Circuit board having heat dissipation structure, and electronic apparatus

Abstract

The present application provides a circuit board having a heat dissipation structure, and an electronic apparatus. The circuit board comprises: a circuit board body, a heat dissipation device, and a back plate; heating devices are deployed on the front surface and the back surface of the circuit board body; the heat dissipation device is in contact with at least part of each heating device deployed on the front surface of the circuit board body and is used for performing a heat dissipation operation on the heating device; the back plate is connected to the circuit board body, a heat dissipation member is arranged on the back plate, the heat dissipation member is in contact with at least part of the heating device deployed on the back surface of the circuit board body, and the heat dissipation member and the heat dissipation device form at least one heat dissipation link, such that the heat dissipation member transmits heat to the heat dissipation device for heat dissipation.

Description

Circuit Board with Heat Dissipation Structure and Electronic Device - Technical Field

[0001] This application relates to the technical field of circuit boards, and particularly to a circuit board with a heat dissipation structure and an electronic device. Background Art

[0002] A circuit board can be called a printed circuit board or a printed wiring board, and its English name can be Printed Circuit Board, thus it can be called a PCB board. It mainly consists of pads, vias, mounting holes, conductors, components, connectors, etc.

[0003] However, during the operation of the circuit board, the components located on the circuit board will generate a certain amount of heat during operation. If the heat cannot be dissipated in time, it may cause damage to the electrical components, thereby affecting the normal operation of the electronic device. Summary of the Invention

[0004] The embodiments of this application provide a circuit board with a heat dissipation structure and an electronic device, which can stably dissipate heat from the heat - generating devices on both sides of the circuit board, ensuring the stable and reliable operation of the electrical components.

[0005] In a first aspect, the embodiments of this application provide a circuit board with a heat dissipation function, including: a circuit board main body, with heat - generating devices deployed on both the front and back surfaces of the circuit board main body; a radiator, in contact with at least some of the heat - generating devices deployed on the front surface of the circuit board main body, for dissipating heat from the heat - generating devices; a backplane, connected to the circuit board main body, with a heat dissipation member provided on the backplane, the heat dissipation member in contact with at least some of the heat - generating devices deployed on the back surface of the circuit board main body, and the heat dissipation member and the radiator form at least one heat dissipation link, so that the heat dissipation member transfers heat to the radiator.

[0006] In some instances, the heat dissipation member is embedded in the backplane, and the upper surface of the heat dissipation member is on the same plane as the upper surface of the backplane.

[0007] In some instances, the radiator is in contact with at least some of the heat - generating devices deployed on the front surface of the circuit board main body through a heat - conducting member.

[0008] In some instances, at least one raised end for connecting to the radiator is provided on the heat dissipation member, and the at least one raised end is in contact with the radiator through a heat - conducting member to form at least one heat dissipation link.

[0009] In some examples, the size of the backplane is larger than that of the main body of the circuit board, and there is a preset gap between the protruding end and the main body of the circuit board.

[0010] In some examples, the radiator includes at least one protruding end for connecting with the heat dissipation component. The at least one protruding end is in contact with the heat dissipation component through a heat conducting component, and there is a preset gap between the protruding end and the main body of the circuit board.

[0011] In some examples, at least one first protruding end is provided on the heat dissipation component. The radiator includes at least one second protruding end for contacting the first protruding end. The first protruding end is in contact with the second protruding end through a heat conducting component to form at least one heat dissipation link.

[0012] In some examples, the backplane is an insulating board, and the main body of the circuit board is installed and connected to the backplane through an insulating layer.

[0013] In some examples, the backplane is a non-insulating electrode, and the heat conduction ability of the heat dissipation component is higher than that of the backplane.

[0014] In some examples, the heat dissipation component is a pipe structure made of a heat conducting material.

[0015] In some examples, a preset liquid is filled in the pipe structure.

[0016] In some examples, the radiator is installed at the upper front end of the main body of the circuit board through a detachable connecting piece.

[0017] In some examples, the main body of the circuit board is fixed between the upper clamping plate and the backplane. The upper clamping plate is located between the main body of the circuit board and the radiator, and the main body of the circuit board is detachably installed through the upper clamping plate and the backplane.

