Resist composition comprising scattering particles and having wide viewing angle

Abstract

A photoresist including scattering particles, according to the present invention, as compared to conventional scattering films, has an improved wide viewing angle, improved total light transmittance, improved transmittance according to the viewing angle, and improved low reflectance and has no change in brightness, because stains according to the angle of light are removed and the light is scattered at various angles. In addition, the scattering particles of the present invention have significant advantages in terms of stability because the specific gravity of the scattering particles is lower than that of conventional scattering particles and thus the degree of sedimentation is less.

Description

Resist composition containing scattering particles and having a wide viewing angle

[0001] The present invention relates to a light-scattering composition comprising scattering particles and a display device comprising the same.

[0002] Demand for large-scale organic light-emitting diode displays and outdoor advertising displays has been increasing recently, and development in this area is ongoing. In particular, flat-panel displays for outdoor advertising are being installed on building exteriors, and the movable elements of these displays are highlighting the need for a wide viewing angle. To accurately convey information through these displays, brightness must be increased across a wide viewing angle.

[0003] To increase the viewing angle of flat panel displays, the following methods have been applied: stacking multiple layers of high and low refractive indices, forming microlens arrays, or introducing charged nanoparticles. However, these conventional methods suffer from the disadvantage of low light transmittance and brightness, which significantly reduces the display device's power consumption.

[0004] (Prior art literature)

[0005] (Patent Document 1) Korean Patent Publication No. 10-2016-0060904

[0006] (Patent Document 2) Korean Patent Publication No. 10-2017-0019277

[0007] The present invention provides a photocurable composition that improves staining and light efficiency reduction according to the angle of light by using a photoresist to which scattering particles are applied.

[0008] In addition, by introducing scattering particles according to the present invention and a scattering film composition including the same, problems such as staining and reduced transmittance are solved and a wide viewing angle is secured.

[0009] The resist composition according to the present invention comprises: an alkali-soluble resin; a reactive unsaturated compound; a photoinitiator; and a density of 0.8 g / cm. 3 4.20g / cm 3 It is preferable to include a human scattering particle and a solvent.

[0010] It is preferable that the above scattering particles are SiO2, polymer beads, ZnS, Al2O3MgF2, NaF, LiF, indium tin oxide, MgO, GaP, Si3N4 or a combination thereof.

[0011] It is preferred that the polymer is PMMA or polystyrene or a combination thereof.

[0012] It is preferable that the average particle diameter of the scattering particles is 20 nm to 1200 nm.

[0013] The refractive index of the alkali-soluble resin is preferably 1.3 to 1.96, the refractive index of the scattering particles is preferably 1.35 to 2.5, and the difference in refractive index between the alkali-soluble resin and the scattering particles is preferably 0.001 to 1.

[0014] It is preferable that the above scattering particles are included in an amount of 1 to 50 wt% based on the total amount of the resist composition.

[0015] It is preferable that the above alkaline soluble resin is included in an amount of 5 to 80 wt% based on the total amount of the resist composition.

[0016] It is preferable that the above unsaturated compound is included in an amount of 5 to 80 wt% based on the total amount of the resist composition.

[0017] It is preferable that the above photoinitiator is included in an amount of 0.1 to 10 wt% based on the total amount of the resist composition.

[0018] It is preferable that the above alkaline-soluble resin includes an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0019] It is preferable that the above alkali-soluble resin includes a resin containing a repeating unit of chemical formula (3).

[0020] Chemical formula (3)

[0021]

[0022] In the above chemical formula (5),

[0023] 1) * indicates the part where the combination is connected as a repeating unit,

[0024] 2) n is a repeating unit of 2 to 200,000,

[0025] 3) R 21 and R 22 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0026] 4) R 21 and R 22 Each adjacent tile can form a ring,

[0027] 5) i and j are integers from 0 to 4, independently of each other.

[0028] 6) B 11 is a single bond, O, CO, SO2, CR'R", SiR'R", chemical formula (D) or chemical formula (E),

[0029] 6-1) R' and R" are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0030] 6-2) R' and R" can each form adjacent tile rings,

[0031] Chemical formula (D)

[0032]

[0033] Chemical formula (E)

[0034]

[0035] In the above chemical formula (D) and chemical formula (E),

[0036] 6-3) * indicates the binding position,

[0037] 6-4) B 23 is O, S, SO2 or NR',

[0038] 6-5) R' is hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0039] 6-6) R 23 ~R 26are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0040] 6-7) R 23 ~R 26 Each adjacent tile can form a ring,

[0041] 6-8) k~n are integers from 0 to 4, independently of each other.

[0042] 7) B 21 is a fluorenyl group; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 aryloxy group; or a combination thereof,

[0043] 8) A 21 and A 22 are independently chemical formula (F) or chemical formula (G),

[0044] Chemical formula (F)

[0045]

[0046] Chemical formula (G)

[0047]

[0048] In the above chemical formula (F) and chemical formula (G),

[0049] 8-1) * indicates the binding position,

[0050] 8-2) R 27 ~R 30 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0051] 8-3) C 21 and C 22 are independently of each other and have chemical formula (H),

[0052] Chemical formula (H)

[0053]

[0054] 8-3-1) * indicates the bonding position,

[0055] 8-3-2) R 31 Silver hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0056] 8-3-3) L 21 is a single bond; fluorenylene group; C1~C 30 alkylene; C6~C 30 Arylene of; C2~C 30 Heterocyclic ring of; or C1~C 30 is an alkoxylene,

[0057] 8-4) In the resin containing the repeating unit represented by chemical formula (3), the ratio of chemical formula (F) and chemical formula (G) is 1:9 to 9:1,

[0058] 9) The above R 21 ~R 31 , R', R", B 21 , and L 21 And the rings formed by combining adjacent groups are each composed of deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30and combinations thereof, and adjacent substituents may form a ring.

[0059] It is preferable that the weight average molecular weight of the above alkali-soluble resin is 1,000 to 100,000 g / mol.

[0060] As another specific example, the present invention provides a scattering film formed from the resist composition.

[0061] It is preferable that the haze value of the above scattering film is 10 to 50.

[0062] The reflectivity of the above scattering film is preferably 0.5% to 10%, the specular reflectivity is preferably 2% to 15%, and the difference in reflectivity at each wavelength over the entire range of wavelengths is preferably within 5%.

[0063] The total transmittance of the above scattering film is 70% to 99%, and it is preferable that the transmittance at a viewing angle of 100° to 180° is 70% to 99%.

[0064] As another specific example, the present invention provides a display device including the scattering film.

[0065] As another specific example, the present invention provides an electronic device including the display device and a control unit for driving the display device.

[0066] The photoresist including scattering particles according to the present invention removes stains according to the angle of light and scatters light in various angles, thereby improving the wide viewing angle, total light transmittance, transmittance according to the viewing angle, and low reflectivity compared to existing scattering films, and there is no change in brightness.

