Injection-molded part, camera module base assembly and manufacturing method therefor, and camera module

Abstract

Disclosed in the present invention are an injection-molded part, a camera module base assembly and a manufacturing method therefor, and a camera module. The manufacturing method comprises: a, providing a first material tape, the first material tape comprising a plurality of first metal elements, and performing first injection molding on the first material tape to form a plurality of first injection-molded portions, so as to obtain a first semi-finished product; b, providing a second material tape, the second material tape comprising a plurality of second metal elements, stacking the second material tape on the first material tape such that the second metal elements are located at corners of the first semi-finished product, so as to form magnetic attraction elements, and then performing second injection molding on the first semi-finished product and the second material tape to form a plurality of second injection-molded portions, so as to obtain a second semi-finished product; c, cutting the second semi-finished product to obtain a plurality of unit semi-finished products, each unit semi-finished product being provided with a first metal element; and d, providing an electronic component, and welding the electronic component to the unit semi-finished product to electrically connect the electronic component to a mounting portion of the first metal element, so as obtain an injection-molded part finished product.

Description

Injection molded part, camera module base assembly, manufacturing method thereof, and camera module Technical Field

[0001] The present application relates to the field of optical imaging, and specifically to an injection molded part, a camera module base assembly, a manufacturing method thereof, and a camera module. Background Art

[0002] In recent years, smart electronic devices have experienced rapid development, becoming increasingly thinner and lighter. Camera modules are an essential component of mobile electronic devices. With the further advancement of camera module technology, user demands for camera modules have become increasingly sophisticated and demanding. Camera product development must not only meet high performance requirements but also meet the requirements for miniaturization, lightness, and compactness. Therefore, to adapt to this development, camera modules are increasingly required to be multifunctional, lightweight, and compact, enabling electronic devices to be made thinner and meeting the imaging requirements of camera modules. Consequently, camera module manufacturers are committed to designing and manufacturing camera modules that meet these requirements. A camera module consists of a lens, a motor, and a photosensitive component. Light passes through the lens and reaches the photosensitive component, where it is received by the photosensitive chip. The motor drives the lens to adjust its position. To further improve image quality and enable more imaging functions, camera modules are becoming increasingly versatile, including but not limited to autofocus (AF), optical image stabilization (OIS), variable aperture, and continuous zoom. The AF function is usually achieved by a motor driving the lens to move linearly along the optical axis. The OIS function is usually achieved by a motor compensating for shake displacement. The shake of the camera module includes translation in the direction perpendicular to the optical axis (translation in the x-axis and y-axis directions) and rotation (referring to rotation in the xoy plane, and its axis direction can be roughly the same as the optical axis), as well as tilt shake (referring to rotation around the x-axis and y-axis. In the field of camera modules, tilt shake is also called tilt shake). When the gyroscope (or other position sensing element) of the camera module detects shake in a certain direction, it can issue a command to drive the motor to move a certain distance in the opposite direction to compensate for the shake of the lens. The motor usually has a base for supporting the focus carrier and the anti-shake carrier. The focus carrier supports the lens for focusing movement, and the anti-shake carrier supports the lens for shake compensation movement. The design and assembly of the base, focus carrier, and anti-shake carrier will affect the size of the motor, and thus affect the size of the camera module. However, the installation space of the camera module in the electronic device is very limited, and the increase in the motor volume is limited, so the driving force cannot be effectively increased. For example, the thickness of the mobile phone is strictly limited, which leads to a serious limitation in the height of the camera module. Under the condition of limited height, how to design increasingly complex motors to meet the requirements of higher imaging quality and smaller size is a major problem for those skilled in the art. Taking the voice coil motor camera module as an example, the motor includes a coil and a magnet. The coil is arranged around the optical axis in a plane perpendicular to the optical axis, usually arranged on the top surface of the motor base. The magnet is arranged above the coil along the optical axis to interact with the coil to generate a driving force perpendicular to the optical axis and realize translational motion perpendicular to the optical axis. The coil and magnet are arranged longitudinally, which affects the shoulder height of the camera module.If the installation height of the coil in the camera module is high, the installation height of the magnet is raised accordingly, and the magnet is installed on the carrier, and the installation height of the carrier is also raised accordingly.

[0003] In addition, the coil needs to be connected to the circuit board of the camera module to pass current. Usually, the coil is installed on a coil substrate or the coil is formed on the coil substrate, and then the coil substrate and the circuit board of the camera module are connected to achieve the conduction of the coil. Therefore, a coil substrate, such as a flexible printed circuit board, needs to be set inside the camera module, which will also occupy a certain height space and increase the shoulder height of the camera module.

[0004] Furthermore, the implementation of these functions requires the camera module to have built-in metal components for power supply and control. The built-in circuit is connected to an external power source (such as an electronic device) through the camera module's circuit board to obtain power and also transmit information. To further save space, there is currently a technology that integrates metal components into the injection molded parts of the camera module. This can avoid the need for a separate corresponding circuit board and help reduce the size of the camera module.

[0005] In current camera modules, injection molded parts, such as motor bases, lens bases, motor carriers, lens carriers, etc., are generally manufactured by injection molding of coated metal components and surface mounting of electronic components. The general process is to form the metal material into a strip, each strip including multiple metal components, and then coat the metal components by injection molding, and then perform SMT (Surface Mounted Technology) on the exposed parts of the metal components, and then cut the semi-finished products obtained after SMT to obtain the final finished product. Therefore, injection molding and SMT are both carried out in the form of a whole strip, which causes the efficiency of injection molding to affect the efficiency of the SMT link. When SMT is performed in the form of a whole strip, the yield of the SMT reflow link is relatively low, which also affects efficiency.

[0006] In addition, there is a secondary injection molding process, which is generally performed after SMT. Generally, the yield of secondary injection molding is lower than that of primary injection molding. If SMT is performed first and then secondary injection molding, the yield of SMT will be lower. However, SMT has a higher added value, and the waste caused by scrapping semi-finished products and rework is high, resulting in higher production costs. Summary of the Invention

[0007] One advantage of the present application is that it provides an injection molded part, a camera module base assembly, a manufacturing method thereof, and a camera module, thereby improving production efficiency and finished product yield.

[0008] One advantage of the present application is that it provides an injection molded part, a camera module base assembly, a manufacturing method thereof, and a camera module, wherein the coil of the camera module is built into the camera module base assembly, becoming a part of the camera module base assembly, saving space inside the camera module and reducing the shoulder height of the camera module.

[0009] One advantage of the present application is that it provides an injection molded part, a camera module base assembly, a manufacturing method thereof, and a camera module. The camera module base assembly is formed by a molding process and has a high flatness.

[0010] One advantage of the present application is that it provides an injection molded part, a camera module base assembly, a manufacturing method thereof, and a camera module. The support portion of the camera module base assembly is formed on the surface of the circuit board to form the base of the circuit board, which can improve the flatness of the circuit board.

[0011] One advantage of the present application is that it provides an injection molded part, a camera module base assembly, a manufacturing method thereof, and a camera module, wherein the support part is molded twice. After the first molding, the coil is installed, and then the second molding is performed so that the coil is built into the support part.

[0012] One advantage of the present application is that it provides an injection molded part, a camera module base assembly, a manufacturing method thereof, and a camera module, in which the focusing conductive part of the driving part is built into the supporting part and becomes a part of the camera module base assembly, thereby improving the integration of the camera module base assembly, simplifying the design of the focusing conductive structure, and reducing production costs.

[0013] One advantage of the present application is that it provides an injection molded part, a camera module base assembly, a manufacturing method thereof, and a camera module, in which the coil and the circuit board are fixed and connected by lead ends, eliminating the coil substrate design of the coil, reducing parts, and further reducing the shoulder height of the camera module.

[0014] One advantage of the present application is that it provides an injection molded part, a camera module base assembly, a manufacturing method thereof, and a camera module, wherein the support portion integrally forms a positioning column to form a support and positioning structure for the drive portion, thereby reducing manufacturing steps and improving production efficiency.

[0015] One advantage of the present application is that it provides an injection molded part, a camera module base assembly, a manufacturing method thereof, and a camera module, wherein electronic components are mounted on the surface of the circuit board, and the support portion covers the electronic components, so that the electronic components are built into the support portion, thereby improving the integration and saving the internal space of the camera module.

[0016] One advantage of the present application is that it provides an injection molded part, a camera module base assembly, a manufacturing method thereof, and a camera module, in which the coil conduction area and the electronic components on the surface of the circuit board are designed to avoid each other to avoid mutual interference.

[0017] To achieve the above objectives, the present invention adopts the following technical solution: a method for manufacturing an injection molded part, comprising the following steps:

[0018] a. Providing a first material strip, the first material strip including a first metal element, performing a first injection molding on the first material strip to form a plurality of first injection-molded parts to obtain a first semi-finished product;

[0019] b. Providing a second material strip, the second material strip comprising a plurality of second metal elements, and stacking the second material strip on the first material strip so that the second metal elements are located at corners of the first semi-finished product to form magnetic elements, wherein the second metal elements are longitudinally spaced from the first metal elements, and performing a second injection molding on the first semi-finished product and the second material strip to form a plurality of second injection-molded parts to obtain a second semi-finished product;

[0020] c. cutting the second semi-finished product to obtain a plurality of unit semi-finished products, such that each of the unit semi-finished products has the first metal element;

[0021] d. Providing electronic components, welding the electronic components to the semi-finished unit product, and electrically connecting the electronic components to the mounting portion of the first metal element to obtain a finished injection molded part.

[0022] Therefore, magnetic components can be installed during injection molding through an embedded method, improving positioning accuracy and eliminating additional installation steps. Furthermore, the second half product, which is a full strip, can be cut into individual semi-finished units before SMT. This allows the SMT process to be performed on the individual semi-finished units, eliminating the need to wait for the entire strip to pass the second injection molding process before proceeding to SMT, thus improving production efficiency.

[0023] To achieve at least one of the above objectives, the present invention employs a technical solution comprising: an injection molded part comprising an injection molding portion, a metal element, and an electronic component, wherein at least a portion of the metal element is encapsulated within the injection molding portion, and the electronic component is electrically connected to the metal element, the injection molded part being manufactured by any of the aforementioned methods for manufacturing injection molded parts. By performing a second injection molding process prior to the SMT process, the loss of semi-finished products that have already undergone the SMT process is reduced, thereby lowering the production cost of the injection molded part.

[0024] According to one aspect of the present application, the present application provides a camera module base assembly, comprising:

[0025] a circuit board; a plurality of coils, wherein the coils are conductively connected to the circuit board;

[0026] a first supporting portion, the first supporting portion being formed on the circuit board, wherein the first supporting portion comprises a plurality of coil mounting portions, each of the coils being correspondingly mounted on each of the coil mounting portions; and

[0027] The second supporting portion is integrally formed on the circuit board, covers the coil mounting portion and the coil, and forms a supporting portion together with the first supporting portion.

[0028] According to another aspect of the present application, the present application also provides a method for manufacturing a camera module base assembly, comprising the following steps:

[0029] Providing a circuit board;

[0030] forming a first supporting portion on the circuit board to form a coil mounting portion;

[0031] Installing a coil on the coil installation portion to electrically connect the coil and the circuit board; and

[0032] A second supporting portion is formed on the circuit board, and the second supporting portion covers the coil mounting portion.

[0033] According to another aspect of the present application, the present application provides a camera module, comprising:

[0034] Circuit board;

[0035] a coil, the coil being conductively connected to the circuit board;

[0036] A support portion providing a top surface, wherein the coil is built into the support portion and is located below the top surface;

[0037] a driving portion, the driving portion comprising a driving magnet and an anti-shake carrier, the anti-shake carrier being movably mounted on the support portion, the driving magnet being mounted on the anti-shake carrier, wherein a bottom surface of the driving magnet faces a top surface of the support portion;

[0038] a light-sensing portion, wherein a light-sensing area of ​​the light-sensing portion is exposed through a light-through hole defined by the supporting portion; and

[0039] A lens unit is mounted on the driving unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] FIG1 is a schematic structural diagram of a first material strip according to some embodiments of the present application;

[0041] FIG2 is a schematic structural diagram of a first semi-finished product according to some embodiments of the present application;

[0042] FIG3 is an enlarged schematic diagram of a portion A in FIG2 of the present application;

[0043] FIG4 is an enlarged schematic diagram of a portion B in FIG2 of the present application;

[0044] FIG5 is an enlarged schematic diagram of a portion C in FIG2 of the present application;

[0045] FIG6 is a schematic structural diagram of a second material strip according to some embodiments of the present application;

[0046] FIG7 is a schematic structural diagram of a second material strip disposed on a first semi-finished product according to some embodiments of the present application;

[0047] FIG8 is a schematic diagram of a positioning device cooperating with a first material tape and a second material tape according to some embodiments of the present application;

[0048] FIG9 is an enlarged schematic diagram of a portion D in FIG8 of the present application;

[0049] FIG10 is a schematic structural diagram of a second semi-finished product according to some embodiments of the present application;

[0050] FIG11 is a schematic structural diagram of a unit semi-finished product according to some embodiments of the present application;

[0051] FIG12 is a schematic structural diagram of a finished injection molded part according to some embodiments of the present application.

