Probe card for testing semiconductor device

Abstract

This probe card for testing the electrical characteristics of a semiconductor device may comprise: a base; a circuit board which is positioned at one side of the base; a first probe part which includes a first needle electrically connected to a first position of the circuit board and supported by a first support and includes a second needle electrically connected to a second position of the circuit board, spaced apart from the first position, and supported by a second support; a second probe part which is positioned to adjoin the first probe part on the base, includes a third needle electrically connected to a third position of the circuit board and supported by a third support, and includes a fourth needle electrically connected to a fourth position of the circuit board, spaced apart from the third position, and supported by a fourth support; and a position adjustment part which adjusts a relative position between the first probe part and the second probe part on the base.

Description

Probe card for testing semiconductor devices

[0001] The present disclosure relates to a probe card for testing electrical characteristics of a semiconductor device.

[0002] The Electrical Die Sorting (EDS) process is an electrical characteristic inspection performed between the FAB process and the packaging process that forms the final product. This electrical characteristic inspection of semiconductor devices (e.g., integrated circuit chips) allows for verification that individual semiconductor devices (chips) have reached the desired quality level.

[0003] Specifically, electrical characteristic inspection is used to check whether each semiconductor device implemented on the wafer reaches the desired quality level. Specifically, electrical characteristic inspection determines whether each semiconductor device implemented on the wafer meets the desired electrical characteristic specifications, resulting in a pass / fail decision. Failing chips are marked with a specific inking mark. Chips deemed defective in this way are excluded from subsequent processes, thereby improving manufacturing efficiency.

[0004] Thus, the EDS process, as the final test (where passed chips are packaged), is required to increase semiconductor yield. Semiconductor yield is calculated as the percentage of prime good chips produced relative to the maximum number of chips designed for a single wafer, and is directly linked to semiconductor productivity.

[0005] This EDS process can be performed by contacting a probe card connected to a test device with a wafer on which semiconductor devices are manufactured. The probe card's numerous microscopic pins (needles) contact the pads of individual semiconductor devices manufactured on the wafer, transmitting electricity. This signal can then be used to identify defective chips.

[0006] Typically, semiconductor devices are placed in a chip-on-flim (COF) format. Multiple semiconductor devices are positioned on a film and continuously fed onto a probe card for inspection. However, shifts in the relative positions of the semiconductor devices on the film can occur. For example, individual semiconductor devices may not be positioned in a continuous, linear fashion on the film, but rather may be misaligned from their intended positions.

[0007] In such cases, the probe card's needle may not make precise contact with the pad area of ​​the semiconductor device. If this occurs, inspection of the semiconductor device may become impossible.

[0008] Therefore, solutions to these problems are emerging.

[0009] According to one embodiment of the present disclosure, there is provided a probe card for testing semiconductor devices that enables stable and simultaneous contact with and testing of a plurality of semiconductor devices.

[0010] According to one embodiment of the present disclosure, there is provided a probe card for testing semiconductor devices, which enables inspection to be performed by contacting a needle at an accurate position when a shift occurs between semiconductor devices supplied for inspection.

[0011] According to one embodiment of the present disclosure, a probe card for testing a semiconductor device may include: a base; a circuit board positioned on one side of the base; a first probe portion including a first needle electrically connected to a first position of the circuit board and supported by a first support portion, and a second needle electrically connected to a second position spaced apart from the first position of the circuit board and supported by a second support portion; a second probe portion including a third needle electrically connected to a third position of the circuit board and supported by a third support portion, and a fourth needle electrically connected to a fourth position spaced apart from the third position of the circuit board and supported by a fourth support portion; and a position adjusting portion for adjusting relative positions of the first probe portion and the second probe portion on the base.

[0012] According to one embodiment of the present disclosure, a probe card for testing a semiconductor device may include: a base; a circuit board positioned on one side of the base; first support portions connected to each other to form a ring shape and positioned at a position spaced apart from each other; a first probe portion including a first needle electrically connected to a first position of the circuit board and supported by the first support portion; a second support portion positioned adjacent to the first probe portion on the base, connected to each other to form a ring shape and positioned at a position spaced apart from each other; a second probe portion including a second needle electrically connected to a second position of the circuit board and supported by the second support portion; and a position adjusting portion for adjusting relative positions of the first probe portion and the second probe portion on the base.

