Test apparatus and test chamber

Abstract

The present application discloses a test apparatus and a test chamber. The test apparatus comprises a test base, a test assembly, and a temperature changing apparatus. A mounting slot is provided in the test base, and is used for mounting an object under test. The test assembly is fixedly arranged on the test base and extends to the mounting slot so as to be connected to the object under test to perform testing. The temperature changing apparatus is fixedly arranged in the test base to change the ambient temperature for the object under test. By means of the above structure, the present application can improve the temperature changing efficiency of the whole test apparatus, guarantee the surface temperature uniformity of an electronic device, and reduce the temperature difference, thereby ensuring the accuracy of a test result.

Description

Test equipment and test chambers

Technical field

[0001] The present application is applied to the technical field of device testing, and in particular to a testing device and a testing box. [Background Technology]

[0002] Before electronic devices leave the factory, they often need to undergo various tests to determine if their performance is up to standard. Currently, high and low temperature testing is a very important part of the electronic device production test process. Therefore, it is very important to create a high and low temperature environment that can quickly and evenly balance the electronic device testing.

[0003] Currently, a common method for high and low temperature testing in production testing is to place multiple electronic components in a high and low temperature chamber. The chamber uses a compressor to exchange heat with the air, lowering the air temperature in the chamber to a specified temperature, thereby achieving low-temperature testing. For high-temperature testing, a heater blows hot air through the chamber to heat the air in the chamber, thereby achieving high-temperature testing.

[0004] However, the compressor's slow temperature control results in long cooling times, slow testing efficiency, and reduced production capacity. Furthermore, the compressor's temperature control and the heating wire's hot air control can't guarantee temperature uniformity across the entire chamber, resulting in poor surface temperature uniformity and large temperature differences on the electronic equipment, leading to errors in test results.

[0005] [Summary of the invention]

[0006] The present application provides a testing device and a testing box to solve the problems of low efficiency and large temperature difference in high and low temperature testing of electronic equipment.

[0007] To solve the above technical problems, the present application provides a testing device, including: a test seat, a test assembly and a temperature changing device. The test seat is provided with a mounting groove for installing the object to be tested. The test assembly is fixed to the test seat and extends to the mounting groove to connect the object to be tested for testing. The temperature changing device is fixed in the test seat to change the ambient temperature of the object to be tested.

[0008] Among them, the test seat includes a base and an upper cover, one end of the base is rotatably connected to one end of the upper cover; the mounting groove is arranged on the side of the base close to the upper cover, and a first cavity is arranged in the base, and the test component is fixedly arranged in the first cavity; a pressure plate is arranged on the side of the upper cover close to the base, and a second cavity is arranged in the upper cover, and the temperature change device is fixedly arranged in the second cavity; when the object to be tested is tested, the upper cover and the base are rotated relative to each other until the pressure plate is fitted with the object to be tested.

[0009] Among them, the temperature-changing device includes a temperature-changing component, a conductive part and a temperature-changing pipe. The temperature-changing component is fitted on the side of the pressure plate away from the base; the temperature-changing pipe passes through the second cavity, and the conductive part is arranged between the temperature-changing component and the temperature-changing pipe, and contacts the temperature-changing component and the temperature-changing pipe respectively.

[0010] Among them, the temperature-variable pipe includes a liquid inlet pipe, a liquid outlet pipe, a built-in pipe and a power device; the liquid inlet pipe, the built-in pipe and the liquid outlet pipe are connected in sequence, and the liquid inlet pipe and the liquid outlet pipe are inserted on the upper cover so that the built-in pipe is built into the second cavity; the power device is arranged in the liquid inlet pipe to drive the liquid in the temperature-variable pipe to flow.

[0011] Among them, the temperature-changing component includes a temperature-changing plate and a temperature-changing circuit board connected to each other, and the temperature-changing circuit board is also connected to the test component; the temperature-changing plate is attached to the side of the pressure plate away from the base, and the temperature-changing circuit board is fixed in the second cavity.

[0012] The test assembly includes a control circuit board and multiple probes; one end of each probe is connected to the control circuit board. The probes include a first probe and a second probe. The first probe extends from one end of the control circuit board to the mounting slot to connect to the object under test for testing. The second probe extends from one end of the control circuit board to the second cavity to connect to the temperature-variable circuit board.

