Electronic device

Abstract

An electronic device of the present invention comprises: a display module; and a digitizer disposed below the display module and including a folding part folded along a folding axis extending in a first direction, and a first non-folding part and a second non-folding part spaced apart from each other in a second direction crossing the first direction with the folding part interposed therebetween. The digitizer comprises a plurality of sensing coils, different sensing coils among the plurality of sensing coils are shared through a common line, and the common line is disposed in at least the folding part.

Description

electronic devices

[0001] The present invention relates to an electronic device, and more particularly, to an electronic device including a digitizer.

[0002]

[0003] In the information society, electronic devices are increasingly important as visual information transmission media. Electronic devices are activated by electrical signals. They include a digitizer that detects input from outside the display layer that displays images.

[0004] A digitizer in an electronic device may include various sensing coils that are activated by electrical signals. The regions where the sensing coils are activated respond to signals applied from outside.

[0005]

[0006] The purpose of the present invention is to provide an electronic device having improved folding characteristics of a digitizer and improved sensing sensitivity in a folding area.

[0007]

[0008] An electronic device according to one embodiment of the present invention comprises: a display module including an active area in which an image is provided and a peripheral area adjacent to the active area; and a digitizer including a folding portion disposed below the display module and folded along a folding axis extending in a first direction, a first non-folding portion and a second non-folding portion spaced apart in a second direction intersecting the first direction with the folding portion interposed therebetween, wherein the digitizer includes a plurality of sensing coils, and different sensing coils among the plurality of sensing coils are shared through a common wiring, and the common wiring is disposed at least within the folding portion.

[0009] The above common wiring may be characterized by extending along the second direction.

[0010] It may be characterized in that when any one of the different detection coils shared through the common wiring is driven by detection, the remaining different detection coils shared through the common wiring are driven by floating.

[0011] The plurality of sensing coils may include first sensing coils arranged along the first direction, each of which extends along the second direction; and second sensing coils arranged along the second direction, each of which extends along the first direction, and each of which includes non-folding coils disposed within the first non-folding portion or the second non-folding portion and folding coils at least partially disposed within the folding portion, and the first sensing coils and the second sensing coils may be characterized in that they are insulated from each other and each forms an open loop.

[0012] The above common wiring may be characterized in that it is shared by two folding coils.

[0013] The above common wiring may be characterized in that it is shared by two folding coils and one first sensing coil.

[0014] The above common wiring may be characterized in that it is shared by two first sensing coils.

[0015] The above common wiring may be characterized in that it is shared by one folding coil and two first sensing coils.

[0016] Each of the first sensing coils may include first extension wires extending along the second direction and first connection wires connected to the first extension wires and extending along the first direction, and each of the first extension wires may be characterized in that it extends from the first non-folding portion to the second non-folding portion via the folding portion.

[0017] Each of the non-folding coils may include second extension wires extending along the first direction and second connection wires connected to the second extension wires and extending along the second direction, each of the folding coils may include third extension wires extending along the first direction and third connection wires connected to the third extension wires and extending along the second direction, and each of the third connection wires may be characterized in that it is arranged at least in the folding portion.

[0018] The above folding coils may include a first folding coil, a second folding coil, and a third folding coil, and the common wiring may be provided in a plurality, such that the plurality of common wirings include a first common wiring and a second common wiring, and the first common wiring may be shared by one third connection wiring of the first folding coil and one third connection wiring of the second folding coil, and the second common wiring may be shared by another third connection wiring of the second folding coil and one third connection wiring of the third folding coil.

[0019] The digitizer may include at least one base layer, and the third extension wires arranged in the folding portion may be connected to corresponding third connection wires through contact holes penetrating the base layer.

[0020] The above contact holes may be defined within the folding portion, and the third extension wires arranged within the folding portion may be characterized in that they extend along the first direction within the folding portion.

[0021] The above contact holes may be defined within the first non-folding portion or the second non-folding portion, and each of the third extension wires arranged within the folding portion may include an extension portion extending along the first direction within the folding portion and a connecting portion connecting the extension portion and the corresponding contact hole.

[0022] The above folding portion may include an inner portion, an upper outer portion and a lower outer portion spaced apart in the first direction with the inner portion therebetween, and a maximum of four wires are arranged in the same layer in each of the upper outer portion and the lower outer portion, and the first common wire is arranged at least in the upper outer portion, and the second common wire is arranged at least in the lower outer portion.

[0023] At least one of the two first extension wires of the first first detection coil and the two first extension wires of the second first detection coil crosses the upper outer portion, and at least one of the two first extension wires of the n-1th first detection coil and the two first extension wires of the nth first detection coil crosses the lower outer portion, and n is a natural number greater than or equal to 4.

[0024] The first common wiring may be further shared by one first extension wiring of the first first detection coil, and the second common wiring may be further shared by one first extension wiring of the n-1th first detection coil, wherein n is a natural number greater than or equal to 4.

[0025] Each of the first sensing coils and the folding coils may form a double-wound open loop, and the first extension wires of each of the first sensing coils may include first-1 to first-4 extension wires, the first connection wires of each of the first sensing coils may include first-1 to first-4 connection wires, the third extension wires of each of the folding coils may include third-1 to third-4 extension wires, and the third connection wires of each of the folding coils may include third-1 to third-4 connection wires.

[0026] The above folding coils may include a first folding coil, a second folding coil, and a third folding coil arranged along the second direction, and the common wiring may be shared by a 3-1 connection wiring of the first folding coil, a 3-1 connection wiring of the second folding coil, and a 1-2 extension wiring of the first first sensing coil.

[0027] The digitizer may include a first base layer; a second base layer disposed under the first base layer; a first cover layer disposed on the first base layer; a second cover layer disposed under the second base layer; a first conductive layer disposed between the first base layer and the first cover layer; a second conductive layer disposed between the first base layer and the second base layer; and a third conductive layer disposed between the second base layer and the second cover layer, wherein the folding portion may include an inner portion and an outer portion spaced apart from the inner portion in the first direction, and at most four wires may be disposed in the same layer in the outer portion.

[0028] The above folding coils may further include a left folding coil and a right folding coil spaced apart from each other in the second direction with the first to third folding coils therebetween, and the 1-1 extension wire of the first first detection coil, the 1-1 and 1-2 extension wires of the second first detection coil, and the 3-2 connection wire of the second folding coil may be characterized in that they are included in the first conductive layer and pass through the outer portion. The common wire, the 3-2 connection wire of the first folding coil, and the 3-1 and 3-2 connection wires of the third folding coil may be characterized in that they are included in the second conductive layer and pass through the outer portion. The 3-3 and 3-4 extension wires of the first folding coil, the 3-1 and 3-2 extension wires of the third folding coil, the 3-1 and 3-2 connection wires and the 3-3 and 3-4 extension wires of the left folding coil, and the 3-1 and 3-2 connection wires and the 3-1 and 3-2 extension wires of the right folding coil may be characterized in that they are included in the third conductive layer and pass through the outer portion.

[0029] The above folding portion may include an inner portion and an outer portion spaced apart from the inner portion in the first direction, and the outer portion may have up to four wires arranged within the same layer, the common wire being shared by one first extension wire of the i-th first detection coil and one first extension wire of the j-th first detection coil, and the common wire may be characterized in that it passes through the inner portion.

[0030] The digitizer may further include bridge wires passing through the folding portion, electrically connecting the second sensing coils arranged in the first non-folding portion and the connector, and the common wire may be further shared by at least one bridge wire.

[0031] The folding part may include an inner portion and an outer portion spaced apart from the inner portion in the first direction, and the folding part may be characterized in that first holes are defined in the inner portion and at least second holes and third holes are defined in the outer portion. The first holes may be characterized in that they include first group holes, each extending along the first direction and arranged along the first direction; and second group holes, each alternately arranged with the first group holes and shifted along the first direction from the first group holes, each extending along the first direction and arranged along the first direction. The second holes may be characterized in that they each extend along the first direction and are spaced apart from the first group holes in the first direction. The third holes may be characterized in that they include 3-1 holes, each extending along the first direction and being spaced apart from the second group holes in the first direction. And it may be characterized by including 3-2 holes spaced apart from the 3-1 holes in the first direction, arranged along the second direction at the edge of the outer portion, and defining an open opening.

[0032] It may be characterized in that a maximum of four wires are arranged within the same layer between adjacent holes in the first direction, and a maximum of two wires are arranged within the same layer between adjacent holes in the second direction.

[0033] At least some of the plurality of sensing coils may include sensing wires extending across the folding portion and bending along the edges of the holes, wherein a spacing between adjacent holes and sensing wires is less than 75 micrometers, a spacing between adjacent sensing wires is greater than or equal to 20 micrometers and less than or equal to 40 micrometers, and a width of each of the sensing wires is greater than or equal to 40 micrometers and less than or equal to 200 micrometers.

[0034] The digitizer may include a first base layer in which first base holes are defined; a second base layer disposed under the first base layer and in which second base holes are defined; a first cover layer disposed on the first base layer and in which first cover holes are defined; and a second cover layer disposed under the second base layer and in which second cover holes are defined, wherein holes are defined in the folding portion of the digitizer, and each of the holes is characterized in that a corresponding first base hole, a second base hole, a first cover hole, and a second cover hole are defined and aligned with each other along a thickness direction.

[0035] Each of the first base layer, the second base layer, the first cover layer, and the second cover layer may include a reinforced fiber composite, and the modulus of each of the first base layer, the second base layer, the first cover layer, and the second cover layer may be about 10 GPa or more and 30 GPa or less.

[0036] The digitizer may include a first base layer having first base holes defined therein; a second base layer disposed under the first base layer and having second base holes defined therein; a third base layer disposed under the second base layer and having third base holes defined therein; a first cover layer disposed on the first base layer and having first cover holes defined therein; and a second cover layer disposed under the third base layer and having second cover holes defined therein, wherein holes are defined in the folding portion of the digitizer, and each of the holes is characterized in that a corresponding first base hole, a second base hole, a third base hole, a first cover hole, and a second cover hole are defined and aligned with each other along a thickness direction.

[0037] An electronic device according to one embodiment of the present invention comprises: a display module including an active area in which an image is provided and a peripheral area adjacent to the active area; and a digitizer including a folding portion disposed below the display module and folded along a folding axis extending in a first direction, and a first non-folding portion and a second non-folding portion spaced apart in a second direction intersecting the first direction with the folding portion therebetween, wherein the digitizer comprises a plurality of sensing coils, each of which includes a plurality of sensing wires; and a plurality of bridge wires connecting between the plurality of sensing coils and a connector, wherein a portion of the plurality of sensing wires and the plurality of bridge wires passing through the folding portion is shared through a common wire.

[0038]

[0039] According to the present invention, by providing a common wiring to a digitizer, the wiring density in the folding section can be reduced. This prevents the wiring reliability from being reduced due to the wiring density, and reduces the number of wirings provided in a bypass manner. Accordingly, a digitizer with improved detection performance in the folding section can be provided. Furthermore, detection performance in the folding section can be improved without adding a conductive layer, thereby preventing the folding reliability of the digitizer from being reduced due to the wiring density. Accordingly, a digitizer with improved folding characteristics can be provided.

[0040]

[0041] FIGS. 1A to 1C are perspective views of an electronic device according to one embodiment of the present invention.

[0042] FIG. 2A is an exploded perspective view of an electronic device according to one embodiment of the present invention.

[0043] FIG. 2b is a block diagram of an electronic device according to one embodiment of the present invention.

[0044] Figure 3 is a plan view of a display panel according to one embodiment of the present invention.

[0045] Figure 4a is a schematic cross-sectional view of a display module according to one embodiment of the present invention.

[0046] FIG. 4b is a drawing illustrating a cross-section of a display module corresponding to one pixel illustrated in FIG. 3.

[0047] FIG. 5a is a cross-sectional view of a display device according to one embodiment taken along line I-I' of FIG. 3.

[0048] FIG. 5b is a cross-sectional view of a bent display device according to one embodiment of the present invention.

[0049] FIG. 6A is a plan view of a digitizer showing first sensing coils of the digitizer according to one embodiment of the present invention.

[0050] FIG. 6b is a plan view illustrating a first sensing coil according to one embodiment of the present invention.

[0051] FIG. 7A is a plan view of a digitizer showing second sensing coils of the digitizer according to one embodiment of the present invention.

[0052] FIG. 7b is a plan view illustrating a second sensing coil according to one embodiment of the present invention.

[0053] FIGS. 8A and 8B are cross-sectional views of a digitizer according to one embodiment of the present invention.

[0054] Figure 9 is a cross-sectional view of a digitizer according to one embodiment of the present invention.

[0055] Figures 10a to 10c are drawings illustrating some of the long sides of the first sensing coils.

[0056] FIG. 11 is an enlarged plan view of some of the holes defined in a digitizer according to one embodiment of the present invention.

[0057] FIG. 12A is an enlarged plan view of a portion of a digitizer according to one embodiment of the present invention.

[0058] FIGS. 12b to 12d are enlarged cross-sectional views of a portion of a digitizer according to one embodiment of the present invention.

[0059] FIG. 13A is an enlarged plan view of a portion of a digitizer according to one embodiment of the present invention.

[0060] [Correction under Rule 91 26.02.2025] Figures 13b to 13c are enlarged cross-sectional views of a portion of a digitizer according to one embodiment of the present invention.

[0061] FIG. 14a is an enlarged plan view of a portion of a digitizer according to one embodiment of the present invention.

[0062] FIG. 14b is an enlarged cross-sectional view of a portion of a digitizer according to one embodiment of the present invention.

[0063] FIG. 15 is an enlarged plan view of a portion of a digitizer according to one embodiment of the present invention.

[0064] FIG. 16 is an enlarged plan view of a portion of a digitizer according to one embodiment of the present invention.

[0065] FIG. 17A is an enlarged cross-sectional view of a portion of a digitizer according to one embodiment of the present invention.

[0066] FIGS. 17b to 17d are enlarged plan views of a portion of a digitizer according to one embodiment of the present invention.

[0067] Fig. 18 is an enlarged plan view of a portion of a digitizer according to a comparative example.

[0068] Figure 19a is an enlarged cross-sectional view of a portion of a digitizer according to a comparative example.

[0069] Figures 19b to 19e are enlarged plan views of a portion of a digitizer according to a comparative example.

[0070] FIGS. 20 to 23 are enlarged plan views of a portion of a digitizer according to one embodiment of the present invention.

[0071] Fig. 24 is a cross-sectional view of a base layer according to one embodiment of the present invention.

[0072] Figure 25 is a plan view of a base layer according to one embodiment of the present invention.

[0073]

[0074] In this specification, when it is said that a component (or region, layer, portion, etc.) is “on,” “connected to,” or “coupled to” another component, it means that it can be directly disposed / connected / coupled to the other component, or a third component may be disposed between them.

[0075] Identical drawing numbers indicate identical components. Furthermore, in the drawings, the thicknesses, proportions, and dimensions of the components are exaggerated for the purpose of effectively illustrating the technical content. "And / or" encompasses any combination of one or more of the associated components.

[0076] While terms such as "first" and "second" may be used to describe various components, these components should not be limited by these terms. These terms are used solely to distinguish one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a "second component," and similarly, a second component may also be referred to as a "first component." Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0077] Additionally, terms such as "below," "below," "above," and "above" are used to describe the relationships between components depicted in the drawings. These terms are relative concepts and are described based on the directions indicated in the drawings.

[0078] It should be understood that terms such as "include" or "have" are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the specification, but do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0079] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. Furthermore, terms defined in commonly used dictionaries should be interpreted to have a meaning consistent with their meaning in the relevant technical context, and should not be interpreted in an overly idealistic or overly formal sense unless explicitly defined herein.

[0080] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0081]

[0082] Figures 1a to 1c are perspective views of an electronic device (ED) according to one embodiment of the present invention. Figure 1a illustrates an unfolded state of the electronic device (ED), and Figures 1b and 1c illustrate a folded state of the electronic device (ED).

[0083] Referring to FIGS. 1A to 1C, an electronic device (ED) according to an embodiment of the present invention may include a display surface (DS) defined by a first direction (DR1) and a second direction (DR2) intersecting the first direction (DR1). The electronic device (ED) may provide an image (IM) to a user through the display surface (DS).

[0084] A display surface (DS) may include a display area (DA) and a non-display area (NDA) surrounding the display area (DA). The display area (DA) may display an image (IM), and the non-display area (NDA) may not display the image (IM). The non-display area (NDA) may surround the display area (DA). However, the shape of the display area (DA) and the shape of the non-display area (NDA) may be modified.

[0085] The display surface (DS) may further include a sensing area (TA). The sensing area (TA) may be a portion of the display area (DA). The sensing area (TA) has a higher light transmittance than other areas of the display area (DA). Hereinafter, other areas of the display area (DA) excluding the sensing area (TA) may be defined as a general display area.

[0086] An optical signal, such as visible light or infrared light, can travel through the sensing area (TA). The electronic device (ED) can capture an external image through the visible light passing through the sensing area (TA) or determine the accessibility of an external object through infrared light. While one sensing area (TA) is illustrated as an example in Fig. 1a, the present invention is not limited thereto, and multiple sensing areas (TA) may be provided.

[0087] Hereinafter, a direction substantially perpendicular to the plane defined by the first direction (DR1) and the second direction (DR2) is defined as the third direction (DR3). The third direction (DR3) serves as a reference for distinguishing the front and back surfaces of each member. In this specification, "on the plane" may be defined as a state viewed from the third direction (DR3).

[0088] An electronic device (ED) may include a folding area (FA) and a plurality of non-folding areas (NFA1, NFA2). The non-folding areas (NFA1, NFA2) may include a first non-folding area (NFA1) and a second non-folding area (NFA2). The first non-folding area (NFA1) and the second non-folding area (NFA2) may be spaced apart from each other along a second direction (DR2) with the folding area (FA) interposed therebetween.

[0089] As illustrated in FIG. 1B, the folding area (FA) can be folded based on the folding axis (FX) parallel to the first direction (DR1). The folding area (FA) has a predetermined curvature and a radius of curvature (VV). A distance between the first non-folding area (NFA1) and the second non-folding area (NFA2) can be substantially equal to twice the radius of curvature (VV). According to one embodiment, the first non-folding area (NFA1) and the second non-folding areas (NFA2) face each other, and the electronic device (ED) can be folded in an in-folding manner so that the display surface (DS) is not exposed to the outside.

[0090] As illustrated in Fig. 1c, the distance between the first non-folding area (NFA1) and the second non-folding area (NFA2) may be less than twice the radius of curvature (VV). Accordingly, the distance between the first non-folding area (NFA1) and the second non-folding area (NFA2) may be reduced in the folded state. Accordingly, an electronic device (ED) having a slim state when folded can be provided.

[0091] However, the present invention is not limited thereto, and in one embodiment, the electronic device (ED) may be outer-folded so that the display surface (DS) is exposed to the outside. In one embodiment of the present invention, the electronic device (ED) may be configured such that an in-folding or out-folding operation is mutually repeated from an unfolding operation, but is not limited thereto. In one embodiment of the present invention, the electronic device (ED) may be configured to select any one of an unfolding operation, an in-folding operation, and an out-folding operation.

[0092]

[0093] FIG. 2a is an exploded perspective view of an electronic device (ED) according to one embodiment of the present invention. FIG. 2b is a block diagram of an electronic device (ED) according to one embodiment of the present invention.

[0094] Referring to FIGS. 2A and 2B, the electronic device (ED) may include a display device (DD), an electronic module (EM), an electro-optical module (ELM), a power module (PSM), and a housing (HM). Although not separately illustrated, the electronic device (ED) may further include a mechanical structure (e.g., a hinge) for controlling a folding operation of the display device (DD).

[0095] The display device (DD) generates images and detects external input. The display device (DD) includes a window (WM) and a display module (DM). The window (WM) provides the front surface of the electronic device (ED). A detailed description of the window (WM) will be provided later.

[0096] A display module (DM) may include a display panel (DP). Although FIG. 2A illustrates only the display panel (DP) among the laminated structures of the display module (DM), the display module (DM) may actually further include a plurality of components arranged on the upper side of the display panel (DP). A detailed description of the laminated structure of the display module (DM) will be provided below.

[0097] The type of display panel (DP) is not particularly limited. For example, the display panel (DP) may be an emissive display panel such as an organic light-emitting display panel or a quantum dot light-emitting display panel.

[0098] The display panel (DP) includes a display area (DP-DA) and a non-display area (DP-NDA), which correspond to the display area (DA, see FIG. 1a) and the non-display area (NDA, see FIG. 1a) of the electronic device (ED), respectively. In this specification, "areas / portions correspond to areas / portions" means that they overlap and are not limited to the same area.