[0052] Figure 13A is a schematic diagram of a camera module base assembly according to an embodiment of the present application.

[0053] FIG13B is an exploded schematic diagram of a camera module according to an embodiment of the present application.

[0054] Figure 13C is an exploded schematic diagram of the camera module base assembly according to one embodiment of the present application.

[0055] Figure 14 is a schematic diagram and a partially enlarged schematic diagram of the power supply part of the camera module base assembly according to an embodiment of the present application.

[0056] Figure 15 is a schematic diagram of a camera module base assembly after a first support portion is formed on a circuit board according to an embodiment of the present application.

[0057] FIG16A is an enlarged schematic diagram of area A in FIG15 .

[0058] FIG16B is an enlarged schematic diagram of area B in FIG15 .

[0059] Figure 16C is a schematic diagram of the first supporting portion of the camera module base assembly according to one embodiment of the present application.

[0060] FIG16D is an enlarged schematic diagram of region C in FIG15 .

[0061] Figure 17 is a schematic diagram and a partially enlarged schematic diagram of a camera module base assembly after a second support portion is formed on the circuit board according to an embodiment of the present application.

[0062] FIG18A is a simplified schematic diagram of the internal structure of a camera module according to an embodiment of the present application.

[0063] Figure 18B is a schematic diagram of the internal structure of an implementation of a camera module according to an embodiment of the present application.

[0064] Figure 18C is a schematic diagram of the internal structure of another implementation of a camera module according to an embodiment of the present application.

[0065] Figure 18D is a schematic diagram of another implementation of the camera module base assembly according to an embodiment of the present application.

[0066] Figure 19A is a schematic diagram of an implementation method of installing the filter part of a camera module according to an embodiment of the present application.

[0067] Figure 19B is a schematic diagram of another implementation method of installing the filter part of the camera module according to an embodiment of the present application.

[0068] In the figure: 10, finished injection molded part; 11, first semi-finished product; 12, second semi-finished product; 13, unit semi-finished product; 20, first material strip; 21, first metal element; 211, inner peripheral portion; 212, outer peripheral portion; 213, pin portion; 2131, first pin portion; 2132, second pin portion; 214, mounting portion; 214a, first mounting portion; 214b, second mounting portion; 215, conductive portion; 22, first connecting portion; 23, first baseband portion; 24, first fixing portion; 30, first injection molded portion; 31. First mounting channel; 311. Hall mounting channel; 312. IC mounting channel; 32. Limiting portion; 40. Second material strip; 41. Second metal element; 42. Second connecting portion; 43. Second baseband portion; 44. Second fixing portion; 50. Second injection molding portion; 51. Second mounting channel; 52. Support arm; 53. Ball groove; 60. Electronic component; 61. Position sensing element; 611. Hall element; 612. IC; 70. Positioning device; 71. First positioning portion; 72. Second positioning portion.10B, power supply unit; 11B, circuit board; 110B, circuit board through hole; 111B, first surface; 112B, coil conduction area; 113B, first peripheral surface; 114B, outer edge; 115B, connecting portion; 12B, connecting belt; 13B, magnetic element; 131B, first magnetic portion; 132B, second magnetic portion; 14B, electronic component; 141B, position sensor; 142B, controller; 20B, support portion; 201B, filter mounting portion; 21B, first support portion; 211B, coil mounting portion; 2110B, molded avoidance space; 2 111B, top surface; 2112B, positioning protrusion; 212B, covering portion; 213B, first positioning post; 214B, spacer; 215B, step portion; 2131, inner surface; 21311B, first inner surface; 21312B, second inner surface; 2132B, first top portion; 2133B, first positioning portion; 2134B, second positioning portion; 22B, second supporting portion; 221B, bottom plate; 2211B, top surface; 222B, second positioning post; 223B, guide portion; 224B, boss; 2230B, guide groove; 200B , light hole; 210B, first light hole; 220B, second light hole; 2000B, installation space; 23B, positioning column; 231B, installation column; 232B, outer peripheral surface; 30B, driving part; 301B, anti-shake component; 302B, focusing component; 31B, coil; 310B, installation hole; 3101B, inner peripheral wall; 311B, lead end; 3111B, first lead end; 3112B, second lead end; 32B, focusing conductive member; 321B, first conductive end; 322B, second conductive end; 323B, first part; 324B, first Two parts; 33B, driving magnet; 331B, bottom surface; 34B, anti-shake carrier; 340B, avoidance space; 3401B, first avoidance space; 3402B, second avoidance space; 34021B, upper guide groove; 35B, ball bearing; 36B, elastic member; 361B, first elastic member; 362B, second elastic member; 37B, focus carrier; 38B, focus coil; 40B, photosensitive part; 41B, photosensitive chip; 50B, lens part; 60B, filter part; 61B, filter; 62B, filter bracket; 70B, reinforcement plate; 80B, outer shell. DETAILED DESCRIPTION

[0069] The present invention will be further described below in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0070] In the description of the present invention, it should be noted that, for directional words, such as the terms "center", "horizontal", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like, indicating directions and positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and cannot be understood as limiting the specific scope of protection of the present invention.

[0071] It should be noted that the terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0072] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct, contact, or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0073] The injection molded parts of the camera module include but are not limited to a lens base, a lens carrier, a motor base, a motor carrier, etc. According to one aspect of the present invention, the present invention provides a method for manufacturing an injection molded part, as shown in FIG. 1 to FIG. 19B , comprising the following steps.

[0074] a. Provide a first material strip 20 , which includes a plurality of first metal elements 21 , and perform a first injection molding on the first material strip 20 to form a plurality of first injection-molded parts 30 , thereby obtaining a first semi-finished product 11 , as shown in FIG. 1 to FIG. 5 .

[0075] b. Provide a second material strip 40, wherein the second material strip 40 includes a plurality of second metal elements 41. The second material strip 40 is stacked on the first material strip 20 so that the second metal elements 41 are located at the corners of the first semi-finished product 11 to form magnetic elements. The second metal elements 41 and the first metal elements 21 are longitudinally spaced apart. Perform a second injection molding on the first semi-finished product 11 and the second material strip 40 to form a plurality of second injection-molded parts 50 to obtain a second semi-finished product 12, as shown in FIG10 .

[0076] c. Cut the second semi-finished product 12 to obtain a plurality of unit semi-finished products 13 , so that each unit semi-finished product 13 has a first metal element 21 , as shown in FIG. 11 .

[0077] d. Provide an electronic component 60 , weld the electronic component 60 to the unit semi-finished product 13 , and electrically connect the electronic component 60 to the mounting portion 214 to obtain a finished injection molded part 10 , as shown in FIG. 12 .

[0078] Specifically, in step a, when the first injection molding is performed, the first injection molding part 30 at least covers the inner circumference 211 of the first metal element 21, and avoids the pin portion 213 and the mounting portion 214 of the first metal element 21; in step b. In step b, when the second injection molding is performed, the second injection molding part 50 covers the first semi-finished product 11 and the second metal element 41, and the second injection molding part 50 avoids the mounting portion 214 and the end of the pin portion 213. It can be understood that in step b, the magnetic element is installed in an embedded manner when manufacturing the injection molded part, which improves the position accuracy of the magnetic element and eliminates the additional installation steps. In step d, SMT (Surface Mounted Technology) is usually used to solder the electronic components 60 to the unit semi-finished product 13. It is understandable that performing SMT first and then performing a second injection molding will result in loss of the completed SMT semi-finished product due to the relatively low yield of the second injection molding. However, the added value of the completed SMT semi-finished product is higher, further increasing production costs. In this embodiment, however, the second injection molding is advanced to step b, that is, the second injection molding is performed before SMT, which reduces the loss of the completed SMT semi-finished product and helps reduce production costs. In addition, when performing SMT in the form of a whole strip, the SMT efficiency is limited by the efficiency of injection molding. In this embodiment, the strip is cut in step c to form individual unit semi-finished products 13. After the unit semi-finished products 13 are placed on a plate, SMT can be performed, which helps improve SMT efficiency.

[0079] As shown in Figure 6, the second material strip 40 includes a second metal element 41, a second baseband portion 43 and a second connecting portion 42. Several second metal elements 41 are arranged at intervals along the extension direction of the second baseband portion 43, and the second metal elements 41 are connected to the second baseband portion 43 through several second connecting portions 42.

[0080] A second material strip 40 is provided, which includes multiple second metal elements 41. The second material strip 40 is stacked with the first material strip 20 so that at least part of the first metal elements 21 of the first material strip 20 and the second metal elements 41 of the second material strip 40 are arranged opposite to each other, and then a second injection molding is performed.

[0081] Specifically, as shown in Figure 6 , the second material strip 40 includes a second metal element 41, a second base strip portion 43, and a second connecting portion 42. Several second metal elements 41 are spaced apart along the extension direction of the second base strip portion 43, and the second metal elements 41 are connected to the second base strip portion 43 via several second connecting portions 42. As shown in Figures 7 to 9 , before the second injection molding process, the second material strip 40 is placed on the first semi-finished product 11 so that the second metal elements 41 on the second material strip 40 correspond to the first metal elements 21 on the first material strip 20. Furthermore, during the second injection molding process, the second injection molding portion 50 covers the second metal elements 41. It is understood that the second material strip 40 and the first material strip 20 can be stacked, either in contact with each other or separated by the first injection molding portion 30.

[0082] In one embodiment, the second material strip 40 is arranged above the first material strip 20 and is arranged in a manner opposite to the bottom direction of the first injection molding part 30. There is a longitudinal gap between the second metal element 41 and the first metal element 21 to avoid mutual interference. In a subsequent step, a second injection molding is performed, and the second injection molding part 50 covers the second metal element 41 of the second material strip 40, so that the second metal element 41 is embedded in the second injection molding part 50. Furthermore, the second metal element 41 is placed at the corner of the first injection molding part 30, and after being covered by the second injection molding part 50, an embedded magnetic element is formed, which is beneficial to improve the position accuracy of the magnetic element and avoids the need to install a magnetic element separately when assembling the camera module, which is beneficial to improve production efficiency. Furthermore, the outer end of the second metal element 41 is protruding from the outside of the finished injection molding part 10, which is suitable for welding with the outer shell.

[0083] As can be understood, as shown in Figure 7, the magnetic elements formed by the second metal elements 41 are located at the four corners of the finished injection molded part 10, generating two oppositely directed magnetic resetting forces on the same magnet subsequently installed above the finished injection molded part 10. Furthermore, each second metal element 41 includes two intersecting portions extending in opposite directions, generating magnetic forces on two adjacent magnets.

[0084] Furthermore, as shown in FIG7 , in step b, the second metal element 41 of the second material strip 40 is placed on the limiting portion 32 of the first injection molding part 30, thereby horizontally limiting the relative position of the first material strip 20 and the first semi-finished product 11. During the first injection molding, the four corners of the first injection molding part 30 form the limiting portions 32, which are located above the first metal element 21. When the second layer of material strip is set, the second metal element 41 is located above the first metal element 21. The limiting portions 32 are implemented as grooves at the four corners of the first injection molding part 30, and their shape is adapted to the shape of the second metal element 41 to serve as a limiting function.

[0085] Specifically, the four corners of the first injection molding section 30 are provided with stoppers 32. The stoppers 32 are adapted to cooperate with the second material strip 40 to accommodate the second metal element 41. When laying out the second material strip 40, the second material strip 40 is placed in the stoppers 32, thereby placing the second material strip 40 in a predetermined position. This also prevents the second material strip 40 from shifting relative to the first semi-finished product 11 during movement or during a second injection molding process, further improving the relative positional accuracy of the second material strip 40 and the first semi-finished product 11. It will be appreciated that in the first semi-finished product 11 formed by the first injection molding, the stoppers 32 are formed at the four corners of the first injection molding section 30 and are longitudinally aligned with the first metal element 21, with the second metal element 41 positioned above the first metal element 21. In the finished injection-molded part 10, the second metal element 41 is positioned below the first metal element 21.

[0086] In other examples, the second metal element 41 forms a second layer circuit, which is longitudinally spaced apart from the first layer circuit formed by the first metal element 21. The first layer circuit and the second layer circuit do not interfere with each other and can be electrically connected to different functional elements respectively.

[0087] In some optional embodiments, the finished injection molded part 10 is only provided with the first material strip 20, and the first injection molding is performed on the first material strip 20 to form a first injection molding portion 30 to cover the inner periphery 211 of the first metal element 21, and the first injection molding portion 30 avoids the pin portion 213 and the mounting portion 214 of the first metal element 21, so that in the finished injection molded part 10, the mounting portion 214 can be fixed and electrically connected to the electronic component 60. The second injection molding is also performed on the first material strip 20 to form a second injection molding part 50 to cover at least part of the first injection molding part 30 and the position on the first metal element 21 not covered by the first injection molding part 30, such as the periphery 212 and the pin portion 213. The second injection molding part 50 avoids the mounting portion 214 and the end of the pin portion 213 of the first metal element 21, so that in the finished injection molding part 10, the mounting portion 214 can be fixed and electrically connected to the electronic component 60, and at the same time, the finished injection molding part 10 can be electrically connected to the external circuit through the end of the pin portion 213.

