Liquid replenishment-based heat dissipation apparatus of submerged liquid cooling system

Abstract

Embodiments of the present disclosure provide a liquid replenishment-based heat dissipation apparatus of a submerged liquid cooling system. The apparatus comprises: a plurality of TANK containers, configured to place workpieces to be cooled; a liquid level sensor, configured to measure the liquid levels of heat dissipation media in the plurality of TANK containers, and output liquid level results and the serial numbers of the TANK containers; a turbulence pump, configured to pump heat dissipation media for the plurality of TANK containers; and a controller, configured to replenish, by means of the turbulence pump and on the basis of the liquid level results and the serial numbers of the TANK containers, the heat dissipation media for the TANK containers corresponding to the serial numbers of the TANK containers.

Description

Liquid refill heat dissipation device for immersion liquid cooling system

[0001] Cross-references to related publications

[0002] The present disclosure is based on Chinese Patent Publication No. 2024100112246, filed on January 3, 2024, entitled “Liquid Replenishment and Heat Dissipation Device for Immersed Liquid Cooling System”, and claims the priority of the patent disclosure, and all the contents disclosed therein are incorporated into the present disclosure by reference. Technical Field

[0003] The embodiments of the present disclosure relate to the technical field of heat dissipation, and in particular, to a liquid replenishment heat dissipation device for an immersion liquid cooling system. Background Art

[0004] A submerged liquid cooling system is a cooling system that uses a liquid medium to dissipate heat. Unlike traditional air cooling systems, it completely or partially immerses electronic equipment or computer components in liquid for cooling. In an immersion liquid cooling system, the device or component is placed in a tank filled with a specific liquid heat dissipation medium (such as water or oil). The device is in direct contact with the liquid, and heat is absorbed and carried away by the liquid through conduction and convection. The heat dissipation medium is then directed to an external heat dissipation device (such as a cooling tower or heat exchanger) via a heat pump to dissipate heat before being recirculated into the system.

[0005] In related art, a centralized liquid supply system is generally used to supply and circulate heat dissipation medium for tank containers. However, this system is typically connected to multiple tank containers. When the liquid level in one or more tank containers drops, the centralized liquid supply system will replenish heat dissipation medium for all connected tank containers, which can easily lead to heat dissipation medium waste. Summary of the Invention

[0006] An embodiment of the present disclosure provides a liquid replenishment and heat dissipation device for an immersion liquid cooling system.

[0007] According to one embodiment of the present disclosure, a liquid replenishment and heat dissipation device for an immersion liquid cooling system is provided, comprising: a plurality of TANK containers, configured to place workpieces to be cooled; a liquid level sensor, configured to measure the liquid level of the heat dissipation medium in the plurality of TANK containers, and output the liquid level result and the number of the TANK container; a spoiler pump, configured to pump the heat dissipation medium for the plurality of TANK containers; and a controller, configured to replenish the heat dissipation medium for the TANK containers corresponding to the TANK container numbers through the spoiler pump based on the liquid level result and the TANK container numbers.

[0008] Through the disclosed embodiments, a liquid level sensor is introduced to measure the level of the cooling medium in each tank and output the level result and the tank number. Using the level sensor's measurement results and the tank number, the controller can accurately determine which tank requires cooling medium replenishment. Furthermore, utilizing a turbulent flow pump installed within the tank, the controller can provide cooling medium specifically to the tank in need, avoiding the need to centrally supply liquid to all connected tanks.

[0009] The disclosed embodiments enable accurate and efficient replenishment of heat dissipation medium for each tank, avoiding waste and reducing excessive consumption of heat dissipation medium. Furthermore, since only tanks requiring replenishment are replenished with heat dissipation medium, energy savings and costs are also reduced. This addresses the issue of heat dissipation medium waste that often occurs during tank replenishment in the related art, thereby reducing excessive consumption of heat dissipation medium. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] FIG1 is a schematic diagram of the connection relationship among a controller, a flow disturbance pump, a plurality of TANK containers, and a centralized heat dissipation system according to an embodiment of the present disclosure;

[0011] FIG2 is a schematic structural diagram of a liquid replenishment and heat dissipation device of an immersion liquid cooling system according to an embodiment of the present disclosure;

[0012] FIG3 is a structural block diagram of a flow-disrupting component in which a flow-disrupting workpiece is a flow-disrupting tube according to an embodiment of the present disclosure;

[0013] FIG4 is a structural block diagram of a spoiler component according to an embodiment of the present disclosure, in which the spoiler workpiece is a spoiler plate.

