LED light strip structure

Abstract

An LED light strip structure, comprising a light strip, end caps, and a packaging colloid. The packaging colloid covers the outside of the light strip, and the end caps are arranged at two ends of the packaging colloid. The packaging colloid comprises at least a light-transmitting colloid and a light-shielding colloid. The light strip has a light-strip light-emitting surface, a light-strip backlight surface, and two light-strip side surfaces. The light-shielding colloid covers the outside of the two light-strip side surfaces and extends in the direction of length of the light strip, and the light-transmitting colloid is arranged on the light-strip light-emitting surface and the light-strip backlight surface.

Description

LED light strip structure

[0001] The present invention claims priority to Chinese patent application No. 2024200629845, filed with the Patent Office of China on January 10, 2024, entitled “LED Light Strip Structure,” the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present invention relates to the field of LED technology, and in particular to an LED light strip structure. Background Art

[0003] LED lights are widely used in the lighting and display industries due to their advantages such as energy saving, power saving, high efficiency, fast response time, long life cycle, mercury-free and environmental protection, and have become one of the most popular products in recent years.

[0004] LED light strips are a specific use of LED lights. They include a light strip and a transparent adhesive layer that is injection-molded around the outside of the light strip. The light on the light strip can be emitted to the surroundings through the transparent adhesive layer, causing light overflow. Not only is the utilization rate low, but there is also a serious light pollution problem, which cannot meet people's requirements for light. Summary of the Invention

[0005] The present invention provides an LED light strip structure, which can ensure that the light of the light strip can only be emitted in one direction toward a light-transmitting colloid arranged on the light-emitting surface of the light strip, thereby preventing the light strip from scattering in all directions and causing light overflow or light pollution.

[0006] The present invention provides an LED light strip structure, comprising a light strip, a plug, and an encapsulated body. The encapsulated body is coated on the outside of the light strip and extends along the length of the light strip. An input end and an output end are provided at each end of the light strip. The plugs are provided at both ends of the encapsulated body and are used to apply a damping force to the input end and the output end to prevent the input end and the output end from sliding relative to the light strip.

[0007] Among them, the encapsulated body includes at least a light-transmitting colloid and a light-shielding colloid, the light strip has a light-emitting surface, a light-strip backlight surface and two light-strip side surfaces, the light-shielding colloid is wrapped around the outer side of the two light strip side surfaces and extends along the length direction of the light strip, and the light-transmitting colloid is arranged on the light-emitting surface of the light strip and / or the backlight surface of the light strip.

[0008] The technical solution provided by the embodiment of the present invention may include the following beneficial effects: The present invention designs an LED light strip structure, including a light strip, a plug and a colloid, the colloid includes at least a light-transmitting colloid and a light-shielding colloid, the light-shielding colloid is wrapped on the outer side of the two sides of the light strip and extends along the length direction of the light strip, the light-transmitting colloid is arranged on the light-emitting surface of the light strip, so that the light of the light strip can only be emitted in one direction toward the light-transmitting colloid arranged on the light-emitting surface of the light strip, preventing the light of the light strip from scattering around and causing light overflow or light pollution and other problems. At the same time, the light-transmitting colloid can also be arranged on the backlight surface of the light strip, so that the light strip information on the light strip can be displayed through the light-transmitting colloid, such as the working voltage of the light strip, the cutting position of the light strip, etc. In addition, plugs are also provided at both ends of the colloid, which can be used to apply a damping force to the input end and the output end to prevent the input end and the output end from sliding relative to the light strip, and to prevent the metal cables of the input end and the output end from breaking.

[0009] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0011] FIG1 is a schematic structural diagram of an LED light strip structure provided by an embodiment of the present invention;

[0012] FIG2 is an exploded schematic diagram of the LED light strip structure in FIG1 ;

[0013] FIG3 is a schematic structural diagram of the plug in FIG1 ;

[0014] FIG4 is a partial structural diagram of the LED light strip structure in FIG1 ;

[0015] FIG5 is a partial structural diagram of the LED light strip structure in FIG1 at another angle;

[0016] FIG6 is a partial exploded view of the LED light strip structure in FIG1 ;

[0017] FIG7 is a schematic diagram of the structure of the LED lamp in FIG1;

[0018] FIG8 is an exploded schematic diagram of the LED lamp in FIG7 ;

[0019] FIG9 is an exploded schematic diagram of the LED lamp in FIG8 ;

[0020] FIG10 is a second structural diagram of the LED lamp in FIG1 ;

[0021] FIG11 is a third structural diagram of the LED lamp in FIG1 ;

[0022] FIG12 is a fourth structural diagram of the LED lamp in FIG1 ;

[0023] FIG13 is a fifth structural diagram of the LED lamp in FIG1 .

