Scalable cryogenic system

Abstract

A scalable system of cryoplants can include multiple cryoplants that are connected in a sequence to increase cooling power while maintaining stable pressures and flows in the system. Respective cryoplants in the scalable system can provide coolant to a return path (exhaust) of a subsequent cryoplant. One cryoplant can be coupled to a cryogenic payload (e.g., computing chips) to maintain the payload at a cryogenic temperature, such as a temperature below 10 Kelvin.

Description

[0001] SCALABLE CRYOGENIC SYSTEM CLAIM OF PRIORITY

[0001] This application claims the benefit of priority to U.S. Patent Application Serial No. 63 / 608,643, filed on December 11, 2023, which is incorporated by reference herein in its entirety. TECHNICAL FIELD

[0002] Embodiments herein relate generally to cryogenic systems, such as cryogenic systems used for high performance computing implementations having a scalable architecture. BACKGROUND

[0003] A cryostat is a device that is used to maintain cryogenic temperatures (e.g., 120° Kelvin (K) or less) for objects or materials located within the cryostat, such as computing chips. Cryostats can be powered by a cryoplant that can include a cold box having heat exchangers that liquify a cryogenic coolant, such as Nitrogen or Helium. It can be difficult to implement these cryogenic systems in a scalable manner that maintains the overall system stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] The present disclosure will be understood more fully from the detailed description given below and from the accompanying drawings of various embodiments of the disclosure.

[0005] FIG. 1A shows a distributed cryoplant system, in accordance with some example embodiments.

[0006] FIG. 1B shows a heat exchanger, in accordance with some example embodiments.

[0007] FIG. 2 shows a sequential scalable cryoplant system in a refrigeration configuration, in accordance with some example embodiments.

[0008] FIG. 3 shows a sequential scalable cryoplant system in a liquification configuration, in accordance with some example embodiments.

[0009] FIG. 4 shows an example of a method for operating a scalable cryogenic system having distributed cryoplants.

[0010] Descriptions of certain details and implementations follow, including a description of the figures, which may depict some or all of the embodiments described below, as well as discussing other potential embodiments or implementations of the inventive concepts presented herein. An overview of embodiments of the disclosure is provided below, followed by a more detailed description with reference to the drawings. DETAILED DESCRIPTION

[0011] Reference will now be made in detail to specific example embodiments for carrying out the inventive subject matter. Examples of these specific embodiments are illustrated in the accompanying drawings, and specific details are set forth in the following description in order to provide a thorough understanding of the subject matter. It will be understood that these examples are not intended to limit the scope of the claims to the illustrated embodiments. On the contrary, they are intended to cover such alternatives, modifications, and equivalents as may be included within the scope of the disclosure.

[0012] The described cryogenic cooling architecture comprises multiple interconnected but pressure-isolated cooling stages. A first cryogenic system includes a cold box containing heat exchangers that cool and liquify a cryogenic coolant, such as helium gas, supplied from a main vessel. The cold box implements a series of heat exchangers and collects the cooled and liquified helium in a first collection vessel.

[0013] A second cryogenic system, which operates independently but shares the main supply vessel, receives the liquid helium from the first system via a connector channel. This second system contains its own cold box with heat exchangers that further cool the helium before collecting it in a second vessel.

[0014] The systems are pressure isolated from each other through strategic placement of valves and connection points. Only the connector channel between the first collection vessel and second cold box, along with return paths to the supply vessel, link the otherwise independent cooling loops.

[0015] This isolation enables stable pressure control while allowing additional cooling stages to be added in series.

[0016] A payload loop receives the ultra-cold liquid helium from the final cooling stage to maintain electronic components like photonic integrated circuits at cryogenic temperatures. The architecture supports both refrigeration mode, where coolant cycles at a constant cryogenic temperature (e.g., 4.5K), and liquefaction mode, where the coolant warms to room temperature to achieve even colder payload temperatures around 2K.

[0017] FIG. 1A shows a distributed cryoplant system 100, in accordance with some example embodiments. The system 100 comprises a first cryogenic system 104 (e.g., a first cryoplant) and a second cryogenic system 149 (e.g., a second cryoplant), where respective cryogenic systems can share one or more components, such as a first cryogenic supply vessel 102 (e.g., helium supply vessel) and a second cryogenic supply vessel 177 (e.g., nitrogen supply vessel). The system 100 can also comprise a payload loop 197.

[0018] In the illustrated example, the second cryogenic supply vessel 177 comprises a coolant that can have a higher cryogenic temperature than the coolant of the first cryogenic supply vessel. For example, nitrogen can be stored in the second cryogenic supply vessel 177 (e.g., for nitrogen based cooling to 77K), and can be used for exchanging heat with a first set of heat exchangers (e.g., first stage exchangers, heat exchanger 108A, heat exchanger 152A) in one or more cold boxes. In another example, helium can be stored in first cryogenic supply vessel 102 (e.g., for cooling to a range of temperatures below 77K , e.g., to 4K-2K), and the helium can undergo heat exchanging with the first set of heat exchangers (which are cooled by liquid nitrogen) and undergoes further heat exchangers (e.g., second stage heat exchangers, heat exchangers 108B-108F, heat exchangers 152B-152F).

