Circuit board and electronic device

Abstract

The present application relates to the technical field of electronic devices. Disclosed are a circuit board and an electronic device. The electronic device comprises a circuit board, a rotary shaft mechanism, a first main body and a second main body. The first main body and the second main body are rotationally connected by means of a connecting assembly of the rotary shaft mechanism, and can rotate relative to each other around an axis extending in a first direction. The circuit board comprises a first extension section, a connecting section and a second extension section, which are connected in sequence. The first extension section and the second extension section extend to the first main body and the second main body, respectively. The connecting section extends through the rotary shaft mechanism, and the connecting section comprises a first sub-section and a second sub-section, which are spaced apart from each other in the first direction. The first sub-section and the second sub-section are both connected to the first extension section and the second extension section, and are located in the first direction on two sides of the center of the electronic device in the first direction. The connecting assembly of the rotary shaft mechanism comprises a first connecting assembly, wherein in the first direction, the first connecting assembly is arranged between the first sub-section and the second sub-section, thereby enhancing the strength of the electronic device.

Description

Circuit boards and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 27, 2023, with application number 202311820711.9 and application name “Circuit Board and Electronic Equipment”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic equipment, and in particular to a circuit board and electronic equipment. Background Art

[0003] Foldable electronic devices are popular among users due to their large display screens and ease of portability. These devices typically include a hinge mechanism and two main bodies rotatably connected by the hinge mechanism. A through-the-axis circuit board (PCB) can extend from one main body to the other through the hinge mechanism and electrically connect to electronic components (e.g., circuit boards, chips, processors, and batteries) in both bodies, facilitating signal transmission between the electronic components.

[0004] The current solution of passing the through-axis circuit board through the rotating shaft mechanism (referred to as the "through-axis solution") will weaken the strength of the electronic device and cause the electronic device to be easily deformed.

[0005] Summary of the Invention

[0006] In order to solve the above technical problems, the present application provides a circuit board and an electronic device. The present application is introduced from multiple aspects below, and the implementation methods and beneficial effects of the following multiple aspects can be referenced with each other.

[0007] In a first aspect, the present application provides an electronic device. The electronic device includes a first body, a second body, a hinge mechanism, and a circuit board. The first body is connected to the second body via the hinge mechanism so as to be rotatable relative to the second body about an axis extending in a first direction. The hinge mechanism includes at least one set of connecting components that rotatably connect the first and second bodies, the at least one set of connecting components including a first connecting component. The circuit board includes a first extending section, a connecting section, and a second extending section, which are sequentially connected. The connecting section includes a first subsection and a second subsection spaced apart along the first direction. The first subsection has two ends connected to the first and second extending sections, respectively, while the second subsection has two ends connected to the first and second extending sections, respectively. The first and second extending sections extend into the first and second bodies, respectively. The connecting section extends through the hinge mechanism, and along the first direction, the first and second subsections of the connecting section are located on opposite sides of the center of the electronic device along the first direction. Along the first direction, the first connecting component is located between the first and second subsections of the connecting section.

[0008] In the aforementioned electronic device, the circuit board's connecting section adopts a bifurcated design, comprising a first subsection and a second subsection. This allows the first and second subsections of the connecting section to be positioned on opposite sides of the center of the electronic device along a first direction, thereby allowing the circuit board's connecting section to avoid the center of the electronic device. This allows the hinge mechanism to have the first connecting component positioned at its center, providing a fulcrum for the center of the electronic device. This effectively enhances the hinge mechanism's support for the first and second bodies at the center of the electronic device, thereby increasing the strength of the electronic device and improving its overall resistance to deformation.

[0009] In one possible implementation of the first aspect, the first extension segment includes a first end and a second end spaced apart along a first direction, and the second extension segment includes a first end and a second end spaced apart along the first direction. The second subsegment has two ends connected to the first end of the first extension segment and the first end of the second extension segment, respectively, and the second ends of the first extension segment and the second extension segment are both located on a side of the first subsegment facing away from the second subsegment along the first direction.

[0010] In this way, after the circuit board is installed in the electronic device, more stacking space can be saved for other electronic components, which is beneficial to the thinning design of the electronic device.

[0011] In one possible implementation of the first aspect, the circuit board includes a first trace and a second trace, wherein the length of the first trace is shorter than the length of the second trace, wherein the first trace extends from the second end of the first extension section to the second end of the second extension section via a first subsection of the connecting section, and the first trace is configured to transmit one of the following signals: a high-speed signal or a high-current power supply signal. The second trace extends from the second end of the first extension section to the second end of the second extension section via a second subsection of the connecting section, and the second trace is configured to transmit one of the following signals: a low-speed signal, a digital signal, a low-current power supply signal, or an analog-to-digital converter signal.

[0012] In the above-mentioned circuit board, the first trace is used to transmit signals that are greatly affected by the trace length. Since the length of the first trace is relatively short, this can effectively reduce the parasitic inductance, parasitic capacitance, and low-frequency impedance of the first trace, thereby effectively improving the signal transmission effect. The second trace is used to transmit signals that are insensitive to the trace length. Therefore, even if the length of the second trace is relatively long, it will not affect the actual functional module or actual detection. In summary, the signal transmission effect of the circuit board has been effectively improved.

[0013] In a possible implementation of the first aspect above, the circuit board is a flexible circuit board.

[0014] In one possible implementation of the first aspect, the first connecting assembly is located at the center of the electronic device along the first direction. That is, the first connecting assembly is disposed in the exact middle of the electronic device. This further improves the reliability of the connection between the hinge mechanism and the first and second bodies at the center of the electronic device, thereby enhancing the strength of the electronic device.

[0015] In a possible implementation of the first aspect above, the first connecting assembly includes a first swing arm and a second swing arm, and the first connecting assembly is connected to the first body through the first swing arm and is connected to the second body through the second swing arm; wherein the material of the first swing arm and the second swing arm is powder metallurgy material or profile aluminum.

[0016] In this way, the mechanical properties of the first swing arm and the second swing arm can be effectively improved, so that the hinge mechanism can better support the first body and the second body, and the strength of the electronic device is better.

[0017] In a possible implementation of the first aspect, along the first direction, a ratio of a distance between the first sub-segment and the second sub-segment of the connecting segment to a size of the rotating shaft mechanism is 0.05-0.3, for example, 0.05, 0.1, 0.2, 0.3, etc.

