Portable electronic device comprising heat dissipation structure and battery

Abstract

The present disclosure provides a portable electronic device and variant embodiments thereof, the portable electronic device comprising a support member, a display module, a printed circuit board, a battery, a heat dissipation structure, and a double-sided adhesive member, wherein: the heat dissipation structure comprises a first portion placed in a first region of the support member and a second portion placed in an opening of the support member; the second portion is exposed from the rear surface of the support member through the opening of the support member; and the double-sided adhesive member comprises a front surface including a non-adhesive area not adhered to the second portion of the heat dissipation structure while facing the second portion and a rear surface including an adhesive area adhered to the battery.

Description

Portable electronic devices including heat-dissipating structures and batteries

[0001] Various embodiments of this document relate to portable electronic devices having a heat dissipating structure and a battery.

[0002] Portable electronic devices such as smartphones, tablets, laptops, slate PCs, and notebooks can support calling and various content delivery functions based on various applications. In this regard, portable electronic devices include batteries and utilize battery power to provide various functions.

[0003] Meanwhile, portable electronic devices can be manufactured with a smaller overall size for portability. While portable electronic devices are manufactured smaller, their functionality is maintained or expanded. Consequently, the frequency and speed of use of various electronic components related to user functions are increasing, and addressing heat generation issues is becoming increasingly important. In this regard, portable electronic devices are equipped with heat dissipation structures to manage heat generated by electronic components. In slimmer or lighter portable electronic devices, the appropriate placement of the aforementioned heat dissipation structures and batteries may be considered.

[0004] The above information may be provided as background information to aid in understanding this document. None of the above is claimed to be prior art related to this document or can be used to determine prior art.

[0005] According to various embodiments of the present disclosure, a portable electronic device (or a portable communication device) includes a support member including an opening, a display module, a printed circuit board and a battery, a heat dissipation structure, and a double-sided adhesive member, wherein the heat dissipation structure includes a first portion placed in a first region of the support member and a second portion at least partially overlapping the opening of the support member, the second portion being exposed to the rear surface of the support member through the opening, and the double-sided adhesive member may include a front surface (or upper surface) including a first adhesive region and a non-adhesive region facing the second portion of the heat dissipation structure and not in contact with the second portion, and a rear surface (or lower surface) including a second adhesive region that is in contact with the battery.

[0006] Other, various embodiments are disclosed.

[0007] FIG. 1A is a drawing showing an example of the front surface of a portable electronic device according to one embodiment.

[0008] FIG. 1b is a drawing showing an example of the rear surface of a portable electronic device according to one embodiment.

[0009] FIG. 1c is a drawing showing an example of an exploded perspective view of a first type portable electronic device according to one embodiment.

[0010] FIG. 2 is a drawing showing an example of a cross-section of a portion of a first type portable electronic device according to one embodiment.

[0011] FIG. 3 is a drawing showing an example of another cross-section of a first type portable electronic device according to one embodiment.

[0012] FIG. 4 is a drawing showing an example of a configuration of a first type portable electronic device including a first type fixed structure and a support member and a heat dissipation structure according to one embodiment.

[0013] FIG. 5 is a drawing showing an example of an exploded perspective view of a second type portable electronic device according to one embodiment.

[0014] FIG. 6 is a drawing showing an example of a second type fixed structure and a third mask member according to one embodiment.

[0015] FIG. 7 is a drawing showing the arrangement of a support member and some peripheral components of a second type portable electronic device according to one embodiment.

[0016] FIG. 8 is a drawing showing an example of a cross-section of one side of a support member on which a second type fixed structure is arranged according to one embodiment.

[0017] FIG. 9 is a drawing showing an example of an assembly sequence of a second type portable electronic device according to one embodiment.

[0018] FIG. 10 is a drawing showing an example of an exploded perspective view of a third type portable electronic device according to one embodiment.

[0019] FIG. 11 is a drawing showing an example of a cross-section taken along line A3-A3` for some configurations of a third type portable electronic device according to one embodiment.

[0020] FIG. 12 is a drawing showing an example of an assembly sequence of some components of a third type portable electronic device according to one embodiment.

[0021] FIG. 13 is a drawing showing an example of at least a portion of a configuration of a fixed structure according to one embodiment.

[0022] FIG. 14 is a drawing showing an example of a structure of a fourth type portable electronic device according to an embodiment of the present invention.

[0023] Hereinafter, various embodiments of this document are described with reference to the attached drawings.

[0024] For example, a portable electronic device according to various embodiments of the present document may include a heat dissipation structure (or heat circulation device) and a support member (or bracket, frame, front frame, housing, case) that supports a display, and the support member may include a structure that provides a space in which the heat dissipation structure and a battery are arranged, and separates the heat dissipation structure from the support member. This structure may support easy disassembly and disassembly of the portable electronic device through independent arrangement from the battery in a structure in which heat generated from electronic components of the portable electronic device is diffused to the heat dissipation structure.

[0025] Other intended purposes according to the embodiments of the present disclosure will be mentioned as needed in the process of explaining each embodiment.

[0026] FIG. 1A is a drawing showing an example of the front side of a portable electronic device according to one embodiment. FIG. 1B is a drawing showing an example of the rear side of a portable electronic device according to one embodiment.

[0027] Referring to FIGS. 1A and 1B, a portable electronic device (400) (or electronic device, portable communication device) according to one embodiment may include a housing (410) including a first side (or front side) (410A), a second side (or back side) (410B), and a side surface (410C) surrounding a space between the first side (410A) and the second side (410B). According to one embodiment (not shown), the housing may refer to a structure forming a portion of the first side (410A), the second side (410B), and the side surface (410C) of FIG. 1A. According to one embodiment, the first side (410A) may be formed by a front plate (402) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (410B) may be formed by a substantially opaque back plate (411). The rear plate (411) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side (410C) may be formed by a side bezel structure (or “side member”) (418) that is coupled to the front plate (402) and the rear plate (411) and comprises a metal and / or polymer. In some embodiments, the rear plate (411) and the side bezel structure (418) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0028] In the illustrated embodiment, the front plate (402) may include two first regions (410D) that extend seamlessly from the first side (410A) toward the rear plate (411), at both ends of a long edge of the front plate (402). In the illustrated embodiment (see FIG. 1B), the rear plate (411) may include two second regions (410E) that extend seamlessly from the second side (410B) toward the front plate (402), at both ends of a long edge. In some embodiments, the front plate (402) (or the rear plate (411)) may include only one of the first regions (410D) (or the second regions (410E)). In one embodiment, some of the first regions (410D) or some of the second regions (410E) may not be included. In the above embodiments, when viewed from the side of the portable electronic device (400), the side bezel structure (418) may have a first thickness (or width) on the side that does not include the first regions (410D) or the second regions (410E) as described above, and may have a second thickness that is thinner than the first thickness on the side that includes the first regions (410D) or the second regions (410E).

[0029] According to one embodiment, the portable electronic device (400) may include at least one of a display (401), an audio module (403, 407, 414), a sensor module (404, 419), a camera module (405, 412, 413), a key input device (417), a light emitting element (406), and a connector hole (408, 409). In some embodiments, the portable electronic device (400) may omit at least one of the components (e.g., the key input device (417) or the light emitting element (406)) or may additionally include other components.

[0030] The display (401) may be exposed, for example, through a significant portion of the front plate (402). In some embodiments, at least a portion of the display module (401) may be exposed through the front plate (402), which forms the first surface (410A) and the first areas (410D) of the side surfaces (410C). In some embodiments, the edges of the display (401) may be formed to be substantially identical to the adjacent outer shape of the front plate (402). In one embodiment (not shown), in order to expand the area to which the display (401) is exposed, the gap between the outer edge of the display (401) and the outer edge of the front plate (402) may be formed to be substantially identical.

[0031] According to one embodiment (not shown), a recess or opening may be formed in a part of a screen display area of ​​the display (401), and at least one of an audio module (414), a sensor module (404), a camera module (405), and a light-emitting element (406) may be included that are aligned with the recess or opening. According to one embodiment (not shown), at least one of an audio module (414), a sensor module (404), a camera module (405), a fingerprint sensor, and a light-emitting element (406) may be included on a back surface of the screen display area of ​​the display (401). According to one embodiment (not shown), the display (401) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (404, 419) and / or at least a portion of the key input device (417) may be disposed in the first areas (410D) and / or the second areas (410E).

[0032] The audio module (403, 407, 414) may include a microphone hole (403) and a speaker hole (407, 414). The microphone hole (403) may have a microphone disposed inside to acquire external sound, and in some embodiments, multiple microphones may be disposed to detect the direction of the sound. The speaker hole (407, 414) may include an external speaker hole (407) and a receiver hole (414) for calls. In some embodiments, the speaker hole (407, 414) and the microphone hole (403) may be implemented as a single hole, or a speaker may be included without the speaker hole (407, 414) (e.g., a piezo speaker).

[0033] The sensor modules (404, 419) can generate electrical signals or data values ​​corresponding to the internal operating state of the portable electronic device (400) or the external environmental state. The sensor modules (404, 419) can include, for example, a first sensor module (404) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (410A) of the housing (410), and / or a third sensor module (419) (e.g., an HRM sensor) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (410B) of the housing (410). The fingerprint sensor may be disposed on the first surface (410A) of the housing (410) (e.g., the display module (401) as well as the second surface (410B). The portable electronic device (400) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (404).

[0034] The camera modules (405, 412, 413) may include a first camera device (405) disposed on a first side (410A) of the portable electronic device (400), a second camera device (412) disposed on a second side (410B), and / or a flash (413). The camera devices (405, 412) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (413) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the portable electronic device (400).

[0035] The key input device (417) may be disposed on a side surface (410C) of the housing (410). In one embodiment, the portable electronic device (400) may not include some or all of the above-mentioned key input devices (417), and the key input devices (417) that are not included may be implemented in other forms, such as soft keys, on the display (401). In some embodiments, the key input device may include a sensor module disposed on a second surface (410B) of the housing (410).

[0036] The light-emitting element (406) may be disposed, for example, on the first surface (410A) of the housing (410). The light-emitting element (406) may provide, for example, status information of the portable electronic device (400) in the form of light. According to one embodiment, the light-emitting element (406) may provide a light source that is linked to the operation of, for example, the camera module (405). The light-emitting element (406) may include, for example, an LED, an IR LED, and a xenon lamp.

[0037] The connector holes (408, 409) may include a first connector hole (408) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with a portable electronic device, and / or a second connector hole (e.g., an earphone jack) (409) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0038] FIG. 1C is a drawing showing an example of an exploded perspective view of a first type portable electronic device according to one embodiment. The first type portable electronic device (101) may include at least some components of the portable electronic device (400) described above in FIGS. 1A and 1B.

[0039] Referring to FIG. 1c, the first type portable electronic device (101) may include a support member (140) (e.g., a bracket, a frame, a housing), a display module (110) (or a display assembly, a display structure, a display assembly) (e.g., a structure including a front plate (402) and a display (401) of FIGS. 1a and 1b), a printed circuit board (181, 182), a battery (160), and a rear case (170) (e.g., a rear plate (411) of FIGS. 1a and 1b). According to one embodiment, the first type portable electronic device (101) may include a heat dissipation structure (120) at least partially disposed between the support member (140) and the display module (110), and a first type fixing structure (150) (or a first battery fixing structure, a first battery adhesive structure, a first adhesive structure, a first adhesive member, a first adhesive assay, a double-sided adhesive member, or a double-sided adhesive tape) disposed between the support member (140) and the battery (160). According to one embodiment, the first type portable electronic device (101) may include first and second adhesive members (131, 132) that are in contact with or adhered to the heat dissipation structure (120).

[0040] In some embodiments, the first type portable electronic device (101) may exclude at least one of the above-described components (e.g., some printed circuit boards (e.g., one of the printed circuit boards 181 or 182), one of the first and second adhesive members (131, 132)), or may include components of different types or modified components (e.g., the printed circuit boards 181 and 182 may be connected or integrated, the first and second adhesive members (131, 132) may be integrated or connected). At least one of the components of the first type portable electronic device (101) may be the same as or similar to at least one of the components of the portable electronic device (400) of FIG. 1A or FIG. 1B, and thus, redundant descriptions of the same or similar components are omitted.

[0041] According to one embodiment, the support member (140) may include a portion that is at least partially disposed inside the first type portable electronic device (101) (or covered by another component) and at least partially exposed to the outside (e.g., a side bezel structure). Alternatively, the support member (140) may be disposed inside the first type portable electronic device (101) and may be covered by another component so as not to be observed from the outside. At least a portion or the entirety of the support member (140), or a certain proportion thereof, may include, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. The display module (110) may be disposed on one side (e.g., in the z-axis direction) of the support member (140) and the printed circuit boards (181, 182) may be disposed on the other side (or the second side of the support member (140)) in the -z-axis direction. At least a portion of the above-described support member (140) may include a first region (or first part, first structure) formed of a first material (e.g., a first metal material) and a second region (or second part, second structure) formed of a second material (e.g., a second metal material or injection-molded material different from the first material). The shape, ratio, distribution, etc. of the above-described first region and second region may be changed according to the shape or structure of the first type portable electronic device (101). As an example, the support member (140) may be formed of only one material (e.g., a metal material or an injection-molded material). Various parts (or components) may be arranged on the support member (140).