[0088] In other optional embodiments, the finished injection molded part 10 is provided with a first material strip 20 and a second material strip 40, the first injection molding is performed only on the first material strip 20, forming a first injection molding part 30 to cover the inner periphery 211 of the first metal element 21, and the second injection molding is performed on the first material strip 20 and the second material strip 40, forming a second injection molding part 50 to cover at least part of the first injection molding part 30, and the position on the first metal element 21 not covered by the first injection molding part 30, such as the periphery 212 and the surrounding of the pin portion 213, and covering at least part of the second material strip 40, and the second injection molding part 50 avoids the mounting portion 214 of the first metal element 21 and the end of the pin portion 213, so that in the finished injection molded part 10, the mounting portion 214 can be fixed and electrically connected to the electronic component 60, and at the same time, the finished injection molded part 10 can be electrically connected to the external circuit through the end of the pin portion 213.

[0089] In other optional embodiments, the finished injection molded part 10 is provided with a first material strip 20 and a second material strip 40, and the first injection molding is performed only on the first material strip 20 to form a first injection molding portion 30 to cover the first material strip 20, and the first injection molding portion 30 avoids the mounting portion 214 and the end of the pin portion 213 of the first metal element 21, so that in the finished injection molded part 10, the mounting portion 214 can be fixed and electrically connected to the electronic component 60, and at the same time, the finished injection molded part 10 can be electrically connected to the external circuit through the end of the pin portion 213, and the second injection molding is performed only on the second material strip 40 to form a second injection molding portion 50 to cover at least part of the position of the second material strip 40.

[0090] It is understandable that the materials used in the first injection and the second injection can be consistent or inconsistent, and the precision of the first injection and the second injection can be consistent or inconsistent to meet the different requirements of the first injection part 30 and the second injection part 50.

[0091] In one specific embodiment, as shown in FIG11 , the finished injection molded part 10 is a motor base. The first injection molding process is performed on the first strip 20. The first injection molding portion 30 covers the inner periphery 211 of the first metal element 21, thereby enclosing most of the branches that secure the first metal element 21. The first injection molding portion 30 avoids the connection portion, the pin portion 213, and other branches located on the outer periphery 212 of the first metal element 21, thereby obtaining a first semi-finished product 11, i.e., the bottom plate portion of the finished injection molded part 10. The second injection molding process is performed on the first strip 20 and the second strip 40. The second injection molding portion 50 covers the second metal element 41, the outer periphery 212 and pin portion 213 of the first metal element 21, and a portion of the first injection molding portion 30. The second injection molding portion 50 avoids the end of the pin portion 213 and the mounting portion 214, thereby obtaining a second semi-finished product 12, i.e., the main body and side portions of the finished injection molded part 10. Specifically, support arms 52 are protruding from the four corners of the top surface of the second injection molding part 50 to support other components in the camera module; ball grooves 53 are formed on the top surface of the second injection molding part 50 adjacent to the support arms 52 to accommodate the balls in the camera module.

[0092] Furthermore, during manufacturing, the mounting portion 214 of the first metal element 21 is facing away from the mold and facing upward. The first material strip 20 is set in the mold with the mounting portion 214 facing upward. After the first injection molding, the bottom of the first injection molding part 30 faces away from the mold and faces upward. When the pin portion 213 is bent, the pin portion 213 is bent upward. Among them, the limiting portion 32 formed at the bottom of the first injection molding part 30 is also facing upward, which is suitable for placing the second material strip 40. After the second injection molding, when the second semi-finished product 12 is cut to obtain the unit semi-finished product 13 and the plate is placed, the bottom of the unit semi-finished product 13 can be facing upward to expose the mounting portion 214 at the bottom for SMT.

[0093] This allows the injection mold to avoid the mounting portion 214 during injection molding. Furthermore, the support arms 52 and ball bearing grooves 53 at the four corners of the first injection molding portion 30 face downward, preventing interference with the subsequent lamination of the second strip 40 and the formation of the second injection molding portion 50. Furthermore, the mounting portion 214 faces away from the support arms 52 and ball bearing grooves 53. During SMT, the support arms 52 and ball bearing grooves 53 do not interfere with the installation of the electronic components 60. The bottom of the semi-finished unit product 13, where the mounting portion 214 is located, does not interfere with the operation of the SMT device.

[0094] Furthermore, as shown in Figures 2 and 7, step a also includes step a1: cutting a portion of the first connecting portion 22 around the first metal element 21 after the first injection molding to facilitate bending a portion of the pin portion 213 of the first metal element 21 and / or to facilitate step b. Specifically, the first material strip 20 also includes a first base strip portion 23 and a first connecting portion 22. A plurality of first metal elements 21 are arranged at intervals along the extension direction of the first base strip portion 23, and the first metal elements 21 are connected to the first base strip portion 23 via a plurality of first connecting portions 22. After the first injection molding, the first material strip 20 is cut to remove a portion of the first connecting portion 22 to prevent short circuiting caused by overlapping the first material strip 20 and the second material strip 40. Preferably, retaining a portion of the first connecting portion 22 prevents the first metal element 21 from detaching from the first base strip portion 23, facilitating a second injection molding of the entire material strip.

[0095] In one specific embodiment, as shown in FIG2 , some of the first connecting portions 22 of the first material strip 20 connect the first metal element 21 and the first base strip portion 23, while other first connecting portions 22 are located in the middle region of the first metal element 21 to connect different portions of the first metal element 21, thereby enhancing the structural strength of the first material strip 20 and preventing deformation of the first metal element 21. After the first injection molding, the first injection molding portion 30 is able to cover the inner circumference 211 of the first metal element 21, thereby ensuring the structural strength of the first material strip 20. At this time, the first connecting portions 22 located in the middle region of the first metal element 21 are cut away, as shown in FIG7 , to facilitate the subsequent second injection molding.

[0096] Furthermore, as shown in Figures 1 and 2, in one specific embodiment, the first metal element 21 further includes a conductive portion 215 located on the outer periphery 212. Before cutting, one end of the conductive portion 215 is integrally connected to other portions of the first metal element 21, and the other end of the conductive portion 215 is integrally connected to the first baseband portion 23. Cutting separates the conductive portion 215 from the first baseband portion 23, facilitating subsequent bending of the conductive portion 215. Furthermore, the conductive portion 215 is located at a vertex of the first metal element 21.

[0097] Furthermore, step a further includes step a2: after the first injection molding, at least a portion of the pin portions 213 of the first metal element 21 are bent along a predetermined position, so that at least a portion of the pin portions 213 are arranged vertically, suitable for electrical connection to the external circuit of the finished injection-molded part 10. Specifically, the inner circumference 211 of the first metal element 21 is arranged horizontally, and at least a portion of the pins of the first metal element 21 are bent so that at least a portion of the pin portions 213 are arranged vertically. This adjusts the arrangement direction of the branches of the first metal element 21, further ensuring that the arrangement of the first metal element 21 meets predetermined requirements, and facilitates electrical connection to the external circuit of the finished injection-molded part 10 after the finished injection-molded part 10 is formed.

[0098] It is worth mentioning that when the branch is bent after the first injection molding, since the pin portion 213 of the first metal element 21 is not covered by the first injection molding portion 30, it is easy to bend, and the inner peripheral portion 211 of the first metal element 21 is fixed by the first injection molding portion 30, which further avoids deformation, which is beneficial to improving the yield of the finished injection molded part 10.

[0099] It is understood that the number of pin portions 213 can be one, including multiple pins, or two or more, each including multiple pins. The bending directions of the two or more pin portions 213 can be toward the same side of the first metal element 21, or they can be toward opposite sides of the first metal element 21. When the second semi-finished product 12 is cut into unit semi-finished products 13, the connecting portions at the ends of the pin portions 213 are cut away, and the ends of the multiple pins are separated from each other, suitable for separate electrical connection.

[0100] In one specific embodiment, the finished injection molded part 10 is a motor base, as shown in Figures 1 and 2. The pin portion 213 includes a first pin portion 2131 and a second pin portion 2132 arranged on opposite sides. The conductive portion 215 is located at a corner of the first metal element 21 adjacent to the first pin portion 2131 and the second pin portion 2132. In step a2, the first pin portion 2131 is bent toward the bottom of the motor base to facilitate connection with the PCB circuit located below the motor base. The conductive portion 215 is bent toward the top of the motor base to facilitate connection with other electrical components located above the motor base. For example, the conductive portion 215 is electrically connected to the AF (Automatic Focus) coil of the motor drive unit via the upper spring plate to form an AF conductive structure. Furthermore, the conductive portion 215 is formed by multiple bends.

[0101] Furthermore, the method for manufacturing injection molded parts also includes step e: fixing the first material strip 20 by its first fixing portion 24 and the positioning device 70 of the mold in step a, so as to prevent the first material strip 20 from moving relative to the mold in step a during the first injection molding process, which is beneficial to improving the yield of the first injection molding. Fixing the second material strip 40 by its second fixing portion 44 and the positioning device 70 of the mold in step b, so as to prevent the second material strip 40 from moving relative to the mold in step b during the second injection molding process, which is beneficial to improving the yield of the second injection molding. In which, the first fixing portion 24 and the second fixing portion 44 are arranged adjacent to each other, and the positioning device 70 of steps a and b is the same, including adjacent first positioning portions 71 and second positioning portions 72, which respectively position the first fixing portion 24 and the second fixing portion 44.

[0102] It is understood that, as shown in FIG8 , in some embodiments, during the first injection molding process, the first strip 20 is fixed to the positioning device 70 of the mold in step a, thereby preventing the first strip 20 from moving relative to the mold in step a during the first injection molding process. During the second injection molding process, both the first strip 20 and the second strip 40 need to be fixed to the positioning device 70 of the mold in step b, thereby preventing the first strip 20 and the second strip 40 from moving relative to the mold in step b during the second injection molding process, which also helps prevent the first strip 20 from moving relative to the second strip 40. Preferably, when the second strip 40 is disposed on the first semi-finished product 11, the first fixing portion 24 of the first strip 20 and the second fixing portion 44 of the second strip 40 are disposed adjacent to each other. During the second injection molding process, the first fixing portion 24 and the second fixing portion 44 can be positioned by the same positioning device 70 of the mold in step b, thereby reducing the complexity of the mold in step b and further reducing the difficulty and cost of mold opening.

[0103] In a specific embodiment, as shown in Figures 7 to 9, when the second material strip 40 is arranged on the first semi-finished product 11, the first fixing portion 24 and the second fixing portion 44 are both located at the four corners of the first injection molding portion 30, and the positioning device 70 is provided with a plurality of protruding first positioning portions 71 and a plurality of protruding second positioning portions 72, wherein the first fixing portion 24 is suitable for being placed between the oppositely arranged first positioning portions 71, and the second fixing portion 44 is suitable for being placed between the oppositely arranged second positioning portions 72, so that the first material strip 20 and the second material strip 40 can be detachably fixedly connected to the mold in step b through the first positioning portion 71 and the second positioning portion 72.

[0104] Furthermore, the first fixing portion 24 and the second fixing portion 44 are located at or near the corners of each first metal element 21 and each second metal element 41, respectively. This allows for a certain amount of spacing between adjacent first fixing portions 24 and adjacent second fixing portions 44. Accordingly, the first positioning portion 71 and the second positioning portion 72 of the positioning device 70 are located at or near the corners, also allowing for a certain amount of spacing between adjacent first positioning portions 71 and adjacent second positioning portions 72. Therefore, the positioning and installation of the first and second material strips 20 and 40 cause less interference with the first and second metal elements 21 and 41, facilitating the design of the first and second metal elements 21 and 41, such as allowing them to occupy a larger space and design more complex circuit shapes. Auxiliary materials can also be placed in the remaining areas of the first and second material strips 20 and 40 to support the first and second metal elements 21 and 41 and provide structural reinforcement.

[0105] Furthermore, as shown in Figures 2 to 5, the method for manufacturing an injection molded part further includes step f1: providing a first mounting channel 31 in the first injection molded part 30, wherein the mounting portion 214 is located on the bottom surface of the first metal component 21 and is exposed through the first mounting channel 31. Furthermore, the method for manufacturing an injection molded part further includes step f2: providing a second mounting channel 51 in the second injection molded part 50, wherein the second mounting channel 51 is arranged opposite to the first mounting channel 31, so that the mounting portion 214 of the first metal component 21 is exposed to the outside and is suitable for connecting with the electronic component 60.

