Dimming device and dimming structure

Abstract

A dimming device and a dimming structure. The dimming device comprises a first substrate (11), a first adhesive layer (12), a dimming functional layer (13), a second adhesive layer (50) and a second substrate (41) which are sequentially stacked, and further comprises a rubber frame (20) arranged between the first substrate (11) and the second substrate (41) and surrounding the first adhesive layer (12), the dimming functional layer (13) and the second adhesive layer (50). The orders of magnitude of the thermal expansion coefficients of materials of the glue frame (20), the first adhesive layer (12) and the second adhesive layer (50) are all 10-4. The dimming device and the dimming structure can reduce or even avoid interface bubbles at the junction between the rubber frame (20) and the first adhesive layer (12) and the junction between the rubber frame (20) and the second adhesive layer (50), so that the step of printing black edges for masking can be omitted, and the problem of bubbles appearing in a display area is avoided.

Description

Light adjusting device and light adjusting structure TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of light adjusting, in particular to a light adjusting device and a light adjusting structure. BACKGROUND

[0002] Laminated glass is a composite glass product composed of two or more pieces of glass and one or more layers of organic polymer interlayer film between the glass. After special high-temperature pre-pressing (or vacuum extraction) and high-temperature and high-pressure process treatment, the glass and the interlayer film are permanently bonded. Laminated glass can withstand a certain amount of external impact or temperature difference changes without breaking. Even if it breaks, the fragments will stick to the interlayer film and are not easy to hurt people, thus having a certain safety. Therefore, laminated glass is widely used in the fields of building, transportation, etc.

[0003] SUMMARY

[0004] The present disclosure aims to at least solve one of the technical problems existing in the prior art, and proposes a light adjusting device and a light adjusting structure.

[0005] To achieve the above-mentioned purpose, the present disclosure provides a light adjusting device, comprising a first substrate, a first adhesive layer, a light adjusting functional layer, a second adhesive layer and a second substrate which are sequentially stacked; further comprising a glue frame, the glue frame is arranged between the first substrate and the second substrate, and surrounds the first adhesive layer, the light adjusting functional layer and the second adhesive layer.

[0006] The thermal expansion coefficient of the material of the glue frame, the thermal expansion coefficient of the material of the first adhesive layer and the thermal expansion coefficient of the material of the second adhesive layer are all of the order of magnitude of 10 -4 .

[0007] In some embodiments, the material of the glue frame is the same as the material of the first adhesive layer.

[0008] In some embodiments, the material of the first adhesive layer and the glue frame comprises polyvinyl butyral or ethylene-vinyl acetate copolymer.

[0009] In some embodiments, the material of the glue frame comprises polyvinyl butyral or ethylene-vinyl acetate copolymer.

[0010] The material of the second adhesive layer comprises optically transparent resin glue.

[0011] In some embodiments, the light adjusting device further comprises a third adhesive layer, the third adhesive layer is arranged between the first adhesive layer and the light adjusting functional layer, and is used to absorb the thermal stress of the first adhesive layer.

[0012] In some embodiments, the third adhesive layer is made of optical glue.

[0013] In some embodiments, the third adhesive layer has a thickness greater than or equal to 100 μm and less than or equal to 188 μm.

[0014] In some embodiments, the third adhesive layer has a coefficient of thermal expansion of the material in the order of 10 -4 and / or the third adhesive layer has an elastic modulus greater than or equal to 30 kPa and less than or equal to 40 kPa.

[0015] In some embodiments, the glue frame has at least one glue filling opening, a projection of the glue filling opening along a first direction at least partially overlaps with a projection of the second adhesive layer along the first direction; the first direction is perpendicular to a side of the glue frame where the glue filling opening is located.

[0016] The diameter of the glue filling opening is greater than or equal to 0.5 mm and less than or equal to 20 mm.

[0017] In some embodiments, the light control function layer comprises a first substrate layer, a dye liquid crystal layer, a second substrate layer and a frame sealant which are sequentially stacked, wherein the first substrate layer and the second substrate layer are oppositely arranged, the dye liquid crystal layer is arranged between the first substrate layer and the second substrate layer, the frame sealant is arranged between the first substrate layer and the second substrate layer and surrounds the dye liquid crystal layer; the dye liquid crystal layer comprises liquid crystal molecules, dye molecules and a plurality of spacer spacers.

[0018] In some embodiments, the width of the frame sealant is greater than or equal to 4 mm and less than or equal to 6 mm; and / or the distance between the outer peripheral edge of the frame sealant and the inner peripheral edge of the glue frame is greater than or equal to 1 mm and less than or equal to 1.5 mm.

[0019] In some embodiments, the height of the spacer is greater than or equal to 10 μm and less than or equal to 20 μm.

[0020] In some embodiments, the height of the spacer is greater than or equal to 10 μm and less than or equal to 15 μm.

[0021] In some embodiments, the distance between adjacent spacers is greater than or equal to 0.2 mm and less than or equal to 1 mm.

[0022] In some embodiments, the shape of the spacer comprises a truncated cone, the maximum radius of the truncated cone is greater than or equal to 12 μm and less than or equal to 17 μm; the minimum radius of the truncated cone is greater than or equal to 5 μm and less than or equal to 10 μm.

[0023] In some embodiments, the height of the light-adjusting functional layer is greater than or equal to 0.21 mm and less than or equal to 0.38 mm.

[0024] In some embodiments, the width of the glue frame is greater than or equal to 20 mm and less than or equal to 30 mm.

[0025] In some embodiments, the thickness of the first substrate and the second substrate is greater than or equal to 1.6 mm and less than or equal to 2.1 mm.

[0026] In some embodiments, the first substrate and the second substrate are a planar glass substrate, or a glass substrate with curvature in a first direction, or a glass substrate with curvature in a first direction and a second direction intersecting with each other.

[0027] In some embodiments, the curvature in the first direction is greater than or equal to 12 mm / m and less than or equal to 39 mm / m, and the curvature in the second direction is greater than or equal to 19 mm / m and less than or equal to 26 mm / m, the first direction and the second direction intersecting with each other.

[0028] As another technical solution, the embodiments of the present disclosure further provide a light-adjusting device, comprising a first substrate, a first adhesive layer, a light-adjusting functional layer and an explosion-proof stack arranged in sequence.

[0029] The explosion-proof stack comprises at least two explosion-proof layers and at least two second adhesive layers; the explosion-proof layers and the second adhesive layers are arranged alternately, and the second adhesive layer closest to the light-adjusting functional layer is located on the side of the explosion-proof layer closest to the light-adjusting functional layer.

[0030] In some embodiments, the material of the explosion-proof layer comprises plastic; and the material of the second adhesive layer comprises optical glue.

[0031] In some embodiments, the thickness of the explosion-proof stack is greater than or equal to 100 μm and less than or equal to 500 μm.

[0032] In some embodiments, the light-adjusting device further comprises a glue frame, the glue frame being located between the first substrate and the explosion-proof stack and surrounding the first adhesive layer and the light-adjusting functional layer.

[0033] As another technical solution, the embodiments of the present disclosure further provide a light-adjusting structure, comprising the above-mentioned light-adjusting device provided by the embodiments of the present disclosure; the light-adjusting structure comprises one of a curtain wall, a daylighting roof, a rail transit vehicle and a passenger car. BRIEF DESCRIPTION OF DRAWINGS

[0034] FIG. 1 is a structural diagram of a light-adjusting device in the related art;

[0035] FIG. 2 is a structural diagram of a dimming device, according to some embodiments;

[0036] FIG. 3 is another structural diagram of a dimming device, according to some embodiments;

[0037] FIG. 4 is a side structural diagram of a dimming device at a potting opening, according to some embodiments;

[0038] FIG. 5 is a top structural diagram of a dimming device at a potting opening, according to some embodiments;

[0039] FIG. 6 is a structural diagram of relative positions of a potting opening and a flexible circuit board, according to some embodiments;

[0040] FIG. 7 is another structural diagram of relative positions of a potting opening and a flexible circuit board, according to some embodiments;

[0041] FIG. 8 is another structural diagram of relative positions of a potting opening and a flexible circuit board, according to some embodiments;

[0042] FIG. 9 is a structural diagram of relative positions of a potting opening, a vent opening, and a flexible circuit board, according to some embodiments;

[0043] FIG. 10 is another structural diagram of relative positions of a potting opening, a vent opening, and a flexible circuit board, according to some embodiments;

[0044] FIG. 11 is a structural diagram of a baffle position, according to some embodiments;

