Processing method for printed circuit board with arc-shaped corner

Abstract

Specifically disclosed in the present invention is a processing method for a printed circuit board with an arc-shaped corner. The method comprises the following steps: S1, on the basis of clearance requirements of a printed circuit board, determining the radian of an arc-shaped corner to be processed, and then calculating the stress situation of the outermost edge position point of the radian of the arc-shaped corner; S2, on the basis of the stress situation of the outermost edge position point of the radian of the arc-shaped corner, determining a safe position point for the placement of a solder pad on the top surface of the printed circuit board; S3, on the basis of the arc-shaped corner, determining a wiring-forbidden area on the bottom surface of the printed circuit board; and S4, on the basis of the radian of the arc-shaped corner, selecting an arc-shaped milling cutter having a corresponding radian to process a pre-designed printed circuit board, so as to obtain a printed circuit board having the arc-shaped corner. By means of calculating the stress borne by a printed circuit board, the present invention realizes the effective clearance for a device while ensuring the reliability of a product, improves the integration level of the device, reduces the space a single functional module occupies on a mainboard, and thus reduces the area of the mainboard, and more space can be provided for mounting other components.

Description

Method for processing printed circuit board with arc corners

[0001] This application claims priority to a Chinese patent application filed with the Patent Office of China on January 5, 2024. The application number of the Chinese patent application is 202410018103.4, and the name of the invention is “A method for processing a printed circuit board with curved corners”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The invention belongs to the technical field of circuit board processing, and in particular relates to a processing method of a printed circuit board with an arc corner. Background Art

[0003] Consumer electronics like mobile phones, tablets, and smart speakers often incorporate small PCBA modules specifically designed to achieve superior optical or acoustic performance. These small modules are typically placed on densely packed motherboards. Traditional PCBs are typically arranged vertically across a horizontal plane, requiring sufficient clearance for these small PCBAs on the motherboard, which reduces the motherboard footprint. If portions of the PCB are specially shaped to accommodate this clearance, the structural support of the PCB may be insufficient, impacting product reliability.

[0004] Summary of the Invention

[0005] In order to solve the above technical problems, the present invention provides a method for processing a printed circuit board with curved corners, the method comprising the following steps:

[0006] S1. Determine the curvature of the arc angle to be processed based on the avoidance requirements of the printed circuit board, and then calculate the force condition of the outermost edge position of the arc angle;

[0007] S2. Determine a safe position for placing the pads on the top surface of the printed circuit board based on the force applied to the outermost edge of the arc angle;

[0008] S3, determining a prohibited wiring area on the bottom surface of the printed circuit board according to the arc angle;

[0009] S4. Based on the arc angle, a curved milling cutter with a corresponding arc is selected to process the pre-designed printed circuit board, thereby obtaining a printed circuit board with a curved angle.

[0010] Preferably, the step S1 specifically includes:

[0011] S11. determining avoidance requirements on the printed circuit board according to the avoidance device;

[0012] S12, determining the radian of the arc angle to be processed on the printed circuit board and the starting point of the radian of the arc angle based on the avoidance requirement on the printed circuit board;

[0013] S13. Calculate the force condition of the outermost edge of the arc angle based on the arc angle and the remaining thickness of the printed circuit board.

[0014] Preferably, the step S2 specifically includes: determining a safe position point for placing the solder pad on the top surface of the printed circuit board based on the stress condition of the outermost edge position point of the arc angle and the remaining thickness of the printed circuit board.

[0015] Preferably, the safe position point for placing the solder pad on the top surface of the printed circuit board is related to the stress condition at the outermost edge position point of the arc angle, the remaining thickness of the printed circuit board and the curvature of the milling cutter arc angle. When the stress condition at the outermost edge position point of the arc angle and the remaining thickness of the printed circuit board remain unchanged, the safe position point is proportional to the curvature of the arc angle.

[0016] Preferably, the prohibited wiring area on the bottom surface of the printed circuit board in step S3 is the area between the starting point of the arc angle and the outermost edge point of the arc angle.

[0017] Preferably, in step S4, the printed circuit board is pre-designed based on the arc angle, the pad placement area on the top surface of the printed circuit board, and the keep-out area on the bottom surface of the printed circuit board.

[0018] Compared with the prior art, the present invention provides a method for processing a printed circuit board with curved corners. By calculating the stress that the printed circuit board can withstand, the area on the top surface where the pads are placed and the area on the bottom surface where wiring is prohibited are determined. This effectively avoids components while ensuring product reliability, improves component integration, reduces the space occupied by a single functional module on the main board, and thereby reduces the area of ​​the main board, providing more space for the installation of other components. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] FIG1 is a flow chart of a method for processing a printed circuit board with curved corners according to the present invention.

