Substrate control device and semiconductor reaction chamber

Abstract

Provided in the present application are a substrate control device and a semiconductor reaction chamber. The substrate control device comprises a substrate bearing portion, a first driving portion, a second driving portion and a bottom tray, wherein the substrate bearing portion is used for bearing a substrate; the first driving portion is arranged below the substrate bearing portion and used for driving the substrate bearing portion to rotate within a horizontal plane, and the inside of the first driving portion is provided with a hollow area; the second driving portion comprises a cylinder portion and a rod portion, the cylinder portion being arranged inside the hollow area, one end of the rod portion being arranged inside the cylinder portion, and the other end of the rod portion being fixedly arranged on the bottom tray; and the second driving portion is configured to drive the cylinder portion to ascend and descend along the rod portion, thus driving the substrate bearing portion and the first driving portion to ascend and descend in a vertical direction. The substrate control device of the present application has a small size and is easy to install, and is thus suitable for semiconductor devices with limited space.

Description

Substrate control device and semiconductor reaction chamber Technical Field

[0001] The present application relates to the field of semiconductors, and in particular to a substrate control device and a semiconductor reaction chamber. Background Art

[0002] With the rapid development of the global technology industry, chip manufacturing technology is becoming increasingly important. Semiconductor equipment, as the vehicle for chip manufacturing, is fundamental to achieving high-precision and cutting-edge chip manufacturing processes. Various equipment, including semiconductor electroplating equipment, involves the lifting and rotation of substrates. However, some current substrate lifting and rotation devices are large and require a large amount of space, making them unsuitable for use in confined spaces. For example, some equipment, such as electroplating equipment, has limited available space. Therefore, achieving high-precision lifting and rotation within this limited space is crucial. Summary of the Invention

[0003] The technical problem to be solved by the present application is that the current substrate lifting and rotating device is relatively large in size.

[0004] To solve the above technical problems, the present application provides a substrate control device, comprising a substrate carrying part, a first driving part, a second driving part and a bottom tray, wherein the substrate carrying part is used to carry a substrate; the first driving part is arranged below the substrate carrying part, and is used to drive the substrate carrying part to rotate in a horizontal plane, and the interior of the first driving part has a hollow area; the second driving part comprises a cylinder and a rod, the cylinder is arranged in the hollow area, one end of the rod is arranged inside the cylinder, and the other end of the rod is fixed on the bottom tray, and the second driving part is configured to drive the cylinder to rise and fall along the rod, so as to drive the substrate carrying part and the first driving part to rise and fall in a vertical direction.

[0005] In order to solve the above technical problems, the present application also proposes a semiconductor reaction chamber, including at least two process positions, including the substrate control device as described above, and the substrate control device is used to drive the substrate to move to any one of the at least two process positions.

[0006] The substrate control device of the present application arranges the substrate supporting part, the first driving part, and the second driving part in a stacked manner in the vertical direction, and the second driving part and the first driving part are nested with each other, so that the substrate control device has a compact structure and has a smaller volume than other existing designs. It occupies less space and is suitable for semiconductor equipment with limited space. The substrate control device of the present application is easy to install by arranging the lifting guide on the bottom tray, and does not require operations such as alignment, and is easy to install. The substrate control device of the present application also provides a plurality of sealing members to seal the substrate control device itself and the substrate control device and the semiconductor reaction chamber, thereby avoiding mutual interference between the substrate control device and the semiconductor reaction chamber.

[0007] Summary of the Figures

[0008] The features and performance of the present application are further described by the following examples and accompanying drawings. The accompanying drawings are provided to provide a further understanding of the present application and are incorporated into and constitute a part of this application. The accompanying drawings illustrate the embodiments of the present application and, together with this specification, serve to explain the principles of the present application. In the accompanying drawings:

[0009] FIG1 is a perspective schematic diagram of a substrate control device according to an embodiment of the present application;

[0010] FIG2 is a side sectional view of the substrate control device of the embodiment shown in FIG1;

[0011] FIG3 is a schematic top view of a semiconductor reaction chamber according to an embodiment of the present application;

[0012] FIG. 4 is a second schematic top view of a semiconductor reaction chamber according to an embodiment of the present application.

