Packaging structure and manufacturing method therefor

Abstract

Embodiments of the present disclosure provide a packaging structure and a manufacturing method therefor. The packaging structure comprises a packaging body and a reinforcing structure. The packaging body comprises a chip, and has a front side and a back side opposite to each other in a first direction and a side wall connecting the front side and the back side, wherein the side of the packaging body provided with the chip is the front side of the packaging body. The reinforcing structure at least comprises a first reinforcing portion, and the first reinforcing portion is connected to the side wall of the packaging body, and surrounds the packaging body in the direction parallel to the main surface of the packaging body.

Description

Packaging structure and manufacturing method thereof

[0001] This application claims priority to Chinese patent application No. 202311795251.9 filed on December 25, 2023, and the contents of the above-mentioned Chinese patent application disclosure are hereby incorporated by reference in their entirety as a part of this application. Technical Field

[0002] Embodiments of the present disclosure relate to a packaging structure and a method for manufacturing the same. Background Art

[0003] Integrated circuit (IC) chips are widely used in various electronic devices and can be packaged using semiconductor packaging technology. In semiconductor packaging structures, differences in the coefficient of thermal expansion (CTE) between different materials can cause the package structure to warp under certain temperature conditions, potentially affecting device performance and even causing package failure.

[0004] Therefore, how to reduce or avoid the warping of the packaging structure is an important research topic in this field. Summary of the Invention

[0005] According to at least one embodiment of the present disclosure, a package structure and a manufacturing method thereof are provided, which can avoid or significantly reduce warping of the package structure, thereby improving device performance and reliability of the package structure.

[0006] At least one embodiment of the present disclosure provides a packaging structure, comprising a packaging body and a reinforcement structure. The packaging body includes a chip and has a front side and a back side opposite to each other in a first direction, and a sidewall connecting the front side and the back side, wherein the side of the packaging body on which the chip is provided is the front side of the packaging body. The reinforcement structure includes at least a first reinforcement portion, the first reinforcement portion being bonded to the sidewall of the packaging body and surrounding the packaging body in a direction parallel to the main surface of the packaging body.

[0007] At least one embodiment of the present disclosure provides a method for manufacturing a packaging structure, comprising: providing a packaging body, wherein the packaging body includes a chip and has a front side and a back side opposite to each other in a first direction; providing a carrier and placing a reinforcement structure on the carrier; and picking up the packaging body and joining the packaging body to the reinforcement structure to form the packaging structure, wherein the reinforcement structure includes at least a first reinforcement portion, the first reinforcement portion is joined to a side wall of the packaging body and surrounds the packaging body in a direction parallel to a main surface of the packaging body. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, rather than limiting the present disclosure.

[0009] FIG1 shows a schematic cross-sectional view of a package structure according to some embodiments of the present disclosure.

[0010] 2A to 2D are schematic plan views illustrating package structures according to some embodiments of the present disclosure.

[0011] 3 to 9 illustrate schematic structural diagrams of various steps in a method for manufacturing a package structure according to some embodiments of the present disclosure.

[0012] FIG. 10 is a schematic cross-sectional view illustrating a package structure according to other embodiments of the present disclosure.

[0013] FIG. 11 shows a schematic bottom view of a package structure according to other embodiments of the present disclosure.

[0014] 12 to 21 are schematic cross-sectional views illustrating package structures according to further embodiments of the present disclosure.

[0015] 22A shows a simulation cloud diagram of the package structure of the first comparative example in a first set of simulation tests conducted at 25° C. FIG22B and FIG22C respectively show simulation cloud diagrams of the package structures of some embodiments of the present disclosure in a first set of simulation tests conducted at 25° C.

[0016] 23A shows a simulation cloud diagram of the package structure of the first comparative example in a first set of simulation tests conducted at 260° C. FIG23B and FIG23C respectively show simulation cloud diagrams of the package structures of some embodiments of the present disclosure in a first set of simulation tests conducted at 260° C.

[0017] 24A shows a simulation cloud diagram of the package structure of the second comparative example in a second set of simulation tests conducted at 25° C. FIG24B and FIG24C respectively show simulation cloud diagrams of the package structures of some embodiments of the present disclosure in a second set of simulation tests conducted at 25° C.

[0018] 25A shows a simulation cloud diagram of the package structure of the second comparative example in a second set of simulation tests conducted at 260° C. FIG25B and FIG25C respectively show simulation cloud diagrams of the package structures of some embodiments of the present disclosure in a second set of simulation tests conducted at 260° C.

[0019] 26A shows a simulation cloud diagram of the package structure of the third comparative example in the third set of simulation tests conducted at 25° C. FIG26B and FIG26C respectively show simulation cloud diagrams of the package structures of some embodiments of the present disclosure in the third set of simulation tests conducted at 25° C.

[0020] 27A shows a simulation cloud diagram of the package structure of the third comparative example in the third set of simulation tests conducted at 260° C. FIG27B and FIG27C respectively show simulation cloud diagrams of the package structures of some embodiments of the present disclosure in the third set of simulation tests conducted at 260° C. DETAILED DESCRIPTION

[0021] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0022] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0023] Ball Grid Array (BGA) packaging technology is a high-density surface-mount packaging technology for integrated circuits. The bottom of the BGA package typically uses an array of tin alloy solder balls as pins. BGA packages are typically mounted on printed circuit boards (PCBs) using surface mount technology (SMT). Flip Chip Ball Grid Array (FCBGA) is a type of BGA package and is widely used in the packaging of a variety of high-performance chips.

[0024] In the FCBGA process, reflow soldering is typically used to gradually increase the temperature so that the solder reflows in a molten state, forming solder joints between the chip and the package substrate, and between the package substrate and the PCB, thereby achieving electrical connections between the chip and the package substrate, and between the package substrate and the PCB. However, due to the CTE mismatch between different materials in the FCBGA package structure, the package structure may warp, for example, during a high-temperature reflow process. When the warping is excessive, it may further cause solder balls to short circuit (bridging), solder not wet open, and head-in-pillow effect after the package structure is mounted on the PCB, thereby affecting device performance, such as causing device failure. Typically, the zero warpage temperature (i.e., steady-state temperature) of the FCBGA package is between 100°C and 200°C. When the temperature is above or below the steady-state temperature, the JEDEC standard defines two types of deformation: "smiley face" (concave deformation) and "crying face" (convex deformation).

[0025] In response to the above problems, an embodiment of the present disclosure provides a packaging structure and a manufacturing method thereof, wherein the packaging structure includes a packaging body and a reinforcement structure; the packaging body includes a chip, and has a front side and a back side opposite to each other in a first direction, and a side wall connecting the front side and the back side, wherein the side of the packaging body on which the chip is provided is the front side of the packaging body; the reinforcement structure includes at least a first reinforcement portion, the first reinforcement portion is joined to the side wall of the packaging body, and surrounds the packaging body in a direction parallel to the main surface of the packaging body.

[0026] In the package structure and manufacturing method of the disclosed embodiments, by providing a reinforcement structure, warping of the package structure can be reduced or avoided under various temperature conditions (e.g., temperatures above or below the steady-state temperature range), thereby avoiding device failures caused by warping and improving the device performance and reliability of the package structure. The following describes the package structure of the disclosed embodiments using an FCBGA package as an example.

[0027] Figure 1 is a schematic cross-sectional view of a package structure according to some embodiments of the present disclosure. Figures 2A to 2D are schematic top views of a package structure according to some embodiments of the present disclosure.

[0028] Referring to FIG. 1 , in some embodiments, a package structure 500a includes a package body 50a and a reinforcement structure 200. The package body 50a includes a chip 110 and has a front side FS and a back side BS that are opposite to each other in a first direction D1, and a sidewall 50s connecting the front side and the back side. In some embodiments, the side of the package body 50a on which the chip 110 is disposed is referred to as the front side FS of the package body 50a. The reinforcement structure 200 includes at least a first reinforcement portion 200a, which is bonded to the sidewall 50s of the package body 50a and surrounds the package body in a direction parallel to the main surface of the package body 50a (e.g., a horizontal direction including the second direction D2 and the third direction D3). In some embodiments, the first reinforcement portion 200a extends continuously in the first direction D1 to cover (e.g., completely cover) the entire sidewall of the package body. For example, the surface area of ​​the first reinforcement portion 200a that is adjacent to or faces the package body may be greater than or equal to the area of ​​the sidewall of the package body. For example, an orthographic projection of the side wall of the package body on a reference plane parallel to the side wall is located within an orthographic projection of the first reinforcing portion on the reference plane.

[0029] In some embodiments, the package body 50a is a flip-chip package and includes a package substrate 100, a chip 110, and a reinforcement member 130; the package substrate 100 has a first side a1 and a second side a2 that are opposite to each other in a first direction D1. The first side a1 and the second side a2 of the package substrate 100 correspond to the front side FS and the back side BS of the package body 50a, respectively. For example, the chip 110 is disposed on the first side a1 of the package substrate 100 and is electrically connected to the package substrate 100. The second side a2 of the package substrate 100 is located on or is the back side BS of the package body 50a. The reinforcement member 130 is located on the first side a1 of the package substrate 100 and may include at least a reinforcement joint 130a. For example, the reinforcement joint 130a is bonded to an edge portion of the package substrate 100. The chip 110 may be located in an area surrounded by the reinforcement member 130 in a direction parallel to the main surface of the package substrate (e.g., a horizontal direction including the second direction D2 and the third direction D3). The first direction D1 is perpendicular to the main surfaces of the package substrate and the package body. The second direction D2 and the third direction D3 are both perpendicular to the first direction D1, that is, parallel to the main surfaces of the package body and the package substrate, and intersect with each other, for example, are perpendicular to each other. It should be understood that the directions "D2 / D3" marked in the cross-sectional views represent the second direction D2 or the third direction D3.

