Jet solder device

Abstract

A jet solder device includes a storage tank 110 for storing molten solder S, supply parts 120, 130 for supplying molten solder S, and a guide member 150 for guiding the molten solder S supplied from the supply parts 120, 130 to the molten solder S in the storage tank 110. The guide member 150 is immersed at an angle of 40 degrees or less with respect to the liquid surface of the molten solder S.

Description

Wave soldering equipment

[0001] The present invention relates to a jet soldering device that supplies molten solder to a substrate.

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[0074] The solder flow relaxation section takes in the molten solder flowing out from the outlet from the top of the first basket and discharges it from the holes in the first basket and the holes in the second basket.

[0003] In the configuration of JP 2011-124453 A, the molten solder jetted by the jet nozzle flows out from the outlet and is guided to the solder tank main body, but the present invention provides a jet soldering device that adopts a different configuration from JP 2011-124453 A and can prevent the molten solder from splashing onto the substrate.

[0004] [Concept 1] A jet soldering device according to a first aspect of the present invention comprises: a supply unit for supplying molten solder; a storage tank for storing the molten solder; and a guide member for guiding the molten solder supplied from the supply unit to the molten solder in the storage tank, wherein the guide member may be immersed at an angle of 40 degrees or less with respect to the liquid surface of the molten solder in the storage tank.

[0005] [Concept 2] In the jet soldering apparatus according to Concept 1, the guide member has a first guide member located at the tip end, a second guide member located at the base end, and a guide bend portion provided between the first guide member and the second guide member, the first guide member is immersed at an angle of 40 degrees or less with respect to the liquid surface of the molten solder in the storage tank, and the angle of the second guide member with respect to the liquid surface of the molten solder in the storage tank may be larger than the angle of the first guide member with respect to the liquid surface of the molten solder in the storage tank.

[0006] [Concept 3] The jet soldering device according to Concept 1 or 2 may further include a cover member positioned above at least a portion of the guide member that is immersed in the liquid surface of the molten solder in the reservoir tank.

[0007] [Concept 4] In the jet soldering device according to Concept 3, the cover member may extend toward the supply part, and the tip of the cover member may be located closer to the supply part than the point where the guide member is immersed in the liquid surface of the molten solder in the storage tank.

[0008] [Concept 5] In the wave soldering device according to Concept 3 or 4, the cover member has a first cover member located on the tip end side, a second cover member located on the base end side, and a cover bend portion provided between the first cover member and the second cover member, and the first cover member may be bent downward relative to the second cover member via the cover bend portion.

[0009] [Concept 6] In the jet soldering device according to Concept 5, the guide member has a first guide member located on the tip end side, a second guide member located on the base end side, and a guide bend portion provided between the first guide member and the second guide member, and the tip of the first cover member may be located closer to the supply section than the guide bend portion.

[0010] [Concept 7] In the jet soldering apparatus according to any one of Concepts 1 to 6, the guide member may be immersed at an angle exceeding 0 degrees with respect to the liquid surface of the molten solder in the reservoir.

[0011] [Concept 8] In the jet soldering apparatus according to any one of Concepts 1 to 7, the guide member may have a plurality of holes.

[0012] [Concept 9] A jet soldering device according to a second aspect of the present invention comprises: a supply unit for supplying molten solder; a storage tank for storing the molten solder; and a guide member for guiding the molten solder supplied from the supply unit to the molten solder in the storage tank, wherein the guide member has a first guide member located at the tip end, a second guide member located at the base end, and a guide bend portion provided between the first guide member and the second guide member, and the first guide member may be immersed in the liquid surface of the molten solder in the storage tank.

[0013] [Concept 10] A second aspect of the present invention provides a jet soldering device comprising: a cover member disposed above the molten solder in the storage tank and extending from the side of the storage tank toward a supply point of the molten solder in the supply unit; the cover member having a first cover member disposed on the tip end side, a second cover member disposed on the base end side, and a cover bend portion disposed between the first cover member and the second cover member; and an imaginary line connecting the landing position of the first guide member with respect to the molten solder and the tip of the first cover member may be positioned on the side of the supply unit.

[0014] [Concept 11] A jet soldering device according to a third aspect of the present invention comprises: a supply section for supplying molten solder; a storage tank for storing the molten solder; and a cover member provided above the molten solder in the storage tank and extending from a side surface of the storage tank toward a supply point of the molten solder in the supply section, wherein the tip of the cover member and the supply point may be spaced apart in a plan view.

[0015] [Concept 12] A jet soldering device according to a third aspect of the present invention comprises a guide member for guiding molten solder supplied from the supply unit to the molten solder in the storage tank, wherein the guide member is immersed at an angle of 40 degrees or less with respect to the liquid surface of the molten solder in the storage tank, and an imaginary line connecting the contact position of the guide member with the molten solder and the tip of the cover member may be positioned on a side of the supply unit.

