Dross transport conveyor, laser processing device, and workpiece processing method

Abstract

A dross transport conveyor comprises: one group of transport plates including a first transport plate extending in a first direction and a second transport plate disposed adjacent to the first transport plate and extending in the first direction, the group of transport plates transporting dross generated by irradiating a workpiece with a laser; a first temperature increase suppression surface that covers at least part of the first transport plate and suppresses any increase in the temperature of the first transport plate due to energy of the laser; and a second temperature increase suppression surface that covers at least part of the second transport plate and suppresses any increase in the temperature of the second transport plate due to energy of the laser.

Description

Dross transport conveyor, laser processing device, and workpiece processing method

[0001] The present invention relates to a dross transport conveyor, a laser processing device, and a workpiece processing method.

[0002] A laser processing machine equipped with a chip conveyor is known.

[0003] As a related technique, Patent Document 1 discloses a chip conveyor for a laser processing machine. The chip conveyor described in Patent Document 1 has multiple plates that form a conveyor belt. Each plate is connected to the other plates by a joint so that they can be bent freely.

[0004] Microfilm of Japanese Utility Model Application No. 3-19091 (Japanese Utility Model Application Laid-Open No. 4-108984)

[0005] An object of the present invention is to provide a dross transport conveyor, a laser processing device, and a workpiece processing method that can suppress thermal deformation of the transport plate.

[0006] In some embodiments, the dross transport conveyor includes a group of transport plates that includes a first transport plate extending in a first direction and a second transport plate arranged adjacent to the first transport plate and extending in the first direction, and transports dross generated by irradiating a workpiece with a laser; a first temperature rise suppression surface that covers at least a portion of the first transport plate and suppresses the first transport plate from being heated due to the energy of the laser; and a second temperature rise suppression surface that covers at least a portion of the second transport plate and suppresses the second transport plate from being heated due to the energy of the laser.

[0007] In some embodiments, the dross transport conveyor includes a group of transport plates including a first transport plate extending in a first direction and a second transport plate disposed adjacent to the first transport plate and extending in the first direction, for transporting dross generated by irradiating a workpiece with a laser. The first transport plate is primarily made of copper, a copper alloy, aluminum, or an aluminum alloy, and at least a portion of a first transport surface of the first transport plate is made of copper, a copper alloy, aluminum, or an aluminum alloy. The second transport plate is primarily made of copper, a copper alloy, aluminum, or an aluminum alloy, and at least a portion of a second transport surface of the second transport plate is made of copper, a copper alloy, aluminum, or an aluminum alloy.

[0008] In some embodiments, the laser processing apparatus includes a laser irradiation device including a laser head that irradiates a laser beam toward a workpiece, a moving device that moves the laser head relative to a workpiece support member that supports the workpiece, a control device that controls the laser irradiation device and the moving device, and a dross transport conveyor. The dross transport conveyor includes a group of transport plates that includes a first transport plate extending in a first direction and a second transport plate disposed adjacent to the first transport plate and extending in the first direction, and transports dross generated by irradiating the workpiece with the laser, a first temperature rise suppression surface that covers at least a portion of the first transport plate and suppresses a temperature rise of the first transport plate due to energy of the laser, and a second temperature rise suppression surface that covers at least a portion of the second transport plate and suppresses a temperature rise of the second transport plate due to the energy of the laser.

[0009] In some embodiments, a workpiece machining method includes the steps of machining the workpiece by irradiating the workpiece with a laser, and transporting dross generated by the laser irradiation of the workpiece using a group of transport plates including a first transport plate extending in a first direction and a second transport plate disposed adjacent to the first transport plate and extending in the first direction. The step of machining the workpiece is performed in a state in which a temperature rise of the first transport plate due to the energy of the laser is suppressed by a first temperature rise suppression surface covering at least a portion of the first transport plate. The step of machining the workpiece is performed in a state in which a temperature rise of the second transport plate due to the energy of the laser is suppressed by a second temperature rise suppression surface covering at least a portion of the second transport plate.

[0010] The present invention provides a dross transport conveyor, a laser processing device, and a workpiece processing method that can suppress thermal deformation of the transport plate.

[0011] FIG. 1 is a schematic cross-sectional view showing a laser processing apparatus according to a first embodiment. FIG. 2 is a schematic cross-sectional view showing a portion of the laser processing apparatus according to the first embodiment. FIG. 3 is a schematic cross-sectional view showing a portion of a laser processing apparatus according to a comparative example. FIG. 4 is a schematic perspective view showing a laser processing apparatus according to the first embodiment. FIG. 5 is a schematic perspective view showing a group of transport plates including a first transport plate and a second transport plate that are movable along a circular orbit. FIG. 6 is a schematic perspective view showing a dross transport conveyor according to the first embodiment. FIG. 7 is an exploded perspective view showing a portion of a group of transport plates. FIG. 8 is a schematic view showing a first transport plate attached to a first endless chain and a second endless chain. FIG. 9 is a schematic cross-sectional view for explaining the first transport plate and the second transport plate. FIG. 10 is a schematic perspective view for explaining the first transport plate and the second transport plate. FIG. 11 is a schematic cross-sectional view showing an enlarged view of a turning portion of the dross transport conveyor according to the first embodiment. FIG. 12 is a schematic cross-sectional view showing a portion of the laser processing apparatus according to the first embodiment. FIG. 13 is a schematic perspective view for explaining a first example of a temperature-rise suppression surface. FIG. 14 is a schematic cross-sectional view showing a portion of the laser processing apparatus according to the first embodiment. FIG. 15 is a schematic cross-sectional view showing a portion of the laser processing apparatus according to the first embodiment. FIG. 16 is a schematic perspective view for explaining a second example of a temperature-rise suppression surface. FIG. 17 is a schematic cross-sectional view showing a portion of the laser processing apparatus according to the first embodiment. FIG. 18 is a schematic cross-sectional view showing a portion of the laser processing apparatus according to the first embodiment. FIG. 19 is a schematic cross-sectional view showing a portion of the laser processing apparatus according to the first embodiment. FIG. 20 is a schematic perspective view for explaining a fourth example of a temperature-rise suppression surface. FIG. 21 is a schematic perspective view for explaining a fourth example of a temperature-rise suppression surface. FIG. 22 is a schematic perspective view for explaining a fourth example of a temperature-rise suppression surface. FIG. 23 is a schematic perspective view for explaining a fourth example of a temperature-rise suppression surface. FIG. 24 is a schematic cross-sectional view showing a part of the laser processing apparatus according to the first embodiment.FIG. 25 is a schematic cross-sectional view showing a state in which the orbital path of one group of transport plates includes an upward slope. FIG. 26 is a schematic side view showing a laser processing apparatus according to the first embodiment. FIG. 27 is a schematic plan view showing a portion of the laser processing apparatus according to the first embodiment. FIG. 28 is a schematic perspective view showing an example of a work support member. FIG. 29 is a schematic perspective view showing a laser processing apparatus according to a first modified example of the first embodiment. FIG. 30 is a schematic plan view showing a state in which a machined workpiece is removed from a work support member. FIG. 31 is a schematic perspective view showing a laser processing apparatus according to a second modified example of the first embodiment. FIG. 32 is a diagram showing a state in which a control device can control multiple control target devices. FIG. 33 is a schematic side view showing a laser processing apparatus according to the first embodiment. FIG. 34 is a schematic cross-sectional view showing a portion of a laser processing apparatus including a cooling device. FIG. 35 is a schematic cross-sectional view showing a laser processing apparatus according to a second embodiment. Fig. 36 is a schematic cross-sectional view showing a part of a laser processing apparatus according to a second embodiment. Fig. 37 is an exploded perspective view showing a part of a group of transport plates. Fig. 38 is a schematic perspective view showing a state in which a group of transport plates including a first transport plate and a second transport plate are movable along a circular orbit. Fig. 39 is a schematic cross-sectional view showing a part of a laser processing apparatus according to a second embodiment. Fig. 40 is a schematic cross-sectional view showing a part of a laser processing apparatus according to the second embodiment. Fig. 41 is a schematic cross-sectional view showing a part of a laser processing apparatus according to the second embodiment. Fig. 42 is a flowchart showing an example of a workpiece processing method according to a third embodiment.

[0012] Hereinafter, the dross transport conveyor 2, the laser processing device 1, and the workpiece processing method according to the embodiment will be described with reference to the drawings. In the following description of the embodiment, parts and members having the same functions are given the same reference numerals, and repeated descriptions of parts and members given the same reference numerals will be omitted.

[0013] (Definition of Terms) As illustrated in Fig. 2, each of the group of transport plates 3 has a transport surface 3u. In this specification, the transport surface means a surface that directly or indirectly supports the dross during dross transport. More specifically, the transport surface 3u is a surface that faces generally upward during dross transport.

[0014] 2, each of the group of transport plates 3 has a back surface 3n. In this specification, the back surface means the surface of each transport plate opposite to the transport surface 3u. More specifically, the back surface 3n is a surface that faces generally downward when transporting dross.

[0015] In this specification, the area that can be reached by the laser emitted from the laser irradiation device 60 is defined as a "processing area RG1" (see FIG. 1). The workpiece W placed in the processing area RG1 is processed by the laser (more specifically, cut or drilled). Dross generated by irradiating the workpiece W with the laser is received by a group of transport plates 3 in the processing area RG1.

[0016] (Definition of Directions) In this specification, the extension direction of the first transport plate 3-1 (or the extension direction of each transport plate 3) is defined as the first direction DR1. In this specification, the movement direction of the first group of transport plates 3 (or the movement direction of each transport plate 3) is defined as the second direction DR2. As illustrated in FIG. 5, in this specification, the direction from the inside of the orbit OB of the first group of transport plates 3 (see the area hatched with dots in FIG. 5) to the outside of the orbit OB is defined as the third direction DR3, and the direction opposite to the third direction DR3 is defined as the fourth direction DR4. As illustrated in FIG. 2, the third direction DR3 is the direction from the first back surface 3n-1 of the first transport plate 3-1 to the first transport surface 3u-1 of the first transport plate 3-1. The third direction DR3 is the direction from the second back surface 3n-2 of the second transport plate 3-2 toward the second transport surface 3u-2 of the second transport plate 3-2. As illustrated in Figure 2, the fourth direction DR4 is the direction from the first transport surface 3u-1 of the first transport plate 3-1 toward the first back surface 3n-1 of the first transport plate 3-1. The fourth direction DR4 is the direction from the second transport surface 3u-2 of the second transport plate 3-2 toward the second back surface 3n-2 of the second transport plate 3-2.

[0017] First Embodiment A dross transport conveyor 2A and a laser processing apparatus 1A according to a first embodiment will be described with reference to FIGS. 1 to 34. FIG. 1 is a schematic cross-sectional view of the laser processing apparatus 1A according to the first embodiment. FIG. 2 is a schematic cross-sectional view of a portion of the laser processing apparatus 1A according to the first embodiment. FIG. 3 is a schematic cross-sectional view of a portion of a laser processing apparatus according to a comparative example. FIG. 4 is a schematic perspective view of the laser processing apparatus 1A according to the first embodiment. FIG. 5 is a schematic perspective view of a group of transport plates 3 including a first transport plate 3-1 and a second transport plate 3-2 that can move along a circular orbit OB. FIG. 6 is a schematic perspective view of the dross transport conveyor 2A according to the first embodiment. FIG. 7 is an exploded perspective view of a portion of a group of transport plates 3. FIG. 8 is a schematic view of a first transport plate 3-1 attached to a first endless chain 21a and a second endless chain 22a. FIG. 9 is a schematic cross-sectional view illustrating the first transport plate 3-1 and the second transport plate 3-2. FIG. 10 is a schematic perspective view illustrating the first transport plate 3-1 and the second transport plate 3-2. FIG. 11 is a schematic cross-sectional view illustrating an enlarged view of a turning portion of the dross transport conveyor 2A in the first embodiment. FIG. 12 is a schematic cross-sectional view illustrating a portion of the laser processing apparatus 1A in the first embodiment. FIG. 13 is a schematic perspective view illustrating a first example of a temperature-rise suppression surface. FIG. 14 is a schematic cross-sectional view illustrating a portion of the laser processing apparatus 1A in the first embodiment. FIG. 15 is a schematic cross-sectional view illustrating a portion of the laser processing apparatus 1A in the first embodiment. FIG. 16 is a schematic perspective view illustrating a second example of a temperature-rise suppression surface. FIG. 17 is a schematic cross-sectional view illustrating a portion of the laser processing apparatus 1A in the first embodiment. FIG. 18 is a schematic cross-sectional view illustrating a portion of the laser processing apparatus 1A in the first embodiment. Fig. 19 is a schematic cross-sectional view showing a part of the laser processing apparatus 1A according to the first embodiment. Figs. 20 to 23 are schematic perspective views for explaining a fourth example of the temperature rise suppression surface.FIG. 24 is a schematic cross-sectional view showing a portion of the laser processing apparatus 1A according to the first embodiment. FIG. 25 is a schematic cross-sectional view showing a state in which the orbit OB of one group of transport plates 3 includes an ascending slope CL. FIG. 26 is a schematic side view showing a portion of the laser processing apparatus 1A according to the first embodiment. FIG. 27 is a schematic plan view showing a portion of the laser processing apparatus 1A according to the first embodiment. FIG. 28 is a schematic perspective view showing an example of a work support member 90. FIG. 29 is a schematic perspective view showing a laser processing apparatus 1A according to a first modified example of the first embodiment. FIG. 30 is a schematic plan view showing a state in which the machined workpiece Wb is removed from the work support member 90. FIG. 31 is a schematic perspective view showing a laser processing apparatus 1A according to a second modified example of the first embodiment. FIG. 32 is a diagram showing a state in which the control device 8 can control a plurality of control target devices. Fig. 33 is a schematic side view showing the laser processing apparatus 1A in the first embodiment. Fig. 34 is a schematic cross-sectional view showing a part of the laser processing apparatus including the cooling device 95.