[0018] Based on this, on the one hand, the distance between the first and second sub-segments is not too small, allowing the connecting section to better avoid the center of the electronic device. In addition, by properly setting the distance between the first and second sub-segments, sufficient space can be provided at the center of the electronic device to place the components of the hinge mechanism, further enhancing the strength of the electronic device's center. On the other hand, the distance between the first and second sub-segments is not too large, leaving sufficient space and strength at both ends of the electronic device to place other components of the hinge mechanism, thereby ensuring that the strength of the electronic device's ends is not significantly weakened.

[0019] In one possible implementation of the first aspect, at least one set of connecting assemblies further includes a second connecting assembly and a third connecting assembly, with the second connecting assembly and the third connecting assembly being disposed on opposite sides of the connecting section of the circuit board, thereby further improving the connection reliability between the hinge mechanism and the first and second bodies.

[0020] In a possible implementation of the first aspect, along the first direction, the distances between the second connecting component and the third connecting component and the center of the electronic device along the first direction are equal.

[0021] In this way, the second connecting component and the third connecting component can be distributed more evenly relative to the first connecting component, thereby improving the uniformity of the force applied to the hinge mechanism and meeting the design requirements of the movement trajectory of the opening and closing of the electronic device.

[0022] In a possible implementation of the first aspect above, the second connecting component and the third connecting component are rotationally symmetric about a center of the electronic device along the first direction.

[0023] In this way, the overall structure of the rotating shaft mechanism can be roughly symmetrical, thereby reducing the types of components in the rotating shaft mechanism, reducing the complexity of assembly and the probability of material mismixing, and avoiding the problem of increased production costs due to the generation of excessive stagnant materials.

[0024] A second aspect of the present application provides a circuit board. The circuit board includes a first extension segment, a connecting segment, and a second extension segment connected in sequence. The connecting segment includes a first subsegment and a second subsegment spaced apart along a first direction. The first subsegment is connected to the first extension segment and the second extension segment at both ends, and the second subsegment is connected to the first extension segment and the second extension segment at both ends.

[0025] In one possible implementation of the second aspect, the first extension segment includes a first end and a second end spaced apart along a first direction, and the second extension segment includes a first end and a second end spaced apart along the first direction. The second subsegment has two ends connected to the first end of the first extension segment and the first end of the second extension segment, respectively, and the second ends of the first extension segment and the second extension segment are both located on a side of the first subsegment facing away from the second subsegment along the first direction.

[0026] In one possible implementation of the second aspect, the circuit board includes a first trace and a second trace, wherein the length of the first trace is shorter than the length of the second trace, wherein the first trace extends from the second end of the first extension section to the second end of the second extension section via a first subsection of the connecting section, and the first trace is configured to transmit one of the following signals: a high-speed signal or a high-current power supply signal. The second trace extends from the second end of the first extension section to the second end of the second extension section via a second subsection of the connecting section, and the second trace is configured to transmit one of the following signals: a low-speed signal, a digital signal, a low-current power supply signal, or an analog-to-digital converter signal.

[0027] In a possible implementation of the second aspect, the circuit board is a flexible circuit board.

[0028] It should be understood that the beneficial effects of the second aspect mentioned above can be referred to the description of the first aspect mentioned above and will not be repeated here.

[0029] Among them, the technical effects brought about by any implementation method in the second aspect can refer to the technical effects brought about by different implementation methods in the above-mentioned first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] FIG1A shows a perspective view of a foldable mobile phone in a flattened state according to an embodiment of the present application;

[0031] FIG1B shows a perspective view of a foldable mobile phone in a folded state according to an embodiment of the present application;

[0032] FIG1C shows an exploded view of the foldable mobile phone in a flattened state according to an embodiment of the present application;

[0033] FIG2A shows a first structural diagram of a through-axis circuit board in a foldable mobile phone in some technical solutions;

[0034] FIG2B shows a second structural diagram of a through-axis circuit board in a foldable mobile phone in some technical solutions;

[0035] FIG3A shows a first structural diagram of a through-axis circuit board in a foldable mobile phone according to an embodiment of the present application;

[0036] FIG3B shows a second structural diagram of a through-axis circuit board in a foldable mobile phone according to an embodiment of the present application;

[0037] FIG4A shows a schematic diagram 1 of a three-bar bending test of a foldable mobile phone in the technical solution shown in FIG2A and FIG2B ;

[0038] FIG4B shows a second schematic diagram of a three-bar bending test of a foldable mobile phone in the technical solution shown in FIG2A and FIG2B ;

[0039] FIG5A shows a schematic diagram 1 of a three-bar bending test of a foldable mobile phone according to an embodiment of the present application;

[0040] FIG5B shows a second schematic diagram of a three-bar bending test of a foldable mobile phone according to an embodiment of the present application;

[0041] FIG6A is a schematic diagram showing a wiring path of a through-axis circuit board in some technical solutions;

[0042] FIG6B is a schematic diagram showing a wiring path of a through-axis circuit board in an embodiment of the present application;

[0043] FIG7 shows a schematic structural diagram of a rotating shaft mechanism in some other technical solutions. DETAILED DESCRIPTION

[0044] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0045] The present application provides a circuit board and an electronic device including the circuit board. The electronic device has good strength and reliability.

[0046] It is understood that the electronic devices provided herein may include, but are not limited to, foldable electronic devices with circuit boards, such as foldable phones, tablet computers, laptop computers, ultra-mobile personal computers (UMPCs), handheld computers, netbooks, personal digital assistants (PDAs), wearable devices, and virtual reality devices. For ease of description, the following description uses a foldable phone as an example. Furthermore, for ease of description, the state of a foldable phone after being folded is defined as a folded state, the state of a foldable phone after being flattened is defined as a flattened state, and the state of a foldable phone between the folded and flattened states is defined as an intermediate state.

[0047] Figures 1A to 1C illustrate an exemplary structure of a foldable phone 1 according to an embodiment of the present application. Figure 1A is a perspective view of the foldable phone 1 in a flattened state, Figure 1B is a perspective view of the foldable phone 1 in a folded state, and Figure 1C is an exploded view of the foldable phone 1 in a flattened state.

