Distributed jet heat exchange device for power device

Abstract

The present invention relates to the technical field of heat exchange apparatuses for power devices. Disclosed is a distributed jet heat exchange device for a power device. The distributed jet heat exchange device comprises a housing, and a liquid intake cavity, a liquid output cavity and a heat exchange cavity are provided in the housing, wherein an outer surface of a bottom plate of the heat exchange cavity is in contact with the power device to exchange heat, and an inner surface of the bottom plate of the heat exchange cavity is covered with a triply periodic minimal surface structure layer; and a plurality of jet holes and liquid output holes are provided in a top plate of the heat exchange cavity, the jet holes are in communication with the liquid intake cavity by means of liquid distribution channels, and the liquid output holes are in communication with the liquid output cavity. By means of the provision of the triply periodic minimal surface structure layer in the heat exchange cavity, the present invention can significantly improve the heat exchange efficiency for a power device, thereby ensuring the working stability of the power device and prolonging the service life of the power device.

Description

A distributed jet heat exchange device for power devices Technical Field

[0001] The present invention relates to the technical field of heat exchange equipment for power devices, and in particular to a distributed jet heat exchange device for power devices. Background Art

[0002] The power density of power chips has now exceeded 1000W / cm 2 When a power chip operates under high heat flux density, if it cannot be efficiently cooled, the temperature rise of the power chip will greatly exceed the allowable value for normal operation, affecting the service life of the power chip.

[0003] As the heat load and power density of power chips increase, traditional thermoelectric cooling and single-phase liquid cooling technologies face significant technical challenges. Traditional jet heat exchange structures have significant cross-flow effects at the inlet and outlet, resulting in excessive system flow resistance, poor temperature uniformity, and insufficient heat transfer capacity.

[0004] With the development of additive manufacturing technology, the jet impact of multiple jet inlets and outlets combined with microstructured surface enhanced boiling heat transfer technology has begun to be applied to the thermal management and thermal testing of power chips as a new active heat dissipation technology. The three-period minimal surface structure as a microstructured surface has shown great potential in improving the boiling heat transfer performance.

[0005] Summary of the Invention

[0006] The purpose of the present invention is to provide a distributed jet heat exchange device for power devices to solve the problems existing in the prior art. By setting a three-period minimal surface structure layer in the heat exchange cavity, the heat exchange efficiency of the power device can be significantly improved, the working stability of the power device can be ensured, and the service life of the power device can be extended.

[0007] To achieve the above-mentioned objectives, the present invention provides the following solution: The present invention provides a distributed jet heat exchange device for power devices, comprising a shell, wherein a liquid inlet chamber, a liquid outlet chamber and a heat exchange chamber are provided inside the shell, the outer surface of the bottom plate of the heat exchange chamber is in contact with the power device for heat exchange, and the inner surface of the bottom plate of the heat exchange chamber is covered with a three-periodic minimal surface structure layer; a plurality of jet holes and liquid outlet holes are provided on the top plate of the heat exchange chamber, the jet holes are connected to the liquid inlet chamber through a liquid separation channel, and the liquid outlet holes are connected to the liquid outlet chamber.

[0008] Preferably, the three-periodic minimal surface structure layer is formed by connecting a plurality of three-periodic minimal surface unit cell structure arrays.

[0009] Preferably, the three-periodic minimal surface unit cell structure is any one of a Gyroid surface, a Primitive surface, a Diamond surface, a Lidinoid surface, a Split P surface, and a Neovius surface structure.

[0010] Preferably, the jet hole, the liquid separation channel and the liquid outlet hole are all perpendicular to the top plate of the heat exchange chamber.

[0011] Preferably, the end of the liquid separation channel is a tapered structure, and the small-diameter end of the tapered structure is connected to the jet hole.

[0012] Preferably, the jet hole is located in the middle of the top plate in the heat exchange chamber, and the liquid outlet hole is arranged on the periphery of the jet hole.

[0013] Preferably, the shell is provided with a liquid inlet channel communicating with the liquid inlet cavity and a liquid outlet channel communicating with the liquid outlet cavity.

