Switching element and electronic device comprising same

Abstract

Provided are a switching element and an electronic device comprising same. The switching element comprises a substrate, a first conductive pad arranged in a first region of the substrate and electrically connected to a first signal line external to the switching element, and a second conductive pad arranged in a second region of the substrate, the second conductive pad being connected to an external second signal line electrically connected to an external ground, and further comprises a third conductive pad arranged in a third region of the substrate, the third conductive pad being connected to an external third signal line electrically connected to the external ground. The first conductive pad is electrically connected to one of the second conductive pad or the third conductive pad, and is unconnected to the other, so as to form an RF path between the first conductive pad and the one pad that is electrically connected thereto. The substrate does not have any other ground pad that is electrically connected to the external ground, aside from the first conductive pad, the second conductive pad, and the third conductive pad.

Description

Switching elements and electronic devices including the same

[0001] Embodiments of this document relate to a switching element and an electronic device including the same.

[0002] An electronic device including a communication module can transmit an RF (Radio Frequency) signal to an external device and receive an RF signal from the external device. The electronic device can transmit and receive an RF signal using an RF Front End (RFFE). The RFFE may be a component that transmits and receives an RF signal. For example, the RFFE may include a power amplifier, a filter, or a switching element. The electronic device can connect or short an RF signal path using a switching element among the RFFEs. For example, the switching element may have a structure in which a transistor is connected in series with a parallel ground in the middle of a transmission line forming an RF signal path. The switching element can discharge a DC (Direct Current) to an external ground through selective switching and transmit an input RF signal through the connected RF signal path.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] The switching element of this document and the electronic device including the same are intended to improve the switching element.

[0005] According to various embodiments of the present document, a switching element includes a substrate, a first conductive pad formed in a first region of the substrate and configured to be electrically connected to a first signal line external to the switching element, and a second conductive pad formed in a second region of the substrate, wherein the second conductive pad may be configured to be connected to the second external signal line electrically connected to an external ground. The switching element may include a third conductive pad formed in a third region of the substrate, wherein the third conductive pad may be configured to be connected to the third external signal line electrically connected to the external ground. The first conductive pad may be configured to be electrically connected to one of the second conductive pad and the third conductive pad, and not connected to the remaining pads, to form an RF path between the first conductive pad and the one electrically connected pad. In addition to the first conductive pad, the second conductive pad, and the third conductive pad, a ground pad electrically connected to the external ground may not be formed on the substrate.

[0006] An electronic device according to various embodiments of the present document may include a first element, a second element, a first inductor, a second inductor, a switching element, and a printed circuit board (PCB) on which the first element, the second element, the first inductor, the second inductor, and the switching element are arranged. The printed circuit board may include a ground, a first signal line electrically connected to the first element, a second signal line electrically connected to a first terminal of the second element and connected to the ground through the first inductor, and a third signal line electrically connected to a second terminal of the second element and connected to the ground through the second inductor. The switching element may include a substrate, a first conductive pad formed in a first region of the substrate and electrically connected to the first signal line, a second conductive pad formed in a second region of the substrate and connected to the second signal line, and a third conductive pad formed in a third region of the substrate and connected to the third signal line. The first conductive pad may be configured to be electrically connected to one of the second conductive pad and the third conductive pad and not connected to the remaining pads to form an RF path between the first conductive pad and the one pad that is electrically connected. In addition to the first conductive pad, the second conductive pad, and the third conductive pad, a ground pad electrically connected to the ground may not be formed on the substrate.

[0007] Various embodiments of this document can reduce the size and cost of switching elements.

[0008] The effects of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0010] FIG. 2 is a drawing explaining the configuration of a switching element according to various embodiments.

[0011] FIGS. 3A and 3B are drawings illustrating selectively switched switching elements according to various embodiments.

[0012] FIG. 4 is a drawing illustrating the configuration of a switching element including a plurality of terminals according to various embodiments.

[0013] FIG. 5a and FIG. 5b are drawings comparing the switching elements of the present document with existing switching elements according to various embodiments.

[0014] FIGS. 6, 7 and 8 are diagrams illustrating circuits of electronic devices including switching elements according to various embodiments.

[0015] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0016] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0017] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0018] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0019] The memory (130) can store various data used by at least one component (e.g., the processor (120) or the sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., the program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134). The non-volatile memory (134) can include at least one internal memory (136) and an external memory (138).

[0020] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0021] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0022] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0023] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0024] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0025] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0026] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0027] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0028] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0029] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0030] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0031] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0032] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0033] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0034] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0035] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0036] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0037] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0038] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0039] FIG. 2 is a drawing explaining the configuration of a switching element according to various embodiments.

[0040] Referring to FIG. 2, according to one embodiment, a switching element (1100) may include a plurality of terminals (or pins). For example, the switching element (1100) may include a first terminal (1101), a second terminal (1102), and a third terminal (1103). For example, the first terminal (1101) may be connected to a first element, and the second terminal (1102) and the third terminal (1103) may be connected to a second element. As an example, the first element may be an antenna, and the second element may be a transceiver. As an example, the first element and the second element may be transceivers. The switching element (1100) may be directly connected to the first element and / or the second element, or may be connected through another element (e.g., a multiplexer, an amplifier, a coupling element). The second terminal (1102) may be connected to ground (e.g., a common ground outside the switching element (1100)) through a first inductor (1210) disposed outside the switching element (1100), and the third terminal (1103) may be connected to ground through a second inductor (1220) disposed outside the switching element (1100). As an example, the capacitance of the first inductor (1210) and the second inductor (1220) may be about 22 nH to about 56 nH.

