Carbon-fiber mobile phone middle frame and preparation method therefor

Through the multi-chamber design of carbon fiber stamping and melt forming, combined with the signal conduction of the conductive plating layer, the strength and space utilization problems of the frame in the mobile phone are solved, efficient electronic component configuration and signal transmission are achieved, and the overall performance of the frame in the mobile phone is improved.

WO2025160748A1PCT designated stage Publication Date: 2025-08-07DONGGUAN WEISIDE NEW MATERIAL TECHNOLOGY CO LTD
View PDF 5 Cites 0 Cited by

Patent Information

Application Number
PCT/CN2024/074712
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-01-30
Publication Date
2025-08-07

AI Technical Summary

Technical Problem

It is difficult to achieve high strength and lightweight material for existing mobile phones, and there are difficulties in internal space utilization and electronic component layout. Traditional designs limit the diversified configuration of internal space and the integration of electronic components.

Method used

The first shell formed by carbon fiber press molding and the second shell formed by melt molding are formed in combination with the design of the conductive plating layer, and the signal conduction of the electronic components is realized through the conductive plating layer to avoid wiring board connection.

Benefits of technology

It improves the structural strength of the frame in the mobile phone and the utilization rate of the internal space, simplifies the layout and connection of electronic components, enhances waterproof and dustproof performance, and improves the integration and manufacturing efficiency of the entire machine.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN2024074712_07082025_PF_FP_ABST
    Figure CN2024074712_07082025_PF_FP_ABST
Patent Text Reader

Abstract

The present invention relates to a carbon-fiber mobile phone middle frame. The mobile phone middle frame comprises a first housing formed by carbon-fiber compression molding, a second housing fusion-molded with the first housing, and a conductive plating layer formed on the first housing and the second housing by means of electroplating. The carbon fiber forming the first housing comprises a braided structure formed by spirally winding around the center of a circle, and the braided structure is machined and cut to form a fusion cavity. At least a portion of the conductive plating layer formed on an inner wall of the fusion cavity is connected to the conductive plating layer formed on the second housing, so that electronic components disposed in the fusion cavity can achieve signal connection with electronic components in contact with the second housing without requiring a circuit board, thereby enhancing the structural strength of the mobile phone middle frame while improving utilization of the internal space of the entire device.
Need to check novelty before this filing date? Find Prior Art

Description

Carbon fiber mobile phone middle frame and preparation method thereof Technical Field

[0001] The present invention relates to a carbon fiber mobile phone middle frame, and in particular to a carbon fiber mobile phone middle frame and a preparation method thereof. Background Art

[0002] With the continuous development of mobile devices, the demands on mobile phone structures and materials are also evolving. To improve the performance, lightweighting, and structural complexity of mobile phones, advanced materials such as carbon fiber have become a research hotspot in the mobile phone manufacturing field. At the same time, to accommodate the integration of various electronic components and the formation of complex structures, manufacturing processes and structural designs need to be more innovative and flexible. While the use of traditional materials can help improve the overall strength of the midframe, it often comes with the inevitable additional weight, which restricts the development of lightweight mobile phones. Secondly, existing manufacturing processes cannot effectively realize the complex internal structure of the midframe and have certain difficulties in arranging a variety of electronic components (such as sensors and buttons) within the midframe. In addition, traditional designs are limited in the layout and connection of electronic components, resulting in poor internal space utilization. Similar problems also arise in the frame design of mobile devices such as laptops and tablets. Therefore, it is necessary to provide a carbon fiber mobile phone midframe and its preparation method to improve the structural strength of the mobile phone midframe while improving the utilization of the entire internal space.

[0003] Summary of the Invention

[0004] The purpose of the present invention is to provide a carbon fiber mobile phone middle frame and a preparation method thereof, so as to improve the structural strength of the mobile phone middle frame and improve the utilization rate of the internal space of the entire machine.

[0005] According to one aspect of the present invention, a carbon fiber mobile phone middle frame is provided, comprising a first shell formed by carbon fiber compression molding, a second shell formed by fusion molding with the first shell, and a conductive coating formed on the first shell and the second shell by electroplating.

[0006] The carbon fibers constituting the first shell include a braided body formed by spirally winding and braiding around a center of a circle. The braided body is machined to form a molten cavity. The molten cavity is formed by penetrating a portion of the first shell in a direction perpendicular to the plane of the mobile phone and connecting the molten cavity with the inner and outer sides of the mobile phone middle frame in a direction parallel to the plane of the mobile phone. The second shell is melt-molded in the molten cavity and fills a portion of the molten cavity. The conductive coating is first formed on the inner wall of the molten cavity and then formed on the outer wall of the second shell after the second shell is melt-molded.

[0007] At least a portion of the conductive coating formed on the inner wall of the melting chamber is connected to the conductive coating formed on the second shell, so as to allow the electronic components arranged in the melting chamber to achieve signal conduction with the electronic components in contact with the second shell without passing through the circuit board.

[0008] More preferably, the mobile phone middle frame includes:

[0009] A first cavity is formed in the molten cavity and communicates with the outer side of the mobile phone middle frame in a direction parallel to the plane of the mobile phone and is not filled by the second shell. The mobile phone button is arranged in the first cavity and is connected to the conductive plating layer provided in the molten cavity.

[0010] The second cavity is connected to the first cavity and is connected to the outer side of the mobile phone middle frame in a direction perpendicular to the plane of the mobile phone. The second cavity is formed by the second shell part filling the melting cavity.

