Antenna structure and electronic device including same

Abstract

According to an embodiment of the present disclosure, an electronic device may comprise a housing, a circuit board, an antenna structure, or a conductive connection member. The housing may include a first housing part or a second housing part. The first housing part may include an opening. The second housing part may be configured to move with respect to the first housing part. The circuit board may be disposed in the second housing part. The antenna structure may be disposed in the first housing part. The conductive connection member may be electrically connected to the circuit board and the antenna structure. The antenna structure may include a substrate or a first coil. The first coil may be disposed on the substrate. At least a part of the first coil may overlap the opening.

Description

Antenna structure and electronic device including the same

[0001] Various embodiments disclosed in this document relate to electronic devices, for example, to antenna structures and electronic devices including the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portability and communication.

[0003] Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, or car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, or functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller so that users can conveniently carry them.

[0004] As mobile communication services expand into the realm of multimedia services, the size of displays on electronic devices may increase in order for users to fully utilize multimedia services in addition to voice calls and text messages.

[0005] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0006] According to one embodiment of the present disclosure, an electronic device may include a housing, a circuit board, an antenna structure, or a conductive connecting member. The housing may include a first housing portion or a second housing portion. The first housing portion may include an opening. The second housing portion may be configured to move relative to the first housing portion. The circuit board may be disposed in the second housing portion. The antenna structure may be disposed in the first housing portion. The conductive connecting member may be electrically connected to the circuit board and the antenna structure. The antenna structure may include a substrate or a first coil. The substrate may include a base portion or an extension portion. The base portion may be disposed in the first housing portion. The extension portion may extend from the base portion. The extension portion may be disposed to overlap the opening. The first coil may be disposed on the substrate. At least a portion of the first coil may overlap the opening.

[0007] According to one embodiment of the present disclosure, an electronic device may include a housing, a circuit board, an antenna structure, or a conductive connecting member. The housing may include a first housing portion or a second housing portion. The first housing portion may include an opening. The second housing portion may be configured to move relative to the first housing portion. The circuit board may be disposed in the second housing portion. The antenna structure may be disposed in the first housing portion. The conductive connecting member may be electrically connected to the circuit board and the antenna structure. The antenna structure may include a substrate or a first coil. The substrate may include a base portion, an extension portion, or a connecting portion. The base portion may be disposed in the first housing portion. The extension portion may extend from the base portion. The extending portion may be arranged to overlap the opening. The connecting portion may extend from the base portion. The connecting portion may be electrically connected to the conductive connecting member. The first coil may be disposed on the substrate. The connecting portion may be disposed at least partially within the opening.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0009] FIG. 2 is a drawing showing a state in which a second display area of ​​a display is housed inside an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 3 is a drawing showing a state in which a second display area of ​​a display is exposed to the outside of an electronic device according to one embodiment of the present disclosure.

[0011] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 5A is a cross-sectional view taken along line A-A' of FIG. 2 according to one embodiment of the present disclosure.

[0013] FIG. 5b is a cross-sectional view taken along line B-B' of FIG. 3, according to one embodiment of the present disclosure.

[0014] FIG. 6 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0015] FIG. 7 is an exploded perspective view of an electronic device and antenna structure according to one embodiment of the present disclosure.

[0016] FIG. 8 is an exploded perspective view of an antenna structure according to one embodiment of the present disclosure.

[0017] FIG. 9 is a front view of an antenna structure according to one embodiment of the present disclosure.

[0018] FIG. 10 is a rear view of an antenna structure according to one embodiment of the present disclosure.

[0019] FIG. 11 is a schematic diagram showing the configurations of regions of an antenna structure according to one embodiment of the present disclosure.

[0020] FIG. 12 is a cross-sectional view taken along line CC' of FIG. 2 according to one embodiment of the present disclosure.

[0021] FIGS. 13a, 13b, and 13c are drawings for explaining an assembly process of an electronic device according to one embodiment of the present disclosure.

[0022] FIG. 14 is a rear view of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 15A is a rear view of an electronic device in a slide-in state according to one embodiment of the present disclosure.

[0024] FIG. 15b is a rear view of an electronic device in a slide-out state according to one embodiment of the present disclosure.

[0025] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0026] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0027] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0028] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0029] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0030] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0031] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0032] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0033] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0034] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0035] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0036] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0037] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0038] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0040] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0041] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0042] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0043] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0044] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0045] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0046] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0047] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0048] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0049] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0050] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0051] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0052] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0053] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0054] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0055] FIG. 2 is a diagram illustrating a state in which a second display area of ​​a display is housed within an electronic device according to one embodiment of the present disclosure. The second display area, which extends from the first display area, can be at least partially hidden within the electronic device in a different plane from the first display area.

[0056] FIG. 3 is a diagram illustrating a state in which a second display area of ​​a display is exposed to the outside of an electronic device according to one embodiment of the present disclosure. The second display area, which extends from the first display area, can be at least partially viewed from the outside of the electronic device, substantially in the same plane as the first display area, based on the movement of the second housing portion.

[0057] FIGS. 2 and 3 illustrate a structure in which a display (203) (e.g., a flexible display or a rollable display) expands in a longitudinal direction (e.g., +Y direction) when viewed from the front of an electronic device (101). However, the expansion direction of the display (203) is not limited to one direction (e.g., +Y direction). For example, the expansion direction of the display (203) may be designed to be expandable in an upward direction (+Y direction), a rightward direction (e.g., +X direction), a leftward direction (e.g., -X direction), and / or a downward direction (e.g., -Y direction).

[0058] The state illustrated in FIG. 2 may represent a state in which substantially the entire second display area is hidden within the electronic device, on a different plane from the first display area. For example, the state illustrated in FIG. 2 may be referred to as a slide-in state of the electronic device (101), or a state in which the second display area (A2) of the display (203) is closed.

[0059] The state illustrated in FIG. 3 may represent a state in which the area of ​​the second display area exposed to the outside of the electronic device is maximized on a substantially identical plane with the first display area. The state illustrated in FIG. 3 may be referred to as a slide-out state of the electronic device (101), or a state in which the second display area (A2) of the display (203) is open.

[0060] The embodiments of FIGS. 2 to 3 may be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 4 to 15b.

[0061] Referring to FIGS. 2 and 3, an electronic device (101) (e.g., the electronic device (101) of FIG. 1) may include a housing (210). The housing (210) may include a first housing portion (201) and a second housing portion (202) that is arranged to be relatively movable with respect to the first housing portion (201). In one embodiment, the first housing portion (201) of the electronic device (101) may be interpreted as a structure in which the first housing portion (201) is arranged to be slidably movable with respect to the second housing portion (202). According to one embodiment, the second housing portion (202) may be arranged to be reciprocally movable for a predetermined distance in a direction shown with respect to the first housing portion (201), for example, in a direction indicated by arrow ① of FIG. 3. The first housing portion (201) may be referred to as a first housing, and the second housing portion may be referred to as a second housing (202).

[0062] According to one embodiment, the second housing portion (202), which may be referred to as a slide portion or slide housing, may be relatively movable with respect to the first housing portion (201). According to one embodiment, the second housing portion (202) may accommodate various electrical and electronic components, such as a circuit board or a battery. When the electronic device (101) is in a slide-in state, the second housing portion (202) may be defined as a retracted position, and when the electronic device (101) is in a slide-out state, the second housing portion (202) may be defined as an extended position. For example, the second housing portion (202) may be configured to move between the retracted position and the extended position with respect to the first housing portion (201).

[0063] According to one embodiment, the slide-in state of the electronic device (101) (or the slide-out state of the electronic device (101)) may be changed to the slide-out state of the electronic device (101) (or the slide-in state of the electronic device (101)) based on a predefined user input. For example, the slide-in state of the electronic device (101) (or the slide-out state of the electronic device (101)) may be changed to the slide-out state (or the slide-in state of the electronic device (101)) in response to a user input to a physical button exposed through a portion of the first housing portion (201) or a portion of the second housing portion (202). For example, the slide-in state (or the slide-out state of the electronic device (101)) may be changed to the slide-out state (or the slide-in state of the electronic device (101)) in response to a touch input to an executable object displayed within a screen display area (e.g., the first display area (A1)). For example, the slide-in state (or the slide-out state of the electronic device (101)) may be changed to the slide-out state (or the slide-in state of the electronic device (101)) in response to a touch input having a contact point on the screen display area (e.g., the first display area (A1)) and a pressing strength greater than or equal to a reference strength. For example, the slide-in state (or the slide-out state of the electronic device (101)) may be changed to the slide-out state (or the slide-in state of the electronic device (101)) in response to a voice input received through a microphone of the electronic device (101). For example, the slide-in state (or the slide-out state of the electronic device (101)) may be changed to the slide-out state (or the slide-in state of the electronic device (101)) in response to an external force applied to the first housing portion (201) and / or the second housing portion (202) to move the second housing portion (202) relative to the first housing portion (201).For example, the slide-in state (or the slide-out state of the electronic device (101)) may be changed to the slide-out state (or the slide-in state of the electronic device (101)) in response to a user input identified from an external electronic device (e.g., earbuds or a smart watch) connected to the electronic device (101). However, the method for causing the slide-in / out operation of the electronic device (101) is not limited thereto.

[0064] In one embodiment, the first housing portion (201) can accommodate an actuator (e.g., a motor), a speaker, a SIM socket, and / or a sub-circuit board electrically connected to the main circuit board. The second housing portion (202) can accommodate a main circuit board equipped with electrical components such as an application processor (AP) or a communication processor (CP). In one embodiment, the second housing portion (202) can accommodate an actuator, a speaker, a SIM socket, and / or a sub-circuit board electrically connected to the main circuit board, and the first housing portion (201) can accommodate a main circuit board equipped with electrical components such as an application processor (AP) or a communication processor (CP). In one embodiment, the sub-circuit board and the main circuit board may be disposed in the first housing portion (201), or may be disposed in the second housing portion (202).

[0065] According to one embodiment, the first housing portion (201) may include a first cover member (211) (e.g., a main case). The first cover member (211) may include a first-first side wall (211a), a first-second side wall (211b) extending from the first-first side wall (211a), and a first-third side wall (211c) extending from the first-first side wall (211a) and being substantially parallel to the first-second side wall (211b). According to one embodiment, the first-second side wall (211b) and the first-third side wall (211c) may be formed to be substantially perpendicular to the first-first side wall (211a).

[0066] According to one embodiment, the first-first side wall (211a), the first-second side wall (211b), and the first-third side wall (211c) of the first cover member (211) may be formed in a shape in which one side (e.g., the front face) is open to accommodate (or surround) at least a portion of the second housing portion (202). For example, at least a portion of the second housing portion (202) may be surrounded by the first housing portion (201) and may slide in a direction parallel to the first surface (e.g., the first surface (F1) of FIG. 4), for example, in the direction of arrow ① of FIG. 3, while being guided by the first housing portion (201). According to one embodiment, the first-first side wall (211a), the first-second side wall (211b), and / or the first-third side wall (211c) of the first cover member (211) may be formed as an integral part. According to one embodiment, the first-first side wall (211a), the first-second side wall (211b), and / or the first-third side wall (211c) of the first cover member (211) may be formed as separate structures and then joined or assembled.

[0067] According to one embodiment, the first cover member (211) may be formed to surround at least a portion of the display (203). For example, at least a portion of the display (203) may be formed to surround by the first-first side wall (211a), the first-second side wall (211b), and / or the first-third side wall (211c) of the first cover member (211).

[0068] In one embodiment, the second housing portion (202) may include a second cover member (221) (e.g., a slide plate). The second cover member (221) may have a plate shape and include a first surface (e.g., the first surface (F1) of FIG. 4) that supports internal components. For example, the second cover member (221) may support at least a portion of the display (203) (e.g., the first display area (A1)). In one embodiment, the second cover member (221) may be referred to as a front cover.

[0069] According to one embodiment, the second cover member (221) may include a second-first side wall (221a), a second-second side wall (221b) extending from the second-first side wall (221a), and a second-third side wall (221c) extending from the second-first side wall (221a) and being substantially parallel to the second-second side wall (221b). According to one embodiment, the second-second side wall (221b) and the second-third side wall (221c) may be formed substantially perpendicular to the second-first side wall (221a).

[0070] According to one embodiment, the second housing portion (202) can form a slide-in state and a slide-out state of the electronic device (101) by moving in a first direction (e.g., direction ① of FIG. 3) parallel to the 2-2 side wall (221b) or the 2-3 side wall (221c). In the slide-in state of the electronic device (101), the second housing portion (202) can be positioned at a first distance from the 1-1 side wall (211a) of the first housing portion (201), and in the slide-out state of the electronic device (101), the second housing portion (202) can be positioned at a second distance greater than the first distance from the 1-1 side wall (211a) of the first housing portion (201). In one embodiment, in the slide-in state of the electronic device (101), the first housing portion (201) may be formed to surround a portion of the second-second side wall (221b) and the second-third side wall (221c).