[0048] To facilitate subsequent description, before introducing the specific structure of the foldable phone 1, we first define the X-axis direction, Y-axis direction (as an example of a first direction), and Z-axis direction corresponding to the foldable phone 1 in conjunction with Figures 1A to 1C. Referring to Figures 1A to 1C, the X-axis direction is the length direction of the foldable phone 1 when in the unfolded state; the Z-axis direction is the thickness direction of the foldable phone 1 when in the unfolded state; and the Y-axis direction is a direction perpendicular to both the X-axis and Z-axis directions. For example, the Y-axis direction is the width direction of the foldable phone 1. It should be noted that the width of each component refers to the dimension of each component along the Y-axis direction, and the thickness of each component refers to the dimension of each component along the Z-axis direction. These will not be discussed in detail below.

[0049] 1A to 1C , the foldable phone 1 includes a first body 11 , a second body 12 , and a hinge mechanism 13 .

[0050] The first body 11 includes a first housing 111, a first display screen 112, and a bar-shaped protrusion 113 (also called a "bar"). Along the Z-axis, the first display screen 112 and the bar-shaped protrusion 113 are disposed on opposite sides of the first housing 111. The bar-shaped protrusion 113 extends along the Y-axis and protrudes away from the first display screen 112 along the Z-axis relative to the first housing 111. In other words, the bar-shaped protrusion 113 is thicker than the first housing 111.

[0051] The second body 12 includes a second housing 121 and a second display screen 122, and the second display screen 122 is fixed to the second housing 121. For example, the second display screen 122 and the first display screen 112 can be an integrated structure, thereby forming a bendable flexible screen 14.

[0052] Along the X-axis direction, the first shell 111 and the second shell 121 are respectively arranged on opposite sides of the hinge mechanism 13 and are respectively connected to the hinge mechanism 13. The hinge mechanism 13 may include a plurality of connecting components 130. The plurality of connecting components 130 are arranged at intervals along the Y-axis direction. Each connecting component 130 is connected to the first shell 111 of the first body 11 and the second shell 121 of the second body 12 to achieve a rotational connection between the first body 11 and the second body 12. It can be understood that each connecting component 130 can serve as a fulcrum for the first body 11 and the second body 12, which is conducive to enhancing the overall anti-deformation ability of the foldable mobile phone 1.

[0053] The first shell 111 and the second shell 121 can rotate relative to each other around an axis extending along the Y-axis direction through the hinge mechanism 13, and the flexible screen 14 also moves accordingly and presents a flattened state or a bent state, so that the foldable mobile phone 1 can switch between the flattened state and the folded state at will.

[0054] It will be appreciated that the electronic device in the examples shown in Figures 1A to 1C is a two-fold foldable phone 1 with a screen that folds outward. That is, when the foldable phone 1 is in the outward folded position, the user can observe the display interface of the flexible screen 14 from the outside of the foldable phone 1. In other embodiments, the electronic device can also be a device of other forms. However, this application is not limited thereto.

[0055] For example, in some embodiments, the electronic device may be a two-fold mobile phone with a screen that folds inward. That is, when the foldable mobile phone is in the folded-in state, the user cannot observe the display interface of the flexible screen from the outside of the foldable mobile phone.

[0056] For example, in some other embodiments, the electronic device may be a tri-fold mobile phone. A tri-fold structure refers to a folding mobile phone comprising three main bodies and two hinge mechanisms, with two adjacent main bodies connected by a hinge mechanism. The two adjacent main bodies can be rotated toward each other by folding inward or outward until the angle between the two adjacent bodies is approximately 0°, thereby placing the folding mobile phone in the inward or outward folded state. The two adjacent main bodies can also be rotated away from each other until the angle between the two adjacent bodies is approximately 180°, thereby placing the folding mobile phone in the flattened state.

[0057] The following describes the technical solution of the present application using the electronic device, a foldable phone 1, as shown in Figures 1A to 1C. Continuing with Figures 1A to 1C, in some embodiments of the present application, various electronic components may be disposed within the first body 11 and the second body 12 to implement the various functions of the foldable phone 1.

[0058] For example, the first body 11 may include a first circuit board 101 and a first battery 102. The first circuit board 101 may serve as the mainboard of the foldable phone 1. For example, the first circuit board 101 may include integrated components such as a processor, memory, and a communication module. The first battery 102 is electrically connected to the first circuit board 101 to provide power to the foldable phone 1.

[0059] In addition, the strip-shaped protrusion 113 of the first body 11 can also be used to accommodate some thicker electronic components (not shown), such as a camera, a motor, a universal serial bus (USB) interface, etc.

[0060] The second body 12 may contain a second circuit board 201 and a second battery 202. The second circuit board 201 may serve as a sub-board for the foldable phone 1. For example, the second circuit board 201 may include components such as an adapter, a charging module, a power detection module, and an opening / closing detection module. The second battery 202 is electrically connected to the second circuit board 201 to provide power to the foldable phone 1.

[0061] In order to enable signal transmission between the electronic components in the first body 11 and the electronic components in the second body 12, the foldable mobile phone 1 further includes a through-axis circuit board for connecting the electronic components in the first body 11 and the electronic components in the second body 12.

[0062] For example, Figure 2A shows a schematic diagram of the structure of the through-axis circuit board 10a in a foldable mobile phone 1a in some technical solutions. Figure 2B shows a schematic diagram of the structure of the through-axis circuit board 10a in a foldable mobile phone 1a in some technical solutions. Referring to Figures 2A and 2B, in some technical solutions, the through-axis circuit board 10a includes a first extension section 100a, a second extension section 200a, and a connecting section 300a. Along the X-axis, the first extension section 100a and the second extension section 200a are located on opposite sides of the connecting section 300a and are respectively connected to the connecting section 300a.

[0063] The first extension section 100a extends into the first body 11 and is connected to the first circuit board 101. The second extension section 200a extends into the second body 12 and is connected to the second circuit board 201. The connecting section 300a is provided at a position corresponding to the hinge mechanism 13a.

[0064] The hinge mechanism 13a includes multiple groups of connecting components (for example, a first connecting component 131a and a second connecting component 132a). Considering that the hinge mechanism 13a is a relatively high-cost component in the folding phone 1a, in order to reduce the number of materials, simplify the assembly process and assembly costs, and avoid waste caused by stagnant materials, the multiple groups of connecting components can be arranged in a rotationally symmetrical form. When the multiple groups of connecting components are arranged in a rotationally symmetrical manner, no connecting components are arranged at the center of the folding phone 1a. Therefore, in the example shown in Figures 2A and 2B, the connecting segment 300a is arranged at the center P of the folding phone 1a along the Y-axis direction, that is, the orthographic projection of the connecting segment 300a on the XY plane overlaps with the orthographic projection of the center line L0 of the folding phone 1a on the XY plane.

