Printed circuit board

Abstract

A printed circuit board according to an embodiment of the present invention includes: a first substrate; a second substrate spaced apart from the first substrate in the direction of the top surface of the first substrate; a third substrate arranged between the first substrate and the second substrate in a direction perpendicular to the top surface of the first substrate; a first connection part including a plurality of pins coupled to the top surface of the first substrate and one surface of the third substrate, respectively; and a second connection part arranged on the bottom surface of the second substrate and including a coupling groove coupled to the third substrate.

Description

printed circuit board

[0001] The present invention relates to a printed circuit board, and more specifically, to a printed circuit board that connects two substrates with a substrate.

[0002] Rapid chargers for electric vehicles support high-speed charging at hundreds of kilowatts. They consist of power modules with capacities of tens of kilowatts, connected in parallel, and output a large amount of power. When connected to an electric vehicle, the power modules receive AC power from the grid and output DC power to charge the electric vehicle's battery.

[0003] In order to perform power conversion within a power module, which includes several components, a means for transmitting signals or power between components mounted on different substrates is required.

[0004] The technical problem to be solved by the present invention is to provide a printed circuit board that connects two substrates with a substrate.

[0005] In order to solve the above technical problem, a printed circuit board according to an embodiment of the present invention includes a first substrate; a second substrate spaced apart from the first substrate in a direction of an upper surface of the first substrate; a third substrate disposed between the first substrate and the second substrate in a direction perpendicular to the upper surface of the first substrate; a first connecting portion including a plurality of pins respectively coupled to an upper surface of the first substrate and one surface of the third substrate; and a second connecting portion including a coupling groove disposed on a lower surface of the second substrate and coupled to the third substrate.

[0006] In addition, the first connecting portion may include a body portion in which the upper surface and the first surface of the first substrate are in contact with each other, and the one surface and the second surface of the third substrate are in contact with each other, and the first surface and the second surface of the body portion are perpendicular to each other, and the plurality of pins may include a plurality of first pins extending from the first surface; and a plurality of second pins extending from the second surface.

[0007] Additionally, the plurality of first pins may be electrically connected to the first substrate, the plurality of second pins may be electrically connected to the third substrate, and the plurality of first pins and the second pin may be electrically connected.

[0008] Additionally, the third substrate may include a protrusion inserted into the joining groove on one side facing the second substrate.

[0009] In addition, it includes a conductive pattern portion formed on one surface of the protrusion, and the conductive pattern portion can be inserted into the joining groove and electrically connected to the second substrate.

[0010] Additionally, the second connecting portion may include a plurality of second connecting portions spaced apart in the longitudinal direction of the one side of the third substrate.

[0011] Additionally, the plurality of second connecting portions may not be electrically connected to each other.

[0012] Additionally, the protrusion of the third substrate may include a guide groove, and the second connecting portion may include a guide protrusion inserted into the guide groove inside the joining groove.

[0013] In addition, the coupling groove of the second connecting portion includes a base; a side extending from the base, and an inner surface of a portion of an end of the side of the coupling groove may be inclined in a direction in which the cross-sectional area of ​​the coupling groove increases.

[0014] Additionally, a portion of the end of the protrusion of the third substrate may be inclined in a direction in which the cross-sectional area becomes narrower.

[0015] Additionally, an AC-DC rectifier may be arranged on the first substrate, a DC-DC converter may be arranged on the second substrate, and a signal line or power line between the first substrate and the second substrate may be arranged on the third substrate.

[0016] According to embodiments of the present invention, the substrates can be stably connected by connecting the substrates with each other.

[0017] FIG. 1 illustrates a printed circuit board according to one embodiment of the present invention.

[0018] Figures 2 to 9 are drawings for explaining a printed circuit board according to an embodiment of the present invention.

[0019] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0020] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0021] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0022] Additionally, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0023] In this specification, the singular may also include the plural unless specifically stated otherwise in the phrase, and when it is described as “A and / or at least one (or more) of B, C”, it may include one or more of all combinations that can be combined with A, B, C.

[0024] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and are not intended to limit the nature, order, or sequence of the components.

[0025] And, when a component is described as being 'connected', 'coupled', or 'connected' to another component, it may include not only cases where the component is 'connected', 'coupled', or 'connected' directly to the other component, but also cases where the component is 'connected', 'coupled', or 'connected' by another component between the component and the other component.

[0026] Additionally, when described as being formed or arranged "above" or "below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when expressed as "above" or "below," the meaning may include not only the upward direction but also the downward direction based on one component.