[0024] Explanation of Reference Numerals: 100, light strip; 101, LED light; 102, circuit board; 200, encapsulated body; 201, light-shielding colloid; 202, light-transmitting colloid; 300, plug; 301, mesh tail structure; 400, input end; 500, output end; 10, light-emitting component; 11, driver chip; 12, light-emitting chip group; 121, red chip; 122, blue chip; 123, green chip; 20. Conductive pin; 20a. Via structure; 20b. Accommodation area; 21. Ground pin; 211. First die-bonding portion; 2111. Second extension portion; 212. First soldering portion; 22. Power pin; 221. Second die-bonding portion; 2211. Third extension portion; 2212. Fourth extension portion; 2213. Fifth extension portion; 222. Second soldering portion; 23. Signal input pin; 231. Third die-bonding portion; 232. Third soldering portion; 24. Signal output pin; 241. Fourth die-bonding portion; 242. Fourth soldering portion; 25. Transition pin; 251. Transition die-bonding portion; 2511. First transition die-bonding portion; 2512. Second transition die-bonding portion; 2513. Third transition die-bonding portion; 30. Insulating seat; 31. First end face; 40. Packaging glue. DETAILED DESCRIPTION

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0026] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific realities. In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like, indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0027] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0028] As shown in Figures 1 to 13, the present invention provides an LED light strip structure, comprising a light strip 100, a plug 300, and an encapsulated body 200. The encapsulated body 200 covers the outside of the light strip 100 and extends along its length. An input terminal 400 and an output terminal 500 are provided at each end of the light strip 100, respectively. The plugs 300 are disposed at both ends of the encapsulated body 200 and are used to apply a certain damping force to the input terminal 400 and the output terminal 500 to prevent the input terminal 400 and the output terminal 500 from sliding relative to the light strip. This not only prevents the input terminal 400, the output terminal 500, and the light strip 100 from breaking the metal pads on the light strip 100 during assembly and use, thereby preventing internal short circuits within the light strip 100, but also improves the bending life of the input terminal 400 and the output terminal 500. Furthermore, when the input terminal 400 and the output terminal 500 are pulled, they deform to offset the effect of the encapsulated body 200.

[0029] Exemplarily, the input end 400 includes an input interface and an input cable, the output end 500 includes an output interface and an output cable, and the plug 300 is provided with a mesh tail structure 301 at the end away from the light strip 100. The input interface is connected to the light strip 100 through the input cable, and the output interface is connected to the light strip 100 through the output cable. The mesh tail structure 301 can apply a certain damping force to the input cable and the output cable to prevent the input cable and the output cable from sliding relative to the light strip 100, and at the same time can also improve the bending life of the input cable and the output cable. When the input cable or the output cable is bent, the mesh tail structure 301 is deformed first, which plays a certain protective role for the input cable or the output cable in the mesh tail structure 301, and the mesh tail structure itself will not crack or break, which can effectively protect the connection between the light strip 100 and the input cable and the output cable from cracking of the wire skin and breaking of the wire core during the bending process.

[0030] Specifically, the plug 300 includes a first plug 300a and a second plug 300b. The first plug 300a is provided at the connection between the input cable and the light strip 100, while the second plug 300b is provided at the connection between the output cable and the light strip 100. A receiving groove 302 is formed at the end of each of the first and second plugs 300a, 300b facing away from the mesh tail structure 301, for receiving the light strip 100 or wrapping around the outside of the light strip 100, thereby forming an integrated structure between the light strip 100, the first plug 300a, and the second plug 300b.

[0031] In an optional embodiment, the encapsulated body 200 includes at least a light-transmitting colloid 202 and a light-shielding colloid 201; wherein the light strip 100 has a light-emitting surface, a light-strip backlight surface, and two light-strip side surfaces, the light-shielding colloid 201 is wrapped around the outside of the two light-strip side surfaces and extends along the length direction of the light strip 100, and the light-transmitting colloid 202 is arranged on the light-emitting surface and / or the light-strip backlight surface, so that the light of the light strip 100 can only be emitted in one direction toward the light-transmitting colloid arranged on the light-emitting surface of the light strip, thereby preventing the light of the light strip 100 from scattering around and causing light spillage or light pollution. At the same time, when the light-transmitting colloid 202 is arranged on the backlight surface of the light strip, the light strip information engraved on the backlight surface of the light strip can be displayed through the light-transmitting colloid. The light strip information includes but is not limited to the operating voltage of the light strip, the cutting position of the light strip, etc., so that the user can cut the light strip to prevent the LED lamp beads on the light strip 100 from being cut. The operation is simple and convenient, can meet industry needs, and is suitable for promotion and use.

[0032] Exemplarily, the light strip 100 includes a circuit board 102 and a plurality of LED lights 101, wherein the plurality of LED lights 101 are arranged at equal intervals along the length of the circuit board 102. A light-shielding colloid 201 is wrapped around the two sides of the light strip of the circuit board 102 and extends along the length of the circuit board 102. A light-transmitting colloid 202 is arranged on the front of the circuit board 102 and is located outside the LED lights 101, so that the light emitted by the LED lights 101 is emitted along the front of the light-transmitting colloid 202. In addition, the light-transmitting colloid 202 is arranged on the back of the circuit board 102 so that the light strip information engraved on the light strip circuit board 102 can be displayed through the light-transmitting colloid. However, if the light strip information is engraved on the light-shielding colloid 201, it is not only inconvenient for users to quickly identify it, but it is also difficult to determine the cutting position of the light strip 100, and it is easy to cut the LED lamp beads on the light strip 100.

[0033] In an optional embodiment, the light-shielding colloid 201 is integrally formed with the light strip 100, and a first elongated groove is formed on the light-emitting surface of the LED beads of the light strip 100. The light-transmitting colloid 202 is disposed in the first elongated groove, so that light emitted by the LED beads 101 can be emitted from the light-transmitting colloid 201 in the first elongated groove. This can fully improve light utilization and prevent light pollution, thus having excellent market promotion value. The light-shielding colloid 201 and the light strip 100 can be integrally formed through an extrusion process.