[0011] The third cavity is connected to the first cavity and is connected to the outer side of the middle frame of the mobile phone in a direction perpendicular to the plane of the mobile phone. The third cavity is formed by partially filling the melting cavity with the second shell, and the third cavity is located on the side of the second cavity away from the first cavity.

[0012] More preferably, the conductive coating extends from the first cavity into the second cavity and into the third cavity, wherein the portions of the conductive coating located in the second cavity and the third cavity are buried between the first shell and the second shell to allow the mobile phone buttons arranged in the first cavity and the electronic components arranged in the third cavity to be connected through the conductive coating signals.

[0013] More preferably, the second cavity is not connected to the third cavity, the conductive plating extends from the first cavity into the second cavity and into the third cavity, a portion of the conductive plating located in the second cavity is exposed on the inner wall of the melting cavity, and another portion is buried between the first shell and the second shell, and a portion of the conductive plating located in the third cavity is exposed on the inner wall of the melting cavity, and another portion is buried between the first shell and the second shell, so as to allow the electronic components arranged in the second cavity and the electronic components arranged in the third cavity to be connected through the conductive plating signals.

[0014] More preferably, the first shell includes a first extension portion extending from the inner wall of the first cavity along a direction parallel to the plane of the mobile phone, passing through the second cavity and the third cavity, and contacting the inner side of the mobile phone middle frame along the plane direction of the mobile phone, and the conductive coating extends from the inner wall of the first cavity into the second cavity and the third cavity, and extends to the part where the first extension portion contacts the inner side of the mobile phone middle frame.

[0015] More preferably, the second shell includes a second extension portion extending from the outer wall of the second cavity in a direction parallel to the plane of the mobile phone, passing through the first shell in a direction parallel to the plane of the mobile phone, and contacting the outer side of the mobile phone middle frame in the direction of the mobile phone plane. The conductive coating is formed on the part of the second shell in contact with the outer side of the mobile phone middle frame, the conductive coating on the first extension portion is connected to the conductive coating on the second extension portion, the second extension portion is melted and formed on one side of the first extension portion, and a part of the conductive coating on the first extension portion is buried between the first extension portion and the second extension portion, thereby realizing signal conduction between the part of the first extension portion in contact with the inner side of the mobile phone middle frame and the part of the second extension portion in contact with the outer side of the mobile phone middle frame through the conductive coating buried between the first extension portion and the second extension portion.

[0016] More preferably, the portion of the first extension portion that contacts the inner side of the mobile phone middle frame is at least signal-conductive with the antenna element of the mobile phone.

[0017] More preferably, the second shell also includes a third extension portion extending from the outer wall of the second cavity in a direction parallel to the plane of the mobile phone, passing through the first shell in a direction parallel to the plane of the mobile phone, and contacting the inner side of the mobile phone middle frame in the direction of the mobile phone plane. The portion of the second extension portion in contact with the inner side of the mobile phone middle frame is surrounded by the central area of ​​the third extension portion, and the portion of the third extension portion in contact with the inner side of the mobile phone middle frame is formed with a conductive coating, and is connected to at least any one of the portion of the first extension portion in contact with the inner side of the mobile phone middle frame or the conductive coating formed on the inner wall of the melting cavity, so as to allow signal conduction between the electronic components inside the mobile phone middle frame and the outside of the mobile phone middle frame or the electronic components arranged in the melting cavity.

[0018] A method for preparing a carbon fiber mobile phone middle frame, the mobile phone middle frame comprising a first shell formed by carbon fiber compression molding, a second shell formed by fusion with the first shell, and a conductive coating formed on the first shell and the second shell by electroplating, the method comprising the steps of:

[0019] Helically winding and braiding around the center of a circle to form a carbon fiber braided body, which constitutes the first shell;

[0020] The braided body is machined to form a melting cavity, the melting cavity being formed from a portion of the first shell in a direction perpendicular to the plane of the mobile phone and connecting the melting cavity with the inner and outer sides of the mobile phone middle frame in a direction parallel to the plane of the mobile phone;

[0021] forming the conductive coating on the inner wall of the melting chamber by electroplating;

[0022] Melting and forming the second shell in the melting cavity to fill a portion of the melting cavity;

[0023] After the second shell is melt-formed, a conductive coating is formed on the outer wall of the second shell by electroplating;

[0024] Among them, at least a portion of the conductive coating formed on the inner wall of the melting chamber is connected to the conductive coating formed on the second shell, so as to allow the electronic components arranged in the melting chamber to achieve signal conduction with the electronic components in contact with the second shell without passing through the circuit board.

[0025] More preferably, the step of forming a carbon fiber braid by spirally winding and braiding around the center of a circle specifically includes the following steps:

[0026] The raw carbon fibers are woven into a spiral wound shape around a center of a circle using a weaving process, so as to allow the second shell to release the stress generated by expansion in any direction parallel to the plane during the melt molding process;

[0027] Multiple layers of carbon fiber braids having a spiral winding shape around a center of a circle are stacked to allow the second shell to release stress generated by expansion in a direction perpendicular to the plane during the melt molding process;

[0028] The braided body is poured with epoxy resin to form a first shell having a rigid shape.

