Acoustic device

Abstract

Provided in the present specification is an acoustic device. The acoustic device comprises a housing, a waterproof assembly, an acoustic assembly, a fixing assembly, and a sealing member. The housing comprises an outer wall, an inner wall, an accommodation cavity and a sound port, the sound port being formed in the accommodation cavity and penetrating through the housing and being used for communicating the accommodation cavity with an external space of the housing. The waterproof assembly is arranged in the accommodation cavity and covers the sound port, so as to prevent liquid from entering an internal space of the housing from the external space of the housing. The acoustic assembly comprises an acoustic sensor, and the acoustic assembly is arranged on the side of the waterproof assembly away from the sound port and forms a first gap with the inner wall. The fixing assembly is arranged on the inner wall, and is used for fixing the acoustic assembly and the waterproof assembly in the internal space. The sealing member seals the first gap. By arranging the waterproof assembly at the sound port and using the fixing assembly to fix the acoustic assembly and the waterproof assembly, liquid can be better prevented from flowing into the housing, thereby improving the waterproof capability of the acoustic device.

Description

An acoustic device Technical Field

[0001] The present invention relates to the technical field of electronic equipment, and in particular to an acoustic device. Background Art

[0002] The shell of an acoustic device is usually provided with a sound hole for sound to pass from the external environment to the inside of the acoustic device or from the inside of the acoustic device to the external environment. When the acoustic device is used outdoors or in a humid environment, liquids such as water can easily enter the acoustic device through the sound hole on the shell. For example, the microphone of a wireless headset must have a sound hole to pick up ambient sound and ensure call quality, thereby performing air conduction sound transmission. When a user wears a wireless headset for underwater activities (such as swimming), water will enter the headset through the sound hole. When a wireless headset gets wet, it may not only affect the normal use function of its internal components, such as causing the microphone or speaker to fail, but may even cause a circuit short circuit on the motherboard or some components, resulting in the user being unable to use it normally.

[0003] Therefore, existing acoustic equipment needs to take certain measures to improve its waterproof protection performance, especially the waterproof protection of components such as microphones and speakers should be strengthened.

[0004] Summary of the Invention

[0005] The present specification provides an acoustic device, which includes a shell, a waterproof component, an acoustic component, a fixing component and a sealing member; the shell includes an outer wall, an inner wall, a accommodating cavity and a sound hole, the sound hole is arranged in the accommodating cavity and passes through the shell to connect the accommodating cavity with the external space of the shell, and the sound hole includes a first opening on the outer wall and a second opening on the inner wall; the waterproof component is arranged in the accommodating cavity and covers the sound hole to prevent liquid from entering the internal space of the shell from the external space of the shell; the acoustic component includes an acoustic sensor, the acoustic component is placed on the side of the waterproof component away from the sound hole and forms a first gap with the inner wall; the fixing component is arranged on the inner wall to fix the acoustic component and the waterproof component in the internal space; and the sealing member seals the first gap.

[0006] In some embodiments, the acoustic component further includes a circuit board, which is provided with at least one first fixing hole and is mechanically connected to the acoustic sensor; the fixing component includes at least one fixing part, and the at least one fixing part and the at least one first fixing hole are matched one-to-one.

[0007] In some embodiments, each of the fixing members includes a rod and a head, wherein the first end of the rod is connected to the inner wall and the second end is connected to the head; the rod of each fixing member passes through the first fixing hole corresponding to it, and the head of each fixing member presses against the circuit board along a first direction to fix the acoustic component and the waterproof component in the internal space, wherein the first direction is perpendicular to the upper surface of the circuit board.

[0008] In some embodiments, the acoustic assembly further includes a reinforcement member, the reinforcement member being located between the circuit board and the waterproof assembly, the reinforcement member including at least one second fixing hole; and the rod portion of each fixing member passes through the second fixing hole corresponding thereto.

[0009] In some embodiments, the acoustic component further includes a circuit board and a reinforcement member, wherein the reinforcement member is located between the waterproof component and the circuit board and is mechanically connected to the circuit board; the reinforcement member is provided with at least one third fixing hole, and the fixing component includes at least one fixing member, and the at least one fixing member and the at least one third fixing hole are matched one-to-one.

[0010] In some embodiments, the circuit board is a flexible circuit board; the reinforcement is plate-shaped and has a stiffness greater than that of the circuit board.

[0011] In some embodiments, the inner wall is an arc-shaped surface, and the inner wall also includes an assembly groove. The accommodating cavity is in the assembly groove, and the bottom surface of the assembly groove is a plane. The circuit board is at least partially installed in the assembly groove and abuts against the bottom surface of the assembly groove. The shape of the assembly groove matches the circuit board or the reinforcement to limit the movement of the acoustic component in the direction extended by the circuit board surface.

[0012] In some embodiments, the at least one fixing member includes a screw and / or a heat stake; and the at least one fixing member is distributed around the accommodating cavity.

[0013] In some embodiments, the thickness of the waterproof component in a free state is greater than the depth of the accommodating cavity.

[0014] In some embodiments, the waterproof component includes a waterproof membrane and a buffer component; the waterproof membrane is provided with a central hole, and the buffer component abuts against an edge area of ​​the waterproof membrane.

[0015] In some embodiments, the waterproof component has a first adhesive surface and a second adhesive surface; the first adhesive surface is sticky so that the waterproof component can be adhered to the bottom wall of the accommodating cavity after being subjected to external pressure; and the second adhesive surface is sticky so that the waterproof component and the acoustic component can be adhered when in contact with the acoustic component.

[0016] In some embodiments, the acoustic device is an earphone, and the acoustic sensor is a microphone and / or a speaker.

[0017] In some embodiments, the seal is obtained by providing a fluid sealing material into the first gap and then curing the fluid sealing material.

[0018] In some embodiments, the fluid sealing material is a sealant.

[0019] In some embodiments, the waterproof component is arranged on the bottom wall of the accommodating cavity, the central axis of the sound hole is inclined relative to the bottom wall; and the second opening is smaller than the first opening; and the average diameter of the sound hole is 0.6mm-1.2mm.

[0020] In some embodiments, the acoustic sensor includes a first acoustic sensor and a second acoustic sensor; the accommodating cavity includes a first accommodating cavity and a second accommodating cavity, accommodating the first acoustic sensor and the second acoustic sensor respectively.

[0021] As can be seen from the above technical solution, the acoustic device provided in this specification provides a waterproof component at the sound hole to prevent liquid from flowing into the acoustic component, thereby ensuring the waterproof capability of the acoustic device. Furthermore, the acoustic device provides a fixing component to secure the waterproof component and the acoustic component within the housing, thereby further preventing liquid from flowing into the housing and thus improving the liquid-proof capability of the acoustic device.

