Display module and preparation method therefor, and display device

Abstract

A display module and a preparation method therefor, and a display device, relating to but not limited to the technical field of display. The display module comprises: a display substrate (1) comprising a display area (100), and a first bonding area (40) and a second bonding area (50) which are sequentially arranged on one side of the display area (100), the second bonding area (50) being provided with a bonding pad (51); an integrated circuit chip (3) bonded to the first bonding area (40), the integrated circuit chip (3) comprising a first side edge (31) close to one side of the bonding pad (51); a flexible circuit board (2), the flexible circuit board (2) being bonded to the bonding pad (51) of the second bonding area (50) and covering the bonding pad (51), through holes (4) being formed in the flexible circuit board (2), and the through holes (4) exposing at least part of the first side edge (31); and a first protective layer (61), at least part of which is in direct contact with the first side edge (31) exposed by the through holes (4).

Description

Display module, manufacturing method thereof, and display device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on January 24, 2024, with application number 202410102841.7 and invention name “A display module, its preparation method, and display device”, the content of which should be understood as incorporated into this application by reference. Technical Field

[0002] This article relates to, but is not limited to, the field of display technology, and specifically to a display module and a preparation method thereof, and a display device. Background Art

[0003] Organic Light Emitting Diodes (OLEDs) and Quantum-dot Light Emitting Diodes (QLEDs) are active light-emitting display devices, offering advantages such as self-luminescence, wide viewing angles, high contrast, low power consumption, extremely fast response times, thinness, flexibility, and low cost. With the continuous advancement of display technology, flexible displays using OLEDs or QLEDs as light-emitting devices and thin-film transistors (TFTs) for signal control have become mainstream products in the display field.

[0004] The light-emitting device of an active matrix organic light emitting diode panel (AMOLED) is an organic light-emitting diode. AMOLED generates a driving current by driving a thin film transistor to drive the OLED to emit light. Summary of the Invention

[0005] This application provides a display module, including:

[0006] The display substrate includes a display area and a first binding area and a second binding area sequentially arranged on one side of the display area, wherein the second binding area is provided with a binding pad;

[0007] an integrated circuit chip, bonded and connected to the first bonding area, the integrated circuit chip including a first side adjacent to the bonding pad;

[0008] a flexible circuit board, the flexible circuit board being bonded and connected to the bonding pads of the second bonding area and covering the bonding pads, the flexible circuit board being provided with a through hole, the through hole exposing at least a portion of the first side;

[0009] A first protection layer, at least a portion of the first protection layer is in direct contact with the first side edge exposed by the through hole.

[0010] In an exemplary embodiment, the through hole includes a first sidewall, the first sidewall is located on a side of the first side edge close to the binding pad, and the first protection layer is in direct contact with at least a portion of the first sidewall.

[0011] In an exemplary embodiment, a vertical distance between the first side and an edge of the binding pad close to the first side is greater than or equal to 1.1 mm and less than or equal to 3.1 mm.

[0012] In an exemplary embodiment, a vertical distance between the first side edge and the first sidewall is greater than or equal to 0.01 mm and less than or equal to 0.7 mm.

[0013] In an exemplary embodiment, a bottom of the first protection layer is in direct contact with the display substrate.

[0014] In an exemplary embodiment, the first protective layer includes epoxy resin glue or photosensitive glue.

[0015] In an exemplary embodiment, the integrated circuit chip further includes a side portion located on another side of the integrated circuit chip, and the display module further includes a second protective layer, wherein the second protective layer directly contacts at least a portion of the side portion on another side of the integrated circuit chip.

[0016] In an exemplary embodiment, the other sides of the integrated circuit chip include a second side, a third side, and a fourth side, the second side is located on the side of the first side away from the binding pad, the third side and the fourth side are respectively connected to the two ends of the first side, the second protective layer includes a first sub-protective layer, a second sub-protective layer, and a third sub-protective layer, the first sub-protective layer is in direct contact with at least a portion of the second side, the second sub-protective layer is in direct contact with at least a portion of the third side, and the third sub-protective layer is in direct contact with at least a portion of the fourth side.

[0017] In an exemplary embodiment, a first end portion of the first protective layer covers the second sub-protective layer, and a second end portion of the first protective layer covers the third sub-protective layer.

[0018] In an exemplary embodiment, the first end portion of the first sub-protecting layer and the second sub-protecting layer are stacked on each other, and / or the second end portion of the first sub-protecting layer and the third sub-protecting layer are stacked on each other.

[0019] In an exemplary embodiment, the through hole exposes edges of other sides of the integrated circuit chip.

[0020] In an exemplary embodiment, the shape of the through hole includes a rectangle.

[0021] In an exemplary embodiment, the display substrate further includes a bending region disposed between the display region and the first binding region, the bending region being configured to bend the first binding region and the second binding region toward a backlight side of the display region.

[0022] In an exemplary embodiment, a heat dissipation layer and a bending protective layer are further included, wherein the heat dissipation layer is arranged on the backlight side of the display area, and the bending protective layer is arranged on the side of the heat dissipation layer away from the display area and connected to the second binding area. The side wall of the stacked structure formed by the second binding area and the bending protective layer is roughly flush with the side wall away from the bending area. The side wall of the heat dissipation layer away from the bending area is farther away from the bending area than the side wall of the stacked structure. The side wall of the stacked structure and the surface of the heat dissipation layer form a receiving space, and the receiving space is configured to receive a battery.

[0023] In an exemplary embodiment, a third protective layer is further included. The third protective layer is located on a side of the binding pad away from the integrated circuit chip. A side surface of the third protective layer is in direct contact with the flexible circuit board, and a bottom surface of the third protective layer is in direct contact with the display substrate.

[0024] The present application also provides a display device, comprising the aforementioned display module.

[0025] The present application also provides a method for preparing a display module, comprising:

[0026] Providing a display substrate, wherein a binding pad is provided on the display substrate;

[0027] Binding an integrated circuit chip on the display substrate, wherein the integrated circuit chip includes a first side adjacent to the binding pad;

[0028] Providing a flexible circuit board, wherein the flexible circuit board is provided with a through hole;

[0029] Binding the flexible circuit board to the binding pad of the display substrate, wherein the through hole exposes at least a portion of the first side;

[0030] A first protection layer is coated on the first side edge exposed by the through hole.

[0031] In an exemplary embodiment, the through hole includes a first sidewall adjacent to the bonding pad, and the first protection layer is coated on both the first sidewall and the first sidewall.

