collecting plate of the dust collecting layer is smaller than the thickness of the semiconductor layer of the dust collecting plate of the non-dust collecting layer.

[0015] The technical solution is further configured such that the interior of the dust collecting plate is a conductive layer, and semiconductor layers are provided on both sides of the conductive layer.

[0016] The technical solution is further configured such that, in step S100, a rod-shaped component is sequentially inserted into the process holes on the dust collecting plate and the spacer to form a mold core.

[0017] The present technical solution is further configured such that, in step S100, insulating plates are provided on both sides of the mold core, and a rod-shaped component is sequentially inserted into the process holes on the insulating plates, the dust collecting plates and the spacer, and fastened to the outside of the insulating plates to form a mold core.

[0018] The present technical solution is further configured such that, in step S300, insulating glue is poured along a fixed position reserved on the dust collecting plate, wherein the fixed position is set at an edge of the dust collecting plate.

[0019] The present technical solution is further configured such that, in step S300, a rigid insulating member is installed along a fixed position reserved on the dust collecting plate, and a dust collecting plate gap for accommodating the dust collecting plate is provided on the rigid insulating member.

[0020] The technical solution is further configured such that, in step S300 , the rod-shaped component is removed and the spacer is extracted from the end of the mold core.

[0021] The technical solution is further configured such that, in step S500, a conductor is installed at the end of the mold core, and the end of the mold core is insulated using insulating glue, specifically:

[0022] When the two ends of the dust collecting plate are provided with the process holes, the rod-shaped component is inserted into the process hole again, a conductor is installed in the power connection port at the end of the dust collecting plate, and the two ends of the mold core are placed in the glue injection container in turn. The glue injection container is filled with insulating glue. After the insulating glue is cured, the rod-shaped component is removed.

[0023] The technical solution is further configured such that, in step S500, a conductor is installed at the end of the mold core, and the end of the mold core is insulated using insulating glue, specifically:

[0024] When the process hole is provided at one end of the dust collecting plate, the rod-shaped component is used as a conductor, and the rod-shaped component is inserted into the process hole again, and the two ends of the mold core are placed in the glue injection container in turn. The glue injection container is filled with insulating glue, and the process hole is directly sealed after the insulating glue is cured.

[0025] The technical solution is further configured such that, in step S500, a conductor is installed at the end of the mold core, and the end of the mold core is insulated using insulating glue, specifically:

[0026] When the process hole is provided at one end of the dust collecting plate, the rod-shaped component guides the conductor to penetrate the process hole, and the two ends of the mold core are placed in the glue injection container in turn. The glue injection container is filled with insulating glue, and the process hole is directly sealed after the insulating glue is cured.

[0027] The technical solution is further configured such that a release paper or a thin insulating layer is laid in the glue injection container. The beneficial effects of the present invention are:

[0028] The conductor realizes the electrical connection between the power supply and the dust collecting plate, and the fixed isolation piece can improve the stability of the mold core. The present invention improves and simplifies the production process, helps to improve production efficiency and reduce investment costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG1 is a flow chart of a production process of an electrostatic precipitator according to an embodiment of the present invention;

[0030] FIG2 is a schematic diagram of a mold core in an embodiment of the present invention;

[0031] FIG3 is an exploded view of a mold core according to an embodiment of the present invention;

[0032] FIG4 is a schematic diagram of an electrostatic precipitator according to an embodiment of the present invention;

[0033] Figure 5 is a side view of a dust collecting plate in an embodiment of the present invention;

[0034] Figure 6 is a top view of the dust collecting plate in an embodiment of the present invention;

[0035] FIG7 is a top view of another embodiment of the dust collecting plate in an embodiment of the present invention;

[0036] FIG8 is a schematic diagram of a dust collecting plate seam of a dust collecting plate according to an embodiment of the present invention;

[0037] FIG9 is a top view of another embodiment of the dust collecting plate in an embodiment of the present invention;

[0038] Figure 10 is a top view of another embodiment of the dust collecting plate in an embodiment of the present invention;

[0039] Figure 11 is a top view of another embodiment of the dust collecting plate in an embodiment of the present invention;

[0040] FIG12 is a top view of another embodiment of the dust collecting plate in an embodiment of the present invention.

[0041] In the accompanying drawings: 100, insulating plate; 200, dust collecting plate; 300, fixed isolation piece; 400, insulating rubber layer; 500, conductor; 600, wire; 700, frame; 800, process hole; 201, insulating layer; 202, semiconductor layer; 203, conductive layer; 204, fixing position; 205, avoidance port; 206, power connection port; 207, insulating gap; 208, groove; 209, first electrical safety area; 210, second electrical safety area; 301, dust collecting plate seam. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention is clearly and completely described below in conjunction with the drawings of the present invention. Based on the embodiments in this application, other similar embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of this application. In addition, the directional words mentioned in the following embodiments, such as "up", "down", "left", "right", etc., are only reference to the directions of the drawings. Therefore, the directional words used are used to illustrate rather than limit the invention.

