Circuit board component and electronic device

Abstract

Provided in the present application are a circuit board component (100) and an electronic device (1000). An electromagnetic shielding member (120) is provided on a mainboard (110); a measurement module (130) can be provided, as an independent module, on the electromagnetic shielding member (120); the mainboard (110), the electromagnetic shielding member (120) and the measurement module (130) are stacked to form the circuit board component (100); the circuit board component (100) is mounted to a middle frame (300); a bottom casing (200) is installed on the middle frame (300); the measurement module (130) is electrically connected to the mainboard (110) to implement signal transmission. No safety gap needs to be reserved between the electromagnetic shielding member (120) and the measurement module (130); and there is no need to provide a support having a certain thickness on the bottom casing (200). The electronic device (1000) of the present embodiments achieves miniaturization with a reduced overall thickness, allowing the overall thickness to be reduced by 0.15mm or more; in case of dropping and compression during production or in scenarios of use by users, the measurement module (130), the electromagnetic shielding member (120) and the mainboard (110) undergo synchronous micro-deformation, thus reducing failures of or damage to the measurement module (130) caused by collisions; the electronic device (1000) of the present embodiments facilitates assembly and involves a simple assembly process.

Description

Circuit board assembly and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on January 2, 2024, with application number 202420021841.X and application name “A circuit board assembly and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the technical field of circuit board assemblies, and in particular to a circuit board assembly and an electronic device. Background Art

[0003] Electronic devices, such as watches and bracelets, typically consist of a midframe, bottom case, motherboard, and detection modules. The detection module (e.g., photoplethysmography, PPG) is mounted on the bottom case, and the motherboard is mounted on the midframe. With the advancement of electronic technology, users' expectations for the appearance and performance of electronic devices are becoming increasingly stringent. Miniaturization of electronic devices is a pressing issue.

[0004] Summary of the Invention

[0005] Embodiments of the present application provide a circuit board assembly and an electronic device, which achieve miniaturization of an electronic device having a detection module.

[0006] The embodiments of this application adopt the following technical solutions:

[0007] In a first aspect, embodiments of the present application provide a circuit board assembly comprising: a mainboard, an electromagnetic shielding component, and a detection module. The mainboard has a first surface and a second surface that are opposite to each other. The electromagnetic shielding component has a third surface and a fourth surface that are opposite to each other. The electromagnetic shielding component is disposed on the first surface of the mainboard, with the third surface of the electromagnetic shielding component and the first surface of the mainboard facing each other. The detection module comprises a substrate and a detection unit. The substrate has a fifth surface and a sixth surface that are opposite to each other. The fifth surface of the substrate is fixed to the fourth surface of the electromagnetic shielding component. The detection unit is mounted on the sixth surface of the substrate. The substrate and the mainboard are electrically connected.

[0008] In the circuit board assembly provided in the embodiment of the present application, the electromagnetic shielding component is provided on the main board, and the detection module can be provided on the electromagnetic shielding component as an independent module. The detection module and the main board are conductively connected, and the main board, the electromagnetic shielding component and the detection module are stacked and assembled to form a circuit board assembly. When the circuit board assembly is applied to an electronic device as an integral component, it can be directly assembled on the middle frame of the electronic device. No safety gap needs to be reserved between the electromagnetic shielding component and the detection module, and a bracket with a certain thickness does not need to be provided on the bottom shell. The circuit board assembly of this embodiment can be miniaturized, with a small overall thickness, and can achieve a thinning of the entire machine by more than 0.15mm. In the event of falling or squeezing during the production process or in user usage scenarios, the detection module, the electromagnetic shielding component and the main board will undergo synchronous micro-deformation to reduce failure or damage caused by collision of the detection module.

[0009] In an optional implementation, the fifth surface of the substrate and the fourth surface of the electromagnetic shielding component can be connected by adhesive bonding, welding, riveting, snap connection or fasteners (such as screws), which can conveniently achieve a reliable connection between the substrate and the electromagnetic shielding component.

[0010] In an optional implementation, when the substrate and the electromagnetic shielding component are connected by a colloid, the colloid can be a double-sided tape. The double-sided tape is set on the substrate or the electromagnetic shielding component, and then the substrate and the electromagnetic shielding component are bonded together by the double-sided tape. The double-sided tape is a colloid layer set between the substrate and the electromagnetic shielding component.

[0011] In an optional implementation, when the substrate and the electromagnetic shielding component are connected by colloid, the colloid can be dispensing glue. Liquid glue is set on the substrate or the electromagnetic shielding component, and the substrate and the electromagnetic shielding component are pressed together. After the liquid glue is cured, the connection between the substrate and the electromagnetic shielding component can be achieved.

[0012] In an optional implementation, when the substrate and the electromagnetic shielding component are connected by a snap-fit ​​connection, the substrate has a snap-fit ​​position, and the electromagnetic shielding component has a snap-fit. The snap-fit ​​is placed on the snap-fit ​​position to fix the substrate on the electromagnetic shielding component.

[0013] In one optional implementation, a first electronic component is provided on the first surface of the mainboard, and the electromagnetic shielding component covers the first electronic component. The electromagnetic shielding component includes a plate-like portion and a flange portion, wherein the flange portion is connected to the edge of the plate-like portion and is fixed to the first surface of the mainboard. The end surface of the plate-like portion facing the mainboard forms a third surface, and the end surface of the plate-like portion facing away from the mainboard forms a fourth surface. The plate-like portion is used to provide electromagnetic shielding for the first electronic component and also serves as a support portion for the substrate in the detection module. The flange portion can be connected to the first surface of the mainboard to secure the electromagnetic shielding component to the mainboard.

[0014] In one optional implementation, the substrate may include a first flexible extension section that is electrically conductively connected to the mainboard. The mainboard, electromagnetic shielding component, and detection module are assembled to form a circuit board assembly. The shorter, smaller first flexible extension section is positioned between the mainboard and the substrate, enabling a conductive connection between the mainboard and the detection module at a lower cost.

[0015] In one optional implementation, the connection between the first flexible extension and the mainboard is located on the first surface of the mainboard, near the edge of the electromagnetic shielding element. By achieving a conductive connection between the mainboard and the substrate through the first flexible extension, the length and area of ​​the first flexible extension can be shortened, effectively reducing costs.

[0016] In an optional implementation, the substrate has one or more second flexible extension segments, and the one or more second flexible extension segments are respectively provided with second electronic components.

[0017] A second electronic component with a predetermined function can be mounted on the second flexible extension. By adjusting the position and posture of the second flexible extension, the second electronic component can be adjusted to the predetermined position. The substrate can be configured with multiple second flexible extensions as needed, and with second electronic components with different functions, to achieve diverse functional expansion.

