Device moving method and apparatus, device, and storage medium

Abstract

A device moving method, comprising: acquiring a first voltage value collected by a height measurement sensor when a cutting tool (46) is located at a first position, wherein the first position is a position where the cutting tool (46) is not measured by the height measurement sensor; determining a target threshold voltage of the height measurement sensor on the basis of the first voltage value; and in response to the target threshold voltage collected by the height measurement sensor, controlling the cutting tool (46) to stop moving downwards. According to the method, the target threshold voltage for controlling the cutting tool (46) to stop is determined on the basis of the voltage value of the height measurement sensor when the cutting tool (46) is not measured, thereby avoiding the problem of insufficient device movement control accuracy caused by the influence of interference factors in an environment on the height measurement sensor, and ensuring the processing precision of a wafer cutting device. The present application also relates to a device moving apparatus, a device, and a storage medium.

Description

Device moving method, device, device and storage medium

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 18, 2023, with application number 202311739272.9 and invention name “A method, device, equipment and storage medium for moving a device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of wafer cutting technology, and in particular to a method, apparatus, device and storage medium for moving equipment. Background Art

[0003] A wafer cutting device generally consists of a cutting tool and a stage, wherein the cutting tool is placed above the stage. Before wafer cutting, the cutting tool generally needs to be moved down until it contacts the stage, so the distance between the cutting tool and the stage needs to be measured.

[0004] The wafer dicing process requires cutting fluid. Cutting fluid is an industrial liquid used to cool and lubricate cutting tools and workpieces during the cutting process. Because the liquid is involved in the cutting process, interference factors such as moisture may exist within the wafer dicing equipment. Furthermore, liquid may splash onto the height sensor during previous processing, affecting the accuracy of the distance measurement between the cutting tool and the workpiece stage, and thus, the processing precision of the wafer dicing equipment. Summary of the Invention

[0005] In view of this, the present application provides a method, apparatus, device and storage medium for moving an apparatus, so as to improve the accuracy of distance measurement and ensure the processing accuracy of a wafer cutting apparatus.

[0006] The technical solution is as follows:

[0007] A first aspect of the present application provides a method for moving a device, the method comprising:

[0008] Acquire a first voltage value collected by a height measuring sensor when the cutting tool is at a first position, where the first position is a position where the cutting tool is not detected by the height measuring sensor;

[0009] determining a target threshold voltage of the height measuring sensor according to the first voltage value;

[0010] In response to the height sensor detecting the target threshold voltage, the cutting tool is controlled to stop moving downward.

[0011] In a possible implementation, obtaining a first voltage value collected by a height measuring sensor when the cutting tool is at the first position includes:

[0012] Obtaining a voltage value collected by a height measuring sensor when the cutting tool is at an initial position, wherein the initial position is a position where the cutting tool is not detected by the height measuring sensor; or

[0013] Obtain a voltage value collected by a height sensor when the cutting tool is at a second position, where the total height between the cutting tool and the stage decreases to a first height at a first speed and is not detected by the height sensor.

[0014] In a possible implementation, in response to the height sensor detecting the target threshold voltage, controlling the cutting tool to stop moving downward includes:

[0015] The height between the cutting tool and the stage is reduced at a second speed until the height sensor detects the target threshold voltage, and the cutting tool is controlled to stop moving downward, wherein the first speed is not equal to the second speed.

[0016] In a possible implementation, the first speed is greater than the second speed.

[0017] In a possible implementation, after the height measuring sensor detects the target threshold voltage and controls the cutting tool to stop moving downward, the method further includes:

[0018] moving the cutting tool and the stage away from each other at a third speed until the cutting tool and the stage are at a second height, wherein the third speed is less than the first speed and the second height is less than the first height;

[0019] The second height between the cutting tool and the stage is reduced at a fourth speed until the height sensor detects the target threshold voltage, and the cutting tool is controlled to stop moving downward.

[0020] In a possible implementation, determining a target threshold voltage of the height measuring sensor according to the first voltage value includes:

[0021] determining a corrected voltage value of the height measuring sensor according to the first voltage value, wherein the corrected voltage value is a voltage value generated when the height measuring sensor is affected by an obstructing object;

[0022] A target threshold voltage of the height sensor is determined based on the correction voltage value and the cutting height requirement.

[0023] In a possible implementation, the first height is determined according to the total height and a cutting tool loss value.

