Power conversion apparatus

By integrating a cooling path into a shielding plate that shields electromagnetic interference, the power conversion device addresses design limitations and cost issues, achieving enhanced heat dissipation and flexible internal configuration.

WO2025146943A1PCT designated stage expired Publication Date: 2025-07-10HYUNDAI KEFICO CORP
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Patent Information

Application Number
PCT/KR2024/018611
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-01-03
Filing Date
2024-11-22
Publication Date
2025-07-10

AI Technical Summary

Technical Problem

Conventional power conversion devices face limitations in design freedom due to the arrangement of cooling paths on the bottom or side of the housing, which restricts part placement, and require separate shielding plates for electromagnetic interference, reducing internal package design flexibility and increasing costs.

Method used

Integrating a cooling path into a shielding plate that also shields electromagnetic interference, allowing for improved heat dissipation and reduced part count, thereby enhancing design freedom and assembly efficiency.

Benefits of technology

Secures design freedom, minimizes assembly costs, and improves heat dissipation performance by relocating the cooling path within the housing, enabling easier internal space utilization and module integration.

✦ Generated by Eureka AI based on patent content.

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Abstract

A power conversion apparatus for a vehicle according to an embodiment of the present invention comprises: a housing that houses and protects a plurality of power circuit boards and a control board; a main cooling flow path that is located at the bottom of the housing and has a main inlet and a main outlet for cooling water, the main inlet and the main outlet being located on one side and the other side of the housing, respectively; and a blocking plate that blocks electromagnetic interference between the plurality of power circuit boards and the control board arranged inside the housing. Here, the blocking plate is provided with a sub-cooling flow path connected to the main cooling flow path and radiates heat to a certain neighboring section.
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Description

power conversion device

[0001] The present invention relates to a power conversion device for a vehicle.

[0002]

[0003] Power converters convert direct current (DC) into alternating current (AC) by switching it, then stepping up or down the AC using coils, transformers, capacitance, and other devices. They then rectify it again to direct current (DC) and supply electricity according to the voltage used by each electrical load.

[0004] Conventional technology requires that the cooling channels be located on the bottom or side of the housing, requiring the heating element to be installed in a location where it makes surface contact with the cooling channels. This, in turn, limits the placement of various components.

[0005] In addition, since a shielding plate is separately configured to block electromagnetic interference between each component, the degree of freedom in the internal package design is inevitably significantly reduced.

[0006]

[0007] The present invention has been proposed to solve the above-mentioned problems, and its purpose is to provide a power conversion device that can secure design freedom and reduce cost by integrating a cooling path into a shielding plate that shields electromagnetic waves.

[0008] The problems to be solved by the present invention are not limited to the problems mentioned above, and other problems not mentioned herein will be clearly understood by those skilled in the art from the description below.

[0009]

[0010] A power conversion device according to one embodiment of the present invention is a power conversion device for a vehicle, comprising: a housing in which a plurality of power circuit boards and a control board are built and protected; a main cooling path disposed at a lower portion of the housing and having a main inlet and a main outlet of coolant located at one side and the other side of the housing, respectively; and a shielding plate for shielding electromagnetic interference between a plurality of power circuit boards and the control board disposed within the housing.

[0011] Here, the shielding plate is provided with a sub-cooling channel connected to the main cooling channel, thereby dissipating heat to a predetermined adjacent section.

[0012] The shielding plate includes a first panel having a sealing groove recessed in a predetermined shape along an edge on the main body; a gasket that is forcibly fitted into the sealing groove; and a second panel that is fastened to the first panel with the gasket interposed therebetween, wherein the second panel can be integrally formed with the sub-cooling channel on the main body.

[0013] The shielding plate can be formed in a shape corresponding to the control board.

[0014] It is desirable that the shielding plate seal the upper part of the housing.

[0015] The main cooling channel can be connected to the sub cooling channel located at the top through a single pipe.

[0016] The sub-cooling path can have a straight structure with the same cross-sectional area along the path.

[0017] The sub-cooling path can be configured as a Venturi tube structure in which the cross-sectional area of ​​some straight sections along the path is narrow.

[0018] The sub-cooling path may have an S-shaped curve structure with the same cross-sectional area along the path.

[0019] The sub-cooling path may have a zigzag structure with the same cross-sectional area along the path.

[0020] The sub-cooling path may have an inflection point section at at least two points.