[0065] Because the connecting section 300a of the through-axis circuit board 10a is located at the center P of the foldable phone 1a and occupies a relatively large space, the hinge mechanism 13a cannot be positioned with connecting components at the center P of the foldable phone 1a. Connecting components (e.g., the first connecting component 131a and the second connecting component 132a) must be positioned farther from the center P. This results in insufficient support provided by the hinge mechanism 13a for the first and second bodies 11 and 12 at the center of the foldable phone 1a. This, in turn, weakens the foldable phone 1a at the center, making it susceptible to bending and deformation.

[0066] To address the aforementioned issues, the circuit board's connection section in the embodiment of the present application adopts a bifurcated design to avoid the center of the foldable phone. This allows the connection component to be placed at the center of the hinge mechanism of the foldable phone, thereby increasing the support strength of the hinge mechanism at the center of the foldable phone, thereby effectively enhancing the strength of the foldable phone. This is described in detail below with reference to the accompanying drawings.

[0067] Figure 3A shows a first schematic diagram of the structure of the through-axis circuit board 10 in the foldable phone 1 according to an embodiment of the present application. Figure 3B shows a second schematic diagram of the structure of the through-axis circuit board 10 in the foldable phone 1 according to an embodiment of the present application. Referring to Figures 3A and 3B , the through-axis circuit board 10 includes a first extension section 100, a second extension section 200, and a connecting section 300.

[0068] The first extension segment 100 and the second extension segment 200 are arranged on opposite sides of the connecting segment 300 along the X-axis. The connecting segment 300 includes two sub-segments spaced apart along the Y-axis: a first sub-segment 310 and a second sub-segment 320. The ends of the second sub-segment 320 are connected to the end 100A (as an example of the first end of the first extension segment 100) of the first extension segment 100 and the end 200A (as an example of the first end of the second extension segment 200). The ends of the first sub-segment 310 are connected to the middle portion 100B of the first extension segment 100 and the middle portion 200B of the second extension segment 200.

[0069] The through-axis circuit board 10 is used to connect the electronic components in the first body 11 with the electronic components in the second body 12. For example, the through-axis circuit board 10 can be a flexible printed circuit (FPC). For example, the through-axis circuit board 10 is typically made of polyimide or polyester film as a substrate, and has the characteristics of being able to bend, fold, and twist freely, so as to better adapt to the flattening and folding of the foldable mobile phone 1.

[0070] Specifically, the first extension section 100 of the through-axis circuit board 10 extends into the interior of the first body 11. For example, the end 100C of the first extension section 100 (as an example of the second end of the first extension section 100) can be connected to the first circuit board 101 inside the first body 11.

[0071] The second extension section 200 extends into the interior of the second body 12. For example, an end 200C of the second extension section 200 (as an example of the second end of the second extension section 200) can be connected to the second circuit board 201 inside the second body 12. In this way, the second circuit board 201 can transmit signals to the first circuit board 101.

[0072] The connecting section 300 extends through the hinge mechanism 13. In other words, the connecting section 300 is the portion of the circuit board 10 that passes through the hinge. For example, along the circumference of the hinge mechanism 13 (e.g., direction C shown in Figures 1A and 1B), the connecting section 300 extends from the end where the hinge mechanism 13 is connected to the first body 11 through the middle portion of the hinge mechanism 13 to the end where the hinge mechanism 13 is connected to the second body 12. When the foldable phone 1 is in the flattened state as shown in Figure 1A, the connecting section 300 is in the flattened state, and is shaped like a "one" as a whole, extending along direction C from the end where the hinge mechanism 13 is connected to the first body 11 through the middle portion of the hinge mechanism 13 to the end where the hinge mechanism 13 is connected to the second body 12. When the foldable mobile phone 1 is in the folded state as shown in FIG1B , the connecting section 300 is in a bent state and is shaped like a “C” as a whole, and extends along the C direction from the end where the hinge mechanism 13 is connected to the first body 11 through the middle part of the hinge mechanism 13 to the end where the hinge mechanism 13 is connected to the second body 12.

[0073] Furthermore, along the Y-axis, the first subsegment 310 and the second subsegment 320 of the connecting section 300 are located on opposite sides of the center P of the foldable phone 1. It can be understood that the orthographic projection of the center P on the XY plane overlaps with the orthographic projection of the center line L0 of the foldable phone 1 on the XY plane. In other words, the first subsegment 310 and the second subsegment 320 are located on opposite sides of the center line L0 of the foldable phone 1. For example, the first subsegment 310 is located on a first side S1 of the center line L0, and the second subsegment 320 is located on a second side S2 of the center line L0.

[0074] The hinge mechanism 13 includes a first connecting assembly 131. Along the Y-axis, the first connecting assembly 131 is disposed between the first subsection 310 and the second subsection 320 of the connecting section 300 and connects the first and second bodies 11, 12, thereby enabling relative rotation between them. For example, the first body 11 may include a first door panel 114 for supporting a first display screen 112, and the second body 12 may include a second door panel 123 for supporting a second display screen 122. One end of the first connecting assembly 131 may be connected to the first body 11 via the first door panel 114, and the other end may be connected to the second body 12 via the second door panel 123.

[0075] In the aforementioned foldable phone 1, the connecting section 300 of the through-axis circuit board 10 adopts a bifurcated design, comprising a first subsection 310 and a second subsection 320. This allows the first subsection 310 and the second subsection 320 of the connecting section 300 to be positioned on opposite sides of the center P of the foldable phone 1 along the Y-axis, thereby allowing the connecting section 300 of the through-axis circuit board 10 to avoid the center of the foldable phone 1. This allows a connecting component (e.g., the first connecting component 131) to be positioned at the center of the hinge mechanism 13, providing a fulcrum for the center of the foldable phone 1. This effectively enhances the support strength of the hinge mechanism 13 for the first and second bodies 11, 12 at the center of the foldable phone 1, thereby strengthening the strength of the foldable phone 1 at the center and improving its overall resistance to deformation.

[0076] To more intuitively understand the effect of enhancing the strength of the foldable mobile phone 1 in the embodiment of the present application, the following is an introduction based on the three-bar bending test and simulation results. The three-bar bending test is an experiment used to test the bending strength of electronic devices.