[0043] According to an embodiment of the present invention, a production process for an electrostatic precipitator is provided, as shown in FIG1 , comprising the following steps:

[0044] S100, alternately placing dust collecting plates and spacers in sequence to form a mold core;

[0045] S300, install the fixed isolation piece along the fixed position reserved on the dust collecting plate and remove the spacer;

[0046] S500: Install a conductor at the end of the mold core, and use insulating glue to insulate the end of the mold core.

[0047] It should be noted that the conductor realizes the electrical connection between the power supply and the dust collecting plate, and the fixed isolation piece can improve the stability of the mold core. The present invention improves and simplifies the production process, helps to improve production efficiency and reduce investment costs.

[0048] In the production process of the electrostatic precipitator of this embodiment, please refer to Figures 1 to 3. In step S100, the placement order of the dust collecting plate 200 and the spacer is adjustable.

[0049] Specifically, the dust collecting plate 200 includes a grounded dust collecting plate and a high-voltage dust collecting plate that are alternately stacked. The grounded dust collecting plate and the high-voltage dust collecting plate are staggered 180° and have the same structure. The high-voltage dust collecting plate is electrically connected to the high-voltage end of the power supply of the electrostatic precipitator, and the grounded dust collecting plate is electrically connected to the low-voltage end of the power supply of the electrostatic precipitator.

[0050] Preferably, the power supply of the electrostatic precipitator can be built-in or external.

[0051] Please refer to Figures 3 and 5. The middle part of the dust collecting plate 200 is an insulating layer 201. Semiconductor layers 202 are provided on both sides of the insulating layer 201. A conductive layer 203 is provided between the insulating layer 201 and the semiconductor layer 202. At the same time, adhesive layers are provided between the semiconductor layer 202 and the conductive layer 203, and between the semiconductor layer 202 and the insulating layer 201.

[0052] It should be noted that by adding an insulating layer 201, the strength and stability of the dust collecting plate 200 are improved. The electrostatic dust removal device made of the dust collecting plate 200 with this structure can not only improve the stability and ensure the normal use of the device, but also effectively reduce the distance between the dust collecting plates 200 and increase the dust collecting surface to capture more pollutants and improve the purification efficiency.

[0053] During production, a conductive layer 203, such as conductive ink, is printed symmetrically on both sides of the flat insulating layer 201. After the conductive layer 203 is dried, an adhesive layer is applied and a semiconductor layer is pasted or bonded on the adhesive layer. Similarly, a semiconductor layer is pasted or bonded on the other side using the same method, and then the required dust collecting plate is cut or punched out on the equipment.

[0054] Specifically, the conductive layer 203 is configured as a strip, which can be configured as one strip or multiple strips.

[0055] Specifically, the conductive layer 203 is made of conductive material and additives. The conductive material includes graphite, graphene or conductive ink. The additive includes silicone, which can increase the heat resistance, water repellency and corona resistance of the material.

[0056] The semiconductor layer 202 is made of a polymer material and a thermally conductive material. The polymer material includes polyvinyl chloride, polyethylene, polypropylene, ABS plastic, or polytetrafluoroethylene. The thermally conductive material includes one or a combination of aluminum oxide, silicon dioxide, metal powder, silicon nitride, aluminum nitride, zinc oxide, calcium oxide, graphite, and graphene. To achieve wide applicability while taking into account production and processing, and material costs, polyethylene (PE) is preferred. It has excellent low-temperature resistance and maintains good mechanical properties at -60°C. It is tasteless, odorless, non-toxic, matte, and milky white waxy particles with a melting point of 100-130°C. It is insoluble in water, remains flexible at low temperatures, has high electrical insulation, and has high thermal conductivity.

[0057] The insulating layer 201 is made of one or more of polypropylene, ABS plastic, polyamide, polyoxymethylene, polytetrafluoroethylene, or polycarbonate. The insulating layer 201 is made of a rigid material, leveraging its insulating and supportive properties to maintain the stiffness of the dust collecting plate 200. Polycarbonate, also known as PC plastic, is preferred. It is colorless and transparent, heat-resistant, impact-resistant, and possesses excellent mechanical properties. It is flame-retardant grade BI, has a melting point of 220-230°C, and is flame-retardant and antioxidant.

