Light-emitting device

Abstract

The present invention relates to a light-emitting device, which comprises a circuit substrate and a light-emitting unit provided on the front surface of the circuit substrate; the light-emitting unit comprises a LED light source which is provided on the front surface of the circuit substrate and is electrically connected to a corresponding bonding pad on the front surface of the circuit substrate, and a packaging lens which is provided on the front surface of the circuit substrate and encloses the LED light source. The LED light source has a bottom surface, a top surface and a side surface, the bottom surface being close to the front surface of the circuit substrate, the top surface being far away from the front surface of the circuit substrate and serving as a top light-emitting surface, and the side surface being located between the bottom surface and the top surface and serving as a side light-emitting surface. The packaging lens has a rounded light-emitting surface so as to adjust the output light pattern of the light-emitting unit, the top of the packaging lens being a convex surface or a concave surface. The present invention aims to improve the light effect of display backlight sources or lighting apparatuses.

Description

A light-emitting device Technical Field

[0001] The present invention relates to the field of semiconductor light-emitting devices, and in particular to a light-emitting device. Background Art

[0002] Light Emitting Diode (LED) is a semiconductor light-emitting device widely used in lighting, display and other fields as an LED light source. Its light-emitting component is a light-emitting chip containing a PN junction. By applying voltage to the electrodes of the light-emitting chip, the electrons and holes in it recombine and radiate energy, thereby emitting visible light.

[0003] In the existing technology, LEDs are usually made into packages, which can also be called LED surface mount devices. When used, they are mounted and soldered on PCB (Printed Circuit Board). Improving the connection reliability between LED devices and PCB boards and improving the lighting efficiency are the directions of technological advancement. Summary of the Invention

[0004] The present application provides a light-emitting device, which aims to improve the connection reliability or light efficiency of an LED light source. The light-emitting device provided in the present application includes a circuit substrate and a light-emitting unit provided on the front of the circuit substrate; the light-emitting unit includes an LED light source provided on the front of the circuit substrate and electrically connected to the corresponding pads on the front of the circuit substrate, and a packaging lens provided on the front of the circuit substrate to cover the LED light source; the LED light source has a bottom surface, a top surface and side surfaces, the bottom surface is close to the front of the circuit substrate, the top surface is away from the front of the circuit substrate as a top light-emitting surface, and the side surface is located between the bottom surface and the top surface as a side light-emitting surface, the packaging lens has an arc-shaped light-emitting surface to adjust the light-emitting light pattern of the light-emitting unit; the top of the packaging lens is convex or concave.

[0005] In some embodiments, a ratio of a first maximum distance H1 between the light-emitting surface of the packaging lens and the front surface of the circuit substrate to a second maximum distance H2 between the top light-emitting surface of the LED light source and the front surface of the circuit substrate is 1.5 to 10, and a ratio of a first maximum width W1 of the packaging lens to H1 is 0.75 to 5.3.

[0006] In some embodiments, the light-emitting device further includes a filling layer, which at least fills the gap between the bottom surface of the LED light source and the circuit substrate, and is bonded to at least the bottom surface and side surface of the LED light source; the packaging lens covers the filling layer and the LED light source; the material of the filling layer is a first adhesive material, and the material of the packaging lens is a second adhesive material different from the first adhesive material, wherein the hardness of the first adhesive material is less than or equal to the hardness of the second adhesive material.

[0007] At least some of the solutions provided in this application can improve the connection reliability or lighting efficiency of LED light sources. The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] FIG1 is a schematic structural diagram of a light emitting device provided in Embodiment 1 of the present invention;

[0009] FIG2-1 is a schematic structural diagram of a light-emitting device provided in Embodiment 1 of the present invention;

[0010] FIG2-2 is a schematic structural diagram of a light-emitting device provided in Embodiment 1 of the present invention;

[0011] 2-3 is a schematic structural diagram of a light emitting device provided in Example 1 of the present invention;

[0012] FIG3 is a schematic structural diagram of a light emitting device provided in Embodiment 1 of the present invention;

[0013] FIG4 is a schematic structural diagram of a light emitting device provided in Embodiment 1 of the present invention;

[0014] FIG5 is a schematic structural diagram of a light emitting device provided in Embodiment 1 of the present invention;

[0015] FIG6 is a schematic structural diagram of a light emitting device provided in Embodiment 1 of the present invention;

[0016] FIG7-1 is a schematic diagram of a light pattern of the light emitting device shown in FIG6 ;

[0017] FIG7-2 is a second schematic diagram of a light pattern of the light-emitting device shown in FIG6 ;

[0018] FIG8 is a schematic structural diagram of a light emitting device provided in Embodiment 1 of the present invention;

[0019] FIG9 is a schematic structural diagram of a light emitting device provided in Embodiment 1 of the present invention;

[0020] FIG10-1 is a schematic diagram of a light pattern of the light emitting device shown in FIG9 ;

[0021] FIG10-2 is a second schematic diagram of a light pattern of the light emitting device shown in FIG9 ;

[0022] FIG11 is a schematic structural diagram of a light emitting device provided in Embodiment 1 of the present invention;

[0023] FIG12-1 is a schematic diagram of a light pattern of the light emitting device shown in FIG11 ;

[0024] FIG12-2 is a second schematic diagram of a light pattern of the light-emitting device shown in FIG11 ;

[0025] FIG13 is a schematic structural diagram of a light emitting device provided in Embodiment 1 of the present invention;

[0026] FIG14-1 is a schematic structural diagram of a light emitting device provided in Embodiment 1 of the present invention;

[0027] FIG14-2 is a schematic diagram of the conductive gasket structure of the light-emitting device shown in FIG14-1;

[0028] FIG15 is a schematic structural diagram of a light emitting device provided in Embodiment 1 of the present invention;

[0029] FIG16-1 is a schematic structural diagram of a light emitting device provided in Embodiment 1 of the present invention;

[0030] FIG16-2 is a schematic diagram of the circuit substrate structure of the light-emitting device shown in FIG16-1;

[0031] FIG17-1 is a schematic structural diagram of a light emitting device provided in Embodiment 1 of the present invention;

[0032] FIG17-2 is a schematic diagram of the circuit substrate structure of the light-emitting device shown in FIG17-1;

[0033] FIG18 is a schematic structural diagram of a light emitting device provided in Embodiment 1 of the present invention;

[0034] FIG19 is a schematic structural diagram of a light emitting device provided in Embodiment 2 of the present invention;

[0035] FIG20 is a schematic structural diagram of a light-emitting device provided in Embodiment 2 of the present invention;

[0036] FIG21 is a schematic structural diagram of a light emitting device provided in Embodiment 2 of the present invention;

[0037] FIG22 is a schematic structural diagram of a light emitting device provided in Embodiment 2 of the present invention;

[0038] FIG23 is a schematic structural diagram of a light emitting device provided in Embodiment 2 of the present invention;

[0039] FIG24 is a schematic diagram of the basic process of a method for manufacturing a light-emitting device according to a second embodiment of the present invention;

[0040] FIG25 is a first structural diagram of a light emitting device provided in Example 1 of the present invention;

[0041] FIG26 is a schematic structural diagram of a light emitting device in the related art;

[0042] FIG27 is a schematic structural diagram of a light emitting device provided in Example 1 of the present invention;

[0043] FIG28 is a schematic structural diagram of a light emitting device provided in Example 1 of the present invention;

[0044] FIG29 is a schematic structural diagram of a light emitting device provided in Example 1 of the present invention;

[0045] FIG30 is a schematic structural diagram of the light-emitting device provided in Example 1 of the present invention. DETAILED DESCRIPTION

[0046] To facilitate understanding of the present application, a more comprehensive description of the present application will be provided below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of the present application. Those skilled in the art will recognize that various changes, combinations, or adjustments may be made to the various embodiments of the present invention without departing from the scope and spirit of the present invention.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The phrases such as "in one embodiment" or "some embodiments" in this specification are not limited to specific or identical embodiments.

[0048] Example 1

[0049] This embodiment provides a light-emitting device with a batwing-like light distribution characteristic, which can suppress the light intensity directly above and increase the light intensity at the sides, thereby expanding the light output angle and reducing problems such as uneven brightness. This can improve the lighting effect of lighting equipment and display screens made using this light-emitting device.

[0050] This embodiment provides a light-emitting device, which appropriately raises the height of the top light-emitting surface of the LED light source above the circuit substrate and uses a packaging lens of specific height and width to enable the light-emitting device to have a batwing-like light distribution characteristic.

[0051] As shown in Figure 1, the light-emitting device provided in this embodiment includes a circuit substrate 1 and a light-emitting unit arranged on the front side of the circuit substrate 1, the light-emitting unit includes an LED light source 2 arranged on the front side of the circuit substrate 1 and electrically connected to the corresponding pad on the front side of the circuit substrate 1, and a packaging lens 3 arranged on the front side of the circuit substrate 1 to cover the LED light source 2, wherein the LED light source 2 has a bottom surface, a top surface and a side surface, the bottom surface is close to the circuit substrate 1, the top surface is away from the front side of the circuit substrate 1 as the top light-emitting surface, and the side surface is located between the bottom surface and the top surface as the side light-emitting surface.

[0052] The LED light source 2 in this embodiment can emit light from both the top and side surfaces. If the LED light source 2 is in the shape of a cube or a rectangular parallelepiped, the LED light source 2 is a five-sided light source. If the LED light source 2 is in the shape of a cylinder, the LED light source 2 emits light from both the side and top surfaces of the cylinder. The LED light source 2 in this embodiment emits light from multiple surfaces, including the side and top surfaces. Compared to the prior art light sources that emit light only from the top surface, the light extraction efficiency and utilization rate are higher. The difference in light intensity between the top and side surfaces can be minimized from the source of the LED light source 2, which helps the light-emitting unit achieve a batwing-like light distribution characteristic.

[0053] In this embodiment, the light-emitting surface of the packaging lens 3 is a curved surface C. The maximum distance between the light-emitting surface of the packaging lens 3 and the front surface of the circuit substrate 1 is set as a first maximum distance H1, and the maximum distance between the top light-emitting surface of the LED light source 2 and the front surface of the circuit substrate 1 is set as a second maximum distance H2. The ratio of H1 to H2 is set to 1.5 to 10 (inclusive), and the maximum width of the packaging lens 3 is set to the first maximum width W1, so that the ratio of W1 to H1 is 0.75 to 5.3 (inclusive).

