Novel chip cooling platform based on micro-nano structure

Abstract

Disclosed is a novel chip cooling platform based on a micro-nano structure, comprising a platform body, a cooling conduit, and an external heat dissipation device. The cooling conduit is of a closed-loop structure, and part of the cooling conduit is arranged in the platform body; the cooling conduit is filled with a cooling medium, and a turbulator structure is arranged on the inner wall of the cooling conduit located in the platform body; a first unidirectional hydraulic pump is installed on the cooling conduit arranged on the outer side of the platform body; and the external heat dissipation device is used for dissipating heat of the cooling medium in the cooling conduit. According to the present invention, by providing the turbulator structure, the laminar flow state of the cooling medium is disrupted; additionally, the turbulator structure can enhance the disturbance of the cooling medium, and promote convection within the cooling medium, so that the cooing medium is maintained in a turbulent flow state in the cooling conduit, reducing the contact angle of the cooling medium, achieving the objective of heat transfer enhancement.

Description

A new chip cooling platform based on micro-nanostructure Technical Field

[0001] The present invention relates to the technical field of chip heat dissipation, and in particular to a novel chip cooling platform based on a micro-nano structure. Background Art

[0002] Existing chip heat sinks primarily utilize liquid cooling by flowing a cooling medium through a pipe, exchanging heat with the chip via a cold plate. However, both flat and round tube types suffer from large contact angles and poor wettability between the cooling medium and the chip, which, to a certain extent, impacts heat transfer performance. Furthermore, with the rapid advancement of technology, the integration of integrated circuits is becoming increasingly higher, the size of electronic products is gradually decreasing, and the requirements for heat sinks are also increasing. Current heat sinks on the market are limited by processing technology and suffer from large size, low material utilization, low effective heat dissipation area, and low heat dissipation efficiency. This requires heat sinks to meet the requirements of high heat dissipation efficiency while also being small, high material utilization, large effective heat dissipation area, and high heat dissipation efficiency. Therefore, the development of a new, efficient, and compact heat sink has become a pressing issue.

[0003] Summary of the Invention

[0004] The purpose of the present invention is to provide a novel chip cooling platform based on micro-nano structure to solve the problems existing in the above-mentioned prior art.

[0005] To achieve the above objectives, the present invention provides a novel chip cooling platform based on micro-nano structures, comprising:

[0006] Platform itself;

[0007] A cooling pipe, the cooling pipe is a closed-loop structure, and part of the cooling pipe is arranged in the platform body; the cooling pipe is filled with a cooling medium, and a turbulent flow structure is provided on the inner wall of the cooling pipe located in the platform body; a one-way hydraulic pump is installed on the cooling pipe arranged outside the platform body;

[0008] An external heat dissipation device is used to dissipate heat from the cooling medium in the cooling pipe.

[0009] Preferably, the flow-disturbing structure includes a plurality of micro-nano protrusions arranged on the inner wall of the cooling pipe, the micro-nano protrusions are arranged at equal intervals along the circumference of the cooling pipe, and the micro-nano protrusions are staggered along the axial direction of the cooling pipe.

[0010] Preferably, the micro-nano protrusions are foam metal.

[0011] Preferably, the setting angles of two adjacent micro-nano protrusions are in opposite directions.

[0012] Preferably, the cooling medium is liquid metal.

[0013] Preferably, the cooling pipe arranged in the platform body is a serpentine structure.

[0014] Preferably, the present invention further comprises:

[0015] A connecting pipe, the connecting pipe is arranged outside the platform body, and both ends of the connecting pipe are installed on the cooling pipe through three-way valves; a second one-way hydraulic pump is installed on the connecting pipe, and the second one-way hydraulic pump is arranged in parallel with the first one-way hydraulic pump;

[0016] a temperature measuring component, the temperature measuring component being arranged on the cooling pipe at the outlet end of the platform body, and being used to measure the temperature of the cooling medium in the cooling pipe;

[0017] A control motor is used to control the opening and closing and flow direction of the three-way valve, and the temperature measuring component is electrically connected to the control motor.

[0018] Preferably, the temperature measuring component is a thermometer.