[0058] Specifically, the thickness of the insulating layer 201 is 0.1-1.0 mm, preferably 0.3 mm. If the insulating layer 201 is too thin, for example, less than 0.1 mm, the supporting strength is insufficient and the dust collecting plate is easily deformed. If the insulating layer 201 is too thick, for example, greater than 1 mm, the dust collecting plate will be thicker when the dimensions of other layers are the same, and the effective ventilation area per unit area of ​​the corresponding purification and dust removal device will be smaller, and the purification efficiency and dust holding capacity will be reduced. A range of 0.1-1 mm can take into account both support and control of the dust collecting plate thickness. The thickness of the semiconductor layer 202 is 0.05-0.5 mm, preferably 0.15 mm. If the thickness of the semiconductor layer 202 is too thin, for example, less than 0.05mm, it will be difficult to process during production and will be easily damaged during actual operation, affecting stability. If the thickness of the semiconductor layer 202 is too thick, for example, greater than 0.5mm, the dust collecting plate will be thicker under the condition that the dimensions of other layers are the same, and the effective ventilation area per unit area of ​​the corresponding purification and dust removal device will be smaller, and the purification efficiency and dust holding capacity will be reduced. The range of 0.05-0.5mm can take into account both conductivity and control of the dust collecting plate thickness. The thickness of the conductive layer 203 is 0.005-0.03mm, preferably 0.01mm.

[0059] Referring to Figure 6 , the length of the conductive layer 203 is shorter than that of the semiconducting layer 202, and the conductive layer 203 extends to the power connection end of the dust collecting plate, where the power connection port 206 is provided. In other words, one end of the conductive layer 203 is flush with the end of the semiconducting layer 202, ensuring stable power connection, while the other end of the conductive layer 203 is not flush with the end of the semiconducting layer 202.

[0060] Referring to Figure 10 , the area of ​​the end of the conductive layer 203 located at the power connection is smaller than the area of ​​the other end of the conductive layer 203. This reduced area of ​​the end of the conductive layer 203 located at the power connection prevents the end of the conductive layer 203 from being too close to the electrical safety distance of the frame of the electrostatic precipitator, which could affect the stable operation of the device later. Specifically, the end of the conductive layer 203 located at the power connection is tilted away from the entrance of the power connection port 206. A first electrical safety area 209 exists between the power connection and the conductive layer 203. Two first electrical safety areas 209 are symmetrically arranged, and the first electrical safety areas 209 are triangular. The symmetrical structural design can maintain the uniformity of the electrical safety distance.

[0061] Referring to Figure 11 , conductive layer 203 has a notch at the end of the power connection, forming a second electrical safety zone 210. Two second electrical safety zones 210 are symmetrically arranged, each in a square shape. This symmetrical structural design maintains a uniform electrical safety distance. Specifically, conductive layer 203 extends to the area between the notch and power connection port 206.

[0062] Specifically, the thickness of the semiconductor layer of the dust collecting plate in the dust collecting layer is the same as the thickness of the semiconductor layer of the dust collecting plate in the non-dust collecting layer, which is beneficial to processing and production.

[0063] It should be noted that the dust collecting layer and non-dust collecting layer of the dust collecting plate are related to the high voltage electricity supplied by the electrostatic precipitator and the high voltage electricity supplied by the front-end ionization device. Specifically, the electrical voltage is designed at the beginning, the high voltage power supply is matched, and the dust collecting plates are matched accordingly during production. For example, the ionization device is a DC positive high voltage, and the particulate matter will be positively charged after passing through the ionization device. The dust collecting plates of the electrostatic precipitator are staggered and stacked. One part of the dust collecting plates is supplied with DC positive high voltage, and the other part of the dust collecting plates is connected to the grounding electrode. For this electrostatic precipitator, the dust collecting plates that supply DC positive high voltage are the non-dust collecting layer dust collecting plates, and the grounded dust collecting plates are the dust collecting layer dust collecting plates.

[0064] Specifically, the thickness of the semiconductor layer of the dust collecting plate in the dust collecting layer is smaller than the thickness of the semiconductor layer of the dust collecting plate in the non-dust collecting layer.

[0065] It should be noted that, while ensuring electrical safety, the semiconductor layer thickness of the dust collecting plates in the dust collecting layer is thinner than that of the non-dust collecting plates. In the initial stages of operation, the accumulation of particulate matter on the dust collecting surface is limited and has no impact on purification efficiency. As operation increases, particulate matter accumulation increases, and the dust layer thickness increases. The thinned semiconductor layer quickly conducts away the particle charge, preventing the formation of back corona and ensuring purification efficiency.