[0027] Fig. 1 illustrates a printed circuit board according to one embodiment of the present invention. The printed circuit board according to one embodiment of the present invention includes a first substrate (110), a second substrate (120), and a third substrate (130), and may include a first connecting portion (150) and a second connecting portion (140).

[0028] A printed circuit board according to an embodiment of the present invention may be mounted on a power conversion device, and the power conversion device may be a power conversion device of an electric vehicle charging device. Here, the power conversion device may be a power module of the electric vehicle charging device. The power module may receive AC power from a grid (50 / 60 Hz), convert it into DC power for charging an electric vehicle battery, and output it. Alternatively, the power module may receive DC power from an energy storage system (ESS), convert it into DC power for charging a battery, and output it. Power may be received from an external power source such as a solar power generation module. The power module may include an AC-DC rectifier and a DC-DC converter, and the power conversion device according to an embodiment of the present invention may include an isolated DC-DC converter or a non-isolated converter. Among the isolated DC-DC converters, the power module may include a PSFB (Phase Shift Full Bridge) converter, an LLC resonant converter, a CLLC resonant converter, and a DAB (Dual Active Bridge) converter. Non-isolated DC-DC converters may include buck converters, boost converters, and buck-boost converters.

[0029] The first substrate (110) and the second substrate (120) may be printed circuit board (PCB) substrates in a plate shape and may be rigid substrates. The first substrate (110) and the second substrate (120) may face each other and be spaced apart from each other. The second substrate (120) may be spaced apart from the first substrate (110) in the upper surface direction of the first substrate (110).

[0030] The third substrate (130) may be a PCB (Printed Circuit Board) substrate in a plate shape, and may be a rigid substrate. The third substrate (130) may be disposed between the first substrate (110) and the second substrate (120), and may be disposed between the first substrate (110) and the second substrate (120) in a direction perpendicular to the upper surface of the first substrate (110). The distance between the first substrate (110) and the second substrate (120) may correspond to the height at which the third substrate (130) is erected. The third substrate (130) may electrically connect the first substrate (110) and the second substrate (120), and a signal line or a power line may be disposed between the first substrate (110) and the second substrate (120). Conductive patterns can be formed or components can be mounted on the surfaces of one or both sides of the first substrate (110), the second substrate (120), and the third substrate (130). A conductive pattern can be formed on the third substrate (130), and various connection patterns can be formed using the conductive pattern, thereby increasing the degree of design freedom in the connection between the first substrate (110) and the second substrate (120). The first substrate (110) and the second substrate (120) can be connected more simply and firmly than a connection using wires.

[0031] The first connecting portion (150) may include a plurality of pins (152, 153) that are respectively coupled to the upper surface of the first substrate (110) and one surface of the third substrate (130). The first connecting portion (150) may support the third substrate (130) so that the third substrate (130) may be vertically arranged on the upper surface of the first substrate (110). To this end, the first connecting portion (150) may include a body portion (151) and a plurality of pins (152, 153). The first connecting portion (150) may be formed in the shape of a pin header, as shown in FIG. 6, or may be formed in the shape of an angle type pin header, and may be coupled to the first substrate (110) and the third substrate (130) in a Through-Hole Type (THT) manner rather than a Surface Mount Type (SMT) manner in order to increase the support force of the third substrate (130). The first substrate (110) and the third substrate (130) may also be coupled in a Surface Mount Type (SMT) manner.

[0032] The body part (151) can have a first surface in contact with the upper surface of the first substrate (110), and a second surface in contact with one surface of the third substrate (130). The body part (151) can have a first surface in contact with the first substrate (110) to support the third substrate (130), and a second surface perpendicular to the first surface can be fixed in contact with the third substrate (130) so that the third substrate (130) can be supported perpendicular to the first substrate (110). The body part (151) can have a predetermined length in the longitudinal direction. The area of ​​the body part (151) in contact with the third substrate (130) can be formed long so that the body part (151) supports the third substrate (130).

[0033] The plurality of pins may include a plurality of first pins (152) extending from a first surface of the body portion (151) toward an upper surface of the first substrate (110) and a plurality of second pins (153) extending from a second surface of the body portion (151) toward one surface of the third substrate (130). The body portion may be coupled to the substrate through the plurality of pins. The plurality of pins include conductive pins, and the first substrate (110) and the third substrate (130) may be electrically connected through the plurality of pins. The plurality of first pins (152) may be electrically connected to the first substrate (110), the plurality of second pins (153) may be electrically connected to the third substrate (130), and the plurality of first pins (152) and the plurality of second pins (153) may be electrically connected inside the body portion (151). A plurality of first pins (152) and a plurality of second pins (153) can be connected inside the body (151) and formed as one body.

