Memory card and manufacturing method for memory card

Abstract

The present application discloses a memory card and a manufacturing method for the memory card. The memory card comprises a memory main body and a metal sheet. The memory main body comprises a substrate, wherein the substrate has one surface provided with a gold finger, and the other surface provided with a memory chip; and a first insulator, arranged on the substrate and covering the memory chip. The memory card further comprises the metal sheet, and the metal sheet is fixed to at least one surface of the memory main body facing away from the gold finger. By providing the metal sheet having high hardness and resistance to high pressure on the at least one surface facing away from the gold finger, the memory card having one surface to which the metal sheet is attached and fixed has a better three-proof effect, achieving waterproof and dustproof effects and improving the resistance to high pressure, so that the memory card can still be normally used without damage under high bending pressure; in addition, the metal sheet is not prone to scratches, and lines such as a logo and a promotional picture silk-screened on the surface of the metal sheet can be maintained for a long period of time and are not prone to scratches, thereby avoiding affecting the appearance of the metal sheet.

Description

Memory card and method for manufacturing memory card

Technical field

[0001] The present application relates to the technical field of memory cards, and in particular to a memory card and a method for manufacturing the memory card. [Background Technology]

[0002] A memory card, also known as a flash memory card, is a solid-state electronic flash memory data storage device, typically in the form of a card or block. It typically uses memory chips as the storage medium. It is primarily used in digital cameras, tablets and laptops, music players, handheld game consoles, and other electronic devices. It provides a reusable read / write storage format that does not require an external power source.

[0003] Among them, the existing triple-proof memory card (ie, waterproof, dustproof, and high-pressure-proof) is made of epoxy resin by one-time injection molding. This type of triple-proof memory card has poor high-pressure-proof effect.

[0004] [Summary of the invention]

[0005] The main technical problem solved by the present application is to provide a memory card and a method for manufacturing the memory card, so as to improve the high-voltage protection effect of the memory card.

[0006] In order to solve the above technical problems, the first technical solution adopted in this application is to provide a memory card, which includes a storage body and a metal sheet; the memory card includes: a storage body, the storage body includes: a substrate, one side of the substrate is provided with a gold finger, and the other side of the substrate is provided with a memory chip; a first insulator is provided on the substrate and covers the memory chip; the memory card also includes: a metal sheet, the metal sheet is fixed to the side of the storage body at least facing away from the gold finger.

[0007] In one possible embodiment, the metal sheet includes a main body and a locking portion, the main body is connected to the locking portion on at least two opposite sides, and the main body and the locking portion are integrally connected; the memory card also includes: a second insulator, the second insulator is fixed on the side wall of the storage body, and is arranged around the storage body along the side wall of the storage body; wherein the second insulator also covers the locking portion to fix the metal sheet and the storage body together.

[0008] In a possible implementation manner, one side of the second insulator is bent and extended toward the center of the storage body to form a fixing portion, and the fixing portion covers the clamping portion to fix the metal sheet.

[0009] In a possible implementation manner, the main body and the locking portion of the metal sheet are both attached to one side of the storage body, and the thickness of the locking portion is no greater than the thickness of the main body.

[0010] In a possible implementation manner, the main body of the metal sheet is attached to one side of the storage body, and the locking portion extends perpendicular to the main body along a side wall of the storage body.

[0011] In one possible embodiment, the thickness of the main body ranges from 0.1 mm to 1 mm; the projected area of ​​the metal sheet on the side of the memory card on which the metal sheet is provided is at least 40% of the area of ​​the side; and the memory card further includes: a label card, which is attached to the side of the main body facing away from the storage body.

[0012] In a possible implementation manner, the second insulator further covers a side of the storage body where the gold finger is provided, and is formed with an opening to allow the gold finger to be exposed.

[0013] In order to solve the above technical problems, the second technical solution adopted in this application is to provide a method for manufacturing a memory card, which is used to manufacture the above-mentioned memory card. The manufacturing method includes: obtaining a metal sheet and a storage body, wherein the storage body includes: a substrate, one side of the substrate is provided with a gold finger, and the other side of the substrate is provided with a memory chip; a first insulator is provided on the substrate and covers the memory chip; and the metal sheet is attached and fixed to the side of the storage body facing away from the gold finger.