[0014] Preferably, the material of the three-periodic minimal surface structure layer is copper and copper alloy, aluminum alloy, stainless steel, titanium alloy, mold steel or nickel-based high-temperature alloy.

[0015] Compared with the prior art, the present invention has achieved the following technical effects:

[0016] The present invention can significantly improve the heat exchange efficiency of the power device by arranging a three-period minimal curved surface structure layer in the heat exchange cavity, ensure the working stability of the power device, and extend the service life of the power device.

[0017] The detailed technical effects are described in detail in conjunction with the structure of the present invention in the specific implementation manner. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] FIG1 is a schematic diagram of the overall structure of a distributed jet heat exchange device for power devices in the present invention;

[0020] FIG2 is a side sectional view of a distributed jet heat exchange device;

[0021] FIG3 is a schematic diagram showing the distribution of the jet holes and the liquid outlet holes on the top plate of the heat exchange chamber;

[0022] FIG4 is a schematic diagram of the heat transfer principle of a three-periodic minimal surface structure layer;

[0023] FIG5 is a schematic diagram of a three-periodic minimal surface unit cell structure as a primitive surface structure;

[0024] FIG6 is a schematic diagram of a three-periodic minimal surface unit cell structure as a Gyroid surface structure;

[0025] Figure 7 shows that the three-periodic minimal surface unit cell structure is a Diamond surface structure;

[0026] Among them, 1. Shell; 2. Liquid inlet cavity; 3. Liquid outlet cavity; 4. Heat exchange cavity; 5. Jet hole; 6. Liquid outlet hole; 7. Liquid separation channel; 8. Three-periodic minimal surface structure layer; 9. Liquid inlet channel; 10. Liquid outlet channel. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] The purpose of the present invention is to provide a distributed jet heat exchange device for power devices to solve the problems existing in the prior art. By setting a three-period minimal surface structure layer in the heat exchange cavity, the heat exchange efficiency of the power device can be significantly improved, the working stability of the power device can be ensured, and the service life of the power device can be extended.

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] As shown in Figures 1 to 7, this embodiment provides a distributed jet heat exchange device for power devices, including a shell 1. The shell 1 is internally provided with a liquid inlet chamber 2, a liquid outlet chamber 3 and a heat exchange chamber 4. The outer surface of the bottom plate of the heat exchange chamber 4 is in contact with the power device for heat exchange, and the inner surface of the bottom plate of the heat exchange chamber 4 is covered with a three-periodic minimal surface structure layer 8; the top plate of the heat exchange chamber 4 is arranged parallel to the bottom plate, and a plurality of jet holes 5 and liquid outlet holes 6 are provided on the top plate. The jet holes 5 are connected to the liquid inlet chamber 2 through a liquid separation channel 7, and the liquid outlet holes 6 are connected to the liquid outlet chamber 3.

[0031] During use, the bottom plate of the heat exchange chamber 4 is fitted with the surface of the power device (such as a power chip), and the refrigerant (tetrafluoroethane or trifluoromethane, etc.) is transported to the liquid inlet chamber 2; after the refrigerant enters the liquid inlet chamber 2, it is evenly sprayed into the heat exchange chamber 4 through the array of jet holes 5 to exchange heat with the power device through the bottom plate of the heat exchange chamber 4; after the heat exchange is completed, the gas-liquid mixed refrigerant enters the liquid outlet chamber 3 through the liquid outlet, and finally flows out of the shell 1.

[0032] In this embodiment, the three-periodic minimal surface structure layer 8 is porous, forming horizontal liquid replenishment channels within it. The gradient pore size structure better matches the increasing bubble diameter during boiling. These small horizontal liquid replenishment channels increase the liquid phase's reflux velocity through capillary action, providing a path for vapor escape. Furthermore, the pores on the porous surface of the three-periodic minimal surface structure layer 8 constrain bubble growth and hinder bubble merging, resulting in smaller bubble detachment diameters and faster detachment frequency. The faster the bubble detachment frequency, the better the transient heat transfer effect, significantly enhancing boiling heat transfer performance. Furthermore, the porous surface of the three-periodic minimal surface structure layer 8 increases the density of active nucleation sites and the heat exchange area. The wide range of voids provides a channel for gas-liquid separation, reducing counterflow resistance. The increased number of nucleation sites increases the number of bubbles that escape from the heated wall per unit time, leading to significant transient heat conduction at more locations and improving the overall heat dissipation performance of the heated wall. Furthermore, at high supercooling, the range of effective nucleation site sizes increases, enabling large-sized sites to be activated at low heat flux densities. Simultaneously, the size of the bubbles decreases, significantly reducing the probability of bubble coalescence. Therefore, by providing the three-periodic minimal surface structure layer 8 within the heat exchange cavity 4, this embodiment significantly improves the heat exchange efficiency of the power device, ensuring its operational stability and extending its service life.