[0071] According to one embodiment, the electronic device (101) may have an intermediate state between the slide-in state (e.g., a fully closed state) of FIG. 2 and the slide-out state (e.g., a fully opened state) of FIG. 3. In the intermediate state of the electronic device (101), the distance between the first-first sidewall (211a) and the second-first sidewall (221a) may be shorter than the distance between the first-first sidewall (211a) and the second-first sidewall (221a) of the electronic device (101) in the fully opened state, and may be longer than the distance between the first-first sidewall (211a) and the second-first sidewall (221a) of the electronic device (101) in the fully closed state. According to one embodiment, as at least a portion of the display (203) slides in the intermediate state of the electronic device (101), an area exposed to the outside may vary. For example, in an intermediate state of the electronic device (101), the ratio of the width (e.g., length in the X direction) and the height (e.g., length in the Y direction) of the display (203) and / or the distance between the first-first side wall (211a) and the second-first side wall (221a) may be changed based on the slide movement of the electronic device (101).

[0072] According to one embodiment, the electronic device (101) may include a display (203), a key input device (245), a connector hole (243), an audio module (247a, 247b), or a camera module (249a, 249b). According to one embodiment, the electronic device (101) may further include an indicator (e.g., an LED device) or various sensor modules.

[0073] According to one embodiment, the display (203) may be formed such that the size of a portion visible from the front side of the housing (210) changes based on the sliding movement of the second housing portion (202). According to one embodiment, the display (203) may include a first display area (A1) and a second display area (A2) configured to be exposed to the outside of the electronic device (101) based on the sliding movement of the second housing portion (202).

[0074] According to one embodiment, as the second housing portion (202) moves between a retracted position and an extended position relative to the first housing portion (201), the size of the display (203) viewed toward the exterior front face of the electronic device (101) can be varied. For example, when the second housing portion (202) is positioned in a retracted position relative to the first housing portion (201) (e.g., FIG. 2), the size (or area) of the display (203) viewed toward the exterior front face of the electronic device (101) can be substantially minimized. Additionally, when the second housing portion (202) is positioned in an extended position relative to the first housing portion (201) (e.g., FIG. 3), the size (or area) of the display (203) viewed toward the exterior front face of the electronic device (101) can be substantially maximized.

[0075] According to one embodiment, the first display area (A1) may be disposed on the second housing portion (202). For example, the first display area (A1) may be disposed on the second cover member (221) of the second housing portion (202). According to one embodiment, the second display area (A2) extends from the first display area (A1) and may be accommodated into the interior of the first housing portion (201) or visually exposed to the exterior of the electronic device (101) as the second housing portion (202) slides relative to the first housing portion (201). According to one embodiment, as the electronic device (101) changes from a slide-in state to a slide-out state, the display (203) may extend in a downward direction (e.g., a -Y direction) of the electronic device (101). For example, in the slide-out state of the electronic device (101), the second display area (A2) can be visually exposed from below (e.g., in the -Y direction) of the display (203). According to one embodiment, as the electronic device (101) changes from the slide-in state to the slide-out state, the display (203) can be expanded in the upper direction (e.g., in the +Y direction) of the electronic device (101). For example, in the slide-out state of the electronic device (101), the second display area (A2) can be visually exposed from above (e.g., in the +Y direction) of the display (203).

[0076] According to one embodiment, the second display area (A2) substantially moves along an area of ​​the first housing portion (201) (e.g., the guide rail (250) of FIG. 4) and may be accommodated in a space located inside the first housing portion (201) or exposed to the outside of the electronic device (101). According to one embodiment, the second display area (A2) may move based on the sliding movement of the second housing portion (202) in the first direction (e.g., the direction indicated by arrow ①). For example, while the second housing portion (202) slides, a portion of the second display area (A2) may be deformed into a curved shape at a position corresponding to the curved surface (213a) of the first housing portion (201).

[0077] According to one embodiment, when the electronic device (101) changes from a slide-in state to a slide-out state (e.g., when the second housing portion (202) slides to extend with respect to the first housing portion (201) when viewed from the top (e.g., in the +Z direction or toward the front of the electronic device) of the second cover member (221) (e.g., the front cover), the second display area (A2) may be gradually exposed to the outside of the first housing portion (201) to form substantially the same plane as the first display area (A1). According to one embodiment, the display (203) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen. According to one embodiment, regardless of the slide-in or slide-out state of the electronic device (101), a portion of the exposed second display area (A2) may be positioned on a portion of the first housing portion (e.g., the curved surface (213a) of FIG. 4), and a portion of the second display area (A2) may maintain a curved shape at a position corresponding to the curved surface (213a).

[0078] According to one embodiment, the key input device (245) may be located in an area of ​​the housing (210) (e.g., the first housing portion (201) and / or the second housing portion (202)). Depending on the appearance and usage state, the illustrated key input device (245) may be omitted, or the electronic device (101) may be designed to include additional key input device(s). According to one embodiment, the electronic device (101) may include a key input device not illustrated, for example, a home key button, or a touch pad disposed around the home key button. According to one embodiment, at least a portion of the key input device (245) may be disposed on the first-first side wall (211a), the first-second side wall (211b), and / or the first-third side wall (211c) of the first housing portion (201). According to one embodiment, at least a portion of the key input device (245) may be disposed on the second-first side wall (221a), the second-second side wall (221b), and / or the second-third side wall (221c) of the second housing portion (202).

[0079] According to one embodiment, the connector hole (243) may be omitted depending on the embodiment, and may accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device. According to one embodiment, the electronic device (101) may include a plurality of connector holes (243), and some of the plurality of connector holes (243) may function as connector holes for transmitting and receiving audio signals with the external electronic device. In the illustrated embodiment, the connector hole (243) is located in the second housing portion (202), but is not limited thereto, and the connector hole (243) or a connector hole not illustrated may be located in the first housing portion (201).

[0080] According to one embodiment, the audio module (247a, 247b) may include at least one speaker hole (247a) or at least one microphone hole (247b). One of the speaker holes (247a) may be provided as a receiver hole for voice calls, and the other may be provided as an external speaker hole. The electronic device (101) includes a microphone for acquiring sound, and the microphone may acquire sound from outside the electronic device (101) through the microphone hole (247b). According to one embodiment, the electronic device (101) may include a plurality of microphones for detecting the direction of sound. According to one embodiment, the electronic device (101) may include an audio module in which the speaker hole (247a) and the microphone hole (247b) are implemented as a single hole, or may include a speaker from which the speaker hole (247a) is excluded (e.g., a piezo speaker). According to one embodiment, the speaker hole (247a) and the microphone hole (247b) may be located in the first housing portion (201) and / or the second housing portion (202).

[0081] According to one embodiment, the camera modules (249a, 249b) may include a first camera module (249a) (e.g., a front camera) and a second camera module (249b) (e.g., a rear camera) (e.g., the second camera module (249b) of FIGS. 5A and 5B). According to one embodiment, the electronic device (101) may include at least one of a wide-angle camera, a telephoto camera, or a macro camera, and may measure a distance to a subject by including an infrared projector and / or an infrared receiver, depending on the embodiment. The camera modules (249a, 249b) may include one or more lenses, an image sensor, and / or an image signal processor. The first camera module (249a) may be arranged to face the same direction as the display (203). For example, the first camera module (249a) may be disposed around the first display area (A1) or in an area overlapping with the display (203), and when disposed in an area overlapping with the display (203), may capture a subject by passing through the display (203). According to one embodiment, the first camera module (249a) may not be visually exposed to the screen display area (e.g., the first display area (A1)) and may include a hidden under-display camera (UDC). According to one embodiment, the second camera module (249b) may capture a subject from a direction opposite to the first display area (A1). According to one embodiment, the first camera module (249a) and / or the second camera module (249b) may be disposed on the second housing portion (202). According to one embodiment, the second camera modules (249b) may be formed in multiples to provide various arrangements. For example, a plurality of second camera modules (249b) may be arranged along a width direction (X-axis direction) that is substantially perpendicular to the slide movement direction (e.g., Y-axis direction) of the electronic device (101).As another example, a plurality of second camera modules (249b) may be arranged along the slide movement direction (e.g., Y-axis direction) of the electronic device (101). As another example, a plurality of second camera modules (249b) may be arranged along N * M rows and columns like a matrix.

[0082] According to one embodiment, the second camera module (249b) is not visually exposed to the outside of the electronic device (101) when the electronic device (101) is in a slide-in state, and can capture the outside of the electronic device (101) when the electronic device (101) is in a slide-out state. According to one embodiment, the second camera module (249b) can capture the outside of the electronic device (101) when the electronic device (101) is in a slide-in state and / or a slide-out state. For example, at least a portion of the housing (210) (e.g., the first rear plate (215) and / or the second rear plate (225) of FIG. 4) is substantially transparent, and the second camera module (249b) can capture the outside of the electronic device (101) by passing through the first rear plate (215) and / or the second rear plate (225). According to one embodiment, the second camera module (249b) is visually exposed to the outside of the electronic device (101) in the slide-in and slide-out states of the electronic device (101) and can capture the outside. For example, the first housing portion (201) (e.g., the first rear plate (215) of FIG. 4) may include an opening (201a) for the second camera module (249b).

[0083] According to one embodiment, an indicator (not shown) of the electronic device (101) may be disposed in the first housing portion (201) or the second housing portion (202), and may provide status information of the electronic device (101) as a visual signal by including a light-emitting diode. The sensor modules (261a, 261b) of the electronic device (101) may generate an electrical signal or a data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor modules (261a, 261b) may include a proximity sensor, a fingerprint sensor, and / or a biometric sensor (e.g., an iris / facial recognition sensor or an HRM sensor). In one embodiment, the sensor modules (261a, 261b) may further include at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. According to one embodiment, the sensor modules (261a, 261b) may be disposed in the first housing portion (201) and / or the second housing portion (202). For example, the sensor modules (261a, 261b) may include a first sensor module (261a) (e.g., a proximity sensor or a light sensor) disposed on the front side of the electronic device (101) and / or a second sensor module (261b) (e.g., a heart rate monitoring (HRM) sensor) disposed on the rear side of the electronic device (101).

[0084] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0085] FIG. 5A is a cross-sectional view taken along line A-A' of FIG. 2 according to one embodiment of the present disclosure.

[0086] FIG. 5b is a cross-sectional view taken along line B-B' of FIG. 3, according to one embodiment of the present disclosure.

[0087] Referring to FIGS. 4, 5A, and / or 5B, an electronic device (101) (e.g., the electronic device (101) of FIGS. 1 to 3) may include a housing (210), a first housing portion (201), a second housing portion (202), a display assembly (230), and a driving structure (240). The configuration of the first housing portion (201), the second housing portion (202), and the display assembly (230) of FIGS. 4, 5A, and / or 5B may be all or part of the same as the configuration of the housing (210), the first housing portion (201), the second housing portion (202), and the display (203) of FIGS. 2 and / or 3.

[0088] The embodiments of FIGS. 4 to 5b may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 15b.

[0089] According to one embodiment, the housing (210) may include a first housing portion (201), or a second housing portion (202) movably coupled to the first housing portion (201).

[0090] According to one embodiment, the first housing portion (201) may include a first cover member (211) (e.g., the first cover member (211) of FIGS. 2 and 3), a frame (213), and a first rear plate (215).

[0091] According to one embodiment, the first cover member (211) can accommodate at least a portion of the frame (213) and accommodate a component (e.g., a battery (289)) positioned in the frame (213). According to one embodiment, the first cover member (211) can be formed to surround at least a portion of the second housing portion (202). According to one embodiment, the first cover member (211) can protect a component (e.g., a second circuit board (249) and the frame (213)) positioned in the first housing portion (201) from external impact. According to one embodiment, a second circuit board (249) electrically connected to an electrical component (e.g., an actuator, a speaker, a SIM socket, and / or the first circuit board (248)) can be connected to the first cover member (211).

[0092] According to one embodiment, an outer surface of the first cover member (211) (e.g., a surface facing the -Z direction of FIG. 4) may be at least partially covered by the first rear plate (215). For example, the outer surface of the first cover member (211) may be arranged to face the first rear plate (215). An antenna member (271) may be arranged on the outer surface of the first cover member (211). The antenna member (271) may be arranged between the first cover member (211) and the first rear plate (215).

[0093] According to one embodiment, a frame (213) and / or a battery (289) may be arranged on an inner surface of the first cover member (211) (e.g., a surface facing the +Z direction in FIG. 4). The inner surface of the first cover member (211) (e.g., a surface facing the +Z direction in FIG. 4) may face the frame (213) and / or the battery (289).

[0094] In one embodiment, as the antenna member (271) is disposed in the first housing portion (201) and / or the first cover member (211) and the first circuit board (248) is disposed in the second housing portion (202) and / or the second cover member (221), the first circuit board (248) can have a variable relative position to the antenna member (271). For example, when the second housing portion (202) is moved relative to the first housing portion (201), the first circuit board (248) can be moved relative to the antenna member (271).

[0095] According to one embodiment, the electronic device (101) may include a conductive connection member (e.g., conductive connection member (390) of FIGS. 15A and 15B) (e.g., FPCB) electrically and / or physically connected to the antenna member (271) and the first circuit board (248).

[0096] According to one embodiment, the conductive connecting member can be electrically and / or physically connected to the antenna member (271) and the first circuit board (248) whose relative positions with respect to each other are variable.