[0021] The sub-cooling path can have a slope of a preset angle from the sub-inlet path through which the coolant flows in to the sub-outlet path through which the coolant flows out.

[0022] The main cooling channel includes a first connecting channel connecting the main inlet channel and the sub-inlet channel of the sub-cooling channel; and a second connecting channel connecting the main discharge channel and the sub-discharge channel of the sub-cooling channel.

[0023] The first and second connecting euros may be detachable structures for the sub-inlet and sub-outlet passages, respectively.

[0024] The cross-sectional area of ​​the sub-inlet may be equal to or greater than the cross-sectional area of ​​the sub-outlet.

[0025] The housing has an open top and a storage space inside, and includes an upper cover covering the open top surface of the housing; and a lower cover covering the lower portion of the housing while surrounding the main cooling passage.

[0026] The upper cover may include an upper cooling channel connected to the main cooling channel.

[0027] The upper cooling channel may be a detachable structure located at the lower part of the upper cover.

[0028] The housing includes a hollow socket portion that connects to the main cooling channel.

[0029] The socket section may be formed of a connecting structure that connects the sub-inlet of the sub-cooling channel and the sub-outlet of the sub-cooling channel to the main cooling channel.

[0030] The socket portion protrudes at intervals in the preset section of the housing and can be inserted and connected to the sub-inlet and sub-outlet passages.

[0031] The socket portion may include a connecting groove in which a portion of the end is sunken; and an elastic body that is forcefully fitted into the connecting groove to maintain the seal of the portion.

[0032]

[0033] According to the present invention, the following effects are achieved.

[0034] By integrating the cooling path into a shielding plate that shields electromagnetic waves, design freedom can be secured.

[0035] Assembly costs are minimized by reducing the number of parts, and the freedom of package configuration is increased, allowing for easier use of internal housing space.

[0036] Heat dissipation performance can be improved by relocating the existing limited cooling path inside the housing.

[0037] In particular, module integration is possible by stacking various boards inside the housing.

[0038]

[0039] FIG. 1 is a perspective view illustrating a power conversion device according to one embodiment of the present invention.

[0040] FIG. 2 is a side view illustrating a power conversion device according to one embodiment of the present invention.

[0041] Figure 3 is an exploded perspective view illustrating a power conversion device according to one embodiment of the present invention.

[0042] Figure 4 is an exploded perspective view of a shielding plate according to one embodiment of the present invention.

[0043] Figure 5 is a partial example diagram showing the coupling relationship of part A shown in Figure 4.

[0044] FIG. 6 is an exemplary diagram illustrating the relationship between a main cooling path and a lower cover in a power conversion device according to one embodiment of the present invention.

[0045] Figure 7 is a schematic diagram illustrating a configuration of a power conversion device according to one embodiment of the present invention in a plan view.

[0046] Figure 8 is a configuration example diagram illustrating a power conversion device according to one embodiment of the present invention from the bottom.

[0047] FIG. 9 is an exemplary diagram illustrating a connection relationship between a shielding plate and a main cooling channel according to one embodiment of the present invention.

[0048] Fig. 10 is an exemplary diagram illustrating a shielding plate according to another embodiment of the present invention.

[0049] Fig. 11 is a partial example diagram illustrating a power conversion device according to another embodiment of the present invention.

[0050] Figures 12 and 13 are exemplary diagrams showing a heat dissipation structure of a power conversion device according to another embodiment of the present invention.

[0051] Fig. 14 is an exemplary diagram showing an example of use of a shielding plate according to another embodiment of the present invention.

[0052]

[0053] The advantages and features of the present invention, and the methods for achieving them, will become clearer with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various different forms. These embodiments are provided only to ensure that the disclosure of the present invention is complete and to fully convey the scope of the invention to those skilled in the art, and the present invention is defined by the description of the claims. Meanwhile, the terminology used herein is for the purpose of describing the embodiments and is not intended to limit the present invention. In this specification, the singular also includes the plural unless specifically stated otherwise. As used herein, "comprises" or "comprising" does not exclude the presence or addition of one or more other components, steps, operations, and / or elements other than the listed components, steps, operations, and / or elements. As used herein, the term "and / or" includes any one of the listed items and any combination of one or more of the listed items.

[0054] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0055] Basic configuration

[0056] Figures 1 to 4 illustrate a power conversion device (100) and its main configuration according to one embodiment of the present invention.