[0018] In a second aspect, an embodiment of the present application provides an electronic device, including: a substrate; the circuit board with a heat dissipation function described in the first aspect above, the number of the circuit boards is at least one, and the circuit boards are detachably installed on the substrate.

[0019] For the circuit board with a heat dissipation structure and the electronic device provided in this embodiment, when heat generating devices are deployed on both the front and back sides of the circuit board main body, heat dissipation operation is performed on at least some of the heat generating devices on the front side of the circuit board main body through a radiator, and heat dissipation operation is performed on at least some of the heat generating devices deployed on the back side of the circuit board main body through the heat dissipation component provided on the back plate. Since at least one heat dissipation link can be formed between the heat dissipation component and the radiator, when the heat dissipation component performs heat dissipation operation on at least some of the heat generating devices located on the back side of the circuit board main body, the heat can be transmitted to the radiator located on the front side for heat dissipation operation. In this way, the quality and efficiency of heat dissipation for the heat generating devices deployed on the circuit board main body are effectively guaranteed, and the safety and reliability of the circuit board during use are further ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or related technologies. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0021] FIG. 1 is a first schematic structural diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present application;

[0022] FIG. 2 is a second schematic structural diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present application;

[0023] FIG. 3 is a third schematic structural diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present application;

[0024] FIG. 4 is a fourth schematic structural diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present application;

[0025] FIG. 5 is a schematic structural diagram of the heat dissipation component deployed on the back plate provided by an embodiment of the present application;

[0026] FIG. 6 is a fifth schematic structural diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present application;

[0027] FIG. 7 is a sixth schematic structural diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present application;

[0028] FIG. 8 is a seventh schematic structural diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present application;

[0029] FIG. 9 is an eighth schematic structural diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present application;

[0030] FIG. 10 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

[0031] FIG. 11 is a schematic structural diagram of a circuit board with a heat dissipation function provided by an application embodiment of the present application. Detailed implementation manners

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some but not all of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without making creative efforts shall fall within the protection scope of the present application.

[0033] In the description of the embodiments of the present application, terms such as "installation", "connection", and "fixation" should be understood in a broad sense. For example, "connection" may be a fixed connection, a detachable connection, or an integral connection. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0034] In the description of the embodiments of the present application, it should be understood that terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the embodiments of the present application.

[0035] The terms "including" and "having" in the description and claims of the embodiments of the present application and any variations thereof are intended to cover non-exclusive inclusion. For example, a process or device including a series of steps does not necessarily be limited to those clearly listed steps or structures but may include other steps or structures not clearly listed or inherent to these processes or devices.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the embodiments of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0037] In the description of this specification, the descriptions with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0038] FIG. 1 is a first schematic structural diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present application; as shown in the reference drawing 1, this embodiment provides a circuit board with a heat dissipation structure, and this circuit board can perform stable heat dissipation operations on the heat-generating components. For example, this circuit board may include: a circuit board main body 1, a heat sink 3 located at the upper end of the circuit board main body 1, and a backplane 4 located at the lower end of the circuit board main body 1.

[0039] Circuit board main body 1, heat-generating devices 2 are deployed on both the front and back of the circuit board main body 1.

[0040] Heat sink 3, which is in contact with at least part of the heat-generating devices 2 deployed on the front of the circuit board main body 1, and is used for performing heat dissipation operations on the heat-generating devices 2.

[0041] Backplane 4, which is connected to the circuit board main body 1, a heat dissipation member 5 is provided on the backplane 4, the heat dissipation member 5 is in contact with at least part of the heat-generating devices 2 deployed on the back of the circuit board main body 1, and moreover, the heat dissipation member 5 and the heat sink 3 form at least one heat dissipation link so that the heat dissipation member 5 can transfer heat to the heat sink 3 for heat dissipation.

[0042] Among them, the circuit board main body 1 can be a circuit board for carrying one or more components. The carried components can include heat-generating components and non-heat-generating components. The above-mentioned heat-generating components can refer to components with relatively large power and large heat generation, such as resistors, chips, triodes, etc.; the non-heat-generating components can refer to components with relatively small power and small heat generation, such as capacitors, switch components, potentiometers, inductors, etc.