[0042] According to one embodiment, the support member (140) may include a first side of the support member (140) facing the direction in which the display module (110) is placed (or a front side, a side facing the z-axis direction, a side on which the display module (110) is placed, or a side facing the direction in which the display module (110) is placed), and a second side facing the direction in which the battery (160) is placed (or a rear side, a side facing the -z-axis direction, a side in the direction in which the printed circuit board (181, 182) and / or the battery (160) are placed). The support member (140) may include a structure placement area (140) in which the heat dissipation structure (120) is placed. The above structure placement area (140c) may include a first structure placement area (140ch1) in which a first part (120a) of the heat dissipation structure (120) is placed, and a second structure placement area (140ch2) in which a second part (120b) of the heat dissipation structure (120) (e.g., another part connected to the first part (120a)) is placed. The first structure placement area (140ch1) may include a groove structure in which at least a portion of a front surface (e.g., a surface facing the z-axis) is formed to be stepped in a rear surface (e.g., a surface facing the -z-axis). At least a portion of a surface of the first structure placement area (140ch1) facing the -z-axis may be in contact (e.g., a direct contact state or a contact state via a heat transfer member) with at least one electronic component (e.g., an AP) placed on a printed circuit board (181, 182). The above second structure arrangement area (140ch2) may include a structure (e.g., a penetration portion or hole structure formed to penetrate the front and rear (e.g., a surface facing the z-axis and a surface facing the -z-axis)) from which at least a portion is removed in relation to slimming in consideration of the thickness of the battery (160).In response to this, when the heat dissipation structure (120) is arranged in the second structure arrangement area (140ch2) of the support member (140), the second part (120b) of the heat dissipation structure (120) may directly face the first type fixing structure (150), or at least a portion of the second part (120b) may be in contact with the first type fixing structure (150). The support member (140) may include a sensor arrangement area (140bi) in which a specific sensor (e.g., a fingerprint sensor) is arranged. The sensor arrangement area (140bi) may be arranged to overlap below the display module (110) when observed in the z-axis direction. According to one embodiment, the support member (140) may include a component arrangement area (140cm) in which a camera sensor (or an image sensor) or at least a portion of the sensor is arranged. The component arrangement area (140cm) may include a structure in which the front and rear surfaces are penetrated. In the above-mentioned component placement area (140 cm), components of a first type portable electronic device (101) other than the camera sensor may be placed.

[0043] The heat dissipation structure (120) may be arranged at least in part on a first surface (e.g., a bottom surface facing the z-axis) of the support member (140). For example, a first portion (120a) corresponding to an upper portion (e.g., a portion in the y-axis direction) of the heat dissipation structure (120) may be arranged in a first structure arrangement area (140ch1) formed in the support member (140). A second portion (120b) corresponding to a lower portion (e.g., a portion in the -y-axis direction) of the heat dissipation structure (120) may be arranged in a second structure arrangement area (140ch2) formed in the support member (140). According to one embodiment, the heat dissipation structure (120) may be provided in a flat shape on the front and back sides with respect to the z-axis direction, and at least a portion may include a curved or curved surface. The inside of the heat dissipation structure (120) includes an empty cavity, and at least a portion of a fluid or a gas may be injected into the empty cavity. One side (e.g., the side facing the z-axis direction) of the heat dissipation structure (120) may face the rear surface (e.g., the side facing the -z-axis direction) of the display module (110) or may be in contact with the rear surface of the display module (110). Correspondingly, heat transferred (or absorbed) to the heat dissipation structure (120) may be diffused and dissipated through a metal material or other material disposed on the rear surface of the display module (110). A first part (120a) of the heat dissipation structure (120) may face (or be in contact with) a bottom surface (or a first structure arrangement area (140ch1)) of the support member (140) in the z-axis direction, and a second part (120b) of the heat dissipation structure (120) may be disposed in a second structure arrangement area (140ch2) (or a front-rear penetration area or a penetration hole) of the support member (140). The heat dissipation structure (120) may be formed at least partially of a metallic material, but the present disclosure is not limited thereto. For example, the heat dissipation structure (120) may be formed of a combination of metallic and non-metallic materials, or may be formed solely of non-metallic materials.As an example, when looking at a state in which a heat dissipation structure (120) is placed in a first structure arrangement area (140ch1) and a second structure arrangement area (140ch2) of a support member (140), when observed in the z-axis direction (e.g., a direction from the front to the rear of the display module (110), both a first part (120a) and a second part (120b) of the heat dissipation structure (120) are observed, and when observed in the -z-axis direction (a direction from the rear case (170) to the display module (110), the first part (120a) of the heat dissipation structure (120) is covered by a part of the support member (140), and the second part (120b) can be observed.

[0044] The first adhesive member (131) may serve to fix the first part (120a) of the heat dissipation structure (120) to the first structure placement area (140ch1). As an example, the first adhesive member (131) may include a double-sided tape or a sheet on which an adhesive material is applied on both sides. The first adhesive member (131) may have a hollow center and a shape similar to the edge shape of the first part (120a) so as to attach at least a portion of one edge (e.g., a y-axis edge) of the first part (120a) to the bottom surface of the first structure placement area (140ch1). As an example, the first adhesive member (131) may be provided in a band shape so that one side (e.g., y-axis edge) of the first part (120a) of the heat dissipation structure (120) can be in direct contact with the first structure placement area (140ch1) or can be close to the bottom surface of the first structure placement area (140ch1). According to one embodiment, at least one heat generating element (e.g., AP) of a printed circuit board (181, 182) may be arranged on the opposite side of the first structure placement area (140ch1) where the first adhesive member (131) is arranged (e.g., a side of a part of the side of the support member (140) facing the -z-axis).

[0045] The second adhesive member (132) may bond at least a portion of the second portion (120b) of the heat dissipation structure (120) to at least a portion of the support member (140) forming the second structure arrangement area (140ch2) so that the second portion (120b) of the heat dissipation structure (120) is fixed to the second structure arrangement area (140ch2) of the support member (140), or so that the second portion (120b) of the heat dissipation structure (120) is placed on one surface (e.g., the surface facing the z-axis direction) of the support member (140). As an example, the second adhesive member (132) has a band shape that faces the edge of the second part (120b) of the heat-radiating structure (120), and is provided in the form of a double-sided tape or a sheet with an adhesive material applied to both sides, and can adhere the second part (120b) of the heat-radiating structure (120) to one side of the support member (140) that forms the edge of the second structure arrangement area (140ch2). According to one embodiment, at least a portion of the second adhesive member (132) may include at least one of two adhesive lines, adhesive thread, and adhesive tape formed along the edge of the second part (120b) of the heat-radiating structure (120). The edge of a portion of the support member (140) that forms the second structure arrangement area (140ch2) may be formed to be stepped so that the second adhesive member (132) can be arranged.

[0046] According to one embodiment, the printed circuit board (181, 182) may be equipped with at least one of a hardware processor, a memory, or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the first type portable electronic device (101) to an external electronic device, and may include, for example, a USB connector, an SD card / MMC connector, or an audio connector. Although the printed circuit boards (181, 182) are illustrated in a separate form, they may be configured as one connected structure, and in relation to the connection, the first type portable electronic device (101) may include at least one additional structure (e.g., a flexible PCB).

[0047] According to one embodiment, various electronic components (or passive components, active components) included in the printed circuit board (181, 182) may generate heat during operation. At least a portion of the heat generated from the electronic components may be dissipated through the support member (140). According to one embodiment, the heat generated from the printed circuit board (181, 182) (or heat generated from at least one electronic component disposed on the printed circuit board (181, 182)) may be dissipated through the heat dissipation structure (120). As an example, the first type portable electronic device (101) may include a heat transfer member (e.g., TIM (thermal interface material), mesh-type metal member, heat transfer tape) capable of transferring heat between the support member (140) and at least one electronic component (or printed circuit board (181, 182)). As an example, heat generated in a printed circuit board (181, 182) (or an electronic component disposed on the printed circuit board (181, 182)) may be transferred and diffused through a support member (140) and / or a heat dissipation structure (120). Additionally or alternatively, heat generated in the electronic component (or the printed circuit board (181, 182), hereinafter described based on the electronic component) may be transferred and diffused by a heat transfer member between the support member (140) and the heat dissipation structure (120), and heat generated and transferred in the electronic component may be diffused or dissipated through at least a portion of a peripheral structure (e.g., a display module (110)) adjacent to the heat dissipation structure (120).

[0048] According to one embodiment, the battery (160) is a device for supplying power to at least one component of the first type portable electronic device (101), and may include, for example, a rechargeable secondary battery or a fuel cell. At least a portion of the battery (160) may be disposed on, for example, a surface of the support member (140) that is substantially in the same direction as the printed circuit boards (181, 182) (e.g., a surface of the support member (140) facing the -z axis). The battery (160) may be integrally disposed within the first type portable electronic device (101), or may be detachably disposed with the first type portable electronic device (101). According to one embodiment, the battery (160) may be bonded to at least a portion of the support member (140) via a first type fixing structure (150). As an example, the support member (140) may be formed in a region in the -z-axis direction to include a battery region in which a battery (160) may be placed, and the battery (160) may be fixedly placed in the battery region of the support member (140) through a first type fixing structure (150). As an example, at least a portion of the battery (160) may be attached to the bottom surface of the battery region of the support member (140) through the first type fixing structure (150).

[0049] The first type fixing structure (150) may be disposed between the support member (140) and the battery (160). As an example, the first type fixing structure (150) may be disposed at a position between the support member (140) and the battery (160) that does not overlap with the printed circuit board (181, 182) when observed in the z-axis direction (or -z-axis direction). At least a portion of the first type fixing structure (150) may adhere the battery (160) to a first surface of the support member (140) (e.g., at least a portion of a bottom surface facing the -z-axis direction, or the battery area). In order to prevent the heat dissipation structure (120) and the battery (160) from being adhered to each other, the first type fixing structure (150) may include a structure in which an adhesive material is removed from a surface facing the heat dissipation structure (120), or a first mask member (151) (or a first mask portion, a first mask layer, a first cover, a first non-contact layer, a first non-contact structure) is disposed on the adhesive material. As an example, the first type fixing structure (150) may include an upper surface (or a surface facing the z-axis direction, a front surface, or a lower surface depending on the viewing direction) and a lower surface (or a surface facing the -z-axis direction, a rear surface, or a upper surface depending on the viewing direction). The upper surface may include an upper adhesive region (or first adhesive region) that is adhered to one surface of the support member (140) and a non-adhesive region that is not adhered to the heat dissipation structure (120) (e.g., the non-adhesive region formed by placing a mask member on the upper adhesive region or the non-adhesive region formed by penetrating the front and rear surfaces of the upper adhesive region). The lower surface may include a lower adhesive region (or second adhesive region) that is adhered to one surface of the battery (160).

[0050] According to one embodiment, the first type fixing structure (150) may include a plurality of layers. For example, the first type fixing structure (150) may include a first structure body (153) (or an inner core and an adhesive material or adhesive tape) and a first mask member (151). Alternatively, the first type fixing structure (150) may include an inner core, a plurality of adhesive layers formed on the inner core, and may have a structure in which the plurality of adhesive layers are partially removed. The first type fixing structure (150) is disposed between the bottom surface of the support member (140) and the battery (160) to fix the battery (160) while eliminating contact between the heat dissipation structure (120) and the battery (160), thereby blocking or reducing heat of the heat dissipation structure (120) from being transferred to the battery (160). Additionally or alternatively, the first type fixing structure (150) may include a second mask member (152) (or a second mask portion, a second mask layer, a second cover, a second non-contact layer, a second non-contact structure) that prevents a specific sensor (e.g., a fingerprint sensor) disposed in the sensor placement area (140bi) from adhering to an adhesive material (or an adhesive member). When the first type fixing structure (150) is disposed in an area of ​​the support member (140) (e.g., an area where the battery (160) is disposed), the second mask member (152) may be disposed in an area corresponding to the sensor placement area (140bi). The first mask member (151) and the second mask member (152) may include at least one of a polymer structure, a sponge structure, and a mesh structure. For example, each of the first mask member (151) and the second mask member (152) may include at least one layer or a plurality of layers. When each of the first mask member (151) and the second mask member (152) includes multiple layers, the first mask member (151) and the second mask member (152) may include a laminated form of a polymer structure and a sponge structure.By means of the first mask member (151) described above, at least one air gap can be formed in at least a portion between the battery (160) and the heat dissipation structure (120). For example, an air gap can be formed in at least a portion between the first mask member (151) and the second portion (120b) of the heat dissipation structure (120).