[0030] In some embodiments, the sidewall 50s of the package body 50a includes the sidewall 100s of the package substrate 100 and the sidewall 130s of the reinforcing joint 130a. The first reinforcing portion 200a of the reinforcing structure 200 can extend continuously in the first direction D1 and be bonded to the sidewall 100s of the package substrate 100 and the sidewall 130s of the reinforcing joint 130a. For example, the first reinforcing portion 200a can be attached to the sidewall of the package body 50a (i.e., the sidewalls of both the package substrate and the reinforcing joint) via an adhesive layer 210.

[0031] In some embodiments, the chip 110 is mounted on a first side of the package substrate 100 and is electrically connected to the package substrate 100 through a plurality of conductive connectors 112. The conductive connectors 112 may include conductive bumps and / or solder balls, etc. For example, the chip 110 may include a substrate and a device layer. The substrate may be a semiconductor substrate, such as a silicon substrate. For example, the device layer may include active devices such as transistors, passive devices such as capacitors, or a combination thereof, as well as an interconnection structure, etc. The conductive connectors 112 may be provided on a side of the device layer away from the substrate and provide an electrical connection between the chip and the package substrate. The side of the chip 110 on which the conductive connectors 112 are provided may be referred to as the active side or front side of the chip, and the side opposite to the front side may be referred to as the back side of the chip 110. That is, the active side of the chip 110 faces the package substrate 100 and is electrically connected to the package substrate 100 through a plurality of conductive connectors 112. In some embodiments, the chip 110 may be a digital signal processor (DSP) chip, a graphics processing unit (GPU), an application specific integrated circuit (ASIC) chip, a system on chip (SoC), etc. It should be understood that the above chip types are merely examples, and the chip type can be selected based on product design and requirements, and the present disclosure is not limited thereto.

[0032] In some embodiments, the package substrate 100 may include a core layer 10, a build-up layer 11, a build-up layer 12, a solder mask 13, and a solder mask 15. In a direction perpendicular to the main surface of the package substrate 100 (e.g., a first direction D1), the build-up layer 11 and the build-up layer 12 are located on opposite sides of the core layer 10, and the solder mask 13 and the solder mask 15 are located on the side of the build-up layer 11 and the build-up layer 12 away from the core layer 10, respectively. In some embodiments, the core layer 10 includes a core dielectric layer and a conductive structure; the core dielectric layer may include a resin material such as epoxy resin and / or a material such as glass fiber or similar materials, and the present disclosure does not limit the material type of the core layer. The conductive structure in the core layer 10 may include a conductive via penetrating the core dielectric layer and / or a conductive layer (e.g., including a conductive line) located on opposite sides of the core dielectric layer.

[0033] The buildup layer 11 and the buildup layer 12 may each include one or more dielectric layers and conductive layers stacked on top of each other, one or more conductive layers embedded in the dielectric layer, and the conductive components in the one or more conductive layers may be electrically connected to the conductive structure in the core layer 10, and the conductive components located in different layers may be connected to each other through conductive vias passing through the dielectric layer. For example, the dielectric layer in the buildup layer may include a prepreg, which may include a resin material and glass fiber, etc.; or, the dielectric layer in the buildup layer may also include Ajinomoto Buildup Film (ABF), but the present disclosure is not limited to this. In some embodiments, the solder resist layer 13 and the solder resist layer 15 may each have one or more openings (not shown) to expose part of the conductive components (e.g., conductive pads) in the buildup layers 11 and 12 for further electrical connection. For example, at least part of the conductive pads (not shown) exposed by the solder resist layer 13 is electrically connected to the conductive connector 112, and then connected to the chip through the conductive connector.

[0034] In some embodiments, the sidewalls of multiple material layers (e.g., the core layer, buildup layer, solder resist layer, etc.) of the packaging substrate 100 may be roughly aligned with each other in the first direction D1, and the sidewalls 100s of the packaging substrate 100 include the sidewalls of the multiple material layers.

[0035] In some embodiments, the sidewalls 130s of the reinforcement joint portion 130a of the reinforcement member 130 may be substantially aligned with the sidewalls 100s of the package substrate 100 in the first direction D1. For example, the reinforcement member 130 may be attached to an edge portion of the package substrate 100 via the adhesive layer 128. In some embodiments, the sidewalls of the adhesive layer 128 may also be aligned with the sidewalls 100s of the package substrate 100 and the sidewalls 130s of the reinforcement member 130 in the first direction D1. In other embodiments, the reinforcement member 130 may be bonded to the package substrate 100 in other ways.

[0036] In some embodiments, the first reinforcing portion 200a of the reinforcing structure 200 can be attached to the sidewall 100s of the package substrate 100 and the sidewall 130s of the reinforcing joint portion 130a via an adhesive layer (or first adhesive layer) 210. The materials of the reinforcing structure 200 and the reinforcing member 130 can be the same or different; and the materials of the adhesive layer 210 and the adhesive layer 128 can be the same or different. For example, the reinforcing structure 200 and the reinforcing member 130 can each comprise a metal material, such as at least one selected from pure metals such as gold, silver, copper, iron, aluminum, zinc, tin, lead, cobalt, nickel, tungsten, chromium, molybdenum, titanium, manganese, and zirconium, and their alloys. For example, the adhesive layer 210 and the adhesive layer 128 can each be selected from at least one of an organic adhesive (e.g., epoxy resin, phenolic resin, polyacrylate, polyvinyl acetate, etc.) and an inorganic compound adhesive (e.g., silicate, phosphate, oxide, nitride, etc.). It should be understood that the materials of the reinforcing structure and the adhesive layer listed above are merely examples, and the present disclosure is not limited thereto.

[0037] In some embodiments, the thickness of the first reinforcing portion 200a and the adhesive layer 210 can be selected based on the product design and requirements of the packaging structure, and the thickness of the first reinforcing portion 200a can be the same as or different from the thickness of the reinforcing member 130, and the thickness of the adhesive layer 210 can be the same as or different from the thickness of the adhesive layer 128. It should be understood that the thickness of each material layer refers to the thickness perpendicular to its extension direction. For example, the thickness of the first reinforcing portion 200a and the adhesive layer 210 refers to the thickness in the direction parallel to the main surface of the packaging substrate (for example, the second direction D2 or the third direction D3); the thickness of the reinforcing member 130 (for example, its reinforcing joint 130a) and the adhesive layer 128 refers to the thickness in the direction perpendicular to the main surface of the packaging substrate (for example, the first direction D1).

[0038] In some embodiments, the orthographic projections of the package substrate 100 and the reinforcing joint 130a on a reference plane parallel to the sidewall 100s of the package substrate are located within the orthographic projection of the reinforcement structure 200 on the reference plane. The height of the reinforcement structure 200 in a first direction D1 perpendicular to the main surface of the package substrate may be greater than or equal to the height of the sidewall 50s of the package body 50a in the first direction D1; the height of the sidewall 50s of the package body 50a in the first direction D1 may be defined, for example, by the distance in the first direction D1 between the surface of the reinforcing joint 130a on the side away from the package substrate and the surface of the second side a2 of the package substrate 100 (i.e., the side away from the reinforcing joint). The sidewall 100s of the package substrate 100, the sidewall 130s of the reinforcing joint layer 130a, and the sidewall of the adhesive layer 128 located between the package substrate and the reinforcing joint layer may be completely covered by the reinforcement structure 200.

[0039] For example, as shown in FIG1 , the height H1 of the reinforcement structure 200 in the first direction D1 may be substantially equal to the distance L1 between the surface of the reinforcing joint portion 130a on the side away from the package substrate and the surface of the second side of the package substrate 100 in the first direction D1. The reinforcement structure 200 has a first surface 201 and a second surface 202 that are opposite to each other in the first direction D1. In some embodiments, the first surface of the reinforcement structure 200 is substantially flush with the surface of the reinforcing joint portion 130a on the side away from the package substrate 100 in a direction parallel to the main surface of the package substrate (e.g., a horizontal direction including the second direction D2), and the second surface 202 of the reinforcement structure 200 is substantially flush with the surface of the second side a2 of the package substrate 100 in a direction parallel to the main surface of the package substrate (e.g., a horizontal direction including the second direction D2). In alternative embodiments, the reinforcement structure 200 may also slightly protrude in the first direction from the surface of the reinforcing joint portion 130a on the side away from the package substrate and / or slightly protrude from the surface of the second side of the package substrate.

[0040] In an embodiment where the sidewall 100s of the package substrate 100 and the sidewall 130s of the reinforcing joint 130a are substantially aligned in the first direction D1, the first reinforcing portion 200a may have a substantially uniform width. For example, the first reinforcing portion 200 includes a first reinforcing sub-portion 21 and a second reinforcing sub-portion 22. The first reinforcing sub-portion 21 covers at least the sidewall 100s of the package substrate 100, and the second reinforcing sub-portion 22 covers at least the sidewall 130s of the reinforcing joint 130a. In other words, the first reinforcing sub-portion 21 overlaps with the package substrate 100 in a direction parallel to the main surface of the package substrate, and the second reinforcing sub-portion 22 overlaps with the reinforcing joint 130a in a direction parallel to the main surface of the package substrate. It should be understood that the first reinforcing sub-portion 21 and the second reinforcing sub-portion 22 of the first reinforcing portion 200a are connected to each other and can be formed as a single piece. In some embodiments, the first reinforcement sub-portion 21 and the second reinforcement sub-portion 22 may have the same width W, which is a width in a direction parallel to the main surface of the package substrate (eg, the second direction D2 or the third direction D3 ).

[0041] 2A to 2D are schematic plan views of a package structure 500a according to some embodiments of the present disclosure. For the sake of clarity and brevity, multiple components of the package body 50a are not specifically shown in the plan views.

