Acrylate composition containing BMI resin and use

Abstract

The present invention provides an acrylate composition containing a BMI resin and a use. A conductive silver adhesive is obtained by using a liquid BMI resin with maleimide as a terminal group and maleic anhydride grafted polybutadiene as oligomers, combining with monofunctional and bifunctional acrylate monomers, a peroxide initiator, a silane coupling agent and silver powder, and fully and uniformly dispersing same, and the conductive silver adhesive can be rapidly cured under the mild condition of 120°C×30 min, so as to achieve low-temperature rapid curing. In addition, a cured product obtained by the acrylate composition of the BMI resin and the maleic anhydride grafted polybutadiene has low volume resistivity, low thrust at normal temperature (23°C), good failure surface, good bonding strength at a high temperature (300°C) and good reflow soldering resistance. The acrylate composition can be applied to semiconductor device packaging, especially IC chip mounting.

Description

Acrylate composition containing BMI resin and application thereof

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 12, 2023, with application number 202311703291.6 and invention name “An acrylic composition containing BMI resin and its application”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention belongs to the technical field of semiconductor packaging or microelectronic device packaging, and in particular relates to an acrylate composition containing BMI resin and an application thereof. Background Art

[0003] Adhesives perform numerous functions in the fabrication and assembly of semiconductor packaging and microelectronic devices, including bonding, fixing, sealing, gap filling, grounding, insulation, and flame retardancy. The most common application is attaching electronic components or integrated circuit chips to lead frames or plastic substrates. After curing through baking, wire bonding, and EMC encapsulation with epoxy molding compound, the encapsulated device undergoes high-temperature reflow soldering, becoming a printed circuit board component or a key electrical component. Adhesives used in electronic packaging typically must meet several basic properties for ease of use, including suitable rheological properties to accommodate various application scenarios; a low curing temperature and time; good mechanical strength and low moisture absorption after curing to withstand the high temperatures of multiple reflow processes; and an appropriate coefficient of thermal expansion (CTE) relative to the substrate and molding compound.

[0004] Currently, the mainstream adhesive baking and curing process for chip mounting uses a temperature of 175°C or higher, and the curing time is as long as 1 hour or more. Although low-temperature curing adhesives on the market can achieve lower temperatures and shorter curing times, they cannot achieve both low volume resistivity and sufficiently high mechanical properties. In particular, the latter deficiency often leads to adhesive failure, crystal shedding, etc. during the subsequent high-temperature reflow soldering process.

[0005] Chinese patent CN109439268A discloses a low glass transition temperature, low silver content conductive adhesive. The adhesive uses multifunctional (functionality 6-9) polybutadiene-based polyurethane acrylate and multifunctional (functionality 1.5-3) VTBN (vinyl-terminated nitrile rubber) as base oligomers, supplemented with a reactive acrylic monomer diluent / peroxide and other additives. The system cures quickly, but the bonding strength is low.

[0006] Chinese patent CN103740311A discloses a dual curing mechanism of epoxy resin cation thermally initiated curing and acrylate free radical thermally initiated curing. Although it can achieve fast curing, the large amount of acrylic monomer involved in the curing reduces the heat resistance of the epoxy cured product.

[0007] Chinese patent CN111732929A discloses a low-curing temperature adhesive and its preparation method, which achieves low-temperature curing by adding nitro-substituted styrene and a transition metal catalyst. However, metal ions remain in the cured product after curing, which is not conducive to maintaining long-term electrical performance stability.

[0008] BMI (bismaleimide) resin is an important packaging material with excellent mechanical properties, high temperature resistance, and good resistance to moisture and heat. However, the chemical structure of commercial products contains a large number of cyclic rigid structures, resulting in a very high melting point. If dissolved in a solvent, a solvent removal process step must be added during subsequent use. Therefore, this type of material is inconvenient to process and use. Summary of the Invention

[0009] The first object of the present invention is to provide an acrylate composition containing a BMI resin.