[0022] Other functions of the acoustic device provided by this specification will be partially listed in the following description. The creative aspects of the acoustic device provided by this specification can be fully explained by practicing or using the methods, devices and combinations described in the following detailed examples. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of this specification, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] FIG1 shows a structural diagram of an acoustic device provided according to some embodiments of this specification;

[0025] FIG2A shows an AA cross-sectional view of the acoustic device shown in FIG1 according to this specification;

[0026] FIG2B shows a schematic diagram of a receiving cavity provided in some embodiments of this specification;

[0027] FIG3 is a schematic diagram showing the structure of various parts of an acoustic device provided according to some embodiments of this specification;

[0028] FIG4 shows a schematic structural diagram of an acoustic assembly including two acoustic sensors according to some embodiments of this specification;

[0029] FIG5A shows a schematic structural diagram of an acoustic device provided according to an embodiment of this specification;

[0030] FIG5B shows a schematic structural diagram of another acoustic device provided according to an embodiment of this specification;

[0031] FIG5C shows a schematic structural diagram of another acoustic device provided according to an embodiment of this specification;

[0032] FIG6A shows a schematic diagram of the shape of a hot melt column before hot melting according to some embodiments of this specification;

[0033] FIG6B is a schematic diagram showing the shape of the hot melt column shown in FIG6A after hot melting according to the present application. DETAILED DESCRIPTION

[0034] The following description provides specific application scenarios and requirements of the present application, with the purpose of enabling those skilled in the art to make and use the content of this application. Various local modifications to the disclosed embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of this application. Therefore, this application is not limited to the embodiments shown, but is intended to be of the widest scope consistent with the claims.

[0035] The terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. For example, as used herein, the singular forms "a," "an," and "the" may also include the plural forms unless the context clearly indicates otherwise. When used in this specification, the terms "comprise," "include," and / or "contain" are intended to refer to the presence of the associated integers, steps, operations, elements, and / or components, but do not preclude the presence of one or more other features, integers, steps, operations, elements, components, and / or groups or the addition of other features, integers, steps, operations, elements, components, and / or groups in the system / method.

[0036] In this application, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0037] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0038] Furthermore, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0039] In this specification, "X includes at least one of A, B, or C" means that X includes at least A, or X includes at least B, or X includes at least C. In other words, X may include only any one of A, B, and C, or any combination of A, B, and C, as well as other possible contents / elements. Any combination of A, B, and C may be A, B, C, AB, AC, BC, or ABC.

[0040] In this specification, unless otherwise specified, the association relationship between structures can be a direct association relationship or an indirect association relationship. For example, when describing "A is connected to B", unless it is clearly stated that A is directly connected to B, it should be understood that A can be directly connected to B or indirectly connected to B; for another example, when describing "A is above B", unless it is clearly stated that A is directly above B (AB are adjacent and A is above B), it should be understood that A can be directly above B or indirectly above B (AB is separated by other elements and A is above B). And so on.

[0041] These and other features of the present application, as well as the operation and function of the related elements of the structure, and the economy of assembly and manufacture of the components, can be significantly improved in view of the following description. Reference is made to the accompanying drawings, all of which form a part of this application. However, it should be clearly understood that the drawings are for illustration and description purposes only and are not intended to limit the scope of this application.

[0042] The following description may significantly improve these and other features of the present application, as well as the operation and function of the related elements of the structure, and the economic efficiency of the assembly and manufacture of the components. All of which are incorporated herein by reference in their entirety into the accompanying drawings, which form a part of this application. However, it should be expressly understood that the drawings are for illustration and description purposes only and are not intended to limit the scope of this application. It should also be understood that the drawings are not drawn to scale.

[0043] The present application is described in detail below through specific embodiments:

[0044] The shell of an acoustic device is usually provided with a sound hole for sound to pass from the external environment to the inside of the acoustic device or from the inside of the acoustic device to the external environment. For example, in order to ensure the call quality, a wireless headset with a call function will leave a sound hole for the microphone to pick up the sound to receive the sound transmitted through the air. In order to prevent liquids such as water from entering the acoustic device after the acoustic device is used in the wild or in a humid environment, and to ensure that the acoustic device can still work normally, the sound hole of the acoustic device needs to be treated with liquid-proof. This specification provides an acoustic device, which has a liquid-proof treatment on the sound hole and uses a fixing component to fix the acoustic component and the waterproof component, so as to better prevent liquid from flowing into the shell, thereby improving the liquid-proof ability of the acoustic device. The liquids in this specification include but are not limited to water, oil, sweat and other liquids. For the convenience of description, water is used as an example below.

[0045] Figure 1 shows a block diagram of an acoustic device 01 provided according to some embodiments of this specification. The acoustic device 01 shown in Figure 1 is a (wireless) headset. The following description will use the (wireless) headset as an example. The (wireless) headset can be a bone conduction headset, an air conduction headset, or a bone-to-air conduction headset. It should be understood that the acoustic device 01 can also be other acoustic devices such as a mobile phone, a computer, or a recorder.

[0046] Figure 2A shows an AA cross-sectional view of the acoustic device 01 shown in Figure 1 of this specification. Figure 2B shows a schematic diagram of a housing 130 provided in some embodiments of this specification. As shown in Figure 2A, the acoustic device 01 may include a housing 10, a waterproof component 20, an acoustic component 30, a fixing component 40, and a sealing member 50 (not shown in Figures 2A and 2B).

[0047] As shown in Figure 2B, the shell 10 can be an installation component of the acoustic device 01. Other components of the acoustic device 01 (such as the waterproof component 20, the acoustic component 30, the fixing component 40, etc.) can be installed with the shell 10 as a carrier. The shell 10 may include an inner wall 110 and an outer wall 120. The outer wall 120 may be the appearance surface of the acoustic device 01 that is finally presented to the user. The outer wall 120 may be a smooth curved surface. The inner wall 110 may be provided with grooves or protrusions for easy assembly. The inner wall 110 of the shell 10 may include a shell bottom wall 111 and a shell side wall 112. The shell bottom wall 111 and the shell side wall 112 together enclose an internal space, and other components of the acoustic device 01 may be arranged in the internal space. The fixing component 40 may be arranged on the inner wall 110. In some embodiments, the inner wall 110 may be an arcuate surface, and the inner wall 110 also includes an assembly groove 113.

[0048] The shape of the shell 10 can be any shape, for example, it can be a runway shape (rounded rectangle) or a circle. In some embodiments, the shell 10 can include two parts. After the other parts are assembled, the two parts are buckled together to form the appearance of the acoustic device 01 seen by the user. The shape of the shell 10 can be any shape. For example, when the acoustic device 01 is a wireless headset, the shell 10 can be a shape that conforms to the contour of the human ear, so that the wireless headset can be worn more firmly on the user's ear. The material of the shell 10 can be any material, such as metal, plastic, polymer, etc. This application does not limit the shape and material of the shell 10.

[0049] The housing 10 may include a housing cavity 130 for accommodating other components, such as the waterproof assembly 20. In some embodiments, the inner wall 110 of the housing 10 may form a housing sidewall 131 and a housing bottom wall 132 of the housing cavity 130. For example, the housing bottom wall 111 or the housing sidewall 112 of the housing 10 may form the housing bottom wall 132 and the housing sidewall 131, or the housing bottom wall 111 may form a portion of the housing bottom wall 132 and the housing sidewall 131, and the housing sidewall 112 may form another portion of the housing sidewall 131. In some embodiments, the housing cavity 130 may be a space enclosed by other components. As shown in FIG. 2B , the housing cavity 130 may also be within the assembly groove 113.