[0066] In order to verify whether the difference in thickness of the semiconductor layer on the dust collecting surface and the non-dust collecting surface affects the purification efficiency of the electrostatic precipitator, the inventors conducted the following experiment to compare electrostatic precipitators with a length of 500 mm, a width of 300 mm, and a thickness of 50.8 mm. Under the same conditions of the ionization device and ionization voltage at the front end, and in the same environment, the changes in PM2.5 purification efficiency of the electrostatic precipitator under long-term operation at two wind speeds were compared. The experimental data are shown in Table 1.

[0067] Table 1:

[0068] It can be intuitively concluded from Table 1 that when the thickness of the semiconductor layer on the dust collecting surface is less than that on the non-dust collecting surface, the semiconductor layer on the dust collecting surface is thinner, which is more conducive to the rapid transfer of charge of the captured particulate matter, and the back corona is not easy to form, which is more conducive to ensuring the purification efficiency of the electrostatic precipitator and improving the dust holding capacity.

[0069] In the production process of the electrostatic precipitator of this embodiment, the interior of the dust collecting plate is a conductive layer, and semiconductor layers are provided on both sides of the conductive layer. Preferably, the conductive layer can be a metal material, such as aluminum foil, copper foil, etc.

[0070] In the production process of the electrostatic precipitator of this embodiment, please refer to FIG. 1 . In step S100 , a rod-shaped component is sequentially inserted into the process holes on the dust collecting plate and the spacer to form a mold core.

[0071] In the production process of the electrostatic precipitator of this embodiment, please refer to Figures 1 to 3. In step S100, a rod-shaped component is used to sequentially penetrate the insulating plate 100, the dust collecting plate 200 and the process hole 800 on the spacer, and is fastened to the outside of the insulating plate 100 to form a core mold, ensuring that the core mold size meets the design size.

[0072] During production, to increase stability, insulating sheets 100 are first threaded onto the edge. These insulating sheets 100 are made of insulating material and have a similar structure to the dust collecting plates 200. Their thickness is set based on strength requirements, and multiple sheets or a single thicker insulating sheet 100 are used. After the insulating sheets 100 are threaded, the dust collecting plates 200, spacers, and dust collecting plates 200 are then threaded alternately, with another insulating sheet 100 finally threaded onto the edge. Alternatively, after the insulating sheets 100 are threaded, spacers, dust collecting plates 200, and spacers are then threaded alternately, with another insulating sheet 100 finally threaded onto the edge.

[0073] It should be noted that the insulating plate 100 can be an insulating rigid plate with high stability or an insulating flexible plate for easy assembly.

[0074] In the production process of the electrostatic precipitator of this embodiment, please refer to Figures 1 to 3. In step S300, insulating glue is poured along the fixed position 204 reserved on the dust collecting plate 200, that is, the insulating glue serves as a fixed isolation member 300, and the fixed position 204 is set at the edge of the dust collecting plate 200.

[0075] Specifically, referring to FIG6 , the fixing position 204 is a semicircular opening, and the cured insulating glue is flush with the edge of the dust collecting plate 200 or protrudes from the edge of the dust collecting plate 200. In some other embodiments, the fixing position 204 may also be a slot-shaped opening, and the cured insulating glue is flush with the edge of the dust collecting plate 200 or protrudes from the edge of the dust collecting plate 200. The design of the semicircular opening forms an equidistant safety distance from the avoidance port 205, and after being glued and fixed, a nearly circular colloid is formed. At the same time, the diameter of the semicircular opening is adapted to the amount of glue, and when the cured insulating glue is flush with the edge of the dust collecting plate 200, the surface flatness and aesthetics can be maintained.

[0076] Among them, after the shallow arc opening is perfused with insulating glue and fixed, a nearly circular colloid is formed, and the circular colloid forms an equidistant safety distance with the avoidance port 205. At the same time, the size of the shallow arc opening is adapted to the amount of glue, and the colloid is flush with the edge of the dust collecting plate, or slightly lower than the edge of the dust collecting plate, that is, part of the colloid is within the shallow arc opening, and part is combined with the dust collecting plate, forming a nearly circular colloid, maintaining surface flatness and aesthetics. Alternatively, the fixing position 204 is a semicircular opening, and the avoidance port 205 is a deep arc opening. After the semicircular opening is perfused with insulating glue and fixed, a nearly circular colloid is formed, and the circular colloid forms an equidistant safety distance with the avoidance port 205. At the same time, the size of the semicircular opening is adapted to the amount of glue, and after the glue is applied, the colloid is flush with the edge of the dust collecting plate, or slightly lower than the edge of the dust collecting plate, that is, part of the colloid is within the semicircular opening, and part is combined with the dust collecting plate, forming a nearly circular colloid, maintaining surface flatness and aesthetics. The design of equidistant safety distance utilizes the natural sedimentation of insulating glue and the combination of insulating glue and dust collecting plate to form a nearly circular colloid, which mainly includes the two forms mentioned above; the design of equidistant safety distance can maximize the proportion of the conductive layer of the dust collecting plate, thereby improving the purification efficiency and dust holding capacity of the electrostatic precipitator and extending the maintenance cycle; the design of equidistant safety distance, in the later stage of the operation of the electrostatic precipitator, a layer of dust will adhere to the surface of the colloid and the surface of the dust collecting plate. The dust will have a certain conductivity when encountering high humidity and other environments, indirectly reducing the safety distance of the electrostatic precipitator. At this time, the dust collecting plates and colloids connected with different potential voltages will generate leakage current due to the reduction of the electrical safety distance, thereby reducing the purification efficiency of the electrostatic precipitator and reducing the maintenance cycle.