[0042] In some embodiments, the package body 50a has a plurality of side walls, each of which includes the corresponding side walls of both the package substrate and the reinforcement member (for example, the side walls that are substantially perpendicular to the main surface of the package substrate); the first reinforcement portion of the reinforcement structure may include a plurality of sidewall reinforcement portions, each sidewall reinforcement portion being joined to the corresponding side wall of the package body, for example, being attached to the corresponding side wall of the package body by a sidewall adhesive layer. The sidewall reinforcement portion and the side wall of the package body may be arranged in a one-to-one correspondence, for example. Each sidewall reinforcement portion includes the above-mentioned first reinforcement sub-portion and second reinforcement sub-portion connected to each other, and covering the side walls of both the package substrate and the reinforcement member. In some embodiments, different sidewall reinforcement portions in the reinforcement structure may be separated from each other (that is, not in direct contact). For example, different sidewall reinforcement portions may be joined to each other, for example, by bonding to each other through a sidewall adhesive layer, thereby increasing the structural stability of the reinforcement structure and the package structure as a whole.

[0043] In some embodiments, the sidewall of the package body includes a first sidewall and a second sidewall; the first sidewall extends along the first direction and the second direction, and the second sidewall extends along the first direction and the third direction. The first reinforcement portion includes a first sidewall reinforcement portion and a second sidewall reinforcement portion, the first sidewall reinforcement portion is attached to the first sidewall of the package body through a first sidewall adhesive layer, and the second sidewall reinforcement portion is attached to the second sidewall of the package body through a second sidewall adhesive layer. For example, the first sidewall reinforcement portion and the second sidewall reinforcement portion are separated from each other. For example, the first sidewall reinforcement portion and the second sidewall reinforcement portion are also bonded to each other by at least one of the first sidewall adhesive layer and the second sidewall adhesive layer.

[0044] 1 and 2A to 2D , for example, the sidewall 50s of the package body 50a includes a first sidewall S1 and a second sidewall S2. Each first sidewall S1 of the package body 50a may include the first sidewall of the package substrate 100 and the first sidewall of the reinforcement joint 130a; each second sidewall S2 of the package body 50a may include the second sidewall of the package substrate 100 and the second sidewall of the reinforcement joint 130a. The reinforcement structure 200 may include a first sidewall reinforcement portion P1 and a second sidewall reinforcement portion P2. From a plan view, the first sidewall S1 and the second sidewall S2 extend in different directions and may intersect with each other. For example, the first sidewall S1 and the first sidewall reinforcement P1 of the package body may extend in the second direction D2, and the second sidewall S2 and the second sidewall reinforcement P2 of the package body may extend in the third direction D3.

[0045] In some embodiments, package body 50a is square in plan view, and its first sidewall S1 includes parallel sidewalls S1a and S1b extending in the second direction D2 and opposing each other in the third direction D3. Its second sidewall S2 includes parallel sidewalls S2a and S2b extending in the third direction D3 and opposing each other in the second direction D2. Accordingly, first sidewall reinforcement P1 includes parallel sidewall reinforcements P1a and P1a extending in the second direction D2 and opposing each other in the third direction D3. Second sidewall reinforcement P2 includes parallel sidewall reinforcements P2a and P2b extending in the third direction D3 and opposing each other in the second direction D2.

[0046] Referring to Figures 1 and 2A to 2D, adhesive layer 210 includes adhesive layers 1a, 1b, 2a, and 2b. For example, sidewall reinforcement P1a is attached to sidewall S1a of package body 50a via adhesive layer 1a; sidewall reinforcement P1b is attached to sidewall S1b of package body 50a via adhesive layer 1b; sidewall reinforcement P2a is attached to sidewall S2a of package body 50a via adhesive layer 2a; and sidewall reinforcement P2b is attached to sidewall S2b of package body 50a via adhesive layer 2b. In some embodiments, adhesive layers 1a and 1b may be referred to as first sidewall adhesive layers, and adhesive layers 2a and 2b may be referred to as second sidewall adhesive layers.

[0047] In some embodiments, the plurality of sidewall reinforcements P1a, P1b, P2a, and P2b are separated from one another (i.e., not in direct contact with one another), and may be, for example, independent metal blocks. For example, adjacent sidewall reinforcements among the plurality of sidewall reinforcements may be bonded to one another via at least one of a first sidewall adhesive layer and a second sidewall adhesive layer, thereby improving the overall structural stability of the reinforcement structure.

[0048] In some embodiments, the surface area of ​​each sidewall reinforcement portion close to the side wall of the package body may be greater than or equal to the area of ​​the corresponding side wall of the package body to which it is attached, and each side wall of the package body may be covered by the sidewall reinforcement portion (for example, completely covered). For example, the extension length of each sidewall reinforcement portion in a direction parallel to the main surface of the package substrate (for example, the second direction or the third direction) may be at least equal to the extension length of the corresponding side wall of the package body to which it is attached in the said direction. The extension length of one or more sidewall reinforcement portions in a direction parallel to the main surface of the package substrate may be greater than the extension length of the corresponding side wall of the package body to which it is attached in the said direction, so that the one or more sidewall reinforcement portions may also extend beyond the corresponding side wall edge of the package body and extend to join with the adjacent sidewall reinforcement portion. In some embodiments, the first sidewall reinforcement portion and the second sidewall reinforcement portion intersecting each other may have sidewalls or edges aligned in the extension direction of one of the two, where the extension direction of the sidewall reinforcement portion refers to the extension direction in the plan view, that is, the extension direction parallel to the main surface of the package substrate.

[0049] 2A to 2D schematically illustrate a situation in which a plurality of sidewall reinforcing portions are attached to the sidewalls of the package body through an adhesive layer and bonded to each other.

[0050] As shown in FIG2A , in some examples, the extension length of the second sidewall reinforcements P2a and P2b in the third direction D3 is approximately equal to the extension length of the second sidewalls S2a and S2b of the package body 50a in the third direction D3, and the two opposing sidewalls of the second sidewall reinforcement in the third direction D3 are approximately aligned with the first sidewalls S1a and S1b of the package body 50a in the second direction D2. The extension length of the first sidewall reinforcements P1a and P1b in the second direction D2 is greater than the extension length of the first sidewalls S1a and S1b of the package body 50a in the second direction D2. The first sidewall reinforcement P1a extends beyond the corresponding edge of the package body in the second direction D2 and is further bonded to the second sidewall reinforcements P2a and P2b via the adhesive layer 1a. The first sidewall reinforcement P1b extends beyond the corresponding edge of the package body in the second direction D2 and is further bonded to the second sidewall reinforcements P2a and P2b via the adhesive layer 1b. In some embodiments, two opposite sidewalls of each first sidewall reinforcement P1 in the second direction D2 may be aligned in the third direction D3 with sidewalls of the sidewall reinforcements P2a and P2b away from the package body and extending along the third direction D3.

[0051] As shown in FIG2B , in some examples, the extension length of the sidewall reinforcement portion P2b in the third direction D3 is substantially equal to the extension length of the second sidewall S2b of the package body 50a in the third direction D3, and the two opposing sidewalls of the sidewall reinforcement portion P2b in the third direction D3 are substantially aligned with the first sidewalls S1a and S1b of the package body 50a in the second direction D2. The extension length of the first sidewall reinforcement portions P1a and P1b in the second direction D2 is greater than the extension length of the first sidewalls S1a and S1b of the package body 50a in the second direction D2. One end of the first sidewall reinforcement portions P1a and P1b extends beyond the corresponding edge of the package body in the second direction D2 and is further bonded to the sidewall reinforcement portion P2b via adhesive layers 1a and 1b, respectively. The sidewalls of the other ends of the first sidewall reinforcement portions P1a and P1b may be substantially aligned with the second sidewall S2a of the package body 50a in the third direction D3. In some embodiments, the extension length of sidewall reinforcement P2a in the third direction D3 is greater than the extension length of sidewall S2a of package body 50a in the third direction D3. Sidewall reinforcement P2a may extend beyond opposing edges of the package body in the third direction D3 and further be bonded to sidewall reinforcements P1a and P1b via adhesive layer 2a. For example, two opposing sidewalls of sidewall reinforcement P2a in the third direction D3 may be aligned in the second direction D2 with the sidewalls of sidewall reinforcements P1a and P1b extending away from the package body and in the second direction D2, respectively.

[0052] As shown in FIG2C , in some examples, the extension length of the first sidewall reinforcements P1a and P1b in the second direction D2 is approximately equal to the extension length of the first sidewalls S1a and S1b of the package body 50a in the second direction D2, and the two opposing sidewalls of the first sidewall reinforcement in the second direction D2 are respectively substantially aligned with the second sidewalls S2a and S2b of the package body 50a in the third direction D3. The extension length of the second sidewall reinforcements P2a and P2b in the third direction D3 is greater than the extension length of the second sidewalls S2a and S2b of the package body 50a in the third direction D3. The second sidewall reinforcements may extend beyond the corresponding edges of the package body in the third direction D3 and be further bonded to the first sidewall reinforcements P1a and P1b via an adhesive layer. In some embodiments, the two opposing sidewalls of each second sidewall reinforcement P2 in the third direction D3 may be aligned in the second direction D2 with the sidewalls of the sidewall reinforcements P1a and P1b that extend away from the package body and extend along the second direction D2.

[0053] As shown in FIG2D , in some examples, the extension length of sidewall reinforcement portion P2b in the third direction D3 is substantially equal to the extension length of second sidewall S2b of package body 50a in the third direction D3, and two opposing sidewalls of sidewall reinforcement portion P2b in the third direction D3 are substantially aligned with first sidewalls S1a and S1b of package body 50a in the second direction D2. The extension length of first sidewall reinforcement portions P1a and P1b in the second direction D2 is greater than the extension length of first sidewalls S1a and S1b of package body 50a in the second direction D2. At least one end of first sidewall reinforcement portions P1a and P1b extends beyond the corresponding edge of the package body in the second direction D2. For example, one end of sidewall reinforcement portion P1a may extend beyond sidewall S2b of the package body in the second direction D2 and may be further bonded to sidewall reinforcement portion P2b via first adhesive layer 1a. The sidewall of the other end of sidewall reinforcement portion P1a may be substantially aligned with sidewall S2a of the package body in the third direction D3. For example, sidewall reinforcement portion P1b may extend beyond the opposite edge of the package body in the second direction D2 and may be further bonded to sidewall reinforcement portion P2b and sidewall reinforcement portion P2a via first adhesive layer 1b. In some embodiments, the extension length of sidewall reinforcement portion P2a in the third direction D3 is greater than the extension length of sidewall S2a of package body 50a in the third direction D3. One end of sidewall reinforcement portion P2a may extend beyond sidewall S1a of the package body in the third direction D3 and may be further bonded to sidewall reinforcement portion P1a via second adhesive layer 2a. The sidewall of sidewall reinforcement portion P2a at the other end may be substantially aligned with sidewall S1b of the package body in the second direction D2 and bonded to sidewall reinforcement portion P2a.