[0032] In an exemplary embodiment, the integrated circuit chip further includes edges located on other sides of the integrated circuit chip; before the flexible circuit board is bonded to the bonding pads of the display substrate, a second protective layer is coated on the edges of the other sides of the integrated circuit chip.

[0033] Other features and advantages of the present application will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present application. Other advantages of the present application can be realized and obtained by the solutions described in the description and the drawings.

[0034] Summary of the Figures

[0035] The accompanying drawings are used to provide an understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.

[0036] The accompanying drawings are used to provide an understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.

[0037] FIG1 is a schematic structural diagram of a display device;

[0038] FIG2 is a schematic structural diagram of a display substrate according to an embodiment of the present application;

[0039] FIG3 is a schematic diagram of a cross-sectional structure of a display area of ​​a display module;

[0040] FIG4 is a schematic diagram of a cross-sectional structure of a display module according to an exemplary embodiment of the present disclosure;

[0041] FIG5 is a schematic planar structural diagram of a display substrate and a flexible circuit board of a display module according to an exemplary embodiment of the present disclosure;

[0042] FIG6 is a schematic planar structural diagram of a display substrate and a flexible circuit board of a display module according to an exemplary embodiment of the present disclosure;

[0043] FIG7 a is a schematic cross-sectional view of a display module according to a related art;

[0044] FIG. 7 b is a schematic diagram of a planar structure of a display module according to the related art.

[0045] Details

[0046] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. Note that the embodiments can be implemented in a variety of different forms. A person of ordinary skill in the art can easily understand the fact that the methods and contents can be transformed into various forms without departing from the purpose and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. In the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be arbitrarily combined with each other.

[0047] The scales of the figures in this disclosure can be used as a reference for actual processes, but are not limited to this. For example, the width-to-length ratio of the channel, the thickness and spacing of each film layer, and the width and spacing of each signal line can be adjusted according to actual needs. The number of pixels in the display module and the number of sub-pixels in each pixel are not limited to the numbers shown in the figures. The figures described in this disclosure are only structural schematics, and one embodiment of the present disclosure is not limited to the shapes or values ​​shown in the figures.

[0048] In this specification, ordinal numbers such as “first”, “second” and “third” are provided to avoid confusion among constituent elements, and are not intended to limit the number.

[0049] In this specification, for convenience, words and phrases indicating orientation or positional relationships, such as "middle," "upper," "lower," "front," "back," "vertical," "horizontal," "top," "bottom," "inside," and "outside," are used to illustrate the positional relationships of constituent elements with reference to the accompanying drawings. This is merely for the convenience of describing this specification and simplifying the description, and does not indicate or imply that the device or element referred to must include a specific orientation, be constructed and operate in a specific orientation. Therefore, it should not be understood as a limitation of the present disclosure. The positional relationships of the constituent elements may be appropriately changed according to the direction in which each constituent element is described. Therefore, the words and phrases are not limited to those described in the specification and may be appropriately replaced according to the circumstances.

[0050] In this specification, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, removable, or integral connections; mechanical or electrical connections; direct connections, indirect connections through intermediaries, or internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure.

[0051] In this specification, a transistor refers to a device that includes at least three terminals: a gate electrode, a drain electrode, and a source electrode. A transistor includes a channel region between a drain electrode (drain electrode terminal, drain region, or drain electrode) and a source electrode (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode. Note that in this specification, the channel region refers to the region through which current primarily flows.

[0052] In this specification, the first electrode can be a drain electrode and the second electrode can be a source electrode, or vice versa. The functions of "source electrode" and "drain electrode" may be interchanged when using transistors with opposite polarity or when the direction of current changes during circuit operation. Therefore, in this specification, "source electrode" and "drain electrode" can be interchanged, and "source terminal" and "drain terminal" can be interchanged.

[0053] In this specification, "electrically connected" includes components connected together via an element that performs some electrical function. There are no particular limitations on the "element that performs some electrical function" as long as it enables the transfer of electrical signals between the connected components. Examples of "element that performs some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with various functions.

[0054] In this specification, "parallel" refers to a state where the angle formed by two straight lines is greater than -10° and less than 10°, and thus also includes a state where the angle is greater than -5° and less than 5°. Furthermore, "perpendicular" refers to a state where the angle formed by two straight lines is greater than 80° and less than 100°, and thus also includes a state where the angle is greater than 85° and less than 95°.

[0055] In this specification, the terms "film" and "layer" may be interchanged. For example, "conductive layer" may be replaced with "conductive film." Similarly, "insulating film" may be replaced with "insulating layer."

[0056] The triangles, rectangles, trapezoids, pentagons or hexagons in this specification are not in the strict sense, but may be approximate triangles, rectangles, trapezoids, pentagons or hexagons, etc. There may be some small deformations caused by tolerances, and there may be chamfers, arc edges and deformations.

[0057] The term "about" in the present disclosure refers to a numerical value that is not strictly defined and allows for process and measurement errors.

[0058] Figure 7a is a schematic diagram of the cross-sectional structure of a display module of the related art; Figure 7b is a schematic diagram of the planar structure of a display module of the related art. In an exemplary embodiment, as shown in Figures 7a and 7b, the display module of the related art includes a display substrate 1' and a flexible circuit board 2'. The flexible circuit board 2' is bound and connected to the display substrate 1'. The display substrate 1' includes a display area 100' and a bending area 20', a first binding area 40' and a second binding area 50' sequentially arranged on one side of the display area 100'. The display area 100' includes a light-emitting side and a backlight side 10-2'. The light-emitting side can display an image, and the backlight side 10-2' does not display an image. The bending area 20' is configured to bend the first binding area 40' and the second binding area 50' to the backlight side 10-2' of the display area 100'. An integrated circuit (IC) chip 3' is disposed on the first bonding area 40', and bonding pads 51' are disposed on the second bonding area 50'. Bonding pads 51' can be configured to bond to the flexible circuit board 2'. A blind slot 7' is disposed in the flexible circuit board 2'. The blind slot 7' does not penetrate the flexible circuit board 2' and is configured to accommodate the IC chip 3'. A protective layer 6' is disposed around the IC chip 3'.

[0059] The preparation process of the display module of the related art may include:

[0060] (1) Cutting to form a display substrate;

[0061] (2) bonding the integrated circuit chip to the first bonding area of ​​the display substrate;

[0062] (3) Coating a protective layer around the integrated circuit chip;

[0063] (4) Binding and connecting the flexible circuit board to the binding pads of the display substrate, wherein the flexible circuit board covers the binding pads of the display substrate and the integrated circuit chip, and the integrated circuit chip is located in the blind groove of the flexible circuit board;

[0064] (5) The binding pad of the display substrate is passed through the bending area and bent to the backlight side of the display area.