[0013] The temperature changing device further includes a temperature sensor, which is arranged on a side of the pressing plate close to the base, and is coupled to the control circuit board.

[0014] A target pressing block is provided on the pressing plate, and the position of the target pressing block corresponds to the position of the mounting slot, so that when the upper cover and the base rotate relative to each other until they are closed, the target pressing block contacts the object to be measured.

[0015] Wherein, a heat-insulating component is fitted and fixedly provided on one side of the base close to the upper cover and / or around the edges of one side of the upper cover close to the base.

[0016] In order to solve the above technical problems, the present application also provides a test box, including: a box body, a humidity controller and multiple test devices, the humidity controller is fixedly set on the box body to control the constant humidity in the cavity, and multiple test devices are arranged at intervals in the box body; the test device includes any of the above test devices.

[0017] In order to solve the above technical problems, the test device of the present application includes a test seat, a test assembly and a temperature change device. The test seat is provided with a mounting groove for installing the object to be tested. The test assembly is fixed to the test seat and extends to the mounting groove to connect the object to be tested for testing. The temperature change device is fixed in the test seat to change the ambient temperature of the object to be tested, so that the temperature change device is fixed in the test seat so that the temperature change starts from the inside of the test seat, and the object to be tested itself is placed in the mounting groove of the test seat. Therefore, the temperature change efficiency of the entire test device can be accelerated, and the temperature change starting from the inside of the test seat can improve the temperature balance of the test seat to a certain extent, ensure the surface temperature uniformity of the electronic equipment, reduce the temperature difference, and ensure the accuracy of the test results.

Brief Description of the Drawings

[0018] FIG1 is a schematic cross-sectional view of an embodiment of a testing device provided by the present application;

[0019] FIG2 is a schematic diagram of the first state structure of an embodiment of the testing device provided by the present application

[0020] FIG3 is a schematic diagram of the structure of the second state of an embodiment of the testing device provided by the present application;

[0021] FIG4 is a schematic structural diagram of an embodiment of a test box provided in the present application. [Specific implementation method]

[0022] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0023] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0024] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0025] Please refer to Figures 1-3. Figure 1 is a schematic cross-sectional view of an embodiment of the test device provided by the present application, Figure 2 is a schematic view of the first state of the test device provided by the present application, and Figure 3 is a schematic view of the second state of the test device provided by the present application. The first state is when the base and the upper cover are open, and the second state is when the base and the upper cover are closed.

[0026] The testing device 100 of this embodiment includes a testing socket 110 , a testing assembly 120 , and a temperature changing device 140 .

[0027] The test socket 110 is provided with a mounting slot 115 for mounting the object under test 200. The object under test 200 includes but is not limited to electronic devices such as chips, controllers, processors, drivers, and communication devices that require high and low temperature testing.

[0028] The test assembly 120 is fixed to the test socket 110 and extends to the mounting slot 115 to connect to the object under test 200 for testing. The test assembly 120 is a device for testing the object under test 200. By connecting the object under test 200 at the mounting slot 115, the corresponding performance test is performed.

[0029] The temperature-changing device 140 is fixedly mounted within the test socket 110 to change the ambient temperature of the test object 200. When the test object 200 requires a high-temperature test, the temperature-changing device 140 raises the temperature to a designated temperature range for high-temperature testing, thereby providing a high-temperature environment for the test object 200. When the test object 200 requires a low-temperature test, the temperature-changing device 140 lowers the temperature to a designated temperature range for low-temperature testing, thereby providing a low-temperature environment for the test object 200.

[0030] In this embodiment, the temperature change device 140 is fixedly installed in the test socket 110, so that the temperature change starts from the inside of the test socket 110, and the object under test 200 itself is placed in the installation groove 115 of the test socket 110. Therefore, the temperature change efficiency of the entire test device 100 can be accelerated. The temperature change starting from the inside of the test socket 110 can improve the temperature balance of the test socket 110 to a certain extent, ensure the uniformity of the surface temperature of the object under test 200, reduce the temperature difference, and ensure the accuracy of the test results.