[0045] FIG. 12 is another structural diagram of a dimming device, according to some embodiments;

[0046] FIG. 13 is a process diagram after making a glue frame, according to some embodiments;

[0047] FIG. 14 is a structural diagram of a dimming function layer, according to some embodiments;

[0048] FIG. 15 is a structural diagram of a spacer, according to some embodiments;

[0049] FIG. 16 is a structural diagram of a dimming function layer and a second function layer, according to some embodiments;

[0050] FIG. 17 is a process diagram after bonding a second substrate, according to some embodiments;

[0051] FIG. 18 is a structural diagram of a dimming device including a fourth adhesive layer, according to some embodiments;

[0052] FIG. 19 is a structural diagram of a fourth adhesive layer and a second substrate flush, according to some embodiments;

[0053] FIG. 20 is a structural diagram of a third functional layer according to some embodiments;

[0054] FIG. 21 is a structural diagram of forming a first light shielding layer and a second light shielding layer according to some embodiments;

[0055] FIG. 22 is a structural diagram of a light adjusting device including multiple light adjusting functional layers according to some embodiments;

[0056] FIG. 23 is a sectional view along the section line C-C in FIG. 22;

[0057] FIG. 24 is a structural diagram of a light adjusting device including a limiting strip according to some embodiments;

[0058] FIG. 25 is a sectional view along the section line D-D in FIG. 24;

[0059] FIG. 26 is a structural diagram of a limiting strip provided with a third opening according to some embodiments;

[0060] FIG. 27 is a sectional view along the section line E-E in FIG. 26;

[0061] FIG. 28 is a structural diagram of one of the explosion-proof laminates according to some embodiments;

[0062] FIG. 29 is a structural diagram of another of the explosion-proof laminates according to some embodiments;

[0063] FIG. 30 is a structural diagram of an automobile according to some embodiments. DETAILED DESCRIPTION

[0064] In order to make the purposes, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present disclosure.

[0065] The shapes and sizes of the components in the drawings do not reflect true proportions, and the purpose is only to facilitate the understanding of the contents of the embodiments of the present disclosure.

[0066] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the same meaning as commonly understood by one of ordinary skill in the art to which this present disclosure belongs. Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the same meaning as commonly understood by one of ordinary skill in the art to which this present disclosure belongs. The terms "first", "second" and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are used to distinguish different components. Similarly, the terms "one", "a" or "the" and similar terms do not denote a quantity of limitation, but denote the presence of at least one. The terms "include", "comprise" and similar terms mean that the elements or objects before the term encompass the elements or objects listed after the term and their equivalents, and do not exclude other elements or objects. The terms "connected" or "connected" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to represent relative positional relationships, and when the absolute positions of the described objects are changed, the relative positional relationships may also be changed accordingly.

[0067] The embodiments of the present disclosure are not limited to the embodiments shown in the drawings, but include modifications of the configuration formed based on the manufacturing process. Therefore, the regions illustrated in the drawings have a schematic property, and the shape of the regions shown in the drawings exemplifies a specific shape of the region of the element, but is not intended to be restrictive.

[0068] In the related art, referring to FIG. 1, the light adjusting device includes a first substrate 01, a first adhesive layer 02, a first functional layer 03, a second adhesive layer 05, and a second substrate 06 which are stacked, and a frame 04 which surrounds the first functional layer 03. For example, the first functional layer 03 is a dye liquid crystal light adjusting functional layer, the material of the first adhesive layer 03 is polyvinyl butyral (English: Polyvinyl Butyral), the material of the second adhesive layer 05 is optical clear resin (English: Optical Clear Resin, abbreviated: OCR), and the material of the frame 03 is RTV (English: room temperature vulcanized silicone rubber). The inventor found that interface bubbles are easily generated at the junctions of the frame 03 and the first adhesive layer 02 and the second adhesive layer 05, respectively, and need to be blocked by printing a black border, but the interface bubbles may have the risk of expanding to the display area over time.

[0069] To solve the above problems, referring to FIG. 2, the disclosure provides a light adjusting device, which comprises a first substrate 11, a first adhesive layer 12, a light adjusting functional layer 13, a second adhesive layer 50 and a second substrate 41 which are sequentially stacked; and a glue frame 20 which is arranged between the first substrate 11 and the second substrate 41 and surrounds the first adhesive layer 12, the light adjusting functional layer 13 and the second adhesive layer 50. In some embodiments, the first adhesive layer 12 bonds the first substrate 11 and the light adjusting functional layer 13, and the glue frame 20 bonds the first substrate 11 and the second substrate 41. The glue frame 20 and the light adjusting functional layer 13 abut.

[0070] In addition, the thermal expansion coefficient of the material of the glue frame 20, the thermal expansion coefficient of the material of the first adhesive layer 12 and the thermal expansion coefficient of the material of the second adhesive layer 50 are all of the order of magnitude of 10 -4 . The materials of the glue frame 20, the first adhesive layer 12 and the second adhesive layer 50 have the thermal expansion coefficient of the order of magnitude of 10 -4 , so that the difference in the interface thermal expansion amount of the glue frame 20 and the first adhesive layer 12 and the difference in the interface thermal expansion amount of the glue frame 20 and the second adhesive layer 50 can be reduced, and even the interface thermal expansion amount of the glue frame 20 and the first adhesive layer 12 and the interface thermal expansion amount of the glue frame 20 and the second adhesive layer 50 can be consistent or tend to be consistent, so that the interface bubbles at the junction of the glue frame 20 and the first adhesive layer 12 and the junction of the glue frame 20 and the second adhesive layer 50 can be reduced or even avoided, and the step of printing black edges to cover can be omitted, and the problem of bubbles in the display area does not exist.

[0071] In some embodiments, the material of the glue frame 20 is the same as the material of the first adhesive layer 12. In this way, the interface thermal expansion amount of the glue frame 20 and the first adhesive layer 12 can be consistent, and the order of magnitude of the interface thermal expansion amount of the glue frame 20 and the first adhesive layer 12 is 10 -4 , so that the interface bubbles at the junction of the glue frame 20 and the first adhesive layer 12 can be avoided. In addition, the consistency of the materials in the light adjusting device can be improved, and the preparation cost of the light adjusting device can be reduced. Furthermore, in the process of forming the light adjusting device, the material of the glue frame 20 penetrates into the first adhesive layer 12, the material of the first adhesive layer 12 penetrates into the glue frame 20, and the first adhesive layer 12 and the glue frame 20 become an integral whole, so that the glue frame 20 and the first substrate 11 are bonded more firmly.

[0072] Further optionally, the material of the first adhesive layer 12 and the glue frame 20 comprises polyvinyl butyraldehyde (English: PVB) or ethylene-vinyl acetate copolymer (English: EVA). The thickness of PVB ranges from 0.38mm to 0.76mm, the flow starting temperature is >90℃, the bonding temperature is >120℃, the Tr% (transmittance) is ≥85%, the Hz% (haze) is >0.6%, the ΔYI (yellowing index or yellowing rate or yellowing index) is ≤10, and the 400nm UV light cutoff rate is ≥99%; PVB can filter out UV light below 400nm, thereby protecting the dye in the dye liquid crystal from being damaged, so as to avoid insufficient blackness of the dye. The thickness of EVA ranges from 0.38mm to 0.76mm, the flow starting temperature is >80℃, the bonding temperature is >100℃, the Tr% (transmittance) is >85%, the Hz% (haze) is >0.6%, and the 380nm UV cutoff rate is ≥98%; EVA glue can filter out UV light below 400nm, thereby protecting the dye in the dye liquid crystal from being damaged, so as to avoid insufficient blackness of the dye.

[0073] In some embodiments, on the basis that the material of the glue frame 20 comprises PVB or EVA, the material of the second adhesive layer 50 comprises optical clear resin (English: OCR). Exemplarily, the thickness of OCR ranges from 0.2mm to 5mm, the curing condition is 60℃-80℃ for 15min-30min, the Tr% (transmittance) is >99%, the Hz% (haze) is <0.2, the ΔYI (yellowing index or yellowing rate or yellowing index) is <0.2, the Tg (the temperature at which OCR changes from glass state to viscous state) is -38.9℃, the shrinkage rate is <0.1%, and after curing, it is a colorless transparent solid without UV light cutoff function.

