Assembly for securing a vacuum sensor having a semiconductor housing in a surrounding device housing

Abstract

The invention relates to an assembly for securing a vacuum sensor having a semiconductor housing in a surrounding device housing, in particular a vacuum connecting flange, at least portions of the semiconductor housing being vacuum-tightly connected to adjoining portions of the device housing by means of an adhesive bond.

Description

[0001] Arrangement for mounting a vacuum sensor with a semiconductor package in a surrounding device housing

[0002] Description

[0003] The invention relates to an arrangement for fastening a vacuum sensor with a semiconductor housing in a surrounding device housing.

[0004] The components of vacuum sensors, such as MEMS chips from Pirani sensors or membranes with sensors mounted on them for their deformation, are often housed, especially in their miniaturized versions, in packages adapted from semiconductor technology. These packages are referred to below as semiconductor packages.

[0005] Such semiconductor packages are diverse and encompass a wide range of different designs, types, and classes. Some of these types and classes are known, among others, by the designations DO (diode outline), TO (transistor outline), SIP (single inline package), or DIP (dual inline package). Furthermore, the term "semiconductor package" will also be understood below to mean so-called SMDs. SMD packages are housings for surface mounting in which an electronic component is electrically contacted and attached directly to a printed circuit board as a so-called SMD package without wire connections. The term SMD stands for "surface mounted device." Also to be mentioned here are so-called hermetic packages, in particular hermetic transistor packages.

[0006] Semiconductor packages of the TO and DO variants are a package configuration borrowed from original transistor designs and diode construction, respectively. In the following, the terms "TO package" and "DO package" are understood to refer to general external semiconductor package shapes with a specific basic structure and a specific external contour. A TO package, for example, consists of a TO base, which serves as a carrier for the sensor components, and a TO lid, which covers the components located on the TO base in a dome-like manner. The TO lid has a TO front flank, which contains openings in at least some sections, enabling direct contact between the sensor components and the medium surrounding the vacuum sensor.The wiring is routed out of the TO socket on one side in the form of pins. This TO design enables a compact design of the vacuum sensor, thus making it particularly easy to handle and providing maximum protection for the sensor from external damage. The socket typically has a projection over the TO cover.

[0007] A DO housing is generally essentially cylindrical in shape. The wiring is routed out of the housing on both sides, along the cylinder axis. A base is not necessarily provided for the DO housing. The DO housing has no overhang and is purely cylindrical.

[0008] The structure of the other semiconductor packages is correspondingly variable.

[0009] For the actual installation of such a vacuum sensor housed in a semiconductor package, for example, in the area of ​​a recipient, a vacuum chamber, a container, and similar arrangements, a device housing is required that, on the one hand, protects the vacuum sensor and, on the other hand, stably anchors it in a defined position relative to the vacuum to be measured. The device housing is designed accordingly solidly and features the appropriate external connection means for securely attaching the device housing to the recipient, such as screw threads, clamps, bayonet connections, plug connections, and other similar coupling options.

[0010] Of particular importance is the secure fastening of the semiconductor housing of the vacuum sensor in the device housing itself. This fastening must be sufficiently stable and vacuum-tight and must not affect the functionality of the vacuum sensor or the purity of the overall system (e.g. through outgassing). It must also be adapted to the semiconductor housing used for the vacuum sensor. Typically, the entire vacuum sensor is fastened in a vacuum. The vacuum tightness and electrical contact are then made via a separate electrical vacuum feedthrough. Fastening by clamping is also possible. For example, to fasten a vacuum sensor with a TO housing in the device housing, a configuration is used in which the TO housing is clamped into the device housing.A constant clamping force and a sealing material located between the TO housing and an immediately adjacent contact surface of the device housing are intended to fix the TO housing in position and also achieve the required vacuum seal. The clamping effect is achieved by an arrangement consisting of a clamping plate that presses against the TO socket and is tightened using clamping screws. The TO front flank of the TO cover usually serves as the counterbearing. The TO front flank is pressed towards the base of a receptacle that accommodates the TO housing. A sealing material, such as an elastic O-ring, located between the base and the TO front flank absorbs the compressive force and simultaneously creates a seal.

