Memory array and manufacturing method therefor, and memory and electronic device

By using a three-electrode structure and a dielectric layer design for the capacitor cell, the problem of low integration density of capacitor structures in memory is solved, achieving high integration density and high storage density of capacitors.

WO2025139090A9PCT designated stage Publication Date: 2026-05-28HUAWEI TECH CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
HUAWEI TECH CO LTD
Filing Date
2024-09-18
Publication Date
2026-05-28

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Abstract

The present application relates to the technical field of electronics. Provided are a memory array and a manufacturing method therefor, and a memory and an electronic device, which are used for solving the problem of a capacitor structure in a memory having a low density of integration. The memory array comprises: a substrate, and a capacitor unit arranged on the substrate. The capacitor unit comprises a first electrode, a second electrode and a third electrode, wherein the first electrode, the second electrode and the third electrode all extend in the thickness direction of the substrate, the first electrode is arranged around the second electrode, and the second electrode is arranged around the third electrode. The capacitor unit further comprises a first dielectric layer and a second dielectric layer, wherein the first dielectric layer is arranged between the first electrode and the second electrode, and the second dielectric layer is arranged between the second electrode and the third electrode. The memory array is used for improving the density of integration of a capacitor structure.
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