[0067] In addition, the scattering particles of the present invention have a lower specific gravity than conventional scattering particles, resulting in less sedimentation, and thus have a significant advantage in terms of stability.

[0068] Therefore, it has the advantage of increasing the fairness in that it utilizes the characteristics of the composition without removing optical stains by introducing a physical structure in a display device that requires multi-layer stacking, and it has the advantage of making it easy to produce a scattering film in that it enables precise pattern formation of the photoresist.

[0069] Figure 1 is a photograph showing a pattern surface according to Example 4 of the present invention.

[0070] Figure 2 is a photograph showing a cross-section of a pattern according to Example 4 of the present invention.

[0071] The resist composition according to the present invention comprises: an alkali-soluble resin; a reactive unsaturated compound; a photoinitiator; and a density of 0.8 g / cm. 3 4.20g / cm 3 It is preferable to include a scattering particle and a solvent.

[0072] Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. When assigning reference numerals to components in each drawing, identical components may be assigned the same numerals, as much as possible, even if they are shown in different drawings.

[0073] When describing the present invention, detailed descriptions of related known components or functions may be omitted if they are deemed to obscure the gist of the present invention. When "includes," "has," and "consists of" are used in this specification, other parts may be added, unless "only" is used. When a component is expressed in the singular, it may also include plurals, unless otherwise explicitly stated.

[0074] Additionally, terms such as first, second, A, B, (a), (b), etc. may be used to describe components of the present invention. These terms are only intended to distinguish the components from other components, and the nature, order, sequence, or number of the components are not limited by these terms.

[0075] In a description of the positional relationship of components, when it is described that two or more components are "connected," "combined," or "connected," it should be understood that the two or more components may be directly "connected," "combined," or "connected," but that the two or more components may also be further "interposed" with another component to be "connected," "combined," or "connected." Here, the other component may be included in one or more of the two or more components that are "connected," "combined," or "connected" to each other.

[0076] Furthermore, when a component such as a layer, membrane, region, or plate is said to be "on" or "over" another component, it should be understood that this includes not only the case where it is "directly on" the other component, but also the case where there are other components in between. Conversely, when a component is said to be "directly on" another part, it should be understood that there are no other components in between.

[0077] In the description of the temporal flow relationship related to components, operation methods, or manufacturing methods, for example, when the temporal or flow relationship is described as “after”, “following”, “next to”, “before”, etc., it may also include cases where it is not continuous, unless “immediately” or “directly” is used.

[0078] Meanwhile, when numerical values ​​or corresponding information for components are mentioned, even without separate explicit description, the numerical values ​​or corresponding information may be interpreted as including an error range that may occur due to various factors (e.g., process factors, internal or external impact, noise, etc.).

[0079] The terms used in this specification and the appended claims have the following meanings, unless otherwise stated, without departing from the spirit of the present invention.

[0080] The term “halo” or “halogen” as used in this application includes fluorine (F), chlorine (Cl), bromine (Br), and iodine (I) unless otherwise stated.

[0081] The term "alkyl" or "alkyl group" as used in this application, unless otherwise stated, means a radical of a saturated aliphatic functional group having 1 to 60 carbon atoms connected by a single bond, including a straight-chain alkyl group, a branched-chain alkyl group, a cycloalkyl (alicyclic) group, an alkyl-substituted cycloalkyl group, and a cycloalkyl-substituted alkyl group.

[0082] The term “haloalkyl group” or “halogenalkyl group” as used in this application means an alkyl group substituted with a halogen, unless otherwise stated.

[0083] The term "alkenyl" or "alkynyl" as used in this application, unless otherwise stated, refers to a group having a double bond or a triple bond, including a straight or branched chain group, and having 2 to 60 carbon atoms, but is not limited thereto.

[0084] The term "cycloalkyl" as used in this application, unless otherwise stated, means, but is not limited to, an alkyl group forming a ring having 3 to 60 carbon atoms.

[0085] The term “alkoxy group” or “alkyloxy group” used in this application means an alkyl group to which an oxygen radical is bonded, and unless otherwise stated, has 1 to 60 carbon atoms, but is not limited thereto.

[0086] The term “alkenoxyl group,” “alkenoxy group,” “alkenyloxy group,” or “alkenyloxy group” as used in this application means an alkenyl group having an oxygen radical attached thereto, and unless otherwise stated, has from 2 to 60 carbon atoms, but is not limited thereto.

[0087] The terms "aryl group" and "arylene group" used in this application, unless otherwise stated, each have 6 to 60 carbon atoms, but are not limited thereto. The aryl group or arylene group in this application includes a single ring, a ring aggregate, a fused multiple ring compound, etc. For example, the aryl group may include a phenyl group, a monovalent functional group of biphenyl, a monovalent functional group of naphthalene, a fluorenyl group, a substituted fluorenyl group, and the arylene group may include a fluorenylene group, a substituted fluorenylene group.

[0088] The term "ring assemblies" as used herein means two or more ring systems (single ring or fused ring systems) directly connected to each other via single or double bonds, wherein the number of such direct links between rings is one less than the total number of ring systems in the compound. Ring assemblies may be formed by the same or different ring systems being directly connected to each other via single or double bonds.

[0089] In the present application, since the aryl group includes a ring aggregate, the aryl group includes biphenyl and terphenyl in which a single aromatic ring, a benzene ring, is connected by a single bond. In addition, the aryl group also includes a compound in which an aromatic single ring and an aromatic ring system fused together are connected by a single bond, and thus, for example, the aryl group also includes a compound in which an aromatic single ring, a benzene ring, and an aromatic ring system fused together, a fluorene ring, are connected by a single bond.

[0090] The term "fused multiple ring system" as used in this application means a fused ring structure sharing at least two atoms, and includes a structure in which two or more hydrocarbon ring systems are fused, and a structure in which at least one heterocyclic system containing at least one heteroatom is fused, etc. Such fused multiple ring systems may be aromatic rings, heteroaromatic rings, aliphatic rings, or a combination of these rings. For example, in the case of an aryl group, it may be a naphthalenyl group, a phenanthrenyl group, a fluorenyl group, etc., but is not limited thereto.

[0091] The term "spiro compound" used in this application has a "spiro union," which means a connection formed by two rings sharing only one atom. In this case, the atom shared between the two rings is called a "spiro atom," and depending on the number of spiro atoms contained in a compound, these are called "monospiro-," "dicepiro-," and "trispiro-" compounds, respectively.