[0018] As illustrated in FIG. 2, the dross transport conveyor 2A in the first embodiment includes a group of transport plates 3.

[0019] The first group of transport plates 3 transports dross D generated by irradiating the workpiece W with the laser LB. In addition to the dross D, the first group of transport plates 3 may also transport cut-off pieces CF generated by irradiating the workpiece W with the laser LB.

[0020] In this specification, dross refers to an irregularly shaped mass (in other words, a randomly shaped mass) formed by solidification of a material (more specifically, a metal material) melted by laser irradiation.

[0021] The group of transport plates 3 includes a first transport plate 3-1 extending in the first direction DR1 and a second transport plate 3-2 extending in the first direction DR1. Each of the group of transport plates 3 is an elongated plate with the first direction DR1 as its longitudinal direction. In the example shown in FIG. 2, the second transport plate 3-2 is disposed adjacent to the first transport plate 3-1.

[0022] In the example shown in FIG. 2 , the laser beam LB passing through the workpiece W reaches the dross transport conveyor 2A. As shown in FIG. 3 , when the laser beam LB reaches the transport plate 3, the transport plate 3 is thermally deformed. In the example shown in FIG. 3 , the laser beam LB reaches each of the transport plates 3, causing the transport plates 3 to bend irregularly in the third direction DR3 (more specifically, due to thermal deformation). The transport plates 3 are designed to prevent excessive bending and are sufficiently resistant to thermal deformation. In particular, the transport plate 3 shaped as shown in FIG. 3 has high bending rigidity and is less likely to bend. However, if the output of the laser beam LB is increased or the energy density of the laser beam LB is increased, excessive thermal deformation may occur even in the transport plate 3 shaped as shown in FIG. 3 . Furthermore, excessive thermal deformation of the transport plate 3 may hinder smooth movement of a group of transport plates 3.

[0023] As illustrated in FIG. 2, the dross transport conveyor 2A in the first embodiment includes a first temperature rise suppression surface 4-1 and a second temperature rise suppression surface 4-2.

[0024] The first temperature rise suppression surface 4-1 covers at least a portion of the surface of the first transport plate 3-1. The first temperature rise suppression surface 4-1 also suppresses a temperature rise of the first transport plate 3-1 due to the energy of the laser LB. In the example shown in Figure 2, the first temperature rise suppression surface 4-1 includes the surface of the first laser reflecting layer 4r-1 that covers at least a portion of the first transport surface 3u-1 of the first transport plate 3-1.

[0025] The second temperature rise suppression surface 4-2 covers at least a portion of the surface of the second transport plate 3-2. The second temperature rise suppression surface 4-2 also suppresses a temperature rise of the second transport plate 3-2 due to the energy of the laser LB. In the example shown in FIG. 2, the second temperature rise suppression surface 4-2 includes the surface of the second laser reflecting layer 4r-2 that covers at least a portion of the second transport surface 3u-2 of the second transport plate 3-2.

[0026] In the dross transport conveyor 2A of the first embodiment, the first laser reflecting layer 4r-1 covering at least a portion of the first transport surface 3u-1 effectively reflects the laser LB emitted from the laser irradiation device 60. This suppresses heat input to the first transport plate 3-1, thereby suppressing thermal deformation and warping of the first transport plate 3-1. Furthermore, the second laser reflecting layer 4r-2 covering at least a portion of the second transport surface 3u-2 effectively reflects the laser LB emitted from the laser irradiation device 60. This suppresses heat input to the second transport plate 3-2, thereby suppressing thermal deformation and warping of the second transport plate 3-2. This allows the group of transport plates 3 including the first transport plate 3-1 and the second transport plate 3-2 to move smoothly.

[0027] 1 , the laser processing apparatus 1A in the first embodiment includes the above-mentioned dross transport conveyor 2A, a laser irradiation device 60 including a laser head 61 that irradiates a laser LB toward a workpiece W, a moving device 7 that moves the laser head 61 relative to a workpiece support member 90 that supports the workpiece W, and a control device 8 that controls the laser irradiation device 60 and the moving device 7. Note that one computer may function as the control device 8, or multiple computers may function in cooperation as the control device 8.

[0028] The laser processing device 1A in the first embodiment has the same effects as the dross transport conveyor 2A in the first embodiment.

[0029] (Optional additional configuration) Next, referring to Figures 1 to 34, optional additional configurations that can be adopted in the dross transport conveyor 2A and laser processing apparatus 1A in the first embodiment (or the dross transport conveyor 2B and laser processing apparatus 1B in the second embodiment described below) will be described.

[0030] 1, a portion of the dross transport conveyor 2A is disposed directly below the laser irradiation device 60. Furthermore, one group of transport plates 3 of the dross transport conveyor 2A is configured to be movable across the processing region RG1 (more specifically, the region directly below the laser irradiation device 60).

[0031] In the example shown in Fig. 1, the first group of transport plates 3 transports dross from the processing region RG1 to the discharge region RG2. In the example shown in Fig. 1, each of the first group of transport plates 3 is reversed in the discharge region RG2 (more specifically, turned 180 degrees around the horizontal axis). As a result, the dross D transported by the first group of transport plates 3 is discharged from the first group of transport plates 3 to the container 13 in the discharge region RG2. Note that when the first group of transport plates 3 transports cut-off pieces CF (see Fig. 2), the cut-off pieces CF are also discharged from the first group of transport plates 3 to the container 13 in the discharge region RG2.

[0032] 4 , the dross transport conveyor 2A includes a first endless member 21, a second endless member 22, and a drive device 29. The first endless member 21 and the second endless member 22 support a group of transport plates 3. More specifically, the group of transport plates 3 is attached to the first endless member 21 and the second endless member 22.

[0033] The first endless member 21 and the second endless member 22 are driven directly or indirectly by a driving device 29. More specifically, the first endless member 21 is driven directly or indirectly by the driving device 29 to move along a first orbital orbit B1 (see FIG. 5 ), and the second endless member 22 is driven directly or indirectly by the driving device 29 to move along a second orbital orbit B2 (see FIG. 5 ) parallel to the first orbital orbit B1. A gap G1 between the first orbital orbit B1 and the second orbital orbit B2 (in other words, the distance between the first orbital orbit B1 and the second orbital orbit B2 in the direction along the first direction DR1) is, for example, not less than 1 m and not more than 3 m.

[0034] In the example shown in Fig. 6, the first endless member 21 is a first endless chain 21a, and the second endless member 22 is a second endless chain 22a. In the example shown in Fig. 6, the dross transport conveyor 2 has a plurality of sprockets 28 including a first sprocket 28a, a second sprocket 28b, a third sprocket 28c, and a fourth sprocket 28d. The first endless chain 21a is engaged with at least the first sprocket 28a and the second sprocket 28b (more specifically, the first endless chain 21a is looped around at least the first sprocket 28a and the second sprocket 28b). The second endless chain 22a is engaged with at least the third sprocket 28c and the fourth sprocket 28d (more specifically, the second endless chain 22a is looped around at least the third sprocket 28c and the fourth sprocket 28d).

[0035] In the example shown in Figure 6, the first endless chain 21a is driven by a drive device 29 via at least a first sprocket 28a, and the second endless chain 22a is driven by a drive device 29 via at least a third sprocket 28c.

[0036] The group of transport plates 3 moves along an orbital path OB. As illustrated in Fig. 5, the orbital path OB of the group of transport plates 3 is parallel to the first orbital path B1 of the first endless chain 21a and parallel to the second orbital path B2 of the second endless chain 22a.

[0037] (First group of transport plates 3) As illustrated in Fig. 2, each of the first group of transport plates 3 transports a portion of the multiple pieces of dross D generated by irradiating the workpiece W with the laser LB, and is heated by the laser LB. For example, each of the first transport plate 3-1 and the second transport plate 3-2 transports a portion of the multiple pieces of dross D generated by irradiating the workpiece W with the laser LB, and is heated by the laser LB. Each of the first group of transport plates 3 may be composed of a single part, or may be composed of an assembly of multiple parts.

[0038] In the example shown in FIG. 2 , the dross transport conveyor 2A has a group of transport plates 3 including a first transport plate 3-1, a second transport plate 3-2, and a third transport plate 3-3. Each of the group of transport plates 3 extends along a first direction DR1. The number of transport plates 3 included in one group of transport plates 3 is, for example, 20 or more, 50 or more, or 80 or more. In this specification, the number of transport plates 3 included in one group of transport plates 3 is defined as "N." "N" is, for example, a natural number greater than or equal to 20.

[0039] When "K" is defined as any natural number between 1 and "N-1," the K+1th transport plate is arranged adjacent to the Kth transport plate. Also, the first transport plate 3-1 is arranged adjacent to the Nth transport plate. In this way, the group of transport plates 3 is arranged in a ring shape as a whole. For example, the second transport plate 3-2 is arranged adjacent to the first transport plate 3-1 and also adjacent to the third transport plate 3-3.

[0040] Each of the group of transport plates 3 has a front end 3 f, a rear end 3 e, and an intermediate portion 3 m connecting the front end 3 f and the rear end 3 e. In the example shown in Fig. 2, the front end 3 f of each transport plate 3 is the end on the front side in the movement direction (in other words, the end on the side of the second direction DR2), and the rear end 3 e of each transport plate 3 is the end on the rear side in the movement direction (in other words, the end on the opposite side from the second direction DR2).

[0041] In the example shown in Figure 2, the front end 3f of each transport plate 3 is arranged so as to overlap with the rear end 3e of another adjacent transport plate 3 when viewed in a plan view (in other words, when viewed in a direction along the fourth direction DR4), and the rear end 3e of each transport plate 3 is arranged so as to overlap with the front end 3f of another adjacent transport plate when viewed in a plan view (in other words, when viewed in a direction along the fourth direction DR4).

[0042] For example, the first front end 3f-1 of the first transport plate 3-1 is arranged to overlap the rear end 3e-N of the other transport plate 3-N in a plan view (in other words, when viewed in the direction along the fourth direction DR4). More specifically, the rear end 3e-N of the other transport plate 3-N is covered by the first front end 3f-1 of the first transport plate 3-1.

[0043] For example, the first rear end 3e-1 of the first transport plate 3-1 is arranged to overlap the second front end 3f-2 of the second transport plate 3-2 in a plan view (in other words, when viewed in the direction along the fourth direction DR4). More specifically, the first rear end 3e-1 of the first transport plate 3-1 is covered by the second front end 3f-2 of the second transport plate 3-2.

[0044] For example, the second rear end 3e-2 of the second transport plate 3-2 is arranged to overlap the third front end 3f-3 of the third transport plate 3-3 in a plan view. More specifically, the second rear end 3e-2 of the second transport plate 3-2 is covered by the third front end 3f-3 of the third transport plate 3-3.

[0045] 7, each of the group of transport plates 3 has a left end 3a and a right end 3b. In the example shown in Fig. 7, the left end 3a of each transport plate 3 is the left end when viewing the transport surface 3u of the transport plate 3 in the direction from the rear end 3e to the front end 3f, and the right end 3b of each transport plate 3 is the right end when viewing the transport surface 3u of the transport plate 3 in the direction from the rear end 3e to the front end 3f.

[0046] The first transport plate 3-1 has a first front end 3f-1, a first rear end 3e-1, a first intermediate portion 3m-1 connecting the first front end 3f-1 and the first rear end 3e-1, a left end 3a-1, and a right end 3b-1.

[0047] The second transport plate 3-2 has a second front end 3f-2, a second rear end 3e-2, a second intermediate portion 3m-2 connecting the second front end 3f-2 and the second rear end 3e-2, a left end 3a-2, and a right end 3b-2.

[0048] The third transport plate 3-3 has a third front end 3f-3, a third rear end 3e-3, a third intermediate portion 3m-3 connecting the third front end 3f-3 and the third rear end 3e-3, a left end 3a-3, and a right end 3b-3.

[0049] The length of each of the group of transport plates 3 (more specifically, the length in the direction along the first direction DR1) is, for example, 1 m or more and 3 m or less. The length L1 of the first transport plate 3-1 is, for example, 1 m or more and 3 m or less, and the length of the second transport plate 3-2 is, for example, 1 m or more and 3 m or less.

[0050] The width of each of the first group of transport plates 3 (more specifically, the width of each of the first group of transport plates 3 in the direction along the second direction DR2) is, for example, 40 mm or more and 200 mm or less. The width W1 of the first transport plate 3-1 is, for example, 40 mm or more and 200 mm or less, and the width W2 of the second transport plate 3-2 is, for example, 40 mm or more and 200 mm or less.

[0051] The plate thickness of each of the group of transport plates 3 is, for example, 5 mm or less or 3 mm or less. In the example shown in Figure 7, the plate thickness of the first front end 3f-1 of the first transport plate 3-1 is approximately constant, and the plate thickness of the first rear end 3e-1 of the first transport plate 3-1 is approximately constant. In addition, the plate thickness of the first intermediate portion 3m-1 of the first transport plate 3-1 is approximately constant. In the example shown in Figure 7, the plate thickness of the first transport plate 3-1 as a whole is approximately constant.

[0052] Each of the group of transport plates 3 is made of metal, for example, steel, more specifically, hot-rolled mild steel plate, cold-rolled steel plate, or cold-rolled stainless steel plate.

[0053] The left end 3a of each of the first group of transport plates 3 is attached to a first endless member 21 (more specifically, a first endless chain 21a), and the right end 3b of each of the first group of transport plates 3 is attached to a second endless member 22 (more specifically, a second endless chain 22a).