[0041] For example, the switching element (1100) may include a substrate. The switching element (1100) may include a first conductive pad formed in a first region of the substrate and configured to be electrically connected to a first signal line external to the switching element (1100). The first conductive pad may be connected to a first terminal (1101) formed in the substrate. As an example, the first signal line may be a signal line that electrically connects between the first conductive pad (or the first terminal (1101)) of the switching element (1100) and the first element. The switching element (1100) may include a second conductive pad formed in a second region of the substrate. For example, the second conductive pad may be connected to a second terminal (1102) formed in the substrate and configured to be connected to a second signal line that is electrically connected to an external ground. As an example, the second signal line may be a signal line that electrically connects between a second conductive pad (or, a second terminal (1102)) of the switching element (1100) and the second element. A first inductor (1210) may be connected to the second signal line outside the switching element (1100). The second conductive pad may be configured to be electrically connected to one end of the first inductor (1210). The switching element (1100) may include a third conductive pad formed in a third region of the substrate. For example, the third conductive pad may be connected to a third terminal (1103) formed on the substrate and may be configured to be connected to a third signal line that is electrically connected to an external ground. As an example, the third signal line may be a signal line that electrically connects between a third conductive pad (or, a third terminal (1103)) of the switching element (1100) and the second element. A second inductor (1220) may be connected to a third signal line outside the switching element (1100). The third conductive pad (or third terminal (1103)) may be configured to be electrically connected to one end of the second inductor (1220).For example, a first conductive pad (or first terminal (1101)) may be configured to be electrically connected to one of a second conductive pad (or second terminal (1102)) and a third conductive pad (or third terminal (1103)), and unconnected to the remaining pads. The first conductive pad may form an RF path with one of the electrically connected pads.

[0042] According to one embodiment, the switching element (1100) may include a plurality of switches. The plurality of switches may be formed on a substrate. A first switch (1110) may be connected in series between a second terminal (1102) and a first terminal (1101), and a third switch (1130) may be connected between a path between the second terminal (1102) and the first switch (1110) and an internal ground of the switching element (1100). A second switch (1120) may be connected in series between a third terminal (1103) and the first terminal (1101), and a fourth switch (1140) may be connected between a path between the third terminal (1103) and the second switch (1120) and an internal ground of the switching element (1100).

[0043] According to one embodiment, the switching element (1100) may include a controller (1190). For example, the controller (1190) may receive a clock signal (SCLK) and a data signal (SDATA) from a processor (e.g., the processor (120) of FIG. 1) of the electronic device (101) (e.g., the electronic device (101) of FIG. 1). The controller (1190) may control on / off of the first switch (1110), the second switch (1120), the third switch (1130), and the fourth switch (1140) according to the received clock signal (SCLK) and data signal (SDATA).

[0044] FIGS. 3A and 3B are drawings illustrating selectively switched switching elements according to various embodiments.

[0045] Referring to FIG. 3A, a switching element (1100) is illustrated in which a first RF path is formed between a first terminal (1101) and a second terminal (1102). For example, the switching element (1100) can turn on the first switch (1110), turn off the third switch (1130), turn off the second switch (1120), and turn on the fourth switch (1140) under the control of the controller (1190). An electrical path can be formed between the first terminal (1101) and the second terminal (1102) by the first switch (1110) turned on inside the switching element (1100), and an electrical path can be formed between the internal ground of the switching element (1100) and the third terminal (1103) by the fourth switch (1140) turned on. An electrical path formed between the first terminal (1101) and the second terminal (1102) can transmit an RF signal, and an electrical path formed between the internal ground and the third terminal (1103) can transmit a DC current.

[0046] For example, the switching element (1100) can transmit an RF signal input from a first element connected to a first terminal (1101) to a second element connected to a second terminal (1102) through a first RF path. Alternatively, the switching element (1100) can transmit an RF signal input from a second element connected to a second terminal (1102) to a first element connected to a first terminal (1101) through a first RF path. In one embodiment, a first inductor (1210) can be connected to a path between the second terminal (1102) and the second element. The first inductor (1210) can be connected in parallel between the path between the second terminal (1102) and the second element and ground. As an example, the resistance of the inductor to a high-frequency signal can be close to infinity. Therefore, the RF signal output through the second terminal (1102) can be input to the second element without affecting the first inductor (1210).

[0047] The RF signal may include a DC current, and the switching element needs to discharge the DC current to the ground. The switching element according to the comparative example may include a ground pad. One side of the ground pad may be connected to the internal ground of the switching element, and the other side may be connected to the ground outside the switching element (1100). The switching element according to the comparative example may form a discharge path for discharging the DC current from the internal ground through the ground pad to the ground outside the switching element (1100). The ground pad is formed to have a size greater than a certain size. Since the switching element is very small (e.g., about 1.1 mm * about 1.1 mm), the area ratio occupied by the ground pad in the switching element may be very large. The switching element according to the comparative example has limitations in reducing the size of the component due to the ground pad formed inside, and the cost may increase due to the process of forming the ground pad.

[0048] A switching element (1100) according to one embodiment of the present invention can eliminate an internal ground pad. In addition, the switching element (1100) can form a discharge path that discharges a DC current from an internal ground to an external ground through an inductor connected to the outside of the switching element (1100). Since the switching element (1100) according to one embodiment of the present invention does not include a ground pad, the size of the switching element (1100) can be reduced, and since a process for forming a ground pad is not required, the cost can be reduced.

[0049] For example, the switching element (1100) can form a discharge path that discharges DC current from an internal ground to an external ground through a second inductor (1220) connected to a path between the third terminal (1103) and the second element. The second inductor (1220) can be connected in parallel between the path between the third terminal (1103) and the second element and the ground. As an example, the resistance of the inductor to the DC signal can be close to 0. Therefore, the DC current discharged to the outside of the switching element (1100) through the third terminal (1103) can flow to the ground.

[0050] Referring to FIG. 3B, a switching element (1100) is illustrated in which a second RF path is formed between a first terminal (1101) and a third terminal (1103). For example, the switching element (1100) can turn off the first switch (1110), turn on the third switch (1130), turn on the second switch (1120), and turn off the fourth switch (1140) under the control of the controller (1190). An electrical path can be formed between the first terminal (1101) and the third terminal (1102) by the second switch (1120) turned on inside the switching element (1100), and an electrical path can be formed between the internal ground of the switching element (1100) and the second terminal (1102) by the third switch (1130) turned on. An electrical path formed between the first terminal (1101) and the third terminal (1103) can transmit an RF signal, and an electrical path formed between the internal ground and the second terminal (1102) can transmit a DC current.