[0054] It should be understood that the planar shape of the package body and the configuration of the multiple sidewall reinforcement parts shown in Figures 2A to 2D are illustrative and the present disclosure is not limited thereto. In other embodiments, the package body may also have other shapes, and the configuration of the multiple sidewall reinforcement parts may be adaptively adjusted according to the shape of the package body, so that each side wall of the package body is provided with a sidewall reinforcement part. Adjacent sidewall reinforcement parts may be joined to each other. In the above example, every two adjacent sidewall reinforcement parts are joined to each other; in alternative embodiments, one or more groups of adjacent sidewall reinforcement parts may not be joined to each other.

[0055] Referring back to Figure 1, in some embodiments, the reinforcement member 130 may be a reinforcement cover (lid) SL, and further include a top cover portion 130b1 and a connecting portion 130c. For example, the top cover portion 130b1 may extend in a direction parallel to the main surface of the packaging substrate, and may be attached to the surface of the chip 110 away from the packaging substrate through a thermal interface material (TIM). In some embodiments, the reinforcement cover may also be used as a heat dissipation cover. The top cover portion 130b1 is connected to the reinforcement joint portion 130a through the connecting portion 130c, and the chip 110 may be located in an area enclosed by the reinforcement cover and the packaging substrate. In some embodiments, the top cover portion 130b1 and the reinforcement joint portion 130a may be located at different horizontal heights relative to the main surface of the packaging substrate 100, and the connecting portion 130c may be inclined, for example, but the present disclosure is not limited thereto.

[0056] In some embodiments, relative to the surface of the first side a1 of the package substrate 100, the surface of the reinforcing joint 130a away from the package substrate and the first surface 201 of the first reinforcing portion of the reinforcement structure are located at a lower level than the surface of the chip 110 away from the package substrate. That is, in a first direction D1 perpendicular to the main surface of the package substrate, the distance between the surface of the reinforcing joint 130a away from the package substrate and the surface of the first side a1 of the package substrate 100, and the distance between the first surface 201 of the first reinforcing portion and the surface of the first side a1 of the package substrate 100, is less than the distance between the surface of the chip 110 away from the package substrate and the surface of the first side a1 of the package substrate. However, the present disclosure is not limited to this. For example, in other embodiments, relative to the surface of the first side a1 of the package substrate 100, the surface of the reinforcing joint 130a away from the package substrate and the first surface 201 of the first reinforcing portion of the reinforcement structure may be flush with or higher than the surface of the chip 110 away from the package substrate.

[0057] In some embodiments, the package body 50a of the package structure 500a further includes an underfill layer 115. The underfill layer 115 fills the space between the chip 110 and the package substrate 100 and surrounds and protects the plurality of conductive connectors 112. In some embodiments, conductive connectors 150 are provided on a side of the package substrate 100 away from the chip 110. The conductive connectors 150 are electrically connected to the chip 110 through the package substrate 100, and the package structure 500a can be further connected to other package components or electronic components via the conductive connectors 150, but the present disclosure is not limited thereto. The conductive connectors 150 may include solder balls, such as BGAs. In some embodiments, the package structure 500a can be further connected to a circuit board (not shown), such as a printed circuit board (PCB), via the conductive connectors 150. For example, when the package structure 500a is mounted on the circuit board, the circuit board is located on a side of the package substrate 100 away from the chip 110 in a first direction D1, and the conductive connectors 150 are located between the circuit board and the package substrate to provide an electrical connection between the package structure and the circuit board.

[0058] In some embodiments, an additional device 120 may be further provided on the packaging substrate 100. The additional device 120 may be or include, for example, an electronic device such as a capacitor, and the present disclosure does not limit the type of the additional device. The electronic device 120 is electrically connected to the packaging substrate 100 and may be coupled to the chip 110a. In some embodiments, the electronic device 120 and the chip 110a are provided on the same side of the packaging substrate 100, but the present disclosure is not limited thereto. In other embodiments, the additional device 120 and the chip 110a may also be provided on opposite sides of the packaging substrate 100. It should be understood that the position and number of the additional devices 120 shown in the figure are for illustrative purposes only, and the present disclosure is not limited thereto. In this article, the packaging body refers to the components in the packaging structure other than the reinforcement structure and the adhesive layer for joining the reinforcement structure; that is, the conductive connector 150 and the electronic device 120 also belong to the packaging body.

[0059] An embodiment of the present disclosure provides a method for manufacturing a packaging structure, comprising: providing a packaging body, the packaging body including a chip and having a front side and a back side opposite to each other in a first direction; providing a carrier and placing a reinforcement structure on the carrier; and picking up the packaging body and joining the packaging body to the reinforcement structure to form a packaging structure, wherein the reinforcement structure includes at least a first reinforcement portion, the first reinforcement portion being joined to a side wall of the packaging body and surrounding the packaging body in a direction parallel to a main surface of the packaging body.

[0060] In some embodiments, picking up the package body and joining the package body to the reinforcement structure includes: picking up the package body so that the first side wall of the package body faces the first side wall reinforcement portion, and joining the first side wall of the package body to the first side wall reinforcement portion, thereby forming an intermediate package structure including the package body and the first side wall reinforcement portion; and picking up the intermediate package structure so that the second side wall of the package body faces the second side wall reinforcement portion, and joining the intermediate package structure to the second side wall reinforcement portion.

[0061] Figures 3 to 9 are structural schematic diagrams of each step in the manufacturing method of the packaging structure according to some embodiments of the present disclosure, wherein Figures 3 to 5, Figure 6A, Figure 7A, Figure 8 and Figure 9 are side views or cross-sectional views, and Figure 6B and Figure 7B are top views.

[0062] Referring to FIG3 , in some embodiments, a package body 50a is provided and placed on a carrier 60. For example, multiple package bodies 50a may be placed on the carrier 60, and the packaging process may be performed on multiple package bodies simultaneously, thereby forming multiple package structures simultaneously and improving production efficiency. It should be understood that for the sake of simplicity, the specific structure of the package body 50a is not shown in FIG3 through FIG9 , and the structure of the package body 50a can be referred to above.

[0063] For example, if the package body 50a includes a package substrate, a chip, and a reinforcement member, after the process of forming the package body 50a is completed, the package body 50a is placed on the carrier 60 with a side surface of the package body 50a facing upward. The side surface of the package body 50a may be one of its multiple side walls. In other words, one of the multiple side walls of the package body 50a faces upward, and another of the multiple side walls (e.g., side wall S1 or S2) faces the carrier 60. The process of forming the package body 50a may include mounting the chip on the package substrate and bonding the reinforcement member to the package substrate.

[0064] 4 and 5, a pickup process is performed to pick up the package body 50a from the carrier 60. For example, a pickup head 61 is moved above the carrier 60, and then the pickup head 61 is lowered toward the carrier 60 and absorbs the package body 50a.

[0065] Figures 6A and 6B schematically illustrate a schematic side view and a top view of placing a reinforcement structure 200 on another carrier. Figures 7A and 7B schematically illustrate a schematic side view and a top view of forming an adhesive layer on a reinforcement structure on another carrier.

[0066] 6A and 6B , another carrier 70 is provided, and reinforcement structures 200 are placed on the carrier 70. Each reinforcement structure 200 shown in this step can be a sidewall reinforcement (e.g., a metal block) in the first reinforcement portion 200a, and the dimensions of the sidewall reinforcement correspond to the dimensions of the sidewall of the corresponding package body away from the pickup head in FIG5 . The number of reinforcement structures 200 placed on the carrier 70 can be the same as the number of package bodies 50a to be picked up by the pickup head.

[0067] 7A and 7B , an adhesive layer 210 is formed on the reinforcing structure 200. For example, the adhesive layer 210 can be applied to the reinforcing structure 200 using a dispensing process. In this step, the dimensions of the adhesive layer 210 (e.g., the width or area in a direction parallel to the main surface of the carrier) can be smaller than the dimensions of the corresponding reinforcing structure 200.

[0068] In some embodiments, the step of picking up the package body shown in FIG5 can be performed simultaneously with the steps shown in FIG6A to FIG7B . Alternatively, the steps shown in FIG6A to FIG7B can be performed simultaneously before picking up the package body, for example, while performing any one or more of the steps in FIG3 to FIG5 , to improve production efficiency.

[0069] 8 , the package body 50a sucked by the pickup head 61 is bonded to the reinforcement structure 200. For example, the pickup head 61 can be controlled to move above the reinforcement structure 200 on the carrier 70, and then the package body 50a is placed above the corresponding reinforcement structure 200, so that the package body 50a is aligned with the reinforcement structure 200. The pickup head 61 can apply a downward mechanical force (i.e., toward the reinforcement structure) to the package body 50a so that the package body 50a is attached to the reinforcement structure 200 through the adhesive layer 210. During the bonding process, the adhesive layer 210 is subjected to a compressive force from the package body 50a and / or the reinforcement structure, thereby extending between the package body and the reinforcement structure. In some embodiments, after the bonding is completed, the area of ​​the adhesive layer 210 in a direction parallel to the main surface of the carrier can be approximately the same as the area of ​​the reinforcement structure 200.