[0016] By employing an aspect of the present invention, it is possible to provide a jet soldering device that can prevent molten solder from splashing onto a substrate.

[0017] FIG. 1 is a schematic diagram showing a soldering apparatus according to the present embodiment. FIG. 2 is a side cross-sectional view showing an upstream guide member immersed in the liquid surface of molten solder in the flow soldering apparatus according to the present embodiment. FIG. 3 is a side cross-sectional view showing an upstream guide member immersed in the liquid surface of molten solder and an upstream cover member provided in the flow soldering apparatus according to the present embodiment. FIG. 4 is a side cross-sectional view showing an upstream guide member having an upstream first guide member, an upstream second guide member, and an upstream guide bend portion, and an upstream cover member provided in the flow soldering apparatus according to the present embodiment. FIG. 5 is a side cross-sectional view showing an upstream guide member having an upstream first guide member, an upstream second guide member, and an upstream guide bend portion, and an upstream cover member having an upstream first cover member, an upstream second cover member, and an upstream cover bend portion in the flow soldering apparatus according to the present embodiment. FIG. 6A is a perspective view of a guide member that can be used in the present embodiment. FIG. 6B is a side view of a guide member that can be used in the present embodiment. FIG. 7A is a perspective view of a guide member having a first guide member, a second guide member, and a guide bend portion that can be used in this embodiment. FIG. 7B is a side view of a guide member having a first guide member, a second guide member, and a guide bend portion that can be used in this embodiment. FIG. 8 is a plan view showing a soldering apparatus according to this embodiment, which illustrates a cover member but not a guide member. FIG. 9 is a side cross-sectional view showing an embodiment of a jet soldering apparatus according to this embodiment, in which the upstream guide member has an upstream first guide member, an upstream second guide member, and an upstream guide bend portion, the upstream cover member has an upstream first cover material, an upstream second cover member, and an upstream cover bend portion, and a downstream guide member and a downstream cover member are provided. FIG. 10 is a side cross-sectional view showing an embodiment of a jet soldering apparatus according to this embodiment, in which the upstream guide member and the downstream guide member each have a first guide member, a second guide member, and a guide bend portion, and the upstream cover member and the downstream cover member each have a first cover material, a second cover member, and a cover bend portion. FIG. 11 is a side cross-sectional view showing an example of the relationship between the position of the first guide member where the surface of the first guide member contacts the molten solder and the tip of the first cover material in the jet soldering apparatus according to this embodiment.FIG. 12 is a side cross-sectional view showing an outline of the guide member and cover member in Example 1. FIG. 13 is a side cross-sectional view showing an outline of the guide member and cover member in Example 2. FIG. 14A is a photograph showing the molten solder splashing state in a comparative example in which a guide member and a cover member are not provided. FIG. 14B is a photograph showing that the molten solder does not splash in Example 1. FIG. 14C is a photograph showing that the molten solder does not splash in Example 2. FIG. 15 is a side cross-sectional view showing an aspect in which a guide member is not provided in the flow soldering device according to the present embodiment, and an upstream cover member and a downstream cover member are each provided. FIG. 16 is a side cross-sectional view showing an aspect in which a guide member is not provided in the flow soldering device according to the present embodiment, and each of the upstream cover member and the downstream cover member has a first cover material, a second cover member, and a cover bend portion.

[0018] 1 is an apparatus for soldering a substrate 200 having electronic components, such as semiconductor elements, resistors, and capacitors, mounted on a circuit board. Typically, the electronic components are positioned below the substrate 200. The soldering apparatus includes a main body 1 and a conveying unit 5 for conveying the substrate 200. The main body 1 includes an inlet 2 through which the substrate 200 is conveyed and an outlet 3 through which the substrate 200 is conveyed. The substrate 200 may be conveyed at a predetermined angle, e.g., 3 to 6 degrees, as viewed from the side (see FIGS. 2 to 5, 9, and 10). In this case, the downstream side of the substrate conveying direction A is positioned higher than the upstream side. However, this is not limited thereto, and the substrate 200 may be conveyed horizontally, for example. The conveying unit 5 may include a conveying drive unit (not shown) that applies a driving force for conveying the substrate 200 and a conveying rail 6 that guides the substrate 200.

[0019] As shown in FIG. 1 , the main body 1 may include a fluxer 10 that applies flux to a substrate 200, a preheater 15 that preheats the flux-coated substrate 200, a jet soldering device 100 that jets molten solder to contact the substrate 200, and a cooler 20 that cools the soldered substrate 200. The substrate 200 transported along the transport rails 6 of the transport unit 5 passes through the fluxer 10, the preheater 15, the jet soldering device 100, and the cooler 20 in that order. The jet soldering device 100 may include a control unit 50 that issues commands to and controls each component, a memory unit 60 that stores various information, and an operation unit 70 that allows an operator to input various information to operate the soldering device. Note that FIG. 1 shows the soldering device in a top plan view, except for the control unit 50, the memory unit 60, and the operation unit 70.