[0097] According to one embodiment, the first cover member (211) may include an opening (212). The opening (212) may include a hole penetrating the outer surface and the inner surface of the first cover member (211). At least a portion of the antenna member (271) may be disposed in the opening (212). For example, at least a portion of a connecting portion (e.g., connecting portion (416) of FIG. 7) of the antenna member (271) may be disposed in the opening (212). At least a portion of the connecting portion may be disposed in the opening (212), and the connecting portion may be electrically and / or physically connected to a connector of the conductive connecting member.

[0098] In one embodiment, the frame (213) can be connected to the first cover member (211). For example, the frame (213) can be connected to the first cover member (211), and the second housing portion (202) can move relatively to the first cover member (211) and / or the frame (213). In one embodiment, the frame (213) can accommodate the battery (289). For example, the frame (213) can include a groove for accommodating the battery (289). The frame (213) can be connected to the battery cover (289a) and, together with the battery cover (289a), can surround at least a portion of the battery (289). In one embodiment, the frame (213) can include a curved portion (213a) that faces the display assembly (230).

[0099] In one embodiment, the first back plate (215) can substantially form at least a portion of the first housing portion (201) or the exterior of the electronic device (101). For example, the first back plate (215) can be coupled to an outer surface of the first cover member (211). In one embodiment, the first back plate (215) can provide a decorative effect on the exterior of the electronic device (101). The first back plate (215) can be manufactured using at least one of metal, glass, synthetic resin, or ceramic.

[0100] According to one embodiment, the second housing portion (202) may include a second cover member (221) (e.g., the second cover member (221) of FIGS. 2 and 3), a rear cover (223), and a second rear plate (225).

[0101] According to one embodiment, the second cover member (221) is connected to the first housing portion (201) through a guide rail (250) and can move linearly back and forth in one direction (e.g., in the direction of arrow ① in FIG. 3) while being guided by the guide rail (250).

[0102] According to one embodiment, the second cover member (221) can support at least a portion of the display (231). For example, the second cover member (221) includes a first surface (F1), and a first display area (A1) of the display (231) can be substantially positioned on the first surface (F1) and maintained in a flat shape. According to one embodiment, the second cover member (221) can be formed of a metallic material and / or a non-metallic (e.g., polymer) material. According to one embodiment, a first circuit board (248) that accommodates electronic components (e.g., the processor (120) and / or the memory (130) of FIG. 1) can be connected to the second cover member (221). According to one embodiment, the second cover member (221) can protect components (e.g., the first circuit board (248) and the rear cover (223)) positioned in the second housing portion (202) from external impact.

[0103] According to one embodiment, the rear cover (223) can protect a component (e.g., a first circuit board (248)) located on the second cover member (221). For example, the rear cover (223) can be connected to the second cover member (221) and formed to surround at least a portion of the first circuit board (248). According to one embodiment, the rear cover (223) can include an antenna pattern (e.g., at least one antenna element (223a)) for communicating with an external electronic device. For example, the at least one antenna element (223a) can be disposed on an outer surface (e.g., one surface facing the -Z-axis direction) of the rear cover (223) when the rear cover (223) is formed of an injection-molded product of a dielectric material (e.g., an antenna carrier). For example, at least one antenna element (223a) may include an LDS (laser direct structuring) antenna pattern formed on the outer surface of the rear cover (223). For example, at least one antenna element (223a) may be formed in a manner that it is built in when the rear cover (223) is injected. For example, at least one antenna element (223a) may be configured to transmit or receive a wireless signal in a designated frequency band (e.g., a legacy band) by being electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on the first circuit board (248).

[0104] In one embodiment, the second back plate (225) can substantially form at least a portion of the second housing portion (202) or the exterior of the electronic device (101). For example, the second back plate (225) can be coupled to an outer surface of the second cover member (221). In one embodiment, the second back plate (225) can provide a decorative effect on the exterior of the electronic device (101). The second back plate (225) can be manufactured using at least one of metal, glass, synthetic resin, or ceramic.

[0105] According to one embodiment, the display assembly (230) may include a display (231) (e.g., display (203) of FIGS. 2 and / or 3) and a multi-bar structure (232) supporting the display (231). According to one embodiment, the display (231) may be referred to as a flexible display, a foldable display, and / or a rollable display. According to one embodiment, a first display area (A1) of the display (231) may be supported by a rigid body, and a second display area (A2) may be supported by a bendable structure. For example, the first display area (A1) may be supported by a first surface (F1) of the second cover member (221) or a plate (not shown). The second display area (A2) may be supported by the multi-bar structure (232).

[0106] According to one embodiment, the multi-bar structure (232) can be connected or attached to at least a portion of the display (231) (e.g., the second display area (A2)). According to one embodiment, as the second housing portion (202) slides, the multi-bar structure (232) can move with respect to the first housing portion (201). In the slide-in state of the electronic device (101) (e.g., FIG. 2), the multi-bar structure (232) can be mostly accommodated inside the first housing portion (201) and positioned between the first cover member (211) and the second cover member (221). According to one embodiment, at least a portion of the multi-bar structure (232) can move in response to a curved surface (213a) positioned at the edge of the frame (213). According to one embodiment, the multi-bar structure (232) can be referred to as a display support member or support structure and can be in the form of a single bendable plate.

[0107] In one embodiment, the drive structure (240) can move the second housing portion (202) relative to the first housing portion (201). For example, the drive structure (240) can include an actuator (241) configured to generate a driving force for sliding movement of the second housing portion (202) relative to the first housing portion (201). The drive structure (240) can include a gear (244) (e.g., a pinion) connected to the actuator (241) and a rack (242) configured to mesh with the gear. Referring to FIG. 4, components of the drive structure (240) (e.g., the actuator (241), the rack (242), and the gear (244)) are illustrated inverted within a P1 circle (e.g., facing in the -Z-axis direction).

[0108] In one embodiment, the housing in which the rack (242) is positioned and the housing in which the actuator (241) is positioned may be different. In one embodiment, the actuator (241) may be connected to the first housing portion (201), and the rack (242) may be connected to the second housing portion (202). In one embodiment, the actuator (241) may be connected to the second housing portion (202), and the rack (242) may be connected to the first housing portion (201).

[0109] In one embodiment, the actuator (241) may be controlled by a processor (e.g., the processor (120) of FIG. 1). For example, the processor (120) may include an actuator driver driving circuit and may transmit a pulse width modulation (PWM) signal to the actuator (241) to control the speed of the actuator (241) and / or the torque of the actuator (241). In one embodiment, the actuator (241) may be electrically connected to a processor (e.g., the processor (120) of FIG. 1) located on a circuit board (e.g., the first circuit board (248) of FIG. 4) using a flexible printed circuit board.

[0110] In one embodiment, the second housing portion (202) can accommodate a first circuit board (248) (e.g., a main board). In one embodiment, a processor, a memory, and / or an interface can be mounted on the first circuit board (248). The processor can include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. In various embodiments, the first circuit board (248) can include a radio frequency cable (FRC) of a flexible printed circuit board type. The first circuit board (248) can be disposed on at least a portion of the second cover member (221) and can be electrically connected to an antenna module (e.g., an antenna module (197) of FIG. 1) and a communication module (e.g., a communication module (190) of FIG. 1).

[0111] According to one embodiment, the first circuit board (248) can be moved together with the second housing portion (202) when the second housing portion (202) is moved relative to the first housing portion (201).

[0112] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0113] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0114] In one embodiment, the electronic device (101) may include a first circuit board (248) (e.g., a main circuit board) and a second circuit board (249) (e.g., a sub-circuit board) spaced apart from the first circuit board (248) within the first housing portion (201). The second circuit board (249) may be electrically connected to the first circuit board (248) via a flexible substrate. The second circuit board (249) may be electrically connected to electrical components disposed in an end region of the electronic device (101), such as a battery (289) or a speaker and / or a SIM socket, to transmit signals and power. In one embodiment, the second circuit board (249) may accommodate an antenna member (271) (e.g., a coil) or be connected to the antenna member (271). The antenna element (271) may include a multi-function coil (MFC) antenna including a wireless charging antenna for a wireless charging function, an NFC (near field communication) antenna for an NFC function, and / or an MST (magnetic secure transmission) antenna for performing an electronic payment function. For example, the battery (289) may receive power from an external electronic device using the antenna element (271) for wireless charging. As another example, the battery (289) may transmit power to an external electronic device using the antenna element (271) for wireless charging.

[0115] In one embodiment, the battery (289) is a device for supplying power to at least one component of the electronic device (101), and may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery (289) may be integrally disposed within the electronic device (101), or may be detachably disposed with the electronic device (101). In one embodiment, the battery (289) may be formed as a single integral battery or may include multiple detachable batteries. In one embodiment, the battery (289) may be positioned in the frame (213). For example, the battery (289) may be surrounded by the frame (213) and a battery cover (289a). In one embodiment, the battery (289) may be positioned within the second housing portion (202) and may slide together with the second housing portion (202).

[0116] In one embodiment, the guide rail (250) can guide the movement of the multi-bar structure (232). For example, the multi-bar structure (232) can slide along a slit (251) formed in the guide rail (250). In one embodiment, the guide rail (250) can be connected to the first housing portion (201). For example, the guide rail (250) can be connected to the first cover member (211) and / or the frame (213). In one embodiment, the slit (251) can be referred to as a groove or recess formed on the inner surface of the guide rail (250). Referring to FIG. 4, the guide rail (250) is illustrated enlarged within a P2 circle.

[0117] According to one embodiment, the guide rail (250) can provide force to the multi-bar structure (232) based on the actuation of the actuator (241).

[0118] According to one embodiment, when the electronic device (101) changes from a slide-in state to a slide-out state, at least a portion of the second housing portion (202) can slide to be exposed to the outside from the first housing portion (201) through the driving of the actuator (241). For example, the gear (244) can rotate in the first rotational direction based on the driving of the actuator (241). As the rack (242) is fixed on the second cover member (221) of the second housing portion (202), the second housing portion (202) can slide to be exposed to the outside of the first housing portion (201) based on the sliding movement of the rack (242) toward the slide-out direction.

[0119] According to one embodiment, when the electronic device (101) changes from a slide-in state to a slide-out state, the inner portion (252) of the guide rail (250) can provide force to the multi-bar structure (232). The multi-bar structure (232) provided with force moves along the slit (251) of the guide rail (250), and the second housing portion (202) can slide to expand with respect to the first housing portion (201). At least a portion of the display assembly (230) accommodated between the first cover member (211) and the frame (213) can expand toward the front.

[0120] According to one embodiment, when the electronic device (101) changes from a slide-out state to a slide-in state, at least a portion of the second housing portion (202) can slide to be inserted into the first housing portion (201) through the driving of the actuator (241). For example, the gear (244) can rotate in a second rotational direction opposite to the first rotational direction based on the driving of the actuator (241). Since the rack (242) is fixed on the second cover member (221) of the second housing portion (202), the second housing portion (202) can slide to be inserted into the first housing portion (201) based on the sliding movement of the rack (242) toward the slide-in direction.

[0121] According to one embodiment, when the electronic device (101) changes from a slide-out state to a slide-in state, the outer portion (253) of the guide rail (250) can provide force to the bent multi-bar structure (232). The multi-bar structure (232) provided with force moves along the slit (251) of the guide rail (250), and at least a portion of the second housing portion (202) can slide so as to be accommodated in the first housing portion (201). At least a portion of the display assembly (230) can be accommodated between the first cover member (211) and the frame (213).

[0122] According to one embodiment, the electronic device (101) may be configured to stop in a designated intermediate state between the slide-in state and the slide-out state by controlling the driving of the actuator (241) (free stop function). According to one embodiment, the electronic device (101) may be changed to the slide-in state, the intermediate state, or the slide-out state through a user's operation in a state where no driving force is provided to the actuator (241).

[0123] Referring to FIG. 5A, in the slide-in state of the electronic device (101), at least a portion of the second housing portion (202) may be arranged to be received in the first housing portion (201). As the second housing portion (202) is arranged to be received in the first housing portion (201), the overall size of the electronic device (101) may be reduced. In one embodiment, when the second housing portion (202) is received in the first housing portion (201), the size of the visually exposed display (231) may be minimized. For example, when the second housing portion (202) is completely received in the first housing portion (201), the first display area (A1) of the display (231) is visually exposed, and at least a portion (e.g., a portion facing the -Z axis) of the second display area (A2) may be arranged between the battery (289) and the first rear plate (215).

[0124] Referring to FIG. 5B, when the electronic device (101) is in a slide-out state, at least a portion of the second housing portion (202) may protrude from the first housing portion (201). As the second housing portion (202) protrudes from the first housing portion (201), the overall size of the electronic device (101) may increase. According to one embodiment, when the second housing portion (202) protrudes from the first housing portion (201), at least a portion of the second display area (A2) of the display (231) may be visually exposed to the outside of the electronic device (101) together with the first display area (A1).

[0125] The embodiment of FIG. 6 can be combined with the embodiment of FIG. 1, or the embodiments of FIGS. 7 to 15b.

[0126] Referring to FIG. 6, an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 5B) may include a housing (310), a first housing portion (301), a second housing portion (302), a display (330), a first circuit board (348), a second circuit board (349), an antenna structure (371), or a battery (389).