[0070] Referring to FIG9 , the pickup head 61 is removed, thereby completing the attachment of one sidewall of the package body 50a to the corresponding sidewall reinforcement, and forming the intermediate package structure. In some embodiments, the steps of FIG3 to FIG9 may be repeated to ensure that each side of the package body 50a to be attached to the reinforcement structure is attached to the corresponding reinforcement. In some embodiments, after the package body 50a and the multiple reinforcements of the reinforcement structure are attached, a curing process may be further performed to cure the adhesive layer and form the package structure 500a.

[0071] Figure 10 shows a schematic cross-sectional view of a package structure 500b according to other embodiments of the present disclosure; Figure 11 shows a schematic bottom view of a package structure 500b according to other embodiments of the present disclosure. Package structure 500b is similar to package structure 500a, except that the reinforcement structure of package structure 500b also includes a second reinforcement portion. The differences between package structure 500b are described in detail below, and other features of package structure 500b can be found in the description of package structure 500a.

[0072] 10 and 11 , in some embodiments, in the package structure 500b, the reinforcement structure 200 includes a first reinforcement portion 200a and a second reinforcement portion 200b. The first reinforcement portion 200a is attached to the plurality of sidewalls of the package body 50a by an adhesive layer 210. The second reinforcement portion 200b may be disposed on the back side BS of the package body 50a and bonded to an edge portion of the package body. For example, the second reinforcement portion 200b is disposed on the second side a2 of the package substrate 100 and bonded to an edge portion of the package substrate 100. For example, the second reinforcement portion 200b may be attached to the edge portion of the package substrate 100 by an adhesive layer (or referred to as a second adhesive layer) 220. In some embodiments, the first reinforcement portion 200a and the second reinforcement portion 200b may be bonded to each other. The thickness and width of the second reinforcing portion 200b and the thickness and width of the adhesive layer 220 can be selected according to product design and requirements, and the thickness of the second reinforcing portion 200b can be the same as or different from the thickness of the first reinforcing portion 200a, and the thickness of the adhesive layer 220 can be the same as or different from the thickness of the adhesive layer 210.

[0073] The material of the second reinforcing portion 200b may be the same as or different from the material of the first reinforcing portion 200a. The material of the bonding layer 220 may be the same as or different from the material of the bonding layer 210. For example, the second reinforcing portion 200b includes a metal material, such as at least one selected from pure metals such as gold, silver, copper, iron, aluminum, zinc, tin, lead, cobalt, nickel, tungsten, chromium, molybdenum, titanium, manganese, zirconium, and their alloys. For example, the bonding layer 220 may be selected from at least one of an organic material adhesive (such as epoxy resin, phenolic resin, polyacrylate, polyvinyl acetate, etc.) and an inorganic compound adhesive (such as silicate, phosphate, oxide, nitride, etc.).

[0074] In some embodiments, the height H2 of the first reinforcing portion 200a in a first direction D1 perpendicular to the main surface of the package substrate can be greater than the height of the sidewall 50s of the package body, that is, greater than the distance L1 in the first direction D1 between the surface of the reinforcing joint portion 130a on the side away from the package substrate and the surface of the second side of the package substrate 100. For example, the first surface 201 of the first reinforcing portion 200a is substantially flush with the surface of the reinforcing joint portion 130a on the side away from the package substrate in a direction parallel to the main surface of the package substrate, while the second surface 202 of the first reinforcing portion 200a is at a different level than the surface of the second side a2 of the package substrate 100. For example, the first reinforcing portion 200a protrudes (i.e., extends beyond) the surface of the second side a1 of the package substrate in the first direction D1 (e.g., the direction away from the reinforcing joint). That is, the second surface 202 of the first reinforcing portion 200a is farther away from the surface of the first side a1 of the package substrate in the first direction D1 than the surface of the second side a2 of the package substrate in the first direction D1.

[0075] The first reinforcing portion 200a and the second reinforcing portion 200b may be bonded to each other via at least one of the first adhesive layer and the second adhesive layer. For example, the portion of the first reinforcing portion 200a extending beyond the second side surface of the package substrate may be attached to the second reinforcing portion 200b via at least one of the adhesive layer 210 and the adhesive layer 220.

[0076] With reference to Figures 10 and 11 , in some embodiments, the second reinforcing portion 200b may be annular, and the annular shape may correspond to the planar shape of the package body (e.g., its package substrate). That is, the planar profile of the second reinforcing portion 200b is consistent with, for example, substantially identical to, the planar profile of the package body (e.g., the package substrate). For example, when the planar shape of the package body is square, the second reinforcing portion 200b may be in the shape of a square ring. When the planar shape of the package body is circular or another shape, the planar shape of the second reinforcing portion 200b may be in the shape of a corresponding ring, such as a circular ring.

[0077] For example, the second reinforcing portion 200b may have an inner sidewall IS and an outer sidewall OS that oppose each other in a direction parallel to the main surface of the package substrate. A plurality of conductive connectors 150 may be located in the area surrounded by the inner sidewall IS of the second reinforcing portion 200b. The outer sidewall OS of the second reinforcing portion 200b may be substantially aligned with the sidewalls of the package body 50a (e.g., the sidewalls of the package substrate 100 or the sidewalls of both the package substrate 100 and the reinforcing joint 130a) in the first direction D1. The first reinforcing portion 200a may be bonded to the outer sidewall OS of the second reinforcing portion 200b.

[0078] In some embodiments, the first reinforcing portion 200a and the second reinforcing portion 200b are separated from each other and joined together by an adhesive layer. That is, a portion of the adhesive layer may be located between the first reinforcing portion 200a and the second reinforcing portion 200b. In some embodiments, the multiple sidewall reinforcing portions of the first reinforcing portion 200a are each joined to a corresponding portion of the second reinforcing portion 200b. For example, the multiple sidewall reinforcing portions are each attached to a corresponding portion of the second reinforcing portion 200b by a corresponding adhesive layer.

[0079] For example, the second reinforcing portion 200b includes multiple portions extending along the second direction D2 and the third direction D3. These portions respectively engage with the edge portions of the package substrate extending along the second direction D2 and the direction D3, and engage with corresponding sidewall reinforcing portions. The multiple portions of the second reinforcing portion 200b are interconnected and may be integrally formed. That is, there are no interfaces between the multiple portions of the second reinforcing portion 200b. This improves the structural stability of the second reinforcing portion 200b.

[0080] In some embodiments, the surface of the second reinforcing portion 200b away from the packaging substrate and the second surface 202 of the first reinforcing portion 200a may be substantially flush in a direction parallel to the main surface of the packaging substrate (eg, a horizontal direction including the second direction D2 and the third direction D3).

[0081] In the plan view of the package structure 500b shown in FIG11 , the configuration of the first reinforcement portion 200a is the same as that shown in FIG2A , but it should be understood that the configuration of the first reinforcement portion 200a in the package structure 500b may also adopt FIG2B to FIG2D or other suitable configurations.

[0082] In some embodiments, the manufacturing method of the package structure 500b is similar to the manufacturing method of the package structure 500a, with the only difference being that the manufacturing method of the package structure 500b also includes joining the second reinforcement portion to the back side of the package body, and in some embodiments also includes joining the second reinforcement portion and the first reinforcement portion to each other.

[0083] For example, in a method for manufacturing a package structure, picking up a package body and bonding the package body to a reinforcement structure may include: picking up the package body so that the back side of the package body faces the second reinforcement, bonding the back side of the package body to the second reinforcement to form an intermediate package structure; and picking up the intermediate package structure so that the sidewalls of the package body face the first reinforcement, bonding the first reinforcement to the sidewalls of the package body, or bonding the first reinforcement to the sidewalls of both the package body and the second reinforcement. In this embodiment, the package body may be bonded to the second reinforcement first, and then to the first reinforcement, but the present disclosure is not limited thereto.

[0084] In package structure 500b, the outer sidewall OS of the second reinforcing portion is aligned with the corresponding sidewall of the package body, and the first reinforcing portion protrudes from the surface of the second side of the package substrate to engage with the second reinforcing portion, but the present disclosure is not limited to this. In alternative embodiments, the second surface 202 of the first reinforcing portion 200a is substantially flush with the surface of the second side of the package substrate in a direction parallel to the main surface of the package substrate, and the second reinforcing portion 200b may further extend beyond the sidewall of the package body in a direction parallel to the main surface of the package substrate to engage with the second surface 202 of the first reinforcing portion 200a. For example, the portion of the second reinforcing portion 200a that protrudes from the sidewall of the package body in a direction parallel to the main surface of the package substrate may be attached to the second surface 202 of the first reinforcing portion 200a via at least one of a first adhesive layer and a second adhesive layer (e.g., the second adhesive layer). In this example, the outer sidewall OS of the second reinforcing portion 200b may be substantially aligned in the first direction D1 with the sidewall of the first reinforcing portion 200a that extends away from the package body and along the first direction D1. In some embodiments, the package body may be first joined to the first reinforcing portion and then joined to the second reinforcing portion.

[0085] 12 shows a schematic cross-sectional view of a package structure 500c according to yet other embodiments of the present disclosure. Package structure 500c is similar to package structure 500a, except that in the reinforcement structure of package structure 500c, the first reinforcement sub-portion and the second reinforcement sub-portion of the first reinforcement portion have different widths.

[0086] 12 , in some embodiments, the sidewalls 130s of the reinforcing joint 130a of the reinforcing member 130 and the sidewalls 100s of the package substrate 100 may not be aligned in a first direction D1 perpendicular to the main surface of the package substrate. For example, the sidewalls 130s of the reinforcing member 130 may be offset relative to the sidewalls 100s of the package substrate 100 in a direction parallel to the main surface of the package substrate (e.g., the second direction D2 or the third direction D3) toward the chip 110. That is, in a direction parallel to the main surface of the package substrate, the distance between the sidewalls 130s of the reinforcing member 130s and the chip 110 is smaller than the distance between the corresponding sidewalls 100s of the package substrate 100 and the chip 110. In some embodiments, the reinforcement structure 200 may further extend to cover a portion of the surface of the first side a1 of the package substrate 100.