[0106] Specifically, in some embodiments, a mounting portion 214 is formed on the bottom surface of the first metal element 21. The first injection molded part 30 needs to avoid the mounting portion 214 when covering the first metal element 21. Therefore, a first mounting channel 31 is provided at the bottom of the first injection molded part 30. The first mounting channel 31 is implemented as a hole or notch extending through the first injection molded part 30. Similarly, the second injection molded part 50 needs to avoid both the mounting portion 214 and the first mounting channel 31. Therefore, a second mounting channel 51 is provided at the bottom of the second injection molded part 50. The second mounting channel 51 is implemented as a hole or notch extending through the second injection molded part 50. The electronic component 60 is placed within the first mounting channel 31, secured to and electrically connected to the mounting portion 214 of the first metal element 21. It will be appreciated that the first mounting channel 31 can be formed during the first injection molding process or added to the first injection molded part 30 later in the manufacturing process. Similarly, the second mounting channel 51 can be formed during the second injection molding process or added to the second injection molded part 50 later in the manufacturing process. In an optional embodiment, the orientations of the first mounting channel 31 and the second mounting channel 51 are the same as the bending direction of the pin portion 213 .

[0107] In one embodiment, the finished injection molded part 10 is a motor base, and a plurality of first mounting channels 31 are formed on the bottom surface of the first injection molded portion 30. The first mounting channels 31 are suitable for mounting electronic components 60. The electronic components 60 are mounted on the mounting portion 214 and fixed to the first metal element 21 via SMT.

[0108] The bottom surface of the first metal element 21 forms a mounting portion 214 extending in two intersecting directions. Furthermore, the mounting portion 214 is close to the edge of the first injection molded part 30. The two mounting portions 214 are located on two intersecting edges of the first injection molded part 30. There is a certain distance between the two mounting portions 214.

[0109] As shown in Figures 7 and 12, the electronic component 60 includes a position sensing element 61, which is suitable for conducting with the first metal element 21 to perform position sensing. The position sensing element 61 includes a Hall element 611 and an IC (integrated circuit) 612. In one embodiment, there are two Hall elements 611 and two ICs 612, which are fixedly connected to the two mounting portions 214 respectively. One Hall element 611 and one IC 612 are arranged on the same side, and another Hall element 611 and another IC 612 are arranged on the other side where the extension direction intersects.

[0110] The first mounting channel 31 includes a Hall element mounting channel 311 and an IC mounting channel 312. The Hall element mounting channel 311 is suitable for accommodating the Hall element 611, facilitating the installation of the Hall element 611 on the mounting portion 214 in step d. The IC mounting channel 312 is suitable for accommodating the IC 612, facilitating the installation of the IC 612 on the mounting portion 214 in step d. The Hall element mounting channel 311 and the IC mounting channel 312 can be the same, and are suitable for adjacently arranging the Hall element 611 and the IC 612 on the same side. The Hall element mounting channel 311 and the IC mounting channel 312 can be different, and can be implemented as being arranged on the same side of the first injection molding part 30.

[0111] Specifically, as shown in Figures 7 and 12, in conjunction with Figures 3 and 5, the first injection molded portion 30 is located at the bottom of the first semi-finished product 11. A second mounting portion 214b is formed at a corner of the bottom surface of the first metal element 21. A Hall effect mounting channel 311 is formed at the bottom of one of the corners of the first injection molded portion 30, exposing the second mounting portion 214b for mounting the Hall effect element 611. Two first mounting portions 214a extending in intersecting directions are formed on the bottom surface of the first metal element 21. Two IC mounting channels 312 extending in intersecting directions are formed at the bottom of the first injection molded portion 30, exposing the first mounting portion 214a for mounting the IC 612. Furthermore, the IC mounting channels 312 are located on two intersecting sides of the first injection molded portion 30, enabling detection of displacement in two different directions after mounting the Hall effect element 611 and IC 612, thereby enabling OIS (Optical Image Stabilization) control in two directions. Furthermore, the electronic components 60 can also be mounted in the IC mounting channels 312.

[0112] Step c specifically includes: cutting the first connecting portion 22 around the first metal element 21 after the second injection molding to separate the first metal element 21 from the other parts of the first material strip 20, and cutting the second connecting portion 42 around the second metal element 41 to separate the second metal element 41 from the other parts of the second material strip 40 to obtain a single unit semi-finished product 13, as shown in Figure 11.

[0113] Specifically, the cutting in step c is to cut the first connecting portion 22 of the first material strip 20 and the second connecting portion 42 of the second material strip 40, so that the first metal element 21 is separated from the first connecting portion 22 and the first base strip portion 23 of the first material strip 20, and the second metal element 41 is separated from the second connecting portion 42 and the second base strip portion 43 of the second material strip 40, and further obtain independent unit semi-finished products 13, each unit semi-finished product 13 includes a first metal element 21, a first injection molding part 30, a second metal element 41 and a second injection molding part 50.

[0114] From the above content, it can be seen that compared with performing SMT on the entire material strip, in this embodiment, the material strip is cut to form separate unit semi-finished products 13, and SMT can be performed after the unit semi-finished products 13 are placed on a plate, which is beneficial to improving the efficiency of SMT and improving the yield in the reflow soldering process.

[0115] Furthermore, the method for manufacturing an injection molded part further includes step g: feeding the raw material strip into a molding device and performing PIN molding on the raw material strip to obtain a first strip 20 or a second strip 40. It is worth noting that after PIN molding, the first strip 20 and the second strip 40 are further subjected to a PIN inspection. First strips 20 and second strips 40 that do not meet the use requirements are processed to control the quality of the first strip 20 and second strip 40 before injection molding, thereby improving the yield of the final injection molded part 10 after injection molding.

[0116] Furthermore, after step a is completed, the first semi-finished product 11 is inspected, and the first semi-finished product 11 that does not meet the use requirements is processed; after step b is completed, the second semi-finished product 12 is inspected, and the second semi-finished product 12 that does not meet the use requirements is processed; after step c is completed, the unit semi-finished product 13 is inspected, and the unit semi-finished product 13 that does not meet the use requirements is processed; in order to control the quality of the semi-finished products corresponding to each step and improve the yield of the final finished injection molded part 10 after injection molding, it is understandable that the finished injection molded part 10 also needs to be inspected after step d is completed.

[0117] Furthermore, before performing step a, the first material strip 20 is inspected; before performing step b, the first semi-finished product 11 and the second material strip 40 are inspected; before performing step c, the second semi-finished product 12 is inspected; before step d, the unit semi-finished product 13 is inspected, so that the quality of the materials and semi-finished products used in each step can be controlled in advance, which is conducive to reducing losses.

[0118] An injection molded part includes an injection molding portion, a metal element, and an electronic component 60. At least a portion of the metal element is encapsulated in the injection molding portion, and the electronic component 60 is electrically connected to the metal element. The injection molded part is manufactured by any of the aforementioned injection molding manufacturing methods, i.e., a second injection molding is performed before SMT, thereby reducing the loss of semi-finished products that have completed SMT, which is beneficial to reducing the production cost of the injection molded part.

[0119] Furthermore, the injection molded parts are various components such as a motor base, a lens base, a motor carrier, or a lens carrier, etc. It is understandable that, according to the design requirements of the camera module, the injection molded parts of the camera module that require built-in metal components can all be manufactured using this solution.

[0120] This application provides a camera module base assembly that integrates the functions of the camera module's photosensitive chip base and motor base, reducing components, improving integration, and lowering the height of the camera module. Furthermore, the coil of the camera module motor is integrated within the camera module base assembly of this application, becoming part of the camera module base assembly, further reducing the number of components, saving internal space, and lowering the height of the camera module.

[0121] Specifically, referring to the schematic diagrams of Figures 13A and 13B of the specification, the camera module base assembly of the present application includes a power supply portion 10B, a support portion 20B and a drive portion 30B. The support portion 20B is formed on the surface of the power supply portion 10B.

[0122] The driving unit 30B is mounted on the supporting unit 20B. Furthermore, the bottom of the driving unit 30B is in contact with the supporting unit 20B. The driving unit 30B is electrically connected to the power supply unit 10B, and the power supply unit 10B supplies power to the driving unit 30B.

[0123] The support portion 20B forms a support structure for the driving portion 30B, and is equivalent to a base of the driving portion 30B.

[0124] The camera module further includes a photosensitive portion 40B, which is electrically connected to the power supply portion 10B and is powered by the power supply portion 10B. The camera module further includes a lens portion 50B, which is disposed in the light sensing path of the photosensitive portion 40B.

[0125] Among them, according to actual needs, the driving unit 30B can be configured to drive the lens unit 50B to move along the optical axis to adjust the focus of the camera module, realize AF function or optical zoom, etc.; the driving unit 30B can be configured to drive the lens unit 50B to translate, rotate, tilt and shake in a direction perpendicular to the optical axis to compensate for the shake and realize the OIS function; the driving unit 30B can be configured to drive the photosensitive chip 41B of the photosensitive unit 40B to move in a direction perpendicular to the optical axis to compensate for the shake and realize the OIS function; the driving unit 30B can also be configured to drive the photosensitive unit 40B to move along the optical axis to realize focus adjustment.

[0126] The support portion 20B defines a light hole 200B, within which the photosensitive portion 40B is disposed. The photosensitive area of ​​the photosensitive portion 40B is exposed through the light hole 200B. The camera module also includes a filter portion 60B, which is mounted on the support portion 20B to support and maintain the light path of the photosensitive portion 40B. Therefore, the support portion 20B functions as a base for the photosensitive portion 40B.

[0127] In one embodiment, the bottom of the photosensitive portion 40B is mounted on the surface of the power supply portion 10B. In one embodiment, the power supply portion 10B has a mounting hole, and the photosensitive chip 41B of the photosensitive portion 40B is mounted in the mounting hole so as to be located below the light hole 200B and closer to the bottom of the camera module, thereby reducing the thickness of the support portion 20B.

[0128] For ease of description and understanding, the "below" mentioned in this application is defined as the side opposite to the light incident direction of the camera module.

[0129] The camera module's driver 30B includes a coil 31B, which is built into the support 20B. This allows the coil 31B to be integrated into the support 20B, becoming part of the camera module's base assembly. This further reduces the distance between the top surface of the support 20B and the bottom of the driver 30B, thereby lowering the camera module's shoulder height.

[0130] Specifically, the structure of the camera module base assembly of the present application is first explained.

[0131] Referring to FIG13C , power supply unit 10B includes circuit board 11B, which has a first surface 111B. First surface 111B faces in the opposite direction from the bottom of circuit board 11B. Electronic components 14B are provided on first surface 111B of circuit board 11B, which communicate with components of the camera module to implement corresponding functions. Electronic components 14B are directly connected to circuit board 11B.

[0132] The electronic component 14B is mounted on the first surface 111B of the circuit board 11B by using an SMT (Surface Mount Technology) process.

[0133] The circuit board 11B may be, for example but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), etc.

[0134] The support portion 20B includes a first support portion 21B and a second support portion 22B. The first support portion 21B and the second support portion 22B are formed in two steps. The coil 31B of the driving portion 30B is wrapped inside the support portion 20B to be built into the support portion 20B.

[0135] The first support portion 21B is formed on the first surface 111B of the circuit board 11B to partially cover the electronic component 14B. The coil 31B of the driving unit 30B is mounted on the first support portion 21B.

[0136] The second support portion 22B is formed on the first support portion 21B and the first surface 111B to cover the first support portion 21B and a portion of the first surface 111B. The second support portion 22B covers the coil 31B, so that the coil 31B is built into the support portion 20B and becomes part of the camera module base assembly. Therefore, the camera module base assembly of the present application has the function of anti-shake conduction, and there is no need to set up an anti-shake conduction component, such as a coil substrate, which saves space and reduces costs.

[0137] Preferably, the first support portion 21B is integrally formed on the circuit board 11B through a molding process. Due to the characteristics of the molding process, the first support portion 21B has high flatness and strength. The second support portion 22B is integrally formed on the circuit board 11B through a molding process, providing a bearing surface with high flatness. The support portion 22B thus formed provides a highly flat bearing platform, reducing the difficulty of subsequent component installation and improving installation accuracy. The molding process can include injection molding, transfer molding, press molding, or compression molding.

[0138] Furthermore, when the circuit board 11B is molded to form the support portion 20B through a molding process, the support portion 20B can be molded by combining an insert molding process and a transfer molding process, and a conductive component can be embedded inside the support portion 20B to conduct electricity between the circuit board 11B and the driving portion 30B.

[0139] The driving portion 30B further includes a focus conductive member 32B. The focus conductive member 32B is mounted on the first support portion 21B and is covered by the second support portion 22B, with an exposed end portion for conducting connection with the driving portion 30B.

[0140] The focusing conductive member 32B is embedded in the support portion 20B through an insert molding process, and is used to conduct electricity between the circuit board 11B and the focusing assembly 302B of the driving portion 30B.

[0141] After forming the first support portion 21B and the second support portion 22B on the circuit board 11B, the support portion 20B is formed as a single unit. The support portion 20B is fixedly connected to the power supply portion 10B to form the camera module base assembly. The aforementioned drive portion 30B, photosensitive portion 40B, lens portion 50B, etc. are mounted on the camera module base assembly to complete the camera module.

[0142] The support portion 20B is molded on the circuit board 11B to form a base, which is equivalent to the base structure of the photosensitive component of a traditional camera module; the support portion 20B also forms a support structure for the driving portion 30B, which is equivalent to the base of the motor in a traditional camera module. Therefore, the functions of the molded base and the motor base can be integrated into one component, and there is no need to install the motor base separately, thereby avoiding the tilt error caused by assembly and reducing the cumulative tolerance of the camera module assembly.