[0054] In the example shown in FIG. 7, the left end 3a-1 of the first transport plate 3-1 has a hole h1 through which a bolt can be inserted, and the right end 3b-1 of the first transport plate 3-1 has a hole h2 through which a bolt can be inserted. In the example shown in FIG. 8, the left end 3a-1 of the first transport plate 3-1 is attached to the first endless chain 21a via a bolt BT, and the right end 3b-1 of the first transport plate 3-1 is attached to the second endless chain 22a via a bolt BT. As can be seen from FIG. 2, the first transport plate 3-1 is not connected to any adjacent transport plates. Therefore, if the first transport plate 3-1 is damaged, it can be easily replaced with a new first transport plate.

[0055] In the example shown in FIG. 9, the first transport plate 3-1 has a first transport surface 3u-1 and a first back surface 3n-1.

[0056] The first transport surface 3u-1 supports the dross directly or indirectly via a first laser reflecting layer or the like when the first transport plate 3-1 is transporting the dross. The first transport surface 3u-1 of the first transport plate 3-1 faces generally upward when the first transport plate 3-1 is transporting the dross. The first back surface 3n-1 is the surface of the first transport plate 3-1 that is located on the opposite side of the first transport surface 3u-1. The first back surface 3n-1 of the first transport plate 3-1 is the surface that is located below the first transport surface 3u-1 when the first transport plate 3-1 is transporting the dross. The first back surface 3n-1 faces generally downward when the first transport plate 3-1 is transporting the dross.

[0057] In the example shown in FIG. 9, the second transport plate 3-2 has a second transport surface 3u-2 and a second back surface 3n-2.

[0058] The second transport surface 3u-2 supports the dross directly or indirectly via a second laser reflecting layer or the like when the second transport plate 3-2 is transporting the dross. The second transport surface 3u-2 of the second transport plate 3-2 faces generally upward when the second transport plate 3-2 is transporting the dross. The second back surface 3n-2 is the surface of the second transport plate 3-2 that is located on the opposite side from the second transport surface 3u-2. The second back surface 3n-2 of the second transport plate 3-2 is the surface that is located below the second transport surface 3u-2 when the second transport plate 3-2 is transporting the dross. The second back surface 3n-2 faces generally downward when the second transport plate 3-2 is transporting the dross.

[0059] In the example shown in FIG. 9, the front end 3f of each of the group of transport plates 3 has a convex curved portion CP extending in the first direction DR1.

[0060] For example, the first front end 3f-1 of the first transport plate 3-1 has a convex curved portion CP1 extending in the first direction DR1. The first front end 3f-1 of the first transport plate 3-1 also has a convex transport surface SU1 extending in the first direction DR1. The convex transport surface SU1 is the surface of the convex curved portion CP1 on the third direction DR3 side. In the example shown in Figure 10, the convex transport surface SU1 is a curved surface that is convex in the third direction DR3 and constitutes part of the first transport surface 3u-1 of the first transport plate 3-1.

[0061] For example, the second front end 3f-2 of the second transport plate 3-2 has a convex curved portion CP2 extending in the first direction DR1. The second front end 3f-2 of the second transport plate 3-2 also has a convex transport surface SU2 extending in the first direction DR1. The convex transport surface SU2 is the surface of the convex curved portion CP2 on the third direction DR3 side. In the example shown in Figure 10, the convex transport surface SU2 is a curved surface that is convex in the third direction DR3 and constitutes part of the second transport surface 3u-2 of the second transport plate 3-2.

[0062] In the first embodiment, the shape of the front end portion 3f of each of the group of transport plates 3 is not limited to the example shown in FIG.

[0063] In the example shown in FIG. 9, the rear end portion 3e of each of the group of transport plates 3 has a standing portion TP that protrudes in the third direction DR3.

[0064] For example, the first rear end 3e-1 of the first transport plate 3-1 has a first upright portion TP1 that extends in the first direction DR1 and protrudes in the third direction DR3. In the example shown in Fig. 11, the first upright portion TP1 scrapes out dross D below the convex curved portion CP2 of the second transport plate 3-2 when the first transport plate 3-1 turns.

[0065] For example, the second rear end 3e-2 of the second transport plate 3-2 has a second upright portion TP2 that extends in the first direction DR1 and protrudes in the third direction DR3. In the example shown in Fig. 11, the second upright portion TP2 scrapes out dross below the convex curved portion CP3 of the third transport plate 3-3 when the second transport plate 3-2 turns.

[0066] In the first embodiment, the shape of the rear end portion 3e of each of the group of transport plates 3 is not limited to the example shown in Fig. 11. For example, the shape of the rear end portion 3e of each of the group of transport plates 3 may be a substantially arc shape or a substantially circular shape when viewed in the first direction DR1.

[0067] In the example shown in FIG. 9, the intermediate portion 3m of each of the group of transport plates 3 connects the front end 3f and the rear end 3e.

[0068] For example, the first intermediate portion 3m-1 of the first transport plate 3-1 connects the first front end 3f-1 of the first transport plate 3-1 to the first rear end 3e-1 of the first transport plate 3-1. In the example shown in FIG. 10, the front end of the first intermediate portion 3m-1 is connected to the first front end 3f-1 (more specifically, the convex curved portion CP1) via a first bent portion BA1 extending in the first direction DR1. The rear end of the first intermediate portion 3m-1 is connected to the first rear end 3e-1 (more specifically, the first upright portion TP1) via a second bent portion BB1 extending in the first direction DR1. In the example shown in FIG. 10, the first intermediate portion 3m-1 has a first flat portion FP1. The first intermediate portion 3m-1 also has a flat transport surface SF1 extending in the first direction DR1. The flat transport surface SF1 is the surface of the first flat plate portion FP1 on the third direction DR3 side. The flat transport surface SF1 constitutes a part of the first transport surface 3u-1 of the first transport plate 3-1.

[0069] For example, the second intermediate portion 3m-2 of the second transport plate 3-2 connects the second front end 3f-2 of the second transport plate 3-2 to the second rear end 3e-2 of the second transport plate 3-2. In the example shown in FIG. 10, the front end of the second intermediate portion 3m-2 is connected to the second front end 3f-2 (more specifically, the convex curved portion CP2) via a third bend BA2 extending in the first direction DR1. The rear end of the second intermediate portion 3m-2 is connected to the second rear end 3e-2 (more specifically, the second upright portion TP2) via a fourth bend BB2 extending in the first direction DR1. In the example shown in FIG. 10, the second intermediate portion 3m-2 has a second flat portion FP2. The second intermediate portion 3m-2 also has a flat transport surface SF2 extending in the first direction DR1. The flat transport surface SF2 is the surface of the second flat plate portion FP2 on the third direction DR3 side. The flat transport surface SF2 constitutes a part of the second transport surface 3u-2 of the second transport plate 3-2.

[0070] In the first embodiment, the shape of the intermediate portion 3m of each of the group of transport plates 3 is not limited to the example shown in Fig. 10. For example, at least a part of the intermediate portion 3m of each of the group of transport plates 3 may have a substantially arc shape, a substantially V-shape, or a substantially U-shape when viewed in the first direction DR1.

[0071] Although several examples of temperature rise suppression surfaces are described below, the temperature rise suppression surfaces are not limited to the examples described below. Furthermore, the following representative description will be given of the first temperature rise suppression surface 4-1 that suppresses a temperature rise of the first transport plate 3-1 and the second temperature rise suppression surface 4-2 that suppresses a temperature rise of the second transport plate 3-2, and a description of the temperature rise suppression surfaces that suppress a temperature rise of the other transport plates will be omitted.

[0072] 12, the first temperature-rise suppression surface 4-1 includes a surface of a first laser reflecting layer 4r-1 that covers at least a portion of the first transport surface 3u-1 of the first transport plate 3-1. In other words, at least a portion of the first transport surface 3u-1 of the first transport plate 3-1 is covered by the first laser reflecting layer 4r-1.

[0073] The first laser reflecting layer 4r-1, which covers at least a portion of the first transfer plate 3-1, is made of a material with high laser reflectivity (e.g., copper, silver, or aluminum). The first transfer plate 3-1 is made of, for example, steel, more specifically, a hot-rolled mild steel plate, a cold-rolled steel plate, or a cold-rolled stainless steel plate.

[0074] The laser reflectivity of the first laser reflecting layer 4r-1 is higher than that of the first conveying plate 3-1. In the first embodiment (or the second embodiment described later), the wavelength of the laser LB emitted from the laser irradiation device 60 is, for example, 1060 nm or more and 1080 nm or less. The laser reflectivity of the first laser reflecting layer 4r-1 for a laser having a wavelength of 1060 nm or more and 1080 nm or less is, for example, 70% or more, 80% or more, or 90% or more.

[0075] 12, the first laser reflecting layer 4r-1 covers a portion of the first transport surface 3u-1 of the first transport plate 3-1 (for example, the transport surface of the first intermediate portion 3m-1), while another portion of the first transport surface 3u-1 of the first transport plate 3-1 (for example, the transport surface of the first front end portion 3f-1) is exposed and not covered by the first laser reflecting layer 4r-1.

[0076] In the example shown in FIG. 13, at least a portion of the conveying surface (more specifically, the flat conveying surface SF1) of the first intermediate portion 3m-1 is covered with the first laser reflecting layer 4r-1. Therefore, the first laser reflecting layer 4r-1 suppresses thermal deformation of the first intermediate portion 3m-1, which is relatively susceptible to deformation. More specifically, the laser LB traveling toward the first intermediate portion 3m-1 is reflected by the first laser reflecting layer 4r-1, thereby suppressing heat input to the first intermediate portion 3m-1. In FIG. 13, the laser reflecting layers (4r-1, 4r-2) are hatched with dots to make them easier to understand.

[0077] In the example shown in Figure 13, the entire conveying surface (more specifically, the convex conveying surface SU1) of the first front end 3f-1 of the first conveying plate 3-1 is exposed and not covered by the first laser reflecting layer 4r-1. Also, in the example shown in Figure 13, the entire first rear end 3e-1 (more specifically, the first standing portion TP1) is exposed and not covered by the first laser reflecting layer 4r-1. In this case, the area where the first laser reflecting layer 4r-1 is disposed is reduced, and material costs are reduced.

[0078] Alternatively, as illustrated in Figure 14, substantially the entire first transport surface 3u-1 of the first transport plate 3-1 may be covered with the first laser reflecting layer 4r-1. Note that in the example shown in Figure 13, the left end 3a-1 and the right end 3b-1 of the first transport plate 3-1 are not irradiated with laser, and therefore the left end 3a-1 and the right end 3b-1 are not covered with the first laser reflecting layer 4r-1. Of course, the left end 3a-1 and the right end 3b-1 may also be covered with the first laser reflecting layer 4r-1.

[0079] 12 or 14, the first laser reflecting layer 4r-1 (e.g., a copper layer or aluminum layer covering at least a portion of the first transport surface 3u-1) that covers at least a portion of the first transport surface 3u-1 effectively reflects the laser LB emitted from the laser irradiation device 60. This suppresses heat input to the first transport plate 3-1, and suppresses a temperature rise of the first transport plate 3-1. Furthermore, thermal deformation and warping of the first transport plate 3-1 are suppressed.

[0080] The first laser reflective layer 4r-1 includes a plating layer such as a copper plating layer, a silver plating layer, or an aluminum plating layer. The first laser reflective layer 4r-1 may be a plating layer formed on the first transport plate 3-1 by a wet film formation method, or may be a plating layer formed on the first transport plate 3-1 by a dry film formation method (note that dry film formation methods include vapor deposition methods). Alternatively, the first laser reflective layer 4r-1 may include a laser reflector plate (e.g., a copper or copper alloy plate, or an aluminum or aluminum alloy plate) attached to the first transport plate 3-1.

[0081] 12, the second temperature-rise suppression surface 4-2 includes a surface of the second laser reflecting layer 4r-2 that covers at least a portion of the second transport surface 3u-2 of the second transport plate 3-2. In other words, at least a portion of the second transport surface 3u-2 of the second transport plate 3-2 is covered by the second laser reflecting layer 4r-2.

[0082] The second laser reflecting layer 4r-2, which covers at least a portion of the second transfer plate 3-2, is made of a material with high laser reflectivity (e.g., copper, silver, or aluminum). The second transfer plate 3-2 is made of, for example, steel, more specifically, a hot-rolled mild steel plate, a cold-rolled steel plate, or a cold-rolled stainless steel plate.

[0083] The laser reflectivity of the second laser reflecting layer 4r-2 is higher than that of the second conveying plate 3-2. The laser reflectivity of the second laser reflecting layer 4r-2 for a laser having a wavelength of 1060 nm or more and 1080 nm or less is, for example, 70% or more, 80% or more, or 90% or more.

[0084] 12, the second laser reflecting layer 4r-2 covers a portion of the second transport surface 3u-2 of the second transport plate 3-2 (for example, the transport surface of the second intermediate portion 3m-2), while another portion of the second transport surface 3u-2 of the second transport plate 3-2 (for example, the transport surface of the second front end portion 3f-2) is exposed and not covered by the second laser reflecting layer 4r-2.

[0085] 13, at least a portion of the conveying surface (more specifically, the flat conveying surface SF2) of the second intermediate portion 3m-2 is covered with the second laser reflecting layer 4r-2. Therefore, the thermal deformation of the second intermediate portion 3m-2, which is relatively susceptible to deformation, is suppressed by the second laser reflecting layer 4r-2.

[0086] In the example shown in Figure 13, the entire conveying surface (more specifically, the convex conveying surface SU2) of the second front end 3f-2 of the second conveying plate 3-2 is exposed and not covered by the second laser reflecting layer 4r-2. Also, in the example shown in Figure 13, the entire second rear end 3e-2 (more specifically, the second standing portion TP2) is exposed and not covered by the second laser reflecting layer 4r-2. In this case, the area where the second laser reflecting layer 4r-2 is disposed is reduced, and material costs are reduced.