[0099] The display panel (DP) may include a sensing area (DP-TA, or first area) corresponding to the sensing area (TA) of Fig. 1a. The sensing area (DP-TA) may be an area having a lower resolution than the display area (DP-DA, or second area).

[0100] As illustrated in Fig. 2a, a driving chip (DIC) may be placed on a non-display area (DP-NDA) of a display panel (DP). A flexible circuit board (FCB) may be coupled to the non-display area (DP-NDA) of the display panel (DP). The flexible circuit board (FCB) may be connected to a main circuit board. The main circuit board may be an electronic component constituting an electronic module (EM).

[0101] A driver chip (DIC) may include driving elements, such as a data driving circuit, for driving pixels of a display panel (DP). While FIG. 2A illustrates a structure in which the driver chip (DIC) is mounted on the display panel (DP), the present invention is not limited thereto. For example, the driver chip (DIC) may be mounted on a flexible printed circuit board (FCB).

[0102] As illustrated in FIG. 2b, the display device (DD) may further include an input sensor (IS) and a digitizer (DGT). The input sensor (IS) detects a user's input. The capacitive input sensor (IS) may be positioned above the display panel (DP). The digitizer (DGT) detects a stylus pen input. The electromagnetic induction digitizer (DGT) may be positioned below the display panel (DP).

[0103] An electronic module (EM) may include a control module (10), a wireless communication module (20), an image input module (30), an audio input module (40), an audio output module (50), a memory (60), and an external interface module (70). The electronic module (EM) may include a main circuit board, and the modules may be mounted on the main circuit board or electrically connected to the main circuit board via a flexible circuit board. Each of the input sensor (IS) and the digitizer (DGT) may be connected to the main circuit board via a connector or the like. The electronic module (EM) is electrically connected to a power module (PSM).

[0104] As illustrated in FIG. 2A, the housing (HM) may include a first housing (HM1) and a second housing (HM2). An electronic module (EM) may be disposed in each of the first housing (HM1) and the second housing (HM2), and a power module (PSM) may be disposed in each of the first housing (HM1) and the second housing (HM2). Although not illustrated, the electronic module (EM) disposed in the first housing (HM1) and the electronic module (EM) disposed in the second housing (HM2) may be electrically connected via a flexible circuit board.

[0105] As illustrated in FIG. 2b, the control module (10) controls the overall operation of the electronic device (ED). For example, the control module (10) activates or deactivates the display device (DD) in response to user input. The control module (10) can control the image input module (30), the audio input module (40), the audio output module (50), etc. in response to user input. The control module (10) may include at least one microprocessor.

[0106] The wireless communication module (20) can transmit / receive wireless signals with other terminals using a Bluetooth or Wi-Fi line. The wireless communication module (20) can transmit / receive voice signals using a general communication line. The wireless communication module (20) can include multiple antenna modules.

[0107] The image input module (30) processes the image signal and converts it into image data that can be displayed on the display device (DD). The audio input module (40) receives an external audio signal via a microphone in recording mode, voice recognition mode, etc. and converts it into electrical voice data. The audio output module (50) converts audio data received from the wireless communication module (20) or audio data stored in the memory (60) and outputs it to the outside.

[0108] The external interface module (70) serves as an interface that connects to an external charger, wired / wireless data port, card socket (e.g., memory card, SIM / UIM card), etc.

[0109] The power module (PSM) supplies the power required for the overall operation of the electronic device (ED). The PSM may include a conventional battery device.

[0110] An electro-optical module (ELM) may be an electronic component that outputs or receives an optical signal. The ELM may include a camera module and / or a proximity sensor. The camera module captures an external image through a sensing area (DP-TA). The ELM may be positioned below the display device (DD) and may overlap with the sensing area (DP-TA).

[0111] The housing (HM) is coupled to the window (WM) to accommodate the other modules described above. The housing (HM) is illustrated as including first and second housings (HM1, HM2) that are separated from each other, but is not limited thereto. The electronic device (ED) according to one embodiment may further include a hinge structure for connecting the first and second housings (HM1, HM2).

[0112]

[0113] Figure 3 is a plan view of a display panel (DP) according to one embodiment of the present invention.

[0114] Referring to FIG. 3, the display panel (DP) may include a display area (DP-DA) and a non-display area (DP-NDA) arranged around the display area (DP-DA). The display area (DP-DA) and the non-display area (DP-NDA) are distinguished by the presence of pixels (PX). The pixels (PX) are arranged in the display area (DP-DA). A scan driver (SDV), a data driver, and an emission driver (EDV) may be arranged in the non-display area (DP-NDA). The data driver may be a part of a circuit configured in a driver chip (DIC).

[0115] The display panel (DP) includes a first non-bending area (AA1), a second non-bending area (AA2), and a bending area (BA) that are distinguished within a second direction (DR2). The second non-bending area (AA2) and the bending area (BA) may be part of a non-display area (DP-NDA). The bending area (BA) is positioned between the first non-bending area (AA1) and the second non-bending area (AA2).

[0116] The first non-bending area (AA1) corresponds to the display surface (DS) of Fig. 1a. The first non-bending area (AA1) may include a first non-folding area (NFA10), a second non-folding area (NFA20), and a folding area (FA0). The first non-folding area (NFA10), the second non-folding area (NFA20), and the folding area (FA0) correspond to the first non-folding area (NFA1), the second non-folding area (NFA2), and the folding area (FA) of Figs. 1a to 1c, respectively.

[0117] The sensing area (DP-TA) described above can be defined in the display area (DP-DA) and the first non-folding area (NFA10). The sensing area (DP-TA) can be an area having higher light transmittance and lower resolution than other areas within the display area (DP-DA). The light transmittance and resolution are measured within a reference area. The sensing area (DP-TA) can have a smaller number of pixels arranged within the reference area (or the same area) than the display area (DP-DA). The sensing area (DP-TA) can have a lower occupancy rate of a light-shielding structure within the reference area than other areas within the display area (DP-DA). The light-shielding structure can include a conductive pattern of a circuit layer, an electrode of a light-emitting element, a light-shielding pattern, etc., which will be described later. According to one embodiment, the electro-optical module (ELM) described in FIG. 2A can improve optical signal reception efficiency by overlapping with the sensing area (DP-TA) having high light transmittance.

[0118] The widths of the bending area (BA) and the second non-bending area (AA2) within the first direction (DR1) may be smaller than the width of the first non-bending area (AA1). The bending area (BA) with a relatively small width within the first direction (DR1) can be easily bent based on the bending axis extending in the first direction (DR1).

[0119] A display panel (DP) may include a plurality of pixels (PX), a plurality of scan lines (SL1 to SLm), a plurality of data lines (DL1 to DLn), a plurality of light-emitting lines (EL1 to ELm), first and second control lines (CSL1, CSL2), a power line (PL), and a plurality of display pads (D-PD). Here, m and n are natural numbers. The pixels (PX) may be connected to the scan lines (SL1 to SLm), the data lines (DL1 to DLn), and the light-emitting lines (EL1 to ELm).

[0120] The scan lines (SL1 to SLm) may extend in a first direction (DR1) and be connected to a scan driver (SDV). The data lines (DL1 to DLn) may extend in a second direction (DR2) and be connected to a driver chip (DIC) via a bending area (BA). The light-emitting lines (EL1 to ELm) may extend in a first direction (DR1) and be connected to a light-emitting driver (EDV).

[0121] The power line (PL) may include a portion extending in a second direction (DR2) and a portion extending in a first direction (DR1). The portion extending in the first direction (DR1) and the portion extending in the second direction (DR2) may be arranged on different layers. The portion of the power line (PL) extending in the second direction (DR2) may extend to a second non-bending area (AA2) via a bending area (BA). The power line (PL) may receive a driving voltage.

[0122] The connection lines (CNL) can extend in a first direction (DR1) and be arranged in a second direction (DR2). The connection lines (CNL) can be connected to a power line (PL) and pixels (PX). A driving voltage can be applied to the pixels (PX) through the power line (PL) and connection lines (CNL) that are connected to each other.

[0123] The first control line (CSL1) may be connected to the scanning driver (SDV) and may extend toward the lower end of the second non-bending region (AA2) via the bending region (BA). The second control line (CSL2) may be connected to the emission driver (EDV) and may extend toward the lower end of the second non-bending region (AA2) via the bending region (BA).

[0124] On a plane, display pads (D-PD) can be arranged adjacent to the bottom of the second non-bending area (AA2). A driving chip (DIC), a power line (PL), a first control line (CSL1), and a second control line (CSL2) can be connected to the display pads (D-PD). Substrate pads (F-PD) included in a flexible circuit board (FCB) can be electrically connected to corresponding display pads (D-PD) through an anisotropic conductive adhesive layer.

[0125] Although not shown, a timing controller and a voltage generator may be arranged on a flexible circuit board (FCB). The timing controller may be manufactured as an integrated circuit chip and mounted on the printed circuit board. The timing controller and the voltage generator may be connected to pads (PDs) through the printed circuit board.

[0126] The timing controller can control the operation of the scan driver (SDV), the data driver, and the emission driver (EDV). The timing controller can generate the scan control signal, the data control signal, and the emission control signal in response to control signals received from an external source. The voltage generator can generate the driving voltage.

[0127] The scan control signal can be provided to the scan driver (SDV) via the first control line (CSL1). The light emission control signal can be provided to the light emission driver (EDV) via the second control line (CSL2). The data control signal can be provided to the data driver. The timing controller can receive image signals from an external source, convert the data format of the image signals to match the interface specifications with the data driver, and provide the converted data to the data driver.

[0128] The scan driver (SDV) can generate a plurality of scan signals in response to a scan control signal. The scan signals can be applied to the pixels (PX) through scan lines (SL1 to SLm). The scan signals can be applied to the pixels (PX) sequentially.

[0129] The data driver can generate a plurality of data voltages corresponding to image signals in response to a data control signal. The data voltages can be applied to pixels (PX) through data lines (DL1 to DLn). The light emitting driver (EDV) can generate a plurality of light emitting signals in response to a light emitting control signal. The light emitting signals can be applied to pixels (PX) through light emitting lines (EL1 to ELm).

[0130] Pixels (PX) can receive data voltages in response to scanning signals. Pixels (PX) can display images by emitting light with a brightness corresponding to the data voltages in response to light emission signals. The light emission time of pixels (PX) can be controlled by the light emission signals.

[0131]

[0132] FIG. 4a is a schematic cross-sectional view of a display module (DM) according to one embodiment of the present invention.

[0133] Referring to FIG. 4a, the display module (DM) may include a display panel (DP), an input sensor (IS), and an anti-reflection layer (ARL). The display panel (DP) may include a base layer (110), a circuit layer (120), a light-emitting element layer (130), and an encapsulation layer (140).

[0134] The base layer (110) can provide a base surface on which the circuit layer (120) is arranged. The base layer (110) can be a flexible substrate capable of bending, folding, rolling, etc. The base layer (110) can be a glass substrate, a metal substrate, a polymer substrate, etc. However, the embodiments of the present invention are not limited thereto, and the base layer (110) can be an inorganic layer, an organic layer, or a composite material layer.

[0135] The base layer (110) may have a multilayer structure. For example, the base layer (110) may include a first synthetic resin layer, a multilayer or single-layer inorganic layer, and a second synthetic resin layer disposed on the multilayer or single-layer inorganic layer. Each of the first and second synthetic resin layers may include a polyimide-based resin, and is not particularly limited.

[0136] The circuit layer (120) may be placed on the base layer (110). The circuit layer (120) may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line.

[0137] The light-emitting element layer (130) may be disposed on the circuit layer (120). The light-emitting element layer (130) may include a light-emitting element. For example, the light-emitting element may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, a quantum dot, a quantum rod, a micro LED, or a nano LED.

[0138] The encapsulating layer (140) may be disposed on the light-emitting element layer (130). The encapsulating layer (140) may protect the light-emitting element layer (130) from foreign substances such as moisture, oxygen, and dust particles. The encapsulating layer (140) may include at least one inorganic layer. The encapsulating layer (140) may include a laminated structure of an inorganic layer / organic layer / inorganic layer.

[0139] The input sensor (IS) may be directly disposed on the display panel (DP). The display panel (DP) and the input sensor (IS) may be formed through a continuous process. Here, "directly disposed" may mean that no third component is disposed between the input sensor (IS) and the display panel (DP). In other words, a separate adhesive layer may not be disposed between the input sensor (IS) and the display panel (DP).

[0140] An anti-reflection layer (ARL) may be directly disposed on an input sensor (IS). The anti-reflection layer (ARL) may reduce the reflectance of external light incident from the outside of a display device (DD, see FIG. 1). The anti-reflection layer (ARL) may include color filters. The color filters may have a predetermined arrangement. For example, the color filters may be arranged in consideration of the emission colors of pixels included in the display panel (DP). In addition, the anti-reflection layer (ARL) may further include a black matrix adjacent to the color filters.

[0141] In one embodiment of the present invention, the positions of the input sensor (IS) and the anti-reflection layer (ARL) may be interchanged. In one embodiment of the present invention, the anti-reflection layer (ARL) may be replaced with a polarizing film. The polarizing film may be bonded to the input sensor (IS) via an adhesive layer.

[0142]

[0143] FIG. 4b is a drawing illustrating a cross-section of a display module (DM) corresponding to one pixel illustrated in FIG. 3.

[0144] Referring to FIG. 4b, a pixel (PX) may include a transistor (TR) and a light-emitting element (OLED). The light-emitting element (OLED) may include a first electrode (AE) (or anode), a second electrode (CE) (or cathode), a hole control layer (HCL), an electron control layer (ECL), and an emission layer (EML).

[0145] A transistor (TR) and a light-emitting element (OLED) may be disposed on the base layer (110). By way of example, one transistor (TR) is illustrated, but in practice, the pixel (PX) may include a plurality of transistors and at least one capacitor for driving the light-emitting element (OLED).

[0146] The display area (DA) may include an emissive area (LA) corresponding to each pixel (PX) and a non-emissive area (NLA) surrounding the emissive area (LA). The emissive layer (EML) of the light-emitting element (OLED) may be disposed at least in the emissive area (LA).

[0147] A buffer layer (BFL) is disposed on the base layer (110), and the buffer layer (BFL) may be an inorganic layer. A semiconductor pattern may be disposed on the buffer layer (BFL). The semiconductor pattern may include polysilicon, amorphous silicon, or a metal oxide.

[0148] The semiconductor pattern may be doped with an N-type dopant or a P-type dopant. The semiconductor pattern may include a heavily doped region and a lightly doped region. The heavily doped region has a higher conductivity than the lightly doped region and may essentially function as the source and drain electrodes of the transistor (TR). The lightly doped region may essentially correspond to the active (or channel) portion of the transistor.

[0149] The source (S), active (A), and drain (D) of the transistor (TR) can be formed from a semiconductor pattern. A first insulating layer (INS1) can be disposed on the semiconductor pattern. A gate (G) of the transistor (TR) can be disposed on the first insulating layer (INS1). A second insulating layer (INS2) can be disposed on the gate (G). A third insulating layer (INS3) can be disposed on the second insulating layer (INS2).

[0150] The connection electrode (CNE) may include a first connection electrode (CNE1) and a second connection electrode (CNE2) to connect the transistor (TR) and the light-emitting element (OLED). The first connection electrode (CNE1) may be disposed on the third insulating layer (INS3) and may be connected to the drain (D) through a first contact hole (CH1) defined in the first to third insulating layers (INS1 to INS3).

[0151] A fourth insulating layer (INS4) may be disposed on the first connection electrode (CNE1). A fifth insulating layer (INS5) may be disposed on the fourth insulating layer (INS4). A second connection electrode (CNE2) may be disposed on the fifth insulating layer (INS5). The second connection electrode (CNE2) may be connected to the first connection electrode (CNE1) through a second contact hole (CH2) defined in the fourth and fifth insulating layers (INS4, INS5).

[0152] A sixth insulating layer (INS6) may be disposed on the second connecting electrode (CNE2). The layers from the buffer layer (BFL) to the sixth insulating layer (INS6) may be defined as a circuit layer (120). The first insulating layer (INS1) to the sixth insulating layer (INS6) may be inorganic or organic layers.

[0153] A first electrode (AE) may be disposed on a sixth insulating layer (INS6). The first electrode (AE) may be connected to a second connection electrode (CNE2) through a third contact hole (CH3) defined in the sixth insulating layer (INS6). A pixel defining layer (PDL) having an opening (PX_OP) defined therein for exposing a predetermined portion of the first electrode (AE) may be disposed on the first electrode (AE) and the sixth insulating layer (INS6).

[0154] A hole control layer (HCL) may be disposed on the first electrode (AE) and the pixel defining layer (PDL). The hole control layer (HCL) may include a hole transport layer and a hole injection layer.

[0155] The emission layer (EML) may be disposed on the hole control layer (HCL). The emission layer (EML) may be disposed in an area corresponding to the opening (PX_OP). The emission layer (EML) may include an organic material and / or an inorganic material. The emission layer (EML) may generate light of any one of red, green, and blue.

[0156] An electron control layer (ECL) may be disposed on an emissive layer (EML) and a hole control layer (HCL). The electron control layer (ECL) may include an electron transport layer and an electron injection layer. The hole control layer (HCL) and the electron control layer (ECL) may be disposed commonly in the emissive region (LA) and the non-emissive region (NLA).

[0157] The second electrode (CE) may be disposed on the electronic control layer (ECL). The second electrode (CE) may be disposed commonly on the pixels (PX). The layer on which the light-emitting element (OLED) is disposed may be defined as the light-emitting element layer (130).

[0158] The encapsulation layer (140) may be disposed on the second electrode (CE) to cover the pixel (PX). The encapsulation layer (140) may include a first encapsulation layer (EN1) disposed on the second electrode (CE), a second encapsulation layer (EN2) disposed on the first encapsulation layer (EN1), and a third encapsulation layer (EN3) disposed on the second encapsulation layer (EN2).

[0159] The first and third encapsulating layers (EN1, EN3) include an inorganic insulating layer and can protect the pixel (PX) from moisture / oxygen. The second encapsulating layer (EN2) includes an organic insulating layer and can protect the pixel (PX) from foreign substances such as dust particles.

[0160] A first voltage may be applied to a first electrode (AE) through a transistor (TR), and a second voltage having a lower level than the first voltage may be applied to a second electrode (CE). Holes and electrons injected into the light-emitting layer (EML) combine to form excitons, and when the excitons transition to the ground state, the light-emitting element (OLED) may emit light.

[0161] An input sensor (IS) can be placed on the sealing layer (140). The input sensor (IS) can be manufactured directly on the upper surface of the sealing layer (140).

[0162] A base layer (BSL) may be disposed on the encapsulating layer (140). The base layer (BSL) may include an inorganic insulating layer. At least one inorganic insulating layer may be provided as the base layer (BSL) on the encapsulating layer (140).

[0163] The input sensor (IS) may include a first conductive pattern (CTL1) and a second conductive pattern (CTL2) disposed on the first conductive pattern (CTL1). The first conductive pattern (CTL1) may be disposed on a base layer (BSL). An insulating layer (TINS) may be disposed on the base layer (BSL) to cover the first conductive pattern (CTL1). The insulating layer (TINS) may include an inorganic insulating layer or an organic insulating layer. The second conductive pattern (CTL2) may be disposed on the insulating layer (TINS).

[0164] The first and second conductive patterns (CTL1, CTL2) may overlap the non-emissive region (NLA). Although not shown, the first and second conductive patterns (CTL1, CTL2) may be arranged on the non-emissive region (NLA) between the emissive regions (LA) and may have a mesh shape.

[0165] The first and second conductive patterns (CTL1, CTL2) may form sensors of the aforementioned input sensor (IS). For example, the first and second conductive patterns (CTL1, CTL2) in a mesh shape may be separated from each other in a predetermined area to form sensors. A portion of the second conductive pattern (CTL2) may be connected to the first conductive pattern (CTL1).

[0166] An anti-reflection layer (ARL) may be disposed on the second conductive pattern (CTL2). In one embodiment, the anti-reflection layer (ARL) may include a black matrix (BM) and a plurality of color filters (CFT). The black matrix (BM) may overlap the non-emissive area (NLA), and the color filters (CFT) may overlap the emissive areas (LA), respectively.

[0167] A black matrix (BM) may be disposed on an insulating layer (TINS) to cover a second conductive pattern (CTL2). An opening (B_OP) overlapping an emission area (LA) and an opening (PX_OP) may be defined in the black matrix (BM). The black matrix (BM) may absorb and block light. The width of the opening (B_OP) may be greater than the width of the opening (PX_OP).

[0168] Color filters (CFT) may be disposed on the first insulating layer (TINS) and the black matrix (BM). The color filters (CFT) may be disposed in each of the openings (B_OP). A planarization insulating layer (PINS) may be disposed on the color filters (CFT). The planarization insulating layer (PINS) may provide a flat upper surface.

