Microphone module

Abstract

A microphone module, comprising a shell, a PCB, and at least two MEMS microphones having sound inlet holes. The MEMS microphones, the PCB, and the shell are sequentially arranged from top to bottom; the MEMS microphones are electrically connected to the PCB; the PCB is provided with first sound pickup holes corresponding to the sound inlet holes of the MEMS microphones; the shell is provided with second sound pickup holes corresponding to the first sound pickup holes; and the sound inlet holes, the first sound pickup holes and the second sound pickup holes are sequentially communicated. The diameter size of the first sound pickup hole is defined to be D1 mm, and the distance between the center axes of two adjacent sound inlet holes is greater than or equal to 25D1 mm and less than or equal to 43D1 mm. A plurality of MEMS microphones, a PCB, and a shell are used, and sound waves are sensed by means of sound inlet holes in the MEMS microphones, first sound pickup holes in the PCB and second sound pickup holes in the shell. By means of the sound wave sensing structure, the microphone module has a good sound receiving effect, and the sound recognition effect is improved.

Description

Microphone module Technical Field

[0001] The invention relates to a microphone module, in particular to a microphone module having multiple MEMS microphones. Background Art

[0002] With the rapid development of intelligent technology, the development of voice recognition technology has become increasingly critical, placing higher demands on the recognition capabilities of microphone modules. MEMS (micro-electromechanical systems) microphones in microphone modules are manufactured based on MEMS technology. They offer numerous advantages, such as low mass and lightweight, and are used in many fields, such as mobile phones and automobiles.

[0003] Existing microphone modules contain only a single MEMS microphone, resulting in poor sound pickup and a lack of sound recognition performance that meets current requirements. Another existing microphone module includes multiple MEMS microphone units and an external structural member that secures each unit. The assembly of these units creates an additional microphone front cavity, which significantly affects the microphone's sound pickup response. Therefore, certain constraints must be placed on the front cavity structure and the spacing between the multiple microphones.

[0004] Therefore, it is necessary to provide a microphone module that can improve the sound recognition effect. Utility Model Content

[0005] The invention aims to solve the problem of poor sound recognition effect of microphone modules and provides a new type of microphone module.

[0006] To achieve the above-mentioned objectives, the invention provides a microphone module, comprising a MEMS microphone with a sound inlet hole, a PCB board and a shell arranged in sequence from top to bottom, wherein there are at least two MEMS microphones and are arranged at intervals from each other, each MEMS microphone is electrically connected to the PCB board, a first sound pickup hole is provided on the PCB board corresponding to the sound inlet hole of each MEMS microphone, and a second sound pickup hole is provided on the shell corresponding to the first sound pickup hole, the sound inlet hole, the first sound pickup hole and the second sound pickup hole are connected in sequence, and the diameter of the first sound pickup hole is defined as D1mm, and the distance between the central axes of adjacent sound inlet holes is greater than or equal to 25D1mm and less than or equal to 43D1mm.

[0007] As an improvement, the diameter of the first sound pickup hole is larger than the diameter of the sound inlet hole, and the diameter of the second sound pickup hole is larger than the diameter of the first sound pickup hole.

[0008] As an improvement, the second sound pickup hole is a conical funnel-shaped sound pickup hole, and the first sound pickup hole, the neck of the conical funnel-shaped sound pickup hole and the conical portion of the conical funnel-shaped sound pickup hole are arranged in sequence from top to bottom.

[0009] As an improvement, the shell includes a substrate and a sealing ring, a sealing ring mounting position is provided on the substrate, the sealing ring is located in the sealing ring mounting position, the PCB board is connected to the sealing ring, the center hole of the sealing ring serves as the neck of the conical funnel-shaped sound pickup hole, and a first through hole is provided on the substrate corresponding to the center hole, and the first through hole serves as the conical part of the conical funnel-shaped sound pickup hole.

[0010] As an improvement, the sealing ring is threadedly connected to the sealing ring installation position or is interference-fitted with the sealing ring installation position.

[0011] As an improvement, the diameter of the neck of the conical funnel-shaped sound pickup hole is greater than or equal to 4D1mm and less than or equal to 5D1mm.

[0012] As an improvement, the MEMS microphones are arranged sequentially along the same straight line.

[0013] As an improvement, the distance between the surface of the PCB board close to the housing and the surface of the housing away from the PCB board is less than 7 mm.

[0014] The invention has the beneficial effect of utilizing at least two MEMS microphones, in conjunction with a PCB and a housing, to achieve sound wave perception through the sound inlet holes in the MEMS microphones, the first sound pickup hole in the PCB, and the second sound pickup hole in the housing. The first sound pickup hole has a diameter of D1 mm, and the distance between the center axes of adjacent sound inlet holes is greater than or equal to 25D1 mm and less than or equal to 43D1 mm. This enables the microphone module to pick up sounds from different locations, resulting in improved sound pickup and recognition. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] FIG1 is a cross-sectional view of a microphone module according to a first embodiment of the present invention.