[0014] In one possible embodiment, the step of obtaining the metal sheet specifically includes: obtaining a metal plate with a thickness ranging from 0.1 mm to 1 mm; processing the metal plate by at least one of stamping, casting, and calcining to obtain a metal sheet of a preset shape, wherein the metal sheet includes a main body and a clamping part, and the main body is connected to the clamping part on at least two opposite sides; the step of attaching the metal sheet to one side of the metal sheet specifically includes: roughening one side of the storage body; adhering the metal sheet to the roughened side of the storage body with an adhesive; baking to fix the metal sheet to the storage body; and making a second insulator so that the second insulator fixes the metal sheet to the storage body.

[0015] In one possible embodiment, the step of making the second insulator specifically includes: performing a first injection molding to arrange the plastic material along the side wall of the storage body around the storage body and cover the clamping portion of the metal sheet; performing a second injection molding on the side of the storage body where the gold finger is provided, and connecting the plastic material on this side with the plastic material on the side wall to form a whole, wherein an opening is formed on the second insulator to allow the gold finger to leak out.

[0016] The beneficial effects of the present application are as follows: different from the prior art, the present application provides a memory card, the storage body of the memory card is provided with a metal sheet on at least one side facing away from the gold finger, the metal sheet is hard and resistant to high pressure, and the memory card with the metal sheet fixed on one side has better three-proof effects, which is not only waterproof and dustproof, but also has improved high-pressure resistance, so that the memory card can still be used normally without damage under high bending pressure. On the other hand, the metal sheet is not easy to scratch, and the lines of the logo, promotional pictures, etc. printed on the surface of the metal sheet can be maintained for a long time and are not easily scratched to affect the appearance.

[0017] The structure of the present application as well as its other objectives and beneficial effects will be described in detail with reference to the accompanying drawings to ensure that the description of the preferred embodiments is more obvious and understandable.

Brief Description of the Drawings

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0019] FIG1 is a schematic structural diagram of an embodiment of a memory card of the present application;

[0020] FIG2 is a schematic diagram of the cross-sectional structure of the memory card in FIG1 along line Aa;

[0021] FIG3 is a schematic diagram of a cross-sectional structure of the memory card in FIG1 taken along line Bb;

[0022] FIG4 is a schematic structural diagram of an embodiment of a metal sheet;

[0023] FIG5 is a flow chart of an embodiment of a method for manufacturing a memory card according to the present application;

[0024] FIG6 is a schematic diagram of a flow chart of an embodiment of S11 in FIG5 ;

[0025] FIG. 7 is a flow chart of an embodiment of step S12 in FIG. 5 .

[0026] Among them, the reference numerals in the figure are: 100, memory card; 10, storage body; 101, substrate; 102, gold finger; 103, memory chip; 104, first insulator; 20, second insulator; 22, fixing part; 30, metal sheet; 31, main body; 32, clamping part; 40, label card; 50, control chip. [Specific implementation method]

[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0028] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0029] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" means two or more, unless otherwise specified.

[0031] In the following description, specific details such as specific system structures and technologies are provided for purposes of illustration rather than limitation to facilitate a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, and circuits are omitted to avoid obscuring the description of the present application with unnecessary detail.

[0032] Existing memory cards have poor high-pressure resistance. Under high-pressure conditions, memory cards are easily damaged and cannot be used.

[0033] Based on the above problems, the present application proposes a memory card and a method for manufacturing the memory card, which can effectively solve the above problems by attaching a fixed metal sheet to the side of the storage body of the memory card that is away from the gold finger.

[0034] A memory card and a method for manufacturing the memory card provided in the present application are described in detail below with reference to the accompanying drawings and embodiments.

[0035] This application provides a memory card. Please refer to Figures 1 to 4. Figure 1 is a schematic structural diagram of an embodiment of a memory card of this application; Figure 2 is a schematic cross-sectional structural diagram of the memory card of Figure 1 taken along line Aa; Figure 3 is a schematic cross-sectional structural diagram of the memory card of Figure 1 taken along line Bb; and Figure 4 is a schematic structural diagram of an embodiment of a metal sheet. In a specific embodiment, the memory card 100 of this application includes a storage body 10 and a metal sheet 30.