[0043] For the heat-generating components 2 deployed on the circuit board main body 1, they can be jointly deployed on one side of the circuit board main body 1. For example, all the heat-generating components 2 can be deployed (soldered) on the front or back of the circuit board main body 1. At this time, in order to ensure the stable and reliable operation of the heat-generating components 2, during the operation of the heat-generating components 2, a radiator 3 for realizing heat dissipation operation can be deployed on the same side of the heat-generating components 2.

[0044] When the heat-generating components 2 are deployed on both sides of the circuit board main body 1, that is, multiple heat-generating components 2 can be deployed on both the front and back of the circuit board main body 1. Among them, the front of the circuit board main body 1 can be the side with more components deployed, and the back of the circuit board main body 1 can be the side with fewer components deployed. Of course, for the front and back of the circuit board main body 1, those skilled in the art can flexibly configure according to specific application scenarios or application requirements as long as the front and back of the circuit board main body 1 can be distinguished. In addition, the number of heat-generating components 2 located on the front is the same as or different from the number of heat-generating components 2 located on the back, that is, the number of heat-generating components 2 located on the front can be greater than or less than the number of heat-generating components 2 located on the back.

[0045] In order to ensure that the heat-generating devices 2 on both sides J of the circuit board main body 1 can operate stably, a structure for implementing heat dissipation operations can be deployed on both sides J of the circuit board main body 1. For example, as shown in Figure 1, when the number of heat-generating devices 2 is 3, two heat-generating devices 2 can be deployed on the front side of the circuit board main body 1, and the other heat-generating device 2 can be deployed on the back side of the circuit board main body 1. At this time, in order to ensure the stable operation of the heat-generating device 2 on the front side of the circuit board main body 1, a heat sink 3 can be provided on the upper side of the circuit board main body 1. The heat sink 3 can be deployed at the upper end of the front side of the circuit board main body 1. Among them, the heat sink 3 can be installed at the upper end of the front side of the circuit board main body 1 through a detachable connecting member. The above detachable connecting member can include at least one of the following: bolts, studs, screws, etc. This not only facilitates the disassembly, replacement, and maintenance of the heat sink 3 and the circuit board main body 1, but also can reduce the cost of maintaining the circuit board.

[0046] For the deployed heat sink 3, the heat sink 3 can be in contact with at least part of the heat-generating devices 2 deployed on the front side of the circuit board main body 1. In some instances, the heat sink 3 can be directly in contact with at least part of the heat-generating devices 2 deployed on the front side of the circuit board main body 1, or the heat sink 3 can be in contact with at least part of the heat-generating devices 2 deployed on the front side of the circuit board main body 1 through a heat-conducting member, so as to dissipate heat from the above at least part of the heat-generating devices 2.

[0047] Moreover, for the heat sink 3, the heat dissipation contact surface of the heat sink 3 can be a regular plane for contacting the heat-generating device 2. At this time, for at least one heat-generating device 2 on the front side of the circuit board main body 1, the upper surfaces of all the heat-generating devices 2 are the same plane or different planes. When the upper surfaces of all the heat-generating devices 2 on the front side of the circuit board main body 1 are the same plane, the provided heat sink 3 can be in contact with all the heat-generating devices 2. At this time, the heat sink 3 can dissipate heat from all the heat-generating devices 2 on the front side of the circuit board main body 1.

[0048] Among them, the upper surfaces of all the heat-generating devices 2 located on the front side of the circuit board body 1 can not only be in the same plane, but also in different planes. As shown in Fig. 2, the upper planes of all the heat-generating devices 2 located on the front side of the circuit board body 1 can respectively form two different planes, namely plane 1 and plane 2. Since the heat dissipation contact surface of the heat sink 3 is a regular plane for contacting with the heat-generating device 2, at this time, the heat sink 3 can be in contact with the upper surfaces of some of the heat-generating devices 2 located on the front side of the circuit board body 1, so as to dissipate heat from the above-mentioned part of the heat-generating devices 2.