[0029] The present invention has the following beneficial effects:

[0030] The first shell is formed by configuring a braided body formed by spirally winding and weaving around the center of a circle, so as to allow the second shell to release the stress generated by expansion in any direction parallel to the plane during the melting and molding process; the braided body is cut by machining to form a melting cavity, so as to allow electronic components such as sensors and buttons to be configured on the mobile phone middle frame; the melting cavity is formed by passing through a part of the first shell in a direction perpendicular to the plane of the mobile phone, and the melting cavity is connected to the inner and outer sides of the mobile phone middle frame respectively in a direction parallel to the plane of the mobile phone, so as to allow the electronic components configured on the mobile phone middle frame to be connected to the inside and outside of the mobile phone; the second shell is melt-molded on the melting cavity The conductive plating layer is first formed on the inner wall of the melt cavity, and after the second shell is melt-molded, it is then formed on the outer wall of the second shell, and at least a part of the conductive plating layer formed on the inner wall of the melt cavity is connected to the conductive plating layer formed on the second shell, so as to allow the electronic components configured in the melt cavity to achieve signal conduction with the electronic components in contact with the second shell without passing through the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] FIG1 is a schematic diagram of the three-dimensional structure of a carbon fiber mobile phone middle frame according to one embodiment of the present invention;

[0033] FIG2 is a schematic diagram of the exploded three-dimensional structure of a carbon fiber mobile phone middle frame according to one embodiment of the present invention;

[0034] FIG3 is a partial enlarged schematic diagram of A and B in FIG1 and FIG2;

[0035] FIG4 is a partially exploded schematic diagram of the second housing separated from the first housing according to one embodiment of the present invention;

[0036] FIG5 is a front view of the first housing according to one embodiment of the present invention;

[0037] FIG6 is a side view of a carbon fiber mobile phone middle frame according to an embodiment of the present invention;

[0038] FIG7 is a portion of a cross-sectional schematic diagram of CC in FIG6 ;

[0039] FIG8 is a schematic diagram of the three-dimensional structure of the first cavity, the second cavity, and the third cavity of the carbon fiber mobile phone middle frame according to one embodiment of the present invention;

[0040] FIG9 is a schematic diagram comparing the front view, left view, rear view, and right view of a carbon fiber mobile phone middle frame according to one embodiment of the present invention;

[0041] FIG10 is a comparative schematic diagram showing a portion of the first housing in FIG9 with hatching to highlight the distinction between the first housing and the second housing;

[0042] FIG11 is a comparative schematic diagram showing the formation of a conductive coating on the inner wall of a melting cavity and the formation of a second shell after melt molding according to one embodiment of the present invention;

[0043] FIG12 is a comparative schematic diagram showing the formation of a conductive coating on the inner wall of the melting cavity and the formation of a second shell after melt molding according to one embodiment of the present invention;

[0044] FIG13 is a comparative schematic diagram of a conductive coating formed on the first extension portion and a second housing formed by melt molding according to an embodiment of the present invention;

[0045] FIG14 is a schematic diagram of the three-dimensional structure of the second housing according to one embodiment of the present invention at three different viewing angles a, b, and c;

[0046] FIG15 is a schematic diagram of the three-dimensional structure of a carbon fiber braid according to one embodiment of the present invention;

[0047] Explanation of the accompanying drawings: 200, carbon fiber; 100, mobile phone middle frame; 10, first shell; 20, second shell; 30, conductive plating; 210, braid; 40, melting cavity; 51, first cavity; F1, direction parallel to the plane of the mobile phone; Y1, outer side of the mobile phone middle frame; Y2, inner side of the mobile phone middle frame; 52, second cavity; F2, direction perpendicular to the plane of the mobile phone; 53, third cavity; 11, first extension; 111, portion of the first extension in contact with the inner side of the mobile phone middle frame; 21, second extension; 211, portion of the second extension in contact with the outer side of the mobile phone middle frame; 22, third extension; 221, portion of the third extension in contact with the inner side of the mobile phone middle frame; DETAILED DESCRIPTION

[0048] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0049] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0051] Please refer to Figures 1 to 15. One embodiment of the present invention provides a carbon fiber 200 mobile phone middle frame 100 and a preparation method thereof, which, on the basis of meeting the structural strength of the mobile phone middle frame 100, adapts to the diversified comprehensive requirements of antenna signal conduction, waterproof and dustproof, sensor configuration, and complex and difficult-to-machine connector molding.

[0052] The mobile phone middle frame 100 includes a first shell 10 formed by compression molding of carbon fiber 200, a second shell 20 formed by fusion molding with the first shell 10, and a conductive coating 30 formed on the first shell 10 and the second shell 20 by electroplating.

[0053] Among them, carbon fiber 200 is a lightweight and high-strength material. Using carbon fiber 200 to make the mobile phone middle frame 100 can provide sufficient structural strength while maintaining the overall lightness. By spirally winding and weaving the first shell 10 of carbon fiber 200 around the center of the circle, and then melting and forming the second shell 20, complex structures can be produced, especially for some difficult-to-machine shapes. The setting of electroplating the conductive coating 30 on the first shell 10 and the second shell 20 helps to achieve antenna signal conduction. The presence of the conductive coating 30 allows the electronic components on the mobile phone middle frame 100 to be implemented without going through the circuit board, and to conduct signals with the electronic components in contact with the second shell 20. Dividing the melting chamber 40 into multiple independent chambers, such as the first cavity 51, the second cavity 52 and the third cavity 53, can more flexibly configure the sensors, buttons and other electronic components on the mobile phone middle frame 100. Due to the design of the melting chamber 40, the waterproof and dustproof performance of the mobile phone middle frame 100 can be better achieved because the structure between the cavities can provide additional isolation and protection.