[0020] The fluxer 10 is used to apply flux to the transported substrate 200. The flux may contain a solvent, an activator, etc. The fluxer 10 may be provided with a plurality of application devices. Different types of flux may be used depending on the type of solder and the type of substrate 200.

[0021] The preheater unit 15 heats the substrate 200, thereby raising the temperature of the substrate 200 uniformly to a predetermined level. Heating the substrate 200 in this manner facilitates solder adhesion to predetermined locations on the substrate 200. The preheater unit 15 may be, for example, a far-infrared panel heater. The far-infrared panel heater can rapidly heat the substrate 200 to a set temperature. Alternatively, the substrate 200 may be heated by blowing gas (hot air) heated by the heater onto the substrate 200 using a fan. Alternatively, a halogen heater or the like may be used as the preheater unit 15.

[0022] The cooler 20 has a cooling fan (not shown) and cools the substrate 200 that has been soldered by the jet soldering apparatus 100. The cooling fan may be controlled simply by turning it on and off, or the air speed may be adjusted. The cooler 20 may also be a chiller or the like that cools the substrate 200 to a predetermined temperature.

[0023] The control unit 50 shown in FIG. 1 is communicatively connected to the transport unit 5 including the transport rail 6, the fluxer 10, the preheater unit 15, the jet soldering device 100, the cooler 20, the operation unit 70, and the memory unit 60. The communicative connections include both wired and wireless connections. The operation unit 70 may include a liquid crystal display panel, a numeric keypad, or the like, and is typically a personal computer, smartphone, tablet, or the like. When an operator operates the operation unit 70, the control unit 50 may control the transport speed of the transport unit 5, the timing of transporting the substrate 200, the temperature of the flux in the fluxer 10, the amount of flux applied, the temperature of the preheater unit 15, the temperature of the molten solder S in the jet soldering device 100, the jet flow rate, the jet speed, and ON / OFF of the cooling fan of the cooler 20. The memory unit 60 may store information input via the operation unit 70, instructions from the control unit 50, the operating time of the jet soldering device 100, and the like.

[0024] As shown in FIGS. 2 to 5, 9, and 10, the jet soldering apparatus 100 includes a storage tank 110 that stores molten solder S and supply units 120 and 130 that supply the molten solder S to a substrate 200. In this embodiment, the supply units 120 and 130 include a first supply unit 120 and a second supply unit 130. The first supply unit 120 may include a first pump 141, which is a first drive unit. Similarly, the second supply unit 130 may include a second pump 146, which is a second drive unit. The molten solder S jetted from the first supply unit 120 and the second supply unit 130 is jetted from below upward. The molten solder S, driven by the driving force of the first pump 141, is pressure-fed through a duct and jetted toward the substrate 200, where the solder adheres to a predetermined location on the substrate 200. Similarly, the molten solder S, which receives a driving force from the second pump 146, is pressure-fed through the duct and sprayed toward the substrate 200, where the solder adheres to a predetermined location on the substrate 200. The molten solder S is heated to a temperature of, for example, about 180°C to 250°C by a heater (not shown). The molten solder S supplied from the first supply unit 120 and the second supply unit 130 may be circulated and used. In this case, the molten solder S may be circulated by passing through a filter (not shown). While the first pump 141 and the second pump 146 are typically each composed of a single pump, the first pump 141 and the second pump 146 may each be composed of multiple pumps.

[0025] The first supply unit 120 of the jet soldering apparatus 100 shown in Figures 2 to 5, 9, and 10 has a plurality of first openings 126 (see Figure 8, etc.). The plurality of first openings 126 are used to forcefully supply a large amount of molten solder S to the substrate 200. The second openings 136 of the second supply unit 130 are used to supply the molten solder S to the substrate 200 with less force than the first supply unit 120. The jet solder supplied from the first supply unit 120 is a dynamic supply that causes the molten solder S to collide with the substrate 200 with force, and is intended to spread the molten solder S to every corner of the substrate 200. On the other hand, the jet solder supplied from the second supply unit 130 is a static supply that passes through the molten solder S, which is a gentle flow, to neatly apply the solder to the electrodes, etc., of the substrate 200.