[0127] The configuration of the housing (310), the first housing portion (301), the second housing portion (302), the first circuit board (348), the second circuit board (349), the antenna structure (371), or the battery (389) of FIG. 6 may include the housing (210), the first housing portion (201), the second housing portion (202), the first circuit board (248), the second circuit board (249), the antenna member (271), or the battery (289) of FIGS. 4 to 5B. The configuration of the display (330) of FIG. 6 may be partially or entirely the same as the configuration of the display assembly (230) or the display (231) of FIGS. 4 to 5B.

[0128] According to one embodiment, the housing (310) may include a first housing portion (301). The housing (310) may include a second housing portion (302) configured to move between a retracted position (e.g., FIG. 2 or FIG. 5a) and an extended position (e.g., FIG. 3 or FIG. 5b) relative to the first housing portion (301).

[0129] According to one embodiment, the first housing portion (301) may include a first cover member (311) (e.g., the first cover member (211) of FIGS. 4 to 5B), a frame (313) (e.g., the frame (313) of FIGS. 4 to 5B), or a first rear plate (315) (e.g., the first rear plate (315) of FIGS. 4 to 5B).

[0130] According to one embodiment, the first cover member (311) may include a first-first side wall (311a) (e.g., the first-first side wall (211a) of FIGS. 2 to 3), a first-second side wall (311b) (e.g., the first-second side wall (211b) of FIGS. 2 to 3), or a first-third side wall (311c) (e.g., the first-third side wall (311c) of FIGS. 2 to 3).

[0131] According to one embodiment, the first cover member (311) may include a first plate (311d). The first plate (311d) may be connected to the first side walls (311a, 311b, 311c). The first plate (311d) may be defined and / or referred to as a first support member, a first bracket, a first plane, a first cover, a first front plate, or a first mid plate.

[0132] According to one embodiment, a frame (313) or a battery (389) may be accommodated in a space of a first cover member (311) formed by first side walls (311a, 311b, 311c) and a first plate (311d). The space of the first cover member (311) may be formed to surround at least a portion of the second housing portion (302).

[0133] According to one embodiment, the first plate (311d) may include an outer surface (e.g., a surface facing the -Z direction of FIG. 6) or an inner surface (e.g., a surface facing the +Z direction of FIG. 6).

[0134] According to one embodiment, an outer surface of the first plate (311d) (e.g., a surface facing the -Z direction in FIG. 6) may be covered by a first rear plate (315). An antenna structure (371) or a second circuit board (349) may be disposed on the outer surface of the first plate (311d) (e.g., a surface facing the -Z direction in FIG. 6). The antenna structure (371) or the second circuit board (249) may be disposed between the outer surface of the first plate (311d) and the first rear plate (315).

[0135] According to one embodiment, the first plate (311d) may have a frame (313) or a battery (389) placed on its inner surface (e.g., the surface facing the +Z direction in FIG. 6).

[0136] According to one embodiment, the first cover member (311) may include an opening (312) (e.g., opening (212) of FIG. 4). The opening (312) may include a hole formed through at least a portion of the first plate (311d).

[0137] According to one embodiment, the opening (312) may overlap at least a portion of the antenna structure (371) in the thickness direction of the electronic device (101) (e.g., the Z-axis direction of FIG. 6). The thickness direction of the electronic device (101) may be defined and / or referred to as a second direction (e.g., the Z-axis direction of FIG. 6). The second direction may be a different direction from a first direction (e.g., the Y-axis direction of FIGS. 2 to 6) in which the second housing portion (302) moves relative to the first housing portion (301). The second direction may be substantially perpendicular to the first direction.

[0138] According to one embodiment, the frame (313) may include a recess (313a) capable of accommodating a battery (389). The frame (313) may be connected to a battery cover (389a) (e.g., battery cover (289a) of FIG. 4) and, together with the battery cover (389a), may surround at least a portion of the battery (389).

[0139] According to one embodiment, the second housing portion (302) may include a second cover member (321) (e.g., the second cover member (221) of FIGS. 4 to 5B), or a second rear plate (325) (e.g., the second rear plate (225) of FIGS. 4 to 5B).

[0140] According to one embodiment, the second cover member (321) may include a second-first side wall (321a) (e.g., the second-first side wall (211a) of FIGS. 2 to 3), a second-second side wall (321b) (e.g., the second-second side wall (211b) of FIGS. 2 to 3), or a second-third side wall (321c) (e.g., the second-third side wall (321c) of FIGS. 2 to 3).

[0141] According to one embodiment, the second cover member (321) may include a second plate (321d). The second plate (321d) may be connected to the second side walls (321a, 321b, 321c). The second plate (321d) may be defined and / or referred to as a second support member, a second bracket, a second plane, a second cover, a second front plate, or a second mid plate.

[0142] According to one embodiment, the second plate (321d) may include an outer surface (e.g., a surface facing the +Z direction of FIG. 6) or an inner surface (e.g., a surface facing the -Z direction of FIG. 6).

[0143] According to one embodiment, the outer surface of the second plate (321d) (e.g., the surface facing the +Z direction of FIG. 6) may face in the opposite direction to the outer surface of the first plate (311d) (e.g., the surface facing the -Z direction of FIG. 6).

[0144] According to one embodiment, an inner surface of the second plate (321d) (e.g., a surface facing the -Z direction in FIG. 6) may be covered by a second back plate (325). A first circuit board (348) may be disposed on the inner surface of the second plate (321d) (e.g., a surface facing the -Z direction in FIG. 6). The first circuit board (348) may be disposed at least partially between the inner surface of the second plate (311d) and the second back plate (325). The first circuit board (348) may be referred to as a main circuit board. The second circuit board (348) may move together with the second housing portion (302) when the second housing portion (302) moves relative to the first housing portion (301).

[0145] According to one embodiment, at least a portion of the display (330) may be disposed on an outer surface of the second plate (321d) (e.g., a surface facing the +Z direction in FIG. 6). For example, a first display area (e.g., a first display area (A1) in FIG. 4) of the display (330) may be disposed on an outer surface of the second plate (321d) (e.g., a surface facing the +Z direction in FIG. 6).

[0146] According to one embodiment, when the electronic device (101) and / or the housing (310) is in a closed state or a slide-in state (e.g., FIG. 2 or FIG. 5a), the battery (389) may be positioned between an inner surface of the first plate (311d) (e.g., a surface facing the +Z direction of FIG. 6) and an inner surface of the second plate (321d) (e.g., a surface facing the -Z direction of FIG. 6) in a second direction (e.g., a Z-axis direction of FIG. 6).

[0147] According to one embodiment, when the electronic device (101) and / or the housing (310) is in a closed state or a slide-in state (e.g., FIG. 2 or FIG. 5a), the first circuit board (348) may be positioned between the inner surface of the first plate (311d) and the inner surface of the second plate (321d) in the second direction (e.g., in the Z-axis direction of FIG. 6). When the electronic device (101) and / or the housing (310) is in an open state or a slide-out state (e.g., FIG. 3 or FIG. 5b), the first circuit board (348) may not be positioned between the inner surface of the first plate (311d) and the inner surface of the second plate (321d) in the second direction (e.g., in the Z-axis direction of FIG. 6).

[0148] According to one embodiment, the display (330) may be supported by the housing (310).

[0149] According to one embodiment, at least a portion of the display (330) (e.g., the first display area (A1) of FIGS. 4 to 5B) may be supported by an outer surface of the second plate (321d) (e.g., the surface facing the −Z direction of FIG. 6). Another portion of the display (330) (e.g., the second display area (A2) of FIGS. 4 to 5B) may extend from the first display area and be retracted into the interior of the first housing portion (301) or visually exposed to the exterior of the electronic device (101) as the second housing portion (302) slides relative to the first housing portion (301).

[0150] In one embodiment, the antenna structure (371) may include a multi-function coil (MFC) antenna. For example, the antenna structure (371) may include a wireless charging antenna, a near field communication (NFC) antenna, and / or a magnetic secure transmission (MST) antenna. The antenna structure (371) may be configured to wirelessly transmit and receive power for charging the battery (389), for example, or to communicate with an external electronic device over a short distance. The antenna structure (371) may be defined and / or referred to as an antenna member, an antenna module, an antenna substrate, or an antenna. The battery (389) may be electrically connected to the first circuit board (348). The antenna structure (371) may be electrically connected to the battery (389) through a conductive connection member (e.g., the conductive connection member (390) of FIGS. 15A and 15B) and the first circuit board (348).

[0151] According to one embodiment, the antenna structure (371) may include a board or at least one coil. The board may be disposed on an outer surface of the first plate (211d) (e.g., a surface facing the -Z direction of FIG. 6). The board may be disposed between the outer surface of the first plate (211d) and the first rear plate (315). The at least one coil may be disposed on one surface of the board or inside the board. The at least one coil may include a conductive coil.

[0152] According to one embodiment, the antenna structure (371) may be electrically connected to the first circuit board (348).

[0153] According to one embodiment, the antenna structure (371) can wirelessly transmit and receive power required for charging or communicate with an external electronic device over a short distance.

[0154] According to one embodiment, a power management module (e.g., the power management module (188) of FIG. 1) may be arranged or mounted on the first circuit board (348). The power management module may charge the battery (389) by receiving an induced current generated by the first coil (e.g., the first coil (421) of FIGS. 7 to 9) of the antenna structure (371). A wireless charging circuit including a rectifier for rectifying the induced current may be arranged on the first circuit board (348). The wireless charging circuit may include a converter for converting the induced current into operating power or charging power.

[0155] According to one embodiment, a proximity wireless communication module (e.g., the wireless communication module (192) of FIG. 1) may be arranged or mounted on the first circuit board (348). The proximity wireless communication module may transmit a proximity communication signal or a magnetic-based signal including payment data through a second coil (e.g., the second coil (422) of FIGS. 7 to 9) of the antenna structure (371).

[0156] According to one embodiment, the antenna structure (371) may include a first side connector (378) or a second side connector (379). The first side connector (378) may extend from the substrate. The first side connector (378) may be electrically connected to a key input device (e.g., a key input device (245) of FIG. 2) disposed on the first-second side wall (311b). The second side connector (379) may be electrically connected to a key input device disposed on the first-third side wall (311c).

[0157] According to one embodiment, the opening (312) of the first housing portion (301) and / or the first cover member (311) may provide a passageway or space through which the antenna structure (371) and the first circuit board (348) are connected. For example, the antenna structure (371) may have a relatively fixed position with respect to the first cover member (311) and a relatively unfixed position with respect to the second cover member (321). The first circuit board (348) may have a relatively fixed position with respect to the second cover member (321) and a relatively unfixed position with respect to the first cover member (311). Accordingly, when the second housing portion (302) moves with respect to the first housing portion (301), the first circuit board (348) may move with respect to the antenna structure (371). When the housing (310) is in a closed state (e.g., FIG. 2 or FIG. 5a), the first circuit board (348) can be positioned between the inner surface of the first plate (311d) (e.g., the surface facing the +Z direction in FIG. 6) and the inner surface of the second plate (321d) (e.g., the surface facing the -Z direction in FIG. 6), and the antenna structure (371) can be disposed on the outer surface of the first plate (311d) (e.g., the surface facing the -Z direction in FIG. 6). A connecting member that electrically and / or physically connects the antenna structure (371) and the first circuit board (348) can be at least partially disposed in the opening (312) to electrically and / or physically connect the antenna structure (371) and the first circuit board (348), which are positioned in different directions with respect to the first plate (311d).

[0158] According to one embodiment, the second circuit board (349) may be disposed on an outer surface of the first plate (311d) (e.g., a surface facing the -Z direction in FIG. 6). The second circuit board (349) may be electrically connected to the first circuit board (348). A connecting member electrically and / or physically connecting the second circuit board (349) and the first circuit board (348) may be disposed at least partially in the opening (312) to electrically and / or physically connect the second circuit board (349) and the first circuit board (348), which are positioned in different directions with respect to the first plate (311d). The second circuit board (349) may be referred to as a sub circuit board.

[0159] The embodiments of FIGS. 7 to 9 can be combined with the embodiments of FIGS. 1 to 6, or the embodiments of FIGS. 10 to 15b.

[0160] Referring to FIGS. 7 to 9, an electronic device (e.g., the electronic device (101) of FIG. 1 or the electronic device (101) of FIGS. 2 to 6) may include a first cover member (311) or an antenna structure (400).

[0161] The configuration of the first cover member (311) or antenna structure (400) of FIGS. 7 to 9 may be partially or entirely identical to the configuration of the first cover member (311) or antenna structure (371) of FIG. 6.

[0162] According to one embodiment, the first cover member (311) may include a first plate (311d) (e.g., the first plate (311d) of FIG. 6) or an opening (312) (e.g., the opening (312) of FIG. 6).

[0163] According to one embodiment, the antenna structure (400) may include a substrate (410), at least one coil (420), at least one shielding member (430), a heat dissipation member (440), a first adhesive member (450), a support member (460), a second adhesive member (470), or a third adhesive member (480).

[0164] According to one embodiment, the substrate (410) may be placed on an outer surface of the first plate (311d) (e.g., a surface facing the -Z direction of FIGS. 7 to 9). The substrate (410) may include a flexible printed circuit board (FPCB). The substrate (410) may include a printed circuit board (PCB) or a rigid-flexible PCB (RF-PCB).

[0165] According to one embodiment, at least one coil (420) may be arranged on the substrate (410).

