Electrical connection device
The electrical connection device addresses the challenge of unstable connections by using a probe with elastic connection portions and multiple contact points to securely connect objects to be inspected with the substrate lands, thereby improving inspection accuracy.
Patent Information
- Application Number
- PCT/JP2024/041356
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-12-12
- Filing Date
- 2024-11-21
- Publication Date
- 2025-06-19
AI Technical Summary
Existing electrical connection devices struggle to establish a stable electrical connection between objects to be inspected, such as semiconductor integrated circuits, and the lands on the substrate during inspections.
The electrical connection device features a probe with a columnar main body and a base end portion that includes multiple connection portions with elastic connecting portions and contact portions. These contact portions are connected to lands on a substrate, ensuring a stable electrical connection.
This configuration allows for a stable and reliable electrical connection between the object to be inspected and the land, enhancing the accuracy of electrical characteristic inspections by minimizing contact issues and ensuring consistent connectivity.
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Figure JP2024041356_19062025_PF_FP_ABST
Abstract
Description
Electrical Connection Device
[0001] The present invention relates to an electrical connecting device used for testing electrical characteristics of an object to be tested.
[0002] An electrical connection device including a probe is used to test the electrical characteristics of a test object such as a semiconductor integrated circuit in a wafer state. In a test using a probe, one end of the probe contacts an electrode of the test object, and the other end of the probe contacts a terminal (hereinafter referred to as a "land") arranged on a substrate included in the electrical connection device. The land is electrically connected to a tester or other test device.
[0003] Japanese Patent Application Laid-Open No. 2018-4260
[0004] In order to accurately test the electrical characteristics of an object under test, it is necessary to stably connect the object under test and the lands via probes. An object of the present invention is to provide an electrical connecting device that can stably connect the object under test and the lands.
[0005] An electrical connection device according to one aspect of the present invention includes a probe including a columnar body extending in an axial direction and a base end connected to the body, and a substrate having lands arranged on a first surface facing the base end of the probe, the lands electrically connecting to the base end. The base end of the probe includes a plurality of connection portions, each having a linking portion at one end connecting to the body and a contact portion connecting to the other end of the linking portion. The substrate has a land group including a plurality of lands that individually contact each of the plurality of contact portions included in the same base end.
[0006] According to the present invention, it is possible to provide an electrical connecting device that stabilizes the electrical connection between an object to be inspected and a land.
[0007] FIG. 1 is a schematic diagram showing the configuration of an electrical connecting device according to a first embodiment. FIG. 2 is a schematic perspective view showing the configuration of a probe included in the electrical connecting device according to the first embodiment. FIG. 3 is a schematic perspective view showing the configuration of a base end of the probe shown in FIG. 2. FIG. 4 is a schematic view showing an example of the arrangement of the coupling portion of the base end shown in FIG. 3. FIG. 5 is a schematic view showing the configuration of an electrical connecting device of a comparative example. FIG. 6 is a schematic plan view showing an example of the arrangement of lands on a substrate included in the electrical connecting device according to the first embodiment. FIG. 7 is a schematic cross-sectional view showing an example of the arrangement of internal wiring on a substrate included in the electrical connecting device according to the first embodiment. FIG. 8 is a schematic cross-sectional view showing another example of the arrangement of internal wiring on a substrate included in the electrical connecting device according to the first embodiment. FIG. 9 is a schematic cross-sectional view showing yet another example of the arrangement of internal wiring on a substrate included in the electrical connecting device according to the first embodiment. FIG. 10 is a schematic plan view showing an example of the arrangement of surface wiring on a substrate included in the electrical connecting device according to the first embodiment. FIG. 11 is a schematic cross-sectional view showing an example of electrical connection between the surface wiring and external electrodes shown in FIG. 10. FIG. 12 is a schematic plan view showing another example of the arrangement of surface wiring of a substrate included in the electrical connecting device according to the first embodiment. FIG. 13 is a schematic plan view showing yet another example of the arrangement of surface wiring of a substrate included in the electrical connecting device according to the first embodiment. FIG. 14 is a schematic plan view showing yet another example of the arrangement of surface wiring of a substrate included in the electrical connecting device according to the first embodiment. FIG. 15 is a schematic view showing an example of the structure of a coupling portion of a probe included in the electrical connecting device according to the first embodiment. FIG. 16 is a schematic view showing another example of the structure of a coupling portion of a probe included in the electrical connecting device according to the first embodiment. FIG. 17 is a schematic view showing yet another example of the structure of a coupling portion of a probe included in the electrical connecting device according to the first embodiment. FIG. 18 is a schematic view showing yet another example of the structure of a coupling portion of a probe included in the electrical connecting device according to the first embodiment. FIG. 19 is a schematic view showing yet another example of the structure of a coupling portion of a probe included in the electrical connecting device according to the first embodiment. FIG. 20 is a schematic perspective view showing the configuration of a base end of a probe included in the electrical connecting device according to the second embodiment. FIG. 21 is a schematic diagram showing an example of the arrangement of the connecting portion of the base end portion shown in FIG.Fig. 22 is a schematic plan view showing an example of the arrangement of lands on a substrate included in the electrical connecting device according to the second embodiment. Fig. 23 is a schematic plan view showing another example of the arrangement of lands on a substrate included in the electrical connecting device according to the second embodiment. Fig. 24 is a schematic view showing the configuration of an electrical connecting device according to another embodiment.