[0051] The rear case (170) may be coupled to the support member (140) in the z-axis direction from the -z-axis direction. For example, the rear case (170) may include a bottom surface having a flat front and back surface and a size corresponding to at least a portion of the -z-axis direction surface of the support member (140), and at least two side walls extending at a predetermined angle and height in the z-axis direction from both edges of the bottom surface (e.g., edges in the x-axis and -x-axis directions), so as to surround the -z-axis surface of the support member (140) and be coupled to the support member (140). In the process of coupling the rear case (170) to the support member (140), a coupling means (e.g., double-sided tape, an adhesive material, or a separate coupling means) may be further used. The rear case (170) may include at least one camera hole so that at least one camera disposed on the support member (140) may be exposed to the outside. The rear case (170) is positioned to face the -z-axis direction surface of the battery (160) during the process of being combined with the support member (140), and may be positioned to face one surface of the printed circuit boards (181, 182). The rear case (170) may be composed of at least one layer, and may also be composed of multiple layers in relation to reinforcing rigidity or providing various color expressions or various textures.

[0052] Additionally, the first type portable electronic device (101) may include at least one antenna disposed between the rear case (170) and the battery (160), or on at least a portion of the support member (140). The antenna may include, for example, at least one of a near field communication (NFC) antenna, a wireless charging antenna, a magnetic secure transmission (MST) antenna, and an antenna for supporting various generations of mobile communication. The antenna may, for example, perform short-range or long-range communication with an external device, or wirelessly transmit and receive power required for charging. According to one embodiment, the antenna structure may be formed by at least a portion of the support member (140) formed of a metal material (e.g., a side bezel structure and / or at least a portion of the bottom surface of the support member (140)) or a combination thereof.

[0053] As described above, the first type portable electronic device (101) according to one embodiment may have a structure in which the heat dissipation structure (120) is disposed in the second structure placement area (140ch2) formed to penetrate the front and rear surfaces (e.g., z-axis and -z-axis planes) of the support member (140) in the process of forming the thickness of the support member (140) on which the battery (160) is disposed in relation to slimming or weight reduction. In this regard, the first type portable electronic device (101) may include a first type fixing structure (150) so as to more firmly attach the battery (160) to the battery area of ​​the support member (140), while facilitating the separation of the battery (160) in the process of separating the battery (160) from the support member (140), and prevent the heat dissipation structure (120) from being damaged, crushed, or cracked.

[0054] FIG. 2 is a drawing showing an example of a cross-section of a portion of a first type portable electronic device according to one embodiment.

[0055] Referring to FIGS. 1A to 2, at least a portion of a cross-section cut along the A1-A1` cutting line of the first type portable electronic device (101) may include a display module (110), a support member (140), a first printed circuit board (181), and a rear case (170) in the z-axis direction with respect to the -z-axis direction as illustrated. Additionally or alternatively, when the A1-A1` cutting line cuts a portion including a heat dissipation structure (120), the first type portable electronic device (101) may further include a heat dissipation structure (120) (e.g., a first portion (120a) of the heat dissipation structure (120)) disposed on one side of the support member (140), and a first adhesive member (131).

[0056] The display module (110) can output at least one screen related to the functional operation of the first type portable electronic device (101). The display module (110) can include, for example, a window (111), a display panel (112) (or display), and a sheet (113) (or at least one sheet, a graphite sheet).

[0057] The window (111) may include a layer made of at least one material among a layer of glass material, a layer of polymer material, or a layer of various other transparent materials (a material that allows light to be transmitted to an extent that allows the screen displayed on the display panel (112) to be observed from the outside). For example, the display module (110) of the present disclosure is not limited to the material of the window (111). Alternatively, depending on the nomenclature, the window (111) may be classified (or defined) as a configuration that forms the uppermost layer of the display module (110). Additionally or alternatively, the display module (110) may further include at least one of a polarizing layer, a protective layer, and an adhesive layer.

[0058] According to one embodiment, the display panel (112) may include a structure in which a plurality of pixels capable of implementing a screen according to the operation of a portable electronic device are arranged in a matrix form. As an example, the display panel (112) may be composed of at least one of a liquid crystal display panel, an OLED panel, and a quantum dot panel, but the display module (110) of the present disclosure is not limited to a panel of a specific type or a panel of a specific driving method.

[0059] The sheet (113) may include at least one of various sheets of materials, such as a sheet (or layer) of a material having a certain amount of rigidity for supporting the display panel (112), a sheet (or layer) of a material related to shock absorption, and a sheet (or layer) of a material for waterproofing or dustproofing. The sheet (113) is arranged on the back side of the display panel (112) (e.g., the opposite side of the front side where the screen is displayed), and various types of perforations may be applied according to the sensor arrangement of the first type portable electronic device (101). As an example, the sheet (113) may include at least one of a hole area having a size and position corresponding to at least one of a sensor arrangement area (140bi) of the support member (140), a hole area having a size and position corresponding to at least one of a front camera arrangement area, and a hole area having at least one size and position corresponding to the size and position of an area where a proximity sensor or an illuminance sensor is arranged. At least a portion of the back surface of the display panel (112) may be exposed in the back direction by the hole regions of the sheet (113), and light transmitted through the hole regions of the sheet (113) (e.g., light entering from the outside of the window (111) or the surface of the window (111) toward the display panel (112)) may be transmitted to the corresponding sensor. An area of ​​the display panel (112) corresponding to at least one area of ​​the hole regions of the sheet (113) may include an area from which pixels are removed, or may include pixels distributed at a density different from that of surrounding pixels. Additionally or alternatively, the display module (110) may be configured such that the sheet (113) is removed and only the window (111) and the display panel (112) are included.

[0060] The above heat dissipation structure (120) may include a structure in which the size of the xy plane is formed to be larger than the height of the z-axis, and an empty space is formed therein. As an example, the A1-A1' cross-section of the heat dissipation structure (120) may include, as illustrated, a heat dissipation substrate (120_1), a heat dissipation cover (120_2) placed on the heat dissipation substrate (120_1), and a protruding structure (120_3) placed in the empty space (or closed space) between the heat dissipation substrate (120_1) and the heat dissipation cover (120_2). As an example, a fluid may be placed in the empty space between the heat dissipation substrate (120_1) and the heat dissipation cover (120_2) together with the protruding structure (120_3), or the empty space state may be maintained. The protruding structure (120_3) may form a passage through which the fluid may flow within the empty space. Although the upper part (e.g., the part in the -z-axis direction, the lower part when the observation point is the z-axis) of the uneven structure (120_3) and the heat dissipation cover (120_2) is illustrated as being spaced apart, the present disclosure is not limited thereto. For example, at least a portion of the upper part (or the lower part when the observation point is the z-axis) of the uneven structure (120_3) and the inner part of the upper part of the heat dissipation cover (120_2) may be in contact. The heat dissipation substrate (120_1) and the heat dissipation cover (120_2) may be integrated or joined with respect to forming an empty space. The x-axis length of the heat dissipation substrate (120_1) may be formed longer than the x-axis length of the heat dissipation cover (120_2). The upper part (e.g., the part or surface facing the -z-axis direction) of the above heat dissipation cover (120_2) can be bonded to the support member (140) through the first adhesive member (131) (or heat dissipation tape, a member that is capable of heat transfer and has adhesive performance).The above heat dissipation substrate (120_1) may be placed in a first structure area (140ch1a) (or first arrangement space) among the first structure arrangement areas (140ch1) of the support member (140), and the heat dissipation cover (120_2) may be placed in a second structure area (140ch1b) (or second arrangement space) among the first structure arrangement areas (140ch1) of the support member (140). The heat dissipation structure (120) located in the cross section of the A1-A1` cutting line may correspond to a part of the first portion (120a).

[0061] The above-described support member (140) may have the same structure as the support member (140) described above in FIGS. 1C and 2. As an example, the support member (140) may include at least a first structure arrangement area (140ch1). The first structure arrangement area (140ch1) may include a first structure area (140ch1a) in which a heat dissipation substrate (120_1) of a heat dissipation structure (120) is arranged, and a second structure area (140ch1b) in which a heat dissipation cover (120_2) of the heat dissipation structure (120) is arranged. The first structure region (140ch1a) and the second structure region (140ch1b) include a groove shape or a groove-shaped empty space, and at least a portion of the first structure region (140ch1a) and the second structure region (140ch1b) are connected to each other, and the x-axis length of the first structure region (140ch1a) may be formed longer than the x-axis length of the second structure region (140ch1b). According to one embodiment, the cross-section of the first structure arrangement region (140ch1) among the -z-axis cross-section (or A1-A1` cross-section, the cross-section from the front direction of the display module (110) toward the rear case (170)) of the support member (140) may have a stepped shape. Part of both sides of the heat dissipation substrate (120_1) (e.g., the x-axis and -x-axis edges) may be placed on the step of the support member (140) formed at the edge of the first structure region (140ch1a). At least a portion of the shape of the first structure arrangement area (140ch1) may be formed to be identical or similar to at least a portion of the shape of the heat dissipation structure (120). According to one embodiment, the support member (140) may be formed to have a different thickness depending on the location. For example, the thickness of the support member (140) where the second structure area (140ch1b) is located may be formed to be thinner than the surrounding area.Alternatively, the support member (140) at the position where the first structure area (140ch1a) and the second structure area (140ch1b) overlap (or the position where the heat dissipation cover (120_2) is arranged) may have a first thickness, the support member (140) corresponding to the position of the first structure area (140ch1a) where the second structure area (140ch1b) does not overlap (or the position where the heat dissipation substrate (120_1) is arranged excluding the portion where the heat dissipation cover (120_2) is formed) may have a second thickness, and the support member (140) at the peripheral area where the first structure arrangement area (140ch1) is not formed (or the peripheral area of ​​the position where the heat dissipation structure (120) is arranged) may have a third thickness. The first thickness may be formed to be thinner than the second thickness, and the second thickness may be formed to be thinner than the third thickness.

[0062] Based on the cross-section A1-A1` cut through the first structure arrangement area (140ch1), a first printed circuit board (181) may be arranged between the support member (140) and the rear case (170). The first printed circuit board (181) may include, for example, a substrate portion (181_1) and an electronic component (181_2). In the illustrated drawing, the substrate portion (181_1) is illustrated as two layers, but the present disclosure is not limited thereto, and the substrate portion (181_1) may include a greater number of substrates or may include one substrate. When the substrate portion (181_1) has a structure in which a plurality of substrates are stacked, the substrate portion (181_1) may include at least one interposer that supports the upper and lower substrates while supporting electrical connection between the substrates. The electronic component (181_2) may be arranged on the plurality of substrates. For example, at least one electronic component (181_2) may be arranged on at least one of the front (e.g., the surface in the z-axis direction) or the rear (e.g., the surface in the -z-axis direction) of the substrate portion (181_1). In the illustrated drawing, the electronic component (181_2) is indicated by assigning a drawing number to one electronic component arranged toward the support member (140) among various electronic components, but a plurality of electronic components may be arranged on the substrate portion (181_1). The electronic component (181_2) may form physical contact with the support member (140) through the heat transfer member (183) or may form a heat transfer route.

[0063] The heat transfer member (183) is disposed between the support member (140) and the electronic component (181_2) (or at least a portion of the first printed circuit board (181), hereinafter described based on the electronic component (181_2)) so as to transfer heat generated in the electronic component (181_2) to the support member (140). The heat transfer member (183) may be composed of, for example, a thermal interface material (TIM). Alternatively, the heat transfer member (183) may include at least one of various members capable of transferring heat to the support member (140), for example, a metal member, a mesh member, and a semi-solid type member (e.g., a gel type member). The heat transfer member (183) may include, for example, one surface larger than one surface of the electronic component (181_2) in the z-axis direction. The heat transfer member (183) may further include an adhesive material so as to be fixed between the electronic component (181_2) and the support member (140). For example, the heat transfer member (183) may further include a core material (or sheet, structure) capable of transferring heat, and an adhesive material applied (or arranged) on at least one of a surface of the core material in the -z-axis direction and a surface in the z-axis direction. When the heat transfer member (183) includes an adhesive material, the adhesive material may have a property of transferring heat along with an adhesive function. At least one of the size and position of the area of ​​the support member (140) where the heat transfer member (183) is arranged may correspond to (or be identical to or similar to) at least one of the size and position of the area where the heat dissipation structure (120) is arranged.

[0064] The rear case (170) may be composed of one layer or multiple layers. For example, the rear case (170) may include a first plate (171) and a second plate (172). The first plate (171) may be composed of a transparent material (e.g., glass material). The second plate (172) may be composed of, for example, an MFC material. The first plate (171) and the second plate (172) may also be composed of the same material. The rear case (170) may be combined with the support member (140) to form a space in which a first type portable electronic device (101) may be formed therein.

[0065] FIG. 3 is a drawing showing an example of another cross-section of a first type portable electronic device according to one embodiment.