[0065] The inventors of this application discovered that in related art display modules, a protective layer is first applied around the integrated circuit chip before the flexible circuit board is bonded to the bonding pads of the display substrate. To prevent the protective layer from contaminating the bonding pads, a certain distance must be maintained between the integrated circuit chip and the bonding pads. This distance cannot be reduced, otherwise the protective layer will contaminate the bonding pads, resulting in poor contact after the flexible circuit board is bonded, and in turn, causing abnormal display and failure of the display module. The large distance between the integrated circuit chip and the bonding pads squeezes the battery compartment, reducing the battery capacity.

[0066] Figure 1 is a schematic diagram of the structure of a display device. As shown in Figure 1, the display device may include: a timing controller, a data driver, a scan driver, a light-emitting driver and a pixel array. The timing controller is connected to the data driver, the scan driver and the light-emitting driver respectively. The data driver is connected to a plurality of data signal lines (for example, D1 to Dn), the scan driver is connected to a plurality of scan signal lines (for example, S1 to Sm), and the light-emitting driver is connected to a plurality of light-emitting control lines (for example, E1 to Eo). Wherein, n, m and o can be natural numbers. The pixel array may include a plurality of sub-pixels Pxij, and i and j can be natural numbers. At least one sub-pixel Pxij may include: a pixel circuit and a light-emitting device connected to the pixel circuit. The pixel circuit may be connected to the scan signal line, the light-emitting control line and the data signal line respectively.

[0067] In an exemplary embodiment, the timing controller may provide grayscale values ​​and control signals suitable for the specifications of the data driver to the data driver, clock signals, scan start signals, etc. suitable for the specifications of the scan driver to the scan driver, and clock signals, emission stop signals, etc. suitable for the specifications of the light emitting driver to the light emitting driver. The data driver may use the grayscale values ​​and control signals received from the timing controller to generate data voltages to be provided to the data signal lines D1, D2, D3, ..., and Dn. For example, the data driver may sample grayscale values ​​using the clock signal and apply data voltages corresponding to the grayscale values ​​to the data signal lines D1 to Dn on a pixel row basis. The scan driver may generate scan signals to be provided to the scan signal lines S1, S2, S3, ..., and Sm by receiving the clock signal, scan start signal, etc. from the timing controller. For example, the scan driver may sequentially provide scan signals including on-level pulses to the scan signal lines S1 to Sm. For example, the scan driver can be configured in the form of a shift register and can generate a scan signal by sequentially transmitting a scan start signal provided in the form of an on-level pulse to the next-stage circuit under the control of a clock signal. The light-emitting driver can generate a light-emitting control signal to be provided to the light-emitting control lines E1, E2, E3, ... and Eo by receiving a clock signal, an emission stop signal, etc. from a timing controller. For example, the light-emitting driver can sequentially provide an emission signal including an off-level pulse to the light-emitting control lines E1 to Eo. For example, the light-emitting driver can be configured in the form of a shift register and can generate a light-emitting control signal by sequentially transmitting an emission stop signal provided in the form of an off-level pulse to the next-stage circuit under the control of a clock signal.

[0068] FIG2 is a schematic diagram of the structure of a display substrate according to an embodiment of the present application. In an exemplary embodiment, as shown in FIG2 , the display substrate according to the present application may include a display area 100 , a binding area 200 located on one side of the display area 100 , and a frame area 300 located on the other side of the display area 100 .

[0069] In some examples, the display module may use a flexible substrate, so that the display module may be deformable, such as curled, bent, folded, or rolled up.

[0070] In an exemplary embodiment, the binding area 200 may include a lead area, a bending area, a driver chip area, and a binding pin area arranged in sequence along a direction away from the display area 100. The lead area is connected to the display area 100 and includes at least lead lines, and the plurality of lead lines are configured to connect the data signal lines of the display area 100 in a fan-out routing manner. The bending area is connected to the lead area and may include a composite insulating layer provided with grooves, configured to bend the driver chip area and the binding pin area to the back of the display area 100. An integrated circuit (IC) may be provided in the driver chip area, and the integrated circuit may be configured to be connected to a plurality of lead lines. The binding pin area may include a binding pad (Bonding Pad), and the binding pad may be configured to be bound and connected to an external flexible printed circuit (FPC).

[0071] In some examples, the display area 100 may be a flat area including a plurality of sub-pixels Pxij constituting a pixel array. The plurality of sub-pixels Pxij may be configured to display a dynamic image or a still image. The display area 100 may be referred to as an active area (AA).

[0072] In an exemplary embodiment, the display area 100 of the display module may include a plurality of pixel units arranged in a matrix. For example, at least one pixel unit may include a first sub-pixel emitting a first color light, a second sub-pixel emitting a second color light, and third and fourth sub-pixels emitting a third color light.

[0073] In an exemplary embodiment, the first sub-pixel may be a red sub-pixel (R) that emits red light, the second sub-pixel may be a blue sub-pixel (B) that emits blue light, and the third and fourth sub-pixels may be green sub-pixels (G) that emit green light. In some examples, the shape of the light-emitting device of the sub-pixel may be rectangular, rhombus, pentagonal, or hexagonal, and the light-emitting devices of the four sub-pixels may be arranged in a diamond shape to form an RGBG pixel arrangement. In other exemplary embodiments, the light-emitting devices of the four sub-pixels may be arranged in a horizontal parallel arrangement, a vertical parallel arrangement, or a square arrangement, which is not limited in this disclosure. In other exemplary embodiments, the pixel unit may include three sub-pixels, and the light-emitting devices of the three sub-pixels may be arranged in a horizontal parallel arrangement, a vertical parallel arrangement, or a triangle arrangement, which is not limited in this disclosure.

[0074] In an exemplary embodiment, a sub-pixel Pxij may include a pixel circuit and a light-emitting device. The pixel circuit is electrically connected to a scan signal line, a data signal line, and a light-emitting control line, respectively. The pixel circuit may be configured to receive a data voltage transmitted by the data signal line and output a corresponding current to the light-emitting device under the control of the scan signal line and the light-emitting control line. The light-emitting device in each sub-pixel is connected to the pixel circuit of the sub-pixel, and the light-emitting device is configured to emit light of a corresponding brightness in response to the current output by the pixel circuit of the sub-pixel.