[0019] The first cryogenic system 104 can be a closed loop from the first cryogenic supply vessel 102 through a refrigeration loop (that can include a liquification loop) that includes a return channel 116 to the first cryogenic supply vessel 102. The second cryogenic system 149 can be a closed loop from the first cryogenic supply vessel 102 through a refrigeration loop (that can include a liquification loop) that includes one or more return channels (e.g., a return channel 160, payload output channel 193) to the first cryogenic supply vessel

[0020] In the example of FIG. 1A, the first cryogenic system 104 can be configured as a refrigerator that can cool gaseous helium from a supply vessel to liquid helium temperatures. Then, the liquid helium can be supplied as a refrigerant to the second cryogenic system 149 via connector channel 171 (e.g., connector pipe).

[0021] The second cryogenic system 149 can comprise a pressure-isolated refrigerant (e.g., helium) managed in the second cryogenic system 149 (e.g., on the pressured path down to second collection vessel 158, cooling path 161).

[0022] In some examples, the first cryogenic system 104 can be coupled to the recovery path (e.g., exhaust path, low-pressure path) of the second cryogenic system 149 (e.g., connector channel 171 to return channel 160), and the payload loop 197 can receive liquid refrigerant (e.g., liquid helium) from the second cryogenic system 149. In an example with more than two cryogenic loop systems, the payload loop 197 can receive liquid refrigerant from the last cryogenic loop system, wherein respective cryogenic loop systems can be pressure-isolated from remaining cryogenic loop systems in a scalable configuration.

[0023] The second helium coolant of the second cryogenic system 149 can provide cryogenic cooling for the payload 199 through the payload loop 197. Additional cryogenic loop systems (cryoplants) can be added in series to the distributed cryoplant system 100. For example, each respective system can be used to cool the successive system. In some examples, the last cryoplant system can be connected to the payload loop 197 to cool the payload 199.

[0024] In this way, more total cooling power can be added to the distributed cryoplant system 100 (e.g., by adding additional independent cryoplants) while stable pressures can be maintained across the distributed cryoplant system 100. Maintaining stable pressures can be achieved by isolating the payload loop (e.g., payload loop 197) from the refrigerant loops of one or more of the in-series cryoplant loop systems (e.g., the first cryogenic system 104 in FIG. 1A).

[0025] As the distributed cryoplant system 100 can implement additional cryoplants, having successive cryoplants pressure-isolated and independently operable can be advantageous. For example, if one or more of the cryoplants malfunction, the affected cryoplant can be shut down (e.g., isolated via valve 172, a shut off valve) and can be accessed for maintenance without having to shut down the entire cryoplant system. For example, 30% of the cryoplants can be brought to room temperature for maintenance while the remaining 70% of the cryoplants can remain in cryogenic operation.

[0026] First cryogenic system 104 In some example embodiments, the first cryogenic system 104 includes helium gas stored in the first cryogenic supply vessel 102. In the first cryogenic system 104, the helium gas can be compressed by a compressor 109 and can be input into a cold box 106 as a first coolant.

[0027] The cold box 106 comprises an inlet 110 to receive the first coolant (e.g., helium gas at a first pressure). The first coolant can be cooled by a plurality of heat exchangers 108A-108F (e.g., by exchanging heat between the first coolant and each heat exchanger). At an outlet 112, the first coolant can comprise a liquid component and a gas component (e.g., mixture of liquid helium and gaseous helium). In some example embodiments, less than 25% of the coolant input into inlet 110 makes it to the outlet 112.

[0028] The turbine 107A and turbine 107B (e.g., compressors, expanders) can further liquify the coolant and can output the coolant in gas and liquid form using cryogenic coolant outlet 112. For example, after interfacing with exchanger 108B a portion of the coolant can be diverted to the turbine 107A while another portion of the coolant can continue to exchanger 108C. The coolant can exit the turbine 107A and can be output to the return channel 116 which provides cooling to the coolant loop (e.g., in the first cryogenic system 104). After a several additional exchangers and turbines (e.g., exchangers 108D- 108E, turbine 107B) the first coolant is sufficiently cooled and liquified to be output to the first collection vessel 114 (e.g., Dewar vessel) through outlet 112.

[0029] The gas component of the first coolant can be transferred, via return channel 116 (e.g., pipe, path, stream, exhaust path, low pressure path) to the cold box 106. The return channel 116 can be thermally coupled (e.g., lagged) to the heat exchangers 108A-108F. On the return path, additional heat can be exchanged between the gas component of the first coolant in the return channel 116 and the plurality of heat exchangers 108A-108F. As shown in FIG. 1A, the return channel 116 can be thermally lagged to respective heat exchangers. The gas component of the first coolant in the return channel 116 can be transferred to the first cryogenic supply vessel 102.