[0013] A method for performing inspection of a semiconductor device according to one embodiment of the present disclosure may include a step of recognizing an alignment state of the semiconductor device using a supply unit of the semiconductor device having a camera and the probe card, the step of determining whether a shift has occurred between the first semiconductor device and the second semiconductor device through the recognition process; a step of driving the position adjusting unit according to the occurrence of the shift; and a step of contacting the first needle and the second needle with the first semiconductor device and the second semiconductor device while moving at least one of the first probe unit and the second probe unit according to the amount of shift between the first semiconductor device and the second semiconductor device.

[0014] According to an exemplary embodiment of the present disclosure, the following effects are achieved.

[0015] First, according to one embodiment of the present disclosure, a plurality of semiconductor devices can be stably contacted and tested simultaneously.

[0016] According to one embodiment of the present disclosure, a plurality of semiconductor devices can be stably contacted and tested simultaneously.

[0017] According to one embodiment of the present disclosure, when a shift occurs between semiconductor devices supplied for inspection, inspection can be performed by having the needle contact the correct position.

[0018] Furthermore, according to another embodiment of the present disclosure, there are additional technical effects not mentioned herein. Those skilled in the art will understand this from the context of the specification and drawings.

[0019] FIG. 1 is a schematic perspective view showing a probe card according to one embodiment of the present disclosure.

[0020] FIG. 2 is a perspective view showing the configuration of a probe part of a probe card according to one embodiment of the present disclosure.

[0021] FIG. 3 is a partial cross-sectional view of a probe card according to one embodiment of the present disclosure.

[0022] FIG. 4 is an exploded perspective view showing a portion of a probe card according to one embodiment of the present disclosure.

[0023] FIG. 5 is a diagram showing an example of a semiconductor device inspected by a probe card according to one embodiment of the present disclosure.

[0024] Figures 6 to 9 are diagrams showing relative positional movement of semiconductor devices.

[0025] Fig. 10 is a cross-sectional view showing the configuration of a probe card according to a comparative example.

[0026] Figures 11 and 12 are schematic diagrams explaining the contact state of a semiconductor device of a probe card according to a comparative example.

[0027] Fig. 13 is a block diagram showing a semiconductor device inspection system using a probe card according to an embodiment of the present disclosure.

[0028] FIG. 14 is a flowchart for explaining a process of performing inspection of a semiconductor device using a probe card according to an embodiment of the present disclosure.

[0029] FIG. 15 and FIG. 16 are cross-sectional schematic diagrams for explaining a process of performing inspection of a semiconductor device using a probe card according to an embodiment of the present disclosure.

[0030] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be assigned the same reference numbers, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably solely for the convenience of writing the specification, and do not in themselves have distinct meanings or roles.

[0031] In addition, when describing the embodiments disclosed in this specification, if it is determined that a detailed description of a related known technology may obscure the gist of the embodiments disclosed in this specification, the detailed description is omitted.

[0032] In addition, it should be noted that the attached drawings are only intended to facilitate easy understanding of the embodiments disclosed in this specification, and should not be construed as limiting the technical ideas disclosed in this specification by the attached drawings.

[0033] Furthermore, although each drawing is described for convenience of explanation, it is also within the scope of the present disclosure that a person skilled in the art may implement another embodiment by combining at least two or more drawings.

[0034] Additionally, when an element such as a layer, region or substrate is referred to as existing "on" another element, it will be understood that this may be directly on the other element, or that there may be intermediate elements in between.

[0035] Although terms like "first" and "second" are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, it should be understood that a first component referred to below may also be a second component within the technical scope of the present disclosure.

[0036] Fig. 1 is a schematic perspective view showing a probe card according to one embodiment of the present disclosure. Fig. 2 is a perspective view showing the configuration of a probe portion of a probe card according to one embodiment of the present disclosure. Fig. 3 is a partial cross-sectional view of a probe card according to one embodiment of the present disclosure.