[0008] Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, identical or similar parts are designated by identical or similar reference numerals. However, it should be noted that the drawings are schematic, and the thickness ratios of the various parts may differ from those in reality. Furthermore, it goes without saying that the dimensional relationships and ratios of parts included in the drawings may differ from one another. The embodiments shown below exemplify devices and methods for embodying the technical ideas of the present invention, and the materials, shapes, structures, and arrangements of the components of the embodiments of the present invention are not limited to those described below.
[0009] First Embodiment An electrical connecting device 100 according to the first embodiment shown in FIG. 1 is used to inspect the electrical characteristics of an object under test 200. The electrical connecting device 100 includes a probe 10 including a columnar main body 11 and a base end 13 connected to the main body 11, and a substrate 20 on which a land 21 is arranged to electrically connect to the base end 13 of the probe 10. The substrate 20 is, for example, a printed circuit board or a space transformer. The land 21 is arranged on a first surface 201 of the substrate 20 facing the base end 13 of the probe 10.
[0010] In the following description, the direction in which the substrate 20 is located as viewed from the probe 10 will be referred to as "upward," and the direction in which the probe 10 is located as viewed from the substrate 20 will be referred to as "downward." Furthermore, the upward-facing surface of each part of the electrical connecting device 100 will be referred to as "top surface," the downward-facing surface will be referred to as "bottom surface," and the surface connecting the top and bottom surfaces will be referred to as "side surface." For example, the first surface 201 is the bottom surface of the substrate 20, and the second surface 202 is the top surface of the substrate 20.
[0011] The probe 10 of the electrical connecting device 100 will be described with reference to FIG. 2 . The probe 10 shown in FIG. 2 includes a columnar main body 11, a tip 12 connected to one end of the main body 11 and in contact with the test object 200 during testing, and a base 13 connected to the other end of the main body 11. Hereinafter, the axial direction in which the main body 11 extends will also be referred to simply as the "axial direction." As shown in FIG. 2 , the main body 11 and the tip 12 may be integrally configured. The base 13 includes a plurality of connecting portions 130. Each connecting portion 130 has a linking portion 131 that is elastic and connects to the main body 11, and a contact portion 132 that connects to the linking portion 131.
[0012] 2 has three connection portions 130 at the base end portion 13, the number of connection portions 130 at the base end portion 13 may be two, or may be four or more. Below, an example will be described in which the base end portion 13 has three connection portions 130 as shown in FIG.
[0013] 2, the base end 13 of the probe 10 includes a plurality of connection portions 130, each having a linking portion 131 whose one end connects to the main body portion 11 and a contact portion 132 that connects to the other end of the linking portion 131. On the other hand, the substrate 20, as shown in Fig. 1, has a land group 210 that includes a plurality of lands 21 that individually contact each of the plurality of contact portions 132 included in the same base end 13. In the electrical connecting device 100 that includes a plurality of probes 10, the substrate 20 has a plurality of land groups 210 that correspond to each of the plurality of probes 10.