[0077] Figures 4A and 4B show schematic diagrams of a three-pole bending test on the foldable phone 1a in the technical solution shown in Figures 2A and 2B, with the flexible screen 14 not shown. Figures 5A and 5B show schematic diagrams of a three-pole bending test on the foldable phone 1 in an embodiment of the present application, with the flexible screen 14 not shown.

[0078] 4A and 4B , when a load F is applied to the center of the front of the foldable phone 1a, various parts of the foldable phone 1a will deform to varying degrees. Table 1 shows exemplary deformation amounts of various parts of the foldable phone 1a.

[0079] Table 1

[0080] 4A and 4B , the reliability of the hinge mechanism 13 a connected between the first body 11 and the second body 12 is low, resulting in a relatively large deformation of the second body 12 .

[0081] 5A and 5B , when the same load F is applied to the center of the front of the foldable phone 1, various parts of the foldable phone 1 will also deform to varying degrees. Table 2 shows exemplary deformations of various parts of the foldable phone 1.

[0082] Table 2

[0083] Referring to Table 2 and in conjunction with Figures 5A and 5B , because the through-axis circuit board 10 adopts a bifurcated design, avoiding the center position of the foldable phone 1, the hinge mechanism 13 can be arranged with a connecting component (e.g., first connecting component 131) at its center. This effectively enhances the support strength of the hinge mechanism 13 for the first and second bodies 11, 12 at the center of the foldable phone 1, thereby enhancing the strength of the foldable phone 1 at the center and improving the overall deformation resistance. Compared to the deformation of the second body 12 of the foldable phone 1a described above, the deformation of the second body 12 of the foldable phone 1 is significantly reduced, for example, from 4.56 mm to 2.40 mm, a reduction of approximately half.

[0084] 5A and 5B and Table 2 in conjunction with FIG. 1A to FIG. 1C , a strip-shaped protrusion 113 is provided along the X-axis at one end of the first body 11 away from the hinge mechanism 13. Strip-shaped protrusion 113 is relatively thick, providing some support for the first body 11, thereby minimizing deformation of the first body 11.

[0085] The specific structure and exemplary arrangement of the through-shaft circuit board 10 and the rotating shaft mechanism 13 will be further described below with reference to the accompanying drawings.

[0086] Continuing with Figure 3A , along the Y-axis, ends 100A and 100C of the first extending section 100 are spaced apart, while ends 200A and 200C of the second extending section 200 are spaced apart. Both ends 100C and 200C are located on the side of the first subsection 310 facing away from the second subsection 320. In other words, the first extending section 100 and the second extending section 200 extend at least partially along the Y-axis to the side of the first subsection 310 facing away from the second subsection 320. For example, the first extending section 100 may extend along the negative Y-axis to approximately one-quarter of the length of the foldable phone 1 to facilitate connection to the first circuit board 101; the second extending section 200 may extend along the negative Y-axis to a position near the bottom of the foldable phone 1 to facilitate connection to the second circuit board 201.

[0087] Among them, after extending the end 200A of the second extension section 200 to a position close to the bottom of the foldable mobile phone 1, the second circuit board 201 can also be set at a position close to the bottom of the foldable mobile phone 1, thereby reserving more space for the second battery 202 in the Y-axis direction to increase the length of the second battery 202, and then increase the capacity of the second battery 202 when the thickness space is limited, which is conducive to the thinning design of the foldable mobile phone 1, and can also meet the battery capacity requirements of the foldable mobile phone 1.

[0088] Furthermore, because the connecting section 300 of the through-axis circuit board 10 is divided into a first sub-segment 310 and a second sub-segment 320, the overall width of the connecting section 300 can be set relatively large while ensuring that the widths of the first and second sub-segments 310, 320 are not excessively large. This allows the width and length of the through-axis circuit board 10 to be matched, reducing the impedance of the through-axis circuit board 10 and thereby improving signal transmission. Furthermore, the hinge mechanism 13 does not need to leave a large space to accommodate the first and second sub-segments 310, 320, thereby ensuring the strength of the foldable phone 1.

[0089] For example, as shown in FIG2A , the length and width of the through-axis circuit board 10a are both large. This will result in a larger area for the hinge mechanism 13a to avoid at its center position, further weakening the strength of the folding phone 1a. In the present application, the connecting section 300 of the through-axis circuit board 10 adopts a bifurcated design, including a first sub-segment 310 and a second sub-segment 320. Compared with the connecting section 300a of the through-axis circuit board 10a, the width of the first sub-segment 310 and the second sub-segment 320 has been greatly reduced (for example, reduced by half), the reliability of the hinge mechanism 13 is better, and the strength of the folding phone 1 is enhanced. At the same time, it can also meet the design requirements of reducing the impedance of the through-axis circuit board 10, thereby improving the signal transmission effect.

[0090] In some embodiments of the present application, the through-axis circuit board 10 can use the first sub-segment 310 and the second sub-segment 320 to reasonably allocate the routing path, so that the routing length corresponding to the signal that is greatly affected by the routing length (for example, high-speed signals (for example, signals with a frequency greater than or equal to 100 MHz), large current power supply signals (for example, signals with a current greater than or equal to 0.5 A), etc.) is shorter, while the routing length corresponding to the signal that is not sensitive to the routing length (for example, low-speed signals (for example, signals with a frequency less than 100 MHz), digital signals, small current power supply signals (for example, signals with a current less than 0.5 A), analog-to-digital converter (ADC) signals, etc.) is longer, thereby further optimizing the routing impedance and improving the signal transmission effect.

[0091] Specifically, Figure 6A shows a schematic diagram of the routing path of the through-axis circuit board 10a in some technical solutions. Figure 6B shows a schematic diagram of the routing path of the through-axis circuit board 10 in an embodiment of the present application, wherein, for ease of observation, the first routing line 410a of the through-axis circuit board 10a is shown in dotted lines.

[0092] Referring to FIG6A , in some technical solutions, the through-axis circuit board 10a includes a first trace 410a. The first trace 410a extends from the first extension section 100a via the connecting section 300a to the second extension section 200a. The first trace 410a is used to transmit various signals. For signals that are significantly affected by trace length (e.g., high-speed signals or high-current power signals), the trace length of the first trace 410a is relatively long. As a result, the parasitic inductance, parasitic capacitance, and low-frequency impedance of the first trace 410a are relatively large, thereby significantly affecting the signal quality or voltage drop transmitted by the first trace 410a, resulting in poor signal transmission.