[0034] It should be noted that the depth of the first long groove is any natural number not less than 0. When the depth of the first long groove is 0, the light-emitting surface of the LED lamp bead 101 is just flush with the end face of the light-shielding colloid 201, or the light-emitting surface of the LED lamp bead 101 is at least partially exposed to the light-shielding colloid 201. The translucent colloid 202 can be attached to the light-emitting surface of the LED lamp bead 101, and the translucent colloid 202 can also be attached to the light-shielding colloid 201 and located on the outside of the LED lamp bead 101. That is, the first long groove can be a marking body formed at the position of the LED lamp bead 101 after the light-shielding colloid 201 and the light strip 100 are integrally injection-molded. Multiple LED lamp beads 101 are arranged at equal intervals along the length direction of the circuit board 102, so that the marking body forms a long groove structure extending along the length direction.

[0035] In an optional embodiment, the light-shielding colloid 201 forms a second long groove on the backlight surface of the light strip 100, and the light-transmitting colloid 202 is arranged in the second long groove, so that the light strip information on the backlight surface of the light strip can be displayed through the light-transmitting colloid 202. Among them, the light strip information can be set on the backlight surface of the light strip by printing, coding and engraving, etc., and the present invention is not limited. Specifically, it can be determined according to needs. Exemplarily, the light-transmitting colloid 202 includes a light-transmitting strip 202a composed of fully transparent silicone or translucent silicone, and the light-transmitting strip 202a is formed on the outside of the light-emitting surface of the lamp bead and is in the shape of a 3D arc surface. The arc-shaped light-transmitting strip 202a transmits light outward, thereby providing a luminous effect of not less than 180 degrees. The light-transmitting colloid 202 also includes an identification strip 202b made of fully transparent silicone or translucent silicone. The identification strip 202b is filled in the second long groove and is flush with the end face of the light-shielding colloid 201, so that the light strip information engraved on the backlight surface of the light strip can be displayed through the identification strip 202b. At the same time, the light-shielding colloid 201 and the identification strip 202b can also be attached to the installation surface to fix the light strip structure.

[0036] In an optional embodiment, the light-shielding colloid 201 and the light-transmitting colloid 202 are made of silicone or PU materials, which facilitates bending of the light strip structure, resists breakage, and provides anti-freeze and sun protection. Furthermore, the light beads are wrapped in the light-transmitting colloid 202 of silicone or PU glue, resulting in an ultra-bright, particle-free light effect.

[0037] In an optional embodiment, the LED lamp 101 includes a light-emitting component 10, an insulating base 30, a packaging glue 40 and a plurality of conductive pins 20, wherein the plurality of conductive pins 20 are arranged on the insulating base 30, the light-emitting component 10 is arranged on the conductive pins 20 and is electrically connected to the conductive pins 20, and the packaging glue 40 is encapsulated on the outside of the light-emitting component 10, which can not only protect the light-emitting component 10, but also improve the light transmittance effect of the light-emitting component 10.

[0038] The light-emitting assembly 10 includes a driver chip 11 and multiple light-emitting chip groups 12 connected in parallel or in series. The multiple light-emitting chip groups 12 are arranged sequentially along the layout direction of the insulating base 30, and the spacing between adjacent light-emitting chip groups 12 corresponds to the spacing between adjacent LED lamps 101. At least one driver chip 11 is electrically connected to the multiple light-emitting chip groups 12 to drive the multiple light-emitting chip groups 12 to emit light. The layout direction can be, but is not limited to, the length and width of the insulating base 30. Furthermore, the spacing between adjacent light-emitting chip groups 12 is determined by the spacing between adjacent LED lamps 101. That is, before the LED lamps 101 are packaged, the spacing between adjacent light-emitting chip groups 12 within the LED lamp 101 is determined by the spacing between adjacent LED lamps 101 on the light strip 100. However, due to limitations in solder pads and the packaging process, the spacing between two LED lamps 101 has a minimum physical dimension and cannot be infinitely small. Therefore, the present invention integrates multiple light-emitting chip groups 12 within a single LED lamp 101, meeting the minimum dimension requirement between adjacent LED lamps 101. The distance between the multiple light-emitting chip groups 12 within the LED lamp 101 can be infinitesimally small. However, to ensure uniform light emission across the light strip 100, the distance between two adjacent light-emitting chip groups 12 within the LED lamp 101 is equal to the distance between two adjacent LED lamps 101 on the light strip 100. This means that when the distance between two adjacent LED lamps 101 meets the minimum physical size, the distance between the multiple light-emitting chip groups 12 within the LED lamp 101 can also meet the minimum physical size. In an optional embodiment, each light-emitting chip group 12 includes a blue chip 122, a green chip 123, and a red chip 121. The driver chip 11 is electrically connected to each blue chip 122, each green chip 123, and each red chip 121 to drive each blue chip 122, each green chip 123, and each red chip 121 to emit light.

[0039] For example, if the number of light-emitting chip groups 12 is three, then the number of blue chips 122, green chips 123, and red chips 121 is three each. The three blue chips 122 can be combined in series or in parallel. Similarly, the three green chips 123 can be combined in series or in parallel. The three red chips 121 can be combined in series or in parallel. In addition, the blue chips 122, green chips 123, and red chips 121 can be combined in series or in parallel. The blue chips 122, green chips 123, and red chips 121 can be combined in series or in parallel. The number of driver chips 11 can be one or more, and the present invention is not limited thereto.

