Pin for electronic components

Abstract

The invention relates to a pin (10) for electronic components, comprising a contact point (12), which can be energy-conductively and / or signal-conductively connected to a press-in hole (14), wherein: the contact point (12) has a surface (16); at least a part (18) of the surface (16), starting from a first end (20) of the contact point (12), has an emission coating (22); and the emission coating (22) is designed to absorb a beam having a wavelength between 100 nm and 400 nm and to emit a light beam having a wavelength between 400 nm and 780 nm depending on the beam.

Description

[0001] Description

[0002] title

[0003] Pin for electronic components

[0004] State of the art

[0005] The present invention relates to a pin for electronic components, a method for producing a pin, a method for detecting the pin position, an electrical unit, a vehicle and the use of a pin.

[0006] Currently, there are a variety of different solutions for contacting pins on press-fit holes. Due to the increasing number of contact points as well as the increased cost efficiency requirements, the need for innovative and robust

[0007] Contact options.

[0008] The constant weight reduction in the vehicle sector to reduce fuel consumption as well as increasing competition are creating cost pressure, so that cheaper and more efficient components for vehicles are in greater demand.

[0009] Disclosure of the invention

[0010] The pin for electronic components according to the invention with the features of claim 1 has the advantage over known pins that, by means of a fluorescent coating, the position of the pin can be clearly and precisely determined, regardless of the geometric shape of the pin tip. This enables, in particular, simple, precise, and cost-effective measurement of the pin in an assembly and / or a connection. In particular, the pin with the fluorescent coating can be designed such that, when the pin is arranged in the press-in hole, the pin tip protruding from the rear of the press-in hole can be very easily checked to determine whether the pin has been successfully pressed into the press-in hole.

[0011] This is achieved according to the invention in that the pin for electronic components has a contact point. The contact point can be connected to a press-in hole in an energy- and / or signal-conducting manner, wherein the contact point has a surface, wherein at least a portion of the surface, starting from a first end of the contact point, has an emission coating. The emission coating is configured to absorb a beam with a wavelength between 100 nm and 400 nm and to emit a light beam with a wavelength between 400 nm and 780 nm depending on the beam.

[0012] In other words, the pin can be designed such that the emission coating or fluorescent coating is arranged at the tip of the pin and can emit visible light when irradiated with UVA radiation, also known as black light, in a dark environment. This allows the detection system to easily and precisely detect the correct position of the pin in a surrounding housing or a press-in hole, regardless of the shape of the pin tip. This can be achieved in particular because detection can take place independently of the emitted visible light, since the exact center of the pin can be determined regardless of the shape of the pin tip. In a further advantageous application, the pin tip can be detected in the same way when the pin has been guided through the press-in hole and protrudes on the back of the press-in hole.The pins can be manufactured using a wheel-to-wheel process or electroplated. The emissive coating can be applied as an additional selective coating to the pin tips using a strip electroplating process. Furthermore, the entire pin can be coated with a fluorescent coating, provided it has sufficient electrical conductivity to provide a power and / or signal-conducting connection to the press-fit hole.

[0013] The subclaims describe preferred developments of the invention. The emission coating preferably has an emission surface, wherein the emission coating is configured to emit the light beam over substantially the entire emission surface if at least a portion of the emission surface absorbs the beam.

[0014] An advantage of this embodiment is that the detection accuracy of an orientation of the pin can be significantly improved, since the contour of the pin can be detected much more easily by emitting light rays over the entire emission surface.

[0015] More preferably, the emission coating extends substantially completely over the pin.

[0016] One advantage of this embodiment is that any manufacturing process for the pin can be simplified, thus allowing for faster cycle times. This particularly includes manufacturing-related tolerances.

[0017] Preferably, the contact point has a first extension direction, wherein the first end is arranged at a tip of the contact point along the first extension direction.

[0018] An advantage of this embodiment is that as soon as the tip protrudes through the press-in hole, the required contact between the pin and the press-in hole can be determined, since when ultraviolet radiation with a wavelength between 100 nm and 400 nm is applied to the back of the press-in hole, the tip of the pin is excited to emit visible light, and the successful contact can be determined via this emitted visible light by means of a detection system.

