Photosensitive composition, film, optical filter, optical filter manufacturing method, solid-state imaging element, and image display device

Abstract

This photosensitive composition comprises a coloring material, a resin, a polymerizable compound, a photopolymerization initiator, a solvent, and a compound A represented by formula (1). This film, optical filter, optical filter manufacturing method, solid-state imaging element, and image display device all have said photosensitive composition used therein.

Description

Photosensitive composition, film, optical filter, method for manufacturing optical filter, solid-state imaging device and image display device

[0001] The present invention relates to a photosensitive composition containing a colorant, and also to a film, an optical filter, a method for producing an optical filter, a solid-state imaging device, and an image display device using the photosensitive composition.

[0002] In recent years, the widespread use of digital cameras and camera-equipped mobile phones has led to a significant increase in demand for solid-state imaging devices such as charge-coupled device (CCD) image sensors. Color filters are used as key devices in displays and optical elements. Color filters typically have pixels of the three primary colors, red, green, and blue, and serve to separate transmitted light into the three primary colors.

[0003] The pixels of each color of the color filter are produced by forming a pattern using a photosensitive composition containing a coloring material by photolithography.

[0004] As described in Patent Document 1, such a photosensitive composition contains a coloring material, a resin, a polymerizable compound, a photopolymerization initiator, and a solvent.

[0005] Japanese Patent Application Laid-Open No. 2022-063556

[0006] In recent years, efforts have been made to improve the resolution of solid-state imaging devices equipped with optical filters such as color filters, and further miniaturization of pixel sizes for optical filters such as color filters has been studied.

[0007] When pixels are formed by forming a pattern using a photosensitive composition using a method such as photolithography, defects may occur on the pixel surface during pixel formation. However, as the pixel size becomes smaller, defects tend to occur more easily on the pixel surface.

[0008] Therefore, an object of the present invention is to provide a photosensitive composition capable of forming pixels in which the occurrence of chipping is suppressed. Another object of the present invention is to provide a film, an optical filter, a method for manufacturing an optical filter, a solid-state imaging device, and an image display device.

[0009] The present inventors have found through their investigations that the above object can be achieved by using a photosensitive composition as described below, and have thus completed the present invention.

[0010] <1> A photosensitive composition containing a colorant, a resin, a polymerizable compound, a photopolymerization initiator, a solvent, and a compound A represented by formula (1); In formula (1), R １ and R ２ each independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, a group having 1 to 6 carbon atoms containing an acid group, or a group having 1 to 6 carbon atoms containing an amino group; X １ represents a linear or branched alkylene group, n represents an integer of 1 or more, and when n is 2 or more, a plurality of X １ may be the same or different. <2> X in the above formula (1) １ At least one of R is an ethylene group; １ and R ２ <3> The photosensitive composition according to <1>, wherein X in the formula (1) is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. １ is an ethylene group, and R １ and R ２ <4> The photosensitive composition according to <1>, wherein R in the formula (1) is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. １ and R ２is a hydrogen atom. <5> The photosensitive composition according to any one of <1> to <4>, wherein the molecular weight of the compound A is 150 to 2,000. <6> The photosensitive composition according to any one of <1> to <5>, wherein the content of the compound A in the photosensitive composition is 0.01 to 5.0 mass %. <7> The photosensitive composition according to any one of <1> to <6>, wherein the content of the coloring material in the total solid content of the photosensitive composition is 55 mass % or more. <8> A film obtained using the photosensitive composition according to any one of <1> to <7>. <9> An optical filter having the film according to <8>. <10> A method for producing an optical filter, comprising the steps of forming a composition layer on a support using the photosensitive composition according to any one of <1> to <7>, and forming a pattern in the composition layer by photolithography. <11> A solid-state imaging device having the film according to <8>. <12> An image display device having the film according to <8>.

[0011] According to the present invention, a photosensitive composition capable of forming pixels in which the occurrence of chipping is suppressed can be provided. The present invention also provides a film, an optical filter, a method for manufacturing an optical filter, a solid-state imaging device, and an image display device.

[0012] 1 is a side cross-sectional view showing one embodiment of the support body; FIG.

[0013] The present invention will be described in detail below. In this specification, the term "to" is used to mean that the numerical values ​​before and after the term are included as the lower and upper limits. In the description of groups (atomic groups) in this specification, a term without specifying whether it is substituted or unsubstituted encompasses both unsubstituted groups (atomic groups) and substituted groups (atomic groups). For example, the term "alkyl group" encompasses not only unsubstituted alkyl groups (unsubstituted alkyl groups) but also substituted alkyl groups (substituted alkyl groups). In this specification, unless otherwise specified, "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. Examples of light used for exposure include the bright line spectrum of a mercury lamp, far ultraviolet light typified by excimer lasers, extreme ultraviolet light (EUV light), X-rays, electron beams, and other actinic rays or radiation. As used herein, "(meth)acrylate" refers to either or both of acrylate and methacrylate, "(meth)acrylic" refers to either or both of acrylic and methacrylic, and "(meth)acryloyl" refers to either or both of acryloyl and methacryloyl. In the structural formulae herein, Me refers to a methyl group, Et refers to an ethyl group, Bu refers to a butyl group, and Ph refers to a phenyl group. As used herein, the weight-average molecular weight and number-average molecular weight are polystyrene-equivalent values ​​measured by GPC (gel permeation chromatography). As used herein, the term "total solids" refers to the total mass of all components of a composition excluding the solvent. As used herein, the term "pigment" refers to a coloring material that is difficult to dissolve in a solvent. As used herein, the term "process" refers not only to an independent process, but also to a process that cannot be clearly distinguished from other processes, as long as the intended effect of the process is achieved.

[0014] <Photosensitive Composition> The photosensitive composition of the present invention is characterized by containing a colorant, a resin, a polymerizable compound, a photopolymerization initiator, a solvent, and a compound A represented by formula (1).

[0015] The photosensitive composition of the present invention can form pixels in which chipping is suppressed. The reason for this effect is presumed to be as follows. It is presumed that the photosensitive composition of the present invention contains compound A represented by formula (1), which can impart appropriate flexibility to the film obtained by compound A represented by formula (1), thereby suppressing chipping during development.

[0016] Furthermore, as the content of the coloring material in the total solid content of the photosensitive composition increases, chipping tends to occur in the pixels when pixels are formed by patterning using a photolithography method, but the photosensitive composition of the present invention can suppress chipping even when the content of the coloring material in the total solid content of the photosensitive composition is high. Therefore, the effects of the present invention are more pronounced when pixels are formed by patterning using a photosensitive composition having a high content of the coloring material in the total solid content of the photosensitive composition.

[0017] In recent years, the formation of pixels in regions partitioned by partition walls on a support having partition walls has been studied, but when pixels are formed in regions partitioned by partition walls, there is a tendency for chipping to occur in the pixels compared to when pixels are formed on a support without partition walls. However, the photosensitive composition of the present invention can suppress chipping even when pixels are formed in regions partitioned by partition walls on a support having partition walls. Therefore, the photosensitive composition of the present invention exhibits the effects of the present invention more significantly when pixels are formed in regions partitioned by partition walls.

[0018] The photosensitive composition of the present invention is one in which compound A represented by formula (1) is further added in addition to a colorant, a resin, a polymerizable compound, a photopolymerization initiator, and a solvent, thereby containing compound A represented by formula (1) in the photosensitive composition. This differs from, for example, a composition in which compound A represented by formula (1) is contained in a composition by treating a pigment or the like with compound A represented by formula (1) or the like to form a processed pigment, and then incorporating the processed pigment into a photosensitive composition.

[0019] The photosensitive composition of the present invention is preferably used as a photosensitive composition for an optical filter. Examples of the optical filter include a color filter, an infrared transmission filter, and an infrared cut filter, and the color filter is preferred.

[0020] The color filter may have colored pixels that transmit light of a specific wavelength. Examples of the colored pixels include red, green, blue, magenta, cyan, and yellow pixels. The colored pixels of the color filter may be formed using a photosensitive composition containing a chromatic colorant.

[0021] The infrared cut filter preferably has a maximum absorption wavelength in the wavelength range of 700 to 1800 nm, more preferably in the wavelength range of 700 to 1300 nm, and even more preferably in the wavelength range of 700 to 1000 nm. The transmittance of the infrared cut filter over the entire wavelength range of 400 to 650 nm is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. The transmittance at at least one point in the wavelength range of 700 to 1800 nm is preferably 20% or less. The ratio of the absorbance Amax at the infrared cut filter's maximum absorption wavelength to the absorbance A550 at a wavelength of 550 nm (absorbance Amax / absorbance A550) is preferably 20 to 500, more preferably 50 to 500, even more preferably 70 to 450, and particularly preferably 100 to 400. The infrared cut filter can be formed using a photosensitive composition containing an infrared-absorbing colorant.

[0022] The infrared transmission filter is a filter that transmits at least a portion of infrared light. The infrared transmission filter is preferably a filter that blocks at least a portion of visible light and transmits at least a portion of infrared light. Examples of the infrared transmission filter include a filter that satisfies the spectral characteristics of a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 640 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1300 nm. The infrared transmission filter is preferably a filter that satisfies any one of the following spectral characteristics (1) to (5): (1): A filter that has a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 640 nm and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 800 to 1500 nm. (2): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 750 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 900 to 1500 nm. (3): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 830 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1000 to 1500 nm. (4): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 950 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1100 to 1500 nm. (5): A filter having a maximum transmittance of 20% or less (preferably 15% or less, more preferably 10% or less) in the wavelength range of 400 to 1050 nm, and a minimum transmittance of 70% or more (preferably 75% or more, more preferably 80% or more) in the wavelength range of 1200 to 1500 nm.

[0023] The solids concentration of the photosensitive composition of the present invention is preferably 5 to 30% by mass. The lower limit is preferably 7.5% by mass or more, more preferably 10% by mass or more. The upper limit is preferably 25% by mass or less, more preferably 20% by mass or less, and even more preferably 15% by mass or less.

[0024] Each component used in the photosensitive composition of the present invention will be described below.

[0025] <<Colorant>> The photosensitive composition of the present invention contains a colorant. Examples of the colorant include a white colorant, a black colorant, a chromatic colorant, and an infrared-absorbing colorant. In the present invention, the white colorant includes not only pure white colorants but also light gray colorants close to white (e.g., off-white, light gray, etc.).

[0026] The coloring material may be a pigment or a dye. A pigment and a dye may be used in combination. The pigment may be either an inorganic pigment or an organic pigment, but an organic pigment is preferred from the viewpoints of a wide range of color variations, ease of dispersion, safety, etc. A pigment derivative may also be used as the coloring material. When a pigment is used as the coloring material, it is preferred to use a pigment and a pigment derivative in combination.

[0027] The average primary particle diameter of the pigment and pigment derivative is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less. In this specification, the primary particle diameter of the pigment and pigment derivative can be determined from a photograph obtained by observing the primary particles of the pigment and pigment derivative using a transmission electron microscope. Specifically, the projected area of ​​the primary particles of the pigment is determined, and the corresponding circle-equivalent diameter is calculated as the primary particle diameter of the pigment. In addition, the average primary particle diameter in the present invention is the arithmetic mean value of the primary particle diameters of 400 primary particles of the pigment. Furthermore, primary particles of the pigment refer to independent particles without aggregation. The same applies to the average primary particle diameter of pigment derivatives.

[0028] The crystallite size of the pigment and pigment derivative, determined from the half-width of a peak derived from any crystal plane in an X-ray diffraction spectrum obtained using CuKα radiation as an X-ray source, is preferably 0.1 to 100 nm, more preferably 0.5 to 50 nm, even more preferably 1 to 30 nm, and particularly preferably 5 to 25 nm.

[0029] The specific surface area of ​​pigments and pigment derivatives is 1 to 300 m ２ / g. The lower limit is 10 m ２ / g or more, and ２ / g or more is more preferable. ２ / g or less, and ２ The value of the specific surface area can be determined according to the BET (Brunauer, Emmett and Teller) method in accordance with DIN 66131: Determination of the specific surface area of ​​solids by gas adsorption.

[0030] The coloring material contained in the photosensitive composition of the present invention preferably contains a chromatic coloring material, more preferably contains a chromatic coloring material and a pigment derivative. Furthermore, the chromatic coloring material preferably contains a pigment (chromatic pigment).

[0031] (Chromatic Colorant) Examples of chromatic colorants include colorants having a maximum absorption wavelength in the wavelength range of 400 to 700 nm, such as green colorants, red colorants, yellow colorants, purple colorants, blue colorants, and orange colorants.

[0032] Examples of the red colorant include a diketopyrrolopyrrole compound, an anthraquinone compound, an azo compound, a naphthol compound, an azomethine compound, a xanthene compound, a quinacridone compound, a perylene compound, and a thioindigo compound, and the like, preferably a diketopyrrolopyrrole compound, an anthraquinone compound, or an azo compound, and more preferably a diketopyrrolopyrrole compound. The red colorant is preferably a pigment (red pigment), and more preferably a diketopyrrolopyrrole pigment.

[0033] Specific examples of red colorants include C.I. (Color Index) Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2, 81:3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, Examples of red pigments include 150,155,166,168,169,170,171,172,175,176,177,178,179,184,185,187,188,190,200,202,206,207,208,209,210,216,220,224,226,242,246,254,255,264,269,270,272,279,291,294,295,296,297. In addition, as a red colorant, a compound described in paragraph number 0034 of WO 2022 / 085485, or a brominated diketopyrrolopyrrole compound described in JP-A-2020-085947 can also be used.

[0034] As the red colorant, C.I. Pigment Red 122, 177, 224, 254, 255, 264, 269, 272, and 291 are preferred, C.I. Pigment Red 254, 264, and 272 are more preferred, and C.I. Pigment Red 254 and 264 are even more preferred.

[0035] Examples of the green colorant include phthalocyanine compounds and squarylium compounds, and the phthalocyanine compounds are preferred. The green colorant is preferably a pigment (green pigment), and more preferably a phthalocyanine pigment.

[0036] Specific examples of green colorants include green pigments such as C.I. Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, 64, 65, and 66. Furthermore, halogenated zinc phthalocyanine pigments having an average of 10 to 14 halogen atoms, an average of 8 to 12 bromine atoms, and an average of 2 to 5 chlorine atoms per molecule can also be used as green colorants. Specific examples include the compounds described in WO 2015 / 118720. Furthermore, compounds described in paragraph 0029 of WO 2022 / 085485, aluminum phthalocyanine compounds described in JP-A 2020-070426, and diarylmethane compounds described in JP-A 2020-504758 can also be used as green colorants.

[0037] As the green colorant, C.I. Pigment Green 7, 36, 58, 62, and 63 are preferred.

[0038] Examples of orange colorants include diketopyrrolopyrrole compounds and azo compounds. The orange colorant is preferably a pigment (orange pigment). Specific examples of orange colorants include orange pigments such as C.I. Pigment Orange 2, 5, 13, 16, 17:1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 71, and 73.

[0039] Examples of the yellow colorant include an azo compound, an azomethine compound, an isoindoline compound, a pteridine compound, a quinophthalone compound, and a perylene compound. The yellow colorant is preferably a pigment (yellow pigment). Specific examples of the yellow colorant include C.I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125 , 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 215, 228, 231, 232, 233, 234, 235, 236 and the like.

[0040] As the yellow coloring material, an azobarbituric acid nickel complex having the following structure can also be used.

[0041] As the yellow colorant, the compounds described in paragraphs 0031 to 0033 of WO 2022 / 085485, the methine dyes described in JP-A 2019-073695, and the methine dyes described in JP-A 2019-073696 can be used.

[0042] Examples of the purple colorant include an oxazine compound, a quinacridone compound, a perylene compound, and an indigo compound, and the oxazine compound is preferred. The purple colorant is preferably a pigment (purple pigment). Specific examples of the purple colorant include purple pigments such as C.I. Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60, and 61.

[0043] Examples of blue colorants include phthalocyanine compounds and squarylium compounds, with phthalocyanine compounds being preferred. The blue colorant is preferably a pigment (blue pigment). Specific examples of blue colorants include blue pigments such as C.I. Pigment Blue 1, 2, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 22, 29, 60, 64, 66, 79, 80, 87, and 88. Furthermore, aluminum phthalocyanine compounds having phosphorus atoms can also be used as blue colorants. Specific examples include the compounds described in paragraphs 0022 to 0030 of JP-A No. 2012-247591 and paragraph 0047 of JP-A No. 2011-157478.

[0044] Dyes can also be used as chromatic colorants. There are no particular limitations on the dyes, and known dyes can be used. Examples include pyrazole azo dyes, anilino azo dyes, triarylmethane dyes, anthraquinone dyes, anthrapyridone dyes, benzylidene dyes, oxonol dyes, pyrazolotriazole azo dyes, pyridone azo dyes, cyanine dyes, phenothiazine dyes, pyrrolopyrazole azomethine dyes, xanthene dyes, phthalocyanine dyes, benzopyran dyes, indigo dyes, and pyrromethene dyes.

[0045] A dye polymer can also be used as a chromatic colorant. The dye polymer is preferably a dye dissolved in a solvent when used. The dye polymer may also form particles. When the dye polymer is particulate, it is typically used in a dispersed state in a solvent. A particulate dye polymer can be obtained, for example, by emulsion polymerization, and specific examples of the compounds and production methods described in JP-A 2015-214682 include those described in JP-A 2015-214682. The dye polymer has two or more dye structures in one molecule, preferably three or more dye structures. The upper limit is not particularly limited, but can be 100 or less. The multiple dye structures in one molecule may be the same dye structure or different dye structures. The weight-average molecular weight (Mw) of the dye polymer is preferably 2,000 to 50,000. The lower limit is more preferably 3,000 or more, and even more preferably 6,000 or more. The upper limit is more preferably 30,000 or less, and even more preferably 20,000 or less. As the dye multimer, compounds described in JP-A-2011-213925, JP-A-2013-041097, JP-A-2015-028144, JP-A-2015-030742, WO 2016 / 031442, etc. can also be used.