[0054] In this embodiment, the value range of H1 can be set to, but not limited to, 1.5 mm to 4.0 mm. In other embodiments, the value range of H1 can also be 1.5 mm to 2.0 mm, or 2.0 mm to 2.5 mm, or 2.5 mm to 3.0 mm, or 3.0 mm to 4.0 mm, or 1.5 mm to 3.5 mm, or 3.5 mm to 4 mm, or 1.5 mm to 2.5 mm, or 2.5 mm to 4.0 mm, etc.

[0055] In this embodiment, the value range of H2 can be set to 0.4mm~1.0mm. In other embodiments, the value range of H1 can also be 0.4mm~0.5mm, or 0.5mm~0.6mm, or 0.6mm~0.7mm, or 0.7mm~0.8mm, or 0.8mm~0.9mm, or 0.9mm~1.0mm, or 0.4mm~0.8mm, or 0.5mm~0.8mm, or 0.7mm~1.0mm, or 0.8mm~0.10mm, or 0.4mm~0.6mm, or 0.5mm~0.7mm, or 0.6mm~1.0mm, etc.

[0056] In this embodiment, the value range of W1 can be set to, but not limited to, 3.0 mm to 8.0 mm. In other embodiments, the value range of W1 can also be 3.0 mm to 4.0 mm, or 4.0 mm to 5.0 mm, or 5.0 mm to 6.0 mm, or 6.0 mm to 7.0 mm, or 7.0 mm to 8.0 mm, or 3.0 mm to 6.0 mm, or 3.5 mm to 6.5 mm, or 5.0 mm to 8.0 mm, or 3.0 mm to 5.0 mm, or 5.0 mm to 7.0 mm, or 6.0 mm to 8.0 mm, etc.

[0057] In this embodiment, the ratio of H1 to H2 can be set to a range of 1.5 to 10. In other embodiments, the ratio of H1 to H2 can also be set to a range of 1.5 to 3.0, or 1.5 to 2.0, or 1.5 to 3.5, or 2.0 to 3.0, or 2.0 to 3.5, or 3.0 to 5.0, or 5.0 to 7.0, or 7.0 to 8.5, or 8.5 to 10, 1.5 to 5.0, or 5.0 to 8.0, or 8.0 to 10, or 1.5 to 7.0, or 5.0 to 10, or 1.5 to 4.0, or 4.0 to 8.0, or 6.0 to 8.0, or 6.0 to 7.0, or 6.0 to 10.0, or 6.0 to 9.0, or 7.0 to 9.0, or 7.0 to 10.0, etc.

[0058] In this embodiment, the ratio of W1 to H1 can be set to a range of 0.75 to 5.3. In other embodiments, the ratio of W1 to H1 can also be set to a range of 0.75 to 1.0, or 0.75 to 1.5, or 0.75 to 1.8, or 0.75 to 2.0, or 1.0 to 1.5, or 1.0 to 2.0, or 1.0 to 2.5, or 2.5 to 5.0, or 5.0 to 5.3, or 4.0 to 5.3, or 2.0 to 5.3, or 0.75 to 1.5, or 1.5 to 3, or 3 to 5.3, etc.

[0059] In a preferred embodiment, H1 is 2.26 mm, H2 is 0.6 mm, and W1 is 5.5 mm. This combination can achieve better light distribution characteristics.

[0060] In this embodiment, the light-emitting surface of the packaging lens 3 is set to a curved surface, and the ratio of W1 to H1 is set to 0.75 to 5.3, so that the packaging lens 3 has a specific shape. At the same time, the ratio of H1 to H2 is set to 1.5 to 10, so that the top light-emitting surface and the side light-emitting surface of the LED light source 2 are located at appropriate positions in the packaging lens, and the incident angles of the top light-emitting surface and the side light-emitting surface entering the light-emitting surface of the packaging lens 3 are within a set range, so that this part of the light has a batwing-like light distribution characteristic after the light-emitting angle changes after passing through the packaging lens 3, that is, the light distribution curve diagram of the light-emitting unit is a batwing-like light distribution curve diagram, for example, see Figures 7-1 and 7-2.

[0061] The light emitting device of this embodiment can achieve batwing-like light distribution characteristics only through the specific cooperation between the LED light source 2 and the packaging lens 3. It has a very simple structure, low cost, simple production and good versatility.

[0062] It should be understood that the substrate material of the circuit substrate 1 in this embodiment can be, but is not limited to, ceramic, resin, or glass. The circuit substrate 1 can be a rigid substrate or a flexible substrate. For example, the circuit substrate 1 can be, but is not limited to, a rigid PCB or an FPC. In this embodiment, the pads on the front surface of the circuit substrate 1 can be electrically connected to the LED light source 2 by, but is not limited to, soldering or conductive adhesive bonding.

[0063] In this embodiment, the light-emitting unit further provides a reflective layer on the top light-emitting surface of the LED light source 2, and the reflective layer is configured to reflect a portion of the light emitted from the top light-emitting surface and allow a portion of the light emitted from the top light-emitting surface to pass through; in this optimization method, a portion of the light emitted from the top light-emitting surface of the LED light source 2 is reflected by the reflective layer, so that the reflected light is emitted from the side of the LED light source 2, thereby appropriately suppressing the light intensity of the top light-emitting surface of the LED light source 2, expanding the light emission angle of the LED light source 2, and further optimizing the batwing-shaped light distribution characteristics of the light-emitting unit.

[0064] Referring to the light-emitting device shown in FIG2-1 , the main difference between the light-emitting device shown in FIG1 and the light-emitting device is that it further includes a first light-reflecting layer 51 disposed on the top light-emitting surface of the LED light source 2. The first light-reflecting layer 51 is located between the LED light source 2 and the encapsulation lens 3 and covers the top light-emitting surface of the LED light source 2. The first light-reflecting layer 51 can fully cover the top light-emitting surface of the LED light source 2 or partially cover the top light-emitting surface centered on the center of the top light-emitting surface of the LED light source 2, as required.

[0065] Referring to the light-emitting device shown in FIG2-2 , the primary difference between this embodiment and the light-emitting device shown in FIG2-1 is that the reflective layer in this embodiment includes a second reflective layer 52 located on the light-emitting surface of the encapsulating lens 3 and corresponding to the position of the top light-emitting surface of the LED light source 2. The projection of the second reflective layer 52 onto the top light-emitting surface of the LED light source 2 can, as desired, fully cover the top light-emitting surface of the LED light source 2, or can partially cover the top light-emitting surface centered on the center of the top light-emitting surface of the LED light source 2. In one embodiment, the light-emitting device can include both the first reflective layer 51 and the second reflective layer 52, as shown in FIG2-3 .

[0066] In this example, the first and second reflective layers 51 and 52 contain light-transmitting particles, such as hollow glass microspheres. Glass microspheres reflect and refract light, so that light directly above the lamp bead is reflected and refracted by the light-transmitting particles to the areas on both sides, thereby increasing the light intensity on both sides of the LED light source 2 while allowing some light to be emitted from the top light-emitting surface of the LED light source 2. This is suitable for certain scenarios where the light intensity on the top light-emitting surface of the LED light source 2 must not be too weak. The light-transmitting particles can also be other transparent or translucent particles.

[0067] In other examples, the first and second light-reflecting layers 51 and 52 may include opaque reflective particles, such as titanium dioxide or barium sulfate particles. The first and second light-reflecting layers 51 and 52 may also include a mixture of opaque reflective particles and translucent particles, such as a mixture of titanium dioxide particles and glass microspheres, or a mixture of barium sulfate particles and glass microspheres, or a mixture of titanium dioxide and barium sulfate particles and glass microspheres. Titanium dioxide or barium sulfate particles reflect light better than glass microspheres. If the first and second light-reflecting layers 51 and 52 only include titanium dioxide or barium sulfate particles, or a mixture of the two, they block light more effectively from the top light-emitting surface of the LED light source 2. This is more suitable for scenarios where the light on both sides of the LED light source 2 is required to be stronger and the light in the middle is weaker (because there may still be some gaps between the particles, some light may still be emitted from the top light-emitting surface of the LED light source 2). If the first light reflecting layer 51 or the second light reflecting layer 52 contains a mixture of titanium dioxide or barium sulfate particles and glass beads, or contains a mixture of titanium dioxide and barium sulfate particles and glass beads, the proportion of the glass beads can play a role in adjusting the light intensity of the top light emitting surface of the LED light source 2. The higher the proportion of the glass beads in the first light reflecting layer 51 or the second light reflecting layer 52, the stronger the light intensity of the top light emitting surface of the LED light source 2. By adjusting the proportion of the glass beads in the first light reflecting layer 51 or the second light reflecting layer 52, the light intensity of the top light emitting surface of the LED light source 2 can be adjusted.

[0068] Example 2

[0069] As shown in Figure 3 , the light-emitting surface of the encapsulating lens 3, in an area corresponding to the top light-emitting surface of the LED light source 2, has a recess 31 that is concave inward toward the top light-emitting surface. The surface of recess 31 is a curved surface D. Recess 31 forms a similar concave lens, which increases the angle of incidence of light emitted from the top light-emitting surface of the LED light source 2. By utilizing the tendency for light to undergo total internal reflection when passing from a denser medium to a less dense medium (air), this portion of light is redirected, expanding the light-emitting angle of the LED light source 2 and appropriately suppressing the light intensity at the top light-emitting surface of the LED light source 2. This further optimizes the batwing-shaped light distribution characteristics of the light-emitting unit.

[0070] Optionally, in this embodiment, the ratio of the second maximum width W2 of the recess 31 to the maximum depth H3 of the recess 31 can be set to 0.62 to 50 (inclusive), combined with the specific ratios of H1, H2, and W1, to maximize the batwing-like light distribution characteristics of the light-emitting unit. For example, W2 can be set to 0.5 mm to 2.5 mm (inclusive), and H3 can be set to 0.05 mm to 0.8 mm (inclusive).

