Packaged device, backlight module, drive circuit and display apparatus

Abstract

Provided in the present disclosure are a packaged device, a backlight module, a drive circuit and a display apparatus. The packaged device comprises a substrate, at least three light-emitting chips, a first conversion light-emitting layer and a second conversion light-emitting layer. The at least three light-emitting chips are arranged on the substrate side by side and are all used for emitting light of a first color. The first conversion light-emitting layer covers a first light-emitting chip and is used for converting into light of a second color the light of the first color emitted by the first light-emitting chip; and the second conversion light-emitting layer covers a second light-emitting chip and is used for converting into light of a third color the light of the first color emitted by the second light-emitting chip. Each of the first light-emitting chip and the second light-emitting chip is at least one light-emitting chip among the at least three light-emitting chips, and the at least three light-emitting chips comprise at least one light-emitting chip which is not the first light-emitting chip and which is not a second photosensitive chip. Therefore, the present disclosure solves the problems of complex structures and higher costs of backlight drive circuits and power supplies.

Description

Packaging device, backlight module, driving circuit and display device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This disclosure claims priority to Chinese applications filed on January 2, 2024, with application numbers 202410004239.X; filed on January 16, 2024, with application numbers 202420107780.9; and filed on February 22, 2024, with application numbers 202410199856.X, the entire contents of which are incorporated by reference into this disclosure. Technical Field

[0003] The embodiments of the present disclosure relate to the field of backlight technology, and in particular to a packaging device, a backlight module, a driving circuit, and a display device. Background Art

[0004] Field sequential color-liquid crystal display (FSC LCD) technology uses a temporal color mixing method and utilizes red, green, and blue (RGB) backlight sources to achieve color display without the use of a panel color filter (CF).

[0005] Typically, a red, green, and blue backlight source includes light emitting diodes (LEDs) containing a red chip, a blue chip, and a green chip. Color display is achieved by individually driving and controlling the red chip, the blue chip, and the green chip.

[0006] However, the electrical and optical properties of red, blue, and green chips vary significantly. To drive and control them individually, three circuits would be required to control each, respectively. Separate power supplies would also be required. This results in complex backlight drive circuits and power supplies, leading to high costs. Summary of the Invention

[0007] In a first aspect, an embodiment of the present disclosure provides a packaging device, which may include: a substrate; at least three light-emitting chips, which are arranged side by side on the substrate and are all used to emit light of a first color; a first conversion light-emitting layer, covering the first light-emitting chip, and being used to convert the light of the first color emitted by the first light-emitting chip into a second color; a second conversion light-emitting layer, covering the second light-emitting chip, and being used to convert the light of the first color emitted by the second light-emitting chip into a third color; the first light-emitting chip and the second light-emitting chip are both at least one light-emitting chip among the at least three light-emitting chips; the at least three light-emitting chips include at least one light-emitting chip that is not the first light-emitting chip and not the second photosensitive chip; the first color, the second color and the third color are different, and are respectively one of red, green and blue.

[0008] In a second aspect, an embodiment of the present disclosure provides a backlight module, which may include the packaging device described in the first aspect.

[0009] In a third aspect, an embodiment of the present disclosure provides a driving circuit, which is applied to the backlight module described in the second aspect above; the backlight module may include at least one packaging device, the driving circuit may be electrically connected to the packaging device, and the driving circuit is used to drive the packaging device.

[0010] In a fourth aspect, an embodiment of the present disclosure provides a display device, which may include the packaging device described in the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] FIG1 is a schematic structural diagram of a light board provided with three RGB chips according to some embodiments;

[0012] FIG2 is a circuit diagram of a light board equipped with three RGB chips according to some embodiments;

[0013] FIG3 is a schematic diagram of a driving circuit of a backlight module according to some embodiments;

[0014] FIG4 is a schematic structural diagram of a packaged device according to some embodiments;

[0015] FIG5 is a schematic diagram of an exploded structure of a packaged device according to some embodiments;

[0016] FIG6 is a circuit diagram of a light board formed by packaging devices according to some embodiments;

[0017] FIG7 is a schematic structural diagram of a light board formed by packaging devices according to some embodiments;

[0018] FIG8 is a schematic diagram of a driving circuit of a backlight module according to some embodiments;

[0019] FIG9 is another schematic structural diagram of a packaged device according to some embodiments;

[0020] FIG10 is another schematic structural diagram of a packaged device according to some embodiments;

[0021] FIG11 is a schematic structural diagram of a display device according to some embodiments;

[0022] FIG12 is a schematic structural diagram of a display device having conductive pillars according to some embodiments;

[0023] FIG13 is a schematic structural diagram of a first surface of a display device substrate according to some embodiments;

[0024] FIG14 is a schematic structural diagram of the second surface of a display device substrate according to some embodiments;

[0025] FIG15 is a schematic diagram illustrating the positions of a circular conforming area and a circular substrate according to some embodiments;

[0026] FIG16 is a schematic structural diagram of a display device having a conductive layer according to some embodiments;

[0027] FIG17 is another schematic structural diagram of a display device having conductive pillars according to some embodiments;

[0028] FIG18 is a schematic structural diagram of a display device in which a main board is connected to a light board via connection terminals according to some embodiments;

[0029] FIG19 is a schematic diagram of a structure of a display device in which a main board is connected to a light board via wireless communication according to some embodiments;

[0030] FIG20 is a schematic structural diagram of a display device having a control panel according to some embodiments;

[0031] FIG21 is a schematic structural diagram of a display device in which a control board is integrated with a main board according to some embodiments;

[0032] FIG22 is a schematic structural diagram of two first pads according to some embodiments;

[0033] FIG23 is a schematic diagram of a connection structure between a first solder pad and an LED chip according to some embodiments;

[0034] FIG24 is a schematic structural diagram of an LED module according to some embodiments;

[0035] FIG25 is a schematic structural diagram of a first pad according to some embodiments;

[0036] FIG26 is a diagram illustrating the dimensional relationship of a drainage channel according to some embodiments;

[0037] FIG27 is a schematic structural diagram of a first pad according to some embodiments;

[0038] FIG28 is a cross-sectional view of an LED module along a first centerline according to some embodiments;

[0039] FIG29 is a schematic structural diagram of two first pads according to some embodiments;

[0040] FIG30 is a schematic diagram of a connection structure between a first solder pad and an LED chip according to some embodiments;

[0041] FIG31 is a schematic structural diagram of an LED module according to some embodiments;

[0042] Description of reference numerals:

[0043] 1-first solder pad; 2-chip; 3-convex lens; 4-PCB board; 10-lamp board; 100-packaged device; 110-light-emitting chip; 111-first conversion light-emitting layer; 112-second conversion light-emitting layer; 120-green lamp beads; 121-first reflective layer; 122-first filter layer; 130-red lamp beads; 131-second reflective layer; 132-second filter layer; 141-input terminal; 142-output terminal; 150-substrate; 160-bracket; 210-LED lamp beads; 211-red light chip; 212-blue light chip; 213-green light chip; 214-connection terminal; 220-carrying board;

[0044] A101 - attachment area; A102 - wiring area; A10 - substrate; A111 - connection structure; A1111 - conductive pillar; A1112 - conductive layer; A112 - connection terminal; A113 - core board; A1131 - metal conductive layer; A120 - driver chip; A130 - light-emitting element; A140 - connection trace; A150 - connection trace; A200 - control chip; A300 - main board; A400 - control board;

[0045] B11-plane segment; B12-arc segment; B101-first pad body; B1011-first end; B1012-second end; B102-raised portion; B103-positive and negative electrode grooves; B104-drainage groove; B105-white oil welding layer. DETAILED DESCRIPTION

[0046] Field-sequential color LCD technology often uses a temporal color mixing method, utilizing red, green, and blue (RGB) backlight sources to achieve color display. This method primarily involves refreshing the backlight system with different colors within a frame, while simultaneously adjusting the thin-film transistor (TFT) in each pixel to change the deflection angle of the liquid crystal molecules. This method then utilizes the human eye's persistence of vision to achieve color display. This method eliminates the need for a color filter (CF) to achieve color display, and because there's no light filtering effect from the CF, the display module's light transmittance can be increased by approximately three times, effectively reducing the power consumption of the liquid crystal display (LCD).

[0047] FIG1 is a schematic structural diagram of a light board provided with three RGB chips according to some embodiments. The light board shown in FIG1 may include a carrier board 220 and a plurality of LED lamp beads 210 disposed on the carrier board 220 .