[0143] In addition, the support portion 20B covers most or all of the electronic components 14B of the circuit board 11B, so that the molded base, motor base, and electronic components 14B are spatially overlapped, and there is no need to reserve a safety distance around the electronic components 14B, thereby reducing the height of the camera module.

[0144] The first support portion 21B has a first light-through hole 210B, and the second support portion 22B has a second light-through hole 220B. The first light-through hole 210B and the second light-through hole 220B communicate with each other to form a light-through hole 200B of the support portion 20B.

[0145] Furthermore, circuit board 11B is generally square, and may be rectangular or square, with four edges. Accordingly, the outer contours of first support portion 21B and second support portion 22B are generally square, and may be rectangular or square, with four edges. The shapes of first light aperture 210B and second light aperture 220B may be rectangular, square, circular, elliptical, or other shapes.

[0146] In addition, the power supply unit 10B further includes a connection strip 12B adapted to connect the circuit board 11B and an external circuit, such as a circuit of an electronic device, to obtain external power for the circuit board 11B.

[0147] In some examples of the present application, a magnetic element 13B is provided on the first surface 111B of the circuit board 11B. The magnetic element 13B is adapted to generate a magnetic attraction force on the aforementioned driving unit 30B to assist in resetting the driving unit 30B. Preferably, the magnetic element 13B is provided at a corner of the first surface 111B.

[0148] Furthermore, in some examples, the magnetic elements 13B are disposed at the four corners of the first surface 111B.

[0149] In some examples of the present application, the electronic components 14B include components for closed-loop control of the drive unit 30B, which are used to detect displacement and control the current of the coil 31B. Specifically, the first surface 111B is provided with a position sensor 141B, which is conductively connected to the circuit board 11B and is used to detect the displacement of the drive unit 30B to form a closed-loop connection. The first surface 111B is also provided with a controller 142B, which is conductively connected to the position sensor 141B and the circuit board 11B to form a closed-loop control. Furthermore, the position sensor 141B and / or the controller 142B are arranged at a corner of the circuit board 11B or near a corner to avoid the middle area of ​​the circuit board 11B.

[0150] The position sensor 141B and / or the controller 142B form a closed-loop control component for controlling the displacement driven by the driving portion 30B to achieve shake compensation.

[0151] In one embodiment, the position sensor 141B and / or the controller 142B are disposed inside the magnetic element 13B.

[0152] The controller 142B is conductively connected to the coil 31B, and controls the magnitude and direction of the driving force generated by the driving unit 30B by controlling the magnitude and direction of the current flowing into the coil 31B, thereby compensating for the jitter displacement and realizing the optical image stabilization function.

[0153] The position sensor 141B can be implemented as a Hall sensor, adapted to the position of the sensing magnet, for detecting the shaking displacement. The driving magnet 33B of the driving unit 30B can be implemented as a shared sensor. In other examples, a sensing magnet can also be provided separately in the driving unit 30B.

[0154] The position sensor 141B may also be implemented as a gyroscope sensor. The gyroscope sensor can detect the shaking of the camera module. The gyroscope sensor can detect the angular velocity or linear velocity generated by the shaking of the camera module.

[0155] The position sensor 141B can be electrically connected to the controller 142B. The vibration of the camera module detected by the position sensor 141B can be used by the controller 142B to control the current flowing into the coil 31B, prompting the driving unit 30B to move, so as to achieve the optical image stabilization function.

[0156] In addition, the electronic components 14B may also include electronic elements and devices such as capacitors, resistors, inductors, diodes, transistors, potentiometers, and relays. The electronic components 14B, or most of the electronic components 14B, may be covered by the support portion 20B to form a flat surface on the surface of the support portion 20B for mounting the driver 30B, thereby reducing assembly difficulty and assembly tolerances and forming a protective structure for the electronic components 14B.

[0157] Support portion 20B covers most of the area of ​​circuit board 11B, which can reduce deformation of circuit board 11B and reduce warping of circuit board 11B.

[0158] 14 , before forming the aforementioned support portion 20B, components such as the magnetic element 13B, the position sensor 141B and / or the controller 142B and the electronic component 14B are mounted on the first surface 111B.

[0159] The first surface 111B of the circuit board 11B is further provided with a coil conductive area 112B. The aforementioned coil 31B is adapted to be conductively connected to the circuit board 11B via the coil conductive area 112B.

[0160] The coil conductive area 112B is disposed near a corner of the first surface 111B to avoid the middle area of ​​the circuit board 11B.

[0161] In one embodiment, the coil conductive area 112B is located inside the magnetic element 13B.

[0162] Furthermore, in the area where the position sensor 141B and the controller 142B are provided, the coil conductive area 112B and the position sensor 141B and the controller 142B are provided to avoid each other.

[0163] 13C and 15 , a first support portion 21B is formed on the first surface 111B of the circuit board 11B. The first support portion 21B covers at least a portion of the electronic components 14B and at least a portion of the magnetic element 13B disposed on the first surface 111B.

[0164] Furthermore, the first support portion 21B covers the position sensor 141B and the controller 142B, and the coil conductive area 112B is exposed.

[0165] The inner edge of the first support portion 21B defines a first light hole 210B. The optical axis of the camera module passes through the first light hole 210B. The outer edge of the first support portion 21B is close to or flush with the outer edge of the circuit board 11B.

[0166] For ease of description, the optical axis of the camera module is defined as the Z axis, and the two axes perpendicular to the Z axis are the X axis and the Y axis, which are perpendicular to each other. The camera module base assembly extends in the XY plane perpendicular to the Z axis and has a height extending along the Z axis.

[0167] 15 and 16A , the first support portion 21B includes a coil mounting portion 211B, the bottom of the coil mounting portion 211B is fixed to the circuit board 11B, covering a portion of the first surface 111B of the circuit board 11B, the coil 31B is mounted on the coil mounting portion 211B, and the coil mounting portion 211B separates the coil 31B and the circuit board 11B.

[0168] The first support portion 21B includes a plurality of coil mounting portions 211B, which are adapted to the number of the coils 31B. The coil mounting portions 211B are arranged around the optical axis.

[0169] In one embodiment of the present application, the number of coil mounting portions 211B is implemented as four. Furthermore, the multiple coil mounting portions 211B are divided into two coil mounting portions 211B extending along the X-axis and two coil mounting portions 211B extending along the Y-axis. Each coil mounting portion 211B is adjacent to the edges of the circuit board 11B, and its extension direction is parallel to the extension direction of the corresponding edge.

[0170] In one embodiment of the coil mounting portion 211B, a top surface 2111B of the coil mounting portion 211B is provided with a positioning protrusion 2112B. The positioning protrusion 2112B protrudes out from the top surface 2111B to position and mount the coil 31B.

[0171] Each coil mounting portion 211B is provided with two positioning protrusions 2112B. The two positioning protrusions 2112B are formed to protrude from the top surface 2111B in an opposite direction along the extension direction of the coil mounting portion 211B, and are respectively close to both ends of the extension direction of the coil mounting portion 211B.

[0172] In one embodiment of the coil mounting portion 211B, the coil mounting portion 211B is provided with an accommodating groove to accommodate the coil 31B.

[0173] In addition, in one example of the present application, the coil mounting portion 211B covers a portion of the magnetic element 13B. As shown in FIG16A , the magnetic element 13B includes a first magnetic portion 131BB and a second magnetic portion 132B. The extension direction of the first magnetic portion 131BB and the extension direction of the second magnetic portion 132B intersect. Further, the first magnetic portion 131BB extends along the X-axis, and the second magnetic portion 132B extends along the Y-axis. Magnetic elements 13B are provided at the four corners of the first surface 111B of the circuit board 11B, so that the two ends of each coil mounting portion 211B are adjacent to or overlap with a portion of the magnetic element 13B. Furthermore, the two ends of the coil mounting portion 211B extending along the X-axis at least cover a portion of the magnetic element 13B, and the two ends of the coil mounting portion 211B extending along the Y-axis at least cover a portion of the magnetic element 13B.

[0174] Such an arrangement enables both ends of the magnet of the driving portion 30B to be affected by the magnetic attraction force, resulting in reset in two opposite directions along the X axis or along the Y axis.

[0175] In one embodiment of the present application, three coil mounting portions 211B are provided, arranged around the optical axis on first surface 111B near three edges of circuit board 11B. Three coils 31B are provided, and correspondingly, magnetic elements 13B are provided at three corners of first surface 111B.

[0176] The magnetic element 13B is located below the coil 31B. The first magnetic portion 131BB overlaps with the projection of the coil 31B extending along the X-axis along the optical axis, while the second magnetic portion 132B overlaps with the projection of the coil 31B extending along the Y-axis along the optical axis.

[0177] In addition, in one example of the present application, the number of position sensors 141B can be implemented as two or more, wherein at least one position sensor 141B is arranged along the X-axis for detecting jitter displacement along the X-axis, and at least one position sensor 141B is arranged along the Y-axis for detecting jitter displacement along the Y-axis. The number of controllers 142B can be implemented as two or more, each connected to one position sensor 141B.

[0178] Taking the case where there are two position sensors 141B and controllers 142B as an example, each position sensor 141B and each controller 142B are adjacently arranged on the inner side of two magnetic elements 13B to be close to the magnets of the coil 31B and the driving unit 30B installed subsequently.

[0179] Referring to the schematic diagram of Figure 16B, the coil 31B is disposed on the coil mounting portion 211B. The coil 31B has a mounting hole 310B, which is defined by the inner peripheral wall 3101B of the coil 31B. The coil 31B is positioned and mounted on the coil mounting portion 211B via the positioning protrusion 2112B, with the bottom of the coil 31B resting against the top surface 2111B of the coil mounting portion 211B, and the positioning protrusion 2112B abutting against the inner peripheral wall 3101B. The extension direction of the coil 31B is parallel to the extension direction of the coil mounting portion 211B, and the projection of the body of the coil 31B along the direction parallel to the optical axis falls into the projection of the coil mounting portion 211B along the optical axis.

[0180] The coil 31B has a lead end 311B, which is fixed to the coil conductive area 112B so as to be conductively connected to the circuit board 11B. The lead end 311B is exposed outside the coil mounting portion 211B.

[0181] The lead end 311B is divided into a first lead end 3111B and a second lead end 3112B. Each coil 31B leads out a first lead end 3111B and a second lead end 3112B. The first lead end 3111B and the second lead end 3112B are respectively fixedly connected to a coil conducting area 112B.

[0182] Furthermore, winding begins with the first lead end 3111B as the starting end and ends with the second lead end 3112B as the ending end, with the first lead end 3111B and the second lead end 3112B exposed outside the body of the coil 31B. Alternatively, the coil 31B may be mounted on the coil mounting portion 211B after winding is completed in advance. Alternatively, the coil 31B may be wound around the two positioning protrusions 2112B on the coil mounting portion 211B to form the coil 31B.

[0183] In one embodiment of the present application, in combination with the schematic diagrams of Figures 16B and 14, the first lead end 3111B and the second lead end 3112B are respectively exposed on opposite sides of the coil 31B in the extension direction, and the two coil conduction areas 112B are respectively arranged adjacent to the opposite sides of the coil 31B in the extension direction to fix the first lead end 3111B and one coil conduction area 112B nearby, and to fix the second lead end 3112B and one coil conduction area 112B nearby.

[0184] Two adjacent coils 31B form two adjacent lead ends 311B. Correspondingly, two adjacent coil conducting areas 112B are formed on the first surface 111B near its corners.

[0185] 14 , 15 and 16C , the first support portion 21B further includes a covering portion 212B, which covers at least a portion of the electronic components 14B on the first surface 111B, thereby protecting the electronic components 14B and improving the flatness of the circuit board 11B.

[0186] Furthermore, the covering portion 212B covers the position sensor 141B and the controller 142B to form a flat top surface, thereby improving the flatness.

[0187] Position sensors 141B and controllers 142B are located inside two magnetic elements 13B. When molding the first support portion 21B, two covering portions 212B are formed at corresponding locations, positioned inside the two magnetic elements 13B. The covering portions 212B are located between and connect two adjacent coil mounting portions 211B.

[0188] The coil conductive area 112B and the covering portion 212B avoid each other, so that after the first support portion 21B is formed, the coil conductive area 112B is still exposed on the first surface 111B for conductive connection with the coil 31B.

[0189] Further, referring to the schematic diagram of FIG16A , in combination with FIG14 , one group of position sensors 141B and controller 142B are located on the inner side of the coil 31B extending along the X-axis to detect the displacement of the drive unit 30B along the X-axis, and one group of position sensors 141B and controller 142B are located on the inner side of the coil 31B extending along the Y-axis to detect the displacement of the drive unit 30B along the Y-axis. The two adjacent coil conduction areas 112B are distributed on both sides of the position sensor 141B and the controller 142B to be close to the two adjacent coils 31B respectively. This makes it so that one of the coil conduction areas 112B is located between the magnetic element 13B and the controller 142B. When forming the first support portion 21B, the covering portion 212B and the coil mounting portion 211B need to avoid the coil conduction area 112B.