[0057] A power conversion device (100) according to one embodiment of the present invention converts general direct current (DC) into alternating current (AC) by switching it, and boosts or lowers the voltage of this alternating current using a coil, transformer, capacitance, etc. Thereafter, it rectifies it again to convert it into direct current (DC), and then supplies electricity according to the voltage used in each electric load.

[0058] The power conversion device (100) according to one embodiment of the present invention has a main feature in that the shielding plate (130) has a single cooling path, thereby effectively dissipating heat from internal components. Therefore, the description of the remaining parts except for the part related to the feature is omitted. However, even if the description is omitted, it is preferable that the power conversion device (100) be equipped with the necessary configurations and functions.

[0059] A power conversion device (100) according to one embodiment of the present invention includes a housing (110), a main cooling channel (120), a shielding plate (130), and an upper cover (140).

[0060] The housing (110) has an open top and a storage space inside. This housing (110) protects a plurality of power circuit boards (111, 112) and a control board (113) by installing them in the storage space.

[0061] The main cooling path (120) is placed at the lower part of the housing (110).

[0062] The main cooling passage (120) includes a main inlet passage (121) located on one side of the housing (110), a main discharge passage (122) located on the other side of the housing (110), a first connecting passage (123), and a second connecting passage (124).

[0063] The shielding plate (130) shields electromagnetic interference between a plurality of power circuit boards (111, 112) and a control board (113) placed inside the housing (110).

[0064] Additionally, the shielding plate (130) can radiate heat to a predetermined adjacent section connected to the main cooling path (120).

[0065] The shielding plate (130) may be formed in a shape corresponding to the control board (113) to effectively shield electromagnetic waves and dissipate heat to the surroundings.

[0066] The shielding plate (130) includes a first panel (131), a gasket (132), and a second panel (133).

[0067] The first panel (131) includes a sealed groove (131a) recessed along the edge of the main body in a preset shape. Here, the preset shape may vary depending on the position of the adjacent electronic components.

[0068] The gasket (132) functions as a packing member that is forcibly fitted into the sealing groove (131a). This gasket (132) may be made of rubber. The gasket (132) may have a structure in which a plurality of protrusions (not shown) or grooves (not shown) are formed at each connection section with the sealing groove (131a). In this case, separate protrusions (not shown) corresponding to the grooves of the gasket (132) may be formed at intervals on the sealing groove (131a).

[0069] The second panel (133) is fastened to the first panel (131) with a gasket (132) in between. The second panel (133) is formed integrally with a sub-cooling channel (133a) connected to the main cooling channel (120) on the main body. The main cooling channel (120) can be connected to the sub-cooling channel (133a) located at the top through a single pipe.

[0070] The sub-cooling path (133a) may have an S-shaped curve structure with the same cross-sectional area along the path.

[0071] As another example, the sub-cooling channel (133a) may have a zigzag structure with the same cross-sectional area along the path. In this case, the sub-cooling channel (133a) may have an inflection point section at at least two points.

[0072] The upper cover (140) covers the open upper surface of the housing (110). At this time, the upper cover (140) may include an upper cooling channel (141) connected to the main cooling channel (120).

[0073] The upper cooling channel (120) may be a detachable structure at the lower part of the upper cover (140). This upper cooling channel (120) may be connected to the main cooling channel (120) and the sub cooling channel (133a) of the shielding plate (130) through a single pipe.

[0074]

[0075] Cooling channel structure and connection relationship

[0076] Figure 5 illustrates the coupling relationship of part A shown in Figure 4.

[0077] The housing (110) includes a hollow socket portion (114) connected to the main cooling channel (120). At this time, it is preferable that at least two socket portions (114) are formed on the main body of the housing (110).

[0078] The socket part (114) may be a connecting structure that connects the sub inlet (133b) of the sub cooling channel (133a in FIG. 4) and the sub discharge channel (133c in FIG. 4) of the sub cooling channel (133a in FIG. 4) to the main cooling channel (120).

[0079] The socket part (114) protrudes at intervals in the preset section of the housing (110) and is structured to be inserted and connected to the sub inlet (133b) and sub outlet (133c in FIG. 4).

[0080] The socket part (114) includes a connecting groove (114a) and an elastic body (114b).

[0081] The connecting home (114a) has a structure in which a portion of the end of the socket portion (114) is sunken.

[0082] The elastic body (114b) is forcibly fitted into the connecting groove (114a) to maintain the sealing of the relevant section.

[0083] FIG. 6 illustrates the relationship between the main cooling path and the lower cover in a power conversion device according to one embodiment of the present invention.