[0092] As used herein, the terms "fluorenyl group", "fluorenylene group", and "fluorenetriyl group" mean, unless otherwise stated, a monovalent, divalent, or trivalent functional group in which R, R', R", and R'" in the following structures are all hydrogen, and a "substituted fluorenyl group", a "substituted fluorenylene group", or a "substituted fluorenetriyl group" means that at least one of the substituents R, R', R", and R'" is a substituent other than hydrogen, and includes a case where R and R' are bonded to each other to form a spiro compound together with the carbon to which they are bonded. In the present specification, regardless of the valence such as monovalent, divalent, or trivalent, a fluorenyl group, a fluorenylene group, and a fluorenetriyl group may all be referred to as a fluorene group.

[0093]

[0094] In addition, the R, R', R" and R'" can each independently be an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or a heterocyclic group having 2 to 30 carbon atoms, for example, the aryl group can be phenyl, biphenyl, naphthalene, anthracene or phenanthrene, and the heterocyclic group can be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidine, pyridazine, pyrazine, triazine, indole, benzofuran, quinazoline or quinoxaline. For example, the substituted fluorenyl group and fluorenylene group may be a monovalent functional group or a divalent functional group of 9,9-dimethylfluorene, 9,9-diphenylfluorene, and 9,9'-spirobi[9H-fluorene], respectively.

[0095] The term "heterocyclic group" used in this application includes not only aromatic rings such as "heteroaryl group" or "heteroarylene group" but also non-aromatic rings, and unless otherwise stated means a ring having 2 to 60 carbon atoms each containing one or more heteroatoms, but is not limited thereto. The term "heteroatom" used in this application represents N, O, S, P or Si unless otherwise stated, and the heterocyclic group means a monocyclic ring, ring aggregate, fused multiple ring system, spiro compound, etc. containing a heteroatom.

[0096] For example, “heterocyclic group” may also include compounds that contain heteroatom groups such as SO2, P=O, etc. instead of ring-forming carbon, such as the compounds below.

[0097]

[0098] The term "ring" as used in this application includes monocyclic and polycyclic rings, and includes hydrocarbon rings as well as heterocyclic rings containing at least one heteroatom, and includes aromatic and non-aromatic rings.

[0099] The term "polycyclic" as used in this application includes ring assemblies such as biphenyls, terphenyls, etc., fused multiple ring systems and spiro compounds, including aromatic as well as non-aromatic, and including hydrocarbon rings as well as heterocycles containing at least one heteroatom.

[0100] The term "aliphatic ring" used in this application refers to a cyclic hydrocarbon other than an aromatic hydrocarbon, and includes a single ring, a ring aggregate, a fused multiple ring system, a spiro compound, etc., and unless otherwise specified, refers to a ring having 3 to 60 carbon atoms, but is not limited thereto. For example, even if an aromatic ring, benzene, and a non-aromatic ring, cyclohexane, are fused, it is considered an aliphatic ring.

[0101] Also, when prefixes are named consecutively, it means that the substituents are listed in the order they were first written. For example, in the case of an arylalkoxy group, it means an alkoxy group substituted with an aryl group, in the case of an alkoxycarbonyl group, it means a carbonyl group substituted with an alkoxy group, and in the case of an arylcarbonylalkenyl group, it means an alkenyl group substituted with an arylcarbonyl group, where the arylcarbonyl group is a carbonyl group substituted with an aryl group.

[0102] Also, unless explicitly stated otherwise, the term "substituted" in the term "substituted or unsubstituted" used in this application means deuterium, halogen, amino group, nitrile group, nitro group, C1~C 30 Alkyl group of C1~C 30 Alkoxy group, C1~C 30 Alkylamine group of C1~C 30 Alkylthiophene group, C6~C 30 Arylthiophene group, C2~C 30 Alkenyl group, C2~C 30 Alkyne group, C3~C 30 Cycloalkyl group, C6~C 30 Aryl group of C6~C substituted with deuterium 30 Aryl group of C8~C 30 C2~C containing at least one heteroatom selected from the group consisting of arylalkenyl group, silane group, boron group, germanium group, and O, N, S, Si and P 30 It means that it is substituted with one or more substituents selected from the group consisting of heterocyclic groups, but is not limited to these substituents.

[0103] In this application, the 'functional group name' corresponding to the aryl group, arylene group, heterocyclic group, etc., which are exemplified as examples of each symbol and its substituent, may be described as the 'name of the functional group reflecting the valence', but may also be described as the 'name of the parent compound'. For example, in the case of 'phenanthrene', which is a type of aryl group, the name of the group may be described by distinguishing the valence, such as 'phenanthryl (group)' for the monovalent 'group' and 'phenantrylene (group)' for the divalent group, but the name of the parent compound, 'phenanthrene', may also be described regardless of the valence.

[0104] Similarly, in the case of pyrimidine, regardless of the valence, it can be written as 'pyrimidine', or in the case of monovalent, it can be written as pyrimidinyl (group), in the case of divalent, it can be written as the 'group name' of the corresponding valence, such as pyrimidinylene (group). Accordingly, in the present application, when the type of substituent is written as the name of the parent compound, it can mean an n-valent 'group' formed by the elimination of a hydrogen atom bonded to a carbon atom and / or heteroatom of the parent compound.

[0105] In addition, in this specification, numbers or alphabets indicating positions may be omitted when describing compound names or substituent names. For example, pyrido[4,3-d]pyrimidine may be described as pyridopyrimidine, benzofuro[2,3-d]pyrimidine as benzofuropyrimidine, 9,9-dimethyl-9H-fluorene as dimethylfluorene, etc. Accordingly, both benzo[g]quinoxaline and benzo[f]quinoxaline may be described as benzoquinoxaline.

[0106] Additionally, unless explicitly stated otherwise, the chemical formulas used in this application are applied in the same manner as the substituent definitions by the index definitions of the chemical formulas below.

[0107]

[0108] Here, if a is an integer of 0, the substituent R 1means that it is absent, that is, when a is 0, it means that all the carbons forming the benzene ring are bonded with hydrogen, and in this case, the indication of hydrogen bonded to carbon can be omitted and the chemical formula or compound can be described. In addition, when a is an integer of 1, one substituent R 1 It binds to one of the carbons forming the benzene ring, and when a is an integer of 2 or 3, it can bind as follows, for example, and when a is an integer of 4 to 6, it binds to the carbon of the benzene ring in a similar manner, and when a is an integer of 2 or more, R 1 may be the same or different.

[0109]

[0110] Unless otherwise stated in this application, forming a ring means that adjacent groups are bonded to each other to form a single ring or a fused multiple ring, and the single ring and the formed fused multiple ring include a hydrocarbon ring as well as a heterocycle containing at least one heteroatom, and may include aromatic and non-aromatic rings.

[0111] Additionally, unless otherwise stated herein, when indicating a condensed ring, the number in the expression "number-condensed ring" indicates the number of condensed rings. For example, a form in which three rings are condensed together, such as anthracene, phenanthrene, and benzoquinazoline, can be expressed as a 3-condensed ring.