[0087] Alternatively, as illustrated in Figure 14, substantially the entire second transport surface 3u-2 of the second transport plate 3-2 may be covered with the second laser reflecting layer 4r-2. Note that in the example shown in Figure 13, the left end 3a-2 and the right end 3b-2 of the second transport plate 3-2 are not irradiated with laser light, and therefore the left end 3a-2 and the right end 3b-2 are not covered with the second laser reflecting layer 4r-2. Of course, the left end 3a-2 and the right end 3b-2 may also be covered with the second laser reflecting layer 4r-2.

[0088] 12 or 14, the second laser reflecting layer 4r-2 covering at least a portion of the second transport surface 3u-2 effectively reflects the laser LB emitted from the laser irradiation device 60. This suppresses heat input to the second transport plate 3-2, suppressing a temperature rise of the second transport plate 3-2, and also suppressing thermal deformation and bending of the second transport plate 3-2.

[0089] The second laser reflecting layer 4r-2 includes, for example, a plated layer such as a copper plated layer, a silver plated layer, or an aluminum plated layer. Alternatively, the second laser reflecting layer 4r-2 may include a laser reflecting plate (for example, a copper or copper alloy plate, or an aluminum or aluminum alloy plate) attached to the second conveying plate 3-2.

[0090] 15, the first temperature-rise suppression surface 4-1 includes the surface of the first thermally conductive layer 4c-1 that covers at least a portion of the first back surface 3n-1 of the first transport plate 3-1 (i.e., the surface of the first transport plate 3-1 opposite the first transport surface 3u-1). In other words, at least a portion of the first back surface 4n-1 of the first transport plate 3-1 is covered by the first thermally conductive layer 4c-1.

[0091] The thermal conductivity of the first thermally conductive layer 4c-1 is higher than that of the first transfer plate 3-1. The first thermally conductive layer 4c-1 is made of a material with high thermal conductivity (e.g., copper, silver, or aluminum). The first transfer plate 3-1 is made of, for example, steel, more specifically, a hot-rolled mild steel plate, a cold-rolled steel plate, or a cold-rolled stainless steel plate. The thermal conductivity of the first thermally conductive layer 4c-1 is, for example, 150 W / m·K or more, 200 W / m·K or more, or 300 W / m·K or more.

[0092] 15, the first thermally conductive layer 4c-1 covers a portion of the first back surface 3n-1 of the first transport plate 3-1 (for example, the back surface of the first intermediate portion 3m-1), while another portion of the first back surface 3n-1 of the first transport plate 3-1 (for example, the back surface of the first front end portion 3f-1) is exposed and not covered by the first thermally conductive layer 4c-1.

[0093] In the example shown in FIG. 16, at least a portion of the back surface (more specifically, the flat back surface SN1) of the first intermediate portion 3m-1 is covered by the first thermally conductive layer 4c-1. Therefore, heat from the first intermediate portion 3m-1 is effectively diffused by the first thermally conductive layer 4c-1. For example, consider a case where the temperature of the first intermediate portion 3m-1 increases due to the laser LB being incident on the first intermediate portion 3m-1. In this case, heat is rapidly diffused from the area of ​​the first intermediate portion 3m-1 irradiated with the laser LB to other areas via the first thermally conductive layer 4c-1. Note that in FIG. 16, the thermally conductive layers (4c-1, 4c-2) are hatched with dots to make them easier to understand.

[0094] 16, the entire back surface (more specifically, the concave back surface SD1) of the first front end 3f-1 of the first transport plate 3-1 is exposed and not covered by the first thermally conductive layer 4c-1. Also, in the example shown in FIG. 16, the entire first rear end 3e-1 (more specifically, the first upright portion TP1) is exposed and not covered by the first thermally conductive layer 4c-1. In this case, the area where the first thermally conductive layer 4c-1 is disposed is reduced, and material costs are reduced.

[0095] Alternatively, as illustrated in Figure 17, substantially the entire first back surface 3n-1 of the first transport plate 3-1 may be covered with the first thermally conductive layer 4c-1. In the example shown in Figure 16, the left end 3a-1 and the right end 3b-1 of the first transport plate 3-1 are not irradiated with laser light, and therefore the left end 3a-1 and the right end 3b-1 are not covered with the first thermally conductive layer 4c-1. Of course, the left end 3a-1 and the right end 3b-1 may also be covered with the first thermally conductive layer 4c-1.

[0096] In the example shown in Figure 15 or Figure 17, the first thermally conductive layer 4c-1 (e.g., a copper layer, silver layer, or aluminum layer covering at least a portion of the first back surface 3n-1 of the first transport plate 3-1) quickly diffuses heat from the area of ​​the first transport plate 3-1 irradiated with the laser beam LB to other areas of the first transport plate 3-1. This suppresses local temperature increases in the first transport plate 3-1 and thermoplastic deformation of the first transport plate 3-1. Furthermore, the surface of the first thermally conductive layer 4c-1 quickly dissipates heat from the first transport plate 3-1 to the air surrounding the first transport plate 3-1. In the example shown in Figure 15 or Figure 17, heat conduction in the first thermal conduction layer 4c-1 and heat dissipation from the surface of the first thermal conduction layer 4c-1 suppresses the temperature rise of the first transport plate 3-1, and suppresses thermal deformation and bending of the first transport plate 3-1.

[0097] The first thermally conductive layer 4c-1 includes a plating layer such as a copper plating layer, a silver plating layer, or an aluminum plating layer. The first thermally conductive layer 4c-1 may be a plating layer formed on the first transport plate 3-1 by a wet film-forming method, or a plating layer formed on the first transport plate 3-1 by a dry film-forming method. Alternatively, the first thermally conductive layer 4c-1 may include a thermally conductive plate (e.g., a copper or copper alloy plate, or an aluminum or aluminum alloy plate) attached to the first transport plate 3-1, or a heat-dissipating sheet (e.g., a graphite sheet, a resin heat-dissipating sheet, or a fluororubber heat-dissipating sheet) attached to the first transport plate 3-1. The first thermally conductive layer 4c-1 may also include a layer made of heat-dissipating paint.

[0098] 15, the second temperature rise suppression surface 4-2 includes the surface of the second thermally conductive layer 4c-2 that covers at least a portion of the second back surface 3n-2 of the second transport plate 3-2 (i.e., the surface of the second transport plate 3-2 opposite the second transport surface 3u-2). In other words, at least a portion of the second back surface 4n-2 of the second transport plate 3-2 is covered by the second thermally conductive layer 4c-2.

[0099] The thermal conductivity of the second thermally conductive layer 4c-2 is higher than that of the second transfer plate 3-2. The second thermally conductive layer 4c-2 is made of a material with high thermal conductivity (e.g., copper, silver, or aluminum). The second transfer plate 3-2 is made of, for example, steel, more specifically, a hot-rolled mild steel plate, a cold-rolled steel plate, or a cold-rolled stainless steel plate. The thermal conductivity of the second thermally conductive layer 4c-2 is, for example, 150 W / m·K or more, 200 W / m·K or more, or 300 W / m·K or more.

[0100] 15, the second thermally conductive layer 4c-2 covers a portion of the second back surface 3n-2 of the second transport plate 3-2 (for example, the back surface of the second middle portion 3m-2), while another portion of the second back surface 3n-2 of the second transport plate 3-2 (for example, the back surface of the second front end portion 3f-2) is exposed and not covered by the second thermally conductive layer 4c-2.

[0101] 16, at least a portion of the back surface (more specifically, the flat back surface SN2) of the second intermediate portion 3m-2 is covered with the second thermally conductive layer 4c-2, so that the heat of the second intermediate portion 3m-2 is effectively diffused by the second thermally conductive layer 4c-2.

[0102] 16, the entire back surface (more specifically, the concave back surface SD2) of the second front end 3f-2 of the second transport plate 3-2 is exposed and not covered by the second thermally conductive layer 4c-2. Also, in the example shown in FIG. 16, the entire second rear end 3e-2 (more specifically, the second upright portion TP2) is exposed and not covered by the second thermally conductive layer 4c-2. In this case, the area where the second thermally conductive layer 4c-2 is disposed is reduced, and material costs are reduced.

[0103] Alternatively, as illustrated in FIG. 17, substantially the entire second rear surface 3n-2 of the second transport plate 3-2 may be covered with the second thermally conductive layer 4c-2.

[0104] In the example shown in FIG. 15 or 17, the second thermally conductive layer 4c-2, which covers at least a portion of the second back surface 3n-2 of the second transport plate 3-2, quickly diffuses heat from the area of ​​the second transport plate 3-2 irradiated with the laser beam LB to other areas of the second transport plate 3-2. This suppresses localized temperature increases in the second transport plate 3-2 and thermoplastic deformation of the second transport plate 3-2. Furthermore, the surface of the second thermally conductive layer 4c-2 quickly dissipates heat from the second transport plate 3-2 into the air surrounding the second transport plate 3-2. In the example shown in FIG. 15 or 17, thermal conduction in the second thermally conductive layer 4c-2 and heat dissipation from the surface of the second thermally conductive layer 4c-2 suppresses temperature increases in the second transport plate 3-2 and suppresses thermal deformation and warping of the second transport plate 3-2.

[0105] The second thermally conductive layer 4c-2 includes a plated layer such as a copper-plated layer, a silver-plated layer, or an aluminum-plated layer. Alternatively, the second thermally conductive layer 4c-2 may include a thermally conductive plate (e.g., a copper or copper alloy plate, or an aluminum or aluminum alloy plate) attached to the second transport plate 3-2, or a heat-dissipating sheet (e.g., a graphite sheet, a resin heat-dissipating sheet, or a fluororubber heat-dissipating sheet) attached to the second transport plate 3-2. The second thermally conductive layer 4c-2 may also include a layer made of heat-dissipating paint.

[0106] (Third Example of Temperature Rise Suppression Surface) The third example of the temperature rise suppression surface is a combination of the first example of the temperature rise suppression surface and the second example of the temperature rise suppression surface. In other words, at least a portion of the first transport surface 3u-1 of the first transport plate 3-1 is covered by a first laser reflecting layer 4r-1, and at least a portion of the first back surface 3n-1 of the first transport plate 3-1 is covered by a first thermally conductive layer 4c-1. Furthermore, at least a portion of the second transport surface 3u-2 of the second transport plate 3-2 is covered by a second laser reflecting layer 4r-2, and at least a portion of the second back surface 3n-2 of the second transport plate 3-2 is covered by a second thermally conductive layer 4c-2.

[0107] 18, the first temperature-rise suppression surface 4-1 includes a surface of a first laser reflecting layer 4r-1 covering at least a portion of the first transport surface 3u-1 of the first transport plate 3-1 and a surface of a first thermally conductive layer 4c-1 covering at least a portion of the first back surface 3n-1 of the first transport plate 3-1. The second temperature-rise suppression surface 4-2 includes a surface of a second laser reflecting layer 4r-2 covering at least a portion of the second transport surface 3u-2 of the second transport plate 3-2 and a surface of a second thermally conductive layer 4c-2 covering at least a portion of the second back surface 3n-2 of the second transport plate 3-2.

[0108] In the third example of the temperature-rise-suppressing surface, all of the features described in the first example of the temperature-rise-suppressing surface can be used as the configuration of each of the first laser reflecting layer 4r-1 and the second laser reflecting layer 4r-2. Also, in the third example of the temperature-rise-suppressing surface, all of the features described in the second example of the temperature-rise-suppressing surface can be used as the configuration of each of the first thermally conductive layer 4c-1 and the second thermally conductive layer 4c-2.

[0109] In the first example of the temperature rise suppression surface, the second example of the temperature rise suppression surface, and the third example of the temperature rise suppression surface, the main material of the first transport plate 3-1 is, for example, steel. Also, the main material of the second transport plate 3-2 is, for example, steel. Note that in this specification, the main material of the first transport plate 3-1 refers to the material that accounts for the largest proportion of its weight in the total weight of the first transport plate 3-1. Also, in this specification, the main material of the second transport plate 3-2 refers to the material that accounts for the largest proportion of its weight in the total weight of the second transport plate 3-2.

[0110] In the first example of the temperature rise suppression surface, the second example of the temperature rise suppression surface, or the third example of the temperature rise suppression surface, the first temperature rise suppression surface 4-1 is made of, for example, copper, silver, or aluminum. More specifically, the first temperature rise suppression surface 4-1 is made of copper, a copper alloy, aluminum, or an aluminum alloy. Furthermore, the second temperature rise suppression surface 4-2 is made of, for example, copper, silver, or aluminum. More specifically, the second temperature rise suppression surface 4-2 is made of copper, a copper alloy, aluminum, or an aluminum alloy.

[0111] When the main material of the first conveying plate 3-1 is steel and the first temperature rise suppression surface 4-1 is made of copper, silver or aluminum, all of the strength requirements, formability requirements, manufacturing cost requirements, and temperature rise suppression requirements of the first conveying plate 3-1 can be met.

[0112] When the main material of the second conveying plate 3-2 is steel and the second temperature rise suppression surface 4-2 is made of copper, silver or aluminum, all of the strength requirements, formability requirements, manufacturing cost requirements, and temperature rise suppression requirements of the second conveying plate 3-2 can be met.

[0113] (Fourth Example of Temperature Rise Suppression Surface) In the example shown in FIG. 19, the first temperature rise suppression surface 4-1 includes the surface of the first heat dissipation member 5-1 that is arranged in contact with at least a portion of the first back surface 3n-1 of the first transport plate 3-1.

[0114] 19, the dross transport conveyor 2A includes a first heat dissipation member 5-1 supported by a first transport plate 3-1. The first transport plate 3-1 has a contact surface 31t that contacts the first heat dissipation member 5-1. The contact surface 31t also includes at least a portion of the first back surface 3n-1 of the first transport plate 3-1.

[0115] The first heat dissipation member 5-1 is attached to the first transport plate 3-1. The first heat dissipation member 5-1 may be attached to the first transport plate 3-1 by welding, or may be attached to the first transport plate 3-1 via an attachment member such as a bolt or an adhesive sheet.

