Printed circuit board and electronic device including printed circuit board

Abstract

An electronic device, according to an embodiment disclosed in the present document, may include an electronic component. In the embodiment, the electronic device may include a printed circuit board including a conductive layer. In the embodiment, the electronic device may include a flexible printed circuit board that connects the electronic component and the printed circuit board, and includes a first portion spaced apart from the printed circuit board by a first distance and a second portion spaced apart from the printed circuit board by a second distance smaller than the first distance. In the embodiment, the printed circuit board may include: a first region from which the conductive layer is removed and which overlaps the second portion of the flexible printed circuit board in a direction perpendicular to one surface of the printed circuit board and; and a second region excluding the first region. Various other embodiments are possible.

Description

Printed circuit boards and electronic devices including printed circuit boards

[0001] Various embodiments disclosed in this document relate to printed circuit boards and electronic devices including printed circuit boards.

[0002] As portable electronic devices become more powerful, they are increasingly equipped with electronic components that perform a variety of functions. These components are connected to the device's printed circuit board and can be controlled by a processor connected to the printed circuit board.

[0003] Meanwhile, electronic devices are becoming increasingly slimmer, allowing electronic components to be densely packed into confined spaces. In such cases, noise can be generated between multiple electronic components.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0005] A frame forming the side appearance of an electronic device may be electrically connected to a communication module and used as an antenna for transmitting or receiving a communication signal. Electronic components (e.g., a camera module) positioned adjacent to the frame may easily induce electrical noise generated when transmitting or receiving a communication signal through the frame. For example, when transmitting a communication signal, electrical noise generated from a printed circuit board connected to the communication module may be induced to electronic components adjacent to the printed circuit board. The electrical noise generated when transmitting or receiving a communication signal may be induced to surrounding electronic components in various ways. In one embodiment, when a flexible printed circuit board connecting an electronic component and a printed circuit board comes into contact with or is in close proximity to the printed circuit board, electrical noise related to the communication signal may be induced from the printed circuit board to the flexible printed circuit board. Unnecessary electrical noise may be induced from the electronic component to the flexible printed circuit board, which is connected to the electronic component, resulting in malfunction or failure of the electronic component. For example, when a camera module transmits or receives a communication signal, electrical noise generated on the printed circuit board may be transmitted to the flexible printed circuit board, which may interfere with signals related to the camera function transmitted from the printed circuit board, causing the camera function to malfunction.

[0006] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those with ordinary skill in the technical field to which this document pertains from the description below.

[0007] An electronic device according to an embodiment disclosed in the present document may include an electronic component. In one embodiment, the electronic device may include a printed circuit board including a conductive layer. In one embodiment, the electronic device may include a flexible printed circuit board connecting the electronic component and the printed circuit board, the flexible printed circuit board including a first portion spaced apart from the printed circuit board by a first distance and a second portion spaced apart from the printed circuit board by a second distance less than the first distance. In one embodiment, the printed circuit board may include a first region, which overlaps a second portion of the flexible printed circuit board in a direction perpendicular to one surface of the printed circuit board, from which the conductive layer is removed, and a second region excluding the first region.

[0008] An electronic device according to one embodiment disclosed in the present document may include an electronic component. In one embodiment, the electronic device may include a printed circuit board including a conductive layer. In one embodiment, the electronic device may include a flexible printed circuit board connecting the electronic component and the printed circuit board, the flexible printed circuit board including a first portion spaced apart from the printed circuit board by a first distance and a second portion spaced apart from the printed circuit board by a second distance smaller than the first distance. In one embodiment, the printed circuit board may include a first region (440A) overlapping a second portion of the flexible printed circuit board in a direction perpendicular to one surface of the printed circuit board, and a second region (440B) excluding the first region. In one embodiment, the first region of the printed circuit board may include a first layer region (441) and a second layer region (442) disposed between the first layer region and the second portion of the flexible printed circuit board, the second layer region having the conductive layer removed.

[0009] According to one embodiment of the present disclosure, a printed circuit board may be electrically connected to an electronic component disposed in an electronic device through a flexible printed circuit board. In one embodiment, the flexible printed circuit board may include a first portion spaced apart from the printed circuit board by a first distance and a second portion spaced apart from the printed circuit board by a second distance smaller than the first distance. In one embodiment, the printed circuit board may include a first region overlapping a second portion of the flexible printed circuit board in a direction perpendicular to one surface of the printed circuit board, and a second region excluding the first region. In one embodiment, the first region of the printed circuit board may include a first layer region and a second layer region disposed between the first layer region and the second portion of the flexible printed circuit board, the second layer region having a conductive layer removed.

[0010] According to various embodiments disclosed herein, a printed circuit board can be electrically connected to electronic components via a flexible printed circuit board. The printed circuit board can include a fill-cut structure in which a conductive layer is removed in an area overlapping the flexible printed circuit board. For example, the printed circuit board can be configured with only an insulating layer in an area that can be in contact with the flexible printed circuit board. Accordingly, a phenomenon in which noise generated in the printed circuit board is transferred to the flexible printed circuit board when the printed circuit board and the flexible printed circuit board come into contact or are in close proximity can be improved or reduced.