[0046] As chromatic colorants, triarylmethane dye polymers described in Korean Patent Publication No. 10-2020-0028160, xanthene compounds described in JP 2020-117638 A, phthalocyanine compounds described in WO 2020 / 174991 A, isoindoline compounds described in JP 2020-160279 A or salts thereof, compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069442 A, compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069730 A, compounds represented by formula 1 described in Korean Patent Publication No. 10-2020-0069070 A Compounds represented by the formula 1 described in Korean Patent Publication No. 10-2020-0069067, compounds represented by the formula 1 described in Korean Patent Publication No. 10-2020-0069062, halogenated zinc phthalocyanine pigments described in Japanese Patent No. 6809649, isoindoline compounds described in JP-A-2020-180176, phenothiazine compounds described in JP-A-2021-187913, halogenated zinc phthalocyanines described in WO 2022 / 004261, and halogenated zinc phthalocyanines described in WO 2021 / 250883 can be used. The chromatic colorant may be a rotaxane, and the dye skeleton may be used in the cyclic structure of the rotaxane, in the rod-shaped structure, or in both structures. As chromatic colorants, quinophthalone compounds represented by formula 1 in Korean Patent Publication No. 10-2020-0030759, polymer dyes described in Korean Patent Publication No. 10-2020-0061793, chromatic colorants described in JP-A-2022-029701, isoindoline compounds described in WO 2022 / 014635, aluminum phthalocyanine compounds described in WO 2022 / 024926, and JP-A-2022-045 Compounds described in Patent Publication No. 895, compounds described in WO 2022 / 050051, compounds described in JP 2020-090676, compounds described in JP 2020-055956, compounds described in JP 2021-031681, compounds described in JP 2022-056354, compounds described in US Patent Application Publication No. 2021 / 0355327, compounds described in WO 2022 / 065357,Compounds described in JP 2020-045436 A, compounds described in Korean Patent Publication No. 10-2021-0146726 A, compounds described in JP 2018-178039 A, compounds described in Chinese Patent Application Publication No. 113881244 A, compounds described in Chinese Patent Application Publication No. 113881245 A, compounds described in Chinese Patent Application Publication No. 113881246 A, compounds described in JP 2022-104822 A, compounds described in JP 2022-096701 A, compounds described in JP 2020- Compounds described in JP-A-023652, green pigments described on pages 80 to 84 of the Journal of the Color Materials Association (published in 2022), compounds described in JP-A-2022-143135, compounds described in JP-A-2022-140287, compounds described in WO 2022 / 136308, perylene compounds described in Chinese Patent Application Publication No. 113061349, cyan pigments described in Korean Patent Publication No. 10-2017-0018993, isoindoline compounds described in JP-A-2020-180176, Compounds described in JP-A-3-013209, compounds described in JP-A-2023-013166, xanthene compounds described in WO 2023 / 286526, compounds described in JP-A-2021-155746, compounds described in JP-A-2021-155747, compounds described in JP-A-2021-155748, compounds described in JP-A-2021-155749, compounds described in WO 2018 / 051876, compounds described in JP-A-2020-083981, JP-A-2023-05 Compounds described in JP-A-6463, compounds described in JP-T-2023-515473, dioxane compounds described in JP-T-2022-549530, pigment preparations described in JP-A-2022-061494, diketopyrrolopyrrole pigments described in JP-A-2023-057917, diketopyrrolopyrrole compounds described in JP-A-2023-061273, phthalocyanines described in JP-T-2023-519314, and quinophthalones described in JP-A-2023-080419 can also be used.

[0047] Two or more chromatic colorants may be used in combination. When two or more chromatic colorants are used in combination, the combination of the two or more chromatic colorants may form a black color. Examples of such combinations include the following embodiments (1) to (7). When the photosensitive composition contains two or more chromatic colorants and exhibits a black color through the combination of the two or more chromatic colorants, the photosensitive composition of the present invention can be preferably used as a photosensitive composition for forming an infrared transmission filter. (1) An embodiment containing a red colorant and a blue colorant. (2) An embodiment containing a red colorant, a blue colorant, and a yellow colorant. (3) An embodiment containing a red colorant, a blue colorant, a yellow colorant, and a purple colorant. (4) An embodiment containing a red colorant, a blue colorant, a yellow colorant, a purple colorant, and a green colorant. (5) An embodiment containing a red colorant, a blue colorant, a yellow colorant, and a green colorant. (6) An embodiment containing a red color material, a blue color material, and a green color material. (7) An embodiment containing a yellow color material and a purple color material.

[0048] (White coloring material) Examples of the white coloring material include inorganic pigments such as titanium oxide, strontium titanate, barium titanate, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silica, talc, mica, aluminum hydroxide, calcium silicate, aluminum silicate, and zinc sulfide. As the white coloring material, the white pigments described in paragraphs 0040 to 0043 of WO 2022 / 085485 can be used.

[0049] (Black Colorant) The black colorant is not particularly limited, and known materials can be used. The black colorant may be an inorganic black colorant or an organic black colorant. The black colorant is preferably a pigment. In this specification, the black colorant refers to a colorant that exhibits absorption over the entire wavelength range of 400 to 700 nm.

[0050] Examples of inorganic black colorants include carbon black, titanium black, graphite, etc., with carbon black and titanium black being preferred, and titanium black being more preferred. Titanium black is a black particle containing titanium atoms, and low-order titanium oxide or titanium oxynitride is preferred. As the titanium black, the titanium black described in paragraph 0044 of WO 2022 / 085485 can be used. As the inorganic black colorant, zirconium nitride powder described in JP 2023-048173 A can also be used.

[0051] Examples of organic black colorants include bisbenzofuranone compounds, azomethine compounds, perylene compounds, and azo compounds, with bisbenzofuranone compounds and perylene compounds being preferred. The organic black colorant may be a compound described in paragraph 0166 of International Publication No. 2022 / 065215. Furthermore, examples of organic black colorants include perylene black (such as Lumogen Black FK4280) described in paragraphs 0016 to 0020 of JP-A-2017-226821 and black azo pigments described in JP-A-2022-121935.

[0052] The black coloring material may be any of those described in pages 294 to 307 of the Journal of the Color Materials Association, Vol. 96, No. 9, 2023.

[0053] (Infrared absorbing colorant) The infrared absorbing colorant is preferably a compound having a maximum absorption wavelength longer than 700 nm. The infrared absorbing colorant is preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1800 nm, more preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1400 nm, even more preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1200 nm, and particularly preferably a compound having a maximum absorption wavelength in the wavelength range of more than 700 nm to 1000 nm. In addition, the absorbance A of the infrared absorbing colorant at a wavelength of 500 nm is １ and absorbance A at the maximum absorption wavelength ２ Ratio A １ / A ２is preferably 0.08 or less, and more preferably 0.04 or less. The infrared absorbing colorant is preferably a pigment, and more preferably an organic pigment.

[0054] Examples of infrared absorbing colorants include pyrrolopyrrole compounds, cyanine compounds, squarylium compounds, phthalocyanine compounds, naphthalocyanine compounds, quaterrylene compounds, merocyanine compounds, croconium compounds, oxonol compounds, iminium compounds, dithiol compounds, triarylmethane compounds, pyrromethene compounds, azomethine compounds, anthraquinone compounds, dibenzofuranone compounds, dithiolene metal complexes, metal oxides, metal borides, etc. Specific examples of these include the compounds described in paragraph 0114 of WO 2022 / 065215.Examples of infrared absorbing colorants include the compounds described in paragraph 0121 of WO 2022 / 065215, squarylium compounds described in JP 2020-075959 A, copper complexes described in Korean Patent Publication No. 10-2019-0135217, croconic acid compounds described in JP 2021-195515 A, infrared absorbing dyes described in JP 2022-022070 A, croconium compounds described in WO 2019 / 021767, compounds described in JP 2019-127549 A, compounds described in WO 2022 / 059619, and compounds described in JP Compounds described in JP-A-2022-151682, squarylium compounds described in JP-A-2022-188858, compounds described in JP-A-2022-184710, compounds described in JP-A-2022-189736, squarylium compounds described in JP-A-2023-004570, squarylium compounds described in WO 2019 / 230660, squarylium compounds described in WO 2020 / Compounds described in JP-A-2023-068643, diiminium compounds described in JP-A-2023-068643, squarylium compounds described in JP-A-2023-052770, phthalocyanine compounds described in Korean Patent Publication No. 10-2022-0163680, indigo monoboron complexes described in JP-A-2023-073064, phthalocyanine compounds described in JP-A-2023-066025 It is also possible to use the following compounds: phthalocyanine compounds described in JP 2020-041127 A; indigo compounds described in JP 2023-073064 A; indigo compounds described in Korean Patent Publication No. 10-2023-0016355 A; squarylium compounds described in WO 2019 / 230570 A; and diiminium compounds described in JP 2023-095824 A.

[0055] (Pigment Derivative) Examples of the pigment derivative include a compound having a colorant structure and an acid group or a basic group.

[0056] Examples of the dye structure include a quinoline dye structure, a benzimidazolone dye structure, a benzisoindole dye structure, a benzothiazole dye structure, an iminium dye structure, a squarylium dye structure, a croconium dye structure, an oxonol dye structure, a pyrrolopyrrole dye structure, a diketopyrrolopyrrole dye structure, an azo dye structure, an azomethine dye structure, a phthalocyanine dye structure, a naphthalocyanine dye structure, an anthraquinone dye structure, a quinacridone dye structure, a dioxazine dye structure, a perinone dye structure, a perylene dye structure, a thiazineindigo dye structure, a thioindigo dye structure, an isoindoline dye structure, an isoindolinone dye structure, a quinophthalone dye structure, a dithiol dye structure, a triarylmethane dye structure, and a pyrromethene dye structure.

[0057] Examples of the acid group possessed by the pigment derivative include a carboxy group, a sulfo group, a phosphate group, a boronic acid group, an imidic acid group, and salts thereof. Examples of the atom or atomic group constituting the salt include an alkali metal ion (Li ＋ , Na ＋ , K. ＋ etc.), alkaline earth metal ions (Ca ２＋ , Mg ２＋ Examples of the imide acid group include an ammonium ion, an imidazolium ion, a pyridinium ion, and a phosphonium ion. ２ NHSO ２ R Ｘ１ , -CONHSO ２ R Ｘ２ , -CONHCOR Ｘ３ or -SO ２ NHCOR Ｘ４ is preferred, and —SO ２ NHSO ２ R Ｘ１ , -CONHSO ２ R Ｘ２ , or -SO ２ NHCOR Ｘ４ is more preferred, and —SO ２ NHSO ２ R Ｘ１ or -CONHSO ２ R Ｘ２ is more preferred. Ｘ１ ~R Ｘ４R each independently represents an alkyl group or an aryl group. Ｘ１ ~R Ｘ４ The alkyl group and aryl group represented by R may have a substituent. The substituent is preferably a halogen atom, more preferably a fluorine atom. Ｘ１ ~R Ｘ４ are each independently preferably an alkyl group containing a fluorine atom or an aryl group containing a fluorine atom, and more preferably an alkyl group containing a fluorine atom. The number of carbon atoms in the alkyl group containing a fluorine atom is preferably 1 to 10, more preferably 1 to 5, and even more preferably 1 to 3. The number of carbon atoms in the aryl group containing a fluorine atom is preferably 6 to 20, more preferably 6 to 12, and even more preferably 6.

[0058] Examples of basic groups possessed by the pigment derivative include amino groups, pyridinyl groups and their salts, ammonium salts, and phthalimidomethyl groups. Examples of atoms or atomic groups that constitute the salts include hydroxide ions, halogen ions, carboxylate ions, sulfonate ions, and phenoxide ions.

[0059] The amino group is —NR ｘ１１ R ｘ１２ and a cyclic amino group.

[0060] -NR ｘ１１ R ｘ１２ In the group represented by ｘ１１ and R ｘ１２ are each independently a hydrogen atom, an alkyl group, or an aryl group, and are preferably an alkyl group. That is, the amino group is preferably a dialkylamino group. The alkyl group preferably has 1 to 10 carbon atoms, more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent. Examples of the substituent include the substituent T described above. The aryl group preferably has 6 to 30 carbon atoms, more preferably 6 to 20, and even more preferably 6 to 12. The aryl group may have a substituent. Examples of the substituent include the substituent T described above.

[0061] Examples of the cyclic amino group include a pyrrolidine group, a piperidine group, a piperazine group, a morpholine group, etc. These groups may further have a substituent.

[0062] The content of the coloring material in the total solid content of the photosensitive composition is preferably 50% by mass or more, and more preferably 55% by mass or more.

[0063] The colorant used in the photosensitive composition of the present invention preferably contains a pigment, and more preferably contains a pigment and a pigment derivative. The pigment is preferably a chromatic pigment. The content of the pigment in the colorant is preferably 20 to 100% by mass, more preferably 50 to 100% by mass, and even more preferably 70 to 100% by mass. The content of the pigment derivative is preferably 1 to 30 parts by mass, and even more preferably 3 to 20 parts by mass, per 100 parts by mass of the pigment. The total content of the pigment and pigment derivative in the colorant is preferably 25 to 100% by mass, more preferably 55 to 100% by mass, and even more preferably 75 to 100% by mass.

[0064] The photosensitive composition of the present invention may contain only one colorant or two or more colorants. When two or more colorants are contained, the total amount thereof is preferably within the above range.

[0065] <<Polymerizable Compound>> The photosensitive composition of the present invention contains a polymerizable compound. Examples of the polymerizable compound include a compound having an ethylenically unsaturated bond-containing group. Examples of the ethylenically unsaturated bond-containing group include a vinyl group, a (meth)allyl group, and a (meth)acryloyl group. The polymerizable compound is preferably a radically polymerizable compound.

[0066] The polymerizable compound may be in any chemical form, such as a monomer, prepolymer, or oligomer, but is preferably a monomer. The molecular weight of the polymerizable compound is preferably 100 to 2500. The upper limit is preferably 2000 or less, more preferably 1500 or less. The lower limit is preferably 150 or more, more preferably 250 or more.

[0067] The ethylenically unsaturated bond-containing group value (hereinafter referred to as C═C value) of the polymerizable compound is preferably 2 to 14 mmol / g from the viewpoint of storage stability of the photosensitive composition. The lower limit is preferably 3 mmol / g or more, more preferably 4 mmol / g or more, and even more preferably 5 mmol / g or more. The upper limit is preferably 12 mmol / g or less, more preferably 10 mmol / g or less, and even more preferably 8 mmol / g or less. The C═C value of the polymerizable compound is a value calculated by dividing the number of ethylenically unsaturated bond-containing groups contained in one molecule of the polymerizable compound by the molecular weight of the polymerizable compound.

[0068] The polymerizable compound is preferably a compound containing three or more ethylenically unsaturated bond-containing groups, more preferably a compound containing 3 to 15 ethylenically unsaturated bond-containing groups, and even more preferably a compound containing 3 to 6 ethylenically unsaturated bond-containing groups. Furthermore, the polymerizable compound is preferably a trifunctional to 15-functional (meth)acrylate compound, and more preferably a trifunctional to hexafunctional (meth)acrylate compound. Specific examples of the polymerizable compound include the compounds described in paragraphs 0075 to 0083 of WO 2022 / 065215 and the compounds described in Taiwan Patent Application Publication No. 201832008.

[0069] Preferred polymerizable compounds include dipentaerythritol tri(meth)acrylate (commercially available product: KAYARAD D-330, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetra(meth)acrylate (commercially available product: KAYARAD D-320, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta(meth)acrylate (commercially available product: KAYARAD D-310, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa(meth)acrylate (commercially available products: KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd., and NK Ester A-DPH-12E, manufactured by Shin-Nakamura Chemical Co., Ltd.), and compounds having a structure in which the (meth)acryloyl group is bonded via an ethylene glycol and / or propylene glycol residue (e.g., SR454, SR499, commercially available from Sartomer).Examples of polymerizable compounds include diglycerin EO (ethylene oxide) modified (meth)acrylate (commercially available product: M-460, manufactured by Toagosei Co., Ltd.), pentaerythritol tetraacrylate (NK Ester A-TMMT, manufactured by Shin-Nakamura Chemical Co., Ltd.), and 1,6-hexanediol diacrylate (KAYARAD, manufactured by Nippon Kayaku Co., Ltd.). HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), Aronix TO-2349 (manufactured by Toagosei Co., Ltd.), NK Oligo UA-7200 (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600, LINC-202UA (manufactured by Kyoeisha Chemical Co., Ltd.), 8UH-1 006, 8UH-1012 (all manufactured by Taisei Fine Chemical Co., Ltd.), Light Acrylate POB-A0 (manufactured by Kyoeisha Chemical Co., Ltd.), Aronix MT-3041, 3042 (manufactured by Toagosei Co., Ltd., polymerizable compounds containing amines), Aronix M-510, 520 (manufactured by Toagosei Co., Ltd., polymerizable compounds having an acidic group), Etercure 6361-100 (Eternal Materials, polymerizable compound having a hyperbranched structure), EBECRYL80 (amine-containing tetrafunctional monomer, manufactured by Daicel-Olknes Co., Ltd.), EBECRYL7100 (amine-containing bifunctional monomer, manufactured by Daicel-Olknes Co., Ltd.), CN371NS (amine-containing bifunctional monomer, manufactured by Arkema), HOA-MPL (2-acryloyloxyethyl-phthalic acid: manufactured by Kyoeisha Chemical Co., Ltd.), HOA-MPE (2-acryloyloxyethyl-2-hydroxyethyl-phthalic acid: manufactured by Kyoeisha Chemical Co., Ltd.), polymerizable compounds having a dendrimer structure or hyperbranched structure described in JP-A No. 2023-043479, and polymerizable compounds described in JP-A No. 2023-529984 can also be used.

[0070] The content of the polymerizable compound in the total solid content of the photosensitive composition is preferably 1 to 30% by mass. The upper limit is preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 10% by mass or less. The lower limit is preferably 3% by mass or more, and more preferably 5% by mass or more. The photosensitive composition of the present invention may contain only one type of polymerizable compound, or may contain two or more types. When two or more types of polymerizable compounds are contained, the total amount thereof is preferably within the above range.

[0071] <<Resin>> The photosensitive composition of the present invention contains a resin. The resin is blended, for example, to disperse pigments and the like in the photosensitive composition or as a binder. Note that resins used primarily to disperse pigments and the like in the photosensitive composition are also called dispersants. However, these uses of resins are merely examples, and resins can also be used for purposes other than these uses.