[0037] Referring to FIG. 1, a probe card (Probe card; 10) according to one embodiment of the present disclosure can test the electrical characteristics of a semiconductor device (Semiconductor device; 50; see FIG. 5). For example, an Electrical Die Sorting (EDS) process can be performed using the probe card (10).

[0038] Here, the semiconductor device (50) is, for example, an integrated circuit chip (IC chip), and the semiconductor device (50) includes pad areas (53, 54, 55, 56; see FIG. 5) that enable electrical contact. The probe card (10) can contact the pad areas (53, 54, 55, 56) of the semiconductor device (50) to inspect the characteristics of the semiconductor device (50).

[0039] Such a probe card (Probe card; 10) may include a base (300) and a circuit board (200) located on one side of the base (300).

[0040] In addition, the probe card (10) may include a first probe portion (110), a second probe portion (120), and a position adjustment portion (400) for adjusting the relative positions of the first probe portion (110) and the second probe portion (120) on the base (300).

[0041] The circuit board (200) is, for example, a printed circuit board (PCB), and can be electrically connected to a first probe unit (110) and a second probe unit (120) that can contact and test a semiconductor device (50). The circuit board (200) can be equipped with a circuit element that can test the electrical characteristics of the semiconductor device (50). Hereinafter, specific details regarding the circuit board (200) are omitted.

[0042] The first probe portion (110) may include a first needle (130) electrically connected to a first position of the circuit board (200) and supported by a first support portion (111; spider).

[0043] This first probe portion (110) may further include a second needle (140) electrically connected to a second position spaced apart from the first position of the circuit board (200) and supported by a second support portion (112; spider).

[0044] Meanwhile, the second probe unit (120) may be positioned adjacent to the first probe unit (110) on the base (300). For example, the second probe unit (120) may be positioned a certain distance (G3; see FIG. 15) away from the first probe unit (110) on the base (300).

[0045] This second probe (120) may include a third needle (131) electrically connected to a third position of the circuit board (200) and supported by a third support (121; spider).

[0046] This second probe (120) may further include a fourth needle (141) electrically connected to a fourth position spaced apart from the third position of the circuit board (200) and supported by a fourth support (122; spider).

[0047] Although not specifically illustrated in the drawing, for example, the first probe portion (110) may have only a first needle (130) supported by the first support portion (111), and the second probe portion (120) may have only a third needle (131) supported by the third support portion (121). That is, as an exemplary embodiment, the probe portions (110, 120) may each include only one needle (130, 131).

[0048] In the probe card (10), the base (300) may be formed in a plate shape. A circuit board (200) may be positioned on one side of the base (300). For example, the support (300) may be positioned on one side of the main plane of the circuit board (200), and the first probe unit (110) and the second probe unit (120) may be positioned on the other side of the main plane of the circuit board (200). As an exemplary embodiment, the circuit board (200) may be provided in a circular shape.

[0049] Referring to FIG. 3, for example, the first support (111) and the second support (112) may have the same slope with respect to the main plane of the base (300). On the other hand, as another example, the first support (111) and the second support (112) may have different slopes with respect to the main plane of the base (300).

[0050] Meanwhile, the first needle (130) and the second needle (140) may be provided facing each other in a direction opposite to the third needle (131) and the fourth needle (141), respectively.

[0051] Accordingly, the first support portion (111) and the second support portion (112) may have a certain inclination with respect to the circuit board (200), and the third support portion (121) and the fourth support portion (122) may also have a certain inclination with respect to the circuit board (200). At this time, the inclination angles of the first support portion (111) and the second support portion (112) may have an inclination angle that faces the third support portion (121) and the fourth support portion (122). For example, the inclination angles of the first support portion (111) and the second support portion (112) may be symmetrical with the inclination angles of the third support portion (121) and the fourth support portion (122) with respect to the boundary line of the first probe portion (110) and the second probe portion (120).

[0052] As mentioned above, the position adjustment unit (400) can adjust the relative positions of the first probe unit (110) and the second probe unit (120) on the base (300).

[0053] As an exemplary embodiment, the position adjustment unit (400) can adjust the relative position of the second probe unit (120). For example, the second probe unit (120) can be positioned on the position adjustment unit (400).