[0014] 3 , the connecting portion 131 has a beam portion 1311 connected to the main body portion 11 and extending in a direction perpendicular to the axial direction, and a support portion 1312 connected to the beam portion 1311 and extending in the axial direction. A first end 132a of the contact portion 132 is connected to the support portion 1312 of the connecting portion 131. The contact portion 132 extends parallel to the axial direction. When viewed from the axial direction, the main body portion 11 and the contact portion 132 are spaced apart. A second end 132b of the contact portion 132 is included in a plane level perpendicular to the axial direction, at a position axially extended from the position of the other end of the main body portion 11 to which the base end portion 13 is connected. The second end 132b of the contact portion 132 is connected to a land 21 during inspection of the test object 200. The other end of the main body 11 is located below the second end 132b of the contact portion 132, and a space is provided between the end of the main body 11 and the first surface 201 of the substrate 20. The larger the diameter of the contact portion 132, the more stable the contact between the land and the probe 10. While an example has been shown in which the diameter of the contact portion 132 is larger than the diameter of the connecting portion 131, the diameters of the contact portion 132 and the connecting portion 131 may be approximately the same. In order to arrange the probes 10 at a narrow pitch, it is preferable that the diameter of the contact portion 132 is small. Note that the end surface of the second end 132b of the contact portion 132 may be configured so as to remove an oxide film from the surface of the land. For example, the end surface of the second end 132b may be uneven.
[0015] The cross section of the main body 11 perpendicular to the axial direction (hereinafter simply referred to as the "cross section") may be, for example, circular or polygonal. In this embodiment, a case where the cross section of the main body 11 is circular will be described as an example. To electrically connect the electrodes of the test object 200 and the lands 21, a conductive material such as a metal material is used for the probe 10. For example, the probe 10 may be made of nickel (Ni), a nickel alloy, gold (Au), silver (Ag), copper (Cu), palladium (Pd), a palladium alloy, rhodium (Rh), a rhodium alloy, or other precious metals.
[0016] When inspecting the object under test 200, the tip 12 of the probe 10 comes into contact with an electrode pad (not shown) of the object under test 200. The connection portion 130 of the base end 13 of the probe 10 is connected to a land 21 of the substrate 20. Specifically, the second end 132b of the contact portion 132 is connected to the land 21. The land 21 is electrically connected to an inspection device such as an IC tester (not shown).
[0017] The tip of the second end 132b of the contact portion 132 may be a flat surface perpendicular to the axial direction of the probe 10. By making the tip of the second end 132b a flat surface, it is possible to increase the contact area between the contact portion 132 and the land 21. The larger the contact area between the contact portion 132 and the land 21, the larger the current that can flow through the probe 10.
[0018] The electrical connecting device 100 may be configured by joining the base end 13 of the probe 10 to the land 21. The connecting method and connecting material for joining the probe 10 to the land 21 may be selected arbitrarily. For example, the second end 132b of the contact portion 132 of the probe 10 may be joined to the land 21 by soldering.
[0019] Because the linking portion 131 of the connecting portion 130 is elastic, when the tip end 12 of the probe 10, with the base end 13 connected to the land 21, is brought into contact with the test object 200, the probe 10 can be elastically deformed along the axial direction. In other words, the main body 11 of the probe 10 is linear and therefore does not have axial elasticity, but the probe 10 as a whole has axial elasticity. Therefore, after the probe 10 is brought into contact with the test object 200, an overdrive can be applied to press the probe 10 against the test object 200. The overdrive can ensure electrical connection between the probe 10 and the test object 200. Furthermore, the base end 13 of the probe 10 has multiple contact portions 132, allowing the probe 10 to stably contact the land 21.
[0020] After the inspection of the inspection object 200 is completed, the probe 10 is separated from the inspection object 200. The connecting portion 131 is formed so as to undergo elastic deformation to return to its original shape after the probe 10 is separated from the inspection object 200. For example, the diameter of the beam portion 1311 of the connecting portion 131 may be made relatively smaller than that of the main body portion 11, thereby making the connecting portion 131 elastic. Alternatively, the connecting portion 131 may be made elastic by using a material for the connecting portion 131 that is less rigid than the main body portion 11. Furthermore, as will be described later, a slit may be provided in the connecting portion 131.
[0021] As shown in FIG. 4 , when viewed from the axial direction of the probe 10, the angle θ between adjacent coupling portions 131 may be the same for all coupling portions 131. For example, if the base end portion 13 has three connection portions 130, the angle θ is approximately 120 degrees. By having the multiple coupling portions 131 extend from the main body portion 11 with equal angles between them, the probe 10 can be stably contacted with the lands 21. For example, the orientation of the probe 10 can be maintained perpendicular to the surface of the substrate 20 on which the lands 21 are arranged. Furthermore, the multiple connection portions 130 of the base end portion 13 contact the lands 21 with the same pressure.