[0019] Preferably, the external heat dissipation device includes a heat dissipation pipe, both ends of the heat dissipation pipe are connected to the cooling pipe, and an evaporator, a compressor, a condenser and an expansion valve are arranged in sequence on the heat dissipation pipe along the flow direction of the cooling medium. The heat dissipation pipe at the outlet end of the expansion valve is connected to the cooling pipe through the evaporator.

[0020] Preferably, the platform body includes:

[0021] siding;

[0022] A heat-conducting component is fixedly mounted on the inner wall of the wall panel. The heat-conducting component includes a heat dissipation sheet, a T4 copper plate and thermal grease arranged in sequence. The cooling pipe is arranged between two groups of the heat-conducting components, and the cooling pipe is in contact with the heat dissipation sheet.

[0023] Compared with the prior art, the present invention has the following advantages and technical effects:

[0024] 1. Compared with the traditional liquid cooling technology that uses water as the coolant, the present invention uses the characteristics of liquid metal itself, which has high thermal conductivity and low viscosity, reduces thermal resistance and thermal stress, and has good heat exchange effect, fast heat exchange and short time;

[0025] 2. Compared with conventional pipes for liquid heat dissipation, the present invention utilizes a foam metal material to arrange an appropriate number of micro-nano protrusions within the cooling pipe, disrupting the laminar flow of the fluid, maintaining a turbulent state of the cooling medium within the cooling pipe and enhancing heat transfer. Furthermore, the foam metal's inherent low density, high porosity, and micro-nano structure reduce the contact angle of the cooling fluid, ensuring lightweight while enhancing wettability and permeability.

[0026] 3. The use of liquid metal as a coolant can reduce the space occupied by the heat dissipation device while ensuring that the effective heat dissipation area remains unchanged, thereby achieving miniaturization of electronic devices. The close arrangement of adjacent serpentine flow channels further improves space utilization, allowing the pipes to contact the chip on all four sides, thereby enhancing heat exchange performance.

[0027] 4. By controlling the switch of the three-way valve and the one-way hydraulic pump, the liquid metal can continue to circulate in the cooling pipe in the cooling platform to cool the chip when it is still at a relatively low temperature; after the liquid metal reaches the temperature required for cooling, the flow direction of the three-way valve is controlled to make the liquid metal flow out of the cooling pipe and into the external heat dissipation device for heat dissipation and cooling, so as to achieve the effect of efficient cooling, energy saving and emission reduction. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0029] FIG1 is a cooling flow chart of a chip cooling platform according to the present invention;

[0030] FIG2 is a schematic plan view of a chip cooling platform according to the present invention;

[0031] Figure 3 is a partial enlarged view of A in Figure 2;

[0032] Figure 4 is a cross-sectional view along the BB direction in Figure 2;

[0033] In the figure: 1. Platform body; 2. Compressor; 3. Condenser; 4. Expansion valve; 5. Thermometer; 6. Evaporator; 7. Control motor; 8. Cooling pipe; 9. Micro-nano protrusions; 10. Wall panel; 11. Heat dissipation sheet; 12. T4 copper plate; 13. Thermal grease; 14. One-way hydraulic pump 1; 15. One-way hydraulic pump 2; 16. Three-way valve. DETAILED DESCRIPTION

[0034] It should be noted that, unless there is a conflict, the embodiments of the present invention and the features of the embodiments may be combined with each other. The embodiments described are only some of the embodiments of the present invention, not all of them. All other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of protection of the present invention. The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

[0035] The present invention provides a novel chip cooling platform based on micro-nano structure, comprising:

[0036] Platform body 1;

[0037] The cooling pipe 8 is a closed-loop structure, and part of the cooling pipe 8 is arranged inside the platform body 1; the cooling pipe 8 is filled with a cooling medium, and a turbulent flow structure is provided on the inner wall of the cooling pipe 8 located inside the platform body 1; a one-way hydraulic pump 14 is installed on the cooling pipe 8 arranged outside the platform body 1;

[0038] The external heat dissipation device is used to dissipate heat from the cooling medium in the cooling pipe 8.

[0039] The present invention destroys the laminar flow state of the cooling medium by setting a disruptive structure. At the same time, the disruptive structure can enhance the disturbance of the cooling medium and enhance the convection between the cooling media, so that it maintains a turbulent state in the cooling pipe 8, reduces the contact angle of the cooling medium, and achieves the purpose of enhancing heat exchange.