[0112] Meanwhile, the term "bridged bicyclic compound" used in this application, unless otherwise specified, refers to a compound in which two rings share three or more atoms to form a ring. The shared atoms may include carbon or heteroatoms.

[0113] In the present application, the organic electric element may mean a component(s) between an anode and a cathode, or may mean an organic light-emitting diode including an anode and a cathode and a component(s) positioned therebetween.

[0114] In addition, in some cases, the display device in the present application may mean an organic electroluminescent element, an organic light-emitting diode, and a panel including the same, or may mean an electronic device including a panel and a circuit. Here, for example, the electronic device may include a lighting device, a solar cell, a portable or mobile terminal (e.g., a smart phone, a tablet, a PDA, an electronic dictionary, a PMP, etc.), a navigation terminal, a game machine, various TVs, various computer monitors, etc., and is not limited thereto, and may be any type of device as long as it includes the above-mentioned component(s).

[0115] Hereinafter, embodiments of the present invention will be described in detail. However, these are presented as examples and are not intended to limit the present invention. The present invention is defined solely by the scope of the claims set forth below.

[0116] A photosensitive resin composition according to one embodiment of the present invention comprises scattering particles, an alkali-soluble resin, a reactive unsaturated compound, a photoinitiator, and a solvent, and may further comprise a colorant in addition to the above components.

[0117] Each component is described in detail below.

[0118] (1) Scatter particles

[0119] A scattering film to which an embodiment of the present invention is applied is applied to a display, and provides a high viewing angle, high light transmittance, and high brightness retention, and has thermal, optical, and chemically stable properties.

[0120] In addition, the composition of the present invention can realize a wide viewing angle by adjusting the refractive index of the scattering particles, alkaline-soluble resin, and photosensitive resin, and the size of the viewing angle can be controlled by a simple method such as adjusting the type and concentration of the scattering particles. The photocurable composition including the light-scattering particles of the present invention can form a precise pattern through an exposure step.

[0121] In order to exhibit the light scattering effect of the present invention, scattering particles are uniformly dispersed.

[0122] The above scattering particles may have various sizes ranging from several nanometers to sub-micron sizes, and those having the property of not dissolving in alkaline-soluble resins and photosensitive resins are used.

[0123] The scattering particles include SiO2, polymer beads (PMMA or Polystyrene), ZnS, Al2O3MgF2, NaF, LiF, indium tin oxide, MgO, GaP, Si3N4, etc., and may be one or a combination of two or more of these.

[0124] The density of the scattering particles is 0.8 g / cm 3 4.20g / cm 3 It is preferable, and more preferably 1.0 g / cm 3 4.20g / cm 3 And , The haze value of the scattering film manufactured including the above scattering particles is preferably 10 to less than 50.

[0125] In addition, in order to obtain light scattering, a material that does not absorb light from a light source must be used, and it is preferable that the difference in refractive index between the alkaline-soluble resin and the scattering particles be in the range of 0.001 to 1. The greater the difference in refractive index, the higher the haze characteristics and the wider the viewing angle can be obtained.

[0126] (2) Alkali-soluble resin

[0127] A photosensitive resin composition according to one embodiment of the present invention includes an acrylic binder resin, a cardo binder resin, or a combination thereof as an alkali-soluble resin.

[0128] Preferably, the alkali-soluble resin comprises a resin including a repeating unit represented by the following chemical formula (3).

[0129] Chemical formula (3)

[0130]

[0131] In the above chemical formula (3),

[0132] 1) * indicates the part where the combination is connected as a repeating unit,

[0133] 2) n is a repeating unit of 2 to 200,000,

[0134] 3) R 21 and R 22 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0135] 4) R 21 and R 22 Each adjacent tile can form a ring,

[0136] 5) i and j are integers from 0 to 4, independently of each other.

[0137] 6) B 11is a single bond, O, CO, SO2, CR'R", SiR'R", chemical formula (D) or chemical formula (E),

[0138] 6-1) R' and R" are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0139] 6-2) R' and R" can each form adjacent tile rings,

[0140] Examples of R' or R" combining to form a ring include:

[0141]

[0142] The above chemical formulas (D) and (E) are specifically as follows.

[0143] Chemical formula (D)

[0144]

[0145] Chemical formula (E)

[0146]

[0147] In the above chemical formula (D) and chemical formula (E),

[0148] 6-3) * indicates the binding position,

[0149] 6-4) B 23 is O, S, SO2 or NR',

[0150] 6-5) R' is hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0151] 6-6) R 23 ~R 26 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0152] 6-7) R 23 ~R 26 Each adjacent tile can form a ring,

[0153] 6-8) k~n are integers from 0 to 4, independently of each other.

[0154] 7) B 21 is a fluorenyl group; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 aryloxy group; or a combination thereof,

[0155] 8) A 21 and A 22 are independently chemical formula (F) or chemical formula (G),

[0156] Chemical formula (F)

[0157]

[0158] Chemical formula (G)

[0159]

[0160] In the above chemical formula (F) and chemical formula (G),

[0161] 8-1) * indicates the binding position,

[0162] 8-2) R 27 ~R 30 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0163] 8-3) C 21 and C 22 are independently of each other and have chemical formula (H),

[0164] Chemical formula (H)

[0165]

[0166] 8-3-1) * indicates the bonding position,

[0167] 8-3-2) R 31 Silver hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkynyl group of; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 30 is an alkoxycarbonyl group,

[0168] 8-3-3) L 21 is a single bond; fluorenylene group; C1~C 30 alkylene; C6~C 30 Arylene of; C2~C 30 Heterocyclic ring of; or C1~C 30 is an alkoxylene,

[0169] 8-4) In the resin containing the repeating unit represented by chemical formula (3), the ratio of chemical formula (F) and chemical formula (G) is 1:9 to 9:1,

[0170] 9) The above R 21 ~R 31 , R', R", B 21 , L 21 And the rings formed by combining adjacent groups are each composed of deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 and combinations thereof, and adjacent substituents may form a ring.

[0171] The above R 21 ~R 31 , when R' and R" are aryl groups, preferably C6~C 30 Aryl group of, more preferably C6~C 18 The aryl group may be, for example, phenyl, biphenyl, naphthyl, terphenyl, etc.

[0172] The above R 21 ~R 31 , R', R", B 21 and L 21 In this case, it is preferably C2~C 30 A heterocyclic group, more preferably C2~C 18 The heterocyclic group may be, for example, dibenzofuran, dibenzothiophene, naphthobenzothiophene, naphthobenzofuran, etc.

[0173] The above R 21 ~R 31 , when R' and R" are fluorenyl groups, preferably 9,9-dimethyl-9H-fluorene, 9,9-diphenyl-9H-fluorenyl group, 9,9'-spirobifluorene, etc.