[0036] Among them, the memory card 100 provided in this application can be any reasonable type of memory card 100, such as an SD card (Secure Digital Memory Card), a CF card (Compact Flash Card), an SM card (Smart Media Card), etc., without specific limitation. In this embodiment, the memory card 100 is specifically an SD card, specifically an SD4.0 card, which has a higher storage capacity and bus speed. In some other embodiments, the memory card 100 can also be an SD1.0 card, SD2.0 card, SD3.0 card, etc.

[0037] The storage body 10 includes a substrate 101, gold fingers 102, a memory chip 103, and a first insulator 104. The gold fingers 102 are provided on one side of the substrate 101, and the memory chip 103 is provided on the other side of the substrate 101. The first insulator 104 is provided on the substrate 101 and covers the memory chip 103. The memory card 100 also includes a metal sheet 30, and the metal sheet 30 is fixed to at least one side of the storage body 10 facing away from the gold fingers 102. Specifically, the memory card 100 implements a storage function through the storage body 10. The memory chip 103 in the storage body 10 can be a NAND FLASH memory chip or other type of memory chip, without specific limitation. The gold fingers 102 are exposed on one side of the substrate 101. The gold fingers 102 are a plurality of metal contact plates. The memory card 100 can establish a connection with an external card reader or device through the gold fingers 102 and transmit data. Conventional memory cards 100 are protected by a single injection molding of a plastic encapsulating material onto the surface of the memory body 10 to form a protective shell. This protective shell has poor three-dimensional protection, particularly poor high-pressure resistance, and can easily damage the memory card 100. In this embodiment, a metal sheet 30 is fixed to the side of the memory body 10 facing away from the gold finger 102. The metal sheet 30 can be made of steel, copper, iron, or duralumin, without limitation. The metal sheet 30 is hard and resistant to high pressures. By attaching and securing the metal sheet 30 to one side of the memory body 10, the memory card 100 possesses high-pressure resistance. Furthermore, the memory card 100 provided with the metal sheet 30 is scratch-resistant. In some embodiments, a logo, promotional image, or other design can be silk-screened on the surface of the metal sheet 30. The silk-screened lines on the metal sheet 30 are durable and not susceptible to scratches that degrade the appearance. In a high-pressure resistance test, the memory card 100 of this application remained functional under a bending force of 180N and remained undamaged after 60 seconds of bending.

[0038] Different from the prior art, the present application proposes a memory card 100, in which the storage body 10 of the memory card 100 is provided with a metal sheet 30 on at least one side facing away from the gold finger 102. The metal sheet 30 is hard and resistant to high pressure. The memory card 100 with the metal sheet 30 fixed on one side has better three-proof effects. It is not only waterproof and dustproof, but also has improved high-pressure resistance, so that the memory card 100 can still be used normally without damage under high bending pressure. On the other hand, the metal sheet 30 is not easy to scratch, and the lines of the logo, promotional pictures, etc. printed on the surface of the metal sheet 30 can be maintained for a long time and are not easily scratched to affect the appearance.

[0039] Among them, the first insulator 104 is used to encapsulate and protect the storage chip 103, etc. The first insulator 104 is a plastic layer. In this embodiment, its main material is EMC (Epoxy Molding Compound, epoxy resin film plastic). In some other embodiments, the plastic material can also include one or more materials such as polyimide, bismaleimide triazine, etc.

[0040] Furthermore, in this embodiment, the metal sheet 30 includes a main body 31 and a retaining portion 32. The retaining portion 32 is connected to the main body 31 on at least two opposing sides, and the main body 31 and retaining portion 32 are integrally connected. The memory card 100 also includes a second insulator 20. The second insulator 20 is fixed to the side wall of the memory body 10 and is arranged along the side wall of the memory body 10 and around the memory body 10. The second insulator 20 also covers the retaining portion 32 to secure the metal sheet 30 to the memory body 10. One side of the second insulator 20 bends and extends toward the center of the memory body 10 to form a fixing portion 22. The fixing portion 22 covers the retaining portion 32 to secure the metal sheet 30. Specifically, the second insulator 20 is also arranged on the side of the substrate 101 of the storage body 10 where the gold finger 102 is provided. The second insulator 20 extends along the side wall of the storage body 10 and covers the clamping portion 32 at the edge of the metal sheet 30 located on the other side of the storage body 10. The second insulator 20 covers the clamping portion 32 and is also combined with the clamping portion 32, so that the metal sheet 30 is displayed on the surface of the storage card 100 in an embedded manner, thereby improving the bonding strength of the metal sheet 30.