[0024] A second aspect of the present application provides an apparatus for moving a device, the apparatus comprising:

[0025] A voltage acquisition module, configured to acquire a first voltage value collected by the height measuring sensor when the cutting tool is in a first position, wherein the first position is a position where the cutting tool is not detected by the height measuring sensor;

[0026] a voltage determination module, configured to determine a target threshold voltage of the height measuring sensor according to the first voltage value;

[0027] The equipment control module is used for controlling the cutting tool to stop moving downward in response to the height measuring sensor collecting the target threshold voltage.

[0028] A third aspect of the present application provides an electronic device, the device comprising: a memory, a processor;

[0029] The memory is used to store computer programs;

[0030] The processor is used to implement the steps of the device movement method introduced in any implementation manner of the first aspect when executing the computer program.

[0031] In a fourth aspect, the present application provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of the method for moving a device as described in any implementation of the first aspect are implemented.

[0032] The above technical solution has the following beneficial effects:

[0033] An embodiment of the present application provides a method for moving an apparatus. First, a first voltage value collected by a height sensor when a cutting tool is in a first position is obtained, where the first position is a position where the cutting tool is not detected by the height sensor. Then, a target threshold voltage of the height sensor is determined based on the first voltage value. Finally, in response to the height sensor collecting the target threshold voltage, the cutting tool is controlled to stop moving downward. This embodiment of the present application determines the target threshold voltage for controlling the cutting tool to stop by using the voltage value of the height sensor when the cutting tool is not detected. This can avoid the problem of insufficient accuracy in equipment movement control caused by the influence of environmental interference factors on the height sensor, thereby ensuring the processing accuracy of the wafer cutting device.

[0034] The embodiments of the present application also provide a device, an electronic device, and a computer-readable storage medium corresponding to the above method, which have the same beneficial effects as the above method. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in this embodiment or the prior art, the following briefly introduces the drawings required for use in the embodiment or the prior art description. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0036] FIG1 is a schematic structural diagram of a wafer cutting device provided in an embodiment of the present application;

[0037] FIG2a is a schematic diagram of the relative position relationship between a cutting tool and a light-receiving portion of a height measurement sensor provided by an embodiment of the present application;

[0038] FIG2 b is a schematic diagram illustrating a light-receiving portion of a height measuring sensor provided by an embodiment of the present application being splashed with liquid;

[0039] FIG3 is a schematic flow chart of a method for moving a device according to an embodiment of the present application;

[0040] FIG4 is a schematic structural diagram of an apparatus for moving equipment provided in an embodiment of the present application. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0042] Referring to FIG1 , a schematic diagram of the structure of a wafer cutting apparatus 42 is shown. The apparatus includes a cutting tool 46, a height sensor (including a light-emitting portion 56 and a light-receiving portion 58), a tool intrusion portion 54, and cutting fluid 21 for cooling and lubricating the tool and workpiece during the cutting process. The light-emitting portion 56 of the height sensor emits light, while the light-receiving portion 58 receives the light. The height sensor collects the luminous flux from the light-receiving portion 58 and calculates the height of the cutting tool based on the luminous flux. Based on this height information, the wafer cutting apparatus 42 controls the movement of the cutting tool 46 to perform wafer cutting.

[0043] FIG2a shows the relative positional relationship between the cutting tool 46 and the light receiving portion 58 of the height sensor (taking the left view of the wafer cutting device provided in FIG1 as an example). Under ideal conditions, the initial luminous flux of the light receiving portion of the height sensor is 100%, that is, there is no detection object at the current detection position. However, as described in the background technology, there are interference factors such as water vapor from the cutting fluid in the wafer cutting device, and the height sensor is easily splashed by liquid during the previous processing. FIG2b shows that the lower part of the light receiving portion 58 of the height sensor receives the splash of cutting fluid. Therefore, the initial luminous flux of the light receiving portion of the height sensor is only 95% (for example only). Under such interference conditions, the accuracy of the height sensor in measuring the distance between the cutting tool and the stage is greatly affected, thereby affecting the processing accuracy of the wafer cutting device.

[0044] Based on this, an embodiment of the present application provides a method for moving equipment to avoid the problem of insufficient accuracy of equipment movement control caused by the influence of environmental interference factors on the height measuring sensor, thereby ensuring the processing accuracy of the wafer cutting device.

[0045] 3 , which shows a flow chart of a method for moving a device. The method may include:

[0046] Step S100: obtaining a first voltage value collected by a height measuring sensor when the cutting tool is at a first position, where the first position is a position where the cutting tool is not detected by the height measuring sensor.