[0071] In this embodiment, the value range of W2 can be set to 0.5mm-2.5mm. In other embodiments, the value range of the second maximum width W2 can also be 0.5mm-0.8mm, or 0.8mm-1.0mm, or 1.0mm-1.2mm, or 1.2mm-1.4mm, or 1.4mm-1.6mm, or 1.6mm-1.8mm, or 1.8mm-2.0mm, or 2.0mm-2.4mm, or 0.5mm-1.0mm, or 1.0mm-2.0mm, or 2.0mm-2.5mm, etc.

[0072] In this embodiment, the value range of H3 can be set to 0.05mm-0.8mm. In other embodiments, the value range of H3 can also be 0.05mm-0.1mm, or 0.15mm-0.2mm, or 0.25mm-0.3mm, or 0.35mm-0.4mm, or 0.45mm-0.5mm, or 0.5mm-0.6mm, or 0.6mm-0.7mm, or 0.7mm-0.8mm, or 0.05mm-0.2mm, or 0.2mm-0.4mm, or 0.4mm-0.8mm, or 0.6mm-0.8mm, or 0.4mm-0.6mm, etc.

[0073] In this embodiment, the ratio of W2 to H3 may range from 0.62 to 50. In other embodiments, the ratio of W2 to H3 may range from 0.62 to 10, or 10 to 20, or 20 to 30, or 30 to 40, or 40 to 50, or 10 to 40, or 45 to 50, or 5.0 to 20, or 10 to 30, or 0.62 to 15, or 15 to 30, or 30 to 50, etc.

[0074] In a preferred embodiment, H3 is 0.4 mm and W2 is 4.8 mm. Such a combination can obtain better light distribution characteristics.

[0075] In a more preferred embodiment, H1 is 2.26 mm, H2 is 0.6 mm, W1 is 5.5 mm, H3 is 0.4 mm, and W2 is 4.8 mm. This combination can achieve better light distribution characteristics.

[0076] This embodiment further includes a first light-reflecting layer 51 disposed on the top light-emitting surface of the light-emitting element, as shown in FIG4 . The specific dimensions and shapes of the first light-reflecting layer 51 and the recess 31 can be adjusted according to specific application requirements. Furthermore, based on the examples shown in FIG3 and FIG4 , a second light-reflecting layer 52 can be disposed within the recess 31, but is not limited thereto.

[0077] Optionally, in this embodiment, the packaging lens 3 is a colloidal lens formed on the front of the circuit substrate 1 using a translucent colloid (various colloids that can form lenses can be used). The colloidal lens is tightly bonded to the front of the circuit substrate 1 and the surface of the LED light source 2, for example, as shown in Figures 1 to 4, thereby improving the reliability of the fixation of the packaging lens 3 and the airtightness of the combination of the packaging lens 3, the circuit substrate 1 and the LED light source 2, and preventing external water vapor from entering the interior of the packaging lens 3 and causing damage to the LED light source 2, thereby improving the overall reliability of the light-emitting device.

[0078] Of course, in this embodiment, the packaging lens 3 can also be pre-made, and then installed on the circuit substrate 1 and cover the LED light source 2 in various ways. At this time, the material of the packaging lens 3 can be but not limited to colloid, plastic or glass. For example, referring to the example shown in Figure 5, the packaging lens 3 at this time can be installed in conjunction with the circuit substrate 1 through the lens fixing foot 32. In this way, there is a gap between the packaging lens 3 and the LED light source 2, which is not conducive to improving the airtightness. However, it should be noted that this application does not exclude this method. This method has the advantages of mature technology and low cost. In certain application scenarios that meet the airtightness requirements, this method is also applicable. It also has the advantage of making the light distribution curve of the light-emitting unit tend to be similar to a batwing shape.

[0079] Example 3

[0080] Please refer to Figure 6, the LED light source 2 adopts an LED package 20 with light emitting from the top and side surfaces, and the LED package 20 includes an LED bracket 22 with light-transmitting sides and an LED chip 23. The bottom of the LED bracket 22 has a supporting substrate 21, wherein the supporting substrate 21 can be used as a component to lift the top light-emitting surface of the LED light source 2; the LED package 20 in this lifting method is directly welded or bonded to the corresponding pad on the front of the circuit substrate 1, so as to achieve the appropriate lifting of the height of the top light-emitting surface of the LED light source 2 on the circuit substrate 1; and it should be understood that the supporting substrate 21 can adopt the substrates of various LED brackets, and can also be thickened according to needs, which will not be repeated here.

[0081] In this example, the LED bracket 22 is a bowl-shaped cup 22 with light-transmitting sides. The bracket material can be transparent or translucent SMC, EMC, PCT, etc. In this example, the supporting substrate 21 is preferably a light-transmitting substrate so that some light can be emitted from the bottom of the LED light source 2 to improve light utilization.

[0082] The bowl cup 22 is arranged on the supporting substrate 21, and the LED chip 23 (which can be one or more than two, and the colors of more than two can be the same or different, and can be flexibly set according to needs) is located at the bottom of the bowl cup 22 and is arranged on the supporting substrate 21. The bowl cup 22 is filled with a sealing glue layer 24 to cover the LED chip 23. The sealing glue layer 24 can be tightly bonded to the inner wall of the bowl cup 22 and the surface of the LED chip 23, thereby improving the airtightness.

[0083] In this example, the top and side surfaces of the LED package serve as the top and side light-emitting surfaces of the LED light source 2. Of course, in this example, the LED chip 23 can be configured to emit light from both the side and top surfaces, further improving light-emitting efficiency and effectiveness. Alternatively, the LED chip 23 can be configured to emit light only from the top or side surfaces, depending on requirements. (This type of chip is a light-emitting chip with a DBR reflective layer, which reflects light directed toward the top surface to the side surfaces, achieving side-only light emission, and is commonly referred to in the industry as a DBR light-emitting chip.)

[0084] In this example, the encapsulating adhesive layer 24 may be a transparent adhesive layer. Optionally, in this example, a light color conversion material (including but not limited to phosphors and / or quantum dots) and / or a light diffusion material (such as silica particles) may be disposed within the encapsulating adhesive layer 24 according to specific application requirements. Optionally, to ensure that the stresses of the encapsulating adhesive layer 24 and the light-transmitting colloid are as close or consistent as possible, both may be made of a silicone-based adhesive layer to prevent cracking at the junction of the two after exposure to heat, thereby further improving reliability.

[0085] In this example, the glue forming the encapsulating adhesive layer 24 has a first refractive index n1, and the glue forming the transparent colloid of the lens 3 has a second refractive index n2, where n1 ≧ n2. Preferably, n1 and n2 are within the range of 1.43 (inclusive) to 1.58 (inclusive). For example, n1 can be 1.53 to 1.58, and n2 can be 1.43 to 1.53. By setting n1 ≧ n2, the diffusion angle of light entering the lens 3 from the encapsulating adhesive layer 24 does not shrink, and may even be further diffused to increase the amount of light emitted.

[0086] In this example, the LED package 20 is secured to the solder pads on the front of the circuit substrate 1 via a conductive connection layer 41. In this example, H2 is primarily determined by the thickness of the first conductive connection layer 41 (including the solder pads on the front of the circuit substrate 1 and the positive and negative electrode pins on the bottom of the LED package), the thickness of the support substrate 21, and the height of the bowl 22 (or the thickness of the sealing adhesive layer 24). Therefore, by flexibly adjusting the dimensions of at least one of these components, the top light-emitting surface can be raised to the height of H2. Existing LED package structures and processes can also be directly employed, resulting in high versatility and low cost.

[0087] The light pattern of the light-emitting device shown in Figure 6, as shown in Figures 7-1 and 7-2, is a typical batwing-like light pattern. Luminous intensity is highest near ±75°, with the center dimmer than the periphery. The light output angle is wide. When used in backlighting, this light pattern achieves better optical effects and higher pitch / OD values, with pitch / OD values ​​exceeding 3. This significantly reduces the number of light-emitting units, simplifies the structure, and reduces costs. In lighting applications, such as library or supermarket lighting, it helps distribute light to the shelves on both sides, rather than wasting most of the light on the bottom surface of the shelf in the middle, as with conventional Lambertian light patterns. In offices, schools, or hospitals, panel lights made with light-emitting devices with a batwing-like light pattern can provide highly uniform flat-field illumination, reducing or eliminating glare and promoting healthy lighting. When used in plant lighting, it also provides more uniform illumination. The wider illumination angle range also allows for greater spacing between lighting devices, reducing the number of lighting devices and lowering costs.

[0088] Optionally, in this embodiment, any one of the optimization methods 1 to 3 shown in the above embodiments may be used to optimize the light emitting device shown in FIG. 6 according to specific application requirements.

[0089] In one example, referring to the light-emitting device shown in FIG8 , a recess 31 is formed in the area of ​​the light-emitting surface of the packaging lens 3 corresponding to the top light-emitting surface of the LED package. The surface of the recess 31 is an arc surface, which can change the light-emitting direction of the light emitted from the top light-emitting surface of the LED package, expand the light-emitting angle of the LED package, appropriately suppress the light intensity of the top light-emitting surface of the LED lamp bead, and further optimize the batwing-shaped light distribution characteristics of the light-emitting unit.

[0090] In another example, referring to the light-emitting device shown in FIG9 , the top light-emitting surface of the LED package 20 is covered with a first light-reflecting layer 51. This layer reflects a portion of the light emitted from the top light-emitting surface, causing the reflected light to be emitted from the side of the LED lamp bead. This appropriately suppresses the light intensity of the top light-emitting surface of the LED package 20, expands the light output angle of the LED package, and further optimizes the batwing-shaped light distribution characteristics of the light-emitting unit. The light pattern of the light-emitting device shown in FIG9 is shown in FIG10-1 and FIG10-2 . Compared with the light pattern shown in FIG7-1 and FIG7-2 , the low-intensity area in the center is wider and has lower light intensity, while the light intensity in the areas on the sides is stronger.

[0091] Of course, it should be understood that in this embodiment, the light-emitting device shown in FIG6 can be optimized by using only any one of the examples of optimization method 1 shown in the above-mentioned embodiment 1, and no further description is given here. Moreover, the above-mentioned parameters and ratio values ​​​​of this embodiment are also applicable to other embodiments of the present application.