[0010] To this end, the above-mentioned purpose of the present invention is achieved through the following technical solutions:

[0011] An acrylate composition containing a BMI resin, comprising:

[0012] The monofunctional acrylate monomer is 22.5 to 33 parts, the difunctional acrylate monomer is 18 to 27.5 parts, the maleic anhydride grafted polybutadiene is 22.5 to 36.7 parts, the BMI-PPG polymer is 15 to 27.5 parts, the peroxide is 1 to 2 parts, and the coupling agent is 1 to 2 parts;

[0013] BMI-PPG polymer is a flowable liquid at room temperature.

[0014] As a preferred technical solution of the present invention: the acrylate composition containing BMI resin comprises:

[0015] In parts by mass, the monofunctional acrylate monomer is 22.5 to 33 parts, the difunctional acrylate monomer is 18 to 27.5 parts, the maleic anhydride grafted polybutadiene is 22.5 to 36.7 parts, the BMI-PPG polymer is 15 to 27.5 parts, the peroxide is 1 to 2 parts, and the coupling agent is 1 to 2 parts;

[0016] BMI-PPG polymer is a flowable liquid at room temperature.

[0017] While adopting the above technical solutions, the present invention may also adopt or combine the following technical solutions:

[0018] As a preferred technical solution of the present invention: the acrylate composition containing BMI resin comprises:

[0019] a1 part of monofunctional acrylate monomer, a2 part of difunctional acrylate monomer, b part of maleic anhydride grafted polybutadiene, c part of BMI-PPG polymer, d part of peroxide, and e part of coupling agent;

[0020] Where: a1+a2+b+c=100;

[0021] a1 / a2=1~1.5; a1+a2=45~55;

[0022] c / b=0.5~1.

[0023] Specifically, a1+a2+b+c=100, a1 / a2=23 / 23=1, a1+a2=23+23=46, c / b=18 / 36=0.5;

[0024] Or a1+a2+b+c=100, a1 / a2=23 / 23=1, a1+a2=23+23=46, c / b=27 / 27=1;

[0025] Or a1+a2+b+c=100, a1 / a2=25.2 / 25.2=1, a1+a2=25.2+25.2=50.4, c / b=20.6 / 29.0=0.71;

[0026] Or a1+a2+b+c=100, a1 / a2=33 / 22=1.5, a1+a2=33+22=55, c / b=15 / 30=0.5;

[0027] Or a1+a2+b+c=100, a1 / a2=33 / 22=1.5, a1+a2=33+22=55, c / b=22.5 / 22.5=1.

[0028] As a preferred technical solution of the present invention: the monofunctional acrylate monomer is: isobornyl acrylate (IBOA), isobornyl methacrylate, tetrahydrofuran acrylate (THFA), tetrahydrofuran methacrylate; methyl acrylate, methyl methacrylate (MMA), N,N-dimethylacrylamide (DMAA); cyclotrimethylolpropane formal acrylate (CTFA), diphenoxyethyl acrylate (PHEA), Beta-hydroxyethyl acrylate, tetrahydrofurfuryl (meth)acrylate; isooctyl acrylate, lauryl acrylate, isodecyl acrylate, tridecyl acrylate, octadecyl acrylate, stearic methacrylate; at least one of isooctyl methacrylate, lauryl methacrylate, and N,N-dimethylacrylamide.

[0029] As a preferred technical solution of the present invention: the bifunctional acrylate monomer is at least one of 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol 400 diacrylate, tetra(ethylene glycol) diacrylate, tripropylene glycol diacrylate, hydroxyl pivalic neopentyl glycol diacrylate, tricyclodecane dimethanol diacrylate, and neopentyl glycol polymethyl ethylene oxide diacrylate.

[0030] As a preferred technical solution of the present invention: the chemical structural formula of the maleic anhydride grafted polybutadiene is as follows:

[0031] The number average molecular weight of the maleic anhydride grafted polybutadiene is 2500-5000.

[0032] As a preferred technical solution of the present invention: the viscosity of the maleic anhydride grafted polybutadiene at 25° C. is 5 kcps to 50 kcps.

[0033] As a preferred technical solution of the present invention: the maleic anhydride grafted polybutadiene contains an average of 2 to 5 maleic anhydride groups per molecule.

[0034] As a preferred technical solution of the present invention: the maleic anhydride grafted polybutadiene is at least one of 131MA5, 131MA8 and 130MA10 produced by Cray Valley.