[0174] B above 21 and L 21 In the case of this arylene group, preferably C6~C 30 Arylene group, more preferably C6~C 18 It may be an arylene group, such as phenyl, biphenyl, naphthyl, terphenyl, etc.

[0175] The above R 21 ~R 31 , when R' and R" are alkyl groups, preferably C1~C 10 It can be an alkyl group, for example, methyl, t-butyl, etc.

[0176] The above R 21 ~R 31 , when R' and R" are alkoxyl groups, preferably C1~C 20 Alkoxyl group of, more preferably C1~C 10 It may be an alkoxyl group, such as methoxy, t-butoxy, etc.

[0177] The above R 21 ~R 31 , R', R", B 21 and L 21 The ring formed by the bonding of adjacent groups is C6~C 60 Aromatic ring group; Fluorenyl group; C2~C containing at least one heteroatom among O, N, S, Si and P 60 Heterocyclic group of; or C3~C 60 It may be an aliphatic ring group, for example, when adjacent groups are bonded to each other to form an aromatic ring, preferably C6~C 20 An aromatic ring, more preferably C6~C 14 It can form aromatic rings such as benzene, naphthalene, phenanthrene, etc.

[0178] The ratio of the structure represented by the chemical formula (F) and the structure represented by the chemical formula (G) within the polymer chain of the resin including the repeating unit represented by the chemical formula (3) is preferably 1:9 to 9:1, and most preferably 8:2 to 2:8. In the case of a resin in which the structure represented by the chemical formula (F) and the structure represented by the chemical formula (G) are mixed within the polymer chain at the above ratio, compatibility with other components in the photosensitive composition is improved, so that when forming a pattern, the generation of residue is less and the resolution is superior compared to when using a resin including only the structure represented by the chemical formula (F) or a resin including only the structure represented by the chemical formula (G).

[0179] The weight average molecular weight of the resin including the repeating unit represented by the above chemical formula (3) may be 1,000 to 100,000 g / mol, preferably 1,000 to 50,000 g / mol, and more preferably 1,000 to 30,000 g / mol. When the weight average molecular weight of the resin is within the above range, the pattern is formed well without residue during the manufacture of the pattern layer, and there is no loss of film thickness during development, and a good pattern can be obtained.

[0180] The resin containing the repeating unit represented by the above chemical formula (3) may be included in an amount of 1 to 50 wt%, more preferably 5 to 45 wt%, based on the total amount of the photosensitive composition. When the resin is included within the above range, excellent sensitivity, developability, and adhesiveness (adhesion) can be obtained.

[0181] The photosensitive composition may further include an acrylic resin in addition to the resin including the repeating unit represented by the chemical formula (3). The acrylic resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin including one or more acrylic repeating units. The acrylic resin may be a copolymer of ethylenically unsaturated monomers including 2 to 10 kinds of acrylates, methacrylates, styrene, maleimide, maleic acid, maleic anhydride, etc., and may have a weight average molecular weight of 5,000 to 30,000 g / mol.

[0182] The sum of the resin including the repeating unit represented by the above chemical formula (3) and the acrylic resin may be included in an amount of 1 to 50 wt%, more preferably 5 to 45 wt%, based on the total amount of the photosensitive composition. When the sum of the resin including the repeating unit represented by the above chemical formula (3) and the acrylic resin is included within the above range, excellent sensitivity, developability, and adhesiveness (adhesion) can be obtained.

[0183] (3) Reactive unsaturated compounds

[0184] A photosensitive resin composition according to one embodiment of the present invention comprises a reactive unsaturated compound capable of being crosslinked by radicals in an exposure step.

[0185] The above reactive unsaturated compound has an ethylenically unsaturated double bond, and thus can sufficiently polymerize upon exposure to light in a pattern forming process to form a pattern with excellent heat resistance, light resistance, and chemical resistance.

[0186] Specific examples of the above reactive unsaturated compounds include ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxyacrylate, ethylene glycol monomethyl ether acrylate, trimethylolpropane triacrylate, tripentaerythritol octaacrylate, and the like.

[0187] Examples of commercially available products of the above reactive unsaturated compounds are as follows.

[0188] Examples of the bifunctional ester of the above (meth)acrylic acid include Aronix M-210, M-240, M-6200, etc. from Toagosei Chemical Industry Co., Ltd.; KAYARAD HDDA, HX-220, R-604, etc. from Nihon Kayaku Industry Co., Ltd.; and V-260, V-312, V-335 HP, etc. from Osaka Yuki Chemical Industry Co., Ltd.

[0189] Examples of the trifunctional ester of the above (meth)acrylic acid include Aronix M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060, etc. from Toagosei Chemical Industry Co., Ltd.; KAYARAD TMPTA, DPCA-20, DPCA-60, DPCA-120, etc. from Nihon Kayaku Industry Co., Ltd.; and V-295, V-300, V-360, etc. from Osaka Yuki Kayaku Industry Co., Ltd.

[0190] The above products can be used alone or in combination of two or more.

[0191] The above reactive unsaturated compound may be used after being treated with an acid anhydride to provide better developability. The reactive unsaturated compound may be included in an amount of 1 to 50 wt%, for example, 5 to 30 wt%, based on the total amount of the photosensitive resin composition. When the reactive unsaturated compound is included within the above range, sufficient curing occurs upon exposure in the pattern forming process, resulting in excellent reliability. The pattern has excellent heat resistance, light resistance, and chemical resistance, and also excellent resolution and adhesion.

[0192] (4) Photoinitiator

[0193] A photosensitive composition according to one embodiment of the present invention may include the following photoinitiator, and an oxime ester compound may be used alone or in combination of two or more types as the photoinitiator.

[0194] The photoinitiator that can be used in combination with the above oxime ester compound is a photoinitiator used in a photosensitive composition, and examples thereof include acetophenone compounds, benzophenone compounds, thioxanthone compounds, benzoin compounds, and triazine compounds.

[0195] Examples of the above oxime ester compounds include 2-(o-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(o-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione2-oxime-O-benzoate, Examples thereof include 1-(4-phenylsulfanylphenyl)-octane-1-one oxime-O-acetate and 1-(4-phenylsulfanylphenyl)-butane-1-one oxime-O-acetate, 1-(4-methylsulfanyl-phenyl)-butane-1-one oxime-O-acetate, hydroxyimino-(4-methylsulfanyl-phenyl)-acetic acid ethyl ester-O-acetate, and hydroxyimino-(4-methylsulfanyl-phenyl)-acetic acid ethyl ester-O-benzoate.

[0196] Examples of the above acetophenone compounds include 2,2'-diethoxy acetophenone, 2,2'-dibutoxy acetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloro acetophenone, pt-butyldichloro acetophenone, 4-chloro acetophenone, 2,2'-dichloro-4-phenoxy acetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc.