[0034] The second connecting portion (140) may include a connecting groove (141) arranged on the lower surface of the second substrate (120) to be coupled with the third substrate (130). The second connecting portion (140) may be arranged in the lower direction of the second substrate (120) so that the third substrate (130) arranged vertically to the first substrate (110) and the second substrate (120) may be coupled. The second connecting portion (140) may include a connecting groove (141) so that it may be connected to a side surface connecting one surface and the other surface of the third substrate (130). The connecting groove (141) may have a width corresponding to the thickness of the third substrate (130) so that a portion of the third substrate (130) may be inserted therein. The second connecting portion (140) may be formed in the shape of a card edge connector, as shown in FIG. 5.

[0035] The third substrate (130) may include a protrusion (131) that is inserted into a joining groove (141) on one side facing the second substrate (120). The protrusion (131), but not the entire side of the third substrate (130), may be inserted into and connected to the joining groove (141) of the second connecting portion (140) formed on the lower surface of the second substrate (120).

[0036] The third substrate (130) may include a conductive pattern portion (132) formed on one surface of the protrusion (131). A conductive connection portion may be included on the inner surface of the joining groove (141) in an area where the conductive pattern portion (132) is positioned when joined with the protrusion (131) of the third substrate (130). The conductive connection portion of the second connecting portion (140) may extend from the inner surface of the joining groove (141) to the lower surface of the second substrate (120) and be electrically connected to the lower surface of the second substrate (120). The conductive pattern portion (132) may be inserted into the joining groove (141) and electrically connected to the second substrate (120) through the conductive connection portion of the second connecting portion (140).

[0037] The coupling groove (141) of the second connecting portion (140) includes a base and a side extending from the base, and an inner surface (142) of a portion of an end of the side of the coupling groove can be inclined in a direction in which the cross-sectional area of ​​the coupling groove increases. By forming the inlet portion of the coupling groove (141) to be inclined, the protrusion (131) of the third substrate (130) can be guided to be inserted into the inside of the coupling groove (141) of the second connecting portion (140). The end portion (132) of the protrusion (131) of the third substrate (130) can be inclined in a direction in which the cross-sectional area decreases. As shown in Fig. 4, the end portion (132) of the protrusion (131) of the third substrate (130) can be formed to have a narrow cross-sectional area so that the protrusion (131) can be easily inserted into the inlet portion of the coupling groove (141).

[0038] The third substrate (130) can be inserted and joined in a direction in which the protrusion (131) on which the conductive pattern portion (132) is formed is inserted into the joining groove (141) of the second connecting portion (140), as shown in Fig. 5. The protrusion (131) of the third substrate (130) can be fitted into the joining groove (141) of the second connecting portion (140).

[0039] The protrusion (131) of the third substrate may include a guide groove (133). The protrusion (131) of the third substrate (130) may include a guide groove (133) so that the connection direction of the third substrate (130) and the joining groove (141) of the second connecting portion (140) is not reversed. The guide groove (133) may be formed offset from the center of the protrusion (131) to one of the two edges. The side of the joining groove of the second connecting portion (140) may be inserted into the guide groove (133) of the protrusion (131). Alternatively, the second connecting portion (140) may include a guide protrusion (not shown) inserted into the guide groove (133) of the protrusion (131) on the inside of the joining groove (141). The guide groove (133) of the protrusion (131) and the guide protrusion of the joining groove (141) or the side of the joining groove (141) can be combined to guide the connection direction and ensure stable connection through insertion.

[0040] The second connecting portion (140) may include a plurality of second connecting portions (141, 142) spaced apart in the longitudinal direction of the one side of the third substrate (130). The plurality of second connecting portions may include two second connecting portions (141, 142), and three or more may be formed. As shown in Fig. 7, the plurality of second connecting portions (141, 142) may be spaced apart from each other and may be firmly connected to the third substrate (130) from both sides, and a plurality of passages may be formed through which the third substrate (130) and the second substrate (120) are connected. At this time, the plurality of second connecting portions (141, 142) may not be electrically connected to each other, and the plurality of second connecting portions (141, 142) may be sufficiently spaced apart from each other to secure an insulating distance. A communication signal line can be connected through one of the second connectors (141, 142) and a power line can be connected through another second connector so that they do not affect each other. This can prevent noise from being generated in the signal line by the power line.

[0041] The third substrate (130) may be formed in a rectangular plate shape, depending on the position where it is coupled with the first substrate (110) and the position where it is coupled with the second substrate (120), and may have a length on one side where it is coupled with the second substrate (120) longer than the length on the other side where it is coupled with the first substrate (110). As shown in Fig. 7, the length on one side of the third substrate may be formed longer depending on the positions of the plurality of second connecting portions (141, 142) formed on the second substrate (120). The shape of the third substrate (130) may be formed in various forms in order to electrically connect the first substrate (110) and the second substrate (120).