[0054] Among them, the carbon fiber 200 constituting the first shell 10 includes a braided body 210 formed by spirally winding and weaving around the center of a circle. The braided body 210 is machined and cut to form a melting cavity 40. The melting cavity 40 is formed from a part of the first shell 10 along a direction F2 perpendicular to the plane of the mobile phone, and is connected to the inner and outer sides of the mobile phone middle frame 100 along a direction F1 parallel to the plane of the mobile phone. The second shell 20 is melt-molded in the melting cavity 40 and fills a part of the melting cavity 40. The conductive coating 30 is first formed on the inner wall of the melting cavity 40, and after the second shell 20 is melt-molded, it is molded on the outer wall of the second shell 20. At least a part of the conductive coating 30 formed on the inner wall of the melting cavity 40 is connected to the conductive coating 30 formed on the second shell 20, so as to allow the electronic components arranged in the melting cavity 40 to achieve signal conduction with the electronic components in contact with the second shell 20 without passing through the circuit board.

[0055] Among them, the first shell 10 is formed by adopting a carbon fiber 200 braided body 210 formed by spiral winding and weaving around the center of a circle, which can provide high strength and lightweight characteristics. Carbon fiber 200 is a high-strength, lightweight material suitable for use in the mobile phone middle frame 100, which helps to improve the durability and portability of the device. The design of the melting cavity 40 is through in the direction F1 perpendicular to and parallel to the plane of the mobile phone, providing a channel for subsequent electronic component configuration and connection. The conductive coating 30 is first formed on the inner wall of the melting cavity 40, and then the conductive coating 30 is formed on the outer wall of the second shell 20, which helps to achieve signal conduction of the electronic components. This setting allows the electronic components configured in the melting cavity 40 to directly contact the second shell 20 without passing through the circuit board, simplifying the design and reducing some complexity in the assembly process. Dividing the melting cavity 40 into multiple independent chambers, and through the melting molding and filling of the second shell 20, helps to achieve a multi-functional configuration. Such a design can accommodate different electronic components, making the mobile phone middle frame 100 more flexible and applicable to different functions and requirements.

[0056] More preferably, the mobile phone middle frame 100 includes: a first cavity 51 , a second cavity 52 and a third cavity 53 .

[0057] The first cavity 51 is formed within the melting cavity 40 and communicates with the outer side Y1 of the mobile phone middle frame 100 along a direction F1 parallel to the plane of the phone. It is not filled by the second shell 20. The phone keys are arranged within the first cavity 51 and connected to the conductive plating 30 provided within the melting cavity 40. The second cavity 52 communicates with the first cavity 51 and communicates with the outer side Y1 of the mobile phone middle frame 100 along a direction F2 perpendicular to the plane of the phone. The second cavity 52 is formed by the second shell 20 partially filling the melting cavity 40. The third cavity 53 communicates with the first cavity 51 and communicates with the outer side Y1 of the mobile phone middle frame 100 along a direction F2 perpendicular to the plane of the phone. The third cavity 53 is formed by the second shell 20 partially filling the melting cavity 40. The third cavity 53 is located on the side of the second cavity 52 facing away from the first cavity 51.

[0058] Among them, by dividing the mobile phone middle frame 100 into multiple cavities, different functional components, such as mobile phone buttons and other electronic components, can be configured in different cavities. Such a design allows for more flexible component arrangements to adapt to various functional requirements. The mobile phone buttons are configured in the first cavity 51, and the first cavity 51 is connected to the conductive plating 30, which helps to simplify the connection between the buttons and the electronic components. This also means that the buttons can be directly connected to the conductive plating 30 without the need for other connection methods, which simplifies the wiring of electronic components. The second cavity 52 and the third cavity 53 are connected in the direction F2 perpendicular to the plane of the mobile phone, and in the horizontal direction with the outer side Y1 of the mobile phone middle frame 100, forming a complex three-dimensional structure. This design can provide independent installation space for different electronic components and create a more flexible configuration in the overall design.

[0059] More preferably, the conductive coating 30 extends from the first cavity 51 into the second cavity 52 and into the third cavity 53, wherein the portion of the conductive coating 30 located in the second cavity 52 and the third cavity 53 is buried between the first shell 10 and the second shell 20 to allow the mobile phone buttons configured in the first cavity 51 and the electronic components configured in the third cavity 53 to be connected in signal through the conductive coating 30.

[0060] Extending the conductive coating 30 from the first cavity 51 to the second cavity 52 and the third cavity 53 allows electronic components in different cavities to transmit signals through the conductive coating 30. This allows signals from mobile phone buttons placed in the first cavity 51 to be transmitted through the conductive coating 30 to the electronic components in the third cavity 53, enabling communication between them. Using the conductive coating 30 for signal transmission simplifies internal wiring, eliminating the need for additional circuit boards or connectors. This helps reduce the size of the mobile phone midframe 100, improves assembly efficiency, and reduces the complexity of connecting electronic components. Burying a portion of the conductive coating 30 between the first and second housings 10 and 20 helps protect the conductive coating 30 from external environmental influences and improve the stability of the electronic components. This buried design also helps reduce the external exposure of the conductive coating 30, improving the overall waterproof performance of the mobile phone midframe 100. The extended conductive coating 30 allows different types of electronic components to be placed in different cavities, with signals transmitted through the conductive coating 30. This provides greater configuration flexibility, allowing designers to better meet various functional requirements.