[0049] In addition, for the heat sink 3, the heat dissipation contact surface of the heat sink 3 can not only be a regular plane for contacting with the heat-generating device 2, but also an irregular plane for contacting with the heat-generating device 2. As shown in Fig. 3, the contact surface of the heat sink 3 for contacting with the heat-generating device 2 can include a heat dissipation contact surface 1 and a heat dissipation contact surface 2, and the heat dissipation contact surface 1 and the heat dissipation contact surface 2 are different planes. At this time, if the upper surfaces of all the heat-generating devices 2 located on the front side of the circuit board body 1 are in the same plane, then the heat sink 3 can only be in contact with some of the heat-generating devices 2 located on the front side of the circuit board body 1, so as to realize the heat dissipation operation for some of the heat-generating devices 2 deployed on the front side of the circuit board body 1.

[0050] Correspondingly, as shown in Fig. 4, when the heat dissipation contact surface of the heat sink 3 is an irregular plane for contacting with the heat-generating device 2, if the upper surfaces of all the heat-generating devices 2 located on the front side of the circuit board body 1 are in different planes, then the heat sink 3 can be in contact with all the heat-generating devices 2, that is, the heat dissipation contact surface 1 can be in contact with the upper surface of the heat-generating device 2 located on the left side, and the heat dissipation contact surface 2 can be in contact with the upper surface of the heat-generating device 2 located on the right side, so as to realize the heat dissipation operation for all the heat-generating devices 2 deployed on the front side of the circuit board body 1.

[0051] It should be noted that for the heat-generating devices 2 deployed on the circuit board body 1, the designer can flexibly configure or adjust the specific quantity and specific structural characteristics of the heat-generating devices 2 according to the specific application requirements or scenario requirements. After the heat-generating devices 2 deployed on the circuit board body 1 are determined, in order to ensure the quality and efficiency of heat dissipation for the heat dissipation devices 2, the heat dissipation contact surface of the heat sink 3 can be configured based on the specific structural characteristics of the heat-generating devices 2, so as to ensure that the heat dissipation contact surface of the heat sink 3 can be in contact with as many heat-generating devices 2 as possible, thereby realizing the heat dissipation operation for more heat-generating devices 2.

[0052] In addition, for the circuit board body 1, since the heating devices 2 are arranged on both the front and back sides of the circuit board body 1, the configured radiator 3 can dissipate heat from at least some of the heating devices 2 arranged on the front side of the circuit board body 1. For the heating devices 2 arranged on the back side of the circuit board body 1, in order to ensure the stable and reliable operation of the heating devices 2 located on the back side of the circuit board body 1, a backplane 4 can be connected to the lower end of the circuit board body 1. Among them, different materials of the backplane 4 can be installed and connected to the circuit board body 1 in different ways. In some instances, the backplane 4 can be an insulating board, and at this time, the circuit board body 1 can be installed and connected to the backplane 4 through an insulating layer. Or, in some instances, the backplane 4 can be a non-insulating board. For example, the backplane 4 can be a metal board. At this time, in order to ensure that the heat dissipation component 5 located on the circuit board body 1 can quickly and stably dissipate the heat generated by the heating device 2, the heat conduction ability of the heat dissipation component 5 is higher than that of the backplane 4. For the heat dissipation component 5 that can be arranged on the backplane 4 for heat dissipation operation, the heat dissipation component 5 can be implemented as a pipe structure composed of a heat-conducting material or a solid block structure composed of a heat-conducting material. The above-mentioned heat-conducting materials can include at least one of the following: copper, iron, aluminum, etc. For example, when the heat dissipation component 5 is implemented as a pipe structure composed of a heat-conducting material, the pipe-structured heat dissipation component 5 can be embedded on the backplane 4. As shown in FIG. 5, in order to improve the heat dissipation quality and effect, the pipe-structured heat dissipation component 5 is filled with a preset liquid, and the preset liquid can be implemented as water, hot oil, silicone oil, etc.

[0053] For the heat dissipation component 5 arranged on the backplane 4, the heat dissipation component 5 can be in contact with at least some of the heating devices 2 arranged on the back side of the circuit board body 1. For example, the heat dissipation component 5 can be in contact with at least some of the heating devices 2 through a heat-conducting member. Since the heat dissipation component 5 is arranged on the backplane 4, at least one heat dissipation link can be formed between the arranged heat dissipation component 5 and the radiator 3, so that the heat dissipation component 5 can transfer the heat to the radiator 3 for heat dissipation operation, effectively ensuring the heat dissipation quality and effect.