[0011] In addition, the printed circuit board may be configured such that a layer adjacent to the flexible printed circuit board among the areas that can come into contact with the flexible printed circuit board is configured as an insulating layer, and a layer relatively spaced from the flexible printed circuit board and arranged below the insulating layer is configured as a conductive layer on which signal wiring is formed. In this case, since the area where the flexible printed circuit board comes into contact with or is close to the printed circuit board is an area formed of an insulating material among areas of the printed circuit board, the phenomenon of noise generated in the printed circuit board being induced into the flexible printed circuit board can be improved or reduced.

[0012] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0013] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0014] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0015] FIG. 2A is a perspective view of the front of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 2B is a perspective view of the rear surface of the electronic device of FIG. 2A, according to one embodiment of the present disclosure.

[0017] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a, according to one embodiment of the present disclosure.

[0018] FIG. 4 is a rear view of an electronic device showing a state in which a printed circuit board and a camera module are connected via a flexible printed circuit board according to one embodiment of the present disclosure.

[0019] FIG. 5A is a view of a printed circuit board disposed in a housing, viewed from the back of an electronic device, according to one embodiment of the present disclosure.

[0020] FIG. 5b is a rear view of a printed circuit board according to one embodiment of the present disclosure.

[0021] FIG. 5c is a perspective view of a printed circuit board according to one embodiment of the present disclosure.

[0022] Figure 6 is a cross-sectional view taken along line AA shown in Figure 2b.

[0023] FIG. 7A is a drawing of an embodiment in which a conductive layer is removed from a first region of a printed circuit board according to one embodiment of the present disclosure.

[0024] FIG. 7b is a drawing of an embodiment in which a conductive layer is removed from some layers of a first region of a printed circuit board according to one embodiment of the present disclosure.

[0025] Figure 8 is a cross-sectional view taken along line AA shown in Figure 2b.

[0026] In the following description, various embodiments of this document are described with reference to the attached drawings. It should be understood that the various embodiments of this document and the terminology used herein are not intended to limit the technical features described herein to specific embodiments, but rather encompass various modifications, equivalents, or alternatives of the embodiments.

[0027] In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of the noun corresponding to an item may include one or more of said items, unless the context clearly indicates otherwise.

[0028] In this document, phrases such as "A or B," "at least one of A and B," "or at least one of B," "A, B, or C," "at least one of A, B, and C," and "at least one of B or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another (e.g., a second) component, with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0029] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100), according to one embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with the electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0030] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0031] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0032] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0033] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0034] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0035] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0036] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0037] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0038] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0040] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0042] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0043] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0044] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0045] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0046] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0047] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0048] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0049] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0050] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0051] FIG. 2A is a perspective view of a front side of an electronic device according to an embodiment of the present disclosure. FIG. 2B is a perspective view of a rear side of the electronic device of FIG. 2A according to an embodiment of the present disclosure.

[0052] The electronic device (200) described below may include at least one of the components of the electronic device (101) described above in FIG. 1.

[0053] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIG. 2A . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (218) (or “side member”) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0054] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 2B), the rear plate (211) may include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0055] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0056] The display (201) may be visually exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which forms the first side (210A) and the first region (210D) of the side surface (210C). The display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first region (210D), and / or the second region (210E).

[0057] The input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. The audio output device (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone (203), the speakers (207, 214), and the connector (208) may be arranged at least partially in the internal space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used jointly for the microphone (203) and the speakers (207, 214). In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210).

[0058] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., a heart rate monitor (HRM) sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210) (e.g., a home key button), a portion of the second surface (210B), and / or under the display (201). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0059] The camera modules (205, 212) may include a first camera module (205) disposed on a first side (210A) of the electronic device (200), a second camera module (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one side of the electronic device (200).

[0060] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0061] The indicator may be disposed, for example, on the first surface (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light (e.g., a light-emitting element). In one embodiment, the light-emitting element may provide, for example, a light source that is linked to the operation of the camera module (205). The indicator may include, for example, a light emitting diode (LED), an infrared (IR) LED, and / or a xenon lamp.

[0062] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a universal serial bus (USB) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) (not shown) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0063] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be visually exposed through the display (201). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (201). According to one embodiment, an area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (201) may include an area having a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some of the sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, the area of ​​the display (201) facing the sensor module may not require a perforated opening.

[0064] According to one embodiment, the electronic device (200) has a bar-type or plate-type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device (200) may be part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and / or a rollable electronic device. The terms "foldable electronic device", "slidable electronic device", "stretchable electronic device" and / or "rollable electronic device" may refer to an electronic device that is capable of bending deformation of a display (e.g., a display (330) of FIG. 3) so that at least a portion thereof is folded, wound or rolled, at least a portion thereof is expanded, and / or can be housed inside a housing (e.g., a housing (210) of FIGS. 2A and 2B). The foldable electronic device, the slidable electronic device, the stretchable electronic device and / or the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a wider area of ​​the display to the outside, depending on the needs of the user.

