Heat dissipation plate, middle frame, and electronic device

Abstract

Provided in the present application are a heat dissipation plate, a middle frame and an electronic device. The heat dissipation plate comprises a first cover plate, a second cover plate, a capillary structure and a cooling medium, wherein the second cover plate comprises a middle region and an edge region arranged around the middle region; the middle region comprises a shaping area and an accommodation area connected to the shaping area; the edge region is fixedly connected to the first cover plate, the accommodation area in the middle region and the first cover plate are spaced apart from each other and enclose an accommodation cavity, the capillary structure is fixedly connected to the first cover plate and is located in the accommodation cavity, and the cooling medium is arranged in the accommodation cavity; and the shaping area in the middle region is fixedly connected to the first cover plate. In this way, when the accommodation area of the second cover plate is uneven, a force can be applied to the shaping area of the second cover plate to enable the flatness of the accommodation area of the second cover plate to be calibrated within specifications, which greatly improves the yield of the flatness of the heat dissipation plate and is thus conducive to solving the problem of the heat dissipation plate pushing against the screen and the problem of battery debonding.

Description

Heat sink, middle frame and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on December 16, 2023, with application number 202311739785.X, and priority to the Chinese patent application with the invention name "Heat dissipation plate, middle frame and electronic device", all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic equipment, and in particular to a heat dissipation plate, a middle frame, and an electronic device. Background Art

[0003] High-performance heat dissipation in mobile phones is an important way to unleash the performance of mobile phones. The heat sink serves as a high-performance heat dissipation component to improve the heat dissipation capacity of the entire device. A traditional heat sink includes a first cover plate, a second cover plate, a capillary structure, and a coolant. The edge of the second cover plate is fixedly connected to the first cover plate so that the middle of the second cover plate and the first cover plate enclose a sealed cavity, and the capillary structure and the coolant are both arranged in the sealed cavity. However, during the assembly process of the heat sink, the first cover plate and / or the second cover plate are prone to deformation, resulting in poor flatness of the first cover plate and / or the second cover plate. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a heat dissipation plate, a middle frame and an electronic device, wherein the heat dissipation plate has high flatness.

[0005] In a first aspect, the present application provides a heat sink. The heat sink includes a first cover plate, a second cover plate, a capillary structure, and a cooling medium. The second cover plate includes a middle region and an edge region surrounding the middle region, the middle region including a shaping region and a receiving region connected to the shaping region. The edge region is fixedly connected to the first cover plate, the receiving region of the middle region is spaced apart from the first cover plate and encloses a receiving cavity, the capillary structure is fixedly connected to the first cover plate and is located within the receiving cavity, and the cooling medium is located within the receiving cavity. The shaping region of the middle region is fixedly connected to the first cover plate.

[0006] It is understandable that if the accommodation area of ​​the second cover plate protrudes away from the first cover plate, the flatness of the accommodation area of ​​the second cover plate will be poor. However, in the embodiments of the present application, a jig can be used to apply a force in the first direction to the shaping area of ​​the second cover plate so that the accommodation area of ​​the second cover plate no longer protrudes away from the first cover plate under tension. In other words, the accommodation area of ​​the second cover plate can be flattened and calibrated to a better flatness, that is, the flatness of the accommodation area of ​​the second cover plate can be calibrated to within specifications, thereby significantly improving the flatness yield of the heat sink. In addition, because the shaping area of ​​the second cover plate is fixedly connected to the first cover plate, no capillary structure is provided between the shaping area and the first cover plate. In this case, the shaping area can withstand a large force, thereby meeting the flatness requirements of the heat sink. In other words, when a force in the first direction is applied to the shaping area of ​​the second cover plate, the second cover plate will not be squeezed against the capillary structure due to deformation toward the first cover plate, thereby preventing damage to the capillary structure.

[0007] It is understandable that if the first cover plate bulges away from the second cover plate, the flatness of the first cover plate will also be poor. However, in the embodiments of the present application, a jig can be used to apply a force in the second direction to the shaping area of ​​the second cover plate, so that the first cover plate no longer bulges away from the second cover plate under the tension. In other words, the first cover plate can be flattened and restored to a better flatness. In other words, the flatness of the first cover plate can be calibrated to within specifications, thereby greatly improving the flatness yield of the heat sink.

[0008] It can be understood that by providing a shaping area in the middle area of ​​the second cover plate, the flatness of a heat sink with a larger area can be shaped by utilizing the shaping area.

[0009] In some implementations, the shaping area is recessed toward the first cover plate and is fixedly connected to the first cover plate. Thus, compared to an embodiment in which at least a portion of the first cover plate protrudes toward the shaping area and is fixedly connected to the shaping area, this embodiment provides a higher degree of flatness for the first cover plate, facilitating a stable connection between the first cover plate and other structural components.

[0010] In some implementations, the accommodation area is arranged around the shaping area. In this way, the shaping area is farther away from the edge area. The shaping area can be responsible for shaping the flatness of most areas of the accommodation area.

[0011] In some implementations, there are multiple shaping zones, spaced apart along the length of the heat sink. Thus, two shaping zones can be responsible for smoothing different locations within the receiving area, ensuring that any deformation or protrusions within the receiving area are smoothed.

[0012] In some implementations, the edge area of ​​the second cover plate includes a first edge and a second edge arranged along the length direction of the heat sink, and the shortest distance between the first edge and the second edge is a; the number of shaping areas is two, and the distance between the center of the first shaping area and the center of the second shaping area is b, where a and b satisfy: 0.25a≤b≤0.4a.

[0013] It can be understood that when a and b satisfy: 0.25a≤b≤0.4a, the first shaping area and the second shaping area can cooperate with each other, so that the flatness of most positions of the accommodating area can be shaped.

[0014] In some implementations, the edge area of ​​the second cover plate includes a third edge and a fourth edge arranged along the width direction of the heat sink, the third edge and the fourth edge are connected between the first edge and the second edge, and the shortest distance between the third edge and the fourth edge is c; the distance between the center of the first shaping area and the third edge is d, where c and d satisfy: 0.4c≤d≤0.6c.

[0015] It can be understood that when c and d satisfy: 0.4c≤d≤0.6c, the shaping area can shape the flatness of most positions of the accommodating area.

[0016] In some implementations, a portion of the accommodating area is recessed toward the first cover plate and fixedly connected to the capillary structure. It is understood that the structure of the accommodating area can solve the problem of low strength due to the thinness of the accommodating area.

[0017] In a second aspect, the present application provides a middle frame. The middle frame comprises a frame and a middle plate, which is fixedly connected to the inner side of the frame. The middle plate comprises a support plate and the aforementioned heat sink. The support plate has a hollowed-out area, and a first cover plate is fixedly connected to the support plate. The first cover plate covers the hollowed-out area and encloses the battery compartment. It is understood that the heat sink has better flatness, which helps improve the flatness of the middle frame.

[0018] In some implementations, there are two shaping zones: the first shaping zone is located directly opposite the junction of the battery compartment and the support plate, and the second shaping zone is located directly opposite the battery compartment. Thus, on the one hand, the first shaping zone can flatten the portion of the heat sink facing the battery compartment, thereby calibrating the flatness of the portion of the heat sink facing the battery compartment to within specifications, thereby significantly improving the flatness yield of the portion of the heat sink facing the battery compartment. Thus, when the middle frame is used in an electronic device, both the battery and the heat sink are better bonded to the battery adhesive, making it less likely for the battery to debond. On the other hand, the first shaping zone can also flatten the portion of the heat sink facing the support plate, thereby calibrating the flatness of the portion of the heat sink facing the support plate to within specifications, thereby significantly improving the flatness yield of the portion of the heat sink facing the support plate. This can solve the problem of the support plate squeezing the heat sink due to poor flatness, causing the heat sink to deform and squeeze the display screen. The display screen of the embodiments of the present application has better reliability.

[0019] It is understandable that the second shaping area can better flatten the area of ​​the heat sink opposite the battery compartment, thereby calibrating the heat sink flatness to within specifications and significantly improving the heat sink flatness yield. In this way, both the battery and the first heat sink cover are better bonded to the battery adhesive, making the battery less likely to debond.

[0020] In some implementations, the support plate includes a first connection area and a second connection area, the second connection area is fixedly connected to the first connection area, the first cover plate includes a third connection area and a fourth connection area, the fourth connection area is fixedly connected to the third connection area; the third connection area of ​​the heat dissipation plate is fixedly connected to the first connection area of ​​the support plate through a fastener, and the fourth connection area of ​​the heat dissipation plate is fixedly connected to the second connection area of ​​the support plate through a backing glue and / or an adhesive layer.

[0021] It is understandable that the heat sink can be fixedly connected to the support plate by the cooperation of the fasteners, the adhesive and the adhesive layer. In this case, the connection between the heat sink and the support plate is more secure and more stable.

[0022] In some implementations, the first connection area of ​​the support plate is provided with a first groove, the fastening hole of the support plate is located within the first groove, and at least a portion of the third connection area of ​​the first cover plate is recessed into the bottom wall of the first groove to form a second groove. The fastening hole of the first cover plate is located within the second groove, and a portion of the fastener is located within the second groove. In this way, when the middle frame is applied to an electronic device, the fastener can avoid the display screen, thereby avoiding the problem of the fastener hitting the screen. In addition, when the electronic device is impacted, the fastener will not impact the display screen, thereby avoiding display defects such as broken bright spots caused by the impact of the fastener.

[0023] In some implementations, the third connection area includes a plurality of spaced convex bumps, which are arranged around the fastening holes of the first cover plate and abut against the first connection area. In this way, the connection between the first cover plate and the support plate is tighter and more secure.

[0024] In some implementations, the second connection area includes the first plate area, the adhesive backing includes the first adhesive backing, and the adhesive layer includes the first adhesive layer; the fourth connection area of ​​the first cover plate is fixedly connected to the first plate area of ​​the support plate through the mutual cooperation of the first adhesive backing and the first adhesive layer.

[0025] It is understandable that, since the first adhesive has good adhesion and impact resistance, the first cover plate of the heat sink is firmly connected to the support plate, thereby better meeting the reliability test requirements.

[0026] In some implementations, the first adhesive backing is provided with adhesive dispensing holes, and the first adhesive layer is disposed within the adhesive dispensing holes. It is understood that due to the stronger viscosity of the first adhesive layer, the first adhesive layer can more securely connect the heat sink and the support plate. This provides a more secure connection between the heat sink and the support plate, better meeting reliability testing requirements.

[0027] It is understood that the first adhesive layer can provide adhesive dispensing holes (i.e., adhesive dispensing spaces) to prevent glue from overflowing during the dispensing process. In addition, when the heat sink is fixed to the support plate, the first adhesive can effectively support the heat sink, thereby preventing the heat sink from collapsing the glue during the pressing process, thereby ensuring the stability of the connection between the heat sink and the support plate.

[0028] In some implementations, the second connection area includes a first edge area, which is fixedly connected to the first plate area; the adhesive layer includes a second adhesive layer, and the fourth connection area of ​​the first cover plate is fixedly connected to the first edge area of ​​the support plate through the second adhesive layer.

[0029] It is understandable that, due to the stronger viscosity of the second adhesive layer, the second adhesive can more firmly connect the heat sink and the first edge of the support plate. In this way, the connection between the heat sink and the support plate is more secure, which can better meet the reliability test requirements.