[0019] Further preferably, the contact point has a predetermined length along the first extension direction, wherein the emission coating extends up to 25% of the first predetermined length along the first extension direction starting from the first end, but at most up to the beginning of the contact point.

[0020] An advantage of this embodiment is that the amount of fluorescent coating can be reduced, which can have a particularly positive impact on the manufacturing costs of the pin. For example, the pin has a length of approximately 5 mm, with the fluorescent coating extending from the first end up to 1 mm along the contact point or the surface of the contact point.

[0021] Further preferably, the contact point has a second extension direction which is arranged substantially orthogonal to the first extension direction, wherein the emission coating substantially encloses the contact point along the second extension direction.

[0022] An advantage of this embodiment is that when the emission coating encloses or covers the contact point along the second extension direction, the emitted visible light of the emission coating is generated from any direction or any position around the contact point, so that the detection of the emitted light can be significantly simplified.

[0023] Preferably, the contact point has a second predetermined length along the second extension direction, wherein a ratio between the first predetermined length and the second predetermined length is substantially between a 1 A and i lies.

[0024] An advantage of this embodiment is that it has been experimentally determined that in this ratio range an optimum can be achieved between the costs of production and the detectability of the fluorescent coating or the successful assembly of the pin.

[0025] Preferably, the emission coating has a layer thickness of less than 10 p.

[0026] An advantage of this embodiment is that the assembly process between the pin and the press-fit hole is not complicated by the additional material thickness due to the emissive coating, since the application can be within the tolerance range of such a connection within a predetermined range of less than 10 μm. Preferably, the emissive coating comprises a temperature-resistant material that can withstand at least one brief thermal load of up to 300°C.

[0027] An advantage of this design is that the emission coating does not dissolve during a subsequent injection molding process, as a temperature-resistant material can form a molding and / or molten bond. For example, the temperature-resistant material could be parylene or a similar material.

[0028] Further preferably, the pin has a contact area, wherein the contact point and the contact area are formed in one piece, wherein the contact area is designed to form a connection with a semi-finished product.

[0029] An advantage of this embodiment is that the contact point does not need to be additionally mounted on the injection-molded part when injecting the pin, thus simplifying and reducing the manufacturing process. In particular, the contact area can be formed with a square surface or similar, and the contact point can be designed in a columnar manner.

[0030] A further aspect of the invention relates to a method for producing a pin, which comprises the following steps:

[0031] - Providing a pin which has a contact point,

[0032] - Immersing the pin in a liquid emissive coating in a basin in a predetermined position,

[0033] - Curing of the emission coating outside the tank,

[0034] - wherein the emission coating is configured to absorb a beam having a wavelength between 100 nm and 400 nm and to emit a light beam having a wavelength between 400 nm and 780 nm depending on the beam, wherein the predetermined position is selected such that a part of the contact point is covered with the emission coating.

[0035] An advantage of this embodiment is that the tip of the pin can be coated using a simple immersion process. Thus, the coating pins can be integrated into the process for pin production. Further preferably, the curing of the emission coating can be carried out, in particular, using an oven and / or a pre-exposure system, depending on the respective substance group. Further preferably, the emission coating can be a fluorescent substance, such as uranine or a water-soluble sodium salt of fluorescein. The pin can also preferably be produced using other manufacturing processes, such as jet processes, microspraying, or the like.

[0036] A further aspect of the invention relates to a method for measuring at least one pin, as described above and below, comprising the steps:

[0037] - Inserting the pin into a press-in hole to form a connection between the pin and the press-in hole,

[0038] - Emitting radiation with a wavelength between 100 nm and 400 nm,

[0039] - detecting a first image element which has an emitted light radiation with a wavelength between 400 nm and 780 nm depending on the radiation and at least one pin,

[0040] - Determining a contour of the pin based on the first image element,

[0041] - Determine the alignment of the pin to the press-in hole based on the determined contour of the pin.