[0075] In an exemplary embodiment, the light emitting device may include an organic light emitting diode (OLED), a micro light emitting diode (LED), or a quantum dot light emitting diode (QLED). The sub-pixel may emit light, for example, red, green, blue, or white light, through the light emitting device.

[0076] In an exemplary embodiment, the display module includes a display area 100 having a rectangular shape. In some embodiments, the display area 100 may also have a circular shape, an elliptical shape, or a polygonal shape such as a triangle or a pentagon.

[0077] In an exemplary embodiment, the display module may be a flat panel display module. In some embodiments, the display module may also be other types of display modules, such as a flexible display module, a foldable display module, a rollable display module, etc.

[0078] In the following, the light-emitting device in the display module of this embodiment is an organic light-emitting diode (OLED) as an example, but the display module of this embodiment is not limited to this. In another embodiment, the light-emitting device in the display module can be a micro light-emitting diode (LED) or a quantum dot light-emitting diode (QLED). For example, the light-emitting layer of the light-emitting device in the display module can include organic materials, inorganic materials, quantum dots, organic materials and quantum dots, inorganic materials and quantum dots, or organic materials, inorganic materials and quantum dots.

[0079] Figure 3 is a schematic cross-sectional view of the display area of ​​a display module. Figure 3 illustrates the structure of three sub-pixels in display area 100. As shown in Figure 3, perpendicular to the display module, the display module may include: a substrate 101, a drive circuit layer 102, a light-emitting structure layer 103, and an encapsulation structure layer 104. In some possible implementations, the display module may include other film layers, such as a touch-sensitive structure layer, but this disclosure does not limit this.

[0080] In an exemplary embodiment, the substrate 101 may be a flexible substrate or a rigid substrate. The driving circuit layer 102 of each sub-pixel may include a pixel circuit composed of multiple transistors and capacitors. The light-emitting structure layer 103 of each sub-pixel may include at least an anode 301, a pixel definition layer 302, an organic light-emitting layer 303, and a cathode 304. The anode 301 is connected to the pixel circuit, the organic light-emitting layer 303 is connected to the anode 301, and the cathode 304 is connected to the organic light-emitting layer 303. The organic light-emitting layer 303 emits light of a corresponding color under the drive of the anode 301 and the cathode 304. The encapsulation structure layer 104 may include a stacked first encapsulation layer 401, a second encapsulation layer 402 and a third encapsulation layer 403. The first encapsulation layer 401 and the third encapsulation layer 403 may be made of inorganic materials, and the second encapsulation layer 402 may be made of organic materials. The second encapsulation layer 402 is arranged between the first encapsulation layer 401 and the third encapsulation layer 403 to form an inorganic material / organic material / inorganic material stacked structure, which can ensure that external water vapor cannot enter the light-emitting structure layer 103.

[0081] In an exemplary embodiment, the organic light-emitting layer 303 may include a light-emitting layer (EML) and any one or more of the following layers: a hole injection layer (HIL), a hole transport layer (HTL), an electron blocking layer (EBL), a hole blocking layer (HBL), an electron transport layer (ETL), and an electron injection layer (EIL). In some examples, one or more of the hole injection layer, hole transport layer, electron blocking layer, hole blocking layer, electron transport layer, and electron injection layer of all sub-pixels may be a common layer that is connected together, and the light-emitting layers of adjacent sub-pixels may have a small amount of overlap or may be isolated from each other.

[0082] This application provides a display module, including:

[0083] A display substrate, wherein a binding pad is provided on the display substrate;

[0084] An integrated circuit chip is provided on the display substrate, wherein the integrated circuit chip includes a first side adjacent to the binding pad;

[0085] a flexible circuit board, the flexible circuit board being bonded and connected to the bonding pads of the display substrate and covering the bonding pads, the flexible circuit board being provided with a through hole, the through hole exposing at least a portion of the first side;

[0086] A first protection layer, at least a portion of the first protection layer is in direct contact with the first side edge exposed by the through hole.

[0087] The display module of the present disclosure is described below with reference to some exemplary embodiments.

[0088] Figure 4 is a schematic cross-sectional view of a display module according to an exemplary embodiment of the present disclosure. In an exemplary embodiment, as shown in Figure 4 , the display module according to an exemplary embodiment of the present disclosure includes a display substrate 1, a flexible circuit board 2, and an integrated circuit chip 3 (IC). Both the flexible circuit board 2 and the integrated circuit chip 3 are bonded to the display substrate 1.

[0089] In an exemplary embodiment, a display substrate 1 includes a display area 100 and a bending region 20, a lead region 30, a first bonding region 40, and a second bonding region 50 sequentially arranged on one side of the display area 100. The display area 100 is configured to display an image and includes a light-emitting side 10-1 and a backlight side 10-2. The light-emitting side 10-1 and the backlight side 10-2 are located on opposite sides of the thickness direction of the display area 100. The light-emitting side 10-1 can display an image, while the backlight side 10-2 does not. The bending region 20 is configured to bend the lead region 30, the first bonding region 40, and the second bonding region 50 toward the backlight side 10-2 of the display area 100. The bending region 20 has a C-shape in a cross-section perpendicular to the display substrate 1. A first end of the bending region 20 is connected to the display area 100, and a second end of the bending region 20 bends toward the backlight side 10-2 of the display area 100 and connects to the lead region 30. The lead region 30, the first binding region 40, and the second binding region 50 are located on the backlight side 10-2 of the display area 100, and are generally parallel to the display area 100. The first end of the lead region 30 is connected to the second end of the bending region 20, and the second end of the lead region 30 extends in a direction opposite to the second direction D2 and connects to the first binding region 40. The lead region 30 includes multiple lead lines, which are configured to connect to multiple data signal lines of the display area 100. The first end of the first binding region 40 is connected to the second end of the lead region 30, and the second end of the first binding region 40 extends in a direction opposite to the second direction D2 and connects to the second binding region 50. The first binding region 40 can be configured to be bonded to an integrated circuit (IC) chip 3. The IC chip 3 is located on a side of the first binding region 40 away from the display area 100 and can be connected to the multiple lead lines of the lead region 30. The first end of the second binding area 50 is connected to the second end of the first binding area 40, and the second end of the second binding area 50 extends in the opposite direction of the second direction D2. A binding pad 51 is provided on the side of the second binding area 50 away from the display area 100, and the binding pad 51 can be configured to be connected to the flexible circuit board 2.