[0014] Explanation of reference numerals: 100, centralized cooling system; 200, TANK container; 201, liquid distributor; 202, pipeline interface; 203, branch electric valve; 204, branch pipe fitting; 205, flow disturbance workpiece; 300, cooling pump; 301, cooling pump front pressure sensor; 302, cooling pump rear pressure sensor; 303, cooling return liquid pressure sensor; 304, cooling return liquid temperature sensor; 305, cooling liquid supply pressure sensor; 306, cooling liquid supply Flow sensor; 307, heat dissipation liquid supply temperature sensor; 308, turbulence liquid supply pressure sensor; 309, turbulence liquid supply temperature sensor; 310, turbulence liquid supply flow sensor; 311, turbulence pump front pressure sensor; 312, inner cavity temperature sensor; 313, liquid level sensor; 400, first electric bypass valve; 500, second electric bypass valve; 600, turbulence pump front electric valve; 700, turbulence pump; 800, purification module; 900, heat dissipation pipeline assembly. DETAILED DESCRIPTION

[0015] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings and in conjunction with embodiments.

[0016] It should be noted that the terms "first", "second", etc. in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0017] In this embodiment, a liquid replenishment and heat dissipation device for an immersion liquid cooling system is provided. FIG1 is a schematic diagram of the connection relationship among a controller, a turbulent flow pump, multiple TANK containers, and a centralized heat dissipation system according to an embodiment of the present disclosure. FIG2 is a structural schematic diagram of a liquid replenishment and heat dissipation device for an immersion liquid cooling system according to an embodiment of the present disclosure. As shown in FIG1 and FIG2, the device includes:

[0018] A plurality of TANK containers 200 are configured to hold heat-dissipated workpieces;

[0019] In an exemplary embodiment, multiple tank containers 200 are placed in a cooling station and configured to store a heat dissipation medium. The heat dissipation medium can be a special liquid (e.g., a fluorinated liquid, oil, etc.) that is pumped into the tank containers 200 to cool the workpiece being cooled. The workpiece being cooled is immersed in the heat dissipation medium, which absorbs and removes the heat generated by the workpiece.

[0020] The liquid level sensor 313 is configured to measure the liquid level of the heat dissipation medium in the plurality of TANK containers 200 and output the liquid level result and the number of the TANK container 200;

[0021] In an exemplary embodiment, in order to measure the liquid level of the heat dissipation medium in the TANK container 200, the following installation methods can be used:

[0022] 1. Immersion installation: Immerse the liquid level sensor 313 directly into the tank container 200 so that it is exposed to the liquid surface. The sensor will measure the height of the liquid and convert it into a corresponding liquid level signal.

[0023] 2. External installation: Install the sensor on the outside of the tank 200 and connect it to the liquid through the wall or side hole. The sensor determines the liquid level by measuring the pressure difference between the liquid and the sensor.

[0024] 3. Plug-around installation: A pipe is installed around the tank 200 and the sensor is installed inside the pipe. The liquid is connected to the sensor through the pipe, and the sensor measures the liquid level.

[0025] 4. Non-contact installation: Use non-contact liquid level sensors 313, such as radar or ultrasonic sensors. These sensors transmit signals from the outside of the container to the inside and measure the liquid level by receiving the reflection of the signal.

[0026] Each liquid level sensor 313 is provided with an IP address, and the controller can obtain the serial number of the TANK container 200 by identifying the IP address of the liquid level sensor 313 .

[0027] A turbulence pump 700 is configured to pump heat dissipation medium for the plurality of TANK containers 200;

[0028] In an exemplary embodiment, a disturbance pump 700 is installed in each TANK container 200 , and the disturbance pump 700 pumps the heat dissipation medium for the TANK container 200 on a one-to-one basis.

[0029] In an exemplary embodiment, as shown in FIG2 , a disturbance pump 700 is installed outside each TANK container 200 , and the disturbance pump 700 pumps the heat dissipation medium for the TANK container 200 on a one-to-one basis.