[0169] When external light directed toward a display panel (DP) is reflected by the display panel (DP) and re-provided to an external user, the user may perceive the external light, as in a mirror. To prevent this phenomenon, for example, an anti-reflection layer (RPL) may include a plurality of color filters (CFTs) that display the same color as the pixels (PX) of the display panel (DP). The color filters (CFTs) may filter the external light into colors identical to those of the pixels (PX). In this case, the external light may not be perceived by the user.

[0170] However, embodiments of the present invention are not limited thereto, and the anti-reflection layer (RPL) may include a polarizing film to reduce the reflectance of external light. The polarizing film may be manufactured separately and attached to the input sensor (IS) by an adhesive layer. The polarizing film may include a phase retarder and / or a polarizer.

[0171]

[0172] Fig. 5a is a cross-sectional view of a display device according to one embodiment taken along line I-I' of Fig. 3. Fig. 5b is a cross-sectional view of a bent display device (DD) according to one embodiment of the present invention. Fig. 5a illustrates an unfolded state in which the display module (DM) is not bent. Fig. 5b illustrates a state in which the bending area (BA) of the display module (DM) is bent.

[0173] Referring to FIGS. 5A and 5B, the display device (DD) includes a window (WM), an upper member (UM), a display module (DM), and a lower member (LM). The upper member (UM) refers to a component positioned between the window (WM) and the display module (DM), and the lower member (LM) refers to a component positioned below the display module (DM).

[0174] A window (WM) may include a thin film glass substrate (UTG), a window protection layer (PF) disposed on the thin film glass substrate (UTG), and a bezel pattern (BP) disposed on the lower surface of the window protection layer (PF). In the present embodiment, the window protection layer (PF) may include a synthetic resin film. A functional layer may be disposed on the window protection layer (PF).

[0175] The bezel pattern (BP) may be disposed on one surface of the thin film glass substrate (UTG) or one surface of the window protection layer (PF). FIG. 5A illustrates an example of a bezel pattern (BP) disposed on the lower surface of the window protection layer (PF). However, the present invention is not limited thereto, and the bezel pattern (BP) may also be disposed on the upper surface of the window protection layer (PF). The bezel pattern (BP) may be a colored light-blocking film. For example, it may be formed by a coating method. The bezel pattern (BP) may include a base material and a dye or pigment mixed into the base material. The non-display area (NDA) illustrated in FIG. 1A may be defined by the shape of the bezel pattern (BP).

[0176] The thickness of the thin film glass substrate (UTG) can range from 15 μm to 45 μm. The thin film glass substrate (UTG) can be chemically strengthened glass. The thin film glass substrate (UTG) can minimize the occurrence of wrinkles even when repeated folding and unfolding.

[0177] The thickness of the window protection layer (PF) may be 50 μm to 80 μm. The synthetic resin film of the window protection layer (PF) may include polyimide, polycarbonate, polyamide, triacetylcellulose, polymethylmethacrylate, or polyethylene terephthalate.

[0178] According to one embodiment, the window (WM) may further include a functional layer disposed on an upper surface of the window protective layer (PF). The functional layer may include at least one of a hard coating layer, an anti-fingerprint layer, and an anti-reflection layer.

[0179] The window protection layer (PF) and the thin film glass substrate (UTG) can be bonded by a first adhesive layer (AL1). The first adhesive layer (AL1) can be a pressure sensitive adhesive film (PSA) or an optically clear adhesive (OCA). The adhesive layers described below can also include the same adhesive as the first adhesive layer (AL1).

[0180] The first adhesive layer (AL1) can be separated from the thin film glass substrate (UTG). That is, the adhesive strength between the first adhesive layer (AL1) and the thin film glass substrate (UTG) may be lower than the adhesive strength between the first adhesive layer (AL1) and the window protection layer (PF). Since the window protection layer (PF) is positioned on top of the thin film glass substrate (UTG), scratches may occur relatively easily. After the first adhesive layer (AL1) and the window protection layer (PF) are separated, a new window protection layer (PF) can be attached to the thin film glass substrate (UTG).

[0181] The upper member (UM) includes a top film (DL). The top film (DL) may include a synthetic resin film. The synthetic resin film may include polyimide, polycarbonate, polyamide, triacetylcellulose, polymethylmethacrylate, or polyethylene terephthalate.

[0182] The upper film (DL) can absorb external impact applied to the front surface of the display device (DD). The display module (DM) described with reference to Fig. 4 may include an anti-reflection layer (ARL) replacing the polarizing film, which may reduce the front impact strength of the display device (DD). The upper film (DL) may compensate for the reduced impact strength by applying the anti-reflection layer (ARL). In one embodiment of the present invention, the upper film (DL) may be omitted. The thin film glass substrate (UTG) and the upper film (DL) may be bonded by a second adhesive layer (AL2). The upper film (DL) and the display module (DM) may be bonded by a third adhesive layer (AL3).

[0183] The lower member (LM) may include a panel protection layer (PPL), a barrier layer (BRL), a digitizer (DGT), a metal layer (ML), a cushion layer (CS), a metal plate (MP), a heat dissipation layer (HRP), a magnetic shielding sheet (MSM), and a step compensation member (AS). The components of the lower member (LM) excluding the digitizer (DGT) may be defined as functional layers.

[0184] A panel protection layer (PPL) may be disposed on the lower side of the display module (DM). The panel protection layer (PPL) may protect the lower portion of the display module (DM). The panel protection layer (PPL) may include a flexible synthetic resin film. For example, the panel protection layer (PPL) may include polyethylene terephthalate.

[0185] In one embodiment, the panel protection layer (PPL) may be non-disposed in the bending area (BA). The panel protection layer (PPL) may include a first panel protection layer (PPL-1) protecting a first non-bending area (AA1) of the display panel (DP, see FIG. 3) and a second panel protection layer (PPL-2) protecting a second non-bending area (AA2).

[0186] A fourth adhesive layer (AL4) bonds the panel protection layer (PPL) and the display module (DM). The fourth adhesive layer (AL4) may include a first portion (AL4-1) corresponding to the first panel protection layer (PPL-1) and a second portion (AL4-2) corresponding to the second panel protection layer (PPL-2).

[0187] As illustrated in FIG. 5b, when the bending area (BA) is bent, the second panel protection layer (PPL-2) may be disposed on the lower side of the first non-bending area (AA1) and the first panel protection layer (PPL-1) together with the second non-bending area (AA2). Since the panel protection layer (PPL) is not disposed on the bending area (BA), the bending area (BA) can be bent more easily. The second panel protection layer (PPL-2) may be attached to the metal plate (MP) via the tenth adhesive layer (AL10). The tenth adhesive layer (AL10) may be omitted. Although not illustrated separately, an additional configuration such as an insulating tape may be further disposed between the second panel protection layer (PPL-2) and the metal plate (MP).

[0188] As illustrated in FIG. 5b, the bending area (BA) has a predetermined curvature and curvature radius. The curvature radius may be about 0.1 mm to 0.5 mm. A bending protection layer (BPL) is disposed at least in the bending area (BA). The bending protection layer (BPL) may overlap the bending area (BA), the first non-bending area (AA1), and the second non-bending area (AA2). The bending protection layer (BPL) may be disposed over the entire area of ​​the bending area (BA), and may be disposed over a portion of the first non-bending area (AA1) and a portion of the second non-bending area (AA2).

[0189] The bending protection layer (BPL) can be bent together with the bending area (BA). The BPL protects the bending area (BA) from external impact and controls the neutral plane of the bending area (BA). The BPL controls the stress in the bending area (BA) so that the neutral plane approaches the signal lines arranged in the bending area (BA).

[0190] The barrier layer (BRL) may be disposed under the panel protection layer (PPL). The barrier layer (BRL) and the panel protection layer (PPL) may be bonded via a fifth adhesive layer (AL5).

[0191] The barrier layer (BRL) can increase resistance to compressive force due to external pressure. Therefore, the barrier layer (BRL) can play a role in preventing deformation of the display panel (DP). The barrier layer (BRL) can include a flexible plastic material such as polyimide or polyethylene terephthalate. In addition, the barrier layer (BRL) can be a colored film with low light transmittance. The barrier layer (BRL) can absorb light incident from the outside. For example, the barrier layer (BRL) can be a black synthetic resin film. When the display device (DD) is viewed from above the window protection layer (PF), components arranged under the barrier layer (BRL) may not be visible to the user.

[0192] The sixth adhesive layer (AL6) bonds the barrier layer (BRL) and the digitizer (DGT). The sixth adhesive layer (AL6) may include a first portion (AL6-1) and a second portion (AL6-2) that are spaced apart from each other. The distance (D6, or gap) between the first portion (AL6-1) and the second portion (AL6-2) corresponds to the width of the folding area (FA0) and may be greater than the gap (GP) described below. The distance (D6) between the first portion (AL6-1) and the second portion (AL6-2) may be 5 mm to 15 mm.

[0193] In this embodiment, the first part (AL6-1) and the second part (AL6-2) are defined as different parts of one adhesive layer, but are not limited thereto. When the first part (AL6-1) is defined as one adhesive layer (e.g., the first adhesive layer or the second adhesive layer), the second part (AL6-2) may be defined as another adhesive layer (e.g., the second adhesive layer or the third adhesive layer). The above-described definitions may be applied to adhesive layers including two parts among the adhesive layers described below as well as the sixth adhesive layer (AL6).

[0194] The digitizer (DGT) according to the present invention can detect input by an electromagnetic pen. At this time, the digitizer (DGT) can detect input by the electromagnetic pen by using a method of electromagnetic induction resonance (EMR).

[0195] The digitizer (DGT) may include a first non-folding portion (NFP1) overlapping a first non-folding area (NFA10), a folding portion (FP) overlapping a folding area (FA0), and a second non-folding portion (NFP2) overlapping a second non-folding area (NFA20). According to one embodiment, holes (HL) penetrating in a third direction (DR3), which is a thickness direction, may be defined in the folding portion (FP). Since the holes (HL) are defined in the folding portion (FP), the shape of the digitizer (DGT) may be easily deformed during a folding operation of the display device (DD). A description of the components included in the digitizer (DGT) will be provided later.

[0196] A metal layer (ML) may be disposed under the digitizer (DGT). The metal layer (ML) may include a first metal layer (ML1) and a second metal layer (ML2) that overlap the first non-folding portion (NFP1) and the second non-folding portion (NFP2), respectively. Each of the first metal layer (ML1) and the second metal layer (ML2) may overlap a portion of the folding portion (FP) and may be spaced apart from each other in the area overlapping the folding portion (FP).

[0197] The metal layer (ML) can dissipate heat generated when the digitizer (DGT) is operated to the outside. The metal layer (ML) transfers heat generated in the digitizer (DGT) to the lower side. The metal layer (ML) can have greater electrical conductivity and thermal conductivity than the metal plate (MP) described below. The metal layer (ML) can include copper or aluminum. The metal layer (ML) with relatively high electrical conductivity can block electromagnetic waves generated from an electronic module (EM, see FIG. 2a) disposed below from affecting the digitizer (DGT) as noise.

[0198] The seventh adhesive layer (AL7) can bond the digitizer (DGT) and the metal layer (ML). The seventh adhesive layer (AL7) can include a first portion (AL7-1) and a second portion (AL7-2) corresponding to the first metal layer (ML1) and the second metal layer (ML2).

[0199] The cushion layer (CS) may include a first cushion layer (CS1) and a second cushion layer (CS2) that overlap the first non-folding portion (NFP1) and the second non-folding portion (NFP2), respectively. Each of the first cushion layer (CS1) and the second cushion layer (CS2) may overlap a portion of the folding portion (FP) and may be spaced apart from each other in the area overlapping the folding portion (FP).

[0200] The first cushion layer (CS1) and the second cushion layer (CS2) can prevent foreign substances from entering the holes (HL) when the display device (DD) is folded. In addition, when the display device (DD) is unfolded, even if the folding portion (FP) is folded with a predetermined curvature, the shape of the digitizer (DGT) can be easily deformed because the first cushion layer (CS1) and the second cushion layer (CS2) are spaced apart from each other in the area overlapping the folding portion (FP).

[0201] A cushion layer (CS) may be disposed under the metal layer (ML). The cushion layer (CS) may protect the display module (DM) from impact transmitted from the bottom of the display module (DM). The cushion layer (CS) may include foam or sponge. The foam may include polyurethane foam or thermoplastic polyurethane foam. When the cushion layer (CS) includes foam, a barrier film may be added as a base layer to the cushion layer (CS), and a foaming agent may be foamed onto the barrier film to form the cushion layer (CS).

[0202] The eighth adhesive layer (AL8) can bond the metal layer (ML) and the cushion layer (CS). The eighth adhesive layer (AL8) can include a first portion (AL8-1) and a second portion (AL8-2) corresponding to the first cushion layer (CS1) and the second cushion layer (CS2).

[0203] A metal plate (MP) may be disposed under a cushion layer (CS). The metal plate (MP) may include a first metal plate (MP1) and a second metal plate (MP2) that overlap a first cushion layer (CS1) and a second cushion layer (CS2), respectively. The metal plate (MP) may absorb an external impact applied from below. The metal plate (MP) may have greater strength and a greater thickness than the metal layer (ML). The metal plate (MP) may include a metal material such as stainless steel.

[0204] The ninth adhesive layer (AL9) bonds the cushion layer (CS) and the metal plate (MP). The ninth adhesive layer (AL9) may include a first portion (AL9-1) and a second portion (AL9-2) corresponding to the first metal plate (MP1) and the second metal plate (MP2).

[0205] A heat dissipation layer (HRP) may be disposed on the lower side of a metal plate (MP). The heat dissipation layer (HRP) may include a first heat dissipation layer (HRP1) and a second heat dissipation layer (HRP2) that overlap a first metal plate (MP1) and a second metal plate (MP2), respectively. The heat dissipation layer (HRP) dissipates heat generated from electronic components disposed on the lower side. The electronic components may be electronic modules (EM) as illustrated in FIGS. 2A and 2B. The heat dissipation layer (HRP) may have a structure in which adhesive layers and graphite layers are alternately laminated. The heat dissipation layer (HRP) may be attached to the metal plate (MP) through an additional adhesive layer disposed between the heat dissipation layer (HRP) and the metal plate (MP).

[0206] A magnetic shielding sheet (MSM) may be placed on the lower side of the metal plate (MP). The magnetic shielding sheet (MSM) shields the magnetic field generated from a magnetic body (not shown) placed on the lower side. The magnetic shielding sheet (MSM) can prevent the magnetic field generated from the magnetic body from interfering with the digitizer (DGT).

[0207] A magnetic shielding sheet (MSM) includes a plurality of sections. At least some of the sections may have different thicknesses. The plurality of sections may be arranged to correspond to a step difference of a bracket (not shown) arranged on the lower side of a display device (DD). The magnetic shielding sheet (MSM) may have a structure in which a magnetic shielding layer and an adhesive layer are alternately laminated. A portion of the magnetic shielding sheet (MSM) may be directly attached to a metal plate (MP).

[0208] A step compensation member (AS) may be placed under the metal layer (ML). The step compensation member (AS) may be a double-sided tape or an insulating film. The step compensation member (AS) may be provided as a first step compensation member (AS-1) and a second step compensation member (AS-2), thereby compensating for steps formed with different widths between components included in the lower member (LM).

[0209] The functional layers arranged under the first non-folding portion (NFP1) and the second non-folding portion (NFP2) of the lower member (LM) are arranged with a predetermined gap (GP) spaced apart from the folding portion (FP) in an area overlapping the folding portion (FP). The gap (GP) may be 0.3 mm to 3 mm.

[0210] A through hole (LTH) may be formed in some of the lower member (LM). The through hole (LTH) is arranged to overlap the sensing area (DP-TA) of Fig. 2a. As illustrated in Fig. 5a, the through hole (LTH) may penetrate from the fifth adhesive layer (AL5) to the metal plate (MP). The through hole (LTH) is similar to the removal of a light-shielding structure from the path of an optical signal, and the through hole (LTH) may improve the optical signal reception efficiency of an electro-optical module (ELM).

[0211] In one embodiment, the display device (DD) may omit at least one of the metal layer (ML), the cushion layer (CS), the metal plate (MP), and the step compensation member (AS), and is not limited to any one embodiment.

[0212]

[0213] FIG. 6A is a plan view of a digitizer (DGT) showing first sensing coils (RF) of the digitizer (DGT) according to one embodiment of the present invention. FIG. 6B is a plan view illustrating a first sensing coil (RF) according to one embodiment of the present invention. FIG. 7A is a plan view of a digitizer (DGT) showing second sensing coils (CF) of the digitizer (DGT) according to one embodiment of the present invention. FIG. 7B is a plan view illustrating a second sensing coil (CF) according to one embodiment of the present invention.

[0214] Referring to FIG. 6A, the area on the plane of the digitizer (DGT) may include an active area (AA) and a non-active area (NAA) surrounding the active area (AA). The non-active area (NAA) may surround the active area (AA). The active area (AA) may overlap the aforementioned display area (DA), and the non-active area (NAA) may overlap the aforementioned non-display area (NDA).

[0215] The digitizer (DGT) may include a connector (CNT), a plurality of first connector connection wires (CCL1), and a plurality of first sensing coils (RF). The connector (CNT) may be arranged on one side of the digitizer (DGT). For example, the connector (CNT) may be arranged in the non-active area (NAA) on the right side. The connector (CNT) may be arranged in the second non-folding portion (NFP2).

[0216] The first connector connection wires (CCL1) may be arranged in the right inactive area (NAA). The first connector connection wires (CCL1) may extend in the second direction (DR2) and be arranged in the first direction (DR1) to be connected to the connector (CNT). The first sensing coils (RF) may be connected to the first connector connection wires (CCL1). The first sensing coils (RF) may be connected to the connector (CNT) via the first connector connection wires (CCL1).

[0217] The first sensing coils (RF) can be arranged in the passive area (NAA) and the active area (AA). The first sensing coils (RF) can extend from the second non-folding portion (NFP2) to the first non-folding portion (NFP1). The first sensing coils (RF) can extend between the holes (HL) in the folding portion (FP). The first sensing coils (RF) can extend so as to be bent along the edges of the holes (HL) in the folding portion (FP).

[0218] The first sensing coils (RF) can be extended to form an open loop shape. For example, the first sensing coils (RF) can be extended to the right passive area (NAA), the active area (AA), and the left passive area (NAA), and then again to the active area (AA) and the right passive area (NAA) to form an open loop shape. The first sensing coils (RF) can be connected to the first connector connection wires (CCL1) and connected to the connector (CNT) through the first connector connection wires (CCL1).

[0219] For example, some of the first sensing coils (RF) are illustrated in an open loop configuration, while the remaining first sensing coils (RF) are illustrated without the loop configuration and extend only in the second direction (DR2) within the active area (AA). However, this is illustrated by omitting the configuration for illustration purposes, and the remaining first sensing coils (RF) may also extend in an open loop configuration.

[0220] Each of the first sensing coils (RF) may include a plurality of sensing wires. The sensing wires of each of the first sensing coils (RF) may include a plurality of first extension wires (EL1) and a plurality of first connection wires (CL1). The first extension wires (EL1) may be arranged in the active area (AA) to extend in the second direction (DR2) and may be arranged in the first direction (DR1). For example, each of the first sensing coils (RF) may include at least one pair of first extension wires (EL1), and the pair of first extension wires (EL1) may extend parallel to each other in the second direction (DR2).

[0221] The first extension wires (EL1) of the first sensing coils (RF) may be arranged in pairs adjacent to each other in the active area (AA) and may extend parallel to each other in the second direction (DR2). The first extension wires (EL1) may extend between the holes (HL). The first extension wires (EL1) may extend so as to be bent along the edges of the holes (HL) in the folding portion (FP).

[0222] The length of the first extension wires (EL1) may be different from the length of the first connection wires (CL1). For example, the first extension wires (EL1) may be longer than the first connection wires (CL1), but the embodiments of the present invention are not limited thereto.

[0223] The first connection wires (CL1) may be arranged in the inactive area (NAA) and may extend in the first direction (DR1). For example, the first connection wires (CL1) may be arranged in the left and right inactive areas (NAAs). The first connection wires (CL1) may be connected to the first extension wires (EL1). For example, the first connection wires (CL1) of each of the first sensing coils (RF) may be connected to both ends of the first extension wires (EL1) of each of the first sensing coils (RF).

[0224] In one embodiment, the first extension wires (EL1) may be arranged on a different layer from the first connection wires (CL1). For example, the first connection wires (CL1) may be arranged below the first extension wires (EL1). The first connection wires (CL1) may be connected to the first extension wires (EL1) through contact holes (CH). This stacking configuration will be described in detail below with reference to FIGS. 8A to 9 .