[0072] The weight average molecular weight (Mw) of the resin is preferably 3,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, and more preferably 500,000 or less. The lower limit is preferably 4,000 or more, and more preferably 5,000 or more.

[0073] Examples of resins include (meth)acrylic resins, epoxy resins, (meth)acrylamide resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, polyamideimide resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, and siloxane resins. Further, examples of the resin include the resins described in paragraphs 0091 to 0099 of WO 2022 / 065215, the blocked polyisocyanate resins described in JP 2016-222891 A, the resins described in JP 2020-122052 A, the resins described in JP 2020-111656 A, the resins described in JP 2020-139021 A, the resins described in JP 2017-138503 A containing a structural unit having a ring structure in the main chain and a structural unit having a biphenyl group in the side chain, and the resins described in paragraphs 0199 to 0233 of JP 2020-186373 A. Resins described above, alkali-soluble resins described in JP 2020-186325 A, resins represented by formula 1 described in Korean Patent Publication No. 10-2020-0078339 A, copolymers containing epoxy groups and acid groups described in WO 2022 / 030445 A, resins described in JP 2018-135514 A, copolymers described in JP 2020-041046 A, resins described in JP 2023-033156 A, resins described in JP 2023-030386 A, resins described in JP 2023-027753 A, resins described in JP 2020-139021 A. Resins described in JP 2023-074038 A. Resins described in JP 2023-079666 A can also be used.

[0074] The resin to be used is preferably a resin having an acid group, such as a carboxy group, a phosphate group, a sulfo group, or a phenolic hydroxy group.

[0075] The acid value of the resin having acid groups is preferably 30 to 500 mgKOH / g. The lower limit is preferably 40 mgKOH / g or more, and more preferably 50 mgKOH / g or more. The upper limit is preferably 400 mgKOH / g or less, more preferably 300 mgKOH / g or less, and even more preferably 200 mgKOH / g or less. The weight average molecular weight (Mw) of the resin having acid groups is preferably 5,000 to 100,000, and more preferably 5,000 to 50,000. The number average molecular weight (Mn) of the resin having acid groups is preferably 1,000 to 20,000.

[0076] The resin having an acid group preferably contains a repeating unit having an acid group on a side chain, and more preferably contains 5 to 70 mol% of the repeating units having an acid group on a side chain based on all repeating units of the resin. The upper limit of the content of repeating units having an acid group on a side chain is preferably 50 mol% or less, more preferably 30 mol% or less. The lower limit of the content of repeating units having an acid group on a side chain is preferably 10 mol% or more, more preferably 20 mol% or more.

[0077] For resins having acid groups, please refer to the descriptions in paragraphs

[0558] to

[0571] of JP 2012-208494 A (corresponding to paragraphs

[0685] to

[0700] of U.S. Patent Application Publication No. 2012 / 0235099 A) and paragraphs

[0076] to

[0099] of JP 2012-198408 A, the contents of which are incorporated herein by reference. Alternatively, commercially available resins having acid groups can be used. There are no particular limitations on the method for introducing acid groups into the resin, and examples include the method described in Japanese Patent No. 6,349,629 A. Furthermore, examples of methods for introducing acid groups into the resin include a method in which an acid anhydride is reacted with a hydroxy group generated by a ring-opening reaction of an epoxy group to introduce the acid group.

[0078] The photosensitive composition of the present invention also preferably contains a resin having a basic group. The resin having a basic group is preferably a resin containing a repeating unit having a basic group in a side chain, more preferably a copolymer having a repeating unit having a basic group in a side chain and a repeating unit not containing a basic group, and even more preferably a block copolymer having a repeating unit having a basic group in a side chain and a repeating unit not containing a basic group. The resin having a basic group can also be used as a dispersant. The amine value of the resin having a basic group is preferably 5 to 300 mgKOH / g. The lower limit is preferably 10 mgKOH / g or more, more preferably 20 mgKOH / g or more. The upper limit is preferably 200 mgKOH / g or less, more preferably 100 mgKOH / g or less.

[0079] Commercially available resins having basic groups include DISPERBYK-161, 162, 163, 164, 166, 167, 168, 174, 182, 183, 184, 185, 2000, 2001, 2050, 2150, 2163, 2164, and BYK-LPN6919 (all manufactured by BYK-Chemie), and Solsperse 112. 00, 13240, 13650, 13940, 24000, 26000, 28000, 32000, 32500, 32550, 32600, 33000, 34750, 35100, 35200, 37500, 38500, 39000, 53095, 56000, 7100 (all manufactured by The Lubrizol Group, Japan), Efka PX 4300, 4330, 4046, 4060, 4080 (all manufactured by BASF), and the like. In addition, the resin having a basic group may be the block copolymer (B) described in paragraphs 0063 to 0112 of JP-A-2014-219665, the block copolymer A1 described in paragraphs 0046 to 0076 of JP-A-2018-156021, or the vinyl resin having a basic group described in paragraphs 0150 to 0153 of JP-A-2019-184763, the contents of which are incorporated herein by reference.

[0080] The photosensitive composition of the present invention also preferably contains both a resin having an acid group and a resin having a basic group. According to this embodiment, the storage stability of the photosensitive composition can be further improved. When a resin having an acid group and a resin having a basic group are used in combination, the content of the resin having a basic group is preferably 20 to 500 parts by mass, more preferably 30 to 300 parts by mass, and even more preferably 50 to 200 parts by mass, per 100 parts by mass of the resin having an acid group.

[0081] It is also preferable to use a resin having an aromatic carboxy group as the resin. In a resin having an aromatic carboxy group, the aromatic carboxy group may be contained in the main chain of the repeating unit or may be contained in a side chain of the repeating unit. It is preferable that the aromatic carboxy group is contained in the main chain of the repeating unit. In this specification, an aromatic carboxy group refers to a group having a structure in which one or more carboxy groups are bonded to an aromatic ring. In the aromatic carboxy group, the number of carboxy groups bonded to the aromatic ring is preferably 1 to 4, and more preferably 1 to 2. Examples of resins having an aromatic carboxy group include the resins described in paragraphs 0082 to 0107 of WO 2021 / 166858.

[0082] It is also preferable to use a resin having a crosslinkable group as the resin. Examples of the crosslinkable group include a (meth)acryloyl group, an epoxy group, and an oxetanyl group. When a resin having a crosslinkable group is used, the content of the resin having a crosslinkable group in the resin contained in the photosensitive composition is preferably 30% by mass or more, more preferably 50% by mass or more, and even more preferably 70% by mass or more.

[0083] The photosensitive composition of the present invention preferably contains a resin as a dispersant. Examples of dispersants include acidic dispersants (acidic resins) and basic dispersants (basic resins). Here, the term "acidic dispersant (acidic resin)" refers to a resin in which the amount of acid groups is greater than the amount of basic groups. The acidic dispersant (acidic resin) is preferably a resin in which the amount of acid groups is 70 mol % or more when the total amount of acid groups and basic groups is 100 mol %. The acid group possessed by the acidic dispersant (acidic resin) is preferably a carboxy group. The acid value of the acidic dispersant (acidic resin) is preferably 10 to 105 mg KOH / g. Furthermore, the basic dispersant (basic resin) refers to a resin in which the amount of basic groups is greater than the amount of acid groups. The basic dispersant (basic resin) is preferably a resin in which the amount of basic groups is greater than the amount of acid groups when the total amount of acid groups and basic groups is 100 mol %. The basic group possessed by the basic dispersant is preferably an amino group.

[0084] The resin used as the dispersant is preferably a graft resin. For details of the graft resin, please refer to the description in paragraphs 0025 to 0094 of JP 2012-255128 A, the contents of which are incorporated herein by reference.

[0085] The resin used as the dispersant is preferably a resin having an aromatic carboxy group, such as those mentioned above.

[0086] The resin used as the dispersant is preferably a polyimine-based dispersant containing a nitrogen atom in at least one of the main chain and the side chain. The polyimine-based dispersant is preferably a resin having a main chain with a partial structure containing a functional group with a pKa of 14 or less and a side chain having 40 to 10,000 atoms, and having a basic nitrogen atom in at least one of the main chain and the side chain. There are no particular restrictions on the basic nitrogen atom, as long as it is a nitrogen atom that exhibits basicity. For details about polyimine-based dispersants, please refer to the description in paragraphs 0102 to 0166 of JP 2012-255128 A, the contents of which are incorporated herein by reference.

[0087] The resin used as a dispersant is preferably a resin having a structure in which multiple polymer chains are bonded to a core portion. Examples of such resins include dendrimers (including star-shaped polymers). Specific examples of dendrimers include polymer compounds C-1 to C-31 described in paragraphs 0196 to 0209 of JP-A-2013-043962.

[0088] The resin used as a dispersant is also preferably a resin containing a repeating unit having an ethylenically unsaturated bond-containing group in a side chain. The content of the repeating unit having an ethylenically unsaturated bond-containing group in a side chain is preferably 10 mol % or more, more preferably 10 to 80 mol %, and even more preferably 20 to 70 mol %, of all repeating units of the resin.

[0089] As the dispersant, the resin described in JP 2018-087939 A, the block copolymers (EB-1) to (EB-9) described in paragraphs 0219 to 0221 of Japanese Patent No. 6432077 A, polyethyleneimine having a polyester side chain described in WO 2016 / 104803, block copolymers described in WO 2019 / 125940 A, block polymers having an acrylamide structural unit described in JP 2020-066687 A, block polymers having an acrylamide structural unit described in JP 2020-066688 A, dispersants described in WO 2016 / 104803, and the like can also be used.

[0090] Dispersants are also available as commercially available products, and specific examples thereof include the DISPERBYK series manufactured by BYK Chemie, the SOLSPERSE series manufactured by Lubrizol Japan, the Efka series manufactured by BASF, and the AJISPER series manufactured by Ajinomoto Fine-Techno Co., Ltd. In addition, the products described in paragraph 0129 of JP 2012-137564 A and the products described in paragraph 0235 of JP 2017-194662 A can also be used as dispersants.

[0091] The content of the resin in the total solid content of the photosensitive composition is preferably 1 to 60% by mass. The lower limit is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 15% by mass or more, and particularly preferably 20% by mass or more. The upper limit is preferably 50% by mass or less, and more preferably 40% by mass or less. The content of the resin having an acid group in the total solid content of the photosensitive composition is preferably 1 to 60% by mass. The lower limit is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 15% by mass or more, and particularly preferably 20% by mass or more. The upper limit is preferably 50% by mass or less, and more preferably 40% by mass or less.

[0092] The content of the resin is preferably 100 to 1,000 parts by mass per 100 parts by mass of the polymerizable compound. The lower limit is preferably 150 parts by mass or more, and more preferably 200 parts by mass or more. The upper limit is preferably 600 parts by mass or less, and more preferably 500 parts by mass or less. The photosensitive composition of the present invention may contain only one type of resin, or may contain two or more types. When two or more types of resins are contained, the total amount thereof preferably falls within the above range.

[0093] <<Photopolymerization initiator>> The photosensitive composition of the present invention contains a photopolymerization initiator. The photopolymerization initiator is not particularly limited and can be appropriately selected from known photopolymerization initiators. For example, a compound that is photosensitive to light in the ultraviolet to visible region is preferred. The photopolymerization initiator is preferably a photoradical polymerization initiator.

[0094] Examples of the photopolymerization initiator include halogenated hydrocarbon derivatives (e.g., compounds having a triazine skeleton, compounds having an oxadiazole skeleton, etc.), acylphosphine compounds, hexaarylbiimidazole compounds, oxime compounds, organic peroxides, thio compounds, ketone compounds, aromatic onium salts, α-hydroxyketone compounds, α-aminoketone compounds, etc. From the viewpoint of exposure sensitivity, the photopolymerization initiator is preferably a trihalomethyltriazine compound, a benzyl dimethyl ketal compound, an α-hydroxyketone compound, an α-aminoketone compound, an acylphosphine compound, a phosphine oxide compound, a metallocene compound, an oxime compound, a hexaarylbiimidazole compound, an onium compound, a benzothiazole compound, a benzophenone compound, an acetophenone compound, a cyclopentadiene-benzene-iron complex, a halomethyloxadiazole compound, or a 3-aryl-substituted coumarin compound, more preferably a compound selected from an oxime compound, an α-hydroxyketone compound, an α-aminoketone compound, and an acylphosphine compound, and even more preferably an oxime compound. Further, as the photopolymerization initiator, compounds described in paragraphs 0065 to 0111 of JP-A-2014-130173, compounds described in Japanese Patent No. 6301489, compounds described in MATERIAL STAGE 37 to 60pp, vol. 19, No. 3,peroxide-based photopolymerization initiators described in WO 2019, photopolymerization initiators described in WO 2018 / 221177, photopolymerization initiators described in WO 2018 / 110179, photopolymerization initiators described in JP 2019-043864 A, photopolymerization initiators described in JP 2019-044030 A, peroxide-based initiators described in JP 2019-167313 A, aminoacetophenone-based initiators having an oxazolidine group described in JP 2020-055992 A, oxime-based photopolymerization initiators described in JP-A-2020-172619, polymers described in JP-A-2020-172619, compounds represented by formula 1 described in WO 2020 / 152120, compounds described in JP-A-2021-181406, photopolymerization initiators described in JP-A-2022-013379, compounds represented by formula (1) described in JP-A-2022-015747, fluorine-containing fluorene oxime ester-based photoinitiators described in JP-T-2021-507058, and those described in Chinese Patent Application Publication No. 110764367. Initiators described in JP-A-2022-518535, initiators described in WO 2021 / 175855, compounds described in Taiwan Patent Application Publication No. 202200534, compounds described in JP-A-2022-078550, compounds described in Korean Patent Publication No. 10-2017-0087330, compounds described in WO 2022 / 075452, oxime ester compounds described in Chinese Patent Application Publication No. 110066225, Korean Patent Publication No. 10-2022-0076157 Compounds described in WO 2019 / 013112, compounds having a triarylamine or N-arylcarbazole skeleton described in paragraphs 0042 to 0062, oxime ester photopolymerization initiators described in Japanese Patent No. 7219378, photopolymerization initiators described in Korean Patent Publication No. 10-2021-0146174, photopolymerization initiators described in WO 2019 / 013112, photopolymerization initiators described in JP 2023-033731, initiators described in JP 2022-515524, initiators described in JP 2023-517304, initiators described in Chinese Patent Publication No. 114149517, and the like.

[0095] Specific examples of hexaarylbiimidazole compounds include 2,2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5-diphenyl-1,1'-biimidazole.

[0096] Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, and Omnirad 127 (all manufactured by IGM Resins B.V.), and Irgacure 184, Irgacure 1173, Irgacure 2959, and Irgacure 127 (all manufactured by BASF). Commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379EG (all manufactured by IGM Resins B.V.), Irgacure 907, Irgacure 369, Irgacure 369E, Irgacure 379EG (all manufactured by BASF), etc. Commercially available acylphosphine compounds include Omnirad 819, Omnirad TPO (all manufactured by IGM Resins B.V.), Irgacure 819, Irgacure TPO (all manufactured by BASF), etc.

[0097] Examples of the oxime compound include the compounds described in paragraph 0142 of WO 2022 / 085485, the compounds described in Japanese Patent No. 5430746, the compounds described in Japanese Patent No. 5647738, the compounds represented by the general formula (1) of JP-A-2021-173858, and the compounds described in paragraphs 0022 to 0024, and the compounds represented by the general formula (1) of JP-A-2021-170089 and the compounds described in paragraphs 0117 to 0120. Specific examples of the oxime compound include 3-benzoyloxyiminobutan-2-one, 3-acetoxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, 2-acetoxyiminopentan-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzoyloxyimino-1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one, 2-ethoxycarbonyloxyimino-1-phenylpropan-1-one, 1-[4-(phenylthio)phenyl]-3-cyclohexyl-propane-1,2-dione-2-(O-acetyloxime), etc. Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, Irgacure OXE04, Irgacure OXE05, Irgacure OXE06, Irgacure OXE07, Irgacure OXE08, Irgacure OXE09, Irgacure OXE10, Irgacure OXE11, Irgacure OXE12, Irgacure OXE13, Irgacure OXE14, Irgacure OXE15, Irgacure OXE16, Irgacure OXE17, Irgacure OXE18, Irgacure OXE19, Irgacure OXE20, Irgacure OXE21, Irgacure OXE22, Irgacure OXE23, Irgacure OXE24, Irgacure OXE25, Irgacure OXE26, Irgacure OXE27, Irgacure OXE28, Irgacure OX OXE04 (all manufactured by BASF), TR-PBG-301, TR-PBG-304, TR-PBG-305, TR-PBG-309, TR-PBG-3054, TR-PBG-3057, TR-PBG-314, TR-PBG-327, TR-PBG-345, TR-PBG-346, TR- Examples of the oxime compound include PBG-358, TR-PBG-365, TR-PBG-380, TR-PBG-610, TR-PBG-A, and TR-PBG-B (all manufactured by TRONLY Corporation), and ADEKA OPTOMER N-1919 (manufactured by ADEKA Corporation; photopolymerization initiator 2 described in JP 2012-014052 A). In addition, it is also preferable to use, as the oxime compound, a compound that is not colorable or a compound that is highly transparent and does not easily discolor. Commercially available products include ADEKA ARCLES NCI-730, NCI-831, NCI-831E, and NCI-930 (all manufactured by ADEKA Corporation).

[0098] As the photopolymerization initiator, an oxime compound having a fluorene ring, an oxime compound having a skeleton in which at least one benzene ring of a carbazole ring is replaced with a naphthalene ring, an oxime compound having a fluorine atom, an oxime compound having a nitro group, an oxime compound having a benzofuran skeleton, an oxime compound in which a substituent having a hydroxy group is bonded to a carbazole skeleton, or a compound described in paragraphs 0143 to 0149 of WO 2022 / 085485 can also be used.

[0099] As the photopolymerization initiator, a compound represented by formula (OX-1) can also be used.

[0100] In formula (OX-1), X １ａ represents a divalent linking group containing at least one ring selected from the group consisting of an aromatic ring and a heterocyclic ring; １ａ represents a hydrogen atom or an acyl group; R ２ａ represents an alkyl group or an aryl group; R ３ａ and R ４ａ each independently represents a hydrogen atom or an alkyl group; Alk １ and Alk ２ each independently represents an alkyl group; R ３ａ and R ４ａ may be bonded to form a ring, Alk １ and Alk ２ may be bonded to form a ring, and n represents 0 or 1.