[0040] After adopting the above technical solution, multiple blue chips 122, multiple green chips 123 and multiple red chips 121 are equidistantly integrated in the LED lamp, which not only enables the multiple blue chips 122, multiple green chips 123 and multiple red chips 121 in one LED lamp to emit corresponding light, thereby generating diverse light colors and simulating a color flashing effect; among them, the LED lamps can be connected in series or in parallel according to needs, and different driving voltages can also be set to achieve a high-density and small-pitch design of LED products, thereby improving the color effect and display effect of LED products and making the resolution of LED products more delicate.

[0041] In an optional embodiment, the insulating seat 30 has a first end surface 31, the conductive foot 20 has a solid crystal portion formed on the first end surface 31, the driving chip 11, the blue chip 122, the green chip 123 and the red chip 121 are arranged on the solid crystal portion and electrically connected to the solid crystal portion, and the packaging glue 40 is encapsulated on the outside of the solid crystal portion.

[0042] In an optional embodiment, the conductive foot 20 also includes a welding portion, which is formed on the other end surface of the insulating seat 30, wherein at least part of the structure of the welding portion is formed with a via structure 20a to enhance the welding strength of the product so that part of the welding material can be accommodated on the via structure 20a.

[0043] After adopting the above technical solution, since the welding portion is formed on the end surface of the insulating base 30 except the first end surface 31, the heat dissipation effect of the LED lamp can be effectively increased, and the welding area and welding firmness of the welding portion can also be increased.

[0044] Since the structural size of the solid crystal part is determined by the number of multiple light-emitting chip groups 12 and the spacing between the multiple light-emitting chips; therefore, in the present invention, multiple light-emitting chip groups 12 are integrated on the solid crystal part, which can not only increase the heat dissipation effect of the light-emitting chip, but also ensure the luminous effect of the LED lamp, and can be used in various light-uniform scenes.

[0045] In an optional embodiment, the conductive pin 20 includes a power pin 22 and a ground pin 21, wherein the driver chip 11 is electrically connected to the power pin 22 and the ground pin 21, the blue chip 122, the green chip 123 and the red chip 121 are electrically connected to the power pin 22 and the driver chip 11, and the blue chip 122, the green chip 123 and the red chip 121 are equidistantly spaced on the insulating seat 30 to achieve a high-density and small-pitch design of the LED lamp.

[0046] In an optional embodiment, the driving chip 11 is set on at least one of the power pin 22 and the ground pin 21, the light-emitting chip group 12 can be set on the power pin 22 or the ground pin 21, and the light-emitting chip group 12 can also be set on other conductive pins 20 except the power pin 22 and the ground pin 21.

[0047] In an optional embodiment, the light-emitting chip group 12 is set on at least one of the power pin 22 and the ground pin 21, the driver chip 11 can be set on the power pin 22 or the ground pin 21, and the driver chip 11 can also be set on other conductive pins 20 except the power pin 22 and the ground pin 21.

[0048] In an optional embodiment, the driving chip 11 is disposed on the ground pin 21 , and the light-emitting chip group 12 is disposed on the power pin 22 .

[0049] Among them, the second input end of the driving chip 11 is electrically connected to the ground pin 21, the first input end of the driving chip 11 and the light-emitting chip group 12 is electrically connected to the power pin 22, and the second input end of the light-emitting chip group 12 is connected to the driving chip 11, that is, the light-emitting chips in the light-emitting chip group 12 are combined together in parallel, and the light emission can also be controlled by the driving chip 11.

[0050] Alternatively, the first input end of the driving chip 11 is electrically connected to the power pin 22, the second input end of the driving chip 11 is electrically connected to the ground pin 21, and the first input end and the second input end of the light-emitting chip group 12 are connected to the driving chip 11, that is, the light-emitting chips of the light-emitting chip group 12 are combined together in series and obtain the working voltage through the driving chip 11, and the light emission can also be controlled by the driving chip 11.

[0051] Exemplarily, the number of driving chips 11 and the number of light-emitting chip groups 12 are three, that is, the number of blue chips 122, green chips 123 and red chips 121 is three, and the three blue chips 122, three green chips 123 and three red chips 121 are correspondingly connected to the three driving chips 11 to form three light-emitting groups, that is, each driving chip 11 can control one blue chip 122, one green chip 123 and one red chip 121; at the same time, the blue chip 122, the green chip 123, the red chip 121 and the driving chip 11 are combined together in parallel, and the three light-emitting groups are arranged at equal intervals in parallel.

[0052] Exemplarily, the number of driving chips 11 and the number of light-emitting chip groups 12 are both four, that is, the number of blue chips 122, green chips 123 and red chips 121 is four, and the four blue chips 122, four green chips 123 and four red chips 121 are correspondingly connected to the four driving chips 11 to form four light-emitting groups, that is, each driving chip 11 can control one blue chip 122, one green chip 123 and one red chip 121; at the same time, the blue chip 122, the green chip 123, the red chip 121 and the driving chip 11 are combined together in parallel, and the four light-emitting groups are arranged at equal intervals in parallel.

[0053] Exemplarily, the number of driving chips 11 and light-emitting chip groups 12 is three, that is, the number of blue chips 122, green chips 123 and red chips 121 is three, and the three blue chips 122, three green chips 123 and three red chips 121 are correspondingly connected to the three driving chips 11 to form three light-emitting groups, that is, each driving chip 11 can control one blue chip 122, one green chip 123 and one red chip 121; at the same time, the blue chip 122, the green chip 123 and the red chip 121 are combined in series through the driving chip 11, and the three light-emitting groups are arranged at equal intervals in parallel at the same time.