[0018] In an optional implementation, the substrate includes a flexible circuit board and a reinforcement sheet, the flexible circuit board and the reinforcement sheet are stacked and connected, the first flexible extension section is formed on the flexible circuit board, the reinforcement sheet is not arranged on the first flexible extension section, the detection unit is arranged in the area of ​​the flexible circuit board corresponding to the reinforcement sheet, and the reinforcement sheet is fixed on the fourth surface of the electromagnetic shielding component.

[0019] The flexible printed circuit board serves as a carrier for mounting the detection unit, while the first flexible extension section connects the base plate to the mainboard. The reinforcing sheet increases structural strength. The reinforcing sheet is secured to the electromagnetic shielding element, ensuring the detection module is securely fixed to the element.

[0020] In an optional implementation, the substrate includes a first rigid board and a first flexible board, the first rigid board and the first flexible board are conductively connected, the first flexible board serves as a first flexible extension section, the detection unit is provided on the first rigid board, and the first rigid board is fixed on the fourth surface of the electromagnetic shielding component.

[0021] The first rigid board serves as a carrier for mounting the detection unit, and the first flexible board serves as a flexible extension portion for connecting the first rigid board and the main board. The first rigid board is fixed to the electromagnetic shielding component to ensure that the detection module is reliably fixed to the electromagnetic shielding component.

[0022] In an optional implementation, the substrate is a rigid-flexible board, which includes a first rigid part and a first flexible part. The first rigid part and the first flexible part are conductively connected, the first flexible part serves as a first flexible extension segment, the detection unit is provided on the first rigid part, and the first rigid part is fixed on the fourth surface of the electromagnetic shielding component.

[0023] The first rigid portion and the first flexible portion are integrally structured. The first rigid portion serves as a carrier for mounting the detection unit, while the first flexible portion serves as a flexible extension connecting the first rigid portion to the mainboard. The first rigid portion is secured to the electromagnetic shielding element, ensuring the detection module is securely fixed to the electromagnetic shielding element.

[0024] In one optional implementation, the substrate and mainboard are electrically connected via a connector. The connector includes a first connecting portion and a second connecting portion that engage with each other. The first connecting portion is provided on the substrate, and the second connecting portion is provided on the mainboard. Using the connector to connect the substrate and mainboard facilitates assembly and provides an electrically conductive connection between the two.

[0025] In an optional implementation, the connector may be a board-to-board connector, a zero insertion force connector, or other types of connectors.

[0026] In an optional implementation, when the substrate has a first flexible extension section, the first connecting portion can be provided on the first flexible extension section. After the substrate is fixed to the electromagnetic shielding component, the position of the first flexible extension section is adjusted so that the first connecting portion and the second connecting portion are plugged in and matched, and the assembly is convenient and reliable.

[0027] In an optional implementation, when the substrate does not have a first flexible extension section, the first connecting portion can be provided on the side of the substrate facing the mainboard, and the second connecting portion can be provided on the side of the mainboard facing the substrate. By plugging the first connecting portion and the second connecting portion into each other, a conductive connection between the substrate and the mainboard can be achieved.

[0028] In an optional implementation, the substrate and the mainboard are electrically connected by welding. The substrate has a first welding pad, and the mainboard has a second welding pad. The first welding pad and the second welding pad are welded together. The welding pad connection between the substrate and the mainboard is easy to assemble and realizes an electrically conductive connection between the two.

[0029] In one optional implementation, the detection unit may include at least one of an optical plethysmography sensor, an electrocardiogram sensor, and a temperature sensor. In other words, the detection unit may be configured with one or more functions as needed. Different detection units may monitor different physiological parameters of the user.

[0030] In an optional implementation, when the detection unit includes an optical plethysmography sensor, the optical plethysmography sensor includes one or more light-emitting diodes and one or more photodiodes, the light-emitting surface of the light-emitting diode is arranged to face away from the mainboard, and the light-receiving surface of the photodiode is arranged to face away from the mainboard.

[0031] In an optional implementation, a light shield is provided between the light emitting diode and the photodiode to prevent the light from the light emitting diode from directly irradiating the photodiode, so that the photodiode receives the light signal reflected by the human body, thereby improving detection accuracy.

[0032] In one optional implementation, the light shielding member can be made of a material such as foam. The light shielding member can be configured in a rectangular or circular shape and surround the LED. The area of ​​the light shielding member can be adjusted as needed. The light shielding member can be secured to the substrate by bonding or other methods.

[0033] In an optional implementation, the inner wall of the bottom shell may have partition ribs. When the bottom shell is fixed to the middle frame, the partition ribs are pressed against the shading member to achieve a shading effect between the light-emitting diode and the photodiode.

[0034] In an optional implementation, two photodiodes, two photodiodes and a frame-shaped shading member are provided on the substrate, the photodiodes and the photodiodes are arranged alternately in a predetermined direction, and the shading member is arranged between two adjacent photodiodes and around one photodiode.

[0035] In one optional implementation, a first lens is positioned in front of the light-emitting surface of the LED, and a second lens is positioned in front of the light-receiving surface of the photodiode. The combination of the LED and the first lens allows the light generated by the LED to be effectively emitted. The combination of the photodiode and the second lens allows external light to be effectively received by the photodiode.

[0036] In one optional implementation, a battery is secured to the second surface of the mainboard, electrically connected to the mainboard. The battery can be used to power components such as the mainboard and detection module. This allows for a larger battery size and capacity, increasing the maximum operating time of the entire device. The battery can be located within the midframe.

[0037] In the second aspect, an embodiment of the present application provides an electronic device, including the above-mentioned circuit board assembly, a bottom shell and a middle frame, the bottom shell and the middle frame are connected, the circuit board assembly includes a mainboard, an electromagnetic shielding component and a detection module, the mainboard has a first surface and a second surface opposite to each other, the mainboard is arranged on the middle frame, the first surface of the mainboard and the bottom shell are arranged facing each other, the electromagnetic shielding component is arranged on the first surface of the mainboard, the detection module is arranged on the electromagnetic shielding component, the detection module and the mainboard are conductively connected, and the detection module is arranged close to the bottom shell.

[0038] In the electronic device provided by the embodiment of the present application, the electromagnetic shielding component is provided on the mainboard, and the detection module can be provided on the electromagnetic shielding component as an independent module. The mainboard, the electromagnetic shielding component and the detection module are stacked and assembled to form a circuit board assembly, and the circuit board assembly is assembled on the middle frame, and the bottom shell is installed on the middle frame. The detection module and the mainboard are conductively connected to realize signal transmission. No safety gap needs to be reserved between the electromagnetic shielding component and the detection module, and a bracket with a certain thickness does not need to be provided on the bottom shell. The electronic device of this embodiment can be miniaturized, and the thickness of the whole machine is small, which can achieve a thinning of the whole machine by more than 0.15mm. In the case of falling or squeezing during the production process or user use scenarios, the detection module, the electromagnetic shielding component and the mainboard are synchronously slightly deformed to reduce failure or damage caused by collision of the detection module. The electronic device of this embodiment is easy to assemble, and the assembly process is simple. There is no need to use the hot melt column of the bottom shell to fix the detection module, nor is there a need to stick a mylar sheet on the outer surface of the hot melt column.