[0022] However, a comparative probe (hereinafter referred to as "comparative probe 10M"), which has one end of a columnar body as a tip that contacts the test object and the other end connected to a land at a single point at the base end, does not have axial elasticity in the probe itself. For this reason, overdrive is applied by bending the body of comparative probe 10M, as in the comparative electrical connecting device shown in Figure 5.
[0023] In the comparative electrical connection device shown in FIG. 5 , a comparative probe 10M is held by a probe head 30 having a bottom guide plate 31 and a top guide plate 32. The bottom guide plate 31 is disposed around the tip end of the comparative probe 10M. The top guide plate 32 is disposed around the base end of the comparative probe 10M. The probe head 30 further includes a first guide film 34 and a second guide film 35 spaced apart from each other in a space defined by a spacer 33 sandwiched between the top guide plate 32 and the bottom guide plate 31. The top guide plate 32 and the bottom guide plate 31 (hereinafter collectively referred to as "guide plates") are made of, for example, a ceramic material. The first guide film 34 and the second guide film 35 (hereinafter collectively referred to as "guide films") are made of, for example, a resin film. The comparative probe 10M passes through guide holes (not shown) formed in the guide plates and guide films.
[0024] In the probe head 30 shown in Fig. 5, the guide holes through which the same comparative probe 10M passes are offset in position in the top guide plate 32 relative to the guide holes in the bottom guide plate 31, with the guide holes being displaced parallel to the main surface of the bottom guide plate 31. Due to the offset arrangement, the main body of the comparative probe 10M is curved inside the probe head 30, as shown by the solid line in Fig. 5. That is, the comparative probe 10M is curved due to elastic deformation in the hollow region between the bottom guide plate 31 and the top guide plate 32.
[0025] Because the guide plates are offset, when the tip of the comparative probe 10M comes into contact with the test object, the comparative probe 10M buckles in the hollow region. That is, in the contact state where the comparative probe 10M is in contact with the test object, the comparative probe 10M further bends due to flexural deformation as shown by the dashed line in Figure 5. As the comparative probe 10M further bends, it comes into contact with the test object 200 at a predetermined pressure.
[0026] 5, deformation of the comparative probe 10M causes friction between the comparative probe 10M and the guide plate and guide film, which results in problems such as insufficient contact between the comparative probe 10M and the land 21 or the object under test, and insufficient conductivity between the object under test and the land 21.
[0027] In contrast, the probe 10 does not need to be held in a curved state with the main body 11. In other words, there is no friction between the probe 10 and the guide plate or guide film, and conductivity between the test object 200 and the lands 21 is stable.
[0028] As described above, the electrical connecting device 100 according to the embodiment is configured using the probe 10 including a plurality of connecting portions 130, each having a contact portion 132 that connects to the main body portion 11 via a linking portion 131. Therefore, the electrical connecting device 100 can stabilize the electrical connection between the object to be inspected 200 and the land 21.
[0029] Furthermore, in the electrical connecting device 100 including a plurality of probes 10, the arrangement of the lands 21 on the first surface 201 of the substrate 20 can be set arbitrarily. For example, as shown in Fig. 6, a plurality of lands 21 included in a land group 210 may be arranged spaced apart from one another on the first surface 201 of the substrate 20. Fig. 6 is a plan view of the first surface 201 of the substrate 20 as viewed from the axial direction. Also, as shown in Fig. 6, at least some of the lands 21 included in one land group 210 adjacent to that land group 210 may be arranged between the lands 21 included in that land group 210.
[0030] 6, in the electrical connecting device 100, at least a portion of the lands 21 included in one land group 210 can be arranged between the lands 21 included in another land group 210. As a result, the electrical connecting device 100 can narrow the distance D between the main bodies 11 of the probes 10 when viewed in the axial direction. In other words, it is possible to configure the electrical connecting device 100 in which the distance between the probes 10 is narrowed.
[0031] The substrate 20 has external electrodes corresponding to each of the land groups 210 and electrically connected to at least one land 21 included in the land group 210. For example, as shown in Fig. 7 , external electrodes 22 are arranged on a second surface 202 of the substrate 20 facing in the opposite direction to the first surface 201. In the substrate 20 shown in Fig. 7 , all of the lands 21 included in the land group 210 are electrically connected to the external electrodes 22 via internal wiring 23 arranged inside the substrate 20.