[0030] The liquid component of the first coolant can collect, via outlet 112, in the first collection vessel 114. The first collection vessel 114 can be used for further cooling (e.g., transfer to the second cryogenic system 149, a subsequent cryoplant having different operating characteristics and pressures, a different type of cryoplant having hardware from a different manufacturer).

[0031] Second cryogenic system 149 In some example embodiments, the second cryogenic system 149 can include helium gas stored in the first cryogenic supply vessel 102. In the second cryogenic system 149, the helium gas can be compressed by a compressor 115 and can be input into a second cold box 150 as a second coolant.

[0032] The second cold box 150 can comprise an inlet 154 to receive the second coolant, which can be cooled by a plurality of heat exchangers 152A-152F. At an outlet 156, the second coolant can comprise a liquid component and a gas component. Turbine 113A and turbine 113B can liquify the coolant and can output the coolant in gas form and in liquid form using outlet 156. The outlet 156 can be connected a second collection vessel 158 (e.g., Dewar, tank).

[0033] The gas component of the second coolant can be transferred, via return channel 160 (e.g., pipe, path, stream), to the second cold box 150. The return channel 160 can be thermally coupled to the plurality of heat exchangers 152A- 152F. On the return path, additional heat can be exchanged between the gas in the return channel 160 and the plurality of heat exchangers 152A-152F. As shown in FIG. 1A, the return channel 160 can be thermally lagged to respective heat exchangers. The gas component of the second coolant in the return channel 160 can be transferred to the first cryogenic supply vessel 102.

[0034] The liquid component of the coolant can collect, via outlet 156, in the second collection vessel 158 for collection and for further cooling (e.g., transfer to the payload loop 197).

[0035] Connecting the first loop and the second loop A connector channel 171 (e.g., pipe, connection channel) can transfer the liquid component of the first coolant (stored in the first collection vessel 114) to the second cryogenic system 149. In some examples, the connector channel 171 can transfer the gas component of the first coolant to the second cryogenic system 149. In some example embodiments, a valve 172 on the connector channel 171 can enable the first coolant (having a liquid component) to flow on the connector channel 171 to a next stage. In the illustrated example, the connector channel 171 transfers the first coolant from the first collection vessel 114 to the second cold box 150.

[0036] The first coolant can cool the plurality of heat exchangers 152B-152F, which can cause portions of the liquid component of the first coolant to warm into a gas component. The plurality of heat exchangers 152A-152F can exchange heat with two other channels, including coolant that can be on the way (downward direction in FIG. 1A) to the second collection vessel 158 using cooling path 161 (e.g., pipe, a cooling path isolated from the connector channel 171).

[0037] At the ^top^ of the second cold box (before passing by first heat exchanger 152A which can be nitrogen cooled), the connector channel 171 can be joined with the return channel 160. The connector channel 171 can transfer the first coolant, which can be primarily a gas component of the first coolant after exchanging heat with the plurality of heat exchangers to the return channel 160. As noted above, the return channel 160 can couple gas from the second collection vessel 158 and gasified liquid from the first collection vessel 114 (from connector channel 171) to the first cryogenic supply vessel 102. Note that, although FIG. 1A shows connector channel 171 connecting to the return channel 160, the connector channel 171 can be configured to connect to the first cryogenic supply vessel 102 without a connection to the return channel 160. That is, in some embodiments, the connector channel 171 can bypass return channel 160 and can be connected to the first cryogenic supply vessel on its own return path (e.g., after coupling to exchanger 152B, the connector channel 171 exits the second cold box, is processed by one or more additional components, such as turbines, and provided to first cryogenic supply vessel 102).

[0038] In this way, the first cryogenic system 104 can provide cooling for an additional cooling system (e.g., second cryogenic system 149), such that the additional cooling system can operate more efficiently. Specifically, the second cryogenic system 149 can reduce the flowrate of turbines 113A and 113B such that more liquid coolant can be output to the second collection vessel 158 of the second cryogenic system 149. Further, the heat exchangers 152 are thermally coupled to more channels having coolant (three paths, connector channel171, return channel 160, and cooling path 161) in comparison to the heat exchangers 108 in the first cold box (e.g., two paths, heat exchanger 108D is thermal coupled to the downward channel and the return channel 116 (an exhaust or recovery path)).

[0039] Further, the additional operational efficiency can isolate respective cooling loops such that each cooling loop can maintain a separate pressure. That is, the only coupling between the two cryogenic systems (e.g., 104 and 149) can be with the connector channel 171 and the valve 172. That is, the first collection vessel 114 can be connected to the exhaust path of the return channel 160, which is not pressure connected to the second coolant (e.g., coolant in cooling path 161) in the second cold box 150. In some examples, the valve 172 can be used to disconnect the two cryogenic systems (e.g., 104 and 149), to perform maintenance on one of the cryogenic systems (e.g., to the second cryogenic system 149).