[0042] An advantage of this embodiment is that only one detection unit is sufficient to detect the successful connection between the pin and the press-in hole, since the emissions from the pin using the emission coating can be used to determine whether the connection has been formed as predetermined or not. In the event that the pin has been arranged in the press-in hole as predetermined, the emission coating protrudes on the back of the press-in hole, so that when the back of the press-in hole is illuminated with ultraviolet radiation, the pin emits light depending on the ultraviolet radiation. In the event that the pin has not formed a successful connection with the press-in hole, the emission coating does not protrude on the back of the press-in hole, so that no emitted light can be detected. In the event that the pin has been successfully arranged in the press-in hole, the pin tip protrudes.The emission coating protrudes from the back of the press-in hole, so that a signal can be output, which can be used, for example, to be integrated into a production line or the like. Further preferably, the method for measuring the pin, wherein the pin has an emission coating, comprises the steps:

[0043] - emitting the radiation onto at least part of the emission coating,

[0044] - Determine the contour of the pin based on an outer contour of the emission coating.

[0045] An advantage of this embodiment is that when the radiation hits a part of the emission coating, the emission coating emits or emits rays over its entire surface, so that the pin tip is completely visible in a camera image. This makes it much easier to capture the outer contour of the emission coating, since it is not distorted by reflections or mirroring or the like.

[0046] More preferably, the measurement method comprises the steps:

[0047] - Determining a second contour of a second pin based on the first image element,

[0048] - Determining a second alignment of the second pin to the press-in hole based on the second determined contour of the pin,

[0049] - Determining a relation between the orientation of the pin and the second orientation of the second pin.

[0050] An advantage of this embodiment is that, with a UV light source, a plurality of emission coatings can be illuminated onto a plurality of pins, and all contours or orientations of the pins can be captured using a single image element. Furthermore, the relationships between the individual pins of the plurality of pins can thus be determined. This results in significant cost advantages, as potential pin breakage can be prevented, since both the position of the pin and the relationship between the pins can be determined.

[0051] Further preferably, determining the contour of the pin comprises the step:

[0052] - Identifying the contour based on a comparison between a pixel of the pixel element that contains the light beam and another pixel of the pixel element that is substantially free of the light beam. An advantage of this embodiment is that the outer contour of the pin can be easily identified due to the high contrast between pixels of the first pixel element that represent a light beam emitted by the emission coating and pixels that do not contain any beams. Thus, the contour of the pin, in particular, can be determined.

[0053] More preferably, the method further comprises the steps:

[0054] - Determining a center point of the pin based on the determined contour of the pin,

[0055] - Determine or adjust the determined orientation based on the determined center point of the pin.

[0056] An advantage of this embodiment is that any incorrect assembly of the pin can be detected in a timely manner, allowing appropriate measures to be initiated. Based on the pin's outer contour determined by the emissive coating, a center point of the pin can be determined. Furthermore, the position of the center point can also be adjusted, for example, to better simulate an assembly process.

[0057] Preferably, the measurement method comprises the step:

[0058] - Outputting a signal if the detected image element has at least one pixel with a light beam.

[0059] An advantage of this embodiment is that a self-controlling system can be created which can reduce the number of incorrect assemblies.

[0060] More preferably, the measuring method further comprises the steps:

[0061] - generating a second image element which shows an emitted light radiation with a wavelength between 400 nm and 780 nm depending on the beam and the at least one pin with a second detection unit,

[0062] - generating a third image element showing the press-in hole with a third detection unit,

[0063] - correlating a first position of the pin in the second image element with a second position of the press-in hole in the third image element,

[0064] - Forming the connection based on the correlation of the first position with the second position. An advantage of this embodiment is that, using a detection unit, a position of a relation to the camera can be detected for each pin and for the press-in hole. Further preferably, the position between the detection unit and the third detection unit is known, so that the position of the pin relative to the press-in hole can be determined. Further preferably, when mounting the pin in the press-in hole, the respective positions of the pin and the press-in hole are taken into account based on the correlation, so that the connection between the pin and the press-in hole can be successfully formed.

[0065] A further aspect of the invention relates to an electronic unit having a pin as described above and below.

[0066] Another aspect relates to a vehicle having a pin as described above and below.

[0067] A further aspect relates to the connection of a pin, as described above and below, at least partially for forming an energy and / or signal-conducting connection, in particular in an electronic unit.