[0030] In an exemplary embodiment, as shown in FIG1 , a disturbance pump 700 can be connected to multiple TANK containers 200 via multiple pipelines, with a liquid separation valve installed in each pipeline. The liquid separation valve and the disturbance pump 700 cooperate to pump heat dissipation medium to each TANK container 200. The disturbance pump 700 can be a common mechanical pump or a shielded pump, and the choice can be made based on actual conditions, and this disclosure does not limit it.

[0031] In an exemplary embodiment, the heat dissipation medium is delivered to the TANK container 200 through the disturbance pump 700, which can not only replenish the heat dissipation medium in the TANK container 200, but also allow the replenished heat dissipation medium to enter the TANK container 200, thereby promoting the flow of the heat dissipation medium contained in the TANK container 200, thereby playing a disturbing role on the heat dissipation medium in the TANK container 200.

[0032] The controller is configured to replenish the heat dissipation medium for the TANK container 200 corresponding to the number of the TANK container 200 through the disturbance pump 700 based on the liquid level result and the number of the TANK container 200 .

[0033] In an exemplary embodiment, a valve body is installed on each pipeline connecting the controller and the TANK container 200, and the controller controls the opening and closing of the corresponding valve body to pump the heat dissipation medium to the TANK container 200 respectively.

[0034] Through the above device, the liquid level sensor 313 is introduced to measure the liquid level of the heat dissipation medium in each TANK container 200, and output the liquid level result and the number of the TANK container 200.

[0035] Based on the measurement results of the liquid level sensor 313 and the tank container 200 number, the controller can accurately determine which tank container 200 needs to be replenished with heat dissipation medium. Furthermore, using the turbulence pump 700, the controller can provide heat dissipation medium to the tank container 200 in need of replenishment, avoiding the situation where all connected tank containers 200 need to be centrally supplied with liquid.

[0036] Through the above-described method, the technical solution of the present disclosure can accurately and effectively replenish the heat dissipation medium for each tank container 200, thereby avoiding waste of heat dissipation medium and reducing excessive consumption of heat dissipation medium. Furthermore, since only the tank containers 200 that require replenishment are replenished with heat dissipation medium, energy can be saved and costs can be reduced.

[0037] FIG3 is a structural block diagram of a spoiler assembly according to an embodiment of the present disclosure, wherein the spoiler component is a spoiler tube. In one embodiment, as shown in FIG3 , the device further includes:

[0038] Multiple groups of spoiler components are arranged in the TANK container 200, wherein each TANK container 200 is provided with at least one heat dissipation station for placing a workpiece to be cooled, and the spoiler components correspond to the heat dissipation stations;

[0039] In an exemplary embodiment, as shown in Figures 2 and 3, a tank container 200 can be provided with five heat dissipation stations to accommodate ten workpieces to be cooled. Of course, Figures 2 and 3 are merely examples, and the number of heat dissipation stations within each tank container 200 can be set according to actual circumstances and is not limited by this disclosure. Each heat dissipation station is provided with a flow spoiler assembly to alter the flow rate and flow path of the heat dissipation medium at the heat dissipation station to dissipate heat from the workpieces to be cooled.

[0040] The liquid distributor 201 is configured to distribute the heat dissipation medium to multiple groups of flow-disturbing components;

[0041] In an exemplary embodiment, the liquid distributor 201 can be a tubular liquid distributor 201: the tubular liquid distributor 201 directs the heat dissipation medium from the pipeline between the controller and the TANK container 200 to the corresponding flow-disrupting components. The tubular liquid distributor 201 can be made of metal or plastic and have a series of pipes and connectors to accurately distribute the heat dissipation medium to the corresponding flow-disrupting components.

[0042] The controller is also configured to obtain temperature data of the heat dissipated device, and when the temperature data is higher than the device frequency reduction threshold, pump heat dissipation medium to the spoiler component corresponding to the heat dissipated device through the spoiler pump 700, wherein the heat dissipated device is installed on the heat dissipated workpiece.

[0043] In an exemplary embodiment, each heat dissipation device is integrated with a temperature sensor during installation, and the heat dissipation device is installed in the heat dissipation workpiece. The heat dissipation workpiece can be a communication device such as a server, router, switch, BBU, etc., and the heat dissipation device can be a chip such as a CPU and GPU. By receiving the temperature collected by the temperature sensor, the controller can know the working temperature of the heat dissipation device corresponding to the temperature sensor. By comparing the received temperature data with the device frequency reduction threshold, the heat dissipation medium is pumped to the spoiler component corresponding to the heat dissipation device through the spoiler pump 700 to cool the heat dissipation workpiece.