[0074] The interface thermal expansion amount of the above-mentioned glue frame 20 and the second adhesive layer 50 is of the order of 10 -4, so as to avoid interface bubbles at the junction of the frame 20 and the second adhesive layer 50. On this basis, by arranging the first adhesive layer 12 on one side of the light-adjustable functional layer 13 and made of PVB or EVA, the thermal stress of the first adhesive layer 12 can be effectively released, avoiding affecting the light-adjustable functional layer 13, so that the internal and external pressure of the light-adjustable functional layer 13 is balanced, and in combination with the second adhesive layer arranged on the other side of the light-adjustable functional layer 13, since the material of the second adhesive layer is OCR, it has fluidity and can be heat-cured, and the OCR (the thermal shrinkage rate is only 0.01, unit: 1 / MPa) has little effect on the surface shrinkage stress of the light-adjustable functional layer 13 during heat curing, and the OCR with fluidity has good effect on spherical filling, thereby having large-size processing feasibility. In addition, the frame 20 made of PVB or EVA has better water vapor barrier performance than RTV.

[0075] Since the material of the first adhesive layer 12 and the material of the second adhesive layer 50 are different, the impact resistance of the material of the first adhesive layer 12 is better, which can improve the risk of the first substrate 11 being broken due to external impact or temperature difference. The stress absorption performance of the material of the second adhesive layer 50 is good, which can absorb the stress of the light-adjustable functional layer 13 on the second adhesive layer 50, that is, it can absorb the stress applied to the light-adjustable functional layer 13 due to the uneven thickness of the first adhesive layer 12, so that the stress of the second adhesive layer 50 on the light-adjustable functional layer 13 is smaller or none, which can reduce the risk of uneven stress of the light-adjustable functional layer 13.

[0076] In addition, exemplarily, when the material of the first adhesive layer 12 is PVB, the process condition of bonding the first substrate 11 and the first adhesive layer 12 is high temperature and high pressure. Alternatively, exemplarily, when the material of the first adhesive layer 12 is EVA, the bonding temperature of the first substrate 11 and the first adhesive layer 12 is lower than that when the material of the first adhesive layer 12 is PVB, and the bonding pressure is lower than that when the material of the first adhesive layer 12 is PVB, so that the bonding process of EVA is relatively simple, and the preparation cost of bonding the first substrate 11 and the first adhesive layer 12 can be reduced.

[0077] In some embodiments, the first substrate 11 and the second substrate 41 may include a rigid or flexible material with high light transmittance, such as a glass substrate. Specifically, both the first substrate 11 and the second substrate 41 may be a planar glass substrate (i.e., flat glass), or a glass substrate with curvature in a first direction (i.e., single-curved glass), or a glass substrate with curvature in both the intersecting first and second directions (i.e., hyperbolic glass). Further optionally, the curvature of the single-curved glass in the first direction is greater than or equal to 12 mm / m and less than or equal to 39 mm / m. The curvature of the hyperbolic glass in the first direction is greater than or equal to 12 mm / m and less than or equal to 39 mm / m, and the curvature in the second direction is greater than or equal to 19 mm / m and less than or equal to 26 mm / m.

[0078] In some embodiments, the thickness of the first substrate 11 and the second substrate 41 is greater than or equal to 1.6 mm and less than or equal to 2.1 mm.

[0079] In some embodiments, the adhesive frame 20 may include multiple stacked adhesive layers, i.e., the thickness of the adhesive frame 20 is N×d, where N is the number of adhesive layers. The number of adhesive layers is less than six, for example, two to five adhesive layers, i.e., N is 2 to 5. The thickness of the adhesive frame 20 refers to the distance between the surface of the adhesive frame 20 away from the first substrate 11 and the surface of the first substrate 11 near the adhesive frame 20.

[0080] In some embodiments, the first adhesive layer 12 may include multiple stacked adhesive layers, i.e., the thickness of the first adhesive layer 12 is M×d, where M is the number of adhesive layers and d is the thickness of the adhesive layer. The number of adhesive layers is less than six, for example, one to three adhesive layers, i.e., M is 1 to 3. The thickness of the adhesive layer is 0.3mm to 0.5mm, for example, 0.3mm, 0.4mm, or 0.5mm.

[0081] Under high temperature and pressure, the adhesive material has fluidity, so the thickness of the adhesive layer may remain unchanged or decrease. That is, the thickness of the first adhesive layer 12 changes from M×d to M×d1, and the thickness of the adhesive frame 20 changes from N×d to N×d2, where d1 is less than or equal to d, d2 is less than or equal to d, and d1 and d2 are 0.3mm to 0.5mm, for example, d1 and d2 are 0.3mm, 0.38mm, or 0.48mm.

[0082] Since the thickness of the frame 20 is greater than the thickness of the first adhesive layer 12, the fluidity of the adhesive material included in the frame 20 is less than or equal to the fluidity of the adhesive material included in the first adhesive layer 12. That is, the reduction in the thickness of the adhesive layer included in the frame 20 is less than or equal to the reduction in the thickness of the adhesive layer included in the first adhesive layer 12. In other words, the thickness d2 of the adhesive layer included in the frame 20 is greater than or equal to the thickness d1 of the adhesive layer included in the first adhesive layer 12.

[0083] When the thickness of the first adhesive layer 12 is inconsistent, the thicker portion of the first adhesive layer 12 arches towards the direction from the first substrate 11 to the second substrate 41. Correspondingly, the portion of the dimming functional layer 13 bonded to this portion arches towards the direction from the first substrate 11 to the second substrate 41. The thinner portion of the first adhesive layer 12 is recessed towards the direction from the second substrate 41 to the first substrate 11. Correspondingly, the portion of the dimming functional layer 13 bonded to this portion moves towards the direction from the second substrate 41 to the first substrate 11. In this way, the stress exerted by the first adhesive layer 12 on the dimming functional layer 13 is released, reducing the risk of uneven stress on the dimming functional layer 13 caused by the inconsistent thickness of the first adhesive layer 12.

[0084] In some embodiments, as shown in FIG2, the orthographic projection of the dimming functional layer 13 on the reference surface coincides with the orthographic projection of the first adhesive layer 12 on the reference surface. Compared to the orthographic projection of the dimming functional layer 13 on the reference surface, it is located within the orthographic projection of the first adhesive layer 12 on the reference surface and is spaced from the boundary of the first adhesive layer 12. During the process of applying pressure to the first substrate 11 and laminating the first substrate 11 and the first adhesive layer 12, the entire first adhesive layer 12 is compressed, which can make the thickness of the first adhesive layer 12 uniform, thereby making the dimming functional layer 13 subjected to more uniform force.

[0085] In other embodiments, as shown in FIG3, the orthographic projection of the first adhesive layer 12 on the reference surface coincides with the orthographic projection of the first substrate 11 on the reference surface. The orthographic projection of the dimming functional layer 13 on the reference surface is located within the range of the orthographic projection of the first adhesive layer 12 on the reference surface and is spaced from the boundary of the first adhesive layer 12. In this way, the first adhesive layer 12 covers the first substrate 11. When the first substrate 11 is subjected to an external impact of a certain energy or a temperature difference change that causes the first substrate 11 to break, any part of the first substrate 11 will adhere to the first adhesive layer 12, reducing the risk of fragments of the first substrate 11 scattering everywhere.

[0086] In some embodiments, the thickness of the dimming functional layer 13 is d3, wherein d3 is greater than or equal to 0.21 mm and less than or equal to 3.28 mm.

[0087] In some embodiments, referring to Figures 4 and 5 together, when the material of the second adhesive layer 50 is a fluid material such as OCR, an injection opening 21 can be provided on the frame 20, and OCR can be injected into the space between the dimming functional layer 13 and the second substrate 41 through the injection opening 21. Furthermore, by arranging the frame 20 around the first adhesive layer 12, the dimming functional layer 13, and the second adhesive layer 50 (formed after OCR injection), the second adhesive layer 50 can be positioned so that it only contacts the frame 20 and the dimming functional layer 13, and the interfacial thermal expansion between the second adhesive layer 50 and the frame 20 is on the order of 10. -4 This avoids the formation of interface bubbles at the junction of the adhesive frame 20 and the second adhesive layer 50.

[0088] In some examples, as shown in Figure 5, the frame 20 has at least one potting opening 21, the projection of which along a first direction M1 at least partially coincides with the projection of the second adhesive layer 50 along the first direction M1; the first direction M1 is perpendicular to the side of the frame 20 where the potting opening 21 is located. Thus, liquid adhesive (e.g., OCR) can be injected through at least one potting opening 21 into the gap between the dimming functional layer 13 and the second substrate 41, which communicates with the potting opening 21, and then the liquid adhesive is cured to form the aforementioned second adhesive layer 50. In other words, the second adhesive layer 50 is prepared through a potting and curing process, and the second adhesive layer 50 exerts little or no force on the dimming functional layer 13, thereby improving the service life of the dimming functional layer 13.