[0101] X in formula (OX-1) １ａ Examples of the divalent linking group represented by include a divalent aromatic ring group, a divalent heterocyclic group, a divalent group in which two or more aromatic rings are bonded via a single bond or a linking group, a divalent group in which two or more heterocycles are bonded via a single bond or a linking group, and a divalent group in which an aromatic ring and a heterocycle are bonded via a single bond or a linking group. Examples of the linking group that bonds the above-mentioned aromatic rings, heterocyclic groups, or aromatic rings and heterocycles include -CH ２ -, -O-, -CO-, -S-, -NR ｘ - and groups combining these. ｘrepresents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heterocyclic group.

[0102] X in formula (OX-1) １ａ is preferably a group represented by any one of formulas (X-1) to (X-13), more preferably a group represented by formula (X-1), formula (X-2), formula (X-4), formula (X-6) or formula (X-8), and further preferably a group represented by formula (X-2) or formula (X-6). In the formula R Ｘ１ ~R Ｘ９ each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heterocyclic group, and * represents a bond.

[0103] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, and more preferably 1 to 10. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0104] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkenyl group represented by is preferably 2 to 15, and more preferably 2 to 10. The alkenyl group may be linear, branched, or cyclic. The alkenyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0105] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkynyl group represented by is preferably 2 to 15, and more preferably 2 to 10. The alkynyl group may be linear, branched, or cyclic. The alkynyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heterocyclic group.

[0106] R Ｘ１ ~R Ｘ９The number of carbon atoms in the aryl group represented by is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group.

[0107] R Ｘ１ ~R Ｘ９ The heterocyclic group represented by is preferably a 5-membered or 6-membered ring. The heteroatoms contained in the heterocyclic group are preferably oxygen atoms, nitrogen atoms, and sulfur atoms. The number of heteroatoms contained in the heterocyclic group is preferably 1 to 3. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and an aryl group.

[0108] R in formula (OX-1) １ａ represents a hydrogen atom or an acyl group, and is preferably an acyl group. １ａ The acyl group represented by is —C(O)—R １０１ It is preferable that R １０１ represents an aryl group or a heterocyclic group, and is preferably an aryl group.

[0109] R １０１ The number of carbon atoms in the aryl group represented by R is preferably 6 to 20, and more preferably 6 to 12. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group. １０１ The aryl group represented by is preferably a phenyl group, a methylphenyl group or a naphthyl group, more preferably a methylphenyl group or a naphthyl group.

[0110] R １０１ The heterocyclic group represented by is preferably a 5-membered or 6-membered ring. The heteroatoms contained in the heterocyclic group are preferably oxygen atoms, nitrogen atoms, and sulfur atoms. The number of heteroatoms contained in the heterocyclic group is preferably 1 to 3. The heterocyclic group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and an aryl group.

[0111] R in formula (OX-1)２ａ represents an alkyl group or an aryl group, and is preferably an alkyl group because the reactivity of the generated radical is high. ２ａ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. R ２ａ The alkyl group represented by R is preferably an unsubstituted linear or branched alkyl group, and more preferably an unsubstituted linear alkyl group. ２ａ The number of carbon atoms in the aryl group represented by is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent, but is preferably an unsubstituted aryl group.

[0112] R in formula (OX-1) ３ａ and R ４ａ R each independently represents a hydrogen atom or an alkyl group, and is preferably a hydrogen atom. ３ａ and R ４ａ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. R ３ａ and R ４ａ may be bonded to form a ring. The ring formed is preferably a 5- or 6-membered ring, and more preferably a 5- or 6-membered aliphatic hydrocarbon ring.

[0113] Alk of formula (OX-1) １ and Alk ２each independently represents an alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. Alk １ and Alk ２ may be bonded to form a ring, and preferably form a ring. The ring formed is preferably a 5- or 6-membered ring, more preferably a 5- or 6-membered aliphatic hydrocarbon ring, and more preferably a cyclopentane ring or a cyclohexane ring.

[0114] In formula (OX-1), n ​​represents 0 or 1, and is preferably 0.

[0115] Specific examples of the compound represented by formula (OX-1) include the compounds described in paragraphs 0092 to 0096 of JP-A No. 2012-113104 and the compound described in paragraph 0041 of JP-A No. 2012-189997.

[0116] As the photopolymerization initiator, a compound represented by formula (OX-2) can also be used.

[0117] In formula (OX-2), R １ｂ and R ２ｂ each independently represents a substituent, R ３ｂ ~R ７ｂ each independently represents a hydrogen atom or a substituent, Ar １ｂ represents an aromatic ring group or a heterocyclic group which may have a substituent; n represents 0 or 1;

[0118] R １ｂ and R ２ｂExamples of the substituent represented by include an alkyl group and an aryl group, and an alkyl group is preferred. The alkyl group preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, an alkenyl group, an alkynyl group, and a heterocyclic group. The aryl group preferably has 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms, even more preferably 6 to 10 carbon atoms, and particularly preferably 6 carbon atoms. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group.

[0119] R ３ｂ ~R ７ｂ Examples of the substituent represented by R include a halogen atom, an alkyl group, and an aryl group. Examples of the alkyl group and the aryl group include those described above. ３ｂ ~R ７ｂ is preferably a hydrogen atom.

[0120] Ar １ｂ represents an aromatic ring group or a heterocyclic group which may have a substituent, Ar １ｂ is preferably an aromatic ring group which may have a substituent. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group. Examples of the substituent include a halogen atom, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, an alkylthio group, an arylthio group, a nitro group, and an acyl group, and an acyl group is preferred. Examples of the acyl group include the acyl groups described above.

[0121] As the photopolymerization initiator, a compound represented by formula (OX-3) can also be used.

[0122] In formula (OX-3), Ar １ｃ represents a (k+m+1)-valent aromatic ring group or a (k+m+1)-valent heterocyclic group; Ar ２ｃ represents a (k+2)-valent aromatic ring group or a (k+2)-valent heterocyclic group; R １ｃ ~R ３ｃeach independently represents a substituent; １ｃ is a single bond or CR １１ｃ R １２ｃ represents R １１ｃ and R １２ｃ each independently represents a hydrogen atom, an alkyl group, or an aryl group; １ｃ Ha-CH ２ represents --, --O-- or --S--; k represents 0 or 1; m represents an integer of 0 to 4; and n represents 0 or 1.

[0123] R １ｃ and R ２ｃ Examples of the substituent represented by include an alkyl group and an aryl group, and an alkyl group is preferred. The alkyl group preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, an alkenyl group, an alkynyl group, and a heterocyclic group. The aryl group preferably has 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms, even more preferably 6 to 10 carbon atoms, and particularly preferably 6 carbon atoms. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heterocyclic group. R ２ｃ is preferably an alkyl group having a branched or cyclic structure.

[0124] R ３ｃ Examples of the substituent represented by include a halogen atom, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, and an acyl group, and an acyl group is preferred. Examples of the acyl group include the acyl groups described above.

[0125] L １ｃ is a single bond or CR １１ｃ R １２ｃ represents R １１ｃ and R １２ｃ R each independently represents a hydrogen atom, an alkyl group, or an aryl group. １１ｃ and R １２ｃ The alkyl group and aryl group in R １ｃ and R ２ｃWhen k is 1, L １ｃ is preferably a single bond.

[0126] X １ｃ is -CH ２ It represents -, -O- or -S-, and is preferably -O- or -S-.

[0127] Ar １ｃ represents a (k+m+1)-valent aromatic ring group or a (k+m+1)-valent heterocyclic group, and is preferably a (k+m+1)-valent aromatic ring group. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group.

[0128] Ar ２ｃ represents a (k+2)-valent aromatic ring group or a (k+2)-valent heterocyclic group, and is preferably a (k+2)-valent aromatic ring group. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group.

[0129] k represents 0 or 1, and is preferably 0. m represents an integer of 0 to 4, and is preferably 0 or 1, and more preferably 1. n represents 0 or 1, and is preferably 0.

[0130] Specific examples of oxime compounds that can be preferably used in the present invention are shown below, but the present invention is not limited to these.

[0131]

[0132]

[0133]

[0134]

[0135] The oxime compound is preferably a compound having a maximum absorption wavelength in the wavelength range of 350 to 500 nm, and more preferably a compound having a maximum absorption wavelength in the wavelength range of 360 to 480 nm. Furthermore, from the viewpoint of sensitivity, the molar absorption coefficient of the oxime compound at a wavelength of 365 nm or 405 nm is preferably high, more preferably 1,000 to 300,000, even more preferably 2,000 to 300,000, and particularly preferably 5,000 to 200,000. The molar absorption coefficient of the compound can be measured using a known method. For example, it is preferable to measure using a spectrophotometer (Varian Cary-5 spectrophotometer) at a concentration of 0.01 g / L using ethyl acetate as a solvent.

[0136] As the photopolymerization initiator, it is also preferable to use a combination of Irgacure OXE01 (manufactured by BASF) and / or Irgacure OXE02 (manufactured by BASF) and Omnirad 2959 (manufactured by IGM Resins B.V.).

[0137] As the photopolymerization initiator, a bifunctional or trifunctional or higher functional photoradical polymerization initiator may be used. By using such a photoradical polymerization initiator, two or more radicals are generated from one molecule of the photoradical polymerization initiator, thereby obtaining good sensitivity. Furthermore, when a compound with an asymmetric structure is used, crystallinity is reduced and solubility in solvents is improved, making it less likely to precipitate over time, thereby improving the storage stability of the photosensitive composition. Specific examples of bifunctional or trifunctional or higher functional photoradical polymerization initiators include the compounds described in paragraph 0148 of WO 2022 / 065215.

[0138] The content of the photopolymerization initiator in the total solid content of the photosensitive composition is preferably 0.1 to 20% by mass. The lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more, and even more preferably 1.5% by mass or more. The upper limit is preferably 15% by mass or less, more preferably 10% by mass or less. In the photosensitive composition of the present invention, only one type of photopolymerization initiator may be used, or two or more types may be used. When two or more types are used, the total amount thereof preferably falls within the above range.

[0139] <<Specific Compound>> The photosensitive composition of the present invention contains a compound A represented by formula (1) (hereinafter also referred to as a specific compound). In formula (1), R １ and R ２ each independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, a group having 1 to 6 carbon atoms containing an acid group, or a group having 1 to 6 carbon atoms containing an amino group; X １ represents a linear or branched alkylene group, n represents an integer of 1 or more, and when n is 2 or more, a plurality of X １ may be the same or different.

[0140] R １ and R ２ The number of carbon atoms in the alkyl group represented by is preferably 1 to 3, and more preferably 1 or 2. The alkyl group is preferably a methyl group or an ethyl group, and is more preferably a methyl group because it allows for the formation of pixels in which the occurrence of chipping is further suppressed.

[0141] R １ and R ２ The aryl group having 6 to 12 carbon atoms represented by is preferably a phenyl group or a naphthyl group, more preferably a phenyl group.

[0142] R １ and R ２ With regard to the group having 1 to 6 carbon atoms containing an acid group represented by the formula (I), examples of the acid group include a carboxy group, a sulfo group, and a phosphate group.

[0143] R １ and R ２ The amino group may be any of the following: -NRa １ Ra ２ Examples include those represented by the formula: Ra １ and Ra ２ each independently represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms.

[0144] R １ and R ２are preferably each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, because this allows for the formation of pixels in which the occurrence of chipping is further suppressed. In addition to the above effects, it is also preferable that R １ and R ２ Preferably, one of R is a hydrogen atom and the other is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; １ and R ２ is more preferably a hydrogen atom. １ and R ２ At least one of these is preferably an alkyl group, more preferably a methyl group.

[0145] X １ represents a linear or branched alkylene group, and is preferably a linear alkylene group. The alkylene group preferably has 1 to 5 carbon atoms, and more preferably has 1 to 3 carbon atoms. X １ is preferably an ethylene group.

[0146] When n is 2 or more, multiple X １ may be the same or different, but are preferably the same. １ At least one of X is preferably an ethylene group. １ is more preferably an ethylene group.

[0147] In formula (1), n ​​represents an integer of 1 or more. The upper limit of n is preferably 500 or less, more preferably 50 or less, and even more preferably 15 or less. The lower limit of n is preferably 2 or more, and more preferably 4 or more.

[0148] The molecular weight of the specific compound is preferably 100 to 30,000, more preferably 100 to 10,000, and even more preferably 100 to 5,000. It is particularly preferably 150 to 2,000, because this allows for the formation of pixels with reduced chipping. The upper limit of the molecular weight is preferably 1,000 or less, more preferably 800 or less, and even more preferably 500 or less. In this specification, the molecular weight of the specific compound refers to the value calculated from the structural formula of the specific compound when the molecular weight can be calculated from the structural formula; when calculation from the structural formula is difficult, it refers to the number average molecular weight. The number average molecular weight of the specific compound is a polystyrene-equivalent value measured by GPC (gel permeation chromatography).

[0149] The boiling point of the specific compound is preferably 150°C to 1000°C, more preferably 250°C to 900°C, and even more preferably 300°C to 800°C, and particularly preferably 320°C to 700°C, because this allows for the formation of pixels in which chipping is further suppressed.

[0150] Specific examples of the specific compound include polyethylene glycol 200, polyethylene glycol 400, polyethylene glycol 1000, polyethylene glycol 20000, polyethylene glycol monomethyl ether 550, polyethylene glycol dimethyl ether 550, diethylene glycol monoethyl ether, triethylene glycol monoethyl ether, ethylene glycol monobutyl ether, triethylene glycol monobutyl ether, polypropylene glycol 400, dipropylene glycol monobutyl ether, tripropylene glycol monobutyl ether, diethylene glycol monophenyl ether, (2-butoxyethoxy)acetic acid, and 2-[2-(2-aminoethoxy)ethoxy]ethanol.

[0151] The content of the specific compound in the photosensitive composition is preferably 0.01 to 5.0% by mass. The upper limit is preferably 2.0% by mass or less, more preferably 1.5% by mass or less, and even more preferably 1.0% by mass or less. The lower limit is preferably 0.05% by mass or more. Only one type of the specific compound may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount thereof is within the above range.

[0152] <<Solvent>> The photosensitive composition of the present invention contains a solvent. Examples of the solvent include organic solvents. The type of solvent is basically not particularly limited as long as the solubility of each component and the coatability of the composition are satisfied. Examples of organic solvents include ester-based solvents, ketone-based solvents, alcohol-based solvents, amide-based solvents, ether-based solvents, and hydrocarbon-based solvents. For details of these, please refer to paragraph 0223 of WO 2015 / 166779, the contents of which are incorporated herein by reference. Furthermore, ester-based solvents substituted with a cyclic alkyl group and ketone-based solvents substituted with a cyclic alkyl group can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether ... Examples of suitable ethylene glycol monomethyl ether acetate include 3-methoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, propylene glycol diacetate, 3-methoxybutanol, methyl ethyl ketone, gamma butyrolactone, sulfolane, anisole, 1,4-diacetoxybutane, diethylene glycol monoethyl ether acetate, butane-1,3-diyl diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as diacetone alcohol, 4-hydroxy-4-methyl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, and isopropyl alcohol.However, it may be preferable to reduce the amount of aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) used as organic solvents for environmental reasons (for example, the amount may be 50 ppm by mass (parts per million) or less, 10 ppm by mass or less, or 1 ppm by mass or less, relative to the total amount of organic solvents).

[0153] The metal content of the organic solvent is preferably low. The metal content of the organic solvent is preferably, for example, 10 parts per billion (ppb) by mass or less. If necessary, an organic solvent having a metal content of ppt (parts per trillion) by mass may be used, and such an organic solvent is provided, for example, by Toyo Gosei Co., Ltd. (The Chemical Daily, November 13, 2015).

[0154] Methods for removing impurities such as metals from organic solvents include, for example, distillation (molecular distillation, thin-film distillation, etc.) and filtration using a filter. The pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The filter material is preferably polytetrafluoroethylene, polyethylene, or nylon.

[0155] The organic solvent may contain isomers (compounds having the same number of atoms but different structures). The organic solvent may contain only one type of isomer or multiple types of isomers.

[0156] The organic solvent preferably has a peroxide content of 0.8 mmol / L or less, and more preferably contains substantially no peroxide.

[0157] The content of the solvent in the photosensitive composition is preferably from 10 to 95% by mass, more preferably from 20 to 90% by mass, and even more preferably from 30 to 90% by mass.

[0158] From the viewpoint of environmental regulations, the photosensitive composition of the present invention preferably does not substantially contain environmentally restricted substances. In the present invention, "substantially does not contain environmentally restricted substances" means that the content of environmentally restricted substances in the photosensitive composition is 50 mass ppm or less, preferably 30 mass ppm or less, more preferably 10 mass ppm or less, and particularly preferably 1 mass ppm or less. Examples of environmentally restricted substances include benzene; alkylbenzenes such as toluene and xylene; and halogenated benzenes such as chlorobenzene. These substances are registered as environmentally restricted substances under the REACH (Registration Evaluation Authorization and Restriction of Chemicals) regulations, the PRTR (Pollutant Release and Transfer Register) Act, the VOC (Volatile Organic Compounds) regulations, etc., and their usage amounts and handling methods are strictly regulated. These compounds may be used as solvents when producing components used in photosensitive compositions, and may be mixed into the photosensitive composition as residual solvents. From the viewpoints of human safety and environmental considerations, it is preferable to reduce these substances as much as possible. Methods for reducing environmentally restricted substances include heating or reducing the pressure in the system to a temperature above the boiling point of the environmentally restricted substance, thereby distilling off the environmentally restricted substance from the system. Furthermore, when distilling off a small amount of environmentally regulated substances, it is useful to perform azeotropy with a solvent having a boiling point equivalent to that of the solvent in question in order to increase efficiency. Furthermore, when a radically polymerizable compound is contained, a polymerization inhibitor or the like may be added before distillation under reduced pressure to prevent intermolecular crosslinking due to the progress of a radical polymerization reaction during distillation under reduced pressure. These distillation methods can be used at any stage, such as the stage of raw materials, the stage of a product obtained by reacting the raw materials (e.g., a resin solution or a polyfunctional monomer solution after polymerization), or the stage of a photosensitive composition prepared by mixing these compounds.