[0035] As a preferred technical solution of the present invention: the chemical structural formula of the BMI-PPG polymer is as follows:

[0036] Wherein, n is 5 to 20;

[0037] The terminal groups of BMI-PPG polymer are maleimide groups, and the main chain has propylene oxide repeating units;

[0038] At room temperature, for example, at 25°C, it is a reddish-brown viscous flowable liquid with a viscosity of 5-40 kcps@10 rpm (data obtained by testing in accordance with GB / T22314-2008 "Determination of viscosity of plastic epoxy resins").

[0039] As a preferred technical solution of the present invention: the BMI-PPG polymer is maleimide-terminated polyoxypropylene 400, and the viscosity at 25°C is 25-30 kcps@10rpm;

[0040] or maleimide-terminated polyoxypropylene 1000, with a viscosity of 5 to 10 kcps @ 10 rpm at 25°C.

[0041] As a preferred technical solution of the present invention: the peroxide is at least one of benzoyl peroxide (BPO), tert-butyl peroxy-2-ethylhexanoate, di-tert-butyl peroxide, tert-butyl peroxybenzoate, tert-butyl peroxyneodecanoate, tert-amyl peroxy-2-ethylhexanoate (Arkema Luperox 575), cumene hydroperoxide (CHPO), di-tert-butyl peroxide (DTBP), diisopropyl peroxide (DCPD), tert-amyl peroxyneodecanoate, and diisopropyl peroxydicarbonate.

[0042] As a preferred technical solution of the present invention: the coupling agent is at least one of a silane coupling agent and a titanate coupling agent;

[0043] The silane coupling agent is at least one of KH-560 and KH-570;

[0044] The titanate coupling agent is at least one of NDZ-401 and NDZ-201.

[0045] In a specific embodiment of the present invention, the acrylate composition containing BMI resin includes:

[0046] 23 parts IBOA, 23 parts 238NS, 36 parts 131MA8, 18 parts BMI-PPG1000, 1 part CHPO, and 1 part KH570;

[0047] or 23 parts IBOA, 23 parts 238NS, 27 parts 131MA8, 27 parts BMI-PPG1000, 1 part CHPO, and 1 part KH570;

[0048] or 25.2 parts IBOA, 25.2 parts 238NS, 29 parts 131MA8, 20.6 parts BMI-PPG1000, 1 part CHPO, and 1 part KH570;

[0049] or 33 parts IBOA, 22 parts 238NS, 30 parts 131MA8, 15 parts BMI-PPG1000, 1 part CHPO, and 1 part KH570;

[0050] or 33 parts IBOA, 22 parts 238NS, 22.5 parts 131MA8, 22.5 parts BMI-PPG1000, 1 part CHPO, and 1 part KH570;

[0051] or includes 23 parts IBOA, 23 parts 238NS, 27 parts 131MA8, 27 parts BMI-PPG400, 1 part CHPO, and 1 part KH570;

[0052] Or include 33 parts IBOA, 22 parts 238NS, 30 parts 131MA8, 15 parts BMI-PPG400, 1 part CHPO and 1 part KH570.

[0053] The present invention preferably prepares the acrylate composition containing BMI resin according to the following method:

[0054] 22.5 to 33 parts of a monofunctional acrylate monomer, 18 to 27.5 parts of a difunctional acrylate monomer, 22.5 to 36.7 parts of maleic anhydride grafted polybutadiene, 15 to 27.5 parts of a BMI-PPG polymer, 1 to 2 parts of a peroxide, and 1 to 2 parts of a coupling agent are mixed under stirring to obtain an acrylate composition containing a BMI resin.

[0055] The stirring rate used in preparing the acrylic ester composition containing the BMI resin is 750 to 850 rpm and the stirring time is 13 to 17 minutes.

[0056] The second object of the present invention is to provide applications of the aforementioned acrylate composition containing BMI resin.

[0057] To this end, the above-mentioned purpose of the present invention is achieved through the following technical solutions:

[0058] The aforementioned application of the BMI resin-containing acrylate composition for semiconductor device packaging includes adding conductive silver powder to the BMI resin-containing acrylate composition to obtain a conductive adhesive, which is then used for semiconductor device packaging. Preferably, the conductive silver powder is added to the BMI resin-containing acrylate composition, dispersed under stirring, and then vacuum degassed to obtain the conductive adhesive; the stirring rate is 750-850 rpm, the dispersion time is 13-17 minutes, and the vacuum degassed time is 9-11 minutes.