[0030] In some implementations, a first retaining wall is protruding from the first edge area of ​​the support plate, and the first retaining wall is located between the second adhesive layer and the battery compartment; the middle frame also includes a retaining wall insulating member, which is connected between the fourth connection area of ​​the first cover plate and the first retaining wall.

[0031] It is understood that the first retaining wall can prevent glue from overflowing the dispensing groove and flowing into the battery compartment during the dispensing process. In addition, the thickness of the glue layer can be flexibly controlled by adjusting the height of the first retaining wall, thereby ensuring that the second glue layer has sufficient glue height to ensure a stable connection between the heat sink and the support plate.

[0032] In this way, the fourth connection area of ​​the first cover plate of the heat dissipation plate can also be insulated from the first retaining wall of the support plate by the retaining wall insulating member.

[0033] In some implementations, the second connection area includes a first side area, the first side area is fixedly connected to the first plate area, and the width D of the first side area in the width direction of the middle frame is greater than or equal to 1.5 mm; the adhesive backing includes a second adhesive backing, and the fourth connection area of ​​the first cover plate is fixedly connected to the first side area of ​​the support plate via the second adhesive backing. In this case, the first cover plate can be fixedly connected to the first side area of ​​the support plate via the second adhesive backing. In this way, due to the good adhesion and impact resistance of the second adhesive backing, the connection between the first cover plate and the first side area of ​​the support plate is more secure, which can better meet the requirements of reliability testing.

[0034] It is understandable that, compared to the solution in which the fourth connection area of ​​the first cover plate is fixedly connected to the first side area of ​​the support plate via the second adhesive layer, in this implementation, since the fourth connection area of ​​the first cover plate is fixedly connected to the first side area of ​​the support plate via the second adhesive layer, this implementation does not require the use of a dispensing process, thereby avoiding the risk of glue overflow and eliminating the dispensing process, thereby reducing process costs. In addition, the first side area of ​​the support plate no longer needs to be provided with a protruding first retaining wall. In this way, on the one hand, the structure of the first side area of ​​the support plate is relatively simple and easy to produce; on the other hand, the flatness of the first side area of ​​the support plate is relatively high, which is conducive to the connection between the first cover plate and the support plate.

[0035] In some implementations, the support plate includes a first connection area and a second connection area, the second connection area is fixedly connected to the first connection area, the first cover plate includes a third connection area and a fourth connection area, the fourth connection area is fixedly connected to the third connection area, and the thickness H of the first cover plate is less than or equal to 0.2 mm; the third connection area of ​​the heat sink is fixedly connected to the first connection area of ​​the support plate through a solder joint, and the fourth connection area of ​​the heat sink is fixedly connected to the second connection area of ​​the support plate through a backing adhesive and / or an adhesive layer. At this time, a solder joint is formed between the third connection area of ​​the first cover plate and the first connection area of ​​the support plate. The solder joint is a conductive member. At this time, the third connection area of ​​the heat sink can be electrically connected to the first connection area of ​​the support plate through a solder joint. Since the first connection area of ​​the support plate is the grounding position of the antenna, the third connection area of ​​the heat sink can be grounded through a solder joint.

[0036] It can be understood that compared with the solution of grounding the heat sink through fasteners, the heat sink in the embodiment of the present application is grounded through solder points. On the one hand, the electrical connection between the heat sink and the support plate is stronger and more reliable. On the other hand, the third connection area of ​​the heat sink and the first connection area of ​​the support plate are not easily damaged by the openings, thereby ensuring that the heat sink and the support plate have better structural strength.

[0037] In some implementations, a portion of the frame forms the antenna's radiator, or the antenna's radiator is fixed to the inner side of the frame; the support plate includes a first connection area and a second connection area, the second connection area is fixedly connected to the first connection area, and the first connection area is the grounding location of the antenna's radiator; the first cover plate includes a third connection area and a fourth connection area, the fourth connection area is fixedly connected to the third connection area; the third connection area of ​​the heat sink is electrically connected to the first connection area of ​​the support plate via a conductive member, and the fourth connection area of ​​the heat sink is insulated from the second connection area of ​​the support plate via an insulating member. In this case, the antenna's current is less likely to be grounded at an ungrounded location on the heat sink, thereby preventing the ungrounded location from exciting a new magnetic field that could affect antenna performance.

[0038] In some implementations, the conductive member includes a fastener, a solder joint, or a conductive foam, wherein the fastener is made of a conductive material, the insulating member includes an adhesive backing or an adhesive layer, and the adhesive backing and the adhesive layer are made of an insulating material.

[0039] It is understood that by configuring the fastener to include a conductive material and the first connection area of ​​the support plate as the grounding location for the antenna, the third connection area of ​​the heat sink can be electrically connected to the first connection area of ​​the support plate via the fastener. In other words, the third connection area of ​​the heat sink can be grounded via the fastener. In this way, the heat sink is less likely to generate clutter for surrounding antennas, thereby preventing them from affecting antenna performance.

[0040] It is understood that the fastener can not only securely connect the third connection area of ​​the heat sink to the first connection area of ​​the support plate, but also securely and electrically connect the third connection area of ​​the heat sink to the first connection area of ​​the support plate. The fastener has a "one-item-multiple-purposes" effect.

[0041] It is understood that by making both the backing adhesive and the adhesive layer comprise insulating materials, the fourth connection area of ​​the heat sink can be insulated from the second connection area of ​​the support plate. In this manner, the antenna current is less likely to be grounded at an ungrounded portion of the heat sink, thereby preventing the ungrounded portion of the heat sink from generating a new magnetic field that could affect antenna performance.

[0042] It is understood that the adhesive backing and the adhesive layer can not only securely connect the fourth connection area of ​​the heat sink to the second connection area of ​​the support plate, but also electrically connect the fourth connection area of ​​the heat sink to the second connection area of ​​the support plate. The adhesive backing and the adhesive layer have a "multi-purpose" effect.

[0043] In some implementations, a limiting boss is provided on the inner side surface of the frame, and the distance between the heat sink and the limiting boss is smaller than the distance between the heat sink and the inner side surface of the frame. In this way, since the distance between the first cover plate of the heat sink and the limiting boss is smaller, the heat sink and the frame can be positioned to a certain extent by the mutual cooperation between the first cover plate of the heat sink and the limiting boss. At this time, the multiple fastening holes of the heat sink and the multiple fastening holes of the support plate can also be precisely positioned. On the one hand, the process of locking the fasteners into the fastening holes of the heat sink and the fastening holes of the support plate is relatively simple; on the other hand, the fasteners are less likely to have problems such as floating, loose locking, and assembly deviation.

[0044] In some implementations, the support plate is provided with a plurality of first positioning holes, and the first cover plate is provided with a plurality of second positioning holes, and the plurality of second positioning holes are arranged relative to the plurality of first positioning holes in a one-to-one correspondence. By providing the first positioning holes on the support plate and the second positioning holes on the heat sink, during the assembly process of the heat sink and the support plate, the first positioning holes and the second positioning holes are first aligned, and then the positioning columns of the assembly tool are inserted into the first positioning holes and the second positioning holes, thereby fixing the relative position of the heat sink on the support plate. At this time, the plurality of fastening holes of the heat sink and the plurality of fastening holes of the middle plate can also be precisely positioned. In this way, on the one hand, the process of locking the fasteners into the fastening holes of the heat sink and the fastening holes of the support plate is relatively simple; on the other hand, the fasteners are not prone to problems such as floating, loose locking, and assembly deviation.

[0045] In a third aspect, the present application provides an electronic device. The electronic device includes a back cover, a display screen, a battery, and the aforementioned middle frame; at least a portion of the display screen is fixedly connected to the second cover plate of the heat sink, the battery is fixedly connected to the first cover plate of the heat sink, and the battery is located in the battery compartment; the back cover is fixedly connected to the edge of the middle frame, the back cover is located on the side of the middle plate of the middle frame away from the display screen, and the back cover covers the battery.

[0046] It is understandable that, on the one hand, the battery is fixedly connected to the first cover plate of the heat sink, and at this time, there is no support plate between the battery and the first cover plate. In this way, the thickness of the support plate can be omitted in the thickness direction of the electronic device, which is conducive to achieving a thinner setting of the electronic device. On the other hand, the heat sink can not only dissipate heat for the battery and the flexible screen, but also support the battery and the flexible screen. The heat sink has the effect of "one thing for multiple uses".

[0047] It can be understood that since the flatness of the heat sink can be calibrated to within the specifications, the yield of the flatness of the heat sink can be greatly improved, which can solve the problem of the heat sink squeezing the display screen, that is, the reliability of the display screen of the embodiment of the present application is better. On the other hand, it can make the battery and the first cover of the heat sink better combined with the battery back glue, and the battery is not prone to debonding problems.

[0048] In some implementations, the electronic device further includes a display screen insulator positioned between the display screen and the second cover plate. In this implementation, the display screen insulator is positioned between a portion of a central portion of the display screen and the second cover plate to isolate the central portion of the display screen from the second cover plate, thereby preventing electrical connection between the display screen and the second cover plate.

[0049] In some implementations, the electronic device further includes a circuit board, which is fixedly connected to the support plate and located on a side of the support plate away from the first cover plate. In this implementation, heat generated by the circuit board can be transferred to the first cover plate via the support plate. In this manner, the first cover plate can also dissipate heat generated by the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0051] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0052] FIG2 is a partially exploded schematic diagram of the electronic device shown in FIG1 in some embodiments;

[0053] FIG3 is a partial cross-sectional schematic diagram of the electronic device shown in FIG1 taken along line AA in some embodiments;

[0054] FIG4 is a schematic diagram of a partial structure of the electronic device shown in FIG1 in one embodiment;

[0055] FIG5 is an enlarged schematic diagram of the middle frame shown in FIG2 at another angle;

[0056] FIG6 is a partially exploded schematic diagram of the middle frame shown in FIG2 in one embodiment;

[0057] FIG7 is a partially exploded schematic diagram of the heat dissipation plate shown in FIG6 in one embodiment;

[0058] FIG8 is a partial cross-sectional schematic diagram of the heat dissipation plate shown in FIG6 taken along line BB in some embodiments;

[0059] FIG9 is a partial cross-sectional schematic diagram of the middle frame shown in FIG2 taken along CC in some embodiments;

[0060] FIG10 is a partial cross-sectional schematic diagram of the heat dissipation plate shown in FIG6 taken along line BB in some other embodiments;

[0061] FIG11 is a partially exploded schematic diagram of the middle frame shown in FIG2 in another embodiment;

[0062] FIG12 is an enlarged schematic diagram of a portion of the middle frame shown in FIG11 in one embodiment;

[0063] FIG13 is a partial cross-sectional schematic diagram of the middle frame shown in FIG2 taken along DD in some embodiments;

[0064] FIG14 is a schematic diagram of a partial structure of the middle frame shown in FIG2 in one embodiment;

[0065] FIG15 is a partial cross-sectional schematic diagram of the middle frame shown in FIG2 taken along EE in some embodiments;

[0066] FIG16 is a partial cross-sectional schematic diagram of the middle frame shown in FIG2 taken along FF in some embodiments;

[0067] FIG17 is a partial cross-sectional schematic diagram of the middle frame shown in FIG2 taken along FF in some other embodiments;

[0068] FIG18 is a partial cross-sectional schematic diagram of the middle frame shown in FIG2 taken along DD in some other embodiments;

[0069] FIG19 is a partial cross-sectional schematic diagram of the middle frame shown in FIG2 taken along DD in some further embodiments;

[0070] FIG20 is a partial cross-sectional schematic diagram of the middle frame shown in FIG2 taken along FF in some other embodiments;

[0071] FIG21 is a partial cross-sectional schematic diagram of the middle frame shown in FIG2 taken along GG in some embodiments;

[0072] FIG22 is a schematic structural diagram of an embodiment of the middle frame shown in FIG2 at another angle. DETAILED DESCRIPTION

[0073] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0074] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the two are connected to each other and the relative position relationship after connection remains unchanged. The directional terms mentioned in the embodiments of the present application, such as "top", "bottom", "up", "down", "inside", "outside", etc., are only reference to the directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. "Multiple" means at least two. A and / or B include three schemes, specifically Scheme A, Scheme B and Scheme AB. Among them, "electrical connection" means that electrical signals can be conducted between each other. In addition, the two components are integrated into an integrated structure through an integrated molding process, which means that in the process of forming one of the two components, the component is connected to the other component, and there is no need to connect the two components together through further processing (such as bonding, welding, snap connection, screw connection).