[0011] The clamping plate mentioned above generally fulfills additional tasks in addition to its clamping function. In particular, it is designed as a circuit board for electronics that operate the sensor components of the pressure sensor system located within the TO housing.

[0012] This configuration, which is common in the state of the art, is problematic in several respects. Firstly, it cannot be ruled out that the clamping force acting on the TO package and the resulting pressure on the TO package could adversely affect both the sensor and the TO package. At the very least, care must be taken when installing the TO package in the device housing to ensure that the clamping force is not excessive. On the other hand, however, it is precisely the clamping force that ensures the vacuum tightness of the entire sensor system. Therefore, care must be taken to ensure that the clamping force is not too low. It goes without saying that this requires a certain amount of experience when installing the TO package in the device housing.

[0013] Furthermore, the clamped sealing material between the TO face and the base of the mounting bushing is subject to progressive fatigue over time. After a certain period of use of the vacuum sensor, leaks can no longer be ruled out with the necessary degree of certainty. To ensure operational reliability with the required measurement accuracy of the pressure sensor, regular maintenance work is required, which at least includes replacing the sealing material. This requires the removal and subsequent reinstallation of the TO housing, which must be carried out with the necessary care as described.

[0014] In addition, the sealing material clamped in this way has two significant vacuum-related disadvantages. Firstly, an elastomer-sealed connection cannot achieve a leak rate lower than 10 smbar l / s can be achieved. This is due to the physically limited permeation rate of the elastomer material. Furthermore, the material composition of the elastomer connectors is characterized by fluorine compounds, which impart important properties to the material. In vacuum applications, fluorine compounds can be released from the material and enter the actual vacuum process. As a result, unacceptable fluorine contamination can negatively impact the vacuum process and even lead to complete system failure.

[0015] Finally, the entire configuration is too complex and disadvantageous in terms of its effort and the arrangement of the required parts. The clamping plate and the clamping screws take up a relatively large amount of space. This limits the miniaturization of the entire arrangement. Furthermore, the clamping plate is somewhat of an intrusive component. It requires at least feedthroughs for the contacts and wiring of the sensor components in the TO housing. If the clamping plate also carries electronic components of the measurement sensors, corresponding wiring to the components within the TO housing is necessary. In the interest of a miniaturized design, this wiring is usually designed to be non-detachable because plug connections take up too much space. On the other hand, the TO housing with the sensor components and the connected electronics on the clamping plate cannot be replaced separately.Both components must then be replaced as a whole.

[0016] Finally, the electronics are located relatively close to the receiver and therefore at the point of pressure measurement itself. This means that the electronics and the processes in the receiver may influence each other, which at the very least distorts the pressure measurement result. However, for certain measurements, gases, and pressure conditions, electronics located so close to the receiver are undesirable. Although the electronics can then be located remotely rather than on the clamping plate, the clamping plate, as described above, limits the possible miniaturization of the pressure sensor itself.

[0017] The integration of a vacuum sensor into the respective device housing is correspondingly variable and diverse for other types and classes of semiconductor packages. For this purpose, appropriate sealing materials must be selected and adapted to the semiconductor package. The mechanical clamping devices and the wiring connection to the corresponding downstream electronics of the vacuum sensor must also be adapted individually. This requires considerable design effort with regard to each specific design of the respective semiconductor package.

[0018] The object is therefore to eliminate the disadvantages described and to create an arrangement for fastening a vacuum sensor with a semiconductor housing in a surrounding device housing, in which these disadvantages are avoided from the outset.

[0019] The object is achieved with an arrangement for fastening a vacuum sensor with a semiconductor housing in a surrounding device housing with the features of claim 1. The subclaims contain expedient and / or advantageous embodiments and configurations.

[0020] In the following, the term "semiconductor housing" refers to all housing forms commonly used for enclosing semiconductor components, provided they are used for a vacuum sensor.