[0077] During production, after the stringing process is completed, the mold core is formed and corrected by a right-angle tool. At this time, glue is applied along the fixing position 204. The gluing can be done by an automated process or by manual gluing. The insulating glue has high bonding strength and can withstand high and low temperature impacts, such as the PUR glue on the market. Hot melt glue can also be used for fixation. The application field of electrostatic dust removal devices fixed with hot melt glue is limited. It cannot be used in environments with large temperature differences throughout the year or large temperature differences between morning and evening. Hot melt glue easily softens when exposed to high temperatures and cracks when exposed to low temperatures. After the glue is cured on one side of the mold core, it is turned over and proofread with a right-angle tool to prevent displacement. After proofreading with the right-angle tool, glue is applied to the other side of the mold core along the fixing position 204. Generally, gravity is used to glue the top of the mold core.

[0078] In addition, please refer to Figure 7. The interior of the fixed position 204 is provided with a groove 208 facing the avoidance port 205. The groove 208 increases the contact area between the fixed position 204 and the colloid, and can realize vertical gluing. Vertical gluing can be carried out on two sides at the same time, and the production speed is faster. The design of the groove 208 allows more colloid to be immersed in the groove 208 when vertically gluing, and a combination of the colloid and the dust collecting plate can be formed in the groove 208, so that the contact area is larger and the firmness is better.

[0079] In the production process of the electrostatic precipitator of this embodiment, please refer to Figures 1 to 3 and 8. In step S300, a rigid insulating member is installed along the fixed position 204 reserved on the dust collecting plate 200, that is, the rigid insulating member serves as a fixed isolation member 300, and a dust collecting plate seam 301 for accommodating the dust collecting plate 200 is opened on the rigid insulating member.

[0080] It should be noted that at the contact point between the rigid insulator and the dust collecting plate 200, the width of the rigid insulator increases along the length direction of the dust collecting plate 200. At the same time, the rigid insulator opens a dust collecting plate seam 301 to better clamp the dust collecting plate 200, increase the fixed contact area of ​​the dust collecting plate 200, and ensure the stability of the spacing between the dust collecting plates 200.

[0081] In addition, a rigid insulator can be installed on one side of the model, and insulating glue can be poured into the other side of the model. In some other embodiments, a rigid insulator can be used to clamp the dust collecting plate 200, and then insulating glue can be poured into it to fix it and increase stability.

[0082] Specifically, the dust collecting plate seam 301 is set to a closing structure (that is, the size of the opening part of the dust collecting plate seam 301 is smaller than its internal size), and prestressing is preset after the dust collecting plate 200 is clamped to increase the fixing strength. In addition, the dust collecting plate seam 301 is set to an anti-slip structure (that is, the inner wall of the dust collecting plate seam 301 is a non-smooth surface, and its inner wall is provided with anti-slip protrusions or anti-slip teeth). After the dust collecting plate 200 is clamped, it is not easy to loosen. At the same time, the anti-slip structure can minimize the use of insulating glue. It should be noted that the dust collecting plate seams 301 do not need to be all set to anti-slip structures, and can be set at intervals, that is, some of the dust collecting plate seams 301 are anti-slip structures.

[0083] In the production process of the electrostatic precipitator of this embodiment, please refer to FIG. 1 to FIG. 3 . In step S300 , the rod-shaped component is removed and the spacer is pulled out from the end of the mold core.

[0084] It should be noted that the rod-shaped component can be either metal or non-metallic and requires good rigidity. The rod-shaped component must be perfectly aligned with the process hole 800 . The diameter of the rod-shaped component must be smaller than the diameter of the process hole 800 , with a clearance of 0.5±0.1mm to ensure the structural shape of the mold core.