[0039] In one optional implementation, the electronic device is a watch, bracelet, or other wearable device, and the bottom housing is mounted on a middle frame. The middle frame can be connected to a watch strap or wristband for easy wear and use. When the user wears the wearable device, the detection module is positioned near the bottom housing, facing the user's skin, and can detect information such as the user's physiological indicators.

[0040] In an optional implementation, the mainboard and the middle frame may be connected by fasteners (such as screws), snaps, rivets, adhesives, and other different connection methods, and the mainboard and the middle frame may be assembled as a circuit board assembly on the middle frame.

[0041] In an optional implementation, the mainboard has multiple through holes and the middle frame has multiple threaded holes. By aligning the through holes of the mainboard and the threaded holes of the middle frame, passing fasteners through the through holes and threading them into the threaded holes, the circuit board assembly can be securely fixed to the middle frame.

[0042] In an optional implementation, the mainboard has a latching position and the middle frame has a buckle. By placing the buckle on the latching position, the circuit board assembly can be reliably fixed on the middle frame.

[0043] In an optional implementation, the middle frame and the bottom shell may be connected by means of colloid bonding, snap fastening, or the like to achieve a reliable connection between the middle frame and the bottom shell.

[0044] In one optional implementation, the device further includes a screen assembly, which is disposed on the midframe and electrically connected to the motherboard. The second surface of the motherboard faces the screen assembly. The screen assembly is configured to output light to display images, text, and other information. The screen assembly and the bottom case can be disposed at opposite ends of the midframe, with the screen assembly displaying information to the user and a detection module located near the bottom case detecting the user.

[0045] In an optional implementation, the screen assembly may have a touch layer, the touch layer being electrically connected to the mainboard, and the touch layer being used to detect touch operations applied thereon or in the vicinity thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] FIG1 is a cross-sectional view of an electronic device of the related art;

[0047] FIG2 is a partial enlarged view of point A in FIG1 ;

[0048] FIG3 is a schematic diagram of the assembly of the detection module and the bottom shell in the related art;

[0049] FIG4 is a three-dimensional structural diagram of the detection module of FIG3;

[0050] FIG5 is a cross-sectional view of another electronic device of the related art;

[0051] FIG6 is an exploded perspective view of an electronic device provided in an embodiment of the present application;

[0052] FIG7 is a schematic diagram of the assembly of a portion of the electronic device in FIG6 ;

[0053] FIG8 is a perspective assembly diagram of the circuit board assembly in the electronic device of FIG6 ;

[0054] FIG9 is a front view of the circuit board assembly of FIG8;

[0055] FIG10 is a side view of the circuit board assembly of FIG9;

[0056] FIG11 is a cross-sectional view of the circuit board assembly of FIG8 taken along line BB;

[0057] FIG12 is a schematic structural diagram of a detection module in the circuit board assembly of FIG9 ;

[0058] FIG13 is a schematic structural diagram of a detection module in a circuit board assembly provided by another embodiment of the present application;

[0059] FIG14 is a schematic structural diagram of a detection module in a circuit board assembly provided in another embodiment of the present application;

[0060] FIG15 is a cross-sectional view of an electronic device provided in an embodiment of the present application;

[0061] FIG16 is a partial enlarged view of point C in FIG15 .

[0062] Description of reference numerals:

[0063] 10 - electronic device; 11 - middle frame; 12 - bottom shell; 13 - mainboard; 13a - electronic components; 14 - electromagnetic shielding; 15 - detection module; 15a - substrate; 15b - flexible printed circuit board; 16 - battery; 17 - gap; 18 - hot melt column;

[0064] 20 - electronic device; 21 - middle frame; 22 - bottom shell; 23 - main board; 24 - sub-board; 25 - detection module; 25a - substrate; 25b - flexible printed circuit board; 26 - battery; 27 - bracket; 28 - gap; 29 - flexible circuit board;

[0065] 100-circuit board assembly;

[0066] 110 - mainboard; 110a - first surface; 110b - second surface; 111 - via; 112 - first electronic component;

[0067] 120 - electromagnetic shielding member; 120a - third surface; 120b - fourth surface; 121 - plate-shaped portion; 122 - flange portion; 123 - edge;

[0068] 130 - Detection module; 131 - Substrate; 131a - Fifth surface; 131b - Sixth surface; 131c - Flexible circuit board; 131d - Reinforcement sheet; 131e - First rigid board; 131f - First flexible board; 131g - Connector; 131h - First rigid portion; 131i - First flexible portion; 1311 - First flexible extension; 1311a - Connection position; 1312 - Second flexible extension; 132 - Detection unit; 1321 - Light-emitting diode; 1322 - Photodiode; 1323 - Light shielding member; 1324 - First lens; 1325 - Second lens; 133 - Predetermined device;

[0069] 140 - colloid; 150 - second electronic component; 160 - connector; 161 - first connecting portion; 162 - second connecting portion; 170 - battery;

[0070] 200- bottom shell; 201- partition rib; 300- middle frame; 301- fastener; 400- screen assembly; 1000- electronic device. DETAILED DESCRIPTION

[0071] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application clearer, the application is further described in detail below in conjunction with the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain this application and are not used to limit this application. Although the description of this application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of introducing the application in conjunction with the embodiment is to cover other options or modifications that may be extended based on the claims of this application. In order to provide an in-depth understanding of the application, the following description will contain many specific details. This application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of this application, some specific details will be omitted in the description. It should be noted that the embodiments in this application and the features in the embodiments can be combined with each other unless there is a conflict.

[0072] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0073] It should be understood that in the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The orientation or positional relationship indicated by the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0074] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0075] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0076] Referring to Figures 1 and 2, an electronic device 10 in the related art may include a middle frame 11, a bottom housing 12, a motherboard 13, an electromagnetic shielding element 14, a detection module 15, and a battery 16. The detection module 15 is mounted on the bottom housing 12, the motherboard 13 is mounted on the middle frame 11, and the battery 16 is assembled on the top surface of the motherboard 13. The bottom surface of the motherboard 13 may be mounted with electronic components 13a, such as a communication chip. The electromagnetic shielding element 14 is disposed on the bottom surface of the motherboard 13 and covers the electronic components 13a. The bottom surface of the motherboard 13 and the bottom housing 12 are arranged facing each other, and the bottom housing 12 is mounted on the middle frame 11. A safety gap 17 of at least 0.15 mm is required between the electromagnetic shielding element 14 and the substrate 15a of the detection module 15 to reduce the possibility of instantaneous micro-deformation of the detection module 15 caused by drops or squeezing during production or user use, which could lead to failure or damage to the detection module 15 due to collisions. The safety gap 17 increases the thickness of the electronic device 10 (the dimension in the left-right direction in FIG. 1 and FIG. 2 ).