[0051] For example, the switching element (1100) can transmit an RF signal input from a first element connected to a first terminal (1101) to a second element connected to a third terminal (1103) through a second RF path. Alternatively, the switching element (1100) can transmit an RF signal input from a second element connected to a third terminal (1103) to a first element connected to a first terminal (1101) through a second RF path. A second inductor (1220) can be connected to the path between the third terminal (1103) and the second element. The second inductor (1220) can be connected in parallel between the path between the third terminal (1103) and the second element and the ground. Since the resistance of the inductor to a high-frequency signal is close to infinity, the RF signal output through the third terminal (1103) can be input to the second element without being affected by the second inductor (1220).

[0052] For example, the switching element (1100) can form a discharge path that discharges a DC current from an internal ground to an external ground through a first inductor (1210) connected to a path between the second terminal (1102) and the second element. The first inductor (1210) can be connected in parallel between the path between the second terminal (1102) and the second element and the ground. Since the resistance of the inductor to the DC signal is close to 0, the DC current discharged to the outside of the switching element (1100) through the second terminal (1102) can flow to the ground.

[0053] FIG. 4 is a drawing illustrating a configuration of a switching element including more terminals according to various embodiments.

[0054] Referring to FIG. 4, a switching element (1100-1) is illustrated, which includes a first terminal (1101), a second terminal (1102), a third terminal (1103), a fourth terminal (1104), and a fifth terminal (1105). Although FIG. 4 illustrates a switching element including five terminals, the switching element may include a variety of terminal numbers. For example, the switching element may include four, six, seven, or more terminals.

[0055] For example, the first terminal (1101) may be connected to the first element, and the second terminal (1102), the third terminal (1103), the fourth terminal (1104), and the fifth terminal may be connected to the second element. As an example, the first element may be an antenna, and the second element may be a transceiver. As an example, the first element and the second element may be transceivers. The second terminal (1102) may be connected to the ground through a first inductor (1210) disposed outside the switching element (1100-1), and the third terminal (1103) may be connected to the ground through a second inductor (1220) disposed outside the switching element (1100-1).

[0056] According to one embodiment, the switching element (1100-1) may include a plurality of switches. A first switch (1110) may be connected in series between a second terminal (1102) and a first terminal (1101), and a third switch (1130) may be connected between a path between the second terminal (1102) and the first switch (1110) and an internal ground. A second switch (1120) may be connected in series between a third terminal (1103) and the first terminal (1101), and a fourth switch (1140) may be connected between a path between the third terminal (1103) and the second switch (1120) and an internal ground. The fifth switch (1150) may be connected in series between the fourth terminal (1104) and the first terminal (1101), and the seventh switch (1170) may be connected between the path between the fourth terminal (1104) and the fifth switch (1150) and the internal ground. The sixth switch (1160) may be connected in series between the fifth terminal (1105) and the first terminal (1101), and the eighth switch (1180) may be connected between the path between the fifth terminal (1105) and the seventh switch (1170) and the internal ground.

[0057] For example, the switching element (1100-1) can form a first RF path between the first terminal (1101) and the second terminal (1102). The switching element (1100-1) can turn on the first switch (1110), turn off the third switch (1130), turn off the second switch (1120), and turn on the fourth switch (1140) under the control of the controller (1190). In addition, the switching element (1100-1) can turn off the fifth switch (1150), turn on the seventh switch (1170), turn off the sixth switch (1160), and turn on the eighth switch (1180).

[0058] An electrical path may be formed between the first terminal (1101) and the second terminal (1102) by the first switch (1110) turned on inside the switching element (1100-1). An electrical path may be formed between the internal ground of the switching element (1100-1) and the third terminal (1103) by the turned-on fourth switch (1140). An electrical path may be formed between the internal ground of the switching element (1100-1) and the fourth terminal (1104) by the turned-on seventh switch (1170). An electrical path may be formed between the internal ground of the switching element (1100-1) and the fifth terminal (1105) by the turned-on eighth switch (1180). An RF signal may be transmitted through the electrical path formed between the first terminal (1101) and the second terminal (1102). An electrical path formed between the internal ground and the third terminal (1103), an electrical path formed between the internal ground and the fourth terminal (1104), and an electrical path formed between the internal ground and the fifth terminal (1103) can transmit DC current.

[0059] For example, the switching element (1100-1) can transmit an RF signal input from a first element connected to a first terminal (1101) to a second element connected to a second terminal (1102) through a first RF path. Alternatively, the switching element (1100-1) can transmit an RF signal input from a second element connected to a second terminal (1102) to a first element connected to the first terminal (1101) through a first RF path. A first inductor (1210) can be connected to the outside of the second terminal (1102). The first inductor (1210) can be connected in parallel between the path between the second terminal (1102) and the second element and the ground. Since the resistance of the inductor to a high-frequency signal is close to infinity, the RF signal output through the second terminal (1102) can be input to the second element without being affected by the first inductor (1210).

[0060] For example, the switching element (1100-1) can form a discharge path that discharges a DC current from an internal ground to a ground outside the switching element (1100-1) through a second inductor (1220) connected to the outside of the third terminal (1103). The second inductor (1220) can be connected in parallel between the path between the third terminal (1103) and the second element and the ground. As an example, since the resistance of the inductor to a DC signal is close to 0, the DC current discharged to the outside of the switching element (1100-1) through the third terminal (1103) can flow to the ground.