[0026] As shown in FIGS. 2 to 5, 9, and 10, the first supply unit 120 includes a first housing 121 and one or more first openings 126 provided on the upper surface of the first housing 121 for supplying the molten solder S. In this embodiment, the first openings 126 are nozzle-shaped and protrude upward from the upper surface of the first housing 121. The second supply unit 130 includes a second housing 131 and one or more second openings 136 provided on the upper surface of the second housing 131 for supplying the molten solder S. The first housing 121 and the second housing 131 may be spaced apart from each other, or may be integrally formed. In this embodiment, as an example, the first opening 126 is described using a plurality of nozzles 127 and one slit-shaped second opening 136 (see FIG. 8, etc.). However, this is not limited to this embodiment. For example, a plurality of slit-shaped second openings 136 may be provided. In this case, the plurality of slit-shaped second openings 136 may be arranged in parallel. The second opening 136 may also be formed from a plurality of nozzles. In this embodiment, the first opening 126 and the second opening 136 are supply points of the molten solder S in the supply units 120 and 130 .

[0027] While the molten solder S is being supplied, the molten solder S supplied from the first supply unit 120 and the molten solder S supplied from the second supply unit 130 may be mixed. The molten solder S mixed in this manner may be configured not to be separated from the substrate 200 transported by the transport unit 5 between the first supply unit 120 and the second supply unit 130. The substrate 200 is transported while being supported by the transport rail 6, and the upper surface of the mixed molten solder S may not be positioned lower than the lower end of the transport rail 6 transporting the substrate 200 when viewed from the side, over the entire length region along the substrate transport direction A between the first supply unit 120 and the second supply unit 130. In this case, the molten solder S is configured not to be separated from the substrate 200 transported by the transport unit 5 between the first supply unit 120 and the second supply unit 130.

[0028] The molten solder S supplied from the first supply unit 120 and the molten solder S supplied from the second supply unit 130 may be integrated and sprayed to a position higher than the transport position of the substrate 200, but this is not limited to such an embodiment.A location where the molten solder S does not come into contact with the substrate 200 may be provided between the molten solder S supplied from the first supply unit 120 and the molten solder S supplied from the second supply unit 130, and the molten solder S may be sprayed in two clearly separated stages.

[0029] The temperature of molten solder S is generally about 50°C above the melting temperature of the solder. In recent years, there has been a growing need to lower operating temperatures to reduce component damage and machine power consumption. Furthermore, as the market prices of Sn and Ag have risen sharply, the use of solders that do not contain these metals has been considered. Typically, Sn-58Bi (melting point 139°C) has been considered as a replacement for Sn-3Ag-0.5Cu (melting point 217°C). Sn-58Bi is a low-temperature eutectic solder. Using Sn-58Bi, soldering can be performed at temperatures below 200°C. On the other hand, due to its low surface tension, Sn-58Bi tends to splash when the molten solder S supplied from the supply unit falls into the molten solder S stored in the storage tank. This tendency is observed in solders containing Bi, particularly in solders containing 35% or more Bi by mass. For this reason, it is extremely beneficial to employ this embodiment in solders containing 35% or more by mass of Bi. Furthermore, the tendency for molten solder S to easily splash increases when soldering is performed using the jet soldering device 100 in an inert gas atmosphere such as a nitrogen atmosphere, so it is extremely beneficial to employ this embodiment even in an inert gas atmosphere such as a nitrogen atmosphere. It is believed that the absence of oxides in an inert gas atmosphere such as a nitrogen atmosphere makes molten solder S more likely to splash.

[0030] In this embodiment, guide member 150 is provided to guide molten solder S supplied from supply units 120, 130 to molten solder S in reservoir 110. In this embodiment, guide member 150 has upstream guide member 151 located upstream of supply units 120, 130 in board transport direction A, and downstream guide member 152 located downstream of supply units 120, 130 in board transport direction A, but at least one of these may be immersed at an angle greater than 0 degrees and less than or equal to 40 degrees with respect to the liquid surface of molten solder S in reservoir 110. If the angle θ1 of guide member 150 with respect to the liquid level of molten solder S in reservoir 110 exceeds 40 degrees (for example, 45 degrees), the molten solder S is more likely to splash when the molten solder S supplied from supply units 120, 130 falls into the molten solder S stored in reservoir 110, and therefore it is beneficial for the angle θ1 of guide member 150 with respect to the liquid level of molten solder S in reservoir 110 to be 40 degrees or less. The height position of the liquid level of molten solder S in this embodiment is typically the height position of the liquid level assumed in the design of the device.

[0031] 6A to 7B, guide member 150 may have a plurality of holes 159. Providing such holes 159 allows molten solder S to fall from holes 159, but since molten solder S basically continues to fall from holes 159 while molten solder is being supplied to board 200, there is little chance that molten solder S falling through holes 159 will splash and adhere to board 200. On the other hand, providing such holes 159 is beneficial in that it allows molten solder S to be guided more smoothly to molten solder S in reservoir tank 110.