[0031] Through the above structure, the test device of the present application includes a test seat, a test assembly and a temperature change device. The test seat is provided with a mounting groove for installing the object to be tested. The test assembly is fixed to the test seat and extends to the mounting groove to connect the object to be tested for testing. The temperature change device is fixed in the test seat to change the ambient temperature of the object to be tested, so that the temperature change device is fixed in the test seat, so that the temperature change starts from the inside of the test seat, and the object to be tested itself is placed in the mounting groove of the test seat, so that the temperature change efficiency of the entire test device can be accelerated, and the temperature change starting from the inside of the test seat can improve the temperature balance of the test seat to a certain extent, ensure the surface temperature uniformity of the electronic equipment, reduce the temperature difference, and ensure the accuracy of the test results.

[0032] In some embodiments, the test socket 110 includes a base 112 and a cover 111, wherein one end of the base 112 is rotatably connected to one end of the cover 111. The base 112 and the cover 111 can be rotatably connected via a bearing, a hinge, or other rotatable connection methods.

[0033] The mounting groove 115 is disposed on a side of the base 112 close to the upper cover 111. A first cavity (not marked in the figure) is disposed in the base 112, and the test assembly 120 is fixedly disposed in the first cavity.

[0034] A pressing plate 113 is provided on one side of the upper cover 111 close to the base 112 , and a second cavity (not marked in the figure) is provided in the upper cover 111 , and the temperature changing device 140 is fixedly provided in the second cavity.

[0035] When the object 200 is being tested, the upper cover 111 and the base 112 rotate relative to each other until the pressing plate 113 is in contact with the object 200 .

[0036] Specifically, when testing the object under test 200, the upper cover 111 is first rotated until the test socket 110 is opened to expose the mounting slot 115 on the base 112. After the object under test 200 is placed in the mounting slot 115, the upper cover 111 is rotated again until the test socket 110 is closed and the pressure plate 113 of the upper cover 111 is placed in contact with the object under test 200 in the mounting slot 115. After the test is completed, the upper cover 111 is rotated again to open the test socket 110, and the object under test 200 is then removed.

[0037] Among them, after closing the test seat 110, the pressure plate 113 is fitted with the object under test 200 in the installation groove 115, and the temperature change of the temperature changing device 140 can be transmitted to the object under test 200 through the pressure plate 113, thereby improving the temperature change efficiency and the temperature balance of the environment in which the object under test 200 is located.

[0038] The temperature changing device 140 and the testing assembly 120 are respectively accommodated in the upper cover 111 and the base 112 , so that the functions of the two devices do not interfere with each other and can be performed independently.

[0039] In some embodiments, the temperature changing device 140 includes a temperature changing component 130, a conductive member 144, and a temperature changing pipe 145. The temperature changing component 130 can self-cool or self-heat, thereby changing the ambient temperature.

[0040] The temperature-variable component 130 is fitted on the side of the pressure plate 113 away from the base 112. When the test seat 110 is closed, the object under test 200 and the temperature-variable component 130 are respectively provided on the opposite sides of the pressure plate 113, which can shorten the heat transfer channel between the object under test 200 and the temperature-variable component 130, thereby accelerating the temperature change efficiency and improving the test efficiency.

[0041] The temperature-variable pipe 145 passes through the second cavity, and the conductive member 144 is disposed between the temperature-variable assembly 130 and the temperature-variable pipe 145, making contact with each of the temperature-variable assembly 130 and the temperature-variable pipe 145. The conductive member 144 is disposed between the temperature-variable assembly 130 and the temperature-variable pipe 145 to accelerate heat transfer between the temperature-variable assembly 130 and the temperature-variable pipe 145. The conductive member 144 includes, but is not limited to, thermally conductive silicone, thermally conductive gaskets, and the like.

[0042] Cold water or hot water can flow through the variable temperature pipe 145 to deal with different temperature changes. In a specific application scenario, when the test device 100 is undergoing a low-temperature test, the variable temperature component 130 begins to cool down, and cold water flows through the variable temperature pipe 145, thereby taking away the heat at the test device 100 through the flow of cold water, accelerating the temperature drop efficiency, and ice water can also flow through the variable temperature pipe 145. While taking away the heat at the test device 100, it further assists the test device 100 in cooling down, improves temperature balance, and provides a stable and reliable low-temperature test environment for the object under test 200. In a specific application scenario, when the test device 100 is undergoing a high-temperature test, the variable temperature component 130 begins to heat up, and hot water flows through the variable temperature pipe 145, thereby simultaneously heating the test device 100 through the hot water and the heated variable temperature component 130, accelerating the temperature rise efficiency and improving temperature balance.