[0061] Although FIG. 4 illustrates a first inductor (1210) connected to the second terminal (1102) and a second inductor (1220) connected to the third terminal (1103), for example, a third inductor connected to the outside of the fourth terminal (1104) and / or a fourth inductor connected to the outside of the fifth terminal (1105) may be included. The switching element (1100-1) may form a discharge path that discharges DC current from the internal ground to the external ground through the fourth terminal (1104) and the third inductor and / or a discharge path that discharges DC current from the internal ground to the external ground through the fifth terminal (1105) and the fourth inductor.

[0062] FIGS. 5A and 5B are drawings comparing a switching element according to a comparative example according to various embodiments and a switching element according to an embodiment of the present invention.

[0063] Referring to FIG. 5A, a switching element (2110) according to a comparative example and a switching element (2120) from which a ground pad is removed according to an embodiment of the present invention are illustrated. The switching element (2110) according to the comparative example may include a ground pad in a central region. For example, the size of the switching element (2110) according to the comparative example may be approximately 1.1 mm * 1.1 mm. The switching element (2120) according to an embodiment of the present invention may not include a ground pad. For example, the size of the switching element (2120) according to an embodiment of the present invention may be approximately 1.1 mm * 0.7 mm. Therefore, the switching element (2120) according to an embodiment of the present invention can reduce the size of the component.

[0064] Referring to FIG. 5B, a switching element (2130) according to a comparative example and a switching element (2140) from which a ground pad is removed according to an embodiment of the present invention are illustrated. The switching element (2130) according to the comparative example may include a ground pad in a central region. The switching element (2140) according to an embodiment of the present invention may not include a ground pad and may include an additional terminal in the ground pad region. As an example, the sizes of the switching element (2130) according to the comparative example and the switching element (2140) according to an embodiment of the present invention may be approximately 1.1 mm * 1.1 mm. The switching element (2140) according to an embodiment of the present invention has the same size as the switching element (2130) according to the comparative example, but may additionally form a path for transmitting an RF signal.

[0065] FIGS. 6, 7 and 8 are diagrams illustrating circuits of electronic devices including switching elements according to various embodiments.

[0066] Referring to FIG. 6, a circuit of an electronic device (101) including a switching element (1100) for transmitting an RF signal between a first element and a second element is illustrated.

[0067] According to one embodiment, the electronic device (101) may include an antenna (1300), a multiplexer (1400), a switching element (1100), a first inductor (1210), a second inductor (1220), a PA (1510), an LNA (1520), a transceiver (1600), and / or a processor (1700). For example, the electronic device (101) may include a printed circuit board (PCB). For example, at least some of the elements of the electronic device (101) may be disposed on the PCB. The antenna (1300) may receive an RF signal from the outside or transmit an RF signal of the electronic device (101) to the outside. The antenna (1300) may be connected to a multiplexer (1400). The multiplexer (1400) may connect various input lines to a single output line. The multiplexer (1400) can be connected to the switching element (1100).

[0068] The switching element (1100) may include a plurality of terminals. For example, the switching element (1100) may include three terminals. The first terminal (1101) may be connected to the first element, and the second terminal (1102) and the third terminal (1103) may be connected to the second element. As an example, the first element may be an antenna (1300) and the second element may be a transceiver (1600). The first terminal (1101) of the switching element (1100) illustrated in FIG. 6 may be connected to the antenna (1300). The second terminal (1102) of the switching element (1100) may be connected to an output terminal (Tx) (1601) of the transceiver (1600). A power amplifier (PA) (1510) for amplifying an output signal may be connected between the second terminal (1102) of the switching element (1100) and the output terminal (1601) of the transceiver (1600). A third terminal (1103) of the switching element (1100) may be connected to an input terminal (Rx) (1602) of the transceiver (1600). A low noise amplifier (LNA) (1520) for amplifying an input signal while reducing noise may be connected between the third terminal (1103) of the switching element (1100) and the input terminal (1602) of the transceiver (1600). As an example, the transceiver (1600) illustrated in FIG. 6 includes an output terminal (1601) and an input terminal (1602), but the transceiver (1600) may include at least one of the output terminal or the input terminal. A first inductor (1210) may be connected to a path between a second terminal (1102) of a switching element (1100) and a power amplifier (1510), and a second inductor (1220) may be connected to a path between a third terminal (1103) and a low-noise amplifier (1520).The first inductor (1210) may be connected in parallel between the path between the second terminal (1102) of the switching element (1100) and the power amplifier (1510) and the ground of the electronic device (101), and the second inductor (1220) may be connected in parallel between the path between the third terminal (1103) of the switching element (1100) and the low-noise amplifier (1520) and the ground of the electronic device (101).

[0069] The transceiver (1600) and the switching element (1100) may be connected to the processor (1700). For example, the processor (1700) may control the transceiver (1600) and the switching element (1100) or transmit a clock signal and / or a data signal.

[0070] As an example, an RF signal received by an antenna (1300) may be transmitted to a switching element (1100) through a multiplexer (1400). Since the transmitted RF signal is a signal input from the outside, the switching element (1100) may control an internal switch to form a first electrical path between a first terminal (1101) and a third terminal (1103). For example, the formed first electrical path may be a second RF path. The switching element (1100) may transmit the RF signal to an input terminal (1602) of a transceiver (1600) through the second RF path. The RF signal output from the switching element (1100) may be amplified while reducing noise in an LNA (1520) and transmitted to the transceiver (1600). Additionally, the switching element (1100) can form a second electrical path between the second terminal (1102) and the ground of the electronic device (101). For example, the formed second electrical path can be a DC current path. The switching element (1100) can discharge the DC current to the ground through the first inductor (1210) on the DC current path.

[0071] As an example, an RF signal generated in a transceiver (1600) may be transmitted to a switching element (1100) through an output terminal (1601) of the transceiver (1600). The RF signal output from the transceiver (1600) may be amplified in a PA (1510) and transmitted to the switching element (1100). Since the transmitted RF signal is a signal input through a second terminal (1102) of the switching element (1100), the switching element (1100) may control an internal switch to form a first electrical path between the first terminal (1101) and the second terminal (1102). For example, the formed first electrical path may be a first RF path. The switching element (1100) may transmit the RF signal to the antenna (1300) through the first RF path. The RF signal may be transmitted to the antenna (1300) via a multiplexer (1400). Additionally, the switching element (1100) can form a second electrical path between the third terminal (1103) and the ground of the electronic device (101). For example, the formed second electrical path can be a DC current path. The switching element (1100) can discharge the DC current to the ground through the second inductor (1220) on the DC current path.