[0225] The first connector connection wires (CCL1) can be connected to the first connection wires (CL1) arranged in the right inactive area (NAA). In one embodiment, the first connector connection wires (CCL1) are arranged on the same layer as the first extension wires (EL1), and can be arranged on a different layer from the first connection wires (CL1). The first connection wires (CL1) can be connected to the first connector connection wires (CCL1) through contact holes (CH). However, the embodiment is not limited thereto, and the first connector connection wires (CCL1) can be arranged on the same layer as the first connection wires (CL1), and can be arranged on a different layer from the first extension wires (EL1). Alternatively, the first connector connection wires (CCL1) may be arranged on a different layer from the first connection wires (CL1) and the first extension wires (EL1), and may be arranged, for example, below the first connection wires (CL1) and the first extension wires (EL1).

[0226] Each of the first extension wires (EL1) may include first extension portions (EX1) disposed in the first and second non-folding portions (NFP1, NFP2), respectively, and first pattern portions (PP1) disposed in the folding portion (FP). The first extension portions (EX1) may extend in the second direction (DR2) from the first and second non-folding portions (NFP1, NFP2), respectively. The first pattern portions (PP1) may extend between the holes (HL). The first pattern portions (PP1) may extend so as to be bent along the edges of the holes (HL) in the folding portion (FP). The first pattern portions (PP1) may extend from the first extension portions (EX1). That is, in one embodiment of the present invention, the first pattern portions (PP1) may be formed integrally with the first extension portions (EX1).

[0227] Meanwhile, each of the first sensing coils (RF) according to one embodiment of the present invention may be formed in a double-wound open loop shape. FIG. 6b illustrates an example of one first sensing coil (RF) having a double-wound open loop shape and the first connector wires (CLL1) connected thereto.

[0228] Referring to FIG. 6b, the first sensing coil (RF) may include first extension wires (EL1) and first connection wires (CL1).

[0229] The first extension wires (EL1) may include first-first, first-second, first-third, and first-fourth extension wires (11e, 12e, 13e, 14e). The first-first to first-fourth extension wires (11e, 12e, 13e, 14e) may be sequentially arranged along the first direction (DR1). Each of the first-first to first-fourth extension wires (11e, 12e, 13e, 14e) may include first extension wires (EX1) disposed in the first and second non-folding wires (NFP1, NFP2), respectively, and a first pattern wire (PP1) disposed in the folding wire (FP). In Fig. 6b, the first pattern portion (PP1) is simply illustrated as extending in a straight line along the second direction (DR2), but in reality, the first pattern portion (PP1) can extend so as to be curved along the edges of the holes (HL) in the folding portion (FP).

[0230] The first connecting wires (CL1) may include first-first, first-second, first-third, and first-fourth connecting wires (11c, 12c, 13c, 14c). The first-first and first-second extension wires (11c, 12c) may be sequentially arranged along the second direction (DR2) within the first non-folding portion (NFP1). The first-third and first-fourth extension wires (13c, 14c) may be sequentially arranged along the second direction (DR2) within the second non-folding portion (NFP2).

[0231] The 1-4th connection wire (14c) may include a 1-1st sub-wire (14c1) and a 1-2nd sub-wire (14c2). The 1-1st sub-wire (14c1) and the 1-2nd sub-wire (14c2) may each extend in the first direction (DR1) and be spaced apart from each other in the first direction (DR1). The 1-1st sub-wire (14c1) and the 1-2nd sub-wire (14c2) may each be connected to a corresponding pair of first connector wires (CLL1) through contact holes (CH).

[0232] The 1-1 sub-wiring (14c1) of the 1-4 connecting wire (14c), the 1-1 extension wire (11e), the 1-1 connecting wire (11c), the 1-3 extension wire (13e), the 1-3 connecting wire (13c), the 1-2 extension wire (12e), the 1-2 connecting wire (12c), the 1-4 extension wire (14e), and the 1-2 sub-wiring (14c2) of the 1-4 connecting wire (14c) can be sequentially connected to form a two-turn open loop shape.

[0233]

[0234] Referring to FIG. 7a, the digitizer (DGT) may include a plurality of second sensing coils (CF), a plurality of bridge wires (BL), and a plurality of second connector connection wires (CCL2).

[0235] The second detection coils (CF) are connected to the second connector connection wires (CCL2), and the second connector connection wires (CCL2) can be connected to the connector (CNT). The second detection coils (CF) can be connected to the connector (CNT) via the second connector connection wires (CCL2). Some of the second detection coils (CF) can be connected to the bridge wires (BL), and can be connected to the second connector connection wires (CCL2) via the bridge wires (BL).

[0236] The second sensing coils (CF) may extend to form an open loop shape. For example, the second sensing coils (CF) may extend to the upper inactive area (NAA), the active area (AA), and the lower inactive area (NAA), and then extend back to the active area (AA) and the upper inactive area (NAA) to form an open loop shape. The second sensing coils (CF) may be connected to the second connector connection wires (CCL2) and may be connected to the connector (CNT) through the second connector connection wires (CCL2). In one embodiment, some of the second sensing coils (CF) may be connected to the second connector connection wires (CCL2) through the first bridge wires (BL1) and may be connected to the connector (CNT) through the first bridge wires (BL1) and the second connector connection wires (CCL2).

[0237] For example, some of the second sensing coils (CF) are illustrated in an open loop shape, and the remaining second sensing coils (CF) are illustrated to extend in the first direction (DR1) within the active area (AA) without the loop shape. However, this is illustrated by omitting it for illustration purposes, and the remaining second sensing coils (CF) may also extend in an open loop shape.

[0238] The bridge wires (BL) may include a plurality of first bridge wires (BL1) and a plurality of second bridge wires (BL2). In Fig. 7a, some of the first bridge wires (BL1) and some of the second bridge wires (BL2) are omitted.

[0239] The first bridge wires (BL1) may be adjacent to the upper and lower sides of the digitizer (DGT) with respect to the first direction (DR1). The second bridge wires (BL2) may be arranged between the first bridge wires (BL1) adjacent to the upper side of the digitizer (DGT) and the first bridge wires (BL1) adjacent to the lower side of the digitizer (DGT).

[0240] The first bridge wires (BL1) may include first-first bridge line portions (LP11), first-second bridge line portions (LP12), and first bridge pattern portions (BPP1). The first-first and first-second bridge line portions (LP11, LP12) may be adjacent to holes (HL). The first-first bridge line portions (LP11) may be arranged in an area adjacent to the folding portion (FP) among the first non-folding portions (NFP1). The first-second bridge line portions (LP12) may be arranged in an area adjacent to the folding portion (FP) among the second non-folding portions (NFP2). The first bridge pattern portions (BPP1) may be arranged in the folding portion (FP). The first bridge pattern portions (BPP1) may extend from the folding portion (FP) to between the holes (HL). The first bridge pattern portions (BPP1) can extend to be bent along the edges of the holes (HL) in the folding portion (FP). The first bridge pattern portions (BPP1) can connect the first-first bridge line portions (LP11) and the first-second bridge line portions (LP12). Each of the first bridge wires (BL1) can be a connection between the first-first bridge line portion (LP11), the first bridge pattern portion (BPP1), and the first-second bridge line portion (LP12).

[0241] The second bridge wires (BL2) may include second-first bridge line portions (LP21), second-second bridge line portions (LP22), and second bridge pattern portions (BPP2). The second-first and second-second bridge line portions (LP21, LP22) may be adjacent to holes (HL). The second-first bridge line portions (LP21) may be arranged in an area adjacent to the folding portion (FP) among the first non-folding portions (NFP1). The second-second bridge line portions (LP22) may be arranged in an area adjacent to the folding portion (FP) among the second non-folding portions (NFP2). The second bridge pattern portions (BPP2) may be arranged in the folding portion (FP). The second bridge pattern portions (BPP2) may extend from the folding portion (FP) to between the holes (HL). The second bridge pattern portions (BPP2) can extend to be bent along the edges of the holes (HL) in the folding portion (FP). The second bridge pattern portions (BPP2) can connect the second-first bridge line portions (LP21) and the second-second bridge line portions (LP22). Each of the second bridge lines (BL2) can be a connection between the second-first bridge line portion (LP21), the second bridge pattern portion (BPP2), and the second-second bridge line portion (LP22).

[0242] In one embodiment, the bridge wires (BL) may be arranged on the same layer as some of the second sensing coils (CF). However, the embodiment is not limited thereto, and the bridge wires (BL) may also be arranged below the second sensing coils (CF).

[0243] In one embodiment, the first to second-second bridge line portions (LP11, LP12, LP21, LP22) and the first and second bridge pattern portions (BPP1, BPP2) may be arranged on different layers and may be connected to each other through contact holes (CH'). However, the embodiment is not limited thereto, and the first to second-second bridge line portions (LP11, LP12, LP21, LP22) and the first and second bridge pattern portions (BPP1, BPP2) may be arranged on the same layer, and each of the first and second bridge wires (BL1, BL2) may extend continuously.

[0244] The second sensing coils (CF) may include non-folding coils disposed within the first non-folding portion (NFP1) or the second non-folding portion (NFP2) and folding coils at least partially disposed within the folding portion (FP). The second sensing coils (CF) may include a plurality of second extension wires (EL2), a plurality of third extension wires (EL3), a plurality of second connection wires (CL2), a plurality of third connection wires (CL3), and a plurality of fourth connection wires (CL4).

[0245] Each of the non-folding coils may include a plurality of sensing wires, and the sensing wires of each of the non-folding coils may include a plurality of second extension wires (EL2), a plurality of second connection wires (CL2), and a plurality of fourth connection wires (CL4). Each of the folding coils may include a plurality of sensing wires, and the sensing wires of each of the folding coils may include a plurality of third extension wires (EL3) and a plurality of third connection wires (CL3).

[0246] The second extension wires (EL2) may be arranged at least in the active area (AA) to extend in the first direction (DR1) and may be arranged in the second direction (DR2). The second extension wires (EL2) may be arranged in the first and second non-folding portions (NFP1, NFP2). The second extension wires (EL2) may be arranged in pairs adjacent to each other and may extend parallel to each other in the first direction (DR1).

[0247] Some of the third extension wires (EL3) may be arranged in the folding portion (FP), and other parts of the third extension wires (EL3) may be arranged in the first and second non-folding portions (NFP1, NFP2) adjacent to the folding portion (FP). Some of the third extension wires (EL3) arranged in the folding portion (FP) may extend between adjacent holes (HL) in the second direction (DR2). Other parts of the third extension wires (EL3) may be closer to the holes (HL) than the second extension wires (EL2). The third extension wires (EL3) may be arranged in pairs adjacent to each other and may extend parallel to each other in the first direction (DR1).

[0248] The second extension wires (EL2) and the third extension wires (EL3) may be arranged below the first extension wires (EL1). That is, in the active area (AA), the second sensing coils (CF) may be arranged below the first sensing coils (RF, see FIG. 6A). In one embodiment, the second extension wires (EL2) may be arranged on the same layer as the first connection wires (CL1).

[0249] The second connection wires (CL2) may be arranged in the non-active area (NAA) and extend in the second direction (DR2). For example, the second connection wires (CL2) may be arranged in the upper and lower non-active areas (NAA). In one embodiment, the second connection wires (CL2) may be arranged on the same layer as the first extension wires (EL1, see FIG. 6A).

[0250] The second connecting wires (CL2) can be connected to both ends of the second extension wires (EL2) through the contact holes (CH'). Some of the second connecting wires (CL2) can be connected to the first bridge wires (BL1) through the contact holes (CH').

[0251] At least a portion of each of the third connection wires (CL3) may be arranged on the folding portion (FP). The third connection wires (CL3) may extend between the holes (HL). The third connection wires (CL3) may extend to bend along the edges of the holes (HL). Although not illustrated in FIG. 7A, the third connection wires (CL3) may be connected to both ends of the third extension wires (EL3). The arrangement and connection relationship between the third connection wires (CL3) and the third extension wires (EL3) will be described later.

[0252] The fourth connecting wires (CL4) may be arranged in the inactive area (NAA) and extend in the first direction (DR1). The fourth connecting wires (CL4) may be arranged in the left and right inactive areas (NAAs).

[0253] The fourth connection wires (CL4) arranged in the right inactive area (NAA) can be connected to the second connection wires (CL2) arranged in the second non-folding portion (NFP2) through contact holes (CH'). The fourth connection wires (CL4) arranged in the left inactive area (NAA) can be connected to the second connection wires (CL2) arranged in the first non-folding portion (NFP1) through contact holes (CH').

[0254] The second connector connection wires (CCL2) can be connected to the connector (CNT) and extend in the second direction (DR2). Some of the second connector connection wires (CCL2) can be connected to the second connection wires (CL2), and other parts can extend to the active area (AA) and be connected to some of the second extension wires (EL2) and some of the third extension wires (EL3). In one embodiment, the second connector connection wires (CCL2) can be arranged on the same layer as the first extension wires (EL1, see FIG. 6A) described above. However, the embodiment is not limited thereto, and the second connector connection wires (CCL2) can also be arranged below the first extension wires (EL1, see FIG. 6A) and the second extension wires (EL2).

[0255] The second connector connection wires (CCL2) may include a plurality of second-first wires (L2-1), a plurality of second-second wires (L2-2), and a plurality of second-third wires (L2-3). The second-first wires (L2-1) may be arranged in the right inactive area (NAA). The second-first wires (L2-1) may be connected to the fourth connection wires (CL4) through the contact holes (CH'). The second-first wires (L2-1) may be connected to the second connection wires (CL2) through the fourth connection wires (CL4).

[0256] The second-second wires (L2-2) may be arranged in the second non-folding portion (NFP2). Some of the second-second wires (L2-2) may extend into the active area (AA) and be connected to some of the second extension wires (EL2) through the contact holes (CH'). Some of the second-second wires (L2-2) may be connected to some of the second extension wires (EL2) arranged in the active area (AA). In addition, although not shown, other parts of the second-second wires (L2-2) may extend into the active area (AA) and be connected to some of the third extension wires (EL3) through the contact holes (CH').

[0257] The second-third wires (L2-3) may be arranged in the second non-folding portion (NFP2). The second-third wires (L2-3) may extend to the active area (AA). The second-third wires (L2-3) may be connected to the second bridge wires (BL2) through the contact holes (CH') in the active area (AA). A pair of the second-third wires (L2-3) may be connected to a corresponding pair of the second bridge wires (BL2).

[0258] In one embodiment, a plurality of dummy pattern portions (DPT) may be arranged between holes (HL) where the first and second bridge pattern portions (BPP1, BPP2) and the third connection wires (CL3) are not arranged. The dummy pattern portions (DPT) may be insulated from surrounding conductors and may be in a floating state. However, depending on the embodiment, the dummy pattern portions (DPT) may be omitted.

[0259] Meanwhile, each of the second sensing coils (CF) according to one embodiment of the present invention may be formed in a double-wound open loop shape. FIG. 7b illustrates an example of one second sensing coil (CF) having a double-wound open loop shape and the second connector wires (CLL2) connected thereto. FIG. 7b illustrates a second sensing coil (CF, or non-folding coil) disposed in a second non-folding portion (NFP2).

[0260] Referring to FIG. 7b, the second sensing coil (CF) may include second extension wires (EL2) and second connection wires (CL2).

[0261] The second extension wires (EL2) may include the 2-1, 2-2, 2-3, and 2-4 extension wires (21e, 22e, 23e, 24e). The 2-1 to 2-4 extension wires (21e, 22e, 23e, 24e) may be sequentially arranged along the second direction (DR2).

[0262] The second connecting wires (CL2) may include the 2-1, 2-2, 2-3, and 2-4 connecting wires (21c, 22c, 23c, 24c). The 2-1 and 2-2 connecting wires (21c, 22c) may be sequentially arranged along the first direction (DR1). The 2-3 and 2-4 connecting wires (23c, 24c) may be sequentially arranged along the first direction (DR1).

[0263] The 2-4 extension wire (24e) may include a 2-1 sub-wire (24e1) and a 2-2 sub-wire (24e2). The 2-1 sub-wire (24e1) and the 2-2 sub-wire (24e2) may each extend in the first direction (DR1) and be spaced apart from each other in the first direction (DR1). The 2-1 sub-wire (24e1) and the 2-2 sub-wire (24e2) may each be connected to a corresponding pair of second connector connection wires (CCL2) through contact holes (CH'). Meanwhile, in the case of the second sensing coil (CF) arranged in the first non-folding portion (NFP1, see FIG. 7a), the second-first sub-wiring (24e1) and the second-second sub-wiring (24e2) may be connected to a corresponding pair of second bridge wirings (BL2, see FIG. 7a) through contact holes (CH'), respectively.

[0264] The 2-1 sub-wiring (24e1) of the 2-4 extension wiring (24e), the 2-1 connection wiring (21c), the 2-1 extension wiring (21e), the 2-4 connection wiring (24c), the 2-3 extension wiring (23e), the 2-2 connection wiring (22c), the 2-2 extension wiring (22e), the 2-3 connection wiring (23c), and the 2-2 sub-wiring (24e2) of the 2-4 extension wiring (24e) can be sequentially connected to form a two-turn open loop shape.

[0265] Referring to FIGS. 6A to 7B, in an embodiment of the present invention, the second detection coils (CF) may be defined as drive coils, and the first detection coils (RF) may be defined as sensing coils, but the present invention is not limited thereto, and vice versa. When current flows through the second detection coils (CF), magnetic lines of force may be induced between the second detection coils (CF) and the first detection coils (RF). The first detection coils (RF) may detect the induced electromagnetic force emitted from the electromagnetic pen and output it as a sensing signal to each terminal of the first detection coils (RF).

[0266]

[0267] Fig. 8a is a cross-sectional view of a digitizer (DGT) according to one embodiment of the present invention. Fig. 8b is a cross-sectional view of a digitizer (DGT) according to one embodiment of the present invention. The same / similar reference numerals are used for components identical / similar to those described in Figs. 5a to 7b, and duplicate descriptions are omitted.

[0268] Referring to FIG. 8A, a digitizer (DGT) according to one embodiment may include a first non-folding portion (NFP1) overlapping a first non-folding area (NFA10), a second non-folding portion (NFP2) overlapping a second non-folding area (NFA20), and a folding portion (FP) overlapping a folding area (FA0). A plurality of holes (HL) may be defined in the folding portion (FP).

[0269] A digitizer (DGT) according to one embodiment may include a first base layer (BG1), a second base layer (BG2), first sensing coils (RF), second sensing coils (CF), bridge wires (BL, see FIG. 7A), a first cover layer (IL1), and a second cover layer (IL2). FIG. 8A representatively illustrates the first bridge wire (BL1) among the bridge wires (BL, see FIG. 7A). The first sensing coils (RF), the second sensing coils (CF), and the bridge wires (BL, see FIG. 7A) may include copper.

[0270] The second base layer (BG2) may be disposed under the first base layer (BG1). The first cover layer (IL1) may be disposed on the first base layer (BG1), and the second cover layer (IL2) may be disposed under the second base layer (BG2). A first base hole (B1-H) penetrating the front and back may be defined in the first base layer (BG1). A second base hole (B2-H) penetrating the front and back may be defined in the second base layer (BG2). A first cover hole (I1-H) penetrating the front and back may be defined in the first cover layer (IL1). A second cover hole (I2-H) penetrating the front and back may be defined in the second cover layer (IL2).

[0271] Each of the holes (HL) defined in the folding portion (FP) may be formed such that the corresponding first base hole (B1-H), second base hole (B2-H), first cover hole (I1-H), and second cover hole (I2-H) are aligned with each other along the third direction (DR3). Accordingly, the respective inner surfaces defining the first base hole (B1-H), the second base hole (B2-H), the first cover hole (I1-H), and the second cover hole (I2-H) may be aligned with each other along the third direction (DR3).

[0272] At least some of the first extension wires (EL1) of the first sensing coil (RF) may be disposed on the upper surface (BG1-U) of the first base layer (BG1). At least some of the first connection wires (CL1) of the first sensing coil (RF) may be disposed on the upper surface (BG2-U) of the second base layer (BG2). The first extension wire (EL1) and the first connection wire (CL1) of the first sensing coil (RF) may be connected through a contact hole (CH) penetrating the first base layer (BG1).

[0273] At least some of the second extension wires (EL2) of the second sensing coil (CF) may be disposed on the upper surface (BG2-U) of the second base layer (BG2). At least some of the second connection wires (CL2) of the second sensing coil (CF) may be disposed on the upper surface (BG1-U) of the first base layer (BG1). The second extension wire (EL2) and the second connection wire (CL2) of the second sensing coil (CF) may be connected through a contact hole (CH') penetrating the first base layer (BG1).

