Mixing-type heat exchanger
The hybrid heat exchanger with a multi-channel structure and mixing chambers addresses inefficiencies in droplet aerosol vaporization, ensuring complete vaporization and preventing liquefaction, thereby reducing contaminant particles and operational costs in thin film deposition processes.
Patent Information
- Application Number
- PCT/KR2024/019002
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-01-12
- Filing Date
- 2024-11-27
- Publication Date
- 2025-07-17
AI Technical Summary
Existing methods for vaporizing droplet aerosols in thin film deposition processes for semiconductor devices are inefficient, leading to incomplete vaporization and liquefaction, which results in contaminant particles, and incur high process design, maintenance, and management costs.
A hybrid heat exchanger with a multi-channel structure and mixing chambers that increases the surface area of contact and residence time for droplet aerosols and vapors, using a heater unit to supply thermal energy, ensuring complete vaporization and preventing liquefaction.
The hybrid heat exchanger effectively vaporizes droplet aerosols and prevents liquefaction, reducing contaminant particles and lowering operational costs by enhancing thermal energy distribution.
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Figure KR2024019002_17072025_PF_FP_ABST
Abstract
Description
mixed heat exchanger
[0001] The present invention relates to a heat exchanger for a vaporization device for thin film deposition of a semiconductor device, and more particularly, to a mixed heat exchanger positioned between a vaporization device and a chamber to completely vaporize a liquid aerosol that has not been vaporized in the vaporization device or a liquid aerosol formed by liquefaction while vaporized in the vaporization device flows to the chamber.
[0002] In semiconductor device and display manufacturing processes, a thin film deposition process using a liquid precursor is commonly performed. This process can be accomplished by transforming the liquid precursor into a finely divided droplet aerosol into a vapor state via a vaporizer, supplying it into a chamber, and depositing the vapor onto a substrate within the chamber.
[0003] At this time, droplet aerosols may not be vaporized due to heat loss in the vaporizer, or may liquefy while the vapor flows through the path from the vaporizer to the chamber. These droplet aerosols can become a source of contaminant particles in the thin film deposition process.
[0004] Conventional techniques have disclosed methods for supplying thermal energy to droplet aerosols and vapors by wrapping a heating wire around a flow path to prevent the generation of contaminant particles during such thin film deposition processes. In particular, a method is disclosed in which the flow path is formed of a metal with high thermal conductivity, thereby supplying a large amount of thermal energy to the droplet aerosols and vapors in a short period of time.
[0005] However, since the droplet aerosol and vapor pass through the channel quickly, they come into contact with the channel, and it is difficult for the droplet aerosol and vapor that are not in contact with the channel to receive sufficient thermal energy compared to the droplet aerosol and vapor, so the droplet aerosol is not completely vaporized and the vapor may liquefy. To prevent this, a method has been proposed to increase the surface area of the droplet aerosol and vapor in contact with the channel by heating the channel to a high temperature or forming the diameter of the channel narrow. This method can completely vaporize the droplet aerosol and vapor and prevent the liquefaction of the vapor by supplying a lot of thermal energy to the droplet aerosol and vapor. However, when applied to actual process equipment, there is a problem of inefficiency due to increased process design costs, maintenance costs, and management costs.
[0006] Therefore, there is a need to develop a device that can more efficiently completely vaporize droplet aerosols and prevent liquefaction of vapor.
[0007] [Patent Document]
[0008] Patent Publication No. 10-2125183 (June 22, 2020)
[0009] Accordingly, the purpose of the present invention is to provide a mixed heat exchanger that completely vaporizes a droplet aerosol and prevents liquefaction of the vapor, thereby preventing the generation of contaminant particles in a thin film deposition process of a semiconductor.
[0010] In order to achieve the above object, a mixed heat exchanger according to the present invention is formed with a multi-channel structure and includes a plurality of heat exchange units that mix and heat liquid aerosol of a liquid precursor and vaporized liquid aerosol in a vertical direction, and includes a heat exchange part having an inlet for introducing the liquid aerosol and vapor, and an outlet for discharging the vapor; and a heater part located on an outer surface of the heat exchange part and heating the heat exchange part.