[0050] The accommodating cavity 130 may be provided with a sound hole 133, which passes through the shell 10. For example, a sound hole 133 may be provided on the accommodating bottom wall 132 of the accommodating cavity 130. The sound hole 133 allows sound waves to pass through. External sound waves can enter the shell 10 through the sound hole 133 and be collected by the acoustic component 30. Sound waves emitted by the acoustic component 30 can also be transmitted to the outside world through the sound hole 133. Due to the cutting position, the complete structure of the sound hole 133 is not shown in Figure 2A. As an example, Figure 3 shows a schematic structural diagram of various parts of an acoustic device 01 provided according to some embodiments of this specification. As can be seen from Figure 3, the sound hole 133 passes through the shell 10. The sound hole 133 may include a first opening 133-A on the outer wall 120 and a second opening 133-B on the inner wall 110.

[0051] In some embodiments, the second opening 133-B is smaller than the first opening 133-A. In other words, the sound hole 133 can be shaped like a trumpet, larger on the outside and smaller on the inside. Designing the sound hole 133 in a trumpet shape not only makes it easier for the user to clean out foreign matter, such as solids or liquids, that has entered the sound hole 133, but also facilitates smooth demolding during the processing of the sound hole 133. The shape of the sound hole 133 can be any shape, such as circular, elliptical, square, rectangular, etc., and this application does not limit the shape of the sound hole 133.

[0052] In some embodiments, the central axis of the sound hole 133 can be tilted relative to the bottom wall 132 to prevent water from entering the interior of the housing 10 through the sound hole 133. The central axis of the sound hole 133 can be a line connecting the center of the first opening 133-A on the outer wall 120 and the center of the second opening 133-B on the inner wall 110. The angle of inclination of the central axis of the sound hole 133 relative to the bottom wall 132 can be selected based on the design and processing requirements of the product, without affecting the acoustic performance of the acoustic device 01. In some embodiments, the inclination angle can be in the range of [30, 90) degrees. When the inclination angle is in the range of [60, 90) degrees, while ensuring a certain degree of inclination, the processing difficulty of the sound hole 133 is reduced. When the inclination angle is in the range of [30, 60] degrees, ensuring the inclination angle is within this range, the ability to prevent water from entering the interior of the housing 10 through the sound hole 133 is further improved. In some applications, such as swimming, by tilting the sound hole 133, water will not flow directly into the sound hole 133 when the acoustic device 01 is subjected to dynamic water pressure, thereby improving the waterproof capability of the acoustic device 01 under dynamic water pressure. In some embodiments, the central axis of the sound hole 133 can be perpendicular to the bottom wall 132, that is, the angle between the central axis and the bottom wall 132 is 90 degrees, to reduce the difficulty of machining the sound hole 133. The shape of the sound hole 133 can be any shape, such as circular, elliptical, square, rectangular, etc. This specification does not limit the shape of the sound hole 133.

[0053] In some embodiments, the sound hole 133 can also be a through hole. That is to say, the sound path of the sound hole 133 is bent, so that the whole is similar to an "L" shape. Among them, with the bending point as the boundary, there is a non-zero angle between the central axis before the bending and the central axis after the bending. The angle can be 90 degrees, thus forming the above-mentioned "L" shape; the angle can also be non-90 degrees, for example, greater than 90 degrees. The sound hole 133 is designed as a through hole, and the design of the angle of the sound hole 133 can ensure that when the acoustic device 01 is subjected to dynamic water pressure, the water flow will not directly flow into the sound hole 133 and then enter the interior of the acoustic device 01, thereby increasing the dynamic waterproof capability of the acoustic device 01.

[0054] In some embodiments, the average diameter of the sound hole 133 is 0.6 mm to 1.2 mm, so as to reduce the possibility of liquid entering the interior of the housing 10 while not affecting the sound pickup of the acoustic device 01. The average diameter may refer to the average of the diameters of the first opening 133-A and the second opening 133-B of the sound hole 133.

[0055] In some embodiments, the sound hole 133 has a cylindrical structure. The diameter of any cross-section of the cylinder ranges from 0.6 mm to 1.2 mm, with the cross-section being perpendicular to the central axis of the sound hole 133. In some embodiments, the sound hole 133 has a frustum structure. The diameter of any cross-section of the frustum ranges from 0.6 mm to 1.2 mm, with the cross-section being perpendicular to the central axis of the sound hole 133.

[0056] In some embodiments, the acoustic device 01 may include a plurality of accommodating chambers 130 to accommodate a plurality of components respectively. For example, as shown in FIG2B , the accommodating chamber 130 may include a first accommodating chamber 130-A and a second accommodating chamber 130-B. The first accommodating chamber 130-A may be arranged on the bottom wall 111 of the shell, and the second accommodating chamber 130-B may be arranged on the side wall 112 of the shell, so that the sound holes 133 in different accommodating chambers 130 can receive sounds from different directions or transmit sounds to different directions. In some embodiments, the first accommodating chamber 130-A and the second accommodating chamber 130-B may both be arranged on the bottom wall 111 or the side wall 112 of the shell to enhance the ability of the sound holes 133 to receive sounds from the same direction or transmit sounds to the same direction. The first accommodating chamber 130-A and the second accommodating chamber 130-B may respectively accommodate different components, and the specific contents will be described below.

[0057] In some embodiments, the acoustic device 01 may include a sealing member 50 . The sealing member 50 may seal the assembly gaps between the components in the accommodating cavity 130 to improve the waterproof performance of the acoustic device 01 .

[0058] 3 , the waterproof component 20 is disposed in the accommodating cavity 130 and covers the sound hole 133 to prevent liquid from entering the interior of the housing 10 from the exterior space. The acoustic component 30 is disposed on a side of the waterproof component 20 away from the sound hole 133 .

[0059] In some embodiments, as shown in FIG3 , the waterproof component 20 may include a waterproof membrane 210 and a buffer 220. The waterproof membrane 210 may allow air molecules to pass through and block water molecules from passing through the waterproof membrane 210. The waterproof membrane 210 may be made of a waterproof and breathable material having an equivalent microporous structure. The characteristic of the waterproof and breathable material is that air molecules can pass through the equivalent microporous structure, but water molecules cannot pass through the equivalent microporous structure. When the acoustic device 01 is working, when sound waves propagate to the interface of the waterproof membrane 210, air molecules can freely enter and exit the equivalent microporous structure in the waterproof membrane 210 due to the larger distance between molecules and the smaller molecules. For example, ambient sound waves pass through the waterproof membrane 210 and are collected by a microphone, or sound waves generated by a speaker pass through the waterproof membrane 210 to the outside of the acoustic device 01.

[0060] The buffer member 220 may have a central hole 221 formed therein and may abut against the edge of the waterproof membrane 210. Specifically, the non-perforated edge region of the buffer member 220 abuts against the edge of the waterproof membrane 210. Specifically, the edge region of the buffer member 220 abuts against the edge region of the waterproof membrane 210. In other words, the waterproof membrane 210 may completely cover the central hole 221 of the buffer member 220, thereby preventing liquid flowing through the central hole 221 from being blocked by the waterproof membrane 210.