[0059] While adopting the above technical solutions, the present invention may also adopt or combine the following technical solutions:

[0060] As a preferred technical solution of the present invention: the conductive silver powder is in the form of spheres, flakes or a mixture of the two;

[0061] The conductive silver powder is preferably micron-sized flake conductive silver powder with an average particle size of 0.3 to 30 μm, preferably 1 to 15 μm.

[0062] As a preferred technical solution of the present invention: the amount of conductive silver powder is not less than 300 parts.

[0063] As a preferred technical solution of the present invention: the conductive silver powder is preferably at least one of Technic's silver powder Technic-077, Metalor's silver powder AA3462, AA-192N, P543-14, and Ames Goldsmith's silver powder KP84 and KP74.

[0064] It should be noted that the monofunctionality and difunctionality in the present invention refer to the number of acrylate functional groups in the acrylate monomer being one and two, respectively.

[0065] The present invention provides an acrylate composition containing BMI resin and its application. The composition adopts a liquid BMI resin with maleimide as an end group and maleic anhydride grafted polybutadiene as oligomers, and is combined with monofunctional and difunctional acrylate monomers, a peroxide initiator, a silane coupling agent and silver powder. After being fully and evenly dispersed, a conductive silver paste is obtained. The composition can be rapidly cured under mild conditions of 120°C for 30 minutes, thereby achieving low-temperature rapid curing. At the same time, the cured product obtained from the acrylate composition of the BMI resin and maleic anhydride grafted polybutadiene has low volume resistivity, low thrust at room temperature (23°C), a good failure surface, good bonding strength at high temperature (300°C), and excellent reflow resistance. The composition can be used in semiconductor device packaging, especially IC chip mounting. DETAILED DESCRIPTION

[0066] To further illustrate the present invention, an acrylate composition containing BMI resin and its application provided by the present invention are described in detail below with reference to examples, but they should not be construed as limiting the scope of protection of the present invention.

[0067] Example

[0068] 1. Test preparation

[0069] 1.1 Test materials

[0070] 1.2 Performance Testing

[0071] Adhesive strength test: The test method refers to "HG / T 5912-2021 Conductive Adhesives".

[0072] The silicon wafer size is 2 mm × 2 mm; the substrate is a silver-plated copper sheet, and the curing conditions are a hot plate at 120°C for 30 min. The testing equipment is a DAGE-4000P multi-function push-pull testing machine (Nordson DAGE Precision Industries LTD, USA) with a temperature-controlled heating plate. The shear strength is the thrust force (unit: kgF). Five specimens of each adhesive sample are taken, and the arithmetic mean is calculated.

[0073] Volume resistivity test: Refer to the four-probe method of the industry standard "HG / T 5912-2021 Conductive Adhesives".

[0074] Conductive film preparation: On a glass substrate, a conductive adhesive with a thickness of 25 μm, a width of 9 mm, and a length of 50 mm was prepared using a controlled-thickness tape scraping method. The film was then cured at 120°C for 30 min.

[0075] The resistance tester is the TH2516 DC resistance tester produced by Changzhou Tonghui Electronics Co., Ltd.

[0076] Damage surface assessment: The residual adhesive on the substrate after thrust damage is observed under an optical microscope, and the area ratio of the residual adhesive portion (as a percentage of the chip area) is evaluated using a 10-point scale, with 100% residual adhesive corresponding to 10; 90% residual adhesive corresponding to 9, and so on. 10% residual adhesive corresponds to 1; 0% residual adhesive corresponds to 0; the arithmetic average of 10 samples is taken.

[0077] 2. Experimental process

[0078] 2.1 Preparation of BMI-PPG

[0079] (1) Preparation of BMI-PPG400

[0080] Dissolve 253.5g (1.5mol) of maleimidopropionic acid in 2500ml of dichloromethane, then dissolve 309g (1.5mol) of dicyclohexylcarbodiimide (DCC) powder in 300ml of dichloromethane. Slowly add the DCC solution dropwise to the maleimidopropionic acid solution while stirring. Once complete, continue stirring and react for 10 minutes. Then, add 200g (0.5mol) of PPG-400. Finally, slowly add 6.1g (0.05mol) of 4-dimethylaminopyridine (DMAP) powder. The reaction is stopped after 8 hours. Filter to remove insoluble matter, extract the filtrate with water in a separatory funnel, combine the organic layers, dry over anhydrous Na2SO4, and spin-dry to obtain a red, viscous liquid. After cooling, a small amount of solid precipitates. Filter again to obtain the final product in a yield of 98%.