[0011] The heat exchange unit may include a first heat exchange unit formed in a multi-channel structure and mixing and heating the droplet aerosol and vapor introduced through the inlet in an up-and-down direction and a center-to-outward direction; a second heat exchange unit formed in a multi-channel structure and connected to the outlet and mixing and heating the droplet aerosol and vapor introduced through the first heat exchange unit in an up-and-down direction and a center-to-outward direction; and a first mixing chamber formed between the first and second heat exchange units and allowing the droplet aerosol and vapor introduced through the first heat exchange unit to be mixed with each other and introduced into the second heat exchange unit.
[0012] The first heat exchange unit may include a first passage, which is a tube positioned at the center of the heat exchange section, the upper portion of which is connected to the inlet, and through which the droplet aerosol and vapor introduced through the inlet move downward; a second passage, which is a plurality of tubes surrounding the outer side of the first passage, through which the droplet aerosol and vapor introduced through the first passage move upward; a third passage, which is a plurality of tubes surrounding the outer side of the second passage, through which the droplet aerosol and vapor introduced through the second passage move downward; a second mixing chamber formed at a lower portion of the first and second passages, through which the droplet aerosol and vapor introduced through the first passage are mixed with each other and introduced into the second passage; and a third mixing chamber formed at an upper portion of the second and third passages, through which the droplet aerosol and vapor introduced through the second passage are mixed with each other and introduced into the third passage.
[0013] The second heat exchange unit may include a fourth passage through which the droplet aerosol and vapor passing through the first mixing chamber move downward, the fourth passage through which the droplet aerosol and vapor passing through the first mixing chamber move upward, the fifth passage through which the droplet aerosol and vapor passing through the fourth passage move upward, the sixth passage through which the droplet aerosol and vapor passing through the fifth passage move downward, the fourth mixing chamber formed below the fourth and fifth passages and allowing the droplet aerosol and vapor passing through the fourth passage to mix with each other and flow into the fifth passage, and the fifth mixing chamber formed above the fifth and sixth passages and allowing the droplet aerosol and vapor passing through the fifth passage to mix with each other and flow into the sixth passage.
[0014] The heat exchanger according to the present invention includes a heat exchange unit formed with a multi-channel structure, thereby increasing the surface area of the droplet aerosol and vapor in contact with the channel and increasing the time that the droplet aerosol and vapor remain in the heat exchange unit, thereby supplying a large amount of heat energy.
[0015] The heat exchanger according to the present invention can evenly supply thermal energy to the droplet aerosol and vapor by including a heat exchange unit that allows the droplet aerosol and vapor to move up and down and mix with each other.
[0016] In addition, the heat exchanger according to the present invention can include a mixing chamber formed between a plurality of heat exchange units so that droplet aerosol and vapor passing through each heat exchange unit are mixed with each other.
[0017] That is, the heat exchanger according to the present invention is positioned between the vaporizer and the chamber, and completely vaporizes the liquid aerosol that was not vaporized in the vaporizer or the liquid aerosol that was formed by liquefying the vapor vaporized in the vaporizer while flowing to the chamber, and prevents the liquefaction of the vapor, thereby preventing the generation of contaminant particles in the thin film deposition process.
[0018] FIG. 1 is a drawing showing a longitudinal cross-section of a heat exchanger according to an embodiment of the present invention.
[0019] Figure 2 is a drawing showing a cross-section of a heat exchanger according to an embodiment of the present invention.
[0020] The present invention is being filed with the support of the tasks described in [Table 1].
[0021] Project number 00434116 Ministry name Ministry of Trade, Industry and Energy Project management (specialized) Organization name Korea Institute for Advancement of Technology Research project name Materials and components industry technology-based innovation (mass production performance evaluation support) Research project name Mass production performance evaluation of DLI (Direct Liquid Injection) type vaporizer for TEOS deposition process Project performing organization name ASK Co., Ltd. Research period 2024.05.01 ~ 2025.04.30
[0022] It should be noted that in the following description, only the parts necessary for understanding the embodiments of the present invention are described, and the description of other parts will be omitted to the extent that it does not deviate from the gist of the present invention.
[0023] The terms and words used in this specification and claims described below should not be interpreted as limited to their conventional or dictionary meanings, but should be interpreted with meanings and concepts that conform to the technical idea of the present invention based on the principle that the inventor can appropriately define the concept of the term to best describe his or her own invention. Therefore, the embodiments described in this specification and the configurations illustrated in the drawings are merely preferred embodiments of the present invention and do not represent all of the technical idea of the present invention. Therefore, it should be understood that there may be various equivalents and modified examples that can replace them at the time of this application.