[0021] The arrangement for fastening a vacuum sensor with a semiconductor housing in a surrounding device housing, in particular a vacuum connection flange, is designed according to the invention such that the semiconductor housing is connected in a vacuum-tight manner, at least in sections, to adjacent sections of the device housing by means of an adhesive bond. According to the invention, the semiconductor housing is thus glued into the surrounding device housing in the intended position. The adhesive bond ensures that the semiconductor housing is securely held in place within the device housing and also seals the area of ​​the installed semiconductor housing to the outside in a vacuum-tight manner. A clamp connection and additional sealing means adapted to the respective structural design are therefore no longer required. The disadvantages associated with such a clamp connection and mentioned at the beginning are therefore completely eliminated.This allows the vacuum sensor's wiring to be easily routed out of the surrounding device housing, eliminating the space otherwise required for clamping devices, and allowing the device housing to be reduced in size accordingly. Furthermore, leak rates of less than ICT are possible. 9 mbar I / s can be achieved. These are thus an order of magnitude lower than when using mechanical elastomer seals.

[0022] In a first embodiment, the arrangement for mounting a vacuum sensor is a semiconductor package in the form of a TO package in a device housing. The TO package consists of a TO base and a TO cover, and the surrounding device housing, which is in particular a vacuum connection flange, is designed according to the invention such that the TO package is connected in a vacuum-tight manner, at least in sections, to adjacent sections of the device housing by means of an adhesive bond.

[0023] In one embodiment of the arrangement, the TO housing is inserted into a receiving socket of the device housing via its TO cover, wherein the adhesive connection is provided between a lateral surface of the TO cover and the inner wall of the receiving socket.

[0024] In a further embodiment, the TO housing is inserted into the receiving socket of the device housing via its TO cover, wherein the adhesive connection is provided between a TO socket flank of the TO socket and a corresponding section of the inner wall of the receiving socket.

[0025] In a further embodiment, the TO housing is inserted into the receiving socket of the device housing via its TO cover, wherein the adhesive connection is provided between a TO shoulder of the TO socket and a step-shaped formation of the receiving socket.

[0026] Finally, in another embodiment, the adhesive bond is provided as a vacuum-tight filler that continuously covers the contact surface between the outer surface of the TO cover and the inner wall of the receptacle, as well as between the TO socket flank and the TO shoulder of the TO socket and the corresponding contact surfaces of the receptacle. In this embodiment, the TO housing is cast into the intended mounting location via the adhesive bond.

[0027] In a further embodiment, the semiconductor package is an SMD package mounted directly on a circuit board with a housing body accommodating the vacuum sensor. The adhesive connection is formed between the housing body and the receiving socket of the device housing.

[0028] In a further embodiment, the semiconductor housing is a protrusion-free TO or DO housing with a straight lateral surface, wherein the adhesive connection is formed in the region of the surface and / or the end face of the semiconductor housing.

[0029] In a further embodiment, the adhesive connection is formed in the region of a wiring of the semiconductor housing and a mechanical guide means of the wiring.

[0030] In another embodiment, the semiconductor package is a hermetic transistor package. These are, in particular, semiconductor packages made of a ceramic or metallic material with increased pressure and temperature resistance.

[0031] The arrangement according to the invention will be explained in more detail below using exemplary embodiments. The attached figures serve to illustrate this.

[0032] It shows: Fig. 1 a known and usual basic structure of a TO housing of a vacuum sensor,

[0033] Fig. 2 shows a conventional clamping connection between the TO housing and a device housing,

[0034] Fig. 3 shows a first exemplary embodiment of the invention with an adhesive bond between the outer surface of the TO cover and the inner wall of the receiving socket,

[0035] Fig. 4 shows an exemplary embodiment with an adhesive connection between a TO shoulder of the TO socket and a step-shaped formation of the receiving socket,

[0036] Fig. 5 shows an embodiment with a TO housing protruding from the receiving socket of the device housing,

[0037] Fig. 6 shows an exemplary embodiment with an adhesive bond as a vacuum-tight filling between the TO housing and the receiving socket,

[0038] Fig. 7 is a plan view of several TO packages inserted into a common device housing and secured by adhesive bonding,

[0039] Fig. 8 a vacuum sensor with an SMD housing and the corresponding connection components,

[0040] Fig. 9 shows an example of the installation of the vacuum sensor with SMD housing into a surrounding device housing,

[0041] Fig. 10 shows a vacuum sensor with a purely cylindrical semiconductor housing, in particular a DO housing, without any projection in a device housing with an adhesive connection in the jacket area, Fig. 11 shows a vacuum sensor with a purely cylindrical semiconductor housing, in particular a DO housing, without any projection in a device housing with an adhesive connection in the front area,

[0042] Fig. 12 shows an example of an adhesive connection in the area of ​​the wiring of the vacuum sensor.