[0048] In the related art, a light emitting diode (LED) containing three chips, a red light chip 211, a blue light chip 212, and a green light chip 213 (abbreviated as an RGB three-chip LED) is often used. The three chips are packaged in a bracket 160 in the form of a POB package to form an LED lamp bead 210, and the three chips in the LED lamp bead 210 are individually driven and controlled.

[0049] Figure 2 is a circuit diagram of a light board equipped with three RGB chips according to some embodiments, corresponding to the light board structure shown in Figure 1. As shown in Figure 2, each LED lamp bead 210 includes six connection terminals 214, which are used to connect to a power source, etc. Each light-emitting chip 110 corresponds to two connection terminals 214, which serve as the current input terminal 141 and output terminal 142, respectively.

[0050] As shown in Figure 2, the current light board circuit is relatively complex. Therefore, the drive system used to drive the backlight module, which includes three RGB LED chips 210, is more complex and more expensive than conventional backlight drive systems. Furthermore, because the driving voltages of the red chip 211, the blue chip 212, and the green chip 213 differ, the corresponding drive power supplies must also be designed separately, resulting in a complex design and high cost.

[0051] FIG3 is a schematic diagram of a driving circuit of a backlight module according to some embodiments. As shown in FIG3 , the driving circuit may include three integrated circuits, and the voltage of each circuit needs to be controlled separately;

[0052] Among them, the "MCU" shown in Figure 3 represents a microcontroller unit (MCU). "IC" represents an integrated circuit. "PFC+LLC" represents a resonant circuit with a power factor correction function. "LDO" represents a low dropout regulator (LDO). "VDD" represents the driving voltage of the integrated circuit IC. "DC-DC" represents an electric energy conversion device that can convert voltage value electric energy in a direct current circuit. "FB-R" represents a red light anti-interference device. "FB-G" represents a green light anti-interference device. "FB-L" represents a blue light anti-interference device. "VIN" represents the input voltage. "Vout-1", "Vout-2" and "Vout-3" represent three set output voltages. It can be intuitively found from Figure 3 that the current driving circuit design for the backlight module of the light-emitting diode containing three RGB chips is relatively complicated.

[0053] In view of this, the embodiments of the present disclosure provide a packaging device, a backlight module, a driving circuit, and a display device. At least three light-emitting chips for emitting light of the same color are arranged side by side on the substrate of the packaging device; a first conversion light-emitting layer for converting the first color light emitted by the first light-emitting chip into the second color is covered on the first light-emitting chip, and a second conversion light-emitting layer for converting the first color light emitted by the second light-emitting chip into the third color is covered on the second light-emitting chip; wherein the first light-emitting chip and the second light-emitting chip are both at least one light-emitting chip among the at least three light-emitting chips; the at least three light-emitting chips include at least one light-emitting chip that is neither the first light-emitting chip nor the second photosensitive chip; the first color, the second color, and the third color are different and are respectively one of red, green, and blue.

[0054] The above process sets a first conversion light-emitting layer and a second conversion light-emitting layer on at least two light-emitting chips respectively, so that the light-emitting sides of at least three light-emitting chips on the substrate can emit red, green and blue lights to meet the full-color backlight requirements, and can simplify the structure of the driving circuit and power supply of the backlight module using the packaging device, reduce the design difficulty of the driving circuit and power supply, and thus reduce costs.

[0055] It should be noted that the number of light-emitting chips in the packaged device of the embodiment of the present disclosure can be set according to actual needs, and the number can be no less than three.

[0056] It should be understood that in actual applications, the number of light-emitting chips can be set to more than three, for example, five, based on actual needs. In implementation, a of the five light-emitting chips can be used as the first light-emitting chip, and b of the remaining 5-a light-emitting chips can be used as the second light-emitting chip. This can be accomplished by covering the first light-emitting chip with the first conversion light-emitting layer and the second light-emitting chip with the second light-emitting layer. The number of light-emitting chips that are not first light-emitting chips must be no less than two, and the number of chips that are not second light-emitting chips must be no less than two. Furthermore, the total number of light-emitting chips must be greater than the sum of the number of first and second light-emitting chips.

[0057] For ease of description, the following description uses an example in which a packaged device includes only three light-emitting chips. Next, FIG4 shows a schematic structural diagram of a packaged device according to some embodiments. The packaged device 100 may include a substrate 150 and three light-emitting chips 110 arranged side by side on the substrate 150, each configured to emit light of a first color.

[0058] The substrate 150 is provided to provide mounting locations for the three light emitting chips 110, so that the three light emitting chips 110 and the substrate 150 are packaged into a packaged device 100. By providing three light emitting chips 110, the packaged device 100 can emit three light beams.

[0059] In some embodiments, the package device 100 may further include a bracket 160 , and the three light-emitting chips 110 are located in the bracket 160 to form the package device 100 .

[0060] FIG5 is a schematic diagram of an exploded structure of a package device according to some embodiments. As shown in FIG5 , the package device 100 may further include a first conversion light-emitting layer 111 and a second conversion light-emitting layer 112 .

[0061] The first conversion light-emitting layer 111 covers one of the three light-emitting chips 110 . The first conversion light-emitting layer 111 is used to receive the first color light emitted by the light-emitting chip 110 and convert it into a second color.

[0062] The second conversion luminescent layer 112 covers another of the three light-emitting chips 110. The second conversion luminescent layer 112 is configured to receive the first color light emitted by the light-emitting chip 110 and convert it into a third color. The first color, the second color, and the third color are each different and are one of red, green, and blue, respectively.

[0063] The package device in the embodiment of the present disclosure can emit red, green and blue light through the above configuration. Thus, the backlight module using the package device 100 can meet the full-color backlight requirements.

[0064] By covering the first conversion light-emitting layer 111 on one of the three light-emitting chips 110 and covering the second conversion light-emitting layer 112 on another one of the three light-emitting chips 110, it is achieved that only one light-emitting chip 110 is required in the entire packaged device 100 to emit red, green and blue colors of light to meet the full-color backlight requirements.

[0065] In addition, by setting the three light-emitting chips 110 to emit light of the same color, there is only one light-emitting chip 110 in the packaged device 100, so it can be driven by one driving circuit. This can simplify the structure of the driving circuit and power supply of the backlight module using the packaged device 100, reduce the design difficulty of the driving circuit and power supply, and thus reduce costs.

[0066] Figure 6 is a circuit diagram of a light board formed by a packaging device according to some embodiments. As shown in Figure 6, the three light-emitting chips 110 in the packaging device 100 can be connected in series or in parallel to form an input terminal 141 and an output terminal 142.

[0067] It should be noted that, generally, the backlight module includes a lamp board 10 . For example, the lamp board 10 shown in FIG. 7 may be provided with a plurality of packaged devices 100 in the above embodiment. The plurality of packaged devices 100 are arranged in parallel on the lamp board 10 .

[0068] Continuing with FIG6 , the circuit diagram of the lamp board 10 is much simpler than the circuit of the lamp board containing three RGB chips in FIG2 . This can simplify the circuit structure of the lamp board 10 , and further simplify the structure of the lamp board 10 , thereby reducing the cost of the lamp board 10 using the packaged device 100 .

[0069] By connecting the three light-emitting chips 110 in series or in parallel, the three light-emitting chips 110 ultimately form an input terminal 141 and an output terminal 142, or in other words, a positive pin and a negative pin, for connection to the driving circuit of the backlight module. In addition, this also allows the packaged device 100 equipped with three light-emitting chips 110 to be driven by a single driving circuit. As shown in FIG8 , compared to the driving circuit schematic in FIG3 , the driving circuit of the backlight module in the disclosed embodiment has a simple structure, low design difficulty, and low cost, which is conducive to the miniaturization of the backlight module.

[0070] It should be noted that, in the embodiment of the present disclosure, there is no limit to the number of packaging devices 100 provided on a light board 10 and the number can be set according to specific circumstances.

[0071] In some embodiments, the light-emitting chip 110 may be a blue light chip, with a first color of blue, a second color of green, and a third color of red. The first conversion light-emitting layer 111 is configured to receive the blue light emitted by the light-emitting chip 110 and convert it into green light. The second conversion light-emitting layer 112 is configured to receive the blue light emitted by the light-emitting chip 110 and convert it into red light.