[0072] Referring to FIG. 7, a circuit of an electronic device (101) is illustrated that includes a switching element (1100-1) that includes an additional terminal for transmitting an RF signal between a first element and a second element.

[0073] According to one embodiment, the electronic device (101) may include an antenna (1300), a multiplexer (1400), a switching element (1100-1), a first inductor (1210), a second inductor (1220), a first PA (1511), a second PA (1512), a first LNA (1521), a second LNA (1522), a transceiver (1600) and / or a processor (1700). The antenna (1300), multiplexer (1400), first inductor (1210), second inductor (1220), first PA (1511), second PA (1512), first LNA (1521), second LNA (1522), transceiver (1600), and processor (1700) illustrated in FIG. 7 are similar to those described in FIG. 6, so FIG. 7 will describe the switching element (1100-1).

[0074] According to one embodiment, the switching element (1100-1) may include a plurality of terminals. For example, the switching element (1100-1) may include five terminals. The first terminal (1101) may be connected to the first element, and the second terminal (1102), the third terminal (1103), the fourth terminal (1104), and the fifth terminal (1105) may be connected to the second element. As an example, the first element may be an antenna (1300) and the second element may be a transceiver (1600). The first terminal (1101) of the switching element (1100-1) illustrated in FIG. 7 may be connected to the antenna (1300). The second terminal (1102) and the third terminal (1103) of the switching element (1100-1) may be connected to the output terminals (Tx) (1611, 1612) of the transceiver (1600). A first PA (1511) and a second PA (1512) may be connected between the second terminal (1102) and the third terminal (1103) of the switching element (1100-1) and the output terminals (1611, 1612) of the transceiver (1600), respectively. The fourth terminal (1104) and the fifth terminal (1105) of the switching element (1100-1) may be connected to the input terminals (Rx) (1613, 1614) of the transceiver (1600). A first LNA (1521) and a second LNA (1522) may be connected between the fourth terminal (1104) and the fifth terminal (1105) of the switching element (1100-1) and the input terminals (1613, 1614) of the transceiver (1600). A first inductor (1210) may be connected to a path between the second terminal (1102) of the switching element (1100-1) and the first PA (1511), and a second inductor (1220) may be connected to a path between the fifth terminal (1105) and the first LNA (1521).The first inductor (1210) may be connected in parallel between the path between the second terminal (1102) of the switching element (1100-1) and the first PA (1511) and the ground of the electronic device (101), and the second inductor (1220) may be connected in parallel between the path between the fifth terminal (1105) of the switching element (1100-1) and the first LNA (1521) and the ground of the electronic device (101).

[0075] As an example, an RF signal received by an antenna (1300) may be transmitted to a switching element (1100-1) through a multiplexer (1400). Since the transmitted RF signal is a signal input from the outside, the switching element (1100-1) may control an internal switch to form a first electrical path between the first terminal (1101) and the fourth terminal (1104). Alternatively, the switching element (1100-1) may form a first electrical path between the first terminal (1101) and the fifth terminal (1105). For example, the formed first electrical path may be a second RF path. The switching element (1100-1) may transmit the RF signal to the input terminals (1613, 1614) of the transceiver (1600) through the second RF path. Additionally, the switching element (1100-1) may form a second electrical path between the remaining terminals (e.g., the second terminal (1102), the third terminal (1103), and the fifth terminal (1105)) excluding the terminals (e.g., the first terminal (1101) and the fourth terminal (1104)) where the second RF path is formed and the ground of the electronic device (101). For example, the formed second electrical path may be a DC current path. The switching element (1100) may discharge the DC current to the ground through the first inductor (1210) on the DC current path.

[0076] As an example, an RF signal generated in a transceiver (1600) may be transmitted to a switching element (1100-1) through an output terminal (1611, 1612) of the transceiver (1600). Since the transmitted RF signal is a signal input through a second terminal (1102) or a third terminal (1103) of the switching element (1100-1), the switching element (1100-1) may control an internal switch to form a first electrical path between the first terminal (1101) and the second terminal (1102). Alternatively, the switching element (1100-1) may form a first electrical path between the first terminal (1101) and the third terminal (1103). For example, the formed first electrical path may be a first RF path. The switching element (1100-1) may transmit the RF signal to the antenna (1300) through the first RF path. Additionally, the switching element (1100-1) may form a second electrical path between the remaining terminals (e.g., the third terminal (1103), the fourth terminal (1104), and the fifth terminal (1105)) excluding the terminals where the first RF path is formed (e.g., the first terminal (1101) and the second terminal (1102)) and the ground of the electronic device (101). For example, the formed second electrical path may be a DC current path. The switching element (1100-1) may discharge the DC current to the ground through the second inductor (1220) on the DC current path.

[0077] Referring to FIG. 8, a circuit of an electronic device (101) including a switching element (1100-1) connected between second elements is illustrated.

[0078] According to one embodiment, the electronic device (101) may include an antenna (1300), a multiplexer (1400), a switching element (1100-1), a first inductor (1210), a second inductor (1220), a first coupling circuit (1531), a second coupling circuit (1532), a third coupling circuit (1533), a fourth coupling circuit (1534), a first PA (1511), a second PA (1512), a third PA (1513), a fourth PA (1514), a transceiver (1600), and / or a processor (1700).