[0033] Furthermore, in this embodiment, the three-periodic minimal surface structure layer 8 is formed by connecting a plurality of three-periodic minimal surface unit cell structure arrays. The three-periodic minimal surface unit cell structure is any one of a Gyroid surface, a Primitive surface, a Diamond surface, a Lidinoid surface, a Split P surface, and a Neovius surface structure, as shown in Figures 5 to 7.

[0034] A liquid separation channel 7, disposed between the liquid inlet chamber 2 and the heat exchange chamber 4, is perpendicular to the ceiling of the heat exchange chamber 4. The end of the liquid separation channel 7 is a tapered structure, the smaller end of which communicates with the jet orifice 5. The jet orifice 5 is located in the middle of the ceiling of the heat exchange chamber 4, with the liquid outlet 6 disposed outside of the jet orifice 5.

[0035] Furthermore, in this embodiment, the housing 1 is provided with a liquid inlet channel 9 communicating with the liquid inlet chamber 2 and a liquid outlet channel 10 communicating with the liquid outlet chamber 3 .

[0036] Adaptive changes based on actual needs are all within the scope of protection of the present invention.

[0037] It should be noted that it will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and it is intended that all variations within the meaning and range of equivalents of the claims be encompassed within the present invention. Any reference signs in the claims should not be construed as limiting the claim to which they relate.

Claims

1. A distributed jet heat exchange device for power devices, characterized in that It includes a housing, an inlet liquid chamber, an outlet liquid chamber and a heat exchange chamber are arranged inside the housing, the outer surface of the bottom plate of the heat exchange chamber is in contact with a power device for heat exchange, and a three-period minimal surface structure layer is covered on the inner surface of the bottom plate of the heat exchange chamber; a plurality of jet holes and outlet holes are arranged on the top plate of the heat exchange chamber, the jet holes are communicated with the inlet liquid chamber through a liquid distribution channel, and the outlet holes are communicated with the outlet liquid chamber.

2. The distributed jet heat exchange device for power devices according to claim 1, characterized in that The three-period minimal surface structure layer is formed by connecting multiple three-period minimal surface unit cell structures in an array.

3. The distributed jet heat exchange device for a power device according to claim 2, wherein, The three-period minimal surface unit cell structure is any one of Gyroid surface, Primitive surface, Diamond surface, Lidinoid surface, SplitP surface, Neovius surface structure.

4. The distributed jet heat exchange device for power devices according to any one of claims 1 to 3, characterized in that, The jet holes, the liquid distribution channel and the outlet holes are all perpendicular to the top plate of the heat exchange chamber.

5. The distributed jet heat exchange device for power devices according to claim 4, characterized in that, The end of the liquid distribution channel is a conical structure, and the small-diameter end of the conical structure is communicated with the jet holes.

6. The distributed jet heat exchange device for a power device according to claim 4, wherein The jet holes are located in the middle of the middle top plate of the heat exchange chamber, and the outlet holes are arranged around the jet holes.

7. The distributed jet heat exchange device for a power device according to claim 6, wherein An inlet liquid channel communicated with the inlet liquid chamber and an outlet liquid channel communicated with the outlet liquid chamber are arranged on the housing.

8. The distributed jet heat exchange device for a power device according to claim 7, characterized in that, The material of the three-period minimal surface structure layer is copper and copper alloy, aluminum alloy, stainless steel, titanium alloy, die steel or nickel-based superalloy.

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