[0061] In some embodiments, the center hole 221 and the second opening 133-B of the sound hole 133 are not coaxial. In some embodiments, the center hole 221 and the second opening 133-B of the sound hole 133 are coaxial, allowing the waterproof membrane 210 to be evenly subjected to the water pressure flowing from the sound hole 133. This reduces the risk of damage to the waterproof membrane 210 due to uneven water pressure, which could reduce or even render the waterproofing effectiveness of the waterproof assembly 20 ineffective. The center hole 221 and the second opening 133-B are coaxial, meaning that the central axis of the center hole 221 coincides with the central axis of the second opening 133-B.

[0062] The shape of the center hole 221 can be any shape such as circular, elliptical, square, rectangular, etc., and this specification does not limit the shape of the center hole 221. In some embodiments, the shape of the center hole 221 can be adapted to the shape of the sound hole 133, and the aperture of the center hole 221 can be larger than the aperture of the sound hole 133, so that a larger area of ​​the waterproof membrane 210 can be sound-permeable, thereby reducing acoustic loss. Herein, the aperture refers to the diameter of the hole. In some embodiments, the aperture of the center hole 221 can be 0.8mm-1.8mm. While adapting to the accommodating space of the accommodating cavity 130 and the aperture of the sound hole 133, the aperture of the center hole 221 is enlarged to increase the area of ​​the waterproof membrane 210 that withstands water pressure. In some embodiments, the aperture of the sound hole 133 can be the above-mentioned 0.6mm-1.2mm. While not affecting the sound pickup of the acoustic device 01, the aperture is made smaller to reduce the possibility of liquid entering the interior of the shell 10.

[0063] In some embodiments, the waterproof component 20 may have an adhesive surface, so that after the waterproof component 20 is placed in the accommodating cavity 130, the adhesive surface and the accommodating bottom wall 132 of the accommodating cavity 130 are bonded together, thereby achieving a sealed connection and fixing the waterproof component 20. For example, the waterproof component 20 may have a first adhesive surface 222 and a second adhesive surface 223. The first adhesive surface 222 can adhere the waterproof component 20 to the accommodating cavity 130 after being subjected to external pressure. For example, the external pressure can be provided by the gravity of the acoustic component 30, or by manual direct contact with the waterproof component 20. In some embodiments, pressure can also be applied to the waterproof component 20 using a pressure jig.

[0064] The second bonding surface 223 can seal and bond the waterproof component 20 and the acoustic component 30 when they are in contact. Specifically, the waterproof component 20 can have two buffer members 220, which are distributed on both sides of the waterproof membrane 210. The two surfaces of the buffer member 220 facing the accommodating cavity 130 and the acoustic component 30 can be sticky. After the waterproof component 20 is placed in the accommodating cavity 130, the external pressure applies a preset pressure to the waterproof component 20, so that the waterproof component 20 can be firmly bonded to the accommodating bottom wall 132. By providing the bonding surface, the waterproof component 20 is fixed in the accommodating cavity 130 by bonding, achieving a waterproof effect while ensuring the simplicity and convenience of the operation process.

[0065] Furthermore, the buffer 220 can also be elastic. The buffer 220 can evenly distribute the physical pressure (impact energy) applied to the waterproof component 20. During the installation process of the waterproof component 20, the buffer 220 can protect the waterproof membrane 210 from wrinkling due to large impacts, thereby affecting its waterproof and acoustic properties. In some embodiments, the material of the buffer 220 can be foam glue, foam + acrylic glue (acrylate adhesive), or acrylic glue (acrylate adhesive). In some embodiments, the thickness range of a single buffer 220 is greater than or equal to 0.1 mm. When the buffer 220 has a certain thickness, it can increase the height / thickness of the waterproof component 20, thereby making the waterproof component 20 easier to install and disassemble, and easier to assemble the waterproof component 20 into the housing 10. In addition, when the buffer 220 has a certain thickness, it can increase the deformability of the waterproof component 10, thereby being able to adapt to the manufacturing errors of different housings 10 and easier to assemble the waterproof component 20 into the housing 10.

[0066] In some embodiments, the waterproof membrane 210 can be directly connected to support members at both ends, which are then connected to the buffer member 220. The support members can reduce the degree of wrinkling of the waterproof membrane 210 during assembly of the waterproof assembly 20. When the waterproof assembly 20 is assembled into the earphone housing 10, it is subjected to external pressure. This pressure can be the weight of the acoustic assembly 30 or the pressure applied by a pressure jig. This pressure may have a lateral component, meaning that the waterproof membrane 210 is subjected to lateral shear forces. If the waterproof membrane 210 were to withstand this shear force alone, it would wrinkle. Due to the strong deformation resistance of the support members, the support members will hardly deform when subjected to shear forces. Therefore, the support of the waterproof membrane 210 by the support members also enhances its deformation resistance, thereby reducing the degree of wrinkling of the waterproof membrane 210 during assembly. The degree of wrinkling of the waterproof membrane can be determined by the height difference between the highest and lowest points of the wrinkled waterproof membrane, based on the flat state of the waterproof membrane. The greater the height difference, the greater the wrinkling; the smaller the height difference, the less wrinkling. In some embodiments, the support member can be made of polyethylene terephthalate (PET). PET has excellent shear strength and can provide support for the waterproof membrane 10. In some embodiments, the thickness of a single support member is 0.1 mm or less, minimizing the space occupied within the housing 10 while ensuring support strength. In some embodiments, one side of the support member is connected to the waterproof membrane 210, and the other side of the support member is connected to the buffer member 220.

[0067] In some embodiments, the support member and the waterproof membrane 210 are bonded together by an adhesive layer. In some embodiments, the adhesive layer is acrylic glue. Acrylic glue has relatively high strength and rigidity. Using acrylic glue to bond the support member and the waterproof membrane 210 can ensure that when the support member and the waterproof membrane 210 are subjected to lateral forces, the adhesive layer is not easily deformed, thereby causing deformation of the waterproof membrane 210. To ensure a strong bond, the thickness of the adhesive layer should not be too thin or too thick, so as to facilitate the processing of the waterproof assembly 20 and ensure that the "sandwich" structure of the waterproof membrane 210 sandwiched between the two support members has greater strength. In some embodiments, the thickness of a single adhesive layer can range from 0.03 mm to 0.05 mm.

[0068] In some embodiments, the thickness of the waterproof assembly 20 in a free state is greater than the depth of the accommodating cavity 130. In other words, the height of the buffer member 220 (the waterproof assembly 20) when not compressed by an external force is higher than the height of the accommodating sidewall 131 of the accommodating cavity 130, so that the waterproof assembly 20 can be compressed by the acoustic assembly 30 or other components after being assembled into the accommodating cavity 130.