[0054]

[0055] ​On the other hand, the specific implementation manner of the heat dissipation member 5 disposed on the backplane 4 in this embodiment is not limited. For example, the heat dissipation member 5 can be disposed on the backplane 4 through a connecting member or an adhesive. At this time, the heat dissipation member 5 can be fixedly disposed on the upper surface of the backplane 4. Further, since the backplane 4 is installed and connected to the circuit board body 1, in order to minimize the influence of the heat dissipation member 5 on the installation and connection operation of the backplane 4 and the circuit board body 1, preferably, the heat dissipation member 5 is embedded in the backplane 4, and the upper surface of the heat dissipation member 5 and the upper surface of the backplane 4 are in the same plane.

[0056] For the circuit board with a heat dissipation structure provided in this embodiment, when heat generating devices 2 are deployed on both the front and back surfaces of the circuit board body 1, at least part of the heat generating devices 2 on the front surface of the circuit board body 1 are cooled by the radiator 3, and at least part of the heat generating devices 2 deployed on the back surface of the circuit board body 1 are cooled by the heat dissipation member disposed on the backplane 4. Since at least one heat dissipation link can be formed between the heat dissipation member 5 and the radiator 3, when the heat dissipation member 5 cools at least part of the heat generating devices 2 located on the back surface of the circuit board body 1, the heat can be transferred to the radiator 3 located on the front surface for cooling operation, effectively ensuring the quality and efficiency of cooling the heat generating devices 2 deployed on the circuit board body 1, and further ensuring the stable and reliable use of the circuit board.

[0057] FIG. 6 is a schematic structural diagram IV of a circuit board with a heat dissipation structure provided by an embodiment of the present application; on the basis of the above embodiment, referring to FIG. 6, this embodiment does not limit at least one heat dissipation link formed between the heat dissipation member 5 and the radiator 3. In some instances, the heat dissipation member 5 can be in contact with the radiator 3 through the provided raised end 501. At this time, at least one raised end 501 for connecting to the radiator 3 is provided on the heat dissipation member 5, and at least one raised end 501 is in contact with the radiator 3 through a heat conducting member to form at least one heat dissipation link.

[0058] In addition, in order to ensure the normal operation of the circuit board, the size of the backplane 4 can be larger than the size of the circuit board body 1. In order to stably form a heat dissipation link between the heat dissipation member 5 and the radiator 3 through at least one raised end 501, a preset gap can exist between the raised end 501 and the circuit board body 1. The preset gap can refer to the gap existing between the edge of the raised end 501 and the edge of the circuit board body 1, that is, the distance between the edge of the raised end 501 and the edge of the circuit board body 1 can be greater than 0.​

[0059] For the protruding end 501 provided on the heat dissipation member 5, the number of the protruding ends 501 can be one or more, and the protruding end 501 can be integrally connected or fixedly connected to the heat dissipation member. In order to ensure the heat transfer effect, the protruding end 501 can be in contact with the radiator 3 through a heat conducting member, so as to form at least one heat dissipation link. For example, when the number of the protruding ends 501 is multiple, the multiple protruding ends 501 can be in contact with the radiator 3 through the heat conducting member, so as to form multiple heat dissipation links. Through the multiple heat dissipation links, the heating device 2 can be cooled, thus effectively ensuring the quality and effect of cooling the heating device 2 on the main body 1 of the circuit board.

[0060] FIG. 7 is a sixth schematic structural diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present application; on the basis of the above embodiment, referring to FIG. 7, at least one heat dissipation link formed by the heat dissipation member 5 and the radiator 3 can not only be in contact with the radiator 3 through the protruding end 501 provided in the heat dissipation member 5, but also be in contact with the heat dissipation member 5 through the protruding end 301 provided in the radiator 3 to form at least one heat dissipation link. For example, the radiator 3 includes at least one protruding end 301 for connecting with the heat dissipation member 5, and the at least one protruding end 301 is in contact with the heat dissipation member 5 through a heat conducting member 6, and there is a preset gap between the protruding end 301 and the main body 1 of the circuit board.