[0092] As another example, referring to FIG11 , a conductive gasket is provided between the bottom of the electrode of a general LED light-emitting device and the front surface of the circuit substrate 1, thereby achieving an appropriate elevation of the height of the top light-emitting surface of the LED light source 2 on the circuit substrate 1; the LED light-emitting device in this elevation method can adopt an LED chip that emits light from both the side and top surfaces or an LED package that emits light from both the side and top surfaces, such as a CSP (Chip Scale Package) LED package, an NCSP (Near Chip Scale Package) LED package, or at least one of other types of LED packages.

[0093] The LED light-emitting device used in this example is an LED chip 23. In other embodiments, the LED light-emitting device may also be replaced by a CSP LED package, an NCSP LED package, or other conventional LED packages.

[0094] In this example, the conductive gasket includes a first conductive gasket 251 and a second conductive gasket 252 that are insulated and isolated from each other. The first electrode and the second electrode of the LED chip 23 (i.e., the LED light-emitting device) are fixedly connected and electrically connected to the front surfaces of the first conductive gasket 251 and the second conductive gasket 252, respectively. The back surfaces of the first conductive gasket 251 and the second conductive gasket 252 are fixedly connected and electrically connected to the corresponding pads on the front surface of the circuit substrate 1. As shown in Figure 11, the back surfaces of the first conductive gasket 251 and the second conductive gasket 252 are fixed and electrically connected to the corresponding pads on the front surface of the circuit substrate 1 through the conductive connection layer 42, respectively. The first electrode and the second electrode of the LED chip 23 are fixed and electrically connected to the front surfaces of the first conductive gasket 251 and the second conductive gasket 252 through the conductive connection layer 43. In this example, light can be emitted from both the side and the top surfaces of the LED chip 23. In order to distinguish each other, the conductive connection layer 42 and the conductive connection layer 43 can be referred to as the first conductive layer 42 and the second conductive layer 43, respectively.

[0095] In the example shown in Figure 11, H2 is mainly determined by the thickness of the second conductive connection layer 42 (including the solder pad), the first conductive gasket 251, the second conductive gasket 252 and the thickness of the third conductive connection layer 43. Therefore, by flexibly setting the size of at least one of the above parts, the top light-emitting surface can be raised to the height of H2, and it can be achieved mainly by setting the first conductive gasket 251 and the second conductive gasket 252 of appropriate thickness on the basis of adopting the general LED chip 23 on the market (which can also be replaced by the general CSP LED package, NCSP LED package or other LED package on the market). It has a simple structure, good versatility and low cost.

[0096] The light pattern of the light-emitting device shown in Figure 11 is shown in Figures 12-1 and 12-2, which is also a typical bat-wing-shaped light pattern. The luminous intensity is highest near ±75°, the center is darker than the periphery, and the light output angle is large.

[0097] The LED chip 23 in this example and the LED package obtained based on the LED chip 23 can use but is not limited to Mini LED chips or Micro LED chips. Of course, other LED chips larger than the Mini LED chip can also be used according to needs.

[0098] Optionally, in this embodiment, any one of the optimization methods 1 to 3 shown in the above embodiments may be used to optimize the light-emitting device shown in FIG. 11 according to specific application requirements.

[0099] For example, see the light-emitting device shown in FIG13 , which is an example of optimization method 1. Based on the light-emitting device shown in FIG11 , the top light-emitting surface of the LED chip 23 is covered with a first light-reflecting layer 51 , which can reflect a portion of the light emitted from the top light-emitting surface so that the reflected light is emitted from the side of the LED chip 23 , thereby appropriately suppressing the light intensity of the top light-emitting surface of the LED chip 23 , expanding the light emission angle of the LED chip 23 , and further optimizing the batwing-shaped light distribution characteristics of the light-emitting unit. Of course, it should be understood that in this embodiment, any of the other examples of optimization method 1 shown in the above-mentioned embodiment 1, or optimization method 2 or optimization method 3, can also be used to optimize the light-emitting device shown in FIG11 , and they will not be described in detail here.

[0100] 14-1 to 14-2 , an example of a conductive gasket is shown, in which the conductive gasket includes an insulating support gasket 253, a first conductive gasket 251 and a second conductive gasket 252 are respectively embedded in the insulating support gasket 253, and the front and back surfaces of the first conductive gasket 251 and the second conductive gasket 252 are exposed on the insulating support gasket 253. In other words, the first conductive gasket 251 and the second conductive gasket 252 are arranged on the same insulating support gasket 253, and the insulating characteristics of the insulating support gasket 253 are utilized to achieve insulation isolation between the first conductive gasket 251 and the second conductive gasket 252, and to combine the first conductive gasket 25 and the second conductive gasket 252 together, thereby facilitating the subsequent fixation of the LED chip 23 and the fixation of the LED light source 2 on the circuit substrate 1.

[0101] In this application example, the insulating support spacer 253 can be opaque or can be configured as a translucent spacer as needed, thereby further improving light extraction efficiency and light extraction angle. The insulating support spacer 253 can be made of, but not limited to, resin, glass, etc., which is low-cost and easy to manufacture.

[0102] For example, see FIG15 , which illustrates a light-emitting device. Based on the light-emitting device shown in FIG14-1 , a recess 31 is formed on the light-emitting surface of encapsulating lens 3 in an area corresponding to the top light-emitting surface of LED chip 23. The surface of recess 31 is curved, and the top light-emitting surface of LED chip 23 is covered with a first light-reflecting layer 51. In this example, a portion of light emitted from this top light-emitting surface is reflected, causing the reflected light to be emitted from the side of LED chip 23. This appropriately suppresses the light intensity at the top light-emitting surface of LED chip 23, expands the light-emitting angle of LED chip 23, and further optimizes the batwing-shaped light distribution characteristics of the light-emitting unit.

[0103] In another example, the LED light source 2 can use a general-purpose LED light-emitting device currently available on the market. For example, the LED light-emitting device can use an LED chip that emits light from both the side and top surfaces, or an LED package that emits light from both the side and top surfaces, and then the area where the solder pad is set on the front of the circuit substrate 1 is appropriately raised.

[0104] As shown in Figures 16-1 to 16-2, the LED light source 2 can be an LED chip or an LED package, which includes any one or more of a CSP LED package, an NCSP LED package or other LED packages. The area on the front of the circuit substrate 1 where the solder pad 12 is provided is a convex portion 11 with a raised area, and the area on the front of the circuit board 1 outside the convex portion 11 is a flat area. Both solder pads 12 are provided on the convex portion 11 and are insulated from each other. In the example shown in Figure 16-1, H2 is mainly determined by the thickness of the convex portion 11 and the LED light source 2. Therefore, by flexibly setting the thickness of the convex portion 11, the top light-emitting surface of the LED light source 2 can be raised to the height of H2, and a general-purpose LED light source 2 on the market can be used, which has a simple structure, good versatility and low cost.

[0105] Another example of protrusion 11 is shown in Figures 17-1 and 17-2 . Protrusion 11 comprises two separate protrusions 13, with two solder pads 12 disposed on each protrusion 13. In this example, encapsulating lens 3 is formed on the front surface of circuit substrate 1 using a light-transmitting colloid. This provides a larger bonding area (with the front surface of circuit substrate 1 and the surface of protrusion 13), resulting in a more reliable connection and improved airtightness.

[0106] Optionally, in this embodiment, any one of the optimization methods 1 to 3 shown in the above embodiment 1 may be used to optimize the light-emitting device shown in FIG. 16-1 and / or FIG. 17-1 according to specific application requirements.

[0107] An example is the light-emitting device shown in Figure 18, in which a recess 31 is formed on the light-emitting surface of the encapsulation lens 3 in an area corresponding to the top light-emitting surface of the LED light source, and a reflective layer 51 is also covered on the top light-emitting surface of the LED light source 2. The reflective layer 51 can reflect a portion of the light emitted from the top light-emitting surface of the LED light source 2, so that the reflected light is emitted from the side of the LED light source 2, thereby appropriately suppressing the light intensity of the top light-emitting surface of the LED light source 2, expanding the light-emitting angle of the LED light source 2, and optimizing the batwing-shaped light distribution characteristics of the light-emitting unit.

[0108] In this embodiment, any of the above-mentioned lifting methods can achieve appropriate lifting of the height of the top light-emitting surface of the LED light source 2 on the circuit substrate 1. Various examples and embodiments can be combined according to usage requirements.

[0109] It should be understood that the method for appropriately raising the height of the top light-emitting surface of the LED light source 2 above the circuit substrate 1 in this embodiment is not limited to the above-described method. Regardless of the method employed, as long as the ratio of H1 to H2 is 1.5 to 10 and the ratio of W1 to H1 is 0.75 to 5.3, a batwing-like light distribution characteristic can be achieved solely through the aforementioned coordination of the LED light source 2 and the encapsulating lens 3.

[0110] Example 4

[0111] This embodiment provides a light-emitting device, as shown in Figures 19 to 23 . The light-emitting device includes, but is not limited to, a circuit substrate 1 and a light-emitting unit disposed on the circuit substrate 1. The light-emitting unit includes an LED light source 2 disposed on the circuit substrate 1, and an encapsulation lens 3 disposed on the front of the circuit substrate 1 and covering the LED light source. The LED light source 2 has a bottom surface, a top surface, and side surfaces. The bottom surface is close to the front of the circuit substrate 1, the top surface is away from the front of the circuit substrate 1 and serves as a top light-emitting surface, and the side surfaces are located between the bottom and top surfaces and serve as side light-emitting surfaces. The encapsulation lens 3 has a curved light-emitting surface to adjust the light output pattern of the light-emitting unit. The top of the encapsulation lens 3 is convex or concave.

[0112] The LED light source 2 in this embodiment can be an LED chip or an LED package. The following description will first be made using the LED chip 2 as an example.

[0113] In this embodiment, the light-emitting device also includes a filling layer 4. The electrode 26 of the LED chip 2 is electrically connected to the pad 12 on the circuit substrate 1; the LED chip 2 has a bottom surface, a top surface and a side surface, the bottom surface is close to the circuit substrate 1, and the top surface is away from the circuit substrate 1. The filling layer 4 fills the gap between the bottom surface and the circuit substrate 1, and is bonded to at least the bottom surface and the side surface of the LED chip 2; the encapsulation lens 3 tightly covers the filling layer 4 and the LED chip 2. Among them, the material of the filling layer 4 and the material of the encapsulation lens 3 are both adhesive materials. For the sake of distinction, in the embodiment of the present application, the material of the filling layer 4 is referred to as the first adhesive material, and the material of the encapsulation lens 3 is referred to as the second adhesive material. Among them, the first adhesive material and the second adhesive material are different.