[0085] At the same time, the width of the spacer is smaller than the width of the dust collecting plate 200, and the length of the spacer is longer than the length of the dust collecting plate 200, making it easier to disassemble. The spacers are identical in size and can be set to different thicknesses to meet the design requirements of the dust collecting plate gap. Generally, when insulating adhesive is used as the fixed spacer 300, the dust collecting plate gap is 0.5-3mm. When rigid insulating members are used as the fixed spacer 300, or when rigid insulating members are combined with insulating adhesive, the dust collecting plate gap can be larger.

[0086] In the production process of the electrostatic precipitator of this embodiment, please refer to Figures 1 to 6. In step S500, a conductor 500 is installed at the end of the mold core, and the end of the mold core is insulated with insulating glue to form an insulating glue layer 400. Specifically,

[0087] When the process holes 800 are provided at both ends of the dust collecting plate 200, an insulating gap 207 is provided between the process holes 800 and the conductive layer 203 to form a safe distance, and the production process is cumbersome. In order to maintain the stability of the mold core, after removing the isolating member, the rod-shaped member is inserted into the mold core again along the process hole 800. At this time, a stable structure is formed by the rod-shaped member and the fixed isolating member 300, and the model will not be displaced or loosened. The conductor 500 is installed in the power connection port 206 at the end of the dust collecting plate 200, and the two ends of the mold core are placed in the glue injection container in turn. The glue injection container is filled with insulating glue. After the insulating glue is solidified, the rod-shaped member is removed.

[0088] It should be noted that after assembly, the insulating adhesive layer 400 directly seals the process hole 800 and the power port 206. However, after the rod-shaped component is removed, part of the process hole 800 is exposed. During the operation of the electrostatic precipitator, the exposed part of the process hole 800 is likely to form a purification blind spot.

[0089] Specifically, the power connection port 206 adopts a closed-end structure, and the conductor 500 is inserted into the power connection port 206 to achieve power connection. The closed-end structure of the power connection port 206 generates an inward force on the conductor 500, so that the conductor 500 and the conductive layer 203 are more closely fitted.

[0090] Preferably, as shown in FIG6 , the power port 206 of the closed-end structure includes an open end and a closed end, with a protruding end disposed between the open and closed ends. The conductor 500 enters the power port 206 through the open end. The power port 206 of the closed-end structure has an upper base of an isosceles trapezoid as the open end, a lower base of the isosceles trapezoid as the closed end, and a waist of the isosceles trapezoid as the protruding end. The protruding end exerts an inward force on the conductor 500, achieving a snap-together connection between the power port 206 and the conductor 500. The protruding end forms an angle of 10-25° with the horizontal. When this angle is less than 10°, the power port 206 and the conductor 500 are easier to snap into, but the resulting connection is less secure. When this angle is greater than 25°, the power port 206 and the conductor 500 are more difficult to snap into, but the resulting connection is more secure. When the angle is 15°, the power port 206 and the conductor 500 are easier to snap into, and the resulting connection is more secure. In addition, an arc matching the conductor 500 may be provided at the protruding end, so that after the conductor 500 is inserted into the power connection port 206 , a portion of the conductor 500 falls into the arc, making the insertion tighter.

[0091] In some other embodiments, the cross-section of the power connection port 206 of the closed-end structure is in the shape of an arc, and the contact area between the arc and the conductor 500 is increased, and the power connection stability is better. Preferably, the arc is a preferred arc. The diameter of the conductor 500 matches the arc, and the gap is 0.2-1mm. When the gap is less than 0.2mm, the gap between the conductor 500 and the arc is too small, making it difficult to snap together, and the production and processing technology requirements are too high. When the gap is greater than 1mm, the gap between the conductor 500 and the arc is too large, and it will become loose after snapping together, resulting in poor power connection stability.

[0092] In the production process of the electrostatic precipitator of this embodiment, please refer to Figures 1 to 5 and 9. In step S500, a conductor 500 is installed at the end of the mold core, and the end of the mold core is insulated with insulating glue to form an insulating glue layer 400. Specifically,

[0093] When the process hole 800 is provided at one end of the dust collecting plate 200, the distance between the process hole 800 and the end of the dust collecting plate 200 is 2-5mm. The process hole 800 also serves as a power connection port. At this time, there is no need to set an insulating gap between the process hole 800 and the conductive layer 203, thereby reducing the difficulty of processing. The rod-shaped component serves as a conductor 500. After removing the isolating member, the rod-shaped component is inserted into the mold core again along the process hole 800. At this time, a stable structure is formed by the rod-shaped component and the fixed isolating member 300, and the model will not be displaced or loosened. The two ends of the mold core are placed in a glue injection container in turn. The glue injection container is filled with insulating glue. After the insulating glue is cured, the process hole 800 is directly sealed without removing the rod-shaped component again, thereby simplifying the production process.