[0061] More preferably, the second cavity 52 is not connected to the third cavity 53, and the conductive coating 30 extends from the first cavity 51 into the second cavity 52 and into the third cavity 53. A portion of the conductive coating 30 located in the second cavity 52 is exposed on the inner wall of the melting cavity 40, and another portion is buried between the first shell 10 and the second shell 20. A portion of the conductive coating 30 located in the third cavity 53 is exposed on the inner wall of the melting cavity 40, and another portion is buried between the first shell 10 and the second shell 20, so as to allow the electronic components arranged in the second cavity 52 and the electronic components arranged in the third cavity 53 to be connected in signal through the conductive coating 30.

[0062] The second cavity 52 and the third cavity 53 are not directly connected to each other, which is done to isolate or separate different functional components. This design can effectively prevent mutual interference or electromagnetic interference between the two cavities, especially when a certain degree of isolation is required between the electronic components in the two cavities. In the second cavity 52 and the third cavity 53, a portion of the conductive coating 30 is exposed on the inner wall of the melting cavity 40 to achieve more direct contact between the electronic components and provide more reliable signal transmission. The exposed conductive coating 30 forms an electrical connection path between the two cavities, allowing the electronic components to connect to each other through the conductive coating 30, thereby achieving signal conduction. Another portion of the conductive coating 30 is buried between the first shell 10 and the second shell 20, which helps protect the conductive coating 30 from the external environment and improve its stability. This buried design can also help isolate the electronic components in different cavities, ensuring that the signal transmission between them is not affected by external interference. This arrangement provides a certain degree of flexibility, allowing different types of electronic components to be configured in different cavities and signal transmission through the conductive coating 30. At the same time, the buried design may also make electronic components easier to maintain and replace because their connecting parts are located between the shells rather than directly exposed to the outside.

[0063] More preferably, the first shell 10 includes a first extension portion 11 extending from the inner wall of the first cavity 51 along a direction parallel to the plane of the mobile phone, passing through the second cavity 52 and the third cavity 53, and contacting the inner side Y2 of the mobile phone middle frame 100 along the plane direction of the mobile phone. The conductive coating 30 extends from the inner wall of the first cavity 51 into the second cavity 52 and the third cavity 53, and extends to the portion 111 where the first extension portion 11 contacts the inner side Y2 of the mobile phone middle frame 100.

[0064] The first housing 10 extends to form a first extension 11, which passes through the second cavity 52 and the third cavity 53 and contacts the inner side Y2 of the phone's middle frame 100 along the phone's plane. This structure provides additional strength and stability, helping to support the entire phone frame. By passing through multiple cavities, it effectively distributes stress and enhances the overall structural strength of the phone. The conductive coating 30 extends from the inner wall of the first cavity 51 into the second and third cavities 52, 53, and extends to the portion 111 where the first extension 11 contacts the inner side Y2 of the phone's middle frame 100. This layout facilitates a comprehensive electronic component layout, enabling signal transmission between the phone's buttons in the first cavity 51 and the electronic components in the third cavity 53 via the conductive coating 30. By extending the conductive coating 30 to the portion in contact with the first extension 11, the design is more integrated, utilizing the conductive coating 30 as a channel for signal transmission between electronic components. This integrated design helps reduce the use of circuit boards and simplifies the layout and connection of electronic components. This design allows for relatively simple manufacturing steps without the need for complex assembly and connection processes.

[0065] More preferably, the second shell 20 includes a second extension portion 21 extending from the outer wall of the second cavity 52 along a direction parallel to the plane of the mobile phone, penetrating the first shell 10 along a direction F1 parallel to the plane of the mobile phone, and contacting the outer side Y1 of the mobile phone middle frame 100 along the plane direction of the mobile phone. The conductive plating 30 is formed on the part of the second shell 20 in contact with the outer side Y1 of the mobile phone middle frame 100, the conductive plating 30 on the first extension portion 11 is connected to the conductive plating 30 on the second extension portion 21, the second extension portion 21 is melted and formed on one side of the first extension portion 11, and a part of the conductive plating 30 on the first extension portion 11 is buried between the first extension portion 11 and the second extension portion 21, thereby realizing that the part 111 of the first extension portion 11 in contact with the inner side Y2 of the mobile phone middle frame 100 and the part 211 of the second extension portion 21 in contact with the outer side Y1 of the mobile phone middle frame 100 realize signal conduction through the conductive plating 30 buried between the first extension portion 11 and the second extension portion 21.

[0066] Among them, the conductive coating 30 on the first extension part 11 is connected to the conductive coating 30 on the second extension part 21. The conductive coating 30 is buried between the first extension part 11 and the second extension part 21, thereby realizing signal conduction between the part 111 of the first extension part 11 that contacts the inner side Y2 of the mobile phone middle frame 100 and the part 211 of the second extension part 21 that contacts the outer side Y1 of the mobile phone middle frame 100. This design helps to ensure the stability and reliability of signal transmission. The second extension part 21 is formed by melting on one side of the first extension part 11 in order to better integrate the first shell 10 and the second shell 20 during the manufacturing process to ensure a stronger connection between the two. Such a design helps to simplify the manufacturing process and reduce the number of assembly steps. By forming the conductive coating 30 and the fusion connection during the manufacturing process, complex assembly processes can be avoided and manufacturing efficiency can be improved.