[0114] The filling layer 4 is combined with the epitaxy and substrate of the LED chip 2, and the corners of the LED chip should avoid air gaps with the filling layer 4 as much as possible. The second adhesive is located at the outermost layer of the LED chip, and its shape needs to remain stable. It cannot be fully combined with the LED chip 2 and the circuit substrate 1 by, for example, pressurization. If the material of the encapsulation lens 3 is directly covered on the LED chip, it will be difficult to fill the gap between the circuit substrate 1 and the bottom surface of the LED chip 2, and bubbles may exist between the encapsulation lens 3 and the surface of the substrate or the LED chip. In this embodiment, the hardness of the first adhesive (the hardness of the adhesive described in this embodiment refers to the hardness after the adhesive is cured) is preferably less than or equal to the hardness of the second adhesive. When in use, the viscosity of the first adhesive is preferably lower than the viscosity of the second adhesive. The first adhesive is first used to combine with the LED chip. Since the first adhesive has low viscosity, good fluidity, and good wettability, it is more fully combined with the surface of the LED chip 2, avoiding contact between the second adhesive and the LED chip 2. Since the first adhesive has relatively better bonding with the LED chip 2, air gaps and cracks are not easy to occur. Since the filling layer 4 is located inside the light-emitting unit, there are no specific requirements for its shape. Therefore, the filling layer 4 can be fully bonded to the surface of the circuit substrate 1 and the surface of the LED chip 2 by, for example, applying pressure. As shown in FIG19 , the electrode 26 at the bottom of the LED chip 2 and at least some of the sharp corners of the epitaxial layer of the LED chip 2 can be blocked by the first adhesive. Due to the tension of the adhesive, the first adhesive itself does not produce sharp corners, preventing the second adhesive from directly contacting sharp corners, thereby improving the situation where the encapsulation lens 3 is prone to cracking. At the same time, the contact area between the second adhesive and the circuit substrate 1 is reduced, reducing the risk of delamination between the second adhesive and the circuit substrate 1. Furthermore, the encapsulation lens 4 using the second adhesive still serves as an outer layer component, ensuring the overall structural strength of the light-emitting unit. Thus, in the light-emitting device of this embodiment, the first adhesive is first fully bonded to the bottom and side surfaces of the LED chip 2 to form the filling layer 4, which is then combined with the encapsulation lens 3 formed by the second adhesive. This increases the reliability of the structure while still ensuring overall strength.

[0115] In a preferred embodiment, the hardness of the first adhesive material is smaller than the hardness of the second adhesive material.

[0116] In some embodiments, the hardness of the first adhesive is in the range of Shore A30 to Shore D40, for example, Shore A40, Shore A50, Shore A60, Shore D10, Shore D20, Shore D30, etc.; the hardness of the second adhesive is in the range of Shore D20 to Shore D50, for example, Shore D20, Shore D30, Shore D40, or Shore D50, etc. The first and second adhesives in the above hardness ranges can achieve a good balance between the stability and strength of the LED chip 2 package, thereby improving the reliability of the LED chip 2 package and extending the service life of the light-emitting device.

[0117] Optionally, in this embodiment, the contact angle between the filling layer 4 and the surfaces of the circuit substrate 1 and the LED chip 2 is less than 90°, and there is no gap between the filling layer 4 and the surfaces of the circuit substrate 1 and the LED chip 2. The contact angle is the angle from the interface of the circuit substrate 1 or the LED chip 2 through the interior of the filling layer 4 to the interface between the filling layer 4 and the encapsulation lens 3. A contact angle of less than 90° actually means that the first adhesive can wet the surfaces of the circuit substrate 1 and the LED chip 2 before curing, and the wetting angle (i.e., contact angle) of the liquid first adhesive with the circuit substrate 1 and the LED chip 2 is less than 90°.

[0118] Optionally, in this embodiment, the viscosity of the first adhesive before curing is lower than the viscosity of the second adhesive before curing. In some applications, the second adhesive is typically a higher viscosity adhesive for better molding. On this basis, the first adhesive directly bonded to the bottom and side surfaces of the LED chip 2 is a lower viscosity adhesive, which has better fluidity and is more likely to flow into and fill the gap between the bottom surface of the LED chip 2 and the circuit substrate 1 than the second adhesive. This prevents the formation of bubbles due to unexhausted gas between the bottom surface of the LED chip 2 and the circuit substrate 1, thereby enhancing the airtightness and the overall stability and lifespan of the light-emitting device.

[0119] Optionally, in this embodiment, the molecular diameter of the first adhesive is smaller than the molecular diameter of the second adhesive.

[0120] In some embodiments, the viscosity of the first adhesive before curing is in the range of 1000 to 5000 mPa·s, such as 1000 mPa·s, 2000 mPa·s, 3000 mPa·s, 4000 mPa·s, or 5000 mPa·s; the viscosity of the second adhesive before curing is in the range of 7000 to 12000 mPa·s, such as 7000 mPa·s, 8000 mPa·s, 9000 mPa·s, 10000 mPa·s, 11000 mPa·s, or 12000 mPa·s. Selecting the first and second adhesives within the above viscosity ranges ensures that the filling layer 4 and the encapsulated lens 3 can be easily processed into the desired shape while also ensuring airtightness and structural bonding stability.

[0121] As shown in Figure 19, in some implementations, a first adhesive with a lower viscosity can form a sloped sidewall 44 of the filling layer 4 on the side of the LED chip 2. This sidewall has a relatively flat surface and a larger surface area, making it easier to adhere to the second adhesive. The second adhesive with a higher viscosity can be easily formed into a lens shape, facilitating the formation of the encapsulated lens 3. It can be seen that in some implementations, using a first adhesive with a lower hardness and viscosity than the second adhesive to form the filling layer 4 can further improve the reliability of the LED chip 2 encapsulation and the lifespan of the light-emitting device. More specifically, the first adhesive forms a sidewall 44 on the surface of the LED chip 2 that slopes from a certain height from the side of the LED chip 2 toward the substrate, and whose thickness increases toward the side away from the LED chip 2. The outer contour of this sidewall 44 is a concave arc.

[0122] In some optional embodiments, the filling layer 4 does not cover the top surface of the LED chip 2, that is, it is only arranged on the side and bottom surfaces. The filling layer 4 can also be made of a light-transmitting material so that the LED chip 2 can emit light from the side area, reducing the optical impact of the filling layer 4 and having a higher light extraction efficiency. As an example, when the filling layer 4 does not cover the top surface of the LED chip 2, that is, it is only arranged on the side and bottom surfaces, the filling layer 4 can also contain light-reflecting materials or light-diffusing materials (such as silica particles or hollow glass beads, etc.). In another example, the filling layer 4 does not cover the top surface of the LED chip 2, that is, it is only arranged on the side and bottom surfaces. If the filling layer 4 contains light-reflecting material, the light emitted from the side of the LED chip 2 is reflected, which can make the light of the LED chip 2 concentrated on emitting only on the top surface to meet the light distribution requirements of some special application scenarios.

[0123] Optionally, in order to maximize the bonding between the encapsulation lens 3 and the LED chip 2, the filling layer 4 can be configured to completely cover the LED chip 2. As shown in FIG20 , the filling layer 4 completely wraps the surface of the LED chip 2, and the encapsulation lens 3 covers the filling layer 4 to cover the LED chip 2 and the filling layer 4. At this time, the encapsulation lens 3 is bonded to the filling layer 4 without contacting the LED chip 2. Since the surface of the LED chip 2 is coated with the softer first adhesive, the bonding between the two is better, and the filling layer 4 that completely covers the LED chip 2 further reduces the possibility of air gap formation; and the first adhesive and the second adhesive, which are both adhesives, can also be well bonded, and the overall airtightness is better. On the other hand, since the filling layer 4 completely covers the LED chip 2, even if the outer encapsulation lens 3 is cracked, damaged, or the like, resulting in failure of the protective performance, the filling layer 4 can still play a packaging and protective role to a certain extent, thereby improving the reliability of the light-emitting device.

[0124] It is understood that if the filling layer 4 covers the top surface of the LED chip 2, the filling layer 4 is light-transmissive. In this embodiment, the encapsulating lens 3 is also made of a light-transmissive material. Since light is emitted through the filling layer 4, in some implementations, some optical materials may also be disposed within the filling layer 4. For example, a light color conversion material (including but not limited to phosphors and / or quantum dots) and / or a light diffusion material (such as silica particles or hollow glass microspheres) may be disposed within the filling layer 4.

[0125] The encapsulating lens 3 has a curved light-emitting surface, thereby adjusting the light-emitting pattern of the light-emitting unit. This embodiment does not limit the shape of the encapsulating lens. For example, in the example of FIG. 19 , the encapsulating lens 3 can be formed into a hemispherical or nearly hemispherical shape, i.e., the top of the encapsulating lens 3 is convex. As another example, as shown in FIG. 21 , a recess 31 can be formed on the light-emitting surface of the encapsulating lens 3 in the area corresponding to the top surface of the LED chip 2, which is concave toward the top surface of the LED chip 2. The surface of the recess 31 can be curved, and the area outside the recess 31 can also be curved. The recess 31 forms a concave surface at the top of the encapsulating lens 3, which increases the angle of incidence of light emitted from the top surface of the LED chip 2 upon entering the recess 31. By utilizing the characteristic that light is easily totally reflected when it passes from a denser medium to a less dense medium (air), the direction of the light emitted by this portion of the light is changed, thereby expanding the light-emitting angle of the LED chip 2 and appropriately suppressing the light intensity in the area of ​​the top surface of the LED chip 2. In some implementations, the light-emitting unit can be optimized to form a light distribution curve similar to a batwing. In other embodiments, the packaging lens 3 may also be designed to have other shapes.