[0043] In some embodiments, the temperature-variable pipe 145 includes a liquid inlet pipe 141, a liquid outlet pipe 142, an internal pipe 143, and a power device (not shown). The liquid inlet pipe 141, the internal pipe 143, and the liquid outlet pipe 142 are sequentially connected. The liquid inlet pipe 141 and the liquid outlet pipe 142 are inserted into the upper cover 111 so that the internal pipe 143 is embedded in the second cavity.

[0044] Liquid inlet pipe 141 and liquid outlet pipe 142 are disposed outside of test device 100 and may be flexible hoses for easy storage. Internal pipe 143 may be a rigid pipe, such as a brass pipe, steel pipe, or other metal pipe, which can quickly conduct heat while providing sufficient structural rigidity to maintain the structural stability of temperature-variable pipe 145 and minimize impact on test socket 110.

[0045] A power unit can be located within the liquid inlet pipe 141 to drive the liquid within the temperature-variable pipe 145 to flow. The power unit can include a pump or other drive device. The power unit is located outside the test socket 110 to reduce the size of the test socket 110. The power unit can also be located elsewhere outside the test apparatus 100, depending on actual needs.

[0046] In a specific application scenario, the temperature-variable pipe 145 can also be filled with phase change material, and the temperature-variable pipe 145 can be in a sealed state, using the heat absorption and heat dissipation capabilities of the phase change material itself to increase and decrease the temperature.

[0047] In some embodiments, the temperature-changing component 130 includes a temperature-changing plate 131 and a temperature-changing circuit board 132 that are connected to each other. The temperature-changing circuit board 132 is also connected to the test component 120 .

[0048] In a specific application scenario, the temperature-changing plate 131 may include a semiconductor temperature-changing plate, thereby achieving both cooling and heating functions. In a specific application scenario, the temperature-changing plate 131 may also include two plates, namely a heating plate and a condensing plate, thereby achieving heating and cooling functions respectively.

[0049] The temperature-changing circuit board 132 is also connected to the test component 120 , and the test component 120 supplies power to the temperature-changing circuit board 132 . The temperature-changing circuit board 132 is used to supply power to the temperature-changing plate 131 and control the start or shut down of the temperature-changing plate 131 .

[0050] The temperature-changing plate 131 is attached to the side of the pressure plate 113 away from the base 112 to adjust the temperature of the pressure plate 113. The temperature-changing plate 131 transmits the temperature to the object 200 in real time through the pressure plate 113, thereby improving the efficiency of temperature change. The temperature-changing circuit board 132 is fixedly disposed within the second cavity. The specific location can be set based on actual needs and is not limited here. The temperature-changing circuit board 132 can be fixed to the inner wall of the second cavity by screws.

[0051] In some embodiments, the test assembly 120 includes a control circuit board 121 and a plurality of probes 124 ; the control circuit board 121 is used to control the test of the entire test device 100 and the temperature change of the temperature variable assembly 130 .

[0052] One end of each probe 124 is connected to the control circuit board 121. The probes 124 include a first probe 123 and a second probe 122. The first probe 123 extends from the control circuit board 121 to the mounting slot 115 to connect to the object under test 200 for testing. The second probe 122 extends from the control circuit board 121 to the second cavity to connect to the temperature variable circuit board 132.

[0053] The first probe 123 is respectively connected to the control circuit board 121 and the object under test 200, so as to perform high and low temperature tests under the control of the control circuit board 121. The second probe 122 is respectively connected to the control circuit board 121 and the temperature variable circuit board 132, so as to control the temperature variable circuit board 132 through the control circuit board 121, and then control the temperature variable plate 131 to change the temperature.

[0054] In some embodiments, the temperature changing device 140 further includes a temperature sensor 160 . The temperature sensor 160 is disposed on a side of the pressing plate 113 close to the base 112 , and the temperature sensor 160 is coupled to the control circuit board 121 .

[0055] In a specific application scenario, the control circuit board 121 collects the temperature information inside the test socket 110 through the temperature sensor 160, takes the target temperature and the actual temperature as the error value, and controls the output of the temperature variable plate 131 through the incremental PID control algorithm, thereby achieving the temperature rise and fall of the test socket 110 to reach the specified temperature, reducing environmental interference and stabilizing it at the specified temperature, and ensuring the balance of the test environment temperature.