[0054] Exemplarily, the number of driving chips 11 is one, and the number of light-emitting chip groups 12 is at least two, that is, the number of blue chips 122, green chips 123 and red chips 121 is at least two, at least two blue chips 122 are combined in series to form a first light-emitting group, at least two red chips 121 are combined in series to form a second light-emitting group, and at least two green chips 123 are combined in series to form a third light-emitting group. The first light-emitting group, the second light-emitting group and the third light-emitting group are combined in parallel and electrically connected to the driving chip 11, so that the driving chip 11 can control the first light-emitting group, the second light-emitting group and the third light-emitting group to emit light.

[0055] Exemplarily, the number of driving chips 11 is one, and the number of light-emitting chip groups 12 is two, that is, the number of blue chips 122, green chips 123 and red chips 121 is two, among which one blue chip 122, one green chip 123 and one red chip 121 are located on one side of the insulating base 30 in the length direction, and the other blue chip 122, one green chip 123 and one red chip 121 are located on the other side of the insulating base 30 in the length direction. The driving chip 11 is arranged on one side of the insulating base 30 in the length direction and is electrically connected to the blue chip 122, the green chip 123 and the red chip 121, and is used to control the two blue chips 122, the two green chips 123 and the two red chips 121 to emit light.

[0056] In an optional embodiment, the LED lamp adopts CHIP type packaging technology, that is, the corresponding circuit is first arranged on the packaging substrate, and then the driver chip 11 and the light-emitting chip group 12 are arranged at equal intervals, and finally electrical connections are made.

[0057] In an optional embodiment, the ground pin 21 includes a first soldering portion 212 and a first die-bonding portion 211, and the power pin 22 includes a second soldering portion 222 and a second die-bonding portion 221, wherein portions of the second soldering portion 222 and the first soldering portion 212 are disposed on opposite sides of the insulating base 30, the driver chip 11 is disposed on the first die-bonding portion 211, and the light-emitting chip group 12 is disposed on the second die-bonding portion 221. In this embodiment, the size of the first die-bonding portion 211 corresponds to the number and density of the first die-bonding portions 211, and the size of the second die-bonding portions 221 corresponds to the number and density of the light-emitting chip group 12, so that heat generated by the driver chip 11 and the light-emitting chip group 12 during operation can be transferred to the first soldering portion 212 and the second soldering portion 222 via the first die-bonding portion 211 and the second die-bonding portion 221, respectively, and then transferred to the connected circuit board or dissipated to the external environment via the first soldering portion 212 and the second soldering portion 222.

[0058] In an optional embodiment, the conductive foot 20 also includes a signal input pin 23 and a signal output pin 24, and the signal input pin 23 and the signal output pin 24 are respectively electrically connected to the signal input end and the signal output end of the driver chip 11, or the signal input end and the signal output end between two adjacent driver chips 11 are electrically connected, and the signal input pin 23 and the signal output pin 24 are electrically connected to the signal input end and the signal output end of the driver chip 11 on both sides of the insulating seat 30, so that the signal input pin 23 and the signal output pin 24 can input or output the control signal of the light-emitting chip group 12 to the driver chip 11.

[0059] In an optional embodiment, the signal input pin 23 and the ground pin 21 are arranged on one side of the insulating base 30, and the signal output pin 24 and the power pin 22 are arranged on the other side of the insulating base 30, that is, the signal input pin 23 and the ground pin 21 are located on the same side of the insulating base 30, and the signal output pin 24 and the power pin 22 are located on the side of the insulating base 30 opposite to the signal input pin 23 and the ground pin 21, thereby improving the heat dissipation effect of the ground pin 21 and the power pin 22 during operation.

[0060] In an optional embodiment, the signal input pin 23 includes a third welding portion 232 and a third solid crystal portion 231, and the signal output pin 24 includes a fourth welding portion 242 and a fourth solid crystal portion 241. Part of the structure of the third welding portion 232 is arranged on the adjacent side of the first welding portion 212 and is located on the opposite side of the second welding portion 222. Part of the structure of the fourth welding portion 242 is arranged on the adjacent side of the second welding portion 222 and is located on the opposite side of the first welding portion 212. The third solid crystal portion 231 is connected to the third welding portion 232 and is located on one side of the first solid crystal portion 211. The fourth solid crystal portion 241 is connected to the fourth welding portion 242 and is located on one side of the second solid crystal portion 221. The signal input end and the signal output end between the driving chip 11 on both sides of the insulating seat 30 are electrically connected to the third solid crystal portion 231 and the fourth solid crystal portion 241 respectively.

[0061] In an optional embodiment, the number of driving chips 11 and light-emitting chip groups 12 is at least two, and at least two light-emitting chip groups 12 are correspondingly connected to two driving chips 11 and combined together in parallel, so that each driving chip 11 can control each light-emitting chip group 12 connected thereto to emit light.

[0062] In an optional embodiment, the conductive foot 20 also includes at least one transition pin 25, the transition pin 25 has a transition solid crystal portion 251, and the transition solid crystal portion 251 is arranged between two adjacent driver chips 11, and is used to electrically connect the signal input end of one driver chip 11 with the signal output end of the other driver chip 11, thereby reducing the connection length of the bonding wire on the driver chip 11, reducing the difficulty of packaging the LED lamp, and also making the structure of the LED lamp simpler.

[0063] In an optional embodiment, the second crystal-bonding portion 221 and the fourth crystal-bonding portion 241 are disposed on both sides of the second crystal-bonding portion 221 and the first crystal-bonding portion 211 , and the transition crystal-bonding portion 251 is disposed between the second crystal-bonding portion 221 and the first crystal-bonding portion 211 .