[0126] In some embodiments, the filling layer 4 is bonded to the surface of the circuit substrate 1, and the coverage area of ​​the encapsulation lens 3 (i.e., the projected area onto the surface of the circuit substrate 1) is larger than the coverage area of ​​the filling layer 4, and the encapsulation lens 3 is also bonded to the surface of the circuit substrate 1 around the filling layer 4. The filling layer 4 and the encapsulation lens 3 are directly bonded to the circuit substrate 1, which can enhance the bonding with the circuit substrate 1 and improve the airtightness of the package. Because the second adhesive material used for the encapsulation lens 3 is relatively hard and has a high viscosity, the stress after bonding to a larger area of ​​the circuit substrate 1 is relatively large. In this embodiment, under the same area covered by the encapsulation lens 3, the contact area between the encapsulation lens 3 and the circuit substrate 1 is reduced due to the provision of the filling layer 4, thereby reducing the phenomenon of easy delamination from the circuit substrate 1 when subjected to external forces such as cold and hot shock or vibration during use.

[0127] In actual applications, the bonding area between the filling layer 4 and the circuit substrate 1 and the bonding area between the encapsulation lens 3 and the circuit substrate 1 can be configured according to actual conditions. In some examples, the encapsulation lens 3 may not be in contact with the circuit substrate 1, and the coverage of the filling layer 4 is not less than the coverage of the encapsulation lens 3. For example, in the example of Figure 22, the coverage of the filling layer 4 is equal to the coverage of the encapsulation lens 3, and the filling layer 4 completely covers the LED chip 2. The encapsulation lens 3 is only bonded to the filling layer 4, and the packaging structure of the LED chip 2 and the circuit substrate 1 are only combined through the filling layer 4, and the bonding between the two is good. This example avoids the contact between the second adhesive of the encapsulation lens 3 and the circuit substrate 1 to the greatest extent possible. The filling layer 4 preferably uses a softer first adhesive (with a lower hardness than the second adhesive) and is not easy to delaminate with the circuit substrate 1, thereby improving the packaging reliability. In the actual manufacturing process, it is difficult to achieve that the coverage of the filling layer 4 is equal to the coverage of the encapsulation lens 3. During the manufacturing process, it is also possible for the coverage of the filling layer 4 to exceed the coverage of the encapsulation lens.

[0128] The LED chip 2 in this embodiment can be, but is not limited to, a Mini LED (Mini Light Emitting Diode) chip, a Micro LED (Micro Light Emitting Diode) chip, or an LED chip of other sizes. The light-emitting wavelength of the LED chip 2 can be arbitrary. In the light-emitting device, one or more light-emitting units can be included. The LED chip 2 in the light-emitting device can be uniformly single-color or a mix of multiple colors. The base material 15 of the circuit substrate 1 can be, but is not limited to, ceramic, resin, or glass. The circuit substrate 1 can be a rigid substrate or a flexible substrate. For example, the circuit substrate 1 can be, but is not limited to, a rigid PCB (Printed Circuit Board) board or an FPC (Flexible Printed Circuit) board. Other adhesives can also be used in some examples. To further improve reliability, the first adhesive and the second adhesive can be selected to have similar stress and good mutual bonding properties, for example, the same type of adhesive can be used, such as both using silicone-based adhesives, such as organic silicone.

[0129] A specific example is provided below. Referring to FIG23 , the circuit substrate 1 includes a substrate 15 and a solder resist ink layer 14 provided on the surface. The solder resist ink layer 14 can protect the circuit on the substrate 15 to prevent the circuit from short-circuiting and improve the anti-oxidation corrosion performance and insulation performance. The LED chip 2 is bonded to the pad 12 exposed on the surface of the circuit substrate 1 through a bonding layer (not shown in the figure). The bonding layer can be made of bonding materials such as solder paste and conductive glue. The area outside the pad 12 can be covered and protected by the solder resist ink layer 14. The filling layer 4 and the packaging lens 3 can be directly bonded to the solder resist ink layer 14. The solder resist ink layer 14 is tightly bonded to the filling layer 4 and the packaging lens 3, and can have a waterproof and airtight effect. By controlling the bonding area between the packaging lens 3 and the solder resist ink layer 14 through the filling layer 4, the delamination of the packaging lens 3 and the circuit substrate 1 can also be alleviated.

[0130] In this example, the backing layer 4 completely covers the LED chip 2. Even if delamination occurs between the encapsulation lens 3 and the solder mask ink layer 14, completely degrading the protective properties of the encapsulation lens 3, the combination of the backing layer 4 and the solder mask ink layer 14 still ensures effective airtightness and waterproofing, preventing direct exposure of the LED chip 2. Furthermore, this example also allows the encapsulation lens 3 to achieve bonded contact with the circuit substrate 1. The higher viscosity and hardness of the encapsulation lens 3 provide a stronger bond to the circuit substrate 1, providing a more stable bond and contributing to the stability of the encapsulation structure.

[0131] In this example, the filling layer 4 can completely cover the LED chip 2, similar to forming a layer of adhesive film outside the LED chip 2. The height H4 of the filling layer 4 can range from 50μm to 300μm, for example, 50μm, 100μm, 200μm, 300μm, etc., and can also be set according to the height of the LED chip 2. In this example, the encapsulation lens 3 is specifically a hemispherical encapsulation lens, and its bottom diameter W3 can range from 3mm to 8mm, for example, 4mm, 5mm, 6mm, 7mm, etc., and its height H5 can range from 1.5mm to 4mm, for example, 2mm, 2.5mm, 3mm, 3.5mm, etc.

[0132] The filling layer 4 is bonded to the surface of the circuit substrate 1 at the bottom and around the LED chip 2. In the area where the filling layer 4 is provided, the encapsulating lens 3 in this example has a larger diameter than the filling layer 4. The encapsulating lens 3 is bonded only to the filling layer 4 at the position corresponding to the LED chip 2, and directly to the surface of the circuit substrate 1 around the filling layer 4. It should be noted that in this example, the projections of the filling layer 4 and the encapsulating lens 3 onto the circuit substrate 1 are assumed to be circular, and the diameters are used to reflect the coverage areas of the filling layer 4 and the encapsulating lens 3. However, it should be understood that in other examples, the specific shapes of the filling layer 4 and the encapsulating lens 3 can be other shapes.

[0133] This embodiment also provides a method for manufacturing a light-emitting device. Please refer to FIG24 . The method provided in this embodiment includes but is not limited to:

[0134] S101, providing a circuit substrate;

[0135] S102, placing an LED chip on a circuit substrate, and electrically connecting electrodes of the LED chip to pads on the circuit substrate;

[0136] The LED chip has a bottom surface, a top surface, and side surfaces. The bottom surface is close to the circuit substrate, while the top surface is away from the circuit substrate. After the LED chip is placed on the circuit substrate, the circuit substrate's pads and the LED chip can be electrically bonded using bonding materials such as solder paste and conductive adhesive.

[0137] S103, placing a first adhesive material at the LED chip to form a filling layer, wherein the filling layer is formed by the liquid first adhesive material soaking the surface of the circuit substrate and the surface of the LED chip and then curing; the first adhesive material at least fills the gap between the bottom surface of the LED chip and the circuit substrate, and adheres to at least the bottom surface and side surface of the LED chip;

[0138] It should be noted that when the liquid first adhesive material soaks into the surface of the circuit substrate and the surface of the LED chip, the wetting angle (i.e., contact angle) between the first adhesive material and the surface of the circuit substrate and the surface of the LED chip is less than 90°; after curing, the contact angle between the filling layer and the surface of the circuit substrate and the surface of the LED chip can be less than 90°. When forming the filling layer, in other embodiments, the first adhesive material can be fully bonded to the surface of the circuit substrate and the surface of the LED chip by means including but not limited to pressurization, so as to completely fill the gap between the circuit substrate and the bottom surface of the LED chip.

[0139] To ensure airtightness and waterproofing, the filling layer in this embodiment is formed directly on the circuit substrate. After the LED chip is installed, a first adhesive can be applied to or next to the LED chip through methods including, but not limited to, dispensing. Due to the fluidity of the first adhesive, it can flow to the bottom surface of the LED chip to fill the gap between the LED chip and the circuit substrate. In some implementations, the coverage of the LED chip can be controlled by controlling the amount of the first adhesive. For example, applying a larger amount of the first adhesive can completely cover the LED chip.

[0140] S104, placing a second adhesive material on the LED chip to form a packaging lens 3, wherein the second adhesive material tightly covers the first adhesive material and the LED chip, wherein the hardness of the first adhesive material is less than or equal to the hardness of the second adhesive material;

[0141] In this embodiment, the encapsulation lens 3 is also formed directly on the circuit substrate 1. After the LED chip is installed, a second adhesive can be applied to the LED chip through methods including, but not limited to, dispensing. The second adhesive can tightly cover the filling layer and the LED chip, eliminating any gaps, providing high reliability and improved airtightness, preventing external moisture from entering the encapsulation lens 3 and damaging the LED chip.

[0142] It can be understood that the manufacturing method of the light-emitting device of this embodiment can be used to manufacture the light-emitting devices illustrated in the aforementioned Figures 19 to 23.

[0143] The above examples are described using LED chips as the LED light source 2. Alternatively, the LED crystal may be replaced with an LED package as another example of the LED light source 2, as described in the following example:

[0144] Refer to the light-emitting device shown in Figure 25. The LED light source 2 in the light-emitting device is an LED package 20. The LED package 20 includes an LED bracket, an LED chip 23, and a packaging glue 27 covering the LED chip 23 on the LED bracket 21. The LED bracket includes a support substrate 21 and an electrode 28. The electrode 28 is electrically connected to the circuit substrate 1. The LED package 20 has a bottom surface, a top surface, and side surfaces. The bottom surface is close to the circuit substrate 1, and the top surface is away from the circuit substrate 1. The filling layer 4 fills the gap between the bottom surface and the circuit substrate 1; the packaging lens 3 tightly covers the filling layer 4 and the LED light source, and the filling layer 4 and the packaging lens 3 are both bonded to the circuit substrate 1. In the LED package in this example, the LED chip 23 is arranged on the support substrate 21 and is covered by the packaging glue 27. There are no other blocking components. The packaging glue 27 is a light-transmitting glue material. The light emitted from the top and side surfaces of the LED chip directly enters the packaging lens after passing through the packaging glue 27.

[0145] The filling layer 4, the encapsulating lens 3, and the encapsulating adhesive 27 are all made of adhesive materials. For ease of distinction, in the present embodiment, the material of the filling layer 4 is referred to as the first adhesive material, the material of the encapsulating lens 3 is referred to as the second adhesive material, and the material of the encapsulating adhesive 27 is referred to as the third adhesive material. The first adhesive material and the second adhesive material are different.