[0087] For example, the reinforcing joint 130a is joined to an edge portion of the packaging substrate 100, and an end portion of the packaging substrate 100 located between the edge portion and the sidewall 100s is not covered by the reinforcing joint 130a. For example, the first reinforcing portion 200a of the reinforcing structure 200 may also be joined to the surface of the end portion of the packaging substrate 100 located on the first side a1. The first reinforcing portion 200a may be attached to the sidewall 100s of the packaging substrate 100 and a portion of the surface of the first side a1 thereof (i.e., the surface of the end portion) and the sidewall 130s of the reinforcing member 130 via an adhesive layer 210. In some embodiments, one or more of the multiple sidewalls of the reinforcing member 130 (e.g., all the sidewalls) are offset relative to the corresponding sidewalls of the packaging substrate, and accordingly, one or more sidewall reinforcement portions of the first reinforcing portion 200a further extend to join with the end portion of the packaging substrate not covered by the reinforcing member.

[0088] For example, the portions of the adhesive layer 210 corresponding to the one or more sidewall reinforcement portions (i.e., one or more of the adhesive layers 1a, 1b, 2a, 2b shown in Figures 2A-2D) may each extend continuously along the corresponding side walls of the packaging substrate 100 and the surface of the first side of the end portion thereof, as well as the adhesive layer 128 and the side wall 130s of the reinforcement joint 130a; one or more sidewall reinforcement portions of the first reinforcement portion 200a are attached to the side walls of the packaging substrate and part of the surface of the first side thereof and the side walls of the reinforcement joint through the corresponding adhesive layers.

[0089] In some embodiments, the first reinforcing portion 200a includes a first reinforcing sub-portion 21 and a second reinforcing sub-portion 22. The first reinforcing sub-portion 21 overlaps at least the package substrate 100 in a direction parallel to the main surface of the package substrate and is bonded to the sidewall of the package substrate. The second reinforcing sub-portion 22 overlaps at least the reinforcing joint portion 130a in a direction parallel to the main surface of the package substrate and is bonded to the sidewall of the reinforcing joint portion 130a and a portion of the surface of the first side a1 of the package substrate. In some embodiments, the width W2 of the second reinforcing sub-portion 22 in a direction parallel to the main surface of the package substrate (e.g., the second direction D2 or the third direction D3) is greater than the width W1 of the first reinforcing sub-portion 21 in the direction parallel to the main surface of the package substrate (e.g., the second direction D2 or the third direction D3).

[0090] In some embodiments, the sidewalls of the first and second reinforcing subsections 21 and 22 that are distal to the package substrate and the reinforcement member may be substantially aligned with each other in a first direction D1 perpendicular to the main surface of the package substrate, and the second reinforcing subsection 22 may protrude from the sidewall of the first reinforcing subsection 21 that is proximal to the package substrate in a direction parallel to the main surface of the package substrate toward the reinforcement joint. In some embodiments, the second reinforcing subsection 22 may overlap an end portion of the package substrate 100 in the first direction D1 perpendicular to the main surface of the package substrate.

[0091] In this embodiment, similar to the package structure 500a, the height H1 of the first reinforcing portion 200a may be substantially equal to the distance L1 in the first direction D1 between the surface of the reinforcing joint portion 130a on the side away from the package substrate and the surface of the second side of the package substrate 100. The first surface 201 of the first reinforcing portion 200a may be substantially flush with the surface of the reinforcing joint portion 130a on the side away from the package substrate in a direction parallel to the main surface of the package substrate, and the second surface 202 of the first reinforcing portion 200a may be substantially flush with the surface of the second side a2 of the package substrate 100 in a direction parallel to the main surface of the package substrate.

[0092] In this embodiment, the first reinforcing sub-portion and the second reinforcing sub-portion of each sidewall reinforcing portion may also be integrally formed, and the method of forming the first reinforcing portion on the package body is the same as that of the aforementioned embodiment and will not be repeated here.

[0093] 13 shows a schematic cross-sectional view of a package structure 500d according to further embodiments of the present disclosure. Package structure 500d is similar to package structure 500c, except that the first and second reinforcing sub-portions of the first reinforcing portion in the reinforcing structure of package structure 500d have different widths.

[0094] 13 , in some embodiments, in package structure 500d , reinforcement structure 200 includes a first reinforcement portion 200a and a second reinforcement portion 200b . The structure of second reinforcement portion 200b and its positional relationship with first reinforcement portion 200a are similar to those of the previous embodiment and are not further described here.

[0095] In some embodiments, the first reinforcement portion 200 a of the package structure 500 d is similar in structure to the first reinforcement portion of the package structure 500 c , except that in the package structure 500 d , the first reinforcement portion 200 a is further bonded to the second reinforcement portion 200 b .

[0096] For example, in this embodiment, the sidewall 130s of the reinforcing joint portion 130a of the reinforcing member 130 is offset relative to the sidewall 100s of the package substrate 100 in a direction parallel to the main surface of the package substrate, toward the chip 110, so that the end of the package substrate is not covered by the reinforcing member 130. The second reinforcing sub-portion 22 of the first reinforcing portion 200a further extends to engage with the surface of the end of the package substrate located on the first side a1, and the width W2 of the second reinforcing sub-portion 22 can be greater than the width W1 of the first reinforcing sub-portion 21. Other relevant features of the first reinforcing portion 200a can be found in the description of the package structures 500b and 500c in the previous embodiments and are not repeated here.

[0097] In the package structures 500a to 500d, the reinforcing member 130 is a reinforcing cap, but the present disclosure is not limited thereto. The reinforcing member 130 may also be other types of reinforcing members, such as a top hat, a stiffener, or any other suitable type of reinforcing member, as long as the reinforcing member covers the edge portion of the package substrate to prevent warping.

[0098] Figures 14, 15, 16 and 17 respectively show schematic cross-sectional views of packaging structures 600a, 600b, 600c and 600d according to other embodiments of the present disclosure. The packaging structures 600a to 600d are similar to the aforementioned packaging structures 500a to 500d, except that the reinforcement members 130 in the packaging structures 600a to 600d use reinforcement top caps.

[0099] Referring to Figures 14 to 17, in some embodiments, the reinforcement member 130 adopts a reinforcement top cap SH and may include a reinforcement joint portion 130a and a hat part 130b2. The hat part 130b2 may also be referred to as a top cover portion. The reinforcement joint portion 130a is annular and may extend to the same height as the hat part 130b2 in a first direction D1 perpendicular to the main surface of the packaging substrate and be connected to the hat part 130b2. The hat part 130b2 may extend in a direction parallel to the main surface of the packaging substrate to be directly connected to the reinforcement joint portion 130a. The hat part 130b2 is attached to the surface of the chip 110 away from the packaging substrate 100 through the thermal interface material layer 131.

[0100] In some embodiments, the surfaces of the reinforcing joint portion 130a and the cap portion 130b2 facing away from the package substrate may be substantially flush with respect to the main surface of the package substrate. The reinforcement structure 200 is bonded to the sidewall 100s of the package substrate 100 and the sidewall 130s of the reinforcing joint portion 130a. In some embodiments, the first surface 201 of the first reinforcing portion 200a of the reinforcement structure 200 may be substantially flush with the surfaces of both the reinforcing joint portion 130a and the cap portion 130b2 of the reinforcement member 130 facing away from the package substrate, parallel to the main surface of the package substrate.

[0101] In some embodiments, relative to the surface of the first side a1 of the package substrate 100, the surface of the reinforcing joint portion 130a away from the package substrate and the first surface 201 of the first reinforcing portion are located at a higher level than the surface of the chip 110 away from the package substrate. That is, in a first direction D1 perpendicular to the main surface of the package substrate, the distance between the surface of the reinforcing joint portion 130a away from the package substrate and the surface of the first side a1 of the package substrate 100 and the distance between the first surface 201 of the first reinforcing portion and the surface of the first side a1 of the package substrate 100 is greater than the distance between the surface of the chip 110 away from the package substrate and the surface of the first side a1 of the package substrate.

[0102] Other features of the package structures 600a to 600d are substantially the same as the related features of the aforementioned package structures 500a to 500d, and reference may be made to the above description of the package structures 500a to 500d, which will not be repeated here.

[0103] Figures 18, 19, 20, and 21 illustrate schematic cross-sectional views of package structures 700a, 700b, 700c, and 700d, respectively, according to other embodiments of the present disclosure. Package structures 700a through 700d are similar to the aforementioned package structures 500a through 500d, except that the reinforcement member 130 in package structures 700a through 700d is a stiffener.

[0104] Referring to Figures 18 to 21, in some embodiments, the reinforcement member 130 employs a stiffener SF and may include only a reinforcement joint 130a without a top cover. The reinforcement joint 130a is bonded to the edge of the package substrate and has a ring shape. The chip 110 may be located in an area surrounded by the reinforcement joint 130a in a direction parallel to the main surface of the package substrate. In this embodiment, the surface of the chip 110 away from the package substrate 100 may be exposed.

[0105] The surface of the reinforcing joint 130a facing away from the package substrate and the surface of the chip 110 facing away from the package substrate may be at the same or different levels relative to the surface of the first side a1 of the package substrate 100. For example, in a first direction D1 perpendicular to the main surface of the package substrate, the distance between the surface of the reinforcing joint 130a facing away from the package substrate and the surface of the first side a1 of the package substrate 100 may be greater than, less than, or approximately equal to the distance between the surface of the chip 110 facing away from the package substrate and the surface of the first side a1 of the package substrate 100. The first surface 201 of the first reinforcing portion 200a of the reinforcing structure 200 may be approximately flush with the surface of the reinforcing joint 130a facing away from the package substrate in a direction parallel to the main surface of the package substrate.

[0106] Other features of the package structures 700a to 700d are substantially the same as the relevant features of the package structures 500a to 500d, and reference may be made to the above description of the package structures 500a to 500d, which will not be repeated here.