[0041] Among them, the second insulator 20 is a plastic layer, and its material can include one or more materials such as phenolic resin, urea-formaldehyde resin, unsaturated polyester resin, etc. Its main function is to fix the metal sheet 30 on the storage body 10. In addition, the second insulator 20 covers the storage body 10 and also has the effect of waterproof and dustproof, thereby improving the three-proof effect of the memory card 100 of this application.

[0042] In some embodiments, the storage body 10 further includes a control chip 50, which is connected to the storage chip 103. When the memory card 100 establishes a connection with an external card reader or device via the gold finger 102, the control chip 50 controls data transmission between the memory card 100 and the external device. Furthermore, the control chip 50 also performs operations such as storage, reading, and writing. The control chip 50 can be an integrated circuit chip with signal processing capabilities. In other embodiments, the control chip 50 can also be a general-purpose processor, a digital signal processor, an application-specific integrated circuit, or other chip capable of receiving and processing signals and generating corresponding control electrical signals, without specific limitation.

[0043] In some preferred embodiments, before the metal sheet 30 is attached to one side of the storage body 10, a roughening treatment is performed on the side of the first insulator 104 of the storage body 10 to which the metal sheet 30 is attached. The purpose of the roughening treatment is to change the surface properties of the first insulator 104, such as the roughness and chemical affinity, thereby improving the interlayer bonding between the metal sheet 30 and the first insulator 104, thereby increasing the bonding strength between the two. After the roughening treatment, the metal sheet 30 can be positioned on the surface of the storage body 10 by gluing, applying adhesive tape, or double-sided tape, and then the metal sheet 30 and the storage body 10 can be tightly bonded together by forming the second insulator 20. The roughening treatment can be achieved by physical or chemical methods, such as blackening technology, micro-etching technology, browning technology, etc., without specific limitation.

[0044] It can be understood that the main body 31 of the metal sheet 30 has two sets of opposite side edges. In the present embodiment, both sets of side edges are integrally connected with a retaining portion 32. The retaining portion 32 connected on one set of opposite side edges and the main body 31 of the metal sheet 30 are both attached to one side of the storage body 10, and the thickness of the retaining portion 32 is not greater than the thickness of the main body 31. Specifically, the thickness of the retaining portion 32 can be equal to or less than the thickness of the main body 31. This structure forms a convex cross-sectional shape of a set of opposite retaining portions 32 of the metal sheet 30 and the main body 31. As shown in FIG2 , the second insulator 20 covers the retaining portions 32 on both sides of the main body 31 and is combined with the retaining portions 32, so that the metal sheet 30 is displayed on the surface of the storage card 100 in an embedded manner, so that the metal sheet 30 is firmly fixed. In this embodiment, the retaining portions 32 connected to the other set of opposite side edges extend perpendicularly to the main portion 31 along the sidewall of the storage body 10. The main portion 31 of the metal sheet 30 is attached to one side of the storage body 10. As shown in FIG3 , this structure forms a Z-shaped cross-section of the main portion 31 of the metal sheet 30 and the two portions connected to the retaining portions 32. Both the convex and Z-shaped cross-sections allow the second insulator 20 to cover the retaining portions 32 on both sides, thereby fixing the metal sheet 30 and achieving the purpose of embedded fixation of the metal sheet 30. In this embodiment, the cross-sections of the metal sheet 30 in two perpendicular directions are respectively convex and Z-shaped. In some other embodiments, the cross-sections of the metal sheet 30 in two perpendicular directions can also be both convex or Z-shaped, without specific limitation. In other embodiments, as shown in FIG4 , the two sides of the metal sheet 30 can also be S-shaped, with the second insulator 20 covering both sides of the metal sheet 30. Without specific limitation.