[0044] In an exemplary embodiment, a plurality of temperature sensors are installed in the workpiece to be cooled, and each temperature sensor is placed near the position of the workpiece to be cooled, so as to collect temperature data of the workpiece to be cooled.

[0045] In an exemplary embodiment, a thermistor network is used to measure the temperatures of multiple heat dissipating components. The thermistor network connects multiple thermistors to a circuit board, with each thermistor connected to a heat dissipating component. The temperature of each heat dissipating component is determined by measuring the change in resistance of each thermistor. For example, a table is pre-established that correlates resistance values ​​with temperatures. The temperature corresponding to each resistance value is determined based on the table. Alternatively, the thermistor values ​​at known temperatures are pre-measured, and a calibration curve is generated based on the measurement results. The calibration curve represents a functional relationship between resistance value and temperature. The measured resistance values ​​are then used to determine the corresponding temperature based on the functional relationship.

[0046] In one embodiment, the spoiler assembly includes:

[0047] The flow-disturbing workpiece 205 is installed in the heat dissipation station and is configured to change the flow path of the heat dissipation medium around the heat dissipation device;

[0048] FIG4 is a structural block diagram of a spoiler component according to an embodiment of the present disclosure in which the spoiler workpiece is a spoiler. In one implementation, as shown in FIG3 and FIG4 , the spoiler workpiece 205 is at least one of the following: a spoiler tube, a spoiler.

[0049] In an exemplary embodiment, the spoiler tube can be a tapered tube, a reducer, etc. to increase the flow rate of the coolant. The diameter of the spoiler tube can be determined according to the power, position, and flow rate of the spoiler pump 700.

[0050] The spoiler can be one or more of the following: a straight plate spoiler, a corrugated spoiler, a columnar spoiler, and a mesh spoiler. A straight plate spoiler is a flat, plate-like structure installed between areas where the heat dissipation medium flows and is configured to guide the flow. It can change the speed and direction of the fluid, increase the contact area between the heat dissipation medium and the equipment or components, and improve heat transfer efficiency. A corrugated spoiler is a wavy structure used in areas where the heat dissipation medium flows. It increases the tortuosity and friction of the fluid path, thereby increasing heat transfer and dispersion, and improving heat transfer efficiency. A columnar spoiler is a cylindrical or rod-shaped structure installed in areas where the heat dissipation medium flows. It disperses the fluid flow, increases the heat transfer path and contact area, and improves heat transfer efficiency. A mesh spoiler is a spoiler with a grid-like structure installed in areas where the heat dissipation medium flows. It increases the turbulence and mixing of the fluid, thereby improving the efficiency and uniformity of heat transfer.

[0051] A branch pipe 204, one end of which is connected to the liquid distributor 201, and the other end of which is connected to the flow-disturbing workpiece 205;

[0052] In an exemplary embodiment, the branch pipe 204 can be made of either a hard or soft material. When the branch pipe 204 is made of a soft material, it can swing during the flow of the heat dissipation medium, thereby causing the flow-disrupting member 205 to swing. For example, when the flow-disrupting member 205 is a flow-disrupting tube, the swinging of the branch pipe 204 can cause the flow-disrupting tube to swing, thereby changing the orientation of the flow-disrupting tube outlet and, in turn, altering the flow path of the heat dissipation medium.

[0053] In one embodiment, the liquid dispenser 201 is provided with a plurality of pipeline interfaces 202 , and one end of the branch pipe 204 is connected to the liquid dispenser 201 via the pipeline interface 202 .

[0054] The branch electric valve 203 is installed on the branch pipe 204 and is configured to adjust the flow of the heat dissipation medium in the branch pipe 204 .