[0075] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first," "second," "third," or "fourth" may explicitly or implicitly include one or more of the features.

[0076] In addition, in the embodiments of the present application, the mathematical concepts mentioned, such as parallel and perpendicular, are all in terms of the current state of the art, rather than being absolutely strict definitions in a mathematical sense. A small amount of deviation is allowed, and being approximately parallel or approximately perpendicular is acceptable. For example, A and B are parallel, which means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 and 10 degrees. For example, A and B are perpendicular, which means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 and 100 degrees.

[0077] It is understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It should also be noted that, for ease of description, only the parts related to the invention are shown in the drawings.

[0078] FIG1 is a schematic structural diagram of an electronic device 1000 provided in an embodiment of the present application.

[0079] As shown in FIG1 , in some embodiments, the electronic device 1000 may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, an in-vehicle device, a wearable device, augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses, or a VR helmet, and other devices having a middle frame 100. The electronic device 1000 in the embodiment shown in FIG1 is described using a mobile phone as an example.

[0080] FIG2 is a partially exploded schematic diagram of the electronic device 1000 shown in FIG1 in some embodiments.

[0081] As shown in Figures 1 and 2, the electronic device 1000 includes a middle frame 100, a back cover 200, a display screen 300, a circuit board 400 and a battery 500. It will be understood that Figure 1 and the related figures below only schematically illustrate some components included in the electronic device 1000, and the actual shape, actual size, actual position and actual structure of these components are not limited by Figure 1 and the figures below. In addition, for the convenience of description below, the electronic device 1000 is defined as having a first direction X, a second direction Y and a third direction Z. The first direction X can be the width direction of the electronic device 1000, the second direction Y can be the length direction of the electronic device 1000, and the third direction Z can be the thickness direction of the electronic device 1000. In some embodiments, the coordinate system setting of the electronic device 1000 can be flexibly set according to specific actual needs.

[0082] In some embodiments, the display screen 300 may be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a liquid crystal display (LCD), etc.

[0083] FIG3 is a partial cross-sectional schematic diagram of the electronic device 1000 shown in FIG1 taken along line AA in some embodiments.

[0084] As shown in Figures 2 and 3, the middle frame 100 includes a frame 101 and a middle plate 102. The middle plate 102 is fixedly connected to the inner side 104 of the frame 101. The frame 101 can be arranged around the middle plate 102.

[0085] As shown in Figures 2 and 3, the display screen 300 is fixedly connected to the middle frame 100. It is understandable that the middle frame 100 can be used to support the display screen 300.

[0086] In some embodiments, the edge of the display screen 300 can be fixedly connected to the border 101 of the middle frame 100. At least a portion of the middle portion of the display screen 300 can be fixedly connected to the middle plate 102 of the middle frame 100. In some embodiments, the connection method between the display screen 300 and the middle frame 100 is not specifically limited.

[0087] As shown in Figures 2 and 3, the back cover 200 is fixedly connected to the middle frame 100. The back cover 200 is located on the side of the middle plate 102 of the middle frame 100 away from the display screen 300. The back cover 200 can be used to cover the middle plate 102 of the middle frame 100 and related components on the middle plate 102.

[0088] In some embodiments, the edge of the back cover 200 may be fixedly connected to the frame 101 of the middle frame 100 . The middle portion of the back cover 200 may be disposed opposite to the middle plate 102 of the middle frame 100 .

[0089] Figure 4 is a schematic diagram of a partial structure of the electronic device 1000 shown in Figure 1 under one embodiment. Figure 4 may be a schematic diagram of the back of the electronic device 1000 shown in Figure 1 with the back cover 200 hidden. Figure 5 is an enlarged schematic diagram of the middle frame 100 shown in Figure 2 from another angle.

[0090] As shown in Figures 3 to 5, the middle plate 102 of the middle frame 100 can be provided with a battery compartment 103 and a receiving slot 105. The battery compartment 103 and the receiving slot 105 can be interconnected or provided separately. The openings of the battery compartment 103 and the receiving slot 105 on the middle plate 102 can face the rear cover 200.

[0091] In some embodiments, the battery 500 is fixedly connected to the middle plate 102 of the middle frame 100 and is located in the battery compartment 103. The circuit board 400 is fixedly connected to the middle plate 102 of the middle frame 100 and is located in the receiving groove 105. The back cover 200 covers the battery 500 and the circuit board 400 to protect them. It will be understood that the depth of the battery compartment 103 and the receiving groove 105 in the Z-axis direction can be flexibly set according to different needs to better adapt to the size of the battery 500 and the circuit board 400.

[0092] FIG6 is a partially exploded schematic diagram of the middle frame 100 shown in FIG2 in one embodiment.

[0093] As shown in Figures 5 and 6, the middle plate 102 of the middle frame 100 includes a heat sink 10 and a support plate 20. It is understood that the support plate 20 can be a plate-like structure. In some embodiments, the support plate 20 is fixed to the inner side 104 of the frame 101. For example, the support plate 20 and the frame 101 can be formed into an integrated structure through an injection molding process.

[0094] In some embodiments, the support plate 20 is provided with a hollow area 20a. The heat sink 10 is fixedly connected to the support plate 20. The heat sink 10 covers the hollow area 20a of the support plate 20 and surrounds the battery compartment 103. As shown in FIG4 , the battery 500 is fixedly connected to the heat sink 10. It can be understood that the heat sink 10 can not only dissipate heat for the battery 500, but also support the battery 500. As shown in FIG3 , a portion of the middle portion of the display screen 300 is fixedly connected to the support plate 20, and a portion is fixedly connected to the heat sink 10. The support plate 20 and the heat sink 10 jointly support the display screen 300. In addition, the heat sink 10 can also dissipate heat for the display screen 300.

[0095] As shown in Figures 4 and 5, the support plate 20 may be provided with a receiving groove 105. In this case, the circuit board 400 is fixedly connected to the support plate 20. In some embodiments, the receiving groove 105 may also be formed by the support plate 20 and the heat sink 10. In this case, the circuit board 400 may be fixedly connected to the heat sink 10. The heat sink 10 can dissipate heat from the circuit board 400.

[0096] The above description combines the relevant drawings to introduce the connection relationship between the display screen 300, battery 500, circuit board 400, support plate 20 of the middle plate 102, and heat sink 10. The structure of the heat sink 10 will be described in detail below with the relevant drawings.

[0097] FIG. 7 is a partially exploded schematic diagram of the heat dissipation plate 10 shown in FIG. 6 in one embodiment.

[0098] As shown in Figure 7, the heat sink 10 includes a first cover plate 11, a second cover plate 12, a capillary structure 13, and a cooling medium 14. It is understood that Figure 7 only schematically illustrates the cooling medium 14 through a rectangular frame.

[0099] In some embodiments, the first cover plate 11 may be made of a high-strength material. For example, the first cover plate 11 may be made of a multi-layer material. For example, the first cover plate 11 may be made of two layers. The first layer may be made of stainless steel, and the second layer may be made of copper or a copper alloy.

[0100] In some embodiments, the thickness of the first cover plate 11 in the Z-axis direction may be in the range of 0.15 mm to 0.2 mm. For example, the thickness of the first cover plate 11 in the Z-axis direction may be 0.15 mm, 0.16 mm, 0.18 mm, or 0.2 mm.

[0101] In some embodiments, the second cover plate 12 may also be made of a high-strength material. For example, the second cover plate 12 may be made of a multi-layer material. For example, the second cover plate 12 may be made of two layers. The first layer may be made of stainless steel, and the second layer may be made of copper or a copper alloy.

[0102] In some embodiments, the thickness of the second cover plate 12 in the Z-axis direction may be in the range of 0.04 mm to 0.08 mm. For example, the thickness of the first cover plate 11 in the Z-axis direction may be 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, or 0.08 mm.

[0103] In some embodiments, the capillary structure 13 may be a metal structure with a porous structure, for example, a copper mesh, copper fiber, foam copper, etc.

[0104] In some embodiments, the cooling medium 14 may be water, methanol, acetone, or the like.

[0105] As shown in FIG. 7 , the first cover plate 11 may include a first surface 11 a and a first surface 11 b disposed in opposite directions.

[0106] 7 , the second cover plate 12 may include a middle region 121 and an edge region 122 surrounding the middle region 121. In some embodiments, the width of the edge region 122 of the second cover plate 12 may be in a range of 1 mm to 6 mm.

[0107] In addition, the middle area 121 of the second cover plate 12 may include a shaping area 1211 and a receiving area 1212 connected to the shaping area 1211. In some embodiments, the receiving area 1212 is arranged around the shaping area 1211. It is understood that the receiving area 1212 can be arranged around a portion of the shaping area 1211 or around the entire shaping area 1211. In some embodiments, there are two shaping areas 1211. In some embodiments, the actual shape, actual size, actual position, and actual number of the shaping areas 1211 are not specifically limited in this application.

[0108] FIG8 is a partial cross-sectional schematic diagram of the heat dissipation plate 10 shown in FIG6 taken along line BB in some embodiments.

[0109] As shown in Figures 7 and 8, the second cover plate 12 and the first cover plate 11 can be arranged opposite each other. The edge region 122 of the second cover plate 12 can be fixed to the first surface 11a of the first cover plate 11, that is, the edge region 122 of the second cover plate 12 can be fixedly connected to the first cover plate 11. The space between the second cover plate 12 and the first cover plate 11 can form a sealed space. The accommodation area 1212 of the middle region 121 of the second cover plate 12 can be spaced apart from the first cover plate 11, and encloses the accommodation cavity 15.

[0110] In some embodiments, the shaping area 1211 of the middle area 121 of the second cover plate 12 can be recessed in the direction close to the first cover plate 11 and fixed on the first surface 11a of the first cover plate 11, that is, the shaping area 1211 of the middle area 121 of the second cover plate 12 can be fixedly connected to the first cover plate 11. In this way, compared with the solution in which at least a portion of the first cover plate 11 protrudes in the direction close to the shaping area 1211 and is fixedly connected to the shaping area 1211, the flatness of the first cover plate 11 in this implementation is higher, which is conducive to the stable connection of the first cover plate 11 with other structural parts. In some embodiments, the first cover plate 11 protrudes in the direction close to the shaping area 1211 and is fixedly connected to the shaping area 1211.