[0045] In this embodiment, metal sheets 30 of different shapes can be obtained by obtaining metal plates and processing the metal plates through stamping, casting, calcination and other processing methods to obtain the metal sheets 30 with the above-mentioned cross-sections in convex, Z-shaped, S-shaped and other shapes.

[0046] To further improve the high-pressure resistance of the memory card 100, in some preferred embodiments, a reinforcement structure may be formed on the surface of the metal sheet 30 to increase the strength and rigidity of the metal sheet 30. The reinforcement structure may specifically be reinforcement ribs formed on the surface of the metal sheet 30.

[0047] Furthermore, in this embodiment, the thickness of the main body 31 ranges from 0.1 mm to 1 mm. Specifically, the thickness of the main body 31 can be 0.1 mm, 0.3 mm, 0.5 mm, 0.8 mm, 1 mm, etc., without specific limitation. A metal sheet 30 within this thickness range can improve the high-voltage resistance of the memory card 100 while preventing the memory card 100 from being too thick and affecting its usability.

[0048] In some preferred embodiments, the projected area of ​​the metal sheet 30 on the side of the memory card 100 where the metal sheet 30 is provided is at least 40% of the area of ​​that side. Specifically, the metal sheet 30 occupies at least 40% and at most 100% of the area of ​​that surface. For example, the metal sheet 30 may occupy 40%, 60%, 80%, 100%, etc., without specific limitation. This size design ensures that the metal sheet 30 covers a sufficient area to ensure its high-pressure resistance.

[0049] Furthermore, in this embodiment, the memory card 100 also includes a label card 40, which is attached to the side of the main body 31 facing away from the memory body 10. The label card 40 may include information such as the model and serial number of the memory card 100. In FIG1 , C denotes the area on the memory card 100 where the label card 40 is attached.

[0050] In this embodiment, a metal sheet 30 is fixed to the side of the memory card 100 facing away from the gold finger 102. In some preferred embodiments, the metal sheet 30 can also be provided on the side of the memory card 100 where the gold finger 102 is provided. The metal sheet 30 is not connected to the gold finger 102 and is exposed outside the gold finger 102. By attaching and fixing the metal sheet 30 to both sides of the memory body 10, the high-voltage resistance of the memory card 100 can be enhanced.

[0051] In this embodiment, the second insulator 20 also covers the side of the memory card 10 where the gold fingers 102 are located, and has openings formed therein to allow the gold fingers 102 to be visible. Specifically, the second insulator 20 semi-surrounds the side of the memory card 10 where the gold fingers 102 are located, the sidewalls, and the side where the metal sheet 30 is located. This semi-surrounding covering provides a more secure attachment to the memory card 10, thereby tightly connecting the metal sheet 30 to the memory card 10. Furthermore, the second insulator 20 enveloping the memory card 10 enhances the three-proofing properties of the memory card 100.

[0052] In this embodiment, a metal sheet 30 is attached and fixed to the surface of the storage body 10 to enhance its high-voltage resistance. However, the metal sheet 30 is easily corroded and damaged when exposed. In some preferred embodiments, an anti-corrosion coating can be applied to the surface of the metal sheet 30. Specifically, applying the anti-corrosion coating to the surface of the metal sheet 30 isolates the metal sheet 30 from the surrounding medium, preventing corrosion and maintaining its high-voltage resistance over time. Specifically, the anti-corrosion coating can be a polyethylene adhesive tape, a polyolefin coating, or the like.

[0053] Different from the prior art, the present application provides a memory card 100, in which a metal sheet 30 is provided on the side of the storage body 10 of the memory card 100 facing away from the gold finger 102. The metal sheet 30 is hard and resistant to high pressure. The memory card 100 with the metal sheet 30 fixed on one side has better three-proof effects. It is not only waterproof and dustproof, but also has improved high-pressure resistance, so that the memory card 100 can still be used normally without damage under high bending pressure. On the other hand, the metal sheet 30 is not easy to scratch, and the lines of the logo, promotional pictures, etc. printed on the surface of the metal sheet 30 can be maintained for a long time and are not easily scratched to affect the appearance.