[0107] In the package structure of the disclosed embodiments, by providing a reinforcement structure at least on the sidewalls of the package body, warping of the package structure can be avoided or significantly reduced, thereby improving the device performance and reliability of the package structure. For example, after the package structure is mounted on a PCB, defects such as bridging short circuits, solder non-wetting open circuits, and pillow effects caused by warping of the package structure can be avoided, thereby ensuring an effective connection between the package structure and the PCB, and improving device performance and reliability.

[0108] In the packaging structure, the reinforcement member provided on the front side of the packaging structure may also be helpful in reducing the warping of the packaging structure; in theory, the warping of the packaging structure may also be optimized by increasing the thickness, width and other dimensions of the reinforcement member (for example, its reinforcement joint) and / or replacing the material of the reinforcement member. However, when the space on the front side of the packaging structure is limited, the thickness that can be increased by the reinforcement member is limited; moreover, since space needs to be reserved on the surface of the packaging substrate to set up additional devices such as capacitors, the width that can be increased by the reinforcement joint is also limited; and replacing the material of the reinforcement member may increase the cost. In other words, the effect of reducing warping by improving the reinforcement member is limited. In the packaging structure of the embodiment of the present disclosure, the package warping is avoided or reduced by providing a reinforcement structure, which does not need to be subject to the above-mentioned space limitations, and common metal materials can be used to form the reinforcement structure, thereby achieving a significant reduction in package warping at a relatively low cost.

[0109] In order to more intuitively characterize the optimization of the packaging structure of the present application for device warpage, the packaging structures of various embodiments are modeled and simulated using FCBGA packaging as an example to compare and test the warpage of these packaging structures before and after adding the reinforcement structure.

[0110] For example, a first set of simulation tests is used to compare the warping conditions of the packaging structure of the first comparative example and the packaging structures 500a and 500b of the embodiment of the present disclosure; a second set of simulation tests is used to compare the warping conditions of the packaging structure of the second comparative example and the packaging structures 600a and 600b of the embodiment of the present disclosure; and a third set of simulation tests is used to compare the warping conditions of the packaging structure of the third comparative example and the packaging structures 700a and 700b of the embodiment of the present disclosure. In each set of simulation tests, the packaging structure of the comparative example has the reinforcement structure removed compared to the packaging structure of the embodiment of the present disclosure, that is, the packaging structure of the comparative example is consistent with the structure of the packaging body in the packaging structure of the embodiment of the present disclosure. The dimensions of the relevant components of each packaging structure in the simulation tests are shown in Table 1 below. It should be understood that the same dimensions are used for the same components in each packaging structure in the same set of simulation tests.

[0111] Table 1:

[0112] In Table 1, the length and width of each component refer to the corresponding dimensions in a direction parallel to the main surface of the packaging substrate, that is, the dimensions in a plan view; the thickness of each component refers to the thickness (or height) of the component material in the direction perpendicular to its extension. For example, the thickness of the first reinforcement part 220a and the adhesive layer 210 refers to their thickness in a direction parallel to the main surface of the packaging substrate. The thickness of the second reinforcement part 200b and the adhesive layer 220 refers to their thickness in a direction perpendicular to the main surface of the packaging substrate. The width of the second reinforcement part 200b refers to its width in a direction parallel to the main surface of the packaging substrate.

[0113] Considering that the absolute value of the warping of the packaging structure is the largest at room temperature and high temperature, simulation tests are carried out at room temperature (25°C) and high temperature (260°C) to test the warping values ​​of the packaging structures of various embodiments of the present disclosure and the corresponding comparative examples at the above temperatures.

[0114] Figures 22A, 22B, and 22C respectively show the simulation cloud graphs of the package structure, package structure 500a, and package structure 500b of the first comparative example of the first set of simulation tests performed at a temperature of 25°C. Figures 23A, 23B, and 23C respectively show the simulation cloud graphs of the package structure, package structure 500a, and package structure 500b of the first comparative example of the first set of simulation tests performed at a temperature of 260°C. It should be noted that the simulation cloud graphs of each package structure shown in the present disclosure only show the simulation cloud graphs from the central area (for example, the left area in the figure) to an edge area (the right area in the figure) of the package structure, and do not show the entire area of ​​the package structure. Table 2 shows the results of the first set of simulation tests, which specifically shows the warpage values ​​of the package structure, package structure 500a, and package structure 500b of the first comparative example at temperatures of 25°C and 260°C.

[0115] Table 2:

[0116] It should be understood that when the warpage value of the package structure is 0, it indicates that the package structure has no warpage. When the warpage value of the package structure is non-zero, the closer the warpage value is to 0, that is, the smaller the absolute value of the warpage value is, the lower the degree of warpage of the structure. When the warpage value of the package structure is positive, the package structure exhibits a crying face (i.e., convex deformation) warpage, and the smaller the warpage value is, the lower the degree of warpage is. When the warpage value of the package structure is negative, the package structure exhibits a smiling face (i.e., concave deformation) warpage, and the larger the warpage value is (i.e., the smaller the absolute value is), the lower the degree of warpage is.

[0117] As shown in Figures 22A to 22C and Table 2, at low temperatures (e.g., 25°C) such as room temperature, the package structure of the first comparative example exhibits weeping-face warpage. While package structures 500a and 500b of the disclosed embodiments also exhibit weeping-face warpage, the degree of warpage of package structures 500a and 500b is significantly reduced. Specifically, as shown in Table 2, at low temperatures, compared to the package structure of the first comparative example, the warpage of package structure 500a is optimized (i.e., reduced) by approximately 25%, while the warpage of package structure 500b is optimized (i.e., reduced) by approximately 25.4%.

[0118] As shown in Figures 23A to 23C and Table 2, under high temperature conditions (e.g., 260°C), the package structure of the first comparative example exhibits a smiley face (i.e., concave) warpage. While package structures 500a and 500b of the disclosed embodiments also exhibit smiley face warpage, the degree of warpage of package structures 500a and 500b is significantly reduced. Specifically, as shown in Table 2, under high temperature conditions, compared to the package structure of the first comparative example, the warpage of package structure 500a is optimized (i.e., reduced) by approximately 12.4%, and the warpage of package structure 500b is optimized (i.e., reduced) by approximately 13.6%.

[0119] As can be seen from Figures 22A to 23C and Table 2, under the same temperature conditions, the warpage of package structures 500a and 500b in the embodiments of the present disclosure is lower than that of the package structure of the first comparative example. Therefore, the provision of a reinforcement structure can significantly reduce package warpage. On the other hand, under the same temperature conditions, the absolute value of the warpage of package structure 500b is lower than that of package structure 500a; that is, the warpage of package structure 500b is lower than that of package structure 500a. This is because in package structure 500a, the reinforcement structure only includes a first reinforcement portion bonded to the package body, while in package structure 500b, the reinforcement structure includes the first reinforcement portion and also includes a second reinforcement portion disposed on the back side of the package body. In package structure 500b, the provision of the second reinforcement portion further reduces the warpage of the package structure.

[0120] Figures 24A, 24B, and 24C respectively show simulation cloud plots of the package structure of the second comparative example, package structure 600a, and package structure 600b, for the second set of simulation tests conducted at 25°C. Figures 25A, 25B, and 25C respectively show simulation cloud plots of the package structure of the second comparative example, package structure 600a, and package structure 600b, for the second set of simulation tests conducted at 260°C. Table 3 shows the results of the second set of simulation tests, specifically showing the warpage values ​​of the package structure of the second comparative example, package structure 600a, and package structure 600b at 25°C and 260°C.

[0121] Table 3:

[0122] As shown in Figures 24A to 24C and Table 3, at low temperatures (e.g., 25°C) such as room temperature, the package structure of the second comparative example exhibits weeping-face warpage. While package structures 600a and 600b of the disclosed embodiments also exhibit weeping-face warpage, the degree of warpage of package structures 600a and 600b is significantly reduced. Specifically, as shown in Table 3, at low temperatures, compared to the package structure of the second comparative example, the warpage of package structure 600a is optimized (i.e., reduced) by approximately 26.1%, while the warpage of package structure 600b is optimized (i.e., reduced) by approximately 26.7%.

[0123] As shown in Figures 25A to 25C and Table 3, under high temperature conditions (e.g., 260°C), the package structure of the second comparative example exhibits a smiley face (i.e., concave) warpage. While the package structures 600a and 600b of the disclosed embodiments also exhibit smiley face warpage, the degree of warpage of package structures 600a and 600b is significantly reduced. Specifically, as shown in Table 3, under high temperature conditions, compared to the package structure of the second comparative example, the warpage of package structure 600a is optimized (i.e., reduced) by approximately 15.8%, while the warpage of package structure 600b is optimized (i.e., reduced) by approximately 17%.

[0124] As can be seen from Figures 24A to 25C and Table 3, under the same temperature conditions, the warpage of package structures 600a and 600b in the embodiments of the present disclosure is lower than that of the package structure of the second comparative example. Therefore, the provision of a reinforcement structure can significantly reduce package warpage. On the other hand, under the same temperature conditions, the absolute value of the warpage of package structure 600b is lower than that of package structure 600a; that is, the warpage of package structure 600b is lower than that of package structure 600a. This is because in package structure 600a, the reinforcement structure only includes a first reinforcement portion bonded to the package body, while in package structure 600b, the reinforcement structure includes the first reinforcement portion and also includes a second reinforcement portion disposed on the back side of the package body. In package structure 600b, the provision of the second reinforcement portion further reduces the warpage of the package structure.

[0125] Figures 26A, 26B, and 26C respectively show simulation cloud plots of the package structure of the third comparative example, package structure 700a, and package structure 700b, for the third set of simulation tests conducted at 25°C. Figures 27A, 27B, and 27C respectively show simulation cloud plots of the package structure of the third comparative example, package structure 700a, and package structure 700b, for the third set of simulation tests conducted at 260°C. Table 4 shows the results of the third set of simulation tests, specifically showing the warpage values ​​of the package structure of the third comparative example, package structure 700a, and package structure 700b at 25°C and 260°C.