[0111] In some embodiments, the edge region 122 of the second cover plate 12 can be fixedly connected to the first cover plate 11 by a welding process (e.g., brazing). In this way, the connection between the second cover plate 12 and the first cover plate 11 is more stable and secure. In addition, the sealing performance of the accommodating cavity 15 is improved.

[0112] In some embodiments, the shaping area 1211 of the middle region 121 of the second cover plate 12 may also be fixedly connected to the first cover plate 11 by a welding process (such as brazing, etc.). In this way, the connection between the shaping area 1211 and the first cover plate 11 is more stable and firm.

[0113] As shown in Figures 7 and 8, the capillary structure 13 is fixed to the first surface 11a of the first cover plate 11, and the capillary structure 13 is located in the accommodating cavity 15. In some embodiments, the capillary structure 13 can be fixedly connected to the first cover plate 11 through a welding process. In this way, the connection between the capillary structure 13 and the first cover plate 11 is more stable and secure.

[0114] As shown in FIG7 and FIG8 , the cooling medium 14 may be disposed in the accommodating cavity 15 , and the capillary structure 13 may be immersed in the cooling medium 14 .

[0115] As shown in Figures 5 and 6 , the first cover plate 11 of the heat dissipation plate 10 can be fixedly connected to the support plate 20. The first cover plate 11 can cover the hollow area 20a of the support plate 20 and surround the battery compartment 103.

[0116] As shown in Figures 4 and 5, the battery 500 can be fixedly connected to the first cover plate 11 and located within the battery compartment 103. In this case, on the one hand, the heat generated by the battery 500 can be transferred to the heat sink 10 and dissipated through the heat sink 10. On the other hand, the support plate 20 is no longer provided between the battery 500 and the heat sink 10. This eliminates the thickness of the support plate 20 in the thickness direction of the electronic device 1000, thereby facilitating a thinner design of the electronic device 1000.

[0117] In some embodiments, the battery 500 may be fixedly connected to the first cover plate 11 by battery adhesive (eg, double-sided adhesive).

[0118] As shown in Figures 4 and 5, the circuit board 400 can be fixedly connected to the support plate 20 and located on a side of the support plate 20 away from the first cover plate 11. The heat generated by the circuit board 400 can be transferred to the first cover plate 11 through the support plate 20. In this way, the first cover plate 11 can also dissipate the heat generated by the circuit board 400.

[0119] As shown in FIG3 , a portion of the middle portion of the display screen 300 can be fixedly connected to the second cover plate 12. In some embodiments, the portion of the middle portion of the display screen 300 can be fixedly connected to the second cover plate 12 via a display screen adhesive (not shown). In some embodiments, the middle portion of the display screen 300 may not be fixedly connected to the second cover plate 12.

[0120] In some embodiments, a display screen insulator 80 may be provided between a portion of the middle portion of the display screen 300 and the second cover plate 12 to separate the middle portion of the display screen 300 from the second cover plate 12 , thereby preventing electrical connection between the display screen 300 and the second cover plate 12 .

[0121] As shown in Figures 7 and 8, a shaping area 1211 can be set in the middle area 121 of the second cover plate 12 and fixed to the first surface 11a of the first cover plate 11, so that the flatness of the accommodating area 1212 and the first cover plate 11 can be shaped by using the shaping area 1211.

[0122] It is understandable that if the accommodation area 1212 of the second cover plate 12 protrudes in a direction away from the first cover plate 11, the flatness of the accommodation area 1212 of the second cover plate 12 is poor. In this case, when the heat sink 10 is applied to the electronic device 1000, the second cover plate 12 of the heat sink 10 is likely to hit the screen, thereby damaging the display screen 300. In the embodiment of the present application, a force in the first direction can be applied to the shaping area 1211 of the second cover plate 12 by a jig, so that the accommodation area 1212 of the second cover plate 12 no longer protrudes in a direction away from the first cover plate 11 under tension, that is, the accommodation area 1212 of the second cover plate 12 can be flattened, and the accommodation area 1212 of the second cover plate 12 can be calibrated to a better flatness, that is, the flatness of the accommodation area 1212 of the second cover plate 12 can be calibrated to within the specifications, thereby greatly improving the flatness yield of the heat sink 10. In this way, the second cover plate 12 of the heat sink 10 is less likely to have the problem of the top screen, thereby ensuring that the display screen 300 has better reliability. Among them, the first direction can be the direction of the second cover plate 12 toward the first cover plate 11. In addition, since the shaping area 1211 of the second cover plate 12 is fixedly connected to the first cover plate 11, no capillary structure 13 is set between the shaping area 1211 and the first cover plate 11. At this time, the shaping area 1211 can bear a larger force, thereby meeting the flatness requirements of the heat sink 10. In other words, when a force along the first direction is applied to the shaping area 1211 of the second cover plate 12, the second cover plate 12 will not be squeezed into the capillary structure 13 due to deformation close to the first cover plate 11, thereby avoiding damage to the capillary structure 13.

[0123] It is understandable that if the first cover plate 11 protrudes in the direction away from the second cover plate 12, the flatness of the first cover plate 11 is also poor. At this time, when the heat sink 10 is applied to the electronic device 1000, due to the poor flatness of the first cover plate 11, the battery 500 and the first cover plate 11 of the heat sink 10 are poorly bonded to the battery adhesive, the connection is not firm, and the battery 500 is prone to debonding and other problems. In the embodiment of the present application, a force in the second direction can be applied to the shaping area 1211 of the second cover plate 12 by a jig, so that the first cover plate 11 no longer protrudes in the direction away from the second cover plate 12 under tension, that is, the first cover plate 11 can be flattened, and the first cover plate 11 can be restored to a better flatness, that is, the flatness of the first cover plate 11 can be calibrated to within the specification, thereby greatly improving the flatness yield of the heat sink 10. In this way, the battery 500 and the first cover plate 11 of the heat sink 10 are well bonded to the battery adhesive, and the battery 500 is not prone to debonding.

[0124] As shown in FIG7 , there are multiple shaping zones 1211. In some embodiments, there can be two shaping zones 1211. The two shaping zones 1211 can be spaced apart along the length of the heat sink 10 (i.e., the Y-axis). In this way, the two shaping zones 1211 can be responsible for smoothing different locations of the accommodation zone 1212, thereby ensuring that most of the accommodation zone 1212 can be smoothed if any deformation or protrusions occur.

[0125] As shown in FIG. 7 , the edge region 122 of the second cover plate 12 may include a first edge 1221 and a second edge 1222 arranged along the length direction (ie, the Y-axis direction) of the heat dissipation plate 10 .

[0126] In some embodiments, the shortest distance between the first edge 1221 and the second edge 1222 is a. The distance between the center of the first shaping area 1211 and the center of the second shaping area 1211 is b. Here, a and b satisfy the following: 0.25a ≤ b ≤ 0.4a. For example, b can be 0.25a, ​​0.3a, 0.35a, or 0.4a. It will be appreciated that when a and b satisfy the following: 0.25a ≤ b ≤ 0.4a, the first shaping area 1211 and the second shaping area 1211 can cooperate with each other, thereby achieving flatness adjustment across most of the accommodating area 1212.

[0127] In some embodiments, the edge area 122 of the second cover plate 12 includes a third edge 1223 and a fourth edge 1224 arranged along the width direction of the heat dissipation plate 10 (i.e., the X-axis direction), and the third edge 1223 and the fourth edge 1224 are connected between the first edge 1221 and the second edge 1222, and the shortest distance between the third edge 1223 and the fourth edge 1224 is c.

[0128] The distance between the center of the shaping area 1211 and the third edge 1223 is d, where c and d satisfy: 0.4c≤d≤0.6c. For example, d can be equal to 0.4c, 0.5c, 0.55c, or 0.6c.

[0129] It can be understood that when c and d satisfy: 0.4c≤d≤0.6c, the shaping area 1211 can shape the flatness of most positions of the accommodating area 1212 .

[0130] FIG. 9 is a partial cross-sectional schematic diagram of the middle frame 100 shown in FIG. 2 taken along CC in some embodiments.

[0131] As shown in Figure 9, for example, the first shaping area 1211 can be directly opposite the junction of the battery compartment 103 and the support plate 20. In this way, the first shaping area 1211 can perform flatness shaping on the portion of the heat sink 10 directly opposite the battery compartment 103, so that the flatness of the portion of the heat sink 10 directly opposite the battery compartment 103 can be calibrated to within the specifications, thereby greatly improving the yield rate of the flatness of the portion of the heat sink 10 directly opposite the battery compartment 103. In this way, both the battery 500 and the heat sink 10 are better bonded to the battery adhesive, and the battery 500 is not prone to debonding problems. The first shaping area 1211 can also perform flatness shaping on the portion of the heat sink 10 directly opposite the support plate 20, so that the flatness of the portion of the heat sink 10 directly opposite the support plate 20 can be calibrated to within the specifications, thereby greatly improving the yield rate of the flatness of the portion of the heat sink 10 directly opposite the support plate 20. In this case, the problem that the support plate 20 squeezes the heat sink 10 due to poor flatness, and the heat sink 10 deforms and squeezes the display screen 300 can be solved. The display screen 300 of the embodiment of the present application has better reliability.

[0132] As shown in Figure 9, for example, the second shaping area 1211 can be positioned directly opposite the battery compartment 103. This allows the second shaping area 1211 to better flatten the area of ​​the heat sink 10 directly opposite the battery compartment 103, thereby ensuring that the flatness of the heat sink 10 is calibrated to within specifications and significantly improving the flatness yield of the heat sink 10. This ensures that both the battery 500 and the first cover 11 of the heat sink 10 adhere better to the battery adhesive, making it less likely that the battery 500 will become debonded.

[0133] FIG10 is a partial cross-sectional schematic diagram of the heat dissipation plate 10 shown in FIG6 taken along line BB in some other embodiments.

[0134] As shown in Figure 10, in some embodiments, a portion of the accommodating area 1212 of the second cover plate 12 can be recessed toward the first cover plate 11 and can be fixedly connected to the capillary structure 13. In this way, the accommodating area 1212 of the second cover plate 12 is generally curved, which improves the strength of the second cover plate 12. It can be understood that the structure of the accommodating area 1212 of the second cover plate 12 in the embodiments of the present application can solve the problem of low strength of the accommodating area 1212 of the second cover plate 12 due to its thin thickness.

[0135] It is understandable that, although FIG10 shows that the capillary structure 13 is separately provided from the shaping area 1211 of the second cover plate 12 , in some embodiments, the capillary structure 13 may also be connected to the shaping area 1211 of the second cover plate 12 .

[0136] It will be appreciated that the heat sink 10 described above, in conjunction with the accompanying drawings, not only supports the battery 500 and display screen 300 but also dissipates heat from them. Clearly, the reliability of the connection between the heat sink 10 and the support plate 20 is particularly important. The following, in conjunction with the accompanying drawings, details several methods for securing the heat sink 10 to the middle plate 102 to ensure a stable and secure connection between the heat sink 10 and the support plate 20.