[0116] 19, the first heat dissipation member 5-1 includes a first heat sink 50-1. The first heat sink 50-1 may have a first base portion 51-1 and a plurality of first heat dissipation pieces 52-1 (for example, a plurality of heat dissipation pins 52p-1 described below or a plurality of heat dissipation fins 52f-1 described below) arranged on the first base portion 51-1. In addition to the first heat sink 50-1, the first heat dissipation member 5-1 may also include a heat dissipation sheet (more specifically, a heat conduction sheet with high thermal conductivity) arranged between the first heat sink 50-1 and the first transfer plate 3-1. The first heat sink 50-1 is made of, for example, aluminum, copper, or ceramics.

[0117] 20, the first heat dissipation member 5-1 includes a plurality of heat dissipation protrusions (more specifically, a plurality of heat dissipation fins 52p-1). Each of the plurality of heat dissipation protrusions (more specifically, a plurality of heat dissipation fins 52p-1) protrudes, for example, in the fourth direction DR4. Alternatively, as illustrated in FIG. 21, the first heat dissipation member 5-1 may include a plurality of heat dissipation fins 52f-1. Each of the plurality of heat dissipation fins 52f-1 protrudes, for example, in the fourth direction DR4.

[0118] In the example shown in FIG. 20 or 21, the first heat dissipation member 5-1 is disposed in contact with at least a part of the first intermediate portion 3m-1 (more specifically, the first flat plate portion FP1) of the first transport plate 3-1.

[0119] 19, the first heat dissipation member 5-1 receives heat from the first transport plate 3-1 and dissipates the received heat into the air surrounding the first heat dissipation member 5-1. In this way, the surface (i.e., the heat dissipation surface) of the first heat dissipation member 5-1 suppresses a temperature rise in the first transport plate 3-1 caused by laser irradiation, and suppresses thermal deformation and bending of the first transport plate 3-1.

[0120] In the example shown in FIG. 19, the second temperature rise suppression surface 4-2 includes the surface of the second heat dissipation member 5-2 that is arranged in contact with at least a portion of the second rear surface 3n-2 of the second transport plate 3-2.

[0121] 19, the dross transport conveyor 2A includes a second heat dissipation member 5-2 supported by a second transport plate 3-2. The second transport plate 3-2 has a contact surface 32t that contacts the second heat dissipation member 5-2. The contact surface 32t also includes at least a portion of the second back surface 3n-2 of the second transport plate 3-2.

[0122] The second heat dissipation member 5-2 is attached to the second transfer plate 3-2. The second heat dissipation member 5-2 may be attached to the second transfer plate 3-2 by welding, or may be attached to the second transfer plate 3-2 via an attachment member such as a bolt or an adhesive sheet.

[0123] 19, the second heat dissipation member 5-2 includes a second heat sink 50-2. The second heat sink 50-2 may have a second base portion 51-2 and a plurality of second heat dissipation pieces 52-2 (e.g., a plurality of heat dissipation pins or a plurality of heat dissipation fins) arranged on the second base portion 51-2. In addition to the second heat sink 50-2, the second heat dissipation member 5-2 may also include a heat dissipation sheet (more specifically, a heat conduction sheet with high thermal conductivity) arranged between the second heat sink 50-2 and the second transfer plate 3-2. The second heat sink 50-2 is made of, for example, aluminum, copper, or ceramics.

[0124] 22, the second heat dissipation member 5-2 includes a plurality of heat dissipation protrusions (more specifically, a plurality of heat dissipation fins 52p-2). Each of the plurality of heat dissipation protrusions (more specifically, a plurality of heat dissipation fins 52p-2) protrudes, for example, in the fourth direction DR4. Alternatively, as illustrated in FIG. 23, the second heat dissipation member 5-2 may include a plurality of heat dissipation fins 52f-2. Each of the plurality of heat dissipation fins 52f-2 protrudes, for example, in the fourth direction DR4.

[0125] In the example shown in FIG. 22 or 23, the second heat dissipation member 5-2 is disposed in contact with at least a part of the second intermediate portion 3m-2 (more specifically, the second flat plate portion FP2) of the second transport plate 3-2.

[0126] 19, the second heat dissipation member 5-2 receives heat from the second transport plate 3-2 and dissipates the received heat into the air surrounding the second heat dissipation member 5-2. In this way, the surface (i.e., the heat dissipation surface) of the second heat dissipation member 5-2 suppresses a temperature rise in the second transport plate 3-2 caused by laser irradiation, and suppresses thermal deformation and bending of the second transport plate 3-2.

[0127] (Fifth Example of Temperature Rise Suppression Surface) In the first to fourth examples of the temperature rise suppression surface, a first temperature rise suppression surface 4-1 is provided separately from the first transport plate 3-1, and a second temperature rise suppression surface 4-2 is provided separately from the second transport plate 3-2. In the fifth example of the temperature rise suppression surface, the first transport plate 3-1 itself has a temperature rise suppression surface that suppresses a temperature rise of the first transport plate 3-1, and the second transport plate 3-2 itself has a temperature rise suppression surface that suppresses a temperature rise of the second transport plate 3-2.

[0128] 24, the first transfer plate 3-1 is mainly made of copper or aluminum. More specifically, the first transfer plate 3-1 is made of copper or a copper alloy, or aluminum or an aluminum alloy.

[0129] In the example shown in Figure 24, at least a portion of the first transport surface 3u-1 of the first transport plate 3-1 is made of copper or aluminum. The entire first transport surface 3u-1 of the first transport plate 3-1 may be made of copper or aluminum. In the example shown in Figure 24, the copper or aluminum surface that constitutes at least a portion of the first transport surface 3u-1 of the first transport plate 3-1 is a temperature rise suppression surface with high laser reflectivity. The copper or aluminum surface effectively reflects the laser LB emitted from the laser irradiation device 60.

[0130] 24, the main material of the second transfer plate 3-2 is copper or aluminum. More specifically, the second transfer plate 3-2 is made of copper or a copper alloy, or aluminum or an aluminum alloy.

[0131] In the example shown in Figure 24, at least a portion of the second transport surface 3u-2 of the second transport plate 3-2 is made of copper or aluminum. The entire second transport surface 3u-2 of the second transport plate 3-2 may be made of copper or aluminum. In the example shown in Figure 24, the copper or aluminum surface that constitutes at least a portion of the second transport surface 3u-2 of the second transport plate 3-2 is a temperature rise suppression surface with high laser reflectivity. The copper or aluminum surface effectively reflects the laser LB emitted from the laser irradiation device 60.

[0132] When the first transport plate 3-1 is primarily made of copper or aluminum, the first transport plate 3-1 has high laser reflectivity and high thermal conductivity, so the first transport plate 3-1 itself suppresses the temperature rise of the first transport plate 3-1.

[0133] If the second transport plate 3-2 is primarily made of copper or aluminum, the second transport plate 3-2 has high laser reflectivity and high thermal conductivity, and therefore the second transport plate 3-2 itself suppresses the temperature rise of the second transport plate 3-2.

[0134] 25, the orbit OB of the group of transport plates 3 may include an upward slope CL that increases in height from the processing region RG1 toward the discharge region RG2. When the orbit OB includes an upward slope CL, it is easy to arrange, in the discharge region RG2, a container 13 that receives the dross D from the dross transport conveyor 2A, or a second transport conveyor 15 (see FIG. 31 if necessary) that receives the dross D from the dross transport conveyor 2A.

[0135] 1 , the laser processing apparatus 1A includes a dross transport conveyor 2A, a laser irradiation device 60, a moving device 7, and a control device 8. Additionally, the laser processing apparatus 1A may include a workpiece support member 90.

[0136] The dross transport conveyor 2A has already been explained, so a repeated explanation of the dross transport conveyor 2A will be omitted.

[0137] 26 , the laser irradiation device 60 has a laser head 61, and the laser head 61 has an emission port OP for emitting a laser. The laser irradiation device 60 may include a laser light source 63 and an optical component 65 (e.g., an optical fiber) that transmits a laser from the laser light source 63 to the laser head 61.

[0138] The moving device 7 moves the laser head 61 relative to the workpiece support member 90. The moving device 7 also moves the laser head 61 relative to the workpiece W supported by the workpiece support member 90. The workpiece W supported by the workpiece support member 90 is, for example, a plate material.

[0139] In the example shown in FIG. 26, the moving device 7 has a moving body (71a; 73a) that supports the laser head 61, and a driving device (71b; 73b) that moves the moving body (71a; 73a).

[0140] 26, the moving device 7 includes a first moving device 71. The first moving device 71 includes a first moving body 71a that supports the laser head 61, and a first driving device 71b (e.g., a first motor) that moves the first moving body 71a.

[0141] 26 , the first moving body 71a functions as a Z saddle, and the first driving device 71b functions as a Z-axis driving unit. The first driving device 71b moves the first moving body 71a in a direction parallel to the vertical direction (in other words, the Z-axis direction). More specifically, the first driving device 71b can move the first moving body 71a downward so that the first moving body 71a approaches the workpiece support member 90. The first driving device 71b can also move the first moving body 71a upward so that the first moving body 71a moves away from the workpiece support member 90.

[0142] 26 , the moving device 7 includes a second moving device 73. The second moving device 73 includes a second moving body 73 a and a second driving device 73 b (e.g., a second motor) that moves the second moving body 73 a. The second moving body 73 a supports the first moving body 71 a so that the first moving body 71 a can move in a direction parallel to the vertical direction.

[0143] 26, the second moving body 73a functions as a Y saddle, and the second driving device 73b functions as a Y-axis driving unit. The second driving device 73b moves the second moving body 73a in a direction parallel to the horizontal plane (more specifically, in the Y-axis direction).

[0144] 27 , the moving device 7 includes a third moving device 75. The third moving device 75 includes a third moving body 75a and a third driving device 75b (e.g., a third motor) that moves the third moving body 75a. The third moving body 75a supports the second moving body 73a so that the second moving body 73a can move in a direction parallel to the Y-axis direction.

[0145] 27, the third movable body 75a functions as an X saddle, and the third driving device 75b functions as an X-axis driving unit. The third driving device 75b moves the third movable body 75a in a direction parallel to the horizontal plane (more specifically, in the X-axis direction perpendicular to the Z-axis and Y-axis).

[0146] As illustrated in Fig. 26, the third movable body 75a may be configured as a gate-shaped structure. In the example illustrated in Fig. 27, the third movable body 75a is movable across the processing region RG1 in a plan view. The third movable body 75a is supported by the base 70 so as to be movable in a direction parallel to the X-axis direction.

[0147] 28, the workpiece support member 90 includes a pin holder for supporting a workpiece W, which is a plate material. The pin holder has a plurality of tops 92 for supporting the workpiece W, which is a plate material.

[0148] 28, the workpiece support member 90 has a plurality of plate members 91 arranged in an upright position relative to a horizontal plane (for example, the XY plane in FIG. 28). Each of the plurality of plate members 91 has a sawtooth edge portion EG.

[0149] The workpiece support member 90 may have 10 or more plate members 91 arranged to stand on a horizontal plane, or may have 20 or more plate members 91 arranged to stand on a horizontal plane. Each plate member 91 is made of, for example, metal.

[0150] 28 , the workpiece support member 90 is a movable pallet PT. The pallet PT has a plurality of plate members 91 and a frame 93 to which the plate members 91 are attached. The bottom of the frame 93 defines a bottom opening. Dross D generated by irradiating the workpiece W with the laser LB falls toward the dross transport conveyor 2A through the space between two adjacent plate members 91 and the bottom opening defined by the frame 93.

[0151] As illustrated in FIG. 29 , the laser processing apparatus 1A may include a transfer device 11 that transfers the workpiece support member 90. The transfer device 11 transfers the workpiece support member 90 from the processing region RG1 to the removal region RG3. Thereafter, the machined workpiece Wb (more specifically, the machined plate material) is removed from the workpiece support member 90 arranged in the removal region RG3. As illustrated in FIG. 30 , the removal may be performed using a suction cup 121 that can suction the machined workpiece Wb, or may be performed using a fork that can scoop up the machined workpiece Wb. Alternatively, the removal may be performed by a robot or an operator.

[0152] 30, the laser processing apparatus 1A has a workpiece transfer device 12 (e.g., a robot hand) that transfers a workpiece before processing and a processed workpiece Wb. The workpiece transfer device 12 may be a plate material transfer device 12a that transfers a workpiece that is a plate material. The plate material transfer device 12a may have a plurality of suction cups 121 that adsorb the workpiece that is a plate material, or forks that support the workpiece that is a plate material from below.

[0153] 1, the laser processing apparatus 1A has a container 13 that receives the dross D from the dross transport conveyor 2A. The container 13 is disposed directly below the dross transport conveyor 2A in the discharge region RG2.

[0154] The laser processing apparatus 1A may have a second transfer conveyor 15 that receives the dross D from the dross transport conveyor 2A. In the example shown in Fig. 31, the dross transport surface of the second transfer conveyor 15 is disposed directly below the dross transport conveyor 2A in the discharge area RG2. In the example shown in Fig. 31, the second transfer conveyor 15 transports the dross received from the dross transport conveyor 2A to the container 13.

[0155] 32, the control device 8 controls the laser irradiation device 60 and the moving device 7 (e.g., the first driving device 71b, the second driving device 73b, and the third driving device 75b). The control device 8 may also control the transfer device 11 (see FIG. 29) that transfers the work support member 90 and / or the work transfer device 12 (see FIG. 30) that transfers the workpiece W. The control device 8 may also control the drive device 29 of the dross transport conveyor 2A.

[0156] 33 , the control device 8 transmits an emission command R1 to the laser irradiation device 60 (e.g., the laser light source 63), thereby causing the laser head 61 to emit the laser beam LB. More specifically, the control device 8 transmits the emission command R1 to the laser irradiation device 60 (e.g., the laser light source 63), and the laser irradiation device 60 that receives the emission command R1 emits the laser beam LB from the laser head 61 (more specifically, from the emission port of the laser head 61).