[0016] FIG2 is a perspective view of a microphone module according to a second embodiment of the present invention.

[0017] FIG3 is a front view of the microphone module shown in FIG2 .

[0018] FIG. 4 is a three-dimensional structural diagram of a substrate of the microphone module shown in FIG. 2 .

[0019] FIG5 is a partial structural diagram of the housing of the microphone module shown in FIG2 , illustrating the positional relationship between the sealing ring and the substrate. DETAILED DESCRIPTION

[0020] The invention will be described in detail below with reference to FIG. 1 to FIG. 5 .

[0021] As shown in Figure 1, a microphone module 100 according to a first embodiment of the present invention includes a housing 1, a PCB board 2, and at least two MEMS microphones 3. The MEMS microphones 3, the PCB board 2, and the housing 1 are arranged sequentially from top to bottom. The multiple MEMS microphones are spaced apart. Each MEMS microphone 3 has a sound inlet 31 electrically connected to the PCB board 2. A first sound pickup hole 21 is provided on the PCB board 2 corresponding to the sound inlet 31 of the MEMS microphone 3, and a second sound pickup hole 13 is provided on the housing 1 corresponding to the first sound pickup hole 21. The sound inlet 31, the first sound pickup hole 21, and the second sound pickup hole 13 are sequentially connected.

[0022] There are at least three MEMS microphones 3. In this embodiment, four MEMS microphones 3 are used. All MEMS microphones 3 are located on a single PCB board 2, which is located on a single housing 1. The connection method between the MEMS microphones 3 and the PCB board 2, or between the PCB board 2 and the housing 1, is not limited, and may be adhesively bonded or welded. The PCB board 2 is provided with a plurality of first sound pickup holes 21, which extend through the upper and lower surfaces of the PCB board 2. The housing 1 is provided with a plurality of second sound pickup holes 13, which extend through the upper and lower surfaces of the housing 1. The number of first sound pickup holes 21 and the number of second sound pickup holes 13 are the same as the number of MEMS microphones 3. The sound inlet holes 31 of the MEMS microphones 3 correspond to the first sound pickup holes 21, and the sound inlet holes 31 and the second sound pickup holes 13 correspond to each other. Sound is transmitted to the sound inlet holes 31 through the second sound pickup holes 13 and the first sound pickup holes 21.

[0023] In this embodiment, the diameter of the first sound pickup hole 21 is larger than the diameter of the sound inlet hole 31 , and the diameter of the second sound pickup hole 13 is larger than the diameter of the first sound pickup hole 21 .

[0024] In this embodiment, the second sound pickup hole 13 includes an upper sound pickup hole 131 and a lower sound pickup hole 132 . The upper sound pickup hole 131 is located above the lower sound pickup hole 132 , and the upper sound pickup hole 131 is connected to the lower sound pickup hole 132 .

[0025] In this embodiment, the second sound pickup hole 13 is a conical funnel-shaped sound pickup hole, comprising a neck portion and a conical portion connected to the neck portion. The neck portion of the conical funnel-shaped sound pickup hole corresponds directly to the first sound pickup hole 21, and the neck portion of the conical funnel-shaped sound pickup hole is located above the conical portion of the conical funnel-shaped sound pickup hole. In other alternative embodiments, the second sound pickup hole 13 is a horn-shaped sound pickup hole.

[0026] As an example, the left and right ends of the substrate 11 have baffles 14, and the PCB 2 is located between the left and right baffles 14. In a second embodiment, the baffles can be omitted. Figures 2 to 5 show schematic diagrams of the substrate 11 without baffles.

[0027] As shown in Figure 1, a sealing ring mounting position 111 is provided on the substrate 11. The sealing ring 12 is located in the sealing ring mounting position 111. The sealing ring 12 protrudes from the sealing ring mounting position 111. Of course, the sealing ring 12 can also be flush with the sealing ring mounting position 111. The sealing ring mounting position 111 is a groove provided on the substrate 11. Specifically, the sealing ring 12 is threadedly connected to the sealing ring mounting position 111 or has an interference fit with the sealing ring mounting position 111. The number of sealing ring mounting positions 111 and sealing rings 12 is equal to the number of MEMS microphones 3. The PCB board 2 is connected to the upper end of the sealing ring 12. A first through hole is provided on the substrate 11 corresponding to the center hole of the sealing ring 12. The first through hole is connected to the center hole of the corresponding sealing ring 12, together forming a second sound pickup hole 13. Specifically, as shown in Figure 3 , the center hole of the sealing ring 12 serves as the neck portion of the tapered funnel-shaped sound pickup hole, i.e., the upper sound pickup hole 131, and the first through hole serves as the tapered portion of the tapered funnel-shaped sound pickup hole, i.e., the lower sound pickup hole 132. In a second embodiment, as shown in Figures 2 to 5 , the sealing ring mounting position 111 is provided to protrude from the base plate 11.