[0066] Referring to FIGS. 1A to 3, at least a portion of a cross-section cut along the B1-B1` cutting line of the first type portable electronic device (101) may include a display module (110), a support member (140), a battery (160), and a rear case (170) in the z-axis direction with respect to the -z-axis direction as illustrated. Additionally or alternatively, when the B1-B1` cutting line cuts a portion including a heat dissipation structure (120), the first type portable electronic device (101) may further include a heat dissipation structure (120) (e.g., a second portion (120b) of the heat dissipation structure (120)) disposed on one side of the support member (140) and a first type fixing structure (150). Additionally or alternatively, if the B1-B1` cutting line cuts a portion of the battery (160), the first type portable electronic device (101) may further include at least one flexible circuit board (184_1, 184_2) (e.g., FPCB) connecting the first printed circuit board (181) and the second printed circuit board (182). According to one embodiment, the flexible circuit boards (184_1, 184_2) are configured to connect the top and the bottom of the first type portable electronic device (101), and may be arranged to connect other electronic components other than the printed circuit boards (181, 182). In the illustrated drawing, a structure in which two flexible circuit boards (184_1, 184_2) are arranged is exemplified, but the present disclosure is not limited thereto. For example, the first type portable electronic device (101) may include one flexible circuit board or three or more flexible circuit boards.

[0067] At least one of the display module (110), heat dissipation structure (120), and rear case (170) shown in the above B1-B1` cross-section has the same structure or configuration as the display module and rear plate described above in FIG. 2, so the detailed description thereof can be replaced with the content described above.

[0068] The support member (140) may include a second structure placement area (140ch2) connected to the first structure placement area (140ch1). The second structure placement area (140ch2) may include a shape in which the front and back surfaces of the support member (140) are penetrated. As an example, the second structure placement area (140ch2) may include a third structure area (140ch2a) and a fourth structure area (140ch2b). The third structure area (140ch2a) and the fourth structure area (140ch2b) may indicate areas in which at least a portion of the support member (140) is removed and the front and back surfaces are penetrated. A part of the heat dissipation structure (120) (e.g., at least one of the heat dissipation cover (120_2), the uneven structure (120_3), or the fluid) may be placed in the third structure area (140ch2a). Another part of the heat dissipation structure (120) (e.g., a part of the heat dissipation substrate (120_1)) may be arranged in the fourth structure region (140ch2b), which is connected to the third structure region (140ch2a) and partially overlaps the third structure region (140ch2a) when observed in the z-axis direction. The support member (140) on which the third structure region (140ch2a) and the fourth structure region (140ch2b) are formed may have a stepped shape. For example, the support member (140) on which the fourth structure region (140ch2b) is arranged includes first stepped portions that are engraved in the -z-axis direction more than the surrounding area of ​​the point where the heat dissipation structure (120) is arranged, and the first stepped portions may be formed at both edges based on the heat dissipation cover (120_2). Second adhesive members (132) may be arranged in the first stepped portions. When observed in the Z-axis direction, the first steps may overlap at least part of both edges of the heat dissipation substrate (120_1).An area of ​​the support member (140) where the third structure area (140ch2a) is arranged may be more concave in the -z-axis direction than the first step area where the edge of the heat dissipation substrate (120_1) is arranged, and a hole penetrating in the -z-axis direction may be formed. A heat dissipation cover (120_2) and a first mask member (151) included in the first type fixing structure (150) may be arranged in the hole area of ​​the support member (140) (e.g., the third structure area (140ch2a)). A gap (e.g., an air gap) may be formed in at least a portion between the heat dissipation structure (120) (e.g., the second portion (120b)) and the first mask member (151).

[0069] At least a portion of one surface (e.g., a surface facing the z-axis) of the battery (160) may be attached to the bottom surface of the support member (140) in the -z-axis direction via the first type fixing structure (150). At least a portion of the other surface (e.g., a surface facing the -z-axis) of the battery (160) may be arranged to face the rear case (170), and at least a portion of flexible circuit boards (184_1, 184_2) may be arranged on the other surface of the battery (160).

[0070] The first type fixing structure (150) may be disposed between the battery (160) and the support member (140). The first type fixing structure (150) may have, for example, a size corresponding to one side of the battery (160) or a size smaller than the size of one side of the battery (160). The first type fixing structure (150) may have an adhesive material applied to the remaining area except for the area where the first mask member (151) is disposed. Alternatively, the first type fixing structure (150) may have an adhesive material applied to the remaining area except for the area where the first mask member (151) is disposed, which faces the second part (120b) of the heat dissipation structure (120). Alternatively, the first mask member (151) may be disposed to cover a portion of the adhesive material of the first structure body (153). The first type fixing structure (150) may be in a non-adhesive state with the heat dissipation structure (120) through the first mask member (151). One surface (e.g., the surface facing the -z-axis direction) of the first type fixing structure (150) may be entirely adhered to one surface of the battery (160), and accordingly, the first type portable electronic device (101) including the first type fixing structure (150) may improve the fixing force of the battery (160) (the force that fixes the battery (160) to the battery area of ​​the first type portable electronic device (101). Accordingly, when performing an operation of removing the battery (160) from the first type portable electronic device (101), only the battery (160) may be separated without the heat dissipation structure (120) being broken, damaged, or displaced.

[0071] FIG. 4 is a drawing showing an example of a configuration of a first type portable electronic device including a first type fixed structure and a support member and a heat dissipation structure according to one embodiment.

[0072] Referring to FIGS. 1A to 4, a first type fixed structure (150) according to an embodiment may include a first structure body (153), a first mask member (151), a second mask member (152), and an auxiliary hole (154). The first type fixed structure (150) may include an upper surface (150_f) (or a surface facing the z-axis direction, the front surface of the fixed structure, or the front surface of the double-sided adhesive member) and a lower surface (150_b) (or a surface facing the -z-axis direction, the rear surface of the fixed structure, or the rear surface of the double-sided adhesive member). The front surface of the first structure body (153) and the front surfaces of the first and second mask members (151, 152) may be disposed on the upper surface (150_f). The rear surface of the first structure body (153) may be disposed on the lower surface (150_b). At least a portion of the upper surface (150_f) (the upper bonding region where the first and second mask members (151, 152) are not formed, or the first bonding region) may be bonded to one surface of the support member (140). The non-bonding region of the upper surface (150_f) (e.g., the region where the first and second mask members (151, 152) are disposed on the first structure body (153)) may be disposed to face the second part (120b) of the heat dissipation structure. At least a portion (or the entirety) of the lower surface (150_b) may include a lower bonding region (or second bonding region) bonded to the battery (160). According to one embodiment, the size of the surface area of ​​the lower bonding region (or second bonding region) may be equal to the sum of the size of the surface area of ​​the non-bonding region and the size of the surface area of ​​the upper bonding region (or first bonding region).

[0073] The first structure body (153) may include a shape similar to the shape of one side (e.g., a side facing the z-axis) of the battery (160). For example, the first structure body (153) may be formed such that the length of the x-axis or y-axis is greater than the thickness of the z-axis. The first structure body (153) includes at least four edges, and as an example, the length of the y-axis direction may be formed to be longer than the length of the x-axis direction depending on the shape of the battery (160). When the shape of the battery (160) is changed, the shape of the first structure body (153) may be changed. At least some of the four corners where the four edges of the first structure body (153) meet may be rounded. As an example, one edge (e.g., -x-axis edge) of the first structure body (153) may include a handle groove (156) (e.g., a groove for placing a battery disassembly structure or a battery disassembly tape, an opening for a handle) with at least a portion thereof removed in the inner center direction. The handle groove (156) may be omitted. When the handle groove (156) is omitted, a portion of the first structure body (153) may be disposed in the handle groove (156) area, as illustrated in FIG. 1C. An adhesive material may be applied to the entire front and rear surfaces of the first structure body (153). Alternatively, the first structure body (153) may be formed of a double-sided tape that is adhesiveable on the front and rear surfaces.

[0074] The first mask member (151) may include a shape corresponding to the shape of at least a portion (e.g., the second portion (120b)) of the heat dissipation structure (120). For example, when the second portion (120b) of the heat dissipation structure (120) is provided with a shape in which the length in the -y-axis direction from the y-axis is longer than the length in the x-axis direction, and at least a portion of the second portion (120b) forms a curved surface that is curved from the y-axis to the -y-axis direction, the first mask member (151) may include a curved surface in which at least a portion is curved to correspond to the shape of the second portion (120b), and the length of at least a portion of the first mask member (151) in the -y-axis direction may be formed to be longer than the length in the other direction. For example, the first mask member (151) may be disposed on an upper surface (e.g., a surface facing the z-axis direction, or a front surface) of the first structure body (153). Alternatively, the first mask member (151) may be disposed between the heat dissipation structure (120) (or the second portion (120b) of the heat dissipation structure (120)) and the first structure body (153) (or the battery (160)). The front and back surfaces of the first mask member (151) may be formed of a non-adhesive material. For example, one surface (or front surface) of the first mask member (151) may be adhered to the first structure body (153), and the other surface (or back surface) of the first mask member (151) may be disposed to face the heat dissipation structure (120) (e.g., the second portion (120b)). For example, one surface of the first mask member (151) facing the first structure body (153) may include an adhesive material, and the other surface facing the heat dissipation structure (120) may include a non-adhesive material. The first mask member (151) may include at least one layer. As an example, the first mask member (151) may include at least one of a polymer, sponge, and mesh structure. Alternatively, the first mask member (151) may be formed of a semi-solid type (e.g., gel type) material.The above first mask member (151) can prevent or reduce damage to the heat dissipation structure (120) when the battery (160) is disassembled, and can provide an effect of blocking at least a portion of the heat of the heat dissipation structure (120) (or the heat dissipation member) from being transferred to the battery (160).

[0075] The second mask member (152) may include a shape corresponding to the shape of a sensor (e.g., a biometric sensor) disposed below the display module (110) of the first type portable electronic device (101). For example, when the sensor has a rectangular shape, the second mask member (152) may include a rectangular shape corresponding to the shape of the sensor. For example, the second mask member (152) may be disposed on an upper surface (e.g., a surface facing the z-axis direction or a front surface) of the first structure body (153) that does not overlap with the first mask member (151). Accordingly, the first mask member (151) and the second mask member (152) may be disposed on the same surface of the first structure body (153). The second mask member (152) may be disposed between the biometric sensor and the first structure body (153) (or the battery (160)). The front and back surfaces of the second mask member (152) may be formed of a non-adhesive material. For example, one surface of the second mask member (152) may be adhered to a first structure body (153) that does not overlap with the first mask member (151) when viewed in the z-axis direction, and the other surface of the second mask member (152) may be arranged to face the sensor arrangement area (140bi) (toward the sensor arrangement area (140bi)). The second mask member (152) may be formed of the same material as the first mask member (151). Alternatively, the second mask member (152) may be formed of a different material from the first mask member (151). The second mask member (152) may be composed of a single layer or multiple layers, and may have the same number of layers as the first mask member (151) or may be composed differently. According to one embodiment, at least one of the first mask member (151) and the second mask member (152) may be composed of multiple layers having different types of materials.

[0076] Meanwhile, although the structure in which the first type fixed structure (150) includes the second mask member (152) is exemplified in the above description, the present disclosure is not limited thereto. For example, the first type portable electronic device (101) may not include a sensor at a lower position of the display module (110). For example, the second mask member (152) may be excluded from the first type fixed structure (150). Similarly, the sensor placement area (140bi) (hole area) for sensor placement in the battery area (140_rc) of the support member (140) may be removed, and a part of the support member made of a metallic or injection-molded material may be placed (the sensor placement area (140bi) may be filled).

[0077] The auxiliary holes (154) may be formed to penetrate the front and rear surfaces (e.g., surfaces facing the z-axis and the -z-axis) of the first structure body (153). The auxiliary holes (154) may be arranged in multiple numbers at regular intervals, for example. For example, the auxiliary holes (154) may include multiple holes, and the multiple holes may be divided into pairs of two, and the holes belonging to each pair may be connected through a cut portion or gap formed through the front and rear surfaces of the first structure body (153). The auxiliary holes (154) may be arranged in multiple numbers on one side of the first structure body (153) where the first mask member (151) and the second mask member (152) are not formed. For example, the auxiliary holes (154) may include a structure in which holes spaced apart in the y-axis direction at regular intervals are arranged to form a row. The above auxiliary hole (154) serves as a passage for inducing air flow in the front-rear direction while the first type fixing structure (150) is placed on the battery area (140_rc) of the support member (140), thereby supporting the first type fixing structure (150) to be adhered to the battery area (140_rc) without generating separate air bubbles. In addition, the above auxiliary hole (154) can support the battery (160) to be adhered to the first type fixing structure (150) without generating separate air bubbles while the battery (160) is adhered. The above auxiliary hole (154) may be omitted.

[0078] The above-described support member (140) may include a first substrate region (140pb1), a second substrate region (140pb2), and a battery region (140_rc) arranged on one surface in the -z-axis direction. At least a portion of a first printed circuit board (181) may be placed on the first substrate region (140pb1), and at least a portion of a second printed circuit board (182) may be placed on the second substrate region (140pb2). Additionally or alternatively, at least a portion of other hardware components related to a user function of the first type portable electronic device (101) may be arranged on the first substrate region (140pb1) and the second substrate region (140pb2). As described above, a heat dissipation structure (120) and a display module (110) may be arranged on one surface of the support member (140) facing the z-axis direction. The second part (120b) of the heat dissipation structure (120) may be disposed in a penetration portion (or hole area, or second structure placement area (140ch2)) penetrating the front and rear surfaces of the support member (140). The battery area (140_rc) may be disposed between the first substrate area (140pb1) and the second substrate area (140pb2). For example, the battery area (140_rc) may include at least one side wall formed at an edge of the battery area (140_rc) and protruding in the -z-axis direction from the z-axis. A second structure placement area (140ch2) in which the second part (120b) of the heat dissipation structure (120) is disposed may be formed in the battery area (140_rc). For example, the second structure placement area (140ch2) described above may be formed by removing a portion of the battery area (140_rc). As an example, a sensor placement area (140bi) in which a sensor (e.g., a biometric sensor) is placed may be formed in the battery area (140_rc). The sensor placement area (140bi) may be excluded if the first type portable electronic device (101) does not include a specific sensor.