[0093] 6B , in the embodiment of the present application, the through-axis circuit board 10 includes a first trace 410 and a second trace 420 , as shown by the solid line in FIG6B .

[0094] For example, the first trace 410 may extend from the end 100C of the first extension segment 100 to the end 200C of the second extension segment 200 via the first sub-segment 310 of the connecting segment 300. The second trace 420 may extend from the end 100C of the first extension segment 100 to the end 200C of the second extension segment 200 via the second sub-segment 320 of the connecting segment 300.

[0095] The first trace 410 is used to transmit a first signal. The first signal is a signal that is significantly affected by trace length. For example, the first signal may include, but is not limited to, a high-speed signal or a high-current power supply signal. The second trace 420 is used to transmit a second signal. The second signal is a signal that is less affected by trace length. For example, the second signal may include, but is not limited to, a low-speed signal, a digital signal, a low-current power supply signal, an analog-to-digital converter signal, etc.

[0096] In the aforementioned through-axis circuit board 10, the relatively short length of first trace 410 effectively reduces parasitic inductance, parasitic capacitance, and low-frequency impedance, thereby improving the transmission efficiency of the first signal. The second signal is insensitive to trace length, so even if the length of second trace 420 is relatively long, it will not affect the actual functional module or actual detection.

[0097] Comparing Figures 6A and 6B , the embodiment of the present application utilizes first sub-segment 310 and second sub-segment 320 to rationally design routing paths for different signals, reducing the length of first trace 410 by approximately 20% compared to the length of first trace 410a. Consequently, the routing impedance of first trace 410 can also be optimized by approximately 20% compared to the routing impedance of first trace 410a, further facilitating the transmission of the first signal, which is significantly affected by routing length. In summary, compared to the through-axis circuit board 10a, the through-axis circuit board 10 provided in the embodiment of the present application has a more reasonable routing impedance design and better overall signal transmission.

[0098] In some embodiments of the present application, the high-speed signal may include a camera mobile industry processor interface (Camera MIPI) signal, a display mobile industry processor interface (Display MIPI) signal, or a differential input signal (e.g., D+, D-) of a universal serial bus (USB).

[0099] In some embodiments of the present application, the high-current power supply signal may include a voltage bus signal (voltage bus, VBUS), a battery voltage signal (voltage of battery, VBAT), a system power signal (VPH-power), a system voltage signal (voltage of system, VSYS), a positive power supply voltage output signal (ELVDD), a negative power supply voltage output signal (ELVSS), a speaker signal (for example, SPK+, SPK-), etc.

[0100] In some embodiments of the present application, the low-speed signal may include a general purpose input output (GPIO) signal, an enable signal, or a detection signal.

[0101] In some embodiments of the present application, the digital signal may include an inter integrated circuit (I2C) bus interface signal, an improved inter integrated circuit (I3C) bus interface signal, or a serial peripheral interface (SPI) bus signal.

[0102] In some embodiments of the present application, the low-current power signal may include an input / output (I / O) power signal or a motor power signal.

[0103] In some embodiments of the present application, the analog-to-digital converter signal may include an identification (ID) signal.

[0104] Continuing with Figures 3A and 3B , in some embodiments of the present application, the first connecting component 131 is located at the center P of the foldable phone 1 along the Y-axis. In other words, the orthographic projection of the first connecting component 131 on the XY plane at least partially overlaps with the orthographic projection of the centerline L0 of the foldable phone 1 on the XY plane. This further enhances the reliability of the connection between the hinge mechanism 13 and the first and second bodies 11, 12 at the center of the foldable phone 1, resulting in greater strength and improved resistance to deformation.

[0105] In some embodiments of the present application, the first connecting assembly 131 includes a first swing arm 1311 and a second swing arm 1312. The first connecting assembly 131 is connected to the first body 11 (e.g., to the first door panel 114 for supporting the first display screen 112) via the first swing arm 1311, and is connected to the second body 12 (e.g., to the second door panel 123 for supporting the second display screen 122) via the second swing arm 1312. Furthermore, both the first swing arm 1311 and the second swing arm 1312 are capable of rotating about an axis extending along the Y-axis, thereby enabling relative rotation between the first body 11 and the second body 12.

[0106] In some embodiments of the present application, the first swing arm 1311 and the second swing arm 1312 may be made of powder metallurgy material. This can effectively improve the mechanical properties of the first swing arm 1311 and the second swing arm 1312, thereby increasing the support strength of the hinge mechanism 13 on the first body 11 and the second body 12, thereby improving the strength of the foldable phone 1.

[0107] In some implementations, the first swing arm 1311 and the second swing arm 1312 can be formed by metal injection molding (MIM), thereby making the production efficiency of the first swing arm 1311 and the second swing arm 1312 higher and the production cost lower.

[0108] In some other embodiments of the present application, the material of the first swing arm 1311 and the second swing arm 1312 can also be a material that can be processed by computer numerical control machine tools (CNC), such as profile aluminum, so as to effectively improve the mechanical properties of the first swing arm 1311 and the second swing arm 1312, thereby improving the supporting strength of the hinge mechanism 13 on the first body 11 and the second body 12, and the strength of the folding mobile phone 1 is better.

[0109] In other embodiments of the present application, the material of the first swing arm 1311 and the second swing arm 1312 can also be a material that can be die-cast, that is, the first swing arm 1311 and the second swing arm 1312 can also be die-cast parts.

[0110] In some embodiments of the present application, the first swing arm 1311 and the second swing arm 1312 can be fixedly connected to the first door panel 114 and the second door panel 123 respectively by fasteners (for example, screws), thereby further enhancing the connection reliability between the hinge mechanism 13 and the first body 11 and the second body 12, thereby improving the strength of the foldable mobile phone 1.

[0111] In some embodiments of the present application, connecting components may also be provided on opposite sides of the connecting section 300 of the through-axis circuit board 10 along the Y-axis direction, thereby further improving the connection reliability between the rotating shaft mechanism 13 and the first body 11 and the second body 12.