[0054] In this case, the first probe part (110) may be positioned on a height reinforcing part (310) having a height corresponding to the position adjusting part (400). For example, the first support part (111) and the second support part (112) may be positioned on the height reinforcing part (310).

[0055] As an exemplary embodiment, the first support (111) and the second support (112) may be positioned on the first support (113) and the second support (114), respectively, which are positioned on the height reinforcement (310). That is, the first support (111) may be positioned on the first support (113) which is positioned on the height reinforcement (310), and the second support (112) may be positioned on the second support (114) which is positioned on the height reinforcement (310).

[0056] In addition, as an exemplary embodiment, the third support (121) and the fourth support (122) may be positioned on the third support (123) and the fourth support (124), respectively, which are positioned on the position adjusting unit (400). That is, the third support (121) may be positioned on the third support (123) which is positioned on the position adjusting unit (400), and the fourth support (122) may be positioned on the fourth support (124) which is positioned on the position adjusting unit (400).

[0057] The circuit board (200) may be positioned between each of the supports (113, 114, 123, 124). For example, referring to FIG. 3, in terms of cross-sectional height, the circuit board (200) may be positioned between the height reinforcing member (310) and the first support member (111) and / or the second support member (112). In addition, in terms of cross-sectional height, the circuit board (200) may be positioned between the position adjusting member (400) and the third support member (121) and / or the fourth support member (122).

[0058] As an exemplary embodiment, the first support (113) and the second support (114) may have a ring shape that is integrally connected. Meanwhile, as an exemplary embodiment, the first support portion (111) and the second support portion (112) may have a ring shape that is integrally connected.

[0059] Referring to FIGS. 1 and 2, the first support portion (111) and the second support portion (112) may have a rectangular ring shape that is connected to each other. For example, the first support portion (111) and the second support portion (112) may be formed on a rectangular ring-shaped support body (113, 114) to form an inclined surface.

[0060] The first needle (130) and the second needle (140) may be provided on the inclined surfaces of the first support member (111) and the second support member (112) by being attached by an adhesive, for example, an adhesive such as epoxy.

[0061] Meanwhile, as an exemplary embodiment, the third support (123) and the fourth support (124) may have a ring shape that is integrally connected. Meanwhile, as an exemplary embodiment, the third support (121) and the fourth support (122) may have a ring shape that is integrally connected.

[0062] However, this is an exemplary embodiment, and as another example, the first support (113) and the third support (123) may be integrally connected to have a ring shape. In this case, the second support (112) and the fourth support (124) may be integrally connected to have a ring shape of a smaller size. In this case, similarly, the first support (111) and the third support (121) may be integrally connected to have a ring shape. In this case, the second support (112) and the fourth support (122) may be integrally connected to have a ring shape of a smaller size.

[0063] Referring to FIGS. 1 and 2, the third support (121) and the fourth support (122) may have a ring shape that is connected to each other. For example, the third support (121) and the fourth support (122) may be formed on a rectangular ring-shaped support (123, 124) to form an inclined surface. Although this ring shape is illustrated as a rectangular ring shape, this ring shape may also have a circular, oval, or other shape.

[0064] The third needle (131) and the fourth needle (141) may be provided on the inclined surfaces of the third support (121) and the fourth support (122) by being attached by an adhesive, for example, an adhesive such as epoxy.

[0065] Here, at least one of the first needle (130), the second needle (140), the third needle (131), and the fourth needle (141) may include a plurality of wires, one end of which is connected to the contact portion (210) of the circuit board (200) and the other end of which has a probe (needle) shape. In this way, at least one of the first needle (130), the second needle (140), the third needle (131), and the fourth needle (141) may be provided with a plurality of wires formed into a bundle.

[0066] As an exemplary embodiment, the position adjustment unit (400) may include a two-way stage that moves the position of the second probe unit (120) in two mutually perpendicular directions. As another example, the position adjustment unit (400) may include a two-way stage that adjusts the position of the first probe unit (110). Meanwhile, separate position adjustment units (400) that adjust the positions of the first probe unit (110) and the second probe unit (120) may be provided, respectively. Hereinafter, an embodiment in which the position adjustment unit (400) adjusts the position of the second probe unit (120) will be described in detail.