[0159] <<Ionic Compound>> The photosensitive composition of the present invention contains a cation CX ＋ and anion CZ －The compound may contain a salt of the compound (hereinafter also referred to as an ionic compound).

[0160] The ionic compound preferably has a specific absorbance represented by formula (Aλ) of 5 or less, more preferably 3 or less, and even more preferably 1 or less. The specific absorbance represented by formula (Aλ) is an index showing the degree to which the ionic compound absorbs light in the visible range. The smaller the specific absorbance represented by formula (Aλ), the lower the absorbance of light in the visible range. The lower limit of the specific absorbance is not limited. When a lower limit of the specific absorbance is set, the specific absorbance represented by formula (Aλ) may be determined to be 0.001 or more.

[0161] E １ = A １ / (c １ ×l １ )...(Aλ) In formula (Aλ), E １ represents the specific absorbance of the ionic compound at the maximum absorption wavelength in the wavelength range of 400 to 700 nm, and A １ represents the absorbance of the ionic compound at the maximum absorption wavelength in the wavelength range of 400 to 700 nm, and １ represents the cell length in cm, and c １ represents the concentration of the ionic compound in solution, expressed in mg / ml.

[0162] In the formula (Aλ), “A １ The absorbance represented by " is measured by the following method. A measurement sample is prepared using an ionic compound and a solvent in which the ionic compound is sufficiently soluble. If the ionic compound has sufficient solubility in methanol, methanol is used as the solvent. If the ionic compound does not have sufficient solubility in methanol, cyclohexanone is used as the solvent. The absorbance of the measurement sample at 25°C (room temperature) is measured using a cell with an optical path length of 1 cm.

[0163] The molecular weight of the ionic compound is preferably 80 to 5000. The upper limit is preferably 3000 or less, more preferably 2000 or less, even more preferably 1500 or less, and particularly preferably 1210 or less. The lower limit is preferably 100 or more, more preferably 200 or more.

[0164] Anion CZ in ionic compounds － Examples of the anion CZ include an imide anion, a methide anion, a borate anion, an anion containing a phosphorus atom, and a sulfonate anion. The anion CZ is preferably an imide anion, a methide anion, or a borate anion, and more preferably an imide anion or a borate anion. － is also preferably an anion containing at least one selected from a fluorine atom and a sulfur atom.

[0165] Anion CZ of ionic compounds － From the viewpoint of storage stability of the photosensitive composition, the pKa of the conjugate acid is preferably 0 or less, more preferably -5 or less, even more preferably -8 or less, even more preferably -10 or less, and particularly preferably -10.5 or less. There is no particular limitation on the lower limit, but it can be -20 or more, or can be -18 or more. The pKa of the conjugate acid can be measured, for example, by the method described in J. Org. Chem. 2011, 76, 391-395.

[0166] In ionic compounds, the cation CX ＋ As anion CZ － Any structure that can cancel out the electric charges will suffice.

[0167] Cation CX ＋ The molecular weight of anion CZ － The molecular weight is preferably 2 to 500, more preferably 2 to 200, and even more preferably 6 to 90, because this makes it easier to reduce the ionic bond energy with the polymer.

[0168] Cation CX ＋is preferably a cation of a single metal atom, a carbocation, an ammonium cation, a phosphonium cation or a sulfonium cation, and more preferably a cation of a single metal atom or an ammonium cation. ＋ It is also preferable that is a divalent or higher cation. According to this embodiment, a stronger film can be formed, and chipping of the film after development can be more effectively suppressed.

[0169] Specific examples of the ionic compound include the compounds shown below.

[0170] The content of the ionic compound in the total solid content of the photosensitive composition is preferably 0.1 to 15% by mass. The upper limit is preferably 12% by mass or less, and more preferably 10% by mass or less. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. Only one type of ionic compound may be used, or two or more types may be used. When two or more types are used, the total amount thereof preferably falls within the above range.

[0171] <<Polyalkyleneimine>> The photosensitive composition of the present invention can also contain a polyalkyleneimine. The polyalkyleneimine is used, for example, as a dispersing aid for pigments. A dispersing aid is a material for improving the dispersibility of coloring materials such as pigments in a photosensitive composition. The polyalkyleneimine is a polymer obtained by ring-opening polymerization of an alkyleneimine. The polyalkyleneimine is preferably a polymer having a branched structure containing a primary amino group, a secondary amino group, and a tertiary amino group. The alkyleneimine preferably has 2 to 6 carbon atoms, more preferably 2 to 4 carbon atoms, even more preferably 2 or 3 carbon atoms, and particularly preferably 2 carbon atoms.

[0172] The molecular weight of the polyalkyleneimine is preferably 200 or more, more preferably 250 or more. The upper limit is preferably 100,000 or less, more preferably 50,000 or less, even more preferably 10,000 or less, and particularly preferably 2,000 or less. Regarding the molecular weight value of the polyalkyleneimine, if the molecular weight can be calculated from the structural formula, the molecular weight of the polyalkyleneimine is the value calculated from the structural formula. On the other hand, if the molecular weight of the specific amine compound cannot be calculated from the structural formula or calculation is difficult, the number average molecular weight value measured by the boiling point elevation method is used. If the number average molecular weight cannot be measured by the boiling point elevation method or is difficult to measure, the number average molecular weight value measured by the viscosity method is used. If the number average molecular weight cannot be measured by the viscosity method or is difficult to measure, the number average molecular weight value measured in terms of polystyrene by GPC (gel permeation chromatography) is used.

[0173] The amine value of the polyalkyleneimine is preferably 5 mmol / g or more, more preferably 10 mmol / g or more, and even more preferably 15 mmol / g or more.

[0174] Specific examples of alkyleneimines include ethyleneimine, propyleneimine, 1,2-butyleneimine, and 2,3-butyleneimine, with ethyleneimine or propyleneimine being preferred, and ethyleneimine being more preferred. It is particularly preferred that the polyalkyleneimine be polyethyleneimine. Furthermore, the polyethyleneimine preferably contains primary amino groups in an amount of 10 mol% or more, more preferably 20 mol% or more, and even more preferably 30 mol% or more, based on the total of primary amino groups, secondary amino groups, and tertiary amino groups. Commercially available polyethyleneimines include Epomin SP-003, SP-006, SP-012, SP-018, SP-200, and P-1000 (all manufactured by Nippon Shokubai Co., Ltd.).

[0175] The content of the polyalkyleneimine in the total solid content of the photosensitive composition is preferably 0.1 to 5% by mass. The lower limit is preferably 0.2% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1% by mass or more. The upper limit is preferably 4.5% by mass or less, more preferably 4% by mass or less, and even more preferably 3% by mass or less. The content of the polyalkyleneimine is preferably 0.5 to 20 parts by mass per 100 parts by mass of the pigment. The lower limit is preferably 0.6 parts by mass or more, more preferably 1 part by mass or more, and even more preferably 2 parts by mass or more. The upper limit is preferably 10 parts by mass or less, and even more preferably 8 parts by mass or less. Only one type of polyalkyleneimine may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount thereof is in the above-mentioned range.

[0176] <<Compound Having a Cyclic Ether Group>> The photosensitive composition of the present invention can contain a compound having a cyclic ether group. Examples of the cyclic ether group include an epoxy group and an oxetanyl group. The epoxy group may be an alicyclic epoxy group. The alicyclic epoxy group refers to a monovalent functional group having a cyclic structure in which an epoxy ring and a saturated hydrocarbon ring are condensed. The compound having a cyclic ether group is preferably a compound having an epoxy group (hereinafter also referred to as an epoxy compound). Examples of epoxy compounds include compounds having one or more epoxy groups per molecule, and compounds having two or more epoxy groups are preferred. The epoxy compound is preferably a compound having 1 to 100 epoxy groups per molecule. The upper limit of the number of epoxy groups contained in the epoxy compound can be, for example, 10 or less, or 5 or less. The lower limit of the number of epoxy groups contained in the epoxy compound is preferably 2 or more.

[0177] Examples of compounds having a cyclic ether group include the compounds described in paragraphs 0034 to 0036 of JP-A-2013-011869, 0147 to 0156 of JP-A-2014-043556, and 0085 to 0092 of JP-A-2014-089408, and the compounds described in JP-A-2017-179172, the xanthene epoxy resins described in JP-A-2021-195421, and the xanthene epoxy resins described in JP-A-2021-195422 can be used.

[0178] The compound having a cyclic ether group may be a low molecular weight compound (for example, a molecular weight of less than 2000, or even less than 1000) or a high molecular weight compound (macromolecule) (for example, a molecular weight of 1000 or more, and in the case of a polymer, a weight average molecular weight of 1000 or more). The weight average molecular weight of the compound having a cyclic ether group is preferably 200 to 100,000, and more preferably 500 to 50,000. The upper limit of the weight average molecular weight is preferably 10,000 or less, more preferably 5,000 or less, and even more preferably 3,000 or less.

[0179] Commercially available examples of compounds having a cyclic ether group include EHPE3150 (manufactured by Daicel Corporation), EPICLON N-695 (manufactured by DIC Corporation), Marproof G-0150M, G-0105SA, G-0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, and G-01758 (all manufactured by NOF Corporation, epoxy group-containing polymers).

[0180] The content of the compound having a cyclic ether group in the total solid content of the photosensitive composition is preferably 0.1 to 20% by mass. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. The upper limit is preferably 15% by mass or less, and more preferably 10% by mass or less. Only one type of compound having a cyclic ether group may be used, or two or more types may be used. When two or more types are used, the total amount thereof preferably falls within the above range.

[0181] <<Curing Accelerator>> The photosensitive composition of the present invention may contain a curing accelerator. Examples of the curing accelerator include thiol compounds, methylol compounds, amine compounds, phosphonium salt compounds, amidine salt compounds, amide compounds, base generators, isocyanate compounds, alkoxysilane compounds, and onium salt compounds. Specific examples of the curing accelerator include the compounds described in paragraph 0164 of WO 2022 / 085485 and the compounds described in JP 2021-181406 A. The content of the curing accelerator in the total solids content of the photosensitive composition is preferably 0.3 to 8.9% by mass, more preferably 0.8 to 6.4% by mass.

[0182] <<UV Absorber>> The photosensitive composition of the present invention may contain an UV absorber. Examples of UV absorbers include conjugated diene compounds, aminodiene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriazine compounds, indole compounds, triazine compounds, and dibenzoyl compounds. Specific examples of such compounds include the compound described in paragraph 0179 of WO 2022 / 085485, the reactive triazine UV absorber described in JP 2021-178918 A, the UV absorber described in JP 2022-007884 A, the compound described in Korean Patent Publication No. 10-2022-0014454, and the compound described in JP 2023-013321 A. The content of the UV absorber in the total solids content of the photosensitive composition is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass. The ultraviolet absorber may be used alone or in combination of two or more kinds. When two or more kinds are used, the total amount thereof is preferably in the above range.

[0183] <<Polymerization Inhibitor>> The photosensitive composition of the present invention may contain a polymerization inhibitor. Examples of polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-methyl-6-t-butylphenol), and N-nitrosophenylhydroxyamine salts (ammonium salts, cerous salts, etc.). Of these, p-methoxyphenol is preferred. The content of the polymerization inhibitor in the total solids content of the photosensitive composition is preferably 0.0001 to 5 mass%. One type of polymerization inhibitor may be used alone, or two or more types may be used. When two or more types are used, the total amount preferably falls within the above range.

[0184] <<Silane Coupling Agent>> The photosensitive composition of the present invention may contain a silane coupling agent. Examples of the silane coupling agent include silane compounds having a hydrolyzable group, and preferably a silane compound having both a hydrolyzable group and another functional group. The hydrolyzable group refers to a substituent directly bonded to a silicon atom that can form a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, and an acyloxy group, with an alkoxy group being preferred. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. Examples of functional groups other than the hydrolyzable group include a vinyl group, a (meth)allyl group, a (meth)acryloyl group, a mercapto group, an epoxy group, an oxetanyl group, an amino group, a ureido group, a sulfide group, an isocyanate group, and a phenyl group, with an amino group, a (meth)acryloyl group, and an epoxy group being preferred. Specific examples of the silane coupling agent include the compound described in paragraph 0177 of WO 2022 / 085485 and the compound described in JP 2019-183020 A. The content of the silane coupling agent in the total solid content of the photosensitive composition is preferably 0.1 to 15% by mass. The upper limit is preferably 10% by mass or less, more preferably 5% by mass or less. The lower limit is preferably 0.5% by mass or more, more preferably 1% by mass or more. The silane coupling agent may be one type or two or more types. When two or more types are used, it is preferable that the total amount is within the above range.

[0185] <<Surfactant>> The photosensitive composition of the present invention may contain a surfactant. As the surfactant, various surfactants such as a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone-based surfactant may be used. The surfactant is preferably a silicone-based surfactant or a fluorine-based surfactant, and more preferably a silicone-based surfactant. For details of the surfactant, reference may be made to the surfactants described in paragraphs 0238 to 0245 of WO 2015 / 166779, the contents of which are incorporated herein by reference.

[0186] As the fluorine-based surfactant, compounds described in paragraphs 0167 to 0173 of WO 2022 / 085485 can be used.

[0187] Examples of nonionic surfactants include the compounds described in paragraph 0174 of WO 2022 / 085485.

[0188] Silicone surfactants include DOWSIL SH8400, SH8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, and SF 8419. OIL (all manufactured by Dow Toray Industries, Inc.), TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (all manufactured by Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-333, BYK-3760, BYK-UV3510 (all manufactured by BYK-Chemie). Furthermore, compounds having the following structure can also be used as the silicone surfactant.

[0189] The content of the surfactant in the total solid content of the photosensitive composition is preferably 0.001% by mass to 5.0% by mass, more preferably 0.005% by mass to 3.0% by mass. The surfactant may be one type or two or more types. When two or more types are used, the total amount preferably falls within the above range.

[0190] <<Antioxidant>> The photosensitive composition of the present invention may contain an antioxidant. Examples of antioxidants include phenolic antioxidants, amine antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants. Examples of phenolic antioxidants include hindered phenol compounds. The phenolic antioxidant is preferably a compound having a substituent at the position adjacent to the phenolic hydroxy group (ortho position). The substituent is preferably a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms. The antioxidant is also preferably a compound having a phenol group and a phosphite ester group in the same molecule. Examples of phosphorus-based antioxidants include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2]dioxaphosphepin-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphepin-2-yl)oxy]ethyl]amine, ethyl bis(2,4-di-tert-butyl-6-methylphenyl)phosphite, and tris(2,4-di-tert-butylphenyl)phosphite. Commercially available antioxidants include, for example, ADK STAB AO-20, ADK STAB AO-30, ADK STAB AO-40, ADK STAB AO-50, ADK STAB AO-50F, ADK STAB AO-60, ADK STAB AO-60G, ADK STAB AO-80, ADK STAB AO-330 (manufactured by ADEKA Corporation), and JP-650 (manufactured by Johoku Chemical Industry Co., Ltd.). Antioxidants include the compounds described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967, the compounds described in WO 2017 / 006600, the compounds described in WO 2017 / 164024, and the compounds described in Korean Patent Publication No. 10-2019-0059371. The content of the antioxidant in the total solid content of the photosensitive composition is preferably 0.01 to 20 mass %, more preferably 0.3 to 15 mass %. Only one antioxidant may be used, or two or more antioxidants may be used. When two or more antioxidants are used, the total amount thereof preferably falls within the above range.

[0191] <<Other Components>> The photosensitive composition of the present invention may contain, as necessary, a sensitizer, a plasticizer, and other auxiliary agents (e.g., conductive particles, fillers, antifoaming agents, flame retardants, leveling agents, peeling promoters, fragrances, surface tension modifiers, chain transfer agents, etc.). By appropriately incorporating these components, properties such as film physical properties can be adjusted. As these components, the compounds described in paragraph 0182 of WO 2022 / 085485 can be used.

[0192] The photosensitive composition of the present invention may contain a metal oxide in order to adjust the refractive index of the resulting film. Examples of the metal oxide include TiO ２ , ZrO ２ , Al ２ O ３ , SiO ２ The primary particle size of the metal oxide is preferably 1 to 100 nm, more preferably 3 to 70 nm, and even more preferably 5 to 50 nm. The metal oxide may have a core-shell structure. In this case, the core may be hollow.

[0193] The photosensitive composition of the present invention may contain a light resistance improver. Examples of the light resistance improver include the compounds described in paragraph 0183 of WO 2022 / 085485.

[0194] It is also preferable that the photosensitive composition of the present invention is substantially free of terephthalic acid esters. Here, "substantially free" means that the content of terephthalic acid esters in the total amount of the photosensitive composition is 1,000 ppb by mass or less, more preferably 100 ppb by mass or less, and particularly preferably zero.

[0195] In view of environmental regulations, the photosensitive composition of the present invention preferably has a melamine content of 10,000 ppm by mass or less.

[0196] The photosensitive composition of the present invention preferably has a free metal content of 100 ppm or less, more preferably 50 ppm or less. The free halogen content is preferably 100 ppm or less, more preferably 50 ppm or less. Methods for reducing the free metals and halogens in the photosensitive composition include washing with ion-exchanged water, filtration, ultrafiltration, and purification with an ion-exchange resin.