[0112] For example, referring again to Figures 3A and 3B , in addition to the first connecting component 131, the hinge mechanism 13 may further include four connecting components: a second connecting component 132, a third connecting component 133, a fourth connecting component 134, and a fifth connecting component 135. Along the Y-axis, the second connecting component 132 and the third connecting component 133 are disposed on opposite sides of the connecting section 300 of the through-shaft circuit board 10; the fourth connecting component 134 and the fifth connecting component 135 are disposed on opposite sides of the connecting section 300 of the through-shaft circuit board 10. Furthermore, the second connecting component 132 and the fourth connecting component 134 are located on the same side of the connecting section 300 of the through-shaft circuit board 10, and the third connecting component 133 and the fifth connecting component 135 are located on the same side of the connecting section 300 of the through-shaft circuit board 10.

[0113] Among them, the specific structural forms of the second connecting component 132, the third connecting component 133, the fourth connecting component 134 and the fifth connecting component 135 are consistent with the specific structural forms of the first connecting component 131, so you can refer to the above description of the first connecting component 131 and will not repeat them here.

[0114] In some embodiments of the present application, along the Y-axis, the distance from the second connecting component 132 to the center P can be equal to the distance from the third connecting component 133 to the center P. This allows for a more even distribution of the second connecting component 132 and the third connecting component 133 relative to the first connecting component 131, thereby improving the uniformity of the force applied to the hinge mechanism 13, meeting the support requirements for the first display 112 and the second display 122, and satisfying the design requirements for the motion trajectory of the foldable phone 1 during opening and closing, resulting in a better opening and closing experience.

[0115] Similarly, in some embodiments of the present application, along the Y-axis, the distance from the fourth connecting component 134 to the center P can also be equal to the distance from the fifth connecting component 135 to the center P. In this way, the fourth connecting component 134 and the fifth connecting component 135 can be more evenly distributed relative to the first connecting component 131, thereby further improving the uniformity of the force applied to the hinge mechanism 13, meeting the support requirements for the first display screen 112 and the second display screen 122, and meeting the design requirements for the movement trajectory of the foldable phone 1 when opening and closing, and providing a better opening and closing experience.

[0116] In some embodiments of the present application, the second connecting component 132 and the third connecting component 133 are rotationally symmetric relative to the center P, and the fourth connecting component 134 and the fifth connecting component 135 are rotationally symmetric relative to the center P.

[0117] For example, after the second connecting component 132 rotates 180° around the point center P, it can completely overlap with the third connecting component 133, and after the fourth connecting component 134 rotates 180° around the center P, it can completely overlap with the fifth connecting component 135.

[0118] In this way, the overall structure of the hinge mechanism 13 can be roughly symmetrical about the connecting section 300 of the through-axis circuit board 10, thereby effectively reducing the types of components in the hinge mechanism 13, simplifying assembly, and reducing production costs.

[0119] In some embodiments of the present application, along the Y-axis direction, the ratio of the distance between the first sub-segment 310 and the second sub-segment 320 of the through-axis circuit board 10 to the size of the rotating shaft mechanism 13 can be 0.05-0.3, for example, 0.05, 0.1, 0.2, 0.3, etc.

[0120] Based on this, on the one hand, the distance between the first sub-segment 310 and the second sub-segment 320 is not too small, allowing the connecting section 300 to better avoid the center P of the foldable phone 1. Furthermore, by properly setting the distance between the first sub-segment 310 and the second sub-segment 320, sufficient space is left at the center of the foldable phone 1 to accommodate components of the hinge mechanism 13 (e.g., the first connecting assembly 131), further enhancing the strength of the center of the foldable phone 1. On the other hand, the distance between the first sub-segment 310 and the second sub-segment 320 is not too large, leaving sufficient space and strength at both ends of the foldable phone 1 to accommodate other components of the hinge mechanism 13 (e.g., the second connecting assembly 132 and the third connecting assembly 133), thereby ensuring that the strength of the two ends of the foldable phone 1 is not significantly weakened.

[0121] The above is an exemplary description of the arrangement of the components of the rotating shaft mechanism 13 relative to the through-shaft circuit board 10. However, the present application is not limited thereto. In other embodiments, the components of the rotating shaft mechanism 13 may also be arranged in other ways.

[0122] For example, in the example shown in Figures 3A and 3B , the hinge mechanism 13 includes five sets of connecting assemblies. In other examples, the hinge mechanism 13 may include other numbers of connecting assemblies, such as three, seven, etc. It will be appreciated that the greater the number of connecting assemblies, the better the support provided by the hinge mechanism 13 for the first and second bodies 11, 12. Furthermore, the multiple sets of connecting assemblies may be arranged at equal or substantially equal intervals to provide as uniform support as possible for the first and second bodies 11, 12.

[0123] Specifically, in this embodiment, the connecting section 300 of the through-shaft circuit board 10 includes a first sub-section 310 and a second sub-section 320, and the hinge mechanism 13 includes a connecting component disposed between the first sub-section 310 and the second sub-section 320, for example, a first connecting component 131. In other embodiments, the hinge mechanism 13 may further include more connecting components between the first sub-section 310 and the second sub-section 320, for example, two, three, or four. In still other embodiments, the connecting section 300 of the through-shaft circuit board 10 may further include more sub-sections (for example, three, four, or five), with a connecting component of the hinge mechanism 13 disposed between each two adjacent sub-sections.

[0124] For example, in this embodiment, the hinge mechanism 13 includes four connecting components, for example, a second connecting component 132, a third connecting component 133, a fourth connecting component 134, and a fifth connecting component 135, disposed on opposite sides of the connecting section 300 of the through-shaft circuit board 10. In other embodiments, more or fewer connecting components may be disposed on opposite sides of the connecting section 300 of the through-shaft circuit board 10. For example, the hinge mechanism 13 may include the second connecting component 132 and the third connecting component 133, but not the fourth connecting component 134 and the fifth connecting component 135. Furthermore, along the Y-axis, the second connecting component 132 and the third connecting component 133 are disposed on opposite sides of the connecting section 300 of the through-shaft circuit board 10.

[0125] The following describes a comparison between the rotating shaft mechanism provided in the embodiment of the present application and the rotating shaft mechanisms in other technical solutions with reference to the accompanying drawings.