[0166] According to one embodiment, at least one coil (420) may be disposed on one surface of the substrate (410) (e.g., the surface facing the -Z direction of FIGS. 7 to 9). At least one coil (420) may also be disposed inside the substrate (410).

[0167] In one embodiment, at least one coil may be formed on one surface of the substrate (410) via a laser direct structuring (LDS) process. For example, the at least one coil may be defined and / or referred to as an antenna pattern formed on one surface of the substrate (410).

[0168] According to one embodiment, the substrate (410) may include a base portion (411), a bending portion (412), or an extension portion (413).

[0169] According to one embodiment, the base portion (411) may be disposed on an outer surface of the first plate (311d) (e.g., a surface facing the -Z direction of FIGS. 7 to 9 ). The base portion (411) may form a shape of the overall body or overall appearance of the antenna structure (400). The base portion (411) may be defined and / or referred to as a first region, a first body portion, or a first substrate portion.

[0170] According to one embodiment, the extension portion (413) may extend from the base portion (412). The extension portion (413) may protrude from at least a portion of the base portion (412). The extension portion (413) may be defined and / or referred to as a second region, a second body portion, a second substrate portion, or a protruding portion.

[0171] In one embodiment, the extension portion (413) may be configured to be foldable relative to the base portion (411). For example, the substrate (410) may include a bending portion (412) connected to the base portion (411) and the extension portion (413). The bending portion (412) may be configured to be at least partially foldable or unfoldable. As the bending portion (412) is configured to be foldable, the extension portion (413) may be configured to be foldable or unfoldable relative to the base portion (411).

[0172] In one embodiment, the extension portion (413) may overlap the opening (312). For example, the extension portion (413) may overlap the opening (312) in a second direction (e.g., the Z-axis direction of FIGS. 7 to 9). The extension portion (413) may be disposed over the opening (312).

[0173] According to one embodiment, the substrate (410) may include a connecting portion (416). The connecting portion (416) may extend from the base portion (411). The connecting portion (416) may be configured to be foldable relative to the base portion (416). The connecting portion (416) may be configured such that at least a portion of the connecting portion (416) is foldable. The connecting portion (416) may be defined and / or referred to as a third region, a third body portion, or a third substrate portion.

[0174] In one embodiment, the connecting portion (416) can be physically and / or electrically connected to a conductive connecting member (e.g., the conductive connecting member (390) of FIGS. 15A and 15B). As the conductive connecting member is physically and / or electrically connected to the first circuit board (e.g., the first circuit board (348) of FIG. 6), the antenna structure (400) and / or the substrate (410) can be electrically connected to the first circuit board via the connecting portion (416) and the conductive connecting member.

[0175] According to one embodiment, the substrate (410) may include a first side connector (418) (e.g., the first side connector (318) of FIG. 6) or a second side connector (419) (e.g., the second side connector (319) of FIG. 6).

[0176] According to one embodiment, at least one coil (420) may be disposed on the substrate (410). The at least one coil (420) may include a first coil (421) or a second coil (422).

[0177] According to one embodiment, the first coil (421) may be placed on one side of the substrate (410) (e.g., the side facing the -Z direction of FIGS. 7 to 9).

[0178] According to one embodiment, the first coil (421) may be disposed at least partially inside the second coil (422). The first coil (421) may be a wireless charging coil. For example, when an electronic device (e.g., the electronic device (101) of FIGS. 2 to 5B) is mounted on a wireless power transmission device (e.g., a wireless charger or a wireless charging pad), the first coil (421) of the antenna structure (400) may be aligned with the coil of the wireless power transmission device. In response to the electromagnetic field generated by the coil of the wireless power transmission device, the first coil (421) of the antenna structure (400) may generate an induced current. The induced current generated by the first coil (421) may be used as charging power for charging a battery of the electronic device (e.g., the battery (389) of FIG. 6). The first coil (421) can be electrically connected to the battery through a conductive connecting member (e.g., the conductive connecting member (390) of FIGS. 15A and 15B) and a first circuit board (e.g., the first circuit board (348) of FIG. 6 or the first circuit board (348) of FIG. 15B).

[0179] According to one embodiment, the first coil (421) may have a wound shape. For example, the first coil (421) may have a shape that is wound multiple times. The first coil (421) may include a loop coil. A first portion of the first coil (421) (e.g., the first portion (4211) of FIG. 9) may be disposed in the base portion (411). At least a portion of the first coil (421) may be disposed in the extension portion (413). For example, a second portion of the first coil (421) (e.g., the second portion (4212) of FIG. 9) may be disposed in the extension portion (413). As the extension portion (413) overlaps with the opening (312), the second portion (4212) of the first coil (421) can overlap with the opening (312) in a second direction (e.g., the Z-axis direction of FIGS. 7 to 9). The portion of the first coil (421) that overlaps with the opening (312) can be interpreted as the second portion (4212), and the portion that does not overlap with the opening (312) can be interpreted as the first portion (4211).

[0180] According to one embodiment, the second coil (422) may be placed on one side of the substrate (410) (e.g., the side facing the -Z direction of FIGS. 7 to 9).

[0181] In one embodiment, the second coil (422) may be disposed along an edge of the substrate (410). The second coil (422) may extend along the edge of the substrate (410). The second coil (422) may be disposed at least partially outside the first coil (421). The first coil (421) may be configured to transmit and receive radio frequency signals for near field communication (NFC) communication.

[0182] In one embodiment, the second coil (422) may include a loop coil extending along an edge of the substrate (410). A third portion (e.g., the third portion (4221) of FIG. 9) of the second coil (422) may be disposed on the base portion (411). At least a portion of the second coil (422) may be disposed on the extension portion (413). For example, a fourth portion (e.g., the fourth portion (4222) of FIG. 9) of the second coil (422) may be disposed on the extension portion (413). As the extension portion (413) overlaps the opening (312), the fourth portion (4222) of the second coil (422) may overlap the opening (312) in a second direction (e.g., the Z-axis direction of FIGS. 7 to 9). Among the second coils (422), the portion that overlaps with the opening (312) can be interpreted as the fourth portion (4222), and the portion that does not overlap with the opening (312) can be interpreted as the first portion (4221).

[0183] According to one embodiment, the first coil (421) and / or the second coil (422) may be disposed at least partially in the connecting portion (412).

[0184] According to one embodiment, at least one shielding member (430) may be coupled to the substrate (410). For example, at least one shielding member (430) may be positioned or laminated on the other surface of the substrate (410) (e.g., the surface facing the +Z direction of FIGS. 7 to 9 ).

[0185] According to one embodiment, at least one shielding member (430) may include a copper (Cu) sheet. The at least one shielding member (430) may be configured to shield interference of electromagnetic waves so that the electromagnetic waves generated from the at least one coil (420) do not affect surrounding electronic components of the electronic device.

[0186] According to one embodiment, at least one shielding member (430) may include a first shielding member (431) or a second shielding member (433). The first shielding member (431) may be disposed or laminated below the base portion (411) (e.g., in the +Z axis direction of FIG. 7). The shape and / or size of the first shielding member (431) may be formed to correspond to the shape and / or size of the base portion (411). The second shielding member (433) may be disposed or laminated below the extension portion (413) (e.g., in the +Z axis direction of FIG. 7). The shape and / or size of the second shielding member (433) may be formed to correspond to the shape and / or size of the extension portion (413).

[0187] According to one embodiment, the first shielding member (431) may be positioned between the base portion (411) and the heat dissipation member (440).

[0188] According to one embodiment, the second shielding member (433) may be positioned between the extension portion (413) and the second adhesive member (470). The second shielding member (433) may at least partially overlap the opening (312) in the second direction (e.g., the Z-axis direction of FIGS. 7 to 9).

[0189] According to one embodiment, the heat dissipation member (440) may be coupled to at least one shielding member (430). For example, the heat dissipation member (440) may be disposed or laminated on the first shielding member (431). The heat dissipation member (440) may include a graphite sheet. The heat dissipation member (440) may be configured to efficiently spread heat generated from at least one coil (420). The heat dissipation member (440) may be defined and / or referred to as a heat dissipation member. The shape and / or size of the heat dissipation member (440) may be formed to correspond to the shape and / or size of the first shielding member (431).

[0190] According to one embodiment, the heat dissipation member (440) may be disposed between the first shielding member (431) and the first plate (311d). The heat dissipation member (440) may be disposed between the first shielding member (431) and the first adhesive member (450).

[0191] According to one embodiment, a first adhesive member (450) may be disposed between the first plate (311d) and the heat dissipation member (440). The first adhesive member (450) may include a double-sided tape. The first adhesive member (450) may be configured to adhere the antenna structure (400) to the first plate (311d). The shape and / or size of the first adhesive member (450) may be formed to correspond to the shape and / or size of the heat dissipation member (440).

[0192] According to one embodiment, the second adhesive member (470) may be disposed between the second shielding member (433) and the support member (470). The second adhesive member (470) may at least partially overlap the opening (312) in the second direction (e.g., the Z-axis direction of FIGS. 7 to 9). The second adhesive member (470) may include a double-sided tape. The second adhesive member (470) may be configured to adhere the second shielding member (433) and the support member (470). The shape and / or size of the second adhesive member (470) may be formed to correspond to the shape and / or size of the second shielding member (433).

[0193] In one embodiment, the support member (460) can be positioned between the second adhesive member (470) and the third adhesive member (480). The support member (460) can at least partially overlap the opening (312) in the second direction (e.g., the Z-axis direction of FIGS. 7 to 9).

[0194] In one embodiment, the support member (460) may include a solid material. For example, the support member (460) may include stainless steel (STS) or plastic. The size of the support member (460) may be larger than the size of the opening (312), but is not limited thereto. The support member (460) may cover the opening (312). The support member (460) may be defined and / or referred to as a covering member.

[0195] In one embodiment, the support member (460) may be disposed or seated on an inner rim or inner edge of the first plate (311d) defining the first opening (312). The support member (460) may be bonded to the inner rim or inner edge defining the first opening (312) via a third adhesive member (480).

[0196] According to one embodiment, the support member (460) can support the extension portion (413) so that the extension portion (413) is not inserted into the opening (312) when an external impact or pressure is applied to the electronic device. As the support member (460) covers the opening (312) of the first plate (311d), the flatness or rigidity of the first plate (311d) can be improved.

[0197] According to one embodiment, the support member (460) may be configured to be bonded to the first plate (311d) via a third adhesive member (480).

[0198] According to one embodiment, a third adhesive member (480) may be disposed between the first plate (311d) and the support member (460). The third adhesive member (480) may include a double-sided tape.

[0199] According to one embodiment, the third adhesive member (480) may be positioned or secured to at least a portion of the inner perimeter or inner edge of the first plate (311d) defining the opening (312). The third adhesive member (480) may be configured to secure or couple the support member (460) to the first plate (311d).

[0200] In one embodiment, the third adhesive member (480) can be configured to join at least two edges of the support member (460) and at least two inner edges or inner borders defining the opening (312). For example, the third adhesive member (380) can be bonded to at least two edges of the support member (460) and at least two inner borders defining the opening (312). The third adhesive member (480) can include a first adhesive portion (481) or a second adhesive portion (482). One end of the first adhesive portion (481) can be connected to one end of the second adhesive portion (482). The first adhesive portion (481) and the second adhesive portion (482) can extend in different directions. The first adhesive portion (481) can be arranged perpendicular to the second adhesive portion (482), but is not limited thereto.

[0201] In one embodiment, the first adhesive portion (481) may be configured to join a first edge of the support member (460) and a first inner edge defining the opening (312). The second adhesive portion (482) may be configured to join a second edge of the support member (460) and a second inner edge defining the opening (312).

[0202] In one embodiment, at least a portion of a connecting portion (416) may be positioned between the remaining edge(s) of the support member (460) where the third adhesive member (480) is not positioned and the remaining inner edge(s) defining the opening (312). For example, the connecting portion (416) may be positioned to be inserted into the opening (312) through the space between the remaining edge(s) of the support member (460) and the remaining inner edge(s).

[0203] According to one embodiment, at least a portion (4212) of the first coil (421) may overlap the opening (312) in a second direction (e.g., in the Z-axis direction of FIGS. 7 to 9) as it is disposed in the extension portion (413). At least a portion (4222) of the second coil (422) may overlap the opening (312) in a second direction (e.g., in the Z-axis direction of FIGS. 7 to 9) as it is disposed in the extension portion (413). As at least one coil (420) at least partially overlaps the opening (312), the design area of ​​at least one coil (420) disposed or mounted on the substrate (410) may be improved.

[0204] The embodiments of FIGS. 10 to 11 can be combined with the embodiments of FIGS. 1 to 9, or the embodiments of FIGS. 12 to 15b.

[0205] Referring to FIG. 10, the antenna structure (400) (e.g., the antenna structure (400) of FIGS. 7 to 9) may include a substrate (410), a connecting portion (416), a first adhesive member (450), or a support member (460).

[0206] The configuration of the substrate (410), the connecting portion (416), the first adhesive member (450), or the support member (460) of FIG. 10 may be partially or entirely the same as the configuration of the substrate (410), the connecting portion (416), the first adhesive member (450), or the support member (460) of FIGS. 7 to 9.