[0055] In an exemplary embodiment, the branch electric valve 203 can adopt one or more of the following: a rotary electric valve, a straight-moving electric valve, a pulse electric valve, and a regulating electric valve. Among them, the rotary electric valve drives the valve disc to rotate through an electric actuator to control the on-off and regulation of the medium. Different types of valves such as ball valves, butterfly valves, and plug valves can be used, which have the characteristics of fast response, precise control, and reliable closure. The straight-moving electric valve drives the valve stem to move linearly through an electric actuator to control the valve opening and medium flow. The straight-moving electric valve can adopt a gate valve, a stop valve, etc. The pulse electric valve generates a fast pulse action through an electric actuator to achieve the function of quickly opening and closing the valve. The regulating electric valve drives the valve disc through an electric actuator to make fine adjustments to achieve precise flow or pressure control. Regulating ball valves, regulating butterfly valves, etc. can be used.

[0056] In one embodiment, the device further comprises:

[0057] The inlet pressure sensor of the disturbance pump 700 is configured to obtain the inlet pressure value of the disturbance pump 700;

[0058] In an exemplary embodiment, the pressure sensor is electrically connected to the controller so as to send the collected data to the controller.

[0059] The controller is also configured to control the centralized cooling system 100 to supply cooling medium to the cooling pump 300 of the TANK container 200 when the temperature data is higher than the device frequency reduction threshold and the inlet pressure value is lower than the start threshold of the disturbance pump 700.

[0060] In an exemplary embodiment, the activation of the turbulence pump 700 requires a startup threshold to be met, which requires a startup time. Therefore, during the activation period of the turbulence pump 700, the centralized cooling system 100 is controlled to supply heat dissipation medium to the heat pump 300 of the tank container 200, effectively utilizing the cooling capacity of the centralized cooling system 100 and thus effectively dissipating heat for the workpiece being cooled.

[0061] In one embodiment, the centralized cooling system 100 includes:

[0062] The heat dissipation pump 300 is configured to provide circulation power for the heat dissipation medium, so that the heat dissipation medium circulates in the pipe assembly between the centralized heat dissipation system 100 and the TANK container 200;

[0063] The heat pump front pressure sensor 301 is configured to monitor the heat pump 300 inlet pressure and transmit the monitored data to the control system of the centralized heat dissipation system 100; wherein, the number of heat pump front pressure sensors 301 is set according to the number of heat pumps 300, so that one heat pump 300 is equipped with one heat pump front pressure sensor 301.

[0064] The heat pump outlet pressure sensor 302 is configured to monitor the outlet pressure of the heat pump 300 and transmit the monitored data to the control system of the centralized cooling system 100. The number of heat pump outlet pressure sensors 302 is set according to the number of heat pumps 300, so that each heat pump 300 is equipped with one heat pump outlet pressure sensor 302.

[0065] In one embodiment, the controller is further configured to:

[0066] When the temperature data is higher than the device frequency reduction threshold and the inlet pressure value is greater than or equal to the start threshold of the turbulence pump 700, the flow rate of the heat dissipation medium of the centralized heat dissipation system 100 is reduced, and the turbulence pump 700 is started to pump the heat dissipation medium for the turbulence component corresponding to the temperature sensor.

[0067] In an exemplary embodiment, when the turbulence pump 700 meets the startup threshold, the turbulence pump 700 can be used to dissipate heat for the workpiece being cooled, and the flow rate of the cooling medium of the centralized cooling system 100 can be reduced. While meeting the cooling requirements, the power consumption of the entire device can be effectively saved.

[0068] In one embodiment, the controller is further configured to:

[0069] The rotation speed of the disturbance pump 700 is obtained. When the rotation speed of the disturbance pump 700 reaches the rated rotation speed and the temperature data is higher than the device frequency reduction threshold, the flow rate of the heat dissipation medium of the centralized heat dissipation system 100 is increased.

[0070] In an exemplary embodiment, when the rotation speed of the spoiler pump 700 reaches the rated rotation speed, but the temperature data is still higher than the device frequency reduction threshold, it indicates that the heat dissipation capacity of the spoiler pump 700 is difficult to meet the current heat dissipation requirements. By increasing the flow rate of the heat dissipation medium of the centralized heat dissipation system 100, the spoiler pump 700 and the centralized heat dissipation system 100 can simultaneously dissipate heat for the workpiece to be cooled, thereby improving the heat dissipation efficiency.

[0071] In one embodiment, the controller is further configured to:

[0072] When the temperature data drops to within the first preset temperature range, the disturbance pump 700 is controlled to reduce its rotation speed.