[0024] Hereinafter, embodiments of the present invention will be described in more detail with reference to the attached drawings.
[0025] FIG. 1 is a drawing showing a longitudinal cross-section of a heat exchanger according to an embodiment of the present invention, and FIG. 2 is a drawing showing a cross-section of a heat exchanger according to an embodiment of the present invention.
[0026] Referring to FIGS. 1 and 2, a heat exchanger (100) according to an embodiment is a heat exchanger for a vaporization device for thin film deposition of a semiconductor element, and includes a heat exchange unit (10) formed in a multi-flow path structure and including a plurality of heat exchange units that mix and heat liquid aerosol of a liquid precursor and vaporized liquid aerosol in an up-and-down direction, and a heater unit (20) located on the outer surface of the heat exchange unit (10) and heats the heat exchange unit (10).
[0027] Semiconductor device and display manufacturing processes typically involve thin film deposition using liquid precursors. This process can be accomplished by transforming the liquid precursor into finely divided droplet aerosols through a vaporizer, converting them into a vapor state, supplying the vapor to a chamber, and depositing the vapor onto a substrate within the chamber. However, droplet aerosols that fail to vaporize in the vaporizer, or droplet aerosols formed by liquefaction of vapor due to heat loss as it flows from the vaporizer to the chamber, can become sources of contamination during the thin film deposition process.
[0028] Accordingly, the heat exchanger (100) according to the embodiment is positioned between the vaporizer and the chamber, and completely vaporizes the liquid aerosol that was not vaporized in the vaporizer or the liquid aerosol that was formed by liquefying the vapor vaporized in the vaporizer while flowing to the chamber, and prevents the liquefaction of the vapor, thereby preventing the generation of contaminant particles in the thin film deposition process.
[0029] Hereinafter, the configuration of the heat exchanger (100) according to the embodiment will be described in more detail.
[0030] The heat exchanger (10) may be connected to a vaporizer and may have an inlet (11a) through which liquid aerosol that has not been vaporized in the vaporizer and vaporized in the vaporizer are introduced, and an outlet (11b) connected to a chamber and which discharges vapor into the chamber.
[0031] In addition, the heat exchange unit (10) may include a plurality of heat exchange units. For example, the heat exchange unit (10) may include a first heat exchange unit (13), a second heat exchange unit (15) formed at the lower portion of the first heat exchange unit (13), and a first mixing chamber (14) positioned between the first and second heat exchange units (13, 15).
[0032] The first and second heat exchange units (13, 15) are formed in a multi-flow path structure, and can mix and heat the droplet aerosol and vapor in the vertical direction. The shape of the first and second heat exchange units (13, 15) is not particularly limited, but is preferably cylindrical. In addition, the material of the first and second heat exchange units (13, 15) is not particularly limited, but is preferably formed of a metal with high thermal conductivity.
[0033] In general, liquid aerosols and vapors can be supplied with thermal energy in proportion to the surface area in contact with the flow path. Therefore, the heat exchanger (100) according to the embodiment includes first and second heat exchange units (13, 15) formed in a multi-flow path structure, thereby increasing the surface area in which liquid aerosols and vapors are in contact with the flow path and increasing the time that liquid aerosols and vapors remain in the first and second heat exchange units (13, 15), thereby supplying a large amount of thermal energy, thereby completely vaporizing liquid aerosols and preventing liquefaction of vaporized vapors.
[0034] Specifically, the first heat exchange unit (13) can heat and mix the liquid aerosol and vapor introduced through the inlet (11a) in the up-down direction and from the center to the outside, and can include a first flow path (13a), a second flow path (13b), a third flow path (13c), a second mixing chamber (13d), and a third mixing chamber (13e).
[0035] Here, the first flow path (13a) may be a pipe located at the center of the heat exchanger (10), the second flow path (13b) may be a plurality of pipes surrounding the outer side of the first flow path (13a), and the third flow path (13c) may be a plurality of pipes surrounding the outer side of the second flow path (13b). The second mixing chamber (13d) may be formed at the lower part of the first and second flow paths (13a, 13b), and may allow the droplet aerosol and vapor passing through the first flow path (13a) to be mixed with each other and flow into the second flow path (13b). In addition, the third mixing chamber (13e) may be formed at the upper part of the second and third flow paths (13b, 13c), and may allow the droplet aerosol and vapor passing through the second flow path (13b) to be mixed with each other and flow into the third flow path (13c).