[0032] 3 to 5, 9, and 10, a cover member 160 may be provided above at least the portion of the guide member 150 that is immersed in the liquid surface of the molten solder S. Even if the angle θ1 of the guide member 150 with respect to the liquid surface of the molten solder S in the storage tank 110 is set to 40 degrees or less, the molten solder S may splash when the molten solder S supplied from the supply units 120 and 130 falls into the molten solder S stored in the storage tank 110. Therefore, providing the cover member 160 of this embodiment can prevent the splashed molten solder S from adhering to the substrate 200. In particular, providing the cover member 160 above at least the portion of the guide member 150 that is immersed in the liquid surface of the molten solder S can enhance the effect of preventing the splashed molten solder S from adhering to the substrate 200.

[0033] The supply units 120, 130 may be provided with a guide member 150 immersed in the molten solder S and a cover member 160 on the upstream side in the board transport direction A, or with a guide member 150 immersed in the molten solder S and a cover member 160 on the downstream side in the board transport direction A, or with guide members 150 immersed in the molten solder S and a cover member 160 on both the upstream and downstream sides in the board transport direction A. Figures 2 to 5 show an embodiment in which the supply units 120, 130 are provided with an upstream guide member 151 on the upstream side in the board transport direction A where they are immersed in the molten solder S, and Figures 9 and 10 show an embodiment in which the supply units 120, 130 are provided with an upstream guide member 151 on the upstream side in the board transport direction A where they are immersed in the molten solder S, and a downstream guide member 152 on the downstream side. In addition, in Figures 3 to 5, the cover member 160 has an upstream cover member 161 provided upstream in the substrate transport direction A, and in Figures 9 and 10, the cover member 160 has an upstream cover member 161 provided upstream in the substrate transport direction A and a downstream cover member 162 provided downstream in the substrate transport direction A.

[0034] When the transport position of the substrate 200 is positioned higher downstream in the substrate transport direction A than upstream, the scattering of molten solder S upstream of the supply sections 120, 130 in the substrate transport direction A is more likely to be a problem than the scattering of molten solder S downstream of the supply sections 120, 130 in the substrate transport direction A, so it is beneficial to provide an upstream guide member 151 or an upstream cover member 161 upstream of the supply sections 120, 130 in the substrate transport direction A.

[0035] 7A and 7B , the guide member 150 may have a first guide member 150a located at the distal end, a second guide member 150b located at the proximal end, and a guide bend 150c provided between the first guide member 150a and the second guide member 150b. When this configuration is adopted, the second guide member 150b prevents the molten solder S supplied from the supply unit 120, 130 from stopping midway, while the first guide member 150a prevents the molten solder S from splashing when it falls into the molten solder S stored in the storage tank 110. When the guide member 150 is provided without the cover member 160, solder splashing can be prevented by restricting (adjusting) the angle of the guide member 150. In contrast, when the cover member 160 is provided together with the guide member 150, the drop point of the molten solder S can be set in the lower region (rear side) of the cover member 160, thereby further preventing solder splashing.

[0036] First guide member 150a may be immersed at an angle greater than 0 degrees and equal to or less than 40 degrees relative to the liquid surface of molten solder S. Angle θ2 of second guide member 150b relative to the liquid surface (basically a horizontal plane) of molten solder S may be set to be greater than angle θ1 of first guide member 150a relative to the liquid surface (basically a horizontal plane) of molten solder S. By setting such an angle restriction, second guide member 150b prevents molten solder S supplied from supply units 120 and 130 from stopping midway, and first guide member 150a can further enhance the effect of suppressing splashing of molten solder S when it falls into molten solder S stored in storage tank 110.

[0037] Since second guide member 150b is not immersed in molten solder S in reservoir 110, angle θ2 of second guide member 150b with respect to the liquid surface of molten solder S is the angle of second guide member 150b with respect to the liquid surface of molten solder S in reservoir 110 when second guide member 150b is virtually extended. This angle is basically equal to the angle with respect to the horizontal plane.

[0038] 4, 5, and 9, the upstream guide member 151 has an upstream first guide member 151a located at the tip end, an upstream second guide member 151b located at the base end, and an upstream guide bend 151c provided between the upstream first guide member 151a and the upstream second guide member 151b. In the embodiment shown in Fig. 10, the upstream guide member 151 has an upstream first guide member 151a located at the tip end, an upstream second guide member 151b located at the base end, and an upstream guide bend 151c provided between the upstream first guide member 151a and the upstream second guide member 151b, and the downstream guide member 152 has a downstream first guide member 152a located at the tip end, a downstream second guide member 152b located at the base end, and a downstream guide bend 152c provided between the downstream first guide member 152a and the downstream second guide member 152b.