[0089] In some embodiments, the thickness of the second adhesive layer 50 is greater than or equal to 100 μm and less than or equal to 188 μm.

[0090] In some embodiments, the diameter of the glue-filling opening 21 is greater than or equal to 0.5 mm and less than or equal to 20 mm.

[0091] In some embodiments, the width of the frame 20 is greater than or equal to 20 mm and less than or equal to 30 mm.

[0092] In some embodiments, as shown in FIG5, along the second direction M2, the size of the potting opening 21 on the frame 20 is less than or equal to half the size of the first substrate 11. For example, the size of the potting opening 21 is less than or equal to half, one-third, or one-quarter of the size of the first substrate 11. That is, along the second direction M2, the size of the potting opening 21 is smaller than the size of the side surface of the frame 20 where the potting opening 21 is located. The second direction M2 is parallel to the side surface of the frame 20 where the potting opening 21 is located.

[0093] For example, the frame 20 has one, two, or three glue-filling openings 21. For instance, Figure 5 shows the frame 20 with one glue-filling opening 21, which reduces the amount removed from the frame 20 and lowers the risk of poor sealing. Alternatively, the frame 20 may have three glue-filling openings 21, which increases the glue-filling speed and reduces the preparation time of the dimming device.

[0094] Figures 6 to 8 are several schematic diagrams illustrating the positional relationship between the potting opening 21 and the flexible circuit boards 132 / 134. For example, as shown in Figure 6, the first opening 21 and the flexible circuit boards 132 / 134 are located on adjacent sides of the frame 20. For instance, the flexible circuit boards 132 / 134 are located on the upper side of the frame 20, and the first opening 21 is located on the left or right side of the frame 20. Alternatively, as shown in Figure 7, the first opening 21 and the flexible circuit boards 132 / 134 are located on opposite sides of the frame 20. Or, as shown in Figure 8, the first opening 21 and the flexible circuit boards 132 / 134 are located on the same side of the frame 20. When the dimming device is applied to a car window, the flexible circuit boards 132 / 134 are located on the lower side. Thus, during the raising and lowering of the car window, the flexible circuit boards 132 / 134 are hidden in the car door. Since the first opening 21 and the flexible circuit boards 132 / 134 are on the same side of the frame 20, the first opening 21 is also hidden in the car door. Since a sealing block 80 (as shown in Figure 4) will be set to seal the first opening 21 after the glue is applied, the sealing block 80 can also be hidden in the door using the above design. This makes the sealing block 80 less likely to be damaged, thereby reducing the risk of moisture entering the dimming device 100 through the first opening 21.

[0095] In some embodiments, as shown in FIG9, the frame 20 further has at least one venting opening 22. During the process of injecting liquid adhesive into the gap between the dimming functional layer 13 and the second substrate 41, the venting opening 22 can expel air from the gap, reducing the risk of air bubbles in the dimming device. Exemplarily, the frame 20 also has one, two, or three venting openings 22 to ensure normal venting of the dimming device. The potting opening 21 and the venting opening 22 are, for example, located on the same side of the frame 20.

[0096] When the potting opening 21 and the flexible circuit board 132 / 134 are located on the same side of the frame 20, the relative positions of the potting opening 21, the venting opening 22, and the flexible circuit board 132 / 134 can be set according to the actual situation. For example, as shown in Figure 9, the potting opening 21 and the venting opening 22 are located on the same side of the flexible circuit board 132 / 134. Or, as shown in Figure 10, the potting opening 21 is located on one side of the flexible circuit board 132 / 134, and the venting opening 22 is located on the other side. When the frame 20 is composed of multiple layers of adhesive, the flexible circuit board 132 / 134 extends between two adjacent adhesive layers, and there is a certain distance between the flexible circuit board 132 / 134 and the potting opening 21 to ensure that the portion of the flexible circuit board 132 / 134 located within the frame 20 is completely enclosed by the frame 20, and that the multiple adhesive layers at the potting opening 21 are not separated by the flexible circuit board 132 / 134, thus ensuring good sealing performance of the frame 20. For example, the distance between the potting opening 21 and the flexible circuit board 132 / 134 is greater than 30mm.

[0097] In some embodiments, as shown in FIG11, a baffle 30 is also used in the process of forming the glue-filling opening 21 and the venting opening 22. The glue frame 20 has a glue-filling opening 21, and the baffle 30 is located inside the glue-filling opening 21, dividing the glue-filling opening 21 into two sub-openings, one of which is the glue-filling opening 21 and the other is the venting opening 22. Having a glue-filling opening 21 in the glue frame 20 allows for less removal of the glue frame 20, which can reduce the risk of poor sealing of the glue frame 20.

[0098] As shown in Figure 4, the sealing block 80 is located at the glue-filling opening 21 and seals the glue-filling opening 21. The sealing block 80 can reduce the risk of moisture entering the second adhesive layer 50 through the glue-filling opening 21. Exemplarily, the material of the sealing block 80 is hot-melt butyl rubber. The specific process of sealing the glue-filling opening 21 with the sealing block 80 can be that hot-melt butyl rubber is applied inside the glue-filling opening 21, and the hot-melt butyl rubber seals the glue-filling opening 21. The hot-melt butyl rubber can reduce the risk of moisture in the air entering the second adhesive layer 50. When the dimming device includes a baffle 30 (as shown in Figure 11), the baffle 30 also needs to be removed from the glue-filling opening 21 before sealing the glue-filling opening 21. In some embodiments, as shown in Figure 4, the materials of the glue frame 20 and the sealing block 80 can be the same, for example, the material of the glue frame 20 is PVB, and the material of the sealing block 80 is hot-melt butyl rubber.

[0099] In some embodiments, as shown in FIG12, the dimming device further includes a third adhesive layer 16, which is disposed between the first adhesive layer 12 and the dimming functional layer 13, and is used to absorb the thermal stress of the first adhesive layer 12. By absorbing the thermal stress of the first adhesive layer 12 with the third adhesive layer 16, a soft-to-soft bonding between the third adhesive layer 16 and the dimming functional layer 13 can be achieved. This prevents deformation of the first adhesive layer 12 due to thermal stress, which could cause uneven stress distribution in the dimming functional layer 13 during assembly, thus preventing the dimming functional layer 13 from exhibiting a mura phenomenon. The aforementioned assembly of the dimming device refers to the permanent bonding of the first substrate 11 on one side of the adhesive layer and the second substrate 41 on the other side of the adhesive layer, after the adhesive layer undergoes special high-temperature pre-pressing (or vacuuming) and high-temperature high-pressure processes. The lamination process is carried out under high temperature and high pressure. For example, the first substrate 11, the first adhesive layer 12, the dimming functional layer 13, the second adhesive layer 50, the second substrate 41, and the frame 20 are laminated in an autoclave.

[0100] In some embodiments, the third adhesive layer 16 is made of optically clear adhesive (OCA). This optical adhesive has high light transmittance. The thickness of the OCA ranges from 100 μm to 200 μm. Preferably, to better absorb the thermal stress of the first adhesive layer 12, the thickness of the third adhesive layer 16 is greater than or equal to 100 μm and less than or equal to 188 μm. The UV cutoff of the OCA in the 380 nm to 400 nm range is ≥90%.

[0101] In some embodiments, the coefficient of thermal expansion of the material of the third adhesive layer 16 is on the order of 10. -4 In this way, the amount of thermal expansion at the interface between the adhesive frame 20 and the third adhesive layer 16 can both be on the order of 10. -4 This avoids the formation of interface bubbles at the junction of the frame 20 and the third adhesive layer 16.

[0102] In some embodiments, in order to better absorb the thermal stress of the first adhesive layer 12, the elastic modulus of the third adhesive layer 16 is greater than or equal to 30 kPa and less than or equal to 40 kPa.

[0103] In some embodiments, FIG13 shows a process diagram of the dimming device after the adhesive frame is formed, but before it is laminated with the second substrate. As shown in FIG13, the end of the adhesive frame 20 away from the first substrate 11 is further away from the end of the dimming functional layer 13 away from the first substrate 11. That is, along the thickness direction of the dimming functional layer 13, the lower surface of the adhesive frame 20 is lower than the lower surface of the dimming functional layer 13. In this way, on the one hand, during the subsequent bonding process of the second substrate 41, the adhesive frame 20 can provide a gap 2 between the dimming functional layer 13 and the second substrate 41, providing space for the potting process of the second adhesive layer 50. On the other hand, the portion of the adhesive frame 20 surrounding the dimming functional layer 13 is relatively large, which can further reduce the risk of moisture entering the dimming functional layer 13.