[0028] In this embodiment, the diameter of the sound inlet 31 is defined as D mm, and the diameter of the first sound pickup hole 21 is defined as D1 mm. The diameter D1 mm of the first sound pickup hole 21 is larger than the diameter D mm of the sound inlet 31 to ensure effective sound recognition. In this embodiment, the diameter of the upper sound pickup hole 131 is defined as D2 mm, where D2 mm is greater than 4 D1 mm (4D1 mm means 4 times D1 mm) and less than or equal to 5D1 mm. Preferably, the diameter D2 of the upper sound pickup hole 131 is 2-3 mm.

[0029] In this embodiment, the distance between the center axes of the sound inlet holes 31 of adjacent MEMS microphones 3 is D3 mm, which is greater than or equal to 25D1 mm and less than or equal to 43D1 mm. Based on this design, the microphone module can pick up sounds from different locations, effectively improving the sound recognition effect. Preferably, the distance D3 between the center axes of the sound inlet holes 31 of adjacent MEMS microphones 3 is 20-30 mm. The distance between the surface of the PCB board 2 on the side closest to the housing 1 and the surface of the housing 1 on the side away from the PCB board 2 is less than 7 mm.

[0030] In this embodiment, the MEMS microphones 3 are arranged sequentially along the same straight line.

[0031] The above structure shows that the microphone module 100 provided in this embodiment utilizes at least two MEMS microphones 3, coupled with the same PCB board 2 and the same housing 1. Sound wave sensing is achieved through the sound inlet 31 of the MEMS microphone 3, the first sound pickup hole 21 of the PCB board 2, and the second sound pickup hole 13 of the housing 1. This multiple sound wave sensing structure improves the sound pickup effect of the microphone module 100 and enhances the sound recognition performance. When applied to automobiles, the microphone module provided in this embodiment can capture sound from various locations within the vehicle.

[0032] The above is only an embodiment of the invention. It should be pointed out that for ordinary technicians in this field, improvements can be made without departing from the inventive concept, but these all fall within the scope of protection of the invention.

Claims

1. A microphone module, characterized in that: It includes a MEMS microphone with an intake hole, a PCB board, and a housing, which are sequentially arranged from top to bottom. There are at least two MEMS microphones spaced from each other, and each MEMS microphone is electrically connected to the PCB board. A first sound pickup hole is provided on the PCB board corresponding to the intake hole of each MEMS microphone, and a second sound pickup hole is provided on the housing corresponding to the first sound pickup hole. The intake hole, the first sound pickup hole, and the second sound pickup hole are sequentially communicated. Define the diameter size of the first sound pickup hole as D1mm, and the distance between the central axes of adjacent intake holes is greater than or equal to 25D1mm and less than or equal to 43D1mm.

2. The microphone module according to claim 1, wherein: The diameter size of the first sound pickup hole is greater than the diameter size of the intake hole, and the diameter size of the second sound pickup hole is greater than the diameter size of the first sound pickup hole.

3. The microphone module according to claim 2, wherein: The second sound pickup hole is a conical funnel-shaped sound pickup hole, and the first sound pickup hole, the neck of the conical funnel-shaped sound pickup hole, and the conical part of the conical funnel-shaped sound pickup hole are sequentially arranged from top to bottom.

4. The microphone module according to claim 3, wherein: The housing includes a substrate and a sealing ring. A sealing ring installation position is provided on the substrate, and the sealing ring is located in the sealing ring installation position. The PCB board is connected to the sealing ring. The central hole of the sealing ring serves as the neck of the conical funnel-shaped sound pickup hole, and a first through hole corresponding to the central hole is provided on the substrate. The first through hole serves as the conical part of the conical funnel-shaped sound pickup hole.

5. The microphone module according to claim 4, wherein: The sealing ring is threadedly connected to the sealing ring installation position or is in interference fit with the sealing ring installation position.

6. The microphone module according to any one of claims 3 to 5, wherein: The diameter size of the neck of the conical funnel-shaped sound pickup hole is greater than or equal to 4D1mm and less than or equal to 5D1mm.

7. The microphone module according to claim 1, wherein: The MEMS microphones are sequentially arranged along the same straight line.

8. The microphone module according to claim 1, wherein: The distance between the surface of the PCB board close to the housing and the surface of the housing far from the PCB board is less than 7mm.

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