[0040] Furthermore, the spoiler structure includes a plurality of micro-nano protrusions 9 arranged on the inner wall of the cooling pipe 8. The micro-nano protrusions 9 are arranged at equal intervals along the circumference of the cooling pipe 8, and the micro-nano protrusions 9 are staggered along the axial direction of the cooling pipe 8; the micro-nano protrusions 9 are foam metal, and the setting angles of two adjacent micro-nano protrusions 9 are opposite.

[0041] The micro-nano protrusions 9 are made of many tiny metal particles connected to form a complex three-dimensional network structure; the micro-nano protrusions 9 can effectively increase the surface area and turbulence of the tube wall, thereby improving the heat transfer coefficient; utilizing the loose and porous characteristics of the foam metal, the laminar bottom layer of the cooling fluid on the tube wall is destroyed by changing the shape and arrangement of the micro-nano protrusions 9; at the same time, the micro-nano protrusions 9 have good thermal conductivity and mechanical strength, and can be tightly combined with the tube wall to ensure the stability and reliability of the cooling medium; at the same time, the lower density and weight characteristics of the micro-nano protrusions 9 are utilized to reduce the burden and cost of the chip cooling and heat dissipation system.

[0042] Furthermore, the cooling medium is liquid metal.

[0043] Liquid metal is used as the coolant, which has the characteristics of high thermal conductivity, low viscosity, and low thermal resistance.

[0044] Furthermore, the cooling pipe 8 provided in the platform body 1 is a serpentine structure.

[0045] Furthermore, the present invention also includes:

[0046] The connecting pipe is arranged on the outside of the platform body 1, and both ends of the connecting pipe are installed on the cooling pipe 8 through the three-way valve 16; the connecting pipe is installed with a one-way hydraulic pump 2 15, which is arranged in parallel with the one-way hydraulic pump 1 14;

[0047] The temperature measuring component is arranged on the cooling pipe 8 at the outlet end of the platform body 1 and is used to measure the temperature of the cooling medium in the cooling pipe 8;

[0048] The control motor 7 is used to control the opening and closing of the three-way valve 16 and the flow direction. The temperature measuring component is electrically connected to the control motor 7.

[0049] Furthermore, the temperature measuring component is a thermometer 5 .

[0050] Furthermore, the external heat dissipation device includes a heat dissipation pipe, both ends of which are connected to the cooling pipe 8. The evaporator 6, compressor 2, condenser 3 and expansion valve 4 are arranged in sequence on the heat dissipation pipe along the flow direction of the cooling medium. The heat dissipation pipe at the outlet end of the expansion valve 4 is connected to the cooling pipe 8 through the evaporator 6.

[0051] Furthermore, the platform body 1 includes:

[0052] Wall panel 10;

[0053] The heat-conducting component is fixedly mounted on the inner wall of the wall panel 10. The heat-conducting component includes a heat dissipation sheet 11, a T4 copper plate 12 and a thermal grease 13 arranged in sequence. The cooling pipe 8 is arranged between the two groups of heat-conducting components, and the cooling pipe 8 is in contact with the heat dissipation sheet 11.

[0054] The novel chip cooling platform based on micro-nano structures provided by the present invention operates as follows: Liquid metal flows into the platform body 1 through the cooling pipe 8 and begins operation. By controlling the flow direction of the three-way valve 16 and activating the one-way hydraulic pump 2 15, the liquid metal, which has excellent cooling performance, is circulated back and forth within the cooling pipe 8 and the heat dissipation pipe. During the circulation cooling, the micro-nano protrusions 9 arranged within the cooling pipe 8 disrupt the laminar flow of the liquid metal. Simultaneously, the arrangement of the micro-nano protrusions 9 enhances the disturbance of the liquid metal and strengthens convection between the liquid metal, maintaining a turbulent state within the cooling pipe 8. This reduces the contact angle of the cooling fluid and achieves the purpose of enhancing heat exchange.

[0055] The temperature of the liquid metal that has completed a cycle and flows out of the cooling platform is measured by the thermometer 5, and the temperature measurement result is fed back to the control motor 7. When the temperature detected by the program in the control motor 7 reaches the threshold set by the program, the flow direction of the three-way valve 16 is controlled, and the liquid metal with a higher temperature after the cycle is cooled by the external heat dissipation device. When the heat dissipation of the liquid metal is completed, the liquid metal with restored cooling effect is re-introduced into the cooling pipe 8 by opening the one-way hydraulic pump 14, and the chip in the cooling platform is circulated and cooled again.