[0207] According to one embodiment, the antenna structure (400) may include a first region (401), a second region (402), or a third region (403). The first region (401) of the antenna structure (400) may be defined as a base portion of the substrate (410) (e.g., the base portion (411) of FIGS. 7 to 9) and at least a portion of the components laminated on the base portion. The second region (402) of the antenna structure (400) may be defined as a bend portion (e.g., the bend portion (412) of FIGS. 7 to 9) and at least a portion of the components laminated on the bend portion. The third region (403) of the antenna structure (400) may be defined as an extension portion (e.g., the extension portion (413) of FIGS. 7 to 9) and at least a portion of the components laminated on the extension portion.

[0208] In one embodiment, the third region (403) may be configured to be foldable relative to the first region (401). For example, the second region (402) may be connected to the first region (401) and the third region (403), and the second region (402) may be at least partially foldable or unfoldable.

[0209] FIG. 11 is a schematic diagram for explaining the stacked structure of regions (e.g., regions (401, 402, 403) of FIG. 10) of an antenna structure (e.g., antenna structure (400) of FIGS. 7 to 10).

[0210] Referring to FIGS. 10 and 11, the substrate (410) may include a flexible printed circuit board (FPCB). The substrate (410) may include a base portion (411) (e.g., the base portion (411) of FIGS. 7 to 9), a bending portion (412) connected to the base portion (411) (e.g., the bending portion (412) of FIGS. 7 to 9), or an extension portion (413) connected to the bending portion (412) (e.g., the extension portion (413) of FIGS. 7 to 9).

[0211] According to one embodiment, the first region (401) may include a base portion (411) (e.g., the base portion (411) of FIGS. 7 to 9), a first shielding member (431) (e.g., the first shielding member (431) of FIGS. 7 to 9), a heat dissipation member (440) (e.g., the heat dissipation member (440) of FIGS. 7 to 9), or a first adhesive member (450) (e.g., the first adhesive member (450) of FIGS. 7 to 9).

[0212] According to one embodiment, the base portion (411) may include a first film layer (4111), a first conductive layer (4112), a fourth conductive layer (4113), a first-first coverlay layer (4114), or a first-second coverlay layer (4115).

[0213] According to one embodiment, the first film layer (4111) may be a polyimide (PI)-based film layer.

[0214] According to one embodiment, a first conductive layer (4112) may be disposed on one side of the first film layer (4111) (e.g., a side facing the +Z direction in FIG. 11), and a fourth conductive layer (4113) may be disposed on the other side of the first film layer (4111) (e.g., a side facing the -Z direction in FIG. 11). The first conductive layer (4112) and the fourth conductive layer (4113) may be electrically connected through conductive vias.

[0215] According to one embodiment, the first film layer (4111), the first conductive layer (4112), and the fourth conductive layer (4113) may form a flexible copper clad laminate (FCCL). The first conductive layer (4112) may be a metal plate (e.g., copper (Cu)) laminated on one surface of the first film layer (4111). The fourth conductive layer (4113) may be a metal plate (e.g., copper (Cu)) laminated on the other surface of the first film layer (4111).

[0216] According to one embodiment, each of the first conductive layer (4112) and the fourth conductive layer (4113) may include signal wiring for signal transmission.

[0217] According to one embodiment, a 1-1 coverlay layer (4114) may be disposed on one side of the 4th conductive layer (4114) (e.g., the side facing the -Z direction of FIG. 11). The 1-1 coverlay layer (4114) may be a substrate layer based on polypropylene glycol (PPG) or polyimide (PI).

[0218] According to one embodiment, a first-second coverlay layer (4115) may be disposed on one side of the first conductive layer (4112) (e.g., the side facing the +Z direction in FIG. 11). The first-second coverlay layer (4115) may be a substrate layer based on polypropylene glycol (PPG) or polyimide (PI).

[0219] According to one embodiment, a first shielding member (431) may be arranged on the first-second coverlay layer (4115). The first shielding member (431) may include a plurality of shielding sheets. According to the illustrated embodiment, the first shielding member (431) may include, but is not limited to, five shielding sheets. The thickness of the first shielding member (431) (e.g., the thickness in the Z-axis direction of FIG. 11) may be greater than the thickness of the second shielding member (433) (e.g., the thickness in the Z-axis direction of FIG. 11), but is not limited thereto. The number of the second shielding members (433) may be less than the number of the first shielding members (431), but is not limited thereto.

[0220] According to one embodiment, a heat dissipation member (440) may be disposed on the first shielding member (431). A first adhesive member (450) may be disposed on the heat dissipation member (440).

[0221] According to one embodiment, the second region (402) may include a bending portion (412) (e.g., the bending portion (412) of FIGS. 7 to 9).

[0222] According to one embodiment, the bending portion (412) may include a second film layer (4121), a second conductive layer (4122), a second-first coverlay layer (4124), or a second-second coverlay layer (4125).

[0223] According to one embodiment, the second film layer (4121) may be a polyimide (PI)-based film layer.

[0224] According to one embodiment, a second conductive layer (4122) may be disposed on one side of the second film layer (4121) (e.g., the side facing the +Z direction in FIG. 11).

[0225] In one embodiment, the second film layer (4121) and the second conductive layer (4122) may form a flexible copper clad laminate (FCCL). The second conductive layer (4122) may be a metal plate (e.g., copper (Cu)) laminated on one surface of the second film layer (4121).

[0226] According to one embodiment, the second challenge layer (4122) may include signal wiring for signal transmission.

[0227] According to one embodiment, a second-first coverlay layer (4124) may be disposed on the other side of the second film layer (4121) (e.g., the side facing the -Z direction of FIG. 11). The second-first coverlay layer (4124) may be a substrate layer based on polypropylene glycol (PPG) or polyimide (PI).

[0228] According to one embodiment, a second-second coverlay layer (4125) may be disposed on one side of the second conductive layer (4122) (e.g., the side facing the +Z direction in FIG. 11). The second-second coverlay layer (4125) may be a substrate layer based on polypropylene glycol (PPG) or polyimide (PI).

[0229] According to one embodiment, the third region (403) may include an extension portion (413) (e.g., the extension portion (413) of FIGS. 7 to 9), a second shielding member (433) (e.g., the second shielding member (433) of FIGS. 7 to 9), a second adhesive member (470) (e.g., the second adhesive member (470) of FIGS. 7 to 9), a support member (460) (e.g., the support member (460) of FIGS. 7 to 9), or a third adhesive member (480) (e.g., the third adhesive member (480) of FIGS. 7 to 9).

[0230] According to one embodiment, the extension portion (413) may include a third film layer (4131), a third conductive layer (4132), a third-first coverlay layer (4134), or a third-second coverlay layer (4135).

[0231] According to one embodiment, the third film layer (4131) may be a polyimide (PI)-based film layer.

[0232] According to one embodiment, a third conductive layer (4132) may be disposed on one side of the third film layer (4131) (e.g., the side facing the +Z direction in FIG. 11).

[0233] In one embodiment, the third film layer (4131) and the third conductive layer (4132) may form a flexible copper clad laminate (FCCL). The third conductive layer (4132) may be a metal plate (e.g., copper (Cu)) laminated on one surface of the third film layer (4131).

[0234] According to one embodiment, the third conductive layer (4132) may include signal wiring for signal transmission.

[0235] According to one embodiment, a 3-1 coverlay layer (4134) may be disposed on the other side of the 3rd film layer (4131) (e.g., the side facing the -Z direction of FIG. 11). The 3-1 coverlay layer (4134) may be a substrate layer based on polypropylene glycol (PPG) or polyimide (PI).

[0236] According to one embodiment, a 3-2 coverlay layer (4135) may be disposed on one side of the 3rd conductive layer (4132) (e.g., the side facing the +Z direction in FIG. 11). The 3-2 coverlay layer (4135) may be a substrate layer based on polypropylene glycol (PPG) or polyimide (PI).

[0237] According to one embodiment, a second shielding member (433) may be arranged on the 3-2 coverlay layer (4135). The second shielding member (433) may include a plurality of shielding sheets. According to the illustrated embodiment, the second shielding member (433) may include three shielding sheets, but is not limited thereto. The number of second shielding members (433) may be less than the number of first shielding members (431), but is not limited thereto.

[0238] According to one embodiment, a second adhesive member (470) may be disposed on the second shielding member (433). A support member (460) may be disposed on the second adhesive member (470). A third adhesive member (480) may be disposed on the support member (460).

[0239] In one embodiment, the first film layer (4111), the second film layer (4121), and the third film layer (4131) may be formed of substantially the same film layers. For example, the second film layer (4121) may be formed integrally with the first film layer (4111) and the third film layer (4131), but is not limited thereto.

[0240] In one embodiment, the first conductive layer (4112), the second conductive layer (4122), and the third conductive layer (4132) may be formed of substantially the same conductive layers. For example, the second conductive layer (4122) may be formed integrally with the first conductive layer (4112) and the third conductive layer (4132), but is not limited thereto.

[0241] In one embodiment, the first-first coverlay layer (4114), the second-first coverlay layer (4124), and the third-first coverlay layer (4134) may be formed of substantially the same coverlay layer. For example, the second-first coverlay layer (4124) may be formed integrally with the first-first coverlay layer (4114) and the third-first coverlay layer (4134), but is not limited thereto. In one embodiment, the first-second coverlay layer (4115), the second-second coverlay layer (4125), and the third-second coverlay layer (4135) may be formed of substantially the same coverlay layer. For example, the second-second coverlay layer (4125) may be formed integrally with the first-second coverlay layer (4115) and the third-second coverlay layer (4135), but is not limited thereto. The above coverlay layer may be defined and / or referred to as an insulating layer.

[0242] According to one embodiment, at least one coil (e.g., at least one coil (420) of FIGS. 7 to 9) may be positioned or mounted on an outer surface (e.g., a surface facing the -Z direction of FIG. 11) of the first-1 coverlay layer (4114), the second-1 coverlay layer (4124), and the third-1 coverlay layer (4134).

[0243] According to one embodiment, the base portion (411) may include a plurality of first layers (4111, 4112, 4113, 4114, 4115). The extension portion (413) may include a plurality of second layers (4131, 4132, 4133, 4134). The number of the first layers (4111, 4112, 4113, 4114, 4115) may be different from the number of the second layers (4131, 4132, 4133, 4134). For example, the number of first layers (4111, 4112, 4113, 4114, 4115) may be greater than the number of second layers (4131, 4132, 4133, 4134).

[0244] According to one embodiment, the thickness of the first region (401) (e.g., the thickness in the Z-axis direction of FIG. 11) may be greater than the thickness of the second region (402). The thickness of the third region (403) may be greater than the thickness of the second region (402). The thickness of the third region (403) may be less than the thickness of the first region (401), but is not limited thereto.

[0245] In one embodiment, the base portion (411) may be thicker than the bend portion (412) as it includes the fourth conductive layer (4113). The bend portion (412) may be relatively more flexible than the base portion (411) as it is configured to be thinner than the base portion (411). The bend portion (412) may be defined as a portion of a substrate (e.g., the substrate (410) of FIG. 10) that is at least partially folded or unfolded. The bend portion (412) may be at least partially folded or unfolded. As the bend portion (412) is folded or unfolded, the third region (403) and / or the extension portion (413) may be configured to be foldable with respect to the first region (401) and / or the base portion (411).

[0246] According to one embodiment, the third region (403) and / or the extension portion (413) may overlap with an opening (312) (e.g., the opening (312) of FIG. 7) formed in a first plate (311d) (e.g., the first plate (311d) of FIG. 7) of a first cover member (311) (e.g., the first cover member (311) of FIG. 7). For example, the extension portion (413) may be disposed over the opening (312).

[0247] According to one embodiment, the first cover member (311) may include a protruding portion (311e). The protruding portion (311e) may protrude from at least a portion of the first plate (311d). The protruding portion (311e) may be arranged to correspond to the bending portion (412). For example, the protruding portion (311e) may protrude toward the second region (402) and / or the bending portion (412). Since the second region (402) and / or the bending portion (412) is configured to be thinner than the other regions (401, 403) and / or the other portions (411, 413), a gap may be formed between the second region (402) and / or the extension portion (412) and the first plate (311d). As the gap is filled by the protruding portion (412), the gap between the bending portion (412) and the first plate (311d) can be eliminated or minimized. When an external impact is applied to the electronic device, the second region (402) and / or the bending portion (412) can be supported by the protruding portion (412), and the occurrence of cracks or tears in the second region (402) and / or the bending portion (412) can be limited and / or reduced. The protruding portion (311d) can be defined and / or referred to as a rib.

[0248] FIG. 12 is a cross-sectional view taken along line CC' of FIG. 2 according to one embodiment of the present disclosure.

[0249] The embodiment of FIG. 12 can be combined with the embodiments of FIGS. 1 to 11, or the embodiments of FIGS. 13a to 15b.

[0250] Referring to FIG. 12, an electronic device (101) (e.g., the electronic device (101) of FIG. 1 or the electronic device (101) of FIGS. 2 to 7) may include a housing (310), a display (330), an antenna structure (400), a battery (389), or a conductive connecting member (390).