[0079] The antenna (1300) can receive an RF signal from the outside or transmit an RF signal of the electronic device (101) to the outside. The antenna (1300) can be connected to a multiplexer (1400). The multiplexer (1400) can connect various input lines to a single output line. For example, a plurality of terminals of the multiplexer (1400) can be connected to a first coupling circuit (1531), a second coupling circuit (1532), a third coupling circuit (1533), or a fourth coupling circuit (1534), respectively. For example, the first coupling circuit (1531), the second coupling circuit (1532), the third coupling circuit (1533), or the fourth coupling circuit (1534) may each be connected to at least one output terminal (Tx) (1622, 1623, 1624, 1625) of the transceiver (1600) and at least one terminal (1102, 1103, 1104, 1105) of the switching element (1100-1).

[0080] According to one embodiment, the switching element (1100-1) may include a plurality of terminals. For example, the switching element (1100-1) may include five terminals. The first terminal (1101) may be connected to the first element, and the second terminal (1102), the third terminal (1103), the fourth terminal (1104), and the fifth terminal (1105) may be connected to the second element. As an example, the first element and the second element may be a transceiver (1600). The first terminal (1101) of the switching element may be connected to a feedback receiver (FBRX) terminal (1621) of the transceiver (1600). Except for the first terminal (1101) of the switching element, the remaining terminals (e.g., the second terminal (1102), the third terminal (1103), the fourth terminal (1104), and the fifth terminal (1105)) can be connected to PAs (e.g., the first PA (1511), the second PA (1512), the third PA (1513), and the fourth PA (1514)) and coupling circuits (e.g., the first coupling circuit (1531), the second coupling circuit (1532), the third coupling circuit (1533), and the fourth coupling circuit (1534)). A first inductor (1210) may be connected to a path between a second terminal (1102) of a switching element (1100-1) and a first coupling circuit (1531), and a second inductor (1220) may be connected to a path between a fifth terminal (1105) and a fourth coupling circuit (1534). For example, the first inductor (1210) may be connected in parallel between a path between a second terminal (1102) of a switching element (1100-1) and a first coupling circuit (1531) and a ground of an electronic device (101), and the second inductor (1220) may be connected in parallel between a path between a fifth terminal (1105) of a switching element (1100-1) and a fourth coupling circuit (1534) and a ground of an electronic device (101).

[0081] For example, an RF signal generated from a transceiver (1600) may be output through output terminals (1622, 1623, 1624, 1625) of the transceiver (1600). The RF signal output from the transceiver (1600) may be transmitted to an antenna (1300) via a PA, a coupling circuit, and a multiplexer. In addition, the RF signal output from the transceiver (1600) may be transmitted to a switching element (1100-1) via a PA and a coupling circuit.

[0082] As an example, an RF signal output from a first output terminal (1622) of a transceiver (1600) can be transmitted to an antenna (1300) via a first PA (1511), a first coupling circuit (1531), and a multiplexer (1400). In addition, the RF signal output from the first output terminal (1622) of the transceiver (1600) can be transmitted to the second terminal (1102) of the switching element (1100-1) via the first PA (1511) and the first coupling circuit (1531). The switching element (1100-1) can form a first electrical path between the first terminal (1101) and the second terminal (1102) by controlling an internal switch. For example, the formed first electrical path can be a first RF path. The switching element (1100-1) can transmit the RF signal to the FBRX terminal (1621) of the transceiver (1600) via the first RF path. In addition, the switching element (1100-1) can transmit the RF signal to the FBRX terminal (1621) of the transceiver (1600) via the terminals (e.g., the first terminal (1101) and the second terminal (1102)) where the first RF path is formed. A second electrical path can be formed between the terminal (1103), the fourth terminal (1104), and the fifth terminal (1105) and the ground of the electronic device (101). For example, the formed second electrical path can be a DC current path. The switching element (1100-1) can discharge the DC current to the ground through the second inductor (1220) on the DC current path.

[0083] As an example, the switching element (1100) may include a substrate, a first conductive pad formed in a first region of the substrate and configured to be electrically connected to a first signal line external to the switching element (1100), and a second conductive pad formed in a second region of the substrate. The second conductive pad may be configured to be connected to the second external signal line that is electrically connected to an external ground. The switching element (1100) may include a third conductive pad formed in a third region of the substrate. The third conductive pad may be configured to be connected to the third external signal line that is electrically connected to the external ground. The first conductive pad may be configured to be electrically connected to one of the second conductive pad and the third conductive pad, and not connected to the remaining pads, to form an RF path between the first conductive pad and the one electrically connected pad. In addition to the first conductive pad, the second conductive pad, and the third conductive pad, a ground pad electrically connected to the external ground may not be formed on the substrate.

[0084] As an example, while the second conductive pad is electrically connected to the first conductive pad to form a first RF path, the third conductive pad may be configured to be unconnected from the first conductive pad and connected to the external ground through a second inductor connected to the third signal line. While the third conductive pad is electrically connected to the first conductive pad to form a second RF path, the second conductive pad may be configured to be unconnected from the first conductive pad and connected to the external ground through a first inductor connected to the second signal line.

[0085] As an example, the second conductive pad may be set to be electrically connected to one end of the first inductor (1210). The third conductive pad may be set to be electrically connected to one end of the second inductor (1220).

[0086] As an example, the switching element (1100) may further include a plurality of terminals (1101, 1102, 1103) formed on the substrate and a plurality of switches (1110, 1120, 1130, 1140) formed on the substrate. The plurality of terminals (1101, 1102, 1103) formed on the substrate may include a first terminal (1101) connected to the first conductive pad, a second terminal (1102) connected to the second conductive pad, and a third terminal (1130) connected to the third conductive pad. The plurality of switches (1110, 1120, 1130, 1140) formed on the substrate may include a first switch (1110) for connecting the second terminal (1102) and the first terminal (1101) and a second switch (1120) for connecting the third terminal (1103) and the first terminal (1101).

[0087] As an example, there may be no pad other than the second conductive pad for electrically connecting the second terminal (1102) of the switching element (1100) and the external ground, and there may be no pad other than the third conductive pad for electrically connecting the third terminal (1103) and the external ground.