[0079] FIG. 5 is a drawing showing an example of an exploded perspective view of a second type portable electronic device according to one embodiment. The battery side wall (141ba_s2) is a drawing showing an example of a second type fixing structure and a third mask member according to one embodiment.

[0080] The second type portable electronic device (102) may include at least a portion of the configuration of the portable electronic device (400) described above in FIGS. 1A and 1B.

[0081] Referring to FIGS. 1A to 5 , a second type portable electronic device (102) may include a support member (140) (e.g., a bracket, a frame, or a housing), a display module (110) (or display assembly, display structure, display assembly) (e.g., a structure including a front plate (402) and a display (401) of FIGS. 1A and 1B ), a battery (160), and a rear case (170) (e.g., a rear plate (411) of FIGS. 1A and 1B , a rear case (170) of FIG. 1C ). According to one embodiment, the second type portable electronic device (102) may include a heat dissipation structure (120) at least partially disposed between the support member (140) and the display module (110), a second type fixing structure (250) (e.g., a third mask member (230), a second structure body (253)) (or a second battery fixing structure, a second battery adhesive structure, a second adhesive structure, a second adhesive member, a second adhesive assay) disposed between the support member (140) and the battery (160).

[0082] Additionally or alternatively, the second type portable electronic device (102) may include at least one of the printed circuit boards (181, 182) described above in FIG. 1C. Furthermore, according to one embodiment, the second type portable electronic device (102) may include first and second adhesive members (131, 132) that secure the heat dissipation structure (120) to one side of the support member (140) as described above with respect to the first type portable electronic device (101).

[0083] In the configuration of the second type portable electronic device (102) described above, the display module (110), the heat dissipation structure (120), the support member (140), the battery (160), and the rear case (170) may have the same or similar configurations as the display module, the heat dissipation structure, the support member, the battery, and the rear case described in the first type portable electronic device (101), and thus, a detailed description thereof may be replaced with the description described above.

[0084] The second structure body (253) may be disposed between the support member (140) and the battery (160). The second type fixing structure (250) may be disposed so as not to overlap the third mask member (230) when partially cut or removed and observed in the z-axis direction. Alternatively, at least a portion of the area surrounding the third mask member (230) among the second type fixing structures (250) may be disposed so as to overlap an edge portion of the third mask member (230).

[0085] In FIG. 6, state 601 shows an example of a state in which the direction in which the battery (160) is placed (or the direction from the -z axis to the z axis) is observed among the states in which the third mask member (230) and the second type fixing structure (250) are placed on the support member (140). In FIG. 6, state 603 shows an example of a state in which the direction in which the display module (110) (or the heat dissipation structure (120)) is placed on the support member (140) is observed among the states in which the third mask member (230) and the second type fixing structure (250) are placed on the support member (140) (or the direction from the z axis to the -z axis).

[0086] Referring to state 601 and state 603, the second structure body (253) may include a front body (253_f) and a rear body (253_b). The front body (253_f) and the rear body (253_b) of the second structure body (253) may include the same structure and shape. As an example, an adhesive material may be applied (or placed) to the entirety or part of the front body (253_f) and the rear body (253_b). As an example, at least a portion (or the entire surface) of the rear body (253_b) may be adhered to the bottom surface of the support member (140). At least a portion (or the entire surface) of the front body (253_f) of the second structure body (253) may be adhered to the front surface of the battery (160) (e.g., a surface facing the z-axis direction in the battery (160).

[0087] The second structure body (253) may include four edges, a handle groove (253rc) (e.g., the same configuration as the handle groove (156) of FIG. 4) disposed on one edge (e.g., the edge in the -x-axis direction), a first opening (253op) disposed on an edge in the y-axis direction, and a sensor hole (253h) formed to be biased toward the -y direction and to penetrate the front and rear surfaces. According to one embodiment, the sensor hole (253h) may be excluded from the second structure body (253), and the sensor hole (253h) area may be filled by the front body (253_f) and the rear body (253_b) to which an adhesive material is applied. The second structure body (253) in which the sensor hole (253h) area is excluded and the corresponding area (sensor hole area) is filled with an adhesive material may be applied even if the second type portable electronic device (102) includes a sensor (e.g., a biometric sensor). Meanwhile, one edge on which the handle groove (253rc) is arranged may be replaced with or excluded from the other edge (e.g., the edge in the x-axis direction) of the second structure body (253) to facilitate disassembly of the battery (160). Alternatively, the handle groove (253rc) may be formed at least on one of the two edges (e.g., the -x-axis and x-axis edges). The second structure body (253) may include at least one auxiliary hole (e.g., the auxiliary hole (154) described in FIG. 4) penetrating the front and rear surfaces.

[0088] The third mask member (230) may be disposed between the support member (140) and the battery (160). Alternatively, in a stacked state of the respective components of the second type portable electronic device (102), when observed from the z-axis, a part of the third mask member (230) may be adhered to one surface of the support member (140) in the -z-axis direction, and the other part of the third mask member (230) may be disposed between the support member (140) on which the heat dissipation structure (120) is disposed (or the second part (120b) of the heat dissipation structure (120)) and the battery (160). In this regard, the third mask member (230) may include a first mask upper member (230a) and a first mask lower member (230b). The first mask upper member (230a) may include a first mask upper front surface (230a_mf) on which a separate adhesive material is not applied (or on which no adhesive material is disposed) and a first mask upper back surface (230a_b) on which a separate adhesive material is applied (or on which an adhesive material is disposed). The first mask lower member (230b) may include a first mask lower front surface (230b_f) on which a separate adhesive material is applied (or on which an adhesive material is disposed) and a first mask lower back surface (230b_mb) on which a separate adhesive material is not applied (or on which an adhesive material is not disposed).

[0089] The x-axis length of the first mask upper member (230a) may include a bar-type shape formed to be longer than the y-axis length. The x-axis length of the first mask upper member (230a) may be formed to be longer than the x-axis length of the first mask lower member (230b). The y-axis length of the first mask upper member (230a) may be formed to be shorter than the y-axis length of the first mask lower member (230b).

[0090] The first mask lower member (230b) may include a structure extending in the -y-axis direction from one side of the first mask upper member (230a). For example, at least a portion of the shape of the first mask lower member (230b) may include a shape corresponding to the shape of the first opening (253op). For example, the size of the first mask lower member (230b) may be formed to be smaller by a predetermined size than the size of the first opening (253op), so that when the second type fixed structure (250) including the third mask member (230) and the second structure body (253) is placed on the support member (140), a gap of a predetermined size may be formed between the rim (or edge) of the first mask lower member (230b) and the rim (or inner edge) of the second structure body (253) forming the first opening (253op). According to one embodiment, the size of the first mask lower member (230b) is formed to be larger than the size of the first opening (253op) by a predetermined size (e.g., several to several hundred micrometers) so that the edge of the first mask lower member (230b) can be in a bonded state with the inner edge of the second structure body (253) forming the first opening (253op).

[0091] The second type portable electronic device (102) described above may have a structure in which the heat dissipation structure (120) is arranged on the rear surface (e.g., the surface in the -z-axis direction) of the support member (140), and the third mask member (230) may be arranged to cover the second portion (120b) of the heat dissipation structure (120), thereby providing a structure in which the heat dissipation structure (120) and the battery (160) do not directly contact each other. Correspondingly, a gap (or air gap) may be formed in at least a portion between the second portion (120b) of the heat dissipation structure (120) and the third mask member (230).

[0092] FIG. 7 is a drawing showing the arrangement of a support member and some peripheral components of a second type portable electronic device according to one embodiment.

[0093] Referring to FIGS. 5 to 7, a second type portable electronic device (102) according to an embodiment may include a support member (140), as in state 701. One surface (e.g., a surface facing the -z axis) of the support member (140) may include a battery bonding area (140ad), a sensor placement area (140bi), a second structure placement area (140ch2), and a mask bonding area (140m). The battery bonding area (140ad) may include an area where at least a portion of the second structure body (253) of the second type fixed structure (250) is bonded. The sensor placement area (140bi) may include an area where a biometric sensor (e.g., a fingerprint sensor) included in the second type portable electronic device (102) is placed. The sensor placement area (140bi) may be omitted when the second type portable electronic device (102) does not include a biometric sensor. If the sensor placement area (140bi) is omitted, the space corresponding to the sensor placement area (140bi) may be filled by a specific material member (e.g., a metal member) constituting the support member (140). The second structure placement area (140ch2) may include an area where at least a portion of the second part (120b) of the heat dissipation structure (120) is placed. As mentioned above, the second structure placement area (140ch2) may include a hole shape through which the front and rear surfaces of the support member (140) are penetrated. The mask bonding area (140m) may include an area where at least a portion of the third mask member (230) (e.g., the first mask upper member (230a)) is bonded.

[0094] Referring to state 703, a second type fixing structure (250) may be arranged on the support member (140). For example, a first mask upper member (230a) of a third mask member (230) may be adhered to a mask bonding area (140m). A first mask lower member (230b) of a third mask member (230) may be arranged on a second structure arrangement area (140ch2). A second structure body (253) may be adhered to a battery bonding area (140ad). A sensor hole (253h) formed on the second structure body (253) may be arranged to be aligned with a sensor arrangement area (140bi) formed on the support member (140). In this regard, the sensor hole (253h) and the sensor arrangement area (140bi) may have the same or similar size and shape.

[0095] Referring to states 701 to 707, a second part (120b) of a heat dissipation structure (120) may be disposed in a second structure placement area (140ch2) of a second type portable electronic device (102). The rear surface of a sensor (180bi) related to biometric sensing of the second type portable electronic device (102) may be disposed in the sensor placement area (140bi). The rear surface of the sensor (180bi) may include at least one of a substrate, a metal plate, and a noise blocking sheet supporting the sensor (180bi). According to one embodiment, a first part (120a) connected to the second part (120b) of the heat dissipation structure (120) may be disposed on an upper portion (e.g., a portion in the y-axis direction) of a support member (140). A front surface of the sensor (180bi) may be disposed on one surface of the support member (140) in the z-axis direction. A sensing unit that receives light transmitted through the display module (110) may be placed on the front of the sensor (180bi).

[0096] The battery (160) may be bonded to the second structure body (253) disposed on the battery bonding area (140ad) of the support member (140). When the battery (160) is placed on the second structure body (253), it may be bonded to the first mask lower member (230b) of the third mask member (230). Correspondingly, a sensor (180bi) and a part of the heat dissipation structure (120) (e.g., the second part (120b)) may be disposed on the lower part of the battery (160) (e.g., the lower part when looking from the -z axis to the z axis, the upper part of the battery (160) when looking from the z axis to the -z axis). A third mask member (230) (e.g., the first mask lower member (230b)) may be placed between the second portion (120b) of the heat dissipation structure (120) and an area of ​​the battery (160), and an air gap may be formed in at least a portion between the second portion (120b) and the third mask member (230). Similarly, an air gap may be formed in at least a portion between the sensor (180bi) and the battery (160).

[0097] FIG. 8 is a drawing showing an example of a cross-section of one side of a support member on which a second type fixed structure is arranged according to one embodiment.

[0098] Referring to FIGS. 5 to 8, the drawing of the state 801 shown at line A2-A2` in the illustrated drawings shows a state in which the second type fixing structure (250) and the support member (140) are aligned before the battery (160) is placed, and the cross-section of the state 803 cut along the line A2-A2` illustrates a structure including the battery (160). The second type portable electronic device (102) according to one embodiment may partially include the support member (140), the second type fixing structure (250), and the battery (160). The support member (140) may include a predetermined area (e.g., the battery area (140_rc) of FIG. 4) in which the battery (160) may be placed, and the battery area (140_rc) may include at least one side wall (e.g., the battery upper side wall (141ba_s1)). When observing a second type portable electronic device (102) including some components (e.g., components including a support member (140) and a heat dissipation structure (120) and a second type fixed structure (250)) from the z-axis direction toward the -z-axis direction, a front surface (e.g., a surface facing the z-axis) of a first part (120a) and a second part (120b) of a heat dissipation structure (120) can be observed on one side (e.g., a surface facing the z-axis) of the support member (140). A back surface (e.g., a surface facing the -z-axis) of the second part (120b) can face one side of a first mask lower part (230b) of a third mask member (230).