[0197] From the standpoint of environmental regulations, the use of perfluoroalkylsulfonic acids and their salts, and perfluoroalkylcarboxylic acids and their salts may be restricted. When the content of the above-mentioned compounds in the photosensitive composition of the present invention is reduced, the content of perfluoroalkylsulfonic acids (particularly perfluoroalkylsulfonic acids having a perfluoroalkyl group with 6 to 8 carbon atoms) and their salts, and perfluoroalkylcarboxylic acids (particularly perfluoroalkylcarboxylic acids having a perfluoroalkyl group with 6 to 8 carbon atoms) and their salts is preferably in the range of 0.01 ppb to 1000 ppb, more preferably in the range of 0.05 ppb to 500 ppb, and even more preferably in the range of 0.1 ppb to 300 ppb, relative to the total solids content of the photosensitive composition. The photosensitive composition of the present invention may be substantially free of perfluoroalkylsulfonic acids and their salts, and perfluoroalkylcarboxylic acids and their salts. For example, by using a compound that can replace perfluoroalkyl sulfonic acid and its salt, and a compound that can replace perfluoroalkyl carboxylic acid and its salt, a photosensitive composition that is substantially free of perfluoroalkyl sulfonic acid and its salt, and perfluoroalkyl carboxylic acid and its salt may be selected. Examples of compounds that can replace regulated compounds include compounds that are exempt from regulation due to differences in the number of carbon atoms in the perfluoroalkyl group. However, the above does not preclude the use of perfluoroalkyl sulfonic acid and its salt, and perfluoroalkyl carboxylic acid and its salt. The photosensitive composition of the present invention may contain perfluoroalkyl sulfonic acid and its salt, and perfluoroalkyl carboxylic acid and its salt, within the maximum allowable range.

[0198] The water content of the photosensitive composition of the present invention is usually 3% by mass or less, preferably 0.01 to 1.5% by mass, and more preferably 0.1 to 1.0% by mass. The water content can be measured by the Karl Fischer method.

[0199] The photosensitive composition of the present invention can be used by adjusting its viscosity for the purposes of adjusting the film surface state (flatness, etc.), film thickness, etc. The viscosity value can be appropriately selected as needed, but is preferably 0.3 mPa·s to 50 mPa·s, and more preferably 0.5 mPa·s to 20 mPa·s at 25°C. The viscosity can be measured, for example, using a cone-plate type viscometer at a temperature adjusted to 25°C.

[0200] <<Storage Container>> The storage container for the photosensitive composition is not particularly limited, and any known storage container can be used. In addition, the container described in paragraph 0187 of WO 2022 / 085485 can be used as the storage container.

[0201] <Method for preparing photosensitive composition> The photosensitive composition of the present invention can be prepared by mixing the above-mentioned components. When preparing the photosensitive composition, all components may be simultaneously dissolved and / or dispersed in a solvent to prepare the photosensitive composition, or, if necessary, each component may be prepared as two or more appropriate solutions or dispersions, which are mixed at the time of use (coating) to prepare the photosensitive composition.

[0202] The preparation of the photosensitive composition preferably includes a process for dispersing the pigment. Mechanical forces used to disperse the pigment in the process include compression, squeezing, impact, shear, and cavitation. Specific examples of these processes include a bead mill, a sand mill, a roll mill, a ball mill, a paint shaker, a microfluidizer, a high-speed impeller, a sand grinder, a flow jet mixer, high-pressure wet atomization, and ultrasonic dispersion. Furthermore, when grinding the pigment in a sand mill (bead mill), it is preferable to use small-diameter beads, increase the bead packing ratio, or otherwise increase the grinding efficiency under such conditions. Furthermore, it is preferable to remove coarse particles after the grinding process by filtration, centrifugation, or the like. In addition, the process and disperser for dispersing pigments can be suitably used, for example, the process and disperser described in "Dispersion Technology Encyclopedia," published by Joho Kiko Co., Ltd., July 15, 2005, or "Dispersion Technology and Industrial Applications Focused on Suspension (Solid / Liquid Dispersion System) - Comprehensive Data Collection," published by the Management Development Center Publishing Department, October 10, 1978, and paragraph 0022 of JP 2015-157893 A. In addition, in the process for dispersing pigments, particle refinement may be performed in a salt milling process. For details on the materials, equipment, processing conditions, etc. used in the salt milling process, see, for example, JP 2015-194521 A and JP 2012-046629 A. Examples of materials for beads used in dispersion include zirconia, agate, quartz, titania, tungsten carbide, silicon nitride, alumina, stainless steel, and glass. The beads may also be made of an inorganic compound having a Mohs hardness of at least 2. The photosensitive composition may contain 1 to 10,000 ppm of the above beads.

[0203] When preparing the photosensitive composition, it is preferable to filter the photosensitive composition with a filter for the purpose of removing foreign matter, reducing defects, etc. Examples of the types of filters and filtration methods used for filtration include the filters and filtration methods described in paragraphs 0196 to 0199 of WO 2022 / 085485.

[0204] <Film> The film of the present invention is a film obtained from the photosensitive composition of the present invention described above. The film of the present invention can be used in optical filters such as color filters, infrared transmission filters, and infrared cut filters.

[0205] The thickness of the film of the present invention can be adjusted appropriately depending on the purpose. For example, the thickness is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less. The lower limit of the thickness is preferably 0.1 μm or more, more preferably 0.2 μm or more, and even more preferably 0.3 μm or more.

[0206] When the film of the present invention is used as a color filter, the film of the present invention preferably has a green, red, blue, cyan, magenta, or yellow hue. The film of the present invention can also be preferably used as a color pixel of a color filter. Examples of the color pixel include a red pixel, a green pixel, a blue pixel, a magenta pixel, a cyan pixel, and a yellow pixel.

[0207] <Optical Filter> The film of the present invention can be used in an optical filter. Types of optical filters include color filters, infrared cut filters, and infrared transmission filters, and a color filter is preferred. The color filter preferably has the film of the present invention as its pixel, and more preferably has the film of the present invention as a colored pixel.

[0208] The optical filter may have a protective layer provided on the surface of the film of the present invention. By providing a protective layer, various functions can be imparted, such as oxygen blocking, low reflectivity, hydrophilicity / hydrophobicity, and blocking of light of specific wavelengths (ultraviolet rays, infrared rays, etc.). The thickness of the protective layer is preferably 0.01 to 10 μm, more preferably 0.1 to 5 μm. Methods for forming the protective layer include a method of applying a resin composition for forming the protective layer, a chemical vapor deposition method, and a method of attaching a molded resin with an adhesive. Components constituting the protective layer include (meth)acrylic resin, ene-thiol resin, polycarbonate resin, polyether resin, polyarylate resin, polysulfone resin, polyethersulfone resin, polyphenylene resin, polyarylene ether phosphine oxide resin, polyimide resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, polyol resin, polyvinylidene chloride resin, melamine resin, urethane resin, aramid resin, polyamide resin, alkyd resin, epoxy resin, modified silicone resin, fluororesin, polyacrylonitrile resin, cellulose resin, Si, C, W, Al ２ O ３ , Mo, SiO ２ , Si ２ N ４ For example, in the case of a protective layer intended to block oxygen, the protective layer may contain a polyol resin and SiO ２ and Si ２ N ４ In the case of a protective layer intended to reduce reflection, the protective layer preferably contains a (meth)acrylic resin and a fluorine resin.

[0209] When forming a protective layer by applying a resin composition, known methods such as spin coating, casting, screen printing, and inkjet printing can be used as the method for applying the resin composition. Known organic solvents (e.g., propylene glycol 1-monomethyl ether 2-acetate, cyclopentanone, ethyl lactate, etc.) can be used as the organic solvent contained in the resin composition. When forming the protective layer by chemical vapor deposition, known chemical vapor deposition methods (thermal chemical vapor deposition, plasma chemical vapor deposition, photochemical vapor deposition) can be used as the chemical vapor deposition method.

[0210] The protective layer may contain additives such as organic or inorganic fine particles, absorbers for light of specific wavelengths (e.g., ultraviolet light, infrared light, etc.), refractive index adjusters, antioxidants, adhesives, and surfactants, as needed. Examples of organic or inorganic fine particles include polymeric fine particles (e.g., silicone resin fine particles, polystyrene fine particles, and melamine resin fine particles), titanium oxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, titanium nitride, titanium oxynitride, magnesium fluoride, hollow silica, silica, calcium carbonate, and barium sulfate. Known absorbers for light of specific wavelengths can be used. The content of these additives can be adjusted as appropriate, but is preferably 0.1 to 70% by mass, and more preferably 1 to 60% by mass, of the total mass of the protective layer.

[0211] As the protective layer, the protective layers described in paragraphs 0073 to 0092 of JP-A-2017-151176 can also be used.

[0212] The optical filter may have a structure in which each pixel is embedded in a space partitioned by partition walls, for example, in a grid pattern.

[0213] <Method for manufacturing optical filter> A method for manufacturing an optical filter using the photosensitive composition of the present invention will be described. The method for manufacturing an optical filter includes the steps of forming a composition layer on a support using the photosensitive composition of the present invention, and forming a pattern in the composition layer by photolithography. The pattern formation method using photolithography preferably includes the steps of exposing the composition layer to light in a pattern and developing and removing the unexposed areas of the composition layer.

[0214] In the step of forming a composition layer, a composition layer is formed on a support using the photosensitive composition of the present invention. The support is not particularly limited and can be appropriately selected depending on the application. Examples include a glass substrate and a silicon substrate, with a silicon substrate being preferred. The silicon substrate may also be formed with a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), a transparent conductive film, or the like. A black matrix is ​​sometimes formed on the silicon substrate to isolate each pixel. The silicon substrate may also be provided with an underlayer to improve adhesion with an upper layer, prevent diffusion of substances, or flatten the substrate surface. The surface contact angle of the underlayer is preferably 20 to 70° when measured with diiodomethane. It is also preferably 30 to 80° when measured with water.

[0215] The support may have partition walls. FIG. 1 is a side cross-sectional view showing one embodiment of a support having partition walls, and FIG. 2 is a plan view of the support as viewed from directly above. In FIG. 1 , partition walls 11 are formed on the surface of the support 10. As shown in FIG. 2 , a plurality of regions partitioned by the partition walls 11 are provided on the surface of the support 10. Note that in FIG. 2 , the partition walls 11 are formed in a lattice pattern on the surface of the support 10, and the shape of the region partitioned by the partition walls 11 on the support 10 (hereinafter also referred to as the shape of the opening of the partition wall) is square. However, the shape of the opening of the partition wall 11 is not particularly limited and may be, for example, rectangular, circular, elliptical, polygonal, or the like. Furthermore, in FIG. 1 , the partition wall 11 is columnar, but the shape of the partition wall is not limited to a columnar shape and may be forward tapered or reverse tapered. Furthermore, the width of the partition wall may be gradually increased or decreased from the support side toward the tip. The forward tapered shape refers to a shape in which the width of the partition wall continuously decreases from the support side toward the tip, the inverse tapered shape refers to a shape in which the width of the partition wall continuously increases from the support side toward the tip, and the columnar shape refers to a shape in which the width of the partition wall is approximately the same on the support side and the tip side.

[0216] The width W1 of the partition wall 11 is preferably 20 to 500 nm. The lower limit is preferably 30 nm or more, more preferably 40 nm or more, and even more preferably 50 nm or more. The upper limit is preferably 300 nm or less, more preferably 200 nm or less, and even more preferably 100 nm or less.

[0217] The thickness (height) H1 of the partition wall 11 is preferably 200 nm or more, more preferably 300 nm or more, and even more preferably 400 nm or more. The upper limit is preferably 200% or less of the pixel thickness, more preferably 150% or less of the pixel thickness, and even more preferably substantially the same as the pixel thickness. The ratio of the height to the width of the partition wall 11 (height / width) is preferably 1 to 100, more preferably 5 to 50, and even more preferably 5 to 30.

[0218] In this specification, the thickness of the partition wall means the length of the partition wall in the vertical direction, and the width of the partition wall means the length of the partition wall in the horizontal direction.

[0219] The pitch W3 of the partition walls 11 arranged on the support 10 is preferably 400 to 1200 nm. The lower limit of the pitch W3 is preferably 450 nm or more, and more preferably 500 nm or more. The upper limit of the pitch W3 is preferably 1000 nm or less, more preferably 900 nm or less, and even more preferably 800 nm or less. In this specification, the partition wall pitch is the sum of the width W1 of the partition wall and the width W2 of the partition wall opening 12 (the distance between the opposing surfaces of partition walls arranged opposite each other).

[0220] The width W2 of the partition opening 12 is preferably 300 to 1100 nm. The lower limit is preferably 400 nm or more, and more preferably 450 nm or more. The upper limit is preferably 1000 nm or less, and more preferably 900 nm or less. The width W2 of the partition opening 12 corresponds to the width of a pixel formed between the partitions. If the width W2 of the partition opening 12 is within the above-mentioned range, it is possible to achieve a solid-state imaging device with a smaller size and higher resolution.

[0221] There is no particular limitation on the material of the partition walls 11. Examples of the material include organic materials such as siloxane resin and fluororesin, and inorganic particles such as silica particles and magnesium fluoride. The partition walls 11 preferably contain silica particles because this can increase the strength of the partition walls.

[0222] The partition walls 11 can be formed by a conventionally known method. For example, the partition walls can be formed as follows.

[0223] First, a partition wall material layer is formed on a support. The partition wall material layer can be formed, for example, by applying a composition containing inorganic particles such as silica particles (partition wall-forming composition) onto a support and then curing the composition. Examples of such compositions include the compositions described in paragraphs

[0012] to

[0077] and

[0093] to

[0105] of WO 2019 / 017280 and the compositions described in paragraphs

[0089] to

[0091] of WO 2019 / 111748, the contents of which are incorporated herein by reference.

[0224] The barrier rib material layer can also be formed by forming a film of an inorganic material such as silicon dioxide on a support by a deposition method such as chemical vapor deposition (CVD) or vacuum deposition, or by a method such as sputtering.

[0225] Next, a resist pattern is formed on the partition wall material layer using a mask having a pattern that follows the shape of the partition wall.

[0226] Next, the partition wall material layer is etched using this resist pattern as a mask to form a pattern. Examples of etching methods include dry etching and wet etching. Dry etching can be performed under the conditions described in paragraphs 0128 to 0133 of JP 2016-014856 A. Next, the resist pattern is peeled off and removed from the partition wall material layer. In this manner, the partition wall can be formed.

[0227] Although not shown, an underlayer may be provided on the surfaces of the partition wall 11 and the support 10. The provision of an underlayer can improve adhesion between the pixels and the partition wall. Furthermore, it can also suppress diffusion of components in the pixels into the partition wall and increase the strength of the partition wall. Various inorganic and organic materials can be used as the material for the underlayer. Examples of organic materials include acrylic resin, polystyrene resin, polyimide resin, and organic SOG (Spin-on-Glass) resin. The underlayer can also be formed using a composition containing a compound having an ethylenically unsaturated bond-containing group. The underlayer can also be formed using an organic silane compound such as 1,1,1,3,3,3-hexamethyldisilazane. Examples of the ethylenically unsaturated bond-containing group include vinyl groups, (meth)allyl groups, (meth)acryloyl groups, and styryl groups, with (meth)allyl groups and (meth)acryloyl groups being preferred. The compound having an ethylenically unsaturated bond-containing group may be a monomer or a resin such as a polymer. Examples of inorganic materials include silicon dioxide and aluminum oxide. The underlayer can be formed using a conventionally known method. When forming an underlayer made of an organic material, for example, the underlayer can be formed by applying a composition containing the organic material (underlayer composition) onto the partition wall and drying it. When forming an underlayer made of an inorganic material, for example, the underlayer can be formed by forming a film of the inorganic material constituting the underlayer on the surface of the partition wall by a vapor deposition method such as chemical vapor deposition (CVD) or vacuum deposition, or by a method such as sputtering.

[0228] In forming the composition layer, known methods can be used as the coating method of the photosensitive composition. For example, a dropping method (drop casting); a slit coating method; a spray method; a roll coating method; a rotary coating method (spin coating); a casting coating method; a slit and spin method; a pre-wetting method (for example, the method described in JP 2009-145395 A); inkjet (for example, on-demand method, piezo method, thermal method), various printing methods such as nozzle jet ejection printing, flexographic printing, screen printing, gravure printing, reverse offset printing, metal mask printing; a transfer method using a mold or the like; a nanoimprint method, etc. can be mentioned. In addition, the coating method described in paragraph number 0207 of WO 2022 / 085485 can also be used.

[0229] The composition layer formed on the support may be dried (prebaked). When a film is produced by a low-temperature process, prebaking may not be performed. When prebaking is performed, the prebaking temperature is preferably 150°C or lower, more preferably 120°C or lower, and even more preferably 110°C or lower. The lower limit can be, for example, 50°C or higher, or can also be 80°C or higher. The prebaking time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, and even more preferably 80 to 220 seconds. Prebaking can be performed using a hot plate, an oven, or the like.

[0230] Next, the composition layer is exposed to light in a pattern (exposure step). For example, the composition layer can be exposed to light in a pattern by using a stepper exposure machine, a scanner exposure machine, or the like, through a mask having a predetermined mask pattern. This allows the exposed portion to be cured.

[0231] Examples of radiation (light) that can be used for exposure include g-line and i-line. Light with a wavelength of 150 to 300 nm can also be used. Examples of light with a wavelength of 150 to 300 nm include KrF line (wavelength 248 nm) and ArF line (wavelength 193 nm), with KrF line (wavelength 248 nm) being preferred. Light with a wavelength of 150 to 300 nm is preferably excimer laser light with a wavelength of 150 to 300 nm. A long-wavelength light source of 300 nm or more can also be used for exposure.

[0232] In the exposure step, it is preferable to irradiate the composition layer with light having a wavelength of 150 to 300 nm (preferably excimer laser light having a wavelength of 150 to 300 nm) to expose it in a pattern.

[0233] The exposure may be performed by continuous irradiation with light or by pulsed irradiation (pulse exposure), which is an exposure method in which light is repeatedly irradiated and paused in a short cycle (for example, on the order of milliseconds or less).

[0234] The irradiation amount (exposure amount) is, for example, 0.03 to 2.5 J / cm ２ is preferred, and 0.05 to 1.0 J / cm ２ The oxygen concentration during exposure can be appropriately selected. In addition to being performed in the atmosphere, exposure may be performed in a low-oxygen atmosphere with an oxygen concentration of 19% by volume or less (e.g., 15% by volume, 5% by volume, or substantially oxygen-free), or in a high-oxygen atmosphere with an oxygen concentration of more than 21% by volume (e.g., 22% by volume, 30% by volume, or 50% by volume). The exposure illuminance can be appropriately set, and is usually 1000 W / m ２ ~100000W / m ２ (For example, 5000 W / m ２ , 15000W / m ２ , or 35,000 W / m ２ The oxygen concentration and exposure illuminance may be appropriately combined. For example, an oxygen concentration of 10% by volume and an illuminance of 10,000 W / m ２ , oxygen concentration 35% by volume, illuminance 20,000 W / m ２ etc.