[0043] Fig. 1 shows a conventional structure of a TO housing for a vacuum sensor, as is known from the prior art. The vacuum sensor 1 is only indicated in this example. This could, for example, be a MEMS chip for a Pirani pressure sensor. The MEMS chip is located in a TO housing 2, consisting of a TO socket 3, which serves as a carrier and contacting base for the MEMS chip. The TO socket has wiring 3a via which the vacuum sensor can be connected to an evaluation electronics. Also provided is a TO cover 6, which at least partially covers the area of ​​the MEMS chip in the direction of the vacuum to be measured. The TO cover has an opening (not shown here) through which the vacuum sensor is in contact with the medium to be measured in the recipient.

[0044] The TO socket 3 has a TO socket flank 5 and a TO shoulder 4. The TO cover 6 contains a TO shell surface 7 and a TO end surface 8. The aforementioned opening for the medium to enter the vacuum sensor is usually located in the TO end surface.

[0045] The TO housing itself is vacuum-tight; the individual components of the TO housing, i.e., the TO socket and the TO lid, are usually welded or soldered together. Crimp connections and other similar vacuum-tight connections are also possible.

[0046] Fig. 2 shows a conventional clamp connection between a TO housing and a surrounding device housing, known from the prior art, in a sectional view and a top view. The TO housing 2 corresponds in its structure to the illustration in Fig. 1 and is additionally highlighted by hatching. The device housing 9 surrounds the TO housing inserted therein. The TO housing 2 is inserted into a receiving socket 10 of the device housing. The receiving socket 10 has a socket base 11. The socket base 11 contains bores 12 to ensure the connection between the vacuum in the volume of the recipient to be measured and the TO housing 2 and ultimately the vacuum sensor. Between the socket base 11 and the TO end face 8 of the TO housing there is a sealant in the form of an elastic O-ring 13. This also serves as a spacer between the socket base 11 and the TO end face 8.

[0047] The TO package 2 is clamped into the receiving socket 10 of the device housing 9. This is achieved by a clamping plate 14, which exerts a compressive force on the back of the TO socket of the TO package 2. Clamping screws 15 are provided to generate the compressive force. These screws are guided through corresponding holes in the clamping plate 14 and screwed into threaded holes 16 in corresponding sections of the device housing 9. The socket base 11 and the O-ring 13 serve as abutments for the clamping force exerted on the TO package.

[0048] The following embodiments represent a series of exemplary adhesive bonds between a semiconductor housing on the one hand and a device housing on the other.

[0049] It should be emphasized that the following exemplary embodiments are not intended to be limiting. In principle, it is possible to mount semiconductor packages of various designs and configurations in the device housing using the means explained below. Possible semiconductor package designs include transistor outline packages (TO), diode outline packages (DO), surface-mounted device (SMD) packages, and hermetic transistor packages (HTP).

[0050] Hermetic transistor packages are specifically designed for higher pressure and temperature resistance and are made of ceramic and / or metallic materials. A distinction is made between multilayer ceramic packages, pressed ceramic packages, and metal can packages.

[0051] First, we will assume the use of a TO housing as an example. Fig. 3 shows a first exemplary embodiment of the invention with an adhesive bond between the outer surface of the TO cover and the inner wall of the receptacle. For clarity, the adhesive bond is shown below only on one side. However, it is clear that the adhesive bond is expediently implemented around the entire periphery of the corresponding sections.

[0052] The TO housing 2 is highlighted by hatching in the illustration in Fig. 3. Here, the TO housing 2 again consists of the TO socket 3 and the TO cover 6. The device housing 9 contains the receptacle 10. The TO housing 2 is inserted into the receptacle along the TO cover 6. The TO cover 6 has a peripheral surface 7. This surface is located directly opposite an inner wall 10a of the receptacle 10.