[0081] The NMR spectrum data are as follows:

[0082] 1 H NMR (600MHz, Chloroform-d) δ6.66 (s, 4H), 3.76 (p, J = 7.9, 7.3Hz, 4H), 3.63-3.32 (m, 21H), 2.58 (t, J = 7.2Hz, 4H), 1.46-0.83 (m, 18H).

[0083] The viscosity at 25°C is 25-30 kcps @ 10 rpm. The viscosity test is based on the national standard GB / T 22314-2008, "Determination of Viscosity of Epoxy Resins, Plastics," using the Anton Paar Rheolab QC viscometer with a Z5 rotor.

[0084] (2) Preparation of BMI-PPG1000

[0085] Dissolve 253.5g (1.5mol) of maleimidopropionic acid in 2500ml of dichloromethane, then dissolve 309g (1.5mol) of dicyclohexylcarbodiimide (DCC) powder in 300ml of dichloromethane. Slowly add the DCC solution dropwise to the maleimidopropionic acid solution while stirring. Once complete, continue stirring and react for 10 minutes. Then, add 500g (0.5mol) of PPG-1000. Finally, slowly add 6.1g (0.05mol) of 4-dimethylaminopyridine (DMAP) powder. The reaction is stopped after 8 hours. Filter to remove insoluble matter, extract the filtrate with water in a separatory funnel, combine the organic layers, dry over anhydrous Na2SO4, and spin-dry to obtain a red, viscous liquid. After cooling, a small amount of solid precipitates. Filter again to obtain the final product in a yield of 98%.

[0086] The NMR spectrum data are as follows:

[0087] 1 H NMR (600MHz, Chloroform-d) δ6.67 (s, 4H), 3.78 (t, J = 7.2Hz, 4H), 3.61-3.26 (m, 52H), 2.60 (t, J = 7.1Hz, 4H), 1.29-0.98 (m, 51H).

[0088] The viscosity at 25°C is 5-10 kcps @ 10 rpm. The viscosity test is based on the national standard GB / T22314-2008, "Determination of Viscosity of Plastic Epoxy Resins," using the Anton Paar Rheolab QC viscometer with a Z5 rotor.

[0089] 2.2 Preparation of Conductive Adhesive (Taking Example 1 as an Example)

[0090] Weigh 18 parts of BMI-PPG1000 (see Section 2.1 for self-production), 36 parts of liquid polybutadiene 131MA8 grafted with maleic anhydride groups, 23 parts of isobornyl acrylate, 23 parts of difunctional acrylate monomer 238NS, 1 part of peroxide CHPO, and 1 part of silane coupling agent KH-560, add them to a mixing kettle, mix at 800 rpm for 15 minutes, then add 300 parts of silver powder, disperse at 800 rpm for 15 minutes, and then vacuum degas for 10 minutes, with a vacuum degree of <-0.095 MPa; discharge at normal pressure to obtain a conductive adhesive.

[0091] Table 1

[0092] Table 2

[0093] 3. Discussion of results

[0094] Volume resistivity:

[0095] The higher the content of the two monomers (monofunctional acrylate monomer and difunctional acrylate monomer), the lower the overall volume resistivity. That is, a high content of oligomers (BMI-PPG resin and 131MA8) is not conducive to reducing the volume resistivity. For example, the total amount of monomers in Examples 3, 4, and 5 is 50 to 55 parts relative to the total amount of monomers in Examples 1 and 2, which is 46 parts. The volume resistivity increases from 12×10 -5 ~18×10 -5 Ω·cm is reduced to less than 10×10 -5 Ω·cm.

[0096] With reference to Example 1 and Example 2 as well as Example 4 and Example 5, when the monomer contents are similar, the higher the relative content of the oligomer 131MA8 is, the greater the volume resistivity is.