[0067] More preferably, the portion 111 of the first extension portion 11 that contacts the inner side Y2 of the mobile phone middle frame 100 is at least connected to the antenna element signal of the mobile phone.

[0068] Among them, the antenna element is responsible for receiving and sending wireless signals in the mobile phone, such as Wi-Fi, Bluetooth, and mobile network signals. Ensuring that the first extension portion 11 is signal-conductive with the antenna element can reduce the impedance of signal transmission and help improve the strength and stability of the signal. By extending the conductive coating 30 to the part in contact with the inner side Y2 of the mobile phone middle frame 100, possible electromagnetic interference during signal transmission can be reduced. This helps to maintain signal clarity and reduce the impact of interference during communication. Such a design is to achieve the integration of the mobile phone middle frame 100 and the antenna element, thereby reducing the complexity of the overall design. By considering the signal conduction of the antenna element in the design of the frame, the internal structure of the mobile phone can be simplified and the integration can be improved. Keeping the antenna connected to the mobile phone middle frame 100 as an integral part helps optimize the performance of the mobile phone. Mobile phone antennas are usually designed in the frame of the mobile phone to maximize the efficiency of wireless communication.

[0069] More preferably, the second shell 20 also includes a third extension portion 22 extending from the outer wall of the second cavity 52 in a direction parallel to the plane of the mobile phone, passing through the first shell 10 in a direction parallel to the plane of the mobile phone, and contacting the inner side Y2 of the mobile phone middle frame 100 in the plane direction of the mobile phone. The portion 211 of the second extension portion 21 in contact with the inner side Y2 of the mobile phone middle frame 100 is surrounded by the central area of ​​the third extension portion 22, and the portion 221 of the third extension portion 22 in contact with the inner side Y2 of the mobile phone middle frame 100 is formed with a conductive coating 30, and is connected to at least any one of the portion 111 of the first extension portion 11 in contact with the inner side Y2 of the mobile phone middle frame 100 or the conductive coating 30 formed on the inner wall of the melting cavity 40, so as to allow the electronic components on the inner side Y2 of the mobile phone middle frame 100 to be connected to the signals of the electronic components on the outer side Y1 of the mobile phone middle frame 100 or the electronic components arranged in the melting cavity 40.

[0070] Among them, the third extension portion 22 is formed with a conductive coating 30, so that the part in contact with the inner side Y2 of the mobile phone middle frame 100 is conductive. This helps to ensure signal transmission between the electronic components on the inner side Y2 of the mobile phone middle frame 100 and other electronic components on the outer side Y1 of the mobile phone middle frame 100 or in the melting cavity 40. By including the third extension portion 22 in the design of the second shell 20, an integrated design between the inside and outside of the mobile phone middle frame 100 can be achieved. This helps to simplify the overall structure and improve the manufacturing efficiency and reliability of the mobile phone. By ensuring that the third extension portion 22 is connected to the conductive coating 30, multifunctionality can be achieved in this part. For example, sensors or other electronic components may be configured to realize additional functions of the mobile phone or improve the user experience. By connecting the third extension portion 22 to the first extension portion 11 or the conductive coating 30 in the melting cavity 40, it helps to ensure the stability of the signal when transmitting between the inside and outside.

[0071] This specific embodiment also provides a method for preparing a carbon fiber 200 mobile phone middle frame 100, wherein the mobile phone middle frame 100 includes a first shell 10 formed by compression molding of the carbon fiber 200, a second shell 20 formed by melting the first shell 10, and a conductive coating 30 formed on the first shell 10 and the second shell 20 by electroplating. The method includes the following steps:

[0072] S10: spirally winding and weaving the carbon fiber 200 around the center to form a braided body 210, which constitutes the first shell 10;

[0073] S20 machining the braided body 210 to form a melting cavity 40. The melting cavity 40 is formed from a portion of the first shell 10 along a direction F2 perpendicular to the plane of the mobile phone, and is connected to the inner and outer sides of the mobile phone middle frame 100 along a direction F1 parallel to the plane of the mobile phone.

[0074] S30: electroplating to form the conductive coating 30 on the inner wall of the melting chamber 40;

[0075] S40: forming the second shell 20 by melting in the melting cavity 40 and filling a portion of the melting cavity 40;

[0076] S50 After the second shell 20 is melt-formed, a conductive plating layer 30 is electroplated on the outer wall of the second shell 20, wherein at least a portion of the conductive plating layer 30 formed on the inner wall of the melting cavity 40 is connected to the conductive plating layer 30 formed on the second shell 20, so as to allow the electronic components arranged in the melting cavity 40 to achieve signal conduction with the electronic components in contact with the second shell 20 without passing through the circuit board.

[0077] The braided body 210, formed by spirally winding and weaving carbon fibers 200 around a center, provides the required strength and rigidity for the mobile phone midframe 100. Carbon fibers 200 are lightweight, high-strength, and corrosion-resistant, ensuring that the mobile phone midframe 100 maintains sufficient structural strength while remaining lightweight. Machining the braided body 210 to form a melt cavity 40 provides the necessary space for subsequent steps, such as filling the second housing 20 and applying the conductive coating 30. This also facilitates accommodating electronic components within the mobile phone midframe 100 and ensuring that the channel formed by the melt cavity 40 allows for connection of electronic components. Electroplating the conductive coating 30 on the inner wall of the melt cavity 40, which connects to the conductive coating 30 on the second housing 20, facilitates signal communication between the electronic components inside and outside the mobile phone midframe 100. This design avoids the use of traditional circuit boards, improving the integrity and reliability of the mobile phone midframe 100. After the second housing 20 is melt-formed, the conductive coating 30 is electroplated again on its outer wall to ensure connection with the conductive coating 30 on the inner wall of the melt cavity 40. This helps to achieve an integrated design of electronic components within the mobile phone middle frame 100, making the entire structure more compact and stable.