[0157] 33 , the control device 8 moves the laser head 61 by transmitting a movement command S to the moving device 7. More specifically, the control device 8 transmits the movement command S to the moving device 7, and the moving device 7 that receives the movement command S moves the laser head 61.

[0158] As illustrated in FIG. 33 , the control device 8 includes a hardware processor 80 (hereinafter simply referred to as the "processor 80"), a memory 82, a communication circuit 84, and an input device 86 (e.g., a touch-panel display 862). The processor 80, the memory 82, the communication circuit 84, and the input device 86 are connected to one another via a bus 88. Data necessary for machining the workpiece W (e.g., workpiece data 826 including shape data of the workpiece W and machining position data of the workpiece W) may be input to the control device 8 via the input device 86, or may be input to the control device 8 from another computer via the communication circuit 84. Note that the input device 86 is not limited to the touch-panel display 862. For example, the control device 8 may include an input device 86 such as a button, a switch, a lever, a pointing device, or a keyboard, and a display that displays the data input to the input device 86 or other information.

[0159] The memory 82 stores data such as workpiece data 826 and programs such as a machining program 822. The memory 82 is a storage medium readable by the processor 80 of the control device 8. The memory 82 may be, for example, a non-volatile or volatile semiconductor memory such as a RAM, a ROM, or a flash memory, a magnetic disk, or any other type of memory.

[0160] The processor 80 of the control device 8 executes the machining program 822 stored in the memory 82, causing the control device 8 to generate control commands. Furthermore, the communication circuit 84 transmits the control commands to the devices to be controlled (more specifically, the laser irradiation device 60, the moving device 7, the transport device 11, the workpiece transport device 12, the driving device 29, etc.). In this way, the processor 80 executes the machining program 822, allowing the control device 8 to control the laser irradiation device 60, the moving device 7, the transport device 11, the workpiece transport device 12, the driving device 29, etc.

[0161] The control device 8 may control the moving speed of the first group of transport plates 3 in conjunction with the control of at least one of the laser irradiation device 60 and the moving device 7 .

[0162] For example, the control device 8 may control the drive device 29 so that the first group of transport plates 3 moves at a first speed (a speed other than zero) when the laser irradiation device 60 stops emitting the laser LB, and may control the drive device 29 so that the first group of transport plates 3 moves at a second speed faster than the first speed when the laser irradiation device 60 emits the laser LB.

[0163] For example, the control device 8 may control the drive device 29 so that the movement speed of the first group of conveying plates 3 is changed depending on the magnitude of the output of the laser LB emitted by the laser irradiation device 60 or the type of processing performed by the laser irradiation device 60 (for example, whether it is drilling, cutting, etc.).

[0164] (Cooling Device 95) As illustrated in FIG. 34, the laser processing apparatus 1A may have a cooling device 95 that forcibly cools the group of transport plates 3.

[0165] For example, the laser processing apparatus 1A may include an air-cooling type cooling device 95a that blows air onto the group of transport plates 3. In the example shown in Fig. 34, the cooling device 95a has an air injection device 96 that blows air onto the back surface 3n of each of the group of transport plates 3. Alternatively, or additionally, the cooling device 95a may have an air injection device that blows air onto the transport surface 3u of each of the group of transport plates 3.

[0166] Alternatively, or additionally, the laser processing apparatus 1A may include a liquid-cooling type cooling device 95b that cools the group of transport plates 3 with liquid. In the example shown in Fig. 34, the cooling device 95b has a liquid tank 97 (e.g., a water tank) that is arranged so that the orbit of the group of transport plates 3 crosses it. The group of transport plates 3 is cooled by passing through the liquid (e.g., water) in the liquid tank 97. Furthermore, the liquid adhering to the surfaces of the group of transport plates 3 is vaporized by laser irradiation (heat of vaporization), thereby suppressing a rise in temperature of the transport plates 3.

[0167] Second Embodiment A dross transport conveyor 2B and a laser processing apparatus 1B according to a second embodiment will be described with reference to Figs. 35 to 41. Fig. 35 is a schematic cross-sectional view showing a laser processing apparatus 1B according to the second embodiment. Fig. 36 is a schematic cross-sectional view showing a portion of the laser processing apparatus 1B according to the second embodiment. Fig. 37 is an exploded perspective view showing a portion of a group of transport plates 3. Fig. 38 is a schematic perspective view showing a state in which a group of transport plates 3 including a first transport plate 3-1 and a second transport plate 3-2 can move along an orbit OB. Figs. 39 to 41 are schematic cross-sectional views showing a portion of the laser processing apparatus 1B according to the second embodiment.

[0168] The dross transport conveyor 2B of the second embodiment differs from the dross transport conveyor 2A of the first embodiment in that each of the group of transport plates 3 is hingedly connected to the other transport plates.

[0169] In the second embodiment, differences from the first embodiment will be mainly described. On the other hand, in the second embodiment, repeated descriptions of matters already described in the first embodiment will be omitted. Therefore, it goes without saying that matters already described in the first embodiment can be applied to the second embodiment even if they are not explicitly described in the second embodiment. Conversely, all matters described in the second embodiment can be applied to the first embodiment.

[0170] In the example shown in Figures 35 and 36, the dross transporting conveyor 2B in the second embodiment is equipped with a group of transport plates 3 that transport dross generated by irradiating a workpiece with a laser, and the group of transport plates 3 includes a first transport plate 3-1 extending in a first direction DR1 and a second transport plate 3-2 arranged adjacent to the first transport plate 3-1 and extending in the first direction DR1.

[0171] As illustrated in FIG. 36, the dross transport conveyor 2B includes a first temperature rise suppression surface 4-1 and a second temperature rise suppression surface 4-2.

[0172] The first temperature rise suppression surface 4-1 covers at least a part of the first transfer plate 3-1 and suppresses the temperature rise of the first transfer plate 3-1 caused by the energy of the laser LB.

[0173] The second temperature rise suppression surface 4-2 covers at least a part of the second transfer plate 3-2 and suppresses the temperature rise of the second transfer plate 3-2 caused by the energy of the laser LB.

[0174] In the example shown in Figure 35, the laser processing apparatus 1B in the second embodiment includes the above-mentioned dross transport conveyor 2B, a laser irradiation device 60 including a laser head 61 that irradiates a laser toward the workpiece W, a moving device 7 that moves the laser head 61 relative to a workpiece support member 90 that supports the workpiece W, and a control device 8 that controls the laser irradiation device 60 and the moving device 7.

[0175] Therefore, the dross transport conveyor 2B and the laser processing device 1B in the second embodiment have the same effects as the dross transport conveyor 2A and the laser processing device 1A in the first embodiment.

[0176] As illustrated in Figure 37, the first rear end 3e-1 of the first transport plate 3-1 and the second front end 3f-2 of the second transport plate 3-2 are hingedly connected. In the example shown in Figure 37, a rod (hereinafter referred to as the "second rod RD2") is arranged so that it passes through both the first rear end 3e-1 of the first transport plate 3-1 and the second front end 3f-2 of the second transport plate 3-2, thereby hinge-connecting the first rear end 3e-1 of the first transport plate 3-1 and the second front end 3f-2 of the second transport plate 3-2. Furthermore, a rod (hereinafter referred to as the "third rod RD3") is arranged so that it passes through both the second rear end 3e-2 of the second transport plate 3-2 and the third front end 3f-3 of the third transport plate 3-3, thereby hinge-connecting the second rear end 3e-2 of the second transport plate 3-2 and the third front end 3f-3 of the third transport plate 3-3.

[0177] (Optional Additional Configuration) Next, optional additional configurations that can be employed in the dross transport conveyor 2B and the laser processing apparatus 1B in the second embodiment will be described with reference to FIGS.

[0178] 35, a portion of the dross transport conveyor 2B is disposed directly below the laser irradiation device 60. Furthermore, one group of transport plates 3 of the dross transport conveyor 2B is configured to be movable across the processing region RG1 (more specifically, the region directly below the laser irradiation device 60).

[0179] In the example shown in Fig. 35, the first group of transport plates 3 transports dross from the processing region RG1 to the discharge region RG2. In the example shown in Fig. 35, each of the first group of transport plates 3 is reversed in the discharge region RG2 (more specifically, turned 180 degrees around the horizontal axis). As a result, the dross D transported by the first group of transport plates 3 is discharged from the first group of transport plates 3 in the discharge region RG2. Note that when the first group of transport plates 3 transports cut-off pieces CF (see Fig. 36), the cut-off pieces CF are also discharged from the first group of transport plates 3 in the discharge region RG2.

[0180] 38 , the dross transport conveyor 2B includes a first endless member 21 (more specifically, a first endless chain 21a), a second endless member 22 (more specifically, a second endless chain 22a), and a drive device 29. The first endless member 21 and the second endless member 22 support a group of transport plates 3. More specifically, the group of transport plates 3 is attached to the first endless member 21 and the second endless member 22.

[0181] The first endless member 21 and the second endless member 22 are driven directly or indirectly by a driving device 29. The first endless member 21, the second endless member 22, and the driving device 29 have already been described in the first embodiment, so a repeated description of these configurations will be omitted.

[0182] (First group of transport plates 3) The first group of transport plates 3 moves along an orbital path OB. As illustrated in Fig. 38, the orbital path OB of the first group of transport plates 3 is parallel to the first orbital path B1 of the first endless chain 21a and parallel to the second orbital path B2 of the second endless chain 22a. In the example shown in Fig. 35, the first group of transport plates 3 are arranged in a continuous manner to form a circular transport body.

[0183] The length of each of the group of transport plates 3 is, for example, 1 m or more and 3 m or less. The width of each of the group of transport plates 3 is, for example, 40 mm or more and 200 mm or less. The plate thickness of each of the group of transport plates 3 (more specifically, the plate thickness of the middle portion 3 m of each of the group of transport plates 3) is, for example, 5 mm or less or 3 mm or less. Each of the group of transport plates 3 is made of metal. Each of the group of transport plates 3 is made of, for example, steel, more specifically, hot-rolled mild steel plate, cold-rolled steel plate, or cold-rolled stainless steel plate.

[0184] 37, the first transport plate 3-1 has a first front end 3f-1, a first rear end 3e-1, and a first intermediate portion 3m-1 connecting the first front end 3f-1 and the first rear end 3e-1. The first front end 3f-1 of the first transport plate 3-1 is formed with a plurality of front receiving portions 30f-1 (more specifically, a plurality of through-holes into which the first rod RD1 is inserted) for receiving the first rod RD1. Furthermore, the first rear end 3e-1 of the first transport plate 3-1 is formed with a plurality of rear receiving portions 30e-1 (more specifically, a plurality of through-holes into which the second rod RD2 is inserted).

[0185] 37, the second transport plate 3-2 has a second front end 3f-2, a second rear end 3e-2, and a second intermediate portion 3m-2 connecting the second front end 3f-2 and the second rear end 3e-2. The second front end 3f-2 of the second transport plate 3-2 is formed with a plurality of front receiving portions 30f-2 (more specifically, a plurality of through-holes into which the second rod RD2 is inserted) for receiving the second rod RD2. The second rear end 3e-2 of the second transport plate 3-2 is formed with a plurality of rear receiving portions 30e-2 (more specifically, a plurality of through-holes into which the third rod RD3 is inserted) for receiving the third rod RD3.

[0186] 36, the first temperature-rise suppression surface 4-1 includes a surface of a first laser reflecting layer 4r-1 that covers at least a portion of the first transport surface 3u-1 of the first transport plate 3-1. In other words, at least a portion of the first transport surface 3u-1 of the first transport plate 3-1 is covered by the first laser reflecting layer 4r-1.

[0187] The first laser reflecting layer 4r-1, which covers at least a portion of the first transfer plate 3-1, is made of a material with high laser reflectivity (e.g., copper, silver, or aluminum). The first transfer plate 3-1 is made of, for example, steel, more specifically, a hot-rolled mild steel plate, a cold-rolled steel plate, or a cold-rolled stainless steel plate.

[0188] The laser reflectivity of the first laser reflective layer 4r-1 is higher than the laser reflectivity of the first conveying plate 3-1, and is, for example, 70% or more, 80% or more, or 90% or more.

[0189] The first laser reflective layer 4r-1 may cover only a portion of the first transport surface 3u-1 of the first transport plate 3-1 (for example, the transport surface of the first intermediate portion 3m-1 of the first transport plate 3-1). Alternatively, the first laser reflective layer 4r-1 may cover the entire first transport surface 3u-1 of the first transport plate 3-1. In the example shown in Figure 36, the first laser reflective layer 4r-1 covers at least a portion of the flat transport surface SF1 of the first transport plate 3-1.

[0190] The first laser reflective layer 4r-1 has already been described in the first embodiment, so a repeated description of the first laser reflective layer 4r-1 will be omitted.

[0191] 36, the second temperature rise suppression surface 4-2 includes the surface of the second laser reflecting layer 4r-2 that covers at least a portion of the second transport surface 3u-2 of the second transport plate 3-2. In other words, at least a portion of the second transport surface 3u-2 of the second transport plate 3-2 is covered by the second laser reflecting layer 4r-2.

[0192] The second laser reflecting layer 4r-2, which covers at least a portion of the second transfer plate 3-2, is made of a material with high laser reflectivity (e.g., copper, silver, or aluminum). The second transfer plate 3-2 is made of, for example, steel, more specifically, a hot-rolled mild steel plate, a cold-rolled steel plate, or a cold-rolled stainless steel plate.

[0193] The laser reflectivity of the second laser reflective layer 4r-2 is higher than the laser reflectivity of the second transfer plate 3-2, and is, for example, 70% or more, 80% or more, or 90% or more.