[0042] The second connecting portion (140) may be formed as a floating type having a function of compensating for misalignment for ease of assembly. The second connecting portion (140) may include a fixed portion (143) that is fixedly combined with the lower surface of the second substrate (120) and a fixed groove (141) that is coupled with the third substrate (130), and a floating portion (144) that can move in a first left-right direction with respect to the fixed portion (143). The fixed portion (143) may be referred to as a fastened portion, and the floating portion (144) may be referred to as a floating portion. As shown in FIG. 8, the second connecting portion (140) may be implemented as a floating type so that it can be coupled with the third substrate (130) not only when the third substrate (130) and the second connecting portion (140) are aligned but also when they are misaligned.

[0043] A first substrate (110), a second substrate (120), and a third substrate (130) can be combined as shown in FIG. 9. First, a second connecting portion (140) is mounted on the second substrate (120), a first connecting portion (150) is mounted on the third substrate (130), the first substrate (110) and the third substrate (130) are combined through the first connecting portion (150), and the third substrate (130), which is combined with the first substrate (110), can be combined with the second substrate (120) through the second connecting portion (140). Through this, the first substrate (110), the second substrate (120), and the third substrate (130) can be electrically connected.

[0044] According to an embodiment of the present invention, components of a power module may be mounted separately on a printed circuit board. An AC-DC rectifier may be placed on a first substrate (110), and a DC-DC converter may be placed on a second substrate (120). An AC-DC rectifier may be placed on the first substrate (110), and a DC-DC converter may be placed on the second substrate (120). A signal line or power line between the first substrate (110) and the second substrate (120) may be placed on a third substrate (130).

[0045] As described above, by connecting the two substrates with a substrate, signal lines or power lines can be freely designed through the conductive pattern of the substrate, and can be firmly fixed between the two substrates.

[0046] Those skilled in the art will appreciate that the present invention can be implemented in modified forms without departing from the essential characteristics of the above-described description. Therefore, the disclosed methods should be considered illustrative rather than restrictive. The scope of the present invention is set forth in the claims, not the foregoing description, and all differences within the scope equivalent thereto should be construed as being encompassed by the present invention.

Claims

1. First substrate; A second substrate spaced apart from the first substrate in the upper surface direction of the first substrate; A third substrate disposed between the first substrate and the second substrate in a direction perpendicular to the upper surface of the first substrate; A first connecting portion including a plurality of pins each coupled to the upper surface of the first substrate and one surface of the third substrate; and A printed circuit board including a second connecting portion including a joining groove arranged on a lower surface of the second substrate and joined to the third substrate.

2. In paragraph 1, The above first connecting part is, It includes a body part in which the upper surface and the first surface of the first substrate are in contact with each other, and the one surface and the second surface of the third substrate are in contact with each other, The first surface and the second surface of the above body part are perpendicular to each other, The above multiple pins are, a plurality of first pins extending from the first surface; and A printed circuit board comprising a plurality of second pins extending from the second surface.

3. In paragraph 2, The above plurality of first pins are electrically connected to the first substrate, The above plurality of second pins are electrically connected to the third substrate, A printed circuit board in which the plurality of first pins and the second pins are electrically connected.

4. In paragraph 1, The above third substrate, A printed circuit board including a protrusion inserted into the joining groove on one side facing the second substrate.

5. In paragraph 4, Including a conductive pattern portion formed on one surface of the above protrusion, A printed circuit board in which the above-mentioned conductive pattern portion is inserted into the above-mentioned joining groove and electrically connected to the above-mentioned second substrate.

6. In paragraph 4, The above second connecting part, A printed circuit board comprising a plurality of second connecting portions spaced apart in the longitudinal direction of the one side of the third substrate.

7. In paragraph 6, A printed circuit board wherein the plurality of second connectors are not electrically connected to each other.

8. In paragraph 4, The protrusion of the third substrate includes a guide groove, The above second connecting part A printed circuit board including a guide protrusion inserted into the guide groove inside the above-described joining groove.

9. In paragraph 4, The above-mentioned joining groove of the second connecting part is, a base; comprising a side extending from said base; A printed circuit board in which the inner surface of a portion of the end of the side of the above-mentioned joining groove is inclined in a direction in which the cross-sectional area of ​​the above-mentioned joining groove increases.

10. In paragraph 9, A printed circuit board in which a portion of the end of the protrusion of the third substrate is inclined in a direction in which the cross-sectional area becomes narrower.

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