[0047] Specifically, the wafer cutting device can obtain the first voltage value collected by the height measuring sensor when no processing work is carried out, or can obtain the first voltage value collected by the height measuring sensor when the cutting tool moves downward and is not detected by the height measuring sensor.

[0048] As an optional implementation method, the above-mentioned step S100 may specifically include: obtaining the voltage value collected by the height measuring sensor when the cutting tool is in an initial position, the initial position being the position where the cutting tool is not detected by the height measuring sensor; or, obtaining the voltage value collected by the height measuring sensor when the cutting tool is in a second position, the second position being the position where the total height between the cutting tool and the worktable decreases to a first height at a first speed and is not detected by the height measuring sensor.

[0049] It can be understood that the initial position is the position where the cutting tool stops when the wafer cutting device is not processing wafers, and the second position is the position where the cutting tool moves downward when the wafer cutting device is processing wafers but has not yet been detected by the height sensor. Therefore, the collected first voltage value can be used as the initial voltage value of the height sensor, reflecting the initial parameters of the height sensor in the current operating scenario, facilitating subsequent adjustments to the cutting tool height measurement calculation.

[0050] As an optional implementation, the cutting tool may be a blade or other device with a cutting function.

[0051] As an optional implementation method, the total height can be the distance between the center of the cutting tool and the worktable. The reference point can be the worktable or the center of the cutting tool, and the specific height is further determined by actual conditions.

[0052] As an optional implementation, the movement of the cutting tool or the stage is accomplished by a motor. That is, the controller issues corresponding instructions to control the movement of the cutting tool or the stage. This application does not impose any restrictions on the motor and the controller.

[0053] As an optional implementation, the cutting tool may be moved while the stage remains fixed. Specifically, the cutting tool moves a first distance toward the stage at a first speed to a first height, where the first height is determined based on the total height and the loss value of the cutting tool.

[0054] As an optional implementation, the stage may move while the cutting tool remains fixed. Specifically, the stage moves a first distance toward the cutting tool at a first speed to a first height, where the first height is determined based on the total height and the loss value of the cutting tool.

[0055] Through the above two optional implementation methods, either the stage or the cutting tool can be moved. Therefore, during the equipment installation process, the appropriate method can be selected according to the actual situation on site, which can effectively improve the flexibility of equipment installation.

[0056] As an optional implementation, the first height is determined based on the total height and the loss value of the cutting tool. The loss value of the cutting tool can be 0.1 mm, which is an estimated value based on a large amount of data statistics, that is, it is estimated that the loss value of the cutting tool is 0.1 mm for each cutting action.

[0057] It should be noted that the wafer cutting process is a multi-cycle process, that is, each time the cutting equipment is started, multiple cuts are completed. Therefore, the total height is also a constantly changing value. The current total height is the relative height between the cutting tool center and the stage after the last cut was completed.

[0058] Step S200: determining a target threshold voltage of the height measuring sensor according to the first voltage value.

[0059] Specifically, a target preset voltage for controlling the cutting tool to stop movement is determined based on the first voltage value. It is understood that because the first voltage value is the initial voltage value of the altimeter sensor, it reflects the initial parameters of the altimeter sensor in the current operating scenario. This makes subsequent cutting tool height measurement calculations more accurate, ensuring accurate control of the cutting tool.

[0060] As an optional implementation, the above step S200 may specifically include the following steps:

[0061] Step S201: determining a corrected voltage value of the altimeter sensor according to the first voltage value, wherein the corrected voltage value is a voltage value generated when the altimeter sensor is affected by an obstructing object.

[0062] Step S202: determining a target threshold voltage of the height sensor based on the correction voltage value and the cutting height requirement.

[0063] Specifically, the correction voltage value is the voltage value generated when the height measuring sensor is affected by obstructing objects such as water vapor, cutting fluid splashing, etc. The target threshold voltage is calculated based on the correction voltage value and the cutting height requirement, where the cutting height requirement can be set according to actual processing requirements.

[0064] Step S300: In response to the height measuring sensor collecting the target threshold voltage, the cutting tool is controlled to stop moving downward.

[0065] Specifically, when the height measuring sensor detects the target threshold voltage, the cutting tool is controlled to stop moving downward.

[0066] As an optional implementation method, the above step S300 may specifically include: reducing the height between the cutting tool and the worktable at a second speed until the height sensor collects the target threshold voltage, and controlling the cutting tool to stop moving downward, wherein the first speed is not equal to the second speed.

[0067] As an optional implementation, the first speed is greater than the second speed.