[0039] The cover member 160 may extend from the side surface of the storage tank 110 toward the supply units 120 and 130. More specifically, the upstream cover member 161 may be provided extending from the side surface of the storage tank 110 on the upstream side in the substrate transport direction A toward the downstream side in the substrate transport direction A where the supply units 120 and 130 are located. The tip of the upstream cover member 161 may be located closer to the supply units 120 and 130 (downstream) than the point where the upstream guide member 151 is immersed in the liquid surface of the molten solder S. When the molten solder S guided by the upstream guide member 151 toward the upstream side in the substrate transport direction A falls onto the liquid surface, the molten solder S tends to splash toward the upstream side in the substrate transport direction A. However, by providing the upstream cover member 161 from the side surface of the storage tank 110 toward the supply units 120 and 130, the effect of preventing the splashed molten solder S from adhering to the substrate 200 can be further enhanced. Similarly, downstream cover member 162 may be provided extending from the downstream side surface of storage tank 110 in substrate transport direction A toward the upstream side in substrate transport direction A where supply units 120, 130 are located. The tip of downstream cover member 162 may be located closer to supply units 120, 130 (upstream) than the point where downstream guide member 152 is immersed in the liquid surface of molten solder S. When molten solder S guided by downstream guide member 152 toward the downstream side in substrate transport direction A falls onto the liquid surface, the molten solder S tends to splash toward the downstream side in substrate transport direction A. However, by providing downstream cover member 162 from the side surface of storage tank 110 toward supply units 120, 130, the effect of preventing splashed molten solder S from adhering to substrate 200 can be further enhanced.

[0040] Furthermore, by providing cover member 160 and adopting an embodiment in which guide bent portion 150c is provided, first guide member 150a can be angled more gently with respect to the horizontal plane, and the position at which first guide member 150a comes into contact with the liquid surface of molten solder S can be positioned closer to the base end (rear side) of cover member 160. This further enhances the effect of preventing molten solder S from splashing onto substrate 200.

[0041] As shown in FIGS. 5, 9, and 10, the cover member 160 may have a first cover member 160a located at the distal end, a second cover member 160b located at the proximal end, and a cover bend portion 160c provided between the first cover member 160a and the second cover member 160b. The first cover member 160a may be bent downward relative to the second cover member 160b via the cover bend portion 160c. By adopting such an embodiment, the effect of preventing the molten solder S, which is splashed when the molten solder S guided by the guide member 150 falls onto the liquid surface of the molten solder S, from adhering to the substrate 200 can be further enhanced. In the upstream cover member 161 located upstream, the upstream first cover member 161a is located downstream in the substrate transport direction A (right side in FIGS. 5, 9, and 10), and the upstream second cover member 161b is located upstream in the substrate transport direction A (left side in FIGS. 5, 9, and 10). On the other hand, in the downstream cover member 162 located on the downstream side, the downstream first cover member 162a is located upstream in the substrate transport direction A, and the downstream second cover member 162b is located downstream in the substrate transport direction A.

[0042] 5 and 9, the upstream cover member 161 has an upstream first cover member 161a located on the tip side, an upstream second cover member 161b located on the base end side, and an upstream cover bent portion 161c provided between the upstream first cover member 161a and the upstream second cover member 161b. In the aspect shown in Fig. 10, the upstream cover member 161 has an upstream first cover member 161a located on the tip side, an upstream second cover member 161b located on the base end side, and an upstream cover bent portion 161c provided between the upstream first cover member 161a and the upstream second cover member 161b, and the downstream cover member 162 has a downstream first cover member 162a located on the tip side, a downstream second cover member 162b located on the base end side, and a downstream cover bent portion 162c provided between the downstream first cover member 162a and the downstream second cover member 162b.

[0043] When guide member 150 has first guide member 150a located on the tip end side, second guide member 150b located on the base end side, and guide bent portion 150c provided between first guide member 150a and second guide member 150b, the tip of first cover member 160a may be located closer to supply units 120 and 130 than guide bent portion 150c. By adopting such an embodiment, the gap formed between the tip of first cover member 160a and second guide member 150b can be made smaller, and the effect of preventing molten solder S that splashes when molten solder S guided by guide member 150 falls to the liquid surface of molten solder S from adhering to substrate 200 can be further improved.

[0044] 11 , an imaginary line L connecting the surface position of first guide member 150a located on the tip side with respect to molten solder S and the tip of first cover member 160a may be positioned on the side of supply unit 120, 130. In FIG. 11 , an embodiment is shown in which imaginary line L connecting the surface position of upstream first guide member 151a located on the tip side with respect to molten solder S and the tip of upstream first cover member 161a is positioned so as to abut against the side of first supply unit 120.