[0065] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a, according to one embodiment of the present disclosure.

[0066] The electronic device (300) of FIG. 3 may be at least partially similar to the electronic device (200) of FIGS. 2A and 2B, or may include other embodiments of the electronic device.

[0067] Referring to FIG. 3, the electronic device (300) (e.g., the electronic device (200) of FIG. 2A or FIG. 2B) may include a side member (310) (e.g., a side bezel structure), a first support member (311) (e.g., a bracket or a support structure), a front plate (320) (e.g., a front cover) (e.g., the front plate (202) of FIG. 2A), a display (330) (e.g., the display (201) of FIG. 2A), a substrate (340) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380) (e.g., a rear cover) (e.g., the rear plate (211) of FIG. 2B). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (300) may be identical to or similar to at least one of the components of the electronic device (200) of FIG. 2A or FIG. 2B, and any redundant description thereof will be omitted below.

[0068] The first support member (311) may be disposed inside the electronic device (300) and connected to the side member (310), or may be formed integrally with the side member (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. The first support member (311) may have a display (330) coupled to one surface and a substrate (340) coupled to the other surface. A processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1) may be mounted on the substrate (340). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0069] The memory may include, for example, volatile memory or non-volatile memory.

[0070] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, for example, and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector.

[0071] The battery (350) is a device for supplying power to at least one component of the electronic device (300), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the substrate (340). The battery (350) may be integrally disposed within the electronic device (300). In one embodiment, the battery (350) may be disposed so as to be detachably attached to the electronic device (300).

[0072] The antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, perform short-range communication with an external electronic device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a portion or a combination of the side bezel structure (310) and / or the first support member (311).

[0073] FIG. 4 is a rear view of an electronic device according to an embodiment of the present disclosure, showing a state in which a printed circuit board and a camera module are connected via a flexible printed circuit board. FIG. 5a is a rear view of an electronic device according to an embodiment of the present disclosure, showing a printed circuit board disposed in a housing. FIG. 5b is a rear view of a printed circuit board according to an embodiment of the present disclosure. FIG. 5c is a perspective view of a printed circuit board according to an embodiment of the present disclosure.

[0074] In the description of the electronic device (400) described below, descriptions of configurations identical or similar to those described through FIGS. 1 to 3 are omitted.

[0075] According to one embodiment, as illustrated in FIGS. 4 and 5A, an electronic device (400) (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A, and / or the electronic device (300) of FIG. 3) may include a housing (410) in which electronic components are disposed (e.g., the housing (210) of FIG. 2A) and a frame (420) (e.g., the side member (310) of FIG. 3) that surrounds a side surface of the housing (410). In one embodiment, the frame (420) may form an exterior surface of a side surface of the electronic device (400) (e.g., the side surface (210C) of FIG. 2A). For example, the frame (420) may be arranged to surround a side surface of the housing (410), such that at least a portion of the frame (420) may constitute a portion of the side surface of the electronic device (400). In one embodiment, the housing (410) is disposed within the frame (420), and electronic components constituting the electronic device (400) may be disposed therein. In one embodiment, the housing (410) and the frame (420) may be formed integrally. Alternatively, the frame (420) may be formed separately from the housing (410) and joined to the housing (410) through machining. According to one embodiment, the housing (410) and the frame (420) may be formed using various machining methods, such as computer numerical control (CNC), die casting, or pressing.

[0076] In one embodiment, the frame (420) may be formed of a conductive material (e.g., a metal material) and may be used as an antenna radiator. In one embodiment, the frame (420) may be electrically connected to a communication module (190) connected to a printed circuit board (440) of an electronic device (400) to transmit a communication signal (e.g., a radio frequency (RF) signal) to an external electronic device or receive a communication signal from an external electronic device.

[0077] In one embodiment, the frame (420) may be electrically connected to a printed circuit board (440) via an RF connection member (not shown). In one embodiment, the frame (420) may include a conductive portion. The RF connection member may be connected to the conductive portion of the frame (420). The communication module (190) may be disposed on the printed circuit board (440) and may be electrically connected to the frame (420) via the RF connection member. The RF connection member may transmit a communication signal processed by the communication module (190) of the electronic device (400) to the frame (420), which acts as an antenna, or transmit a communication signal received via the frame (420) to the communication module (190).

[0078] In one embodiment, the frame (420) can transmit or receive RF signals of various frequency bands. In one embodiment, the frame (420) is electrically connected to the communication module (190) to transmit or receive RF signals of 2.4 GHz, 5 GHz, and / or 6 GHz bands. In one embodiment, the frame (420) is electrically connected to the communication module (190) to transmit or receive RF signals of high frequency bands (e.g., 3.5 GHz to 28 GHz, 28 GHz to 100 GHz (mmWave)).