[0078] More preferably, the step of forming the braided body 210 of the carbon fiber 200 by spirally winding and braiding around the center of a circle specifically includes the following steps:

[0079] S11 uses a weaving process to weave the raw carbon fiber 200 into a spirally wound shape around a center of a circle, so as to allow the second shell 20 to release the stress generated by expansion in any direction parallel to the plane during the melt molding process;

[0080] S12: multiple layers of carbon fiber 200 braided bodies 210 having a spiral winding shape around a center of a circle are stacked to allow the second shell 20 to release the stress generated by expansion in a direction perpendicular to the plane during the melt molding process;

[0081] S13: Epoxy resin is poured into the braided body 210 to form a first shell 10 having a rigid shape.

[0082] Among them, the raw carbon fiber 200 is woven into a shape of spiral winding around the center of a circle using a weaving process, which helps to provide a uniform distribution of the carbon fiber 200 in multiple directions. Such a weaving structure can provide strength in all directions, so that the performance of the carbon fiber 200 can be maximized. By stacking multiple layers of carbon fiber 200 braids 210 having a shape of spiral winding around the center of a circle, the overall thickness and strength can be increased. In addition, the stacked multi-layer structure can also release the stress generated by expansion in a direction perpendicular to the plane, thereby improving the stability of the material. Infusion of epoxy resin helps to fix the multi-layer braids 210 together and provide rigidity to the entire structure. This ensures that the first shell 10 maintains a stable shape during the melt molding process, reduces the stress caused by the expansion of the carbon fiber 200, and improves the overall strength and rigidity.

[0083] In this way, the first shell 10 is formed by configuring a braided body 210 formed by spirally winding and weaving around the center of a circle, so as to allow the second shell 20 to release the stress generated by expansion in any direction parallel to the plane during the melting and molding process; the braided body 210 is machined to form a melting cavity 40, so as to allow electronic components such as sensors and buttons to be configured on the mobile phone middle frame 100; the melting cavity 40 is formed by penetrating a part of the first shell 10 along a direction F2 perpendicular to the plane of the mobile phone, and connecting the melting cavity 40 with the inner and outer sides of the mobile phone middle frame 100 along a direction F1 parallel to the plane of the mobile phone, so as to allow the electronic components configured on the mobile phone middle frame 100 to be connected to the inside and outside of the mobile phone; the second shell 20 is melt-molded in the melting cavity 40, And fill a part of the melting cavity 40 to allow the molding of connectors with complex structural shapes, and divide the melting cavity 40 into multiple independent chambers for configuring electronic components such as sensors and buttons according to actual conditions; the conductive plating 30 is first molded on the inner wall of the melting cavity 40, and after the second shell 20 is melt-molded, it is then molded on the outer wall of the second shell 20, and at least a part of the conductive plating 30 molded on the inner wall of the melting cavity 40 is connected to the conductive plating 30 molded on the second shell 20, so as to allow the electronic components configured in the melting cavity 40 to achieve signal conduction with the electronic components in contact with the second shell 20 without going through the circuit board.

[0084] The above-described embodiments merely represent several embodiments of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A carbon fiber mobile phone middle frame, characterized in that: The mobile phone middle frame includes a first shell formed by carbon fiber compression molding, a second shell formed by melting the first shell, and a conductive plating layer formed on the first shell and the second shell by electroplating, characterized in that: The carbon fibers constituting the first shell include a braided body formed by spirally winding and braiding around a center of a circle. The braided body is machined to form a molten cavity. The molten cavity is formed by penetrating a portion of the first shell in a direction perpendicular to the plane of the mobile phone and connecting the molten cavity with the inner and outer sides of the mobile phone middle frame in a direction parallel to the plane of the mobile phone. The second shell is melt-molded in the molten cavity and fills a portion of the molten cavity. The conductive coating is first formed on the inner wall of the molten cavity and then formed on the outer wall of the second shell after the second shell is melt-molded. At least a portion of the conductive coating formed on the inner wall of the melting chamber is connected to the conductive coating formed on the second shell, so as to allow the electronic components arranged in the melting chamber to achieve signal conduction with the electronic components in contact with the second shell without passing through the circuit board.

2. The carbon fiber mobile phone middle frame according to claim 1, characterized in that: The mobile phone middle frame includes: A first cavity is formed in the molten cavity and communicates with the outer side of the mobile phone middle frame in a direction parallel to the plane of the mobile phone and is not filled by the second shell. The mobile phone button is arranged in the first cavity and is connected to the conductive plating layer provided in the molten cavity. The second cavity is connected to the first cavity and is connected to the outer side of the mobile phone middle frame in a direction perpendicular to the plane of the mobile phone. The second cavity is formed by the second shell part filling the melting cavity. The third cavity is connected to the first cavity and is connected to the outer side of the middle frame of the mobile phone in a direction perpendicular to the plane of the mobile phone. The third cavity is formed by partially filling the melting cavity with the second shell, and the third cavity is located on the side of the second cavity away from the first cavity.