[0056] The number of the temperature sensors 160 may be one or more, and may be set based on actual needs, which is not limited here.

[0057] In some embodiments, a target pressing block 114 is provided on the pressing plate 113 , and the position of the target pressing block 114 corresponds to the position of the mounting slot 115 , so that when the upper cover 111 and the base 112 rotate relative to each other until they are closed, the target pressing block 114 contacts the object 200 .

[0058] By setting the target pressing block 114 to directly contact the object under test 200, the temperature change of the temperature-changing plate 131 behind the target pressing block 114 can be specifically conducted through the target pressing block 114, thereby further accelerating the environmental temperature change efficiency of the object under test 200 and ensuring the uniformity of the surface temperature of the object under test 200, reducing the temperature difference, and ensuring the accuracy of the test results.

[0059] In a specific application scenario, the temperature sensor 160 is preferably disposed near the target pressing block 114 to measure the temperature near the measured object 200 and improve the accuracy of the ambient temperature measurement of the measured object 200.

[0060] In some embodiments, a heat-insulating member (not shown) is attached and fixed to one side of the base 112 close to the upper cover 111 and / or to the edges of the upper cover 111 close to the base 112. The heat-insulating member may include heat-insulating cotton and / or aluminum foil.

[0061] By providing insulation around the edges of the base 112 and / or the upper cover 111, the insulation fills the gap between the base 112 and the upper cover 111 when the upper cover 111 is closed, sealing and insulating the entire test socket 110. This reduces heat exchange losses, improves cooling and heating efficiencies, enhances temperature control efficiency, improves energy conservation, and ensures temperature uniformity in the test environment in contact with the test object 200. Furthermore, when multiple test devices 100 are performing different tests simultaneously, the provision of insulation can also reduce mutual interference between the different test devices 100.

[0062] Through the above structure, the test device 100 of this embodiment fixes the temperature change device 140 in the test socket 110, so that the temperature change starts from the inside of the test socket 110, and the object under test 200 itself is placed in the installation groove 115 of the test socket 110. Therefore, the temperature change efficiency of the entire test device 100 can be accelerated, and the temperature change starting from the inside of the test socket 110 can improve the temperature balance of the test socket 110 to a certain extent, ensure the uniformity of the surface temperature of the electronic equipment, reduce the temperature difference, and ensure the accuracy of the test results. The temperature-variable device 140 includes a temperature-variable component 130, a conductive element 144, and a temperature-variable pipe 145. When the test device 100 is performing a low-temperature test, the temperature-variable component 130 begins to cool down, while cold water flows through the temperature-variable pipe 145. This cold water removes heat from the test device 100, accelerating the temperature drop efficiency. Ice water can also flow through the temperature-variable pipe 145. While removing heat from the test device 100, it further assists in cooling the test device 100, improves temperature balance, and provides a stable and reliable low-temperature testing environment for the test object 200. When the test device 100 is performing a high-temperature test, the temperature-variable component 130 begins to heat up, while hot water flows through the temperature-variable pipe 145. This heats up the test device 100 simultaneously through the hot water and the heated temperature-variable component 130, accelerating the temperature rise efficiency and improving temperature balance. The temperature changing piece 131 is attached to the side of the pressing plate 113 away from the base 112 to change the temperature of the pressing plate 113 and transmit the temperature to the object 200 in real time through the target pressing block 114, thereby further improving the temperature change efficiency.

[0063] Please refer to FIG4 , which is a schematic diagram of the structure of an embodiment of a test box provided by the present application. The test box 400 of this embodiment includes: a box body 410 , a humidity controller 420 , and a plurality of test devices 100 .

[0064] The humidity controller 420 is fixedly mounted on the housing 410 to maintain a constant humidity within the housing 410. Since frost and condensation may occur during low-temperature testing, which can easily cause water to enter the test device 100 and damage the test device 100 or the object being tested, the humidity controller 420 controls the humidity within the housing 410 at a low level, thereby reducing the occurrence of frost and condensation, thereby reducing the risk of water entering the test device 100 and damaging the test device 100 or the object being tested, and improving test reliability.

[0065] A plurality of testing devices 100 are disposed at intervals in the box 410 ; the testing devices 100 include the testing devices 100 of any of the above embodiments.