[0079] According to one embodiment, electronic components may be positioned within the housing (410) adjacent to the frame (420). In one embodiment, referring to FIG. 4, a front camera (405) (e.g., the camera module (180) of FIG. 1 and / or the first camera module (205) of FIG. 2A) and a rear camera (412) (e.g., the camera module (180) of FIG. 1 and / or the second camera module (212) of FIG. 2A) may be positioned adjacent to the frame (420).

[0080] According to one embodiment, the electronic components disposed in the housing (410) can be electrically connected to the printed circuit board (440) via the flexible printed circuit board (450). In one embodiment, the flexible printed circuit board (450) can be formed of a flexible material. In one embodiment, the flexible printed circuit board (450) can be physically and electrically connected to the printed circuit board (440) through various methods. In one embodiment, the connector (451) of the flexible printed circuit board (450) can be electrically connected to the printed circuit board (440) through an electrical connection method such as a soldering method, a clip method, a socket method, a bolt method, and / or a bonding method.

[0081] Meanwhile, in the process of transmitting or receiving a communication signal through the frame (420), electrical noise (e.g., electrical noise (N) of FIG. 4) may be induced to peripheral electronic components through the printed circuit board (440). For example, in the process of transmitting a communication signal through the frame (420), a relatively higher level of power may be supplied to the printed circuit board (440) than in the process of receiving a communication signal. In particular, the printed circuit board (440) may transmit a communication signal at maximum output to communicate with an external electronic device in a weak electric field environment, and a relatively higher level of power may be supplied to the printed circuit board (440). In this case, electrical noise may be induced to electronic components positioned adjacent to the printed circuit board (440) from the printed circuit board (440). In one embodiment, the electrical noise may be induced directly to the electronic components. In one embodiment, the electrical noise may be induced to a flexible printed circuit board (450) connecting the electronic components and the printed circuit board (440). As electrical noise generated from the printed circuit board (440) is transmitted to the flexible printed circuit board (450), signals related to electronic components transmitted from the printed circuit board (440) may be interfered with by the electrical noise, causing malfunctions in the electronic components.

[0082] According to one embodiment, as illustrated in FIG. 4, in one embodiment, the flexible printed circuit board (450) may be connected adjacent to the printed circuit board (440) so as not to be separated from the printed circuit board (440) when an external impact (e.g., collision, dropping) is applied to the electronic device (400). For example, referring to FIG. 6 described below, the flexible printed circuit board (450) may be connected adjacent to the printed circuit board (440) in a state in which at least a portion (e.g., the third portion (450C)) is bent. In this case, when an external impact is applied to the electronic device (400), the degree to which the flexible printed circuit board (450) can move relative to the printed circuit board (440) is reduced, so that the phenomenon of the flexible printed circuit board (450) being separated from the printed circuit board (440) may be reduced.

[0083] Meanwhile, when the flexible printed circuit board (450) and the printed circuit board (440) are disposed adjacently, the flexible printed circuit board (450) and the printed circuit board (440) may come into contact. As the flexible printed circuit board (450) comes into contact with or is close to the printed circuit board (440), electrical noise generated in the printed circuit board (440) may be induced. For example, when transmitting an antenna signal through the frame (420), a relatively high power may be generated in the printed circuit board (440). As the flexible printed circuit board (450) comes into contact with the printed circuit board (440), electrical noise associated with the antenna signal may be induced from the printed circuit board (440). As unnecessary electrical noise is induced in the flexible printed circuit board (440) and / or electronic components, the electronic components may malfunction or fail. For example, if the electronic component is a front camera (405), electrical noise may be induced from the printed circuit board (440) to the flexible printed circuit board (450), and thus, signals related to the camera function transmitted from the printed circuit board (450) may be interfered with by the noise, causing the camera function to malfunction. In one embodiment, malfunctions that may occur in the front camera (405) may include malfunctions such as preview image interruption, video interruption, camera application operation abnormalities, and various other malfunctions.

[0084] According to one embodiment of the present disclosure, the printed circuit board (440) may include a fill cut structure in which a conductive layer (e.g., a layer formed of a conductive material, a copper layer) located at a portion that may come into contact with the flexible printed circuit board (450) is removed or omitted. For example, the printed circuit board (440) may have a conductive layer (e.g., a conductive layer (4403)) located at a portion facing a portion of the flexible printed circuit board (450) (e.g., a second portion (450B)) omitted or removed. In this case, even if the flexible printed circuit board (450) comes into contact with the printed circuit board (440), electrical noise generated in the printed circuit board (440) may not be induced. Accordingly, electronic components (e.g., a front camera) connected to the flexible printed circuit board (450) may not malfunction. Hereinafter, the structure of a printed circuit board (440) that blocks the transmission of electrical noise to a flexible printed circuit board (450) will be described in detail. In addition, the flexible printed circuit board (450) is described as a configuration that connects a front camera (405) and a printed circuit board (440), but the following embodiment can be equally applied to a flexible printed circuit board that connects an electronic component other than a front camera (405) and a printed circuit board (440).