[0053] In the area of ​​the TO socket 3, the TO socket has a socket flank 5. The socket flank 5 is located, with the TO housing inserted into the receptacle 10, directly opposite a section 10b of the inner wall 10a of the receptacle 10. The gap between the opposing sections 7 and 10a and 5 and 10b is filled with an adhesive, so that an adhesive bond 17 is formed between each of these sections. The adhesive bond covers the entire circumference of the outer surface 7 and the inner wall 10a as well as the socket flank 5 and section 10b of the inner wall of the receptacle. The adhesive thus completely fills the gap in these areas and seals this gap vacuum-tight, whereby the TO housing is securely and stably anchored in the receptacle.

[0054] In the example shown in Fig. 3, an adhesive bond is provided both between the TO socket and the receptacle, and between the TO cover and the receptacle. It is clear that one of the adhesive bonds can be omitted here, as long as the TO housing is anchored in the receptacle in a stable and vacuum-tight manner.

[0055] Thanks to the adhesive bond, a bushing base serving as a counter-bearing for the receiving bushing is no longer required. The entire surface of the TO face 8 is thus completely exposed, and the vacuum sensor in the TO housing is thus maximally accessible to the medium in the container to be measured.

[0056] Fig. 4 shows an exemplary embodiment with an adhesive bond between a TO shoulder of the TO socket and a stepped recess of the receptacle. For clarity, the adhesive bond has been shown on only one side. The adhesive bond is, of course, applied over the entire periphery of the TO shoulder and the recess.

[0057] The embodiment in Fig. 4 takes advantage of the fact that the diameter of the TO socket 3 is larger than that of the TO lid, and the TO socket thus has the TO shoulder 4. The TO shoulder 4 on the TO socket 3 rests on a recess 18 on the connection socket 10. The contact surface thus formed is wetted with an adhesive, so that the adhesive connection 17 is formed in this area. It is clear that the adhesive connection covers the entire periphery of the projection 3b and the recess 18, so that the adhesive connection is vacuum-tight.

[0058] The adhesive connection between the TO shoulder 4 and the formation 18 enables a space-saving and material-reduced design of the device housing 9, in particular a tightly dimensioned dimensioning of the receiving socket.

[0059] Fig. 5 shows an example of a reduced-depth receptacle 10, in which the TO housing 2 with its TO cover 6 and the TO face 8 protrudes from the device housing into the vacuum to be measured, thus being maximally exposed. The adhesive bond between the TO shoulder 4 and the recess 18 is located inside the device housing in a location not exposed to the vacuum, but always ensures a secure, vacuum-tight anchoring of the TO housing in the device housing.

[0060] Fig. 6 shows an example in which the adhesive bond 17 covers and completely fills all contact areas between the TO housing 2 and the receiving socket 10 of the device housing 9. The adhesive bond 17 is designed here as a filler that completely closes the gap between the TO housing and the receiving socket. It completely covers the part of the outer surface 7 of the TO cover 6 located within the receiving socket, the inner wall 10a of the receiving socket, the TO base 3 at its base flank 5, and the corresponding section 10b of the receiving socket, as well as the TO shoulder 4 and the recess 18. With such a filling, the TO cover of the TO housing 2 can protrude from the receiving socket 10 in the region of the TO end face 8 into the vacuum region.

[0061] Fig. 7 shows a top view of several TO housings 2 inserted into a common device housing 9 and secured by adhesive bonds. In this example, the device housing 9 has two receptacles 10, into each of which a TO housing 10 is inserted and secured therein in a vacuum-tight manner by means of the adhesive bond 17. It is understood that the number of individual receptacles in the device housing 9 can be any desired number.

[0062] Adhesive bonding offers a number of advantageous properties. In particular, bonding is possible on almost all surfaces / geometries. This allows for the simple attachment of highly variable semiconductor packages. With adhesive bonds, force vectors do not need to be considered. Furthermore, an adhesive bond serves as both a sensor mount and sensor attachment, as well as a sensor seal, all in one. This allows for more freedom and greater flexibility in the design of the device housing. This can be used for miniaturization, component savings, and / or to reduce manufacturing costs. Furthermore, an adhesive bond allows for easy adaptation and application to any vacuum sensor geometry, i.e., to a wide variety of different semiconductor packages.