[0072] It should be noted that, while blue light chips are mature and have a high luminous efficiency of over 60% and good stability, there is a significant gap between green and red LEDs in terms of luminous efficiency and stability. The current, voltage, and brightness (IVL) curve of green LEDs is very poorly linear. Red LEDs are sensitive to temperature. For example, when the ambient temperature rises from 25°C to 85°C, the brightness drops by over 50%, causing red LEDs to be prone to color shift during use. Furthermore, changes in the drive current can also easily cause color shift.

[0073] This makes backlight brightness adjustment very difficult when the backlight module includes red and green LEDs. Furthermore, as chip size decreases, the luminous efficiency of blue, red, and green LEDs decreases to a certain extent, but this is particularly pronounced for red LEDs. For red LEDs with a size of less than 50μm, the external quantum efficiency (EQE) is only around 10%. Therefore, when the chip size is less than 100μm, the luminous efficiency of the red, green, and blue chips will vary significantly, or the driving current will vary significantly when the luminous efficiency is the same.

[0074] Therefore, by using a blue light chip as the light emitting chip 110, the light efficiency and stability of the packaged device 100 can be improved, which is conducive to the miniaturization of the packaged device 100. In addition, because the blue light chip has high light efficiency and good stability and is less affected by factors such as temperature, it can reduce the difficulty of adjusting the backlight brightness of the backlight module using the packaged device 100, thereby reducing costs.

[0075] Of course, in other embodiments, the light emitting chip 110 may be set as a green light chip or a red light chip. In the embodiment of the present disclosure, the color of the light emitted by the light emitting chip 110 is not further limited.

[0076] In some embodiments, the first conversion light-emitting layer 111 may include green phosphor or green quantum dots. By providing the first conversion light-emitting layer 111 with green phosphor or green quantum dots, blue light passing through the first conversion light-emitting layer 111 can be excited to produce green light, so that the light-emitting chip 110 provided with the first conversion light-emitting layer 111 can emit green light.

[0077] In some embodiments, the second conversion light-emitting layer 112 may include red phosphor or red quantum dots. By providing the second conversion light-emitting layer 112 with red phosphor or red quantum dots, blue light passing through the second conversion light-emitting layer 112 can be excited to produce red light, so that the light-emitting chip 110 provided with the second conversion light-emitting layer 112 can emit red light.

[0078] It should be noted that the green phosphor in the first conversion luminescent layer 111 and the red phosphor in the second conversion luminescent layer 112 can both be fluoride phosphors, also known as KSF phosphors, or oxynitride phosphors, also known as β-SiALON phosphors. Of course, other types of phosphors can also be used in other embodiments. In the present disclosure, the types of phosphors are not further limited.

[0079] It should be noted that the green phosphor in the first conversion light-emitting layer 111 and the quantum dots in the second conversion light-emitting layer 112 can be cadmium selenide (CdSe) quantum dots, indium phosphide (InP) quantum dots, perovskite quantum dots, or copper indium sulfide (CuInS2) quantum dots. In the disclosed embodiments, the type of quantum dots is not further limited.

[0080] In some embodiments, as shown in FIG9 , the light emitting chip 110 covered with the first conversion light emitting layer 111 is configured as a green lamp bead 120. The light emitting side of the green lamp bead 120 is covered with a first reflective layer 121, which is used to reflect red and blue light and transmit green light.

[0081] By setting a first reflective layer 121 on the light-emitting side of the green lamp bead 120, the green lamp bead 120 can be prevented from emitting part of the blue light and red light, thereby improving the purity of the green light emitted by the green lamp bead 120, thereby improving the accuracy of the backlight module using the packaging device 100, and thereby improving the resolution of the display device using the backlight module.

[0082] In some embodiments, the first reflective layer 121 is a distributed Bragg reflector (DBR). Of course, in other embodiments, the first reflective layer 121 can also be other reflective layers. In the embodiments of the present disclosure, the type of the first reflective layer 121 is not further limited.

[0083] In some embodiments, the light emitting chip 110 covered with the second conversion light emitting layer 112 is configured as a red lamp bead 130. The light emitting side of the red lamp bead 130 is covered with a second reflective layer 131, which is used to reflect green light and blue light and transmit red light.

[0084] It should be noted that the light-emitting side refers to the side from which the light is emitted, that is, the side of the lamp bead from which the light is emitted.

[0085] By setting a second reflective layer 131 on the light-emitting side of the red lamp bead 130, the red lamp bead 130 can be prevented from emitting part of the blue light and green light, thereby improving the purity of the red light emitted by the red lamp bead 130, thereby improving the accuracy of the backlight module using the packaging device 100, and thereby improving the resolution of the display device using the backlight module.

[0086] In some embodiments, the second reflective layer 131 is a distributed Bragg reflector (DBR). Of course, in other embodiments, the second reflective layer 131 can also be other reflective layers. In the embodiments of the present disclosure, the type of the second reflective layer 131 is not further limited.

[0087] In some embodiments, as shown in FIG10 , the light-emitting side of the green lamp bead 120 is covered with a first filter layer 122 . The first filter layer 122 is used to filter out red light and blue light and transmit green light.

[0088] By setting a first filter layer 122 on the light-emitting side of the green lamp bead 120, the green lamp bead 120 can be prevented from emitting part of the blue light and red light, thereby improving the purity of the green light emitted by the green lamp bead 120, thereby improving the accuracy of the backlight module using the packaging device 100, and thereby improving the resolution of the display device using the backlight module.

[0089] It should be noted that the first filter layer 122 may be a color filter (CF) or other types of filters, and the embodiment of the present disclosure does not limit the type of the first filter layer 122 .

[0090] In some embodiments, the light-emitting side of the red lamp bead 130 is covered with a second filter layer 132 . The second filter layer 132 is used to filter out green light and blue light and transmit red light.

[0091] By setting a second filter layer 132 on the light-emitting side of the red lamp bead 130, the red lamp bead 130 can be prevented from emitting part of the blue light and green light, thereby improving the purity of the red light emitted by the red lamp bead 130, thereby improving the accuracy of the backlight module using the packaging device 100, and thereby improving the resolution of the display device using the backlight module.

[0092] It should be noted that the first filter layer 122 may be a color filter (CF). Of course, in other embodiments, it may also be other filters. In the embodiment of the present disclosure, the type of the first filter layer 122 is not further limited.

[0093] In some embodiments, the first conversion light-emitting layer 111 of the green lamp bead 120 and the second conversion light-emitting layer 112 of the red lamp bead 130 can be encapsulated on the light-emitting chip 110 by dispensing. Of course, they can also be encapsulated on the light-emitting chip 110 by other methods, such as POB packaging, CSP packaging, NCSP packaging, etc. In the embodiment of the present disclosure, the packaging method of the green lamp bead 120 and the red lamp bead 130 is not further limited.

[0094] In some embodiments, the three light-emitting chips 110 can be packaged on the substrate 150 by POB packaging, CSP packaging, NCSP packaging, etc. Of course, they can also be packaged on the substrate 150 by other methods. In the embodiment of the present disclosure, the packaging method between the light-emitting chip 110 and the substrate 150 is not further limited.

[0095] The packaged device provided in the disclosed embodiments utilizes a more mature, optoelectronically stable blue-light chip, paired with a luminescence conversion layer, to achieve full-color backlighting. This mature driving scheme minimizes changes in the current-voltage (IV) characteristics and chip luminous efficiency with driving current and temperature, simplifying drive control. Furthermore, the driving voltages for the red, green, and blue chips vary widely, while the voltage spans a wide range. By switching to driving only the blue-light chip, the voltage span is narrower, simplifying power supply design and reducing costs.

[0096] An embodiment of the present disclosure further provides a backlight module, comprising the packaging device in any of the above embodiments.

[0097] It should be noted that the backlight module may include the light boards 10 shown in Figure 7, each light board 10 being provided with a plurality of packaged devices 100. In the embodiment of the present disclosure, the number of light boards 10 in the backlight module and the number of packaged devices 100 on each light board 10 are not further limited.

[0098] The backlight module in the embodiments of the present disclosure is provided with a packaging device in any of the above embodiments. Since at least three light-emitting chips in the packaging device are set to emit light of the same color, they can be driven by one driving circuit. This can simplify the structure of the driving circuit and power supply of the backlight module using the packaging device, reduce the design difficulty of the driving circuit and power supply, and thus reduce the cost. In addition, it is conducive to the miniaturization development of the backlight module.

[0099] The present disclosure also provides a driving circuit for use in the above backlight module, wherein the backlight module includes at least one packaged device according to any one of the above embodiments, and the driving circuit is electrically connected to the packaged device, and is used to drive the packaged device.