3. The carbon fiber mobile phone middle frame according to claim 2, characterized in that: The conductive coating extends from the first cavity into the second cavity and into the third cavity, wherein the portions of the conductive coating located in the second cavity and the third cavity are buried between the first shell and the second shell to allow the mobile phone buttons arranged in the first cavity and the electronic components arranged in the third cavity to be connected through the conductive coating signals.

4. The carbon fiber mobile phone middle frame according to claim 2, characterized in that: The second cavity is not connected to the third cavity, and the conductive plating extends from the first cavity into the second cavity and into the third cavity. A portion of the conductive plating located in the second cavity is exposed on the inner wall of the melting cavity, and another portion is buried between the first shell and the second shell. A portion of the conductive plating located in the third cavity is exposed on the inner wall of the melting cavity, and another portion is buried between the first shell and the second shell, so as to allow signal conduction between the electronic components arranged in the second cavity and the electronic components arranged in the third cavity through the conductive plating.

5. The carbon fiber mobile phone middle frame according to claim 2, characterized in that: The first shell includes a first extension portion extending from the inner wall of the first cavity along a direction parallel to the plane of the mobile phone, passing through the second cavity and the third cavity, and contacting the inner side of the mobile phone middle frame along the plane direction of the mobile phone. The conductive coating extends from the inner wall of the first cavity into the second cavity and the third cavity, and extends to the part where the first extension portion contacts the inner side of the mobile phone middle frame.

6. The carbon fiber mobile phone middle frame according to claim 5, characterized in that: The second shell includes a second extension portion extending from the outer wall of the second cavity in a direction parallel to the plane of the mobile phone, passing through the first shell in a direction parallel to the plane of the mobile phone, and contacting the outer side of the mobile phone middle frame in the direction of the mobile phone plane. The conductive coating is formed on the part of the second shell in contact with the outer side of the mobile phone middle frame, the conductive coating on the first extension portion is connected to the conductive coating on the second extension portion, the second extension portion is melted and formed on one side of the first extension portion, and a part of the conductive coating on the first extension portion is buried between the first extension portion and the second extension portion, thereby realizing signal conduction between the part of the first extension portion in contact with the inner side of the mobile phone middle frame and the part of the second extension portion in contact with the outer side of the mobile phone middle frame through the conductive coating buried between the first extension portion and the second extension portion.

7. The carbon fiber mobile phone middle frame according to claim 6, characterized in that: The portion of the first extension portion that contacts the inner side of the mobile phone middle frame is at least signal-conducting with the antenna element of the mobile phone.

8. The carbon fiber mobile phone middle frame according to claim 6, characterized in that: The second shell also includes a third extension portion extending from the outer wall of the second cavity in a direction parallel to the plane of the mobile phone, passing through the first shell in a direction parallel to the plane of the mobile phone, and contacting the inner side of the mobile phone middle frame in the direction of the mobile phone plane. The portion of the second extension portion in contact with the inner side of the mobile phone middle frame is surrounded by the central area of the third extension portion. The portion of the third extension portion in contact with the inner side of the mobile phone middle frame is formed with a conductive coating, and is connected to at least the portion of the first extension portion in contact with the inner side of the mobile phone middle frame or the conductive coating formed on the inner wall of the melting cavity, so as to allow signals of the electronic components inside the mobile phone middle frame to be conducted with those outside the mobile phone middle frame or the electronic components arranged in the melting cavity.

9. A method for preparing a carbon fiber mobile phone middle frame, the mobile phone middle frame comprising a first shell formed by carbon fiber compression molding, a second shell formed by fusion with the first shell, and a conductive coating formed on the first shell and the second shell by electroplating, characterized in that: The method comprises the steps of: Helically winding and braiding around the center of a circle to form a carbon fiber braided body, which constitutes the first shell; The braided body is machined to form a melting cavity, the melting cavity being formed from a portion of the first shell in a direction perpendicular to the plane of the mobile phone and connecting the melting cavity with the inner and outer sides of the mobile phone middle frame in a direction parallel to the plane of the mobile phone; forming the conductive coating on the inner wall of the melting chamber by electroplating; Melting and forming the second shell in the melting cavity to fill a portion of the melting cavity; After the second shell is melt-formed, a conductive coating is formed on the outer wall of the second shell by electroplating; Among them, at least a portion of the conductive coating formed on the inner wall of the melting chamber is connected to the conductive coating formed on the second shell, so as to allow the electronic components arranged in the melting chamber to achieve signal conduction with the electronic components in contact with the second shell without passing through the circuit board.

10. The method for preparing a carbon fiber mobile phone middle frame according to claim 9, characterized in that: The step of forming a carbon fiber braid by spirally winding and braiding around the center of a circle specifically includes the following steps: The raw carbon fibers are woven into a spiral wound shape around a center of a circle using a weaving process, so as to allow the second shell to release the stress generated by expansion in any direction parallel to the plane during the melt molding process; Multiple layers of carbon fiber braids having a spiral winding shape around a center of a circle are stacked to allow the second shell to release stress generated by expansion in a direction perpendicular to the plane during the melt molding process; The braided body is poured with epoxy resin to form a first shell having a rigid shape.

Citation Information

Patent Citations

  • Shell assembly for electronic equipment and electronic equipment

    CN110933881A

  • Metal-plastic composite, preparation method and preparation device

    CN112318814A

  • Electronic equipment and middle frame manufacturing method thereof

    CN114464982A

  • Shell assembly and electronic equipment

    CN216649723U

  • Game machine

    JP2023007972A