[0073] In an exemplary embodiment, when the temperature data drops to within a first preset temperature range, it indicates that effective heat dissipation has been achieved for the heat dissipated device. The controller controls the rotation speed of the turbulence pump 700 to reduce power consumption. The maximum value of the first preset temperature range is less than the device frequency reduction threshold. The specific range can be set based on actual conditions.

[0074] In one embodiment, the controller is further configured to:

[0075] When the temperature data drops to within a second preset temperature range, the disturbance pump 700 is turned off, wherein the second preset temperature range is a temperature drop range handled by the centralized cooling system 100 .

[0076] In an exemplary embodiment, when the temperature data drops to within a second preset temperature range, it indicates that the centralized heat dissipation system 100 can be used to dissipate heat for the heat dissipated device. At this time, the centralized heat dissipation system 100 is used to dissipate heat alone, which can further reduce the power consumption of the device.

[0077] In one embodiment, the device also includes: a first electric bypass valve 400, which is arranged between the heat input pipe and the heat output pipe of the centralized heat dissipation system 100, and is configured to form a diversion branch between the heat input pipe and the heat output pipe when the speed of the heat pump 300 of the centralized heat dissipation system 100 is reduced to a first speed.

[0078] In an exemplary embodiment, as shown in FIG2 , when the centralized cooling system 100 is dissipating heat for a heat dissipation device, when the first electric bypass valve 400 is open, an additional flow path is created between the centralized cooling system 100 and the heat dissipation device. If the heat dissipation medium in the tank container 200 is saturated, the heat dissipation medium can be easily diverted back to the centralized cooling system 100 through the diversion branch of the first electric bypass valve 400 , or from the tank container 200 through the diversion branch back to the tank container 200 , thereby reducing the probability of the heat dissipation medium overflowing from the tank container 200.

[0079] In one embodiment, the device also includes: a second electric bypass valve 500, which is arranged between the disturbance flow input pipe and the disturbance flow output pipe of the disturbance flow pump 700, and is configured to form a diversion branch between the disturbance flow input pipe and the disturbance flow output pipe when the speed of the disturbance flow pump 700 is reduced to a second speed.

[0080] In an exemplary embodiment, as shown in FIG2 , the second electric bypass valve 500 is disposed between the turbulence input and output pipes of the turbulence pump 700. When the second electric bypass valve 500 is open, an additional flow path is created between the turbulence pump 700 and the heat dissipation device. If the heat dissipation medium in the tank container 200 becomes saturated, the heat dissipation medium can be easily diverted back to the turbulence pump 700 through the diversion branch of the second electric bypass valve 500, or back into the tank container 200 through the diversion branch, thereby reducing the probability of the heat dissipation medium overflowing from the tank container 200.

[0081] In one embodiment, the device further includes: a heat dissipation return liquid pressure sensor 303 , a heat dissipation return liquid temperature sensor 304 , a heat dissipation supply liquid pressure sensor 305 , a heat dissipation supply liquid flow sensor 306 , and a heat dissipation supply liquid temperature sensor 307 .

[0082] The heat dissipation return liquid pressure sensor 303 and the heat dissipation return liquid temperature sensor 304 are both installed in the heat dissipation pipeline assembly 900 of the return liquid pipeline between the centralized cooling system 100 and the tank container 200. They are respectively configured to monitor the pressure and temperature of the heat dissipation medium flowing from the tank container 200 to the centralized cooling system 100, and transmit the pressure and temperature data to the controller. The heat dissipation supply liquid pressure sensor 305, the heat dissipation supply liquid flow sensor 306, and the heat dissipation supply liquid temperature sensor 307 are all installed in the heat dissipation pipeline assembly 900 of the supply liquid pipeline between the centralized cooling system 100 and the tank container 200. They are respectively configured to detect the pressure, flow, and temperature of the heat dissipation medium flowing from the centralized cooling system 100 to the tank container 200, and transmit the pressure, flow, and temperature data to the controller.

[0083] In one embodiment, the device further includes: a turbulent flow supply liquid pressure sensor 308 , a turbulent flow supply liquid temperature sensor 309 , and a turbulent flow supply liquid flow sensor 310 .