[0013] Preferred embodiment of this application

[0014] To more clearly illustrate the technical solutions of the embodiments of this application, the following is a brief introduction to the drawings required for describing the embodiments. Obviously, the drawings described below are merely examples or embodiments of this application. Those skilled in the art can apply this application to other similar scenarios based on these drawings without inventive effort. Unless otherwise apparent from the context or otherwise noted, the same reference numerals in the figures represent the same structure or operation.

[0015] As used herein, unless the context clearly indicates otherwise, the terms "a," "an," "an," and / or "the" are not intended to refer to the singular but may include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements specifically identified, and these steps and elements do not constitute an exclusive list. A method or apparatus may also include other steps or elements.

[0016] Unless otherwise specifically stated, the relative arrangement of the parts and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to actual proportional relationships. The techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values ​​should be interpreted as being merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0017] In the description of this application, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of this application; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0018] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0019] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is solely for the purpose of distinguishing the corresponding components. Unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application. Furthermore, while the terms used in this application are selected from commonly known and commonly used terms, some terms mentioned in this specification may have been selected by the applicant at his or her discretion, and their detailed meanings are explained in the relevant sections of this description. Furthermore, this application should be understood not only by the actual terms used, but also by the meaning implied by each term.

[0020] The substrate control device of the present application is mainly used to carry the substrate and drive the substrate to rise and fall and rotate. It can be used in any scenario where the substrate needs to be raised, lowered and rotated, including but not limited to the annealing device in semiconductor electroplating equipment.

[0021] Figure 1 is a perspective schematic diagram of a substrate handling device according to one embodiment of the present application. Figure 2 is a side cross-sectional view of the substrate handling device according to the embodiment shown in Figure 1. As shown in Figures 1 and 2, the substrate handling device 100 according to this embodiment includes a substrate supporting portion 110, a first drive portion 120, a second drive portion 130, and a bottom tray 140. The substrate supporting portion 110 is used to support a substrate W. As shown in Figure 1, a substrate W is shown supported by the substrate supporting portion 110. In this example, the substrate supporting portion 110 is a flat-plate-shaped robotic arm having a small end 111 and a large end 112. The large end 112 is shaped and sized to accommodate the substrate W and includes several support rods on which the substrate W can be placed. The small end 111 is connected to the lifting and rotating mechanism in the substrate handling device 100. When the small end 111 is raised or rotated, it can drive the large end 112 and the substrate W to rise and fall and rotate.

[0022] The first driving unit 120 is disposed below the substrate supporting portion 110 and is configured to drive the substrate supporting portion 110 to rotate within a horizontal plane. The first driving unit 110 has a hollow interior. The second driving unit 130 includes a barrel 131 and a rod 132. The barrel 131 is disposed within the hollow interior. One end of the rod 132 is disposed within the barrel 131, and the other end of the rod 132 is fixedly mounted on the bottom tray 140. The second driving unit 130 is configured to drive the barrel 131 to rise and fall along the rod 132, thereby driving the substrate supporting portion 110 and the first driving unit 120 to rise and fall in the vertical direction D.

[0023] As shown in FIG. 2 , since the substrate control device 100 is shown in an assembled state, the cylindrical portion 131 of the second driving portion 130 is located in the hollow area inside the first driving portion 110 , and there may be some space between the two.

[0024] In some embodiments, the substrate supporting portion 110 can be directly fixedly disposed above the first driving portion 120 via its small end 111. When the first driving portion 120 rotates, the substrate supporting portion 110 can be driven to rotate. The barrel portion 131 of the second driving portion 130 is fixedly connected to the first driving portion 120. When the second driving portion 130 drives the barrel portion 131 to rise and fall along the rod portion 132, the barrel portion 131 drives the first driving portion 120 to rise and fall together, thereby driving the substrate supporting portion 110 and the substrate W to rise and fall together.

[0025] The substrate control device 100 of the present application stacks the substrate supporting part 110, the first driving part 120, and the second driving part 130 in sequence along the vertical direction D, and the second driving part 130 and the first driving part 120 are nested with each other, so that the substrate control device 100 has a compact structure and has a smaller volume than other existing designs, occupies less space, and is suitable for semiconductor equipment with limited space.