[0137] FIG11 is a partially exploded schematic diagram of the middle frame 100 shown in FIG2 in another embodiment.

[0138] As shown in Figure 11, the heat sink 10 can be fixedly connected to the support plate 20 by means of a fastener 31, adhesive 32, and adhesive layer 33. The fastener 31 can be a screw, bolt, or pin, etc. The adhesive 32 can be double-sided tape. The adhesive layer 33 can be a structure formed by cured glue. The glue can be applied between the heat sink 10 and the support plate 20 through a dispensing process.

[0139] FIG. 12 is an enlarged schematic diagram of a portion of the middle frame 100 shown in FIG. 11 in one embodiment.

[0140] As shown in FIG12 , the support plate 20 may include a first connection area 21 and a second connection area 22 . The second connection area 22 is fixedly connected to the first connection area 21 .

[0141] In some embodiments, the number of first connection areas 21 may be one or more, and the number of second connection areas 22 may be one or more. The following description will take the example of a case where there are multiple first connection areas 21 and one second connection area 22.

[0142] In some embodiments, the second connection region 22 may be disposed around the plurality of first connection regions 21. In addition, the plurality of first connection regions 21 may be distributed close to the edge of the second connection region.

[0143] In some embodiments, the present application does not specifically limit the number, shape, size, and position of the first connection area 21 and the second connection area 22 of the support plate 20 .

[0144] In some embodiments, the second connection area 22 may include a first plate area 221 and a second plate area 222, and a first side area 223 and a second side area 224 arranged opposite to each other. The first side area 223 and the second side area 224 may be connected between the first plate area 221 and the second plate area 222. The first side area 223, the second side area 224, the first plate area 221 and the second plate area 222 may be arranged around the hollow area 20a. In addition, the first side area 223 and the second side area 224 may be arranged along the width direction of the heat dissipation plate 10 (i.e., the X-axis direction). The first plate area 221 and the second plate area 222 may be arranged along the length direction of the heat dissipation plate 10 (i.e., the Y-axis direction). It is understood that in the width direction of the middle frame 100, the sizes of the first side area 223 and the second side area 224 may be smaller than the sizes of the first plate area 221 and the second plate area 222.

[0145] It is understandable that when there are multiple first connection areas 21 , the first connection areas 21 may be distributed at intervals in the first plate area 221 , the second plate area 222 , the first side area 223 and the second side area 224 of the second connection area 22 .

[0146] As shown in FIG11 , in some embodiments, the first cover plate 11 of the heat dissipation plate 10 may include a third connection area 111 and a fourth connection area 112 . The fourth connection area 112 is fixedly connected to the third connection area 111 .

[0147] For example, the number of third connection areas 111 matches the number of first connection areas 21. The number of fourth connection areas 112 matches the number of second connection areas 22. For example, there may be multiple third connection areas 111 and one fourth connection area 112. In some embodiments, this application does not specifically limit the number, shape, size, and position of the third connection areas 111 and the fourth connection area 112 of the first cover plate 11 of the heat sink 10.

[0148] As shown in Figures 11 and 12, the third connection area 111 of the heat sink 10 can be fixedly connected to the first connection area 21 of the support plate 20 via a fastener 31. The fourth connection area 112 of the heat sink 10 is fixedly connected to the second connection area 22 of the support plate 20 via an adhesive backing 32 and an adhesive layer 33. In this way, the heat sink 10 can be fixedly connected to the support plate 20 through the cooperation of the fastener 31, the adhesive backing 32, and the adhesive layer 33. At this point, the connection between the heat sink 10 and the support plate 20 is more secure and stable, and the heat sink 10 can better support the battery 500 and the display screen 300.

[0149] First, as shown in FIG. 11 and FIG. 12 , the third connection region 111 of the heat dissipation plate 10 may be fixedly connected to the first connection region 21 of the support plate 20 by a fastener 31 .

[0150] FIG. 13 is a partial cross-sectional schematic diagram of the middle frame 100 shown in FIG. 2 taken along line DD in some embodiments.

[0151] As shown in Figure 13, for example, the first connection area 21 of the support plate 20 can be provided with a fastening hole 211. The third connection area 111 of the first cover plate 11 can also be provided with a fastening hole 113. The fastening hole 113 of the first cover plate 11 can be arranged opposite to the fastening hole 211 of the support plate 20. The middle frame 100 can also include a fastener 31. By sequentially passing the fastener 31 through the fastening hole 211 of the support plate 20 and the fastening hole 113 of the first cover plate 11, the heat sink 10 is locked to the support plate 20. At this time, the connection between the heat sink 10 and the support plate 20 is more secure and more stable.

[0152] It is understood that when there are multiple first connection areas 21, the number of fastening holes 211 of the support plate 20 can also be multiple. The number of fastening holes 113 of the first cover plate 11 can match the number of fastening holes 211 of the support plate 20, that is, the number of fastening holes 113 of the first cover plate 11 can also be multiple. In this case, the multiple fastening holes of the first cover plate 11 and the multiple fastening holes of the support plate 20 are arranged in a one-to-one correspondence. The multiple fasteners 31 pass through the multiple fastening holes of the first cover plate 11 and the multiple fastening holes of the support plate 20 in a one-to-one correspondence.

[0153] For example, the first connection region 21 of the support plate 20 may be provided with a first groove 212. The fastening holes 211 of the support plate 20 may be located within the first groove 212. The fastening holes 211 of the support plate 20 may open into the bottom wall of the first groove 212. Furthermore, at least a portion of the third connection region 111 of the first cover plate 11 may be recessed into the bottom wall of the first groove 212 to form a second groove 114. The fastening holes 113 of the first cover plate 11 may be located within the second groove 114. The fastening holes 113 of the first cover plate 11 may open into the bottom wall of the second groove 114.

[0154] It is understood that after the fastener 31 passes through the fastening hole 113 of the first cover plate 11 and the fastening hole 211 of the support plate 20, a portion of the fastener 31 (e.g., the nut) can be located within the second groove 114. This allows the fastener 31 to avoid contact with the display screen 300, thereby preventing the fastener 31 from pressing against the display screen. Furthermore, if the electronic device 1000 is impacted, the fastener 31 will not impact the display screen 300, thereby preventing display defects such as bright spots on the display screen 300 caused by the impact of the fastener 31.

[0155] For example, the second groove 114 of the first cover plate 11 may be formed by a stamping process.

[0156] For example, when there are multiple fasteners 31, the number of the first grooves 212 of the support plate 20 and the number of the second grooves 114 of the first cover plate 11 can match the number of fasteners 31. In this way, the nuts of the multiple fasteners 31 are disposed in the multiple second grooves 114 in a one-to-one correspondence.

[0157] For example, the third connection region 111 of the first cover plate 11 may include a plurality of spaced-apart protrusions 115. The plurality of protrusions 115 may be arranged around the fastening holes 113 of the first cover plate 11. When the first cover plate 11 is fastened to the support plate 20 via the fasteners 31, the plurality of protrusions 115 may abut against the first connection region 21 of the support plate 20. This provides a tighter and more secure connection between the first cover plate 11 and the support plate 20.

[0158] Second, as shown in FIG. 11 and FIG. 12 , the fourth connection region 112 of the heat dissipation plate 10 can be fixedly connected to the second connection region 22 of the support plate 20 through the cooperation between the adhesive 32 and the adhesive layer 33 .

[0159] It is understood that in some embodiments, because the dimensions of the first plate area 221 and the second plate area 222 of the second connection area 22 are both larger than the dimensions of the first side area 223 and the second side area 224 of the second connection area 22 in the width direction of the middle frame 100, and the bonding strength between the adhesive and the heat sink 10 and the support plate 20 is closely related to the dimensions of the support plate 20 in the width direction of the middle frame 100, the following description will separately discuss the methods for securing the heat sink 10 to the first plate area 221 and the second plate area 222, and the methods for securing the heat sink 10 to the first side area 223 and the second side area 224. Furthermore, in some embodiments, because the dimensions of the second plate area 222 and the first plate area 221 of the support plate 20 in the width direction of the middle frame 100 are substantially the same, the following description will use the method for securing the first plate area 221 of the support plate 20 to the heat sink 10 as an example. For details on the method for securing the second plate area 222 of the support plate 20 to the heat sink 10, please refer to the method for securing the first plate area 221 of the support plate 20 to the heat sink 10. Of course, other fixing methods can also be used to fix the second plate area 222 of the support plate 20 and the heat sink 10. The specific details will not be repeated here. Similarly, the following will also take the fixing method of the first side area 223 of the support plate 20 and the heat sink 10 as an example to introduce.

[0160] Fig. 14 is a partial structural schematic diagram of the middle frame 100 shown in Fig. 2 in one embodiment. Fig. 15 is a partial cross-sectional schematic diagram of the middle frame 100 shown in Fig. 2 taken along line EE in some embodiments.

[0161] As shown in FIG. 14 and FIG. 15 , the fourth connection area 112 of the first cover plate 11 of the heat dissipation plate 10 can be fixedly connected to the first plate area 221 of the support plate 20 through the cooperation between the first adhesive 321 and the first adhesive layer 331 .

[0162] Exemplarily, the adhesive backing 32 may include a first adhesive backing 321. The first adhesive backing 321 is bonded between the fourth connection area 112 of the first cover plate 11 and the first plate area 221 of the support plate 20. It is understood that due to the good adhesion and impact resistance of the first adhesive backing 321, the connection between the first cover plate 11 of the heat sink 10 and the support plate 20 is secure, thereby effectively meeting reliability testing requirements.

[0163] Exemplarily, the first adhesive backing 321 may be provided with an adhesive dispensing hole 3211. The adhesive layer 33 may further include a first adhesive layer 331. The first adhesive layer 331 may be disposed in the adhesive dispensing hole 3211. The first adhesive layer 331 may also be bonded between the fourth connection area 112 of the first cover plate 11 and the first plate area 221 of the support plate 20. It is understandable that, due to the stronger viscosity of the first adhesive layer 331, the first adhesive layer 331 may more firmly fix the heat sink 10 and the support plate 20. In this way, the connection between the heat sink 10 and the support plate 20 is more secure, which can better meet the reliability test requirements.

[0164] It is understood that the first adhesive layer 331 can be provided with adhesive dispensing holes 3211 (i.e., adhesive dispensing spaces) to prevent glue from overflowing during the dispensing process. Furthermore, when the heat sink 10 is secured to the support plate 20, the first adhesive layer 321 can effectively support the heat sink 10, thereby preventing the heat sink 10 from collapsing the glue during the pressing process and ensuring a stable connection between the heat sink 10 and the support plate 20.

[0165] It is understandable that the fourth connection area 112 of the heat sink 10 may not be limited to being fixedly connected to the first plate area 221 of the support plate 20 by the cooperation between the first adhesive 321 and the first adhesive layer 331. In some embodiments, the fourth connection area 112 of the heat sink 10 may also be fixedly connected to the first plate area 221 of the support plate 20 solely through the first adhesive 321, or may be fixedly connected to the first plate area 221 of the support plate 20 solely through the first adhesive layer 331. In some embodiments, the heat sink 10 may also be fixedly connected to the first plate area 221 of the support plate 20 by other fixing methods. This application does not make any specific limitations.

[0166] FIG16 is a partial cross-sectional schematic diagram of the middle frame 100 shown in FIG2 taken along line FF in some embodiments.