[0061] Wherein, in order to ensure the normal operation of the circuit board, the size of the backplane 4 can be larger than the size of the main body 1 of the circuit board. In order to stably form a heat dissipation link between the heat dissipation member 5 and the radiator 3 through at least one protruding end 301, there can be a preset gap between the protruding end 301 and the main body 1 of the circuit board. The preset gap can refer to the gap existing between the edge of the protruding end 301 and the edge of the main body 1 of the circuit board, that is, the distance between the edge of the protruding end 301 and the edge of the main body 1 of the circuit board can be greater than 0.

[0062] For the protruding end 301 provided on the radiator 3, the number of the protruding ends 301 can be one or more, and the protruding end 301 can be integrally connected or fixedly connected to the radiator 3. In order to ensure the heat transfer effect, the protruding end 301 can be in contact with the radiator 3 through a heat conducting member 6, so as to form at least one heat dissipation link. For example, when the number of the protruding ends 301 is multiple, the multiple protruding ends 301 can be respectively in contact with the radiator 3 through the heat conducting member 6 Touching enables the formation of multiple heat dissipation links. Through these multiple heat dissipation links, heat dissipation operations can be performed on the heat-generating device 2 located on the back of the circuit board main body 1. This not only ensures the flexible diversity of the heat dissipation links but also effectively guarantees the quality and effect of heat dissipation for the heat-generating device 2 on the circuit board main body 1 based on the heat dissipation links.

[0063] FIG. 8 is a seventh schematic structural diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present application; on the basis of the above embodiment, referring to FIG. 8, the heat dissipation link can be realized not only by the protruding end provided on the heat dissipation member 5 coming into contact with the radiator 3 to form at least one heat dissipation link, or by the protruding end provided on the radiator 3 coming into contact with the heat dissipation member 5 to form at least one heat dissipation link, but also by the protruding ends provided on the heat dissipation member 5 and the radiator 3 to form at least one heat dissipation link. At this time, at least one first protruding end 501 is provided on the heat dissipation member 5, and the radiator 3 includes at least one second protruding end 301 for contacting the first protruding end 501. The first protruding end 501 is in contact with the second protruding end 301 through the heat conducting member 6 to form at least one heat dissipation link.

[0064] Among them, in order to ensure the flexible reliability of the heat dissipation link setting, the heat dissipation link can be realized not only by the heat dissipation member 5 coming into contact with the protruding end provided on the radiator 3, or by the radiator 3 coming into contact with the protruding end provided on the heat dissipation member 5, but also by the second protruding end 301 provided on the radiator 3 coming into contact with the first protruding end 501 provided on the heat dissipation member 5. And the first protruding end 501 can be integrally provided with the heat dissipation member 5 or connected through a connecting member. Similarly, the second protruding end 301 can be designed together with the radiator 3 or connected through a connecting member, as long as it can ensure that the first protruding end 501 can be stably connected to the heat dissipation member 5 and the second protruding end 301 can be stably connected to the radiator 3. Details are not described herein again.

[0065] For the heat dissipation component 5 disposed on the backplane 4, the structure and quantity of the heat dissipation component 5 can be flexibly configured according to the structural features between the backplane 4 and the main circuit board 1. In particular, for the quantity of the protruding ends 501 provided on the heat dissipation component 5, the quantity of the first protruding ends 501 provided on the heat dissipation component 5 can be at least one. Correspondingly, in order to enable the heat dissipation component 5 to form at least one heat dissipation link with the radiator 3, at least one second protruding end 301 for contacting the first protruding end 501 can be configured on the radiator 3, that is, the quantity of the second protruding ends 301 can be the same as the quantity of the first protruding ends 501, and the contact surface of the second protruding end 301 corresponds to the contact surface of the first protruding end 501. This can not only ensure the stable reliability of generating at least one heat dissipation link, but also ensure the quality and effect of dissipating heat from the heat generating device 2 based on the heat dissipation link.