[0197] Examples of the above benzophenone compounds include benzophenone, benzoyl benzoate, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxy benzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

[0198] Examples of the above thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, 2-chlorothioxanthone, etc.

[0199] Examples of the above benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyldimethyl ketal, etc.

[0200] Examples of the above triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, Examples include 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-yl)-4,6-s(trichloromethyl)-s-triazine, 2-4-trichloromethyl(piperonyl)-6-triazine, and 2-4-trichloromethyl(4'-methoxystyryl)-6-triazine.

[0201] In addition to the above compound, the above photoinitiator may also include a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a biimidazole compound, etc.

[0202] The above photoinitiator may be a radical polymerization initiator, such as a peroxide-based compound or an azobis-based compound.

[0203] Examples of the above photoperoxide compounds include ketone peroxides such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methylcyclohexanone peroxide, and acetylacetone peroxide; diacyl peroxides such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, and bis-3,5,5-trimethylhexanoyl peroxide; hydroperoxides such as 2,4,4,-trimethylpentyl-2-hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide, and t-butyl hydroperoxide; Dialkyl peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, 1,3-bis(t-butyloxyisopropyl)benzene, and t-butylperoxyvaleric acid n-butyl ester; alkyl peresters such as 2,4,4-trimethylpentyl peroxyphenoxyacetate, α-cumyl peroxyneodecanoate, t-butyl peroxybenzoate, and di-t-butyl peroxytrimethyl adipate; Examples include percarbonates such as di-3-methoxybutyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, bis-4-t-butylcyclohexyl peroxydicarbonate, diisopropyl peroxydicarbonate, acetylcyclohexylsulfonyl peroxide, and t-butyl peroxyaryl carbonate.

[0204] Examples of the above azobis compounds include 1,1'-azobiscyclohexane-1-carbonitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2, -azobis(methylisobutyrate), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), α,α'-azobis(isobutylnitrile), and 4,4'-azobis(4-cyanovaleic acid).

[0205] The above initiator may also be used with a photosensitizer that causes a chemical reaction by absorbing light, becoming excited, and then transferring the energy. Examples of the photosensitizer include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, and dipentaerythritol tetrakis-3-mercaptopropionate.

[0206] The above initiator may be included in an amount of 0.01 to 10 wt%, for example, 0.1 to 5 wt%, based on the total amount of the photosensitive resin composition. When the above initiator is included within the above range, sufficient curing occurs upon exposure in the pattern forming process, thereby obtaining excellent reliability, and the pattern has excellent heat resistance, light resistance, and chemical resistance, and also excellent resolution and adhesion, and can prevent a decrease in transmittance due to unreacted initiator.

[0207] (5) Solvent

[0208]

[0209] *The solvent may be a material that is compatible with, but does not react with, the alkali-soluble resin, the reactive unsaturated compound, the reactive dye, the colorant, and the initiator.

[0210] Examples of the solvent include alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methylphenyl ether, and tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; carbitols such as methylethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methylethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone; Saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; Lactic acid esters such as methyl lactate and ethyl lactate; Oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, and butyl oxyacetate; Alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, and ethyl ethoxyacetate; 3-oxypropionic acid alkyl esters such as methyl 3-oxypropionate and ethyl 3-oxypropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate;2-oxy-2-methyl propionic acid esters such as methyl 2-oxy-2-methyl propionic acid, ethyl 2-oxy-2-methyl propionic acid, etc.; monooxy monocarboxylic acid alkyl esters of 2-alkoxy-2-methyl propionic acid alkyls such as methyl 2-methoxy-2-methyl propionic acid, ethyl 2-ethoxy-2-methyl propionic acid; esters such as ethyl 2-hydroxypropionic acid, ethyl 2-hydroxy-2-methyl propionic acid, ethyl hydroxyacetate, methyl 2-hydroxy-3-methyl butanoate; ketone acid esters such as ethyl pyruvate, etc.;

[0211] In addition, high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate can also be used.

[0212] Among the above solvents, taking compatibility and reactivity into consideration, glycol ethers such as ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as 2-hydroxypropionate ethyl; carbitols such as diethylene glycol monomethyl ether; and propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate can be used.

[0213] The solvent may be included as a remainder based on the total amount of the photosensitive resin composition, and specifically, may be included at 50 to 90 wt%. When the solvent is included within the above range, the photosensitive resin composition has an appropriate viscosity, thereby providing excellent processability in the manufacture of a pattern layer.

[0214] (6) Other additives

[0215] The above photosensitive composition may further include additives such as malonic acid; 3-amino-1,2-propanediol; a silane coupling agent containing a vinyl group or a (meth)acryloxy group; a leveling agent; a fluorinated surfactant; a silicone surfactant; and a radical polymerization initiator to prevent stains or spots during application, improve leveling performance, and prevent the formation of residues due to non-development.

[0216] For example, the photosensitive resin composition may further include a silane coupling agent having a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group, or an epoxy group to improve adhesion to a substrate, etc.

[0217] Examples of the above silane coupling agent include trimethoxysilyl benzoic acid, γ-methacryl oxypropyl trimethoxysilane, vinyl triacetoxysilane, vinyl trimethoxysilane, γ-isocyanate propyl triethoxysilane, γ-glycidoxy propyl trimethoxy silane, β-epoxy cyclohexyl ethyl trimethoxysilane, etc., and these may be used alone or in combination of two or more.

[0218] The above silane coupling agent may be included in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the silane coupling agent is included within the above range, adhesion, storability, etc. are excellent.

[0219] In addition, the photosensitive resin composition may further include a surfactant, such as a fluorinated surfactant or a silicone surfactant, to improve coating properties and prevent defects, if necessary.

[0220] As the above fluorinated surfactant, BM Chemie's BM-1000 ® , BM-1100 ® Mecha Pack F 142D by Dai Nippon Inki Kagaku Kogyo Co., Ltd. ® , East F 172 ®, East F 173 ® , East F 183 ® Back; Prorad FC-135 from Sumitomo 3M Co., Ltd. ® , East FC-170C ® , East FC-430 ® , East FC-431 ® Saffron S-112 from Asahi Glass Co., Ltd. ® , East S-113 ® , East S-131 ® , East S-141 ® , East S145 ® SH-28PA from Toray Silicone Co., Ltd. ® , East-190 ® , East-193 ® , SZ-6032 ® , SF-8428 ® Fluorinated surfactants sold under the names of etc. can be used.

[0221] As the above silicone surfactant, BASF's EFKA ® 3030, EFKA ® 3034, EFKA ® 3886, etc.; 3030, 3085, 3236 from AFCONA; BYK-379, BYK-3550, BYK-3751, BYK-3754 from BYK can be used.

[0222] The content of the above additives can be easily adjusted according to the desired properties.