[0084] The lower cover (150) covers the lower part of the housing (110) while surrounding the main cooling channel (120). At this time, the lower cover (150) may be connected to the housing (110) with a snap-fit ​​fastening structure, or may be detachably fastened with a sliding insertion method.

[0085] Figures 7 and 8 illustrate the cooling flow path structure of a power conversion device according to one embodiment of the present invention.

[0086] The main cooling path (120) and the sub cooling path (133a) can be located between the upper and lower boards to manage heat generation of the upper and lower boards built into the housing of the power conversion device (100).

[0087] The sub-cooling channel (133a) is formed between the substrates inside the housing to perform heat dissipation. At this time, the main cooling channel (120) and the sub-cooling channel (133a) are connected by a single pipe. That is, it is preferable that the single pipe be structured so that the cooling water can flow along the main inlet channel (121) and join the main discharge channel (122) via the sub-cooling channel (133a).

[0088] The first connecting duct (123) connects the main inlet duct (121) and the sub inlet duct (133b in Fig. 4) of the sub cooling duct (133a).

[0089] The second connecting euro (124) connects the main exhaust path (122) and the sub exhaust path (133c in Fig. 4) of the sub cooling path (133a).

[0090] The first and second connecting euros (123, 124) may be detachably attached to the sub inlet (133b in FIG. 4) and sub outlet (133c in FIG. 4), respectively.

[0091] Here, the first and second connecting euros (123, 124) have the same purpose as the socket part (114) connection structure of FIG. 5, but may be configured as a separate structure, or may serve as a connector connecting the socket part (114) and the sub inlet (133b).

[0092] Figure 9 examines the connection relationship between the shielding plate and the main cooling channel according to one embodiment of the present invention.

[0093] The main cooling channel (120) is connected to the sub cooling channel (133a) located at the top through a single pipe.

[0094] The sub-cooling channel (133a) may be configured as a Venturi tube structure in which some straight sections along the path have narrow cross-sectional areas. As another example, the sub-cooling channel (133a) may be a straight structure with the same cross-sectional area along the path.

[0095] The sub-cooling path (133a) may have a slope of a preset angle as it goes from the sub-inlet path (133b) through which the coolant is introduced to the sub-outlet path (133c) through which the coolant is discharged.

[0096] The cross-sectional area of ​​the sub-inlet passage (133b) is greater than or equal to the cross-sectional area of ​​the sub-outlet passage (133c), thereby compensating for the cooling water flow rate. This allows for smooth cooling water confluence between the main cooling passage (120) and the sub-cooling passage (133a).

[0097] Meanwhile, the connector (113a) is mounted on the lower part of the control board (113). At this time, it is preferable that the connector (113a) be surface mounted on the control board (113).

[0098] It is preferable that the shielding plate (130) be soldered to the control board (113) on which the connector (113a) is mounted.

[0099]

[0100] Variant embodiment

[0101] Figure 10 illustrates a shielding plate according to another embodiment of the present invention.

[0102] The shielding plate (130') can suppress the pressure loss of the cooling water by applying the sub-cooling path (133a') in a straight structure.

[0103] FIG. 11 illustrates a modified heat dissipation structure of a power conversion device according to another embodiment of the present invention.

[0104] The shielding plate (130') dissipates heat from the upper surface of the first heating element (101) of the first power circuit board (111) located at the bottom.

[0105] A heat dissipation material (104) is mounted on the upper part of the first panel (131), so that the third heat generating element (103) located at the upper part can be dissipated.

[0106] The second heat generating element (102) is mounted on the lower part of the upper board and can be dissipated through the shielding plate (130').

[0107] Figures 12 and 13 illustrate a heat dissipation structure of a power conversion device according to another embodiment of the present invention.

[0108] In Fig. 12, the first heating element (101) can dissipate heat through natural convection of the shielding plate (130_1').

[0109] In Fig. 13, the first heat generating element (101) faces the shielding plate (130_2') with a heat dissipation material (104) therebetween. The heat dissipation material (104) is positioned between the first heat generating element (101) and the shielding plate (130_2') to dissipate heat to the surrounding area. By adding the heat dissipation material (104), heat dissipation performance can be improved.

[0110] Figure 14 illustrates an example of using a shielding plate according to another embodiment of the present invention.

[0111] The shielding plate (130_3') may also serve to seal the open upper portion of the housing (110'). In this case, the shielding plate (130_3') may not only provide cooling performance but also serve as an upper cover.