[0190] A molded clearance space 2110B is formed within the coil conductive area 112B. The coil mounting portion 211B, the covering portion 212B, and the magnetic element 13B surround the coil conductive area 112B. A portion of the magnetic element 13B is exposed within the molded clearance space 2110B. Furthermore, the junction between the first magnetic portion 131BB and the second magnetic portion 132B of the magnetic element 13B is exposed within the molded clearance space 2110B.

[0191] In an embodiment in which the two position sensors 141B are disposed on the inner sides of two adjacent magnetic elements 13B, the first support portion 21B forms two adjacently disposed molded avoidance spaces 2110B; in an embodiment in which the two position sensors 141B are disposed on the inner sides of two diagonally disposed magnetic elements 13B, the first support portion 21B forms two diagonally disposed molded avoidance spaces 2110B.

[0192] The embodiment of the area in which another set of position sensors 141B and controllers 142B are provided is the same as the aforementioned embodiment.

[0193] 16C and 16D , the first support portion 21B further includes a first positioning post 213B, which is formed to extend along the Z axis. That is, the extending direction of the first positioning post 213B is parallel to the optical axis.

[0194] The first positioning post 213B is formed at a corner of the circuit board 11B and is located between two adjacent coil mounting portions 211B.

[0195] The first support portion 21B further includes a spacer 214B located between two adjacent coil mounting portions 211B, connecting the two adjacent coil mounting portions 211B. Furthermore, the spacer 214B covers the magnetic element 13B, and a first positioning post 213B protrudes from the top of the spacer 214B and is located at a top corner of the first support portion 21B.

[0196] In one embodiment of the present application, the number of first positioning posts 213B is two. Optionally, the two first positioning posts 213B are disposed at two opposite corners of the first support portion 21B along a diagonal line of the first support portion 21B; alternatively, the two first positioning posts 213B are disposed at two adjacent corners of the first support portion 21B along the same side of the first support portion 21B.

[0197] The driving unit 30B also includes a focusing conductive member 32B, which is suitable for conducting the circuit board 11B and the focusing assembly 302B of the aforementioned driving unit 30B. The focusing conductive member 32B is arranged on the first support portion 21B, and the second support portion 22B covers the focusing conductive member 32B, so that the focusing conductive member 32B is built into the support portion 20B and becomes a part of the camera module base assembly. Therefore, the camera module base assembly of the present application has a focusing conduction function, and there is no need to set up a focusing conduction component separately. It can be connected through the built-in focusing conductive component and the focusing assembly 302B of the driving unit 30B to realize the focusing function of the driving unit 30B, saving space and reducing costs.

[0198] As shown in FIG16D , the focusing conductive member 32B has a first conductive end 321B and a second conductive end 322B. The first conductive end 321B is suitable for connecting to the focusing assembly 302B of the driving unit 30B, and the second conductive end 322B is suitable for conducting connection to the circuit board 11B.

[0199] In one embodiment of the present application, there are two focusing conductive members 32B. The first support portion 21B includes two first positioning posts 213B, and the two focusing conductive members 32B are respectively positioned on the two first positioning posts 213B. Optionally, the two first positioning posts 213B are positioned opposite each other along diagonal corners of the first support portion 21B; alternatively, the two first positioning posts 213B are positioned along the same side of the first support portion 21B, at two corners of the same side.

[0200] The focusing conductive member 32B includes a first part 323B and a second part 324B. The first part 323B extends in a direction parallel to or approximately parallel to the optical axis and abuts against the inner surface 2131B of the first positioning column 213B. The second part 324B extends in a direction perpendicular to or approximately perpendicular to the optical axis and abuts against the top of the spacer 214B.

[0201] More preferably, the focusing conductive member 32B is made of an integral metal material, has conductive properties, has lower material cost, and is simpler to manufacture.

[0202] Among them, the focusing conductive part 32B can be installed on the first support part 21B after being formed, or the metal material can be set on the first support part 21B, and the metal material can be formed and cut on the first support part 21B to form the focusing conductive part 32B located on the first positioning column 213B.

[0203] The first conductive end 321B extends from the first portion 323B, exposed at the first top portion 2132B of the first positioning post 213B, and is suitable for conductive connection with the focus assembly 302B of the driver 30B. The second conductive end 322B extends from the second portion 324B and extends to the first surface 111B of the circuit board 11B, thereby being fixedly and conductively connected to the circuit board 11B. Thus, the focus assembly 302B of the driver 30B of the camera module and the circuit board 11B are connected via the focus conductive member 32B, forming a focus conductive path.

[0204] The spacer 214B is located between the focusing conductive member 32B and the circuit board 11B to separate the focusing conductive member 32B and the circuit board 11B, and further separates the second portion 324B of the focusing conductive member 32B and the magnetic element 13B to avoid mutual interference.

[0205] The spacer portion 214B has a certain height. The second conductive end 322B bends downward from the second portion 324B and extends to the first surface 111B, and is pressed and fixed to the first surface 111B.

[0206] The two coil conducting areas 112B disposed at the corners of the circuit board 11B where the first positioning pillars 213B are located are located inside the spacing portion 214B and have a certain distance between them to avoid each other.

[0207] The spacer 214B and the covering portion 212B are disposed at different corners or near corners of the first surface 111B, avoiding each other. Therefore, the focus conductive member 32B and electronic components 14B, such as the position sensor 141B and the controller 142B, are disposed at different corners or near corners to avoid mutual interference and save height space.

[0208] Furthermore, the first positioning post 213B includes a first positioning portion 2133B and a second positioning portion 2134B, and the extension directions of the first positioning portion 2133B and the second positioning portion 2134B intersect. Taking the example of the first positioning portion 2133B extending along the X-axis and the second positioning portion 2134B extending along the Y-axis, the inner surface 2131B of the first positioning post 213B is formed inside the first positioning portion 2133B and the second positioning portion 2134B, and is divided into a first inner surface 21311B and a second inner surface 21312B. The first inner surface 21311B and the second inner surface 21312B are angled together, forming two-directional limits for the focusing conductive member 32B abutting against the first positioning post 213B, thereby accurately positioning the installation position of the focusing conductive member 32B and improving installation accuracy.

[0209] One side of the focusing conductive member 32B abuts against the first inner surface 21311B extending along the X-axis, and the other side of the focusing conductive member 32B abuts against the second inner surface 21312B extending along the Y-axis, so as to be limitedly mounted on the first positioning column 213B.

[0210] A first positioning column 213B formed at another corner of the circuit board 11B or a first positioning column 213B in an alternative embodiment includes a first positioning portion 2133B extending along the Y-axis and a second positioning portion 2134B extending along the X-axis. The focusing conductive member 32B placed on this first positioning column 213B abuts against the first inner surface 21311B extending along the Y-axis, and the other side of the focusing conductive member 32B abuts against the second inner surface 21312B extending along the X-axis to be mounted on the first positioning column 213B in a limited manner.

[0211] Referring to FIG16A , the first support portion 21B further includes a stepped portion 215B that extends outwardly from the outer circumferential surface of the coil mounting portion 211B. Furthermore, the stepped portion 215B extends to the outer circumferential surface of the covering portion 212B. In other words, the stepped portion 215B extends outward from the outer circumferential surfaces of the coil mounting portion 211B and the covering portion 212B.

[0212] Furthermore, the top of the step portion 215B is lower than the tops of the coil mounting portion 211B and the covering portion 212B.

[0213] Furthermore, referring to FIG16C , the covering portion 212B and the spacer portion 214B respectively connect two adjacent coil mounting portions 211B, so that the various parts of the first support portion 21B are interconnected to form a single unit. The first support portions 21B are sequentially formed on the circuit board 11B through an integral molding process, and the formed first support portion 21B is a single unit.

[0214] Referring to the schematic diagram of Figure 17, a second support part 22B is formed on the circuit board 11B, and the second support part 22B covers the first support part 21B to form an integral support part 20B, covering the aforementioned coil 31B and focusing conductive part 32B, so that the coil 31B and focusing conductive part 32B are placed between the first support part 21B and the second support part 22B.

[0215] Specifically, the second support portion 22B includes a bottom plate 221B extending in a plane perpendicular to the optical axis and a second positioning post 222B protruding from a corner of the bottom plate 221B in a direction parallel to the optical axis. The bottom plate 221B has a second light hole 220B.

[0216] The bottom plate 221B covers the coil mounting portion 211B, the covering portion 212B, the first positioning post 213B, and the spacer 214B, forming a flat top surface 2211B. The stepped portion 215B is exposed on the outside of the bottom plate 221B. The top surface 2211B provides a flat support surface for the camera module's driver unit 30B, reducing assembly tolerances.

[0217] Bottom plate 221B covers coil mounting portion 211B, allowing coil 31B mounted thereto to be positioned within support portion 20B, saving space above support portion 20B. Bottom plate 221B covers coil conductive area 112B and lead ends 311B of coil 31B. Therefore, bottom plate 221B extends further toward the optical axis relative to coil mounting portion 211B to cover the remaining portion of first surface 111B of circuit board 11B, further improving the flatness of circuit board 11B.

[0218] In the area where the first positioning post 213B is located, the second positioning post 222B wraps around the first positioning post 213B to form the positioning post 23B. This also covers the focusing conductive member 32B, leaving only the first conductive end 321B exposed. In the area where the first positioning post 213B is not located, the second positioning post 222B directly forms the positioning post 23B. Positioning post 23B is located at the top corner of the support portion 20B and is suitable for positioning the driver 30B in the support portion 20B.

[0219] More specifically, four second positioning columns 222B are formed at the four corners of the bottom plate 221B, two of which cover the two first positioning columns 213B to form two positioning columns 23B, and the other two second positioning columns 222B directly form two positioning columns 23B.

[0220] Mounting space 2000B is defined above base plate 221B and between positioning posts 23B at the four corners, suitable for mounting driver 30B. Top surface 2211B forms the top surface of support portion 20B and defines the bottom of mounting space 2000B. Base plate 221B defines the height of the bottom of driver 30B, while positioning posts 23B define the positions of the four corners of driver 30B.

[0221] The coil 31B is disposed between the bottom plate 221B and the coil mounting portion 211B, and is located below the top surface 2211B of the bottom plate 221B. When viewed from a direction perpendicular to the optical axis, the coil 31B is located below the positioning posts 23B on both sides.

[0222] The bottom of the second positioning column 222B is filled with the aforementioned molded avoidance space 2110B, covering the magnetic element 13B exposed in the molded avoidance space 2110B, as well as the coil conductive area 112B and the lead end 311B arranged inside the magnetic element 13B.

[0223] Positioning post 23B has an outer peripheral surface 232B that faces in a direction opposite to the optical axis and forms the outer periphery of positioning post 23B. Circuit board 11B has a first outer peripheral surface 113B, and outer peripheral surface 232B is flush with first outer peripheral surface 113B.

[0224] The second support portion 22B further includes a guide portion 223B, which is disposed adjacent to the positioning post 23B. The guide portion 223B is formed on the other side of the positioning post 23B. Furthermore, the bottom of the positioning post 23B and the guide portion 223B is filled with the aforementioned molded avoidance space 2110B.

[0225] The guide portion 223B has a guide groove 2230B suitable for accommodating the ball 35B of the driving portion 30B of the camera module. The guide groove 2230B has a length perpendicular to the optical axis, suitable for the ball 35B to move along the length direction, guiding the driving portion 30B to move along the length direction.

[0226] In one example of the present application, the guide portion 223B has a guide groove 2230B extending along the X axis and a guide groove 2230B extending along the Y axis, respectively providing movement for the ball 35B to guide the driving portion 30B to move along the X axis and the Y axis.

[0227] Optionally, the guide portion 223B has two guide grooves 2230B extending along the X-axis and two guide grooves 2230B extending along the Y-axis, which are respectively arranged along the diagonal corners of the support portion 20B, so that adjacent guide grooves 2230B extend in different directions.

[0228] Furthermore, the positioning posts 23B and the guiding portions 223B are arranged rotationally symmetrically around the optical axis, so that the diagonal guiding portions 223B have guiding grooves 2230B extending in the same direction.

[0229] Furthermore, circuit board 11B includes an outer edge portion 114B that extends outward from the outer periphery of circuit board 11B. The projections of outer edge portion 114B and step portion 215B along the optical axis completely overlap. Step portion 215B is formed on outer edge portion 114B. Step portion 215B and outer edge portion 114B are exposed outside of second support portion 22B, forming a step structure for the camera module, upon which the camera module housing 80B rests.

[0230] In one embodiment, the top surface of the step portion 215B is exposed outside the second support portion 22B for support by the housing 80B of the camera module; in one embodiment, the top surface of the step portion 215B is covered by the second support portion 22B, and the second support portion 22B includes a second step portion that is compatible with the step portion 215B, so as to form a step structure of the camera module together with the step structure 215B and the outer edge portion 114B.

[0231] In another embodiment, the step portion 215B is directly formed on the outer periphery of the circuit board 11B; in another embodiment, a step structure is formed when the second support portion 22B is formed, and the step structure extends from the support portion 20B to the outer edge portion 114B of the circuit board 11B; in another embodiment, a step structure is formed when the second support portion 22B is formed, and the step structure extends from the support portion 20B to the outer periphery of the circuit board 11B.