[0235] Next, the unexposed portions of the composition layer are developed and removed to form a pattern (pixels). The unexposed portions of the composition layer can be developed and removed using a developer. As a result, the unexposed portions of the composition layer in the exposure step are dissolved into the developer, leaving only the photocured portions. The temperature of the developer is preferably, for example, 20 to 30°C. The development time is preferably 20 to 180 seconds. In addition, to improve residue removability, the process of shaking off the developer every 60 seconds and then supplying fresh developer may be repeated several times.

[0236] Examples of the developer include organic solvents and alkaline developers, and alkaline developers are preferably used. Regarding the developer and the washing (rinsing) method after development, the developer and washing method described in paragraph 0214 of WO 2022 / 085485 can be used.

[0237] After development and drying, it is preferable to perform additional exposure treatment or heating treatment (post-baking). The additional exposure treatment or post-baking is a post-development curing treatment to ensure complete curing. The heating temperature in post-baking is, for example, preferably 100 to 300°C, more preferably 200 to 270°C. Post-baking can be performed continuously or batchwise using a heating means such as a hot plate, convection oven (hot air circulation dryer), or high-frequency heater to achieve the above conditions for the developed film. When additional exposure treatment is performed, it is preferable that the light used for exposure has a wavelength of 400 nm or less. The additional exposure treatment may also be performed by the method described in Korean Patent Publication No. 10-2017-0122130.

[0238] <Solid-state imaging device> The solid-state imaging device of the present invention has the above-described film of the present invention. The configuration of the solid-state imaging device is not particularly limited as long as it has the film of the present invention and functions as a solid-state imaging device, but examples thereof include the following configurations.

[0239] The substrate includes a plurality of photodiodes constituting a light-receiving area of ​​a solid-state imaging device (such as a CCD (charge-coupled device) image sensor or a CMOS (complementary metal-oxide semiconductor) image sensor) and transfer electrodes made of polysilicon or the like. A light-shielding film is formed on the photodiodes and transfer electrodes, with only the light-receiving portions of the photodiodes exposed. A device protection film made of silicon nitride or the like is formed on the light-shielding film so as to cover the entire light-shielding film and the light-receiving portions of the photodiodes. A color filter is also provided on the device protection film. Furthermore, the device protection film may include a light-collecting means (e.g., a microlens, etc.; the same applies hereinafter) below the color filter (on the side closer to the substrate), or on the color filter. The color filter may have a structure in which each color pixel is embedded in a space partitioned by partition walls, for example, in a grid pattern. In this case, the partition walls preferably have a lower refractive index than the color pixels. Examples of imaging devices having such a structure include those described in JP 2012-227478 A, JP 2014-179577 A, and WO 2018 / 043654 A. Furthermore, as shown in JP 2019-211559 A, an ultraviolet absorbing layer may be provided within the structure of the solid-state imaging element to improve light resistance. An imaging device equipped with the solid-state imaging element of the present invention can be used for digital cameras, electronic devices with imaging functions (such as mobile phones), as well as in-vehicle cameras and surveillance cameras.

[0240] <Image Display Device> The image display device of the present invention has the above-described film of the present invention. Examples of image display devices include liquid crystal display devices and organic electroluminescence display devices. Definitions of image display devices and details of each image display device are described, for example, in "Electronic Display Devices" (written by Akio Sasaki, published by Kogyo Chosakai Co., Ltd. in 1990) and "Display Devices" (written by Nobuaki Ibuki, published by Sangyo Tosho Co., Ltd. in 1989). Liquid crystal display devices are described, for example, in "Next Generation Liquid Crystal Display Technology" (edited by Tatsuo Uchida, published by Kogyo Chosakai Co., Ltd. in 1994). There are no particular limitations on the liquid crystal display device to which the present invention can be applied, and the present invention can be applied to various types of liquid crystal display devices described in the above-mentioned "Next Generation Liquid Crystal Display Technology."

[0241] The present invention will be explained in more detail below with reference to examples. The materials, amounts used, ratios, treatment details, treatment procedures, etc. shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. In the structural formulas shown below, Et is an ethyl group, and iPr is an isopropyl group.

[0242] <Preparation of Dispersion Liquid> A mixture of the materials listed in the table below was mixed and dispersed for 3 hours using a bead mill (using zirconia beads with a diameter of 0.1 mm), and then further dispersed using a high-pressure disperser equipped with a pressure reducing mechanism, NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.), at a pressure of 2000 MPa and a flow rate of 500 g / min. This dispersion process was repeated 10 times to obtain each dispersion liquid.

[0243]

[0244] The details of the materials indicated by the abbreviations in the table above are as follows: (Pigments) PG7: C.I. Pigment Green 7 (phthalocyanine compound, green pigment) PG36: C.I. Pigment Green 36 (Heliogen Green L 9362, manufactured by Sun Chemical, phthalocyanine compound, green pigment) PG58: C.I. Pigment Green 58 (phthalocyanine compound, green pigment) PY139: C.I. Pigment Yellow 139 (isoindoline compound, yellow pigment) PY139A: C.I. Pigment Yellow 139 (Paliotol Yellow L 2140 HD, manufactured by Sun Chemical, isoindoline compound, yellow pigment) PY150: C.I. Pigment Yellow 150 (azo compound, yellow pigment) PY185: C.I. Pigment Yellow 185 (Paliotol Yellow L 1155, manufactured by Sun Chemical, isoindoline compound, yellow pigment) PR254: C.I. Pigment Red 254 (diketopyrrolopyrrole compound, red pigment) PR254A: C.I. Pigment Red 254 (Irgazin Red K 3842, manufactured by Sun Chemical, diketopyrrolopyrrole compound, red pigment) PR264: C.I. Pigment Red 264 (Irgazin Rubine K 4082, manufactured by Sun Chemical, diketopyrrolopyrrole compound, red pigment) PR272: C.I. Pigment Red 272 (diketopyrrolopyrrole compound, red pigment) PB15:4: C.I. Pigment Blue 15:4 (phthalocyanine compound, blue pigment) PB15:6: C.I. Pigment Blue 15:6 (Heliogen Blue D 6700 T, manufactured by Sun Chemical, phthalocyanine compound, blue pigment) PV2: C.I. Pigment Violet 2 (purple pigment) PV2A: C.I. Pigment Violet 2 (Fanal Violet D 5460, manufactured by Sun Chemical, purple pigment) PV19: C.I. Pigment Violet 19 (purple pigment)PV19A: C.I. Pigment Violet 19 (Cinquasia Violet K5350, manufactured by Sun Chemical, purple pigment) PV19B: C.I. Pigment Violet 19 (Fastogen Super Red 7100Y, manufactured by Sun Chemical, purple pigment) PV23: C.I. Pigment Violet 23 (dioxazine compound, purple pigment) PV23A: C.I. Pigment Violet 23 (Pigmosol AGRO Violet 5890, manufactured by Sun Chemical, dioxazine compound, purple pigment) PV37: C.I. Pigment Violet 37 (Cromophtal Violet K 5700, manufactured by Sun Chemical, purple pigment)

[0245] (Dye) Dye-1: Dye having the following structure (xanthene compound, purple dye)

[0246] (Pigment derivative) Syn-1: Compound having the following structure Syn-2: a compound having the following structure Syn-3: a compound having the following structure Syn-4: Compound having the following structure

[0247] (Dispersant) B-1: 30% by mass propylene glycol monomethyl ether acetate (PGMEA) solution of a resin having the following structure (the number attached to the main chain is the molar ratio of the structural units, and the number attached to the side chain is the number of structural units; weight average molecular weight: 20,000, acid value: 48.7 mgKOH / g).

[0248] B-2: 30 mass% PGMEA solution of a polymer (acid value 28 mg KOH / g, amine value 72.4 mg KOH / g, weight average molecular weight 5000) obtained by reacting 5 parts by mass of compound b-1, 5 parts by mass of compound b-2, and 90 parts by mass of compound b-3 Resin B-2 has the structure shown below.

[0249] B-3: 30% by mass PGMEA solution of a resin having the following structure (the number attached to the main chain is the molar ratio of the structural units, and the number attached to the side chain is the number of structural units; weight-average molecular weight 20,000, acid value 70.1 mgKOH / g) B-4: 30% by mass PGMEA solution of Plysurf A212C (manufactured by Daiichi Kogyo Yakuhin Co., Ltd., acid value 100 to 120 mgKOH / g) CB-1: 30% by mass PGMEA solution of a resin (weight average molecular weight 10,000) having the following structure

[0250] (Solvent) S-1: Propylene glycol monomethyl ether acetate (PGMEA) S-2: Cyclopentanone S-3: Cyclohexanone

[0251] <Preparation of Photosensitive Composition> The materials shown in the table below were mixed in the parts by mass shown in the table below, stirred, and then filtered through a nylon filter (manufactured by Nippon Pall Co., Ltd.) with a pore size of 0.45 μm to prepare a photosensitive composition. In the table below, the content of the specific compound in the photosensitive composition is shown in the "Specific Compound Concentration (% by mass)" column, and the content of the colorant (total content of pigment, dye, and pigment derivative) in the total solid content of the photosensitive composition is shown in the "Colorant Concentration (% by mass)" column. The total solid content of the photosensitive composition refers to the total mass of the components excluding the solvent.

[0252]

[0253]

[0254] The details of the materials indicated by the abbreviations in the table showing the formulation of the photosensitive composition are as follows:

[0255] (Dispersions) Dispersions R-2, R-5 to R-10, B-1, G-1, and CG-1: the above-mentioned dispersions R-2, R-5 to R-10, B-1, G-1, and CG-1

[0256] (Binder Resin) C-1: 30% by mass propylene glycol monomethyl ether acetate (PGMEA) solution of a resin having the following structure (the numerical values ​​attached to the main chain are the molar ratios of the constituent units; weight average molecular weight 11,000, acid value 69 mgKOH / g) C-2: 30% by mass propylene glycol monomethyl ether acetate (PGMEA) solution of a resin having the following structure (the numerical values ​​attached to the main chain are the molar ratios of the constituent units; weight average molecular weight 11,000, acid value 195.4 mgKOH / g) C-3: 30% by mass PGMEA solution of a resin having the following structure (the number attached to the main chain is the molar ratio of the structural units, and the number attached to the side chain is the number of structural units; weight-average molecular weight 20,000, acid value 94.7 mg KOH / g, C=C value: neutral / salt=0.62 / 0.12 (mmol / g)) CC-1: 30% by mass PGMEA solution of a resin (weight average molecular weight 20,000) having the following structure

[0257] (Polymerizable monomers (polymerizable compounds)) M-1: KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd., a compound having an ethylenically unsaturated bond-containing group) M-2: NK Ester A-TMMT (manufactured by Shin-Nakamura Chemical Co., Ltd., a compound having an ethylenically unsaturated bond-containing group) M-3: M-305 (manufactured by Toagosei Co., Ltd., a compound having an ethylenically unsaturated bond-containing group) M-4: M-350 (manufactured by Toagosei Co., Ltd., a compound having an ethylenically unsaturated bond-containing group) CM-1: NK Ester A-DPH-12ET (manufactured by Shin-Nakamura Chemical Co., Ltd., a compound having an ethylenically unsaturated bond-containing group)

[0258] (Photopolymerization initiators) I-1 to I-3, CI-1: compounds having the following structures

[0259] (Polymerization inhibitor) In-1: p-methoxyphenol

[0260] (Additives) A-1: ​​Compound having the following structure (molecular weight 2300, compound having a cyclic ether group) A-2 to A-6: Compounds having the following structures

[0261] (Specific compounds) P-1: Polyethylene glycol 200 (compound having the following structure, number average molecular weight: 200) P-2: Polyethylene glycol 400 (compound having the following structure, number average molecular weight: 400) P-3: Polyethylene glycol 1000 (compound having the following structure, number average molecular weight: 1000) P-4: Polyethylene glycol 20000 (compound having the following structure, number average molecular weight: 20000) P-5: Polyethylene glycol monomethyl ether 550 (compound having the following structure, number average molecular weight: 550) P-6: Polyethylene glycol dimethyl ether 550 (compound having the following structure, number average molecular weight: 550) P-7: Diethylene glycol monoethyl ether (compound having the following structure, molecular weight: 134) P-8: Triethylene glycol monoethyl ether (compound having the following structure, molecular weight: 178) P-9: Ethylene glycol monobutyl ether (compound having the following structure, molecular weight: 118) P-10: Triethylene glycol monobutyl ether (compound having the following structure, molecular weight: 206) P-11: (2-butoxyethoxy)acetic acid (compound with the following structure, molecular weight 176) P-12: 2-[2-(2-aminoethoxy)ethoxy]ethanol (compound with the following structure, molecular weight 149)

[0262] (Surfactant) W-1: KF-6001 (manufactured by Shin-Etsu Chemical Co., Ltd.)

[0263] (Solvent) S-1: Propylene glycol monomethyl ether acetate (PGMEA) S-3: Cyclohexanone

[0264] <Evaluation> (Pixel Defects) An underlayer composition (CT-4000, manufactured by FUJIFILM Electronic Materials Co., Ltd.) was applied by spin coating to a film thickness of 0.1 μm on an 8-inch diameter silicon wafer (Substrate A) or a support (Substrate B) having an 8-inch diameter silicon wafer on which partition walls each having a height of 0.5 μm and a width of 0.15 μm were formed at intervals of 1.0 μm, and an underlayer was formed by heating at 220°C for 1 hour using a hot plate. Each photosensitive composition was applied to the silicon wafer with the underlayer using a spin coater (manufactured by Mikasa Co., Ltd.) to a film thickness of 0.6 μm after prebaking to form a coating. Next, the silicon wafer was heated (prebaked) at 100°C for 2 minutes using a hot plate. Next, the wafer was exposed to light at 1000 mJ / cm using an i-line stepper exposure system FPA-3000i5+ (manufactured by Canon Corporation). ２ The wafer was exposed to light through a 1.0 μm square Bayer pattern mask at an exposure dose of 100 μm. Next, puddle development was performed using a 0.3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH) at 23°C for 60 seconds. The wafer was then rinsed with a spin shower and further washed with pure water to form pixels. The silicon wafer with the pixels formed thereon was divided and platinum was evaporated, after which cross-sectional scanning electron microscope (SEM) images of the pixels were obtained using a scanning electron microscope (manufactured by Hitachi High-Tech Corporation). 100 pixels were extracted from the obtained surface SEM images, and the number of pixels with defects measuring 0.1 μm or more on the pixel surface was counted, and pixel defects were evaluated according to the following evaluation criteria. Note that a "-" in the table indicates that no evaluation was performed. That is, evaluation of pixel defects on Substrate B was performed only for Examples 1 to 10, 55 to 57, and Comparative Example 1. -Evaluation criteria- 5: Of 100 pixels, the number of pixels in which chipping of 0.1 μm or more was observed was 0. 4: Of 100 pixels, the number of pixels in which chipping of 0.1 μm or more was observed was 1 or more but less than 5. 3: Of 100 pixels, the number of pixels in which chipping of 0.1 μm or more was observed was 5 or more but less than 10. 2: Of 100 pixels, the number of pixels in which chipping of 0.1 μm or more was observed was 10 or more but less than 50. 1: Of 100 pixels, the number of pixels in which chipping of 0.1 μm or more was observed was 50 or more.

[0265] (Sensitivity) An underlayer composition (CT-4000, manufactured by FUJIFILM Electronic Materials Co., Ltd.) was applied to an 8-inch diameter silicon wafer by spin coating to a film thickness of 0.1 μm, and then heated using a hot plate at 220°C for 1 hour to form an underlayer. Each photosensitive composition was applied to this silicon wafer with the underlayer using a spin coater (manufactured by Mikasa Co., Ltd.) to a film thickness of 0.6 μm after pre-baking to form a coating. Next, the coating was heated (pre-baked) at 100°C for 2 minutes using a hot plate. Next, exposure was performed using an i-line stepper exposure system FPA-3000i5+ (manufactured by Canon Corporation) through a 1.0 μm square Bayer pattern mask. Next, paddle development was performed using a 0.3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH) at 23°C for 60 seconds. Thereafter, the wafer was rinsed using a spin shower and further washed with pure water to form pixels. The silicon wafer on which the pixels were formed was observed using a scanning electron microscope (SEM) to observe the top surface of the pixels, and the line width of the pixels was evaluated according to the following evaluation criteria. Note that "-" in the table means that no evaluation was performed. -Evaluation criteria- 5: The exposure amount required to reach a line width of 1.0 μm was less than 100 mJ 4: The exposure amount required to reach a line width of 1.0 μm was 100 mJ or more but less than 300 mJ 3: The exposure amount required to reach a line width of 1.0 μm was 300 mJ or more but less than 1000 mJ 2: The exposure amount required to reach a line width of 1.0 μm was 1000 mJ or more but less than 2000 mJ 1: The exposure amount required to reach a line width of 1.0 μm was 2000 mJ or more

[0266] (Developability) An underlayer composition (CT-4000, manufactured by Fujifilm Electronic Materials Co., Ltd.) was applied to an 8-inch diameter glass wafer by spin coating to a film thickness of 0.1 μm, and then heated on a hot plate at 220°C for 1 hour to form an underlayer. Each photosensitive composition was applied to this silicon wafer with the underlayer using a spin coater (manufactured by Mikasa Co., Ltd.) to form a coating film so that the film thickness after pre-baking would be 0.6 μm. Next, paddle development was performed at 23°C for 60 seconds using a 0.3% by mass aqueous solution of tetramethylammonium hydroxide. This was followed by rinsing with a spin shower and washing with pure water to obtain a developed glass wafer. The maximum difference in absorbance (ΔAbs) between the developed glass wafer and a glass wafer with an underlayer not coated with a photosensitive composition was measured, and the developability was evaluated according to the following evaluation criteria. A smaller ΔAbs value indicates better developability. In the table, "-" means that no evaluation was performed. -Evaluation criteria- 5: ΔAbs was 0.01 or less 4: ΔAbs was greater than 0.01 and less than 0.02 3: ΔAbs was greater than 0.02 and less than 0.03 2: ΔAbs was greater than 0.03 and less than 0.04 1: ΔAbs was greater than 0.04

[0267]

[0268]

[0269] As shown in the above table, the example was able to suppress the occurrence of pixel defects.