[0146] As a comparison with the light-emitting device shown in FIG25 , referring to the light-emitting device shown in FIG26 , there is no filler layer between the LED light source 2 and the circuit substrate. Instead, the encapsulating lens 3 is bonded to the circuit substrate 1 around the periphery of the LED light source 2 and on the bottom surface of the LED light source 2 (except where blocked by the electrode 28), creating a large bonding area with the circuit substrate 1. To ensure the structural strength and plasticity of the encapsulating lens 3, the material of the encapsulating lens 3 is relatively hard and viscous, which may result in greater stress when the second adhesive material contacts the circuit substrate 1 over a large area. During use, it may be susceptible to delamination from the circuit substrate 1 when subjected to external forces such as thermal shock or vibration. In addition, in order to form stable airtight protection, the material of the packaging lens 3 should cover the LED light source 2 as seamlessly as possible. However, due to the high viscosity and poor fluidity of the material of the packaging lens 3, it is difficult to fully infiltrate the surface of the circuit substrate 1 and the LED light source 2 during the manufacturing process. Moreover, since the packaging lens 3 is located at the outermost layer of the LED light source 2, its shape needs to remain stable to achieve a specific optical effect, and it cannot be fully combined with the LED light source 2 and the circuit substrate 1 by, for example, applying pressure. Therefore, it is difficult for the second adhesive to fill the gap between the circuit substrate 1 and the bottom surface of the LED package body, and bubbles may exist between the packaging lens 3 and the surface of the circuit substrate 1 or the LED light source 2.

[0147] Compared to the light-emitting device shown in FIG26 , the light-emitting unit in this example further includes a filling layer 4, which fills at least the gap between the bottom surface of the LED package 20 and the circuit substrate 1. In the light-emitting device shown in FIG26 , the filling layer 4 only fills the area between the electrodes 28 on the bottom surface of the LED light source. In other embodiments, the coverage of the filling layer 4 is not limited to this.

[0148] In this embodiment, the filling layer 4 is made of a material with better fluidity to facilitate filling the gap between the bottom of the LED package 20 and the circuit substrate 1. Since the filling layer 4 is located on the inner side of the light-emitting unit, there is no special requirement for its shape. During the manufacturing process, the filling layer can be fully combined with the surface of the circuit substrate and the surface of the LED package 20 by, for example, applying pressure. In the area where the filling layer 4 is provided, the packaging lens 3 is not in direct contact with the circuit substrate 1. Since the hardness of the first adhesive is less than or equal to the hardness of the second adhesive, and the filling area is small, the stress generated is small, and it is not easy to delaminate with the circuit substrate 1; and when the coverage area of ​​the packaging lens 3 remains unchanged, the contact area of ​​the second adhesive with the circuit substrate 1 is reduced, which also reduces the risk of delamination between the second adhesive and the circuit substrate 1. The packaging lens 3 (i.e., the second adhesive) is still an outer layer component, and the overall structural strength of the light-emitting unit and the plasticity requirements of the packaging lens can still be met.

[0149] The light-emitting device of this example can increase the reliability of the structure while still ensuring the overall structural strength.

[0150] In some embodiments, as shown in Figure 27, the coverage area of ​​the packaging lens 3 (i.e., the area projected onto the surface of the circuit substrate 1) is larger than the coverage area of ​​the filling layer 4, and is bonded to the surface of the circuit substrate 1 around the filling layer 4, so that the filling layer 4 and the packaging lens 3 are both bonded to the circuit substrate 1.

[0151] In some embodiments, as shown in Figures 27 and 28 , the area of ​​the filling layer 4 is larger than the projected area of ​​the LED package 20 onto the circuit substrate 1, so as to completely cover the electrodes 28 of the LED package 20. The filling layer 4 provides additional airtight protection for the electrodes 28 of the LED package 20, and even in the event of failure of the encapsulation lens 3, it can provide a certain degree of protection without directly exposing the electrodes 28 of the LED package 20. In actual applications, the bonding area between the filling layer 4 and the circuit substrate 1, and the bonding area between the encapsulation lens 3 and the circuit substrate 1, can be configured according to actual conditions. In the above embodiment, by controlling the bonding area between the filling layer 4 and the encapsulation lens 3 and the circuit substrate 1, the bonding strength between the overall structure of the light-emitting unit and the circuit substrate 1 can be adjusted, thereby achieving a balanced configuration of bonding strength and stability according to actual conditions.

[0152] Referring to Figures 27 and 28 , in some implementations, a first adhesive with a lower viscosity can form a sloped sidewall of the filling layer 4 on the side of the LED package 20 near the bottom. This sidewall has a contact angle of less than 90° with the surface of the circuit substrate 1 and the surface of the LED package, resulting in a relatively flat surface and a larger surface area, making it easier to adhere to the second adhesive. The second adhesive with a higher viscosity can be easily formed into a lens shape. Using a first adhesive with a lower hardness and viscosity than the second adhesive to form the filling layer 4 can improve the structural reliability of the LED package and the lifespan of the light-emitting device. The first adhesive forms a sidewall 44 on the surface of the LED package 20 that slopes from a certain height toward the substrate from the side of the LED package 20 and expands in thickness toward the side away from the LED package 20. The outer contour of the sidewall 44 is a concave arc. The filling layer 4 can contact the circuit substrate 21 or the encapsulating adhesive 27 of the LED package 20.

[0153] Referring to the light-emitting device illustrated in FIG28 , the coverage of the filling layer 4 is equal to that of the encapsulating lens 3. The encapsulating lens 3 adheres to the filling layer 4 and to the exposed portion of the LED package 20 (i.e., the portion not covered by the filling layer 4), but is not bonded to the circuit substrate 1. This minimizes contact between the second adhesive of the encapsulating lens 3 and the circuit substrate 1. The softer first adhesive used in the filling layer 4 is less likely to delaminate from the circuit substrate 1, thereby improving the structural reliability of the light-emitting unit. In this example, the third adhesive is preferably the same as the second adhesive, which has the advantage of good bonding.

[0154] In this example, the filling layer 4 can be a translucent adhesive material or an opaque adhesive material. If the filling layer 4 is a translucent material, some optical materials can also be set in the filling layer 4; for example, a light diffusion material (such as silica particles or hollow glass beads, etc.) can be set in the filling layer 4. If the filling layer 4 is opaque, the filling layer 4 is made of a material that can reflect light or an optical material that can reflect light is set therein. Since the filling layer 4 is set on the bottom surface of the LED package, the filling layer 4 can be used to reflect the bottom light of the LED package 20 toward the top surface or side surface of the LED package 20, thereby improving the utilization rate of light.

[0155] Referring to the light-emitting device illustrated in FIG29 , a recess 31 can be formed on the light-emitting surface of the packaging lens 3 in an area corresponding to the top surface of the LED package 20, which is concave toward the top surface of the LED light source. The surface of the recess 31 can be formed into an arc shape, and the area outside the recess 31 can also be formed into an arc shape. The recess 31 forms a concave surface at the top of the packaging lens 3, which can increase the angle of incidence of light emitted from the top surface of the LED light source when it hits the recess 31. By utilizing the characteristic that light is easily totally reflected when it passes from a denser medium to a less dense medium (air), the direction of the light emission of this part of the light is changed, the light emission angle of the LED package 20 is expanded, and the light intensity of the top surface area of ​​the LED package 20 is appropriately suppressed. In some implementations, the light-emitting unit can be optimized to form a light distribution characteristic similar to a batwing shape. In other embodiments, the packaging lens 3 can also be designed into other shapes.

[0156] The LED package in this embodiment may be, but is not limited to, a Mini LED package, a Micro LED (Micro Light Emitting Diode) package, or an LED package of other sizes. The light-emitting wavelength of the LED package may be arbitrary, and in the light-emitting device, one or more light-emitting units may be included. The LED package in the light-emitting device may be uniformly single-color or a mix of multiple colors. The first adhesive, the second adhesive, and the third adhesive in this embodiment may be silicone-based adhesives, such as organic silicone, and other adhesives may also be used in some examples. To further improve reliability, the first adhesive, the second adhesive, and the third adhesive may be selected from those with similar stress and good mutual bonding, for example, the same type of adhesive, such as silicone-based adhesives.

[0157] A specific example is provided below. Referring to FIG30 , the circuit substrate 1 includes a substrate 15 and a solder resist ink layer 14 disposed on the surface of the circuit substrate 1. The solder resist ink layer 14 can protect the circuit on the substrate 15 to prevent short circuits and improve the anti-oxidation corrosion performance and insulation performance. The LED package 20 is bonded to the pad 12 exposed on the surface of the circuit substrate 1 through a bonding layer (not shown in the figure). The bonding layer can be made of bonding materials such as solder paste and conductive glue. The area outside the pad 12 can be covered and protected by the solder resist ink layer 14. The filling layer 4 and the encapsulation lens 3 can be directly bonded to the solder resist ink layer 14. The solder resist ink layer 14 is tightly bonded to the filling layer 4 and the encapsulation lens 3, which can have a waterproof and airtight effect. By controlling the bonding area between the encapsulation lens 3 and the solder resist ink layer 14 through the filling layer 4, the delamination of the encapsulation lens 3 and the circuit substrate 1 can also be alleviated.

[0158] The LED package 20 includes an LED bracket, an LED chip 23 and a packaging lens 3. In this example, the LED bracket includes a supporting substrate 21 and a bowl cup 25 with light-transmitting sides, that is, the top surface (the side away from the circuit substrate 1) and the side of the LED package can emit light. Continuing to refer to Figure 30, the supporting substrate 21 can be an opaque substrate, or it can be preferably a light-transmitting substrate to improve the light output rate of the light-emitting unit, which can be set according to needs. The bowl cup 25 is provided on the supporting substrate 21, and the supporting substrate 21 is provided with a lead electrode. At least one LED chip 23 is provided at the bottom of the bowl cup 25 and is bonded to the lead electrode on the supporting substrate 21 (that is, electrically connected). The packaging glue 27 is filled in the bowl cup 25 to cover the LED chip 23. The packaging glue 27 can fit tightly with the inner wall of the bowl cup 25 and the surface of the LED chip 23 to form an airtight package and improve the light extraction efficiency. The encapsulation glue 27 adopts a third glue material, which is specifically a silicone-based glue material in this example. It can be understood that the encapsulation glue 27 is light-transmitting. It can be transparent or provided with optical materials, such as light color conversion materials (including but not limited to phosphors and / or quantum dots) and / or light diffusion materials (such as silica particles or hollow glass beads, etc.).