[0054] Correspondingly, this application also proposes a method for manufacturing a memory card, which is used to manufacture the memory card described in the above embodiment. Please refer to Figures 5 to 7. Figure 5 is a flow chart of an embodiment of the method for manufacturing a memory card of this application; Figure 6 is a flow chart of an embodiment of S11 in Figure 5; and Figure 7 is a flow chart of an embodiment of S12 in Figure 5. In one specific embodiment, the manufacturing method specifically includes:

[0055] S11: Obtain a metal sheet.

[0056] The metal sheet can be a steel sheet, a copper sheet, an iron sheet, a hard aluminum sheet, etc., without being specifically limited. The metal sheet has the characteristics of high hardness and high pressure resistance.

[0057] In one embodiment, S11 may specifically include:

[0058] S111: Obtain a metal plate with a thickness ranging from 0.1 mm to 1 mm.

[0059] For example, metal plates of any reasonable thickness such as 0.1 mm, 0.3 mm, 0.8 mm, 1 mm, etc. can be obtained.

[0060] S112: Processing the metal plate by at least one of stamping, casting, and calcining to obtain a metal sheet of a preset shape.

[0061] Stamping and calcining involve applying pressure to a metal sheet using a press, forging machine, mold, or other equipment to deform it and form it into a metal sheet of a specific shape. Casting involves melting a metal sheet, pouring it into a mold, and then cooling and solidifying it to produce a metal sheet of a specific shape. The processing method is not specifically limited.

[0062] After the metal plate is processed, the metal sheet includes a main body and a clamping portion, and the main body is connected to the clamping portion on at least two opposite sides.

[0063] In this embodiment, the metal sheet has two sets of opposite side edges, and the retaining portions connected to one set of opposite side edges are coplanar with the metal sheet, and the thickness of the retaining portions is not greater than the thickness of the main body. Specifically, the thickness of the retaining portions can be equal to or less than the thickness of the main body. This structure forms a convex cross-sectional shape between one set of opposite retaining portions and the main body of the metal sheet, wherein the retaining portions connected to the other set of opposite side edges have a portion extending perpendicular to the direction of the main body. This structure forms a convex cross-sectional shape between the main body of the metal sheet and the two portions connected to the retaining portions. In this embodiment, the cross-sectional shapes of the metal sheet in the two perpendicular directions of the metal sheet are respectively convex and z-shaped. In some other embodiments, the cross-sectional shapes of the metal sheet in the two perpendicular directions of the metal sheet can also be both convex or both z-shaped, without specific limitation. In some other embodiments, the main body and the retaining portions on both sides can also form a cross-sectional shape such as an S-shape, without specific limitation.

[0064] S12: Obtain the storage body, and attach and fix the metal sheet to the side of the storage body facing away from the gold finger.

[0065] The obtained storage body includes: a substrate, a gold finger is provided on one side of the substrate, and a storage chip is provided on the other side of the substrate; and a first insulator is provided on the substrate and covers the storage chip.

[0066] In one embodiment, S12 may specifically include:

[0067] S121: performing roughening processing on one side of the storage body.

[0068] Specifically, a roughening treatment is performed on the first insulator on the side of the storage body facing away from the gold finger. The purpose of the roughening treatment is to change the surface properties of the first insulator, such as roughness and chemical affinity, so as to improve the interlayer bonding force between the metal sheet and the first insulator, thereby making the bonding strength between the two higher.

[0069] Furthermore, the roughening treatment method may specifically include mechanical roughening, chemical roughening, etc. Mechanical roughening can roughen the surface of the first insulator by sandblasting, tumbling, polishing with sandpaper, etc. Chemical roughening can rapidly roughen the surface of the first insulator by using chemical reagents. The specific roughening method is not specifically limited.

[0070] S122: Adhere the metal sheet to the roughened side of the storage body using an adhesive.

[0071] Specifically, the metal sheet can be adhered to the roughened side of the storage body by using adhesives such as glue, adhesive tape, adhesive with adhesive properties, and glue.

[0072] S123: Baking treatment to securely connect the metal sheet to the storage body.

[0073] The metal sheet is fixed to one side of the storage body through the cured adhesive through the baking process.