[0063] The adhesive bond described ensures a secure seal even on undefined surfaces or surfaces with generous or uncertain dimensional tolerances. In addition, adhesive bonds designed in this way ensure improved force transmission to the semiconductor package. This prevents unfavorable, one-sided, and excessive force vectors on the package and prevents damage. The bonding process itself can take place at sufficiently low temperatures, at which the components of the vacuum sensor located in the TO package, in particular a MEMS chip arranged there, are not damaged and a vacuum seal is created. The use of epoxy resin adhesives or polymer adhesives is possible here. Furthermore, the adhesive used is characterized by its absence of fluorine compounds. This prevents unwanted contamination of the process vacuum.

[0064] The embodiments shown below relate to semiconductor packages in further configurations.

[0065] Fig. 8 shows an example of a vacuum sensor with an SMD package. In this example, the vacuum sensor 1 is a MEMS chip with a surrounding SMD package 19, which, on the one hand, protects the MEMS chip from external damage and, on the other hand, has an access opening 20 that enables the MEMS chip to be connected to the surrounding vacuum to be measured. According to the basic structure of an SMD configuration, the MEMS chip and the package are mounted directly on a circuit board 21, which generally contains additional electronic components for operating the MEMS chip. Contacting the structure consisting of the SMD package and external components is achieved via pins 22 on the circuit board 21.

[0066] Fig. 9 shows an example of the SMD vacuum sensor from Fig. 8 installed in an external device housing 9. The SMD vacuum sensor is inserted via its package 19 into a designated receptacle 10 of the device housing 9 and glued in place with vacuum-tight adhesive joints 17. In this example, the adhesive joints are located in the area of ​​the access opening 20 and in the area of ​​the upper section of the receptacle 10 in the direction of the printed circuit board 21. It is clear that the adhesive joint can basically be provided at any contact point between the package and the receptacle.

[0067] Fig. 10 and Fig. 11 show exemplary installation situations for a generally cylindrical sensor housing 23 without overhang in the area of ​​a base in the surrounding device housing 9. This can be, for example, a DO housing or a modified TO housing from one of the previously mentioned embodiments.

[0068] The cylindrical sensor housing 23 is inserted into a receiving socket 10 and, as shown in Fig. 10, is vacuum-tightly bonded to the inside of the receiving socket 10 in the area of ​​the outer surface with an adhesive bond 17. In the example shown in Fig. 11, the adhesive bond 17 is arranged in the area of ​​the end face of the cylindrical semiconductor housing.

[0069] It is obvious that an adhesive connection 17 arranged on the end face can also be arranged in all of the previously explained embodiments, provided that the receiving bush is designed accordingly and provided that such an adhesive connection on the end face is desired or necessary.

[0070] Fig. 12 shows an exemplary adhesive connection in the area of ​​the wiring of the vacuum sensor. This exemplary embodiment is illustrated here using a TO housing 2 from one of the preceding embodiments. However, it is not limited to a TO housing, but can also be applied analogously to other semiconductor housings of any type. The structure shown in Fig. 12 includes a guide means for the wiring 3a of the TO housing in the form of a guide plate 24, which is provided with feedthroughs 25 for the wiring 3a, i.e., at least for pins present in the area of ​​the TO housing. The guide plate exerts no force-fit or clamping effect on the semiconductor housing. It merely defines an area for the adhesive connection 17.In the present example, the adhesive bond 17 is provided between the guide plate 24 and the underlying section of the semiconductor package, in this case the TO socket 3. In addition, in this example, the adhesive bond also surrounds the flanks of the guide plate 24 and its upper side as a type of potting material.