[0068] Short description of the drawings

[0069] Embodiments of the invention are described in detail below with reference to the accompanying drawings. In the drawing:

[0070] Figures 1 to 2b show a pin according to an embodiment,

[0071] Figures 3 and 4 show an electronic unit according to an embodiment,

[0072] Figure 5 shows a pin according to an embodiment,

[0073] Figure 6 shows an electronic unit according to an embodiment,

[0074] Figure 7 shows a vehicle according to an embodiment,

[0075] Figures 8a to 9 show a pin according to an embodiment, Figure 10 shows a flow chart illustrating steps of the method for producing a pin according to an embodiment, and

[0076] Figures 11 and 12 show a flow chart illustrating steps of the method for measuring at least one pin according to an embodiment.

[0077] Embodiments of the invention

[0078] Preferably, all identical components, elements and / or units in all figures are provided with the same reference numerals.

[0079] Figure 1 shows a pin 10 according to one embodiment. The pin 10 for electronic components has a contact point 12, which can be connected to a press-in hole 14 in an energy- and / or signal-conducting manner. The contact point 12 has a surface 16, at least a portion 18 of the surface 16, starting from a first end 20 of the contact point 12, having an emission coating 22. The emission coating 22 is configured to absorb a beam with a wavelength between 100 nm and 400 nm and to emit a light beam with a wavelength between 400 nm and 780 nm depending on the beam. The emission coating 22 preferably has an emission surface 23. The emission coating 22 is preferably configured to emit the light beam over substantially the entire emission surface 23 if at least a portion of the emission coating 22 absorbs the beam.

[0080] More preferably, the first end 20 of the contact surface 12 has a tip 26 of the contact point 12. In particular, the tip 26 preferably protrudes on a rear side of the press-in hole 14 when the pin 10 of the press-in hole 14 has been introduced. More preferably, the contact surface 12 has a predetermined length 28 along the first extension direction 24. As shown in Figure 1, the emission coating 22 preferably extends up to 25% of the predetermined length 28 along the first extension direction 24 starting from the first end 20, in particular along the surface 16 of the contact surface 12. More preferably, the contact surface 12 has a second extension direction 30, which is arranged substantially orthogonal to the first extension direction 24. In this context, substantially orthogonal can mean a deviation of ± 45°.More preferably, the emission coating 22 encloses the contact point 12 along the second extension direction 30. As shown in Figure 1, the emission coating 22 encloses the contact point 12 completely around its circumference, so that it is completely enclosed or covered along the second extension direction 30. More preferably, the contact point 12 has a predetermined length 32 along the second extension direction 30, wherein a ratio of the first predetermined length 28 and the second predetermined length 32 is substantially between 1 / 4 and 1 / 2. More preferably, the pin 10 has a contact region 34. In this case, the contact region 34 can in particular be introduced into a semi-finished product or the like and thus form a connection with the semi-finished product. In this case, the contact point 12 can in particular be formed integrally by the contact region 34.

[0081] Figure 2a shows a pin 10 according to one embodiment. In Figure 2a, the pin 10 is preferably introduced into a predetermined position 104 in a liquid emission coating 22 in a basin 102. The predetermined position 104 can be used to adjust the degree of coating on the pin 10 by means of the emission coating 22. Further preferably, a plurality 108 of pins 10 can be arranged in a stamped part or the like, wherein the stamped part is at least temporarily introduced into the basin 102 in order to coat a plurality of pins 10.

[0082] Figure 2b shows a pin 10 according to one embodiment. The pin 10 is arranged outside the basin 102. As can be seen in Figure 2b, all pins 10 of the plurality 108 of pins 10 are provided to a certain degree with the emission coating 22 on the contact point 12. The degree of coating can be variably adjusted based on the predetermined position 104 along the contact point 12.

[0083] Figure 3 shows an electronic unit 300 according to one embodiment. The electronic unit 300 has a plurality of pins 10. The pins 10 can be arranged in particular on a contact 302 or the like. Figure 4 shows an electronic unit 300 according to one embodiment. The electronic unit 300 has in particular a plurality of pins 10. The plurality of pins 10 can be arranged along a contact 302. Each pin 10 has a contact point 12 which is at least partially covered with an emission coating 22. More preferably, a plurality of pins can also be arranged at different locations on the electronic unit 300. More preferably, pins 10 without an emission coating 22 can also be arranged in the electronic unit 300.