[0274] The third extension wires (EL3) arranged in the non-folding portions (NFP1, NFP2) of the second sensing coil (CF) may be arranged on the upper surface (BG2-U) of the second base layer (BG2), and the third extension wires (EL3) arranged in the folding portion (FP) may be arranged on the lower surface (BG2-B) of the second base layer (BG2). At least some of the third connection wires (CL3) of the second sensing coil (CF) may be arranged on the upper surface (BG2-U) of the second base layer (BG2).

[0275] Meanwhile, the arrangement of the first extension wires (EL1) and the third connection wires (CL3) passing through the folding portion is not limited to FIGS. 8a and 8b. Various embodiments thereof will be described later.

[0276] Among the first bridge wiring (BL1), the first-first and first-second bridge line portions (LP11, LP12) may be disposed on the lower surface (BG2-B) of the second base layer (BG2). The first bridge pattern portion (BPP1) among the first bridge wiring (BL1) may be disposed on the upper surface (BG2-U) of the second base layer (BG2). The first-first and first-second bridge line portions (LP11, LP12) and the first bridge pattern portion (BPP1) may be connected through a contact hole (CH') defined by penetrating the second base layer (BG2). The first-first and first-second bridge line portions (LP11, LP12) may be connected to the second connection wiring (CL2) through a contact hole (CH') defined by penetrating the first and second base layers (BG1, BG2).

[0277] Although the second bridge wiring (BL2, see FIG. 7a) is not illustrated in FIGS. 8a and 8b, the 2-1 and 2-2 bridge line portions (LP21, LP22, see FIG. 7a) and the 2nd bridge pattern portion (BPP2, see FIG. 7a) of the second bridge wiring (BL2, see FIG. 7a) may be arranged on the same layer as the 1-1 and 1-2 bridge line portions (LP11, LP12) and the 1st bridge pattern portion (BPP1) of the first bridge wiring (BL1), respectively.

[0278]

[0279] Fig. 9 is a cross-sectional view of a digitizer (DGT) according to one embodiment of the present invention. The same / similar reference numerals are used for configurations identical / similar to those described in Figs. 5a to 8b, and duplicate descriptions are omitted.

[0280] Referring to FIG. 9, a digitizer (DGT) according to one embodiment may include a first base layer (BG1), a second base layer (BG2), a third base layer (BG3), a first cover layer (IL1), and a second cover layer (IL2). The third base layer (BG3) may be disposed under the second base layer (BG2), and the second cover layer (IL2) may be disposed under the third base layer (BG3). A third base hole (B3-H) penetrating the front and back surfaces may be defined in the third base layer (BG3).

[0281] Each of the holes (HL) defined in the folding portion (FP) may be formed such that the corresponding first base hole (B1-H), second base hole (B2-H), third base hole (B3-H), first cover hole (I1-H), and second cover hole (I2-H) are aligned with each other along the third direction (DR3). Accordingly, the respective inner surfaces defining the first base hole (B1-H), the second base hole (B2-H), the third base hole (B3-H), the first cover hole (I1-H), and the second cover hole (I2-H) may be aligned with each other along the third direction (DR3).

[0282] According to the present embodiment, some of the third connection wires (CL3) may be arranged on the upper surface (BG2-U) of the second base layer (BG2), and other some of the third connection wires (CL3) may be arranged on the lower surface (BG3-B) of the third base layer (BG3). Through this, compared to a case where all of the third connection wires (CL3) are arranged on the same layer, the arrangement of the third connection wires (CL3) can be prevented from being crowded, and the third connection wires (CL3) may not be provided in a form in which they are detoured to pass through the folding part (FP) where space constraints exist.

[0283] Meanwhile, although not shown, according to another embodiment of the present invention, some of the first extension wires (EL1) may be disposed on the upper surface (BG1-U) of the first base layer (BG1), and other some of the first extension wires (EL1) may be disposed on the lower surface (BG3-B) of the third base layer (BG3).

[0284]

[0285] FIGS. 10A to 10C illustrate some of the long sides (or the first extension wires (EL1, see FIG. 6A)) of the first sensing coils (RF, see FIG. 6A). FIG. 11 is an enlarged plan view of some of the holes (HL) defined in the digitizer (DGT) according to one embodiment of the present invention. The same / similar reference numerals are used for the same / similar configurations as those described in FIGS. 5A to 8B, and duplicate descriptions are omitted.

[0286] Referring to FIGS. 10A to 11, the folding portion (FP) of the digitizer (DGT) in the present embodiment may include an outer portion (OM) and an inner portion (IN). The outer portion (OM) may be a portion positioned outerward relative to the inner portion (IN) with respect to the first direction (DR1). A plurality of outer portions (OMs) may be provided, and may be positioned at the top and bottom of the folding portion (FP), respectively. For convenience of explanation, FIG. 11 illustrates only the outer portion (OM) positioned at the top of the folding portion (FP), but the description of FIG. 11 may also be applied to the outer portion positioned at the bottom of the folding portion (FP).

[0287] FIGS. 10A to 10C illustrate some of the first sensing coils (RF) by way of example. FIGS. 10A to 10C illustrate enlarged views of the first extension wires (EL1) of the first sensing coils (RF) arranged on the inner side (IN) of the folding part (FP) and the first non-folding part (NFP1) adjacent thereto.

[0288] FIG. 10a illustrates only six sequentially arranged wires (hereinafter referred to as first to sixth wires (L-1 to L-6)) among the first extension wires (EL1) as an example, and illustrates some of the first extension wires (EX1) arranged in the first non-folding portion (NFP1) and the first pattern wires (PP1) arranged in the folding portion (FP).

[0289] Referring to FIG. 10A, the first to sixth wires (L-1 to L-6) may each extend along the second direction (DR2) and be sequentially arranged along the first direction (DR1). For example, on a plane, the first and second wires (L-1, L-2) may be arranged adjacent to each other, the third and fourth wires (L-3, L-4) may be arranged adjacent to each other, and the fifth and sixth wires (L-5, L-6) may be arranged adjacent to each other.

[0290] The separation distance in the first direction (DR1) between the second wire (L-2) and the third wire (L-3) may be greater than the separation distance in the first direction (DR1) between the first wire (L-1) and the second wire (L-2). In addition, the separation distance in the first direction (DR1) between the fourth wire (L-4) and the fifth wire (L-5) may be greater than the separation distance in the first direction (DR1) between the third wire (L-3) and the fourth wire (L-4).

[0291] In the present embodiment, the first holes (HL-N) arranged in the inner side (IN) of the folding portion (FP) may include first group holes (HG1) and second group holes (HG2). For example, the first group holes (HG1) may include a first-first hole (H1-1) and a first-second hole (H1-2), each of which extends along a first direction (DR1) and is arranged in the first direction (DR1). The second group holes (HG2) may be spaced apart from the first group holes (HG1) along a second direction (DR2). The second group holes (HG2) may include a second-first hole (H2-1), a second-second hole (H2-2), and a second-third hole (H2-3), each of which extends along the first direction (DR1) and is arranged in the first direction (DR1). Each of the first group holes (HG1) and the second group holes (HG2) is provided in multiples and can be arranged alternately along the second direction (DR2) within the folding portion (FP).

[0292] In this embodiment, the second group hole (HG2) can be shifted by a predetermined distance in the first direction (DR1) from the first group hole (HG1). The shape of the remaining portion of the folding portion (FP), excluding the first holes (HL-N), can have a lattice-patterned slit shape.

[0293] Each of the first pattern portions (PP1) may include a first-first pattern (P1-1), a first-second pattern (P1-2), a second pattern (P2), and a third pattern (P3).

[0294] Each of the first-first pattern (P1-1) and the first-second pattern (P1-2) may extend in the second direction (DR2) and be spaced apart along the second direction (DR2) with a corresponding hole (HL) therebetween. The second pattern (P2) may be connected to one end of each of the first-first pattern (P1-1) and the first-second pattern (P1-2) to connect the first-first pattern (P1-1) and the first-second pattern (P1-2). The second pattern (P2) may extend along the end of the hole (HL). The second pattern (P2) may extend in a curved shape.

[0295] One end of the third pattern (P3) may be connected to the other end of the first-second pattern (P1-2), and the other end of the third pattern (P3) may be connected to the other end of the first-first pattern (P1-1) of the continuous first pattern portion (PP1). In one embodiment, the third pattern (P3) may extend in the second direction (DR2) in a straight line.

[0296] The first pattern portion (PP1) of the first wiring (L-1) and the first pattern portion (PP1) of the second wiring (L-2) may have a shape that is symmetrical along an imaginary line extending in the second direction (DR2).

[0297] According to the present embodiment, on a plane, four or fewer wires may be arranged between adjacent first holes (HL-N) in a first direction (DR1), and two or fewer wires may be arranged between adjacent first holes (HL-N) in a second direction (DR2). Meanwhile, the description thereof may be equally applied not only to the first holes (HL-N) but also to holes arranged in an outer portion (OM, see FIG. 11) to be described later.

[0298] Each of the first holes (HL-N) may include one end (HE1) and the other end (HE2) spaced apart along the first direction (DR1). The width (HW1) of each of the first holes (HL-N) in the first direction (DR1) may be 4 millimeters (mm) or more and 10 millimeters (mm) or less. The width (HW2) of each of the holes (HL) in the second direction (DR2) may be 0.1 millimeters (mm) or more and 0.5 millimeters (mm) or less.

[0299] In one embodiment, the distance (d1) between adjacent wires and the first hole (HL-N) may be 100 micrometers (um) or less, and more preferably, less than 75 micrometers (um). The distance (d2) between adjacent wires may be 50 micrometers (um) or less, and more preferably, 20 to 40 micrometers (um). The thickness (or width) of each of the wires may be 40 micrometers (um) or more and 200 micrometers (um) or less.

[0300]

[0301] FIG. 10b illustrates only 10 sequentially arranged wires (hereinafter referred to as first to tenth wires (L-1 to L-10)) among the first extension wires (EL1), and illustrates some of the first extension wires (EX1) arranged in the first non-folding portion (NFP1) and the first pattern wires (PP1) arranged in the folding portion (FP).

[0302] Referring to FIG. 10b, the first to tenth wires (L-1 to L-10) may each extend along the second direction (DR2) and be sequentially arranged along the first direction (DR1). For example, on a plane, the first and second wires (L-1, L-2) may be arranged adjacent to each other, the third and fourth wires (L-3, L-4) may be arranged adjacent to each other, and the fifth and sixth wires (L-5, L-6) may be arranged adjacent to each other. The seventh and eighth wires (L-7, L-8) may be arranged adjacent to each other, and the ninth and tenth wires (L-9, L-10) may be arranged adjacent to each other.

[0303] According to one embodiment, the distance between the first wiring (L-1) and the second wiring (L-2), the distance between the third wiring (L-3) and the fourth wiring (L-4), the distance between the fifth wiring (L-5) and the sixth wiring (L-6), the distance between the seventh wiring (L-7) and the eighth wiring (L-8), and the distance between the ninth wiring (L-9) and the tenth wiring (L-10) in the first direction (DR1) may be equal to each other (hereinafter, defined as the first distance). According to one embodiment, the first distance may be maintained constant in the first non-folding portion (NFP1), the folding portion (FP), and the second non-folding portion (NFP2, see FIG. 6A). The first distance may be 20 to 40 micrometers.

[0304] In the first direction (DR1), the distance between the second wire (L-2) and the third wire (L-3), the distance between the fourth wire (L-4) and the fifth wire (L-5), the distance between the sixth wire (L-6) and the seventh wire (L-7), and the distance between the eighth wire (L-8) and the ninth wire (L-9) (hereinafter defined as the second distance (LW)) may be equal to each other. The second distance (LW) may be greater than the first distance.

[0305] Meanwhile, according to one embodiment, the second distance (LW) between the second wiring (L-2) and the third wiring (L-3), between the sixth wiring (L-6) and the seventh wiring (L-7), and the second distance (LW) between the fourth wiring (L-4) and the fifth wiring (L-5), and between the eighth wiring (L-8) and the ninth wiring (L-9) may be different from each other.

[0306] Each of the first folding portions (PP1) of the first wiring (L-1), the second wiring (L-2), the fifth wiring (L-5), the sixth wiring (L-6), the ninth wiring (L-9), and the tenth wiring (L-10) may include first patterns (U-P1), second patterns (U-P2), and third patterns (U-P3) arranged between the corresponding first patterns (U-P1) and second patterns (U-P2). The first patterns (U-P1) may extend along one end (HE1) of the first holes (HL-N) included in the first group holes (HG1) and may extend in a curved shape. The second patterns (U-P2) may extend along the other ends (HE2) of the first holes (HL-N) included in the second group holes (HG2) and may extend in a curved shape. The third patterns (U-P3) extend in the first direction (DR1) and can extend in a straight line.

[0307] The first folding portion (PP1) of each of the third wiring (L-3), the fourth wiring (L-4), the seventh wiring (L-7), and the eighth wiring (L-8) may include first patterns (B-P1), second patterns (B-P2), and third patterns (B-P3) arranged between the corresponding first pattern (B-P1) and the second pattern (B-P2). The first patterns (B-P1) may extend along one end (HE1) of the first holes (HL-N) included in the second group of holes (HG2) and may extend in a curved shape. The second patterns (B-P2) may extend along the other ends (HE2) of the first holes (HL-N) included in the first group of holes (HG1) and may extend in a curved shape. The third patterns (B-P3) may extend in the first direction (DR1) and may extend in a straight shape. That is, in the present embodiment, each of the first to tenth wires (L-1 to L-10) can extend along both ends (HE1, HE2) of the two group holes (HG1, HG2).

[0308]

[0309] Referring to FIG. 10c, the width of the first holes (HL-N) included in the first group hole (HG1a) in the first direction (DR1) (hereinafter, the first hole width (HW11)) and the width of the first holes (HL-N) included in the second group hole (HG2a) in the first direction (DR1) (hereinafter, the second hole width (HW12)) may be different from each other. In one embodiment, the first hole width (HW11) may be greater than the second hole width (HW12). Accordingly, the second distances (LW2) between the fourth wiring (L-4) and the fifth wiring (L-5) and between the eighth wiring (L-8) and the ninth wiring (L-9) may be greater than the second distances (LW1) between the second wiring (L-2) and the third wiring (L-3) and between the sixth wiring (L-6) and the seventh wiring (L-7), respectively.

[0310]

[0311] Referring to Fig. 11, the holes (HL) may include first holes (HL-N), second holes (HL-S), and third holes (HL-C, HL-M). The first holes (HL-N) are holes arranged within the inner side (IN) of the folding portion (FP), and the second holes (HL-S) and third holes (HL-C, HL-M) may be holes at least partially arranged within the outer side (OM). Since the first holes (HL-N) have been described above with reference to Figs. 10a to 10c, a detailed description thereof will be omitted below. Fig. 11 exemplarily illustrates that the first holes (HL-N) described above with reference to Fig. 10c are arranged within the inner side (IN).

[0312] The second holes (HL-S) may be holes spaced apart from the first group holes (HG1a) in the first direction (DR1). In one embodiment, the second holes (HL-S) may have the same shape as the first group holes (HG1a) and may have the same width (HW2) as the first hole width (HW11) of the first group holes (HG1a). However, the present invention is not limited thereto, and the width (HW2) of the second holes (HL-S) may be smaller than the first hole width (HW11).

[0313] The third holes (HL-M, HL-C) may be holes spaced apart from the second group holes (HG2a) in the first direction (DR1). The third holes (HL-M, HL-C) may include third-first holes (HL-M) and third-second holes (HL-C) having different shapes. The third-second holes (HL-C) may be holes arranged at the outermost portion within the outer portion (OM). The third-first holes (HL-M) may be arranged between the third-second holes (HL-C) and the second group holes (HG2a). Some of the third-first holes (HL-M) may be arranged in the inner portion (IN), and other some of the third-first holes (HL-M) may be arranged in the outer portion (OM).

[0314] In one embodiment, the 3-1 holes (HL-M) may have a width (HW31) smaller than the second hole width (HW12) of the 2nd group holes (HG2a). The 3-2 holes (HL-C) may be arranged at the edge of the outer portion (OM) and may have a shape in which a portion is cut off. Accordingly, each of the 3-2 holes (HL-C) may define an open opening. The width (HW32) of the 3-2 holes (HL-C) may be smaller than the width (HW31) of the 3-1 holes (HL-M).

[0315] In the present embodiment, the outer portion (OM) may be a portion where four wires are sequentially arranged from the edge of the folding portion (FP). That is, four wires may be sequentially arranged within the outer portion (OM) based on the first direction (DR1). The wires arranged within the outer portion (OM) may be arranged in a similar manner to the wires arranged within the inner portion (IN).

[0316]

[0317] Fig. 12a is an enlarged plan view of a portion of a digitizer (DGT) according to an embodiment of the present invention. Figs. 12b to 12d are enlarged cross-sectional views of a portion of a digitizer (DGT) according to an embodiment of the present invention. Fig. 12a illustrates an enlarged view of the second sensing coils (CF) at least partially disposed in the folding portion (FP). Figs. 12b to 12d illustrate cross-sections of the second sensing coils (CF) at least partially disposed in the folding portion (FP). The same / similar reference numerals are used for configurations identical / similar to those described in Figs. 5a to 9, and duplicate descriptions are omitted.

[0318] Referring to FIG. 12A, three second sensing coils (CF) (hereinafter referred to as a first folding coil (F1), a second folding coil (F2), and a third folding coil (F3)) are exemplarily illustrated as being at least partially disposed on a folding portion (FP). The first to third folding coils (F1, F2, and F3) may be sequentially arranged along the second direction (DR2).

[0319] FIG. 12a illustrates, by way of example, that each of the first to third folding coils (F1, F2, F3) is composed of a coil wound twice. However, this is not limited thereto, and the first to third folding coils (F1, F2, F3) may be composed of a coil wound once, or may be composed of a coil wound more than twice.

[0320] The first folding coil (F1) may be arranged in the first non-folding portion (NFP1) and the folding portion (FP). The second folding coil (F2) may be arranged in the first non-folding portion (NFP1), the folding portion (FP), and the second non-folding portion (NFP2). The third folding coil (F3) may be arranged in the second non-folding portion (NFP2) and the folding portion (FP).

[0321] Each of the first to third folding coils (F1, F2, F3) may include third extension wires (EL3) and third connection wires (CL3).

[0322] The third extension wires (EL3) may include the third-1, third-2, third-3, and third-4 extension wires (1eF1 to 4eF1, 1eF2 to 4eF2, 1eF3 to 4eF3). Each of the third extension wires (EL3) may extend along the first direction (DR1). The first folding coil (F1) may include the third-1 to third-4 extension wires (1eF1, 2eF1, 3eF1, 4eF1). The second folding coil (F2) may include the third-1 to third-4 extension wires (1eF2, 2eF2, 3eF2, 4eF2). The third folding coil (F3) may include third-1 to third-4 extension wires (1eF3, 2eF3, 3eF3, 4eF3).

[0323] The 3-1st and 3-2nd extension wires (1eF1, 2eF1) of the first folding coil (F1), the 3-1st and 3-2nd extension wires (1eF2, 2eF2) of the second folding coil (F2), and the 3-1st and 3-2nd extension wires (1eF3, 2eF3) of the third folding coil (F3) may be arranged relatively on the left. The 3-3rd and 3-4th extension wires (3eF1, 4eF1) of the first folding coil (F1), the 3-3rd and 3-4th extension wires (3eF2, 4eF2) of the second folding coil (F2), and the 3-3rd and 3-4th extension wires (3eF3, 4eF3) of the third folding coil (F3) may be arranged relatively on the right.

[0324] The third connecting wires (CL3) may include the third-1st, third-2nd, third-3rd, and third-4th connecting wires (1cF1 to 4cF1, 1cF2 to 4cF2, 1cF3 to 4cF3). The first coil (F1) may include the third-1st to third-4th connecting wires (1cF1, 2cF1, 3cF1, 4cF1). The second coil (F2) may include the third-1st to third-4th connecting wires (1cF2, 2cF2, 3cF2, 4cF2). The third coil (F3) may include the third-1st to third-4th connecting wires (1cF3, 2cF3, 3cF3, 4cF3).

[0325] Each of the third connection wires (CL3) may extend along the second direction (DR2). At least a portion of each of the third connection wires (CL3) may be disposed in the folding portion (FP). In FIG. 12A, each of the third connection wires (CL3) is simply illustrated as extending in a straight line from the folding portion (FP) along the second direction (DR2), but in practice, the third connection wires (CL3) may extend in a curved manner along the edges of the holes (HL, see FIG. 7A) in the folding portion (FP).