[0167] As shown in FIG. 14 and FIG. 16 , the fourth connection region 112 of the first cover plate 11 of the heat dissipation plate 10 may also be fixedly connected to the first edge region 223 of the support plate 20 via the second adhesive layer 332 .

[0168] Exemplarily, the first side area 223 of the second connection area 22 of the support plate 20 may be provided with a first retaining wall 225. The first retaining wall 225 may be located at the end of the first side area 223 close to the battery compartment 103. The first retaining wall 225, the first side area 223 of the support plate 20 and the frame 101 may enclose a glue dispensing groove. The glue layer also includes a second glue layer 332. The second glue layer 332 is bonded between the fourth connection area 112 of the first cover plate 11 and the first side area 223 of the support plate 20. It can be understood that due to the stronger viscosity of the second glue layer 332, the second glue can more firmly fix the heat sink 10 and the first side area 223 of the support plate 20. In this way, the connection between the heat sink 10 and the support plate 20 is more reliable, which can better meet the reliability test requirements.

[0169] It is understood that the first retaining wall 225 can prevent glue from overflowing the dispensing groove and flowing into the battery compartment 103 during the dispensing process. In addition, the thickness of the glue layer can be flexibly controlled by setting the height of the first retaining wall 225, thereby ensuring that the second glue layer 332 has a sufficient glue height to ensure a stable connection between the heat sink 10 and the support plate.

[0170] FIG17 is a partial cross-sectional schematic diagram of the middle frame 100 shown in FIG2 taken along FF in some other embodiments.

[0171] As shown in FIG. 17 , the fourth connection region 112 of the first cover plate 11 of the heat dissipation plate 10 may also be fixedly connected to the first edge region 223 of the support plate 20 via the second adhesive 322 .

[0172] In some embodiments, the width D of the first side region 223 of the support plate 20 in the width direction (i.e., the X-axis direction) of the middle frame 100 can be greater than or equal to 1.5 mm. For example, the width D of the first side region 223 can be 1.5 mm, 2 mm, 2.5 mm, 2.6 mm, 2.8 mm, 3.1 mm, or 4 mm. In some embodiments, the width D of the first side region 223 of the support plate 20 can also be not specifically limited.

[0173] Illustratively, the adhesive backing 32 includes a second adhesive backing 322. The second adhesive backing 322 can be bonded between the fourth connection area 112 of the first cover plate 11 and the first side area 223 of the support plate 20. In this case, the first cover plate 11 of the heat sink 10 can be fixedly connected to the first side area 223 of the support plate 20 via the second adhesive backing 322. This ensures a more secure connection between the first cover plate 11 of the heat sink 10 and the first side area 223 of the support plate 20 due to the excellent adhesion and impact resistance of the second adhesive backing 322, effectively meeting reliability testing requirements.

[0174] It can be understood that, compared to the solution in which the fourth connection area 112 of the first cover plate 11 is fixedly connected to the first side area 223 of the support plate 20 through the second adhesive layer 332, in the embodiment of the present application, the fourth connection area 112 of the first cover plate 11 can be fixedly connected to the first side area 223 of the support plate 20 through the second adhesive layer 322. Therefore, the embodiment of the present application can not adopt the dispensing process, thereby avoiding the risk of glue overflow and eliminating the dispensing process, thereby reducing the process cost. In addition, the first side area 223 of the support plate 20 can also no longer be provided with a protruding first retaining wall 225. In this way, on the one hand, the structure of the first side area 223 of the support plate 20 is relatively simple and easy to produce; on the other hand, the flatness of the first side area 223 of the support plate 20 is relatively high, which is conducive to the connection between the first cover plate 11 of the heat dissipation plate 10 and the support plate 20.

[0175] In some embodiments, the fourth connection area 112 of the first cover plate 11 can also be fixedly connected to the first edge area 223 of the support plate 20 through the cooperation between the second adhesive 322 and the second adhesive layer 332. This application does not limit this in detail.

[0176] It will be appreciated that the preceding text, in conjunction with the relevant drawings, specifically describes a method in which the third connection area 111 of the heat sink 10 is fixedly connected to the first connection area 21 of the support plate 20 via fasteners 31, and the fourth connection area 112 of the heat sink 10 is fixedly connected to the second connection area 22 of the support plate 20 via adhesive backing 32 and adhesive layer 33. This method ensures a stable and secure connection between the heat sink 10 and the support plate 20. The following text, in conjunction with the relevant drawings, further describes several methods for fixing the third connection area 111 of the heat sink 10 to the first connection area 21 of the support plate 20.

[0177] FIG18 is a partial cross-sectional schematic diagram of the middle frame 100 shown in FIG2 taken along DD in some other embodiments.

[0178] As shown in FIG18 , in some embodiments, the third connection region 111 of the heat dissipation plate 10 may be fixedly connected to the first connection region 21 of the support plate 20 via a solder joint 52. The solder joint 52 may be a structure formed between the heat dissipation plate 10 and the support plate 20 by a soldering process.

[0179] In some embodiments, the thickness H of the first cover plate 11 of the heat sink 10 can be less than or equal to 0.2 mm. For example, the thickness L of the first cover plate 11 can be 0.2 mm, 0.15 mm, 0.14 mm, 0.13 mm, 0.12 mm, or 0.1 mm. In some embodiments, the thickness H of the first cover plate 11 is not specifically limited.

[0180] For example, the third connection area 111 of the first cover plate 11 of the heat dissipation plate 10 can be fixedly connected to the first connection area 21 of the support plate 20 by a welding process. At this time, a welding point 52 can be formed between the third connection area 111 of the first cover plate 11 and the first connection area 21 of the support plate 20.

[0181] It can be understood that compared with the solution in which the third connection area 111 of the heat sink 10 is fixedly connected to the first connection area 21 of the support plate 20 by the fastener 31, in the embodiment of the present application, since the third connection area 111 of the heat sink 10 is fixedly connected to the first connection area 21 of the support plate 20 by the welding point 52, the third connection area 111 of the heat sink 10 and the first connection area 21 of the support plate 20 are not easily damaged by the opening of the hole, thereby ensuring that the heat sink 10 and the support plate 20 have better structural strength.

[0182] FIG19 is a partial cross-sectional schematic diagram of the middle frame 100 shown in FIG2 taken along DD in some further embodiments.

[0183] As shown in Figure 19, in some embodiments, the third connection area 111 of the heat dissipation plate 10 can be fixedly connected to the first connection area 21 of the support plate 20 by a third adhesive 323. The third adhesive 323 can be a double-sided adhesive.

[0184] In some embodiments, the middle frame 100 may include a third adhesive backing 323. The third adhesive backing 323 may be bonded between the third connection area 111 of the heat sink 10 and the first connection area 21 of the support plate 20. In this case, the third connection area 111 of the heat sink 10 can be fixedly connected to the first connection area 21 of the support plate 20 via the third adhesive backing 323. Due to the excellent adhesion and impact resistance of the third adhesive backing 323, the connection between the first cover plate 11 of the heat sink 10 and the support plate 20 is more secure, effectively meeting reliability testing requirements.

[0185] The preceding text, combined with the relevant figures, details several methods for securing the heat sink 10 to the middle plate 102. It is understood that because the heat sink 10 not only supports the battery 500 and display screen 300 but also dissipates heat, it is typically constructed of high-strength metal. This can easily generate interference in the surrounding antenna 60, severely impacting antenna 60 performance. In particular, when the heat sink 10 is located over a large area, the impact of the heat sink 10 on the antenna 60 is particularly significant. To address this issue, the present embodiment provides several methods for electrically connecting a portion of the heat sink 10 to the support plate 20, thereby addressing the issue of the heat sink 10 impacting antenna 60 performance. Furthermore, the present embodiment also provides several methods for insulating a portion of the heat sink 10 from the support plate 20, thereby preventing current from grounding at ungrounded locations on the heat sink 10. This, in turn, prevents the ungrounded locations from generating new magnetic fields that could impact antenna 60 performance. First, several methods for grounding the heat sink 10 will be described in detail below, combined with the relevant figures.

[0186] As shown in FIG13 , the electronic device 1000 may include an antenna 60. It will be appreciated that the radiator 61 of the antenna 60 may be configured to radiate antenna 60 signals to the exterior of the electronic device 1000 based on the RF signals when receiving RF signals. Furthermore, the radiator 61 of the antenna 60 may also be configured to receive antenna 60 signals from the exterior of the electronic device 1000 and convert the antenna 60 signals into RF signals. In some embodiments, a portion of the frame 101 may form the radiator 61 of the antenna 60. Alternatively, the radiator 61 of the antenna 60 may be fixed to the inner side 104 of the frame 101.

[0187] It is understandable that the number of antennas 60 is not limited to the one shown in FIG. 13 , and the number of antennas 60 may be multiple.

[0188] First, by grounding a portion of the heat sink 10 , the heat sink 10 is prevented from generating clutter to the surrounding antenna 60 , thereby preventing the performance of the antenna 60 from being affected.

[0189] As shown in Figure 13, the first connection area 21 of the support plate 20 serves as the grounding location for the antenna 60. At this point, the third connection area 111 of the heat sink 10 is located in an area with a high electric field strength. This area can easily generate clutter around the antenna 60, severely impacting its performance.

[0190] In an embodiment of the present application, the third connection area 111 of the heat dissipation plate 10 can be fixedly connected to the first connection area 21 of the support plate 20 by a fastener 31. The material of the fastener 31 may include a conductive material. In this case, the fastener 31 may be a conductive member 50. It is understandable that by setting the material of the fastener 31 to include a conductive material and the first connection area 21 of the support plate 20 as the grounding position of the antenna 60, the third connection area 111 of the heat dissipation plate 10 can be electrically connected to the first connection area 21 of the support plate 20 through the fastener 31, that is, the third connection area 111 of the heat dissipation plate 10 can be grounded through the fastener 31. In this way, the heat dissipation plate 10 is not likely to generate interference to the surrounding antenna 60, thereby not affecting the performance of the antenna 60.

[0191] It is understood that the fastener 31 can not only securely connect the third connection area 111 of the heat sink 10 to the first connection area 21 of the support plate 20, but also securely and electrically connect the third connection area 111 of the heat sink 10 to the first connection area 21 of the support plate 20. The fastener 31 has a "one-item, multiple-purpose" effect.

[0192] Second, by insulating the non-grounded position of the heat sink 10 from the support plate 20, the current of the antenna 60 is prevented from being grounded at the non-grounded position of the heat sink 10, thereby preventing the non-grounded position of the heat sink 10 from exciting a new magnetic field and affecting the performance of the antenna 60.

[0193] 11 and 12 , the second connection area 22 of the support plate 20 is the non-grounded position of the antenna 60. Thus, the fourth connection area 112 of the heat sink 10 fixedly connected to the second connection area 22 of the support plate 20 is also the non-grounded position of the antenna 60.