[0085] Fig. 6 is a cross-sectional view taken along line AA illustrated in Fig. 2b. Fig. 7a is a drawing of an embodiment in which a conductive layer is removed from a first region of a printed circuit board according to one embodiment of the present disclosure.

[0086] FIG. 7b is a drawing of an embodiment in which a conductive layer is removed from some layers of a first region of a printed circuit board according to one embodiment of the present disclosure.

[0087] According to one embodiment, as illustrated in FIG. 6, the flexible printed circuit board (450) may be formed of a flexible material and thus may electrically connect the printed circuit board (440) and electronic components (e.g., a front camera) in a bent shape. In one embodiment, the flexible printed circuit board (450) may include a first portion (450A), a second portion (450B), a third portion (450C) (e.g., a bending portion) that connects the first portion (450A) and the second portion (450B) and is at least partially bent.

[0088] In one embodiment, referring to FIG. 6, the second portion (450B) may be a portion closer to an electronic component (e.g., a front camera (405)) than the first portion (450A). In one embodiment, the first portion (450A) of the flexible printed circuit board (450) may be a portion that is relatively further away from the printed circuit board (440) than the second portion (450B). In one embodiment, the first portion (450A) of the flexible printed circuit board (450) may be spaced apart from the printed circuit board (440) by a first distance (H1). The second portion (450B) of the flexible printed circuit board (450) may be spaced apart from the printed circuit board (440) by a second distance (H2) that is smaller than the first distance (H1). In summary, when looking at the printed circuit board (440) in a direction perpendicular to one surface of the printed circuit board (440) (e.g., the Z-axis direction of FIG. 6), the second portion (450B) of the flexible printed circuit board (450) may be a portion that is relatively closer to the printed circuit board (440) than the first portion (450A).

[0089] According to one embodiment, the flexible printed circuit board (450) may have a higher frequency of contact with the printed circuit board (440) in the second portion (450B) than in the first portion (450A). The printed circuit board (440) may have a conductive layer (e.g., conductive layer (4403)) used as a ground layer or signal layer removed or omitted in a region (e.g., first region (440A)) that overlaps the second portion (450B) of the flexible printed circuit board (450) in a direction perpendicular to one surface of the printed circuit board (440) (e.g., +Z direction in FIG. 6) so that unnecessary electrical connection with the flexible printed circuit board (450) can be blocked. For example, referring to FIGS. 7A and 7B, the printed circuit board (440) may include a region (4403') in the first region (440A) where the conductive layer is removed. In one embodiment, the area (4403') from which the conductive layer is removed may be replaced with an insulating layer (4402). Hereinafter, as illustrated in FIGS. 5A and 6 described above, an area of ​​the printed circuit board (440) that overlaps with a second portion (450B) of the flexible printed circuit board (450) in a direction perpendicular to one surface of the printed circuit board (440) is defined as a first area (440A), and an area remaining excluding the first area (440A) is defined as a second area (440B). The first area (440A) of the printed circuit board (440) may be an area that can be in contact with the flexible printed circuit board (450).

[0090] In one embodiment, referring to FIG. 5A, the first region (440A) may be adjacent to the region where the front camera (405) is disposed, rather than the second region (440B). In one embodiment, referring to FIGS. 5A, 5B, and 5C described above, the first region (440A) may be positioned between fixing holes (443) into which a fixing member (e.g., the fixing member (F) of FIG. 4) for fixing the printed circuit board (440) to the housing (410) is inserted. In one embodiment, the second region (440B) of the printed circuit board (440) may be at least partially facing the first portion (450A) of the flexible printed circuit board (450).

[0091] According to one embodiment, the printed circuit board (440) may include a structure in which a plurality of layers (e.g., the first layer region (441) and the second layer region (442) of FIGS. 7A and 7B) are laminated. In one embodiment, the printed circuit board (440) may include a conductive layer (4403) (e.g., a copper layer) made of a conductive material used for power supply and ground, a solder mask (4401) (e.g., a coating layer) laminated on the upper and lower surfaces of the printed circuit board (440) to protect the conductive layer (4403), and an insulating layer (4402) formed of an insulating material (e.g., a prepreg (preimpregnated materials) layer). In one embodiment, the printed circuit board (440) may include a copper clad laminate (CCL) positioned between the plurality of prepregs.

[0092] According to one embodiment, as illustrated in FIG. 5C, a sensor (501) (e.g., a proximity sensor and / or a light sensor) may be positioned adjacent to a first region (440A) of a printed circuit board (440) and positioned around a front camera (405). In one embodiment, the printed circuit board (440) may not physically remove the first region (440A) so as to secure an area where the sensor (501) is mounted, but may remove / omit at least some of the conductive layers (4403) positioned in the first region (440A).