[0032] Alternatively, as in the substrate 20 shown in Fig. 8, only one of the lands 21 included in the same land group 210 may be electrically connected to the external electrode 22 via the internal wiring 23. The configuration shown in Fig. 8 has a smaller allowable value for the current flowing through the probe 10 than the configuration shown in Fig. 7. However, according to the substrate 20 configured as shown in Fig. 8, the number of internal wirings 23 can be reduced, which makes it easier to manufacture the substrate 20 and to layout the internal wirings 23.
[0033] 9 , the lands 21 included in the land group 210 may be electrically connected to one another by internal wiring 23 inside the substrate 20. That is, the lands 21 included in the land group 210 may be electrically connected to one another inside the substrate 20.
[0034] As described above, as long as at least one land 21 included in the land group 210 is electrically connected to the external electrode 22, the internal wiring 23 may be arranged in any manner.
[0035] 9 shows an example in which the lands 21 included in a land group 210 are electrically connected to one another by internal wiring 23 arranged inside the substrate 20. On the other hand, as shown in FIG. 10 , a conductive surface wiring 24 that electrically connects the lands 21 included in one land group 210 to one another may be arranged on the first surface 201 of the substrate 20. FIG. 10 shows an example in which all the lands 21 included in the land group 210 are arranged inside one surface wiring 24. As shown in FIG. 11 , the thickness of the surface wiring 24 may be thinner than the thickness of the lands 21. The surface wiring 24 is electrically connected to the external electrode 22 via the internal wiring 23, thereby electrically connecting the lands 21 to the external electrode 22.
[0036] When viewed from the normal direction of the first surface 201, the width of the surface wiring 24 connecting the lands 21 may not exceed the diameter of the land 21. For example, as shown in Fig. 12, the width of the surface wiring 24 perpendicular to the direction from one land 21 toward another adjacent land 21 may be approximately the same as the diameter of the land 21. Alternatively, as shown in Fig. 13, the width of the surface wiring 24 connecting the lands 21 may be narrower than the diameter of the land 21. In other words, the surface wiring 24 may not exceed the straight line connecting the outer edges of adjacent lands 21 included in the same land group 210.
[0037] 14 , the surface wiring 24 may be shaped so as to overlap the shape formed by the main body 11 and the connecting portion 131 of the probe 10 when viewed from the normal direction of the first surface 201. The width of the surface wiring 24 between the lands 21 does not exceed the width of the connecting portion 131. By overlapping the positions of the main body 11 and the connecting portion 131 with the position of the surface wiring 24, it is possible to arrange some of the lands 21 included in one land group 210 between the lands 21 included in another land group 210. Therefore, when viewed from the normal direction of the first surface 201, the outer edge of the surface wiring 24 may not exceed the outer edges of the main body 11 and the connecting portion 131.
[0038] Various configurations can be adopted for the probe 10 in which the linking portions 131 of the connecting portions 130 are elastic. For example, as shown in FIG. 15 , a probe 10 in which slits 1310 are formed in the linking portions 131 of each of a plurality of connecting portions 130 may be used in the electrical connecting device 100. The slits 1310 penetrate the linking portions 131 in a direction parallel to the axial direction of the beam portions 1311. According to the probe 10 shown in FIG. 15 , by providing the slits 1310 that penetrate from the top surface to the bottom surface in the beam portions 1311 of each linking portion 131, it is possible to adjust the needle pressure (hereinafter also simply referred to as "needle pressure") with which the probe 10 contacts the test object 200.
[0039] 16 , a slit 1310 may be formed in the connecting portion 131 of the probe 10, penetrating the connecting portion 131 in a direction perpendicular to the axial direction of the beam portion 1311. By providing the slit 1310 penetrating in the lateral direction in the beam portion 1311, the needle pressure can be adjusted.
[0040] 17 , slits 1310 formed in beam portions 1311 of the plurality of connecting portions 131 may be connected to each other at the portions where the connecting portions 131 are connected to the main body portion 11. By connecting the slits 1310 to each other, the needle pressure can be adjusted across the plurality of connecting portions 131 as a whole.