[0100] The driving circuit provided in the embodiment of the present disclosure can be driven by one driving circuit because at least three light-emitting chips in the packaged device are set to emit light of the same color. This can simplify the structure of the driving circuit, reduce the design difficulty of the driving circuit, and thus reduce costs, and is conducive to the miniaturization of the backlight module.

[0101] The present disclosure also provides a display device comprising the packaging device of any of the above embodiments. By providing the packaging device in the display device of the present disclosure, the structure of the drive circuit and power supply of the backlight module using the packaging device is simplified, the design difficulty of the drive circuit and power supply is reduced, and the display resolution is improved.

[0102] Considering that the number of wiring on the light board has been increasing with the continuous enrichment of the functions of the light board in recent years, this has led to the difficulty of wiring the light board and the high system complexity of the display device. In the related art, the light board is an important component of the display device, which can serve as a backlight source to emit light towards the liquid crystal module of the display device.

[0103] Based on this, the display device provided by the embodiment of the present disclosure may also include: a main board; a light board, including a substrate, a driving chip and a light-emitting element; the driving chip and the light-emitting element are arranged on the first surface of the substrate, and the driving chip is electrically connected to the light-emitting element; a control chip, arranged on the second surface of the substrate; the input end of the control chip is connected to the main board, and the output end of the control chip is connected to the driving chip.

[0104] In some embodiments, the substrate is provided with a connecting structure, a first end of the connecting structure is connected to the input end of the control chip, and a second end of the connecting structure is connected to the driving chip.

[0105] In some embodiments, the substrate has a compliant area and a wiring area connected to the compliant area;

[0106] The control chip is arranged in the compliant area, the output end of the control chip is connected to a connecting wire, at least a portion of the connecting wire is located in the wiring area, and the connecting wire is connected to the first end of the connecting structure.

[0107] In some embodiments, in the same light board, the number of the driving chips is set to be multiple, and the number of the connecting structures is set to be multiple;

[0108] The control chip is electrically connected to the first ends of the plurality of connection structures through the connection wiring, the control chip is connected to the plurality of driver chips through the plurality of connection structures, and the control chip outputs information data to the plurality of driver chips of the same light board.

[0109] In some embodiments, the routing area surrounds the conforming area; in the first direction, the width of the routing area is greater than or equal to half the length of the conforming area.

[0110] In some embodiments, the second surface of the substrate is provided with a plurality of connection terminals, and the plurality of connection terminals are connected to the main board;

[0111] The first portion of the connection terminals is electrically connected to the driver chip through the substrate, and the second portion of the connection terminals is electrically connected to the control chip through the substrate.

[0112] In some embodiments, the input terminal of the control chip is wirelessly connected to the mainboard.

[0113] In some embodiments, the number of the light board and the control chip is set to be multiple;

[0114] The display device further includes a control board, an input end of the control board is connected to the main board, and an output end of the control board is connected to the plurality of control chips.

[0115] In some embodiments, the control board is integrated with the main board.

[0116] As shown in FIG11 , the display device may include a mainboard A300, a light board 10, and a control chip A200. The input end of the control chip A200 is connected to the mainboard A300, and the output end of the control chip A200 is connected to the light board 10. The mainboard A300 can output information data to the light board 10 through the control chip A200. The light board 10 may include a substrate A10, and a driver chip A120 and a light-emitting element A130 disposed on a first surface of the substrate A100. The input end of the driver chip A120 is connected to the control chip A200, and the output end of the driver chip A120 is electrically connected to the light-emitting element A130.

[0117] The control chip A200 can be provided separately or integrated into the main board A300. The output end of the control chip A200 can be connected to the input end of the driver chip A120 through a structure such as a connection terminal A112. The connection terminal A112 is provided on the first surface of the substrate A10, and the connection terminal A112 and the driver chip A120 can be connected through wiring. However, as the functions of the lamp board 10 continue to be enriched, the number of connection terminals A112 and the number of wiring between the connection terminals A112 and the driver chip A120 are also increasing. The wiring between the connection terminals A112 and the driver chip A120 are all located on the first surface of the substrate, which makes the wiring of the lamp board 10 difficult and the system complexity of the display device high.

[0118] In view of this, in the display device of the embodiment of the present disclosure, the control chip can be arranged on the substrate, and the driver chip and the light-emitting element can be arranged on the first surface of the substrate, and the control chip can be arranged on the second surface of the substrate, so that the control chip can be integrated and arranged on the light board 10, thereby reducing the number of wirings between the driver chip and the control chip, and reducing the wiring difficulty of the light board 10. In addition, the control chip is arranged on the second surface of the substrate. Compared with the method in the related art that requires the wiring connecting the control chip and the driver chip to be arranged on the first surface of the substrate, the wiring connecting the control chip and the driver chip in the embodiment of the present disclosure can be arranged on the second surface of the substrate, thereby increasing the wiring space for the wiring connecting the control chip and the driver chip, reducing the wiring difficulty of the light board 10, and reducing the system complexity of the display device.

[0119] As shown in Figures 11-13, the display device provided by the embodiments of the present disclosure may further include: a mainboard A300, a light board 10, and a control chip A200. The input terminal of the control chip A200 is connected to the mainboard A300, and the output terminal of the control chip A200 is connected to the light board 10. The mainboard A300 can output information data to the control chip A200, and the control chip A200 outputs the information data to the light board 10 through the output terminal, so that the light board 10 forms an image based on the information data.

[0120] The light board 10 may include a substrate A10. The substrate A10 may be a single-layer substrate A10 including a core A113. Alternatively, the substrate A10 may be a multi-layer substrate A10. For example, the multi-layer substrate A10 may include multiple cores A113, which may be stacked sequentially along the thickness direction. The core A113 may be formed by covering the surface of the plate with a metal conductive layer A1131.

[0121] The light board 10 may also include a driver chip A120 and a light-emitting element A130. The driver chip A120 and the light-emitting element A130 are disposed on the first surface of the substrate A10. The input terminal of the driver chip A120 may be connected to the control chip A200. The driver chip A120 is electrically connected to the light-emitting element A130. The driver chip A120 can drive the light-emitting element A130 to emit light to form an image based on information data from the control chip A200.

[0122] In some embodiments, the control chip A200 can be disposed on the second surface of the substrate A10, so that the control chip A200 can be integrated into the light board 10. The input end of the control chip A200 can be connected to the main board A300, and the output end of the control chip A200 is connected to the driver chip A120. The control chip A200 and the driver chip A120 are respectively disposed on different surfaces of the substrate A10, thereby increasing the wiring space connecting the control chip A200 and the driver chip A120, reducing the wiring difficulty of the light board 10, and reducing the system complexity of the display device.

[0123] Referring to Figures 13-15 , in some possible embodiments, substrate A10 may have a conforming area A101 and a wiring area A102 connected to conforming area A101. Control chip A200 may be disposed in conforming area A101. The output of control chip A200 may be connected to a connecting trace A140 disposed on the second surface of substrate A10. At least a portion of connecting trace A140 is located within wiring area A102, thereby optimizing the routing of connecting trace A140.

[0124] In some embodiments, routing area A102 can surround conforming area A101. For example, conforming area A101 can be located in the middle of the second surface of substrate A10. In the first direction, the width of routing area A102 is greater than or equal to half the length of conforming area A101, thereby increasing the routing space for connecting traces A140 on the second surface of substrate A10 and reducing the wiring complexity of light board 10.

[0125] It should be noted that the first direction can be used to represent the direction from the middle of substrate A10 to the edge of substrate A10. For example, substrate A10 can be configured as a square substrate A10, and conforming area A101 can be configured as a square conforming area A101. The length direction of conforming area A101 can be parallel to the length direction of substrate A10, and the width direction of conforming area A101 can be configured as the width direction of substrate A10.

[0126] As shown in Figure 14, the first direction can be parallel to the length of the compliant area A101. In the first direction, the length of the compliant area A101 can be set to l1, and the width of the wiring area A102 can be set to W1, where W1 ≥ l1 / 2. Alternatively, the first direction can be parallel to the width of the compliant area A101. In the first direction, the length of the compliant area A101 can be set to l2, and the width of the wiring area A102 can be set to W2, where W2 ≥ l2 / 2.