[0270] (Examples 1001 to 1048) Photosensitive compositions were produced in the same manner as in Examples 1 to 16, except that Dispersion R-2 in Examples 1 to 16 was replaced with Dispersion R-1, R-3, or R-4, and the evaluations were carried out under the same conditions. The same evaluation results as those of the respective Examples were obtained.

[0271] (Examples 3001 to 3096) Photosensitive compositions were produced in the same manner as in Examples 23 to 38, except that Dispersion B-1 in Examples 23 to 38 was replaced with Dispersion B-2, B-3, B-4, B-5, B-6, or B-7, and the evaluations were carried out under the same conditions. The same evaluation results as those of the respective Examples were obtained.

[0272] (Examples 5001 to 5160) Photosensitive compositions were produced in the same manner as in Examples 39 to 54, except that Dispersion G-1 in Examples 39 to 54 was replaced with Dispersion G-2, G-3, G-4, G-5, G-6, G-7, G-8, G-9, G-10, or G-11, and the evaluations were carried out under the same conditions. As a result, the same evaluation results were obtained.

[0273] <Production of partition wall compositions> (Partition wall compositions 1 to 3, 6 to 8) Each component was mixed to obtain the composition shown in the table below (the numerical values ​​of the blending amounts are in parts by mass), and filtered using a DFA4201NIEY (0.45 μm nylon filter) manufactured by Nippon Pall Corporation, to produce partition wall compositions 1 to 3 and 6 to 8.

[0274]

[0275] The raw materials listed in the above table are as follows:

[0276] (Silica particle liquid) P1: A silica particle liquid prepared by adding 3.0 g of trimethylmethoxysilane as a hydrophobic treatment agent to 100.0 g of a propylene glycol monomethyl ether acetate solution (silica particle concentration 20% by mass) of silica particles (beaded silica) in which a plurality of spherical silica particles with an average particle diameter of 15 nm are connected in a beaded shape by metal oxide-containing silica (connecting material), and allowing the mixture to react at 20°C for 6 hours. In the silica particle liquid P1, the average particle diameter of the spherical silica was determined by calculating the number average of the circle-equivalent diameters of the projected images of the spherical portions of 50 spherical silica particles measured by a transmission electron microscope (TEM). Furthermore, the silica particle liquid P1 was examined by TEM observation to determine whether it contained silica particles in which a plurality of spherical silica particles were connected in a beaded shape. P2: A solution of silica particles (hollow structure silica particles) with an average particle diameter of 60 nm, manufactured by Sururia 4110 (manufactured by JGC Catalysts and Chemicals Co., Ltd.). SiO ２P3: Silica particle liquid P3 prepared by the following method. Average particle size: 5 nm, SiO ２ A reaction mother liquid was prepared by mixing 100 g of silica sol with a concentration of 20% by mass and 1,900 g of pure water, and the mixture was heated to 80° C. The pH of this reaction mother liquid was 10.5. ２ 9000 g of a 1.17 mass% sodium silicate aqueous solution as Al2O3 and 9000 g of a 0.83 mass% sodium aluminate aqueous solution as Al2O3 were simultaneously added. During this time, the temperature of the reaction solution was maintained at 80°C. The pH of the reaction solution rose to 12.5 immediately after the addition of sodium silicate and sodium aluminate, and thereafter showed almost no change. After the addition was completed, the reaction solution was cooled to room temperature and washed with an ultrafiltration membrane to obtain a SiO2 solution with a solids concentration of 20 mass%. ２ ・Al ２ O ３ A primary particle dispersion was prepared. ２ ・Al ２ O ３ 500 g of the primary particle dispersion was collected, 1700 g of pure water was added, and the mixture was heated to 98°C. While maintaining this temperature, 50400 g of sodium sulfate with a concentration of 0.5% by mass was added, and then SiO ２ 3000 g of sodium silicate aqueous solution with a concentration of 1.17 mass % and Al ２ O ３ 9000 g of a sodium aluminate aqueous solution having a concentration of 0.5% by mass as a solution was added to obtain a composite oxide microparticle dispersion. This was then washed with an ultrafiltration membrane to obtain a composite oxide microparticle dispersion with a solids concentration of 13% by mass. 1125 g of pure water was added to 500 g of this composite oxide microparticle dispersion, and concentrated hydrochloric acid (35.5%) was added dropwise to adjust the pH to 1.0, and a dealumination treatment was carried out. Next, 10 L of a hydrochloric acid aqueous solution having a pH of 3 and 5 L of pure water were added, and the dissolved aluminum salt was separated with an ultrafiltration membrane, and washed to obtain a dispersion of silica-based microparticles (1) with a solids concentration of 20% by mass. 500 g of pure water, 1750 g of ethanol, and 626 g of 28% ammonia water were added to 1500 g of this aqueous dispersion of silica-based microparticles (1), and the resulting mixture was heated to 35°C, and then ethyl silicate (SiO ２104 g of silica-based fine particles (28% by mass) was added. Then, 5 L of pure water was added and washed with an ultrafiltration membrane to prepare a dispersion of silica-based fine particles (2) with a solid content of 20% by mass. The dispersion of silica-based fine particles (2) was again subjected to hydrothermal treatment at 200°C for 11 hours, and then 5 L of pure water was added and washed with an ultrafiltration membrane to adjust the solid content to 20% by mass. The dispersion medium of this dispersion was then replaced with propylene glycol monomethyl ether using an ultrafiltration membrane to prepare an organosol with a solid content of 20% by mass. This organosol is an organosol (hereinafter referred to as "hollow silica sol A") in which hollow silica fine particles with an average particle size of 23 nm are dispersed. 200 g of hollow silica sol A (silica solid content of 20% by mass) was prepared, and the solvent was replaced with methanol using an ultrafiltration membrane to obtain SiO ２ 100 g of organosol with a water content of 20% by mass (water content is SiO ２ To this was added 28% aqueous ammonia solution so that the ammonia concentration was 100 ppm by mass per 100 g of organosol, and the mixture was thoroughly mixed. ２ A reaction solution (water content: 0.6% by mass relative to 100 parts by mass of SiO2) was added to the reaction solution. The reaction solution was heated to 50°C and heated at 50°C for 15 hours while stirring. After heating, the reaction solution was cooled to room temperature and washed with an ultrafiltration membrane to prepare silica particle solution P3 consisting of coated hollow fine particles with an SiO2 concentration of 20% by mass.

[0277] (Surfactant) W-11: Compound having the following structure (silicone-based nonionic surfactant, carbinol-modified silicone compound; weight-average molecular weight = 3000, kinematic viscosity at 25°C = 45 mm ２ / s) W-12: Compound of the following structure

[0278] (Silane coupling agent) SC-1: Additive A-5

[0279] (Solvent) S-11: 1,4-butanediol diacetate S-12: Propylene glycol monomethyl ether acetate S-13: Propylene glycol monomethyl ether S-14: Methanol S-15: Ethanol S-16: Water S-17: Compound of the following structure S-18: 1-propanol S-19: 2-propanol

[0280] (Partition wall composition 4) 300 g of cation exchange resin powder (WK-40, manufactured by Mitsubishi Chemical Corporation) was added to 1000 g of an aqueous solution containing 40 mass% tetrapropylammonium hydroxide (TPAOH, manufactured by Lion Corporation), and the mixture was stirred at 100 rpm at room temperature for 1 hour, after which the added cation exchange resin powder was removed by filtration. Next, 2100 g of anion exchange resin powder (SAT-10, manufactured by Mitsubishi Chemical Corporation) was added, and the mixture was stirred at 100 rpm at room temperature for 1 hour, after which the added anion exchange resin powder was removed by filtration. Ultrapure water was added to the resulting aqueous solution of tetrapropylammonium hydroxide (TPAOH) to adjust the concentration to 10% by mass, and the amounts of alkali metal element compounds of sodium (Na) and potassium (K), and halogen element compounds of bromine (Br) and chlorine (Cl) contained as impurities in the aqueous solution were measured by atomic absorption spectrometry (AAS method, polarized Zeeman atomic absorption spectrophotometer Z-5710 manufactured by Hitachi, Ltd.) and ion chromatography (2020i manufactured by DIONEX). Furthermore, ultrapure water was added to an aqueous solution of tetrapropylammonium hydroxide (commercially available product) before the ion exchange treatment described above to adjust the concentration to 10% by mass, and the content of impurities contained therein was similarly measured. As a result, the amounts of impurities contained in the aqueous solution before the ion exchange treatment were 50 mass ppm of sodium, 2500 mass ppm of potassium, 2250 mass ppm of bromine, and 13 mass ppm of chlorine on an elemental basis, while the contents of impurities contained in the aqueous solution after the ion exchange treatment were 10 mass ppb or less (detection limit) of sodium, 10 mass ppb (detection limit) of potassium, 1 mass ppm or less of bromine, and 1 mass ppm or less of chlorine on an elemental basis. Next, tetraethyl orthosilicate (TEOS, manufactured by Tama Chemicals Co., Ltd.), methyltrimethoxysilane (MTMS, manufactured by Shin-Etsu Chemical Co., Ltd.), and 99.5 mass% ethanol (ETOH, manufactured by Wako Pure Chemical Industries, Ltd.) were mixed, and the mixed solution was kept at a temperature of 20 ° C. and stirred at a speed of 150 rpm for 30 minutes. To these mixed solutions, a highly purified aqueous solution of tetrapropylammonium hydroxide (containing 10% by mass of TPAOH) was added dropwise over 10 minutes, and the mixture was further stirred at 200 rpm at a temperature of 20° C. for 1 hour.The mixture was then heated to 50°C, and the silica-based coating-forming components (TEOS and MTMS) were hydrolyzed for 20 hours at this temperature while stirring at 200 rpm. Next, the ethanol in the mixed solution containing the hydrolyzate of the silica-based coating-forming components was subjected to a solvent substitution process with propylene glycol monopropyl ether using a rotary evaporator, and the concentration of the silicon compound consisting of the hydrolyzate of tetraethyl orthosilicate (TEOS) and methyltrimethoxysilane (MTMS) was adjusted to convert this compound to SiO. ２ A liquid composition containing 12% by mass of the polymer was obtained. This liquid composition was designated as partition wall composition 4.

[0281] (Partition wall composition 5) Into a 500 ml three-neck flask were mixed 0.05 g (0.4 mmol) of methyltrimethoxysilane (KBM-13: manufactured by Shin-Etsu Chemical Co., Ltd.), 0.66 g (3.0 mmol) of trifluoropropyltrimethoxysilane (KBM-7103: manufactured by Shin-Etsu Chemical Co., Ltd.), 0.10 g (0.4 mmol) of trimethoxysilylpropylsuccinic anhydride (KBM-967: manufactured by Shin-Etsu Chemical Co., Ltd.), 7.97 g (34 mmol) of γ-acryloxypropyltrimethoxysilane (KBM-5103: manufactured by Shin-Etsu Chemical Co., Ltd.), and 224.37 g of a 15.6 mass % dispersion of silica particles in isopropyl alcohol (IPA-ST-UP: manufactured by Nissan Chemical Industries, Ltd.), and 163.93 g of ethylene glycol mono-t-butyl ether was added. While stirring at room temperature, an aqueous phosphoric acid solution prepared by dissolving 0.088 g of phosphoric acid in 4.09 g of water was added over 3 minutes. The flask was then immersed in a 40°C oil bath and stirred for 60 minutes, after which the oil bath was heated to 115°C over 30 minutes. One hour after the start of the temperature increase, the internal temperature of the solution reached 100°C, and the solution was then heated and stirred for 2 hours (internal temperature: 100 to 110°C), yielding partition wall composition 4. The solids concentration of the resulting partition wall composition 4 was 24.3% by mass, and the contents of polysiloxane and silica particles in the solids were 15% by mass and 85% by mass, respectively.

[0282] <Preparation of composition for forming base layer> (Composition 1 for forming base layer) 0.1 part by mass of resin A (weight average molecular weight 20,000, the number attached to the main chain is the mass ratio of the repeating unit) having the following structure, 0.01 part by mass of an epoxy compound (additive A-1 described above), 0.01 part by mass of a surfactant (KF-6000, manufactured by Shin-Etsu Chemical Co., Ltd.), and 99.88 parts by mass of propylene glycol monomethyl ether acetate were mixed together to prepare composition 1 for forming base layer.

[0283] (Undercoat layer forming composition 2) 0.7 parts by mass of a resin (Cyclomer P (ACA) 230AA, manufactured by Daicel Allnex Co., Ltd.), 0.8 parts by mass of a surfactant (KF-6000, manufactured by Shin-Etsu Chemical Co., Ltd.), and 98.5 parts by mass of propylene glycol monomethyl ether acetate were mixed to produce undercoat layer forming composition 2.

[0284] (Undercoat layer forming composition 3) 0.3 parts by mass of the above resin A, 0.02 parts by mass of a polymerizable compound (KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd.), 0.01 parts by mass of a surfactant (KF-6000, manufactured by Shin-Etsu Chemical Co., Ltd.), and 99.67 parts by mass of propylene glycol monomethyl ether acetate were mixed to produce undercoat layer forming composition 3.

[0285] <Production of Lens Material Composition> (Lens Material Composition 1) Lens material composition 1 was produced by mixing 10 parts by mass of a resin having the following structure (weight average molecular weight 19,000, the number attached to the main chain is the molar ratio of the repeating unit), 0.01 part by mass of a surfactant (Ftergent DFX-18, manufactured by Neos Corporation), 51.4 parts by mass of propylene glycol monomethyl ether acetate, and 22.0 parts by mass of propylene glycol monomethyl ether.

[0286] <Production of Solid-State Imaging Device> A silicon wafer with a diameter of 8 inches (20.32 cm) on which a silicon photodiode was formed was used as a support. After post-baking, any of partition wall compositions 1 to 8 was applied by spin coating to a film thickness of 350 nm on the surface of the silicon wafer on which the silicon photodiode was formed, and then heated on a hot plate at 100°C for 120 seconds and at 200°C for 300 seconds to form a film. When partition wall composition 5 was used, the film was further heated at 300°C for 10 minutes to form a film. These films were patterned by dry etching under the conditions described in paragraphs 0128 to 0133 of JP 2016-014856 A to form partition walls in a lattice pattern with a pitch of 0.7 μm. Any of the above-prepared underlayer compositions 1 to 3 was applied by spin coating to the silicon wafer on which the partition walls had been formed and to the surfaces of the partition walls, and the resulting mixture was heated using a hot plate at 100°C for 2 minutes and then at 230°C for 2 minutes to form an underlayer with a thickness of 10 nm on the surfaces of the silicon wafer and the partition walls. Next, a pixel-forming composition of the first color was applied by spin coating to the surface of the silicon wafer on which the partition walls had been formed, and then heated using a hot plate at 100°C for 2 minutes to form a composition layer of the first color. Next, using an i-line stepper exposure system FPA-3000i5+ (manufactured by Canon Corporation), a 150 mJ / cm ２The composition layer was exposed to an exposure dose of 0.3 wt % tetramethylammonium hydroxide (TMAH). The composition layer was then puddle-developed at 23°C for 60 seconds using a 0.3 wt % aqueous solution of tetramethylammonium hydroxide (TMAH). The layer was then rinsed with a spin shower and washed with pure water, and heated on a hot plate at 220°C for 5 minutes to form first-color pixels in the regions defined by the partition walls on the silicon wafer. The second-color pixel-forming composition and the third-color pixel-forming composition were also developed and exposed in the same manner as the first-color pixel-forming composition, thereby sequentially forming second-color pixels and third-color pixels in the regions defined by the partition walls on the silicon wafer to form an optical filter. The photosensitive composition of Example 1 was used for the first-color pixel-forming composition. The photosensitive composition of Example 39 was used for the second-color pixel-forming composition. The photosensitive composition of Example 23 was used for the third-color pixel-forming composition. Next, lens material composition 1 was applied onto this optical filter by spin coating, and then heated using a hot plate at 100°C for 2 minutes, and then heated using a hot plate at 200°C for 5 minutes to form a lens material composition layer with a film thickness of 1.2 µm. Thereafter, using a transfer method using etch-back, which is a known technique, the lens material composition layer was processed so that the height from the lens top to the lens bottom was 400 nm, thereby forming microlenses and producing a solid-state imaging device.

[0287] The partition wall compositions 1 to 8 used in the production of solid-state imaging devices can also be used as low refractive index materials for metamaterials, metasurfaces, optical members including metasurfaces, low refractive index materials for color filters, and low refractive index materials for antireflection layers.

[0288] 10: Support 11: Partition wall

Claims

1. A photosensitive composition comprising a coloring material, a resin, a polymerizable compound, a photopolymerization initiator, a solvent, and a compound A represented by formula (1); In formula (1), R １ and R ２ each independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, a group having 1 to 6 carbon atoms containing an acid group, or a group having 1 to 6 carbon atoms containing an amino group, and X １ represents a linear or branched alkylene group, n represents an integer of 1 or more, and when n is 2 or more, a plurality of X １ may be the same or different.

2. X of the formula (1) １ At least one of which is an ethylene group, and R １ and R ２ are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. The photosensitive composition according to claim 1.

3. X in the formula (1) １ is an ethylene group, and R １ and R ２ are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. The photosensitive composition according to claim 1.

4. R in the formula (1) １ and R ２ are hydrogen atoms. The photosensitive composition according to any one of claims 1 to 3.

5. The photosensitive composition according to any one of claims 1 to 3, wherein the molecular weight of the compound A is 150 to 2000.

6. The photosensitive composition according to any one of claims 1 to 3, wherein the content of the compound A in the photosensitive composition is 0.01 to 5.0% by mass.

7. The photosensitive composition according to any one of claims 1 to 3, wherein the content of the colorant in the total solid content of the photosensitive composition is 55% by mass or more.

8. A film obtained by using the photosensitive composition according to any one of claims 1 to 3.

9. An optical filter having the film according to claim 8.

10. A method for manufacturing an optical filter, comprising: a step of forming a composition layer on a support using the photosensitive composition according to any one of claims 1 to 3; and a step of forming a pattern on the composition layer by a photolithography method.

11. A solid-state imaging device having the film according to claim 8.

12. An image display device having the film according to claim 8.

Images