[0066] FIG. 9 is a schematic structural diagram VIII of a circuit board with a heat dissipation structure provided by an embodiment of the present application; on the basis of the above embodiment, referring to FIG. 9, for the main circuit board 1, since the stiffness of the main circuit board 1 is relatively high, in order to avoid damage to the main circuit board 1 when installing and connecting the main circuit board 1, when installing and configuring the circuit board, in order to ensure the safety level of the main circuit board 1, the main circuit board 1 can be fixed between the upper clamping plate 7 and the backplane 4, and the upper clamping plate 7 is located between the main circuit board 1 and the radiator 3, and the main circuit board 1 is detachably installed on a substrate (not shown in the figure) through the upper clamping plate 7 and the backplane 4. It should be noted that the substrate can be installed with not only one main circuit board 1, but also multiple main circuit boards 1. Specifically, the quantity of the main circuit boards 1 disposed on the substrate can be flexibly configured and adjusted according to application requirements or design requirements, so as to generate an electronic device for realizing a preset function.

[0067] FIG. 10 is a schematic structural diagram of an electronic device provided by an embodiment of the present application; referring to FIG. 10, this embodiment provides an electronic device, which can include: a substrate 200; the circuit board 201 with a heat dissipation function in the above embodiment, the quantity of the circuit boards 201 is at least one, and the circuit boards 201 are detachably installed on the substrate 200.

[0068] Among them, the specific shape structure, implemented functions, and achieved effects of the circuit board 201 in this embodiment are similar to those of the circuit board in the above-mentioned embodiment. For specific details, reference can be made to the above description, which will not be elaborated here.

[0069] In the electronic device of this embodiment, by configuring a circuit board 201 with a heat dissipation function on the substrate 200, an electronic device with preset functions can be realized. Since the circuit board 2 has a heat dissipation structure, the stable and reliable operation of the circuit board 201 is effectively ensured, the safety and reliability of the use of the electronic device are further improved, and the practicality of the electronic device is further enhanced.

[0070] In specific applications, as shown in Figure 11 for reference, taking a heat pipe as the heat dissipation component 5 and the circuit board corresponding to the OCP accelerator module (OCP Accelerator Module, abbreviated as 0AM) corresponding to the parallel processing unit (Parallel Processing Unit, abbreviated as PPU) as the circuit board main body 1, this application embodiment provides a circuit board corresponding to the 0AM module. For the provided circuit board, by embedding a heat pipe 5 in the structural backplane 4 of the 0AM module, the heat of the heat-generating device 2 deployed on the back of the 0AM circuit board can be transferred to the top radiator 3 through the heat pipe 5, thereby solving the problems of complex assembly and poor maintainability of the conventional backside heat dissipation scheme.

[0071] For example, the circuit board may include a 0AM circuit board main body 1, a radiator 3, and a backplane 4.

[0072] The 0AM circuit board main body 1 has heat-generating devices 2 deployed on both the front and back of the 0AM circuit board main body 1, and the 0AM circuit board main body 1 is fixed between the upper clamping plate (not shown in the figure) and the backplane 4.

[0073] The radiator 3 is located at the upper end of the front of the 0AM circuit board main body 1 and is in contact with the heat-generating device 2 deployed on the front of the circuit board main body 1 through a heat-conducting material, and is used for dissipating heat from the heat-generating device 2.

[0074] The backplane 4 is detachably connected to the circuit board main body 1. A heat pipe 5 is embedded in the backplane 4, and the upper surface of the heat pipe 5 is in the same plane as the upper surface of the backplane 4. The heat pipe 5 is in contact with at least part of the heat-generating devices 2 deployed on the back of the circuit board main body 1. Moreover, the length, shape, and path of the heat pipe 5 can be determined according to the specific The structure and layout of the body can be flexibly adjusted, and the heat sink 5 and the heat sink 3 form at least one heat dissipation link, so that the heat sink 5 transfers heat to the heat sink 3 for heat dissipation.

[0075] The substrate 8, the OAM circuit board body 1 is mounted on the substrate 8 through the backplane 4, and at least one OAM circuit board body 1 is deployed on the substrate 8 to realize the preset function.