[0127] In some embodiments, substrate A10 can be configured as a circular substrate A10, and conforming area A101 can be configured as a circular conforming area A101. The center of circular conforming area A101 can coincide with the circle of circular substrate A10. The first direction can be configured as the radial direction of circular substrate A10. In the first direction, the length of circular conforming area A101 can be configured as the diameter d1 of circular conforming area A101, and the width of wiring area A102 can be configured as the difference d2 between the diameter of circular substrate A10 and the diameter of circular conforming area A101, where d2 ≥ d1 / 2.

[0128] It should be understood that on the second surface of substrate A10, the first end of connection trace A140 is connected to control chip A200 located in attachment area A101, and the second end of connection trace A140 extends into wiring area A102. At least a portion of connection trace A140 is located in wiring area A102.

[0129] By setting the control chip A200 in the conforming area A101, the connecting line A140 of the control chip A200 can extend toward the wiring area A102 located outside the conforming area A101, so that the second end of the connecting line A140 can extend in multiple directions, thereby making the arrangement of the connecting line A140 more flexible and reducing the possibility of mutual interference among the connecting lines A140.

[0130] In some embodiments, the control chip A200 can be fixed relative to the second surface of the substrate A10 by attachment or other means. For example, the control chip A200 can be connected to the second surface of the substrate A10 by a Quad Flat No-lead Package (QFN), making the connection between the control chip A200 and the substrate A10 more convenient.

[0131] Referring to Figures 16-18, substrate A10 may be provided with a connection structure A111. Connection structure A111 may be provided in wiring area A102, or alternatively, connection structure A111 may be arranged in attachment area A101. A first end of connection structure A111 may be connected to an input terminal of control chip A200, and a second end of connection structure A111 may be connected to driver chip A120, so that control chip A200 located on the second surface of substrate A10 can be electrically connected to driver chip A120 located on the first surface of substrate A10 through connection structure A111.

[0132] In some embodiments, the substrate A10 may be provided with a through hole, which may be used to accommodate the connecting structure A111 , with a first end of the through hole located on the first surface of the substrate A10 and a second end of the through hole located on the second surface of the substrate A10 .

[0133] For example, the connecting structure A111 can be configured as a conductive pillar A1111. The conductive pillar A1111 can be disposed in a through hole, a first end of the conductive pillar A1111 can be electrically connected to a connecting trace A140 located on the second surface of the substrate A10, and a second end of the conductive pillar A1111 can be electrically connected to a driver chip A120 located on the first surface of the substrate A10 via a connecting trace A150 or other structures, so that the connecting trace A140 is electrically connected to the driver chip A120 through the conductive pillar A1111.

[0134] Alternatively, the interconnecting structure A111 may be configured as a conductive layer A1112. The conductive layer A1112 may be formed within the through-hole by deposition or electroplating. The surface of the conductive layer A1112 facing away from the inner wall of the through-hole may be filled with a plug to support the conductive layer A1112 via the plug, thereby making the structure of the conductive layer A1112 more stable.

[0135] The first end of the conductive layer A1112 can be electrically connected to the connecting trace A140 located on the second surface of the substrate A10, and the second end of the conductive layer A1112 can be electrically connected to the driving chip A120 located on the first surface of the substrate A10, so that the connecting trace A140 is electrically connected to the driving chip A120 through the conductive layer A1112.

[0136] In some embodiments, a trace is provided between the control chip A200 and the driver chip A120. The first portion of the trace can be provided on the second surface of the substrate A10, and the first portion of the trace forms a connecting trace A140. The second portion of the trace is provided on the first surface of the substrate A10, and the second portion of the trace is electrically connected to the first portion of the trace A140 via a connecting structure A111, and the second portion of the trace forms a connecting trace A150.

[0137] For example, on the first surface of substrate A10, when driver chip A120 is disposed in wiring area A102, connection structure A111 can be disposed in wiring area A102, with connection structure A111 close to driver chip A120. Alternatively, on the first surface of substrate A10, when driver chip A120 is disposed in conforming area A101, connection structure A111 can be disposed in conforming area A101, with connection structure A111 close to driver chip A120, thereby reducing the distance between connection structure A111 and driver chip A120 and reducing the length of connection trace A150 between connection structure A111 and driver chip A120.

[0138] It should be understood that the first surface of substrate A10 has driver chip A120 and light-emitting element A130, and the wiring space on the first surface of substrate A10 is smaller than the wiring space on the second surface of substrate A10. The position of connecting structure A111 can be adjusted according to the position of driver chip A120. By changing the position of connecting structure A111, the position of connecting trace A150 on the first surface of substrate A10 can be adjusted, reducing the length of connecting trace A150 on the first surface of substrate A10 and reducing the wiring difficulty of light board 10.

[0139] It should be noted that the connecting trace A140 can be formed by the metal conductive layer A1131 of the substrate A10. For example, the connecting trace A140 can be formed by the metal conductive layer A1131 disposed on the outermost layer, or the connecting trace A140 can also be formed by the metal conductive layer A1131 on the inner side of the substrate A10, so as to make the formation process of the connecting trace A140 more convenient.

[0140] The connecting trace A150 can be formed by the metal conductive layer A1131 of the substrate A10. For example, the connecting trace A150 can be formed by the metal conductive layer A1131 disposed on the outermost layer, or the connecting trace A150 can also be formed by the metal conductive layer A1131 on the inner side of the substrate A10, so that the formation process of the connecting trace A150 is more convenient.

[0141] Continuing with Figures 16-18 , the same light board 10 can have multiple driver chips A120 and multiple interconnect structures A111. The control chip A200 can be electrically connected to the first ends of multiple interconnect structures A111 via a connecting trace A140, and the control chip A200 can output information data to multiple driver chips A120 on the same light board 10.

[0142] In some embodiments, the first portion of the driver chip A120 can be disposed within the wiring area A102, and the connection structure A111 connecting the first portion of the driver chip A120 can be disposed within the wiring area A102. The second portion of the driver chip A120 can be disposed within the conforming area A101, and the connection structure A111 connecting the second portion of the driver chip A120 can be disposed within the conforming area A101.

[0143] In some embodiments, the connection structures A111 connecting the first portion of driver chips A120 may also be disposed within the conforming area A101, and the connection structures A111 connecting the second portion of driver chips A120 may also be disposed within the wiring area A102. The connection structures A111 are positioned close to the corresponding driver chips A120 to reduce the length of the connection traces A150 located on the first surface of the substrate A10.

[0144] Continuing with Figures 16-18 , the second surface of substrate A10 may also be provided with a plurality of connection terminals A112. These connection terminals A112 may be connected to mainboard A300 via a connector or other structure. A first portion of the connection terminals A112 may be electrically connected to driver chip A120 via substrate A10, while a second portion of the connection terminals A112 may be electrically connected to control chip A200 via substrate A10.

[0145] By providing a plurality of connection terminals A112 on the second surface of substrate A10, mainboard A300 is electrically connected to driver chip A120 via a first portion of connection terminals A112, and mainboard A300 is electrically connected to control chip A200 via a second portion of connection terminals A112, thereby enabling both driver chip A120 and control chip A200 to be electrically connected to mainboard A300. Connection terminals A112 do not need to be provided on the first surface of substrate A10, thereby increasing the wiring space on the first surface of substrate A10 and reducing the wiring difficulty on the first surface of substrate A10.

[0146] Among the plurality of connection terminals A112, a first portion of the connection terminals A112 located on the second surface of the substrate A10 can be electrically connected to the driver chip A120 located on the first surface of the substrate A10 via a conductive structure. The configuration of the conductive structure can refer to the configuration of the above-mentioned connection structure A111, and will not be repeated in this embodiment of the present disclosure.

[0147] The second part of the connecting terminal A112 located on the second surface of the substrate A10 can be electrically connected to the control chip A200 through a metal trace. The setting method of the metal trace can refer to the setting method of the above-mentioned connecting trace A150 and the connecting trace A140, and the embodiments of the present disclosure will not be repeated here.

[0148] In some embodiments, the plurality of connection terminals A112 may be close to each other. Alternatively, the plurality of connection terminals A112 may be arranged in sequence to facilitate the docking process between the connector connected to the mainboard A300 and the plurality of connection terminals A112.

[0149] Figure 19 is a structural diagram of a display device in which a mainboard is connected to a light board 10 through wireless communication according to some embodiments. As shown in Figure 19, the input end of the control chip A200 can be wirelessly connected to the mainboard A300, so that the control chip A200 does not need to be connected to the mainboard A300 through connection terminals A112 and wiring, thereby reducing the number of connection terminals A112 and increasing the wiring space of the substrate A10.