[0232] In a more specific embodiment, a stepped structure is formed on three of the four edges of support portion 20B, while a stepped structure is not required at the location where circuit board 11B connects to the aforementioned connecting strip 12B. Specifically, circuit board 11B includes connecting portion 115B, which is suitable for connecting to the aforementioned connecting strip 12B. Three of the four edges of circuit board 11B form outer edge portions 114B, while the other edge forms connecting portion 115B. When forming support portion 20B, connecting portion 115B is exposed on the outside of support portion 20B, eliminating the need for a stepped structure.

[0233] More specifically, when forming the first support portion 21B, the step portions 215B are formed on the outer edge portions 114B at three edges, avoiding the connection portion 115B. Therefore, the step portions 215B are only formed on the three edges of the circuit board 11B.

[0234] In addition, a mounting post 231B is provided on the top of the positioning post 23B. The mounting post 231B is formed to protrude from the top surface 2211B and extend in a direction parallel or substantially parallel to the optical axis, and is suitable for positioning and mounting the aforementioned driving unit 30B.

[0235] Optionally, a top surface 2211B of the bottom plate 221B is provided with a boss 224B, which can serve as an anti-collision structure for the support portion 20B.

[0236] Next, an exemplary implementation of the camera module is described in detail.

[0237] First, referring to the schematic diagrams of Figures 18A and 18B, the driving part 30B of the camera module includes the aforementioned coil 31B and the focusing conductive part 32B which become part of the base assembly of the camera module, and also includes a driving magnet 33B, an anti-shake carrier 34B, a ball 35B, an elastic part 36B, a focusing carrier 37B and a focusing coil 38B, wherein the coil 31B, the driving magnet 33B, the anti-shake carrier 34B, the ball 35B and the elastic part 36B form an anti-shake component 301B for realizing the anti-shake function of the driving part 30B; the focusing conductive part 32B, the elastic part 36B, the focusing carrier 37B and the focusing coil 38B form a focusing component 302B for realizing the focusing function of the driving part 30B.

[0238] The ball bearing 35B is assembled in the guide groove 2230B, and the anti-shake carrier 34B is arranged above the support part 20B. The ball bearing 35B supports the anti-shake carrier 34B above the support part 20B. A certain gap is formed between the bottom of the anti-shake carrier 34B and the top of the support part 20B, so that the friction force of the anti-shake carrier 34B when moving relative to the support part 20B is small, thereby improving the flexibility of movement.

[0239] When the driving unit 30B is working, the driving magnet 33B and the coil 31B interact with each other to generate a driving force, which drives the anti-shake carrier 34B to move on a plane perpendicular to the optical axis to achieve the optical anti-shake function.

[0240] The projections of the anti-shake carrier 34B and the coil 31B along the optical axis overlap, with the coil 31B located below the anti-shake carrier 34B. The driving magnet 33B is mounted on the anti-shake carrier 34B, above the coil 31B. The driving magnet 33B and coil 31B interact to generate a driving force that drives the unit 30B to implement the optical image stabilization function.

[0241] The coil 31B is disposed below the top surface 2211B of the support portion 20B, and the driving magnet 33B is disposed between the positioning posts 23B on both sides. The bottom surface 331B of the driving magnet 33B is close to the top surface 2211B and can interact with the coil 31B.

[0242] The elastic member 36B is installed between the anti-shake carrier 34B and the support portion 20B to suspend the anti-shake carrier 34B on the support portion 20B through an elastic suspending force, so that the anti-shake carrier 34B is movable.

[0243] The elastic member 36B includes a first elastic member 361B and a second elastic member 362B. The first elastic member 361B elastically connects the anti-shake carrier 34B and the support portion 20B. Specifically, the four corners of the first elastic member 361B are fixed to the tops of the positioning posts 23B at the four corners of the support portion 20B. The tops of the positioning posts 23B are equipped with mounting posts 231B, which are adapted to cooperate with the four corners of the first elastic member 361B to secure the first elastic member 361B to the positioning posts 23B.

[0244] The focusing carrier 37B is arranged on the inner side of the anti-shake carrier 34B, and the first elastic member 361B and the second elastic member 362B are respectively installed on one side and the other side of the anti-shake carrier 34B and the focusing carrier 37B to elastically connect the focusing carrier 37B and the anti-shake carrier 34B, thereby suspending the focusing carrier 37B on the inner side of the anti-shake carrier 34B.

[0245] The focus coil 38B is mounted on the focus carrier 37B and interacts with the driving magnet 33B mounted on the anti-shake carrier 34B to generate a driving force, driving the focus carrier 37B to move along the optical axis relative to the anti-shake carrier 34B to achieve the autofocus function.

[0246] The elastic member 36B suspends the anti-shake carrier 34B and the focus carrier 37B so that the anti-shake carrier 34B and the focus carrier 37B are movable.

[0247] There is a certain distance between the bottom surface 331B of the driving magnet 33B and the top surface 2211B of the bottom plate 221B to prevent the driving magnet 33B and the support portion 20B from rubbing against each other during movement.

[0248] Specifically, a gap is created between the bottom portion of the anti-shake carrier 34B opposite the guide portion 223B and the top portion of the guide portion 223B. This gap is supported by the balls 35B on the support portion 20B. This gap also forms between the bottom surface 331B of the driving magnet 33B and the top surface 2211B of the base plate 221B, preventing friction between the driving magnet 33B and the support portion 20B. Because the coil 31B is positioned below the top surface 2211B, the driving magnet 33B does not need to be elevated to avoid the coil 31B. In other words, the balls 35B support the anti-shake carrier 34B and the driving magnet 33B mounted thereon, creating a friction-reducing gap without requiring the driving magnet 33B to avoid the coil 31B and raise its mounting height.

[0249] The gap between the bottom surface 331B of the driving magnet 33B and the top surface 2211B of the bottom plate 221B is small so that the gap between the coil 31B below the top surface 2211B and the driving magnet 33B can meet the design requirements of the driving force of the driving unit 30B.

[0250] Since the coil 31B is built into the support part 20B, compared with the form in which the coil is installed on the top of the motor base in the prior art, the installation height of the coil 31B in the present application in the camera module is reduced, and accordingly the bottom height of the driving magnet 33B is reduced to ensure that the gap between the driving magnet 33B and the coil 31B meets the performance design requirements of the driving part 30B. This allows the installation height of the driving magnet 33B to be reduced, and the anti-shake carrier 34B can have a lower installation height, and the height of its top is reduced. Correspondingly, the height of the positioning column 23B is lowered to adapt to the height of the top of the anti-shake carrier 34B. In addition, the top height of the housing 80B of the camera module is also lowered. Therefore, the thickness of the camera module is reduced, and the shoulder height of the camera module is reduced.

[0251] In addition, the aforementioned closed-loop control component (position sensor 141B and / or controller 142B) can integrate a compensation control function for the focusing movement. In other embodiments, a closed-loop control component for the focusing movement can be provided on the focusing carrier 37B.

[0252] As shown in Figures 18B and 18C , the four corners of the anti-shake carrier 34B provide clearance spaces 340B to allow for positioning posts 23B. After being mounted on the anti-shake carrier 34B, the driving magnet 33B is positioned between the clearance spaces 340B at two corners of the anti-shake carrier 34B. The area between the top surface 2211B of the bottom plate 221B and the housing 80B accommodates the anti-shake carrier 34B and the driving magnet 33B.

[0253] It can be understood that compared with the prior art, the space between the top surface 2211B of the base plate 221B and the housing 80B can have the same or approximately the same height, so that the camera module base assembly of the present application is sufficient to install components of the existing motor, such as the existing driving magnet, as components of the driving part 30B of the present application.

[0254] For example, in one example, the existing anti-shake carrier and driving magnet of the prior art are used as the anti-shake carrier 34B and driving magnet 33B of the present application and are installed on the camera module base assembly of the present application. To adapt to the height of the coil 31B, the height of the bottom of the driving magnet 33B is lowered, the height of the top of the anti-shake carrier 34B is lowered accordingly, the avoidance spaces 340B at the four corners are reduced, the height of the positioning column 23B is reduced accordingly, and the portion of the anti-shake carrier 34B between the avoidance spaces 340B can maintain its original thickness without being reduced, and can accommodate the original driving magnet 33B without changing the size of the driving magnet 33B, so that the driving magnet 33B has sufficient volume and can generate sufficient driving force. At the same time, the components of the existing motor can also be used as the driving part 30B of the present application.

[0255] In one embodiment of the guide portion 223B, as shown in Figures 17 and 18B , the guide portion 223B is formed to protrude from the surface of the base plate 221B in a direction parallel to the optical axis, forming a raised structure on the surface of the base plate 221B. A guide groove 2230B is defined in the guide portion 223B, recessed downward from the top surface of the guide portion 223B. The ball bearing 35B is disposed in the guide groove 2230B. Therefore, the guide portion 223B is higher than the base plate 221B, and the ball bearing 35B is positioned above the top surface 2211B of the base plate 221B. Accordingly, the clearance space 340B of the anti-shake carrier 34B forms a first clearance space 3401B and a second clearance space 3402B, respectively accommodating the positioning post 23B and the guide portion 223B. The first clearance space 3401B and the second clearance space 3402B are interconnected.

[0256] The anti-shake carrier 34B is installed in the installation space 2000B of the support portion 20B, the positioning column 23B is located in the first avoidance space 3401B, and the guide portion 223B is located in the second avoidance space 3402B.

[0257] An upper guide groove 34021B is formed on the bottom surface of the anti-shake carrier 34B, facing the second relief space 3402B, to accommodate a portion of the ball 35B. This groove, in conjunction with the guide groove 2230B, defines a space for the ball 35B. A portion of the ball 35B is exposed outside the upper guide groove 34021B and the guide groove 2230B, located between the anti-shake carrier 34B and the guide portion 223B, creating a gap between the bottom of the anti-shake carrier 34B and the support portion 20B.

[0258] In one embodiment of the guide portion 223B, as shown in Figures 18C and 18D , the guide portion 223B is implemented as a portion of the bottom plate 221B, with the top surface of the guide portion 223B flush with the top surface 2211B of the bottom plate 221B. A guide groove 2230B is formed recessed downward from the top surface 2211B. The ball 35B is mounted in the guide groove 2230B such that a portion of the ball 35B is lower than the top surface 2211B of the bottom plate 221B, while another portion protrudes above the top surface 2211B.

[0259] The anti-shake carrier 34B is mounted on the support portion 20B, with the guide portion 223B positioned below the bottom of the anti-shake carrier 34B and the positioning post 23B positioned within the clearance space 340B. An upper guide groove 34021B is formed on the bottom of the anti-shake carrier 34B, facing the guide portion 223B, to accommodate a portion of the ball bearing 35B.

[0260] The bottom surface 331B of the driving magnet 33B is exposed from the bottom of the anti-shake carrier 34B to interact with the coil 31B to generate a driving force.

[0261] In one embodiment of the drive magnet 33B, the bottom of the drive magnet 33B protrudes from the exterior of the anti-shake carrier 34B. In other words, a portion of the drive magnet 33B is exposed outside the anti-shake carrier 34B. In another embodiment of the drive magnet 33B, the bottom of the drive magnet 33B is exposed from the bottom surface of the anti-shake carrier 34B. The inner surface of the drive magnet 33B is exposed, facing the focus coil 38B, to interact with the focus coil 38B.

[0262] The camera module also includes a lens unit 50B, which is arranged on the driving unit 30B. The driving unit 30B drives the lens unit 50B to realize the lens shift optical image stabilization function and the autofocus function.

[0263] In one embodiment, the lens portion 50B is disposed on the focus carrier 37B, and the anti-shake carrier 34B is disposed outside the focus carrier 37B. The drive magnet 33B is mounted on the anti-shake carrier 34B, with the bottom surface 331B of the drive magnet 33B facing the support portion 20B, interacting with the coil 31B within the support portion 20B to generate a driving force to implement the anti-shake function. The inner surface of the drive magnet 33B faces the focus coil 38B, interacting with each other to generate a driving force to implement the focus function. In other words, the focus function and the anti-shake function share a magnet, saving space.

[0264] The photosensitive portion 40B is conductively connected to the circuit board 11B. The camera module further includes a filter portion 60B, which is disposed in the photosensitive path of the photosensitive portion 40B.

[0265] In one embodiment for mounting photosensitive unit 40B, as shown in FIG19A , circuit board 11B has a circuit board through-hole 110B. Photosensitive unit 40B includes photosensitive chip 41B, which is mounted in circuit board through-hole 110B. The bottom of photosensitive chip 41B and the bottom of circuit board 11B are covered by reinforcing plate 70B, as shown in FIG18A . Photosensitive chip 41B and circuit board 11B are electrically connected via wire bonding.

[0266] In one embodiment of mounting the photosensitive unit 40B, as shown in FIG19B , the circuit board 11B has a circuit board through hole 110B. The photosensitive chip 41B of the photosensitive unit 40B is mounted below the circuit board through hole 110B, so that the photosensitive chip 41B is located below the circuit board 11B, further reducing the height of the photosensitive chip 41B. The photosensitive chip 41B and the circuit board 11B are electrically connected by flip-chip bonding.