[0040] Payload The coolant in the second collection vessel 158 can be used to cool a payload 199 (e.g., a cryostat, a plurality of cryogenic chips, electronic chips, photonic integrated circuits (PICs), single photon detectors) in the payload loop 197. In particular, the liquid component of the second coolant in the second collection vessel 158 can be transferred by way of the payload input channel 195 (e.g., a pipe having a valve 133), which can be coupled to one or more heat exchangers 189 of the payload 199. The one or more heat exchangers can exchange heat with cold plates in contact with chips 187 of the payload 199 to cool (and to maintain) the chips 187 to a cryogenic temperature (e.g., 2.5K, 4K). After cooling the payload 199, the coolant can be transferred to the first cryogenic supply vessel 102 using payload output channel 193 (e.g., one or more output pipes from payload).

[0041] FIG. 1B shows an example of a heat exchanger 120, in accordance with some example embodiments. The heat exchanger 120 (e.g., heat exchanger 152B) comprises a cooling element 125 through which heat from channels 130 and 135 can be exchanged. In some examples, channel 130 and channel 135 can be any suitable channel containing a liquid or a gas. For example, as shown in FIG. 1A, channel 130 can correspond to the return channel 116 when the heat exchanger 120 corresponds to any one of the plurality of heat exchangers 108A-

[0042] The cooling element 125 (e.g., exchange element) can be implemented in different approaches such as a set of fins exposed to the air, or a liquid coolant circulating in pipes in the cooling element 125 (e.g., water, glycol). Further, although the heat exchangers provide cooling it is appreciated that they can exchange heat to provide cooling to some materials while providing warming to other materials based on the temperature of the material that is thermally coupled to the cooling element 125.

[0043] The channels 130 and 135 are configured to thermally interface with the cooling element 125. For example, the channel 130 may make multiple passes or wind around the cooling element 125, or the channel 130 may be dispersed into multiple smaller channels to create more surface area (e.g., contact area) with the cooling element (e.g., as in a fins and plate approach).

[0044] In some example embodiments, the channels 130 and 135 can respectively contain a fluid (e.g., gas, liquid) that can be a different temperature (e.g., cooler or warmer) with respect to the cooling element 155 or the fluid in other channels that are thermally coupled to the cooling element 125. For example, channel 135 (e.g., cooling path 161, a pipe) can comprise helium at a higher temperature (e.g., helium traveling towards dewar) than the helium in channel 130 (e.g., connector channel 171, from the first cryogenic system 104 in FIG. 1A).

[0045] Although a coiled tube type heat exchanger is shown in FIG. 1B as an example, it can be appreciated that other types of heat exchangers can similarly be implemented to exchange heat from channels (e.g., pipes), such as plate-fin based heat exchangers (e.g., thin metal plates with fins between them), shell and tube designs, regenerative based exchangers, and so on.

[0046] FIGs 2 and 3 show example embodiments of the scalable cryogenic systems (cryoplants) shown in FIG. 1A in refrigeration configuration and liquefaction configurations.

[0047] When configured in a refrigeration mode, the cryogenic system is configured to provide (e.g., to the payload, to a next cryoplant loop) the coolant at a given cryogenic temperature (e.g., 4.5K liquid) as a liquid, and the coolant is recovered as a gas at the same cryogenic temperature (e.g., 4.5K gas). When configured in a liquification mode, the cryogenic system is configured to provide (e.g., to the payload, or next cryoplant loop) the coolant as a liquid (e.g., 4.5K liquid) and the coolant is brought up to room temperature (e.g., ambient temperature, environment temperature) and recovered at a higher temperature, thereby further cooling the payload (e.g., to 2K).

[0048] FIG. 2 shows a distributed cryoplant system 200 in a refrigeration configuration, in accordance with some example embodiments. In FIG. 2, a plurality of cryogenic loop systems 202A-202N (e.g., a first cryoplant, a second cryoplant) can be connected in series, as discussed above with reference to FIG. 1A. In FIG. 2, a first set of cryoplants in loop section 230 operate in refrigeration mode and the final cryoplant in loop section 250 also operates in refrigeration mode (e.g., provision and recovery of coolant at the same temperature, such as 4.5K).

[0049] Respective cryoplants 202A-202N can have a plurality of heat exchangers 203A-203N configured to cool and, in some examples, to liquify coolant from a first tank 220 (e.g., helium supply tank). The plurality of heat exchangers 203A-203N can output coolant to respective collection vessels 206A-206N. A second tank 240 (e.g., nitrogen supply tank) can provide cooling to a first heat exchanger of the plurality of heat exchangers 203A-203N. For example, the second tank 240 can be used to assist in cooling the respective paths to the collection vessels 206A-206N (e.g., cooling the coolant from the first tank 220).