[0150] In some embodiments, the control chip A200 may have a Bluetooth transmission module, and the control chip A200 may be wirelessly connected to the mainboard A300 through the Bluetooth transmission module, thereby receiving information data from the mainboard A300 through the Bluetooth transmission module.

[0151] The control chip A200 may have a wireless network transmission module (ie, WiFi), and the control chip A200 may be wirelessly connected to the mainboard A300 through the wireless network transmission module, thereby receiving information data from the mainboard A300 through the wireless network transmission module.

[0152] 20 and 21 , the number of the light board 10 and the control chip A200 in the display device may be multiple.

[0153] In some embodiments, the light board 10 can control one partition. Alternatively, the light board 10 can also control multiple partitions to reduce the number of light boards 10 and improve the integration of the display device. The number of control chips A200 can be equal to the number of light boards 10, and each light board 10 is provided with a control chip A200.

[0154] The display device may also include a control board A400. The input of the control board A400 may be connected to the main board A300, and the output of the control board A400 may be connected to the control chips A200. The main board A300 outputs information data to the multiple control chips A200 via the control board A400, thereby reducing the output pressure of the main board A300 through the control board A400, thereby making the control process of the multiple control chips A200 by the main board A300 more stable.

[0155] The control board A400 can be integrated with the main board A300, reducing the assembly space required for the control board A400 and the main board A300, thereby improving the integration level of the display device and increasing the assembly space of various components of the display device.

[0156] When the display device is in working state, the main board A300 can receive input signals from the signal source and obtain regional brightness and darkness information data of the display device screen according to the input signals. The main board A300 transmits the above information data to the control board A400, and then transmits it to the control chip A200 of the multiple light boards 10 through the control board A400;

[0157] The control chip A200 located on the second surface of the substrate A10 processes the information data and transmits the processed information data to the driving chip A120 located on the first surface of the substrate A10 through the wiring and connecting structure A111. The driving chip A120 controls multiple light-emitting elements A130 to emit light according to the processed information data, thereby realizing image display.

[0158] In summary, by setting the control chip A200 on the substrate A10, and setting the driver chip A120 and the light-emitting element A130 on the first surface of the substrate A10, the control chip A200 is set on the second surface of the substrate A10, so that the control chip A200 can be integrated and set on the lamp board 10, thereby reducing the number of wirings between the driver chip A120 and the control chip A200, and reducing the wiring difficulty of the lamp board 10. In addition, the control chip A200 is set on the second surface of the substrate A10. Compared with the method in the related art that requires the wiring connecting the control chip A200 and the driver chip A120 to be arranged on the first surface of the substrate A10, the wiring connecting the control chip A200 and the driver chip A120 in the embodiment of the present disclosure can be set on the second surface of the substrate A10, thereby increasing the wiring space for the wiring connecting the control chip A200 and the driver chip A120, reducing the wiring difficulty of the lamp board 10, and reducing the system complexity of the display device.

[0159] In some embodiments, the light-emitting chip 110 may be an LED chip. The current LED chip manufacturing process requires soldering the LED chip to pads on a printed circuit board (PCB). Then, using glue dispensing technology, a convex lens is formed on the LED chip to expand the light output angle. During glue dispensing, the main control measures are the diameter and height of the glue dot to achieve the desired structure. The consistency of the glue dot structure is also a key factor influencing the visual consistency.

[0160] In traditional LED modules, due to the presence of grooves between the positive and negative pads, tests have shown that when the amount of glue dispensed increases and the glue dispense diameter is greater than 4mm, the glue will move faster along the groove than at right angles to the groove during the dispensing process. This will cause the shape of the resulting convex lens to approach an elliptical or other irregular shape, thereby affecting the uniformity of the light output.

[0161] Based on this, the embodiment of the present disclosure provides an LED module, which may include: a PCB board, at least one group of component pads is arranged on the PCB board, the component pads include two first pads arranged at intervals, the first pads include a first pad body and a raised portion formed by protruding outward along one side of the first pad body, the raised portions of the two first pads are arranged opposite to each other, and there is a gap between the raised portions of the two first pads, and the gap forms a positive and negative electrode groove; an LED chip, the LED chip is arranged on the component pad, and the positive and negative poles of the LED chip are respectively welded to the raised portions of the two first pads; a convex lens, the convex lens is covered above the LED chip by a dispensing process; wherein, a drainage groove is provided on the first pad, the drainage groove is arranged along a first direction, the first end of the drainage groove is located on the first pad body, and the second end of the drainage groove is located on the raised portion, and the first direction is perpendicular to the direction of the positive and negative electrode grooves.

[0162] In some embodiments, the first end of the drainage groove extends to below the LED chip.

[0163] In some embodiments, the depth of the drainage groove gradually increases from the second end to the first end.

[0164] In some embodiments, the width of the drainage groove gradually decreases from the first end to the second end, and the width of the guide groove is the dimension of the drainage groove along the second direction, and the second direction is parallel to the direction of the positive and negative electrode grooves.

[0165] In some embodiments, the drainage groove is symmetrically arranged about the first center line, and the first center line is the center line of the protrusion along the direction.

[0166] In some embodiments, the groove wall of the first drainage groove includes a plane segment and an arc segment, the plane segment is located at the first end of the drainage groove, the two ends of the arc segment are respectively connected to the two ends of the plane segment, and the arc segment gradually approaches the first center line from the first end of the drainage groove to the second end of the drainage groove.

[0167] In some embodiments, the drainage groove is semi-elliptical in shape.

[0168] In some embodiments, the convex lens is hemispherical in shape, and the convex lens is symmetrical about the first center line and the center lines of the positive and negative electrode grooves.

[0169] In some embodiments, a white oil solder resist layer is provided on the first pad body, and the white oil solder resist layer covers the first pad body and the bottom of the drainage groove located on the first pad body.

[0170] In some embodiments, the protrusion is trapezoidal in shape, and a width of the protrusion gradually decreases in a direction away from the first pad body.

[0171] For the sake of convenience, the protruding direction of the protrusion B102 is used as the first direction X, and the center line direction of the positive and negative electrode grooves B103 is used as the second direction Y. The first direction is perpendicular to the second direction.

[0172] As shown in Figures 22 to 31, the LED module provided by the embodiment of the present disclosure may include an LED chip 2, a convex lens 3 and a PCB board 4. At least one group of component pads is provided on the PCB board 4, and one LED chip 2 is soldered on each group of component pads. The component pads include two first pads 1 arranged at intervals. The first pad 1 includes a first pad body B101 and a protrusion B102 formed by protruding outward along one side of the first pad 1.

[0173] In some embodiments, the raised portions B102 of the two first pads 1 are arranged opposite to each other, and there is a gap between the raised portions B102 of the two first pads 1, and the gap is the positive and negative electrode grooves B103. That is, the two first pads 1 are respectively the positive electrode pad and the negative electrode pad, and the positive and negative electrode grooves B103 separate the positive electrode pad and the negative electrode pad to avoid mutual interference.

[0174] The positive and negative electrodes of the LED chip 2 are respectively welded to the raised portions B102 of the two first solder pads 1. Specifically, one end of the LED chip 2 is the positive electrode and the other end is the negative electrode. The LED chip 2 is correspondingly arranged above the positive and negative electrode grooves B103, and the positive electrode of the LED chip 2 is welded to the raised portion B102 of the positive electrode solder pad, and the negative electrode of the LED chip 2 is welded to the raised portion B102 of the negative electrode solder pad. For example, in Figure 22, the first solder pad 1 on the left is the positive electrode solder pad, the left end of the LED chip 2 is the positive electrode, and the positive electrode of the LED chip 2 is welded and fixed to the positive electrode solder pad. The first solder pad 1 on the right is the negative electrode solder pad, the right end of the LED chip 2 is the negative electrode, and the negative electrode of the LED chip 2 is welded and fixed to the negative electrode solder pad.

[0175] The convex lens 3 is covered on the top of the LED chip 2 through a dispensing process, and a drainage groove B104 is set on the first pad 1. The drainage groove B104 is set along the first direction, and the first end B1011 of the drainage groove B104 is located on the first pad body B101, and the second end B1012 of the drainage groove B104 is located on the protrusion B102. The first direction is perpendicular to the direction of the positive and negative electrode grooves B103. After the LED chip 2 completes the welding with the protrusions B102 of the two first pads 1, during the dispensing process, since the drainage groove B104 is set in the first direction, it can play the same effect of accelerating the flow of glue as the positive and negative electrode grooves B103, so that the flow rate of the glue along the positive and negative electrode grooves B103 is close to the flow rate along the direction perpendicular to the positive and negative electrode grooves B103, which ultimately results in the shape of the formed convex lens 3 being closer to a regular hemispherical shape, improving the consistency and uniformity of the dispensing structure, thereby improving the light output effect of the convex lens 3 and making the light output more uniform.