[0093] In one embodiment, referring to FIGS. 7A and 7B, a first region (440A) of a printed circuit board (440) may include a first layer region (441) and a second layer region (442). In one embodiment, the first layer region (441) and the second layer region (442) may include a plurality of layers constituting the printed circuit board (440). In one embodiment, the second layer region (442) may be located between the first layer region (441) and a second portion (450B) of the flexible printed circuit board (450). In the following description, a plurality of layers (e.g., a conductive layer (4403), an insulating layer (4402), and / or a solder mask (4401)) included in a printed circuit board (440) are described by dividing them into a first layer region (441) and a second layer region (442), but this is merely an example, and the plurality of layers included in the printed circuit board (440) may be divided into various layer regions.

[0094] In one embodiment, referring to FIGS. 6 and 7A, a first region (440A) of a printed circuit board (440) may have a conductive layer (e.g., conductive layer (4403)) removed or omitted. For example, the first region (440A) of the printed circuit board (440) may include a region (4403') from which the conductive layer is removed. In other words, the first region (440A) of the printed circuit board (440) may be composed only of an insulating material (e.g., insulating layer (4402), solder mask (4401)) and may not include the conductive layer (4403). For example, the first layer region (441) and the second layer region (442) of the first region (440A) may be composed only of an insulating material (e.g., insulating layer (4402), solder mask (4401)). In this case, the conductive layer (4403) may be located only in the second region (440B) of the printed circuit board (440). Therefore, when the second portion (450B) of the flexible printed circuit board (450) is in contact with the first region (440A) of the printed circuit board (440), electrical noise may not be induced from the printed circuit board (440) to the flexible printed circuit board (450).

[0095] In one embodiment, referring to FIG. 7B, a first region (440A) of a printed circuit board (440) may have conductive layers (e.g., conductive layer (4403)) positioned adjacent to a second portion (450B) of a flexible printed circuit board (450) removed or omitted. In one embodiment, the first region (440A) of the printed circuit board (440) may have conductive layers (e.g., conductive layer (4403)) removed from a layer (e.g., second layer region (442)) adjacent to a second portion (450B) of the flexible printed circuit board (450) when the printed circuit board (440) is viewed in a direction perpendicular to the printed circuit board (440) (e.g., +Z direction in FIG. 6). In one embodiment, a first layer region (441) that is relatively spaced apart from a second portion (450B) of a flexible printed circuit board (450) relative to a second layer region (442) may include a conductive layer (4403).

[0096] In one embodiment, referring to FIG. 7B, the first layer region (441) may include a conductive layer (4403). In one embodiment, the conductive layer (4403) of the first layer region (441) may be a signal wiring or a ground layer. Accordingly, the printed circuit board (440) may have the conductive layer (4403) removed from a layer (e.g., the second layer region (442)) adjacent to the second portion (450B) of the flexible printed circuit board (450). When the second portion (450B) of the flexible printed circuit board (450) is in contact with the first portion (440A) of the printed circuit board (440), electrical noise may not be induced from the printed circuit board (440) to the flexible printed circuit board (450). Meanwhile, the conductive layer (4403) disposed in the first layer region (441) of the printed circuit board (440) may be used as a signal wiring or a ground layer.

[0097] According to one embodiment, at least a portion of the first region (440A) of the printed circuit board (440) may be physically removed while securing an area for arranging the sensor (501) on the printed circuit board (440). In this case, since physical contact between the second portion (450B) of the flexible printed circuit board (450) and the printed circuit board (440) is blocked, electrical noise due to contact from the printed circuit board (440) to the flexible printed circuit board (450) may not be induced.

[0098] According to one embodiment, an insulating member (e.g., an insulating tape) formed of an insulating material may be placed between a first region (440A) of a printed circuit board (440) and a second portion (450B) of a flexible printed circuit board (450). In one embodiment, the insulating member may be attached to a surface of the first region (440A) of the printed circuit board (440) that faces the second portion (450B) of the flexible printed circuit board (450). The insulating member may block electrical noise induced from the printed circuit board (440) to the flexible printed circuit board (450).

[0099] According to one embodiment, as illustrated in FIG. 8, the flexible printed circuit board (450) may be covered by a cover member (430) (e.g., the back plate (380) of FIG. 3). In one embodiment, the flexible printed circuit board (450) may be disposed between the printed circuit board (440) and the cover member (430). In one embodiment, the cover member (430) may have a groove (431) formed in a portion facing the second portion (450B) of the flexible printed circuit board (450). In one embodiment, the groove (431) may be a portion of a portion of the cover member (430) from which an area facing the second portion (450B) of the flexible printed circuit board (450) is removed. Accordingly, the second portion (450B) of the flexible printed circuit board (450) may not be pressed through the cover member (430), thereby preventing contact with the printed circuit board (440) or reducing the frequency of contact.

[0100] According to one embodiment of the present disclosure, the printed circuit board (440) may have the conductive layer (4403) removed or omitted in the first region (440A) overlapping the second portion (450B) of the flexible printed circuit board (450). Accordingly, when the first region (440A) of the printed circuit board (440) comes into contact with the flexible printed circuit board (450), electrical signals and / or electrical noise generated in the printed circuit board (440) may not be induced into the flexible printed circuit board (450). For example, even if a power of 17 dBm or more is generated in the printed circuit board (440) for transmitting an antenna signal to an external electronic device, electrical signals and / or electrical noise may not be induced into the flexible printed circuit board (450). Accordingly, malfunction of electronic components (e.g., the front camera (405)) connected to the flexible printed circuit board (450) may be prevented or prevented.