[0071] The previously described embodiments can also be applied accordingly to semiconductor packages for vacuum sensors embodied as a hermetic transistor package (HST). In principle, an HST package does not differ fundamentally from the other semiconductor packages described above, in particular not in its shape, but initially only in the material used. Provided the material of the hermetic transistor package interacts advantageously with an adhesive, vacuum sensors in HST packages can be inserted into external device housings in the same way, in particular into device housings of the previously described shapes. It is obvious that the various exemplary configurations of the adhesive bonds can be combined with one another, thus enabling further designs.

[0072] The invention has been explained using exemplary embodiments. Further refinements are possible within the scope of one skilled in the art. Further embodiments are also apparent from the dependent claims.

[0073] List of reference symbols

[0074] 1 vacuum sensor, indicated

[0075] 2 TO housings

[0076] 3 TO sockets

[0077] 3a Wiring

[0078] 4 TO paragraph

[0079] 5 TO socket flank

[0080] 6 TO covers

[0081] 7 TO shell surface

[0082] 8 TO face

[0083] 9 Device housing

[0084] 10 socket

[0085] 10a interior wall

[0086] 10b Inner wall in the area of ​​the TO socket

[0087] 11 Bushing base

[0088] 12 holes

[0089] 13 O-ring

[0090] 14 clamping plate

[0091] 15 clamping screw

[0092] 16 threaded holes

[0093] 17 Adhesive bond

[0094] 18 Formation

[0095] 19 SMD package

[0096] 20 Access opening

[0097] 21 Circuit board

[0098] 22-pin

[0099] 23 Cylindrical sensor housing 24 Guide plate

[0100] 25 Implementation

Claims

Claims 1. Arrangement for fastening a vacuum sensor (1) with a semiconductor housing in a surrounding device housing (9), in particular a vacuum connection flange, wherein the semiconductor housing is connected at least in sections to adjacent sections of the device housing (9) by means of an adhesive connection (17) in a vacuum-tight manner.

2. Arrangement according to claim 1, characterized in that the semiconductor housing is a TO housing (2) consisting of a TO base (3) and a TO cover (6), wherein the TO housing (2) is connected at least in sections to adjacent sections of the device housing (9) by means of an adhesive connection (17) in a vacuum-tight manner.

3. Arrangement according to claim 2, characterized in that the TO housing (2) is inserted via its TO cover (6) into a receiving socket (10) of the device housing (9), wherein the adhesive connection (17) is provided between a jacket surface (7) of the TO cover (6) and the inner wall (10a) of the receiving socket (10).

4. Arrangement according to claim 2 or 3, characterized in that the TO housing (2) is inserted into the receiving socket (10) of the device housing (9) via its TO cover (6), wherein the adhesive connection (17) is provided between a TO socket flank (5) of the TO socket (3) and a corresponding section (10b) of the inner wall (10a) of the receiving socket (10).

5. Arrangement according to one of claims 2 to 4, characterized in that the TO housing (2) is inserted into the receiving socket (10) of the device housing (9) via its TO cover (6), wherein the adhesive connection (17) is provided between a TO shoulder (4) of the TO base (3) and a step-shaped formation (18) of the receiving socket (10).

6. Arrangement according to one of claims 2 to 5, characterized in that the adhesive connection (17) is provided as a vacuum-tight filling continuously covering the contact surface between the outer surface (7) of the TO cover (6) and the inner wall (10a) of the receiving socket (10) and between the TO socket flank (5) and the TO shoulder (4) of the TO socket (3) and the corresponding contact surfaces of the receiving socket (10).

7. Arrangement according to claim 1, characterized in that the semiconductor housing (1a) is an SMD package (19) which sits directly on a printed circuit board (21) and accommodates the vacuum sensor (1), the adhesive connection (17) being formed between the SMD package and the receiving socket (10) of the device housing (9).

8. Arrangement according to claim 1, characterized in that the semiconductor housing is a protrusion-free cylindrical housing, in particular a TO or DO housing, with a straight lateral outer surface, wherein the adhesive connection (17) is formed in the region of the outer surface and / or the end face of the semiconductor housing.

9. Arrangement according to one of the preceding claims, characterized in that the adhesive connection (17) is formed in the region of a wiring (3a) of the semiconductor housing and a mechanical guide means of the wiring.

10. Arrangement according to one of the preceding claims, characterized in that the semiconductor package is a hermetic transistor package.

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