[0050] In some embodiments, each successive cryoplant can provide cooling to the next respective cryoplant using connector pipes 207A-207N, which can function as described above in FIG. 1A (e.g., connector channel 171 and the valve 172). Thus, the overall cooling power available to cool a payload 210 (e.g., plurality of chips to operate at approximately 4.5K) of a payload loop (e.g., loop section 250). Additionally, the payload loop can be pressure-isolated from respective other cryoplants.

[0051] FIG. 3 shows a distributed cryoplant system 300 in a liquification configuration, in accordance with some example embodiments. In FIG. 3, the distributed cryoplant system 300 comprises the plurality of cryogenic loop systems 202A-202N as described above in connection with FIG. 2 and FIG. 1A. In FIG. 3, the first set of cryoplants in loop section 230 operate in refrigeration mode and the final cryoplant in loop section 304 operates in liquification mode, wherein in the last section (e.g., loop section 304), the coolant is provided at a first cryogenic temperature (e.g., 4.5K) and is brought up to room temperature (e.g., ambient temperature), thereby cooling the payload to a colder temperature (e.g., 2K) versus the embodiment of FIG. 2.

[0052] The distributed cryoplant system 300 additionally comprises a payload 302, which can include a plurality of chips configured to operate at a lower temperature (e.g., 2K) than can be achieved by the system 200.

[0053] In FIG. 3, the distributed cryoplant system 300 can achieve an operating temperature for the payload 303 by including a helium recovery unit 306 in a payload loop, in accordance with some example embodiments. The helium recovery unit 306 (e.g., pump, gas heater) can configure the payload loop (of loop section 304) into a liquification mode where the previous loops (e.g., loop section 230, loop of plant 202A, loop of plant 202B) are in refrigeration mode.

[0054] The portions of distributed cryoplant system 300 that are configured in refrigeration mode can have the cryogenic coolant provided as a liquid at a first temperature (e.g., 4.5K liquid helium) and recovered as gas at the same temperature (e.g., 4.5K gas helium). The portions of distributed cryoplant system 300 that are configured in in liquification mode can have the cryogenic coolant provided as a liquid at the first temperature (e.g., 4.5K liquid helium) and recovered as a gas at a different temperature (e.g., room temperature) such that the plurality of chips included in the payload can be cooled to and can maintain a colder cryogenic temperature (e.g., 2K). For example, in liquification mode, the cryogenic coolant can be provided as liquid helium to the payload and can warm to room or ambient temperature, where the helium can be recovered by the helium recovery unit 306.

[0055] As illustrated in FIG. 3, the plurality of cryogenic loop systems 202A- 202N can be connected in series, as discussed above with reference to FIG. 1A.

[0056] Respective cryoplants 202A-202N can have a plurality of heat exchangers 203A-203N configured to cool and, in some examples, to liquify coolant from a first tank 220 (e.g., helium supply tank). The plurality of heat exchangers 203A-203N can output coolant to respective collection vessels 206A-206N. A second tank 240 (e.g., nitrogen supply tank) can provide cooling to a first heat exchanger of the plurality of heat exchangers 203A-203N. For example, the second tank 240 can be used to assist in cooling the respective paths to the collection vessels 206A-206N (e.g., cooling the coolant from the first tank 220).

[0057] In some embodiments, each successive cryoplant can provide cooling to the next respective cryoplant using connector pipes 207A-207N, which can function as described above in FIG. 1A (e.g., connector channel 171 and the valve 172). Thus, the overall cooling power available to cool a payload 210 (e.g., plurality of chips to operate at approximately 2K) of a payload loop (e.g., loop section 304). Additionally, the payload loop can be pressure-isolated from respective other cryoplants.

[0058] FIG. 4 shows an example of a method for operating a scalable cryogenic system having distributed cryoplants.

[0059] At block 405, the method 400 can include providing a cryogenic coolant (e.g., helium) from supply vessel (e.g., vessel 102) to both the first cryogenic system 104 and second cryogenic system 149, where the systems can share components like the helium supply vessel 102 and second cryogenic supply vessel 177 (e.g., nitrogen supply).

[0060] At block 410, the method 400 can include cooling the coolant (e.g., helium) using a first plurality of heat exchangers (e.g., 108A-108F) in the first cryogenic system.

[0061] At block 415, the method 400 can include collecting both liquid and gas components of the cooled first coolant in a collection vessel (e.g., first collection vessel 114, a Dewar).

[0062] At block 420, the method 400 can include exchanging heat between a plurality of heat exchangers 152A-152F and one or more coolants in the second cryogenic system (e.g., the coolant from first collection vessel114 via connector channel 171; second coolant on cooling path 161).

[0063] At block 425, the method 400 can include collecting the liquid and gas components from the second cooled coolant in second collection vessel 158.

[0064] At block 430, the method 400 can include returning multiple gas streams to supply vessel 102: the gas component from return channel 116, the gas component from return channel 160, and the gasified portion of the liquid component from connector channel 171 that was provided to the second cryogenic system.