[0077] 3 , when installing the detection module 15 on the bottom case 12, the base plate 15a of the detection module 15 needs to be passed through the heat-seal posts 18 of the bottom case 12 and fixed to the bottom case 12 by heat riveting. A tape can be applied to the outer surface of the heat-seal posts 18 to prevent wire-drawing or roughening of the outer surface. This complicates the manufacturing process.

[0078] Referring to Figures 3 and 4 , the detection module 15 is mounted on the bottom housing 12. The substrate 15a includes a redundant flexible printed circuit (FPC) 15b. Before the bottom housing 12 is mounted on the middle frame 11, the FPC 15b of the detection module 15 must be connected to the mainboard 13 via a connector to establish a conductive connection between the mainboard 13 and the detection module 15. The FPC 15b of the detection module 15 must be designed to accommodate the gap between the electromagnetic shielding element 14 and the bottom housing 12, ensuring a certain path. This results in a longer length, larger area, and higher cost.

[0079] Referring to FIG5 , another electronic device 20 in the related art may include a middle frame 21, a bottom shell 22, a main board 23, a sub-board 24, a detection module 25, a battery 26, and a bracket 27. The detection module 25 is mounted on the bottom shell 22. The thickness of the bracket 27 is about 0.6 mm. The bracket 27 is mounted on the bottom shell 22 and is located above the detection module 25 (to the left of the detection module 25 in FIG5 ). The battery 26 is mounted on the bracket 27. The main board 23 and the sub-board 24 are mounted on the side of the battery 26, that is, next to the battery 26 in a direction perpendicular to the thickness direction (the battery thickness direction in FIG5 is the left-right direction). A safety gap 28 of greater than or equal to 0.15 mm needs to be reserved between the bracket 27 and the substrate 25a in the detection module 25 to reduce the instantaneous micro-deformation of the detection module 25 caused by falling or squeezing during the production process or user use, and the failure or damage caused by the collision of the detection module 25. The above-mentioned safety gap 28 and the thickness of the bracket 27 will increase the thickness of the electronic device 20 as a whole (the left-right dimension in FIG5 ).

[0080] The main board 23 and the auxiliary board 24 are arranged on the side of the battery 26, which makes the battery 26 smaller in size and capacity, affecting the maximum working time of the whole machine. The main board 23 and the auxiliary board 24 need to be connected by a flexible circuit board 29, which makes the manufacturing process complicated.

[0081] The detection module 25 is mounted on the bottom housing 22. The substrate 25a includes a redundant flexible printed circuit board 25b. Before the bottom housing 22 is mounted on the middle frame 21, the FPC 25b of the detection module 25 must be connected to the mainboard 23 via a connector to establish a conductive connection between the mainboard 23 and the detection module 25. The FPC 25b of the detection module 25 must be designed to accommodate the gaps between multiple components and a specific path. The FPC 25b extends along the bottom, sides, and top of the battery 26, resulting in a long length, large area, and high cost.

[0082] Referring to Figures 6 to 8, an embodiment of the present application provides an electronic device 1000, including a circuit board assembly 100, a bottom shell 200 and a middle frame 300, the bottom shell 200 and the middle frame 300 are connected, the circuit board assembly 100 includes a mainboard 110, an electromagnetic shielding component 120 and a detection module 130, the mainboard 110 has a first surface 110a and a second surface 110b opposite to each other, the mainboard 110 is arranged on the middle frame 300, the first surface 110a of the mainboard 110 and the bottom shell 200 are arranged facing each other, the electromagnetic shielding component 120 is arranged on the first surface 110a of the mainboard 110, the detection module 130 is arranged on the electromagnetic shielding component 120, the detection module 130 and the mainboard 110 are conductively connected, and the detection module 130 is arranged close to the bottom shell 200.

[0083] The electronic device 1000 can be any device with a detection module 130, such as a watch, bracelet, or other wearable device. The bottom housing 200 can be located on one side of the middle frame 300. Both the bottom housing 200 and the middle frame 300 serve as the housing of the electronic device 1000. Structures such as the circuit board assembly 100 and the battery 170 can be located within the middle frame 300.

[0084] The motherboard 110 may be equipped with electronic components such as a processor and a communication chip. The electromagnetic shielding element 120 may cover some of the electronic components on the motherboard 110, providing electromagnetic shielding between these components. The electromagnetic shielding element 120 also supports the detection module 130. The detection module 130 and the motherboard 110 are electrically connected to each other to facilitate signal transmission.

[0085] For example, electronic device 1000 is a watch, bracelet, or other wearable device. Bottom housing 200 is mounted on middle frame 300, which can be connected to a watch strap or wristband for easy wear and use. When a user wears the wearable device, detection module 130 is positioned near bottom housing 200, facing the user's skin. Detection module 130 can detect information such as the user's physiological indicators.

[0086] In an electronic device 1000 provided in an embodiment of the present application, an electromagnetic shielding element 120 is disposed on a mainboard 110. A detection module 130, as an independent module, can be disposed on the electromagnetic shielding element 120. The mainboard 110, electromagnetic shielding element 120, and detection module 130 are stacked and assembled to form a circuit board assembly 100. The circuit board assembly 100 is mounted on a middle frame 300, and a bottom case 200 is mounted on the middle frame 300. The detection module 130 and the mainboard 110 are electrically connected to each other to enable signal transmission. A safety gap need not be reserved between the electromagnetic shielding element 120 and the detection module 130, and a thick bracket need not be provided on the bottom case 200. The electronic device 1000 of this embodiment can be miniaturized, with a reduced overall thickness, enabling a reduction in overall thickness of at least 0.15 mm. In the event of a drop or impact during production or in user use, the detection module 130, electromagnetic shielding element 120, and mainboard 110 undergo simultaneous micro-deformation, reducing failure or damage to the detection module 130 caused by collisions. The electronic device 1000 of this embodiment is easy to assemble, and the assembly process is simple. There is no need to use the heat-melt pins on the bottom shell to fix the detection module, and there is no need to stick Mylar sheets on the outer surface of the heat-melt pins.

[0087] When assembling the mainboard 110 of the circuit board assembly 100 to the middle frame 300, referring to Figures 6 to 8, different connection methods such as fasteners 301 (such as screws), snaps, rivets, and bonding can be used between the mainboard 110 and the middle frame 300 to assemble the circuit board assembly 100 as a whole on the middle frame 300.

[0088] For example, referring to Figures 7 and 8, the mainboard 110 has multiple through holes 111, and the middle frame 300 has multiple threaded holes (not shown). By aligning the through holes 111 of the mainboard 110 and the threaded holes of the middle frame 300, and passing the fasteners 301 through the through holes 111 and threadedly connected to the threaded holes, the circuit board assembly 100 can be reliably fixed to the middle frame 300.