[0020] FIG2 is a schematic structural diagram of a printed circuit board with curved corners in the present invention,

[0021] FIG3 is a top view of FIG2 ,

[0022] FIG. 4 is a bottom view of FIG. 2 . DETAILED DESCRIPTION

[0023] The following is a specific implementation example of the present invention to further illustrate the present invention in detail. The present invention is not limited to the following specific implementation example.

[0024] Unless otherwise defined, all professional terms used hereinafter have the same meanings as those generally understood by those skilled in the art. The words "first", "second" and similar words used in the patent application specification and claims of the present invention do not indicate any order, quantity or importance, but are merely for the convenience of distinguishing the corresponding components. Similarly, words such as "one" or "an" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "connect" or "connected" are not limited to direct connections, but may be indirectly connected through other intermediate connectors. "Above", "below", "one side", "the other side", "vertical", "horizontal" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship also changes accordingly.

[0025] As shown in FIG1 , the present invention provides a method for processing a printed circuit board with curved corners, the method comprising the following steps:

[0026] S1. Determine the curvature of the arc angle to be processed based on the avoidance requirements of the printed circuit board, and then calculate the force condition of the outermost edge position of the arc angle;

[0027] This step is to obtain the corresponding avoidance requirements of the printed circuit board according to the device to be installed, determine the curvature of the arc angle to be processed based on the avoidance requirements, and calculate the force condition of the outermost position point (G point) of the arc angle, which specifically includes:

[0028] S11. determining avoidance requirements on the printed circuit board according to the avoidance device;

[0029] S12, determining the radian of the arc angle to be processed on the printed circuit board and the starting point of the radian of the arc angle based on the avoidance requirement on the printed circuit board;

[0030] S13. Calculate the force condition of the outermost edge of the arc angle based on the arc angle and the remaining thickness of the printed circuit board.

[0031] S2. Determine a safe position for placing the pads on the top surface of the printed circuit board based on the force applied to the outermost edge of the arc angle;

[0032] This step specifically includes: first obtaining the radians of various arc angles of the milling cutter, and calculating the corresponding force conditions at the outermost edge position point (point G) of the different arc angles based on the remaining thickness of the printed circuit board. Then, based on the milling cutters of different arc angles and the force conditions at the outermost edge position point (point G) of the corresponding arc angle, a safe position point (point Y) for placing the pads on the top surface of the printed circuit board can be determined. In this embodiment, the position value of the safe position point (point Y) refers to the distance value between the safe position point (point Y) and the starting position point (point H) of the arc angle. Specific details are shown in Tables 1 and 2. Among them, Table 1 shows the corresponding relationship between the radian of the milling cutter arc angle, the force condition at the outermost position point (G point) of the arc angle, and the safe position point (Y point) for placing the pad on the top surface of the printed circuit board when the remaining thickness of the printed circuit board is 0.4 mm, 0.5 mm, and 0.6 mm respectively; Table 2 shows the corresponding relationship between the radian of the milling cutter arc angle, the force condition at the outermost position point (G point) of the arc angle, and the safe position point (Y point) for placing the pad on the top surface of the printed circuit board when the remaining thickness of the printed circuit board is 0.7 mm and 0.8 mm respectively:

[0033] Table 1 Correspondence between the arc angle of the milling cutter, the force at the outermost edge of the arc angle, and the position of the safety position when the remaining thickness of the printed circuit board is 0.4, 0.5, and 0.6 mm

[0034] Table 2 Correspondence between the remaining thickness of the printed circuit board of 0.7mm and 0.8mm and the arc angle of the milling cutter, the force at the outermost edge of the arc angle, and the position of the safe position point

[0035] It can be seen from Table 1 and Table 2 that when the remaining thickness of the printed circuit board and the arc angle of the milling cutter are determined, the force condition of the outermost edge position point (point G) of the arc angle is inversely proportional to the position of the safe position point (point Y), that is, when the force value of the outermost edge position point (point G) of the arc angle is greater, the position value of the safe position point (point Y) is smaller. In other words, the distance between the safe position point (point Y) and the starting position point of the arc angle is smaller at this time; when the force condition of the outermost edge position point (point G) of the milling cutter arc angle and the remaining thickness of the printed circuit board are determined unchanged, the position of the safe position point (point Y) for placing the pad on the top surface of the printed circuit board is proportional to the arc angle of the milling cutter.