[0076] It should be noted that the contact position or contact surface between the heat pipe on the back plate 4 and the top heat sink 3 can be flexibly set or adjusted according to the component structure space and heat dissipation requirements on the circuit board body 1. In some instances, the heat pipe can be designed at any one or more of the four ends of the circuit board body 1, and the heat pipe can be other materials with strong thermal conductivity, such as: copper block, aluminum block, etc. The boss structure where the heat pipe 5 contacts the heat sink 3 can be the boss structure on the heat sink 3, or it can be the boss structure of the heat pipe 5 on the back plate, thereby ensuring the flexibility and reliability of the circuit board design.

[0077] The circuit board provided in the present application embodiment can transfer the heat of the bottom heating device 2 of the circuit board body 1 to the radiator 3 on the top surface for heat dissipation through the heat pipe 5 or other high-temperature metal material embedded in the back plate 4. The heat dissipation solution is not only simple and reliable, but also adopts a top heat dissipation solution with high heat dissipation quality. At the same time, the heat dissipation structure is decoupled from the substrate and its back plate, so that not only does it not need to groove the substrate, but it is also easy to maintain. When replacing and maintaining components, there is no need to replace the thermal conductive material, and the subsequent maintainability is good. This effectively ensures the flexibility and reliability of the use of the circuit board, and further ensures the practicality of the circuit board.

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

Claims 1. A circuit board with heat dissipation function, comprising: The main body of the circuit board, with heating devices deployed on both the front and back surfaces of the main body of the circuit board; A radiator, which is in contact with at least some of the heating devices deployed on the front surface of the main body of the circuit board and is used to dissipate heat from the heating devices; A backplane, which is connected to the main body of the circuit board. A heat dissipation member is provided on the backplane, and the heat dissipation member is in contact with at least some of the heating devices deployed on the back surface of the main body of the circuit board. Moreover, the heat dissipation member and the radiator form at least one heat dissipation link so that the heat dissipation member transfers heat to the radiator for heat dissipation.

2. The circuit board according to claim 1, wherein The heat dissipation member is embedded in the backplane, and the upper surface of the heat dissipation member is on the same plane as the upper surface of the backplane.

3. The circuit board according to claim 1, wherein The radiator is in contact with at least some of the heating devices deployed on the front surface of the main body of the circuit board through a heat conducting member.

4. The circuit board according to claim 1, wherein, At least one protruding end for connecting with the radiator is provided on the heat dissipation member, and the at least one protruding end is in contact with the radiator through a heat conducting member to form at least one heat dissipation link.

5. The circuit board according to claim 4, wherein, The size of the backplane is larger than that of the main body of the circuit board, and there is a preset gap between the protruding end and the main body of the circuit board.

6. The circuit board according to claim 1, wherein The radiator includes at least one protruding end for connecting with the heat dissipation member, the at least one protruding end is in contact with the heat dissipation member through a heat conducting member, and there is a preset gap between the protruding end and the main body of the circuit board.

7. The circuit board according to claim 1, wherein At least one first protruding end is provided on the heat dissipation member, and the radiator includes at least one second protruding end for contacting with the first protruding end. The first protruding end is in contact with the second protruding end through a heat conducting member to form at least one heat dissipation link.

8. The circuit board according to any one of claims 1-7, wherein The backplane is an insulating board, and the main body of the circuit board is installed and connected to the backplane through an insulating layer.

9. The circuit board according to any one of claims 1-7, wherein The backplane is a non-insulating board, and the heat conduction ability of the heat dissipation member is higher than that of the backplane.

10. The circuit board according to any one of claims 1-7, wherein The heat dissipation member is a pipe structure made of a heat conducting material.

11. The circuit board according to claim 10, wherein, A preset liquid is filled in the pipe structure.

12. The circuit board according to any one of claims 1-7, wherein, The radiator is installed at the upper end of the front surface of the main body of the circuit board through a detachable connector.

13. The circuit board according to any one of claims 1-7, wherein, The main body of the circuit board is fixed between the upper clamping plate and the backplane. The upper clamping plate is located between the main body of the circuit board and the radiator, and the main body of the circuit board is detachably installed on the substrate through the upper clamping plate and the backplane.

14. An electronic device, comprising: Substrate; The circuit board with a heat dissipation function according to any one of claims 1-13, the number of the circuit boards is at least one, and the circuit boards are detachably installed on the substrate.

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