[0069] In order to reduce the difficulty of assembling the waterproof component 20, the acoustic component 30 and the accommodating cavity 130, the size of the waterproof component 20 and the size of the acoustic component 30 can be slightly smaller than the size of the accommodating cavity 130. As shown in Figure 3, the acoustic component 30 can form a first gap I1 with the inner wall 110 of the shell. The first gap I1 can be sealed using a sealant 50. In some embodiments, the sealant 50 can be obtained by providing a fluid sealing material to the first gap I1 and then solidifying it. The fluid sealing material can be a sealant. For example, the sealant can be an ultraviolet ray glue (UV glue for short), silicone or hot melt glue, etc. The fluidity of the fluid sealing material can be used to make the sealant 50 not only fill the first gap, but also fill the assembly gaps of various components to improve the waterproofness of the acoustic device 01.

[0070] The acoustic assembly 30 may include an acoustic sensor 310 and a circuit board 320. In some embodiments, the acoustic assembly 30 may be located outside the accommodating cavity 130, as shown in FIG2A . In some embodiments, the acoustic assembly 30 may be at least partially located inside the accommodating cavity 130. For example, the circuit board 320 may be located inside the accommodating cavity 130, and the acoustic sensor 310 may be located outside the accommodating cavity 130. The acoustic sensor 310 may receive or emit sound. For example, if the acoustic device 01 is a headset, the acoustic sensor 310 may include at least one of a microphone and a speaker.

[0071] In some embodiments, the acoustic device 01 may include a single acoustic component 30. In some embodiments, the acoustic device 01 may also include multiple acoustic components 30, thereby including multiple acoustic sensors 310, to achieve more functions. For example, the acoustic device 01 includes two acoustic components 30. As an example, Figure 4 shows a structural schematic diagram of the acoustic device 01 provided according to some embodiments of this specification including two acoustic components 30. The acoustic device 01 includes a first acoustic component 30-A and a second acoustic component 30-B. The first acoustic component 30-A includes a first acoustic sensor 311, and the second acoustic component 30-B includes a second acoustic sensor 312. For example, when the acoustic sensor 310 is a microphone, two microphones are provided in the headset to achieve a noise reduction effect. One microphone can be a microphone used by ordinary users when making calls, for collecting human voices. The other microphone can have a noise collection function, which is convenient for collecting noise from the surrounding environment.

[0072] In some embodiments, the first acoustic sensor 311 and the second acoustic sensor 312 can be placed on the same circuit board 320. That is, the first acoustic sensor 311 and the second acoustic sensor 312 are connected using the same circuit board 320. In some embodiments, the first acoustic sensor 311 and the second acoustic sensor 312 can also be placed on different circuit boards 320. The two circuit boards 320 of the two acoustic sensors 310 are mechanically connected. For example, the two circuit boards 320 of the two acoustic sensors 310 are connected via another connecting circuit board. For another example, the two circuit boards 320 of the two acoustic sensors 310 can be electrically connected via board-to-board connectors (BTB connectors). For another example, the two circuit boards 320 of the two acoustic sensors 310 can be electrically connected via wirebonds; this specification does not limit the connection method between the two acoustic sensors 310. As previously described, the housing 10 can include a first accommodating chamber 130-A and a second accommodating chamber 130-B. The first accommodating cavity 130 -A can accommodate the first acoustic sensor 311 , and the second accommodating cavity 130 -B can accommodate the second acoustic sensor 312 .

[0073] The acoustic assembly 30 may also include a circuit board 320. The circuit board 320 may be mechanically connected to the acoustic sensor 310. The mechanical connection mentioned herein may be bonding, SMT patching, welding, seam connection, riveting, etc. For example, the acoustic sensor 310 may be fixed to the circuit board 320 by means of an SMT patch. The circuit board 320 may be located between the acoustic sensor 310 and the waterproof assembly 20. As previously described, the acoustic assembly 30 may be bonded to the waterproof assembly 20 by means of the second bonding surface 223 of the buffer 220. Specifically, the circuit board 320 may be bonded to the second bonding surface 223 of the buffer 220, thereby connecting the acoustic assembly 30 to the waterproof assembly 20. In some embodiments, further pressure may be applied to the acoustic assembly 30 so that the circuit board 320 can be more firmly bonded to the second bonding surface 223. For example, pressure may be applied to the acoustic assembly 30 by pressing down on it with a pressure jig. For another example, pressure may be applied to the acoustic assembly 30 by placing a heavy object on it.

[0074] In some embodiments, the circuit board 320 may be a printed circuit board (PCB). PCBs are not easily bent and have a certain degree of rigidity, thus providing good support for the acoustic sensor 310. In some embodiments, the circuit board 320 may be a flexible printed circuit (FPC). FPCs are flexible and bendable. By bending the FPC, the space occupied by the housing 10 can be reduced. To increase the local thickness or rigidity of the FPC and ensure its flatness, the FPC may be reinforced locally or as a whole. For example, steel plates or PI (Polymide) material may be used as reinforcements 330 to reinforce the FPC. PI material is an engineering plastic with excellent mechanical properties, characterized by light weight, thinness, and good flexibility. The reinforcement 330 may be a reinforcing plate having greater rigidity than the circuit board 320. As shown in FIG3 , the reinforcement 330 may be located between the circuit board 320 and the waterproof assembly 20 and mechanically connected to the circuit board 320.

[0075] In some embodiments, the circuit board 320 may be at least partially located within the accommodating cavity 130. In some embodiments, the circuit board 320 may also be located outside the accommodating cavity 130. As shown in FIG4 , when the circuit board 320 is located outside the accommodating cavity 130, the circuit board 320 may abut against the top surface of the accommodating sidewall 131 of the accommodating cavity 130. As previously described, the bottom surface of the assembly slot 113 is flat, and the circuit board 320 is at least partially installed within the assembly slot 113 and abuts against the bottom surface of the assembly slot 113. The shape of the assembly slot 113 matches the circuit board 320 or the reinforcement member 330 to limit the movement of the acoustic assembly 30 in the direction in which the board surface of the circuit board 320 extends.

[0076] In some embodiments, the extension direction of the circuit board 320 can be designed based on connection requirements. As shown in Figure 4 , the first acoustic sensor 311 and the second acoustic sensor 312 share a single circuit board 320. Therefore, the circuit board 320 connected to the second acoustic sensor 312 extends from the housing side wall 112 to the housing bottom wall 111, and then connects to the first acoustic sensor 311.

[0077] Figure 5A shows a schematic diagram of the structure of an acoustic device 01 provided according to an embodiment of this specification. Figure 5B shows a schematic diagram of the structure of another acoustic device 01 provided according to an embodiment of this specification. Figure 5C shows a schematic diagram of the structure of another acoustic device 01 provided according to an embodiment of this specification. As previously shown, the fixing assembly 40 can be disposed on the inner wall 110.

[0078] In some embodiments, at least one first fixing hole 321 is provided on the circuit board 320. The fixing assembly 40 includes at least one fixing part 410. The at least one fixing part 410 and the at least one first fixing hole 321 are matched one-to-one, so that the acoustic component 30 and the waterproof component 20 can be fixed in the internal space of the shell 10. In some embodiments, each fixing part 410 includes a rod 411 and a head 412. The first end 411-A of the rod 411 is connected to the inner wall 110, and the second end 411-B of the rod 411 is connected to the head 412. The head 412 of each fixing part 410 presses against the circuit board 320 along the first direction F1, thereby fixing the acoustic component 30 and the waterproof component 20 in the internal space. The first direction F1 is perpendicular to the upper surface of the circuit board 320.