[0094] It should be noted that there is a rod-shaped component serving as the conductor 500 in the process hole 800. After assembly, the insulating adhesive layer 400 directly seals the process hole 800 and the power port 206, that is, the process hole 800 and the power port 206 are covered, solving the purification blind spot problem.

[0095] Specifically, the edge of the conductive layer 203 is equidistant from the fixed position 204 and the avoidance port 205. The edge shape of the conductive layer 203 is designed based on the shape of the fixed position 204 and the avoidance port 205 to maximize the proportion of the conductive layer 203 without affecting electrical safety. This helps to increase the area of ​​the electrostatic precipitator for capturing particulate matter, increase the action time on particulate matter, improve the purification efficiency of particulate matter, and correspondingly increase the dust holding capacity of the electrostatic precipitator. Referring to Figure 12, the fixed reserved port 204 and the avoidance port 205 are both semicircular, so the edge of the conductive layer 203 is similar to a wave. Referring to Figure 9, the avoidance port 205 is a slot-shaped port, so the edge of the conductive layer 203 is similar to a rectangular tooth.

[0096] In order to verify whether the conductive layer 203 of different shapes affects the purification efficiency of the electrostatic precipitator, the inventors conducted the following experiment to compare electrostatic precipitators with a length of 500 mm, a width of 400 mm, and a thickness of 50.8 mm. When the front end had the same ionization device and ionization voltage, and under the same environment, the PM2.5 purification efficiency of the electrostatic precipitator was compared at two wind speeds. The experimental data are shown in Table 2.

[0097] Table 2:

[0098] Table 2 shows that the wavy conductive layer 203 (see Figure 12) has the largest proportion, achieving the highest PM2.5 purification efficiency at both wind speeds. The square conductive layer 203 (see Figure 9) has the second-highest proportion after the wavy conductive layer, also achieving relatively high PM2.5 purification efficiency. At high wind speeds of 4 m / s, the standard conductive layer 203 (see Figure 6) has the smallest proportion, and its efficiency is the most significantly different from the wavy and square conductive layers. Therefore, increasing the proportion of the conductive layer 203 is beneficial for ensuring the PM2.5 purification efficiency of the electrostatic precipitator, and this increased efficiency also increases the dust holding capacity of the electrostatic precipitator.

[0099] In the production process of the electrostatic precipitator of this embodiment, please refer to Figures 1 to 5 and 9. In step S500, a conductor 500 is installed at the end of the mold core, and the end of the mold core is insulated with insulating glue to form an insulating glue layer 400. Specifically,

[0100] When the process hole 800 is provided at one end of the dust collecting plate 200, the distance between the process hole 800 and the end of the dust collecting plate 200 is 2-5 mm. The process hole 800 also serves as an electrical connection port. In this case, no insulating gap is required between the process hole 800 and the conductive layer 203, reducing the difficulty of processing. After removing the isolating member, the rod-shaped component is inserted into the mold core again along the process hole 800. At the same time, the rod-shaped component guides the conductor 500 into the process hole 800. The two ends of the mold core are sequentially placed in a glue injection container containing insulating glue. After the insulating glue cures, the process hole 800 is directly sealed.

[0101] It should be noted that there is a conductor 500 in the process hole 800. After assembly, the insulating adhesive layer 400 directly seals the process hole 800 and the power port 206, that is, the process hole 800 and the power port 206 are covered, solving the purification blind area problem.

[0102] Specifically, the glue injection container is paved with isolation paper or an insulating thin layer.

[0103] During production, place the end of the mold core with the conductor 500 into the glue injection container. Keep the conductor 500 tight and prevent it from sagging. Then slowly pour in insulating glue, such as epoxy or silicone. Alternatively, depending on the amount of insulating glue required for each mold core, pour the insulating glue first and then slowly place the end of the mold core. After the insulating glue on one end of the mold core cures, cure the other end of the mold core in the same manner.

[0104] It should be noted that before curing, the height of the insulating adhesive should be 3-5 mm higher than the conductor. After curing, the height of the insulating adhesive layer 400 should be 2-4 mm higher than the conductor. Different insulating adhesives have different shrinkage rates, and the appropriate height should be controlled based on the insulation requirements. Furthermore, the grounded dust collecting plate and the high-voltage dust collecting plate are offset, resulting in a gap between their ends. The insulating adhesive layer 400 may either not cover or cover this gap.

[0105] In the production process of the electrostatic precipitator of this embodiment, referring to Figures 1 to 4 , the insulated core is placed in a frame 700. Meanwhile, the conductor 500 is electrically connected to the frame 700 via a wire 600. Furthermore, a high-voltage power supply is provided inside or outside the frame 700, that is, the high-voltage power supply can be internal or external.

[0106] The present invention has been described in detail above. The above description is only a preferred embodiment of the present invention and should not limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made within the scope of this application should still fall within the scope of the present invention.