[0089] Illustratively, the mainboard 110 has a latch (not shown), and the middle frame 300 has a buckle (not shown). By snapping the buckle onto the latch, the circuit board assembly 100 can be securely fixed to the middle frame 300 .

[0090] When assembling the middle frame 300 and the bottom case 200 , referring to FIG. 5 , the middle frame 300 and the bottom case 200 may be connected by means of adhesive bonding, snap fastening, etc. to achieve a reliable connection between the middle frame 300 and the bottom case 200 .

[0091] In order to enable the electronic device 1000 to have a display function, in some embodiments, referring to Figure 6, it also includes a screen assembly 400, which is arranged on the middle frame 300. The screen assembly 400 and the mainboard 110 are conductively connected, and the second surface 110b of the mainboard 110 and the screen assembly 400 are arranged facing each other.

[0092] A conductive connection between the screen assembly 400 and the mainboard 110 enables signal transmission. The screen assembly 400 is used to output light to display images, text, and other information, such as the user's physiological indicators detected by the detection module 130. The screen assembly 400 and the bottom housing 200 can be located at opposite ends of the middle frame 300. The screen assembly 400 displays information to the user, while the detection module 130 near the bottom housing 200 detects the user.

[0093] Among them, the screen component 400 can be an organic light emitting diode (OLED) screen, an active-matrix organic light emitting diode or an active-matrix organic light emitting diode (AMOLED) screen, a mini light emitting diode (Mini LED) screen, a micro light emitting diode (Micro LED) screen, a micro organic light emitting diode (Micro OLED) screen, a quantum dot light emitting diode (QLED) screen, etc.

[0094] To enable the electronic device 1000 to have a touch function, in some embodiments, the screen assembly 400 may have a touch layer (not shown), and the touch layer and the mainboard 110 may be electrically connected. The touch layer is used to detect touch operations acting on or near it. The touch layer can transmit the detected touch operation to the processor to determine the type of touch event. Visual output related to the touch operation is provided through the screen assembly 400. The touch layer can be a conventional capacitive touch sensor or other types of touch sensors.

[0095] Referring to Figures 8 to 11 , an embodiment of the present application provides a circuit board assembly 100 comprising: a mainboard 110, an electromagnetic shielding element 120, and a detection module 130. The mainboard 110 has a first surface 110a and a second surface 110b that are opposite to each other. The electromagnetic shielding element 120 has a third surface 120a and a fourth surface 120b that are opposite to each other. The electromagnetic shielding element 120 is disposed on the first surface 110a of the mainboard 110, with the third surface 120a of the electromagnetic shielding element 120 facing the first surface 110a of the mainboard 110. The detection module 130 includes a substrate 131 and a detection unit 132. The substrate 131 has a fifth surface 131a and a sixth surface 131b that are opposite to each other. The fifth surface 131a of the substrate 131 is fixed to the fourth surface 120b of the electromagnetic shielding element 120, and the detection unit 132 is mounted on the sixth surface 131b of the substrate 131. The substrate 131 and the mainboard 110 are electrically connected.

[0096] Electronic components may be disposed on both the first surface 110a and the second surface 110b of the mainboard 110. The substrate 131 in the detection module 130 may serve as a carrier for a detection unit 132 or other predetermined device 133. The detection unit 132 is a hardware structure and may have various forms.

[0097] For example, when detection module 130 is an optical plethysmography module, detection unit 132 may include a light-emitting diode 1321 and a photodiode 1322. Alternatively, when detection module 130 is an electrocardiogram (ECG) module, detection unit 132 may be an ECG sensor. Alternatively, when detection module 130 is a temperature detection module, detection unit 132 may be a temperature sensor.

[0098] The fifth surface 131 a of the substrate 131 is fixed to the fourth surface 120 b of the electromagnetic shielding element 120 , which means that the fifth surface 131 a of the substrate 131 and the fourth surface 120 b of the electromagnetic shielding element 120 are mechanically connected face to face with no gap therebetween.

[0099] In the circuit board assembly 100 provided in the embodiment of the present application, the electromagnetic shielding element 120 is disposed on the mainboard 110, and the detection module 130 can be disposed on the electromagnetic shielding element 120 as an independent module. The detection module 130 and the mainboard 110 are electrically connected, and the mainboard 110, the electromagnetic shielding element 120, and the detection module 130 are stacked and assembled to form the circuit board assembly 100. When the circuit board assembly 100 is used as an integral component in the electronic device 1000, it can be directly assembled on the middle frame 300 of the electronic device 1000. No safety gap is required between the electromagnetic shielding element 120 and the detection module 130, and no bracket with a certain thickness is required on the bottom case 200. The circuit board assembly 100 of this embodiment can be miniaturized and has a relatively low overall thickness, which can reduce the thickness of the entire device by more than 0.15 mm. In the event of a drop or squeeze during the production process or in user use, the detection module 130, the electromagnetic shielding element 120, and the mainboard 110 undergo simultaneous micro-deformation, reducing the failure or damage of the detection module 130 caused by the collision.

[0100] When connecting the substrate 131 and the electromagnetic shielding element 120, referring to Figures 10 and 11 , the fifth surface 131a of the substrate 131 and the fourth surface 120b of the electromagnetic shielding element 120 can be connected using adhesive 140, welding, riveting, snap-fit ​​connection, or fasteners (e.g., screws). These mechanical connection methods facilitate a reliable connection between the substrate 131 and the electromagnetic shielding element 120.

[0101] Exemplarily, when the substrate 131 and the electromagnetic shielding component 120 are connected using the colloid 140, the colloid 140 can be a double-sided tape. The double-sided tape is set on the substrate 131 or the electromagnetic shielding component 120, and then the substrate 131 and the electromagnetic shielding component 120 are bonded together by the double-sided tape. The double-sided tape is a colloid layer set between the substrate 131 and the electromagnetic shielding component 120.

[0102] Exemplarily, when the substrate 131 and the electromagnetic shielding component 120 are connected using the colloid 140, the colloid 140 can be dispensing glue. Liquid glue is set on the substrate 131 or the electromagnetic shielding component 120. After the substrate 131 and the electromagnetic shielding component 120 are pressed together and the liquid glue is cured, the connection between the substrate 131 and the electromagnetic shielding component 120 can be achieved.

[0103] For example, when the substrate 131 and the electromagnetic shielding component 120 are connected by snap-fit ​​connection, the substrate 131 has a snap-fit ​​position, and the electromagnetic shielding component 120 has a snap-fit. By placing the snap-fit ​​position, the substrate 131 can be fixed on the electromagnetic shielding component 120.

[0104] When installing the electromagnetic shielding member 120, referring to Figure 11 , a first electronic component 112 is disposed on the first surface 110a of the mainboard 110, and the electromagnetic shielding member 120 covers the first electronic component 112. The electromagnetic shielding member 120 includes a plate-shaped portion 121 and a flange portion 122. The flange portion 122 is connected to the edge of the plate-shaped portion 121 and is fixed to the first surface 110a of the mainboard 110. The end surface of the plate-shaped portion 121 facing the mainboard 110 forms the third surface 120a, and the end surface of the plate-shaped portion 121 facing away from the mainboard 110 forms the fourth surface 120b.