[0079] As mentioned above, the buffer 220 can be elastic and can be compressed. And the adhesion and sealing properties of the buffer 220 are related to the degree of compression (compression ratio). Take the buffer 220 as foam glue as an example for explanation. The sealing property of the foam glue, that is, the waterproof property and its adhesion are positively correlated with the compression ratio of the foam to a certain extent. In other words, the higher the compression amount of the foam glue, the higher the compression ratio, the better the sealing property of the foam and the stronger the bonding. Therefore, keeping the compression ratio of the foam glue above the preset value can ensure the good and stable waterproof performance of the acoustic device 01. Among them, the compression ratio of the buffer 220 can be expressed by

[0080] (Original thickness - thickness after compression) / original thickness x 100%

[0081] The compression ratio of the cushioning member 220 can be calculated using a formula. For example, the original thickness of the cushioning member 220 is first recorded. When the cushioning member 220 is pressed downward, its thickness after compression is recorded, thereby obtaining the compression ratio of the cushioning member 220. The preset value may depend on the material of the cushioning member 220. For example, if the cushioning member 220 is made of foam, the preset value of the compression ratio may be 30%, which ensures good sealing and adhesion of the foam.

[0082] Because the acoustic assembly 30 is relatively lightweight, the compression ratio of the buffer 220 may not reach the preset value when the acoustic assembly 30 is placed on the waterproof assembly 20. Therefore, in some embodiments, to increase the compression ratio of the buffer 220 to the preset value, a heavy object may be placed on the acoustic assembly 30. For example, a heavy object may be placed on the circuit board 320. The weight of the heavy object causes the circuit board 320 to press down on the buffer 220, maintaining the compression ratio above the preset value.

[0083] Therefore, the head 412 of each fixing member 410 presses against the circuit board 320 along the first direction F1, which can not only fix the acoustic component 30 and the waterproof component 20 in the internal space, but also apply pressure to the circuit board 320 to press down the buffer member 220, so that its compression ratio exceeds the preset value, ensuring that the foam glue has good sealing and adhesion, thereby ensuring the waterproof ability of the acoustic device 01.

[0084] In some embodiments, the reinforcement 330 includes at least one second fixing hole 331. The rod 411 of each fixing member 410 passes through the second fixing hole 331 corresponding to it. As shown in Figure 5B, the reinforcement 330 is located between the circuit board 320 and the waterproof component 20. The second fixing holes 331 and the first fixing holes 321 on the reinforcement 330 can all correspond one to one. That is, the rod 411 passes through the first fixing hole 321 and the second fixing hole 331 in sequence. In some embodiments, in addition to the second fixing holes 331 corresponding to the first fixing holes 321 on the reinforcement 330, additional second fixing holes 331 can also be provided in the portion not covered by the circuit board 320. By providing additional second fixing holes 331 on each reinforcement 330 and fixing them through the fixing members 410, the acoustic component 30 and the waterproof component 20 are fixed more firmly in the internal space.

[0085] In some embodiments, the circuit board 320 may not have fixing holes to avoid affecting the routing of the circuits in the circuit board 330. As shown in FIG5C , the reinforcement member 330 has at least one third fixing hole 332, and the fixing assembly 40 includes at least one fixing member 410. The at least one fixing member 410 corresponds to the at least one third fixing hole 332 to secure the acoustic assembly 30.

[0086] At least one fixing member 410 may be distributed around the accommodating cavity 130. In some embodiments, the number of fixing members 410 may be multiple, and this specification does not limit the number of fixing members 410, first fixing holes 321, second fixing holes 331, and third fixing holes 332. In some embodiments, there are multiple fixing members 410. Multiple fixing members 410 surround in various directions and fix the acoustic component 30 from multiple aspects. In some embodiments, when there are multiple fixing members 410, the multiple fixing members 410 are unevenly distributed in the accommodating cavity 130 to enhance the fixation of specific positions or specific components of the acoustic component 30. In some embodiments, when there are multiple fixing members 410, the multiple fixing members 410 are evenly or approximately evenly distributed around the accommodating cavity 130, so that the acoustic component 30 is subjected to uniform pressure, so that the buffer 220 can be compressed evenly. As shown in Figure 4, three fixing members 410 are provided on the shell 10, and three third fixing holes 332 are opened on the reinforcement member 330. The three third fixing holes 332 are distributed in a triangular shape around the accommodating cavity 130, so that the acoustic component 30 is firmly fixed and the pressure on the acoustic component 30 is relatively uniform. In some embodiments, four fixing members 410 are provided on the shell 10, and four third fixing holes 332 are opened on the reinforcement member 330. The four third fixing holes 332 and the four fixing members 410 can be arranged in a rectangular shape around the accommodating cavity 130, so that the pressure on the acoustic component 30 is relatively uniform while ensuring that all parts of the reinforcement member 330 can be pressed, thereby ensuring that the reinforcement member 330 is not easily lifted.

[0087] In some embodiments, the above-mentioned fixing member 410 can be a screw. When the fixing member 410 is a screw, the inner wall 110 of the fixing hole can be provided with a texture that matches the screw thread. By tightening the screw, the acoustic component 30 and the waterproof component 20 can be fixed in the internal space of the shell 10. And the head 412 of the tightened screw presses against the circuit board 320 along the first direction F1, so that the circuit board 320 presses down the buffer member 220. In some embodiments, the rod 411 and the head 412 of the fixing member 410 can be connected by a card slot buckle. After the circuit board 320 or the reinforcement member 330 is placed, the head 412 is snapped onto the rod 411 through the card slot buckle structure.

[0088] In some embodiments, the aforementioned fixing member 410 may be 410', made of a hot-melt material, such as plastic. When the circuit board 320 is an FPC, due to its relatively high flexibility and densely distributed circuits, it is difficult to directly drill holes into it and contact it with the (higher temperature) hot-melt material. Therefore, when the fixing member 410 is a hot-melt post 410', the aforementioned solution of providing the third fixing hole 332 in the reinforcement member 330 can be adopted.

[0089] Figure 6A shows a schematic diagram of the shape of a heat-seal column 410' before heat-seal according to some embodiments of this specification. Figure 6B shows a schematic diagram of the shape of a heat-seal column 410' shown in Figure 6A after heat-seal according to this application. The heat-seal column 410' is shown by the shaded portion.

[0090] As shown in Figure 6A , before being heat-soldered, heat-soldered post 410' is a column that passes through third fixing hole 332, with a gap between it and circuit board 320 and reinforcement member 330. Heat-soldered post 410' can be a solid, ribbed, or hollow heat-soldered post, and this specification does not limit this. Heat-soldered post 410' can be melted and reshaped by heating. Heating heat-soldered post 410' can be performed by hot air heat-soldered, pulse heat-soldered, or ultrasonic heat-soldered, and this specification does not limit this.