[0251] The configuration of the housing (310), the display (330), or the battery (389) of FIG. 12 may be partially or entirely identical to the configuration of the housing (310), the display (330), or the battery (389) of FIG. 6. The configuration of the antenna structure (400) of FIG. 12 may be partially or entirely identical to the configuration of the antenna structure (400) of FIG. 7.

[0252] According to one embodiment, the housing (310) may include a first housing portion (301) (e.g., the first housing portion (301) of FIGS. 6-7) or a second housing portion (302) (e.g., the second housing portion (302) of FIGS. 6-7).

[0253] According to one embodiment, the first housing portion (301) may include a first cover member (311) (e.g., the first cover member (311) of FIGS. 6 to 7), a frame (313) (e.g., the frame (313) of FIG. 6), or a first rear plate (315) (e.g., the first rear plate (315) of FIG. 6). The first cover member (311) may include a first plate (311d) (e.g., the first plate (311d) of FIGS. 6 to 7) or an opening (312) (e.g., the opening (312) of FIGS. 6 to 7).

[0254] According to one embodiment, the second housing portion (302) may include a second cover member (321) (e.g., the second cover member (321) of FIG. 6). The second cover member (321) may include a second plate (321d) (e.g., the second plate (321d) of FIG. 6).

[0255] According to one embodiment, when the housing (310) is in a slide-in state (e.g., FIG. 2 or FIG. 5a), the battery (389) may be positioned between the first plate (311d) and the second plate (321d).

[0256] According to one embodiment, when the state of the housing (310) is a slide-in state (e.g., FIG. 2 or FIG. 5a), the second plate (321d) may be disposed between the display (330) and the first plate (311d). When the state of the housing (310) is a slide-in state, the first housing portion (301) and / or the first plate (311d) may be interpreted as a configuration disposed on the outside of the electronic device (101), and the second housing portion (302) and / or the second plate (321d) may be interpreted as a configuration disposed on the inside of the electronic device (101). For example, when the state of the housing (310) is a slide-in state, the first plate (311d) may be disposed at least partially on the outside of the second plate (321d).

[0257] According to one embodiment, the antenna structure (400) may include a connecting portion (416) (e.g., connecting portion (416) of FIGS. 7-9). The connecting portion (416) may extend from a substrate (e.g., substrate (410) of FIGS. 7-9). At least a portion of the connecting portion (416) may be disposed in the opening (312). The connecting portion (416) may be disposed to overlap the opening (312). The connecting portion (416) may be physically and / or electrically connected to a conductive connecting member (390) (e.g., conductive connecting member (390) of FIGS. 15A and 15B).

[0258] In one embodiment, the conductive connecting member (390) may include a flexible printed circuit board (FPCB). In one embodiment, the conductive connecting member (390) may be electrically connected to the connecting portion (416) and the first circuit board (e.g., the first circuit board (348) of FIG. 6). In one embodiment, the antenna structure (400) may be electrically connected to the first circuit board via the conductive connecting member (390).

[0259] According to one embodiment, the conductive connecting member (390) may include a connector (3901). The connector (3901) may be electrically connected to the connecting portion (416). The connector (3901) may overlap the opening (312) in a second direction (e.g., the Z-axis direction of FIG. 11).

[0260] According to one embodiment, the connector (3901) may include a connection pad (3902). The connection pad (3902) may be physically and / or electrically connected to the connection portion (416). The connection pad (3902) may include a soldering, socket, or board-to-board connector.

[0261] FIGS. 13a, 13b, and 13c are drawings for explaining an assembly process of an electronic device according to one embodiment of the present disclosure.

[0262] The embodiments of FIGS. 13a to 13c can be combined with the embodiments of FIGS. 1 to 12 or the embodiments of FIGS. 14 to 15b.

[0263] Referring to FIG. 13A, an electronic device (101) (e.g., the electronic device (101) of FIG. 1 or the electronic device (101) of FIGS. 2 to 7) may include a first cover member (311) (e.g., the first cover member (311) of FIGS. 6 to 7). The first cover member (311) may include a first plate (311d) (e.g., the first plate (311d) of FIGS. 6 to 7) or an opening (312) (e.g., the opening (312) of FIGS. 6 to 7).

[0264] According to one embodiment, the assembly process of the electronic device (101) may include a process of laminating an antenna structure (400) (e.g., the antenna structure (400) of FIGS. 7 to 9) on a first plate (311d).

[0265] According to one embodiment, when laminating the antenna structure (400) on the first plate (311d), the base portion (411) (e.g., the base portion (411) of FIGS. 7 to 9) of the substrate (410) (e.g., the substrate (410) of FIGS. 7 to 9) may be laminated on an outer surface (e.g., a surface facing the -Z direction of FIG. 13a) of the first plate (311d). When laminating the antenna structure (400) on the first plate (311d), the extension portion (413) (e.g., the extension portion (413) of FIGS. 7 to 9) may be folded relative to the base portion (411) so that the opening (312) is opened. When stacking the antenna structure (400) on the first plate (311d), the connecting portion (416) (e.g., the connecting portion (416) of FIGS. 7 to 9) may be placed in the opening (312). The connector (3491) of the second circuit board (349) (e.g., the second circuit board (349) of FIG. 6) placed on the first plate (311d) may also be placed in the opening (312).

[0266] Referring to FIG. 13B, the assembly process of the electronic device (101) may include a process of joining a second housing portion (302) (e.g., the second housing portion (302) of FIG. 6) and a conductive connection member (390). The second housing portion (302) may be joined to the first cover member (311) so as to be slidable relative to the first cover member (311). The conductive connection member (390) may be positioned such that a connector (3901) of the conductive connection member (390) is aligned with the opening (312). The connection portion (416) of the antenna structure (400) and the connector (3491) of the second circuit board (349) may be physically and / or electrically connected to the connector (3901) of the conductive connection member (390). The connector (3901) of the conductive connecting member (390), the connecting portion (416) of the antenna structure (400) and the connector (3491) of the second circuit board (349) can be arranged to overlap with the opening (312).

[0267] Referring to FIG. 13C, the assembly process of the electronic device (101) may include a process of closing the second opening (312). After the second housing portion (302) and the conductive connecting member (390) are completed, the extension portion (413) of the antenna structure (400) may be unfolded relative to the base portion (411) to cover the opening (312). For example, the extension portion (413) may be unfolded relative to the base portion (411) as the bending portion (412) (e.g., the bending portion (412) of FIGS. 7 to 9) is unfolded. The connector (3901) of the conductive connecting member (390) overlapping the opening (312), the connecting portion (416) of the antenna structure (400), and the connector (3491) of the second circuit board (349) may be at least partially covered by the extension portion (413). Components directly or indirectly laminated on the extension portion (413) (e.g., the second shielding member (433), the second adhesive member (470), and the support member (460) of FIG. 7) may overlap the opening (312). The support member (e.g., the support member (460) of FIG. 7) may be bonded to the inner edge of the first plate (311d) defining the opening (312) via a third adhesive member (e.g., the third adhesive member (480) of FIG. 7).

[0268] In the antenna structure (400) of FIGS. 13A to 13C, at least one coil (e.g., at least one coil (420) of FIG. 14) is not illustrated, but the antenna structure (400) may be laminated and / or assembled to the first plate (311d) while including at least one coil. In some embodiments, after the antenna structure (400) is laminated and / or assembled to the first plate (311d) while not including at least one coil, at least one coil may be formed in the antenna structure (400) by a process of forming at least one coil.

[0269] Referring to FIG. 14, an electronic device (101) (e.g., the electronic device (101) of FIG. 1, or the electronic device (101) of FIGS. 2 to 7) may include a first cover member (311), a second housing portion (302), a second circuit board (349), or an antenna structure (400).

[0270] The configuration of the first cover member (311), the second housing portion (302), the second circuit board (349), or the antenna structure (400) of FIG. 14 may be partially or entirely the same as the configuration of the first cover member (311), the second housing portion (302), the second circuit board (349), or the antenna structure (400) of FIGS. 7 to 9.

[0271] According to one embodiment, the antenna structure (400) may include a substrate (410) (e.g., substrate (410) of FIGS. 7 to 9) that includes a base portion (411) (e.g., base portion (411) of FIGS. 7 to 9), a bend portion (412) (e.g., bend portion (412) of FIGS. 7 to 9), and an extension portion (413) (e.g., extension portion (413) of FIGS. 7 to 9).

[0272] According to one embodiment, the connecting portion (416) of the antenna structure (400) (e.g., the connecting portion (416) of FIGS. 7 to 9) and the connector (3491) of the second circuit board (349) (e.g., the connector (3491) of FIGS. 13A to 13B) may be electrically connected to a connector (e.g., the connector (3901) of FIGS. 13A to 13B) of a conductive connecting member (e.g., the conductive connecting member (390) of FIGS. 13A to 13B).

[0273] According to one embodiment, the base portion (411) can be laminated on an outer surface (e.g., a surface facing the -Z direction in FIG. 14) of a first plate (311d) (e.g., the first plate (311d) in FIGS. 6 to 7).

[0274] According to one embodiment, the antenna structure (400) may include at least one coil (420) (e.g., at least one coil (420) of FIGS. 7 to 9). The at least one coil (420) may be positioned or mounted on an outer surface of the substrate (410) (e.g., a surface facing the -Z direction of FIG. 14). The at least one coil (420) may be defined and / or referred to as at least one antenna pattern.

[0275] According to one embodiment, at least one coil (420) may include a first coil (421) (e.g., the first coil (421) of FIGS. 7 to 9) or a second coil (422) (e.g., the second coil (422) of FIGS. 7 to 9).

[0276] According to one embodiment, the first coil (421) may include a first portion (4211) disposed on the base portion (411) (e.g., the first portion (4211) of FIG. 9), or a second portion (4212) disposed on the extension portion (413) (e.g., the second portion (4212) of FIG. 9).

[0277] According to one embodiment, the second coil (422) may include a third portion (4221) disposed in the base portion (411) (e.g., the third portion (4221) of FIG. 9) or a fourth portion (4222) disposed in the extension portion (413) (e.g., the fourth portion (4222) of FIG. 9).

[0278] According to one embodiment, the second portion (4212) of the first coil (421) can at least partially overlap with the opening (e.g., opening (312) of FIGS. 13A to 13C). The fourth portion (4222) of the second coil (422) can at least partially overlap with the opening (e.g., opening (312) of FIGS. 13A to 13C).

[0279] According to one embodiment, since at least a portion of the first coil (421) is positioned to overlap with the opening, a sufficient placement area or mounting area of ​​the first coil (421) can be secured on the substrate (410). As a sufficient placement area or mounting area of ​​the first coil (421) is secured, a wireless charging recognition distance and wireless charging efficiency through the first coil (421) can be improved.

[0280] Charging recognition distance of comparative example Charging recognition distance of example Up / down / left / right Up / down / left / right 1st charging pad 1199101191110 2nd charging pad 10108101010911 3rd charging pad 1110121111101211 4th charging pad 1010101010101110 5th charging pad 77910

[0281] Table 1 above is a table that describes the wireless charging recognition distance of the antenna structure according to a comparative example and the wireless charging recognition distance of the antenna structure according to an embodiment of the present disclosure. The antenna structure according to the comparative example is similar to the antenna structure of FIG. 14 and represents an antenna structure in which the first coil is not arranged in the extended portion (413) of FIG. 14. The antenna structure (400) according to an embodiment of the present disclosure is identical to the antenna structure of FIG. 14 and represents an antenna structure in which the first coil (421) is arranged in the extended portion (413) of FIG. 14. The charging pads may be wireless charging devices (or wireless charging pads).

[0282] The wireless charging recognition distance can be defined as a distance at which charging is possible even if the center of the coil of the antenna structure and the center of the coil of the wireless charging pad are misaligned. For example, when the antenna structure of one embodiment corresponds to the first charging pad, it can be confirmed that the wireless charging recognition distance of the antenna structure is such that charging is recognized up to a distance at which the center of the first coil (421) of the antenna structure (400) is misaligned with the center of the coil of the first charging pad by 11 mm, 9 mm, 11 mm, and 10 mm in the up, down, left, and right directions, respectively.

[0283] When examining the wireless charging recognition distance of the antenna structure (400) according to the comparative example and the antenna structure according to the embodiment of the present disclosure with respect to different charging pads, it can be confirmed that the wireless charging recognition distance of the antenna structure (400) according to the embodiment of the present disclosure is improved for four charging pads among five charging pads compared to the wireless charging recognition distance of the antenna structure (400) according to the comparative example.

[0284] Reader mode (reader mode) Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7 Mode 8 Mode 9 Mode Comparison Example 35 42 15 22 15 14 3 0 6 0 60 Day Example 37 43 17 24 15 15 3 16 0 60

[0285] Table 2 above is a table that describes the NFC recognition distance of the antenna structure according to the comparative example and the NFC recognition distance of the antenna structure according to one embodiment of the present disclosure. The antenna structure according to the comparative example is similar to the antenna structure of FIG. 14 and represents an antenna structure in which the second coil is not arranged in the extended portion (413) of FIG. 14. The antenna structure (400) according to one embodiment of the present disclosure is identical to the antenna structure of FIG. 14 and represents an antenna structure in which the second coil (422) is arranged in the extended portion (413) of FIG. 14. The reader modes represent an NFC recognition mode through the antenna structure according to the comparative example or an NFC recognition mode through the antenna structure (400) according to one embodiment of the present disclosure.