[0223] Hereinafter, synthetic examples and examples according to the present invention are specifically described, but the synthetic examples and examples of the present invention are not limited thereto.

[0224] Synthesis Example 1: (Preparation of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene of Chemical Formula 8)

[0225] 20 g of 9,9'-bisphenol fluorene (Sigma Aldrich), 8.67 g of glycidyl chloride (Sigma Aldrich), and 30 g of anhydrous potassium carbonate were placed in a 300 ml 3-neck round-bottom flask equipped with a distillation column and 100 ml of dimethylformamide, and the mixture was heated to 80°C and reacted for 4 hours. The temperature was lowered to 25°C, the reaction solution was filtered, and the filtrate was added dropwise to 1000 ml of water with stirring. The precipitated powder was filtered, washed with water, and dried under reduced pressure at 40°C to obtain 25 g of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene of the following chemical formula 8. The obtained powder showed a purity of 98% as a result of HPLC purity analysis.

[0226] <Chemical Formula 8>

[0227]

[0228] Synthesis Example 2: Preparation of Alkali-Soluble Resin

[0229] 25 g (54 mmol) of the compound (chemical formula 8) obtained in the above Synthetic Example 1, 8 g of acrylic acid (Daejung Chemicals & Metals Co., Ltd.), 0.2 g of benzyl triethyl ammonium chloride (Daejung Chemicals & Metals Co., Ltd.), and 0.2 g of hydroquinone (Daejung Chemicals & Metals Co., Ltd.) were placed in a 300 ml 3-neck round-bottom flask equipped with a distillation column together with 52 g of propylene glycol methyl ether acetate (Sigma Aldrich Co., Ltd.), and stirred at 110°C for 6 hours. After completion of the reaction, 8 g of biphenyltetracarboxylic dianhydride (Mitsubishi Gas Co., Ltd.) and 1.8 g of tetrahydrophthalic acid (Sigma Aldrich Co., Ltd.) were added, and then stirred again at 110°C for 6 hours. After completion of the reaction, the reaction solution was recovered, and the analysis results showed that a cardo-based binder resin having a molecular weight of 4,580 and a solid content of 45% was obtained.

[0230] Manufacturing Example 1 (Manufacturing of photoresist composition)

[0231] A photoresist composition is prepared as shown in Table 1 below.

[0232] PR Composition (wt%) Scatter particles (Table 2) 25 Alkali-soluble resin (Synthesis example 2) 35 M600 (Miwon Specialty Co., Ltd., dipentaerythritol hexaacrylate) (Reactive unsaturated compound) 35 OXE-02 (BASF Co., Ltd.) (Photoinitiator) 5

[0233] A scattering particle is added to the photoresist composition of Table 1 above as shown in Table 2 below to form a film having a thickness of 3 μm.

[0234] 1. Coating: Spin coat to form a 3㎛ film.

[0235] 2. Prebake: Prebake at 100℃ for 2 minutes.

[0236] 3. Exposure: Exposure the prebaked film with an exposure dose of 100 mJ.

[0237] 4. Development: Develop the exposed film with TMAH developer.

[0238] 5. Post-bake: Post-bake at 100℃ for 1 hour.

[0239] For the coating film (scattering film) manufactured above, the optical properties (Table 2), reflectance (Table 3), and sedimentation stability (Table 4: Haze of the coating film used after a certain storage time after manufacturing the composition) were measured according to the type of scattering particles.

[0240] Tables 2, 3, and 4 show the Haze results measured with the NDH-8000 equipment of Nippon Denshoku for the examples, and Table 2 shows the reflectance values ​​measured with the cm-26d equipment of Konica Minolta.

[0241]

[0242] Scattering particle size (nm) of scattered particles Density (g / cm³) Haze Diffuse reflectance (SCE) Constant reflectance (SCI) Reflectance difference at each wavelength in the entire range of wavelengths Example 4 SiO 2 10 0 0 2.6 5 4 0.2 5.1 3 12.4 4 3.5 Example 6 Polymer beads (PMMA) 10 0 0 1.1 4 0.1 0.6 3 12.3 1.3 1 Example 7 ZnS 5 0 0 4.0 9 4 0.5 8 0 2 11.9 7 3.3 5 Comparative example 2 TiO 2 5 0 0 4.2 3 4 0.1 2 6.7 9 32.5 3 3 0.2 6

[0243] Scattering ParticlesScattering Particle Size (nm)Density (g / cm³)Storage TimeHazeExample 4SiO210002.650 hr40.212 hr40.124 hr40.5Example 7ZnS5004.090 hr40.512 hr40.624 hr40.6Comparative Example 2TiO25004.230 hr40.112 hr48.424 hr51.2

[0244] First, in Examples 1 to 5, when using scattering particles with the same content but different particle sizes, it was confirmed that a difference in haze appeared even when the thickness of the coating was the same at 3 ㎛. In the case of haze, the degree of opacity was such that the larger the particle size, the more the haze tended to increase at the same content.

[0245] In the case of Examples 5 to 7, optical properties such as haze, transmittance, and brightness retention rate were measured depending on the type of organic or inorganic scattering particles, and excellent results were shown in terms of light transmittance and brightness retention rate compared to the scattering particles of Comparative Examples 1 and 2.

[0246] In the case of Examples 8 to 10, it was confirmed that the optical characteristics such as the same haze, transmittance, and brightness retention rate did not change even when different scattering particles were combined.

[0247] The reason why the optical properties such as haze, transmittance, and brightness preservation rate are different between Comparative Examples 1 and 2 and Examples 1 to 10 can be seen from the results in Table 3. When Comparative Example 2 is compared with Examples 4, 6, and 7 in Table 2, it can be seen that Comparative Example 2 has very high diffuse reflectance and regular reflectance, and the difference in reflectance at each wavelength in the entire wavelength range is large. The TiO2 scattering particles of Comparative Example 2 have a high dependence of their properties on a specific wavelength, so the difference in reflectance at each wavelength in the entire wavelength range is large, and this induces effective diffuse reflection, resulting in high diffuse reflectance and regular reflectance as well. In the case of scattering particles with high reflectance, a wide viewing angle can be secured, but the transmittance is poor, making it difficult to preserve brightness, and therefore limiting their use.

[0248] In addition, when the density is high, the scattering particles settle, which limits the production of a uniform film during the process. Regarding the sedimentation stability by scattering particle in Table 4, it can be confirmed that the haze value increases over a 12-hour storage period in Comparative Example 2. This is believed to be a result of the reduced dispersion stability in the case of scattering particles with a relatively high density. In addition, these scattering particles can easily settle during the process due to their high density, which can reduce the stability of the process.

[0249] The above description is merely an example of the present invention, and those skilled in the art will appreciate that various modifications may be made without departing from the essential characteristics of the present invention.