[0067] FIG. 4 is an exploded perspective view showing a portion of a probe card according to one embodiment of the present disclosure.

[0068] Referring to FIG. 4, the position adjustment unit (400) may include a support plate (410), a moving table (420) that is movably installed on the support plate (410), and a motor (430) that drives the moving table (420).

[0069] In this way, by driving the motor (430), the moving table (420) can be moved in two directions that are perpendicular to each other on the support plate (410). The moving table (420) can be moved in a first direction (for example, the X direction) in which the first probe unit (110) and the second probe unit (120) come closer or farther away from each other, and in a second direction (for example, the Y direction) that is perpendicular to the first direction. Accordingly, the motor (430) may include a first motor (431; X-axis motor; see FIG. 13) that drives the X-direction movement and a second motor (432; Y-axis motor; see FIG. 13) that drives the Y-direction movement.

[0070] This motor (430) can be driven by a separate processor (processor 2; 440; see FIG. 13). For example, a shift may occur between the two semiconductor devices (51, 52) being inspected by being electrically connected to the first probe unit (110) and the second probe unit (120), and in this case, the position of the second probe unit (120) is moved by driving the motor (430) so that the first probe unit (110) and the second probe unit (120) can contact the exact positions of the two semiconductor devices (51, 52). This will be described in detail later with reference to the drawings.

[0071] FIG. 5 is a diagram showing an example of a semiconductor device inspected by a probe card according to one embodiment of the present disclosure.

[0072] Referring to FIG. 5, a semiconductor device (50) can be supplied in the form of a COF (chip on film) on a film (57) to a location where a probe card (10) is positioned.

[0073] The semiconductor device (50) may include a first semiconductor device (51) and a second semiconductor device (52) positioned adjacent to each other on a film (57). These semiconductor devices (50) may be continuously supplied on the film (57) to a location where the probe card (10) is positioned.

[0074] The first semiconductor device (51) may include first and second pad regions (53, 54) capable of electrical contact, and the second semiconductor device (52) may include first and second pad regions (55, 56) capable of electrical contact.

[0075] The probe card (10) can contact the pad areas (53, 54, 55, 56) of the semiconductor device (50) to inspect the characteristics of the semiconductor device (50).

[0076] In this way, the semiconductor device (50) includes a first semiconductor device (51) and a second semiconductor device (52), and the first semiconductor device (51) and the second semiconductor device (52) can be in contact with the first probe portion (110) and the second probe portion (120), respectively.

[0077] The first semiconductor device (51) and the second semiconductor device (52) may be supplied simultaneously as a pair. For example, the first semiconductor device (51) and the second semiconductor device (52) may be supplied as a single unit. The first semiconductor device (51) and the second semiconductor device (52) may include a first contact area (A), a second contact area (B), and a third contact area (C).

[0078] However, a shift may occur in the positions of the first semiconductor device (51) and the second semiconductor device (52) on the film (57). For example, the positions of the first semiconductor device (51) and the second semiconductor device (52) on the film (57) are not formed in a continuous line, and the position between the first semiconductor device (51) and the second semiconductor device (52) may be shifted from the appropriate position.

[0079] Figures 6 to 9 are diagrams showing relative positional movement of semiconductor devices.

[0080] For example, as shown in Fig. 6, the positions between the first semiconductor device (51) and the second semiconductor device (52) may be moved away from each other. For example, the second semiconductor device (52) may be shifted in the X direction (X+).

[0081] As another example, as shown in FIG. 7, the positions between the first semiconductor device (51) and the second semiconductor device (52) may become closer to each other. For example, the second semiconductor device (52) may be shifted in the -X direction (X-).

[0082] Meanwhile, as an example, as shown in Fig. 8, the position between the first semiconductor device (51) and the second semiconductor device (52) may be shifted in one direction with respect to the direction of travel (supply direction). For example, the second semiconductor device (52) may be shifted in the -Y direction (Y-).

[0083] As another example, as shown in FIG. 9, the position between the first semiconductor device (51) and the second semiconductor device (52) may be shifted in a different direction with respect to the propagation direction (supply direction). For example, the second semiconductor device (52) may be shifted in the +Y direction (Y+).