[0286] The NFC recognition distance can be defined as the vertical distance at which the coil of the antenna structure can recognize an NFC tag. For example, in the first mode, the second coil (422) of the antenna structure (400) according to one embodiment can recognize an NFC tag that is spaced apart from the antenna structure by 37 mm in the vertical direction. When examining the NFC recognition distances of the antenna structure (400) according to the comparative example and the antenna structure (400) according to one embodiment in different reader modes, it can be confirmed that the NFC recognition distance of the antenna structure (400) according to one embodiment of the present disclosure is improved compared to the NFC recognition distance of the antenna structure (400) according to the comparative example for six of the nine reader modes.

[0287] FIG. 15A is a rear view of an electronic device in a slide-in state according to one embodiment of the present disclosure. FIG. 15B is a rear view of an electronic device in a slide-out state according to one embodiment of the present disclosure.

[0288] The embodiments of FIGS. 15a and 15b can be combined with the embodiments of FIGS. 1 to 14.

[0289] Referring to FIGS. 15A and 15B, an electronic device (101) (e.g., the electronic device (101) of FIG. 1 or the electronic device (101) of FIGS. 2 to 6) may include a housing (310) (e.g., the housing (310) of FIG. 6).

[0290] According to one embodiment, the housing (310) may include a first housing portion (301) (e.g., the first housing portion (301) of FIG. 6) including a first cover member (311) (e.g., the first cover member (311) of FIG. 6), or a second housing portion (302) (e.g., the second housing portion (302) of FIG. 6) including a second cover member (321).

[0291] According to one embodiment, the second housing portion (302) can be configured to move between a retracted position (e.g., FIG. 2, FIG. 5A, or FIG. 15A) and an extended position (e.g., FIG. 3, FIG. 5B, or FIG. 15B) relative to the first housing portion (301).

[0292] According to one embodiment, the antenna structure (400) (e.g., the antenna structure (400) of FIGS. 7 to 9) may include a substrate (410) (e.g., the substrate (410) of FIGS. 7 to 9).

[0293] According to one embodiment, at least a portion of the substrate (410) may be disposed on a first plate (311d) of the first cover member (311) (e.g., the first plate (311d) of FIGS. 6 to 7), and an extended portion (413) of the substrate (410) (e.g., the extended portion (413) of FIGS. 7 to 9) may overlap an opening (312) of the first plate (311d) (e.g., the opening (312) of FIGS. 6 to 7).

[0294] The embodiments of FIGS. 15A and 15B are illustrated, for convenience of explanation, with the extension portion (416) opening the opening (312); however, the extension portion (416) may be positioned and used to close the opening (312).

[0295] According to one embodiment, a connecting portion (416) of a substrate (410) (e.g., connecting portion (416) of FIGS. 7 to 9) may be physically and / or electrically connected to a connector (3901) (e.g., connector (3901) of FIG. 13b) of a conductive connecting member (390) (e.g., conductive connecting member (390) of FIG. 13b).

[0296] According to one embodiment, at least a portion of the conductive connecting member (390) may be electrically connected to a first circuit board (348) (e.g., the first circuit board (348) of FIG. 6).

[0297] According to one embodiment, when the state of the electronic device (101) is a slide-in state (e.g., FIG. 2, FIG. 5A, or FIG. 15A), the conductive connecting member (390) may be configured to be at least partially folded as the second housing portion (302) is positioned in a retracted position relative to the first housing portion (301).

[0298] According to one embodiment, when the electronic device (101) is in a slide-out state (e.g., FIG. 3, FIG. 5B, or FIG. 15B), as the second housing portion (302) is positioned in an extended position relative to the first housing portion (301), the first circuit board (348) may be moved together with the second housing portion (302) away from the connection portion (416). In this case, the conductive connection member (390) may be at least partially unfolded so that the electrical connection state between the antenna structure (400) and the first circuit board (348) is maintained.

[0299] According to one embodiment, when the electronic device (101) is in a slide-in state or a slide-out state, the electrical connection between the first circuit board (348) and the antenna structure (400) can be maintained through the conductive connection member (390). The wireless charging power generated through the antenna structure (400) can be transferred to the first circuit board (348) through the conductive connection member (390), and the power transferred to the first circuit board (348) can be transferred to a battery (e.g., a battery (389) of FIG. 6) so that the battery can be charged.

[0300] According to one embodiment of the present disclosure, an antenna structure having an improved placement area or mounting area of ​​a wireless charging coil and an electronic device including the same can be provided.

[0301] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0302] According to one embodiment of the present disclosure, an antenna structure with improved charging efficiency and charging recognition distance of a wireless charging coil and an electronic device including the same can be provided.

[0303] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0304] According to one embodiment of the present disclosure, an electronic device (101) may include a housing (310), a circuit board (348), an antenna structure (400), or a conductive connection member (390). The housing (310) may include a first housing portion (301) or a second housing portion (302). The first housing portion (301) may include an opening (312). The second housing portion (302) may be configured to move relative to the first housing portion (301). The circuit board (348) may be disposed in the second housing portion (302). The antenna structure (400) may be disposed in the first housing portion (301). The conductive connection member (390) may be electrically connected to the circuit board (348) and the antenna structure (400). The antenna structure (400) may include a substrate (410) or a first coil (422). The substrate (410) may include a base portion (411) or an extension portion (413). The base portion (411) may be disposed on the first housing portion (301). The extension portion (413) may extend from the base portion (411). The extension portion (413) may be disposed to overlap the opening (312). The first coil (421) may be disposed on the substrate (410). At least a portion of the first coil (421) may overlap the opening (312).

[0305] In one embodiment, the second housing portion (302) may include a second plate (321d). The first housing portion (301) may include a first plate (311d). The first plate (311d) may be disposed at least partially outside the second plate (321d). The first plate (311d) may include the opening (312). The circuit board (348) may be disposed on the second plate (321d). The antenna structure (400) may be disposed on the first plate (311d).

[0306] In one embodiment, the second housing portion (302) may be configured to move in a first direction relative to the first housing portion (301). The conductive connection member (390) may include a connector (3901). The connector (3901) may be electrically connected to the antenna structure (400). The connector (3901) may overlap the conductive connection member (390) with the opening (312) in a second direction perpendicular to the first direction.

[0307] According to one embodiment, the base portion (411) may include a plurality of first layers. The extension portion (413) may include a plurality of second layers. The number of the first layers may be different from the number of the second layers.

[0308] In one embodiment, the number of the first layers may be greater than the number of the second layers.

[0309] According to one embodiment, the extension portion (413) may be configured to be bendable relative to the base portion (411).

[0310] According to one embodiment, the antenna structure (400) may further include a support member (460). The support member (460) may cover the opening (312). The support member (460) may be configured to support the extension portion (413).

[0311] According to one embodiment, the electronic device (101) may further include an adhesive member (480). The adhesive member (480) may be positioned between the support member (460) and an inner edge of the first housing portion (301) defining the opening (312).

[0312] According to one embodiment, the adhesive member (480) can be adhered to at least two edges of the support member (460).

[0313] According to one embodiment, the antenna structure (400) may further include a first shielding member (431) or a second shielding member (433). The first shielding member (431) may be disposed below the base portion (411). The second shielding member (433) may be disposed below the extension portion (413). The thickness or number of the second shielding members (433) may be smaller than the thickness or number of the first shielding members (431).

[0314] According to one embodiment, the electronic device (101) may further include a heat dissipation member (440). The heat dissipation member (440) may be disposed between the first shielding member (431) and the first housing portion (301).

[0315] According to one embodiment, the antenna structure (400) may further include a second coil (422). The second coil (422) may be disposed at an edge of the substrate (410). The first coil (421) may be disposed at least partially inside the second coil (422).

[0316] According to one embodiment, at least a portion of the second coil (422) may overlap the opening (312).

[0317] According to one embodiment, the electronic device (101) may further include a battery (389). The battery (389) may be disposed within the housing (310). The first coil (421) may be electrically connected to the battery (389) through the conductive connecting member (390) and the circuit board (348).

[0318] According to one embodiment, the conductive connecting member (390) may include a flexible printed circuit board (FPCB).

[0319] According to one embodiment of the present disclosure, an electronic device (101) may include a housing (310), a circuit board (348), an antenna structure (400), or a conductive connection member (390). The housing (310) may include a first housing portion (301) or a second housing portion (302). The first housing portion (301) may include an opening (312). The second housing portion (302) may be configured to move relative to the first housing portion (301). The circuit board (348) may be disposed in the second housing portion (302). The antenna structure (400) may be disposed in the first housing portion (301). The conductive connection member (390) may be electrically connected to the circuit board (348) and the antenna structure (400). The antenna structure (400) may include a substrate (410) or a first coil (422). The substrate (410) may include a base portion (411), an extension portion (413), or a connection portion (416). The base portion (411) may be disposed in the first housing portion (301). The extension portion (413) may extend from the base portion (411). The extension portion (413) may be disposed to overlap the opening (312). The connection portion (416) may extend from the base portion (411). The connection portion (416) may be electrically connected to the conductive connection member (390). The first coil (421) may be disposed in the substrate (410). The connection portion (416) may be at least partially disposed within the opening (312).

[0320] According to one embodiment, the conductive connecting member (390) may further include a connector (3901). The connector (3901) may be connected to the connecting portion (416). The connector (3901) may overlap the opening (312).

[0321] According to one embodiment, the circuit board (348) can move together with the second housing portion (302) when the second housing portion (302) moves relative to the first housing portion (301).

[0322] According to one embodiment, the substrate (410) may further include a bending portion (412). The bending portion (412) may be connected to the base portion (411) and the extension portion (413). The bending portion (412) may be configured to be at least partially folded or unfolded.

[0323] According to one embodiment, the first housing portion (301) may include a protruding portion (311e). The protruding portion (311e) may protrude from at least a portion of the first housing portion (301). The protruding portion (311e) may be arranged correspondingly to the bending portion (412).

[0324] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In an electronic device (101), A housing (310) comprising a first housing portion (301) including an opening (312), and a second housing portion (302) configured to move relative to the first housing portion (301); A circuit board (348) placed in the second housing portion (302); Antenna structure (400) arranged in the first housing part (301); and A conductive connecting member (390) electrically connected to the circuit board (348) and the antenna structure (400) is included. The above antenna structure (400) is A substrate (410) including a base portion (411) arranged in the first housing portion (301), and an extension portion (413) extended from the base portion (411) and arranged to overlap the opening (312); and An electronic device, wherein a first coil (421) is disposed on the substrate (410), and at least a portion of the first coil (421) overlaps the opening (312).

2. In paragraph 1, The above second housing part (302) includes a second plate (321d), The first housing portion (301) comprises a first plate (311d) which is at least partially disposed on the outside of the second plate (321d) and includes the opening (312). The above circuit board (348) is placed on the second plate (321d), The above antenna structure (400) is an electronic device placed on the first plate (311d).

3. In either of paragraphs 1 and 2, The second housing part (302) is configured to move in a first direction with respect to the first housing part (301), An electronic device in which the conductive connecting member (390) is electrically connected to the antenna structure (400) and includes a connector (3901) that overlaps the opening (312) in a second direction perpendicular to the first direction.

4. In any one of paragraphs 1 to 3, The above base portion (411) includes a plurality of first layers, The above extension portion (413) includes a plurality of second layers, An electronic device wherein the number of the first layers is different from the number of the second layers.

5. In any one of paragraphs 1 to 4, An electronic device wherein the number of the first layers is greater than the number of the second layers.

6. In any one of paragraphs 1 to 5, The above extension portion (413) is an electronic device configured to be bendable with respect to the base portion (411).

7. In any one of paragraphs 1 to 6, An electronic device in which the antenna structure (400) further includes a support member (460) configured to cover the opening (312) and support the extended portion (413).

8. In any one of paragraphs 1 to 7, An electronic device further comprising an adhesive member (480) disposed between the support member (460) and the inner edge of the first housing portion (301) defining the opening (312).

9. In any one of paragraphs 1 to 8, The above adhesive member (480) is an electronic device adhered to at least two edges of the support member (460).

10. In any one of paragraphs 1 to 9, The above antenna structure (400) is A first shielding member (431) positioned below the above base portion (411); and It further includes a second shielding member (433) positioned below the above extension portion (413), An electronic device in which the thickness or number of the second shielding member (433) is smaller than the thickness or number of the first shielding member (431).

11. In any one of paragraphs 1 to 10, An electronic device further comprising a heat dissipation member (440) disposed between the first shielding member (431) and the first housing portion (301).

12. In any one of paragraphs 1 to 11, The above antenna structure (400) further includes a second coil (422) arranged at the edge of the substrate (410), An electronic device in which the first coil (421) is at least partially disposed inside the second coil (422).

13. In any one of paragraphs 1 to 12, An electronic device in which at least a portion of the second coil (422) overlaps the opening (312).

14. In any one of paragraphs 1 to 13, Further comprising a battery (389) placed within the housing (310), The first coil (421) is an electronic device electrically connected to the battery (389) through the conductive connecting member (390) and the circuit board (348).

15. In any one of paragraphs 1 to 14, The above-mentioned conductive connecting member (390) is an electronic device including a flexible printed circuit board (FPCB).

Images