[0101] According to one embodiment disclosed in the present document, an electronic device (101, 200, 300, 400) may include an electronic component. In one embodiment, the electronic device may include a printed circuit board (340, 440) including a conductive layer (4403). In one embodiment, the electronic device may include a flexible printed circuit board (450) that connects the electronic component and the printed circuit board, and includes a first portion (450A) spaced apart from the printed circuit board by a first distance and a second portion (450B) spaced apart from the printed circuit board by a second distance smaller than the first distance. In one embodiment, the printed circuit board may include a first region (440A) that overlaps a second portion of the flexible printed circuit board in a direction perpendicular to one surface of the printed circuit board and from which the conductive layer is removed, and a second region (440B) excluding the first region.

[0102] In one embodiment, the electronic device may further include a cover member (380, 430) arranged to cover the flexible printed circuit board and including a groove (431) formed in a portion facing the second portion.

[0103] In one embodiment, the electronic device may further include a frame (310, 420) comprising a conductive material and at least a portion of which constitutes a side appearance of the electronic device. In one embodiment, the electronic device may further include a communication module (190) disposed on the printed circuit board and electrically connected to the frame so that the frame transmits and receives communication signals. In one embodiment, the electronic component may be disposed in an area adjacent to the frame.

[0104] In one embodiment, a signal generated in the permanent printed circuit board may not be induced into the second portion of the flexible printed circuit board as the conductive layer is removed from the first region of the printed circuit board.

[0105] In one embodiment, the electronic component may be positioned closer to the first region than to the second region of the printed circuit board.

[0106] In one embodiment, the printed circuit board includes a plurality of fixing holes (443) into which fixing members are inserted, and at least a portion of the first region of the printed circuit board can be positioned between the plurality of fixing holes.

[0107] According to one embodiment of the present disclosure, an electronic device (101, 200, 300, 400) may include an electronic component. In one embodiment, the electronic device may include a printed circuit board (340, 440) including a conductive layer (4403). In one embodiment, the electronic device may include a flexible printed circuit board (450) that connects the electronic component and the printed circuit board and includes a first portion (450A) spaced apart from the printed circuit board by a first distance and a second portion (450B) spaced apart from the printed circuit board by a second distance smaller than the first distance. In one embodiment, the printed circuit board may include a first region (440A) that overlaps a second portion of the flexible printed circuit board in a direction perpendicular to one surface of the printed circuit board, and a second region (440B) excluding the first region. In one embodiment, the first region of the printed circuit board may include a first layer region (441) and a second layer region (442) disposed between the first layer region and the second portion of the flexible printed circuit board and having the conductive layer removed.

[0108] In one embodiment, the first layer region may be formed such that the conductive layer of the printed circuit board is removed.

[0109] In one embodiment, the first layer region may include the conductive layer of the printed circuit board.

[0110] In one embodiment, the electronic device may further include a cover member (380, 430) arranged to cover the flexible printed circuit board and including a groove (431) formed in a portion facing the second portion.

[0111] In one embodiment, the electronic device may further include a frame (310, 420) comprising a conductive material and at least a portion of which constitutes a side appearance of the electronic device. In one embodiment, the electronic device may further include a communication module (190) disposed on the printed circuit board and electrically connected to the frame so that the frame transmits and receives communication signals. In one embodiment, the electronic component may be disposed in an area adjacent to the frame.

[0112] In one embodiment, a signal generated in the permanent printed circuit board may not be induced into the second portion of the flexible printed circuit board as the conductive layer is removed from the second layer region located in the first region of the printed circuit board.

[0113] In one embodiment, the electronic component may be positioned closer to the first region than to the second region of the printed circuit board.

[0114] In one embodiment, the printed circuit board may include a plurality of fixing holes (443) into which fixing members are inserted. In one embodiment, at least a portion of the first region of the printed circuit board may be located between the plurality of fixing holes.

[0115] According to one embodiment of the present disclosure, in a printed circuit board (340, 440) electrically connected to an electronic component disposed in an electronic device (101, 200, 300, 400) through a flexible printed circuit board (450), the flexible printed circuit board may include a first portion (450A) spaced apart from the printed circuit board by a first distance and a second portion (450B) spaced apart from the printed circuit board by a second distance smaller than the first distance. In one embodiment, the printed circuit board may include a first region (440A) overlapping with the second portion of the flexible printed circuit board in a direction perpendicular to one surface of the printed circuit board, and a second region (440B) excluding the first region. In one embodiment, the first region of the printed circuit board may include:

[0116] It may include a first layer region (441) and a second layer region (442) disposed between the first layer region and the second portion of the flexible printed circuit board and from which the conductive layer (4403) is removed.