[0068] It can be understood that the second speed is lower than the first speed, which can ensure that the cutting tool approaches the stage at a relatively slow speed to cut the wafer, thereby ensuring the safety of the processing and the equipment.

[0069] The above method determines the target threshold voltage based on the first voltage value collected when the height sensor fails to detect the cutting tool, and controls the cutting tool to stop moving based on the target threshold voltage. As a result, the wafer cutting apparatus can reset the voltage threshold based on the pre-processing luminous flux of the light sensor, thereby reducing interference with the height sensor from factors such as moisture, thereby increasing height measurement accuracy and ensuring wafer processing precision.

[0070] As an optional implementation, after the above-mentioned step S300, the method provided in the embodiment of the present application also includes step S400: moving the cutting tool and the worktable away from each other at a third speed until the cutting tool and the worktable are at a second height, wherein the third speed is less than the first speed, and the second height is less than the first height; reducing the second height between the cutting tool and the worktable at a fourth speed until the height sensor collects the target threshold voltage and controls the cutting tool to stop moving downward.

[0071] Since the wafer cutting process is a multi-cycle process and multiple cutting processes need to be completed, after controlling the cutting tool to stop moving downward in step S300, it is also necessary to control the cutting tool to move upward and lift up for the second cutting process, and repeat this process to complete multiple cutting processes.

[0072] As an optional implementation, the fourth speed may be equal to the second speed.

[0073] As an optional implementation, before reducing the second height between the cutting tool and the worktable at a fourth speed, the target threshold voltage of the height sensor is re-determined, wherein the second height corresponds to a position where the cutting tool is not detected by the height sensor.

[0074] It is understandable that the obstruction of the height sensor may change as the machining process progresses. To ensure the timeliness of the target threshold voltage, the target threshold voltage of the height sensor is re-determined before each downward movement of the cutting tool, and the movement of the cutting tool is controlled based on the re-determined target threshold voltage. Of course, the re-determined target threshold voltage requires that the second height of the cutting tool's upward movement must satisfy the requirement that the position after the movement is not detected by the height sensor. The method for re-determining the target threshold voltage can be similar to the method for determining the target threshold voltage for the first time, and will not be repeated here.

[0075] In summary, the embodiments of the present application provide a method for moving a device. First, a first voltage value collected by a height sensor when the cutting tool is in a first position is obtained, where the first position is a position where the cutting tool is not detected by the height sensor. Then, a target threshold voltage of the height sensor is determined based on the first voltage value. Finally, in response to the height sensor collecting the target threshold voltage, the cutting tool is controlled to stop moving downward. It can be seen that the embodiments of the present application determine the target threshold voltage for controlling the cutting tool to stop by using the voltage value of the height sensor when the cutting tool is not detected. This can avoid the problem of insufficient accuracy in controlling the movement of the device caused by the influence of environmental interference factors on the height sensor, thereby ensuring the processing accuracy of the wafer cutting device.

[0076] Corresponding to the above method, an embodiment of the present application further provides an apparatus for moving a device. Please refer to FIG4 , which shows a schematic structural diagram of the apparatus. The apparatus may include:

[0077] A voltage acquisition module 401 is configured to acquire a first voltage value collected by a height measuring sensor when the cutting tool is in a first position, where the first position is a position where the cutting tool is not detected by the height measuring sensor;

[0078] A voltage determination module 402 is configured to determine a target threshold voltage of the height measuring sensor according to the first voltage value;

[0079] The device control module 403 is configured to control the cutting tool to stop moving downward in response to the height measuring sensor detecting the target threshold voltage.

[0080] As an optional implementation method, the voltage acquisition module 401 is specifically used to: obtain the voltage value collected by the height measuring sensor when the cutting tool is in an initial position, the initial position being the position where the cutting tool is not detected by the height measuring sensor; or, obtain the voltage value collected by the height measuring sensor when the cutting tool is in a second position, the second position being the position where the total height between the cutting tool and the worktable decreases to a first height at a first speed and is not detected by the height measuring sensor.

[0081] As an optional implementation method, the device control module 403 is specifically used to: reduce the height between the cutting tool and the worktable at a second speed until the height sensor collects the target threshold voltage, and control the cutting tool to stop moving downward, wherein the first speed is not equal to the second speed.