[0066] During testing, the test processes between multiple test devices 100 are independent of each other, and the appropriate number of test devices 100 to be used can be flexibly selected. The setting of the insulation parts can be used to reduce the mutual influence between multiple test devices 100, improve temperature control efficiency, and achieve energy saving effects.

[0067] Through the above structure, the test box 400 of this embodiment solves the frosting problem through a humidity control system; at the same time, thermal insulation materials and temperature variable devices are used to increase and decrease the temperature of a single test device 100, thereby reducing the volume of temperature increase and decrease, improving temperature control efficiency, and saving power consumption; and an incremental PID algorithm is used for temperature control. This system can achieve rapid temperature control, reduce temperature increase and decrease time, and ensure temperature balance.

[0068] The above is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. [Corrected according to Rule 26 on 25.01.2024] A test device, wherein, Comprising: A test socket, on which an installation groove is provided for installing the object under test; A test component, which is fixedly arranged with the test socket and extends into the installation groove to connect the object under test for testing; A temperature-changing device, which is fixedly arranged in the test socket to change the ambient temperature of the object under test.

2. [Corrected according to Rule 26 on 25.01.2024] The testing device according to claim 1, wherein, The test socket includes a base and an upper cover, and one end of the base is rotatably connected to one end of the upper cover; The installation groove is arranged on the side of the base close to the upper cover, and a first cavity is arranged in the base, and the test component is fixedly arranged in the first cavity; A pressing plate is arranged on the side of the upper cover close to the base, and a second cavity is arranged in the upper cover, and the temperature-changing device is fixedly arranged in the second cavity; When testing the object under test, the upper cover rotates relative to the base until the pressing plate is in contact with the object under test.

3. [Corrected according to Rule 26 on 25.01.2024] The test device according to claim 2, wherein, The temperature-changing device includes a temperature-changing component, a conduction piece and a temperature-changing pipeline, The temperature-changing component is attached to the side of the pressing plate away from the base; The temperature-changing pipeline penetrates through the second cavity, and the conduction piece is arranged between the temperature-changing component and the temperature-changing pipeline and is in contact with the temperature-changing component and the temperature-changing pipeline respectively.

4. The test device according to claim 3, wherein, The temperature-changing pipeline includes a liquid inlet pipeline, a liquid outlet pipeline, an internal pipeline and a power device; The liquid inlet pipeline, the internal pipeline and the liquid outlet pipeline are connected in sequence, and the liquid inlet pipeline and the liquid outlet pipeline are inserted into the upper cover so that the internal pipeline is placed in the second cavity; The power device is arranged in the liquid inlet pipeline to drive the liquid in the temperature-changing pipeline to flow.

5. The testing device according to claim 3, wherein, The temperature-changing component includes a temperature-changing sheet and a temperature-changing circuit board which are connected to each other, and the temperature-changing circuit board is also connected to the test component; The temperature-changing sheet is attached to the side of the pressing plate away from the base, and the temperature-changing circuit board is fixedly arranged in the second cavity.

6. The test device according to claim 5, wherein, The test component includes a control circuit board and a plurality of probes; One end of each probe is connected to the control circuit board; The probe includes a first probe and a second probe. One end of the first probe away from the control circuit board extends into the installation groove to connect the object under test for testing. One end of the second probe away from the control circuit board extends into the second cavity to connect the temperature-changing circuit board.

7. The test device according to claim 6, wherein, The temperature-changing device further includes a temperature sensor, which is arranged on the side of the pressing plate close to the base, and the temperature sensor is coupled to the control circuit board.

8. The test device according to claim 2, wherein A target pressing block is arranged on the pressing plate, and the position of the target pressing block corresponds to the position of the installation groove, so that when the upper cover and the base rotate relative to each other until they are closed, the target pressing block contacts the object under test.

9. The test device according to claim 2, wherein, Heat insulation parts are attached and fixedly arranged on the four peripheral edges of the side of the base close to the upper cover and / or the side of the upper cover close to the base.

10. A test chamber, wherein, Comprising: A box body; A humidity controller, which is fixedly arranged on the box body to control the humidity in the cavity to be constant humidity; A plurality of test devices, and the plurality of test devices are arranged at intervals in the box body; The test device includes the test device according to any one of claims 1-9 above.

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