[0117] In one embodiment, the first layer region may be a conductive layer (4403) of the printed circuit board that can be removed.

[0118] In one embodiment, the first layer region may include a conductive layer (4403).

[0119] In one embodiment, the electronic device may further include a cover member (380, 430) arranged to cover the flexible printed circuit board and including a groove (431) formed in a portion facing the second portion.

[0120] In one embodiment, the electronic device may further include a frame (310, 420) comprising a conductive material and at least a portion of which constitutes a side appearance of the electronic device, and a communication module (190) disposed on the printed circuit board and electrically connected to the frame so that the frame transmits and receives communication signals. In one embodiment, the electronic component may be disposed in an area adjacent to the frame.

[0121] In one embodiment, a signal generated in the permanent printed circuit board may not be induced into the second portion of the flexible printed circuit board as the conductive layer is removed from the second layer region located in the first region of the printed circuit board.

[0122] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0123] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0124] It will be appreciated that the present invention contemplates and encompasses embodiments based on any combination of two or more of the disclosed embodiments, as well as embodiments comprising any combination of the features disclosed herein. That is, the absence of an explicit indication that two features or two embodiments can be combined does not imply that such a combination is not envisioned, but rather that such a combination is intended to be included herein.

Claims

1. In electronic devices (101, 200, 300, 400), electronic components; A printed circuit board (340, 440) including a challenge layer (4403); and A flexible printed circuit board (450) that connects the electronic component and the printed circuit board and includes a first portion (450A) spaced apart from the printed circuit board by a first distance and a second portion (450B) spaced apart from the printed circuit board by a second distance smaller than the first distance; The above printed circuit board, An electronic device comprising a first region (440A) overlapping a second portion of the flexible printed circuit board in a direction perpendicular to one surface of the printed circuit board and from which the conductive layer has been removed, and a second region (440B) excluding the first region.

2. In paragraph 1, An electronic device further comprising a cover member (380, 430) arranged to cover the flexible printed circuit board and including a groove (431) formed in a portion facing the second portion.

3. In paragraph 1, A frame (310, 420) comprising a challenging material and at least a portion of which constitutes a side appearance of the electronic device; and The above frame further includes a communication module (190) arranged on the printed circuit board and electrically connected to the frame so as to transmit and receive communication signals; The above electronic components, An electronic device positioned in an area adjacent to the above frame.

4. In paragraph 3, Signals generated on permanent printed circuit boards An electronic device in which the conductive layer is not removed from the first region of the printed circuit board and thus is not organic to the second portion of the flexible printed circuit board.

5. In paragraph 1, The above electronic components, An electronic device positioned adjacent to the first region of the printed circuit board rather than the second region.

6. In paragraph 1, The above printed circuit board, It includes a plurality of fixing holes (443) into which a fixing member is inserted, The first region of the above printed circuit board is: An electronic device, at least a portion of which is positioned between said plurality of fixing holes.

7. In electronic devices (101, 200, 300, 400), electronic components; A printed circuit board (340, 440) including a challenge layer (4403); and A flexible printed circuit board (450) that connects the electronic component and the printed circuit board and includes a first portion (450A) spaced apart from the printed circuit board by a first distance and a second portion (450B) spaced apart from the printed circuit board by a second distance smaller than the first distance; The above printed circuit board, A first region (440A) overlapping with a second portion of the flexible printed circuit board in a direction perpendicular to one surface of the printed circuit board, and a second region (440B) excluding the first region, The first region of the above printed circuit board, An electronic device comprising a first layer region (441) and a second layer region (442) disposed between the first layer region and the second portion of the flexible printed circuit board, the second layer region having the conductive layer removed.

8. In paragraph 7, The above first layer region is an electronic device from which the conductive layer of the printed circuit board has been removed.

9. In paragraph 7, An electronic device wherein the first layer region includes the conductive layer of the printed circuit board.

10. In paragraph 7, An electronic device further comprising a cover member (380, 430) arranged to cover the flexible printed circuit board and including a groove (431) formed in a portion facing the second portion.

11. In paragraph 7, A frame (310, 420) comprising a challenging material and at least a portion of which constitutes a side appearance of the electronic device; and The above frame further includes a communication module (190) arranged on the printed circuit board and electrically connected to the frame so as to transmit and receive communication signals; The above electronic components, An electronic device positioned in an area adjacent to the above frame.

12. In paragraph 11, Signals generated on permanent printed circuit boards An electronic device in which the conductive layer is not removed from the second layer region located in the first region of the printed circuit board, thereby not forming a second portion of the flexible printed circuit board.

13. In paragraph 7, The above electronic components, An electronic device positioned adjacent to the first region of the printed circuit board rather than the second region.

14. In paragraph 7, The above printed circuit board, It includes a plurality of fixing holes (443) into which a fixing member is inserted, The first region of the above printed circuit board is: An electronic device, at least a portion of which is positioned between said plurality of fixed holes.

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