[0104] In some embodiments, as shown in FIG. 13, a telescopic gap 1 is provided between the frame 20 and the dimming functional layer 13. This telescopic gap 1 provides space for the thermal expansion and contraction of the dimming functional layer 13, reducing the risk of damage to the dimming functional layer 13 due to mutual compression between the two materials, thus improving the service life of the dimming functional layer 13. When the material of the frame 20 includes PVB or EVA, the material of the frame 20 is fluid during the lamination process. The telescopic gap 1 provides flow space for the frame 20, reducing the risk of the frame 20 flowing onto the surface of the dimming functional layer 13 away from the first substrate 11. Exemplarily, the telescopic gap 1 is 1mm to 5mm, for example, 1mm, 2.5mm, or 5mm, ensuring that the dimming functional layer 13 does not compress against the frame 20 during thermal expansion and contraction.

[0105] Furthermore, when the frame 20 is made of PVB, and the PVB is not bonded to a substrate or film layer, the PVB surface is rough, meaning it is uneven. Based on this, as shown in Figure 2, the orthographic projection of the first adhesive layer 12 onto the reference plane lies within the range of the orthographic projection of the first substrate 11 onto the reference plane, and is spaced from the boundary of the first substrate 11. The orthographic projection of the first adhesive layer 12 onto the reference plane coincides with the orthographic projection of the dimming functional layer 13 onto the reference plane. The reference plane is parallel to the surface of the first substrate 11 near the dimming functional layer 13. In this way, after the frame 20 is formed on one side of the first substrate 11, the frame 20 abuts against the first substrate 11. Since the surface of the frame 20 formed by PVB is uneven, there is a small gap between the frame 20 and the first substrate 11. In the subsequent preparation process, the air in the above-mentioned expansion gap 1 (as shown in Figure 13) between the frame 20 and the dimming functional layer 13 can be discharged through the small gap between the frame 20 and the first substrate 11, thus avoiding the generation of air bubbles in the dimming device.

[0106] The dimming functional layer 13 mentioned above can be a polymer dispersed liquid crystal (PDLC) functional layer, an electrochromic (EC) functional layer, a dye liquid crystal functional layer, or a suspended particle functional layer.

[0107] In some embodiments, referring to FIG14, the dimming functional layer 13 is a dye-liquid crystal functional layer, and includes a first substrate layer 1311, a dye-liquid crystal layer 1314, a second substrate layer 1317, and a sealing adhesive 1318 stacked sequentially. The first substrate layer 1311 and the second substrate layer 1317 are disposed opposite to each other. The dye-liquid crystal layer 1314 is disposed between the first substrate layer 1311 and the second substrate layer 1317. The sealing adhesive 1318 is disposed between the first substrate layer 1311 and the second substrate layer 1317 and surrounds the dye-liquid crystal layer 1314. The dye-liquid crystal layer 1314 includes liquid crystal molecules 1302, dye molecules 1301, and a plurality of spacers 1303 spaced apart. Exemplarily, the dimming functional layer 13 may specifically include a first substrate layer 1311, a first electrode layer 1312, a first alignment layer 1313, a dye-liquid crystal layer 1314, a second alignment layer 1315, a second electrode layer 1316, and a second substrate layer 1317 stacked sequentially.

[0108] The materials of the first substrate layer 1311 and the second substrate layer 1317 may include glass or plastic. The plastic may include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyphenylene sulfone resin (PPSU), cycloolefin polymer (COP), or polymethyl methacrylate (PMMA). The thickness of the first substrate layer 1311 and the second substrate layer 1317 ranges from 60 μm to 188 μm, and the transmittance is greater than 85%.

[0109] In some embodiments, a water-oxygen barrier film is further covered on the outer or inner surface of the first substrate layer 1311 and the second substrate layer 1317. The film is mainly composed of a mixture of silicon nitride and silicon oxide, and has a thickness ranging from 100 nm to 200 nm. The main function of the water-oxygen barrier film is to protect the dye liquid crystal functional layer from long-term moisture permeation.

[0110] The materials of the first electrode layer 1312 and the second electrode layer 1316 include conductive materials with high light transmittance. For example, the materials of the first electrode layer 1312 and the second electrode layer 1316 include indium tin oxide (ITO). The thickness of the first electrode layer 1312 and the second electrode layer 1316 is greater than or equal to 100 nm and less than or equal to 150 nm.

[0111] The dye-liquid crystal layer 1314 includes dye molecules 1301 and liquid crystal molecules 1302 (in Figure 14, black ellipses represent dye molecules 1301, and white ellipses represent liquid crystal molecules 1302). The angle formed by the long axis of dye molecules 1301 and the electric field direction between the first electrode layer 1312 and the second electrode layer 1316 varies, resulting in different amounts of light absorbed by the dye molecules 1301. Changing the voltage value between the first electrode layer 1312 and the second electrode layer 1316 changes the angle formed by the long axis of liquid crystal molecules 1302 and the electric field direction between them. Therefore, by changing this angle, the amount of light absorbed by the dye molecules 1301 can be altered, thus adjusting the transmittance of the dye-liquid crystal layer 1314. For example, when the long axis of the dye molecule 1301 is parallel to the direction of the electric field between the first electrode layer 1312 and the second electrode layer 1316, light can pass through the dye liquid crystal layer 1314, thus making the dye liquid crystal functional layer appear transparent (bright). Conversely, when the long axis of the dye molecule 1301 is perpendicular to the direction of the electric field between the first electrode layer 1312 and the second electrode layer 1316, light cannot pass through the dye liquid crystal layer 1314, thus making the dye liquid crystal functional layer appear dark.

[0112] Spacers 1303 are located between the second alignment layer 1315 and the first electrode layer 1312, and penetrate the first alignment layer 1313. Multiple spacers 1303 are used to maintain the spacing between the first substrate layer 1311 and the second substrate layer 1317.

[0113] In some embodiments, the height of the spacer 1303 is greater than or equal to 10 μm and less than or equal to 20 μm. More preferably, the height of the spacer 1303 is greater than or equal to 10 μm and less than or equal to 15 μm.

[0114] In some embodiments, the spacing between adjacent spacers 1303 is greater than or equal to 0.2 mm and less than or equal to 1 mm.

[0115] For example, as shown in FIG15, the shape of the spacer 1303 includes a frustum of a cone, the maximum radius D2 of which is greater than or equal to 12 μm and less than or equal to 17 μm; the minimum radius D1 of which is greater than or equal to 5 μm and less than or equal to 10 μm.

[0116] Since the density of the spacer 1303 in the space between the second alignment layer 1315 and the first electrode layer 1312 is an important factor affecting the formation of bubbles (low-temperature bubbles, or vacuum bubbles) and mura in the dye-liquid crystal functional layer, especially affecting mura, by adopting the size of the spacer 1303 within the above-mentioned numerical range and / or the spacing between adjacent spacers 1303, the density of the spacer 1303 in the space between the second alignment layer 1315 and the first electrode layer 1312 can be made to maintain the elasticity of the dye-liquid crystal functional layer within a suitable range, thereby making it less likely to generate bubbles and mura (excessive stiffness of the dye-liquid crystal functional layer easily leads to bubbles, while insufficient stiffness easily leads to mura). Furthermore, the height of the spacer 1303 is also an important factor affecting the formation of bubbles (low-temperature bubbles, or vacuum bubbles) and mura; by adopting the above-mentioned numerical range for the height of the spacer 1303, it is less likely to generate bubbles and mura.

[0117] In some embodiments, the width of the sealing adhesive 1318 is greater than or equal to 4 mm and less than or equal to 6 mm; and / or, the distance between the outer peripheral edge of the sealing adhesive 1318 and the inner peripheral edge of the adhesive frame 20 is greater than or equal to 1 mm and less than or equal to 1.5 mm.

[0118] In some embodiments, as shown in FIG14, the dimming device further includes a flexible circuit board 132. The flexible circuit board 132 is used to drive the dimming functional layer 13 to adjust the light transmittance.

[0119] In some embodiments, as shown in FIG16, the dimming device further includes a second functional layer 14 and a fourth adhesive layer 15. The second functional layer 14 is located on the side of the dimming functional layer 13 away from the first substrate 11, and the fourth adhesive layer 15 is located between the dimming functional layer 13 and the second functional layer 14 for bonding the dimming functional layer 13 and the second functional layer 14.