[0097] Referring to Examples 2 and 6 as well as Examples 4 and 7, BMI-PPG400 replaces BMI-PPG1000, resulting in a slight increase in volume resistivity under the same conditions.

[0098] In terms of normal temperature chip thrust:

[0099] The higher the monomer content and the lower the corresponding oligomer (BMI-PPG resin and 131MA8) content, the greater the thrust. For example, in Examples 3, 4, and 5, the monomer content is 50-55 parts, and the thrust is greater than 5.3 kgF. In contrast, in Examples 1 and 2, the monomer content is 46 parts, and the thrust is less than 5.2 kgF.

[0100] When the total amount of oligomers (BMI-PPG resin and 131MA8) is constant, the thrust is improved when the relative content of 131MA8 is high, as can be seen in Example 2 and Example 1 (4.6 kgF and 5.1 kgF, respectively) and Example 5 and Example 4 (5.4 kgF and 6.5 kgF, respectively).

[0101] Referring to Example 6 and Example 2, as well as Example 7 and Example 4, BMI-PPG400 replaces BMI-PPG1000. Under the same conditions, the thrust is greatly improved, from 5.1kgF to 11.2kgF, and from 6.5kgF to 8.6kgF, respectively.

[0102] High temperature chip thrust:

[0103] In terms of high-temperature chip thrust, it first gradually decreases with the increase of monomer (monofunctional acrylate monomer and difunctional acrylate monomer) content. For example, the monomer (monofunctional acrylate monomer and difunctional acrylate monomer) content of Example 1 and Example 2 is 46 parts, with a thrust of 1.2kgF and 1.6kgF respectively. When it is increased to 50-55 parts in Example 3, Example 4, and Example 5, the thrust drops rapidly to below 1.0kgF.

[0104] Correspondingly, when BMI-PPG1000 is replaced by BMI-PPG400, referring to Example 6 and Example 2, and Example 7 and Example 4, under the same conditions, the high-temperature thrust decreases from 1.6 kgF to 0.9 kgF and from 0.5 kgF to 0.2 kgF, respectively.

[0105] Residual glue rate on the damaged surface:

[0106] Low monomer content and high BMI-PPG 400 / 1000 content result in a correspondingly high residual adhesive rate. In Examples 1 and 2, the monomer content was 46 parts, but the relative content of BMI-PPG resin to oligomers was increased from 33% to 50%, resulting in a corresponding increase in the high-temperature residual surface area from 5 to 7. Similarly, in Examples 4 and 5, the monomer content was 55 parts, but the relative content of BMI-PPG resin to oligomers was increased from 33% to 50%, resulting in a corresponding increase in the high-temperature residual surface area from 3 to 4.

[0107] Referring to Example 6 and Example 2, and Example 7 and Example 4, BMI-PPG400 was used instead of BMI-PPG1000. Under other identical conditions, the adhesive residue rate on the damaged surface was reduced (from 7 to 3, and from 3 to 2, respectively).

[0108] Comparative Example 1 and Comparative Example 2 have the same monomer content as Example 1, which is 46 parts. However, the ratio of BMI-PPG resin to 131MA8 is increased from 0.2 to 1.7, and the volume resistivity increases significantly from 18×10 -5 Ω·cm increases to 25×10 -5 ~40×10 -5 Ω·cm, the chip thrust at room temperature is reduced to less than 4kgF; the chip thrust at high temperature is reduced to less than 0.3kgF; the adhesive residue area at high temperature thrust is reduced from 5 to 2-4;

[0109] Compared with Example 1, the content of acrylate monomer in Comparative Example 3 is reduced to 40 parts, and the volume resistivity is increased from 18×10 -5 Ω·cm increases to 50×10 -5 Ω·cm, the thrust of the chip at room temperature dropped to 2.8kgF; the thrust of the chip at high temperature dropped slightly to 0.9kgF, and the residual adhesive surface increased slightly to 6.

[0110] Comparative Example 4: Compared with Example 4, the content of acrylate monomer is 61 parts (greater than 55 parts), and its volume resistivity is reduced to 6×10 -5 Ω·cm, the normal temperature chip thrust is increased to 7kgF, but the high temperature chip thrust is reduced to only 0.1kgF, and the high temperature residual adhesive surface is slightly reduced to 2.