[0064] In an optional embodiment, the first die-bonding portion 211 includes a first extension portion and at least one second extension portion 2111 perpendicular to the first extension portion. The first extension portion and the second die-bonding portion 221 extend along the length of the insulating seat 30. The second extension portion 2111 extends toward the second die-bonding portion 221 and forms an accommodating area 20b. The transition die-bonding portion 251 is disposed in the accommodating area 20b, so that the signal input and signal output terminals of two adjacent driver chips 11 can be electrically connected through the transition die-bonding portion 251, thereby reducing the length of the bonding wires and thus preventing the bonding wires from breaking during packaging. In addition, the signal input and signal output terminals of two adjacent driver chips 11 can also be electrically connected directly by bonding wires, which is not limited by the present invention.

[0065] In an optional embodiment, the number of the driving chips 11 and the light-emitting chip group 12 is three and they are arranged at equal intervals along the length direction of the insulating base 30 , the driving chip 11 is arranged on the second extension portion 2111 , and the transition solid crystal portion 251 is arranged between two adjacent second extension portions 2111 .

[0066] In an optional embodiment, the second solid crystal portion 221 has a third extension portion 2211 extending toward the first extension portion, the third extension portion 2211 is arranged adjacent to the second extension portion 2111, the first input end of the driver chip 11 is connected to the third extension portion 2211 through a bonding wire, and the transition solid crystal portion 251 is arranged in the accommodating area 20b formed between the third extension portion 2211 and the second extension portion 2111.

[0067] In an optional embodiment, the number of driving chips 11 and light-emitting chip groups 12 is four and they are arranged at equal intervals along the length direction of the insulating base 30. The driving chip 11 is arranged on the second extension portion 2111, and the transition solid crystal portion 251 is arranged between the third extension portion 2211 and the second extension portion 2111.

[0068] In an optional embodiment, the number of driving chips 11 and light-emitting chip groups 12 is at least two, at least two light-emitting chip groups 12 are correspondingly connected to two driving chips 11 and combined together in parallel, and the blue chip 122, green chip 123 and red chip 121 on each light-emitting chip group 12 are connected to the driving chip 11 in series.

[0069] Exemplarily, the number of driving chips 11 and light-emitting chip groups 12 is three, that is, the number of blue chips 122, green chips 123 and red chips 121 is three, and the three blue chips 122, three green chips 123 and three red chips 121 are correspondingly connected to the three driving chips 11 to form three light-emitting groups, that is, each driving chip 11 can control one blue chip 122, one green chip 123 and one red chip 121; at the same time, the blue chip 122, the green chip 123 and the red chip 121 are combined in series through the driving chip 11, that is, both ends of the blue chip 122, the green chip 123 and the red chip 121 are electrically connected to the driving chip 11, and the three light-emitting groups are arranged at equal intervals in parallel.

[0070] In an optional embodiment, the number of driving chips 11 and light-emitting chip groups 12 is six, that is, the number of blue chips 122, green chips 123 and red chips 121 is six, and the six blue chips 122, six green chips 123 and six red chips 121 are correspondingly connected to the six driving chips 11 to form six light-emitting groups, that is, each driving chip 11 can control one blue chip 122, one green chip 123 and one red chip 121; at the same time, the blue chip 122, the green chip 123 and the red chip 121 are combined together in parallel, and the signal input end and the signal output end between two adjacent driving chips 11 among the six driving chips 11 can also be directly bonded for electrical connection.

[0071] In an optional embodiment, there is one driver chip 11 and at least two light-emitting chip groups 12. The two light-emitting chip groups 12 are connected in series to the driver chip 11, so that the driver chip 11 can control the light-emitting chips connected in series to emit light.

[0072] In an optional embodiment, the blue chips 122 on multiple light-emitting chips are combined and connected in series, the green chips 123 on multiple light-emitting chips are combined and connected in series, and the red chips 121 on multiple light-emitting chips are combined and connected in series, and the three colors of light-emitting chips, namely the blue chip 122, the green chip 123 and the red chip 121, are arranged in parallel.

[0073] In an optional embodiment, the number of light-emitting chip groups 12 is six, the six blue chips 122 are combined and connected in series, the green chips 123 on the six light-emitting chips are combined and connected in series, the red chips 121 on the six light-emitting chips are combined and connected in series, and the six blue chips 122, the six green chips 123 and the six red chips 121 are arranged in parallel.

[0074] In an optional embodiment, the conductive foot 20 also includes at least one transition pin 25, the transition pin 25 has a transition bonding portion 251, and the transition bonding portion 251 is arranged between at least two adjacent bonding portions of the first bonding portion 211, the second bonding portion 221, the third bonding portion 231 and the fourth bonding portion 241, so that at least one of the first bonding portion 211, the second bonding portion 221, the third bonding portion 231 and the fourth bonding portion 241 can be electrically connected to the driving chip 11 and / or the light-emitting chip group 12 through the transition bonding portion 251.

[0075] In an optional embodiment, a protection device 26 is connected between the transition pin 25 and the power pin 22 to protect the device. The protection device 26 can be a resistor and / or a diode, etc., which can perform voltage division and current limiting to protect the device, including but not limited to the driver chip 11 and the light-emitting chip assembly 12.

[0076] In an optional embodiment, at least a portion of the light-emitting chip group 12 is arranged on the transition carrier and the signal input pin 23, and the remaining portion of the light-emitting chip group 12 is arranged on the power pin 22 and electrically connected to the power pin 22, so that the light-emitting chip group 12 can be arranged at equal intervals on the insulating seat 30.