[0026] Specifically, in some embodiments, the substrate control device 100 also includes an inner sleeve 150 and an outer sleeve 160. The outer sleeve 160 is sleeved on the outer periphery of the inner sleeve 150. The lower end 161 of the outer sleeve 160 is fixedly set on the bottom tray 140. The inner sleeve 150 and the outer sleeve 160 are sealed and connected. The inner sleeve 150 includes a cylinder bottom 151 and a cylinder wall 152. The upper surface of the cylinder bottom 151 is connected to the substrate supporting part 110, and the lower surface of the cylinder bottom 151 is connected to the first driving part 120; the cylinder wall 152 is located between the outer periphery of the first driving part 120 and the outer sleeve 160.

[0027] With reference to shown in Figures 1 and 2, inner sleeve 150 and outer sleeve 160 can be embodied as cylinder.In other embodiments, inner sleeve 150 and outer sleeve 160 can also be other shapes.The barrel bottom 151 and barrel wall 152 of inner sleeve 150 can be connected to each other after being separated, or can be integrally formed.The lower end 161 of outer sleeve 160 can be fixedly arranged on bottom tray 140 by bonding, welding, screw connection and other modes, so that outer sleeve 160 and bottom tray 140 are surrounded and set to be cylindrical together.As shown in Figure 2, inner sleeve 150 and outer sleeve 160 are nested with each other, and the relative position of the two is variable along vertical direction D. Meanwhile, when second drive unit 130 rises and falls, inner sleeve 150 and outer sleeve 160 are in sealed connection state always, and the two can not separate.

[0028] Because the lower surface of the sleeve bottom 151 is connected to the first driving unit 120, when the first driving unit 120 rotates, the inner sleeve 150 is also driven to rotate. Specifically, the substrate support 110, the sleeve bottom 151, and the rotating component of the first driving unit 120 can be fixedly connected using a plurality of screws 113 shown in FIG1 .

[0029] According to these embodiments, the inner sleeve 150 and the outer sleeve 160 are sealed together, and the first and second drive units 120 and 130 are disposed within a sealed space, thereby preventing the sealed space from communicating with the outside world. When the substrate control device 100 is disposed within a semiconductor reaction chamber, this sealed connection prevents gas or liquid within the semiconductor reaction chamber from entering the substrate control device 100, thereby corroding or degrading the components therein.

[0030] This application does not limit how the inner sleeve 150 and the outer sleeve 160 are sealed. As shown in Figure 2, in some embodiments, a first sealing member 171 is provided between the inner wall 152 and the inner wall of the outer sleeve 160 to provide a sealed connection between the inner sleeve 150 and the outer sleeve 160. Specifically, the first sealing member 171 can be a sealing ring. More specifically, a first sealing member receiving groove can be provided on the cylindrical wall 152 to accommodate the first sealing member 171. In other embodiments, the first sealing member 171 can be a multi-layer sealing ring, a Variseal sealing ring, or a magnetic fluid seal, or can be a plurality of separately provided sealing members.

[0031] In some embodiments, the second driving portion 130 is a cylinder, and one end of the rod portion 132 is a piston portion 134. The piston portion 134 is located inside the cylinder portion 131 and divides the interior into an upper space 135 and a lower space 136. The rod portion 132 includes a first air channel 137 and a second air channel 138, wherein the first air channel 137 is connected to the upper space 135, and the second air channel 138 is connected to the lower space 136. Specifically, the second driving portion 130 may also include a first air inlet 211 and a second air inlet 212, wherein the first air inlet 211 is used to supply gas to the first air channel 137, and the second air inlet 212 is used to supply gas to the second air channel 138. When it is necessary to rise, gas is provided to the first air inlet 211 through the air source, and the gas enters the upper space 135 through the first air duct 137, the upper space 135 expands, the lower space 136 shrinks, and the cylinder 131 moves upward, thereby driving the first drive part 120 and the substrate supporting part 110 to rise; when it is necessary to descend, gas is provided to the second air inlet 212 through the air source, and the gas enters the lower space 136 through the second air duct 138, the lower space 136 expands, the upper space 135 shrinks, and the cylinder 131 moves downward, thereby driving the first drive part 120 and the substrate supporting part 110 to descend.