[0111] Overall, the performance of Example 3 is relatively balanced in all aspects.

[0112] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. An acrylate composition containing a BMI resin, characterized in that: The acrylate composition containing BMI resin comprises: The monofunctional acrylate monomer is 22.5 to 33 parts, the difunctional acrylate monomer is 18 to 27.5 parts, the maleic anhydride grafted polybutadiene is 22.5 to 36.7 parts, the BMI-PPG polymer is 15 to 27.5 parts, the peroxide is 1 to 2 parts, and the coupling agent is 1 to 2 parts; BMI-PPG polymer is a flowable liquid at room temperature.

2. The acrylate composition containing BMI resin according to claim 1, characterized in that: The acrylate composition containing BMI resin comprises: a1 part of monofunctional acrylate monomer, a2 part of difunctional acrylate monomer, b part of maleic anhydride grafted polybutadiene, c part of BMI-PPG polymer, d part of peroxide, and e part of coupling agent; Where: a1+a2+b+c=100; a1 / a2=1~1.5; a1+a2=45~55; c / b=0.5~1.

3. The acrylate composition containing BMI resin according to claim 1 or 2, characterized in that: The monofunctional acrylate monomer is: isobornyl acrylate, isobornyl methacrylate, tetrahydrofuran acrylate, tetrahydrofuran methacrylate; methyl acrylate, methyl methacrylate, N,N-dimethylacrylamide; cyclotrimethylolpropane formal acrylate, diphenoxyethyl acrylate, Beta-hydroxyethyl acrylate, tetrahydrofurfuryl (meth) acrylate; isooctyl acrylate, lauryl acrylate, isodecyl acrylate, tridecyl acrylate, octadecyl acrylate, stearic methacrylate; at least one of isooctyl methacrylate, lauryl methacrylate, and N,N-dimethylacrylamide.

4. The acrylate composition containing BMI resin according to claim 1 or 2, characterized in that: The bifunctional acrylate monomer is at least one of 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol 400 diacrylate, tetra(ethylene glycol) diacrylate, tripropylene glycol diacrylate, hydroxypivalic acid neopentyl glycol diacrylate, tricyclodecane dimethanol diacrylate, and neopentyl glycol polymethyl ethylene oxide diacrylate.

5. The acrylate composition containing BMI resin according to claim 1 or 2, characterized in that: The chemical structural formula of the maleic anhydride grafted polybutadiene is as follows: The number average molecular weight of the maleic anhydride grafted polybutadiene is 2500-5000.

6. The acrylate composition containing BMI resin according to claim 1 or 2, characterized in that: The chemical structural formula of the BMI-PPG polymer is as follows: Wherein, n is 5 to 20; The viscosity of BMI-PPG polymer at room temperature is: 5~40 kcps@10 rpm.

7. The acrylate composition containing BMI resin according to claim 1 or 2, characterized in that: The peroxide is at least one of benzoyl peroxide, tert-butyl peroxy-2-ethylhexanoate, di-tert-butyl peroxide, tert-butyl peroxybenzoate, tert-butyl peroxyneodecanoate, tert-amyl peroxy-2-ethylhexanoate, cumene hydroperoxide, diisopropyl peroxide, tert-amyl peroxyneodecanoate, and diisopropyl peroxydicarbonate.

8. The acrylate composition containing BMI resin according to claim 1 or 2, characterized in that: The coupling agent is at least one of a silane coupling agent and a titanate coupling agent; The silane coupling agent is at least one of KH-560 and KH-570; The titanate coupling agent is at least one of NDZ-401 and NDZ-201.

9. Use of the acrylic ester composition containing BMI resin according to any one of claims 1 to 8 in semiconductor device packaging, characterized in that: The application comprises: adding conductive silver powder to an acrylic ester composition containing BMI resin to obtain a conductive adhesive, and applying the conductive adhesive to semiconductor device packaging.

10. The use according to claim 9, characterized in that: The conductive silver powder is in the form of spheres, flakes or a mixture of the two; The conductive silver powder is preferably micron-sized flaky conductive silver powder with an average particle size of 0.3 to 30 μm, preferably 1 to 15 μm.

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