[0074] S124: making a second insulator so that the second insulator fixes the metal sheet on the storage body.

[0075] The steps of making the second insulator specifically include:

[0076] The first injection molding is performed to make the plastic material surround the storage body along the side wall of the storage body and cover the clamping portion of the metal sheet. The purpose of the first injection molding is to fix the metal sheet.

[0077] A second injection molding process is performed on the side of the memory card where the gold finger is located, connecting the plastic material on this side with the plastic material on the sidewall to form a single piece. An opening is formed in the second insulator to allow the gold finger to be exposed. Ultimately, the metal sheet is secured to the memory card via the second insulator, and the second insulator covers the memory card, providing waterproof and dustproof properties, enhancing the memory card's three-proof properties.

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A memory card, wherein, The memory card includes: A storage body, the storage body includes: A substrate, a gold finger is provided on one side of the substrate, and a storage chip is provided on the other side of the substrate; A first insulator, which is provided on the substrate and covers the storage chip; The memory card further includes: A metal sheet, the metal sheet is fixed on at least one side of the storage body facing away from the gold finger.

2. The memory card according to claim 1, wherein, The metal sheet includes a main body portion and a clamping portion, the main body portion is connected with the clamping portion on at least opposite sides, and the main body portion and the clamping portion are integrally connected; The memory card further includes: A second insulator, the second insulator is fixed on the side wall of the storage body and is arranged around the storage body along the side wall of the storage body for one week; wherein, the second insulator also covers the clamping portion to fix the metal sheet and the storage body together.

3. The memory card according to claim 2, wherein, One side of the second insulator bends and extends towards the center direction of the storage body to form a fixing portion, and the fixing portion covers the clamping portion to fix the metal sheet.

4. The memory card according to claim 2, wherein, Both the main body portion and the clamping portion of the metal sheet are attached to one side of the storage body, and the thickness of the clamping portion is not greater than the thickness of the main body portion.

5. The memory card according to claim 2, wherein, The main body portion of the metal sheet is attached to one side of the storage body, and the clamping portion extends along the side wall of the storage body perpendicular to the main body portion.

6. The memory card according to any one of claims 4 or 5, wherein, The thickness range of the main body portion is 0.1 millimeter to 1 millimeter; the projected area of the metal sheet on the side of the memory card where the metal sheet is provided is at least 40% of the area of this side; The memory card further includes: A label card, the label card is attached to the side of the main body portion facing away from the storage body.

7. The memory card according to claim 2, wherein, The second insulator also covers the side of the storage body where the gold finger is provided and forms an opening to expose the gold finger.

8. A method for manufacturing a memory card, which is used to manufacture the memory card according to any one of claims 1-7, wherein, The manufacturing method includes: Obtaining a metal sheet, Obtaining a storage body, the storage body includes: a substrate, a gold finger is provided on one side of the substrate, and a storage chip is provided on the other side of the substrate; a first insulator, which is provided on the substrate and covers the storage chip; Attaching and fixing the metal sheet to the side of the storage body facing away from the gold finger.

9. The manufacturing method according to claim 8, wherein, The step of obtaining the metal sheet specifically includes: Obtaining a metal plate with a thickness range of 0.1 millimeter to 1 millimeter; Processing the metal plate by at least one of stamping, casting, and forging to obtain a metal sheet with a preset shape, wherein the metal sheet includes a main body portion and a clamping portion, and the main body portion is connected with the clamping portion on at least opposite sides; The step of attaching the metal sheet to one side of the metal sheet specifically includes: Roughening one side of the storage body; Adhering the metal sheet to the roughened side of the storage body through an adhesive. Baking treatment is carried out to fixedly connect the metal sheet to the storage body; A second insulator is made to fix the metal sheet on the storage body.

10. The manufacturing method according to claim 9, wherein, The step of making the second insulator specifically includes: Carry out the first injection molding so that the plastic material surrounds the storage body along the side wall of the storage body for one week and covers the clamping part of the metal sheet; Carry out the second injection molding on the side of the storage body where the gold finger is provided, and connect the plastic material on this side with the plastic material on the side wall into a whole, wherein an opening is formed on the second insulator to expose the gold finger.

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