[0032] When the second driving unit 130 is a gas cylinder, due to the connection to an external gas source, the cylinder is subject to inflation and deflation during control, and gas may leak into the space enclosed by the inner sleeve 150 and the outer sleeve 160. Therefore, the sealed connection between the inner sleeve 150 and the outer sleeve 160 can also prevent this gas from entering the semiconductor reaction chamber and affecting the substrate processing.

[0033] In some embodiments, the first driving unit 120 includes a stator 121 and a rotor 122. The rotor 122 is disposed around the outer periphery of the barrel 131, and the stator 121 is disposed around the outer periphery of the rotor 122. The upper surface of the rotor 122 is fixedly connected to the lower surface of the barrel bottom 151 to drive the rotation of the inner sleeve 150 and the substrate support portion 110. According to these embodiments, the middle portion of the rotor 122 has a hollow area for the barrel 131.

[0034] In some embodiments, the first driving unit 120 is specifically a direct drive motor (DD-motor). The encoder of the DD-motor can control the rotation angle, and the speed of the motor is uniform, which can achieve high-precision control.

[0035] In some embodiments, the substrate control device 100 further includes an intermediate connecting plate 180 that is fixedly connected to both the barrel 131 and the stator 121, so that the barrel 131 drives the first drive unit 120 to move vertically. Specifically, the intermediate connecting plate 180 can be a flat plate with screws 181 disposed around its circumference. The lower surface of the stator 121 is provided with threaded holes corresponding to the screws 181, so that the stator 121 and the intermediate connecting plate 180 can be fixedly connected by screws. The middle portion of the intermediate connecting plate 180 also has a through hole for inserting the barrel 131 into the through hole and for the rod 132 to pass through. The through hole has a stepped structure that, combined with the upper surface of the intermediate connecting plate 180, allows the intermediate connecting plate 180 to support the barrel 131 and maintain a relatively fixed positional relationship with the barrel 131. The diameter of the through hole near the lower surface of the intermediate connecting plate 180 is adapted to the rod 132, allowing the intermediate connecting plate 180 to move up and down relative to the rod 132. The provision of the intermediate connecting plate 180 helps to keep the stator 121 horizontal and stably lifted during the lifting process.

[0036] In some embodiments, the substrate control device 100 further includes at least one lifting guide 220. In the embodiment shown in FIG2 , two lifting guides 220 are provided, both disposed along the vertical direction D between the intermediate connecting plate 180 and the bottom tray 140. When the barrel 131 is raised or lowered along the vertical direction D, the lifting guides 220 and the barrel 131 rise or fall synchronously. In a preferred embodiment, three lifting guides 220 are evenly disposed around the rod 132 to assist the first driving member 120, the second driving member 130, and the substrate supporting portion 110 in stably ascending or descending along the vertical direction when the barrel 131 is raised or lowered.

[0037] In the embodiment shown in FIG2 , the lifting guide 220 includes a linear bearing 221 and a guide shaft 222. One end of the linear bearing 221 is fixedly mounted on the bottom tray 140, and the guide shaft 222 is liftably mounted within the linear bearing 221. One end (the upper end in FIG2 ) of the guide shaft 222 is fixedly mounted on the intermediate connecting plate 180. A threaded hole may be defined at the upper end of the guide shaft 222, which is embedded in the interior of the intermediate connecting plate 180 and secured with a screw.

[0038] The present application sets a lifting guide 220 on the bottom tray 140. By simply adjusting the level of the bottom tray 140, it can ensure that the multiple lifting guides 220 have the same level. It is easy to install and simple to level. The matching tolerance requirements for the components are also greatly reduced, thereby reducing processing costs.

[0039] In some embodiments, the substrate control device 100 further includes a guide member 172 disposed between the cylinder wall 152 and the outer sleeve 160. The guide member 172 is configured to rise and fall synchronously with the inner sleeve 150 when the inner sleeve 150 is raised or lowered, and to maintain frictional contact with the inner wall of the outer sleeve 160 during the raising and lowering process. The guide member 172 can be specifically implemented as a guide ring, which is disposed around the cylinder wall 152 of the inner sleeve 150 and is configured to stabilize the inner sleeve 150, prevent the inner sleeve 150 from rocking left and right during movement, and maintain the inner sleeve 150 horizontal during raising and lowering and rotation, thereby also ensuring the horizontal stability of the substrate W during raising and lowering and rotation. Accordingly, a receiving groove can be provided on the cylinder wall 152 to accommodate the guide member 172.