[0065] At block 435, the method 400 can include cooling a thermal payload (e.g., cryogenic chips, electronic chips, PICs) using the liquid component from second collection vessel 158. As demonstrated in FIG. 2 and FIG. 3, this can achieve either 4.5K or 2K payload temperatures depending on the configuration.

[0066] Example 1 is a distributed cryogenic system comprising: a supply vessel storing a cryogenic coolant; a first cryogenic system, comprising: a first cold box configured to receive the cryogenic coolant from the supply vessel as a first coolant and circulate the first coolant on a first cooling path ; a first plurality of heat exchangers configured to cool the first coolant on the first cooling path; and a first collection vessel configured to collect a liquid component and a gas component from the cooled first coolant; a second cryogenic system, comprising: a second cold box configured to receive the cryogenic coolant from the supply vessel as a second coolant and circulate the second coolant on a second cooling path ; a second plurality of heat exchangers configured to cool the second coolant on the second cooling path; a second collection vessel configured to collect a liquid component and a gas component from the cooled second coolant; and a second return channel configured to return the gas component of the cooled second coolant to the supply vessel; a connection channel configured to: provide the liquid component of the cooled first coolant to at least one heat exchanger in the second plurality of heat exchangers; and connect to the second return channel to return a gasified portion of the liquid component of the cooled first coolant to the supply vessel, the connection channel being pressure isolated from the second cooling path; and a thermal payload configured to be cooled by the liquid component of the cooled second coolant.

[0067] In Example 2, the subject matter of Example 1 includes, wherein the first cold box further comprises an inlet configured to receive the cryogenic coolant as a first gas input at a first pressure.

[0068] In Example 3, the subject matter of Examples 1^2 includes, wherein the first cold box further comprises an outlet configured to output the cooled first coolant as the liquid component and the gas component into the first collection vessel.

[0069] In Example 4, the subject matter of Examples 1^3 includes, wherein the first cold box further comprises a first return channel configured to return the gas component of the cooled first coolant to the supply vessel.

[0070] In Example 5, the subject matter of Examples 1^4 includes, wherein the second cold box further comprises an inlet configured to receive the cryogenic coolant as a second gas input at a second pressure.

[0071] In Example 6, the subject matter of Examples 1^5 includes, wherein the second cold box further comprises an outlet configured to output the cooled second coolant as the liquid component and the gas component into the second collection vessel.

[0072] In Example 7, the subject matter of Examples 1^6 includes, wherein the thermal payload comprises a payload heat exchanger and a plurality of cryogenic chips.

[0073] In Example 8, the subject matter of Example 7 includes, wherein the payload heat exchanger is configured to cool the plurality of cryogenic chips.

[0074] In Example 9, the subject matter of Examples 1^8 includes, wherein the thermal payload is connected to the second collection vessel.

[0075] In Example 10, the subject matter of Examples 1^9 includes, a third return channel configured to return the second coolant to the supply vessel from the thermal payload.

[0076] In Example 11, the subject matter of Examples 1^10 includes, wherein connections to the thermal payload are pressure isolated from the first cryogenic system.

[0077] In Example 12, the subject matter of Examples 1^11 includes, a third cryogenic system, comprising: a third cold box configured to receive a third coolant from the supply vessel; a third plurality of heat exchangers configured to cool the third coolant; a third collection vessel configured to collect a liquid component and a gas component from the cooled third coolant; and a third return channel configured to return the gas component of the cooled third coolant to the supply vessel; and a second connection channel configured to: provide the liquid component of the cooled second coolant to at least one heat exchanger in the third plurality of heat exchangers; and connect to the third return channel to return a gasified portion of the liquid component of the cooled second coolant to the supply vessel; wherein the thermal payload is configured to be cooled by the liquid component of the cooled third coolant.

[0078] Example 13 is a method for operating a distributed cryogenic system, comprising: providing, from a supply vessel storing a cryogenic coolant, a first coolant to a first cryogenic system and a second coolant to a second cryogenic system; cooling, in the first cryogenic system, the first coolant with a first plurality of heat exchangers; collecting, at a first collection vessel, a liquid component and a gas component from the cooled first coolant; cooling, in the second cryogenic system, the second coolant with a second plurality of heat exchangers, wherein at least one heat exchanger in the second plurality of heat exchangers is provided with the liquid component from the cooled first coolant; collecting, at a second collection vessel, a liquid component and a gas component from the cooled second coolant; returning, to the supply vessel, the gas component from the cooled first coolant, the gas component from the cooled second coolant, and a gasified portion of the liquid component from the cooled first coolant; and cooling a thermal payload with the liquid component of the cooled second coolant, wherein connections to the thermal payload are pressure isolated from the first cryogenic system.

[0079] In Example 14, the subject matter of Example 13 includes, providing the first coolant to the first cryogenic system at a first pressure.