[0041] As shown in Fig. 18, the connecting portion 131 of the probe 10 may include a beam portion 1311 that is connected to the main body portion 11 and bends elastically, and a support portion 1312 that connects the beam portion 1311 and the contact portion 132. In the probe 10 shown in Fig. 18, the connecting portion 131 includes a bending portion, which makes it easier for the connecting portion 131 to bend when the probe 10 comes into contact with the test object. Therefore, the probe 10 shown in Fig. 18 can apply a stronger overdrive. As a result, the probe 10 can be brought into more stable contact with the test object.
[0042] As shown in FIG. 19 , the connecting portion 131 of the probe 10 may include a first arm 1311a and a second arm 1311b. The first arm 1311a and the second arm 1311b are arranged in parallel and connected to the main body 11. The first arm 1311a extends linearly away from the main body 11 at an angle that intersects the axial direction diagonally. The second arm 1311b has an elastically curved portion. A contact portion 132 is connected to the joint between the first arm 1311a and the second arm 1311b. In the probe 10 shown in FIG. 19 , the second arm 1311b has an elastically curved portion, so that the elasticity of the connecting portion 131 that bends when the probe 10 comes into contact with the test object is increased. As a result, a strong overdrive can be applied. Although an example in which the connecting portion 131 includes a first arm 1311a and a second arm 1311b is shown in Figure 19, the connecting portion 131 may also be composed of three or more arms, including at least one arm having an elastically curved portion.
[0043] Second Embodiment As shown in Figures 20 and 21 , in an electrical connecting device 100 according to a second embodiment, the base end 13 of the probe 10 has four connection portions 130. The angle θ between the linking portions 131 of adjacent connection portions 130 may be constant at approximately 90 degrees. As shown in Figure 22 , one land group 210 includes four lands 21. The electrical connecting device 100 according to the second embodiment differs from the electrical connecting device 100 according to the first embodiment in that the base end 13 of the probe 10 has four connection portions 130 and the land group 210 of the substrate 20 includes four lands 21. In other respects, the second embodiment is similar in configuration to the first embodiment.
[0044] At least one of the four lands 21 included in one land group 210 is electrically connected to an external electrode 22 via, for example, an internal wiring 23, similar to the board 20 shown in Figures 7 to 9. Alternatively, the land 21 is electrically connected to the external electrode 22 via a surface wiring 24, similar to the board 20 shown in Figures 10 to 14.
[0045] In the electrical connecting device 100 according to the second embodiment, the probe 10 may also have a slit 1310 formed in each connecting portion 131 of the connecting portion 130, similar to the probe 10 shown in Figures 15 to 17. Furthermore, the connecting portion 131 of the probe 10 may have a portion that is elastically curved, similar to the probe 10 shown in Figure 18, or may include a first arm 1311a and a second arm 1311b arranged in parallel, similar to the probe 10 shown in Figure 19.
[0046] Even in an electrical connecting device 100 in which one land group 210 includes four lands 21, at least a portion of the lands 21 included in one land group 210 may be arranged between lands 21 included in another land group 210, as shown in FIG. 23 . This allows for the configuration of an electrical connecting device 100 in which the probes 10 are spaced apart from one another by a narrow distance. The arrangement of the land groups 210 shown in FIG. 23 corresponds to a configuration in which probes 10 are arranged adjacent to each other, with the directions in which the connecting portions 131 extend from the main body 11 differing by 45 degrees from each other. For example, the shape of the surface wiring 24 may be formed so as to overlap the shape formed by the main body 11 and connecting portion 131 of the probe 10 when viewed from the normal direction of the first surface 201.
[0047] Otherwise, the electrical connecting device 100 according to the second embodiment is substantially similar to that of the first embodiment, and therefore, a duplicated description will be omitted.
[0048] Although the present invention has been described above by way of the embodiments, the descriptions and drawings that form part of this disclosure should not be understood to limit the present invention. Various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art from this disclosure.
[0049] For example, although the above description exemplifies the case where the number of connecting portions 130 constituting the base end portion 13 is three or four, the number of connecting portions 130 constituting the base end portion 13 may be two. The fewer the number of connecting portions 130, the closer the probes 10 can be arranged to each other. Furthermore, the number of connecting portions 130 constituting the base end portion 13 may be five or more. The greater the number of connecting portions 130, the higher the allowable value of the current flowing through the probe 10 can be.