[0120] The types of the dimming functional layer 13 and the second functional layer 14 can be set according to actual conditions. For example, the dimming functional layer 13 is a dye-liquid crystal functional layer, and the second functional layer 14 is also a dye-liquid crystal functional layer. The dimming functional layer 13 and the second functional layer 14 may have different transmittances, and the cooperation between the dimming functional layer 13 and the second functional layer 14 can enable the dimming device to have at least two regions with different transmittances. Alternatively, the cooperation between the dimming functional layer 13 and the second functional layer 14 can reduce the dark-state transmittance of the dimming device.

[0121] Alternatively, for example, the dimming functional layer 13 is a dye-based liquid crystal functional layer, and the second functional layer 14 is a touch functional layer. The touch functional layer is electrically connected to the dye-based liquid crystal functional layer, so that the light transmittance of the dye-based liquid crystal functional layer can be adjusted through the touch functional layer, making operation convenient. For example, the light transmittance can be adjusted by swiping with a finger.

[0122] Alternatively, for example, the dimming functional layer 13 is a display functional layer, and the second functional layer 14 is a dye-based liquid crystal functional layer. Alternatively, the dimming functional layer 13 is a display functional layer, and the second functional layer 14 is a touch functional layer.

[0123] The fourth adhesive layer 15 is used to connect the dimming functional layer 13 and the second functional layer 14. The material of the fourth adhesive layer 15 can be the same as that of the first adhesive layer 12. For example, both the fourth adhesive layer 15 and the first adhesive layer 12 are made of PVB.

[0124] Based on the above embodiments, as shown in FIG17, during the lamination of the first substrate 11, the first adhesive layer 12, the frame 20, the dimming functional layer 13, and the second substrate 41, the gap 2 between the first adhesive layer 12 and the second substrate 41 provides space for the dimming functional layer 13 and the second functional layer 14 to move. When the thickness of the first adhesive layer 12 is inconsistent, the thicker portion of the first adhesive layer 12 arches towards the direction from the first substrate 11 to the second substrate 41. Correspondingly, the portion of the dimming functional layer 13 bonded to this portion arches towards the direction from the first substrate 11 to the second substrate 41, and the corresponding portion of the second functional layer 14 arches towards the direction from the first substrate 11 to the second substrate 41. The thinner portion of the first adhesive layer 12 is recessed towards the direction from the second substrate 41 to the first substrate 11. Correspondingly, the portion of the dimming functional layer 13 bonded to this portion is recessed towards the direction from the second substrate 41 to the first substrate 11, and the corresponding portion of the second functional layer 14 is recessed towards the direction from the second substrate 41 to the first substrate 11. In this way, the stress applied by the first adhesive layer 12 to the dimming functional layer 13 and the second functional layer 14 is released, which can reduce the risk of uneven stress on the dimming functional layer 13 and the second functional layer 14 due to the inconsistency of the first adhesive layer 12.

[0125] When the thickness of the fourth adhesive layer 15 is inconsistent, the thicker portion of the fourth adhesive layer 15 arches towards the direction from the first substrate 11 to the second substrate 41. Correspondingly, the portion of the second functional layer 14 bonded to this portion arches towards the direction from the first substrate 11 to the second substrate 41. The thinner portion of the fourth adhesive layer 15 is recessed towards the direction from the second substrate 41 to the first substrate 11. Correspondingly, the portion of the second functional layer 14 bonded to this portion is recessed towards the direction from the second substrate 41 to the first substrate 11. In this way, the stress exerted by the fourth adhesive layer 15 on the dimming functional layer 13 and the second functional layer 14 is released, reducing the risk of uneven stress on the dimming functional layer 13 and the second functional layer 14 due to the inconsistency of the fourth adhesive layer 15.

[0126] In some embodiments, as shown in FIG18, the dimming device further includes a fifth adhesive layer 42 stacked between the second substrate 41 and the second adhesive layer 50. The fifth adhesive layer 42 can reduce the risk of the second substrate 41 breaking due to external impact of a certain energy or temperature difference. Even if the second substrate 41 breaks, the fragments of the second substrate 41 will stick to the fifth adhesive layer 42, thereby reducing the risk of fragments of the second substrate 41 flying everywhere. The material of the fifth adhesive layer 42 includes EVA, PVB or SGP.

[0127] For example, as shown in FIG18, the orthographic projection of the fifth adhesive layer 42 on the reference plane coincides with the orthographic projection of the second substrate 41 on the reference plane, and the adhesive frame 20 abuts against the fifth adhesive layer 42. In this way, the fifth adhesive layer 42 covers the second substrate 41. When the second substrate 41 is subjected to an external impact of a certain energy or breaks due to temperature difference, any part of the second substrate 41 will stick to the fifth adhesive layer 42, reducing the risk of fragments of the second substrate 41 flying everywhere.

[0128] Alternatively, as exemplarily shown in FIG19, the orthographic projection of the fifth adhesive layer 42 on the reference surface is located within the range of the orthographic projection of the second substrate 41 on the reference surface and is spaced from the boundary of the second substrate 41. The orthographic projection of the fifth adhesive layer 42 on the reference surface coincides with the orthographic projection of the second adhesive layer 50 on the reference surface. On the one hand, the frame 20 abuts against the second substrate 41, which can reduce the risk of inconsistent spacing between the first substrate 11 and the second substrate 41 due to inconsistency of the fifth adhesive layer 42. On the other hand, the material of the fourth adhesive layer includes PVB. Since the surface of the frame 20 formed by the PVB film is uneven, there is a small gap between the frame 20 and the first substrate 11. In the subsequent manufacturing process, the air in the expansion gap 1 between the frame 20 and the dimming functional layer 13 can be discharged through the small gap between the frame 20 and the first substrate 11, avoiding the generation of air bubbles in the dimming device.

[0129] In other embodiments, as shown in FIG20, the dimming device further includes a fifth adhesive layer 42 and a third functional layer 43 stacked between the second substrate 41 and the second adhesive layer 50. The third functional layer 43 may be a dimming functional layer, a display functional layer, or a touch functional layer.

[0130] The surface of the second substrate 41 near the third functional layer 43 is bonded to the frame 20, with a gap between the second adhesive layer 50 and the third functional layer 43. The orthographic projection of the fifth adhesive layer 42 onto the reference plane is located within the range of the orthographic projection of the second substrate 41 onto the reference plane and is spaced from the boundary of the second substrate 41. The orthographic projection of the fifth adhesive layer 42 onto the reference plane coincides with the orthographic projection of the third functional layer 43 onto the reference plane. The frame 20 also surrounds the third functional layer 43, which can reduce the risk of moisture entering the third functional layer 43.

[0131] The fifth adhesive layer 42 bonds the second substrate 41 and the third functional layer 43. The orthographic projection of the third functional layer 43 on the reference surface coincides with the orthographic projection of the fifth adhesive layer 42 on the reference surface. Compared to the orthographic projection of the third functional layer on the reference surface, the fifth adhesive layer 42, which is located within the orthographic projection of the fourth adhesive layer on the reference surface and is spaced from the boundary of the fourth adhesive layer, is compressed as a whole during the process of applying pressure to the second substrate 41 and laminating the second substrate 41, the fifth adhesive layer 42, the third functional layer 43, and the second adhesive layer 50. This allows the fifth adhesive layer 42 to have a uniform thickness, and the third functional layer 43 to be subjected to more uniform stress.

[0132] In some embodiments, the dimming device is used for vehicle window glass. The first adhesive layer 12 is closer to the interior of the vehicle than the second adhesive layer 50, as shown in FIG21. The dimming device also includes a first light-shielding layer 60 and a second light-shielding layer 70. The first light-shielding layer 60 is located on the side of the first substrate 11 away from the second substrate 41. The first light-shielding layer 60 is disposed along the edge of the first substrate 11. The outer boundary of the orthographic projection of the first light-shielding layer 60 on the first substrate 11 coincides with the boundary of the first substrate 11, and the inner boundary is located within the inner boundary of the orthographic projection of the frame 20 on the first substrate 11. That is, the inner boundary is relative to the inner boundary of the orthographic projection of the frame 20 on the reference plane at the center of the dimming device. In this way, the first light-shielding layer 60 covers the frame 20, which can reduce the risk of ultraviolet light irradiating the frame 20, reduce the risk of aging of the frame 20, and improve the service life of the frame 20.