[0084] Fig. 10 is a cross-sectional view showing the configuration of a probe card according to a comparative example.

[0085] Hereinafter, a process of inspecting a semiconductor device (50) using a probe card (1) according to this comparative example in the case where a shift occurs in the positions of the first semiconductor device (51) and the second semiconductor device (52) will be briefly described. First, the probe card (1) according to the comparative example will be briefly described.

[0086] Referring to FIG. 10, a probe card (Probe card; 1) according to a comparative example may include a base (30) and a circuit board (20) located on one side of the base (30).

[0087] In addition, the probe card (1) may include a first needle (13) supported by a first support member (11; spider) and a second needle (14) supported by a second support member (12). The first support member (11), the second support member (12), the first needle (13), and the second needle (14) may be provided at two locations adjacent to each other on the base (30).

[0088] At this time, the first support (11), the second support (12), the first needle (13), and the second needle (14) can be provided symmetrically to each other at adjacent positions.

[0089] The base (30) may include a first support (31) and a second support (32) that support a first support (11) and a second support (12), respectively.

[0090] The first needle (13) and the second needle (14) can be positioned by being attached to the first support member (11) and the second support member (12), respectively, using an adhesive such as epoxy, with one side connected to the connection member (21) on the circuit board (20).

[0091] Figures 11 and 12 are schematic diagrams explaining the contact state of a semiconductor device of a probe card according to a comparative example.

[0092] First, when the relative positions of the first semiconductor device (51) and the second semiconductor device (52) are normal, as shown in FIG. 11, the first needle (13) and the second needle (14) can normally contact the first pad area (53 / 55, or the second pad area; 54 / 56) of the first semiconductor device (51) and the second semiconductor device (52), respectively.

[0093] For example, the first needle (13) can contact the first pad area (53) of the first semiconductor device (51) having the height H and the width W at point P1 with a radius (R), and the second needle (14) can contact the first pad area (55) of the second semiconductor device (52) having the height H and the width W at point P2 with a radius (R). There is a certain clearance (D) between the radius (R) and the pad area (55), so that a slight shift in the relative positions of the first semiconductor device (51) and the second semiconductor device (52) can be accommodated.

[0094] In this way, when the relative positions of the first semiconductor device (51) and the second semiconductor device (52) are normal, a distance of G1 occurs between the first pad areas (53, 55), and the first needle (13) and the second needle (14) can normally contact the first pad areas (53, 55) of the first semiconductor device (51) and the second semiconductor device (52), respectively.

[0095] Meanwhile, as another example, when a shift occurs in the relative positions of the first semiconductor device (51) and the second semiconductor device (52), for example, when the relative positions of the first semiconductor device (51) and the second semiconductor device (52) become closer to each other and the distance between the first pad areas (53, 55) becomes close to G2, as illustrated in FIG. 12, at least one of the first needle (13) and the second needle (14) may not normally contact the first pad areas (53 / 55, or the second pad areas; 54 / 56) of the first semiconductor device (51) and the second semiconductor device (52).

[0096] For example, the first needle (13) can contact the first pad area (53) of the first semiconductor device (51) having the height H and the width W at the point P1 with a radius (R), but the relative positions of the first semiconductor device (51) and the second semiconductor device (52) are close to each other, so the second needle (14) cannot contact the first pad area (55), and the second needle (14) can contact the point P2 at a position outside the first pad area (55) of the second semiconductor device (52) having the height H and the width W. In such a case, the semiconductor device (50) may not be inspected normally.

[0097] However, according to the embodiment of the present disclosure, even when a shift occurs in the relative positions of the first semiconductor device (51) and the second semiconductor device (52), stable contact can be made between the probe device (10) and the semiconductor device (50), thereby enabling inspection of the semiconductor device (50). Hereinafter, this process will be described in detail with reference to the drawings.

[0098] Fig. 13 is a block diagram illustrating a semiconductor device inspection system using a probe card according to an embodiment of the present disclosure. Fig. 14 is a flowchart illustrating a process for performing inspection of a semiconductor device using a probe card according to an embodiment of the present disclosure. Figs. 15 and 16 are cross-sectional schematic diagrams illustrating a process for performing inspection of a semiconductor device using a probe card according to an embodiment of the present disclosure.