[0126] Table 4:

[0127] As shown in Figures 26A to 26C and Table 4, at low temperatures (e.g., 25°C) such as room temperature, the package structure of the third comparative example exhibits weeping-face warpage. While package structures 700a and 700b of the disclosed embodiments also exhibit weeping-face warpage, the degree of warpage of package structures 700a and 700b is significantly reduced. Specifically, as shown in Table 4, at low temperatures, compared to the package structure of the third comparative example, the warpage of package structure 700a is optimized (i.e., reduced) by approximately 10.3%, while the warpage of package structure 700b is optimized (i.e., reduced) by approximately 11%.

[0128] As shown in Figures 27A to 27C and Table 4, under high temperature conditions (e.g., 260°C), the package structure of the third comparative example exhibits a smiley face (i.e., concave) warpage. While the package structures 700a and 700b of the present embodiment also exhibit smiley face warpage, the degree of warpage of package structures 700a and 700b is significantly reduced. Specifically, as shown in Table 4, under high temperature conditions, compared to the package structure of the third comparative example, the warpage of package structure 700a is optimized (i.e., reduced) by approximately 9.1%, and the warpage of package structure 700b is optimized (i.e., reduced) by approximately 10.8%.

[0129] As can be seen from Figures 26A to 27C and Table 4, under the same temperature conditions, the warpage of package structures 700a and 700b in the embodiments of the present disclosure is lower than that of the package structure of the third comparative example. Therefore, the provision of a reinforcement structure can significantly reduce package warpage. On the other hand, under the same temperature conditions, the absolute value of the warpage of package structure 700b is lower than that of package structure 700a; that is, the warpage of package structure 700b is lower than that of package structure 700a. This is because in package structure 700a, the reinforcement structure only includes a first reinforcement portion bonded to the package body, while in package structure 700b, the reinforcement structure includes the first reinforcement portion and also includes a second reinforcement portion disposed on the back side of the package body. In package structure 700b, the provision of the second reinforcement portion further reduces the warpage of the package structure.

[0130] Combined with the above simulation test results, it can be seen that compared with the packaging structure without a reinforcement structure in the comparative example, the packaging structure of various embodiments of the present disclosure can significantly reduce the package warping by providing a reinforcement structure, thereby improving the performance and reliability of the device.

[0131] In the above embodiments, the concepts of the present application are described using a flip-chip package as an example. It should be understood that the concept of reducing or preventing package warpage by providing a reinforcement structure on the package body can be applied to any type of package structure, for example, fan-out packages and other types of package structures, and the present disclosure is not limited to the type of package structure.

[0132] There are a few points to note:

[0133] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to conventional designs.

[0134] (2) Unless there is any conflict, the features of the same embodiment and different embodiments of the present disclosure may be combined with each other.

[0135] The above are only specific embodiments of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. An encapsulation structure, comprising: An encapsulation body, including a chip, and having a front side and a back side that are opposite to each other in a first direction and side walls connecting the front side and the back side, wherein the side of the encapsulation body where the chip is disposed is the front side of the encapsulation body; And A reinforcing structure, at least including a first reinforcing portion, the first reinforcing portion being joined to the side wall of the encapsulation body and surrounding the encapsulation body in a direction parallel to the main surface of the encapsulation body.

2. The encapsulation structure according to claim 1, wherein the encapsulation body further includes: An encapsulation substrate, having a first side and a second side that are opposite to each other in the first direction, wherein the chip is disposed on the first side of the encapsulation substrate and is electrically connected to the encapsulation substrate, and the second side of the encapsulation substrate is located on the back side of the encapsulation body; And A reinforcing member, located on the first side of the encapsulation substrate, and including a reinforcing joint portion, the reinforcing joint portion being joined to the edge portion of the encapsulation substrate, and the chip being located in an area surrounded by the reinforcing member in a direction parallel to the main surface of the encapsulation substrate, Wherein the side wall of the encapsulation body includes the side wall of the encapsulation substrate and the side wall of the reinforcing joint portion.

3. The encapsulation structure according to claim 1 or 2, wherein the first reinforcing portion is attached to the side wall of the encapsulation body through a first adhesive layer.

4. The encapsulation structure according to claim 2, wherein the orthographic projections of the encapsulation substrate and the reinforcing joint portion on a reference plane parallel to the side wall of the encapsulation substrate are located within the orthographic projection of the reinforcing structure on the reference plane.

5. The encapsulation structure according to claim 4, wherein the height of the reinforcing structure in the first direction is greater than or equal to the distance in the first direction between the surface of the side of the reinforcing joint portion away from the encapsulation substrate and the surface of the second side of the encapsulation substrate.

6. The encapsulation structure according to claim 2, wherein the reinforcing structure has a first surface and a second surface that are opposite to each other in the first direction, and the first surface of the reinforcing structure is flush with the surface of the side of the reinforcing joint portion away from the encapsulation substrate in a direction parallel to the main surface of the encapsulation substrate.

7. The encapsulation structure according to claim 6, wherein The second surface of the reinforcing structure is flush with the surface of the second side of the encapsulation substrate in a direction parallel to the main surface of the encapsulation substrate; or In the first direction, the distance between the second surface of the reinforcing structure and the surface of the first side of the encapsulation substrate is greater than the distance between the surface of the second side and the surface of the first side of the encapsulation substrate.

8. The encapsulation structure according to claim 2, wherein the side wall of the reinforcing joint portion is flush with the side wall of the encapsulation substrate in the first direction perpendicular to the main surface of the encapsulation substrate; or The side wall of the reinforced joint portion is offset toward the chip relative to the side wall of the package substrate in a direction parallel to the main surface of the package substrate, and the reinforcing structure further extends to cover a partial surface of the first side of the package substrate.

9. The package structure according to any one of claims 2-8, wherein the first reinforcing portion comprises: a first reinforcing sub-portion overlapping with the package substrate in a direction parallel to the main surface of the package substrate; and a second reinforcing sub-portion overlapping with the reinforced joint portion in a direction parallel to the main surface of the package substrate, and the first reinforcing sub-portion and the second reinforcing sub-portion are connected to each other.

10. The package structure according to claim 9, wherein the width of the second reinforcing sub-portion in a direction parallel to the main surface of the package substrate is greater than or equal to the width of the first reinforcing sub-portion in a direction parallel to the main surface of the package substrate.

11. The package structure according to claim 1 or 2, wherein the side wall of the package body comprises a first side wall and a second side wall, the first side wall extends along the first direction and the second direction, the second side wall extends along the first direction and the third direction, the second direction and the third direction are perpendicular to the first direction, parallel to the main surface of the package body, and intersect with each other; the first reinforcing portion comprises a first side wall reinforcing portion and a second side wall reinforcing portion, the first side wall reinforcing portion is joined to the first side wall of the package body through a first side wall adhesive layer, and the second side wall reinforcing portion is joined to the second side wall of the package body through a second side wall adhesive layer.

12. The package structure according to claim 11, wherein the first side wall reinforcing portion and the second side wall reinforcing portion are separated from each other.

13. The package structure according to claim 11, wherein the first side wall reinforcing portion and the second side wall reinforcing portion are joined to each other through at least one of the first side wall adhesive layer and the second side wall adhesive layer.

14. The package structure according to any one of claims 1-8, wherein the reinforcing structure further comprises a second reinforcing portion, the second reinforcing portion is disposed on the back side of the package body and joined to an edge portion of the package body, and the first reinforcing portion and the second reinforcing portion are joined to each other.

15. The package structure according to claim 14, wherein the second reinforcing portion is annular and integrally formed.

16. The package structure according to claim 14, wherein the first reinforcing portion is attached to the side wall of the package body through a first adhesive layer; the second reinforcing portion is attached to the back side of the package body through a second adhesive layer; and the first reinforcing portion and the second reinforcing portion are joined to each other through at least one of the first adhesive layer and the second adhesive layer.

17. The package structure according to any one of claims 1-16, wherein the reinforcing member further comprises a top cover portion, the top cover portion is connected to the reinforced joint portion and attached to the surface of the chip on the side away from the package substrate.

18. A manufacturing method of a packaging structure, comprising: providing a packaging body, the packaging body including a chip and having a front side and a back side that are opposite to each other in a first direction; providing a carrier plate and placing a reinforcing structure on the carrier plate; and picking up the packaging body and bonding the packaging body to the reinforcing structure to form the packaging structure, wherein the reinforcing structure at least includes a first reinforcing portion, and the first reinforcing portion is bonded to the side wall of the packaging body and surrounds the packaging body in a direction parallel to the main surface of the packaging body.

19. The manufacturing method of the packaging structure according to claim 18, wherein the side wall of the packaging body includes a first side wall and a second side wall, the first side wall extends along the first direction and a second direction, the second side wall extends along the first direction and a third direction, the second direction and the third direction are perpendicular to the first direction, parallel to the main surface of the packaging body, and intersect with each other; the first reinforcing portion includes a first side wall reinforcing portion and a second side wall reinforcing portion, and picking up the packaging body and bonding the packaging body to the reinforcing structure includes: picking up the packaging body, making the first side wall of the packaging body face the first side wall reinforcing portion, and bonding the first side wall of the packaging body to the first side wall reinforcing portion, thereby forming an intermediate packaging structure including the packaging body and the first side wall reinforcing portion; and picking up the intermediate packaging structure, making the second side wall of the packaging body face the second side wall reinforcing portion, and bonding the intermediate packaging structure to the second side wall reinforcing portion.

20. The manufacturing method of the packaging structure according to claim 18, wherein the reinforcing structure further includes a second reinforcing portion, and picking up the packaging body and bonding the packaging body to the reinforcing structure includes: picking up the packaging body, making the back side of the packaging body face the second reinforcing portion, and bonding the back side of the packaging body to the second reinforcing portion to form an intermediate packaging structure; and picking up the intermediate packaging structure, making the side wall of the packaging body face the first reinforcing portion, and bonding the first reinforcing portion to the side wall of the packaging body, or bonding the first reinforcing portion to the side walls of both the packaging body and the second reinforcing portion.

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