[0040] As shown in FIG2 , in some embodiments, the outer sleeve 160 further includes a radially extending barrel edge 162, and the substrate control device 100 further includes a second sealing member 173 disposed on the lower surface of the barrel edge 162 and / or the outer wall of the outer sleeve 160. When the outer sleeve 160 is disposed in a semiconductor reaction chamber, the barrel edge 162 is used to cooperate with the semiconductor reaction chamber, and the second sealing member 173 is used to seal the outer sleeve 160 and the semiconductor reaction chamber. The second sealing member 173 is disposed on the lower surface of the barrel edge 162 and the outer wall of the outer sleeve 160, indicating that the second sealing member 173 is located at the angle between the lower surface of the barrel edge 162 and the outer wall of the outer sleeve 160, and can simultaneously contact the lower surface of the barrel edge 162 and the outer wall of the outer sleeve 160. Accordingly, a second sealing member receiving groove adapted to the second sealing member 173 can be disposed on the lower surface of the barrel edge 162 and / or the outer wall of the outer sleeve 160.

[0041] In the embodiment shown in Figure 2, the second sealing member 173 is also a sealing ring. In other embodiments, the second sealing member 173 can also be a plurality of sealing members arranged separately.

[0042] In some embodiments, the first seal 171 and the second seal 173 are composed of a flexible material.

[0043] FIG3 is a schematic top view of a semiconductor reaction chamber according to an embodiment of the present application. The semiconductor reaction chamber 300 includes at least two process positions, as shown in FIG3 , wherein two process positions P1 and P2 are shown. It is understood that a receiving chamber is provided in the semiconductor reaction chamber 300, and the substrate control device 100 can be disposed in the receiving chamber, connected to the receiving chamber via the barrel edge 162 and sealed to the receiving chamber via the second sealing member 173, thereby sealing the substrate control device 100 from the semiconductor reaction chamber 300.

[0044] In some embodiments, semiconductor reaction chamber 300 is an annealing chamber, comprising a cold plate 301 and a hot plate 302. Cold plate 301 is located at process position P1, and hot plate 302 is located at process position P2. FIG3 shows substrate support 110 located at cold plate 301, while FIG4 shows substrate support 110 located at hot plate 302.

[0045] The following describes the movement sequence of the substrate control device 100 of the present application in the semiconductor reaction chamber in conjunction with Figures 3 and 4. Assuming that Figure 3 shows the initial state, the DD motor rotates, driving the robotic arm of the substrate support portion 110 to rotate right to the cold plate 301 position P1, and the cylinder descends, driving the robotic arm to descend. The external robot delivers the substrate W from the entrance 310 and places the substrate W on the cold plate 301 station. The cylinder rises, driving the robotic arm to rise. The DD motor rotates, driving the robotic arm to rotate left to the hot plate 302 position and descend, placing the substrate W on the hot plate 302 station, as shown in Figure 4. After the annealing process is completed, the cylinder rises, driving the robotic arm to rise and pick up the substrate W. The DD motor rotates, driving the robotic arm to rotate right to the initial position of the cold plate 301, as shown in Figure 3. The cylinder descends, driving the robotic arm to descend, placing the substrate W on the cold plate 301 station, waiting for the external robot to take the substrate.

[0046] The basic concepts have been described above. It will be apparent to those skilled in the art that the above disclosures are merely examples and do not limit the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and revisions to the present application. Such modifications, improvements, and revisions are suggested in the present application and remain within the spirit and scope of the exemplary embodiments of the present application.

[0047] At the same time, this application uses specific terms to describe the embodiments of this application. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "one embodiment," "an embodiment," or "an alternative embodiment" mentioned twice or multiple times in different locations in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application may be appropriately combined.