[0077] In an optional embodiment, the second solid crystal portion 221 extends from the power pin 22 and extends vertically toward one side of the insulating seat 30 to form a fourth extension portion 2212. The fourth extension portion 2212 extends a fifth extension portion 2213 toward the other side of the insulating seat 30. The fifth extension portion 2213 is parallel to the fourth extension portion 2212. The driving chip 11 is arranged at the intersection of the fourth extension portion 2212 and the fifth extension portion 2213, and at least part of the light-emitting chip group 12 is arranged on the fifth extension portion 2213.

[0078] In an optional embodiment, the conductive foot 20 also includes three transition pins 25, each transition pin 25 has a transition solid crystal portion 251, and the three transition solid crystal portions 251 are arranged at intervals on the insulating seat 30. The driving chip 11 is correspondingly connected to the blue chip 122, the green chip 123 and the red chip 121 through the three transition solid crystal portions 251.

[0079] Exemplarily, the transition pin 25 includes a first transition pin 25, a second transition pin 25 and a third transition pin 25, the first transition pin 25 has a first transition solid crystal portion 2511, the second transition pin 25 has a second transition solid crystal portion 2512, and the third transition pin 25 has a third transition solid crystal portion 2513, the first transition solid crystal portion 2511 is arranged between the fifth extension portion 2213 and the fourth extension portion 2212, the second transition solid crystal portion 2512 is arranged between the fifth extension portion 2213 and the third transition solid crystal portion 2513, and the third transition solid crystal portion 2513 is arranged adjacent to the third solid crystal portion 231.

[0080] In an optional embodiment, one of the blue chip 122 and the green chip 123 is arranged on one of the transition solid crystal parts 251, the other of the blue chip 122 and the green chip 123 is arranged on another transition solid crystal part 251, and the red chip 121 is arranged on the fifth extension part 2213 and connected to the driving chip 11 through the last transition solid crystal part 251.

[0081] Exemplarily, the blue chip 122 is disposed on the first transitional die-bonding portion 2511 and electrically connected to the fifth extension portion 2213, the green chip 123 is disposed on the third transitional die-bonding portion 2513 and electrically connected to the fifth extension portion 2213, and the red chip 121 is disposed on the fifth extension portion 2213 and electrically connected to the fifth extension portion 2213. The blue chip 122 is connected to the driver chip 11 via the first transitional die-bonding portion 2511, the green chip 123 is connected to the driver chip 11 via the third transitional die-bonding portion 2513, and the red chip 121 is connected to the driver chip 11 via the second transitional die-bonding portion 2512.

[0082] In an optional embodiment, the number of light-emitting chip groups 12 is two, two blue chips 122 are arranged at both ends of one transition solid crystal part 251, two green chips 123 are arranged on the other transition solid crystal part 251, and two red chips 121 are arranged at both ends of the fifth extension part 2213.

[0083] Exemplarily, the blue chip 122 is arranged at both ends of the first transition solid crystal portion 2511 and is electrically connected to the fifth extension portion 2213, the green chip 123 is placed at both ends of the third transition solid crystal portion 2513 and is electrically connected to the fifth extension portion 2213, the red chip 121 is arranged at both ends of the fifth extension portion 2213 and is electrically connected to the fifth extension portion 2213, and the blue chip 122 is connected to the driver chip 11 through the first transition solid crystal portion 2511, the green chip 123 is connected to the driver chip 11 through the third transition solid crystal portion 2513, and the red chip 121 is connected to the driver chip 11 through the second transition solid crystal portion 2512.

[0084] In an optional embodiment, the number of light-emitting chip groups 12 is at least three, at least three blue chips 122 are equidistantly arranged along the length direction of one of the transition solid crystal parts 251, at least three green chips 123 are equidistantly arranged along the length direction of another transition solid crystal part 251, and at least three red chips 121 are equidistantly arranged along the length direction of the fourth extension part 2212.

[0085] Exemplarily, the number of light-emitting chip groups 12 is six. Six blue chips 122 are equidistantly arranged along the length of the first transitional die-bonding portion 2511 and electrically connected to the fifth extension portion 2213. Six green chips 123 are equidistantly arranged along the length of the third transitional die-bonding portion 2513 and electrically connected to the fifth extension portion 2213. Six red chips 121 are equidistantly arranged along the length of the fifth extension portion 2213 and electrically connected to the fifth extension portion 2213. Specifically, the blue chips 122 are connected to the driver chip 11 via the first transitional die-bonding portion 2511, the green chips 123 are connected to the driver chip 11 via the third transitional die-bonding portion 2513, and the red chips 121 are connected to the driver chip 11 via the second transitional die-bonding portion 2512.

[0086] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, removable connections, or integral connections. They may refer to mechanical connections or electrical connections. They may refer to direct connections or indirect connections through an intermediary, and they may refer to internal communication between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0087] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0088] The disclosure above provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described above. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numerals and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0089] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative descriptions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Claims

1. An LED strip structure, comprising a wrapping colloid, end plugs, and a strip with a plurality of LED lights arranged at equal intervals. The wrapping colloid is coated on the outside of the strip and extends along the length direction of the strip. The two ends of the strip are respectively provided with an input end and an output end. The end plugs are arranged at the two ends of the wrapping colloid to apply a damping force to the input end and the output end to prevent the input end and the output end from sliding relative to the strip. Among them, The wrapping colloid at least comprises a light-transmitting colloid and a light-shielding colloid. The strip has a strip light-emitting surface, a strip backlight surface, and two strip side surfaces. The light-shielding colloid is wrapped outside the two strip side surfaces and extends along the length direction of the strip. The light-transmitting colloid is arranged on the strip light-emitting surface and / or the strip backlight surface.