[0194] In an embodiment of the present application, the fourth connection area 112 of the heat sink 10 can be fixedly connected to the second connection area 22 of the support plate 20 by the mutual cooperation of the adhesive backing 32 and the adhesive layer 33. The materials of the adhesive backing 32 and the adhesive layer 33 may include insulating materials. At this time, the adhesive backing 32 and the adhesive layer 33 may be insulating members 70. It is understandable that by setting the materials of the adhesive backing 32 and the adhesive layer 33 to include insulating materials, the fourth connection area 112 of the heat sink 10 can be insulated from the second connection area 22 of the support plate 20. At this time, the current of the antenna 60 is not easily grounded at the non-grounded position of the heat sink 10, thereby avoiding the non-grounded position of the heat sink 10 from exciting a new magnetic field, affecting the performance of the antenna 60.

[0195] It is understood that the adhesive backing 32 and the adhesive layer 33 can both securely connect the fourth connection area 112 of the heat sink 10 to the second connection area 22 of the support plate 20 and electrically connect the fourth connection area 112 of the heat sink 10 to the second connection area 22 of the support plate 20. The adhesive backing 32 and the adhesive layer 33 have a "multi-purpose" effect.

[0196] It is understandable that the fixed connection method between the fourth connection area 112 of the heat sink 10 and the second connection area 22 of the support plate 20 may include a method of fixing the fourth connection area 112 of the heat sink 10 to the first plate area 221 of the second connection area 22 of the support plate 20, a method of fixing the fourth connection area 112 of the heat sink 10 to the second plate area 222 of the second connection area 22 of the support plate 20, a method of fixing the fourth connection area 112 of the heat sink 10 to the first side area 223 of the second connection area 22 of the support plate 20, and a method of fixing the fourth connection area 112 of the heat sink 10 to the second side area 224 of the second connection area 22 of the support plate 20. The following description takes the method of fixing the first plate area 221 of the support plate 20 to the heat sink 10 and the method of fixing the first side area 223 of the support plate 20 to the heat sink 10 as examples.

[0197] As shown in Figure 15, in some embodiments, when the fourth connection area 112 of the first cover plate 11 of the heat dissipation plate 10 is fixedly connected to the first plate area 221 of the second connection area 22 of the support plate 20 through the mutual cooperation of the first back glue 321 and the first glue layer 331, the material of the first back glue 321 and the first glue layer 331 can be set to include insulating material, so that the fourth connection area 112 of the first cover plate 11 is insulated from the first plate area 221 of the second connection area 22 of the support plate 20.

[0198] In some embodiments, when the fourth connection area 112 of the first cover plate 11 of the heat dissipation plate 10 is fixedly connected to the first plate area 221 of the second connection area 22 of the support plate 20 through the first adhesive 321 or the first adhesive layer 331 alone, the material of the first adhesive 321 can be set to include an insulating material or the material of the first adhesive layer 331 can be set to include an insulating material, so that the fourth connection area 112 of the first cover plate 11 is insulated from the first plate area 221 of the second connection area 22 of the support plate 20.

[0199] As shown in Figure 16, in some embodiments, when the fourth connection area 112 of the first cover plate 11 of the heat dissipation plate 10 is fixedly connected to the first edge area 223 of the support plate 20 through the second adhesive layer 332, the material of the second adhesive layer 332 can be set to include insulating material, so that the fourth connection area 112 of the first cover plate 11 and the first edge area 223 of the support plate 20 are insulated.

[0200] As shown in Figure 17, when the fourth connection area 112 of the first cover plate 11 of the heat dissipation plate 10 is fixedly connected to the first side area 223 of the support plate 20 through the second adhesive 322, the material of the second adhesive 322 can be set to include insulating material, so that the fourth connection area 112 of the first cover plate 11 and the first side area 223 of the support plate 20 are insulated.

[0201] FIG20 is a partial cross-sectional schematic diagram of the middle frame 100 shown in FIG2 taken along FF in other embodiments.

[0202] As shown in Figure 20, the middle frame 100 may further include a retaining wall insulator 71. The retaining wall insulator 71 may be connected between the fourth connection area 112 of the first cover plate 11 of the heat sink 10 and the first retaining wall 225 of the support plate 20. In this way, the fourth connection area 112 of the first cover plate 11 of the heat sink 10 may also be insulated from the first retaining wall 225 of the support plate 20 by the retaining wall insulator 71.

[0203] For example, the retaining wall insulating member 71 may be made of Mylar. The retaining wall insulating member 71 may be bonded between the fourth connection region 112 of the first cover plate 11 and the first retaining wall 225 of the support plate 20 .

[0204] For example, the retaining wall insulating member 71 may be an insulating varnish. The insulating varnish may be provided on the fourth connection region 112 of the first cover plate 11 or on the first retaining wall 225. In this case, the insulating varnish may insulate the fourth connection region 112 of the first cover plate 11 from the first retaining wall 225 of the support plate 20.

[0205] It will be appreciated that the preceding text, in conjunction with the relevant drawings, specifically describes a scheme in which the third connection area 111 of the heat sink 10 is electrically connected to the first connection area 21 of the support plate 20 via the fastener 31, and the fourth connection area 112 of the heat sink 10 is insulated from the second connection area 22 of the support plate 20 via the adhesive backing 32 and the adhesive layer 33. The following text will further describe, in conjunction with the relevant drawings, several methods for electrically connecting the third connection area 111 of the heat sink 10 to the first connection area 21 of the support plate 20.

[0206] As shown in FIG18 , in some embodiments, the thickness H of the first cover plate 11 of the heat sink 10 can be less than or equal to 0.2 mm. For example, the thickness H of the first cover plate 11 can be 0.2 mm, 0.15 mm, 0.14 mm, 0.13 mm, 0.12 mm, or 0.1 mm. In some implementations, the thickness L of the first cover plate 11 is not specifically limited.

[0207] In some embodiments, the third connection area 111 of the first cover plate 11 of the heat sink 10 can be fixedly connected to the first connection area 21 of the support plate 20 through a welding process. At this time, a welding point 52 is formed between the third connection area 111 of the first cover plate 11 and the first connection area 21 of the support plate 20. The welding point 52 can be a conductive member 50. At this time, the third connection area 111 of the heat sink 10 can be electrically connected to the first connection area 21 of the support plate 20 through the welding point 52. Since the first connection area 21 of the support plate 20 is the grounding position of the antenna 60, the third connection area 111 of the heat sink 10 can be grounded through the welding point 52. In this way, the heat sink 10 is not likely to generate interference to the surrounding antenna 60, thereby not affecting the performance of the antenna 60.

[0208] It can be understood that compared with the solution in which the heat sink 10 is grounded through the fastener 31, the heat sink 10 of the embodiment of the present application is grounded through the solder joint 52. On the one hand, the electrical connection between the heat sink 10 and the support plate 20 is more secure and reliable. On the other hand, the third connection area 111 of the heat sink 10 and the first connection area 21 of the support plate 20 are not easily damaged by the opening, thereby ensuring that the heat sink 10 and the support plate 20 have better structural strength.

[0209] As shown in FIG19 , in some embodiments, the middle frame 100 may include a third adhesive 323 . The material of the third adhesive 323 includes a conductive material. For example, the third adhesive 323 may be conductive foam, conductive adhesive, etc. The conductive foam and conductive adhesive may have the same reference number as the third adhesive 323 . In this case, the third adhesive 323 is a conductive member 50 .

[0210] It is understandable that, since the third connection area 111 of the heat sink 10 is fixedly connected to the first connection area 21 of the support plate 20 via the third adhesive 323, by setting the material of the third adhesive 323 to include a conductive material, and the first connection area 21 of the support plate 20 being the grounding position of the antenna 60, the third connection area 111 of the heat sink 10 can be electrically connected to the first connection area 21 of the support plate 20 via the third adhesive 323, that is, the third connection area 111 of the heat sink 10 can be grounded via the third adhesive 323. In this way, the heat sink 10 is less likely to generate clutter to the surrounding antenna 60, thereby not affecting the performance of the antenna 60.

[0211] It is understood that, compared to the solution of grounding the heat sink 10 via the fastener 31, the heat sink 10 of the embodiment of the present application can be grounded via the third adhesive 323. Therefore, the third connection area 111 of the heat sink 10 and the first connection area 21 of the support plate 20 are not easily damaged by the opening, thereby ensuring that the heat sink 10 and the support plate 20 have better structural strength. In addition, the grounding method of the embodiment of the present application is relatively simple, and the material cost investment is relatively low.

[0212] The preceding text, combined with the relevant drawings, details the fixing method for the heat sink 10 and the middle plate 102, the grounding method for the heat sink 10 and the middle plate 102, and the insulation arrangement for the heat sink 10 and the antenna 60 on the middle plate 102. The following text, combined with the relevant drawings, details the positioning method for the heat sink 10 and the middle plate 102 to ensure a precise connection between the heat sink 10 and the middle plate 102.

[0213] FIG. 21 is a partial cross-sectional schematic diagram of the middle frame 100 shown in FIG. 2 taken along GG in some embodiments.

[0214] As shown in FIG. 21 , in some embodiments, the support plate 20 may be provided with a plurality of first positioning holes 41. The number of first positioning holes 41 may be two. The first positioning holes 41 may be circular. It is understood that the number, shape, and position of the first positioning holes 41 are not specifically limited in this application and may be flexibly configured based on specific needs.

[0215] In some embodiments, the first cover plate 11 of the heat sink 10 may be provided with a plurality of second positioning holes 42 . It is understood that the number, shape, and position of the second positioning holes 42 may match the number, shape, and position of the first positioning holes 41 .

[0216] In some embodiments, the second positioning holes 42 may be disposed opposite to the first positioning holes 41. It is understood that when there are multiple second positioning holes 42 and multiple first positioning holes 41, the multiple second positioning holes 42 may be disposed opposite to the multiple first positioning holes 41 in a one-to-one correspondence.

[0217] It is understood that because the first cover plate 11 of the heat sink 10 can be fixedly connected to the support plate 20 via multiple fasteners 31, the multiple fastening holes of the heat sink 10 can be precisely aligned with the multiple fastening holes of the support plate 20 during the assembly process of the heat sink 10 and the support plate 20. In the embodiments of the present application, by providing first positioning holes 41 and second positioning holes 42 in the support plate 20, during the assembly process of the heat sink 10 and the support plate 20, the first positioning holes 41 and the second positioning holes 42 are first aligned, and then the positioning posts of the assembly tool are inserted into the first positioning holes 41 and the second positioning holes 42, thereby fixing the relative position of the heat sink 10 to the support plate 20. In this way, the multiple fastening holes of the heat sink 10 and the multiple fastening holes of the middle plate 102 can also be precisely aligned. This simplifies the process of fastening the fasteners 31 into the fastening holes of the heat sink 10 and the support plate 20. Furthermore, the fasteners 31 are less likely to float, become loose, or become misaligned during assembly.

[0218] FIG22 is a schematic structural diagram of an embodiment of the middle frame 100 shown in FIG2 at another angle.

[0219] As shown in Figure 22, in some embodiments, the inner side surface 104 of the frame 101 may be provided with a limiting boss 51. Figure 22 schematically distinguishes the frame 101 and the limiting boss 51 by a dotted line.

[0220] The first cover plate 11 of the heat sink 10 can be spaced apart from (i.e., not in contact with) the limiting boss 51. In this case, the first cover plate 11 of the heat sink 10 can be insulated from the frame 101, thereby preventing radiated spurious emission (RSE) from the antenna 60.