[0045] In the present embodiment, the description has been given mainly of an embodiment in which guide member 150 or both guide member 150 and cover member 160 are provided, but an embodiment in which only either guide member 150 or cover member 160 is provided can also be adopted, or an embodiment in which cover member 160 is provided but guide member 150 is not provided can also be adopted, as shown in Figures 15 and 16. If guide member 150 is not provided, molten solder S will splash when it is supplied from supply units 120, 130 and falls into molten solder S in storage tank 110, but by providing cover member 160, it is possible to prevent the molten solder S from adhering to substrate 200 to some extent.

[0046] In this embodiment, the tip of the cover member 160 is spaced apart from the first opening 126 and the second opening 136, which are supply points for the molten solder S, in a plan view. More specifically, in a plan view, the tip of the upstream cover member 161 (the right end in FIGS. 3 to 5 , 9 , 10 , 15 , and 16 ) is spaced apart from the first opening 126 (see G1 in FIG. 8 ). Also, in a plan view, the tip of the downstream cover member 162 (the left end in FIGS. 9 , 10 , 15 , and 16 ) is spaced apart from the second opening 136 (see G2 in FIG. 8 ).

[0047] In order to promote the separation of dross generated by the oxidation of solder, the molten solder S may be provided with an oxidation separating agent such as rice bran, wheat bran, beans, sesame, sunflower, palm, rapeseed, vegetable oil, sugars such as wood flour, pine resin, ammonium chloride, amine halides, etc.

[0048] Next, an example of a method for processing the substrate 200 will be described.

[0049] When an operator places the substrate 200 on the transport rail 6, the transport unit 5 transports the substrate 200, and the substrate 200 is carried into the main body 1 through the carry-in entrance 2. When the substrate 200 reaches the top of the fluxer 10, the fluxer 10 applies flux to a predetermined location on the substrate 200.

[0050] The transport unit 5 transports the substrate 200, on which the flux has been applied by the fluxer 10, to the preheater unit 15. The preheater unit 15 heats the substrate 200 to a predetermined temperature.

[0051] Next, the transport unit 5 transports the substrate 200, which has been heated to a predetermined temperature by the preheater unit 15, to the jet soldering device 100. The jet soldering device 100 solders predetermined locations on the substrate 200. While the jet soldering device 100 is supplying the molten solder S, the molten solder S supplied from the first supply unit 120 and the molten solder S supplied from the second supply unit 130 are mixed together, and the molten solder S is supplied up to a position above the transport rail 6. At this time, the guide member 150 guides the molten solder S supplied from the supply units 120 and 130 to the molten solder S in the storage tank 110, thereby preventing the molten solder S from scattering when the molten solder S supplied from the supply units 120 and 130 lands on the molten solder S in the storage tank 110. Furthermore, by providing the cover member 160, even if the molten solder S supplied from the supply units 120 and 130 splashes when it lands on the molten solder S in the storage tank 110, the molten solder S can be prevented from adhering to the substrate.

[0052] Next, the transport unit 5 transports the soldered board 200 to the cooler 20. For example, a cooling fan of the cooler 20 cools the soldered board 200 for a predetermined time. After the board 200 has been cooled, the transport unit 5 ejects the board 200 from the discharge port 3, and the soldering process on the board 200 is completed.

[0053] Next, the results of an experiment conducted by the inventors of the present application to confirm the effects of this embodiment will be described.

[0054] Soldering was performed under the following soldering conditions: (Soldering conditions) Soldering equipment: Senju Metal "BITHUS-Wave MTF-300" Flux application equipment: Spray fluxer (Senju Metal "SSF-400") Flux application amount: 70 mL / m ２ Conveyor speed (transport speed of transport section 5): 1.2 m / min. Board temperature (average temperature): 120°C. Solder bath temperature: 199°C. Solder alloy composition: Sn-58Bi

[0055] As Example 1, the configuration shown in Fig. 12 was adopted. The angle (angle with respect to the horizontal plane) θ2 of the second guide member 150b located on the base end side (supply side) with respect to the liquid surface of the molten solder S was 40 degrees, and the angle (angle with respect to the horizontal plane) θ1 of the first guide member 150a located on the tip end side (opposite the supply side) with respect to the liquid surface of the molten solder S was 20 degrees. As Example 2, the configuration shown in Fig. 13 was adopted. The angle (angle with respect to the horizontal plane) θ1 of the guide member 150 with respect to the liquid surface of the molten solder S was 40 degrees. As a comparative example, a configuration in which the guide member 150 and the cover member 160 were not provided was also adopted.