[0048] Similarly, it should be noted that, in order to simplify the presentation of this application and thus facilitate understanding of one or more embodiments of the invention, the foregoing descriptions of the embodiments of this application sometimes combine multiple features into a single embodiment, figure, or description thereof. However, this disclosure method does not mean that the subject matter of this application requires more features than those recited in the claims. In fact, an embodiment may have fewer features than all of the features of a single embodiment disclosed above.

[0049] In some embodiments, numbers are used to describe the quantity of components and attributes. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise stated, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in this application are all approximate values, which may change according to the required characteristics of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, the settings of such numerical values ​​are as accurate as possible within the feasible range.

Claims

1. A substrate control device, characterized in that, It includes a substrate carrier, a first driving part, a second driving part and a bottom tray. Among them, the substrate carrier is used to carry a substrate; the first driving part is arranged below the substrate carrier and is used to drive the substrate carrier to rotate in a horizontal plane. There is a hollow area inside the first driving part; the second driving part includes a cylinder part and a rod part. The cylinder part is arranged in the hollow area. One end of the rod part is arranged inside the cylinder part, and the other end of the rod part is fixedly arranged on the bottom tray. The second driving part is configured to drive the cylinder part to lift along the rod part so as to drive the substrate carrier and the first driving part to lift in the vertical direction.

2. The substrate control device according to claim 1, characterized in that, It further includes an inner sleeve and an outer sleeve. The outer sleeve is sleeved on the outer periphery of the inner sleeve. The lower end of the outer sleeve is fixedly arranged on the bottom tray. The inner sleeve and the outer sleeve are hermetically connected. The inner sleeve includes a bottom and a wall. The upper surface of the bottom is connected to the substrate carrier, and the lower surface of the bottom is connected to the first driving part; the wall is located between the outer periphery of the first driving part and the outer sleeve.

3. The substrate control device according to claim 2, wherein It further includes a first seal, which is arranged between the wall and the outer sleeve.

4. The substrate control device according to claim 3, wherein The outer sleeve further includes a flange extending radially. The substrate control device further includes a second seal, which is arranged on the lower surface of the flange and / or the outer wall of the outer sleeve. When the outer sleeve is arranged in a semiconductor reaction chamber, the flange is used to cooperate and connect with the semiconductor reaction chamber, and the second seal is used to seal between the outer sleeve and the semiconductor reaction chamber.

5. The substrate control device according to claim 3, characterized in that, The first seal includes any one or a combination of several of multi-layer sealing rings, Teflon seals and magnetic fluid seals.

6. The substrate control device according to claim 2, wherein It further includes a guide member, which is arranged between the wall and the outer sleeve. The guide member is used to lift synchronously with the inner sleeve when the inner sleeve lifts and keep frictional contact with the inner wall of the outer sleeve during the lifting process.

7. The substrate control device according to claim 2, characterized in that, The first driving part includes a stator and a rotor. The rotor surrounds the outer periphery of the cylinder part, and the stator surrounds the outer periphery of the rotor. The upper surface of the rotor is fixedly connected to the lower surface of the bottom.

8. The substrate control device according to claim 7, wherein, It further includes an intermediate connecting plate, which is fixedly connected to both the cylinder part and the stator so that the cylinder part drives the first driving part to lift in the vertical direction.

9. The substrate control device according to claim 8, characterized in that, It further includes at least one lifting guide member, which is arranged vertically between the intermediate connecting plate and the bottom tray. When the cylinder part lifts in the vertical direction, the lifting guide member lifts synchronously with the cylinder part.

10. The substrate control device according to claim 9, characterized in that, The lifting guide member includes a linear bearing and a guide shaft. Among them, one end of the linear bearing is fixedly arranged on the bottom tray, the guide shaft is arranged in the linear bearing in a liftable manner, and one end of the guide shaft is fixedly arranged on the intermediate connecting plate.

11. The substrate control device according to claim 1, characterized in that, The second driving part is a cylinder, and one end of the rod part is a piston part. The piston part is located inside the cylinder part and divides the inside into an upper space and a lower space. The rod part includes a first air passage and a second air passage. Among them, the first air passage communicates with the upper space, and the second air passage communicates with the lower space.

12. A semiconductor reaction chamber includes at least two process positions, characterized in that, Comprising a substrate control device as described in any one of claims 1-11, the substrate control device being configured to move the substrate to any one of the at least two process positions.

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