[0036] For example, droplet aerosol and vapor can move downward through the first flow path (13a) connected to the upper inlet (11a) and flow into the second mixing chamber (13d). The droplet aerosol and vapor that flow into the second mixing chamber (13d) can collide with the lower part of the second mixing chamber (13d) and mix with each other, and can move outward from the center and flow into the second flow path (13b). The droplet aerosol and vapor that flow into the second flow path (13b) can move upward through the second flow path (13b) and flow into the third mixing chamber (13e). The droplet aerosol and vapor that flow into the third mixing chamber (13e) can collide with the upper part of the third mixing chamber (13e) and mix with each other, and can move outward from the center and flow into the third flow path (13c). The droplet aerosol and vapor introduced into the third flow path (13c) can move downward through the third flow path (13c).
[0037] The first heat exchange unit (13) is formed as a multi-flow path structure including first to third flow paths (13a, 13b, 13c) to increase the surface area of the droplet aerosol and vapor in contact with the flow paths, but it may still be difficult for the droplet aerosol and vapor that do not come into contact with the flow paths to be supplied with sufficient heat energy.
[0038] Therefore, the first heat exchange unit (13) can evenly supply heat energy to the droplet aerosol and vapor by allowing the droplet aerosol and vapor to move up and down and mix with each other, thereby completely vaporizing the droplet aerosol and preventing liquefaction of the vaporized vapor.
[0039] In addition, the first mixing chamber (14) is formed between the first and second heat exchange units (13, 15), and the droplet aerosol and vapor passing through the first heat exchange unit (13) can be mixed with each other and introduced into the second heat exchange unit (15).
[0040] The second heat exchange unit (15) can mix and heat the droplet aerosol and vapor that have passed through the first heat exchange unit (13) in the up-down direction and from the outside to the center, and has a multi-flow path structure similar to the first heat exchange unit (13). Specifically, the second heat exchange unit (15) can include a fourth flow path (15a), a fifth flow path (15b), a sixth flow path (15c), a fourth mixing chamber (15d), and a fifth mixing chamber (15e).
[0041] Here, the fourth flow path (15a) may be a plurality of pipes positioned below the third flow path (13c), the fifth flow path (15b) may be a plurality of pipes surrounding the inside of the fourth flow path (15a), and the sixth flow path (15c) may be a pipe positioned inside the fifth flow path (15b). The fourth mixing chamber (15d) may be formed below the fourth and fifth flow paths (15a, 15b), and may allow the droplet aerosol and vapor passing through the fourth flow path (15a) to be mixed with each other and flow into the fifth flow path (15b). In addition, the fifth mixing chamber (15e) may be formed above the fifth and sixth flow paths (15b, 15c), and may allow the droplet aerosol and vapor passing through the fifth flow path (15b) to be mixed with each other and flow into the sixth flow path (15c).
[0042] For example, the droplet aerosol and vapor can move downward through the fourth passage (15a) connected to the first mixing chamber (14) at the top and flow into the fourth mixing chamber (15d). The droplet aerosol and vapor that have flowed into the fourth mixing chamber (15d) can collide with the lower portion of the fourth mixing chamber (15d) to mix with each other, and can move from the outside toward the center and flow into the fifth passage (15b). The droplet aerosol and vapor that have flowed into the fifth passage (15b) can move upward through the fifth passage (15b) to flow into the fifth mixing chamber (15e). The droplet aerosol and vapor that have flowed into the fifth mixing chamber (15e) can collide with the upper portion of the fifth mixing chamber (15e) to mix with each other, and can move from the outside toward the center and flow into the sixth passage (15c). The droplet aerosol and vapor introduced into the 6th flow path (15c) can move downward through the 6th flow path (15c).
[0043] Therefore, the second heat exchange unit (15) can evenly supply heat energy to the droplet aerosol and vapor by allowing the droplet aerosol and vapor to move up and down and mix with each other, thereby completely vaporizing the droplet aerosol and preventing liquefaction of the vaporized vapor.