[0084] Among them, the turbulent liquid supply pressure sensor 308, the turbulent liquid supply temperature sensor 309, and the turbulent liquid supply flow sensor 310 are all installed in the turbulent pipeline assembly of the liquid supply pipeline between the turbulent pump 700 and the TANK container 200, and are configured to monitor the pressure, temperature, and flow of the heat dissipation medium flowing from the turbulent pump 700 to the TANK container 200, and transmit the pressure data, temperature data, and flow data to the controller.

[0085] In one embodiment, the device further includes a pre-turbulence pump pressure sensor 311. The pre-turbulence pump pressure sensor 311 is installed in the turbulence pipeline assembly of the return liquid pipeline between the turbulence pump 700 and the TANK container 200, and is configured to monitor the pressure at the inlet of the turbulence pump 700 and transmit the pressure at the inlet of the turbulence pump 700 to the controller to monitor and control the working state of the turbulence pump 700.

[0086] In one embodiment, the device further includes a pre-drift pump electric valve 600. This valve is installed at the connection between the spoiler pump 700 and the heat dissipation medium supply system and is configured to control the flow rate of the heat dissipation medium provided by the heat dissipation medium supply system to the heat dissipation medium. The heat dissipation medium supply system can employ a conventional system and is not described in detail in this disclosure.

[0087] In one embodiment, the device further includes an inner cavity temperature sensor 312 configured to measure the temperature of the heat dissipation medium in the plurality of TANK containers 200 and output the temperature result and the number of the TANK container 200;

[0088] In an exemplary embodiment, in order to measure the temperature of the heat dissipation medium in the TANK container 200, the following installation methods can be used:

[0089] Insertion sensor: The temperature sensor is inserted into the tank container 200. The sensor is mounted on the wall or top of the tank container 200 using a hole or flange connector, and directly contacts the heat dissipation medium to measure the temperature.

[0090] Surface-mounted sensor: The temperature sensor is attached to the outer surface of the tank container 200. The sensor can be fixed to the container surface by adhesive or magnetism to measure the temperature of the outer wall in real time.

[0091] Sensing through thermal conductive materials: Use thermal conductive materials, such as thermal film or thermal patch, to directly contact the temperature sensor with the TANK container 200. The thermal conductive material can help the sensor sense the temperature change of the heat dissipation medium more quickly and transfer heat from the heat dissipation medium to the sensor.

[0092] Inlet / outlet pipe installation: Install a temperature sensor on the inlet or outlet pipe of the heat dissipation medium to measure the temperature of the heat dissipation medium entering or leaving the TANK container 200. This can provide monitoring of instantaneous temperature changes of the heat dissipation medium.

[0093] Each temperature sensor is provided with an IP address, and the number of the corresponding TANK container 200 can be obtained by identifying the IP address of the temperature sensor.

[0094] In one embodiment, the apparatus further includes a purification module 800. The purification module 800 is installed in the turbulent flow pipeline assembly of the return liquid pipeline between the turbulent flow pump 700 and the TANK container 200 and is configured to purify the heat dissipation medium flowing from the turbulent flow pump 700 to the TANK container 200. For example, it removes acid and water to ensure that the heat dissipation medium is clean and can effectively transfer heat.

[0095] In an exemplary embodiment, the purification module 800 includes:

[0096] Filter: The filter is a core component of the purification module 800 and can be composed of a filter element or filter screen. Its primary function is to prevent solid impurities (such as sediment, particles, and grains) from entering the liquid cooling system, maintaining the cleanliness of the cooling medium. The filter selection should be determined based on the requirements of the liquid cooling system and the characteristics of the cooling medium.

[0097] Activated carbon filter: This purification module 800 can be equipped with an activated carbon filter to adsorb and remove organic matter, gases, or other contaminants from the liquid cooling medium. Activated carbon has a large surface area and adsorption capacity, effectively purifying the cooling medium and improving system efficiency and stability.

[0098] Valves and pipes: Valves and pipes in the purification module 800 are configured to control and direct the flow of the liquid cooling medium. They are configured to adjust the supply speed and flow rate of the heat dissipation medium in the liquid cooling system to meet actual operating requirements.

[0099] Container and Integration: The purification module 800 may include a container or integrated device configured to house the filter and other components. The container is sealed to prevent foreign matter from entering the liquid cooling system. The integrated device combines multiple purification modules 800 to form a complete liquid cooling medium purification system.