[0091] As shown in Figure 6B , the formed heat-seal column 410' includes the aforementioned stem 411 and head 412. Head 412 is formed by the deformation of the top portion of the heat-seal column 410' after heat-seal. The stem 411 is inserted into the corresponding third fixing hole 332, and the head 412 abuts against the top surface of the circuit board 320, thereby securing the circuit board 320 to the top surface of the accommodating side wall 131 and compressing the waterproof assembly 20 (cushion 220).

[0092] The hot melt pressure method is used to form the originally columnar hot melt column 410' into a rivet-like structure, pressing the buffer part 220 downward and fixing the acoustic component 30 on the shell 10. Not only is the operation simple and efficient, but the hot melt material also seals the gap between the fixing part 410 and the third fixing hole 332 at the same time, and there is no need to seal the gap between the fixing part 410 and the third fixing hole 332 again. The operation is simple, efficient, and reduces costs.

[0093] It is worth noting that the height to which the hot melt column 410' can press down the waterproof assembly 20 after being heat-melted is related to the mass of the heat-melted portion of the hot melt column 410'. The greater the mass of the heat-melted portion, the greater the mass of the head portion 412 pressing down the circuit board 320, and the greater the compression of the waterproof assembly 20. The mass of the heat-melted portion is positively correlated with the height of the hot melt column 410'. Therefore, the height to which the hot melt column 410' can press down the waterproof assembly 20 after being heat-melted is related to the height of the heat-melted portion of the hot melt column 410'. The higher the height of the heat-melted portion, the greater the mass of the head portion 412 pressing down the circuit board 320, and the greater the compression of the waterproof assembly 20. It is important to note that the degree of compression of the buffer 220 should not be excessive; it is best to ensure that the sound-permeable area of ​​the waterproof membrane 210 is in a free, forceless state. In some embodiments, the free, forceless state of the waterproof membrane 210 can be described by the height of each laminated layer of the waterproof assembly 20 before and after lamination.

[0094] As previously described, the waterproof assembly 20 may include a buffer member 220, a waterproof membrane 210, a support member, and an adhesive layer. Taking the uncompressed waterproof assembly 20 as an example, which includes, in order, the buffer member 220 (thickness A1 mm), the support member (thickness B1 mm), the adhesive layer (thickness C1 mm), the waterproof membrane 210 (thickness D mm), the adhesive layer (thickness C2 mm), the support member (thickness B2 mm), and the buffer member 220 (thickness A2 mm), with a total thickness of T1, the following explains when the waterproof membrane 210 is in a free state. To ensure that the waterproof assembly 20 is compressed without lateral deformation, the compression ratio of the buffer member is 45% to 55%, and the compression ratio of the adhesive layer is 15% to 25%. The thickness of each layer after compression is as follows: buffer 220 (thickness range: 0.45A1-0.55A1mm), support member (thickness: B1mm), adhesive layer (thickness range: 0.15C1-0.25C1mm), waterproof membrane 210 (thickness: Dmm), adhesive layer (thickness range: 0.15C2-0.25C2mm), support member (thickness: B2mm), buffer 220 (thickness range: 0.45A2-0.55A2mm), for a total thickness of T2mm, where T2 < T1. Considering the manufacturing accuracy of housing 10, a certain margin can be allowed for the total thickness of waterproof assembly 20 after compression. After the waterproof component 20 is pressed and fixed in this way, the colloid (adhesive layer and buffer) is in a compressed state, but it is only compressed in the height direction and there is no lateral deformation. At this time, the lateral force on the waterproof membrane 210 is negligible, so the sound-transmitting area with a diameter of 0.8mm-1.8mm relative to the center hole 221 of the waterproof membrane 210 is basically in a powerless free state, reflecting the best and most consistent effect.

[0095] Due to manufacturing errors in the height and shape of the aforementioned hot melt column 410', it is difficult to ensure accurate deformation of the waterproof assembly 20 by simply controlling the mass of the hot melt column 410'. Therefore, the degree of deformation of the waterproof assembly 20 can be controlled by rationally designing the height of the accommodating cavity 130. As previously mentioned, the waterproof assembly 20 is located within the accommodating cavity 130. Therefore, the required compression amount of the waterproof assembly 20 can be calculated based on the difference between the combined height of the acoustic assembly 30 and the waterproof assembly 20 in the uncompressed state and the combined height of the three in the ideal compressed state. The height of the accommodating cavity 130 can then be rationally designed so that, in the uncompressed state, the upper surface of the buffer member 220 in the waterproof assembly 20 is a predetermined distance above the housing inner wall 110. That is, in the uncompressed state, the upper surface of the buffer member 220 is separated from the housing inner wall 110 by a predetermined distance. This predetermined distance can be the desired compression amount of the waterproof assembly 20. The amount of compression of the waterproof assembly 20 can be the amount of compression required for the buffer member 220, or the amount of compression of all compressible components in the waterproof assembly 20. Thus, by designing the height of the hot melt column 410' so that the force exerted by the hot melt column 410' on the circuit bar 320 / reinforcement member 330 after hot melting is just enough to push the reinforcement member 330 against the edge of the accommodating cavity 130, the waterproof assembly 20 can be compressed to the target state. This method is simple to operate, highly precise, improves efficiency, and reduces costs. In some embodiments, when the depth of the accommodating cavity 130 is 0.35 mm, the height of the hot melt column 410' before hot melting ranges from 0.6 mm to 1 mm, so that after hot melting, the hot melt column 410' can just push the reinforcement member 330 against the edge of the accommodating cavity 130 and leave the waterproof membrane 210 in a free state without any force.

[0096] In some embodiments, after the waterproof component 20 and the acoustic component 30 are secured within the housing 10, the surfaces of each component can be sealed with a sealant. The use of sealant can, on the one hand, strengthen the securement of the waterproof component 20 and the acoustic component 30 within the housing 10, preventing the hot melt column 410' from falling off during long-term use, which could cause the waterproof membrane 210 to change state and thus affect the acoustic and waterproof performance; on the other hand, it can ensure airtightness, ensuring airtightness between the interior and exterior of the earphone housing 10; and on the other hand, it can fill the gap between the waterproof component 20 and the accommodating sidewall 131 to prevent water from entering through the layers of the waterproof component 20 near the sidewall, causing waterproof failure. In some embodiments, the sealant can be UV glue, silicone, hot melt glue, etc.

[0097] In summary, after reading this detailed disclosure, those skilled in the art will appreciate that the foregoing detailed disclosure may be presented by way of example only and may not be limiting. Although not explicitly stated herein, those skilled in the art will understand that this application is intended to encompass various reasonable changes, improvements, and modifications to the embodiments. Such changes, improvements, and modifications are intended to be proposed by this application and are within the spirit and scope of the exemplary embodiments of this application.

[0098] In addition, certain terms in this application have been used to describe embodiments of the present application. For example, "one embodiment," "an embodiment," and / or "some embodiments" mean that a particular feature, structure, or characteristic described in conjunction with that embodiment may be included in at least one embodiment of the present application. Therefore, it is emphasized and should be understood that two or more references to "an embodiment," "one embodiment," or "an alternative embodiment" in various parts of this specification do not necessarily refer to the same embodiment. Furthermore, particular features, structures, or characteristics may be appropriately combined in one or more embodiments of the present application.