[0099] Referring to FIG. 13, a semiconductor device inspection system using a probe card may include a supply unit (Handler; 500) that supplies a semiconductor device (50), and a probe card (Probe card; 10) that performs inspection by contacting the semiconductor device (50) supplied by the supply unit (500).

[0100] For example, the probe card (10) may be mounted on a part of the supply unit (500). For example, when the semiconductor device (50) is supplied using the supply unit (500), the probe card (10) may be moved in the vertical direction to come into contact with the semiconductor device (50) or move away from the semiconductor device (50).

[0101] The supply unit (500) may include a camera (Camera; 510) capable of monitoring the status of the semiconductor device (50). In addition, the supply unit (500) may include a contact unit (Contact; 520) for transporting the probe card (10) to contact the semiconductor device (50). In addition, the supply unit (500) may include a processor (Processor 1; 530) capable of controlling the camera (510) and the contact unit (520).

[0102] As described above, the probe card (10) may include a motor (430) that drives the moving table (420) of the position adjustment unit (400). The motor (430) may include a first motor (431; X-axis motor) that drives X-direction movement and a second motor (432; Y-axis motor) that drives Y-direction movement.

[0103] This motor (430) can be driven by a separate processor (processor 2; 440). For example, a shift may occur between the two semiconductor devices (51, 52) being inspected by being electrically connected to the first probe unit (110) and the second probe unit (120), and in this case, the position of the second probe unit (120) is moved by driving the motor (430) so that the first probe unit (110) and the second probe unit (120) can come into contact with the exact positions of the two semiconductor devices (51, 52).

[0104] Hereinafter, with reference to FIGS. 14 to 16, a process for performing inspection of a semiconductor device (50) using a probe card (10) according to an embodiment of the present disclosure will be described.

[0105] Referring to Fig. 14, first, the alignment state of the semiconductor device (50) can be recognized using the camera (510) provided in the supply unit (500). For example, the semiconductor device (50) can be continuously supplied as a single unit with two semiconductor devices (51, 52).

[0106] The process performed here can be performed by at least one of the processor (530) of the supply unit (500) and the processor (440) of the probe card (10).

[0107] At this time, the sequential alignment values ​​of the semiconductor device (chip; 50) can be recognized and recorded using a camera (510) (S10). These sequential alignment values ​​of the semiconductor device (chip; 50) can be stored in a separate processor or memory.

[0108] In this way, when the sequential alignment value of the semiconductor device (chip; 50) is recognized using the camera (510), it is possible to check whether a shift has occurred in the semiconductor device (50) (S20). For example, it is possible to check whether a shift has occurred between the first semiconductor device (51) and the second semiconductor device (52) included in the semiconductor device (50).

[0109] Thereafter, when the semiconductor device (50) is supplied to a predetermined position of the supply unit (500) where the probe card (10) is located, if a shift occurs between the first semiconductor device (51) and the second semiconductor device (52) included in the semiconductor device (50), at least one of the first motor (431; X-axis motor) and the second motor (432; Y-axis motor) can be driven according to this shift (S30).

[0110] Then, the position adjustment unit (400) operates in this manner to move the second probe unit (120) between the first semiconductor device (51) and the second semiconductor device (52) according to the shift amount, and the probe card (10) and the semiconductor device (50) can be brought into contact (S40). For example, the probe card (10) can be moved toward the semiconductor device (50) to bring the needles (130, 140, 131, 141) and the pad areas (53, 54, 55, 56) of the semiconductor device (50) into contact with each other, thereby inspecting the semiconductor device (50).

[0111] If no shift occurs between the first semiconductor device (51) and the second semiconductor device (52), inspection can be performed by bringing the probe card (10) and the semiconductor device (50) into contact without driving the first motor (431; X-axis motor) and the second motor (432; Y-axis motor).