2. The strip light structure according to claim 1, wherein, A plurality of LED lights are arranged at equal intervals on the strip. The light-shielding colloid is integrally formed with the strip and forms a first long groove at the light-emitting surface of the lamp beads of the strip. The light-transmitting colloid is arranged in the first long groove so that the light emitted by the LED lamp beads can be emitted from the light-transmitting colloid in the first long groove.

3. The light strip structure according to claim 2, wherein, The light-shielding colloid forms a second long groove at the strip backlight surface of the strip. The light-transmitting colloid is arranged in the second long groove so that the strip information on the strip backlight surface can be displayed through the light-transmitting colloid.

4. The light strip structure according to claim 1, wherein, The LED lamp comprises a light-emitting component, an insulating base, a packaging adhesive, and a plurality of conductive pins. The plurality of conductive pins are arranged on the insulating base. The light-emitting component is arranged on the conductive pins and is electrically connected to the conductive pins. The packaging adhesive is packaged outside the light-emitting component. Wherein, the light-emitting component comprises at least one driving chip and a plurality of light-emitting wafer groups combined in parallel or series. The plurality of light-emitting wafer groups are arranged in sequence along the layout direction of the insulating base. At least one driving chip is electrically connected to the plurality of light-emitting wafer groups, and the distance between adjacent two light-emitting wafer groups corresponds to the distance between adjacent two LED lights.

5. The light strip structure according to claim 4, wherein, Each light-emitting wafer group comprises a blue wafer, a green wafer, and a red chip. At least one driving chip is electrically connected to each blue wafer, each green wafer, and each red chip to drive each blue wafer, each green wafer, and each red chip to emit light.

6. The strip light structure according to claim 5, wherein, The insulating base has a first end surface. The conductive pin has a die bonding part formed on the first end surface. The driving chip, the blue wafer, the green wafer, and the red chip are arranged on the die bonding part and are electrically connected to the die bonding part.

7. The strip light structure according to claim 5, wherein, The conductive pin comprises a power supply pin and a ground pin. The driving chip is electrically connected to the power supply pin and the ground pin. The blue wafer, the green wafer, and the red chip are electrically connected to the power supply pin and the driving chip, and the blue wafer, the green wafer, and the red chip are arranged at equal intervals on the insulating base.

8. The light strip structure according to claim 7, wherein, The driving chip is arranged on the ground pin, and the light-emitting wafer group is arranged on the power supply pin.

9. The light strip structure according to claim 7, wherein, The conductive pins further include a signal input pin and a signal output pin, and the signal input pin and the signal output pin are electrically connected to the signal input end and the signal output end of the driving chip respectively; or the signal input end and the signal output end between two adjacent driving chips are electrically connected, and the signal input pin and the signal output pin are electrically connected to the signal input end and the signal output end of the driving chips on both sides of the insulating base.

10. The strip light structure according to claim 9, wherein, The number of the driving chips and the light-emitting wafer groups is at least two, and at least two light-emitting wafer groups are correspondingly connected to the two driving chips and combined together in a parallel manner, so that each driving chip can correspondingly control the light emission of each light-emitting wafer group connected thereto.

11. The strip light structure according to claim 9, wherein, The number of the driving chips and the light-emitting wafer groups is at least two, and at least two light-emitting wafer groups are correspondingly connected to the two driving chips and combined together in a parallel manner, and the blue wafers, green wafers and red chips on each light-emitting wafer group are connected to the driving chip in a series manner.

12. The light strip structure according to claim 9, wherein, The number of the driving chips is one, and the number of the light-emitting wafer groups is at least two, and the two light-emitting wafer groups are connected to the driving chip in a series manner, so that the driving chip can control the light emission of the light-emitting wafers connected in series.

13. The light strip structure according to claim 12, wherein, The blue wafers on a plurality of the light-emitting wafers are connected in series, the green wafers on a plurality of the light-emitting wafers are connected in series, the red chips on a plurality of the light-emitting wafers are connected in series, and the blue wafers, green wafers and red chips are arranged in parallel.

14. The light strip structure according to claim 4, wherein, The conductive pin further includes a welding part, and the welding part is formed on the other end faces of the insulating base except the first end face.

15. The strip light structure according to claim 14, wherein, At least part of the structure of the welding part is formed with a via structure, and part of the welding material can be accommodated on the via structure.

16. The light strip structure according to claim 6, wherein, The conductive pin further includes at least one transition pin, and the transition pin has a transition die bonding part, and the transition die bonding part is arranged between at least two adjacent die bonding parts, and at least part of the light-emitting wafer groups is arranged on the transition die bonding part.

17. The strip light structure according to claim 16, wherein, The number of the light-emitting wafer groups is at least three, at least three blue wafers are arranged at equal intervals along the length direction of one of the transition die bonding parts, at least three green wafers are arranged at equal intervals along the length direction of another transition die bonding part, and at least three red chips are arranged at equal intervals along the length direction of the fourth extension part.

18. The strip light structure according to claim 16, wherein, A protection device is connected between the transition pin and the power supply pin of the conductive pin.

19. The strip light structure according to claim 1, wherein, The light-shielding colloid and the light-transmitting colloid are made of silica gel material or PU material.

20. The strip light structure according to claim 19, wherein, The strip structure is bent.

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