[0090] In an exemplary embodiment, at least a portion of the flexible circuit board 2 is disposed on a side of the lead region 30, the first bonding region 40, and the second bonding region 50 away from the display region 100, and at least a portion of the flexible circuit board 2 covers the side of the lead region 30, the first bonding region 40, and the second bonding region 50 away from the display region 100. The flexible circuit board 2 is configured to be bonded and connected to the bonding pads 51 of the second bonding region 50, and to cover the bonding pads 51.

[0091] In an exemplary embodiment, a through hole 4 is provided in the flexible circuit board 2 , and the through hole 4 penetrates the flexible circuit board 2 along the thickness direction of the flexible circuit board 2 . The through hole 4 exposes at least a portion of the integrated circuit chip 3 . For example, the through hole 4 exposes the entire integrated circuit chip 3 .

[0092] In an exemplary embodiment, the integrated circuit chip 3 is located on a side of the bonding pad 51 parallel to the direction of the display module. The integrated circuit chip 3 includes a first side edge 31 adjacent to the bonding pad 51 and side edges on other sides of the integrated circuit chip 3. The display module of the disclosed embodiment further includes a first protective layer 61 and a second protective layer. At least a portion of the first protective layer 61 is in direct contact with the first side edge 31 of the integrated circuit chip 3 exposed by the through hole 4, and the first protective layer 61 is configured to seal the first side edge 31 of the integrated circuit chip 3. The second protective layer is in direct contact with at least a portion of the other side edge of the integrated circuit chip 3, and the second protective layer is configured to seal the other side edge of the integrated circuit chip 3.

[0093] In an exemplary embodiment, the first protective layer 61 and the second protective layer may each include epoxy resin glue or photosensitive glue.

[0094] In an exemplary embodiment, the flexible circuit board 2 separates the first protection layer 61 from the bonding pad 51 . The first protection layer 61 does not contact the bonding pad 51 , thereby preventing the first protection layer 61 from affecting the conductivity of the bonding pad 51 .

[0095] The embodiment of the present disclosure shows that the module seals the first side 31 of the integrated circuit chip 3 through the first protective layer 61 to prevent moisture and oxygen from entering the integrated circuit chip 3 .

[0096] The embodiment of the present disclosure shows that the module separates the first protective layer 61 from the binding pad 51 through the flexible circuit board 2 to prevent the first protective layer 61 from contaminating the binding pad 51 .

[0097] In an exemplary embodiment, the integrated circuit chip 3 includes a first side 31 on a side close to the bonding pad 51 and a second side 32 on a side away from the bonding pad 51. The through hole 4 includes a first sidewall 41 on a side close to the bonding pad 51 and a second sidewall 41 on a side away from the bonding pad 51. The first sidewall 41 is disposed on a side of the first side 31 of the bonding pad 51 close to the bonding pad 51, and the second sidewall 41 is disposed on a side of the first side 31 of the bonding pad 51 away from the bonding pad 51. The through hole 4 exposes the first side 31 of the integrated circuit chip 3. For example, the first sidewall 41 is disposed on a side of the first side 31 of the bonding pad 51 close to the bonding pad 51, and the second sidewall 41 is disposed on a side of the second side 32 of the bonding pad 51 away from the bonding pad 51. The through hole 4 exposes the first side 31, the second side 32, and the area between the first side 31 and the second side 32 of the integrated circuit chip 3.

[0098] In an exemplary embodiment, the first protection layer 61 is in direct contact with at least a portion of the first sidewall 41 , and the first protection layer 61 is configured to seal the first sidewall 41 of the through-hole 4 .

[0099] The embodiment of the present disclosure shows that the module can simultaneously seal the first side 31 of the integrated circuit chip 3 and the first side wall 41 of the through hole 4 through the first protective layer 61, preventing water and oxygen from entering the integrated circuit chip 3 and the binding pad covered by the flexible circuit board 2, thereby simplifying the process.

[0100] In an exemplary embodiment, the bottom of the first protection layer 61 is in direct contact with the surface of the first binding region 40 on a side away from the display region 100 .

[0101] In an exemplary embodiment, the second protective layer includes a first sub-protective layer 62, at least a portion of the first sub-protective layer 62 is in direct contact with the second side 32 of the integrated circuit chip 3, the bottom of the first sub-protective layer 62 is in direct contact with the surface of the first binding area 40 away from the display area 100, and the first sub-protective layer 62 is configured to seal the second side 32 of the integrated circuit chip 3.

[0102] The embodiment of the present disclosure shows that the module seals the second side 32 of the integrated circuit chip 3 through the first sub-protective layer 62 to prevent moisture and oxygen from entering the integrated circuit chip 3 .

[0103] In an exemplary embodiment, the display module of the embodiment of the present disclosure further includes a third protective layer 65, which is located on the side of the binding pad 51 away from the integrated circuit chip 3, the side of the third protective layer 65 is in direct contact with the flexible circuit board 2, and the bottom surface of the third protective layer 65 is in direct contact with the surface of the second binding area 50 on the side away from the display area 100, and the third protective layer 65 is configured to seal the flexible circuit board 2.

[0104] In an exemplary embodiment, the third protection layer 65 does not contact the bonding pad 51 , so as to prevent the third protection layer 65 from affecting the conductivity of the bonding pad 51 .

[0105] In an exemplary embodiment, the third protection layer 65 includes epoxy resin glue or photosensitive glue.

[0106] In an exemplary embodiment, the display module of the embodiment of the present disclosure further includes an adhesive layer 22, which is arranged between the flexible circuit board 2 and the lead area 30. The upper surface of the adhesive layer 22 is in direct contact with the surface of the flexible circuit board 2 close to the lead area 30, and the lower surface of the adhesive layer 22 is in direct contact with the surface of the lead area 30 away from the display area 100. The adhesive layer 22 is configured to connect the flexible circuit board 2 and the display substrate 1 together.

[0107] In an exemplary embodiment, the display module of the present disclosure further includes a first back film 8 , which is disposed on the backlight side 10 - 2 of the display area 100 of the display substrate 1 , and is in direct contact with the backlight side 10 - 2 of the display area 100 .

[0108] In an exemplary embodiment, the display module of the present disclosure further includes a heat dissipation layer 7, which is disposed on a side of the first back film 8 away from the display area 100 and in direct contact with the first back film 8. The heat dissipation layer 7 may include a carbon plate.

[0109] In an exemplary embodiment, the display module of the embodiment of the present disclosure also includes a curved protective layer 5, which is arranged on the side of the heat dissipation layer 7 away from the display area 100. The surface of one side of the curved protective layer 5 is in direct contact with the heat dissipation layer 7, and the surface of the other side of the curved protective layer 5 is connected to the first binding area 40 and the second binding area 50 through the second back film 6.