[0084] Figure 5 shows an image of a pin 10 according to one embodiment. The first part 310 of the image shows a pin 10 with a contact point 12 and an emission coating 22, which was recorded using a commercially available sensor. The second part 312 of the image shows an image of the pin 10 with the emission coating 22, whereby this image, or rather the second part 312 of the image, only shows ultraviolet rays. As can be clearly seen in Figure 5, only the emission coatings 22 are visible under ultraviolet radiation and can therefore be easily insulated.

[0085] Figure 6 shows an electronic unit 300 according to one embodiment. The electronic unit 300 preferably has a pin 10 as described above and below.

[0086] Figure 7 shows a vehicle 400 according to one embodiment. The vehicle 400 preferably has a pin 10 as described above and below.

[0087] Figures 8a to 8e show different pins according to different embodiments. Figures 8a to 8e illustrate the concept for measuring pin 10. Pin 10 is irradiated with ultraviolet radiation, so that emission coating 22 begins to fluoresce. Emission coating 22 can have an emission surface 23 which, when at least a portion of emission coating 22 is struck by ultraviolet light, begins to fluoresce essentially completely. Thus, the contour 36 of pin 10 can be determined, in particular by comparing pixels of an image that are dark with pixels that have a fluorescent image. Based on contour 36, the center point 37 of the pin can then be determined.This eliminates the need for precise determination of the pin tip, since the center point 37 of pin 10 can be determined by determining the contour of pin 10. As can be seen in Figures 8a to 8e, pin 10 can exhibit varying degrees of tilt, which, however, are at least partially disregarded in the further process, since the contour 36 of pin 10 can be determined using the fluorescent emission coating 22. This allows, in particular, orientation tolerances of pin 10 to be compensated for during assembly.

[0088] Figure 9 shows a pin 10 according to one embodiment. As already explained, the contour 36 of the pin 10 can be determined by the emission coating 22. Thus, the position of the pin tip 26 does not necessarily have to be determined in order to insert the pin 10 into the press-fit hole 14.

[0089] Figure 10 shows a flowchart illustrating steps of the manufacturing method 100 for producing a pin 10. The method 100 preferably comprises the step of providing S1 a pin 10. Furthermore, the method 100 preferably comprises the step of immersing S2 the pin 10. The method 100 preferably includes the step of curing S3 the emission coating 22.

[0090] Figure 11 shows a flowchart illustrating steps of the method 200 for measuring at least one pin 10 according to one embodiment. The method 200 preferably comprises the steps of introducing S10 the pin 10, emitting S11 a radiation, detecting S12 a first image element, determining S13 a contour 36, and determining S14 an orientation of the pin 10.

[0091] Figure 12 shows a flow chart illustrating steps of method 200 for measuring at least one pin 10 according to an embodiment. Method 200 preferably comprises the steps of introducing S10 to S14, as already explained with reference to Figure 11. Further preferably, method 200 comprises the steps of emitting S15 the radiation and determining S16 the contour 36 of pin 10. Preferably, method 200 comprises the steps of determining S17 a second contour 40 of a second pin 10, determining S18 a second orientation of second pin 10, and determining S19 a relation. Further preferably, method 200 comprises the step of identifying S20 the contour 36. Further preferably, the method comprises the steps of determining S21 a center point 37 and determining and / or adapting S22 the determined orientation. Preferably, method 200 comprises the steps of generating

[0092] 522 of a second picture element, generating S23 a third picture element,

[0093] Correlating S24 a first position of the pin 10 in the second image element with a second position of the press-in hole 14 in the third image element, and

[0094] Form S25 of the connection.

Claims

Claims 1 . Pin (10) for electronic components comprising: a contact point (12) which can be connected to a press-in hole (14) in an energy- and / or signal-conducting manner, wherein the contact point (12) has a surface (16), wherein at least a part (18) of the surface (16), starting from a first end (20) of the contact point (12), has an emission coating (22), wherein the emission coating (22) is configured to absorb a beam having a wavelength between 100 nm and 400 nm and to emit a light beam having a wavelength between 400 nm and 780 nm depending on the beam.