[0082] As an optional implementation method, the device control module 403 is also used to: after controlling the cutting tool to stop moving downward, move the cutting tool and the worktable away from each other at a third speed until the cutting tool and the worktable are at a second height, wherein the third speed is less than the first speed, and the second height is less than the first height; and reduce the second height between the cutting tool and the worktable at a fourth speed until the height sensor collects the target threshold voltage and controls the cutting tool to stop moving downward.

[0083] As an optional implementation, the voltage determination module 402 includes:

[0084] a correction voltage determination submodule, configured to determine a correction voltage value of the altimeter sensor according to the first voltage value, wherein the correction voltage value is a voltage value generated when the altimeter sensor is affected by an obstructing object;

[0085] The threshold voltage determination submodule is used to determine the target threshold voltage of the height measuring sensor based on the correction voltage value and the cutting height requirement.

[0086] It should be noted that the steps executed by each module in the device for moving a device provided in an embodiment of the present application and the related technical features correspond to the method provided in the embodiment of the application. The description of the device part can be found in the embodiment of the aforementioned method part and will not be repeated here.

[0087] In summary, an embodiment of the present application provides a device for moving an apparatus, the device comprising: a voltage acquisition module for acquiring a first voltage value collected by a height sensor when the cutting tool is in a first position, the first position being a position where the cutting tool is not detected by the height sensor; a voltage determination module for determining a target threshold voltage of the height sensor based on the first voltage value; and an apparatus control module for controlling the cutting tool to stop moving downward in response to the height sensor collecting the target threshold voltage. It can be seen that the embodiment of the present application determines the target threshold voltage for controlling the cutting tool to stop by using the voltage value of the height sensor when the cutting tool is not detected, thereby avoiding the problem of insufficient accuracy of the equipment movement control caused by the influence of interference factors in the environment on the height sensor, thereby ensuring the processing accuracy of the wafer cutting apparatus.

[0088] An embodiment of the present application provides an electronic device, which includes a memory and a processor; the memory is used to store a computer program; and the processor is used to implement the steps of the device movement method described in the embodiment of the present application when executing the computer program.

[0089] An embodiment of the present application provides a computer-readable storage medium having a computer program stored thereon. When the program is executed by a processor, the steps of the device movement method described in the embodiment of the present application are implemented.

[0090] Example:

[0091] Embodiment 1: A method for moving a device, wherein the method comprises:

[0092] Acquire a first voltage value collected by a height measuring sensor when the cutting tool is at a first position, where the first position is a position where the cutting tool is not detected by the height measuring sensor;

[0093] determining a target threshold voltage of the height measuring sensor according to the first voltage value;

[0094] In response to the height sensor detecting the target threshold voltage, the cutting tool is controlled to stop moving downward.

[0095] Embodiment 2: The method according to embodiment 1, wherein obtaining a first voltage value collected by a height sensor when the cutting tool is at the first position comprises:

[0096] Obtaining a voltage value collected by a height measuring sensor when the cutting tool is at an initial position, wherein the initial position is a position where the cutting tool is not detected by the height measuring sensor; or

[0097] Obtain a voltage value collected by a height sensor when the cutting tool is at a second position, where the total height between the cutting tool and the stage decreases to a first height at a first speed and is not detected by the height sensor.

[0098] Embodiment 3: The method according to embodiment 1 or 2, wherein, in response to the height sensor detecting the target threshold voltage, controlling the cutting tool to stop moving downward comprises:

[0099] The height between the cutting tool and the stage is reduced at a second speed until the height sensor detects the target threshold voltage, and the cutting tool is controlled to stop moving downward, wherein the first speed is not equal to the second speed.

[0100] Embodiment 4: The method according to any one of embodiments 1-3, wherein the first speed is greater than the second speed.

[0101] Embodiment 5: The method according to any one of embodiments 1 to 4, wherein after the height sensor detects the target threshold voltage and controls the cutting tool to stop moving downward, the method further comprises:

[0102] moving the cutting tool and the stage away from each other at a third speed until the cutting tool and the stage are at a second height, wherein the third speed is less than the first speed and the second height is less than the first height;

[0103] The second height between the cutting tool and the stage is reduced at a fourth speed until the height sensor detects the target threshold voltage, and the cutting tool is controlled to stop moving downward.

[0104] Embodiment 6: The method according to any one of embodiments 1-5, wherein determining the target threshold voltage of the height measuring sensor according to the first voltage value comprises:

[0105] determining a corrected voltage value of the height measuring sensor according to the first voltage value, wherein the corrected voltage value is a voltage value generated when the height measuring sensor is affected by an obstructing object;

[0106] A target threshold voltage of the height sensor is determined based on the correction voltage value and the cutting height requirement.