[0112] For example, when a shift occurs in a direction in which the first semiconductor device (51) and the second semiconductor device (52) become closer to each other, for example, when the second semiconductor device (52) is turned in the -X-axis direction, as illustrated in FIG. 15, the X-axis motor (431) can be driven in one direction so that when the first probe unit (110) and the second probe unit (120) are spaced apart by G3 in a normal state, the moving table (420) of the position control unit (400) can be driven so that the space between the first probe unit (110) and the second probe unit (120) becomes G4 (G3>G4) corresponding to the shift amount.

[0113] Another example, when the first semiconductor device (51) and the second semiconductor device (52) shift in a direction away from each other, for example, when the second semiconductor device (52) is turned in the +X-axis direction, as shown in FIG. 16, by driving the X-axis motor (431) in the other direction, when the first probe part (110) and the second probe part (120) are at a G3 interval in a normal state, the interval between the first probe part (110) and the second probe part (120) is G5 (G3) corresponding to the shift amount. <G5)가 되도록 위치조절부(400)의 무빙테이블(420)을 구동할 수 있다.

[0114] By this process, the first semiconductor device (51) and the second semiconductor device (52) can be brought into precise contact with the pad areas (53, 54, 55, 56) of the first probe part (110) and the second probe part (120), respectively, so that the characteristics of the semiconductor device (50) can be inspected.

[0115] The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present disclosure, and are not necessarily limited to just one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment can be combined or modified in other embodiments by those skilled in the art to which the embodiments pertain. Therefore, the contents related to such combinations and modifications should be construed as being included within the scope of the present disclosure.

[0116] In addition, although the above description focuses on examples, these are merely examples and do not limit the present disclosure. Those skilled in the art to which the present disclosure pertains will appreciate that various modifications and applications not exemplified above are possible without departing from the essential characteristics of the present embodiments. For example, each component specifically shown in the embodiments can be modified and implemented. In addition, differences related to such modifications and applications should be interpreted as being included within the scope of the present disclosure as defined in the appended claims.

[0117] According to the present disclosure, a probe card for testing the characteristics of a semiconductor device can be provided.

Claims

1. In a probe card for testing semiconductor devices, base; A circuit board located on one side of the above base; A first probe portion including a first needle electrically connected to a first location on the circuit board and supported by a first support member, and a second needle electrically connected to a second location spaced from the first location on the circuit board and supported by a second support member; A second probe portion including a third needle positioned adjacent to the first probe portion on the base, electrically connected to a third position of the circuit board and supported by a third support portion, and a fourth needle electrically connected to a fourth position spaced apart from the third position of the circuit board and supported by a fourth support portion; and A position adjusting unit for adjusting the relative positions of the first probe and the second probe on the base. Probe card.

2. In the first paragraph, the position adjustment part Support plate; A moving table that is movably installed on the above support plate; and Including a motor that drives the above moving table Probe card.

3. In the first paragraph, the position adjustment part adjusts the position of the second probe part. Probe card.

4. In the first paragraph, the first probe is located on a height reinforcing member having a height corresponding to the position adjusting member. Probe card.

5. In the fourth paragraph, the first support is located on the first support located on the height reinforcement, and the second support is located on the second support located on the height reinforcement. Probe card.

6. In the fifth paragraph, the first support and the second support have a ring shape that is integrally connected. Probe card.

7. In the first paragraph, the first support member and the second support member have a certain incline with respect to the circuit board. Probe card.

8. In the first paragraph, the third support member is located on the third support member located on the position-adjusting member, and the fourth support member is located on the fourth support member located on the position-adjusting member. Probe card.

9. In the 8th paragraph, the third support and the fourth support have a ring shape that is integrally connected. Probe card.

10. In a probe card for testing semiconductor devices, base; A circuit board located on one side of the above base; A first probe part including a first support part that is connected to each other to form a ring shape and is positioned at a position spaced from each other, and a first needle that is electrically connected to a first position of the circuit board and supported by the first support part; A second probe part including a second support part positioned adjacent to the first probe part on the base, connected to each other to form a ring shape and positioned at a position spaced from each other, a second probe part electrically connected to a second position of the circuit board and supported by the second support part; and A position adjusting unit for adjusting the relative positions of the first probe and the second probe on the base. Probe card.

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