2. Pin (10) according to claim 1, wherein the emission coating (22) has an emission surface (23), wherein the emission coating (22) is configured to emit the light beam over substantially the entire emission surface (23) when at least a portion of the emission coating (22) absorbs the beam.

3. Pin (10) according to one of the preceding claims, wherein the emission coating (22) extends substantially completely over the pin (10).

4. Pin (10) according to one of the preceding claims, wherein the contact point (12) has a first extension direction (24), wherein the first end (20) is arranged at a tip (26) of the contact point (12) along the first extension direction (24).

5. Pin (10) according to one of the preceding claims, wherein the emission coating (22) comprises a temperature-resistant material which withstands at least once a short-term temperature load of up to 300 degrees Celsius.

6. Pin (10) according to one of the preceding claims, wherein the pin (10) has a contact region (34), wherein the contact point (12) and the contact region (34) are formed in one piece, wherein the contact region (34) is adapted to form a connection with a semi-finished product.

7. A method (100) for producing a pin (10), comprising the steps of: providing (S1) a pin (10) having a contact point (12), immersing (S2) the pin (10) in a liquid emission coating (22) in a basin (102) in a predetermined position (104), curing (S3) the emission coating (22) outside the basin (102), wherein the emission coating (22) is configured to absorb a beam having a wavelength between 100 nm and 400 nm and to emit a light beam having a wavelength between 400 nm and 780 nm depending on the beam, wherein the predetermined position (104) is selected such that at least a part of the contact point (12) is covered with the emission coating (22).

8. Method (200) for measuring at least one pin (10) according to one of claims 1 to 6, comprising the steps: Inserting (S10) the pin (10) into a press-in hole (14) to form a connection between the pin (10) and the press-in hole (14), emitting (S11) radiation having a wavelength between 100 nm and 400 nm, detecting (S12) a first image element which has emitted light radiation having a wavelength between 400 nm and 780 nm depending on the beam and the at least one pin (10), determining (S13) a contour (36) of the pin (10) based on the first image element, determining (S14) an alignment of the pin (10) to the press-in hole (14) based on the determined contour (36) of the pin (10).

9. The method (200) according to claim 7, wherein the pin (10) has an emission coating (22), further comprising the steps of: emitting (S15) the radiation onto at least a portion of the emission coating (22), Determining (S16) the contour (36) of the pin (10) based on an outer contour of the emission coating (22).

10. The method (200) according to claim 9, comprising the steps: Determining (S17) a second contour (40) of a second pin (10) based on the first image element, determining (S18) a second alignment of the second pin (10) to a further press-in hole (14) based on the second determined contour of the second pin (10). Determining (S19) a relation between the orientation of the pin (10) and the second orientation of the second pin (10).

11. Method (200) according to one of claims 8 to 10, wherein determining (S16) the contour (36) of the pin (10) comprises the step of: identifying (S20) the contour (36) based on a comparison between a pixel of the pixel having the light beam and another pixel of the pixel that is substantially free of the light beam.

12. The method (200) according to claim 11, further comprising the steps of: determining (S21) a center point (37) of the pin (10) based on the determined contour (36) of the pin (10), Determining and / or adjusting (S22) the determined orientation based on the determined center point (37) of the pin (10).

13. The method (200) according to any one of claims 11 to 12, further comprising the steps: Generating (S22) a second image element which shows an emitted light radiation with a wavelength between 400nm and 780nm depending on the beam and the at least one pin (10) with a second detection unit, generating (S23) a third image element showing the press-in hole (14) with a third detection unit, Correlating (S24) a first position of the pin (10) in the second image element with a second position of the press-in hole (14) in the third image element, Forming (S25) the connection based on the correlation of the first position with the second position.

14. Vehicle (400) comprising a pin (10) according to one of claims 1 to 6.

15. Use of a pin (10) according to one of claims 1 to 6 for at least partially forming an energy and / or signal-conducting connection.

Images