[0056] The soldering apparatus was operated under the above conditions for two hours. After that, the scattering of molten solder S adhering to the underside of the component placed above the conveying rail 6 was observed. In the comparative example without the guide member 150 and cover member 160, numerous scatterings occurred (see FIG. 14A). On the other hand, in the configurations of Examples 1 and 2, the scattering of molten solder S adhering to the underside of the component placed above the conveying rail 6 was minimal (see FIGS. 14B and 14C). More specifically, in the configuration of Example 1, almost no scattering of molten solder S adhering to the underside of the component placed above the conveying rail 6 was observed (see FIG. 14B). In the configuration of Example 2, a small amount of scattering of molten solder S was observed on the underside of the component placed above the conveying rail 6 (see FIG. 14C). Therefore, it was confirmed that beneficial effects could be obtained by adopting the configuration of this embodiment, and particularly, it was confirmed that extremely beneficial effects could be obtained by adopting the configuration in which θ1 is smaller than θ2, as in Example 1.

[0057] The above-mentioned description of each embodiment and the disclosure of the drawings are merely examples for explaining the inventions described in the claims, and the inventions described in the claims are not limited by the above-mentioned description of each embodiment or the disclosure of the drawings. Furthermore, the description of the claims as originally filed is merely an example, and the description of the claims may be changed as appropriate based on the description in the specification, drawings, etc.

[0058] 110 Reservoir S Molten solder 120 First supply unit 130 Second supply unit 150 Guide member 150a First guide member 150b Second guide member 150c Guide bending portion 160 Cover member 160a First cover member 160b Second cover member 160c Cover bending portion

Claims

1. A jet soldering apparatus comprising a supply unit for supplying molten solder, a storage tank for storing the molten solder, and a guide member for guiding the molten solder supplied from the supply unit to the molten solder in the storage tank, wherein the guide member is immersed at an angle of 40 degrees or less with respect to the liquid level of the molten solder in the storage tank.

2. The jet soldering apparatus according to claim 1, wherein the guide member has a first guide member located on the tip side, a second guide member located on the base end side, and a guide bending portion provided between the first guide member and the second guide member, the first guide member is immersed at an angle of 40 degrees or less with respect to the liquid level of the molten solder in the storage tank, and the angle of the second guide member with respect to the liquid level of the molten solder in the storage tank is larger than the angle of the first guide member with respect to the liquid level of the molten solder in the storage tank.

3. The jet soldering apparatus according to claim 1 or 2, further comprising a cover member located above at least a portion where the guide member is immersed in the liquid level of the molten solder in the storage tank.

4. The jet soldering apparatus according to claim 3, wherein the cover member extends toward the supply unit side, and the tip of the cover member is located on the supply unit side of the portion where the guide member is immersed in the liquid level of the molten solder in the storage tank.

5. The jet soldering apparatus according to claim 3, wherein the cover member has a first cover member located on the tip side, a second cover member located on the base end side, and a cover bending portion provided between the first cover member and the second cover member, and the first cover member is bent downward with respect to the second cover member via the cover bending portion.

6. The jet soldering apparatus according to claim 5, wherein the guide member has a first guide member located on the tip side, a second guide member located on the base end side, and a guide bending portion provided between the first guide member and the second guide member, and the tip of the first cover member is located on the supply unit side of the guide bending portion.

7. The jet soldering apparatus according to claim 1 or 2, wherein the guide member is immersed at an angle exceeding 0 degrees with respect to the liquid level of the molten solder in the storage tank.

8. The jet soldering apparatus according to claim 1 or 2, wherein the guide member has a plurality of holes.

9. A supply unit for supplying molten solder, a storage tank for storing the molten solder, and a guide member for guiding the molten solder supplied from the supply unit to the molten solder in the storage tank. The guide member includes a first guide member located on the tip side, a second guide member located on the base end side, and a guide bending portion provided between the first guide member and the second guide member. The first guide member is a jet solder device that is immersed with respect to the liquid level of the molten solder in the storage tank.

10. It includes a cover member provided above the molten solder in the storage tank and extending from the side surface of the storage tank toward the supply location of the molten solder in the supply unit. The cover member includes a first cover member located on the tip side, a second cover member located on the base end side, and a cover bending portion provided between the first cover member and the second cover member. The virtual straight line connecting the landing position of the first guide member with respect to the molten solder and the tip of the first cover member is positioned on the side surface of the supply unit. The jet solder device according to claim 9.

11. A supply unit for supplying molten solder, a storage tank for storing the molten solder, and a cover member provided above the molten solder in the storage tank and extending from the side surface of the storage tank toward the supply location of the molten solder in the supply unit. The jet solder device, wherein the tip of the cover member and the supply location are spaced apart in a plan view.

12. It includes a guide member for guiding the molten solder supplied from the supply unit to the molten solder in the storage tank. The guide member is immersed at an angle of 40 degrees or less with respect to the liquid level of the molten solder in the storage tank. The virtual straight line connecting the landing position of the guide member with respect to the molten solder and the tip of the cover member is positioned on the side surface of the supply unit. The jet solder device according to claim 11.

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