[0133] The second light-shielding layer 70 is located on the side of the second substrate 41 closest to the first substrate 11. The second light-shielding layer 70 is disposed along the edge of the second substrate 41, and at least a portion of the second light-shielding layer 70 is located between the second substrate 41 and the frame 20. That is, the outer boundary of the orthographic projection of the second light-shielding layer 70 onto the second substrate 41 coincides with the boundary of the second substrate 41, and the inner boundary coincides with the inner boundary of the orthographic projection of the frame 20 onto the reference surface, or the inner boundary is located relative to the center of the dimming device relative to the inner boundary of the orthographic projection of the frame 20 onto the reference surface. In this way, the second light-shielding layer 70 covers the frame 20, reducing the risk of ultraviolet light irradiating the frame 20, reducing the aging of the frame 20, and increasing the service life of the frame 20. The location of the second light-shielding layer 70 on the side of the second substrate 41 closest to the first substrate 11 reduces the risk of external objects scratching the second light-shielding layer 70.

[0134] When the dimming device includes a first light-shielding layer 60 and a second light-shielding layer 70, the first light-shielding layer 60 and the second light-shielding layer 70 can also reduce the risk of ultraviolet light irradiating the sealing block 80, reduce the risk of aging of the sealing block 80, and improve the service life of the sealing block 80.

[0135] The first light-shielding layer 60 is located on the side of the first laminated structure 10 away from the second laminated structure 40, and is disposed along the edge of the first laminated structure 10. The outer boundary of the orthographic projection of the first light-shielding layer 60 on the reference plane coincides with the boundary of the orthographic projection of the first laminated structure 10 on the reference plane, and the inner boundary is relative to the inner boundary of the orthographic projection of the frame 20 on the reference plane at the center of the dimming device. That is, the first light-shielding layer 60 covers the frame 20. In this way, the first light-shielding layer 60 can reduce the risk of ultraviolet light irradiating the frame 20, reduce the aging of the frame 20, and improve the service life of the frame 20.

[0136] The second light-shielding layer 70 is located on the surface of the second substrate 41 and is disposed along its edge. The second light-shielding layer 70 is located on the side of the second substrate 41 closer to the dimming functional layer 13, which reduces the risk of external objects scratching the second light-shielding layer 70. At least a portion of the second light-shielding layer 70 is located between the second substrate 41 and the frame 20; that is, the outer boundary of the orthographic projection of the second light-shielding layer 70 onto the reference plane coincides with the boundary of the orthographic projection of the second stacked structure 40 onto the reference plane, and the inner boundary coincides with the inner boundary of the orthographic projection of the frame 20 onto the reference plane, or the inner boundary is closer to the center of the dimming device than the inner boundary of the orthographic projection of the frame 20 onto the reference plane. Thus, the second light-shielding layer 70 covers the frame 20. The second light-shielding layer 70 can reduce the risk of ultraviolet light irradiating the frame 20, reduce the risk of aging of the frame 20, and improve the service life of the frame 20.

[0137] In some embodiments, as shown in Figures 22 and 23, there are multiple dimming functional layers 13, all of which are bonded to the first adhesive layer 12. Generally, fabricating a large dimming functional layer 13 is difficult, while fabricating a smaller one is simpler. Therefore, when the dimming device is large, using multiple smaller dimming functional layers 13 instead of a single large one reduces the fabrication difficulty of the dimming device. There is a gap between adjacent first functional layers 12, which reduces the risk of collision between adjacent first functional layers 12. A portion of the second adhesive layer 50 is located within the gap between adjacent first functional layers 12.

[0138] For example, multiple dimming functional layers 13 are arranged in an array. For instance, a rectangular array of multiple dimming functional layers 13. Or, a circular array of multiple dimming functional layers 13.

[0139] In some embodiments, as shown in Figures 24 and 25, the dimming device further includes a limiting strip 90 located within the gap between two adjacent dimming functional layers 13. The limiting strip 90 is used to separate two adjacent dimming functional layers 13, reducing the risk of two adjacent first functional layers 12 colliding with each other. The limiting strip 90 has a gap with the second stacked structure 40, so that during the injection of liquid adhesive into the dimming device 100, the liquid adhesive can fill the first gap between each dimming functional layer 13 and the second stacked structure 40 through the gap between the limiting strip 90 and the second stacked structure 40.

[0140] For example, the surface of the limiting strip 90 away from the first substrate 11 is higher than the surface of the dimming functional layer 13 away from the first substrate 11. Alternatively, for example, the surface of the limiting strip 90 away from the first substrate 11 is substantially flush with the surface of the dimming functional layer 13 away from the first substrate 11. Alternatively, for example, the surface of the limiting strip 90 away from the first substrate 11 is lower than the surface of the dimming functional layer 13 away from the first substrate 11. When the surface of the limiting strip 90 away from the first substrate 11 is lower than the surface of the dimming functional layer 13 away from the first substrate 11, the second adhesive layer 50 is partially located within the gap between two adjacent dimming functional layers 13.

[0141] In other embodiments, as shown in Figures 26 and 27, the dimming device further includes a limiting strip 90 located within the gap between two adjacent dimming functional layers 13. The limiting strip 90 serves to separate adjacent dimming functional layers 13, reducing the risk of adjacent first functional layers 12 colliding with each other. The limiting strip 90 contacts the second stacked structure 40, thereby reducing the risk of moisture from the dimming functional layers 13 entering adjacent dimming functional layers 13. The limiting strip 90 has a plurality of third openings 91, with at least one third opening 91 between adjacent dimming functional layers 13. Thus, during the injection of liquid adhesive into the dimming device 100, the liquid adhesive can flow through the third openings 91 into the first gap between each dimming functional layer 13 and the second stacked structure 40, thereby filling the first gap. The liquid adhesive also fills the third openings 91, causing the second adhesive layer 50 to be partially located within the third openings 91.

[0142] As another technical solution, please refer to Figure 28. This embodiment of the present disclosure also provides a dimming device, including a first substrate 11, a first adhesive layer 12, a dimming functional layer 13 and an explosion-proof stack 5 stacked sequentially; the explosion-proof stack 5 includes at least two explosion-proof layers 51 and at least two second adhesive layers 52; the explosion-proof layers 51 and the second adhesive layers 52 are alternately arranged, and the second adhesive layer 52 closest to the dimming functional layer 13 is located on the side of the explosion-proof layer 51 closest to the dimming functional layer 13.

[0143] By employing the explosion-proof stack 5, the overall weight of the dimming device can be reduced. Simultaneously, the explosion-proof stack 5 can resist mechanical impacts, thereby preventing the first substrate 11 (e.g., a glass substrate) from shattering and flying debris, which could cause injury. Furthermore, by placing the second adhesive layer 52 closest to the dimming functional layer 13 on the side of the explosion-proof layer 51 closest to the dimming functional layer 13, the explosion-proof stack 5 can be directly attached to the side of the dimming functional layer 13 facing away from the first substrate 11.

[0144] In some embodiments, the explosion-proof layer 51 is made of plastic; the second adhesive layer 52 is made of optical adhesive.

[0145] In some embodiments, the thickness of the explosion-proof stack 5 is greater than or equal to 100 μm and less than or equal to 500 μm.

[0146] In some embodiments, the first substrate 11 may include a rigid or flexible material with high light transmittance, such as a glass substrate. Specifically, both the first substrate 11 and the second substrate 41 may be planar glass substrates (i.e., flat glass), or glass substrates with curvature in the first direction (i.e., single-curved glass), or glass substrates with curvature in both the intersecting first and second directions (i.e., hyperbolic glass). Further optionally, the curvature of the single-curved glass in the first direction is greater than or equal to 12 mm / m and less than or equal to 39 mm / m. The curvature of the hyperbolic glass in the first direction is greater than or equal to 12 mm / m and less than or equal to 39 mm / m, and the curvature in the second direction is greater than or equal to 19 mm / m and less than or equal to 26 mm / m.

[0147] In some embodiments, the material of the first adhesive layer 12 includes optically clear adhesive (OCA), optically clear resin adhesive (OCR), polyvinyl butyraldehyde (PVB), or ethylene-viny acetate copolymer (EVA).

[0148] In some embodiments, when the material of the first adhesive layer 12 is OCA, the thickness of the first adhesive layer 12 ranges from 100 μm to 188 μm, the elastic modulus ranges from 30 kPa to 40 kPa, the thermal shrinkage rate of the first adhesive layer 12 is on the order of one percent, and the coefficient of thermal expansion is on the order of 10. -4 By adopting at least one of the parameters of the first adhesive layer 12, such as thickness, elastic modulus, thermal shrinkage rate, and coefficient of thermal expansion, within the aforementioned numerical range, the deformation caused by thermal stress of the first adhesive layer 12 can be controlled to a minimum. This prevents the first adhesive layer 12 from deforming due to thermal stress, causing uneven stress distribution in some areas of the dimming functional layer 13 during the assembly of the dimming device, thus preventing the dimming functional layer 13 from exhibiting a mura phenomenon.