[0088] As an example, the switching element (1100) may further include an internal ground formed on the substrate. The plurality of switches (1110, 1120, 1130, 1140) formed on the substrate may include a third switch (1130) for connecting the second terminal (1102) and the internal ground, and a fourth switch (1140) for connecting the third terminal (1103) and the internal ground.

[0089] As an example, one end of the third switch (1130) may be connected to the second terminal (1102) and the first switch (1110), and the other end may be connected to the internal ground. One end of the fourth switch (1140) may be connected to the third terminal (1103) and the second switch (1120), and the other end may be connected to the internal ground.

[0090] As an example, one end of the first switch (1110) may be connected to one end of the second terminal (1102) and the third switch (1130), and the other end may be connected to one end of the first terminal (1101) and the second switch (1120). One end of the second switch (1120) may be connected to one end of the third terminal (1103) and the fourth switch (1140), and the other end may be connected to one end of the first terminal (1101) and the first switch (1110).

[0091] As an example, the switching element (1100) may further include a controller (1190). The controller (1190) may be configured to turn on the first switch (1110) and the fourth switch (1140) and turn off the second switch (1120) and the third switch (1130) so that an RF signal is transmitted between the first terminal (1101) and the second terminal (1102). The controller (1190) may be configured to turn on the second switch (1120) and the third switch (1130) and turn off the first switch (1110) and the fourth switch (1140) so that an RF signal is transmitted between the first terminal (1101) and the third terminal (1103).

[0092] As an example, the switching element (1100) can form a discharge path for discharging DC current to the external ground through the second terminal (1102), the second conductive pad, and the first inductor (1210) when the third switch (1130) is turned on. The switching element (1100) can form a discharge path for discharging DC current to the external ground through the third terminal (1103), the third conductive pad, and the second inductor (1220) when the fourth switch (1140) is turned on.

[0093] As an example, the first conductive pad may be electrically connected to the first element. The second conductive pad and the third conductive pad may be electrically connected to the second element.

[0094] As an example, an electronic device (101) may include a first element, a second element, a first inductor (1210), a second inductor (1220), a switching element (1100), and a printed circuit board (PCB) on which the first element, the second element, the first inductor (1210), the second inductor (1220), and the switching element (1100) are arranged. The printed circuit board may include a ground, a first signal line electrically connected to the first element, a second signal line electrically connected to a first terminal of the second element and connected to the ground through the first inductor (1210), and a third signal line electrically connected to a second terminal of the second element and connected to the ground through the second inductor (1220).

[0095] The switching element may include a substrate, a first conductive pad formed in a first region of the substrate and electrically connected to the first signal line, a second conductive pad formed in a second region of the substrate and connected to the second signal line, and a third conductive pad formed in a third region of the substrate and connected to the third signal line. The first conductive pad may be configured to be electrically connected to one of the second conductive pad and the third conductive pad and not connected to the remaining pads to form an RF path between the first conductive pad and the one pad that is electrically connected. In addition to the first conductive pad, the second conductive pad, and the third conductive pad, a ground pad electrically connected to the ground may not be formed on the substrate.

[0096] As an example, when the second conductive pad is electrically connected to the first conductive pad to form a first RF path, the third conductive pad may be set to be unconnected from the first conductive pad and connected to the ground through the second inductor (1220) connected to the third signal line. When the third conductive pad is electrically connected to the first conductive pad to form a second RF path, the second conductive pad may be set to be unconnected from the first conductive pad and connected to the ground through the first inductor (1210) connected to the second signal line.

[0097] As an example, the second conductive pad may be set to be electrically connected to one end of the first inductor (1210). The third conductive pad may be set to be electrically connected to one end of the second inductor (1220).

[0098] As an example, the switching element (1100) may further include a plurality of terminals (1101, 1102, 11030) formed on the substrate and a plurality of switches (1110, 1120, 1130, 1140) formed on the substrate. The plurality of terminals (1101, 1102, 11030) formed on the substrate may include a first terminal (1101) connected to the first conductive pad, a second terminal (1102) connected to the second conductive pad, and a third terminal (1130) connected to the third conductive pad. The plurality of switches (1110, 1120, 1130, 1140) formed on the substrate may include a first switch (1110) for connecting the second terminal (1102) and the first terminal (1101) and a second switch (1120) for connecting the third terminal (1103) and the first terminal (1101).

[0099] As an example, there may be no pad other than the second conductive pad for electrically connecting the second terminal (1102) of the switching element (1100) and the external ground, and there may be no pad other than the third conductive pad for electrically connecting the third terminal (1103) and the external ground.

[0100] As an example, the switching element (1100) may further include an internal ground formed on the substrate. The plurality of switches (1110, 1120, 1130, 1140) formed on the substrate may include a third switch (1130) for connecting the second terminal (1102) and the internal ground, and a fourth switch (1140) for connecting the third terminal (1103) and the internal ground.

[0101] As an example, one end of the third switch (1130) may be connected to the second terminal (1102) and the first switch (1110), and the other end may be connected to the internal ground. One end of the fourth switch (1140) may be connected to the third terminal (1103) and the second switch (1120), and the other end may be connected to the internal ground.

[0102] As an example, one end of the first switch (1110) may be connected to one end of the second terminal (1102) and the third switch (1130), and the other end may be connected to one end of the first terminal (1101) and the second switch (1120). One end of the second switch (1120) may be connected to one end of the third terminal (1103) and the fourth switch (1140), and the other end may be connected to one end of the first terminal (1101) and the first switch (1110).

[0103] As an example, the switching element (1100) may further include a controller (1190). The controller (1190) may be configured to turn on the first switch (1110) and the fourth switch (1140) and turn off the second switch (1120) and the third switch (1130) so that an RF signal is transmitted between the first terminal (1101) and the second terminal (1102). The controller (1190) may be configured to turn on the second switch (1120) and the third switch (1130) and turn off the first switch (1110) and the fourth switch (1140) so that an RF signal is transmitted between the first terminal (1101) and the third terminal (1103).