[0099] According to one embodiment, the first mask upper member (230a) of the third mask member (230) may include an upper adhesive layer (230a1) and an upper substrate layer (230a2), and the first mask lower member (230b) may include a lower adhesive layer (230b1) and a lower substrate layer (230b2). The upper adhesive layer (230a1) may be adhered to a portion of the support member (140) (e.g., a portion (140_rc_bu) of the battery region (140_rc) of the support member (140). The portion (140_rc_bu) of the support member (140) may include a portion where at least a portion of the PCM (Bat_Pcm) (power control module) of the battery (160) is disposed. Alternatively, when viewed in the z-axis direction or the -z-axis direction, at least a portion of the PCM (Bat_Pcm) of the battery (160) may overlap with a portion of the region (140_rc_bu). The upper substrate layer (230a2) may be arranged to face at least a portion of the PCM (Bat_Pcm) of the battery (160). The upper substrate layer (230a2) may include, for example, a sheet on which an upper adhesive layer (230a1) is applied (or an adhesive tape is arranged). The upper substrate layer (230a2) may be formed of a non-adhesive material. For example, the upper substrate layer (230a2) may include a polymer material or a plastic material. The upper adhesive layer (230a1) may be arranged on the upper front surface (230a_mf) of the first mask, and the upper substrate layer (230a2) may be arranged on the upper rear surface (230a_b) of the first mask.

[0100] The lower adhesive layer (230b1) may be disposed on the lower rear surface (230b_mb) of the first mask, and the lower substrate layer (230b2) may be disposed on the lower front surface (230b_f) of the first mask. The lower substrate layer (230b2) may be connected to the upper substrate layer (230a2). The lower substrate layer (230b2) may have the same material as the upper substrate layer (230a2). The lower adhesive layer (230b1) may be disposed on one area of ​​the support member (140) (e.g., an area where the battery (160) is placed), and then, when the battery (160) is placed, it may be adhered to one surface (e.g., a surface facing the z-axis) of the battery (160). Alternatively, at least a portion of the lower adhesive layer (230b1) may overlap with the battery (160) when viewed in the z-axis direction or the -z-axis direction. The lower substrate layer (230b2) may be arranged to face at least a portion of the second portion (120b) of the heat dissipation structure (120). The lower substrate layer (230b2) may include, for example, a sheet on which a lower adhesive layer (230b1) is applied (or on which an adhesive tape is arranged). The lower substrate layer (230b2) may be made of the same material as or a similar material to the upper substrate layer (230a2), for example, a non-adhesive material. The lower adhesive layer (230b1) may be arranged on the lower rear surface (230b_mb) of the first mask, and the lower substrate layer (230b2) may be arranged on the lower front surface (230b_f) of the first mask.

[0101] The front and rear surfaces of the second structure body (253) may be bonded to the bottom surface of the battery area (140_rc) of the support member (140) and the front surface of the battery (160), respectively. When viewed in the -z-axis direction, the edge of the third mask member (230) adjacent to the second structure body (253) and the edge of the second structure body (253) adjacent to the third mask member (230) may be arranged so as not to overlap. Alternatively, a gap may be formed between the edge of the third mask member (230) and the edge of the second structure body (253). The z-axis thickness of the third mask member (230) and the z-axis thickness of the second structure body (253) may be formed to be the same or similar.

[0102] FIG. 9 is a drawing showing an example of an assembly sequence of a second type portable electronic device according to one embodiment.

[0103] Referring to FIGS. 5 to 9, as in state 901, the second type portable electronic device (102) may include at least a support member (140), a heat dissipation structure (120), a second type fixed structure (250) (e.g., a third mask member (230) and a second structure body (253)), and a battery (160). The heat dissipation structure (120) may be placed on one side (e.g., one side in the z-axis direction) of the support member (140). In this process, the second part (120b) of the heat dissipation structure (120) may be placed in the second structure placement area of ​​the support member (140) through which the front and back surfaces are penetrated, and the rear surface of the second part (120b) of the heat dissipation structure (120) may be placed so that it is exposed in the -z-axis direction of the support member (140).

[0104] As in state 903, in a state where the second part (120b) of the heat dissipation structure (120) is exposed in the -z-axis direction through the second structure arrangement area of ​​the support member (140), the third mask member (230) can be placed on the support member (140) to cover the second part (120b) of the heat dissipation structure (120). In this process, the first mask upper part (230a) of the third mask member (230) can be bonded to a portion of the bottom surface of the battery area (140_rc) of the support member (140), and the first mask lower part (230b) can be placed to cover the second part (120b) of the heat dissipation structure (120). According to one embodiment, the size of a portion of the first mask lower member (230b) (e.g., the x-axis length at a point of the first mask lower member (230b)) may be formed smaller than the size of the second portion (120b) of the heat dissipation structure (120) (or the x-axis length at a point of the second portion (120b)). Correspondingly, a width of a predetermined size among the edges of the second portion (120b) of the heat dissipation structure (120) may be exposed in the -z-axis direction in a band shape. According to one embodiment, the size of a portion of the third mask member (230) (e.g., the first mask lower member (230b)) may be formed to be the same as the size of the second portion (120b) of the heat dissipation structure (120) (e.g., the portion exposed in the -z-axis direction of the support member (140)).

[0105] As in state 905, in a state where the third mask member (230) is arranged to cover at least a portion of the second part (120b) of the heat-radiating structure (120), the second structure body (253) can be adhered to the bottom surface of the battery area (140_rc) of the support member (140). In this regard, the front and back surfaces of the second structure body (253) may be coated with an adhesive material or configured in the form of a double-sided adhesive tape. In the illustrated drawing, the second structure body (253) is illustrated as including a sensor hole (253h) corresponding to the area where the sensor (180bi) is arranged, but the present disclosure is not limited thereto. For example, the sensor hole (253h) of the second structure body (253) may be removed, and adhesive materials (e.g., a first adhesive material arranged on the front and a second adhesive material arranged on the rear) may be formed on the front and back surfaces in the same manner as the surroundings. Since the second structure body (253) includes a first opening (253op) having the same size as a portion of the third mask member (230) (e.g., the first mask lower member (230b)) or a larger size than the first mask lower member (230b), the third mask member (230) and the second structure body (253) may be disposed on the same surface. Alternatively, the third mask member (230) and the second structure body (253) may be disposed so as not to overlap when observed in the -z-axis direction (or the z-axis direction). Alternatively, a gap may be formed between the edge of the first mask lower member (230b) of the third mask member (230) and the edge of the second structure body (253) forming the first opening (253op) when observed in the -z-axis direction. The above gap may correspond to the size of the second part (120b) of the heat dissipation structure (120) exposed in the -z-axis direction.

[0106] As in state 907, with the third mask member (230) and the second structure body (253) disposed in the battery area (140_rc) of the support member (140), the battery (160) can be laminated on the third mask member (230) and the second structure body (253). As the adhesive material is disposed on the -z-axis direction surface of the first mask lower member (230b) of the third mask member (230) and the -z-axis direction surface of the second structure body (253), the battery (160) can be more firmly adhered to the third mask member (230) and the second structure body (253). As described above, a second structure arrangement area for arranging a heat dissipation structure (120) is formed in the support member (140), so that even if a first opening (253op) is formed in the second structure body (253), the adhesive area of ​​the battery (160) is further secured through the third mask member (230) on which an adhesive material is applied (or arranged), thereby improving (reducing) the flow of the battery (160).

[0107] FIG. 10 is a drawing showing an example of an exploded perspective view of a third type portable electronic device according to one embodiment. FIG. 11 is a drawing showing an example of a cross-section taken along line A3-A3` of some components of a third type portable electronic device according to one embodiment. FIG. 12 is a drawing showing an example of an assembly order of some components of a third type portable electronic device according to one embodiment.

[0108] Referring to FIGS. 1A to 10 , a third type portable electronic device (103) may include a support member (140) (or bracket, frame, housing), a display module (110) (or display assembly, display structure, display assembly) (e.g., a structure including a front plate (402) and a display (401) of FIGS. 1A and 1B ), a battery (160), and a rear case (170) (e.g., a rear plate (411) of FIGS. 1A and 1B , a rear case (170) of FIG. 1C ). According to one embodiment, the third type portable electronic device (103) may include a heat dissipation structure (120) at least partially disposed between the support member (140) and the display module (110), a third type fixing structure (350) (e.g., a fourth mask member (330), a third structure body (353)) (or a second battery fixing structure, a second battery adhesive structure, a second adhesive structure, a second adhesive member, a second adhesive assay) disposed between the support member (140) and the battery (160).

[0109] Additionally or alternatively, the third type portable electronic device (103) may include at least one of the printed circuit boards (181, 182) described above in FIG. 1C. In addition, according to one embodiment, the third type portable electronic device (103) may include first and second adhesive members (131, 132) that secure the heat dissipation structure (120) to one side of the support member (140) as described above with respect to the first type portable electronic device (101).

[0110] In the configuration of the third type portable electronic device (103) described above, the display module (110), the heat dissipation structure (120), the support member (140), the battery (160), and the rear case (170) may have the same or similar configurations as the display module, the heat dissipation structure, the support member, the battery, and the rear case described in the first type portable electronic device (101) or the second type portable electronic device (102), and thus, a detailed description thereof may be replaced with the description described above.

[0111] The third structure body (353) may be disposed between the support member (140) and the battery (160). The third type fixing structure (350) may be disposed so as not to overlap the fourth mask member (330) when partially cut or removed and observed in the z-axis direction. Alternatively, at least a portion of the area surrounding the fourth mask member (330) among the third type fixing structures (350) may be disposed so as to overlap an edge portion of the fourth mask member (330). At least a portion of the shape, material, and size of the third structure body (353) may be configured to be identical to or similar to, within a certain error range, at least a portion of the material and size of the second structure body (253) described above in the second type fixing structure (250).

[0112] Referring to FIGS. 10 and 11, in a stacked state of each component of the third type portable electronic device (103), when observed from the z-axis, a part of the fourth mask member (330) may be adhered to one surface of the support member (140) in the -z-axis direction, and another part of the fourth mask member (330) may be disposed between the support member (140) on which the heat dissipation structure (120) is disposed (or the second part (120b) of the heat dissipation structure (120)) and the battery (160).

[0113] Referring to FIGS. 10 and 12, the fourth mask member (330) may include a second mask upper member (330a) bonded to a portion of the support member (140), a second mask middle member (330b) connected to the second mask upper member (330a), and a second mask lower member (330c) connected to the second mask middle member (330b) and arranged to surround one side of the battery (160).

[0114] The second mask upper member (330a) may be made of an adhesive material or may be made in the form of a double-sided tape. The second mask upper member (330a) may be adhered to a portion (140_rc_bu) of the battery region (140_rc) of the support member (140). When observed in the z-axis direction or the -z-axis direction, the second mask upper member (330a) may overlap with the PCM (Bat_Pcm) of the battery (160) in at least a portion and the portion (140_rc_bu). The second mask upper member (330a) may include a second mask upper rear surface (330a_mf) disposed on one surface in the -z-axis direction. The second mask upper rear surface (330a_mf) may include a non-adhesive mask member or may include a state in which the adhesive material is removed. The upper rear surface (330a_mf) of the second mask may be positioned so as to face the PCM (Bat_Pcm) of the battery (160). Correspondingly, the PCM (Bat_Pcm) of the battery (160) may be in a non-adhesive state with the upper member (330a) of the second mask.

[0115] The second mask intermediate member (330b) may be disposed between the second mask upper member (330a) and the second mask lower member (330c). The second mask intermediate member (330b) may have the same or similar structure or material as the second mask upper member (330a) and the second mask lower member (330c). For example, the second mask intermediate member (330b) may connect the second mask upper member (330a) and the second mask lower member (330c). The second mask intermediate member (330b) may be composed of an adhesive material or may be composed in the form of a double-sided tape. Alternatively, the second mask intermediate member (330b) may be formed in a non-adhesive structure. The second mask intermediate member (330b) may be disposed to face one side of the PCM (Bat_Pcm) of the battery (160). The second mask intermediate member (330b) may include a mask break portion (330b_mm) formed on one side (e.g., a side facing the y-axis). The mask break portion (330b_mm) may be formed of a non-adhesive material, may include a non-adhesive mask member, or may be formed by removing an adhesive material applied to the second mask intermediate member (330b). The mask break portion (330b_mm) may be disposed between the battery upper side wall (141ba_s1) and the second mask intermediate member (330b), so that the second mask intermediate member (330b) and the battery upper side wall (141ba_s1) may maintain a non-adhesive state.

[0116] The second mask lower member (330c) may extend from one end of the second mask middle member (330b) and may be spaced apart from one side of the battery (160) (e.g., a side facing the -z axis), or at least a portion (or part) thereof may be adhered to one side of the battery (160). As an example, the second mask lower member (330c) may include a second mask lower rear surface (330b_mb) on which no separate adhesive material is applied (or on which no adhesive material is disposed, the adhesive material is removed, or a non-adhesive material is disposed). The fourth mask member (330) described above may have one side (e.g., the second mask upper member (330a)) adhered to one side of the support member (140), and the remaining portion surrounds the battery (160) and at least a portion thereof is adhered to the battery (160), thereby reducing the movement of the battery (160).