[0099] It should be understood that in the foregoing description of the embodiments of the present application, in order to help understand a feature and for the purpose of simplifying the present application, the present application sometimes combines various features in a single embodiment, drawing or its description. Alternatively, the present application disperses various features across multiple embodiments of the present application. However, this does not mean that the combination of these features is necessary. When reading the present application, it is entirely possible for those skilled in the art to extract some of the features and understand them as separate embodiments. In other words, the embodiments in the present application can also be understood as the integration of multiple secondary embodiments. This is also true when the content of each secondary embodiment is less than all the features of a single aforementioned disclosed embodiment.

[0100] In some embodiments, numbers expressing quantities or properties used to describe and claim certain embodiments of the present application should be understood as being modified in some cases by the terms "about," "approximately," or "substantially." For example, unless otherwise indicated, "about," "approximately," or "substantially" can represent a ±20% variation of the value it describes. Therefore, in some embodiments, the numerical parameters listed in the written description and the appended claims are approximate values ​​that can vary depending on the desired properties that a particular embodiment is attempting to obtain. In some embodiments, numerical parameters should be interpreted in light of the number of reported significant digits and by applying ordinary rounding techniques. Although some embodiments of the present application set forth a wide range of numerical ranges and parameters are approximate, the specific examples are listed as precisely as possible.

[0101] Each patent, patent application, patent application publication, and other materials, such as articles, books, specifications, publications, documents, articles, etc., cited herein is hereby incorporated by reference in its entirety for all purposes, except for any prosecution document history related thereto, any equivalent that may be inconsistent or conflicting with this document, or any equivalent prosecution document history that may have a limiting effect on the broadest scope of the claims now or hereafter associated with this document. For example, if there is any inconsistency or conflict between the description, definition, and / or use of terms associated with any incorporated material and the terminology, description, definition, and / or use associated with this document, the terminology in this document shall control.

[0102] Finally, it should be understood that the embodiments of the application disclosed herein are illustrations of the principles of the embodiments of the present application. Other modified embodiments are also within the scope of the present application. Therefore, the embodiments disclosed in the present application are merely examples and not limitations. Those skilled in the art can adopt alternative configurations based on the embodiments in the present application to implement the applications in the present application. Therefore, the embodiments of the present application are not limited to those embodiments that have been precisely described in the application.

Claims

1. An acoustic device, characterized in that, including a housing, including an outer wall, an inner wall, a receiving cavity and a sound hole, the sound hole is arranged in the receiving cavity and penetrates through the housing to communicate the receiving cavity with the external space of the housing, the sound hole includes a first opening on the outer wall and a second opening on the inner wall; a waterproof component, arranged in the receiving cavity and covering the sound hole to prevent liquid from entering the inner space of the housing from the external space of the housing; an acoustic component, including an acoustic sensor, the acoustic component is placed on a side of the waterproof component away from the sound hole and forms a first gap with the inner wall; a fixing component, arranged on the inner wall to fix the acoustic component and the waterproof component in the inner space; and a seal, sealing the first gap.

2. The acoustic device according to claim 1, wherein the acoustic component further includes a circuit board, and at least one first fixing hole is provided on the circuit board and is mechanically connected to the acoustic sensor; the fixing component includes at least one fixing member, and the at least one fixing member and the at least one first fixing hole are in one-to-one correspondence and cooperation.

3. The acoustic device according to claim 2, wherein each fixing member includes a rod portion and a head portion, the first end of the rod portion is connected to the inner wall, and the second end is connected to the head portion; the rod portion of each fixing member passes through the corresponding first fixing hole, and the head portion of each fixing member abuts against the circuit board in a first direction to fix the acoustic component and the waterproof component in the inner space, wherein the first direction is perpendicular to the upper surface of the circuit board.

4. The acoustic device according to claim 3, wherein, the acoustic component further includes a reinforcing member, the reinforcing member is located between the circuit board and the waterproof component, and the reinforcing member includes at least one second fixing hole; and the rod portion of each fixing member passes through the corresponding second fixing hole.

5. The acoustic device according to claim 1, wherein the acoustic component further includes a circuit board and a reinforcing member, the reinforcing member is located between the waterproof component and the circuit board and is mechanically connected to the circuit board; the reinforcing member is provided with at least one third fixing hole, the fixing component includes at least one fixing member, and the at least one fixing member and the at least one third fixing hole are in one-to-one correspondence and cooperation.

6. The acoustic device according to claim 4 or 5, characterized in that, the circuit board is a flexible circuit board; the reinforcing member is plate-shaped, and its stiffness is greater than that of the circuit board.

7. The acoustic device according to claim 4 or 5, characterized in that, the inner wall is an arc surface, and an assembly groove is further included on the inner wall, the receiving cavity is in the assembly groove, the bottom surface of the assembly groove is a plane, at least part of the circuit board is installed in the assembly groove and abuts against the bottom surface of the assembly groove, and the shape of the assembly groove matches the circuit board or the reinforcing member to limit the movement of the acoustic component in the direction extending on the board surface of the circuit board.

8. The acoustic device according to any one of claims 2-5, characterized in that, the at least one fixing member includes a screw and / or a heat melting column; and the at least one fixing member is distributed around the receiving cavity.

9. The acoustic device according to any one of claims 1-5, characterized in that, the thickness of the waterproof component in a free state is greater than the depth of the receiving cavity.

10. The acoustic device according to claim 9, characterized in that, the waterproof component includes: a waterproof film; and a buffer member, provided with a central hole, and the buffer member abuts against the edge area of the waterproof film.

11. The acoustic device according to claim 10, wherein The waterproof component has a first adhesive surface and a second adhesive surface; The first adhesive surface has adhesiveness so as to adhere the waterproof component to the accommodating bottom wall of the accommodating cavity after being subjected to an external pressure; and The second adhesive surface has adhesiveness so as to adhere the waterproof component and the acoustic component when contacting the acoustic component. The acoustic device is a headset, and the acoustic sensor is a microphone and / or a speaker.

12. The acoustic device according to claim 1, wherein The seal is obtained by providing a fluid sealing material to the first gap and then curing it.

13. The acoustic device according to claim 1, characterized in that, The fluid sealing material is a sealant.

14. The acoustic device according to claim 13, characterized in that, Wherein, 15. The acoustic device according to claim 1, wherein The waterproof component is arranged on the accommodating bottom wall of the accommodating cavity, and the central axis of the sound passage hole is inclined relative to the accommodating bottom wall; and The second opening is smaller than the first opening; and The average diameter of the sound passage hole is 0.6 mm - 1.2 mm.

16. The acoustic device according to claim 1, wherein The acoustic sensor includes a first acoustic sensor and a second acoustic sensor; The accommodating cavity includes a first accommodating cavity and a second accommodating cavity, which respectively accommodate the first acoustic sensor and the second acoustic sensor. ​

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