[0107] Embodiment 7: The method according to any one of embodiments 1-6, wherein the first height is determined based on the total height and the cutting tool loss value.

[0108] Embodiment 8: A device for moving equipment, wherein the device comprises:

[0109] A voltage acquisition module, configured to acquire a first voltage value collected by the height measuring sensor when the cutting tool is in a first position, wherein the first position is a position where the cutting tool is not detected by the height measuring sensor;

[0110] a voltage determination module, configured to determine a target threshold voltage of the height measuring sensor according to the first voltage value;

[0111] The equipment control module is used for controlling the cutting tool to stop moving downward in response to the height measuring sensor collecting the target threshold voltage.

[0112] Embodiment 9: An electronic device, comprising:

[0113] A memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the method for moving the device as described in any one of embodiments 1-7 is implemented.

[0114] Embodiment 10: A computer-readable storage medium, wherein the computer-readable storage medium stores instructions, and when the instructions are executed on a terminal device, the terminal device executes the device movement method described in any one of embodiments 1-7.

[0115] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0116] Those skilled in the art will understand that the flowchart shown in the figure is only an example in which the embodiments of the present application can be implemented, and the scope of application of the embodiments of the present application is not limited by any aspect of the flowchart.

[0117] In the several embodiments provided in this application, it should be understood that the disclosed methods, devices and equipment can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interface, the indirect coupling or communication connection of the device or unit can be electrical, mechanical or other forms.

[0118] The units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment. In addition, the functional units in the various embodiments of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0119] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0120] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for moving a device, characterized in that: The method comprises: Acquire a first voltage value collected by a height measuring sensor when the cutting tool is at a first position, wherein the first position is a position where the cutting tool is not detected by the height measuring sensor; determining a target threshold voltage of the height measuring sensor according to the first voltage value; In response to the height sensor collecting the target threshold voltage, the cutting tool is controlled to stop moving downward.

2. The method according to claim 1, characterized in that The step of obtaining a first voltage value collected by a height measuring sensor when the cutting tool is at the first position includes: Acquire a voltage value collected by a height measuring sensor when the cutting tool is at an initial position, wherein the initial position is a position where the cutting tool is not detected by the height measuring sensor; or, A voltage value collected by the height measuring sensor when the cutting tool is in a second position is obtained, wherein the second position is a position where the total height between the cutting tool and the stage decreases to a first height at a first speed and is not detected by the height measuring sensor.

3. The method according to claim 2, characterized in that In response to the height measuring sensor collecting the target threshold voltage, controlling the cutting tool to stop moving downward includes: The height between the cutting tool and the stage is reduced at a second speed until the height sensor detects the target threshold voltage, and the cutting tool is controlled to stop moving downward, wherein the first speed is not equal to the second speed.

4. The method according to claim 3, characterized in that The first speed is greater than the second speed.

5. The method according to claim 3, characterized in that: After the height measuring sensor collects the target threshold voltage and controls the cutting tool to stop moving downward, the method further includes: Move the cutting tool and the stage away from each other at a third speed until the cutting tool and the stage are at a second height, wherein the third speed is less than the first speed and the second height is less than the first height; The second height between the cutting tool and the stage is reduced at a fourth speed until the height measuring sensor detects the target threshold voltage, and the cutting tool is controlled to stop moving downward.

6. The method according to claim 1, characterized in that The step of determining a target threshold voltage of the height measuring sensor according to the first voltage value comprises: Determining a corrected voltage value of the height measuring sensor according to the first voltage value, wherein the corrected voltage value is a voltage value generated when the height measuring sensor is affected by an obstructing object; A target threshold voltage of the height sensor is determined based on the correction voltage value and the cutting height requirement.

7. The method according to claim 2, characterized in that: The first height is determined according to the total height and the cutting tool loss value.

8. A device for moving equipment, characterized in that: The device comprises: A voltage acquisition module, used to acquire a first voltage value collected by the height measuring sensor when the cutting tool is in a first position, wherein the first position is a position where the cutting tool is not detected by the height measuring sensor; a voltage determination module, configured to determine a target threshold voltage of the height measuring sensor according to the first voltage value; The equipment control module is used for controlling the cutting tool to stop moving downward in response to the height measuring sensor collecting the target threshold voltage.

9. An electronic device, characterized in that: include: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the method for moving a device as claimed in any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores instructions, and when the instructions are executed on the terminal device, the terminal device executes the device movement method according to any one of claims 1 to 7.

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