[0105] The electromagnetic shielding component 120 can cover the first electronic component 112 on the mainboard 110 to achieve electromagnetic shielding of the first electronic component 112. The electromagnetic shielding component 120 can be made of metals such as iron and steel, and has a good electromagnetic shielding effect. The first electronic component 112 can be a communication chip, a processor, a memory or other device. The plate-like portion 121 and the flange portion 122 on the electromagnetic shielding component 120 can adopt an integrally formed structure, such as stamping. The plate-like portion 121 is used to achieve electromagnetic shielding of the first electronic component 112, and also serves as a supporting portion for the substrate 131 in the detection module 130. The flange portion 122 can be connected to the first surface 110a of the mainboard 110 to fix the electromagnetic shielding component 120 on the mainboard 110.

[0106] When achieving conductive connection between the substrate 131 and the mainboard 110 , in some embodiments, referring to FIG. 8 , FIG. 9 , and FIG. 12 , the substrate 131 may have a first flexible extension section 1311 , and the first flexible extension section 1311 and the mainboard 110 are conductively connected.

[0107] A first flexible extension section 1311 is disposed on the substrate 131. The first flexible extension section 1311 can be understood as a bendable flexible circuit board. The position and posture of the first flexible extension section 1311 can be easily adjusted to achieve a conductive connection between the substrate 131 and the mainboard 110 for signal transmission. Compared to the technical solutions shown in Figures 3 and 4, which place the mainboard in the middle frame and the detection module in the bottom shell, and configure a redundant FPC to achieve a conductive connection between the mainboard and the detection module, the mainboard 110, electromagnetic shielding member 120, and detection module 130 in this embodiment are assembled to form the overall structure of the circuit board assembly 100. The shorter and smaller first flexible extension section 1311 is configured between the mainboard 110 and the substrate 131, achieving a conductive connection between the mainboard 110 and the detection module 130 at a lower cost.

[0108] When setting the connection location 1311a between the first flexible extension section 1311 and the mainboard 110, referring to Figures 8 and 9, the connection location 1311a between the first flexible extension section 1311 and the mainboard 110 is located on the first surface 110a of the mainboard 110 and is located near the edge 123 of the electromagnetic shielding element 120. This method achieves a conductive connection between the mainboard 110 and the substrate 131 through the first flexible extension section 1311, which can reduce the length and area of ​​the first flexible extension section 1311, effectively reducing costs.

[0109] For example, in this embodiment, a first flexible extension section 1311 with a smaller area can be disposed between the mainboard 110 and the detection module 130 to achieve a conductive connection between the mainboard 110 and the detection module 130. Compared to the technical solutions shown in Figures 3 and 4 , in which the mainboard is disposed in the middle frame and the detection module is disposed in the bottom case, and the mainboard and detection module are conductively connected via a redundant FPC, the area of ​​the first flexible extension section 1311 in this embodiment is reduced by over 50%.

[0110] In order to provide the circuit board assembly 100 with certain functional expansion, in some embodiments, referring to FIG. 8 , FIG. 9 , and FIG. 12 , the substrate 131 has one or more second flexible extension sections 1312 , and a second electronic component 150 is respectively provided on the one or more second flexible extension sections 1312 .

[0111] A second flexible extension section 1312 is configured on the substrate 131. The second flexible extension section 1312 can be understood as a bendable flexible circuit board. A second electronic component 150 with a predetermined function can be installed on the second flexible extension section 1312. By adjusting the position and posture of the second flexible extension section 1312, the second electronic component 150 can be adjusted to a predetermined position. The second electronic component 150 is conductively connected to the second flexible extension section 1312, the first flexible extension section 1311, and the mainboard 110 to achieve drive control of the second electronic component 150. The second electronic component 150 can be a speaker, a vibration motor, etc. The substrate 131 can be configured with multiple second flexible extension sections 1312 as needed, and with second electronic components 150 with different functions to achieve different functional expansions. The second electronic component 150 and the second flexible extension section 1312 can be soldered using solder pads.

[0112] There are multiple optional implementations when manufacturing the substrate 131 , and three implementations are exemplified below.

[0113] The first implementation method of the substrate 131 is: referring to Figures 11 and 12, the substrate 131 includes a flexible circuit board 131c and a reinforcing sheet 131d, the flexible circuit board 131c and the reinforcing sheet 131d are stacked and connected, the first flexible extension section 1311 is formed on the flexible circuit board 131c, the reinforcing sheet 131d is not set on the first flexible extension section 1311, the detection unit 132 is set in the area of ​​the flexible circuit board 131c corresponding to the reinforcing sheet 131d, and the reinforcing sheet 131d is fixed on the fourth surface 120b of the electromagnetic shielding component 120.

[0114] Reinforcing sheet 131d is not provided on first flexible extension section 1311, allowing first flexible extension section 1311 to bend, facilitating adjustment of the position and posture of first flexible extension section 1311 and achieving a conductive connection between first flexible extension section 1311 and mainboard 110. The area of ​​flexible circuit board 131c corresponding to reinforcing sheet 131d is the area on flexible circuit board 131c connected to reinforcing sheet 131d.

[0115] The substrate 131 comprises a flexible circuit board 131c and a reinforcing sheet 131d. The flexible circuit board 131c serves as a carrier for mounting the detection unit 132. The first flexible extension 1311 serves as a flexible extension connecting the substrate 131 to the mainboard 110. The reinforcing sheet 131d enhances structural strength. The reinforcing sheet 131d is secured to the electromagnetic shielding element 120, ensuring that the detection module 130 is securely fixed to the electromagnetic shielding element 120. The reinforcing sheet 131d can be a sheet made of iron or other metal. The reinforcing sheet 131d and the flexible circuit board 131c can be connected using adhesive bonding or other methods. The surface of the reinforcing sheet 131d facing away from the flexible circuit board 131c serves as the fifth surface 131a, which is fixedly connected to the electromagnetic shielding element 120. The surface of the flexible circuit board 131c facing away from the reinforcing sheet 131d serves as the sixth surface 131b, on which the detection unit 132 is mounted.

[0116] When the substrate 131 has a second flexible extension section 1312, the reinforcing sheet 131d is not provided on the second flexible extension section 1312, so that the second flexible extension section 1312 can be bent, thereby facilitating adjustment of the position and posture of the second flexible extension section 1312 and adjusting the second electronic component 150 on the second flexible extension section 1312 to a predetermined position.