Claims

1. A production process for an electrostatic precipitator, characterized in that: The following steps are involved: S100, alternately placing dust collecting plates and spacers in sequence to form a mold core; S300, installing the fixed isolation piece along the fixed position reserved on the dust collecting plate, and removing the spacer; S500, installing a conductor at the end of the mold core, and insulating the end of the mold core with insulating glue.

2. The production process of an electrostatic precipitator according to claim 1, characterized in that: In step S100, the placement order of the dust collecting plates and the spacers is adjustable, and the dust collecting plates include grounded dust collecting plates and high-pressure dust collecting plates that are alternately stacked, and the grounded dust collecting plates and the high-pressure dust collecting plates are staggered 180° and have the same structure.

3. The production process of an electrostatic precipitator according to claim 1, characterized in that: The interior of the dust collecting plate is an insulating layer, semiconductor layers are arranged on both sides of the insulating layer, and a conductive layer is arranged between the insulating layer and the semiconductor layer.

4. The electrostatic precipitator production process according to claim 3, characterized in that: The manufacturing method of the dust collecting plate is: Conductive layers are printed symmetrically on both sides of the insulating layer, an adhesive layer is applied after the conductive layer is dried, a semiconductor layer is pasted or bonded on the adhesive layer, and after flipping, the semiconductor layer is pasted or bonded on the other side of the conductive layer in the same way, and a dust collecting plate that meets the design size requirements is cut or punched out on the equipment.

5. The production process of an electrostatic precipitator according to claim 3, characterized in that: The thickness of the semiconductor layer of the dust collecting plate in the dust collecting layer is less than the thickness of the semiconductor layer of the dust collecting plate in the non-dust collecting layer.

6. The production process of an electrostatic precipitator according to claim 1, characterized in that: The interior of the dust collecting plate is a conductive layer, and semiconductor layers are arranged on both sides of the conductive layer.

7. The electrostatic precipitator production process according to claim 2, characterized in that: In step S100, a rod-shaped component is sequentially inserted into the process holes on the dust collecting plate and the spacer to form a mold core.

8. The production process of an electrostatic precipitator according to claim 7, characterized in that: In step S100, insulating plates are provided on both sides of the mold core, and a rod-shaped component is sequentially inserted into the process holes on the insulating plate, the dust collecting plate and the spacer, and is fastened on the outer side of the insulating plate to form a mold core.

9. The production process of an electrostatic precipitator according to claim 1, characterized in that: In step S300, insulating glue is poured along the fixed position reserved on the dust collecting plate, and the fixed position is set at the edge of the dust collecting plate.

10. The production process of an electrostatic precipitator according to claim 1, characterized in that: In step S300, a rigid insulating member is installed along a fixed position reserved on the dust collecting plate, and a dust collecting plate seam for accommodating the dust collecting plate is provided on the rigid insulating member.

11. A production process for an electrostatic precipitator according to claim 9 or 10, characterized in that: In step S300 , the rod-shaped member is removed and the spacer is extracted from the end of the mold core.

12. The production process of an electrostatic precipitator according to claim 7, characterized in that: In step S500, a conductor is installed at the end of the mold core, and the end of the mold core is insulated by using insulating glue, specifically: When the two ends of the dust collecting plate are provided with the process holes, the rod-shaped component is inserted into the process hole again, a conductor is installed in the power connection port at the end of the dust collecting plate, and the two ends of the mold core are placed in the glue injection container in turn, wherein the glue injection container contains insulating glue, and after the insulating glue is cured, the rod-shaped component is removed.

13. The production process of an electrostatic precipitator according to claim 7, characterized in that: In step S500, a conductor is installed at the end of the mold core, and the end of the mold core is insulated by using insulating glue, specifically: When the process hole is provided at one end of the dust collecting plate, the rod-shaped component is used as a conductor, and the rod-shaped component is inserted into the process hole again, and the two ends of the mold core are placed in the glue injection container in turn. The glue injection container is filled with insulating glue, and the process hole is directly sealed after the insulating glue is cured.

14. The production process of an electrostatic precipitator according to claim 7, characterized in that: In step S500, a conductor is installed at the end of the mold core, and the end of the mold core is insulated by using insulating glue, specifically: When the process hole is provided at one end of the dust collecting plate, the rod-shaped component guides the conductor to penetrate into the process hole, and the two ends of the mold core are placed in the glue injection container in turn. The glue injection container contains insulating glue, and the process hole is directly sealed after the insulating glue is cured.

15. A production process for an electrostatic precipitator according to any one of claims 12 to 14, characterized in that: The glue injection container is paved with isolation paper or an insulating thin layer.

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