[0110] In an exemplary embodiment, the display module of the disclosed embodiment further includes a second back film 6, which is arranged on the side of the curved protective layer 5 away from the display area 100, and the lower surface of the second back film 6 is in direct contact with the curved protective layer 5, and the upper surface of the second back film 6 is in direct contact with the surface of the flat plate portion of the display substrate 1 close to the display area 100.

[0111] In an exemplary embodiment, the side wall of the stacking structure formed by the second binding area 50, the second back film 6 and the bending protective layer 5 is roughly flush on the side away from the bending area 20, and the side wall of the stacking structure on the side away from the bending area 20 extends in a direction perpendicular to the display area 100. The side wall of the heat dissipation layer 7 on the side away from the bending area 20 is farther away from the bending area 20 than the side wall of the stacking structure on the side away from the bending area 20. The side wall of the stacking structure on the side away from the bending area 20 forms a receiving space 9 with the surface of the heat dissipation layer 7, and the receiving space 9 can be configured to accommodate a battery.

[0112] The above-mentioned structure of the display module of the embodiment of the present disclosure can reduce the distance between the integrated circuit chip 3 and the binding pad 51, that is, the distance between the integrated circuit chip 3 and the binding pad 51 in the second direction D2, thereby increasing the length of the accommodating space 9 in the second direction D2. For example, the distance between the integrated circuit chip 3 and the binding pad 51 can be reduced by 2 mm, thereby increasing the length of the accommodating space 9 in the second direction D2 by 2 mm, thereby increasing the capacity of the battery.

[0113] In an exemplary embodiment, the display module of the embodiment of the present disclosure further includes a protective film 21 , at least a portion of which covers the outer surface of the bending region 20 .

[0114] Figure 5 is a schematic plan view of the display substrate and flexible circuit board structure of a display module in accordance with an exemplary embodiment of the present disclosure. In this exemplary embodiment, as shown in Figure 5 , flexible circuit board 2 covers at least a portion of display substrate 1. Flexible circuit board 2 is bonded to and covers bonding pads 51 of display substrate 1. Through holes 4 of flexible circuit board 2 are located on a side of bonding pads 51 of display substrate 1 that is opposite to the second direction D2. Through holes 4 of flexible circuit board 2 are rectangular in shape, exposing the entirety of integrated circuit chip 3.

[0115] In an exemplary embodiment, the integrated circuit chip 3 of the display substrate 1 is located on a side of the display substrate 1 opposite to the bonding pad 51 in the second direction D2. The integrated circuit chip 3 is located in the through-hole 4 and is exposed by the through-hole 4. The integrated circuit chip 3 has a rectangular shape and includes a first side 31, a second side 32, a third side 33, and a fourth side 34. The first side 31 and the second side 32 are long sides, located on opposite sides of the integrated circuit chip 3 in the second direction D2. The first side 31 is located on a side closer to the bonding pad 51, and the second side 32 is located on a side of the first side 31 away from the bonding pad 51. The third side 33 and the fourth side 34 are short sides, located on opposite sides of the integrated circuit chip 3 in the first direction D1. The third side 33 and the fourth side 34 are respectively connected to the ends of the first side 31. The second side 32, the third side 33, and the fourth side 34 are the other sides of the integrated circuit chip 3. The first direction D1 and the second direction D2 intersect each other. For example, the first direction D1 and the second direction D2 are perpendicular to each other.

[0116] In an exemplary embodiment, the through-hole 4 exposes the first side 31 , the second side 32 , the third side 33 , and the fourth side 34 of the integrated circuit chip 3 .

[0117] In an exemplary embodiment, the first protective layer 61 is located on a side of the display substrate 1 opposite to the second direction D2 of the bonding pad 51. The first protective layer 61 extends along the contour of the first side. The first protective layer 61 is shaped like a strip extending along the first direction D1. At least a portion of the first protective layer 61 is in direct contact with the first side 31 of the integrated circuit chip 3 exposed by the through hole 4.

[0118] In an exemplary embodiment, the first protection layer 61 does not contact the bonding pad 51 . The first protection layer 61 is separated from the bonding pad 51 by the flexible circuit board 2 , so as to prevent the first protection layer 61 from affecting the conductivity of the bonding pad 51 .

[0119] In an exemplary embodiment, the first protection layer 61 is in direct contact with at least a portion of the first sidewall 41 . For example, the first protection layer 61 covers the entire first sidewall 41 .

[0120] In an exemplary embodiment, the display module of the embodiment of the present disclosure further includes a second protective layer, which is in direct contact with the edge of the other side of the integrated circuit chip 3 and is configured to seal the edge of the other side of the integrated circuit chip 3 .

[0121] In an exemplary embodiment, the second protective layer includes a first sub-protective layer 62, which is located on the side of the first protective layer 61 away from the binding pad 51. The shape of the first sub-protective layer 62 includes a strip extending along the first direction D1, and the first sub-protective layer 62 is in direct contact with the second side 32 of at least a portion of the integrated circuit chip 3.

[0122] In an exemplary embodiment, the second protection layer further includes a second sub-protection layer 63 . The second sub-protection layer 63 is strip-shaped and extends along the second direction D2 . The second sub-protection layer 63 directly contacts at least a portion of the third side 33 of the integrated circuit chip 3 .

[0123] In an exemplary embodiment, the second protection layer further includes a third sub-protection layer 64 . The third sub-protection layer 64 is strip-shaped and extends along the second direction D2 . The third sub-protection layer 64 directly contacts at least a portion of the fourth side 34 of the integrated circuit chip 3 .

[0124] In an exemplary embodiment, the first protective layer 61 includes a first end and a second end, which are located at opposite ends of the first protective layer 61 in the first direction D1. The first end of the first protective layer 61 covers the first end of the second sub-protective layer 63, and the second end of the first protective layer 61 covers the first end of the third sub-protective layer 64.

[0125] The embodiment of the present disclosure shows that the module covers the second sub-protective layer 63 through the first end of the first protective layer 61 , thereby ensuring the sealing of the binding pad 51 .

[0126] The embodiment of the present disclosure shows that the module covers the third sub-protective layer 64 through the second end of the first protective layer 61 , thereby ensuring the sealing of the binding pad 51 .