[0194] The second laser reflective layer 4r-2 may cover only a portion of the second transport surface 3u-2 of the second transport plate 3-2 (for example, the transport surface of the second intermediate portion 3m-2 of the second transport plate 3-2). Alternatively, the second laser reflective layer 4r-2 may cover the entire second transport surface 3u-2 of the second transport plate 3-2. In the example shown in Figure 36, the second laser reflective layer 4r-2 covers at least a portion of the flat transport surface SF2 of the second transport plate 3-2.

[0195] The second laser reflective layer 4r-2 has already been described in the first embodiment, so a repeated description of the second laser reflective layer 4r-2 will be omitted.

[0196] 39, the first temperature-rise suppression surface 4-1 includes the surface of the first thermally conductive layer 4c-1 that covers at least a portion of the first back surface 3n-1 of the first transport plate 3-1 (i.e., the surface of the first transport plate 3-1 opposite the first transport surface 3u-1). In other words, at least a portion of the first back surface 4n-1 of the first transport plate 3-1 is covered by the first thermally conductive layer 4c-1.

[0197] The thermal conductivity of the first thermally conductive layer 4c-1 is higher than that of the first transfer plate 3-1. The first thermally conductive layer 4c-1 is made of a material with high thermal conductivity (e.g., copper, silver, or aluminum). The first transfer plate 3-1 is made of, for example, steel, more specifically, a hot-rolled mild steel plate, a cold-rolled steel plate, or a cold-rolled stainless steel plate.

[0198] The first thermally conductive layer 4c-1 may cover only a portion of the first back surface 3n-1 of the first transport plate 3-1 (for example, the back surface of the first intermediate portion 3m-1 of the first transport plate 3-1), or alternatively, the first thermally conductive layer 4c-1 may cover the entire first back surface 3n-1 of the first transport plate 3-1.

[0199] The first thermally conductive layer 4c-1 has already been described in the first embodiment, so a repeated description of the first thermally conductive layer 4c-1 will be omitted.

[0200] 39, the second temperature rise suppression surface 4-2 includes the surface of the second thermally conductive layer 4c-2 that covers at least a portion of the second back surface 3n-2 of the second transport plate 3-2 (i.e., the surface of the second transport plate 3-2 opposite the second transport surface 3u-2). In other words, at least a portion of the second back surface 4n-2 of the second transport plate 3-2 is covered by the second thermally conductive layer 4c-2.

[0201] The thermal conductivity of the second thermally conductive layer 4c-2 is higher than that of the second transfer plate 3-2. The second thermally conductive layer 4c-2 is made of a material with high thermal conductivity (e.g., copper, silver, or aluminum). The second transfer plate 3-2 is made of, for example, steel, more specifically, a hot-rolled mild steel plate, a cold-rolled steel plate, or a cold-rolled stainless steel plate.

[0202] The second thermally conductive layer 4c-2 may cover only a portion of the second back surface 3n-2 of the second transport plate 3-2 (for example, the back surface of the second intermediate portion 3m-2 of the second transport plate 3-2), or alternatively, the second thermally conductive layer 4c-2 may cover the entire second back surface 3n-2 of the second transport plate 3-2.

[0203] The second thermally conductive layer 4c-2 has already been described in the first embodiment, so a repeated description of the second thermally conductive layer 4c-2 will be omitted.

[0204] (Third Example of Temperature Rise Suppression Surface) The third example of the temperature rise suppression surface is a combination of the first example of the temperature rise suppression surface and the second example of the temperature rise suppression surface. For example, as illustrated in Figure 39, at least a portion of the first transport surface 3u-1 of the first transport plate 3-1 is covered by a first laser reflecting layer 4r-1, and at least a portion of the first back surface 3n-1 of the first transport plate 3-1 is covered by a first thermally conductive layer 4c-1. Furthermore, at least a portion of the second transport surface 3u-2 of the second transport plate 3-2 is covered by a second laser reflecting layer 4r-2, and at least a portion of the second back surface 3n-2 of the second transport plate 3-2 is covered by a second thermally conductive layer 4c-2.

[0205] In the first example of the temperature rise suppression surface, the second example of the temperature rise suppression surface, or the third example of the temperature rise suppression surface, the first transfer plate 3-1 is primarily made of steel, for example, and the second transfer plate 3-2 is primarily made of steel, for example.

[0206] In the first example of the temperature rise suppression surface, the second example of the temperature rise suppression surface, or the third example of the temperature rise suppression surface, the first temperature rise suppression surface 4-1 is made of, for example, copper, silver, or aluminum. More specifically, the first temperature rise suppression surface 4-1 is made of copper, a copper alloy, aluminum, or an aluminum alloy. Furthermore, the second temperature rise suppression surface 4-2 is made of, for example, copper, silver, or aluminum. More specifically, the second temperature rise suppression surface 4-2 is made of copper, a copper alloy, aluminum, or an aluminum alloy.

[0207] (Fourth Example of Temperature Rise Suppression Surface) In the example shown in FIG. 40, the first temperature rise suppression surface 4-1 includes the surface of the first heat dissipation member 5-1 that is arranged in contact with at least a portion of the first back surface 3n-1 of the first transport plate 3-1.

[0208] 40, the dross transport conveyor 2B includes a first heat dissipation member 5-1 supported by a first transport plate 3-1. The first transport plate 3-1 has a contact surface 31t that contacts the first heat dissipation member 5-1. The contact surface 31t also includes at least a portion of the first back surface 3n-1 of the first transport plate 3-1.

[0209] The first heat dissipation member 5-1 is attached to the first transport plate 3-1. The first heat dissipation member 5-1 may be attached to the first transport plate 3-1 by welding, or may be attached to the first transport plate 3-1 via an attachment member such as a bolt or an adhesive sheet.

[0210] 40, the first heat dissipation member 5-1 includes a first heat sink 50-1. The first heat sink 50-1 may have a first base 51-1 and a plurality of first heat dissipation pieces 52-1 arranged on the first base 51-1. In addition to the first heat sink 50-1, the first heat dissipation member 5-1 may also include a heat dissipation sheet (more specifically, a thermally conductive sheet with high thermal conductivity) arranged between the first heat sink 50-1 and the first transfer plate 3-1. The first heat sink 50-1 is made of, for example, aluminum, copper, or ceramics.

[0211] In the example shown in FIG. 40, the first heat dissipation member 5-1 is disposed in contact with at least a part of the first intermediate portion 3m-1 (more specifically, the first flat plate portion FP1) of the first transport plate 3-1.

[0212] The first heat dissipation member 5-1 has already been described in the first embodiment, so a repeated description of the first heat dissipation member 5-1 will be omitted.

[0213] In the example shown in FIG. 40, the second temperature rise suppression surface 4-2 includes the surface of the second heat dissipation member 5-2 that is arranged in contact with at least a portion of the second rear surface 3n-2 of the second transport plate 3-2.

[0214] 40, the dross transport conveyor 2B includes a second heat dissipation member 5-2 supported by a second transport plate 3-2. The second transport plate 3-2 has a contact surface 32t that contacts the second heat dissipation member 5-2. The contact surface 32t also includes at least a portion of the second back surface 3n-2 of the second transport plate 3-2.

[0215] The second heat dissipation member 5-2 is attached to the second transfer plate 3-2. The second heat dissipation member 5-2 may be attached to the second transfer plate 3-2 by welding, or may be attached to the second transfer plate 3-2 via an attachment member such as a bolt or an adhesive sheet.

[0216] 40, the second heat dissipation member 5-2 includes a second heat sink 50-2. The second heat sink 50-2 may have a second base 51-2 and a plurality of second heat dissipation pieces 52-2 arranged on the second base 51-2. In addition to the second heat sink 50-2, the second heat dissipation member 5-2 may also include a heat dissipation sheet (more specifically, a thermally conductive sheet with high thermal conductivity) arranged between the second heat sink 50-2 and the second transfer plate 3-2. The second heat sink 50-2 is made of, for example, aluminum, copper, or ceramics.

[0217] In the example shown in FIG. 40, the second heat dissipation member 5-2 is disposed in contact with at least a part of the second intermediate portion 3m-2 (more specifically, the second flat plate portion FP2) of the second transport plate 3-2.

[0218] The second heat dissipation member 5-2 has already been described in the first embodiment, so a repeated description of the second heat dissipation member 5-2 will be omitted.

[0219] (Fifth Example of Temperature Rise Suppression Surface) In the first to fourth examples of the temperature rise suppression surface, a first temperature rise suppression surface 4-1 is provided separately from the first transport plate 3-1, and a second temperature rise suppression surface 4-2 is provided separately from the second transport plate 3-2. In the fifth example of the temperature rise suppression surface, the first transport plate 3-1 itself has a temperature rise suppression surface that suppresses a temperature rise of the first transport plate 3-1, and the second transport plate 3-2 itself has a temperature rise suppression surface that suppresses a temperature rise of the second transport plate 3-2.

[0220] 41, the first transfer plate 3-1 is mainly made of copper or aluminum. More specifically, the first transfer plate 3-1 is made of copper or a copper alloy, or aluminum or an aluminum alloy.

[0221] 41, at least a portion of the first transport surface 3u-1 of the first transport plate 3-1 is made of copper, a copper alloy, aluminum, or an aluminum alloy. The entire first transport surface 3u-1 of the first transport plate 3-1 may be made of copper, a copper alloy, aluminum, or an aluminum alloy. In the example shown in FIG. 41, the copper surface or aluminum surface that constitutes at least a portion of the first transport surface 3u-1 of the first transport plate 3-1 is a temperature-rise suppression surface with high laser reflectivity.

[0222] 41, the main material of the second transfer plate 3-2 is copper or aluminum. More specifically, the second transfer plate 3-2 is made of copper or a copper alloy, or aluminum or an aluminum alloy.

[0223] 41, at least a portion of the second transport surface 3u-2 of the second transport plate 3-2 is made of copper, a copper alloy, aluminum, or an aluminum alloy. The entire second transport surface 3u-2 of the second transport plate 3-2 may be made of copper, a copper alloy, aluminum, or an aluminum alloy. In the example shown in FIG. 41, the copper surface or aluminum surface that constitutes at least a portion of the second transport surface 3u-2 of the second transport plate 3-2 is a temperature-rise suppression surface with high laser reflectivity.

[0224] 35, the laser processing apparatus 1B includes a dross transport conveyor 2B, a laser irradiation device 60, a moving device 7, and a control device 8. Additionally, the laser processing apparatus 1B may include a workpiece support member 90. The laser irradiation device 60, the moving device 7, the control device 8, and the workpiece support member 90 have already been described in the first embodiment, and therefore, repeated description of these configurations will be omitted.

[0225] Third Embodiment A workpiece machining method according to a third embodiment will be described with reference to Figures 1 to 42. Figure 42 is a flowchart showing an example of the workpiece machining method according to the third embodiment.

[0226] The workpiece processing method in the third embodiment may be performed using the laser processing apparatus 1A in the first embodiment, the laser processing apparatus 1B in the second embodiment, or any other laser processing apparatus.

[0227] In the first step ST1, the workpiece W is machined. The first step ST1 is a workpiece machining process. In the workpiece machining process, the workpiece W is machined by irradiating the workpiece W with a laser LB. More specifically, the workpiece W is machined by irradiating the workpiece W with the laser LB from the laser head 61 of the laser irradiation device 60. The wavelength of the laser LB emitted from the laser head 61 of the laser irradiation device 60 is, for example, not less than 1060 nm and not more than 1080 nm.

[0228] The workpiece W to be machined in the workpiece machining process (first step ST1) is, for example, a plate material. The workpiece machining process may include laser cutting the workpiece W by moving a laser head 61 that emits a laser beam LB. The workpiece machining process may also include laser perforating the workpiece W by emitting a laser beam LB from a laser head 61 that is temporarily stationary. A product (for example, a plate product) is formed from the workpiece W by machining the workpiece W with the laser beam LB.

[0229] In the workpiece machining process (first step ST1), dross D is generated from the workpiece W by irradiating the workpiece W with a laser LB. Additionally, cutting pieces CF may be generated from the workpiece W by irradiating the workpiece W with the laser LB. The generated dross D and / or cutting pieces CF fall downward in the machining region RG1. The dross D and / or cutting pieces CF that fall downward are received by the dross transport conveyor 2.

[0230] In the workpiece machining process (first step ST1), the laser LB passing through the workpiece W reaches the dross transport conveyor 2. The laser LB reaching the dross transport conveyor 2 raises the temperature of a group of transport plates 3 including the first transport plate 3-1 and the second transport plate 3-2. The first transport plate 3-1, the second transport plate 3-2, etc. are deformed due to thermal expansion.

[0231] In the second step ST2, the dross D is transported. The second step ST2 is a dross transport process. In the dross transport process, the dross D generated by irradiating the workpiece W with the laser LB is transported using a group of transport plates 3 including a first transport plate 3-1 extending in the first direction DR1 and a second transport plate 3-2 arranged adjacent to the first transport plate 3-1 and extending in the first direction DR1. More specifically, the group of transport plates 3 transports the dross D from the processing region RG1 to the discharge region RG2.

[0232] The second step ST2 (dross transport step) is performed in parallel with the first step ST1 (workpiece machining step). More specifically, while the dross transport conveyor 2 is being driven (in other words, while a group of transport plates 3 is moving along the circular orbit OB), the laser irradiator 60 irradiates the workpiece W with a laser LB. By irradiating the workpiece W with the laser LB, dross D and / or cut-off pieces CF are intermittently or continuously generated, and the generated dross D and / or cut-off pieces CF are sequentially transported by the dross transport conveyor 2.

[0233] 12, 14, 15, 17, 18, 19, 36, 39, or 40, the workpiece machining process (the process of machining the workpiece W) is performed in a state where a temperature rise of the first transport plate 3-1 due to the energy of the laser LB is suppressed by a first temperature rise suppression surface 4-1 covering at least a portion of the first transport plate 3-1. Also, the workpiece machining process (the process of machining the workpiece W) is performed in a state where a temperature rise of the second transport plate 3-2 due to the energy of the laser LB is suppressed by a second temperature rise suppression surface 4-2 covering at least a portion of the second transport plate 3-2.