[0080] In Example 15, the subject matter of Example 14 includes, providing the second coolant to the second cryogenic system at a second pressure.

[0081] In Example 16, the subject matter of Examples 13^15 includes, wherein the thermal payload comprises a payload heat exchanger and a plurality of cryogenic chips.

[0082] In Example 17, the subject matter of Example 16 includes, wherein the payload heat exchanger is cooled by the liquid component of the cooled second coolant and wherein the payload heat exchanger is configured to cool the plurality of cryogenic chips.

[0083] In Example 18, the subject matter of Examples 13^17 includes, returning the second coolant to the supply vessel from the thermal payload.

[0084] In Example 19, the subject matter of Examples 13^18 includes, wherein the thermal payload is connected to the second collection vessel.

[0085] Example 20 is a system comprising: storing means to store a coolant means; a first cryogenic system, comprising: a first cold box configured to receive the coolant means from the storing means as a first coolant means and circulate the first coolant means on a first cooling path; a first coolant cooling means configured to cool the first coolant means on the first cooling path; and a first collection means configured to collect a liquid component and a gas component from the cooled first coolant means; a second cryogenic system, comprising: a second cold box configured to receive the coolant means from the storing means as a second coolant means and circulate the second coolant means on a second cooling path; a second coolant cooling means configured to cool the second coolant means on the second cooling path; a second collection means configured to collect a liquid component and a gas component from the cooled second coolant means; and a second return channel configured to return the gas component of the cooled second coolant means to the storing means; a connection channel configured to: provide the liquid component of the cooled first coolant means to the second coolant cooling means; and connect to the second return channel to return a gasified portion of the liquid component of the cooled first coolant means to the storing means, the connection channel being pressure isolated from the second cooling path; and a thermal payload configured to be cooled by the liquid component of the cooled second coolant means.

[0086] Example 21 is an apparatus comprising means to implement of any of Examples 1^20.

[0087] Example 22 is a system to implement of any of Examples 1^20.

[0088] Example 23 is a method to implement of any of Examples 1^20. Although the embodiments of the present disclosure have been described with reference to specific example embodiments, it will be evident that various modifications and changes may be made to these embodiments without departing from the broader scope of the inventive subject matter. Accordingly, the specification and drawings are to be regarded in an illustrative rather than a restrictive sense. The accompanying drawings that form a part hereof show, by way of illustration, and not of limitation, specific embodiments in which the subject matter may be practiced. The embodiments illustrated are described in sufficient detail to enable those skilled in the art to practice the teachings disclosed herein. Other embodiments may be used and derived therefrom, such that structural and logical substitutions and changes may be made without departing from the scope of this disclosure. This Detailed Description, therefore, is not to be taken in a limiting sense, and the scope of various embodiments is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled.

[0089] Such embodiments of the inventive subject matter may be referred to herein, individually and / or collectively, by the term ^invention^ merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed. Thus, although specific embodiments have been illustrated and described herein, it should be appreciated that any arrangement calculated to achieve the same purpose may be substituted for the specific embodiments shown. This disclosure is intended to cover any and all adaptations or variations of various embodiments. Combinations of the above embodiments, and other embodiments not specifically described herein, will be apparent to those of skill in the art, upon reviewing the above description.

[0090] In this document, the terms ^a^ or ^an^ are used, as is common in patent documents, to include one or more than one, independent of any other instances or usages of ^at least one^ or ^one or more.^ In this document, the term ^or^ is used to refer to a nonexclusive or, such that ^A or B^ includes ^A but not B,^ ^B but not A,^ and ^A and B,^ unless otherwise indicated. In the appended claims, the terms ^including^ and ^in which^ are used as the plain-English equivalents of the respective terms ^comprising^ and ^wherein.^ Also, in the following claims, the terms ^including^ and ^comprising^ are open-ended; that is, a system, device, article, or process that includes elements in addition to those listed after such a term in a claim is still deemed to fall within the scope of that claim.

Claims

CLAIMS What is claimed is:

1. A distributed cryogenic system comprising: a supply vessel storing a cryogenic coolant; a first cryogenic system, comprising: a first cold box configured to receive the cryogenic coolant from the supply vessel as a first coolant and circulate the first coolant on a first cooling path; a first plurality of heat exchangers configured to cool the first coolant on the first cooling path; and a first collection vessel configured to collect a liquid component and a gas component from the cooled first coolant; a second cryogenic system, comprising: a second cold box configured to receive the cryogenic coolant from the supply vessel as a second coolant and circulate the second coolant on a second cooling path; a second plurality of heat exchangers configured to cool the second coolant on the second cooling path; a second collection vessel configured to collect a liquid component and a gas component from the cooled second coolant; and a second return channel configured to return the gas component of the cooled second coolant to the supply vessel; a connection channel configured to: provide the liquid component of the cooled first coolant to at least one heat exchanger in the second plurality of heat exchangers; and connect to the second return channel to return a gasified portion of the liquid component of the cooled first coolant to the supply vessel, the connection channel being pressure isolated from the second cooling path; and a thermal payload configured to be cooled by the liquid component of the cooled second coolant.