[0056] When the thermometer 5 detects that the outflowing liquid metal has not reached the set threshold temperature, the flow direction of the three-way valve 16 is controlled to allow the liquid metal with good cooling performance to flow back into the connecting pipe, and the one-way hydraulic pump 15 is turned on to allow the liquid metal to re-enter the cooling pipe 8 and continue to work, thereby achieving the purpose of sufficient heat exchange and efficient cooling.

[0057] Compared to conventional pipes for liquid heat dissipation, the present invention utilizes a foam metal material with an appropriate number of micro-nano projections 9 arranged within the flow channel. The orientation of the micro-nano projections 9 disrupts the laminar flow of the fluid, maintaining a turbulent state of the liquid metal within the cooling pipe 8 and enhancing heat transfer. Furthermore, the foam metal's inherent low density, high porosity, and micro-nanostructure reduce the liquid metal's contact angle, maintaining lightweight while enhancing wettability and permeability. By determining the liquid metal's temperature, its utilization efficiency is greatly improved, achieving the goal of energy conservation and emission reduction.

[0058] The above are merely preferred embodiments of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A novel chip cooling platform based on micro-nano structures, characterized in that, Comprising: Platform body (1); Cooling pipeline (8), the cooling pipeline (8) is a closed-loop structure, and part of the cooling pipeline (8) is arranged inside the platform body (1); a cooling medium is filled in the cooling pipeline (8), the cooling medium is liquid metal, and a flow disturbance structure is arranged on the inner wall of the cooling pipeline (8) located inside the platform body (1); a one-way hydraulic pump one (14) is installed on the cooling pipeline (8) arranged outside the platform body (1); An outer heat dissipation device for dissipating heat from the cooling medium in the cooling pipeline (8); The flow disturbance structure includes a plurality of micro-nano protrusions (9) arranged on the inner wall of the cooling pipeline (8), the micro-nano protrusions (9) are arranged at equal intervals along the circumferential direction of the cooling pipeline (8), and the micro-nano protrusions (9) are arranged staggeredly along the axial direction of the cooling pipeline (8); The setting angle directions of two adjacent micro-nano protrusions (9) are opposite; Further comprising: A connecting pipeline arranged outside the platform body (1), both ends of the connecting pipeline are installed on the cooling pipeline (8) through three-way valves (16); a one-way hydraulic pump two (15) is installed on the connecting pipeline, and the one-way hydraulic pump two (15) is arranged in parallel with the one-way hydraulic pump one (14); A temperature measuring component arranged on the cooling pipeline (8) at the outlet end of the platform body (1), the temperature measuring component is used for measuring the temperature of the cooling medium in the cooling pipeline (8); A control motor (7) for controlling the opening and closing and the flow direction of the three-way valve (16), and the temperature measuring component is electrically connected to the control motor (7); The micro-nano protrusion (9) is a foam metal; The cooling pipeline (8) arranged inside the platform body (1) is a serpentine structure; The outer heat dissipation device includes a heat dissipation pipeline, both ends of the heat dissipation pipeline are communicated with the cooling pipeline (8), an evaporator (6), a compressor (2), a condenser (3) and an expansion valve (4) are sequentially arranged on the heat dissipation pipeline along the flow direction of the cooling medium, and the heat dissipation pipeline at the outlet end of the expansion valve (4) is communicated with the cooling pipeline (8) through the evaporator (6).

2. The novel chip cooling platform based on micro-nano structures according to claim 1, wherein The temperature measuring component is a thermometer (5).

3. The novel chip cooling platform based on micro-nano structures according to claim 1, characterized in that, The platform body (1) includes: Wall panel (10); A heat conduction component fixedly installed on the inner wall of the wall panel (10), the heat conduction component includes a heat dissipation thin plate (11), a T4 copper plate (12) and a heat conduction silicone grease (13) arranged in sequence, the cooling pipeline (8) is arranged between two groups of the heat conduction components, and the cooling pipeline (8) is in contact and cooperation with the heat dissipation thin plate (11).

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