[0044] The heater unit (20) is positioned on the outer surface of the heat exchange unit (10) and surrounds the heat exchange unit (10) to heat it, thereby vaporizing the liquid aerosol present inside the heat exchange unit (10). For example, the heater unit (20) may be a band heater, but is not limited thereto.
[0045] In addition, the heat exchanger according to the present invention may be in the form of a plurality of heat exchangers (100) according to the embodiment connected in series.
[0046] Meanwhile, the embodiments disclosed in this specification and drawings are merely specific examples to aid understanding and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical concepts of the present invention are possible in addition to the embodiments disclosed herein.
[0047] [Explanation of symbols]
[0048] 100: Heat exchanger
[0049] 10: Heat exchanger
[0050] 11a: Inlet
[0051] 11b: exhaust port
[0052] 13: First heat exchange unit
[0053] 13a: 1st Euro
[0054] 13b: Second Euro
[0055] 13c: Third Euro
[0056] 13d: Second mixing room
[0057] 13e: Third Mixing Room
[0058] 14: Mixing Room 1
[0059] 15: Second heat exchange unit
[0060] 15a: 4th Euro
[0061] 15b: 5th Euro
[0062] 15c: 6th Euro
[0063] 15d: Mixing Room 4
[0064] 15e: Mixing Room 5
[0065] 20: Heater section
Claims
1. A heat exchange unit formed with a multi-flow structure and including a plurality of heat exchange units that mix and heat the liquid aerosol of the liquid precursor and the vaporized vapor of the liquid aerosol in the vertical direction, and having an inlet for introducing the liquid aerosol and vapor, and an outlet for discharging the vapor; and A heater part located on the outer surface of the heat exchange part and heating the heat exchange part is included; The above heat exchanger, A first heat exchange unit formed with a multi-channel structure, which mixes and heats the aerosol and vapor droplets introduced through the inlet formed in the center and moves them in the up-and-down direction and from the center to the periphery; A second heat exchange unit formed at the lower portion of the first heat exchange unit and having a multi-channel structure that is symmetrical with the first heat exchange unit, and moves the droplet aerosol and vapor passing through the first heat exchange unit in the vertical direction and from the periphery to the center, mixing and heating them, and discharging them through the discharge port formed in the center; and A first mixing chamber formed between the first and second heat exchange units, wherein the liquid aerosol and vapor discharged from the outer periphery of the first heat exchange unit are mixed with each other and introduced into the outer periphery of the second heat exchange unit; A hybrid heat exchanger comprising:
2. In paragraph 1, The above first heat exchange unit, A first flow path, which is a tube located in the center of the heat exchanger, the upper part of which is connected to the inlet port, and through which the liquid droplet aerosol and vapor introduced through the inlet port move downward; A second passage, comprising a plurality of tubes surrounding the outer side of the first passage, through which the droplet aerosol and vapor passing through the first passage move upward; A third channel, which is a plurality of tubes positioned on the periphery of the heat exchanger and surrounding the outer side of the second channel, through which the droplet aerosol and vapor passing through the second channel move downward; A second mixing chamber formed at the lower portion of the first and second passages, and allowing the droplet aerosol and vapor passing through the first passage to mix with each other and flow into the second passage; and A third mixing chamber formed on the upper part of the second and third passages, and allowing the droplet aerosol and vapor passing through the second passage to mix with each other and flow into the third passage; A hybrid heat exchanger comprising:
3. In paragraph 1, The above second heat exchange unit, A fourth path having a plurality of tubes positioned on the periphery of the heat exchanger, the upper portion of which is connected to the first mixing chamber, and through which the droplet aerosol and vapor passing through the first mixing chamber move downward; A fifth passage, which is surrounded by a plurality of pipes and through which the droplet aerosol and vapor passing through the fourth passage move upward; A sixth path, which is located in the center of the heat exchanger and surrounded by the fifth path, through which the droplet aerosol and vapor passing through the fifth path move downward and are discharged through the outlet connected at the bottom; A fourth mixing chamber formed at the lower part of the fourth and fifth passages, and allowing the droplet aerosol and vapor passing through the fourth passage to mix with each other and flow into the fifth passage; and A fifth mixing chamber formed on the upper portion of the fifth and sixth passages, and allowing the droplet aerosol and vapor passing through the fifth passage to mix with each other and flow into the sixth passage; A hybrid heat exchanger comprising:
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