[0117] Referring to FIGS. 10 to 12, as in state 1201, the third type portable electronic device (103) may include at least a support member (140), a heat dissipation structure (120), a third type fixed structure (350) (e.g., a fourth mask member (330) and a third structure body (353)), and a battery (160). The heat dissipation structure (120) may be placed on one side (e.g., one side in the z-axis direction) of the support member (140). In this process, a second part of the heat dissipation structure (120) may be placed in a second structure placement area of ​​the support member (140) through which the front and back surfaces are penetrated, and the rear surface of the second part of the heat dissipation structure (120) may be placed so that it is exposed in the -z-axis direction of the support member (140). For example, the second part of the heat dissipation structure (120) may be placed so that at least a portion of it is exposed through the battery area (140_rc) of the support member (140).

[0118] As in state 1203, in a state where the second part of the heat dissipation structure (120) is exposed in the -z-axis direction through the battery area (140_rc), a part of the fourth mask member (330) (e.g., the second mask upper member (330a)) may be bonded to a part of the support member (140) (140_rc_bu) that does not overlap the second part of the heat dissipation structure (120) (e.g., a part of the support member where the PCM (Bat_Pcm) of the battery (160) is placed). The second mask upper member (330a) may be bonded to the bottom surface of the support member (140) between the battery upper side wall (141ba_s1) formed in the battery area (140_rc) and the second part of the heat dissipation structure (120).

[0119] As in state 1205, in a state where the second mask upper member (330a) of the fourth mask member (330) is adhered to an area of ​​the support member (140) that does not overlap the second part of the heat dissipation structure (120), the third structure body (353) can be adhered to the bottom surface of the battery area (140_rc) of the support member (140). The front and back surfaces of the third structure body (353) may be coated (or disposed) with an adhesive material (or a first adhesive material disposed on the front and a second adhesive material disposed on the back) or may be configured in the form of a double-sided adhesive tape. In the illustrated drawing, the third structure body (353) is illustrated as including a hole corresponding to the sensor arrangement area, but the present disclosure is not limited thereto. For example, the hole in which the sensor of the third structure body (353) is arranged may be removed, and an adhesive material (e.g., a first adhesive material disposed on the front and a second adhesive material disposed on the back) may be formed on the front and back surfaces in the same manner as the surrounding area. The third structure body (353) may include a first opening (e.g., the first opening (253op) of FIG. 8) that does not overlap with the second portion of the heat dissipation structure (120). Accordingly, when observed in the -z-axis direction, the third structure body (353) and the second portion of the heat dissipation structure (120) may be arranged so as not to overlap each other.

[0120] As in state 1207, the battery (160) can be stacked on the heat dissipation structure (120) and the third structure body (353) in a state where the second part of the heat dissipation structure (120) and the third structure body (353) are placed in the battery area (140_rc) of the support member (140) so as not to overlap. After the battery (160) is stacked, the fourth mask member (330) can be folded to wrap the surface of the battery (160) in the -z-axis direction. In this process, at least a part of the second mask middle member (330b) and the second mask lower member (330c) including the adhesive material can be adhered to the battery (160).

[0121] FIG. 13 is a drawing showing an example of at least a portion of a configuration of a fixed structure according to one embodiment.

[0122] Referring to FIGS. 1C to 13, a structure body (31) according to one embodiment may include a structure body of at least one type of fixed structure among the various types of fixed structures described above in FIGS. 1C to 12. As an example, the structure body (31) may include a first sheet (30in) (or first layer, first sheet layer, core material, first substrate, first plate), a first upper sheet (30out1) (or first outer sheet), and a first lower sheet (30out2) (or second outer sheet). The first sheet (30in) may include a sheet formed of a non-adhesive material. The first sheet (30in) may be composed of at least one material among various materials or a mixed material of a plurality of materials. Alternatively, in the illustrated drawing, a structure in which the first sheet (30in) is formed of one layer is exemplified, but it may also be composed of a plurality of layers. As an example, the first sheet (30in) may be composed of at least one of a polymer structure, a metal or non-metal mesh structure, a plastic, a metal or non-metal plate, a synthetic fiber or natural fiber structure, and a rubber structure. The first upper sheet (30out1) may be laminated on top of the first sheet (30in). The first upper sheet (30out1) may be composed of an adhesive material. Alternatively, the first upper sheet (30out1) may be composed of an adhesive tape. The first upper sheet (30out1) may have at least one of the same size and shape as the first sheet (30in). The first lower sheet (30out2) may be composed of an adhesive material or an adhesive tape similar to or identical to the first upper sheet (30out1). Alternatively, the first lower sheet (30out2) may be formed of the same material as the first upper sheet (30out1). The first lower sheet (30out2) may have the same size and shape as at least one of the first upper sheet (30out1) and the first sheet (30in).Meanwhile, in order to distinguish the positions of the sheets based on the drawing shown, the first upper sheet (30out1) and the first lower sheet (30out2) may be referred to as the lower sheet or the upper sheet may be referred to as the upper sheet at the time of application to the portable electronic device.

[0123] According to one embodiment, the first fixed structure (33) may be configured through a form in which at least a portion of the first upper sheet (30out1) of the structure body (31) described above is removed. As an example, the first fixed structure (33) may include a first sheet (30in), a second upper sheet (30out2), and a first lower sheet (30out2). The first sheet (30in) and the first lower sheet (30out2) may have at least one of the same shape, size, and material as the first sheet and the first lower sheet of the structure body (31) described above. The second upper sheet (30out2) may be arranged to cover the upper surface (or front surface) of the first sheet (30in), and may include a removal area (30out_rm) in which a portion is removed. The removal area (30out_rm) of the second upper sheet (30out2) may be named as at least one hole or opening on a side surface of the second upper sheet (30out2). The above removal area (30out_rm) may be formed, for example, in an area corresponding to at least one of the first mask member (151) and the second mask member (152) described in FIG. 1C. As an example, in the first type fixed structure (150) described in FIG. 1C, the first mask member (151) is excluded, and the removal area (30out_rm) corresponding to the first mask member (151) may be formed on the structure body (153). The removal area (30out_rm) of the structure body (153) faces the second part of the heat dissipation structure (120), and thus, the second part of the heat dissipation structure (120) may be disposed in a non-contact state with the structure body (153). The above-described removal area (30out_rm) may also be equally applied to an area where the second mask member (152) is disposed. As described above, in the embodiments of the present disclosure, the fixed structure may be constructed by removing at least a portion of the structure body, rather than adding a mask member to the structure body.

[0124] According to one embodiment, the second fixed structure (35) may include a structure in which a fifth mask member (30out_ma) is added on the structure body (31) described above. According to one embodiment, the second fixed structure (35) may include the structure body (31) described above and the fifth mask member (30out_ma). The structure body (31) includes a first sheet (30in), a first upper sheet (30out1), and a first lower sheet (30out2), and the fifth mask member (30out_ma) may be placed on the first upper sheet (30out1) (or the first lower sheet (30out2)). The area on which the fifth mask member (30out_ma) is placed may be any one of an area corresponding to the second part (120b) of the heat dissipation structure (120) described above in FIG. 1c, a sensor placement area (e.g., at least a part of an area in which a biometric sensor is placed). The fifth mask member (30out_ma) may include a material identical to or similar to that of the first sheet (30in). As an example, the fifth mask member (30out_ma) may include at least one of a polymer structure, a sponge structure, and a mesh structure. Alternatively, the fifth mask member (30out_ma) may include a sheet in which a polymer structure and a sponge structure are overlapped, or a sponge structure is formed of a polymer material.

[0125] The fixed structure (33, or 35) described in FIG. 13 may be applied to at least one of the first type fixed structure (150), the second type fixed structure (250), and the third type fixed structure (350) described above. Additionally or alternatively, in some embodiments, multiple fixed structures may be applied together. For example, a specific portable electronic device (400, 101, 102, 103) may be configured to include at least one of the first type fixed structure (150), the second type fixed structure (250), and the third type fixed structure (350).

[0126] FIG. 14 is a drawing showing an example of a structure of a fourth type portable electronic device according to an embodiment of the present invention.

[0127] Referring to FIG. 14, a fourth type portable electronic device (104) according to an embodiment may include, for example, a support member (140), a first type fixing structure (150), a battery (160), and a battery disassembly structure (190). State 1401 of FIG. 14 illustrates a state in which the battery disassembly structure (190) and the first type fixing structure (150) are mounted on the support member (140), and state 1403 is a drawing illustrating an example of a cross-section taken along the A4-A4` cutting line after the battery (160) is mounted on the first type fixing structure (150) in state 1401. Additionally or alternatively, the fourth type portable electronic device (104) may further include at least some of the components included in other types of portable electronic devices described above with reference to FIGS. 1A to 13.

[0128] The support member (140) may include a configuration identical or similar to the support member described above in FIG. 1C. For example, the support member (140) may include a battery area (140_rc) on which a battery (160) having at least a portion of a battery disassembly structure (190) installed is mounted. The battery area (140_rc) may include a bottom surface on which the battery (160) is mounted, and at least one side wall extending in the z-axis direction from an edge of the bottom surface (e.g., the battery top side wall (141ba_s1) of FIG. 10, or the illustrated battery side wall (141ba_s2)).

[0129] According to one embodiment, when looking at a cross-section taken along the A4-A4` cutting line for a battery (160) mounted on a battery area (140_rc), the fourth type portable electronic device (104) may include a first battery disassembly portion (191) disposed between the bottom surface of the support member (140) and the battery (160), a second battery disassembly portion (192) disposed between the battery side wall (141ba_s2) and one side surface (e.g., the side facing the -x axis) of the battery (160) while being connected to one end of the first battery disassembly portion (191), and a third battery disassembly portion (193) disposed on an upper surface (e.g., the side facing the -z axis or the front) of the battery (160) while being connected to one end of the second battery disassembly portion (192). The first battery disassembly portion (191) may not be adhered to the bottom surface of the support member (140), but may be adhered to a portion of the bottom surface of the battery (160) (e.g., a portion of the surface facing the z-axis). In this regard, an adhesive material or a double-sided adhesive tape may be disposed between the first battery disassembly portion (191) and the battery (160). The second battery disassembly portion (192) may be configured not to be adhered to the battery side wall (141ba_s2). The second battery disassembly portion (192) may be coated with an adhesive material or include a double-sided adhesive tape so as to be adhered to one side of the battery (160) (e.g., the side facing the -x-axis), but the present disclosure is not limited thereto. For example, the second battery disassembly portion (192) may be in a non-adhesive state with one side of the battery (160). At least a portion of the third battery disassembly portion (193) may be arranged to be in an adhesive state with an upper surface (e.g., a surface or front surface facing the -z axis, which may thus be a lower surface in the observation direction) of the battery (160), and in this regard, an adhesive material or double-sided tape may be arranged between the third battery disassembly portion (193) and the upper surface of the battery (160).As an example, the third battery disassembly portion (193) may be configured to have a non-adhesive state with the upper surface of the battery (160). At least a portion of the lower surface (e.g., the surface or the back surface facing the z-axis) of the battery (160) may be adhered to the bottom surface of the support member (140) by the first type fixing structure (150). In the above-described structure, the worker can release the adhesive state between the battery (160) and the first type fixing structure (150) by pulling the third battery disassembly portion (193) in one direction (e.g., the -z-axis direction) after gripping the third battery disassembly portion (193).

[0130] Meanwhile, in the above description, the battery disassembly structure (190) for releasing the first type fixing structure (150) from being adhered to one surface (e.g., the bottom surface) of the support member (140) is exemplified, but the present disclosure is not limited thereto. For example, the first type fixing structure (150) described as a configuration included in the fourth type portable electronic device (104) may be replaced with any one of the second type fixing structure (250) or the third type fixing structure (350) described above. In addition, the first type fixing structure (150) may also be in the form of any one of the fixing structures described above in FIG. 13.

[0131] In the above description, various types of portable electronic devices have been described as examples, but the fixing structures described for each type may be applied identically or similarly to other types of portable electronic devices. For example, a first type fixing structure (150) applied to a first type portable electronic device (101) may be applied in place of a second type fixing structure (250) described for a second type portable electronic device (102) or a third type portable electronic device (103).

[0132] As described above, a portable electronic device according to an embodiment may include a support member (140) including a first side (or a front side and a second side (or a rear side)), a display module (110) (or a display module positioned in the direction of the first side (or the front side of the first support member) of the first support member), a printed circuit board (181) and a battery (160) (or a printed circuit board and a battery at least a portion of which is positioned in the direction of the second side (or the rear side of the first support member) of the first support member), a heat dissipation structure (120) at least a portion of which is positioned between the first side of the support member and the display module, and a fixing structure (150) positioned between the support member and the battery. The heat dissipation structure includes a first part (120a) positioned in a first area (140ch1) of the support member, and a second part (120b) positioned in a second area (140ch2) (or an opening) of the support member, and At least a portion of the front and rear surfaces of the second region are opened, and the second portion can be exposed to the second surface of the support member through the opened second region. The fixed structure (150) can include an upper surface (150_f) including a non-bonded region that faces the second portion of the heat dissipation structure and is not in contact with the second portion, and a lower surface (150_b) including a lower bonded region that is in contact with the battery.