[0127] In an exemplary embodiment, the first subprotective layer 62 includes a first end and a second end, and the first end and the second end are located at opposite ends of the first subprotective layer 62 in the first direction D1. The first end of the first subprotective layer 62 and the second end of the second subprotective layer 63 are stacked on each other. For example, the first end of the first subprotective layer 62 covers the second end of the second subprotective layer 63, or the second end of the second subprotective layer 63 covers the first end of the first subprotective layer 62; the second end of the first subprotective layer 62 and the second end of the third subprotective layer 64 are stacked on each other. For example, the second end of the first subprotective layer 62 covers the second end of the third subprotective layer 64, or the second end of the third subprotective layer 64 covers the second end of the first subprotective layer 62.

[0128] The embodiment of the present disclosure shows that the module is stacked with the first sub-protective layer 62 and the second sub-protective layer 63 to ensure the sealing of the bonding pad 51.

[0129] The embodiment of the present disclosure shows that the module is stacked with the first sub-protective layer 62 and the third sub-protective layer 64 to ensure the sealing of the bonding pad 51.

[0130] The following is an exemplary description of the preparation process of the display module. In an exemplary embodiment, the preparation process of the display module of the exemplary embodiment of the present disclosure may include:

[0131] (1) Cutting to form a display substrate 1, the display substrate 1 includes a display area 100 and a bending area 20, a first binding area 40, and a second binding area 50 sequentially arranged on one side of the display area 100, wherein the second binding area 50 is provided with a binding pad 51;

[0132] (2) forming a protective film 21 on the bending region 20 of the display substrate 1;

[0133] (3) bonding the integrated circuit chip 3 to the first bonding region of the display substrate 1, wherein the integrated circuit chip 3 is adjacent to the bonding pad 51, and the integrated circuit chip 3 includes a first side 31 adjacent to the bonding pad 51, and a second side 32, a third side 33, and a fourth side 34 located on the other side of the integrated circuit chip 3;

[0134] (4) coating a first sub-protective layer 62 on the second side 32 , coating a second sub-protective layer 63 on the third side 33 , and coating a third sub-protective layer 64 on the fourth side 34 ;

[0135] (5) The flexible circuit board 2 is bound and connected to the binding pad 51 of the display substrate 1, with the flexible circuit board 2 covering the binding pad 51 of the display substrate 1, and the through hole 4 of the flexible circuit board 2 at least exposing the first side 31 of the integrated circuit chip 3;

[0136] (6) coating a first protective layer 61 on the first side edge 31 and the first side wall 41 of the through hole 4, so that the first protective layer 61 seals the first side edge 31 and the first side wall 41 at the same time;

[0137] (7) forming a heat dissipation layer 7 on the backlight side of the display area 100 of the display substrate 1;

[0138] (8) The binding pad 51 of the display substrate 1 passes through the bending area 20 and is bent to the backlight side of the display area 100 , and is connected to the backlight side of the display area 100 through the bending protection layer 5 and the heat dissipation layer 7 .

[0139] After the display module of the embodiment of the present disclosure binds the flexible circuit board 2 to the binding pad 51 of the display substrate 1, the first side 31 of the integrated circuit chip 3 close to the binding pad 51 is exposed through the through hole 4, and then a first protective layer 61 is coated on the first side 31 for sealing. During the coating process of the first protective layer 61, the binding pad 51 is covered by the flexible circuit board 2, thereby preventing the first protective layer 61 from directly contacting the binding pad 51.

[0140] Figure 6 is a schematic plan view of the display substrate and flexible circuit board of a display module in accordance with an exemplary embodiment of the present disclosure. In this exemplary embodiment, as shown in Figure 6 , through-hole 4 includes a first sidewall 41 and a second sidewall 42 disposed opposite each other in a second direction D2. First sidewall 41 extends along first direction D1 and is located on the side of first side 31 of integrated circuit chip 3 that is closer to bonding pad 51. Second sidewall 42 extends along first direction D1 and is located on the side of second side 32 of integrated circuit chip 3 that is farther from bonding pad 51.

[0141] In an exemplary embodiment, the vertical distance between the first side 31 and the edge of the binding pad 51 close to the first side 31 is L1, and L1 is greater than or equal to 1.1 mm and less than or equal to 3.1 mm. For example, L1 is greater than or equal to 1.5 mm and less than or equal to 2 mm.

[0142] In an exemplary embodiment, a vertical distance L2 between the first side edge 31 and the first side wall 41 of the through hole 4 is greater than or equal to 0.01 mm and less than or equal to 0.7 mm. For example, L2 is greater than or equal to 0.1 mm and less than or equal to 0.5 mm.

[0143] The embodiment of the present disclosure shows that the vertical distance L2 between the first side edge 31 of the module and the first side wall 41 of the through hole 4 is greater than or equal to 0.01 mm and less than or equal to 0.7 mm, ensuring that the first protective layer 61 can contact the first side edge 31 and the first side wall 41 at the same time, sealing the first side edge 31 and the first side wall 41, thereby simplifying the process.

[0144] The present disclosure also provides a display device including the aforementioned display module. The display device can be any product or component including a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system, but the present invention is not limited thereto.

[0145] The present disclosure also provides a method for preparing a display module, comprising:

[0146] Providing a display substrate, the display substrate comprising a display area and a first binding area and a second binding area sequentially arranged on one side of the display area, wherein a binding pad is provided on the second binding area;

[0147] Binding an integrated circuit chip on the first binding area, wherein the integrated circuit chip includes a first side edge close to the binding pad;

[0148] Providing a flexible circuit board, wherein the flexible circuit board is provided with a through hole;

[0149] Binding the flexible circuit board to the binding pads of the second binding area, wherein the through hole exposes at least a portion of the first side;

[0150] A first protection layer is coated on the first side edge exposed by the through hole.

[0151] In an exemplary embodiment, the through hole includes a first sidewall adjacent to the bonding pad, and the first protection layer is coated on both the first sidewall and the first sidewall.

[0152] In an exemplary embodiment, the integrated circuit chip further includes edges located on other sides of the integrated circuit chip; before the flexible circuit board is bound and connected to the binding pads of the display substrate, a second protective layer is coated on the edges on the other sides of the integrated circuit chip; after the flexible circuit board is bound and connected to the binding pads of the display substrate, a first protective layer is coated on the first side exposed by the through hole.

[0153] The display module of the embodiment of the present disclosure is coated with a first protective layer after the flexible circuit board is bound and connected to the binding pads of the display substrate, so that the flexible circuit board covers the binding pads, thereby preventing the first protective layer from contaminating the binding pads. This can reduce the distance between the binding pads and the integrated circuit chip, thereby increasing the storage space for accommodating the battery.