[0100] The foregoing description is merely a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. Those skilled in the art will readily appreciate that various modifications and variations of the present disclosure are possible. Any modifications, equivalent substitutions, or improvements made within the principles of the present disclosure shall be included within the scope of protection of the present disclosure.

Claims

1. A liquid replenishment and heat dissipation device for an immersion liquid cooling system, comprising: Multiple TANK containers, configured to place the workpieces to be cooled; A liquid level sensor, configured to measure the liquid level of the heat dissipation medium in the multiple TANK containers, and output the liquid level result and the number of the TANK container; A turbulent flow pump, configured to pump the heat dissipation medium for the multiple TANK containers; A controller, configured to replenish the heat dissipation medium for the TANK container corresponding to the number of the TANK container through the turbulent flow pump based on the liquid level result and the number of the TANK container.

2. The device according to claim 1, wherein It further includes: Multiple groups of turbulent flow components, arranged in the TANK container. Among them, at least one heat dissipation station for placing the workpieces to be cooled is arranged in each TANK container, and the turbulent flow component corresponds to the heat dissipation station; A distributor, configured to distribute the heat dissipation medium to the multiple groups of turbulent flow components; The controller is further configured to: obtain the temperature data of the device to be cooled, and when the temperature data is higher than the device downclocking threshold, pump the heat dissipation medium for the turbulent flow component corresponding to the device to be cooled through the turbulent flow pump, wherein the device to be cooled is installed on the workpiece to be cooled.

3. The apparatus according to claim 2, wherein, The turbulent flow component includes: A turbulent flow workpiece, installed at the heat dissipation station, configured to change the flow path of the heat dissipation medium around the device to be cooled; A branch pipe fitting, one end of which is connected to the distributor, and the other end is connected to the turbulent flow workpiece; A branch electric valve, installed on the branch pipe fitting, configured to adjust the flow rate of the heat dissipation medium in the branch pipe fitting.

4. The apparatus according to claim 2, wherein, It further includes: A turbulent flow pump inlet pressure sensor, configured to obtain the inlet pressure value of the turbulent flow pump; The controller is further configured to: when the temperature data is higher than the device downclocking threshold and when the inlet pressure value is less than the start threshold of the turbulent flow pump, control the centralized heat dissipation system to pump the heat dissipation medium for the TANK container heat dissipation.

5. The device according to claim 4, wherein The controller is further configured to: When the temperature data is higher than the device downclocking threshold and when the inlet pressure value is greater than or equal to the start threshold of the turbulent flow pump, reduce the flow rate of the heat dissipation medium of the centralized heat dissipation system, and start the turbulent flow pump to pump the heat dissipation medium for the turbulent flow component corresponding to the device to be cooled.

6. The device according to claim 5, wherein, The controller is further configured to: Obtain the rotation speed of the turbulent flow pump. When the rotation speed of the turbulent flow pump reaches the rated rotation speed and the temperature data is higher than the device downclocking threshold, increase the flow rate of the heat dissipation medium of the centralized heat dissipation system.

7. The apparatus according to claim 6, wherein, The controller is further configured to: When the temperature data drops to the first preset temperature range, control the turbulent flow pump to reduce the rotation speed.

8. The apparatus according to claim 7, wherein, The controller is further configured to: When the temperature data drops to the second preset temperature range, turn off the turbulent flow pump, wherein the second preset temperature range is the temperature reduction range processed by the centralized heat dissipation system.

9. The apparatus according to claim 1, wherein, It further includes: A first electric bypass valve, arranged between the heat dissipation input pipeline and the heat dissipation output pipeline of the centralized heat dissipation system, configured to form a shunt branch between the heat dissipation input pipeline and the heat dissipation output pipeline when the rotation speed of the heat dissipation pump of the centralized heat dissipation system drops to the first rotation speed.

10. The device according to claim 1, wherein, Further comprising: A second electric bypass valve, disposed between the turbulent flow input pipeline and the turbulent flow output pipeline of the turbulent flow pump, and configured to form a diversion branch between the turbulent flow input pipeline and the turbulent flow output pipeline when the rotational speed of the turbulent flow pump is reduced to a second rotational speed.

11. The apparatus according to claim 3, wherein, The turbulent flow workpiece is at least one of the following: a turbulent flow pipe, a turbulent flow plate.

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