[0326] In one embodiment, the third extension wires (1eF3, 2eF3, 3eF1, 4eF1) arranged in the folding portion (FP) may be arranged in a different layer from the third connection wires (CL3), and the third extension wires (1eF3, 2eF3, 3eF1, 4eF1) arranged in the folding portion (FP) and the third connection wires (1cF1, 2cF1, 1cF3, 2cF3, 3cF1, 4cF1, 3cF3, 4cF3) connected thereto may be connected through a contact hole (CH') penetrating at least one base layer. The contact hole (CH') may be defined within the folding portion (FP).

[0327] In the present invention, the digitizer (DGT) may include at least one common wiring (CML). According to the present embodiment, one common wiring (CML) may provide third connection wirings (CL3) of different folding coils. That is, the third connection wirings (CL3) of different folding coils may be shared by the common wiring (CML).

[0328] In one embodiment, a plurality of common lines (CMLs) may be provided, and the common lines (CMLs) may include a first common line (CML1) and a second common line (CML2). The first common line (CML1) may extend across the folding portion (FP) from the upper side. The second common line (CML2) may extend across the folding portion (FP) from the lower side.

[0329] The first common wiring (CML1) can provide the 3-2 connection wiring (2cF1) of the first folding coil (F1) and the 3-1 connection wiring (1cF2) of the second folding coil (F2) together. That is, the 3-2 connection wiring (2cF1) of the first folding coil (F1) and the 3-1 connection wiring (1cF2) of the second folding coil (F2) can be shared as the first common wiring (CML1).

[0330] The first common wiring (CML1) is connected to the 3-2 extension wiring (2eF1) and the 3-4 extension wiring (4eF1) of the first folding coil (F1), so that a portion of the first common wiring (CML1) can form a portion of the first folding coil (F1). The first common wiring (CML1) is connected to the 3-1 extension wiring (1eF2) and the 3-3 extension wiring (3eF2) of the second folding coil (F2), so that a portion of the first common wiring (CML1) can form a portion of the second folding coil (F2).

[0331] The second common wiring (CML2) can provide the 3-4 connection wiring (4cF2) of the second folding coil (F2) and the 3-3 connection wiring (3cF3) of the third folding coil (F3). That is, the 3-4 connection wiring (4cF2) of the second folding coil (F2) and the 3-3 connection wiring (3cF3) of the third folding coil (F3) can be shared as the second common wiring (CML2).

[0332] The second common wiring (CML2) may be connected to the third-first extension wiring (1eF2) and the third-fourth extension wiring (4eF2) of the second folding coil (F2). A portion of the second common wiring (CML2) may form a portion of the second folding coil (F2). The second common wiring (CML2) may be connected to the third-second extension wiring (2eF3) and the third-third extension wiring (3eF3) of the third folding coil (F3). A portion of the second common wiring (CML2) may form a portion of the third folding coil (F3).

[0333] Meanwhile, the type of the third connection wire (CL3) of each of the first and second folding coils (F1, F2) shared in the first common wire (CML1) and the type of the third connection wire (CL3) of each of the second and third folding coils (F2, F3) shared in the second common wire (CML2) are not limited thereto.

[0334] In this embodiment, only one of the first folding coil (F1) and the second folding coil (F2) can be driven to detect an external input. When the first folding coil (F1) is driven to detect an external input, the second folding coil (F2) can be driven to float. In this case, the first common wire (CML1) can be used to drive the detection of the first folding coil (F1). When the second folding coil (F2) is driven to detect an external input, the first folding coil (F1) can be driven to float. In this case, the first common wire (CML1) can be used to drive the detection of the second folding coil (F2).

[0335] In addition, only one of the second folding coil (F2) and the third folding coil (F3) can be driven to detect an external input. When the second folding coil (F2) is driven to detect an external input, the third folding coil (F3) can be driven to float. In this case, the second common wire (CML2) can be used to drive the detection of the second folding coil (F3). When the third folding coil (F3) is driven to detect an external input, the second folding coil (F2) can be driven to float. In this case, the second common wire (CML2) can be used to drive the detection of the third folding coil (F3).

[0336] A coil that has been driven to float can remain in a floating state. For example, if a specific coil is to be driven to float, the electrical connection between the specific coil and the connector (CNT) can be cut off.

[0337] The first common wiring (CML1), the 3-1st connection wiring (1cF1) of the first folding coil (F1), the 3-2nd connection wiring (2cF2) of the second folding coil (F2), and the 3-1st and 3-2nd connection wirings (1cF3, 2cF3) of the third folding coil (F3) may be arranged on the upper part of the digitizer (DGT). The second common wiring (CML2), the 3-3rd and 3-4th connection wirings (3cF1, 4cF1) of the first folding coil (F1), the 3-3rd connection wiring (3cF2) of the second folding coil (F2), and the 3-4th connection wiring (4cF3) of the third folding coil (F3) may be arranged on the lower part of the digitizer (DGT). That is, five third connection wires (CL3) can be arranged on each of the upper and lower portions of the digitizer (DGT).

[0338] At least one of the first common wiring (CML1), the third-first connection wiring (1cF1) of the first folding coil (F1), the third-second connection wiring (2cF2) of the second folding coil (F2), and the third-first and third-second connection wirings (1cF3, 2cF3) of the third folding coil (F3) may be arranged at the outermost side within the upper portion.

[0339] At least one of the second common wiring (CML2), the 3rd-3rd and 3rd-4th connection wirings (3cF1, 4cF1) of the first folding coil (F1), the 3rd-3rd connection wiring (3cF2) of the second folding coil (F2), and the 3rd-4th connection wiring (4cF3) of the third folding coil (F3) may be arranged at the outermost side within the lower portion.

[0340] FIGS. 12b to 12d illustrate cross-sections of five third connection wires (CL3) (hereinafter, upper third connection wires (3a, 3b, 3c, 3d, 3e)) arranged on the upper portion of the digitizer (DGT). Although the five third connection wires (CL3) arranged on the lower portion of the digitizer (DGT) are omitted in FIGS. 12b to 12d, the description of FIGS. 12b to 12d can be similarly applied to the five third connection wires (CL3) arranged on the lower portion of the digitizer (DGT). One of the five upper third connection wires (3a, 3b, 3c, 3d, 3e) may correspond to the first common wire (CML1), and the rest may correspond to the 3-1 connection wire (1cF1) of the first folding coil (F1), the 3-2 connection wire (2cF2) of the second folding coil (F2), and the 3-1 and 3-2 connection wires (1cF3, 2cF3) of the third folding coil (F3).

[0341] Referring to FIGS. 12a and 12b, five upper third connection wires (3a, 3b, 3c, 3d, 3e) may be arranged sequentially on the same layer. In one embodiment, the digitizer (DGT) includes a first base layer (BG1), a second base layer (BG2), a first cover layer (IL1), and a second cover layer (IL2), and all of the upper third connection wires (3a, 3b, 3c, 3d, 3e) may be arranged on the upper surface (BG2-U) of the second base layer (BG2).

[0342] Among the five upper third connection wires (3a, 3b, 3c, 3d, 3e), four upper third connection wires (3a, 3b, 3c, 3d) may be arranged within the outer portion (OM), and one upper third connection wire (3e) may be arranged in the inner portion (IN). The type of the upper third connection wire (3e) arranged in the inner portion (IN) is not limited to any one.

[0343] Meanwhile, the order in which the upper third connecting wires (3a, 3b, 3c, 3d, 3e) are sequentially arranged in the direction from the outer portion (OM) to the inner portion (IN) is not limited to any one embodiment.

[0344]

[0345] Referring to FIGS. 12A and 12C, the upper third connection wires (3a, 3b, 3c, 3d, 3e) may include some disposed on different layers. In one embodiment, the digitizer (DGT) includes a first base layer (BG1), a second base layer (BG2), a first cover layer (IL1), and a second cover layer (IL2), and one upper third connection wire (3e) among the upper third connection wires (3a, 3b, 3c, 3d, 3e) may be disposed on the uppermost layer, and four upper third connection wires (3a, 3b, 3c, 3d) may be disposed below it. Meanwhile, the number of the third connection wires (3e) disposed on the uppermost layer is not limited to any one embodiment.

[0346] The upper third connection wire (3e) arranged on the uppermost layer may be arranged on the same layer as the first extension wires (EL1, see FIG. 8a) and may be arranged on the upper surface (BG1-U) of the first base layer (BG1). The remaining upper third connection wires (3a, 3b, 3c, 3d) may be arranged on the upper surface (BG2-U) of the second base layer (BG2). The type of the upper third connection wire (3e) arranged on the uppermost layer is not limited to any one.

[0347] The upper third connection wire (3e) arranged on the top layer can overlap any one of the remaining upper third connection wires (3a, 3b, 3c, 3d). Accordingly, all five upper third connection wires (3a, 3b, 3c, 3d, 3e) can be arranged within the outer portion (OM). In this case, the area detectable by the first to third folding coils (F1, F2, F3) can be expanded compared to the case where the five upper third connection wires (3a, 3b, 3c, 3d, 3e) are arranged sequentially.

[0348]

[0349] Referring to FIGS. 12A and 12D , the upper third connection wires (3a, 3b, 3c, 3d, 3e) may include some disposed on different layers. In one embodiment, the digitizer (DGT) includes a first base layer (BG1), a second base layer (BG2), a third base layer (BG3), a first cover layer (IL1), and a second cover layer (IL2), and one upper third connection wire (3e) among the upper third connection wires (3a, 3b, 3c, 3d, 3e) may be disposed on the lowermost layer, and the remaining four upper third connection wires (3a, 3b, 3c, 3d) may be disposed thereon. Meanwhile, the number of the third connection wires (3e) disposed on the lowermost layer is not limited to any one embodiment.

[0350] The upper third connection wire (3e) arranged on the lowest layer may be arranged on the lower surface (BG3-B) of the third base layer (BG3). The remaining upper third connection wires (3a, 3b, 3c, 3d) may be arranged on the upper surface (BG2-U) of the second base layer (BG2). The type of the upper third connection wire (3e) arranged on the lowest layer is not limited to any one.

[0351] The upper third connection wire (3e) arranged on the lowest layer can overlap any one of the remaining upper third connection wires (3a, 3b, 3c, 3d). Accordingly, all five upper third connection wires (3a, 3b, 3c, 3d, 3e) can be arranged within the outer portion (OM). In this case, the area detectable by the first to third folding coils (F1, F2, F3) can be expanded compared to the case where the five upper third connection wires (3a, 3b, 3c, 3d, 3e) are arranged sequentially.

[0352] According to the present embodiment, by providing a common wiring (CML) to the digitizer (DGT), the number of wires passing through the folding portion (FP) can be reduced. In particular, the folding coils (F1, F2, F3), at least some of which are disposed in the folding portion (FP), can provide a wider detection area as the third connection wires (CL3) are disposed closer to the outermost portion. However, in the folding portion (FP), the wires can extend through the holes (HL), and there may be a limit to the number of wires that can be disposed between the holes (HL). That is, in the folding portion (FP), there may be a limitation in the space in which wires can be disposed compared to the non-folding portions (NFP1, NFP2), and in this case, the wires in the folding portion (FP) may be provided in a detour so as to be away from the outermost portion. Meanwhile, according to the present embodiment, the number of wires that need to be disposed in the outermost portion can be reduced through the common wiring (CML). This reduces the density in the outer portion (OM) and reduces the number of wires provided in a bypass manner. Consequently, detection performance in the folding portion (FP) can be improved.

[0353]

[0354] [Revised 26.02.2025 under Rule 91] Fig. 13a is an enlarged plan view of a portion of a digitizer (DGT) according to an embodiment of the present invention. Figs. 13b to 13c are enlarged cross-sectional views of a portion of a digitizer (DGT) according to an embodiment of the present invention. The same / similar reference numerals are used for the same / similar components as those described in Figs. 5a to 9 and 12a to 12d, and duplicate descriptions are omitted.

[0355] In the present embodiment, some of the first sensing coils (RF) may also be arranged on the upper and lower portions of the digitizer (DGT), respectively. Some of the first extension wires (EL1, see FIG. 6a) among the first sensing coils (RF) may be arranged on the upper and lower portions of the digitizer (DGT), respectively.

[0356] n first sensing coils (RF) can be sequentially arranged along the first direction (DR1), and only some of the n first sensing coils (RF) arranged on the upper and lower portions of the digitizer (DGT) are illustrated in FIG. 13a.

[0357] In one embodiment, some of the first and second first sensing coils (R1, R2) may be arranged on the upper portion of the digitizer (DGT), and some of the (n-1)th and nth first sensing coils (Rn-1, Rn) may be arranged on the lower portion of the digitizer (DGT). (n is a natural number greater than or equal to 4.)

[0358] More specifically, the first-first and first-second extension wires (1eR1, 2eR1) of the first first detection coil (R1), and the first-first and first-second extension wires (1eR2, 2eR2) of the second first detection coil (R2) may be arranged on the upper part of the digitizer (DGT). The first-third and first-fourth extension wires (3eRn-1, 4eRn-1) of the n-1th first detection coil (Rn-1), and the first-third and first-fourth extension wires (3eRn, 4eRn) of the nth first detection coil (Rn) may be arranged on the lower part of the digitizer (DGT). That is, four first extension wires (1eR1, 2eR1, 1eR2, 2eR2, 3eRn-1, 4eRn-1, 3eRn, 4eRn) can be arranged on each of the upper and lower portions of the digitizer (DGT).

[0359] [Revised 26.02.2025 under Rule 91] FIG. 13a illustrates, by way of example, that the first extension wires (1eR1, 2eR1, 1eR2, 2eR2, 3eRn-1, 4eRn-1, 3eRn, 4eRn) are arranged on the outside of the third connection wires (CL3) on the upper and lower portions of the digitizer (DGT), respectively, but is not limited thereto. At least a portion of the first extension wires (1eR1, 2eR1, 1eR2, 2eR2, 3eRn-1, 4eRn-1, 3eRn, 4eRn) may be arranged on a different layer from at least a portion of the third connection wires (CL3), and may be arranged to overlap each other. The arrangement form in the cross section will be described in detail with reference to FIGS. 13b to 13c.

[0360] [Correction under Rule 91 26.02.2025] Figures 13b to 13c illustrate cross-sections of five third connection wires (CL3) (hereinafter, upper third connection wires (3a, 3b, 3c, 3d, 3e)) and four first extension wires (EL1) (hereinafter, upper first extension wires (1a, 1b, 1c, 1d)) arranged on the upper part of the digitizer (DGT).

[0361] The four upper first extension wires (1a, 1b, 1c, 1d) may correspond to the first-first and first-second extension wires (1eR1, 2eR1) of the first first detection coil (R1) and the first-first and first-second extension wires (1eR2, 2eR2) of the second first detection coil (R2).

[0362] Two wires are shared through the first common wire (CML1), so that the four long sides of the first sensing coils (RF) that pass through the upper part of the folding part (FP) and the six short sides of the second sensing coils (CF) that pass through the upper part of the folding part (FP) can be provided with nine wires.

[0363] Referring to FIGS. 13a and 13b, the five upper third connection wires (3a, 3b, 3c, 3d, 3e) may be arranged sequentially on the same layer. The four upper first extension wires (1a, 1b, 1c, 1d) may be arranged sequentially on the same layer.

[0364] In one embodiment, the digitizer (DGT) may include a first base layer (BG1), a second base layer (BG2), a first cover layer (IL1), and a second cover layer (IL2). The upper third connection wires (3a, 3b, 3c, 3d, 3e) may all be disposed on the upper surface (BG2-U) of the second base layer (BG2), and the upper first extension wires (1a, 1b, 1c, 1d) may all be disposed on the upper surface (BG1-U) of the first base layer (BG1). In one embodiment, all four upper first extension wires (1a, 1b, 1c, 1d) may be disposed within the outer portion (OM).

[0365]

[0366] Referring to FIGS. 13A and 13C, the upper third connection wires (3a, 3b, 3c, 3d, 3e) may include some arranged in different layers. In one embodiment, the digitizer (DGT) may include a first base layer (BG1), a second base layer (BG2), a first cover layer (IL1), and a second cover layer (IL2). One upper third connection wire (3e) among the upper third connection wires (3a, 3b, 3c, 3d, 3e) may be arranged in the uppermost layer, and four upper third connection wires (3a, 3b, 3c, 3d) may be arranged below it.

[0367] The upper third connecting wire (3e) arranged on the top layer may be arranged on the same layer as the upper first extension wires (1a, 1b, 1c, 1d) and may be arranged on the upper surface (BG1-U) of the first base layer (BG1). The remaining upper third connecting wires (3a, 3b, 3c, 3d) may be arranged on the upper surface (BG2-U) of the second base layer (BG2).

[0368] In one embodiment, all five upper third connection wires (3a, 3b, 3c, 3d, 3e) may be positioned within the outer portion (OM). The upper third connection wire (3e) positioned on the uppermost layer may overlap any one of the remaining upper third connection wires (3a, 3b, 3c, 3d).

[0369] Among the four upper first extension wires (1a, 1b, 1c, 1d), three upper first extension wires (1a, 1b, 1c) may be arranged in the outer portion (OM), and one upper first extension wire (1d) may be arranged in the inner portion (IN). The upper first extension wires (1a, 1b, 1c) arranged in the outer portion (OM) may overlap the upper third connection wires (3a, 3b, 3c, 3d) arranged below. However, the embodiment is not limited thereto, and all four upper first extension wires (1a, 1b, 1c, 1d) may be arranged in the outer portion (OM), and the upper third connection wire (3e) arranged in the uppermost layer may be arranged in the inner portion (IN).

[0370] Meanwhile, the number of third connection wires (3e) arranged on the top layer is not limited to any one embodiment.

[0371]

[0372] [Revised 26.02.2025 under Rule 91] Referring to FIG. 13a, the upper third connecting wires (3a, 3b, 3c, 3d, 3e) may include some arranged on different layers. In one embodiment, the digitizer (DGT) may include a first base layer (BG1), a second base layer (BG2), a third base layer (BG3), a first cover layer (IL1), and a second cover layer (IL2).

[0373] Among the upper third connection wires (3a, 3b, 3c, 3d, 3e), one upper third connection wire (3e) may be arranged on the lowest layer, and four upper third connection wires (3a, 3b, 3c, 3d) may be arranged thereon. The upper third connection wire (3e) arranged on the lowest layer may be arranged on the lower surface (BG3-B) of the third base layer (BG3), and the remaining upper third connection wires (3a, 3b, 3c, 3d) may be arranged on the upper surface (BG2-U) of the second base layer (BG2).

[0374] The upper first extension wires (1a, 1b, 1c, 1d) may be arranged on the upper third connection wires (3a, 3b, 3c, 3d, 3e). All of the upper first extension wires (1a, 1b, 1c, 1d) may be arranged on the upper surface (BG1-U) of the first base layer (BG1).

[0375] All four upper first extension wires (1a, 1b, 1c, 1d) and five upper third connection wires (3a, 3b, 3c, 3d, 3e) can be arranged within the outer portion (OM). The upper third connection wire (3e) arranged in the lowest layer can overlap any one of the remaining upper third connection wires (3a, 3b, 3c, 3d). The upper first extension wires (1a, 1b, 1c, 1d) can overlap the upper third connection wires (3a, 3b, 3c, 3d).

[0376] Meanwhile, the number of third connection wires (3e) arranged on the lowest layer is not limited to any one embodiment.

[0377] Although not shown, according to one embodiment of the present invention, some of the upper first extension wires (1a, 1b, 1c, 1d) may be disposed on the lower surface (BG3-B) of the third base layer (BG3), and some of the upper third connection wires (3a, 3b, 3c, 3d, 3e) may be disposed on the upper surface (BG1-U) of the first base layer (BG1).

[0378]

[0379] [Revised 26.02.2025 under Rule 91] Fig. 14a is an enlarged plan view of a portion of a digitizer (DGT) according to an embodiment of the present invention. Fig. 14b is an enlarged cross-sectional view of a portion of a digitizer (DGT) according to an embodiment of the present invention. The same / similar reference numerals are used for the same / similar components as those described in Figs. 5a to 9 and 12a to 13c, and duplicate descriptions are omitted.

[0380] Referring to FIGS. 14A and 14B, the common lines (CML) may include a first common line (CML1) and a second common line (CML2). According to the present embodiment, the first common line (CML1) may extend from the first non-folding portion (NFP1) on the upper side across the folding portion (FP) to the second non-folding portion (NFP2). The second common line (CML2) may extend from the first non-folding portion (NFP1) on the lower side across the folding portion (FP) to the second non-folding portion (NFP2).

[0381] In this embodiment, each of the first and second common wires (CML1, CML2) can be shared with one first sensing coil (RF) as well as two folding coils (F1, F2, F3).