[0154] This application describes multiple embodiments, but this description is exemplary rather than restrictive, and it will be apparent to those skilled in the art that there may be more embodiments and implementations within the scope of the embodiments described herein. Although many possible feature combinations are shown in the drawings and discussed in the detailed description, many other combinations of the disclosed features are also possible. Unless specifically limited, any feature or element of any embodiment may be used in combination with any other feature or element in any other embodiment, or may replace any other feature or element in any other embodiment.

[0155] This application includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The embodiments, features, and elements disclosed in this application may also be combined with any conventional features or elements to form a unique inventive solution defined by the claims. Any features or elements of any embodiment may also be combined with features or elements from other inventive solutions to form another unique inventive solution defined by the claims. Therefore, it should be understood that any feature shown and / or discussed in this application may be implemented individually or in any appropriate combination. Therefore, except for the limitations made according to the appended claims and their equivalents, the embodiments are not subject to other limitations. In addition, various modifications and changes may be made within the scope of protection of the appended claims.

[0156] In addition, when describing representative embodiments, the specification may have presented the method and / or process as a specific sequence of steps. However, to the extent that the method or process does not rely on the specific order of the steps described herein, the method or process should not be limited to the steps in the specific order described. As will be understood by those skilled in the art, other orders of steps are also possible. Therefore, the specific order of the steps set forth in the specification should not be interpreted as a limitation on the claims. In addition, the claims for the method and / or process should not be limited to performing their steps in the order written, and those skilled in the art can readily understand that these orders can be changed and still remain within the spirit and scope of the embodiments of the present application.

Claims

1. A display module, comprising: A display substrate, comprising a display area and a first bonding area and a second bonding area sequentially arranged on one side of the display area, wherein bonding pads are arranged on the second bonding area; An integrated circuit chip, bonded and connected to the first bonding area, the integrated circuit chip comprising a first side close to one side of the bonding pads; A flexible printed circuit board, the flexible printed circuit board being bonded and connected to the bonding pads of the second bonding area and covering the bonding pads, a through hole being arranged in the flexible printed circuit board, the through hole exposing at least part of the first side; A first protective layer, at least part of the first protective layer being in direct contact with the first side exposed by the through hole.

2. The display module according to claim 1, wherein, The through hole comprises a first side wall, the first side wall being located on a side of the first side close to the bonding pads, the first protective layer being in direct contact with at least part of the first side wall.

3. The display module according to claim 1, wherein, The vertical distance between the first side and the edge of the bonding pads on a side close to the first side is greater than or equal to 1.1 mm and less than or equal to 3.1 mm.

4. The display module according to claim 2, wherein, The vertical distance between the first side and the first side wall is greater than or equal to 0.01 mm and less than or equal to 0.7 mm.

5. The display module according to claim 1, wherein The bottom of the first protective layer is in direct contact with the display substrate.

6. The display module according to claim 1, wherein, The first protective layer comprises epoxy resin glue or photosensitive glue.

7. The display module according to any one of claims 1 to 6, wherein, The integrated circuit chip further comprises edges on other sides of the integrated circuit chip, the display module further comprising a second protective layer, the second protective layer being in direct contact with at least part of the edges on other sides of the integrated circuit chip.

8. The display module according to claim 7, wherein, The edges on other sides of the integrated circuit chip comprise a second side, a third side and a fourth side, the second side being located on a side of the first side far from the bonding pads, the third side and the fourth side being respectively connected to two ends of the first side, the second protective layer comprising a first sub-protective layer, a second sub-protective layer and a third sub-protective layer, the first sub-protective layer being in direct contact with at least part of the second side, the second sub-protective layer being in direct contact with at least part of the third side, and the third sub-protective layer being in direct contact with at least part of the fourth side.

9. The display module according to claim 8, wherein A first end of the first protective layer covers the second sub-protective layer, and a second end of the first protective layer covers the third sub-protective layer.

10. The display module according to claim 8, wherein, A first end of the first sub-protective layer is stacked with the second sub-protective layer, and / or a second end of the first sub-protective layer is stacked with the third sub-protective layer.

11. The display module according to claim 7, wherein, The through hole exposes the edges on other sides of the integrated circuit chip.

12. The display module according to any one of claims 1 to 6, wherein The shape of the through hole comprises a rectangle.

13. The display module according to any one of claims 1 to 6, wherein, The display substrate further comprises a bending area arranged between the display area and the first bonding area, the bending area being configured to bend the first bonding area and the second bonding area to the backlight side of the display area.

14. The display module according to claim 13 further includes a heat dissipation layer and a bending protection layer. The heat dissipation layer is disposed on the backlight side of the display area. The bending protection layer is disposed on a side of the heat dissipation layer away from the display area and is connected to the second bonding area. A side wall of a stacked structure formed by the second bonding area and the bending protection layer on a side away from the bending area is substantially flush. A side wall of the heat dissipation layer on a side away from the bending area is farther from the bending area than the side wall of the stacked structure. The side wall of the stacked structure and a surface of the heat dissipation layer form an accommodation space, and the accommodation space is configured to accommodate a battery.

15. The display module according to any one of claims 1 to 6 further includes a third protection layer. The third protection layer is located on a side of the bonding pad away from the integrated circuit chip. A side surface of the third protection layer is in direct contact with the flexible printed circuit board, and a bottom surface of the third protection layer is in direct contact with the display substrate.

16. A display device, characterized in that, Including the display module according to any one of claims 1 to 15.

17. A method for manufacturing a display module includes: providing a display substrate including a display area and a first bonding area and a second bonding area sequentially disposed on one side of the display area, and a bonding pad is disposed on the second bonding area; bonding an integrated circuit chip on the first bonding area, and the integrated circuit chip includes a first side closer to the bonding pad; providing a flexible printed circuit board provided with a through hole; bonding and connecting the flexible printed circuit board with the bonding pad of the second bonding area, and at least part of the first side is exposed by the through hole; coating a first protection layer on the first side exposed by the through hole.

18. The manufacturing method of the display module according to claim 17, wherein, The through hole includes a first side wall closer to the bonding pad, and the first protection layer is coated on both the first side and the first side wall at the same time.

19. The manufacturing method of the display module according to claim 17, wherein, The integrated circuit chip further includes an edge portion on other sides of the integrated circuit chip; before the flexible printed circuit board is bonded and connected with the bonding pad of the display substrate, a second protection layer is coated on the edge portion on other sides of the integrated circuit chip.

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