[0234] For example, in the examples shown in Figures 12, 14, 18, 36, 39, and 40, the workpiece machining process (the process of machining the workpiece W) is performed in a state where the temperature of the first transport plate 3-1 caused by the energy of the laser LB is suppressed by the first laser reflecting layer 4r-1 covering at least a portion of the first transport surface 3u-1 of the first transport plate 3-1. For example, during the workpiece machining process (the process of machining the workpiece W), a portion of the laser LB emitted from the laser irradiation device 60 is reflected by the first laser reflecting layer 4r-1. Furthermore, the workpiece machining process (the process of machining the workpiece W) is performed in a state where the temperature of the second transport plate 3-2 caused by the energy of the laser LB is suppressed by the second laser reflecting layer 4r-2 covering at least a portion of the second transport surface 3u-2 of the second transport plate 3-2. For example, during the execution of a workpiece processing step (a step of processing the workpiece W), a portion of the laser beam LB emitted from the laser irradiation device 60 is reflected by the second laser reflecting layer 4r-2.

[0235] For example, in the examples shown in Figures 15, 17, 18, and 39, the workpiece machining process (the process of machining the workpiece W) is performed in a state where the first thermally conductive layer 4c-1 covering at least a portion of the first back surface 3n-1 of the first transport plate 3-1 prevents the first transport plate 3-1 from heating up due to the energy of the laser LB. For example, during the workpiece machining process (the process of machining the workpiece W), heat generated by the laser irradiation of the first transport plate 3-1 is diffused by the first thermally conductive layer 4c-1. Furthermore, the workpiece machining process (the process of machining the workpiece W) is performed in a state where the second transport plate 3-2 prevents the second transport plate 3-2 from heating up due to the energy of the laser LB. For example, during the execution of the workpiece machining process (the process of machining the workpiece W), heat generated as a result of the second transport plate 3-2 being irradiated with a laser is diffused by the second thermal conduction layer 4c-2.

[0236] For example, in the example shown in FIG. 19 or 40, the workpiece machining process (the process of machining the workpiece W) is performed in a state in which the temperature rise of the first transport plate 3-1 due to the energy of the laser LB is suppressed by the first heat dissipation member 5-1 arranged in contact with at least a portion of the first back surface 3n-1 of the first transport plate 3-1. For example, during the workpiece machining process (the process of machining the workpiece W), heat generated by the laser irradiation of the first transport plate 3-1 is transferred from the first transport plate 3-1 to the first heat dissipation member 5-1, and the first heat dissipation member 5-1 dissipates the heat received from the first transport plate 3-1 into the air. Furthermore, the workpiece machining process (the process of machining the workpiece W) is performed in a state in which the temperature rise of the second transport plate 3-2 due to the energy of the laser LB is suppressed by the second heat dissipation member 5-2 arranged in contact with at least a portion of the second back surface 3n-2 of the second transport plate 3-2. For example, during the workpiece processing process (the process of processing the workpiece W), heat generated by the laser irradiation of the second transport plate 3-2 is transferred from the second transport plate 3-2 to the second heat dissipation member 5-2, and the second heat dissipation member 5-2 dissipates the heat received from the second transport plate 3-2 into the air.

[0237] In the examples shown in Figures 12, 14, 15, 17, 18, 19, 24, 36, 39, 40, and 41, the workpiece machining process (the process of machining the workpiece W) is performed in a state where the temperature rise of the first transport plate 3-1 is suppressed. Therefore, although the first transport plate 3-1 is thermally deformed due to laser irradiation, large thermal deformation that would lead to thermoplastic deformation is suppressed. Furthermore, the workpiece machining process (the process of machining the workpiece W) is performed in a state where the temperature rise of the second transport plate 3-2 is suppressed. Therefore, although the second transport plate 3-2 is thermally deformed due to laser irradiation, large thermal deformation that would lead to thermoplastic deformation is suppressed.

[0238] In the third step ST3, the first group of transport plates 3 is cooled. The third step ST3 is a cooling step. The cooling step (third step ST3) is performed by, for example, natural cooling. More specifically, the cooling step is performed by leaving the first group of transport plates 3 at room temperature after the processing of the workpieces W is completed.

[0239] Additionally, the cooling step may include forcibly cooling the group of transport plates 3 using at least one of an air-cooling type cooling device 95a and a liquid-cooling type cooling device 95b. For example, as illustrated in Fig. 34, the cooling step may include an air-cooling type cooling device 95a blowing air onto the group of transport plates 3. Alternatively, or additionally, the cooling step may include passing the group of transport plates 3 through a liquid (e.g., water) in a liquid bath 97. Furthermore, the cooling step may include a liquid-cooling type cooling device 95b spraying liquid (e.g., water) onto the group of transport plates 3.

[0240] Forced cooling of a group of transport plates 3 using at least one of an air-cooled cooling device 95a and a liquid-cooled cooling device 95b may be carried out in parallel with the workpiece processing process (first step ST1) and the dross transport process (second step ST2).

[0241] In the workpiece processing method of the third embodiment, the thermoplastic deformation of the first transport plate 3-1 is suppressed, so that the first transport plate 3-1 returns to its original shape before thermal deformation after being cooled in the cooling process. Furthermore, in the workpiece processing method of the third embodiment, the thermoplastic deformation of the second transport plate 3-2 is suppressed, so that the second transport plate 3-2 returns to its original shape before thermal deformation after being cooled in the cooling process. By repeatedly performing the first step ST1 to the third step ST3 described above, some plastic deformation may occur in each of the group of transport plates 3, but plastic deformation to the extent that it would interfere with the operation of the dross transport conveyor 2 is avoided.

[0242] The present invention is not limited to the above-described embodiments or modifications, and it is clear that each embodiment or modification can be appropriately modified or changed within the scope of the technical concept of the present invention. Furthermore, various techniques used in each embodiment or modification can be applied to other embodiments or modifications as long as no technical contradiction occurs. Furthermore, optional additional configurations in each embodiment or modification can be omitted as appropriate.

[0243] 1, 1A, 1B... laser processing device, 2, 2A, 2B... dross transport conveyor, 3... transport plate, 3-1... first transport plate, 3-2... second transport plate, 3-3... third transport plate, 3-N... transport plate, 3a, 3a-1, 3a-2, 3a-3... left end, 3b, 3b-1, 3b-2, 3b-3... right end, 3e... rear end, 3e-1... first rear end, 3e-2... second rear end, 3e-3... third rear end, 3e-N... rear end of transport plate 3-N, 3f... front end, 3f-1... first front end, 3f-2... second front end, 3f-3... third front end, 3m... middle portion, 3m-1 ...first intermediate portion, 3m-2...second intermediate portion, 3m-3...third intermediate portion, 3n...rear surface, 3n-1...first rear surface, 3n-2...second rear surface, 3u...transport surface, 3u-1...first transport surface, 3u-2...second transport surface, 4-1...first temperature rise suppression surface, 4-2...second temperature rise suppression surface, 4c-1...first thermal conduction layer, 4c-2...second thermal conduction layer, 4n-1...first rear surface, 4n-2...second rear surface, 4r-1...first laser reflecting layer, 4r-2...second laser reflecting layer, 5-1...first heat dissipation member, 5-2...second heat dissipation member, 7...moving device, 8...controller, 11...transport device, 12...workpiece transport device, 12a...plate material transport device station, 13...container, 15...second transport conveyor, 21...first endless member, 21a...first endless chain, 22...second endless member, 22a...second endless chain, 28...sprocket, 28a...first sprocket, 28b...second sprocket, 28c...third sprocket, 28d...fourth sprocket, 29...drive device, 30e-1...rear receiving portion, 30e-2...rear receiving portion, 30f-1...front receiving portion, 30f-2...front receiving portion, 31t, 32t...contact surface, 50-1...first heat sink, 50-2...second heat sink, 51-1...first base portion, 51-2...second base portion, 5 2-1...first heat dissipation piece, 52-2...second heat dissipation piece, 52f-1, 52f-2...heat dissipation fins, 52p-1, 52p-2...heat dissipation pins, 60...laser irradiation device, 61...laser head, 63...laser light source, 65...optical component, 70...base, 71...first moving device, 71a...first moving body, 71b...first driving device, 73...second moving device, 73a...second moving body, 73b...second driving device, 75...third moving device, 75a...third moving body, 75b...third driving device, 80...hardware processor, 82...memory, 84...communication circuit, 86...input device, 88...bus, 90...work support member,91...plate member, 92...top portion, 93...frame body, 95, 95a, 95b...cooling device, 96...air injection device, 97...liquid tank, 121...suction cup, 822...machining program, 826...workpiece data, 862...touch panel display, BA1...first bent portion, BB1...second bent portion, BA2...third bent portion, BB2...fourth bent portion, BT...bolt, CF...cut-off piece, CP, CP1, CP2...convex curved portion, D...dross, EG...edge portion, FP1...first flat plate portion, FP2...second flat plate portion, LB...laser, OB...circulating orbit, OP...injection port, PT...pallet, R1...injection command, RD1...first rod, RD2...second rod, RD3...third rod, RG1...processing area, RG2...discharge area, RG3...removal area, S...movement command, SD1, SD2...concave back surface, SF1, SF2...flat conveying surface, SN1, SN2...flat back surface, SU1, SU2...convex conveying surface, TP...standing portion, TP1...first standing portion, TP2...second standing portion, W...work, Wb...machined work, h1, h2...hole portion,

Claims

1. A dross conveyor comprising a first conveying plate extending in a first direction and a second conveying plate adjacent to the first conveying plate and extending in the first direction, the first group of conveying plates for conveying dross generated by irradiating a workpiece with a laser; a first temperature rise suppression surface covering at least a part of the first conveying plate to suppress the first conveying plate from being heated due to the energy of the laser; and a second temperature rise suppression surface covering at least a part of the second conveying plate to suppress the second conveying plate from being heated due to the energy of the laser.

2. The dross conveyor according to claim 1, wherein the first temperature rise suppression surface includes a surface of a first laser reflection layer covering at least a part of a first conveying surface of the first conveying plate.

3. The dross conveyor according to claim 1 or 2, wherein the first temperature rise suppression surface includes a surface of a first heat conduction layer covering at least a part of a first back surface of the first conveying plate, and the heat conductivity of the first heat conduction layer is higher than that of the first conveying plate.

4. The dross conveyor according to claim 3, wherein the first heat conduction layer is composed of a copper plating layer, an aluminum plating layer, or a heat dissipation sheet.

5. The dross conveyor according to any one of claims 1 to 3, wherein the main material of the first conveying plate is steel, and the first temperature rise suppression surface is composed of copper, a copper alloy, aluminum, or an aluminum alloy.

6. The dross conveyor according to any one of claims 1 to 5, wherein the first temperature rise suppression surface includes a surface of a first heat dissipation member arranged in contact with at least a part of a back surface of an intermediate portion of the first conveying plate.

7. The dross conveyor according to claim 6, wherein the first heat dissipation member includes a plurality of heat dissipation protrusions or a plurality of heat dissipation fins.

8. The dross conveyor according to any one of claims 1 to 7, wherein a rear end portion of the first conveying plate and a front end portion of the second conveying plate are arranged to overlap each other.

9. The dross conveyor according to any one of claims 1 to 7, wherein a rear end portion of the first conveying plate and a front end portion of the second conveying plate are hinged.

10. A dross conveyor comprising a first transfer plate extending in a first direction and a second transfer plate disposed adjacent to the first transfer plate and extending in the first direction, the dross conveyor comprising a group of transfer plates for transferring dross generated by irradiating a workpiece with a laser, wherein a main material of the first transfer plate is copper, a copper alloy, aluminum, or an aluminum alloy, and at least a part of a first transfer surface of the first transfer plate is formed of copper, a copper alloy, aluminum, or an aluminum alloy; and a main material of the second transfer plate is copper, a copper alloy, aluminum, or an aluminum alloy, and at least a part of a second transfer surface of the second transfer plate is formed of copper, a copper alloy, aluminum, or an aluminum alloy.

11. A laser processing apparatus comprising: a laser irradiation device including a laser head for irradiating a workpiece with a laser; a moving device for relatively moving the laser head with respect to a workpiece support member for supporting the workpiece; a control device for controlling the laser irradiation device and the moving device; and a dross conveyor, wherein the dross conveyor includes a first transfer plate extending in a first direction and a second transfer plate disposed adjacent to the first transfer plate and extending in the first direction, the dross conveyor including a group of transfer plates for transferring dross generated by irradiating the workpiece with the laser, a first temperature rise suppression surface covering at least a part of the first transfer plate and suppressing a temperature rise of the first transfer plate due to energy of the laser, and a second temperature rise suppression surface covering at least a part of the second transfer plate and suppressing a temperature rise of the second transfer plate due to the energy of the laser.

12. The laser processing apparatus according to claim 11, further comprising a cooling device for forcibly cooling the group of transfer plates.

13. A step of processing the workpiece by irradiating the workpiece with a laser, and a step of conveying dross generated by irradiating the workpiece with the laser, using a group of conveying plates including a first conveying plate extending in a first direction and a second conveying plate extending in the first direction and disposed adjacent to the first conveying plate. The step of processing the workpiece is performed in a state where the temperature rise of the first conveying plate due to the energy of the laser is suppressed by a first temperature rise suppressing surface covering at least a part of the first conveying plate, and the temperature rise of the second conveying plate due to the energy of the laser is suppressed by a second temperature rise suppressing surface covering at least a part of the second conveying plate. A workpiece processing method.

14. The workpiece processing method according to claim 13, further comprising a step of forcibly cooling a group of the conveying plates using at least one of an air-cooled cooling device and a liquid-cooled cooling device, wherein the step of forcibly cooling a group of the conveying plates is performed in parallel with the step of processing the workpiece and the step of conveying the dross.

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