[0036] It can be seen from this that in the processing of printed circuit boards with curved angles, it is necessary to calculate the force conditions at the outermost edge of the curved angle (point G) and the safe position point for placing the pads on the top surface of the printed circuit board (point Y) based on the remaining thickness value of the printed circuit board. Then, a milling cutter with the corresponding curved angle is used for processing to obtain a printed circuit board with the required curved angle.

[0037] S3, determining a prohibited wiring area on the bottom surface of the printed circuit board according to the arc angle;

[0038] In this step, the prohibited wiring area on the bottom surface of the printed circuit board is obtained based on the determined arc angle, that is, the area between the starting point of the arc angle (point H) and the outermost edge point of the arc angle (point G). This can effectively prevent the area from being affected by stress and causing external deformation, or even worse, causing the circuit in the area to deform and peel off, resulting in failure of the printed circuit board.

[0039] S4. Selecting a curved milling cutter with a corresponding curvature based on the curvature of the curved angle and processing the pre-designed printed circuit board to obtain a printed circuit board with a curved angle.

[0040] In this step, the printed circuit board is pre-designed based on the arc angle, the top surface pad placement area of ​​the printed circuit board, and the prohibited wiring area on the bottom surface of the printed circuit board. The pre-designed printed circuit board is processed using a pre-customized arc milling cutter to obtain a printed circuit board with the required arc angle.

[0041] In this embodiment, the stress that the printed circuit board can withstand is first calculated to determine the area on the top surface where the pads are placed and the area on the bottom surface where wiring is prohibited. Then, a bare board design is performed on the printed circuit board based on the wiring rules to obtain a printed circuit board with the required arc angle. This printed circuit board achieves effective device avoidance while ensuring product reliability, improves device integration, reduces the space occupied by a single functional module on the main board, and thus reduces the area of ​​the main board, providing more space for the installation of other components. This solves the technical problem in the prior art of insufficient structural support of the PCB, which affects product reliability.

[0042] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A processing method for a printed circuit board with arc-shaped corners, characterized in that, The method includes the following steps: S1. Determine the radian of the arc corner to be processed based on the avoidance requirements of the printed circuit board, and then calculate the force condition at the outermost position point of the arc corner radian; S2. Determine the safe position point for placing pads on the top surface of the printed circuit board based on the force condition at the outermost position point of the arc corner radian; S3. Determine the area where wiring is prohibited on the bottom surface of the printed circuit board according to the arc corner; S4. Select an arc milling cutter with a corresponding radian based on the arc corner radian to process the pre-designed printed circuit board, and then obtain a printed circuit board with an arc corner.

2. The processing method of the printed circuit board with arc-shaped corners as described in claim 1, characterized in that, The specific content of step S1 includes: S11. Determine the avoidance requirements on the printed circuit board according to the avoidance devices; S12. Determine the radian of the arc corner to be processed on the printed circuit board and the starting position point of the arc corner radian based on the avoidance requirements on the printed circuit board; S13. Calculate the force condition at the outermost position point of the arc corner radian based on the arc corner radian and the remaining thickness of the printed circuit board.

3. The processing method of the printed circuit board with an arc-shaped corner according to claim 2, characterized in that The specific content of step S2 is: Determine the safe position point for placing pads on the top surface of the printed circuit board based on the force condition at the outermost position point of the arc corner radian and the remaining thickness of the printed circuit board.

4. The processing method of the printed circuit board with arc-shaped corners according to claim 3, characterized in that, The safe position point for placing pads on the top surface of the printed circuit board is related to the force condition at the outermost position point of the arc corner radian, the remaining thickness of the printed circuit board, and the radian of the arc of the milling cutter. When the force condition at the outermost position point of the arc corner radian and the remaining thickness of the printed circuit board remain unchanged, the safe position point is proportional to the radian of the arc corner.

5. The processing method of a printed circuit board with an arc-shaped corner as described in claim 4, characterized in that, In step S3, the area where wiring is prohibited on the bottom surface of the printed circuit board is the area between the starting position point of the arc corner radian and the outermost position point of the arc corner radian.

6. The processing method of the printed circuit board with arc-shaped corners according to claim 5, characterized in that, In step S4, the printed circuit board is pre-designed based on the arc corner radian, the pad placement area on the top surface of the printed circuit board, and the area where wiring is prohibited on the bottom surface of the printed circuit board.

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