2. The distributed cryogenic system of claim 1, wherein the first cold box further comprises an inlet configured to receive the cryogenic coolant as a first gas input at a first pressure.

3. The distributed cryogenic system of claim 1, wherein the first cold box further comprises an outlet configured to output the cooled first coolant as the liquid component and the gas component into the first collection vessel.

4. The distributed cryogenic system of claim 1, wherein the first cold box further comprises a first return channel configured to return the gas component of the cooled first coolant to the supply vessel.

5. The distributed cryogenic system of claim 1, wherein the second cold box further comprises an inlet configured to receive the cryogenic coolant as a second gas input at a second pressure.

6. The distributed cryogenic system of claim 1, wherein the second cold box further comprises an outlet configured to output the cooled second coolant as the liquid component and the gas component into the second collection vessel.

7. The distributed cryogenic system of claim 1, wherein the thermal payload comprises a payload heat exchanger and a plurality of cryogenic chips.

8. The distributed cryogenic system of claim 7, wherein the payload heat exchanger is configured to cool the plurality of cryogenic chips.

9. The distributed cryogenic system of claim 1, wherein the thermal payload is connected to the second collection vessel.

10. The distributed cryogenic system of claim 1, further comprising a third return channel configured to return the second coolant to the supply vessel from the thermal payload.

11. The distributed cryogenic system of claim 1, wherein connections to the thermal payload are pressure isolated from the first cryogenic system.

12. The distributed cryogenic system of claim 1, further comprising: a third cryogenic system, comprising: a third cold box configured to receive a third coolant from the supply vessel; a third plurality of heat exchangers configured to cool the third coolant; a third collection vessel configured to collect a liquid component and a gas component from the cooled third coolant; and a third return channel configured to return the gas component of the cooled third coolant to the supply vessel; and a second connection channel configured to: provide the liquid component of the cooled second coolant to at least one heat exchanger in the third plurality of heat exchangers; and connect to the third return channel to return a gasified portion of the liquid component of the cooled second coolant to the supply vessel; wherein the thermal payload is configured to be cooled by the liquid component of the cooled third coolant.

13. A method for operating a distributed cryogenic system, comprising: providing, from a supply vessel storing a cryogenic coolant, a first coolant to a first cryogenic system and a second coolant to a second cryogenic system; cooling, in the first cryogenic system, the first coolant with a first plurality of heat exchangers; collecting, at a first collection vessel, a liquid component and a gas component from the cooled first coolant;cooling, in the second cryogenic system, the second coolant with a second plurality of heat exchangers, wherein at least one heat exchanger in the second plurality of heat exchangers is provided with the liquid component from the cooled first coolant; collecting, at a second collection vessel, a liquid component and a gas component from the cooled second coolant; returning, to the supply vessel, the gas component from the cooled first coolant, the gas component from the cooled second coolant, and a gasified portion of the liquid component from the cooled first coolant; and cooling a thermal payload with the liquid component of the cooled second coolant, wherein connections to the thermal payload are pressure isolated from the first cryogenic system.

14. The method of claim 13, further comprising providing the first coolant to the first cryogenic system at a first pressure.

15. The method of claim 14, further comprising providing the second coolant to the second cryogenic system at a second pressure.

16. The method of claim 13, wherein the thermal payload comprises a payload heat exchanger and a plurality of cryogenic chips.

17. The method of claim 16, wherein the payload heat exchanger is cooled by the liquid component of the cooled second coolant and wherein the payload heat exchanger is configured to cool the plurality of cryogenic chips.

18. The method of claim 13, further comprising returning the second coolant to the supply vessel from the thermal payload.

19. The method of claim 13, wherein the thermal payload is connected to the second collection vessel.

20. A system comprising: storing means to store a coolant means; a first cryogenic system, comprising: a first cold box configured to receive the coolant means from the storing means as a first coolant means and circulate the first coolant means on a first cooling path; a first coolant cooling means configured to cool the first coolant means on the first cooling path; and a first collection means configured to collect a liquid component and a gas component from the cooled first coolant means; a second cryogenic system, comprising: a second cold box configured to receive the coolant means from the storing means as a second coolant means and circulate the second coolant means on a second cooling path; a second coolant cooling means configured to cool the second coolant means on the second cooling path; a second collection means configured to collect a liquid component and a gas component from the cooled second coolant means; and a second return channel configured to return the gas component of the cooled second coolant means to the storing means; a connection channel configured to: provide the liquid component of the cooled first coolant means to the second coolant cooling means; and connect to the second return channel to return a gasified portion of the liquid component of the cooled first coolant means to the storing means, the connection channel being pressure isolated from the second cooling path; and a thermal payload configured to be cooled by the liquid component of the cooled second coolant means.

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