[0382] The first common wiring (CML1) can provide a portion of each of the first first sensing coil (R1), the first folding coil (F1), and the second folding coil (F2).

[0383] The first common wiring (CML1) may provide the first-second extension wiring (2eR1) of the first first detection coil (R1), the third-second connection wiring (2cF1) of the first folding coil (F1), and the third-first connection wiring (1cF2) of the second folding coil (F2) together. That is, the first-second extension wiring (2eR1) of the first first detection coil (R1), the third-second connection wiring (2cF1) of the first folding coil (F1), and the third-first connection wiring (1cF2) of the second folding coil (F2) may be shared as the first common wiring (CML1).

[0384] The first common wiring (CML1) may extend parallel to the first-first extension wiring (1eR1) of the first first sensing coil (R1). Like the first extension wirings (EL1) illustrated in FIG. 6a, the first common wiring (CML1) may also extend to the left inactive area (NAA, see FIG. 6a), the active area (AA, see FIG. 6a), and the right inactive area (NAA, see FIG. 6a).

[0385] The second common wiring (CML2) may provide a portion of each of the n-1th first sensing coil (Rn-1), the second folding coil (F2), and the third folding coil (F3).

[0386] The second common wiring (CML2) may provide the 1-3 extension wiring (3eRn-1) of the n-1th first detection coil (Rn-1), the 3-4th connection wiring (4cF2) of the second folding coil (F2), and the 3-3rd connection wiring (3cF3) of the third folding coil (F3) together. That is, the 1-3 extension wiring (3eRn-1) of the n-1th first detection coil (Rn-1), the 3-4th connection wiring (4cF2) of the second folding coil (F2), and the 3-3rd connection wiring (3cF3) of the third folding coil (F3) may be shared as the second common wiring (CML2).

[0387] The second common wiring (CML2) may extend parallel to the 1-4th extension wiring (4eRn-1) of the n-1th first sensing coil (Rn-1). Like the first extension wirings (EL1) illustrated in Fig. 6a, the second common wiring (CML2) may also extend to the left inactive area (NAA, see Fig. 6a), the active area (AA, see Fig. 6a), and the right inactive area (NAA, see Fig. 6a).

[0388] In this embodiment, only one of the first first detection coil (R1), the first folding coil (F1), and the second folding coil (F2) can be driven to detect an external input. For example, when the first first detection coil (R1) is driven to detect an external input, the first and second folding coils (F1, F2) can be driven to float.

[0389] Additionally, only one of the (n-1)th first detection coil (Rn-1), the second folding coil (F2), and the third folding coil (F3) can be driven to detect an external input. For example, when the (n-1)th first detection coil (Rn-1) is driven to detect an external input, the second and third folding coils (F2, F3) can be driven to float.

[0390] In this embodiment, four third connection wires (CL3), three first extension wires (EL1, see FIG. 6a), and one common wire (CML) may be arranged on each of the upper and lower portions of the digitizer (DGT), and the common wire (CML) may be shared by two third connection wires (CL3) and one first extension wire (EL1, see FIG. 6a).

[0391] FIG. 14b illustrates a cross-section of four third connection wires (CL3) (hereinafter, upper third connection wires (3a, 3b, 3c, 3d)), three first extension wires (EL1) (hereinafter, upper first extension wires (1a, 1b, 1c)), and one upper common wire (CML) arranged on the upper portion of the digitizer (DGT).

[0392] The four upper third connection wires (3a, 3b, 3c, 3d) may correspond to the third-first connection wire (1cF1) of the first folding coil (F1), the third-second connection wire (2cF2) of the second folding coil (F2), and the third-first and third-second connection wires (1cF3, 2cF3) of the third folding coil (F3). The three upper first extension wires (1a, 1b, 1c) may correspond to the first-first extension wire (1eR1) of the first first detection coil (R1), and the first-first and first-second extension wires (1eR2, 2eR2) of the second first detection coil (R2). One upper common wire (CML1) may correspond to the first common wire (CML1).

[0393] In one embodiment, the digitizer (DGT) may include a first base layer (BG1), a second base layer (BG2), a first cover layer (IL1), and a second cover layer (IL2). The upper third connection wires (3a, 3b, 3c, 3d) and the upper common wire (CML1) may be disposed on the upper surface (BG2-U) of the second base layer (BG2), and the upper first connection wires (1a, 1b, 1c) may be disposed on the upper surface (BG1-U) of the first base layer (BG1).

[0394] Three wires are shared through the upper common wire (CML1), so that the four long sides of the two first sensing coils (RF) that pass through the upper part of the folding part (FP) and the six short sides of the three second sensing coils (CF) that pass through the upper part of the folding part (FP) can be provided as eight wires. The eight wires can be provided in a two-layer structure and can all be arranged in the outer part (OM).

[0395]

[0396] Fig. 15 is an enlarged plan view of a portion of a digitizer (DGT) according to one embodiment of the present invention. The same / similar reference numerals are used for configurations identical / similar to those described in Figs. 5a to 9 and Figs. 12a to 14b, and duplicate descriptions are omitted.

[0397] Referring to FIG. 15, in the present embodiment, the third extension wires (1eF3, 2eF3, 3eF1, 4eF1) passing through the folding portion (FP) may be arranged on a different layer from the third connection wires (CL3), and the third extension wires (1eF3, 2eF3, 3eF1, 4eF1) arranged in the folding portion (FP) and the third connection wires (1cF1, 2cF1, 1cF3, 2cF3, 3cF1, 4cF1, 3cF3, 4cF3) connected thereto may be connected through a contact hole (CH') penetrating at least one base layer. According to the present embodiment, the contact hole (CH') may be defined in the first non-folding portion (NFP1) or the second non-folding portion (NFP2) spaced apart from the folding portion (FP).

[0398] Each of the third extension wires (1eF3, 2eF3, 3eF1, 4eF1) passing through the folding portion (FP) may include an extension portion (EP) and a connection portion (CP). The extension portion (EP) is a portion extending along the first direction (DR1) within the folding portion (FP). The connection portion (CP) is a portion connecting the third connection wires (1cF1, 2cF1, 1cF3, 2cF3, 3cF1, 4cF1, 3cF3, 4cF3) corresponding to an end of the extension portion (EP). The connection portion (CP) may extend from the folding portion (FP) to a contact hole (CH') defined within the first non-folding portion (NFP1) or may extend from the folding portion (FP) to a contact hole (CH') defined within the second non-folding portion (NFP2).

[0399] According to the present embodiment, the number of contact holes (CH') arranged in the folding portion (FP) can be reduced, or the contact holes (CH') can be not arranged in the folding portion (FP). Accordingly, damage to the contact holes (CH') due to the folding operation can be prevented, and connection failure of the wires connected through the contact holes (CH') can be prevented. In addition, the wires can be provided thickly near the contact holes (CH') to fill the inside of the contact holes (CH'), thereby reducing or preventing deterioration of the folding characteristics of the digitizer (DGT).

[0400]

[0401] Fig. 16 is an enlarged plan view of a portion of a digitizer (DGT) according to an embodiment of the present invention. Fig. 17a is an enlarged cross-sectional view of a portion of a digitizer (DGT) according to an embodiment of the present invention. Figs. 17b to 17d are enlarged plan views of a portion of a digitizer (DGT) according to an embodiment of the present invention. Figs. 16 to 17d illustrate enlarged views of wires arranged in an upper outer portion (hereinafter, referred to as an upper outer portion (OMu)). The description of Figs. 16 to 17d can be similarly applied to wires arranged in a lower outer portion (OM, see Fig. 11). The same / similar reference numerals are used for configurations identical / similar to those described in Figs. 5a to 15, and duplicate descriptions are omitted.

[0402] Referring to FIG. 16, in the present embodiment, some of the first to third folding coils (F1, F2, F3), some of the first first detection coil (R1), and some of the second first detection coil (R2) described above in FIG. 15 may be disposed in the upper outer portion (OMu). In addition, some of the folding coils disposed on the left side (hereinafter, referred to as the left folding coil (F0)) and some of the folding coils disposed on the right side (hereinafter, referred to as the right folding coil (F4)) compared to the first to third folding coils (F1, F2, F3) may also be disposed in the upper outer portion (OMu). That is, some of the five folding coils (F0 to F5) and some of the two first detection coils (R1, R2) may be disposed in the upper outer portion (OMu).

[0403] Referring to FIG. 17A, in the present embodiment, the digitizer (DGT) may include a first base layer (BG1), a second base layer (BG2), a first cover layer (IL1), and a second cover layer (IL2). The wires arranged on the upper surface (BG1-U) of the first base layer (BG1) and covered by the first cover layer (IL1) may constitute a first conductive layer (CDL1). The wires arranged on the upper surface (BG2-U) of the second base layer (BG2) and covered by the first base layer (BG1) may constitute a second conductive layer (CDL2). The wires arranged on the lower surface (BG2-B) of the second base layer (BG2) and covered by the second cover layer (IL2) may constitute a third conductive layer (CDL3). According to the present embodiment, the conductive layers may be arranged in a three-layer structure in the upper outer portion (OMu).

[0404] Fig. 17b illustrates a plane at the upper outer portion (OMu) of the first conductive layer (CDL1), Fig. 17c illustrates a plane at the upper outer portion (OMu) of the second conductive layer (CDL2), and Fig. 17d illustrates a plane at the upper outer portion (OMu) of the third conductive layer (CDL3).

[0405] Referring to FIGS. 17b to 17d, the outer portion (OM) may include a first section (S1) and a second section (S2). The first section (S1) may be arranged closer to the edge of the folding portion (FP) than the second section (S2). The first section (S1) is a portion where the 3-2 holes (HL-C) are arranged, and the wires arranged in the first section (S1) may extend along the 3-2 holes (HL-C). The second section (S2) is a portion where the 3-1 holes (HL-M) are arranged, and the wires arranged in the second section (S2) may extend along the 3-1 holes (HL-M). In one embodiment, the width of each of the first section (S1) and the second section (S2) in the first direction (DR1) may be 2 millimeters (mm) or less.

[0406] Referring to FIGS. 16, 17a, and 17b, the first-first extension wire (1eR1) of the first first detection coil (R1), the first-first and first-second extension wires (1eR2, 2eR2) of the second first detection coil (R2), and the third-second connection wire (2cF2) of the second folding coil (F2) may be included in the first conductive layer (CDL1).

[0407] In one embodiment, the first-first extension wire (1eR1) of the first first detection coil (R1) and the first-first extension wire (1eR2) of the second first detection coil (R2) may cross the first section (S1), and the first-second extension wire (2eR2) of the second first detection coil (R2) and the third-second connection wire (2cF2) of the second folding coil (F2) may cross the second section (S2).

[0408] Referring to FIGS. 16, 17a, and 17c, the third-first and third-second connection wires (1cF3, 2cF3) of the third folding coil (F3), the first common wire (CML1), and the third-second connection wire (2cF1) of the first folding coil (F1) may be included in the second conductive layer (CDL2). In the present embodiment, the first common wire (CML1) may be shared by the first-second extension wire (2eR1) of the first first sensing coil (R1), the third-first connection wire (1cF1) of the first folding coil (F1), and the third-first connection wire (1cF2) of the second folding coil (F2).

[0409] In one embodiment, the third-first connection wire (1cF3) and the first common wire (CML1) of the third folding coil (F3) may cross the first section (S1), and the third-second connection wire (2cF1) of the first folding coil (F1) and the third-second connection wire (2cF3) of the third folding coil (F3) may cross the second section (S2).

[0410] Referring to FIGS. 16, 17a, and 17d, the 3-3rd and 3-4th extension wires (3eF1, 4eF1) of the first folding coil (F1) and the 3-1st and 3-2nd extension wires (1eF3, 2eF3) of the third folding coil (F3) may be included in the third conductive layer (CDL3).

[0411] As illustrated in FIG. 16, the 3-2 extension wire (3eF1) of the first folding coil (F1) can be connected to the first common wire (CML1) through a contact hole (CH') in the second non-folding portion (NFP2). The 3-4 extension wire (4eF1) of the first folding coil (F1) can be connected to the 3-2 connection wire (2cF1) through a contact hole (CH') in the second non-folding portion (NFP2). The 3-1 extension wire (1eF3) of the third folding coil (F3) can be connected to the 3-2 connection wire (2cF3) through a contact hole (CH') in the first non-folding portion (NFP1). The third-2 extension wire (2eF3) of the third folding coil (F3) can be connected to the third-1 connection wire (1cF3) through the contact hole (CH') in the first non-folding portion (NFP1).

[0412] As illustrated in FIGS. 16 and 17d, the connection portion (CP) of each of the 3-3rd and 3-4th extension wires (3eF1, 4eF1) of the first folding coil (F1) extends from the first non-folding portion (NFP1) into the first section (S1) of the folding portion (FP), and the extension portion (EP) can extend along the first direction (DR1) within the folding portion (FP). The connection portion (CP) of each of the 3-1st and 3-2nd extension wires (1eF3, 2eF3) of the third folding coil (F3) extends from the second non-folding portion (NFP2) into the first section (S1) of the folding portion (FP), and the extension portion (EP) can extend along the first direction (DR1) within the folding portion (FP).

[0413] A portion of the left folding coil (F0) and a portion of the right folding coil (F4) may be included in the third conductive layer (CDL3). More specifically, among the third connection wires (EL3, see FIG. 7a) and the third extension wires (EL3, see FIG. 7a) of the left folding coil (F0), the third extension wires (EL3, see FIG. 7a) arranged in the folding portion (FP) may be included in the third conductive layer (CDL3).

[0414] The third-first and third-second connection wires (1cF0, 2cF0) of the left folding coil (F0) can extend from the first non-folding portion (NFP1) to the folding portion (FP), and the third-third and third-fourth extension wires (3eF0, 4eF0) of the left folding coil (F0) can extend from the third-first and third-second connection wires (1cF0, 2cF0) along the first direction (DR1). The third-first connection wire (1cF0) of the left folding coil (F0) can pass through the first section (S1), and the third-second connection wire (2cF0) of the left folding coil (F0) can pass through the second section (S2).

[0415] The third-first and third-second connection wires (1cF4, 2cF4) of the right folding coil (F4) can extend from the second non-folding portion (NFP2) to the folding portion (FP), and the third-first and third-second extension wires (1eF4, 2eF4) of the right folding coil (F4) can extend from the third-first and third-second connection wires (1cF4, 2cF4) along the first direction (DR1). The third-first connection wire (1cF4) of the right folding coil (F4) can pass through the first section (S1), and the third-second connection wire (2cF4) of the right folding coil (F4) can pass through the second section (S2).

[0416] According to the present embodiment, three wires are shared through the first common wire (CML1), and four long sides of the two first sensing coils (RF) passing through the upper part of the folding part (FP), eight short sides of the five second sensing coils (CF) passing through the upper part of the folding part (FP), and eight long sides passing through the folding part can be provided as twelve wires. The twelve wires can be provided in a three-layer structure and can all be arranged in the upper outer part (OMu).

[0417]

[0418] Fig. 18 is an enlarged plan view of a portion of a digitizer (DGT') according to a comparative example. Fig. 19a is an enlarged cross-sectional view of a portion of a digitizer (DGT') according to a comparative example. Figs. 19b to 19e are enlarged plan views of a portion of a digitizer (DGT') according to a comparative example. Figs. 18 to 19e illustrate enlarged views of wires arranged in an upper outer portion (hereinafter, upper outer portion (OMu)). The description of Figs. 18 to 19e can be similarly applied to wires arranged in a lower outer portion (OM, see Fig. 11).

[0419] Referring to FIG. 18, in a comparative embodiment, some of the five folding coils (F0' to F4') and some of the two sensing coils (R1', R2') may be arranged on the upper outer portion (OMu) as in the embodiment described above in FIG. 16.

[0420] Referring to FIG. 19A, in a comparative embodiment, a digitizer (DGT') may include a first base layer (BG1), a second base layer (BG2), a third base layer (BG3), a first cover layer (IL1), and a second cover layer (IL2). Wires disposed on an upper surface (BG1-U) of the first base layer (BG1) and covered by the first cover layer (IL1) may constitute a first conductive layer (CDL1'). Wires disposed on an upper surface (BG2-U) of the second base layer (BG2) and covered by the first base layer (BG1) may constitute a second conductive layer (CDL2'). Wires disposed on a lower surface (BG2-B) of the second base layer (BG2) and covered by the third base layer (BG3) may constitute a third conductive layer (CDL3'). The wires arranged on the lower surface (BG3-B) of the third base layer (BG3) and covered by the second cover layer (IL2) can form a fourth conductive layer (CDL4'). According to a comparative example, the conductive layers in the upper outer portion (OMu) can be arranged in a four-layer structure.

[0421] FIG. 19b illustrates a plane at the upper outer portion (OMu) of the first conductive layer (CDL1'), FIG. 19c illustrates a plane at the upper outer portion (OMu) of the second conductive layer (CDL2'), FIG. 19d illustrates a plane at the upper outer portion (OMu) of the third conductive layer (CDL3'), and FIG. 19e illustrates a plane at the upper outer portion (OMu) of the fourth conductive layer (CDL4').

[0422] Referring to FIGS. 18 to 19e, in a comparative embodiment, a portion of the first first detection coil (R1') and a portion of the second folding coil (F2') may be included in a first conductive layer (CDL1'), and a portion of the first folding coil (F1') and a portion of the left folding coil (F0') may be included in a second conductive layer (CDL2'). A portion of the third folding coil (F3') and a portion of the right folding coil (F4') may be included in a third conductive layer (CDL3'), and a portion of the second first detection coil (R2') may be included in a fourth conductive layer (CDL4').

[0423] Referring to FIGS. 18, 19a, and 19b, the first-first and first-second extension wires (1eR1', 2eR2') of the first first sensing coil (R1') can cross the first section (S1), and the third-first and third-second connection wires (1cF2', 2cF2') of the second folding coil (F2') can cross the second section (S2).

[0424] Referring to FIGS. 18, 19a, and 19c, the third-first and third-second connection wires (1cF1', 2cF1') of the first folding coil (F1) can extend from the first non-folding portion (NFP1) to the folding portion (FP), and the third-third and third-fourth extension wires (3eF1', 4eF1') of the first folding coil (F1) can extend from the third-first and third-second connection wires (1cF1', 2cF1') along the first direction (DR1). The third-first and third-second connection wires (1cF1', 2cF1') of the first folding coil (F1') can pass through the first section (S1).

[0425] The third-first and third-second connection wires (1cF0', 2cF0') of the left folding coil (F0') can extend from the first non-folding portion (NFP1) to the folding portion (FP), and the third-third and third-fourth extension wires (3eF0', 4eF0') of the left folding coil (F0') can extend from the third-first and third-second connection wires (1cF0', 2cF0') along the first direction (DR1). The third-first and third-second connection wires (1cF0', 2cF0') of the left folding coil (F0') can pass through the second section (S2).

[0426] Referring to FIGS. 18, 19a, and 19d, the third-first and third-second connection wires (1cF3', 2cF3') of the third folding coil (F3') can extend from the second non-folding portion (NFP2) to the folding portion (FP), and the third-first and third-second extension wires (1eF3', 2eF3') of the third folding coil (F3') can extend from the third-first and third-second connection wires (1cF3', 2cF3') along the first direction (DR1). The third-first and third-second connection wires (1cF3', 2cF3') of the third folding coil (F3') can pass through the first section (S1).

[0427] The third-first and third-second connection wires (1cF4', 2cF4') of the right folding coil (F4') can extend from the second non-folding portion (NFP2) to the folding portion (FP), and the third-first and third-second extension wires (1eF4', 2eF4') of the right folding coil (F4') can extend from the third-first and third-second connection wires (1cF4', 2cF4') along the first direction (DR1). The third-first and third-second connection wires (1cF4', 2cF4') of the right folding coil (F4') can pass through the second section (S2).

[0428] Referring to FIGS. 18, 19a, and 19e, the first-first extension wire (1eR2') of the second first detection coil (R2') can cross the first section (S1). The first-second extension wire (2eR2') of the second first detection coil (R2') can cross the second section (S2).

[0429] According to a comparative example, the four long sides of the two first sensing coils (RF') that pass through the upper part of the folding part (FP), the eight short sides of the five second sensing coils (CF') that pass through the upper part of the folding part (FP) and the eight long sides that pass through the folding part (FP) can be provided with 14 wires. The 14 wires must have a four-layer structure in order to pass through the upper outer part (OMu). On the other hand, according to the embodiment of the present invention described above with reference to FIGS. 16 to 17d, since the same number of long sides / short sides can be provided with a smaller number of wires, a three-layer structure can be provided. Accordingly, according to the embodiment of the present invention, even without including a bypass wire due to space constraints, the wiring density in the thickness direction can be reduced, thereby providing a digitizer (DGT, see FIG. 16) with improved sensing performance and improved folding characteristics.