[0176] Glue dispensing is a process, also known as gluing, coating, filling, or dripping, in which electronic glue, oil, or other liquids are applied to a product to achieve adhesion, potting, insulation, fixation, and surface smoothing. In this disclosure, glue dispensing is performed on an LED chip to form a convex lens, thereby improving the light output of the LED chip.

[0177] In some embodiments, the second end B1012 of the drainage groove B104 extends to below the LED chip 2 .

[0178] In some embodiments, during the dispensing process, the glue first flows from the center to the periphery on the LED chip 2. Since the surface of the LED chip 2 is approximately flat, the flow speed of the glue in all directions on the LED is roughly the same. When the glue flows down from the LED chip 2, along the direction of the positive and negative electrode grooves B103, the flow rate of the glue is accelerated due to the action of the positive and negative electrode grooves B103.

[0179] Since the second end B1012 of the drainage groove B104 extends to the bottom of the LED chip 2, the glue flows down from the LED chip 2 in the direction of the drainage groove B104 and directly enters the drainage groove B104, which can also speed up the flow rate of the glue. After the glue flows down from the LED chip 2, the flow rate along the positive and negative electrode grooves B103 and the drainage groove B104 is roughly the same, thereby making the shape of the formed convex lens 3 more regular, further improving the consistency and uniformity of the glue dispensing structure.

[0180] In some embodiments, the depth of the drainage groove B104 gradually increases from the second end B1012 to the first end B1011. This allows the glue to flow from the LED chip 2 down the drainage groove B104 from top to bottom, increasing the flow rate from the second end B1012 to the first end B1011. This allows the glue to flow approximately the same velocity along the positive and negative electrode grooves B103 and along the drainage groove B104.

[0181] As shown in Figures 25 and 26 , the width of the drainage groove B104 in the disclosed embodiment gradually increases from the second end B1012 to the first end B1011. The width of the drainage groove B104 is the dimension of the drainage groove B104 along the second direction, which is parallel to the direction of the positive and negative electrode grooves B103. In other words, the width of the drainage groove B104 gradually increases along the direction of the glue flow, further increasing the flow rate of the glue.

[0182] At the same time, the width of the drainage groove B104 at the second end B1012 is smaller than the width at the first end B1011. Therefore, the area of ​​the contact between the protrusion B102 and the LED chip 2 is smaller the closer it is to the end of the protrusion B102. When the LED chip 2 and the protrusion B102 are welded, the solder paste on the contact surface between the LED chip 2 and the protrusion will form surface tension, thereby forming a certain pulling force on the LED chip. Under the action of the surface tension of the solder paste, the closer to the first center line of the protrusion B102, the smaller the contact area between the LED chip and the protrusion, and the closer to the first center line, the greater the surface tension of the solder paste. The first center line mentioned here is actually the center line of the protrusion B102 along the first direction. During the solidification process, the pulling force is concentrated approximately toward the center position of the positive and negative electrode grooves B103, which automatically corrects the position of the LED chip 2, avoids the problem of biased welding, and improves the welding yield between the LED chip 2 and the protrusion B102.

[0183] In some embodiments, the drainage grooves B104 are symmetrically arranged about the first center line, and the first center line is parallel to the first direction. The symmetrical arrangement of the drainage grooves B104 about the first center line makes the overall structure of the LED module more symmetrical and uniform, and the convex lens 3 formed by the glue dispensing is nearly symmetrical about the first center line. In other words, in this LED module, the flow rate of the glue along the first center line is controlled to be approximately the same as the flow rate along the positive and negative electrode grooves B103, thereby improving the uniformity of the formed convex lens 3 and further improving the light output effect.

[0184] As shown in Figures 25 and 26, the groove wall of the first drainage groove B104 may include: a plane section B11, the plane section B11 is located at the first end B1011 of the drainage groove B104; an arc surface section B12, the two ends of the arc surface section B12 are respectively connected to the two ends of the plane section B11, and the arc surface section B12 gradually approaches the first center line from the first end B1011 of the drainage groove B104 to the second end B1012 of the drainage groove B104.

[0185] In some embodiments, the planar segment B11 is arranged along the second direction and is symmetrical about the first centerline. The arcuate segment B12 is arranged in a C-shape, with its ends connected to the ends of the planar segment B11. The arcuate segment B12 gradually approaches the first centerline from the first end B1011 to the second end B1012, and intersects the first centerline at the second end B1012 of the drainage groove B104.

[0186] The width of the drainage groove B104 formed in this way gradually decreases from the first end B1011 to the second end B1012, and since the groove wall of the drainage groove B104 has an arc surface segment B12, during the glue dispensing process, the arc surface segment B12 constrains the flow trajectory of the glue when the glue flows in the drainage groove B104, making the flow of the glue more uniform.

[0187] In some embodiments, the shape of the drainage groove B104 is semi-elliptical. During the dispensing process, the flow velocity can be increased not only in the first direction but also in the direction at a certain angle to the first direction, thereby further improving the consistency of the flow velocity in all directions during the dispensing process.

[0188] It should be noted that the shape of the drainage groove B104 can also be a trapezoid, triangle or other irregular shapes. Even when the LED module does not need to automatically correct the LED chip 2, the shape of the drainage groove B104 can also be a rectangle, that is, there is no limit on the width of the drainage groove B104.

[0189] In some embodiments, as shown in FIG. 27 , the drainage groove B104 is trapezoidal in shape, and the width of the trapezoidal drainage groove B104 gradually decreases from the first end B1011 to the second end B1012 .

[0190] Furthermore, as shown in FIG28 , the convex lens 3 is hemispherical in shape and is symmetrically arranged about the first centerline and the centerline of the positive and negative electrode grooves B103. A drainage groove B104 is provided in the first direction so that the flow rate of the glue in the first direction is approximately the same as the flow rate in the second direction. The main purpose of this is to make the shape of the final convex lens 3 hemispherical, that is, to make the shape of the convex lens 3 more uniform and regular, thereby improving the light extraction effect of the convex lens 3.

[0191] Each cross section of the convex lens 3 is circular. The light emitted by the LED chip 2 is diffused by the convex lens 3 to expand the luminous angle. By setting each cross section of the convex lens 3 to be circular, the time at which the light reaches each point on the outer surface of the convex lens 3 is consistent, and the light output consistency at each position on the outer surface of the convex lens 3 is high.

[0192] In some embodiments, a white oil welding layer B105 is provided on the first pad body B101. Because the raised portion B102 is to be soldered to the LED chip 2, the raised portion B102 does not have the white oil welding layer B105. The white oil welding layer on the first pad body B101 covers the first pad body B101 and the bottom of the drainage groove B104 located on the first pad body B101. In other words, the drainage groove B104 on the first pad body B101 is provided in the copper layer of the pad, which is still covered with the white oil welding layer. Due to the relatively small thickness of the white oil welding layer, the bottom of the drainage groove B104 is prevented from being covered with the welding layer, and the flow rate of the glue in the drainage groove B104 is still not affected.

[0193] Since the thickness of the white oil welding layer is relatively small, even if the first pad body is covered with the white oil welding layer, the glue will not be affected when flowing in the drainage groove.

[0194] In some embodiments, the depth of the drainage groove on the first pad body can be set to be greater than the depth of the raised portion. In this way, when the white oil welding layer covers the first pad body B101, the glue will not be blocked when flowing from the second end to the first end in the drainage groove B104, thereby increasing the flow speed of the glue in the first direction. The speed in the first direction and the speed in the second direction are roughly the same, thereby improving the uniformity and regularity of the convex lens 3 and the light extraction effect of the convex lens 3.

[0195] Continuing with Figure 26, the length of the protrusion B102 is K, and the length of the protrusion B102 refers to the size of the protrusion B102 along the first direction. The distance between the first end B1011 of the drainage groove B104 and the end of the protrusion B102 is 2K, the distance between the second end B1012 of the drainage groove B104 and the end of the protrusion B102 is N, and the distance between the first end B1011 of the drainage groove B104 and the second end B1012 of the drainage groove B104 is 2K-N.