[0117] The second implementation method of the substrate 131 is: referring to Figure 13, the substrate 131 includes a first rigid board 131e and a first flexible board 131f, the first rigid board 131e and the first flexible board 131f are conductively connected, the first flexible board 131f serves as a first flexible extension section 1311, the detection unit 132 is arranged on the first rigid board 131e, and the first rigid board 131e is fixed on the fourth surface 120b of the electromagnetic shielding component 120.

[0118] The substrate 131 is in the form of a first rigid board 131e and a first flexible board 131f. The first rigid board 131e serves as a carrier for mounting the detection unit 132, and the first flexible board 131f serves as a flexible extension for connecting the first rigid board 131e to the main board 110. The first rigid board 131e and the first flexible board 131f can be electrically connected by means of a connector 131g, soldering pads, etc. The first rigid board 131e is fixed to the electromagnetic shielding component 120 to ensure that the detection module 130 is reliably fixed to the electromagnetic shielding component 120. The surface of the first rigid board 131e facing the electromagnetic shielding component 120 serves as the fifth surface 131a fixedly connected to the electromagnetic shielding component 120. The surface of the first rigid board 131e facing away from the electromagnetic shielding component 120 serves as the sixth surface 131b for mounting the detection unit 132.

[0119] The third implementation method of the substrate 131 is: referring to Figure 14, the substrate 131 is a rigid-flexible board, which includes a first rigid part 131h and a first flexible part 131i. The first rigid part 131h and the first flexible part 131i are conductively connected. The first flexible part 131i serves as a first flexible extension section 1311. The detection unit 132 is arranged on the first rigid part 131h, and the first rigid part 131h is fixed on the fourth surface 120b of the electromagnetic shielding component 120.

[0120] The base plate 131 is a rigid-flexible board, with a first rigid portion 131h and a first flexible portion 131i forming an integrated structure. The first rigid portion 131h serves as a carrier for mounting the detection unit 132, while the first flexible portion 131i serves as a flexible extension that connects the first rigid portion 131h to the mainboard 110. The first rigid portion 131h is secured to the electromagnetic shielding element 120, ensuring that the detection module 130 is securely fixed to the electromagnetic shielding element 120. The surface of the first rigid portion 131h facing the electromagnetic shielding element 120 serves as the fifth surface 131a, which is fixedly connected to the electromagnetic shielding element 120. The surface of the first rigid portion 131h facing away from the electromagnetic shielding element 120 serves as the sixth surface 131b, on which the detection unit 132 is mounted.

[0121] There are multiple optional implementations for the conductive connection between the substrate 131 and the mainboard 110 , and two implementations are exemplified below.

[0122] The first method of implementing the conductive connection between the substrate 131 and the main board 110: Referring to Figures 8 and 11, the substrate 131 and the main board 110 are conductively connected via a connector 160. The connector 160 includes a first connecting portion 161 and a second connecting portion 162 that are plug-fitted. The first connecting portion 161 is provided on the substrate 131, and the second connecting portion 162 is provided on the main board 110.

[0123] Connector 160 connects substrate 131 and mainboard 110, facilitating easy assembly and achieving a conductive connection between the two. During assembly, substrate 131 of detection module 130 is secured to electromagnetic shielding element 120, and first connector 161 is plugged into second connector 162. This creates a conductive connection between substrate 131 and mainboard 110.

[0124] The connector 160 may be a board-to-board (BTB) connector, a zero insertion force (ZIF) connector, or other types of connectors. A ZIF connector does not require additional insertion force during connection and can achieve a stable connection through a snap-fit ​​mechanism.

[0125] In the case where the substrate 131 has a first flexible extension section 1311, referring to Figure 11, the first connecting portion 161 can be provided on the first flexible extension section 1311. After the substrate 131 is fixed to the electromagnetic shielding component 120, the position of the first flexible extension section 1311 is adjusted so that the first connecting portion 161 and the second connecting portion 162 are plugged together, and the assembly is convenient and reliable.

[0126] In the case where the substrate 131 does not have the first flexible extension section 1311, the first connecting portion 161 can be provided on the side of the substrate 131 facing the main board 110, and the second connecting portion 162 can be provided on the side of the main board 110 facing the substrate 131. By plugging the first connecting portion 161 and the second connecting portion 162 into each other, a conductive connection between the substrate 131 and the main board 110 can be achieved.

[0127] The second method for implementing the conductive connection between the substrate 131 and the main board 110: the substrate 131 and the main board 110 are conductively connected by welding, the substrate 131 has a first soldering pad (not shown), the main board 110 has a second soldering pad (not shown), and the first soldering pad and the second soldering pad are welded.

[0128] The substrate 131 and the mainboard 110 are connected by solder pads, which facilitates assembly and achieves a conductive connection between the two. During assembly, the substrate 131 of the detection module 130 can be fixed to the electromagnetic shielding member 120, and the first and second solder pads can be soldered to achieve a conductive connection between the substrate 131 and the mainboard 110.

[0129] When configuring the detection unit 132, the detection unit 132 may include at least one of an optical plethysmography sensor, an electrocardiogram sensor, and a temperature sensor. In other words, the detection unit 132 may be configured with one or more functions as needed. Different detection units 132 may monitor different physiological parameters of the user.

[0130] Photoplethysmography (PPG) sensors use photoelectric sensors to detect the intensity of reflected light after absorption by human blood and tissues, recording changes in blood vessel volume during the cardiac cycle and calculating heart rate and blood oxygen from the resulting pulse waveform.

[0131] An electrocardiogram (ECG) sensor uses electrodes in contact with human skin to record the timing and strength of the electrical signals that cause the heart to beat.

[0132] Temperature sensors use temperature sensitive elements to measure temperature changes in the human body.

[0133] When the detection unit 132 includes an optical plethysmography sensor, referring to Figures 11 to 14 , the optical plethysmography sensor includes one or more light emitting diodes (LEDs) 1321 and one or more photoelectric diodes (PDs) 1322. The light emitting surfaces of the LEDs 1321 are disposed away from the mainboard 110, and the light receiving surfaces of the photodiodes 1322 are disposed away from the mainboard 110.

[0134] Light-emitting diode 1321 is a semiconductor light-emitting device that emits light. Photodiode 1322 is a semiconductor photodetector that converts light into electrical signals. Light-emitting diode 1321 and photodiode 1322 are mounted on substrate 131 and electrically connected to substrate 131. During operation, part of the light signal emitted by light-emitting diode 1321 is absorbed by the body's blood and tissues, while part of the reflected light signal is received by photodiode 1322. The collected light signal is used to track changes in vascular volume during the cardiac cycle, and the heart rate and blood oxygen level are calculated from the resulting pulse waveform. The combination and layout of light-emitting diode 1321 and photodiode 1322 can be determined based on the optical path design.