[0133] According to one embodiment, a portable electronic device characterized in that an air gap is formed between at least a portion of the fixed structure and the second portion of the heat dissipation structure.

[0134] According to one embodiment, the first region includes a groove corresponding to the size and shape of the first portion, and the second region (or opening) includes a first opening corresponding to the size and shape of the second portion.

[0135] According to one embodiment, at least one of a first adhesive member (131) disposed between the first part of the heat dissipation structure and a groove formed in the first region and a second adhesive member (132) disposed between the edge of the second part of the heat dissipation structure and the first region may be further included.

[0136] According to one embodiment, the fixed structure may include a structure body (153) including first and second adhesive materials arranged at the front and rear, and a first mask member (151) arranged at a portion of the structure body facing the second portion to form the non-adhesive area.

[0137] According to one embodiment, the first mask member may include at least one of a polymer structure, a metal mesh structure, a non-metal mesh structure, a plastic structure, a metal plate, a non-metal plate, a synthetic fiber structure, a natural fiber structure, and a rubber structure.

[0138] According to one embodiment, the first mask member may include a plurality of layers, and the plurality of layers may include a mesh structure layer and a polymer structure layer.

[0139] According to one embodiment, the fixed structure includes a structure body (33) including a first adhesive material (or a third adhesive material) disposed on the front side and a second adhesive material (or a fourth adhesive material) partially disposed on the rear side, and the non-adhesive area may include an area on the rear side where the second adhesive material is not disposed.

[0140] According to one embodiment, at least a portion between the upper surface and the second portion may form an air gap.

[0141] According to one embodiment, the display further includes a sensor (180bi) disposed below the display, and the sensor may be disposed in a second opening (140bi) formed in the support member.

[0142] According to one embodiment, the fixed structure (150) may include a structure body (153) including first and second adhesive materials (or fifth and sixth adhesive materials) disposed at the front and rear sides, a first mask member (151) disposed on the structure body to form the non-adhesive area, and a second mask member (152) disposed between the sensor and the structure body.

[0143] According to one embodiment, the fixed structure (250) may include a first adhesive material (or seventh adhesive material) disposed on the front side and a second adhesive material (or eighth adhesive material) disposed on the rear side, a structure body (253) including a first opening corresponding to the second portion of the heat dissipation structure, and a third mask member (230) forming the non-adhesive area.

[0144] According to one embodiment, the third mask member may include a first mask upper member (230a) arranged in a mask bonding area on the second surface of the support member, and a first mask lower member (230b) connected to the first mask upper member and forming the non-bonding area.

[0145] According to one embodiment, the first mask upper member may include a first adhesive material (or a ninth adhesive material) adhered to the mask bonding area, and the first mask lower member may include a second adhesive material (or a tenth adhesive material) disposed between one side of the battery and the second side of the support member and disposed in a direction facing the one side of the battery.

[0146] According to one embodiment, the fixed structure (350) may include a structure body (353) including first and second adhesive materials disposed at the front and rear sides and an opening formed at a position corresponding to the second portion of the heat dissipation structure, a second mask upper member (330a) disposed on one side of a second surface of the support member, a second mask intermediate member (330b) connected to the second mask upper member and facing at least a portion of a side surface of the battery, and a second mask lower member (330c) connected to the second mask intermediate member and placed on an exposed portion of the battery.

[0147] According to one embodiment, the second mask upper member may include an adhesive material disposed on a surface facing the support member.

[0148] According to one embodiment, the second mask intermediate member may be arranged to be in a non-adhesive state with the side wall of the battery area where the battery is mounted.

[0149] In one embodiment, at least a portion of the second mask lower member may be positioned in a non-adhesive state with one side and one exposed side of the battery.

[0150] According to one embodiment, the fixed structure (35) may include an inner core (30in), an upper sheet (30out1) formed on a first surface of the inner core and forming an upper adhesive region, a lower sheet (30out2) formed on a second surface of the inner core and forming a lower adhesive region, and a mask member (30out_ma) placed on the lower sheet and forming the non-adhesive region.

[0151] According to one embodiment, an air gap may be formed at least in part between the mask member and the second portion of the heat dissipation structure.

[0152] A portable electronic device according to one embodiment may be described as including a support member (140) including a front and a back, and including an opening (140ch2), a display module (110), a printed circuit board (181), a battery (160), and a heat dissipation structure (120) at least part of which is disposed between the front of the support member and the display module, and a double-sided adhesive member (150) that attaches the battery to a part of the back of the support member, depending on the definition of the surfaces or the definition method of the areas. In addition, the heat dissipation structure may include a first portion (120a) placed on a first area (140ch1) of the support member, and a second portion (120b) at least partially overlapping an opening of the support member, and the double-sided adhesive member may include a front surface (150_f) including a first adhesive area bonded to the support member and a non-adhesive area facing the second portion of the heat dissipation structure, and a rear surface (150_b) including a second adhesive area bonded to the battery.

[0153] In one embodiment, the size of the surface area of ​​the second adhesive region may be equal to the sum of the size of the surface area of ​​the non-adhesive region and the size of the surface area of ​​the first adhesive region.

[0154] The above non-adhesive area is formed by attaching a masking layer to the front surface of the double-sided adhesive member, and the masking layer is formed in a shape corresponding to an opening formed in the support member so as to maintain an air gap with the heat dissipation structure.

[0155] According to one embodiment, an air gap may be formed at least in part between the double-sided adhesive member and the second portion of the heat dissipation structure.

[0156] According to one embodiment, the first region may include a groove corresponding to the size and shape of the first portion, and the opening may correspond to the size and shape of the second portion.

[0157] According to one embodiment, the double-sided adhesive member may include a structure body (153) including first and second adhesive materials disposed on the front and back sides, and a first mask member (151) disposed on a portion of the structure body facing the second portion to form the non-adhesive area.

[0158] According to one embodiment, the double-sided adhesive member includes a structure body (33) including a first adhesive material disposed on a front surface of the double-sided adhesive member and a second adhesive material partially disposed on a rear surface of the double-sided adhesive member, and the non-adhesive area may include an area on the rear surface of the double-sided adhesive member where the second adhesive material is not disposed.

[0159] According to one embodiment, at least a portion of the front surface and the second portion may form an air gap.

[0160] According to one embodiment, the display module further includes a sensor (180bi) disposed at the bottom, and the sensor may be disposed in an opening (140bi) formed in the support member.

[0161] According to one embodiment, the double-sided adhesive member (150) may include a structure body (153) including first and second adhesive materials disposed on the front and back sides, a first mask member (151) disposed on the structure body to form the non-adhesive area, and a second mask member (152) disposed between the sensor and the structure body.

[0162] According to one embodiment, the double-sided adhesive member (250) may include a first adhesive material disposed on the front surface of the double-sided adhesive member, a second adhesive material disposed on the back surface of the double-sided adhesive member, a structure body (253) including the opening corresponding to the second portion of the heat dissipation structure, and a third mask member (230) forming the non-adhesive area.

[0163] According to one embodiment, the double-sided adhesive member (350) may include a structure body (353) including first and second adhesive materials disposed on the front and back sides and including the opening formed at a position corresponding to the second portion of the heat dissipation structure, a second mask upper member (330a) disposed on one side of the second surface of the support member, a second mask middle member (330b) connected to the second mask upper member and facing at least a portion of a side surface of the battery, and a second mask lower member (330c) connected to the second mask middle member and placed on an exposed portion of the battery.

[0164] According to one embodiment, the double-sided adhesive member (35) may include an inner core (30in), an upper sheet (30out1) formed on a first surface of the inner core and forming an upper adhesive area, a lower sheet (30out2) formed on a second surface of the inner core and forming a lower adhesive area, and a mask member (30out_ma) placed on the lower sheet and forming the non-adhesive area.

[0165] The order expressions such as “first,” “second,” “third,” or “fourth” described in the detailed description of the invention are given only to distinguish the corresponding configuration from other configurations, and may be omitted or changed to other terms without changing the meaning of the corresponding configuration.

[0166] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0167] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0168] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0169] Various embodiments of the present document may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., a portable electronic device). For example, a processor of the machine (e.g., a portable electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0170] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). 쪠 ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0171] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In portable electronic devices, A support member (140) including a front and a rear and including an opening (140ch2); Display module (110); Printed circuit board (181); Battery (160); and A heat dissipation structure (120) at least partially disposed between the front surface of the support member and the display module; A double-sided adhesive member (150) for attaching the battery to a portion of the rear surface of the support member is included; The above heat dissipation structure A first part (120a) placed on the first area (140ch1) of the above support member, A second portion (120b) at least partially overlapping with the opening of the support member; The above double-sided adhesive material A front surface (150_f) including a first adhesive region bonded to the support member and a non-adhesive region facing the second portion of the heat dissipation structure; A portable electronic device characterized by comprising a rear surface (150_b) including a second adhesive area bonded to the battery.

2. In paragraph 1, A portable electronic device, characterized in that the size of the surface area of ​​the second adhesive region is equal to the sum of the size of the surface area of ​​the non-adhesive region and the size of the surface area of ​​the first adhesive region.

3. In paragraph 1, The above non-adhesive area is formed by attaching a masking layer to the front surface of the double-sided adhesive member, A portable electronic device, characterized in that the masking layer is formed in a shape corresponding to an opening formed in the support member to form an air gap in at least a portion between the heat dissipation structures.

4. In paragraph 1, A portable electronic device characterized in that an air gap is formed in at least a portion between the double-sided adhesive member and the second portion of the heat-dissipating structure.

5. In paragraph 1, The first region includes a groove corresponding to the size and shape of the first portion; A portable electronic device, characterized in that the above opening corresponds to the size and shape of the second portion.

6. In paragraph 5, A first adhesive member (131) disposed between the first part of the heat-dissipating structure and the groove formed in the first area; and A portable electronic device characterized by further comprising at least one of a second adhesive member (132) disposed between an edge of a second portion of the heat-dissipating structure and the first region.

7. In paragraph 1, The above double-sided adhesive material A structural body (153) comprising first and second adhesive materials arranged at the front and rear; A portable electronic device characterized by including a first mask member (151) disposed on a portion of the structural body facing the second portion to form the non-adhesive region.

8. In paragraph 7, The above first mask absence, Contains multiple layers, A portable electronic device, wherein the plurality of layers include a mesh structure layer and a polymer structure layer.

9. In paragraph 1, The above double-sided adhesive material A structure body (33) including a first adhesive material disposed on the front side of the double-sided adhesive member and a second adhesive material partially disposed on the rear side of the double-sided adhesive member; A portable electronic device, characterized in that the non-adhesive area includes an area on the rear surface of the double-sided adhesive member where the second adhesive material is not disposed.

10. In paragraph 1, It further includes a sensor (180bi) arranged in an opening (140bi) formed in the lower part of the display module and the support member; The above double-sided adhesive member (150) A structural body (153) comprising first and second adhesive materials arranged at the front and rear; A first mask member (151) arranged on the above structure body to form the non-adhesive area; A portable electronic device characterized by comprising a second mask member (152) disposed between the sensor and the structure body.

11. In paragraph 1, The above double-sided adhesive member (250) A structure body (253) including a first adhesive material arranged on the front side of the double-sided adhesive member and a second adhesive material arranged on the rear side of the double-sided adhesive member, and the opening corresponding to the second part of the heat-dissipating structure; A portable electronic device characterized by comprising a third mask member (230) forming the non-adhesive region.

12. In paragraph 11, The third mask absence mentioned above is, A first mask upper member (230a) arranged in a mask bonding area on the rear side of the above support member; It includes a first mask lower member (230b) connected to the first mask upper member and forming the non-adhesive region; The first mask upper part is Comprising a first adhesive material adhered to the above mask adhesive area, The first mask lower member above A portable electronic device characterized by comprising a second adhesive material disposed between one side of the battery and the second side of the support member, the second adhesive material being disposed in a direction facing the one side of the battery.

13. In paragraph 1, The above double-sided adhesive member (350) A structure body (353) including first and second adhesive materials arranged at the front and rear, and including the opening formed at a position corresponding to the second portion of the heat-dissipating structure; A second mask upper member (330a) arranged on one side of the second surface of the above-mentioned support member; A second mask middle member (330b) connected to the second mask upper member and facing at least a portion of a side of the battery; A second mask lower member (330c) connected to the second mask intermediate member and placed on an exposed portion of the battery; The second mask upper part is Including an adhesive material disposed on a surface facing the support member, The above second mask intermediate member The battery is positioned so as to have a non-adhesive state with the side wall of the battery area where the battery is installed, At least a portion of the lower member of the second mask A portable electronic device characterized in that the exposed surface and one surface of the battery are arranged in a non-adhesive state.

14. In paragraph 1, The above double-sided adhesive member (35) is Inner core (30in); An upper sheet (30out1) formed on the first surface of the inner core and forming an upper adhesive area; A lower sheet (30out2) formed on the second surface of the inner core and forming a lower adhesive area; A portable electronic device characterized by comprising a mask member (30out_ma) placed on the lower sheet and forming the non-adhesive area.

15. In paragraph 14, A portable electronic device characterized in that an air gap is formed between the mask member and the second portion of the heat dissipation structure.

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