[0196] In some embodiments, the value of N is 100 μm. Given that the length of the protrusion B102 is K, the length of the drainage groove B104 on the first welding body is equal to the length of the protrusion B102, also K. Therefore, the distance between the first end B1011 of the drainage groove B104 and the end of the protrusion B102 is 2K. Therefore, the distance between the first end B1011 and the second end B1012 of the drainage groove B104 is 2K-100 μm. In other words, the major axis of the semi-ellipse formed by the drainage groove B104 is 2K-100 μm.

[0197] The width of the protrusion B102 is L, the minimum distance between the drainage groove B104 and the edge of the protrusion B102 along the second direction is M, and the width of the drainage groove B104 is L-2M. In some embodiments, M is 100 μm, and the width of the drainage groove B104 is L-2×100 μm.

[0198] 29 , the shape of the protrusion B102 is trapezoidal, and the width of the protrusion B102 gradually decreases in the direction away from the first pad body B101. In other words, the width of the base of the protrusion B102 is greater than the width of the end of the protrusion B102.

[0199] The shape of the raised portion B102 is set to a trapezoid. Compared with the traditional rectangular raised portion B102, the welding yield of the LED chip 2 is significantly improved. This is because the closer the trapezoidal raised portion B102 is to the end, the smaller the contact area with the LED. When the LED chip 2 and the raised portion B102 are welded, solder paste is used between the contact surface of the raised portion B102 and the LED chip 2. Since the closer the contact area between the raised portion B102 and the LED chip 2 is to the first center line, the tension of the solder paste is concentrated in the direction of the first center line during the solidification process, that is, concentrated towards the center of the LED chip 2, which plays a role in automatically correcting the LED chip 2.

[0200] It should be noted that setting the raised portion B102 to a trapezoidal shape and setting the drainage groove B104 to a semi-elliptical shape can both automatically correct the position of the LED chip 2. Therefore, the automatic correction of the position of the LED chip 2 can be achieved only by setting the shape of the drainage groove B104 to a semi-elliptical shape, or the automatic correction of the position of the LED chip 2 can be achieved only by setting the raised portion B102 to a trapezoidal shape.

[0201] In some embodiments, the shape of the protrusion B102 can be set to a trapezoid, and the shape of the drainage groove B104 can be set to a semi-elliptical shape. The effects of these settings are superimposed, and the automatic correction effect on the LED chip 2 is better.

[0202] When manufacturing the LED module in the above embodiment, first, a drainage groove B104 is opened on the first pad 1. The drainage groove B104 is opened on the copper layer of the first pad 1. The shape of the drainage groove B104 is a semi-ellipse, trapezoid, triangle or rectangle.

[0203] A white oil solder resist layer B105 is then applied to the first pad body B101. The white oil solder resist layer B105 covers the entire first pad body B101 and the drainage groove B104 located at the bottom of the first pad body B101. The upper surface of the raised portion B102 is not coated with the white oil solder resist layer B105. Subsequently, two first pads 1 are symmetrically arranged on the PCB board 4. A positive and negative electrode groove B103 is formed between the raised portions B102 of the two first pads 1 to physically isolate the two first pads 1.

[0204] Place the LED chip 2 on the two first pads 1, with the positive electrode of the LED chip 2 corresponding to the positive pad and the negative electrode of the LED chip 2 corresponding to the negative pad. After the LED chip 2 is placed, solder the LED chip 2 to the first pads 1 using tin soldering. The raised portion B102 of the first pad 1 serves as the soldering point for connecting to the LED chip 2.

[0205] Glue is dispensed on the upper surface of the soldered LED chip 2 to form a convex lens 3. Since a drainage groove B104 is provided on the first soldering pad 1, the flow speed of the glue along the first direction is roughly the same as the flow speed along the second direction during the gluing process. The shape of the convex lens 3 finally formed is approximately a regular hemisphere. The light emitted by the LED chip 2 is diffused by the convex lens 3, which expands the light-emitting angle. Since the shape of the convex lens 3 is a regular hemisphere, the time for the light to reach each point on the outer surface of the convex lens 3 is the same, which further improves the uniformity of the light output. Moreover, the width of the B104 drainage groove B104 at the second end B1012 is smaller than the width at the first end B1011. Under the action of the surface tension of the solder paste, the closer to the first center line of the protrusion B102, the smaller the contact area between the LED chip and the protrusion, and the closer to the first center line, the greater the surface tension of the solder paste. During the solidification process, the tension is concentrated toward the center of the positive and negative electrode grooves B103, which automatically corrects the position of the LED chip 2, avoids the problem of biased soldering, and improves the welding yield between the LED chip 2 and the protrusion B102.

[0206] In the above process, the LED module provided by the embodiment of the present disclosure is provided with a drainage groove B104 on the first solder pad 1, the direction of the drainage groove B104 is perpendicular to the direction of the positive and negative electrode grooves B103, and the first end of the drainage groove B104 is located on the first solder pad body B101, and the second end is located on the raised portion B102. After the LED chip 2 completes the welding with the raised portion B102 of the two first solder pads 1, during the dispensing process, since the drainage groove B104 is provided in the first direction, it can play the same effect of accelerating the flow of glue as the positive and negative electrode grooves B103, so that the flow speed of the glue along the positive and negative electrode grooves is close to the flow speed along the direction perpendicular to the positive and negative electrode grooves, and finally the shape of the formed convex lens 3 is closer to a regular hemispherical shape, which improves the consistency and uniformity of the dispensing structure, thereby improving the light output effect of the convex lens 3 and making the light output more uniform.

Claims

1. An encapsulation device, comprising: a substrate; at least three light-emitting chips, which are arranged side by side on the substrate and are all configured to emit light of a first color; a first conversion light-emitting layer, covering the first light-emitting chip, configured to convert the light of the first color emitted by the first light-emitting chip into a second color; a second conversion light-emitting layer, covering the second light-emitting chip, configured to convert the light of the first color emitted by the second light-emitting chip into a third color; the first light-emitting chip and the second light-emitting chip are both at least one of the at least three light-emitting chips; among the at least three light-emitting chips, there is at least one light-emitting chip that is neither the first light-emitting chip nor the second photosensitive chip; the first color, the second color, and the third color are different from each other and are respectively one of red, green, and blue.

2. The encapsulation device according to claim 1, wherein the at least three light-emitting chips are all blue light chips, the first color is blue, the second color is green, and the third color is red; wherein, the first conversion light-emitting layer is configured to convert the blue light emitted by the first light-emitting chip into green light; the second conversion light-emitting layer is configured to convert the blue light emitted by the second light-emitting chip into red light.

3. The encapsulation device according to claim 2, wherein the first light-emitting chip covered with the first conversion light-emitting layer is configured as a green lamp bead; wherein, the green lamp bead includes a light-emitting side, and the light-emitting side of the green lamp bead is covered with a first reflective layer, and the first reflective layer is configured to reflect red light and blue light and transmit green light; or, the green lamp bead includes a light-emitting side, and the light-emitting side of the green lamp bead is covered with a first filter layer, and the first filter layer is configured to filter out red light and blue light and transmit green light.

4. The encapsulation device according to claim 2, wherein the second light-emitting chip covered with the second conversion light-emitting layer is configured as a red lamp bead; wherein, the red lamp bead includes a light-emitting side, and the light-emitting side of the red lamp bead is covered with a second reflective layer, and the second reflective layer is configured to reflect green light and blue light and transmit red light.

5. The encapsulation device according to claim 2, wherein the second light-emitting chip covered with the second conversion light-emitting layer is configured as a red lamp bead; wherein, the red lamp bead includes a light-emitting side, and the light-emitting side of the red lamp bead is covered with a second filter layer, and the second filter layer is configured to filter out green light and blue light and transmit red light.

6. The encapsulation device according to any one of claims 2-5, wherein the first conversion light-emitting layer includes green phosphor or green quantum dots.

7. The encapsulation device according to any one of claims 2-5, wherein the second conversion light-emitting layer includes red phosphor or red quantum dots.

8. The encapsulation device according to any one of claims 1-4, wherein any two of the at least three light-emitting chips are connected in series or in parallel to form an input end and an output end.

9. A backlight module, comprising the encapsulation device according to any one of claims 1-8.

10. A driving circuit is applied to the backlight module according to claim 9, and the backlight module includes at least one packaged device; The driving circuit is electrically connected to the packaged device, and the driving circuit is used to drive the packaged device.

11. A display device includes the packaged device according to any one of claims 1-8.

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