[0430]

[0431] FIGS. 20 to 23 are enlarged plan views of a portion of a digitizer (DGT) according to one embodiment of the present invention. The same / similar reference numerals are used for configurations identical / similar to those described in FIGS. 5a to 17d, and duplicate descriptions are omitted.

[0432] Referring to FIG. 20, in the present embodiment, some of the first sensing coils (RF) may be arranged on each of the upper outer portion (OMu) and the lower outer portion (OMb) of the digitizer (DGT). Some of the first and second first sensing coils (R1, R2) may be arranged on the upper outer portion (OMu), and some of the (n-1)th and nth first sensing coils (Rn-1, Rn) may be arranged on the lower outer portion (OMb).

[0433] The common lines (CML) may include a first common line (CML1) and a second common line (CML2). Each of the first and second common lines (CML1, CML2) may extend to a left inactive area (NAA, see FIG. 6A), an active area (AA, see FIG. 6A), and a right inactive area (NAA, see FIG. 6A). The first common line (CML1) may extend across the upper outer portion (OMu). The second common line (CML2) may extend across the lower outer portion (OMb).

[0434] In this embodiment, each of the first and second common wires (CML1, CML2) can be shared by two first sensing coils (RF).

[0435] The first common wiring (CML1) may provide a portion of each of the first first detection coil (R1) and the second first detection coil (R2). The first common wiring (CML1) may be shared by the first-second extension wiring (2eR1) of the first first detection coil (R1) and the first-second extension wiring (2eR2) of the second first detection coil (R2).

[0436] The second common wiring (CML2) may provide a portion of each of the n-1th first detection coil (Rn-1) and the nth first detection coil (Rn). The second common wiring (CML2) may be shared by the 1-1st extension wiring (1eRn-1) of the n-1th first detection coil (Rn-1) and the 1-1st extension wiring (1eRn) of the nth first detection coil (Rn).

[0437] Meanwhile, although FIG. 20 illustrates an example in which one common wire is arranged in each of the upper outer portion (OMu) and the lower outer portion (OMb), the present invention is not limited thereto. A plurality of common wires may be arranged in each of the upper outer portion (OMu) and the lower outer portion (OMb).

[0438]

[0439] Referring to FIG. 21, in the present embodiment, a portion of the first sensing coils (RF) and a portion of the folding coil (FC) may be disposed on each of the upper outer portion (OMu) and the lower outer portion (OMb) of the digitizer (DGT). A portion of the first and second first sensing coils (R1, R2) and a portion of the folding coil (FC) may be disposed on the upper outer portion (OMu), and a portion of the n-1th and n-th first sensing coils (Rn-1, Rn) and a portion of the folding coil (FC) may be disposed on the lower outer portion (OMb). The folding coil (FC) may include 3-1 to 3-4th extension wires (1eF, 2eF, 3eF, 4eF) and 3-1 to 3-4th connection wires (1cF, 2cF, 3cF, 4cF).

[0440] The common lines (CML) may include a first common line (CML1) and a second common line (CML2). The first common line (CML1) may extend across the upper outer portion (OMu). The second common line (CML2) may extend across the lower outer portion (OMb). In the present embodiment, each of the first and second common lines (CML1, CML2) may be shared by two first sensing coils (RF) and one folding coil (FC).

[0441] The first common wiring (CML1) may provide a portion of each of the first first detection coil (R1), the second first detection coil (R2), and the folding coil (FC). The first common wiring (CML1) may be shared by the first-second extension wiring (2eR1) of the first first detection coil (R1), the first-second extension wiring (2eR2) of the second first detection coil (R2), and the third-second connection wiring (2cF) of the folding coil (FC).

[0442] The second common wiring (CML2) may provide a portion of each of the n-1th first detection coil (Rn-1), the nth first detection coil (Rn), and the folding coil (FC). The second common wiring (CML2) may be shared by the 1-1st extension wiring (1eRn-1) of the n-1th first detection coil (Rn-1), the 1-1st extension wiring (1eRn) of the nth first detection coil (Rn), and the 3-3rd connection wiring (3cF) of the folding coil (FC).

[0443]

[0444] Fig. 22 is an enlarged view of some of the wires passing through the inner side (IN). Fig. 22 illustrates the ith first detection coil (Ra) and the jth first detection coil (Rb) as examples. (i and j are different natural numbers.)

[0445] Referring to FIG. 22, the i-th first detection coil (Ra) and the j-th first detection coil (Rb) may cross the inner side (IN). The i-th and j-th first detection coils (Ra, Rb) may be first detection coils arranged adjacent to each other (for example, the j-th detection wire corresponds to the i+1-th first detection coil), but are not limited thereto.

[0446] In the present embodiment, at least a portion of the common wiring (CML) may be disposed in the inner side (IN). In one embodiment, the common wiring (CML) may cross the inner side (IN). The common wiring (CML) may extend parallel to an adjacent first extension wiring (EL1, see FIG. 6A). The common wiring (CML) may extend to a left non-active area (NAA, see FIG. 6A), an active area (AA, see FIG. 6A), and a right non-active area (NAA, see FIG. 6A).

[0447] The common wiring (CML) may be shared by two first detection coils (Ra, Rb). FIG. 22 illustrates sharing between the 1-1 extension wiring (1eRa) of the i-th first detection coil (Ra) and the 1-1 extension wiring (1eRb) of the j-th first detection coil (Rb). However, the present invention is not limited thereto, and the common wiring (CML) may be shared by any one of the 1-2 to 1-4 extension wirings (12e, 13e, 14e, see FIG. 6b) of the i-th first detection coil (Ra), or may be shared by any one of the 1-2 to 1-4 extension wirings (12e, 13e, 14e, see FIG. 6b) of the j-th first detection coil (Rb). In one embodiment, the ith first sensing coil (Ra) may further include a first second extension line (2eRa), and the jth first sensing coil (Rb) may further include a first second extension line (2eRb).

[0448] Meanwhile, FIG. 22 illustrates one common wire arranged in the inner part (IN), but multiple common wires may be arranged in the inner part (IN).

[0449]

[0450] Fig. 23 is an enlarged view of some of the wires passing through the inner side (IN). Fig. 23 exemplarily illustrates the i-th and j-th first sensing coils (Ra, Rb) and a pair of first bridge wires (B1, B2).

[0451] Referring to Fig. 23, in the present embodiment, a common wiring (CML) may cross the inner side (IN). The common wiring (CML) may be shared by two first sensing coils (RF) and one first bridge wiring (B1). The first-first extension wiring (1eRa) of the i-th first sensing coil (Ra), the first-first extension wiring (1eRb) of the j-th first sensing coil, and the first bridge pattern portion (BPP1) among the first bridge wiring (B1) may be shared as the common wiring (CML). Fig. 23 illustrates examples of the types of shared first extension wirings (EL1, see Fig. 6b), but is not limited thereto.

[0452] Meanwhile, the embodiment is not limited thereto, and the common wiring (CML) may be shared by the first sensing coils (RF) and the second bridge wiring (BL2, see FIG. 7a).

[0453] The embodiments illustrated in FIGS. 12A to 23 are merely illustrative, and the types of wires within the digitizer (DGT) shared by the common wiring (CML) are not limited to any one embodiment. Some of the wires that extend and bend along the edges of the holes (HL, see FIG. 7A) within the folding portion (FP) may be shared by the common wiring (CML). This reduces the density of the wires within the folding portion (FP), and reduces the number of wires provided in a bypass manner. Accordingly, the detection performance within the folding portion (FP) can be improved.

[0454] Meanwhile, adding a conductive layer may not provide a bypass type of wiring, but may increase the thickness of the digitizer (DGT), which may reduce folding reliability, and may cause wiring to be densely packed in the thickness direction, which may reduce wiring reliability during folding operation. On the other hand, according to the present embodiment, bypass wiring can be reduced even without adding a conductive layer, thereby reducing wiring density without reducing folding reliability and wiring reliability.

[0455]

[0456] Fig. 24 is a cross-sectional view of a base layer (BG) included in a digitizer (DGT, see Fig. 5a) according to an embodiment of the present invention. Fig. 25 is a plan view of a base layer (BG) included in a digitizer (DGT, see Fig. 5a) according to an embodiment of the present invention. The description of the base layer (BG) to be described in Figs. 24 and 25 can be applied to the first to third base layers (BG1, BG2, BG3) and the first and second cover layers (IL1, IL2) described in Figs. 8a to 9.

[0457] Referring to FIGS. 24 and 25, the base layer (BG) according to the present invention may include a matrix (MT) including a filler and woven fiber lines (FL1, FL2) arranged inside the matrix (MT).

[0458] Fiber lines (FL1, FL2) may be alternately arranged along a first direction (DR1) and a second direction (DR2) to form a fabric shape on a plane. Each of the fiber lines (FL1, FL2) may be provided in the form of a bundle of multiple fibers (GL). The diameter of a single fiber (GL) included in a single fiber line may be 3 μm or more and 10 μm or less.

[0459] Each of the fiber lines (FL1, FL2) may include a reinforced fiber composite. The reinforced fiber composite may be either carbon fiber-reinforced plastic (CFRP) or glass fiber-reinforced plastic (GFRP). The fiber lines (FL1, FL2) may be arranged within a matrix (MT). In one embodiment, the matrix (MT) may include at least one of epoxy, polyester, polyamide, polycarbonate, polypropylene, polybutylene, and vinyl ester.

[0460] The matrix (MT) may include a filler. The filler may include at least one of silica, barium sulfate, sintered talc, barium titanate, titanium oxide, clay, alumina, mica, boehmite, zinc borate, and zinc tinate.

[0461] The modulus of the base layer (BG) may have a modulus of 10 gigapascals (GPa) or more and 30 gigapascals (GPa) or less.

[0462] According to the present invention, the base layer (BG) included in the digitizer (DGT, see FIG. 5a) includes a fiber bundle of glass fiber reinforced plastic or carbon fiber reinforced plastic arranged inside the matrix (MT), thereby protecting the lower part of the electronic device (ED, see FIG. 1a) when folded.

[0463] Accordingly, the digitizer (DGT, see FIG. 5a) of the present invention can be configured to function as a protective member while also performing a pen detection function. Accordingly, a separate metal plate between the display module (DM, see FIG. 5a) and the digitizer (DGT, see FIG. 5a) can be omitted, thereby reducing costs and providing a slim electronic device (ED, see FIG. 1a).

[0464]

[0465] While the present invention has been described above with reference to preferred embodiments, it will be understood by those skilled in the art or those with ordinary knowledge in the art that various modifications and changes can be made to the present invention without departing from the spirit and technical scope of the present invention as set forth in the claims below. Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

[0466]

[0467] The present invention has high industrial applicability because it can provide an electronic device with improved folding characteristics of a digitizer and improved sensing sensitivity in a folding area.

Claims

1. A display module including an active area in which an image is provided and a peripheral area adjacent to the active area; and A digitizer including a folding part arranged below the display module and folded along a folding axis extending in a first direction, a first non-folding part and a second non-folding part spaced apart in a second direction intersecting the first direction with the folding part interposed therebetween, An electronic device wherein the digitizer comprises a plurality of sensing coils, different sensing coils among the plurality of sensing coils are shared through a common wiring, and the common wiring is disposed at least within the folding portion.

2. In paragraph 1, An electronic device in which the above common wiring extends along the second direction.

3. In paragraph 1, An electronic device in which, when any one of the different sensing coils shared through the common wiring is sensed and driven, the rest of the different sensing coils shared through the common wiring are float driven.

4. In paragraph 1, The above plurality of sensing coils, First sensing coils arranged along the first direction and each extending along the second direction; and The second sensing coils are arranged along the second direction, each of which extends along the first direction, and include non-folding coils disposed within the first non-folding portion or the second non-folding portion, and folding coils at least some of which are disposed within the folding portion. An electronic device wherein the first sensing coils and the second sensing coils are insulated from each other and each forms an open loop.

5. In paragraph 4, The above common wiring is an electronic device shared by two folding coils.

6. In paragraph 4, The above common wiring is an electronic device shared by two folding coils and one first sensing coil.

7. In paragraph 4, The above common wiring is an electronic device shared by two first sensing coils.

8. In paragraph 4, The above common wiring is an electronic device shared by one folding coil and two first sensing coils.

9. In paragraph 4, Each of the first sensing coils includes first extension wires extending along the second direction and first connecting wires connected to the first extension wires and extending along the first direction, An electronic device in which each of the first extension wires extends from the first non-folding portion through the folding portion to the second non-folding portion.

10. In paragraph 9, Each of the above non-folding coils includes second extension wires extending along the first direction and second connecting wires connected to the second extension wires and extending along the second direction, An electronic device wherein each of the folding coils includes third extension wires extending along the first direction and third connection wires connected to the third extension wires and extending along the second direction, and each of the third connection wires is arranged at least in the folding portion.

11. In Article 10, The above folding coils include a first folding coil, a second folding coil, and a third folding coil, and the common wiring is provided in multiple pieces, so that the multiple common wirings include a first common wiring and a second common wiring, The above first common wiring is shared by one third connection wiring of the first folding coil and one third connection wiring of the second folding coil, An electronic device in which the second common wiring is shared by one other third connecting wiring of the second folding coil and one third connecting wiring of the third folding coil.

12. In paragraph 11, An electronic device in which the digitizer includes a base layer, and third extension wires arranged in the folding portion are connected to corresponding third connection wires through contact holes penetrating the base layer.

13. In paragraph 12, The above contact holes are defined within the folding portion, An electronic device in which the third extension wires arranged in the folding portion extend along the first direction within the folding portion.

14. In paragraph 12, The above contact holes are defined within the first non-folding portion or the second non-folding portion, An electronic device in which each of the third extension wires arranged in the folding portion includes an extension portion extending along the first direction within the folding portion and a connecting portion connecting between the extension portion and a corresponding contact hole.

15. In paragraph 12, The above folding portion includes an inner portion, an upper outer portion and a lower outer portion spaced apart in the first direction with the inner portion therebetween, and a maximum of four wires are arranged in the same layer in each of the upper outer portion and the lower outer portion. An electronic device wherein the first common wiring is disposed at least within the upper outer portion, and the second common wiring is disposed at least within the lower outer portion.

16. In paragraph 15, At least one of the two first extension wires of the first first detection coil and the two first extension wires of the second first detection coil crosses the upper outer portion, An electronic device wherein at least one of the two first extension wires of the n-1th first detection coil and the two first extension wires of the nth first detection coil crosses the lower outer portion, and n is a natural number greater than or equal to 4.

17. In paragraph 11, The above first common wiring is further shared by one first extension wiring of the first first sensing coil, An electronic device wherein the second common wiring is further shared by one first extension wiring of the n-1th first sensing coil, wherein n is a natural number greater than or equal to 4.

18. In paragraph 10, Each of the above first sensing coils and the above folding coils forms an open loop with two turns, The first extension wires of each of the first detection coils include first-1 to first-4 extension wires, and the first connection wires of each of the first detection coils include first-1 to first-4 connection wires. An electronic device wherein the third extension wires of each of the folding coils include third-1 to third-4 extension wires, and the third connection wires of each of the folding coils include third-1 to third-4 connection wires.

19. In paragraph 18, The above folding coils include a first folding coil, a second folding coil, and a third folding coil arranged along the second direction, An electronic device in which the above common wiring is shared by the 3-1 connection wiring of the first folding coil, the 3-1 connection wiring of the second folding coil, and the 1-2 extension wiring of the first first sensing coil.

20. In paragraph 19, The above digitizer, 1st base layer; A second base layer disposed below the first base layer; A first cover layer disposed on the first base layer; A second cover layer disposed under the second base layer; A first conductive layer disposed between the first base layer and the first cover layer; A second conductive layer disposed between the first base layer and the second base layer; and A third conductive layer is disposed between the second base layer and the second cover layer, An electronic device in which the above folding portion includes an inner portion and an outer portion spaced apart from the inner portion in the first direction, and in which a maximum of four wires are arranged within the same layer in the outer portion.

21. In paragraph 20, The above folding coils further include a left folding coil and a right folding coil spaced apart from each other in the second direction with the first to third folding coils interposed therebetween, The first-first extension wire of the first first detection coil, the first-first and first-second extension wires of the second first detection coil, and the third-second connection wire of the second folding coil are included in the first conductive layer and pass through the outer portion, The above common wiring, the 3-2 connection wiring of the first folding coil, and the 3-1 and 3-2 connection wirings of the third folding coil are included in the second conductive layer and pass through the outer portion, An electronic device in which the 3-3rd and 3-4th extension wires of the first folding coil, the 3-1st and 3-2nd extension wires of the third folding coil, the 3-1st and 3-2nd connection wires and the 3-3rd and 3-4th extension wires of the left folding coil, and the 3-1st and 3-2nd connection wires and the 3-1st and 3-2nd extension wires of the right folding coil are included in the third conductive layer and pass through the outer portion.

22. In paragraph 9, The above folding portion includes an inner portion and an outer portion spaced apart from the inner portion in the first direction, and in the outer portion, a maximum of four wires are arranged within the same layer. The above common wiring is shared by one first extension wiring of the i-th first detection coil and one first extension wiring of the j-th first detection coil, and the common wiring passes through the inner part, An electronic device in which the above i and j are different natural numbers.

23. In paragraph 1, An electronic device wherein the digitizer further includes bridge wires passing through the folding portion, electrically connecting the second sensing coils arranged in the first non-folding portion and the connector, and wherein the common wire is further shared by at least one bridge wire.

24. In paragraph 1, The above folding portion includes an inner portion and an outer portion spaced apart from the inner portion in the first direction, and the folding portion has first holes arranged in the inner portion and at least second holes and third holes defined in the outer portion, The above first holes are, First group holes each extending along the first direction and arranged along the first direction; and The first group holes are arranged alternately with each other, shifted from the first group holes along the first direction, each of the first group holes extending along the first direction, and the second group holes are arranged along the first direction. The above second holes each extend along the first direction and are spaced apart from the first group holes in the first direction, The above third holes are, 3-1 holes, each extending along the first direction and spaced apart from the second group holes in the first direction; and An electronic device comprising 3-2 holes spaced apart from the 3-1 holes in the first direction and arranged along the second direction at an edge of the outer portion, the 3-2 holes defining an open aperture.

25. In paragraph 24, An electronic device in which a maximum of four wires are arranged between adjacent holes in the first direction among the first to third holes within the same layer, and a maximum of two wires are arranged between adjacent holes in the second direction among the first to third holes within the same layer.

26. In paragraph 24, At least one of said plurality of sensing coils comprises sensing wires extending across said folding portion and bending along the edges of said holes, The spacing between adjacent holes and sensing wires is less than 75 micrometers, The spacing between adjacent sensing wires is 20 micrometers or more and 40 micrometers or less, An electronic device wherein each of the above sensing wires has a width of 40 micrometers or more and 200 micrometers or less.

27. In paragraph 1, The above digitizer, A first base layer in which first base holes are defined; A second base layer disposed below the first base layer and having second base holes defined therein; A first cover layer disposed on the first base layer and having first cover holes defined therein; and A second cover layer is disposed below the second base layer and has second cover holes defined therein, An electronic device in which holes are defined in the folding portion of the digitizer, and each of the holes is defined such that a corresponding first base hole, a second base hole, a first cover hole, and a second cover hole are aligned with each other along the thickness direction.

28. In paragraph 27, An electronic device wherein each of the first base layer, the second base layer, the first cover layer, and the second cover layer comprises a reinforced fiber composite, and wherein the moduli of each of the first base layer, the second base layer, the first cover layer, and the second cover layer are 10 GPa or more and 30 GPa or less.

29. In paragraph 1, The above digitizer, A first base layer in which first base holes are defined; A second base layer disposed below the first base layer and having second base holes defined therein; A third base layer disposed below the second base layer and having third base holes defined therein; A first cover layer disposed on the first base layer and having first cover holes defined therein; and A second cover layer is disposed below the third base layer and has second cover holes defined therein, An electronic device in which holes are defined in the folding portion of the digitizer, and each of the holes is defined such that a corresponding first base hole, a second base hole, a third base hole, a first cover hole, and a second cover hole are aligned with each other along the thickness direction.

30. A display module including an active area in which an image is provided and a peripheral area adjacent to the active area; and A digitizer including a folding part arranged below the display module and folded along a folding axis extending in a first direction, a first non-folding part and a second non-folding part spaced apart in a second direction intersecting the first direction with the folding part interposed therebetween, The above digitizer, a plurality of sensing coils, each of which comprises a plurality of sensing wires; and A plurality of bridge wires are included to connect the plurality of sensing coils and the connector, An electronic device in which some of the plurality of sensing wires and the plurality of bridge wires passing through the folding section are shared through common wiring.

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