[0112] Although the configuration of the present invention has been described in detail through the above preferred embodiments, this is merely an example, and various modifications and changes are of course possible within the scope permitted by the technical idea of ​​the present invention.

[0113] Accordingly, the scope of protection of the present invention should be defined by the following claims.

[0114]

[0115] As described above, embodiments of the present invention can secure design freedom by integrating a cooling path into a shielding plate that shields electromagnetic waves.

[0116] Additionally, the number of parts is reduced to minimize assembly costs, and the degree of freedom in package configuration is increased, allowing for easier use of internal housing space.

[0117] In particular, heat dissipation performance can be improved by positioning the existing limited cooling path inside the housing.

[0118] In addition, module integration is possible by stacking various boards inside the housing.

Claims

1. In the power conversion device of a vehicle, A housing that houses and protects multiple power circuit boards and control boards; A main cooling channel disposed at the lower portion of the housing and having a main inlet and a main outlet of the cooling water located on one side and the other side of the housing, respectively; and Includes a shielding plate that shields electromagnetic interference between a plurality of power circuit boards and a control board arranged within the housing, The above shielding plate A power conversion device having a sub-cooling channel connected to the main cooling channel and configured to radiate heat to a predetermined adjacent section.

2. In paragraph 1, The above shielding plate A first panel having a sealed groove recessed in a preset shape along the edge of the main body; A gasket that is forcibly fitted into the above confidential groove; and A second panel is included that is connected to the first panel with the gasket interposed therebetween, The above second panel is a power conversion device in which the sub-cooling channel is formed integrally on the main body.

3. In paragraph 1, The above shielding plate A power conversion device having a shape corresponding to the above control board.

4. In paragraph 1, The above shielding plate A power conversion device that seals the upper part of the housing.

5. In paragraph 1, The above main cooling channel is A power conversion device connected to the sub-cooling channel located at the top by a single conduit.

6. In paragraph 5, The above sub-cooling path is A power conversion device having a straight structure with the same cross-sectional area along the path.

7. In paragraph 5, The above sub-cooling path is A power conversion device having a Venturi tube structure in which some straight sections along the path have narrow cross-sectional areas.

8. In paragraph 5, The above sub-cooling path is A power conversion device having an S-shaped curve structure with the same cross-sectional area along the path.

9. In paragraph 5, The above sub-cooling path is A power conversion device having a zigzag structure with the same cross-sectional area along the path.

10. In paragraph 9, The above sub-cooling path is A power conversion device having an inflection point section at at least two points.

11. In paragraph 5, The above sub-cooling path is A power conversion device having a slope of a preset angle from the sub-inlet passage through which coolant is introduced to the sub-outlet passage through which coolant is discharged.

12. In paragraph 1, The above main cooling channel is A first connecting passage connecting the main inlet passage and the sub inlet passage of the sub cooling passage; and A power conversion device including a second connecting passage connecting the main exhaust passage and the sub exhaust passage of the sub cooling passage.

13. In paragraph 12, The above 1st and 2nd connecting euros A power conversion device having a detachable structure for each of the sub-inlet and sub-outlet channels.

14. In paragraph 12, A power conversion device wherein the cross-sectional area of ​​the above sub-inlet is equal to or greater than the cross-sectional area of ​​the above sub-outlet.

15. In paragraph 1, The above housing has an open top and a storage space inside, an upper cover covering the open upper surface of the housing; and A power conversion device comprising a lower cover covering the lower portion of the housing while surrounding the main cooling passage.

16. In paragraph 15, The above upper cover A power conversion device comprising an upper cooling channel connected to the main cooling channel.

17. In paragraph 16, The above upper cooling channel A power conversion device having a detachable structure at the lower part of the upper cover.

18. In paragraph 1, The above housing It includes a hollow socket part connected to the main cooling channel, The above socket part A power conversion device comprising a connecting structure that connects a sub-inlet passage of the sub-cooling channel and a sub-outlet passage of the sub-cooling channel to the main cooling channel.

19. In Article 18, The above socket part A power conversion device that protrudes at intervals in the preset sections of the above housing and is inserted and connected on the sub inlet and sub outlet.

20. In Article 19, The above socket part A connecting groove with a portion of the end section sunken in; and A power conversion device comprising an elastic body that is forcibly fitted into the connecting groove to maintain the seal of the section.

Citation Information

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