[0250] Accordingly, the embodiments disclosed herein are intended to illustrate, rather than limit, the present invention, and the spirit and scope of the present invention are not limited by these embodiments. The scope of protection of the present invention should be interpreted by the claims, and all techniques within the scope equivalent thereto should be interpreted as being included within the scope of the present invention.

[0251] The present invention relates to a light-scattering composition comprising scattering particles and a display device comprising the same.

Claims

1. Alkali-soluble resin; reactive unsaturated compound; photoinitiator; density 0.8 g / cm 3 4.20g / cm2 3 A resist composition comprising: a scattering particle; and a solvent.

2. A resist composition according to claim 1, characterized in that the scattering particles are SiO2, polymer beads, ZnS, Al2O3MgF2, NaF, LiF, indium tin oxide, MgO, GaP, Si3N4 or a combination thereof.

3. A resist composition according to claim 2, characterized in that the polymer of the polymer beads is PMMA, polystyrene or a combination thereof.

4. A resist composition according to claim 1, characterized in that the average particle diameter of the scattering particles is 20 nm to 1,200 nm.

5. A resist composition according to claim 1, wherein the refractive index of the alkali-soluble resin is 1.3 to 1.96, the refractive index of the scattering particles is 1.35 to 2.5, and the difference in refractive indices between the alkali-soluble resin and the scattering particles is 0.001 to 1.

6. A resist composition according to claim 1, characterized in that the scattering particles are contained in an amount of 1 to 50 wt% based on the total amount of the resist composition.

7. A resist composition according to claim 1, characterized in that the alkali-soluble resin is contained in an amount of 5 to 80 wt% based on the total amount of the resist composition.

8. A resist composition according to claim 1, characterized in that the unsaturated compound is contained in an amount of 5 to 80 wt% based on the total amount of the resist composition.

9. A resist composition according to claim 1, characterized in that the photoinitiator is contained in an amount of 0.1 to 10 wt% based on the total amount of the resist composition.

10. A resist composition in accordance with claim 1, wherein the alkali-soluble resin comprises an acrylic binder resin, a cardo binder resin, or a combination thereof.

11. A resist composition according to claim 1, characterized in that the alkali-soluble resin is a resin comprising a repeating unit of chemical formula (3): Chemical formula (3) In the above chemical formula (5), 1) * indicates the part where the combination is connected as a repeating unit, 2) n is a repeating unit of 2 to 200,000, 3) R 21 and R 22 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of ; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of ; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; Fluorenyl group; Carbonyl group; Ether group; or C1~C 30 is an alkoxycarbonyl group, 4) R 21 and R 22 Each can form adjacent tile rings, 5) i and j are independent integers from 0 to 4, 6) B 11 is a single bond, O, CO, SO2, CR'R", SiR'R", chemical formula (D) or chemical formula (E), 6-1) R' and R" are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of ; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of ; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; Fluorenyl group; Carbonyl group; Ether group; or C1~C 30 is an alkoxycarbonyl group, 6-2) R' and R" are each capable of forming adjacent tile rings, Chemical formula (D) Chemical formula (E) In the above chemical formula (D) and chemical formula (E), 6-3) * indicates the binding position, 6-4) B 23 is O, S, SO2 or NR', 6-5) R' is hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of ; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of ; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; Fluorenyl group; Carbonyl group; Ether group; or C1~C 30 is an alkoxycarbonyl group, 6-6) R 23 ~R 26 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of ; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of ; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; Fluorenyl group; Carbonyl group; Ether group; or C1~C 30 is an alkoxycarbonyl group, 6-7) R 23 ~R 26 Each adjacent tile can form a ring, 6-8) k~n are independent integers from 0 to 4, 7) B 21 is fluorenyl group; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of ; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of ; C1~C 30 Alkoxy group of; C6~C 30 aryloxy group; or a combination thereof, 8) A 21 and A 22 are independently chemical formula (F) or chemical formula (G), Chemical formula (F) Chemical formula (G) In the above chemical formula (F) and chemical formula (G), 8-1) * indicates the binding position, 8-2) R 27 ~R 30 are independently hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of ; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of ; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; Fluorenyl group; Carbonyl group; Ether group; or C1~C 30 is an alkoxycarbonyl group, 8-3) C 21 and C 22 are independently chemical formula (H), Chemical formula (H) 8-3-1) * indicates the binding position, 8-3-2) R 31 Silver hydrogen; deuterium; halogen; C6~C 30 Aryl group of; C2~C containing at least one heteroatom among O, N, S, Si and P 30 Heterocyclic group of ; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of; C2~C 30 Alkyne group of ; C1~C 30 Alkoxy group of; C6~C 30 Aryloxy group; Fluorenyl group; Carbonyl group; Ether group; or C1~C 30 is an alkoxycarbonyl group, 8-3-3) L 21 is a single bond; fluorenylene group; C1~C 30 alkylene; C6~C 30 Arylene of; C2~C 30 Heterocyclic ring of ; or C1~C 30 is an alkoxylene, 8-4) In a resin containing a repeating unit represented by chemical formula (3), the ratio of chemical formula (F) and chemical formula (G) is 1:9 to 9:1, 9) R above 21 ~R 31 , R', R", B 21 , and L 21 And the rings formed by bonding with each other are each composed of deuterium; halogen; C1~C 30 Alkyl group or C6~C 30 Silane group substituted or unsubstituted with an aryl group; siloxane group; boron group; germanium group; cyano group; amino group; nitro group; C1~C 30 Alkylthio group of; C1~C 30 Alkoxy group of; C6~C 30 Aryl alkoxy group of; C1~C 30 Alkyl group of; C2~C 30 Alkenyl group of ; C2~C 30 Alkyne group of; C6~C 30 Aryl group of; C6~C substituted with deuterium 30 Aryl group of; Fluorenyl group; C2~C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 Heterocyclic group of ; C3~C 30 Aliphatic ring group; C7~C 30 Arylalkyl group of; C8~C 30 An arylalkenyl group; and combinations thereof may be further substituted with one or more substituents selected from the group consisting of, and adjacent substituents may form a ring.

12. A resist composition according to claim 1, wherein the weight average molecular weight of the alkali-soluble resin is 1,000 to 100,000 g / mol.

13. A scattering film manufactured using the resist composition according to paragraph 1.

14. A scattering film according to claim 13, characterized in that the haze value is 10 to 50.

15. A scattering film characterized in that in the 13th paragraph, the reflectivity is 0.5% to 10%, the regular reflectivity is 2% to 15%, and the difference in reflectivity at each wavelength in the entire range of wavelengths is within 5%.

16. A scattering film according to claim 13, characterized in that the total transmittance is 70% to 99% and the transmittance at a viewing angle of 100° to 180° is 70% to 99%.

17. A display device comprising a scattering film according to Article 13.

18. An electronic device including a display device according to Article 17 and a control unit for driving the display device.

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