[0050] Although the electrical connecting device 100 in which the contact portion 132 of the probe 10 is bonded to the land 21 has been shown above, the electrical connecting device may also be configured so that the contact portion 132 and the land 21 can freely be brought into contact with and separated from each other. For example, as in the electrical connecting device 101 shown in Fig. 24, the probe 10 may be held by a probe head 30. The substrate 20 is disposed adjacent to the probe head 30 in the axial direction. The land 21 is disposed on a first surface 201 of the substrate 20 that faces the probe head 30.
[0051] The probe head 30 may include a guide plate having a plurality of guide holes formed therein, through which the probes 10 respectively pass. The probe head 30 holds the plurality of probes 10 with each probe passing through a different guide hole. This prevents adjacent probes 10 from coming into contact with each other. Furthermore, by holding the probes 10 using the probe head 30, the contact portions 132 of the probes 10 do not need to be joined to the lands 21. Since the contact portions 132 are not joined to the lands 21, the probes 10 can be easily replaced, for example, when a malfunction occurs in the probe 10. Furthermore, the probe 10 may be formed with a stopper whose outer diameter is larger than the inner diameter of the guide hole. The stopper hooks around the periphery of the opening of the guide hole in the probe head 30, thereby preventing the probe 10 from falling off the probe head 30.
[0052] Thus, it goes without saying that the present invention includes various embodiments not described above.
[0053] The entire contents of Japanese Patent Application No. 2023-209369 (filing date: December 12, 2023) are incorporated herein by reference.
Claims
1. An electrical connection device used for testing electrical characteristics of an object to be tested, comprising: a probe including a columnar main body extending in an axial direction and a base end connected to the main body; and a substrate having lands arranged on a first surface facing the base end of the probe, the lands being electrically connected to the base end, the base end of the probe including a plurality of connection portions, each having a linking portion at one end that connects to the main body and a contact portion that connects to the other end of the linking portion, and the substrate having a land group including a plurality of the lands that individually contact each of the plurality of contact portions included in the same base end.
2. The electrical connection device according to claim 1, comprising a plurality of said probes, said substrate having a plurality of said land groups electrically connected to each of said plurality of said probes, and at least a portion of said lands included in one of said land groups being disposed between said lands included in another of said land groups.
3. The electrical connection device according to claim 1 or 2, wherein the substrate has an external electrode electrically connected to at least one of the lands included in one of the land groups.
4. The electrical connection device according to claim 3, wherein said external electrodes are disposed on a second surface of said substrate facing in a direction opposite to said first surface.
5. The electrical connecting device according to claim 3, wherein a plurality of said lands included in one of said land groups are arranged spaced apart from one another on said first surface of said substrate.
6. The electrical connecting device according to claim 5, wherein the external electrode is electrically connected to only one of the lands included in one of the land groups.
7. The electrical connecting device according to claim 5, wherein a plurality of said lands included in said group of lands are electrically connected to each other inside said substrate.
8. The electrical connecting device according to claim 3, wherein surface wiring is disposed on said first surface of said substrate, electrically connecting said lands included in one of said land groups to each other.
9. The electrical connecting device according to claim 8, wherein the width of said surface wiring between said lands does not exceed the diameter of said lands when viewed in the normal direction of said first surface.
10. The electrical connecting device according to claim 8, wherein the shape of the surface wiring overlaps with the shape formed by the main body and the connecting portion of the probe when viewed in the normal direction of the first surface.
11. The electrical connecting device according to claim 1 or 2, wherein the contact portion at the base end of the probe and the land are joined together.
12. The electrical connecting device according to claim 1 or 2, wherein the angles formed between adjacent connecting portions connected to the main body of the probe when viewed in the axial direction are the same for all connecting portions.
13. The electrical connection device according to claim 1 or 2, wherein the probe comprises: a tip portion connected to one end of the main body portion and contacting the object to be tested during the test; and a base portion connected to the other end of the main body portion.
14. The electrical connecting device according to claim 13, wherein the connecting portion is elastically connected to the body portion, a first end of the contact portion is connected to the connecting portion, and a second end of the contact portion is in contact with the land.
15. The electrical connecting device according to claim 1 or 2, further comprising a probe head for holding the probes, and the lands are disposed on the first surface of the substrate that faces the probe head.
Citation Information
Patent Citations
Electrical connection device and contactor
JP2018004260A
Electrical connection device
JP2025093614A
Probe card
JP2000249721A
Anisotropic conductive connector and electric inspection device for circuit device
JP2004335450A
Substrate inspection device, substrate inspection method, and substrate inspection jig
JP2014235126A