[0135] 15 and 16 , in the case where the detection unit 132 of the detection module 130 is a PPG sensor, the circuit board assembly 100 including the mainboard 110, the electromagnetic shielding component 120 and the detection module 130 is directly disposed on the middle frame 300. A predetermined spacing needs to be set between the mainboard 110 and the bottom case 200 so that there is a predetermined distance between the PPG sensor and the bottom case 200, thereby enabling the PPG sensor to operate normally. That is, the light emitting diode 1321 in the PPG sensor emits a light signal to the human body, and the photodiode 1322 in the PPG sensor receives the light signal reflected by the human body, thereby achieving an optimized design of the optical path of the PPG sensor.

[0136] To prevent light from LED 1321 from directly impinging on photodiode 1322, in some embodiments, as shown in FIG12 , a light shield 1323 is provided between LED 1321 and photodiode 1322. Light shield 1323 prevents light from LED 1321 from directly impinging on photodiode 1322, allowing photodiode 1322 to receive light signals reflected by the human body, thereby improving detection accuracy.

[0137] The light shielding member 1323 can be made of a material such as foam. The light shielding member 1323 can be configured in a rectangular or circular shape and surround the light emitting diode 1321. The area of ​​the light shielding member 1323 can be set as needed. The light shielding member 1323 can be fixed to the substrate 131 by bonding or other methods.

[0138] When assembling the bottom shell 200 and the middle frame 300, referring to Figures 15 and 16, the inner wall of the bottom shell 200 may have partition ribs 201. In the process of fixing the bottom shell 200 to the middle frame 300, the partition ribs 201 are pressed against the shading member 1323, thereby achieving a shading effect between the light-emitting diode 1321 and the photodiode 1322.

[0139] For example, referring to Figure 12, two photodiodes 1322, two photodiodes 1322 and a frame-shaped shading member 1323 are provided on the substrate 131. The photodiodes 1322 and the photodiodes 1322 are arranged alternately in a predetermined direction, and the shading member 1323 is arranged between two adjacent photodiodes 1322 and around one photodiode 1322.

[0140] To achieve better light extraction and reception for the PPG sensor, in some embodiments, as shown in Figures 15 and 16 , a first lens 1324 is positioned in front of the light-emitting surface of the LED 1321, and a second lens 1325 is positioned in front of the light-receiving surface of the photodiode 1322. The combination of the LED 1321 and the first lens 1324 allows for better light extraction from the LED 1321. The combination of the photodiode 1322 and the second lens 1325 allows for better reception of external light by the photodiode 1322. Furthermore, some LEDs 1321 and photodiodes 1322 are positioned adjacent to each other and may share a common lens.

[0141] In order to enable the circuit board assembly 100 to have power supply capabilities, in some embodiments, referring to Figures 6, 8, and 10, a battery 170 is fixed to the second surface 110b of the mainboard 110, and the battery 170 and the mainboard 110 are conductively connected. The battery 170 can be used to power components such as the mainboard 110 and the detection module 130. The mainboard 110 is a complete structure, and the battery 170 is arranged on the second surface 110b of the mainboard 110, so that the volume and capacity of the battery 170 can be increased, thereby increasing the maximum operating time of the entire device. The battery 170 can be arranged in the middle frame 300. The battery 170 can be fixed to the mainboard 110 using colloid or other methods.

[0142] When the circuit board assembly 100 and electronic device 1000 of this embodiment need to be verified, the device can be disassembled to check whether the detection module 130 is fixed to the electromagnetic shielding member 120. Alternatively, a computed tomography (CT) scan can be performed to obtain a tomographic image of the circuit board assembly 100 to determine whether the detection module 130 is fixed to the electromagnetic shielding member 120.

[0143] Finally, it should be noted that the above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A circuit board assembly, characterized in that, include: Mainboard, electromagnetic shielding components and detection modules; The main board has a first surface and a second surface facing each other; The electromagnetic shielding component has a third surface and a fourth surface facing each other, the electromagnetic shielding component is arranged on the first surface of the main board, and the third surface of the electromagnetic shielding component and the first surface of the main board are arranged facing each other; The detection module includes a substrate and a detection unit. The substrate has a fifth surface and a sixth surface facing each other. The fifth surface of the substrate is fixed to the fourth surface of the electromagnetic shielding component. The detection unit is installed on the sixth surface of the substrate. The substrate and the main board are conductively connected.

2. The circuit board assembly according to claim 1, wherein The fifth surface of the substrate and the fourth surface of the electromagnetic shielding component are connected by colloid bonding, welding, riveting, snap connection or fastener connection.

3. The circuit board assembly according to claim 1 or 2, characterized in that, A first electronic component is disposed on the first surface of the mainboard, and the electromagnetic shielding component covers the first electronic component; The electromagnetic shielding component includes a plate-like portion and a flange portion, the flange portion is connected to the edge of the plate-like portion, the flange portion is fixed to the first surface of the main board, the end surface of the plate-like portion facing the main board forms the third surface, and the end surface of the plate-like portion away from the main board forms the fourth surface.

4. The circuit board assembly according to any one of claims 1 to 3, characterized in that The substrate has a first flexible extension section, and the first flexible extension section is conductively connected to the main board.

5. The circuit board assembly according to claim 4, characterized in that The connection position between the first flexible extension section and the main board is located on the first surface of the main board and is arranged close to the edge of the electromagnetic shielding component.

6. The circuit board assembly according to claim 4 or 5, characterized in that, The substrate includes a flexible circuit board and a reinforcing sheet, the flexible circuit board and the reinforcing sheet are stacked and connected, the first flexible extension section is formed on the flexible circuit board, the reinforcing sheet is not arranged on the first flexible extension section, the detection unit is arranged in an area of ​​the flexible circuit board corresponding to the reinforcing sheet, and the reinforcing sheet is fixed on the fourth surface of the electromagnetic shielding component.

7. The circuit board assembly according to any one of claims 1 to 6, characterized in that, The substrate and the mainboard are electrically connected via a connector, the connector comprising a first connecting portion and a second connecting portion for plug-in matching, the first connecting portion being arranged on the substrate, and the second connecting portion being arranged on the mainboard; Alternatively, the substrate and the mainboard are conductively connected by welding, the substrate has a first welding pad, the mainboard has a second welding pad, and the first welding pad and the second welding pad are welded.

8. The circuit board assembly according to any one of claims 1 to 7, characterized in that, The detection unit includes at least one of an optical plethysmography sensor, an electrocardiogram sensor, and a temperature sensor.

9. An electronic device, characterized in that, It includes a bottom shell, a middle frame and a circuit board assembly as described in any one of claims 1 to 8, the bottom shell and the middle frame are connected, the mainboard is arranged on the middle frame, the first surface of the mainboard and the bottom shell are arranged facing each other, and the detection module is arranged close to the bottom shell.

10. The electronic device according to claim 9, wherein It also includes a screen assembly, which is arranged on the middle frame. The screen assembly and the mainboard are conductively connected, and the second surface of the mainboard and the screen assembly are arranged facing each other.

11. The electronic device according to claim 10, wherein The electronic device includes a watch or a bracelet.

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