[0221] In some embodiments, the distance M1 between the first cover plate 11 of the heat sink 10 and the limiting boss 51 can be smaller than the distance M2 between the first cover plate 11 of the heat sink 10 and the inner side surface 104 of the frame 101. In this way, since the distance between the first cover plate 11 of the heat sink 10 and the limiting boss 51 is small, the heat sink 10 and the frame 101 can be positioned to a certain extent by the mutual cooperation between the first cover plate 11 of the heat sink 10 and the limiting boss 51. At this time, the multiple fastening holes of the heat sink 10 and the multiple fastening holes of the support plate 20 can also be precisely positioned. On the one hand, the process of locking the fasteners 31 into the fastening holes of the heat sink 10 and the fastening holes of the support plate 20 is relatively simple; on the other hand, the fasteners 31 are not prone to problems such as floating, loose locking, and assembly deviation.

[0222] It can be understood that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other, and any combination of features in different embodiments is also within the scope of protection of the present application. That is to say, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0223] It is understood that all the above drawings are illustrative illustrations of this application and do not represent the actual size of the product. The dimensional ratio relationship between the components in the drawings does not serve as a limitation on the actual product of this application. The above are only some of the embodiments and implementation methods of this application. The scope of protection of this application is not limited to this. Any person skilled in the art who is familiar with the technical scope disclosed in this application can easily think of changes or replacements, which should be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A heat dissipation plate (10), characterized in that: It comprises a first cover plate (11), a second cover plate (12), a capillary structure (13) and a cooling medium (14); The second cover plate (12) comprises a middle area (121) and an edge area (122) arranged around the middle area (121), and the middle area (121) comprises a shaping area (1211) and a containing area (1212) connected to the shaping area (1211); The edge region (122) is fixedly connected to the first cover plate (11), and the accommodation area (1212) of the middle region (121) is spaced apart from the first cover plate (11) and surrounds an accommodation cavity (15); The capillary structure (13) is fixedly connected to the first cover plate (11) and is located in the accommodating cavity (15); the cooling medium (14) is arranged in the accommodating cavity (15); The shaping area (1211) of the middle region (121) is fixedly connected to the first cover plate (11).

2. The heat dissipation plate (10) according to claim 1, characterized in that: The shaping area (1211) is recessed in a direction close to the first cover plate (11), and is fixedly connected to the first cover plate (11).

3. The heat dissipation plate (10) according to claim 1, characterized in that: The accommodating area (1212) is arranged around the shaping area (1211).

4. The heat dissipation plate (10) according to any one of claims 1 to 3, characterized in that: There are a plurality of shaping zones (1211), and the plurality of shaping zones (1211) are arranged at intervals along the length direction of the heat dissipation plate (10).

5. The heat dissipation plate (10) according to claim 4, characterized in that: The edge region (122) of the second cover plate (12) comprises a first edge (1221) and a second edge (1222) arranged along the length direction of the heat dissipation plate (10), and the shortest distance between the first edge (1221) and the second edge (1222) is a; The number of the shaping zones (1211) is two, and the distance between the center of the first shaping zone (1211) and the center of the second shaping zone (1211) is b, wherein a and b satisfy: 0.25a≤b≤0.4a.

6. The heat sink (10) according to claim 5, characterized in that: The edge region (122) of the second cover plate (12) comprises a third edge (1223) and a fourth edge (1224) arranged along the width direction of the heat dissipation plate (10), the third edge (1223) and the fourth edge (1224) being connected between the first edge (1221) and the second edge (1222), and the shortest distance between the third edge (1223) and the fourth edge (1224) is c; The distance between the center of the first shaping area (1211) and the third edge (1223) is d, where c and d satisfy: 0.4c≤d≤0.6c.

7. The heat dissipation plate (10) according to any one of claims 1 to 6, characterized in that: A portion of the accommodating area (1212) is recessed in the direction of the first cover plate (11) and is fixedly connected to the capillary structure (13).

8. A middle frame (100), characterized in that: It comprises a frame (101) and a middle plate (102), wherein the middle plate (102) is fixedly connected to the inner side surface (104) of the frame (101), and the middle plate (102) comprises a support plate (20) and a heat dissipation plate (10) according to any one of claims 1 to 7; The support plate (20) is provided with a hollow area (20a), the first cover plate (11) is fixedly connected to the support plate (20), and the first cover plate (11) covers the hollow area (20a) and surrounds the battery compartment (103).

9. The middle frame (100) according to claim 8, characterized in that: The number of the shaping areas (1211) is two, the first shaping area (1211) is directly opposite to the junction of the battery compartment (103) and the support plate (20), and the second shaping area (1211) is directly opposite to the battery compartment (103).

10. The middle frame (100) according to claim 8 or 9, characterized in that: The support plate (20) comprises a first connection area (21) and a second connection area (22), the second connection area (22) being fixedly connected to the first connection area (21), the first cover plate (11) comprises a third connection area (111) and a fourth connection area (112), the fourth connection area (112) being fixedly connected to the third connection area (111); The third connection area (111) of the heat dissipation plate (10) is fixedly connected to the first connection area (21) of the support plate (20) via a fastener (31), and the fourth connection area (112) of the heat dissipation plate (10) is fixedly connected to the second connection area (22) of the support plate (20) via a backing adhesive (32) and / or an adhesive layer (33).

11. The middle frame (100) according to claim 10, characterized in that: The first connection area (21) of the support plate (20) is provided with a first groove (212), the fastening hole (211) of the support plate (20) is located in the first groove (212), at least part of the third connection area (111) of the first cover plate (11) is recessed toward the bottom wall of the first groove (212) to form a second groove (114), and the fastening hole (113) of the first cover plate (11) is located in the second groove (114); A portion of the fastener (31) is located in the second groove (114).

12. The middle frame (100) according to claim 10 or 11, characterized in that: The third connection area (111) comprises a plurality of convex bumps (115) arranged at intervals, the plurality of convex bumps (115) being arranged around the fastening holes (113) of the first cover plate (11), and the plurality of convex bumps (115) being abutted against the first connection area (21).

13. The middle frame (100) according to claim 12, characterized in that: The second connection area (22) includes a first plate area (221), the back glue (32) includes a first back glue (321), and the glue layer (33) includes a first glue layer (331); The fourth connection area (112) of the first cover plate (11) is fixedly connected to the first plate area (221) of the support plate (20) through the mutual cooperation of the first back adhesive (321) and the first adhesive layer (331).

14. The middle frame (100) according to claim 13, characterized in that: The first adhesive backing (321) is provided with an adhesive dispensing hole (3211), and the first adhesive layer (331) is arranged in the adhesive dispensing hole (3211).

15. The middle frame (100) according to claim 13 or 14, characterized in that: The second connecting area (22) comprises a first side area (223), and the first side area (223) is fixedly connected to the first plate area (221); The adhesive layer (33) comprises a second adhesive layer (332), and the fourth connection area (112) of the first cover plate (11) is fixedly connected to the first edge area (223) of the support plate (20) via the second adhesive layer (332).

16. The middle frame (100) according to claim 15, characterized in that: A first retaining wall (225) is protrudingly provided on the first edge region (223) of the support plate (20), and the first retaining wall (225) is located between the second adhesive layer (332) and the battery compartment (103); The middle frame 100 further comprises a retaining wall insulating member (71), wherein the retaining wall insulating member (71) is connected between the fourth connection area (112) of the first cover plate (11) and the first retaining wall (225).

17. The middle frame (100) according to claim 13 or 14, characterized in that: The second connection area (22) comprises a first side area (223), the first side area (223) is fixedly connected to the first plate area (221), and in the width direction of the middle frame (100), a width D of the first side area (223) is greater than or equal to 1.5 mm; The adhesive backing (32) comprises a second adhesive backing (322), and the fourth connection area (112) of the first cover plate (11) is fixedly connected to the first edge area (223) of the support plate (20) via the second adhesive backing (322).

18. The middle frame (100) according to claim 8 or 9, characterized in that: The support plate (20) comprises a first connection area (21) and a second connection area (22), the second connection area (22) being fixedly connected to the first connection area (21), the first cover plate (11) comprises a third connection area (111) and a fourth connection area (112), the fourth connection area (112) being fixedly connected to the third connection area (111), and the thickness H of the first cover plate (11) is less than or equal to 0.2 mm; The third connection area (111) of the heat dissipation plate (10) is fixedly connected to the first connection area (21) of the support plate (20) via a welding point (52), and the fourth connection area (112) of the heat dissipation plate (10) is fixedly connected to the second connection area (22) of the support plate (20) via a backing adhesive (32) and / or an adhesive layer (33).

19. The middle frame (100) according to any one of claims 8 to 18, characterized in that: A portion of the frame (101) forms a radiator (61) of the antenna (60), or the radiator (61) of the antenna (60) is fixed to an inner side surface (104) of the frame (101); The support plate (20) comprises a first connection area (21) and a second connection area (22), the second connection area (22) being fixedly connected to the first connection area (21), and the first connection area (21) being a grounding position of a radiator (61) of the antenna (60); The first cover plate (11) comprises a third connection area (111) and a fourth connection area (112), and the fourth connection area (112) is fixedly connected to the third connection area (111); The third connection area (111) of the heat dissipation plate (10) is electrically connected to the first connection area (21) of the support plate (20) through a conductive member (50), and the fourth connection area (112) of the heat dissipation plate (10) is insulated from the second connection area (22) of the support plate (20) through an insulating member (70).

20. The middle frame (100) according to claim 19, characterized in that: The conductive component (50) comprises a fastener (31), a welding point (52) or a conductive foam (323), wherein the material of the fastener (31) comprises a conductive material, the insulating component (70) comprises a back glue (32) or a glue layer (33), and the material of the back glue (32) and the glue layer (33) comprises an insulating material.

21. The middle frame (100) according to claim 19 or 20, characterized in that: A limiting boss (51) is protruding from the inner side surface (104) of the frame (101), and the distance between the heat dissipation plate (10) and the limiting boss (51) is smaller than the distance between the heat dissipation plate (10) and the inner side surface (104) of the frame (101).

22. The middle frame (100) according to any one of claims 8 to 21, characterized in that: The support plate (20) is provided with a plurality of first positioning holes (41), and the first cover plate (11) is provided with a plurality of second positioning holes (42), and the plurality of second positioning holes (42) are arranged in a one-to-one correspondence with the plurality of first positioning holes (41).

23. An electronic device (1000), characterized in that: Comprising a back cover (200), a display screen (300), a battery (500), and a middle frame (100) as claimed in any one of claims 8 to 22; At least a portion of the display screen (300) is fixedly connected to the second cover plate (12) of the heat dissipation plate (10), the battery (500) is fixedly connected to the first cover plate (11) of the heat dissipation plate (10), and the battery (500) is located in the battery compartment (103); The back cover (200) is fixedly connected to the frame (101) of the middle frame (100); the back cover (200) is located on a side of the middle plate (102) of the middle frame (100) away from the display screen (300); and the back cover (200) covers the battery (500).

24. The electronic device (1000) according to claim 23, characterized in that: The electronic device (1000) further comprises a display screen insulating member (80), wherein the display screen insulating member (80) is located between the display screen and the second cover plate (12).

25. The electronic device (1000) according to claim 23 or 24, characterized in that: The electronic device (1000) further comprises a circuit board (400), wherein the circuit board (400) is fixedly connected to the support plate (20) and is located on a side of the support plate (20) away from the first cover plate (11).

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