[0267] The filter section 60B includes a filter 61B, which is disposed in the light-sensing path of the light-sensing chip 41B.

[0268] In one embodiment, as shown in FIG19A , the optical filter 61B is mounted directly on the support portion 20B. A filter mounting portion 201B extends from the inner periphery of the support portion 20B along the circuit board 11B toward the optical axis. The inner periphery of the filter mounting portion 201B defines a light aperture 200B. The optical filter 61B is mounted on the filter mounting portion 201B. The circuit board through hole 110B is located below the optical filter 61B. The photosensitive chip 41B can be mounted in the circuit board through hole 110B or below the circuit board through hole 110B.

[0269] In one embodiment, as shown in FIG19B , the filter unit 60B further includes a filter holder 62B. The filter holder 62B is fixed to the first surface 111B of the circuit board 11B. The circuit board through hole 110B is located below the filter holder 62B. The filter 61B is mounted on the filter holder 62B to be held in the light sensing path of the photosensitive chip 41B. The photosensitive chip 41B can be mounted in the circuit board through hole 110B or below the circuit board through hole 110B.

[0270] As shown in FIG18A , the camera module further includes a housing 80B, which covers the driving unit 30B, the supporting unit 20B, the photosensitive unit 40B, and the filter unit 60B. The bottom of the housing 80B rests on the step 215B of the supporting unit 20B.

[0271] According to another aspect of the present application, the present application also provides a method for manufacturing a camera module, comprising the following steps:

[0272] Providing a circuit board, and mounting electronic components on a first surface of the circuit board;

[0273] forming a first supporting portion on the first surface to form a coil mounting portion;

[0274] Install the coil to the coil mounting portion, and connect the coil to the circuit board; and

[0275] A second supporting portion is formed on the first surface to cover the coil, forming a base plate and a positioning column of the supporting portion to obtain a camera module base assembly.

[0276] Wherein, a magnetic attraction element is mounted on the first surface of the circuit board, and the first supporting portion at least covers a portion of the magnetic attraction element or a part of the magnetic attraction element.

[0277] Wherein, the position sensor and the controller are mounted on the first surface of the circuit board, and when the first supporting portion is formed, the position sensor and the controller are covered.

[0278] A coil conduction area is provided on the first surface of the circuit board, and the coil conduction area and the electronic components are avoided. After the first support portion is formed, the coil conduction area is exposed, and the lead end of the coil is fixedly connected to the coil conduction area so that the coil is conductively connected to the circuit board.

[0279] Among them, a first positioning column is formed when the first supporting part is formed, and the first positioning column is located at at least two corners of the circuit board; the focusing conductive member is installed on the first positioning column, and the first conductive end of the focusing conductive member is exposed at the top of the first positioning column, and the second conductive end is fixed to the first surface of the circuit board and is conductively connected to the circuit board.

[0280] When the first supporting portion is formed, a step is formed for the outer shell of the camera module to abut against.

[0281] When forming the second supporting portion, a bottom plate covering the coil mounting portion and a portion of the first surface is formed, and positioning posts are formed at the four corners of the bottom plate.

[0282] Wherein, when forming the second supporting portion, a guide portion is formed on one side of each positioning column.

[0283] Among them, after obtaining the camera module base assembly, the driving part is assembled on the supporting part, and the lens part is assembled on the driving part to obtain the camera module.

[0284] The above describes the basic principles, main features, and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above-described embodiments. The above-described embodiments and the specification merely illustrate the principles of the present application. Various changes and improvements may be made to the present application without departing from the spirit and scope of the present application. These changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the appended claims and their equivalents.

Claims

1. An injection molded part, characterized in that, Including steps: a. Providing a first material strip, the first material strip comprising a plurality of first metal elements, performing a first injection molding on the first material strip to form a plurality of first injection-molded parts to obtain a first semi-finished product; b. Providing a second material strip, the second material strip comprising a plurality of second metal elements, and stacking the second material strip on the first material strip so that the second metal elements are located at corners of the first semi-finished product to form magnetic elements, wherein the second metal elements are longitudinally spaced from the first metal elements, and performing a second injection molding on the first semi-finished product and the second material strip to form a plurality of second injection-molded parts to obtain a second semi-finished product; c. cutting the second semi-finished product to obtain a plurality of unit semi-finished products, such that each of the unit semi-finished products has the first metal element; d. Providing electronic components, welding the electronic components to the semi-finished unit product, and electrically connecting the electronic components to the mounting portion of the first metal element to obtain a finished injection molded part.

2. The manufacturing method of the injection molded part according to claim 1, characterized in that, In step a, when the first injection molding is performed, the first injection molding part at least covers the inner periphery of the first metal element and avoids the pin portion and the mounting portion of the first metal element; in step b, when the second injection molding is performed, the second injection molding part covers the first semi-finished product and the second metal element, and the second injection molding part avoids the end portions of the mounting portion and the pin portion.

3. The manufacturing method of the injection molded part according to claim 1, characterized in that, In step b, the second metal element of the second material strip is placed on the limiting part of the first injection molding part to limit the position of the second material strip relative to the first semi-finished product in the horizontal direction, wherein the four corners of the bottom of the first injection molding part form the limiting part, so that in the finished injection molding part, the magnetic element formed by the second metal element is located below the first metal element.

4. The manufacturing method of the injection molded part according to claim 1, characterized in that, The method further comprises step e: fixing the first material strip through its first fixing portion and the positioning device of the mold in step a; Fixing the second material strip through its second fixing portion and the positioning device of the mold in step b; The first fixing portion and the second fixing portion are adjacently arranged, and the positioning device in step a and step b is the same, including adjacent first positioning portion and second positioning portion, for positioning the first fixing portion and the second fixing portion respectively.

5. The manufacturing method of the injection molded part according to claim 1, characterized in that, The step c specifically includes: cutting the first connecting portion around the first metal element after the second injection molding to separate the first metal element from the other parts of the first material strip, and cutting the second connecting portion around the second metal element to separate the second metal element from the other parts of the second material strip to obtain the single unit semi-finished product.

6. The manufacturing method of the injection molded part according to any one of claims 1 to 5, characterized in that, The step a further includes step a1: cutting a portion of the first connecting portion around the first metal component after the first injection molding to facilitate bending a portion of the pin portion of the first metal component and / or to facilitate the implementation of the step b.

7. The manufacturing method of the injection molded part according to any one of claims 1 to 5, characterized in that, The step a further includes step a2: after the first injection molding, at least part of the pin portion of the first metal component is bent along a preset position so that at least part of the pin portion is vertically arranged and is suitable for being electrically connected to an external circuit of the finished injection molded part.

8. The manufacturing method of the injection molded part according to any one of claims 1 to 5, characterized in that, In the step a, the first strip is arranged in the mold with the mounting portion facing upward, wherein the mounting portion is located on the bottom surface of the first metal component.

9. The manufacturing method of the injection molded part according to claim 8, characterized in that, It further includes step f1: providing a first mounting channel in the first injection portion, wherein the first mounting channel is located at the bottom of the first injection portion, and the mounting portion is exposed through the first mounting channel.

10. The manufacturing method of the injection molded part according to claim 9, characterized in that, It further includes step f2: providing a second mounting channel in the second injection portion, and the second mounting channel is arranged opposite to the first mounting channel so that the mounting portion of the first metal component is exposed to the outside and is suitable for being connected to the electronic component.

11. An injection molded part, comprising an injection molded portion, a metal component, and electronic components, at least a part of the metal component being coated in the injection molded portion, the electronic components being electrically connected to the metal component, characterized in that, The injection molded part is obtained by the manufacturing method of the injection molded part according to any one of claims 1-10.

12. The injection molded part according to claim 11, wherein, The injection molded part is a motor base, or a lens base, or a motor carrier, or a lens carrier.

13. Camera module base assembly, characterized in that Comprising: A circuit board; A plurality of coils, which are conductively connected to the circuit board; A first support portion, which is formed on the circuit board, wherein the first support portion includes a plurality of coil mounting portions, and each of the coils is correspondingly mounted on each of the coil mounting portions; And A second support portion, which is integrally formed on the circuit board, covers the coil mounting portions and the coils, and forms a support portion together with the first support portion.

14. The camera module base assembly according to claim 13, characterized in that, A plurality of coil conduction regions are provided on the first surface of the circuit board, and the coil has a plurality of lead ends, and each of the lead ends is fixed to a corresponding one of the coil conduction regions so that the coil is conductively connected to the circuit board.

15. The camera module base assembly according to claim 14, wherein, The coil conduction region is exposed relative to the first support portion, is located inside the coil mounting portion, and is covered by the second support portion.

16. The camera module base assembly according to claim 15, wherein, The first support portion includes a covering portion, and a closed-loop control component is provided on the first surface of the circuit board, and the covering portion covers the closed-loop control component.

17. The camera module base assembly according to claim 16, wherein, A magnetic attraction element is provided at a corner of the first surface of the circuit board, and the coil mounting portion covers a part of the magnetic attraction element, wherein the projections of the coil and the magnetic attraction element along the direction parallel to the optical axis overlap.

18. The camera module base assembly according to claim 17, wherein, The closed-loop control component and the coil conduction region are arranged inside the magnetic attraction element, and in the region where the closed-loop control component is provided, the coil conduction region is arranged to avoid the closed-loop control component.

19. The camera module base assembly according to claim 18, wherein, The coil mounting portion, the covering portion and the magnetic attraction element are arranged to avoid at least one of the coil conduction regions, so as to form a molding avoidance space at at least one corner of the first support portion, and at least one of the coil conduction regions is exposed in the molding avoidance space, and the second support portion covers the molding avoidance space.

20. The camera module base assembly according to claim 13, characterized in that, The base assembly of the camera module further includes a focusing conductive member. The first support portion includes a first positioning post, and the first positioning post is located at a corner of the circuit board. The focusing conductive member is mounted on the first positioning post. A first conductive end of the focusing conductive member is exposed at the top of the first positioning post, and a second conductive end of the focusing conductive member is fixedly connected to the circuit board and is conductively connected to the circuit board.

21. The camera module base assembly according to claim 20, wherein The first support portion includes a spacer portion. The spacer portion connects two adjacent coil mounting portions. The first positioning post protrudingly extends from the top of the spacer portion. Wherein, a first portion of the focusing conductive member abuts against an inner surface of the first positioning post, and a second portion of the focusing conductive member abuts against the top of the spacer portion.

22. The camera module base assembly according to claim 20, wherein, The second support portion includes an integrally formed bottom plate and a second positioning post. The bottom plate covers a part of the first surface of the coil mounting portion and the circuit board to form a top surface. The second positioning post forms a positioning post, and a part of the second positioning post covers the first positioning post. Wherein, the positioning post is located at a corner of the support portion.

23. The camera module base assembly according to claim 22, wherein, The second support portion integrally forms a plurality of guiding portions. The guiding portions are located on one side of the positioning post. Wherein, the guiding portions define guiding grooves.

24. A manufacturing method of a base assembly of a camera module, characterized in that, Including the following steps: Providing a circuit board; Forming a first support portion on the circuit board to form a coil mounting portion; Mounting a coil in the coil mounting portion and conductively connecting the coil and the circuit board; and, Forming a second support portion on the circuit board, and the second support portion covers the coil mounting portion.

25. The manufacturing method of the camera module base assembly according to claim 24, characterized in that, Including the following steps: Mounting a closed-loop control component on the first surface of the circuit board; When forming the first support portion, covering the closed-loop control component and exposing a coil conduction area provided on the first surface; and, Fixing a lead end of the coil to the coil conduction area.

26. The manufacturing method of the camera module base assembly according to claim 24, characterized in that, Including the following steps: Forming a first positioning post at a corner of the first support portion; Mounting a focusing conductive member inside the first positioning post; And When forming the second support portion, covering the first positioning post with a second positioning post of the second support portion to form a positioning post. Wherein, the focusing conductive member is built inside the positioning post, a first conductive end of the focusing conductive member is exposed at the top end of the positioning post, and a second conductive end of the focusing conductive member is fixed to the circuit board.

27. An imaging module, characterized in that, Including: A circuit board; A coil, and the coil is conductively connected to the circuit board; A support portion providing a top surface, and the coil is built inside the support portion and is located below the top surface; A driving portion, the driving portion includes a driving magnet and an anti-shake carrier. The anti-shake carrier is movably assembled to the support portion, and the driving magnet is assembled to the anti-shake carrier. Wherein, a bottom surface of the driving magnet faces the top surface of the support portion; A photosensitive portion, and a photosensitive area of the photosensitive portion is exposed through a light passing hole defined by the support portion; and A lens portion, and the lens portion is assembled to the driving portion.

28. The imaging module according to claim 27, wherein, The support portion includes a first support portion and a second support portion that are sequentially formed on the circuit board. The coil is disposed on the first support portion, and the second support portion covers the coil to form the support portion. Among them, positioning posts are formed at the four corners of the support portion, and the driving magnet is located between two of the positioning posts.

Images