[0159] In this example, the first adhesive material used for the filling layer 4 and the second adhesive material used for the encapsulation lens 3 are both silicone-based adhesive materials, wherein the first adhesive material is preferably smaller than the second adhesive material in both hardness (the hardness described in this embodiment refers to the hardness after the adhesive material is cured) and viscosity (referring to the viscosity before the adhesive material is cured). The fluidity and bonding properties of the first adhesive material with the LED lamp beads are better than those of the second adhesive material, and the shape of the filling layer 4 formed is relatively flat and can be relatively thin. In this example, the filling layer 4 fills the gap between the LED lamp beads and the circuit substrate 1, and covers a larger area around the LED lamp beads. The filling layer 4 completely covers the electrode 28 of the LED package body to form additional protection, while limiting the bonding area between the encapsulation lens 3 and the circuit substrate 1 to adjust the overall bonding strength.

[0160] Exemplarily, the height H6 of the filling layer 4 can range from 50 μm to 300 μm, such as 50 μm, 100 μm, 150 μm, 200 μm, 300 μm, etc. The height H6 of the filling layer 4 can also be set according to the height of the LED light source. In some applications, the height H6 of the filling layer 4 does not exceed the distance between the bottom surface of the LED chip 23 and the circuit substrate 1, that is, the filling layer 4 is lower than the bottom surface of the LED chip 23. This can prevent the light emitted from the side of the LED lamp bead from passing through the filling layer 4, thereby reducing the impact of the filling layer 4 on the light and reducing the number of layers of medium that the light needs to penetrate.

[0161] In this example, encapsulant 27 completely covers LED chip 23. Even if encapsulation lens 3 delaminates from solder mask layer 14, rendering the protective properties of encapsulation lens 3 completely ineffective, the combination of filler layer 4 and solder mask layer 14 still ensures effective airtightness and waterproofing of LED chip 23. Furthermore, this example ensures that encapsulation lens 3 and circuit substrate 1 are bonded together. The higher viscosity and hardness of encapsulation lens 3 provide a stronger bond to circuit substrate 1, providing a more stable bond and contributing to the stability of the encapsulation structure.

[0162] In other embodiments, the filling layer 4 may also completely cover the LED package 20 .

[0163] In addition to the LED chip and LED package in the above examples, the LED light source 2 in this embodiment can also be replaced by other types of LED light sources, which will not be described in detail in this embodiment.

[0164] The present application also provides a display screen (not shown), which can be applied to but not limited to televisions, curtain walls, vehicle-mounted equipment, mobile devices, and wearable devices. It includes a backlight panel and a display panel. The display panel is arranged on the light-emitting side of the backlight panel. The backlight panel includes the light-emitting device shown in any of the above embodiments. In this embodiment, a plurality of light-emitting units are provided on the circuit substrate of the light-emitting device, and the plurality of light-emitting units can be arranged in a rectangular array or linearly.

[0165] This embodiment also provides a lighting device (not shown), which can be used for outdoor lighting, such as roads, stadiums, etc., and can also be used for indoor lighting, such as offices, gymnasiums, libraries, classroom lights, and can also be used for plant lighting or handheld lighting, etc. It includes a shell and a lighting light source arranged in the shell. The lighting light source is a light-emitting device as shown in any of the above embodiments. The circuit substrate of the light-emitting device can be provided with one or more light-emitting units as needed.

[0166] It should be understood that the application of the present invention is not limited to the above examples. For those skilled in the art, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A light-emitting device, characterized in that, It includes a circuit board and a light-emitting unit disposed on the front side of the circuit board; The light-emitting unit includes an LED light source disposed on the front side of the circuit board and electrically connected to corresponding pads on the front side of the circuit board, and a packaging lens disposed on the front side of the circuit board to cover the LED light source therein; the LED light source has a bottom surface, a top surface and a side surface, the bottom surface is close to the front side of the circuit board, the top surface is far from the front side of the circuit board as the top light-emitting surface, and the side surface is located between the bottom surface and the top surface as the side light-emitting surface, and the packaging lens has an arc-shaped light-emitting surface to adjust the light-emitting pattern of the light-emitting unit; the top of the packaging lens is a convex surface or a concave surface.

2. The light-emitting device according to claim 1, wherein The ratio of the first maximum distance H1 between the light-emitting surface of the packaging lens and the front side of the circuit board to the second maximum distance H2 between the top light-emitting surface of the LED light source and the front side of the circuit board is 1.5 to 10, and the ratio of the first maximum width W1 of the packaging lens to the H1 is 0.75 to 5.

3.

3. The light-emitting device according to claim 2, characterized in that, The LED light source includes an LED light-emitting device and a conductive gasket, the conductive gasket is fixedly connected between the LED light-emitting device and the front side of the circuit board, the conductive gasket includes a first conductive gasket and a second conductive gasket that are insulated and isolated from each other, the first electrode and the second electrode of the LED light-emitting device are respectively electrically connected to the front sides of the first conductive gasket and the second conductive gasket, and the back sides of the first conductive gasket and the second conductive gasket are respectively electrically connected to corresponding pads on the front side of the circuit board.

4. The light-emitting device according to claim 2, characterized in that, The conductive gasket further includes an insulating support gasket, the first conductive gasket and the second conductive gasket are respectively embedded on the insulating support gasket, and the front and back sides of the first conductive gasket and the second conductive gasket are exposed outside the insulating support gasket.

5. The light-emitting device according to claim 4, characterized in that, The insulating support gasket is a light-transmitting gasket.

6. The light-emitting device according to claim 2, wherein, The LED light source is an LED package electrically connected to corresponding pads on the front side of the circuit board, the LED package includes an LED bracket, an LED chip and a potting glue layer, the LED bracket includes a support substrate and a bowl cup disposed on the support substrate and having a light-transmitting side surface, the LED chip is disposed in the bowl cup, and the potting glue layer is filled in the bowl cup to cover the LED chip.

7. The light-emitting device according to claim 2, wherein, The area on the front side of the circuit board where the pads are provided is a raised area having protrusions, the area on the front side of the circuit board outside the raised area is a flat area, the H1 is the first maximum distance between the light-emitting surface of the packaging lens and the flat area, and the H2 is the second maximum distance between the top light-emitting surface of the LED light source and the flat area.

8. The light-emitting device according to any one of claims 1 to 7, characterized in that, The light-emitting unit further includes a reflective layer disposed above the top light-emitting surface of the LED light source, the reflective layer is configured to reflect a part of the light emitted from the top light-emitting surface and allow a part of the light emitted from the top light-emitting surface of the LED light source to pass through, the reflective layer is located between the LED light source and the packaging lens or on the upper surface of the packaging lens, and is at least a first reflective layer covering a part of the top light-emitting surface of the LED light source.

9. The light-emitting device according to any one of claims 1-7, characterized in that, The region of the light-emitting surface of the encapsulation lens corresponding to the top light-emitting surface of the LED light source has a recess concave into the top light-emitting surface, the surface of the recess is an arc surface, and the ratio of the second maximum width W2 of the recess to the maximum depth H3 of the recess is 0.62 to 50.

10. The light-emitting device according to claim 1, wherein The light-emitting device further includes a filling layer, the filling layer at least fills the gap between the bottom surface of the LED light source and the circuit board, and is at least bonded to the bottom surface and the side surface of the LED light source; The encapsulation lens covers the filling layer and the LED light source; the material of the filling layer is a first adhesive material, and the material of the encapsulation lens is a second adhesive material different from the first adhesive material, wherein the hardness of the first adhesive material is less than or equal to the hardness of the second adhesive material.

11. The light-emitting device according to claim 10, wherein, There is no gap between the filling layer and the surfaces of the circuit board and the LED light source.

12. The light-emitting device according to claim 10, wherein, The filling layer forms an inclined surface on the side surface of the LED light source.

13. The light-emitting device according to claim 10, characterized in that, The first adhesive material is made of a light-transmitting material, and the filling layer completely covers the LED light source; the encapsulation lens covers the filling layer, the filling layer is bonded to the surface of the circuit board, the covering area of the encapsulation lens is larger than the covering area of the filling layer, and is bonded to the surface of the circuit board around the filling layer.

14. The light-emitting device according to claim 13, characterized in that, The circuit board includes a substrate and a solder mask layer provided on the surface of the substrate, and the filling layer and the encapsulation lens are bonded to the solder mask layer.

15. The light-emitting device according to claim 10, characterized in that, The hardness range of the first adhesive material is Shore A30 to Shore D40, and the hardness range of the second adhesive material is Shore D20 to Shore D50.

16. The light-emitting device according to any one of claims 10 to 15, characterized in that, The filling layer contains a light color conversion material or a light reflection material or a light diffusion material.

17. The light-emitting device according to any one of claims 10 to 15, characterized in that The LED light source is an LED wafer.

18. The light-emitting device according to any one of claims 10 to 15, characterized in that, The LED light source is an LED package, the LED package includes an LED bracket, an LED chip and a packaging adhesive; the LED bracket includes a bowl cup with side light transmission, and the LED chip is arranged at the bottom of the bowl cup; the packaging adhesive fills the bowl cup and covers the LED chip; the height of the filling layer does not exceed the bottom surface of the LED chip.

19. The light-emitting device according to any one of claims 10 to 15, characterized in that, The LED light source is an LED package, the LED package includes an LED bracket, an LED chip and a packaging adhesive; the LED bracket includes a support substrate, and the LED chip is arranged on the support substrate; The packaging adhesive covers the LED chip; the height of the filling layer does not exceed the bottom surface of the LED chip.

20. The light-emitting device according to any one of claims 10-15, characterized in that, The filling layer forms a side wall on the side of the LED light source that inclines from a certain height on the side of the LED light source towards the substrate direction and the thickness expands towards the side away from the LED light source, and the outer contour of the side wall is a concave arc.

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