[0149] In other embodiments, as shown in FIG29, the dimming device further includes a frame 53 located between the first substrate 11 and the explosion-proof laminate 5, and surrounding the first adhesive layer 12 and the dimming functional layer 13. The frame 53 is made of, for example, RTV (room temperature vulcanized silicone rubber). Exemplarily, the width of the frame 53 ranges from 20mm to 30mm, a range sufficient to prevent moisture penetration during boiling. The thickness of the frame 53 ranges from 1mm to 3mm. The curing conditions for the frame 53 are: temperature within the range of 25℃ ± 2℃; humidity > 60% ± 10% RH.

[0150] When the material of the first adhesive layer 12 is OCR, at least one potting opening is provided on the adhesive frame 53 for potting the OCR into the gap between the first substrate 11 and the dimming functional layer 13. The diameter of the potting opening is in the range of 0.5mm to 2mm. When potting, the potting pressure is in the range of 1Mpa to 8Mpa. After potting, it is allowed to stand and level for 5min to 15min. Then, the dimming device is cured in an oven. Finally, the potting opening is sealed with RTV glue.

[0151] In some embodiments, the present disclosure also provides a dimming structure, which includes a dimming device and includes one of a skylight, a curtain wall, a rail vehicle, a car, or a billboard.

[0152] Dimming devices can be applied in the architectural field, for example, in skylights or curtain walls, or in glass partitions. Compared to using brick walls to separate rooms in the architectural field, the dimming devices in the embodiments of this disclosure are thinner, thus saving space. Company logos can also be displayed on the partition glass. In this case, the dimming structure including the dimming device can be, for example, a skylight, curtain wall, etc.

[0153] Dimming devices can also be applied in the transportation sector, for example, in rail transit vehicles or automobiles. Rail transit vehicles can include subways, light rail, elevated rail trains, trams, and maglev trains, among others. Automobiles can include passenger cars, commercial vehicles, trucks, or buses, among others. In such cases, the dimming structure including the dimming device can be, for example, a rail transit vehicle or automobile.

[0154] Please refer to Figure 30. This disclosure uses a car 1000 as an example to illustrate the dimming structure. The car 1000 includes a vehicle body 1010 and a window glass 1020 mounted on the vehicle body 1010. The window glass 1020 can be one or more of the following types of automotive windows: front window, sunroof, rear window, or side window. The window glass 1020 includes the dimming device of any of the above embodiments. The dimming device can also be applied to the central control touchscreen in the car 1000.

[0155] Dimming devices can also be used in the advertising field, for example, in billboards.

[0156] It should be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A dimming device, characterized in that: The adhesive layer comprises a first substrate, a first adhesive layer, a dimming functional layer, a second adhesive layer, and a second substrate stacked in sequence; and further comprises an adhesive frame disposed between the first substrate and the second substrate and surrounding the first adhesive layer, the dimming functional layer, and the second adhesive layer. The thermal expansion coefficients of the material of the adhesive frame, the material of the first adhesive layer, and the material of the second adhesive layer are all on the order of 10 -4 .

2. The dimming device according to claim 1, wherein: The material of the adhesive frame is the same as that of the first adhesive layer.

3. The dimming device according to claim 2, wherein: The first adhesive layer and the adhesive frame are made of polyvinyl butyral or ethylene-vinyl acetate copolymer.

4. The dimming device according to claim 3, characterized in that: The material of the plastic frame includes polyvinyl butyral or ethylene-vinyl acetate copolymer; The material of the second adhesive layer includes optically transparent resin adhesive.

5. The dimming device according to claim 1, wherein: The dimming device further includes a third adhesive layer, which is disposed between the first adhesive layer and the dimming functional layer and is used to absorb thermal stress of the first adhesive layer.

6. The dimming device according to claim 5, characterized in that: The material of the third adhesive layer includes optical adhesive.

7. The dimming device according to claim 5, characterized in that: The thickness of the third adhesive layer is greater than or equal to 100 μm and less than or equal to 188 μm.

8. The dimming device according to claim 5, characterized in that: The thermal expansion coefficient of the material of the third adhesive layer is on the order of 10 -4 , and / or, the elastic modulus of the third adhesive layer is greater than or equal to 30 kPa and less than or equal to 40 kPa.

9. The dimming device according to claim 1, wherein: The glue frame has at least one glue pouring opening, and a projection of the glue pouring opening along a first direction at least partially overlaps with a projection of the second adhesive layer along the first direction; the first direction is perpendicular to a side surface of the glue frame where the glue pouring opening is located; The diameter of the glue pouring opening is greater than or equal to 0.5 mm and less than or equal to 20 mm.

10. The dimming device according to any one of claims 1 to 9, characterized in that: The dimming functional layer includes a first substrate layer, a dye liquid crystal layer, a second substrate layer and a frame sealing glue which are stacked in sequence, wherein the first substrate layer and the second substrate layer are arranged opposite to each other, the dye liquid crystal layer is arranged between the first substrate layer and the second substrate layer, and the frame sealing glue is arranged between the first substrate layer and the second substrate layer and surrounds the dye liquid crystal layer; the dye liquid crystal layer includes liquid crystal molecules, dye molecules and a plurality of spacers arranged at intervals.

11. The dimming device according to claim 10, characterized in that: The width of the frame sealant is greater than or equal to 4 mm and less than or equal to 6 mm; and / or the distance between the outer peripheral edge of the frame sealant and the inner peripheral edge of the sealant frame is greater than or equal to 1 mm and less than or equal to 1.5 mm.

12. The dimming device according to claim 10, characterized in that: The height of the spacer is greater than or equal to 10 μm and less than or equal to 20 μm.

13. The dimming device according to claim 12, wherein: The height of the spacer is greater than or equal to 10 μm and less than or equal to 15 μm.

14. The dimming device according to claim 12, wherein: The distance between adjacent spacers is greater than or equal to 0.2 mm and less than or equal to 1 mm.

15. The dimming device according to claim 12, wherein: The spacer has a shape of a truncated cone, wherein the maximum radius of the truncated cone is greater than or equal to 12 μm and less than or equal to 17 μm; and the minimum radius of the truncated cone is greater than or equal to 5 μm and less than or equal to 10 μm.

16. The dimming device according to claim 1, wherein: The height of the dimming functional layer is greater than or equal to 0.21 mm and less than or equal to 0.38 mm.

17. The dimming device according to claim 1, wherein: The width of the plastic frame is greater than or equal to 20 mm and less than or equal to 30 mm.

18. The dimming device according to claim 1, wherein: The thickness of the first substrate and the second substrate are both greater than or equal to 1.6 mm and less than or equal to 2.1 mm.

19. The dimming device according to claim 1, wherein: The first substrate and the second substrate are both planar glass substrates, or glass substrates having curvature in a first direction, or glass substrates having curvature in both a first direction and a second direction intersecting with each other.

20. The dimming device according to claim 1, wherein: The curvature in the first direction is greater than or equal to 12 mm / m and less than or equal to 39 mm / m; the curvature in the second direction is greater than or equal to 19 mm / m and less than or equal to 26 mm / m, and the first direction and the second direction intersect with each other.

21. A dimming device, characterized in that: It includes a first substrate, a first adhesive layer, a dimming functional layer and an explosion-proof laminated layer which are stacked in sequence; The explosion-proof laminate includes at least two explosion-proof layers and at least two second adhesive layers; the explosion-proof layers and the second adhesive layers are alternately arranged, and the second adhesive layer closest to the dimming functional layer is located on the side of the explosion-proof layer closest to the dimming functional layer close to the dimming functional layer.

22. The dimming device according to claim 21, characterized in that: The material of the explosion-proof layer includes plastic; the material of the second adhesive layer includes optical adhesive.

23. The dimming device according to claim 21, wherein: The thickness of the explosion-proof laminate is greater than or equal to 100 μm and less than or equal to 500 μm.

24. The dimming device according to claim 21, characterized in that The dimming device further includes a glue frame, which is located between the first substrate and the explosion-proof laminate and surrounds the first adhesive layer and the dimming function layer.

25. A dimming structure comprising the dimming device according to any one of claims 1 to 24; the dimming structure comprises one of a curtain wall, a skylight, a rail vehicle and a passenger car.

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