[0104] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0105] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0106] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0107] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0108] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0109] The effects of this document are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the above description.

Claims

1. In switching elements, substrate; A first conductive pad formed in a first region of the substrate and configured to be electrically connected to a first signal line external to the switching element; A second conductive pad formed in a second region of the substrate, the second conductive pad being set to be connected to the external second signal line that is electrically connected to an external ground; A third conductive pad formed in a third region of the substrate, the third conductive pad being set to be connected to the external third signal line that is electrically connected to the external ground, The above first challenge pad is, Optionally, one of the second conductive pad and the third conductive pad is electrically connected to the other pad, and is configured to be unconnected to the other pad, thereby forming an RF path between the first conductive pad and the one electrically connected pad. A switching element in which no ground pad electrically connected to the external ground is formed on the substrate other than the first conductive pad, the second conductive pad, and the third conductive pad.

2. In paragraph 1, While the second conductive pad is electrically connected to the first conductive pad to form a first RF path, the third conductive pad is set to be unconnected from the first conductive pad and connected to the external ground through a second inductor connected to the third signal line. A switching element wherein the third conductive pad is electrically connected to the first conductive pad to form a second RF path, while the second conductive pad is set to be unconnected from the first conductive pad and connected to the external ground through a first inductor connected to the second signal line.

3. In paragraph 2, The above second challenge pad is, is set to be electrically connected adjacent to one end of the first inductor, The third challenge pad above is, A switching element configured to be electrically connected adjacent to one end of the second inductor.

4. In paragraph 1, a plurality of terminals formed on the substrate; and Further comprising a plurality of switches formed on the substrate; A plurality of terminals formed on the above substrate are, It includes a first terminal connected to the first conductive pad, a second terminal connected to the second conductive pad, and a third terminal connected to the third conductive pad, A plurality of switches formed on the above substrate are, A switching element comprising a first switch for connecting the second terminal and the first terminal, and a second switch for connecting the third terminal and the first terminal.

5. In paragraph 4, A switching element, wherein there is no conductive pad other than the second conductive pad for electrically connecting the second terminal and the external ground, and there is no conductive pad other than the third conductive pad for electrically connecting the third terminal and the external ground.

6. In paragraph 4, Further comprising an internal ground formed on the above substrate; A plurality of switches formed on the above substrate are, A switching element comprising a third switch for connecting the second terminal and the internal ground and a fourth switch for connecting the third terminal and the internal ground.

7. In paragraph 6, One end of the third switch is connected to the second terminal and the first switch, and the other end is connected to the internal ground. A switching element in which one end of the fourth switch is connected to the third terminal and the second switch, and the other end is connected to the internal ground.

8. In paragraph 6, One end of the first switch is connected to one end of the second terminal and the third switch, and the other end is connected to one end of the first terminal and the second switch. A switching element in which one end of the second switch is connected to one end of the third terminal and the fourth switch, and the other end is connected to one end of the first terminal and the first switch.

9. In paragraph 6, further including a controller; The above controller, Turning on the first switch and the fourth switch and turning off the second switch and the third switch so that an RF signal is transmitted between the first terminal and the second terminal, or A switching element configured to turn on the second switch and the third switch, and turn off the first switch and the fourth switch so that an RF signal is transmitted between the first terminal and the third terminal.

10. In paragraph 9, The above switching element, When the third switch is turned on, a discharge path is formed to discharge a DC current to the external ground through the second terminal, the second conductive pad, and the first inductor, A switching element that forms a discharge path for discharging a DC current to the external ground through the third terminal, the third conductive pad, and the second inductor when the fourth switch is turned on.

11. In paragraph 1, The above first conductive pad is electrically connected to the first element, The second conductive pad and the third conductive pad are switching elements electrically connected to the second element.

12. In electronic devices, First element; Second element; 1st inductor; Second inductor; switching elements; and A printed circuit board (PCB) on which the first element, the second element, the first inductor, the second inductor, and the switching element are arranged; The above printed circuit board, Ground; A first signal line electrically connected to the first element; A second signal line electrically connected to the first terminal of the second element and connected to the ground through the first inductor; and A third signal line electrically connected to the second terminal of the second element and connected to the ground through the second inductor; The above switching element, substrate; A first conductive pad formed in a first region of the substrate and electrically connected to the first signal line; A second conductive pad formed in a second region of the substrate and connected to the second signal line; and A third conductive pad formed in a third region of the substrate and connected to the third signal line; The above first challenge pad is, It is configured to be electrically connected to one of the second conductive pad and the third conductive pad, and not connected to the remaining pads, so as to form an RF path between the first conductive pad and the electrically connected one pad, An electronic device in which a ground pad electrically connected to the ground is not formed on the substrate other than the first conductive pad, the second conductive pad, and the third conductive pad.

13. In paragraph 12, When the second conductive pad is electrically connected to the first conductive pad to form a first RF path, the third conductive pad is set to be unconnected from the first conductive pad and connected to the ground through the second inductor connected to the third signal line. An electronic device wherein the third conductive pad is electrically connected to the first conductive pad to form a second RF path, and the second conductive pad is set to be unconnected from the first conductive pad and connected to the ground through the first inductor connected to the second signal line.

14. In paragraph 13, The above second challenge pad is, is set to be electrically connected to one end of the above first inductor, The third challenge pad above is, An electronic device configured to be electrically connected to one end of the second inductor.

15. In paragraph 12, The above switching element, a plurality of terminals formed on the substrate; and Further comprising a plurality of switches formed on the substrate; A plurality of terminals formed on the above substrate are, It includes a first terminal connected to the first conductive pad, a second terminal connected to the second conductive pad, and a third terminal connected to the third conductive pad, A plurality of switches formed on the above substrate are, An electronic device comprising a first switch for connecting the second terminal and the first terminal, and a second switch for connecting the third terminal and the first terminal.

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