[0126] FIG7 shows a schematic structural diagram of the rotating shaft mechanism 13b in some other technical solutions. Referring to FIG7 , in some other technical solutions, the connecting section 300b of the through-axis circuit board 10b is located on the right side of the center line L0. Since the rotating shaft mechanism 13b needs to avoid the offset through-axis circuit board 10b, the overall structure of the rotating shaft mechanism 13b is difficult to achieve symmetry, resulting in a large variety of components of the rotating shaft mechanism 13b, complex assembly, and a high probability of material mismixing. In addition, some materials are prone to excessive inventory, minimal consumption, and extremely low inventory turnover (i.e., stagnant materials), resulting in high production costs.

[0127] Comparing Figures 3B and 7 , in the present application, the first sub-segment 310 and the second sub-segment 320 of the connecting section 300 of the through-axis circuit board 10 are respectively arranged on opposite sides of the center P along the Y-axis direction. This facilitates the symmetrical design of the hinge mechanism 13. For example, the connecting components (e.g., the second connecting component 132, the third connecting component 133, the fourth connecting component 134, and the fifth connecting component 135) located on opposite sides of the through-axis circuit board 10 in the hinge mechanism 13 can be arranged rotationally symmetrically about the center P. In this way, the overall structure of the hinge mechanism 13 can be roughly symmetrical about the connecting section 300 of the through-axis circuit board 10, thereby reducing the number of components in the hinge mechanism 13, reducing the complexity of assembly and the probability of material mismixing, and avoiding the problem of increased production costs due to the generation of excessive stagnant material.

[0128] The above describes the implementation methods of the present application by means of specific specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation methods. On the contrary, the purpose of introducing the application in conjunction with the implementation methods is to cover other options or modifications that may be extended based on the claims of the present application. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details are omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other unless there is a conflict.

[0129] In the description of this application, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "outside", "inside", "circumferential", "radial", "axial", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.

[0130] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "dispose," "install," "connect," and "fit" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0131] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. An electronic device, characterized in that: It includes a first body, a second body, a rotating shaft mechanism and a circuit board, wherein: The first body is connected to the second body via the rotating shaft mechanism so as to be rotatable relative to the second body around an axis extending in a first direction, the rotating shaft mechanism comprising at least one set of connecting components rotatably connecting the first body and the second body, the at least one set of connecting components comprising a first connecting component; The circuit board includes a first extension segment, a connecting segment, and a second extension segment connected in sequence, the connecting segment includes a first sub-segment and a second sub-segment spaced apart along the first direction, wherein two ends of the first sub-segment are respectively connected to the first extension segment and the second extension segment, and two ends of the second sub-segment are respectively connected to the first extension segment and the second extension segment; The first extension section and the second extension section extend into the first body and the second body respectively, the connecting section extends through the hinge mechanism, and, along the first direction, the first subsection and the second subsection of the connecting section are located on opposite sides of the center of the electronic device along the first direction; Wherein, along the first direction, the first connecting component is arranged between the first sub-segment and the second sub-segment of the connecting segment.

2. The electronic device according to claim 1, wherein The first extension section includes a first end and a second end spaced apart along the first direction, and the second extension section includes a first end and a second end spaced apart along the first direction; The two ends of the second sub-segment are respectively connected to the first end of the first extension segment and the first end of the second extension segment, and along the first direction, the second end of the first extension segment and the second end of the second extension segment are both located on the side of the first sub-segment facing away from the second sub-segment.

3. The electronic device according to claim 2, wherein: The circuit board includes a first trace and a second trace, wherein the length of the first trace is shorter than the length of the second trace, wherein: The first trace extends from the second end of the first extension segment to the second end of the second extension segment via the first sub-segment of the connecting segment, and the first trace is used to transmit one of the following signals: a high-speed signal, a high-current power supply signal; The second trace extends from the second end of the first extension segment to the second end of the second extension segment via the second sub-segment of the connecting segment, and the second trace is used to transmit one of the following signals: a low-speed signal, a digital signal, a low-current power supply signal, and an analog-to-digital converter signal.

4. The electronic device according to claim 1, wherein: The circuit board is a flexible circuit board.

5. The electronic device according to claim 1, wherein The first connecting component is located at the center of the electronic device along the first direction.

6. The electronic device according to claim 5, characterized in that The first connecting component includes a first swing arm and a second swing arm, and the first connecting component is connected to the first body through the first swing arm and is connected to the second body through the second swing arm; wherein the materials of the first swing arm and the second swing arm are powder metallurgy materials or aluminum profiles.

7. The electronic device according to claim 1, wherein: Along the first direction, a ratio between a distance between the first sub-segment and the second sub-segment of the connecting segment and a size of the rotating shaft mechanism is 0.05-0.

3.

8. The electronic device according to claim 1, wherein: At least one group of the connecting components further includes a second connecting component and a third connecting component, and the second connecting component and the third connecting component are respectively arranged on opposite sides of the connecting section of the circuit board.

9. The electronic device according to claim 8, wherein: Along the first direction, the second connecting component and the third connecting component are equidistant from the center of the electronic device along the first direction.

10. The electronic device according to claim 8, wherein The second connecting component and the third connecting component are rotationally symmetric about the center of the electronic device along the first direction.

11. A circuit board, characterized in that: It includes a first extension segment, a connecting segment and a second extension segment connected in sequence, wherein the connecting segment includes a first sub-segment and a second sub-segment spaced apart along a first direction, the two ends of the first sub-segment are respectively connected to the first extension segment and the second extension segment, and the two ends of the second sub-segment are respectively connected to the first extension segment and the second extension segment.

12. The circuit board according to claim 11, wherein: The first extension section includes a first end and a second end spaced apart along the first direction, and the second extension section includes a first end and a second end spaced apart along the first direction; The two ends of the second sub-segment are respectively connected to the first end of the first extension segment and the first end of the second extension segment, and along the first direction, the second end of the first extension segment and the second end of the second extension segment are both located on the side of the first sub-segment facing away from the second sub-segment.

13. The circuit board according to claim 12, wherein: The circuit board includes a first trace and a second trace, wherein the length of the first trace is shorter than the length of the second trace, wherein: The first trace extends from the second end of the first extension segment to the second end of the second extension segment via the first sub-segment of the connecting segment, and the first trace is used to transmit one of the following signals: a high-speed signal, a high-current power supply signal; The second trace extends from the second end of the first extension segment to the second end of the second extension segment via the second sub-segment of the connecting segment, and the second trace is used to transmit one of the following signals: a low-speed signal, a digital signal, a low-current power supply signal, and an analog-to-digital converter signal.

14. The circuit board according to claim 11, wherein: The circuit board is a flexible circuit board.

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